JPWO2020250346A1 - - Google Patents

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Publication number
JPWO2020250346A1
JPWO2020250346A1 JP2021525477A JP2021525477A JPWO2020250346A1 JP WO2020250346 A1 JPWO2020250346 A1 JP WO2020250346A1 JP 2021525477 A JP2021525477 A JP 2021525477A JP 2021525477 A JP2021525477 A JP 2021525477A JP WO2020250346 A1 JPWO2020250346 A1 JP WO2020250346A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021525477A
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JP7177928B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2020250346A1 publication Critical patent/JPWO2020250346A1/ja
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Publication of JP7177928B2 publication Critical patent/JP7177928B2/ja
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021525477A 2019-06-12 2019-06-12 転写装置及び部品作業機並びに転写量補正方法 Active JP7177928B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/023325 WO2020250346A1 (ja) 2019-06-12 2019-06-12 転写装置及び部品作業機並びに転写量測定方法及び転写量補正方法

Publications (2)

Publication Number Publication Date
JPWO2020250346A1 true JPWO2020250346A1 (ja) 2020-12-17
JP7177928B2 JP7177928B2 (ja) 2022-11-24

Family

ID=73781357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021525477A Active JP7177928B2 (ja) 2019-06-12 2019-06-12 転写装置及び部品作業機並びに転写量補正方法

Country Status (2)

Country Link
JP (1) JP7177928B2 (ja)
WO (1) WO2020250346A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1075096A (ja) * 1996-09-02 1998-03-17 Matsushita Electric Ind Co Ltd フリップチップ部品の実装装置
WO2014068691A1 (ja) * 2012-10-31 2014-05-08 富士機械製造株式会社 対基板作業システムおよび粘性流体供給方法
WO2018163331A1 (ja) * 2017-03-08 2018-09-13 株式会社Ｆｕｊｉ 転写装置及び部品実装装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4586583B2 (ja) * 2005-03-10 2010-11-24 ソニー株式会社 半導体装置の接合方法
JP4839900B2 (ja) 2006-03-15 2011-12-21 パナソニック株式会社 電子部品実装装置
US9763335B2 (en) 2012-04-10 2017-09-12 Fuji Machine Mfg. Co., Ltd. Ball mounting method and working machine for board
JP6359541B2 (ja) 2013-08-07 2018-07-18 株式会社Ｆｕｊｉ 電子部品装着機、および転写確認方法
JP6883728B2 (ja) * 2016-12-21 2021-06-09 パナソニックＩｐマネジメント株式会社 電子部品実装装置および電子部品実装方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1075096A (ja) * 1996-09-02 1998-03-17 Matsushita Electric Ind Co Ltd フリップチップ部品の実装装置
WO2014068691A1 (ja) * 2012-10-31 2014-05-08 富士機械製造株式会社 対基板作業システムおよび粘性流体供給方法
WO2018163331A1 (ja) * 2017-03-08 2018-09-13 株式会社Ｆｕｊｉ 転写装置及び部品実装装置

Also Published As

Publication number Publication date
WO2020250346A1 (ja) 2020-12-17
JP7177928B2 (ja) 2022-11-24

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