JPWO2020241474A1 - - Google Patents
Info
- Publication number
- JPWO2020241474A1 JPWO2020241474A1 JP2021522305A JP2021522305A JPWO2020241474A1 JP WO2020241474 A1 JPWO2020241474 A1 JP WO2020241474A1 JP 2021522305 A JP2021522305 A JP 2021522305A JP 2021522305 A JP2021522305 A JP 2021522305A JP WO2020241474 A1 JPWO2020241474 A1 JP WO2020241474A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0067—Devices for protecting against damage from electrostatic discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019102441 | 2019-05-31 | ||
| JP2019102441 | 2019-05-31 | ||
| PCT/JP2020/020238 WO2020241474A1 (ja) | 2019-05-31 | 2020-05-22 | 電子制御装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020241474A1 true JPWO2020241474A1 (US20110009641A1-20110113-C00185.png) | 2020-12-03 |
| JP7210722B2 JP7210722B2 (ja) | 2023-01-23 |
Family
ID=73553444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021522305A Active JP7210722B2 (ja) | 2019-05-31 | 2020-05-22 | 電子制御装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7210722B2 (US20110009641A1-20110113-C00185.png) |
| CN (1) | CN113841469B (US20110009641A1-20110113-C00185.png) |
| WO (1) | WO2020241474A1 (US20110009641A1-20110113-C00185.png) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131198U (US20110009641A1-20110113-C00185.png) * | 1987-02-17 | 1988-08-26 | ||
| JPH08316662A (ja) * | 1995-05-24 | 1996-11-29 | Fujitsu Ltd | 電子装置 |
| JP2002368436A (ja) * | 2001-06-11 | 2002-12-20 | Kenwood Corp | 電子機器 |
| JP2008090437A (ja) * | 2006-09-29 | 2008-04-17 | Toshiba Corp | 電子機器 |
| JP2014120677A (ja) * | 2012-12-18 | 2014-06-30 | Aisin Seiki Co Ltd | 電子機器 |
| JP2019133858A (ja) * | 2018-01-31 | 2019-08-08 | 株式会社アドヴィックス | 電子制御装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001332832A (ja) * | 2000-05-19 | 2001-11-30 | Olympus Optical Co Ltd | 医用電気機器 |
| JP2006196664A (ja) * | 2005-01-13 | 2006-07-27 | Fuji Photo Film Co Ltd | 基板へのシールドケース取付構造及び携帯電話 |
| JP2007258615A (ja) * | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | 静電チャック |
| JP4923712B2 (ja) * | 2006-05-02 | 2012-04-25 | 日立電線株式会社 | 光モジュール及びその製造方法 |
| JP5287492B2 (ja) * | 2009-05-18 | 2013-09-11 | 株式会社デンソー | 電子装置 |
| CN201854514U (zh) * | 2010-11-01 | 2011-06-01 | 国营第三八八厂 | 一种具有电磁屏蔽和散热功能的高频地波雷达机箱 |
| JP2012238821A (ja) * | 2011-05-13 | 2012-12-06 | Tdk Corp | シールドケース固定構造及びそれを備える電子装置 |
| CN202799558U (zh) * | 2012-07-16 | 2013-03-13 | 苏州东福电子有限公司 | 一种条状铝箔 |
| JP2014033025A (ja) * | 2012-08-01 | 2014-02-20 | Alps Electric Co Ltd | 電子回路モジュール |
| JP2014075496A (ja) * | 2012-10-05 | 2014-04-24 | Hitachi Automotive Systems Ltd | 車載電子制御装置 |
| CN102943969A (zh) * | 2012-11-21 | 2013-02-27 | 深圳华瀚新能源材料有限公司 | 使用导热高分子材料散热的led灯 |
| JP5998084B2 (ja) * | 2013-03-15 | 2016-09-28 | 日立オートモティブシステムズ株式会社 | 蓄電モジュール |
| JP2014203998A (ja) * | 2013-04-05 | 2014-10-27 | 日立オートモティブシステムズ株式会社 | 車載電子制御装置 |
| JP6387278B2 (ja) * | 2014-09-30 | 2018-09-05 | 太陽誘電株式会社 | 回路モジュール及びその製造方法 |
| CN204598570U (zh) * | 2015-04-10 | 2015-08-26 | 广东昕海科技有限公司 | 一种抗干扰屏蔽装置 |
| CN204668299U (zh) * | 2015-06-18 | 2015-09-23 | 厦门华联电子有限公司 | 一种红外线接收头 |
| US20180220539A1 (en) * | 2015-09-29 | 2018-08-02 | Hitachi Automotive Systems, Ltd. | Electronic Control Device |
| KR102481868B1 (ko) * | 2016-05-04 | 2022-12-28 | 삼성전자주식회사 | 이종의 회로 소자군용 중공 차폐구조 및 그 제조방법 |
-
2020
- 2020-05-22 WO PCT/JP2020/020238 patent/WO2020241474A1/ja active Application Filing
- 2020-05-22 JP JP2021522305A patent/JP7210722B2/ja active Active
- 2020-05-22 CN CN202080036380.8A patent/CN113841469B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63131198U (US20110009641A1-20110113-C00185.png) * | 1987-02-17 | 1988-08-26 | ||
| JPH08316662A (ja) * | 1995-05-24 | 1996-11-29 | Fujitsu Ltd | 電子装置 |
| JP2002368436A (ja) * | 2001-06-11 | 2002-12-20 | Kenwood Corp | 電子機器 |
| JP2008090437A (ja) * | 2006-09-29 | 2008-04-17 | Toshiba Corp | 電子機器 |
| JP2014120677A (ja) * | 2012-12-18 | 2014-06-30 | Aisin Seiki Co Ltd | 電子機器 |
| JP2019133858A (ja) * | 2018-01-31 | 2019-08-08 | 株式会社アドヴィックス | 電子制御装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7210722B2 (ja) | 2023-01-23 |
| WO2020241474A1 (ja) | 2020-12-03 |
| CN113841469B (zh) | 2024-01-02 |
| CN113841469A (zh) | 2021-12-24 |
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