JPWO2020240699A1 - - Google Patents
Info
- Publication number
- JPWO2020240699A1 JPWO2020240699A1 JP2021521626A JP2021521626A JPWO2020240699A1 JP WO2020240699 A1 JPWO2020240699 A1 JP WO2020240699A1 JP 2021521626 A JP2021521626 A JP 2021521626A JP 2021521626 A JP2021521626 A JP 2021521626A JP WO2020240699 A1 JPWO2020240699 A1 JP WO2020240699A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/021109 WO2020240699A1 (en) | 2019-05-28 | 2019-05-28 | Semiconductor module, method for manufacturing semiconductor module, and power conversion apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020240699A1 true JPWO2020240699A1 (en) | 2020-12-03 |
JP7134345B2 JP7134345B2 (en) | 2022-09-09 |
Family
ID=73552847
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021521626A Active JP7134345B2 (en) | 2019-05-28 | 2019-05-28 | SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE MANUFACTURING METHOD AND POWER CONVERTER |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7134345B2 (en) |
CN (1) | CN113841235B (en) |
WO (1) | WO2020240699A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023112990A (en) * | 2022-02-02 | 2023-08-15 | 日立Astemo株式会社 | Semiconductor device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012138475A (en) * | 2010-12-27 | 2012-07-19 | Toyota Motor Corp | Semiconductor module and method for manufacturing the same |
JP2012142465A (en) * | 2011-01-04 | 2012-07-26 | Mitsubishi Electric Corp | Semiconductor device |
JP2015008242A (en) * | 2013-06-26 | 2015-01-15 | 三菱電機株式会社 | Power semiconductor device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5574170B2 (en) * | 2010-06-17 | 2014-08-20 | 株式会社デンソー | Semiconductor module mounting structure |
JP5511621B2 (en) * | 2010-10-13 | 2014-06-04 | 三菱電機株式会社 | Semiconductor device |
JP2012142521A (en) * | 2011-01-06 | 2012-07-26 | Mitsubishi Electric Corp | Power semiconductor device |
JP5653228B2 (en) * | 2011-01-17 | 2015-01-14 | 三菱電機株式会社 | Semiconductor device |
JP5379816B2 (en) * | 2011-02-23 | 2013-12-25 | 三菱電機株式会社 | Power semiconductor device |
JP5843539B2 (en) * | 2011-09-16 | 2016-01-13 | 三菱電機株式会社 | Semiconductor device and method for manufacturing the same |
JP5484429B2 (en) * | 2011-11-18 | 2014-05-07 | 三菱電機株式会社 | Power converter |
JP5813137B2 (en) * | 2011-12-26 | 2015-11-17 | 三菱電機株式会社 | Power semiconductor device and manufacturing method thereof |
JP6398405B2 (en) * | 2014-07-15 | 2018-10-03 | 富士電機株式会社 | Semiconductor device and manufacturing method of semiconductor device |
JP6150866B2 (en) * | 2015-11-02 | 2017-06-21 | 三菱電機株式会社 | Power semiconductor device |
-
2019
- 2019-05-28 JP JP2021521626A patent/JP7134345B2/en active Active
- 2019-05-28 CN CN201980096496.8A patent/CN113841235B/en active Active
- 2019-05-28 WO PCT/JP2019/021109 patent/WO2020240699A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012138475A (en) * | 2010-12-27 | 2012-07-19 | Toyota Motor Corp | Semiconductor module and method for manufacturing the same |
JP2012142465A (en) * | 2011-01-04 | 2012-07-26 | Mitsubishi Electric Corp | Semiconductor device |
JP2015008242A (en) * | 2013-06-26 | 2015-01-15 | 三菱電機株式会社 | Power semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP7134345B2 (en) | 2022-09-09 |
WO2020240699A1 (en) | 2020-12-03 |
CN113841235B (en) | 2024-05-24 |
CN113841235A (en) | 2021-12-24 |
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