JPWO2020240699A1 - - Google Patents

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Publication number
JPWO2020240699A1
JPWO2020240699A1 JP2021521626A JP2021521626A JPWO2020240699A1 JP WO2020240699 A1 JPWO2020240699 A1 JP WO2020240699A1 JP 2021521626 A JP2021521626 A JP 2021521626A JP 2021521626 A JP2021521626 A JP 2021521626A JP WO2020240699 A1 JPWO2020240699 A1 JP WO2020240699A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021521626A
Other languages
Japanese (ja)
Other versions
JP7134345B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020240699A1 publication Critical patent/JPWO2020240699A1/ja
Application granted granted Critical
Publication of JP7134345B2 publication Critical patent/JP7134345B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2021521626A 2019-05-28 2019-05-28 SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE MANUFACTURING METHOD AND POWER CONVERTER Active JP7134345B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/021109 WO2020240699A1 (en) 2019-05-28 2019-05-28 Semiconductor module, method for manufacturing semiconductor module, and power conversion apparatus

Publications (2)

Publication Number Publication Date
JPWO2020240699A1 true JPWO2020240699A1 (en) 2020-12-03
JP7134345B2 JP7134345B2 (en) 2022-09-09

Family

ID=73552847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021521626A Active JP7134345B2 (en) 2019-05-28 2019-05-28 SEMICONDUCTOR MODULE, SEMICONDUCTOR MODULE MANUFACTURING METHOD AND POWER CONVERTER

Country Status (3)

Country Link
JP (1) JP7134345B2 (en)
CN (1) CN113841235B (en)
WO (1) WO2020240699A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023112990A (en) * 2022-02-02 2023-08-15 日立Astemo株式会社 Semiconductor device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012138475A (en) * 2010-12-27 2012-07-19 Toyota Motor Corp Semiconductor module and method for manufacturing the same
JP2012142465A (en) * 2011-01-04 2012-07-26 Mitsubishi Electric Corp Semiconductor device
JP2015008242A (en) * 2013-06-26 2015-01-15 三菱電機株式会社 Power semiconductor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574170B2 (en) * 2010-06-17 2014-08-20 株式会社デンソー Semiconductor module mounting structure
JP5511621B2 (en) * 2010-10-13 2014-06-04 三菱電機株式会社 Semiconductor device
JP2012142521A (en) * 2011-01-06 2012-07-26 Mitsubishi Electric Corp Power semiconductor device
JP5653228B2 (en) * 2011-01-17 2015-01-14 三菱電機株式会社 Semiconductor device
JP5379816B2 (en) * 2011-02-23 2013-12-25 三菱電機株式会社 Power semiconductor device
JP5843539B2 (en) * 2011-09-16 2016-01-13 三菱電機株式会社 Semiconductor device and method for manufacturing the same
JP5484429B2 (en) * 2011-11-18 2014-05-07 三菱電機株式会社 Power converter
JP5813137B2 (en) * 2011-12-26 2015-11-17 三菱電機株式会社 Power semiconductor device and manufacturing method thereof
JP6398405B2 (en) * 2014-07-15 2018-10-03 富士電機株式会社 Semiconductor device and manufacturing method of semiconductor device
JP6150866B2 (en) * 2015-11-02 2017-06-21 三菱電機株式会社 Power semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012138475A (en) * 2010-12-27 2012-07-19 Toyota Motor Corp Semiconductor module and method for manufacturing the same
JP2012142465A (en) * 2011-01-04 2012-07-26 Mitsubishi Electric Corp Semiconductor device
JP2015008242A (en) * 2013-06-26 2015-01-15 三菱電機株式会社 Power semiconductor device

Also Published As

Publication number Publication date
JP7134345B2 (en) 2022-09-09
WO2020240699A1 (en) 2020-12-03
CN113841235B (en) 2024-05-24
CN113841235A (en) 2021-12-24

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