JPWO2020230286A1 - - Google Patents

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Publication number
JPWO2020230286A1
JPWO2020230286A1 JP2021519197A JP2021519197A JPWO2020230286A1 JP WO2020230286 A1 JPWO2020230286 A1 JP WO2020230286A1 JP 2021519197 A JP2021519197 A JP 2021519197A JP 2021519197 A JP2021519197 A JP 2021519197A JP WO2020230286 A1 JPWO2020230286 A1 JP WO2020230286A1
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JP
Japan
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Application number
JP2021519197A
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JP7155414B2 (ja
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Publication of JPWO2020230286A1 publication Critical patent/JPWO2020230286A1/ja
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Publication of JP7155414B2 publication Critical patent/JP7155414B2/ja
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/261—Details
    • H01J37/265—Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6116—Specific applications or type of materials patterned objects; electronic devices semiconductor wafer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/646—Specific applications or type of materials flaws, defects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G06T2207/10061—Microscopic image from scanning electron microscope
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/21—Focus adjustment
    • H01J2237/216—Automatic focusing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2814—Measurement of surface topography
    • H01J2237/2816—Length

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2021519197A 2019-05-15 2019-05-15 検査装置調整システムおよび検査装置調整方法 Active JP7155414B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/019274 WO2020230286A1 (ja) 2019-05-15 2019-05-15 検査装置調整システムおよび検査装置調整方法

Publications (2)

Publication Number Publication Date
JPWO2020230286A1 true JPWO2020230286A1 (ja) 2020-11-19
JP7155414B2 JP7155414B2 (ja) 2022-10-18

Family

ID=73290280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021519197A Active JP7155414B2 (ja) 2019-05-15 2019-05-15 検査装置調整システムおよび検査装置調整方法

Country Status (6)

Country Link
US (1) US11898968B2 (ja)
JP (1) JP7155414B2 (ja)
KR (1) KR102654208B1 (ja)
CN (1) CN113767459B (ja)
TW (1) TWI756662B (ja)
WO (1) WO2020230286A1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010182895A (ja) * 2009-02-06 2010-08-19 Hitachi High-Technologies Corp パターン測定条件設定方法、及びパターン測定条件設定装置
JP2012049411A (ja) * 2010-08-30 2012-03-08 Hitachi High-Technologies Corp 半導体製造装置の管理装置、及びコンピュータプログラム
JP2012104264A (ja) * 2010-11-08 2012-05-31 Hitachi High-Technologies Corp 走査型電子顕微鏡および該装置の制御方法
JP2013200180A (ja) * 2012-03-23 2013-10-03 Toshiba Corp パターン形状計測装置およびパターン形状計測方法
WO2015198926A1 (ja) * 2014-06-27 2015-12-30 株式会社 日立ハイテクノロジーズ パターン測定条件設定装置、及びパターン測定装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3333680B2 (ja) 1996-03-06 2002-10-15 株式会社日立製作所 走査電子顕微鏡
JP4230968B2 (ja) 2004-07-20 2009-02-25 株式会社日立ハイテクノロジーズ 荷電粒子線装置
JP2006118870A (ja) * 2004-10-19 2006-05-11 Olympus Corp 検査条件設定方法及び検査条件設定装置並びにコンピュータプログラム
JP2006332202A (ja) * 2005-05-24 2006-12-07 Mitsubishi Chemicals Corp 発光装置、発光装置の製造方法、及びそれを用いた照明装置、画像表示装置用バックライト並びに画像表示装置
JP4990556B2 (ja) * 2006-05-15 2012-08-01 株式会社日立製作所 半導体検査装置および半導体装置の検査方法
JP4908934B2 (ja) * 2006-06-08 2012-04-04 株式会社日立ハイテクノロジーズ 半導体ウェーハ検査装置および半導体ウェーハ検査方法
US8102408B2 (en) * 2006-06-29 2012-01-24 Kla-Tencor Technologies Corp. Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs
JP4801545B2 (ja) * 2006-09-11 2011-10-26 株式会社日立ハイテクノロジーズ 欠陥検査解析システム、欠陥検査解析方法及びこれに用いる管理コンピュータ
JP5103050B2 (ja) * 2007-04-06 2012-12-19 株式会社日立ハイテクノロジーズ 電子線応用装置
JP5159373B2 (ja) * 2008-03-06 2013-03-06 オリンパス株式会社 基板検査方法
JP2009216401A (ja) * 2008-03-07 2009-09-24 Olympus Corp 基板検査システムおよび基板検査方法
JP5374225B2 (ja) * 2009-05-14 2013-12-25 株式会社日立ハイテクノロジーズ ウェハ検査条件決定方法、ウェハ検査条件決定システム及びウェハ検査システム
JP5579588B2 (ja) * 2010-12-16 2014-08-27 株式会社日立ハイテクノロジーズ 欠陥観察方法及びその装置
JP5953842B2 (ja) * 2012-03-14 2016-07-20 オムロン株式会社 画像検査方法および検査領域設定方法
JP6423011B2 (ja) * 2015-01-23 2018-11-14 株式会社日立ハイテクノロジーズ パターン測定装置及び欠陥検査装置
JP6353008B2 (ja) * 2016-11-02 2018-07-04 ファナック株式会社 検査条件決定装置、検査条件決定方法及び検査条件決定プログラム
JP6935641B2 (ja) * 2017-09-27 2021-09-15 株式会社日立ハイテク システム、特定検査向け支援方法およびプログラム
US11415526B2 (en) * 2020-05-06 2022-08-16 Kla Corporation Multi-controller inspection system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010182895A (ja) * 2009-02-06 2010-08-19 Hitachi High-Technologies Corp パターン測定条件設定方法、及びパターン測定条件設定装置
JP2012049411A (ja) * 2010-08-30 2012-03-08 Hitachi High-Technologies Corp 半導体製造装置の管理装置、及びコンピュータプログラム
JP2012104264A (ja) * 2010-11-08 2012-05-31 Hitachi High-Technologies Corp 走査型電子顕微鏡および該装置の制御方法
JP2013200180A (ja) * 2012-03-23 2013-10-03 Toshiba Corp パターン形状計測装置およびパターン形状計測方法
WO2015198926A1 (ja) * 2014-06-27 2015-12-30 株式会社 日立ハイテクノロジーズ パターン測定条件設定装置、及びパターン測定装置

Also Published As

Publication number Publication date
KR20210147022A (ko) 2021-12-06
TW202044309A (zh) 2020-12-01
US20220252525A1 (en) 2022-08-11
JP7155414B2 (ja) 2022-10-18
TWI756662B (zh) 2022-03-01
US11898968B2 (en) 2024-02-13
WO2020230286A1 (ja) 2020-11-19
KR102654208B1 (ko) 2024-04-04
CN113767459B (zh) 2023-08-11
CN113767459A (zh) 2021-12-07

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