JPWO2020225885A1 - - Google Patents

Info

Publication number
JPWO2020225885A1
JPWO2020225885A1 JP2021518259A JP2021518259A JPWO2020225885A1 JP WO2020225885 A1 JPWO2020225885 A1 JP WO2020225885A1 JP 2021518259 A JP2021518259 A JP 2021518259A JP 2021518259 A JP2021518259 A JP 2021518259A JP WO2020225885 A1 JPWO2020225885 A1 JP WO2020225885A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021518259A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020225885A1 publication Critical patent/JPWO2020225885A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/032—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials
    • H01F1/04—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys
    • H01F1/047—Alloys characterised by their composition
    • H01F1/053—Alloys characterised by their composition containing rare earth metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021518259A 2019-05-08 2019-05-08 Pending JPWO2020225885A1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/018445 WO2020225885A1 (ja) 2019-05-08 2019-05-08 希土類ボンド磁石用コンパウンド、希土類ボンド磁石、希土類ボンド磁石の製造方法、及び樹脂組成物

Publications (1)

Publication Number Publication Date
JPWO2020225885A1 true JPWO2020225885A1 (ja) 2020-11-12

Family

ID=73051517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021518259A Pending JPWO2020225885A1 (ja) 2019-05-08 2019-05-08

Country Status (3)

Country Link
JP (1) JPWO2020225885A1 (ja)
CN (1) CN113795896A (ja)
WO (1) WO2020225885A1 (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08109244A (ja) * 1994-10-07 1996-04-30 Nippon Kayaku Co Ltd 金属粉バインダー用エポキシ樹脂及びその硬化物
JPH11312603A (ja) * 1998-04-30 1999-11-09 Seiko Epson Corp 希土類ボンド磁石、希土類ボンド磁石用組成物および希土類ボンド磁石の製造方法
JP2013021221A (ja) * 2011-07-13 2013-01-31 Nitto Denko Corp 半導体装置用の接着フィルム、フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
JP2017031295A (ja) * 2015-07-31 2017-02-09 日立化成株式会社 Ｓｍ系ボンド磁石用樹脂コンパウンドおよびそれを用いたボンド磁石並びにＳｍ系ボンド磁石の製造方法
JP2017034097A (ja) * 2015-07-31 2017-02-09 日立化成株式会社 Ｎｄ−Ｆｅ−Ｂ系ボンド磁石用樹脂コンパウンド、Ｎｄ−Ｆｅ−Ｂ系ボンド磁石及びその製造方法
JP2018203812A (ja) * 2017-05-30 2018-12-27 日立化成株式会社 シート

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08109244A (ja) * 1994-10-07 1996-04-30 Nippon Kayaku Co Ltd 金属粉バインダー用エポキシ樹脂及びその硬化物
JPH11312603A (ja) * 1998-04-30 1999-11-09 Seiko Epson Corp 希土類ボンド磁石、希土類ボンド磁石用組成物および希土類ボンド磁石の製造方法
JP2013021221A (ja) * 2011-07-13 2013-01-31 Nitto Denko Corp 半導体装置用の接着フィルム、フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
JP2017031295A (ja) * 2015-07-31 2017-02-09 日立化成株式会社 Ｓｍ系ボンド磁石用樹脂コンパウンドおよびそれを用いたボンド磁石並びにＳｍ系ボンド磁石の製造方法
JP2017034097A (ja) * 2015-07-31 2017-02-09 日立化成株式会社 Ｎｄ−Ｆｅ−Ｂ系ボンド磁石用樹脂コンパウンド、Ｎｄ−Ｆｅ−Ｂ系ボンド磁石及びその製造方法
JP2018203812A (ja) * 2017-05-30 2018-12-27 日立化成株式会社 シート

Also Published As

Publication number Publication date
WO2020225885A1 (ja) 2020-11-12
CN113795896A (zh) 2021-12-14

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