JPWO2020203109A1 - - Google Patents

Info

Publication number
JPWO2020203109A1
JPWO2020203109A1 JP2020538160A JP2020538160A JPWO2020203109A1 JP WO2020203109 A1 JPWO2020203109 A1 JP WO2020203109A1 JP 2020538160 A JP2020538160 A JP 2020538160A JP 2020538160 A JP2020538160 A JP 2020538160A JP WO2020203109 A1 JPWO2020203109 A1 JP WO2020203109A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020538160A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020203109A1 publication Critical patent/JPWO2020203109A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/027—Graded interfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
JP2020538160A 2019-03-29 2020-03-11 Pending JPWO2020203109A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019066489 2019-03-29
PCT/JP2020/010456 WO2020203109A1 (fr) 2019-03-29 2020-03-11 Film métallisé et son procédé de fabrication

Publications (1)

Publication Number Publication Date
JPWO2020203109A1 true JPWO2020203109A1 (fr) 2020-10-08

Family

ID=72668633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020538160A Pending JPWO2020203109A1 (fr) 2019-03-29 2020-03-11

Country Status (4)

Country Link
JP (1) JPWO2020203109A1 (fr)
KR (1) KR20210149689A (fr)
CN (1) CN113631370B (fr)
WO (1) WO2020203109A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023228602A1 (fr) * 2022-05-27 2023-11-30 東レＫｐフィルム株式会社 Feuille métallique avec film antiadhésif et son procédé de fabrication, et procédé de fabrication de film de blindage électromagnétique

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58130153A (ja) 1982-01-29 1983-08-03 太平洋セメント株式会社 Ａｌｃ版面の小さな凹部を被覆補修する充填材
JP2007243122A (ja) * 2006-03-06 2007-09-20 Be-Spputer Co Ltd スパッタリング法によるシールド膜の成膜方法及び成膜されたシールド膜
JP2008109022A (ja) * 2006-10-27 2008-05-08 Fujifilm Corp 透光導電性電磁波シールドフィルム及びその製造方法
JP4974803B2 (ja) * 2007-08-03 2012-07-11 タツタ電線株式会社 プリント配線板用シールドフィルム及びプリント配線板
JP6219383B2 (ja) * 2013-05-29 2017-10-25 タツタ電線株式会社 電磁波シールドフィルム、圧延銅箔、シールドプリント配線板、電磁波シールドフィルムの製造方法、金属薄膜の製造方法、及び、シールドプリント配線板の製造方法
KR101375237B1 (ko) * 2013-09-13 2014-03-18 신창핫멜트 주식회사 전자파 차폐용 얇은 금속화 필름의 제조방법 및 그에 의한 금속화 필름
JP6650660B2 (ja) * 2014-01-20 2020-02-19 東洋インキＳｃホールディングス株式会社 フレキシブルプリント配線板用電磁波シールドシート、および電磁波シールドシート付きフレキシブルプリント配線板
JP6446823B2 (ja) * 2014-04-25 2019-01-09 宇部興産株式会社 電磁波遮蔽体の製造方法
CN107405880B (zh) * 2015-03-27 2020-06-30 琳得科株式会社 透明导电层叠层用膜、其制造方法及透明导电膜
JP6671051B2 (ja) * 2015-08-18 2020-03-25 東レＫｐフィルム株式会社 金属化フィルムおよび金属化フィルムの製造方法
JP6949724B2 (ja) 2015-12-25 2021-10-13 タツタ電線株式会社 電磁波シールドフィルム及びその製造方法
JP2017147276A (ja) * 2016-02-15 2017-08-24 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
JP6706654B2 (ja) * 2018-10-01 2020-06-10 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法

Also Published As

Publication number Publication date
KR20210149689A (ko) 2021-12-09
CN113631370B (zh) 2023-06-09
TW202044977A (zh) 2020-12-01
CN113631370A (zh) 2021-11-09
WO2020203109A1 (fr) 2020-10-08

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