JPWO2020195301A1 - - Google Patents

Info

Publication number
JPWO2020195301A1
JPWO2020195301A1 JP2021508237A JP2021508237A JPWO2020195301A1 JP WO2020195301 A1 JPWO2020195301 A1 JP WO2020195301A1 JP 2021508237 A JP2021508237 A JP 2021508237A JP 2021508237 A JP2021508237 A JP 2021508237A JP WO2020195301 A1 JPWO2020195301 A1 JP WO2020195301A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021508237A
Other versions
JP7176615B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020195301A1 publication Critical patent/JPWO2020195301A1/ja
Application granted granted Critical
Publication of JP7176615B2 publication Critical patent/JP7176615B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2021508237A 2019-03-28 2020-02-14 電子機器 Active JP7176615B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019062948 2019-03-28
JP2019062948 2019-03-28
PCT/JP2020/005719 WO2020195301A1 (ja) 2019-03-28 2020-02-14 電子機器

Publications (2)

Publication Number Publication Date
JPWO2020195301A1 true JPWO2020195301A1 (ja) 2020-10-01
JP7176615B2 JP7176615B2 (ja) 2022-11-22

Family

ID=72608756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508237A Active JP7176615B2 (ja) 2019-03-28 2020-02-14 電子機器

Country Status (3)

Country Link
US (1) US20220151113A1 (ja)
JP (1) JP7176615B2 (ja)
WO (1) WO2020195301A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11644249B2 (en) * 2018-04-02 2023-05-09 Nec Corporation Electronic apparatus
US20230032004A1 (en) * 2020-01-06 2023-02-02 Lg Electronics Inc. Display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006261457A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 受熱体、受熱装置及び電子機器
JP2008518468A (ja) * 2004-10-29 2008-05-29 スリーエム イノベイティブ プロパティズ カンパニー 浸漬冷却装置
JP2009139005A (ja) * 2007-12-05 2009-06-25 Yokohama National Univ 冷却器及びその冷却器を備える冷却装置
JP2009206369A (ja) * 2008-02-28 2009-09-10 Panasonic Corp 半導体装置
WO2015174423A1 (ja) * 2014-05-12 2015-11-19 国立大学法人横浜国立大学 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000256A (en) * 1990-07-20 1991-03-19 Minnesota Mining And Manufacturing Company Heat transfer bag with thermal via
US7157793B2 (en) * 2003-11-12 2007-01-02 U.S. Monolithics, L.L.C. Direct contact semiconductor cooling
US7079393B2 (en) * 2004-11-16 2006-07-18 International Business Machines Corporation Fluidic cooling systems and methods for electronic components
US8014150B2 (en) * 2009-06-25 2011-09-06 International Business Machines Corporation Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
JP4801797B1 (ja) * 2010-03-10 2011-10-26 パナソニック株式会社 半導体装置及びその製造方法
US8981556B2 (en) * 2013-03-19 2015-03-17 Toyota Motor Engineering & Manufacturing North America, Inc. Jet impingement cooling apparatuses having non-uniform jet orifice sizes
JP6627901B2 (ja) * 2018-02-23 2020-01-08 日本電気株式会社 電子機器および電子装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008518468A (ja) * 2004-10-29 2008-05-29 スリーエム イノベイティブ プロパティズ カンパニー 浸漬冷却装置
JP2006261457A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 受熱体、受熱装置及び電子機器
JP2009139005A (ja) * 2007-12-05 2009-06-25 Yokohama National Univ 冷却器及びその冷却器を備える冷却装置
JP2009206369A (ja) * 2008-02-28 2009-09-10 Panasonic Corp 半導体装置
WO2015174423A1 (ja) * 2014-05-12 2015-11-19 国立大学法人横浜国立大学 冷却器及びそれを用いた冷却装置、並びに、発熱体の冷却方法

Also Published As

Publication number Publication date
JP7176615B2 (ja) 2022-11-22
US20220151113A1 (en) 2022-05-12
WO2020195301A1 (ja) 2020-10-01

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