JPWO2020195024A1 - - Google Patents

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Publication number
JPWO2020195024A1
JPWO2020195024A1 JP2021508108A JP2021508108A JPWO2020195024A1 JP WO2020195024 A1 JPWO2020195024 A1 JP WO2020195024A1 JP 2021508108 A JP2021508108 A JP 2021508108A JP 2021508108 A JP2021508108 A JP 2021508108A JP WO2020195024 A1 JPWO2020195024 A1 JP WO2020195024A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021508108A
Other versions
JP7285403B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2020195024A1 publication Critical patent/JPWO2020195024A1/ja
Application granted granted Critical
Publication of JP7285403B2 publication Critical patent/JP7285403B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021508108A 2019-03-28 2020-01-15 情報処理装置 Active JP7285403B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019062140 2019-03-28
JP2019062140 2019-03-28
PCT/JP2020/000979 WO2020195024A1 (ja) 2019-03-28 2020-01-15 情報処理装置

Publications (2)

Publication Number Publication Date
JPWO2020195024A1 true JPWO2020195024A1 (ja) 2020-10-01
JP7285403B2 JP7285403B2 (ja) 2023-06-02

Family

ID=72610481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021508108A Active JP7285403B2 (ja) 2019-03-28 2020-01-15 情報処理装置

Country Status (2)

Country Link
JP (1) JP7285403B2 (ja)
WO (1) WO2020195024A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7440438B2 (ja) 2021-02-03 2024-02-28 株式会社日立製作所 公差解析システム
CN116673559B (zh) * 2023-08-04 2023-10-20 苏州荣文库柏照明系统股份有限公司 一种锡量可调节的led灯模组生产用焊锡装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05191034A (ja) * 1992-01-17 1993-07-30 Sharp Corp リフロー方式のプリント配線基板
JPH11175577A (ja) * 1997-12-10 1999-07-02 Hitachi Ltd 仮想製造支援設計方法及び仮想製造支援設計システム
JP2006216589A (ja) * 2005-02-01 2006-08-17 Omron Corp プリント基板の品質管理システム
JP2010271165A (ja) * 2009-05-21 2010-12-02 Aisin Aw Co Ltd プリント基板の検査装置
JP2016063105A (ja) * 2014-09-19 2016-04-25 三菱電機株式会社 プリント配線板
JP2018072029A (ja) * 2016-10-25 2018-05-10 ファナック株式会社 学習モデル構築装置、故障予測システム、学習モデル構築方法及び学習モデル構築プログラム
WO2018139571A1 (ja) * 2017-01-30 2018-08-02 三菱電機株式会社 はんだ付けシステム、制御装置、制御方法およびプログラム

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05191034A (ja) * 1992-01-17 1993-07-30 Sharp Corp リフロー方式のプリント配線基板
JPH11175577A (ja) * 1997-12-10 1999-07-02 Hitachi Ltd 仮想製造支援設計方法及び仮想製造支援設計システム
JP2006216589A (ja) * 2005-02-01 2006-08-17 Omron Corp プリント基板の品質管理システム
JP2010271165A (ja) * 2009-05-21 2010-12-02 Aisin Aw Co Ltd プリント基板の検査装置
JP2016063105A (ja) * 2014-09-19 2016-04-25 三菱電機株式会社 プリント配線板
JP2018072029A (ja) * 2016-10-25 2018-05-10 ファナック株式会社 学習モデル構築装置、故障予測システム、学習モデル構築方法及び学習モデル構築プログラム
WO2018139571A1 (ja) * 2017-01-30 2018-08-02 三菱電機株式会社 はんだ付けシステム、制御装置、制御方法およびプログラム

Also Published As

Publication number Publication date
JP7285403B2 (ja) 2023-06-02
WO2020195024A1 (ja) 2020-10-01

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