JPWO2020170382A1 - - Google Patents

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Publication number
JPWO2020170382A1
JPWO2020170382A1 JP2021501222A JP2021501222A JPWO2020170382A1 JP WO2020170382 A1 JPWO2020170382 A1 JP WO2020170382A1 JP 2021501222 A JP2021501222 A JP 2021501222A JP 2021501222 A JP2021501222 A JP 2021501222A JP WO2020170382 A1 JPWO2020170382 A1 JP WO2020170382A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021501222A
Other versions
JP7180745B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020170382A1 publication Critical patent/JPWO2020170382A1/ja
Priority to JP2022183082A priority Critical patent/JP7435703B2/ja
Application granted granted Critical
Publication of JP7180745B2 publication Critical patent/JP7180745B2/ja
Priority to JP2024015552A priority patent/JP2024050791A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/03—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring coordinates of points
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0972—Prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/04—Prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/18—Diffraction gratings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7026—Focusing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/7034—Leveling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/24—Base structure
    • G02B21/241—Devices for focusing
    • G02B21/245—Devices for focusing using auxiliary sources, detectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2021501222A 2019-02-21 2019-02-21 面位置検出装置、露光装置、基板処理システム、およびデバイス製造方法 Active JP7180745B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022183082A JP7435703B2 (ja) 2019-02-21 2022-11-16 面位置検出装置、露光装置、デバイス製造方法、および基板処理システム
JP2024015552A JP2024050791A (ja) 2019-02-21 2024-02-05 面位置検出装置、露光装置、デバイス製造方法、および基板処理システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/006506 WO2020170382A1 (ja) 2019-02-21 2019-02-21 面位置検出装置、露光装置、基板処理システム、およびデバイス製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022183082A Division JP7435703B2 (ja) 2019-02-21 2022-11-16 面位置検出装置、露光装置、デバイス製造方法、および基板処理システム

Publications (2)

Publication Number Publication Date
JPWO2020170382A1 true JPWO2020170382A1 (ja) 2020-08-27
JP7180745B2 JP7180745B2 (ja) 2022-11-30

Family

ID=72144107

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2021501222A Active JP7180745B2 (ja) 2019-02-21 2019-02-21 面位置検出装置、露光装置、基板処理システム、およびデバイス製造方法
JP2022183082A Active JP7435703B2 (ja) 2019-02-21 2022-11-16 面位置検出装置、露光装置、デバイス製造方法、および基板処理システム
JP2024015552A Pending JP2024050791A (ja) 2019-02-21 2024-02-05 面位置検出装置、露光装置、デバイス製造方法、および基板処理システム

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2022183082A Active JP7435703B2 (ja) 2019-02-21 2022-11-16 面位置検出装置、露光装置、デバイス製造方法、および基板処理システム
JP2024015552A Pending JP2024050791A (ja) 2019-02-21 2024-02-05 面位置検出装置、露光装置、デバイス製造方法、および基板処理システム

Country Status (6)

Country Link
US (1) US20220216119A1 (ja)
EP (1) EP3929529B1 (ja)
JP (3) JP7180745B2 (ja)
KR (1) KR20210129077A (ja)
CN (1) CN113490831B (ja)
WO (1) WO2020170382A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3715930B3 (en) * 2017-11-22 2024-05-01 FUJIFILM Corporation Observation device, method for operating observation device, and observation control program
KR20210129077A (ko) * 2019-02-21 2021-10-27 가부시키가이샤 니콘 면 위치 검출 장치, 노광 장치, 기판 처리 시스템 및 디바이스 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1038513A (ja) * 1996-07-22 1998-02-13 Nikon Corp 表面高さ計測装置及び、これを用いた露光装置
JPH1126359A (ja) * 1997-07-09 1999-01-29 Nikon Corp 面位置検出装置、該装置を備えた露光装置、及び該装置を用いたデバイスの製造方法
JP2013110398A (ja) * 2011-11-21 2013-06-06 Asml Netherlands Bv レベルセンサ、基板の高さマップを決定する方法、及びリソグラフィ装置
JP2013236074A (ja) * 2012-05-08 2013-11-21 Nikon Corp 面位置計測装置、露光装置、およびデバイス製造方法
WO2017153069A1 (en) * 2016-03-07 2017-09-14 Asml Netherlands B.V. Level sensor and lithographic apparatus

Family Cites Families (21)

* Cited by examiner, † Cited by third party
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JPH0820208B2 (ja) * 1985-03-26 1996-03-04 株式会社東芝 位置測定方法
US5162642A (en) * 1985-11-18 1992-11-10 Canon Kabushiki Kaisha Device for detecting the position of a surface
NL9100410A (nl) * 1991-03-07 1992-10-01 Asm Lithography Bv Afbeeldingsapparaat voorzien van een focusfout- en/of scheefstandsdetectie-inrichting.
US5331369A (en) * 1991-09-20 1994-07-19 Hitachi, Ltd. Method of forming patterns and apparatus for carrying out the same
JP3204406B2 (ja) * 1991-10-30 2001-09-04 株式会社ニコン 面位置検出方法及び装置、半導体露光装置、並びに前記方法を用いた露光方法
JP2548068B2 (ja) * 1993-02-22 1996-10-30 株式会社ソルテック 位置ずれ及びギャップ検出方法
JP3994209B2 (ja) * 1998-08-28 2007-10-17 株式会社ニコン 光学系の検査装置および検査方法並びに該検査装置を備えた位置合わせ装置および投影露光装置
JP2000081320A (ja) * 1998-09-03 2000-03-21 Canon Inc 面位置検出装置及びそれを用いたデバイスの製造方法
CN1309017C (zh) * 1998-11-18 2007-04-04 株式会社尼康 曝光方法和装置
JP2002334827A (ja) * 2001-05-09 2002-11-22 Nikon Corp 面位置検出装置、露光装置、及びマイクロデバイスの製造方法
US6947148B2 (en) * 2001-07-24 2005-09-20 Zygo Corporation Interferometric apparatus and method with phase shift compensation
KR101447391B1 (ko) * 2005-07-08 2014-10-06 가부시키가이샤 니콘 면 위치 검출 장치, 노광 장치 및 노광 방법
JP5581563B2 (ja) * 2007-03-08 2014-09-03 株式会社日立製作所 照明装置並びにそれを用いた欠陥検査装置及びその方法並びに高さ計測装置及びその方法
US8502978B2 (en) * 2008-09-09 2013-08-06 Nikon Corporation Surface position detecting apparatus, exposure apparatus, surface position detecting method, and device manufacturing method
US20100231881A1 (en) 2009-03-13 2010-09-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2013168456A1 (ja) * 2012-05-07 2013-11-14 株式会社ニコン 面位置計測装置、露光装置、およびデバイス製造方法
JP5881051B2 (ja) * 2012-10-05 2016-03-09 国立大学法人 香川大学 分光特性測定装置
JP2014229803A (ja) * 2013-05-24 2014-12-08 株式会社ニコン 面位置計測装置、露光装置、およびデバイス製造方法
JP2015032800A (ja) * 2013-08-07 2015-02-16 キヤノン株式会社 リソグラフィ装置、および物品製造方法
NL2015812A (en) * 2014-12-22 2016-09-22 Asml Netherlands Bv Level sensor, lithographic apparatus and device manufacturing method.
KR20210129077A (ko) * 2019-02-21 2021-10-27 가부시키가이샤 니콘 면 위치 검출 장치, 노광 장치, 기판 처리 시스템 및 디바이스 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1038513A (ja) * 1996-07-22 1998-02-13 Nikon Corp 表面高さ計測装置及び、これを用いた露光装置
JPH1126359A (ja) * 1997-07-09 1999-01-29 Nikon Corp 面位置検出装置、該装置を備えた露光装置、及び該装置を用いたデバイスの製造方法
JP2013110398A (ja) * 2011-11-21 2013-06-06 Asml Netherlands Bv レベルセンサ、基板の高さマップを決定する方法、及びリソグラフィ装置
JP2013236074A (ja) * 2012-05-08 2013-11-21 Nikon Corp 面位置計測装置、露光装置、およびデバイス製造方法
WO2017153069A1 (en) * 2016-03-07 2017-09-14 Asml Netherlands B.V. Level sensor and lithographic apparatus

Also Published As

Publication number Publication date
WO2020170382A1 (ja) 2020-08-27
KR20210129077A (ko) 2021-10-27
EP3929529A4 (en) 2022-10-12
TW202040095A (zh) 2020-11-01
US20220216119A1 (en) 2022-07-07
JP2024050791A (ja) 2024-04-10
JP7180745B2 (ja) 2022-11-30
JP2023022106A (ja) 2023-02-14
EP3929529B1 (en) 2024-09-25
EP3929529A1 (en) 2021-12-29
CN113490831B (zh) 2024-08-09
CN113490831A (zh) 2021-10-08
JP7435703B2 (ja) 2024-02-21

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