JPWO2020152967A1 - Copper alloy plate material and its manufacturing method - Google Patents

Copper alloy plate material and its manufacturing method Download PDF

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JPWO2020152967A1
JPWO2020152967A1 JP2020513364A JP2020513364A JPWO2020152967A1 JP WO2020152967 A1 JPWO2020152967 A1 JP WO2020152967A1 JP 2020513364 A JP2020513364 A JP 2020513364A JP 2020513364 A JP2020513364 A JP 2020513364A JP WO2020152967 A1 JPWO2020152967 A1 JP WO2020152967A1
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JP6762453B1 (en
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翔一 檀上
翔一 檀上
樋口　優
優 樋口
俊太 秋谷
俊太 秋谷
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

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  • Crystallography & Structural Chemistry (AREA)
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Abstract

本発明の銅合金板材は、Ｃｏを０．３〜２．５質量％およびＳｉを０．１〜０．７質量％含有し、残部がＣｕおよび不可避不純物からなる合金組成を有する銅合金板材であって、銅合金板材の圧延方向に平行な縦断面に対し、ＥＢＳＤ法によって行なった結晶方位解析は、信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率が４０％以下であり、かつ、前記縦断面を、板材の両表面をそれぞれ含む１対の表層部と、１対の表層部に挟まれて位置する中央部とに区分し、１対の表層部の信頼性指数（ＣＩ値）の平均値をＣＩＳとし、中央部の信頼性指数（ＣＩ値）の平均値をＣＩＣとするとき、ＣＩＣに対するＣＩＳの比（ＣＩＳ／ＣＩＣ比）が、０．８以上２．０以下であり、優れた曲げ加工性と高強度を高いレベルで両立させることができる。The copper alloy plate material of the present invention is a copper alloy plate material having an alloy composition containing 0.3 to 2.5% by mass of Co and 0.1 to 0.7% by mass of Si and the balance being Cu and unavoidable impurities. Therefore, the crystal orientation analysis performed by the EBSD method for the vertical cross section parallel to the rolling direction of the copper alloy plate is the total measurement spot area of the measurement spot area where the reliability index (CI value) is 0.2 or less. The area ratio to 40% or less is 40% or less, and the vertical cross section is divided into a pair of surface layer portions including both surfaces of the plate material and a central portion located between the pair of surface layer portions. When the average value of the reliability index (CI value) of the pair of surface layers is CIS and the average value of the reliability index (CI value) of the central part is CIC, the ratio of CIS to CIC (CIS / CIC ratio) However, it is 0.8 or more and 2.0 or less, and excellent bending workability and high strength can be achieved at a high level.

Description

本発明は、銅合金板材およびその製造方法に関する。 The present invention relates to a copper alloy plate material and a method for producing the same.

銅合金板材、例えば電気・電子部品や自動車車載部品に用いられる銅合金板材としては、従来は、主に析出強化や加工硬化によって強化された高強度銅合金であるＣｕ−Ｎｉ−Ｓｉ系合金（コルソン系合金）が広く用いられてきた。 Copper alloy plate materials, for example, copper alloy plate materials used for electrical / electronic parts and automobile in-vehicle parts, have conventionally been Cu—Ni—Si based alloys, which are high-strength copper alloys mainly strengthened by precipitation strengthening and processing hardening. Corson alloys) have been widely used.

しかしながら、Ｃｕ−Ｎｉ−Ｓｉ系合金は、導電率は最大でも５０％ＩＡＣＳ程度であり、大電流で通電すると抵抗発熱量が多くなり、熱によって接点部のばね性の低下や、端子を固定するモールドの劣化などにより、端子の機能が著しく低下するおそれがあることから、大電流用の端子材料として用いるには適さない。 However, the Cu-Ni-Si alloy has a conductivity of about 50% IACS at the maximum, and when energized with a large current, the amount of heat generated by resistance increases, and the heat reduces the springiness of the contact part and fixes the terminals. It is not suitable for use as a terminal material for large currents because the function of the terminal may be significantly deteriorated due to deterioration of the mold or the like.

このため、Ｃｕ−Ｎｉ−Ｓｉ系合金に代わる端子材料を開発することが求められている。例えば特許文献１には、Ｃｕ−Ｎｉ−Ｓｉ系合金に代えて、Ｃｕ−Ｃｏ−Ｓｉ系合金を用い、再結晶組織において等軸粒と双晶粒界の頻度を制御することで、板材の曲げ加工性と導電性を改善できることが開示されている。 Therefore, it is required to develop a terminal material to replace the Cu—Ni—Si alloy. For example, in Patent Document 1, a Cu—Co—Si alloy is used instead of the Cu—Ni—Si alloy, and the frequency of equiaxed grains and twin grain boundaries is controlled in the recrystallization structure of the plate material. It is disclosed that bendability and conductivity can be improved.

しかしながら、特許文献１に記載のＣｕ−Ｃｏ−Ｓｉ系合金条は、曲げ加工性や強度に大きく影響する歪みについては何ら検討がなされておらず、曲げ加工性や強度に関してはさらに改善の余地があった。 However, in the Cu—Co—Si alloy strip described in Patent Document 1, no study has been made on the strain that greatly affects the bending workability and strength, and there is room for further improvement in the bending workability and strength. there were.

また、特許文献２では、Ｍｇを３．３原子％以上６．９原子％以下の範囲を含む銅合金において、加工時に導入された歪みを、ＳＥＭ−ＥＢＳＤ法により測定した、圧延の幅方向に対して垂直な面（すなわちＴＤ面）のＣＩ値の低い測定点の割合で規定した範囲に収めることで、曲げ加工性が向上できるとしている。 Further, in Patent Document 2, in a copper alloy containing Mg in the range of 3.3 atomic% or more and 6.9 atomic% or less, the strain introduced during processing is measured in the rolling width direction measured by the SEM-EBSD method. On the other hand, it is said that the bending workability can be improved by keeping the ratio of the measurement points having a low CI value on the vertical surface (that is, the TD surface) within the specified range.

さらに、特許文献３では、Ｔｉを２．０〜４．０質量％含有するチタン銅において、表面の歪みをＳＥＭ−ＥＢＳＤ法により測定した信頼性指数（ＣＩ値）が０．２以下の面積率が２０％以下とすることで、曲げ加工性を向上させることができるとしている。 Further, in Patent Document 3, in titanium copper containing 2.0 to 4.0% by mass of Ti, the area ratio having a reliability index (CI value) of 0.2 or less measured by the SEM-EBSD method for surface strain is 0.2 or less. It is said that the bending workability can be improved by setting the value to 20% or less.

特許文献２および３はいずれも、曲げ加工性の向上が認められるものの、Ｃｕ−Ｃｏ−Ｓｉ系合金に関しては記載がなく、加えて、特許文献２には、導電率が３１．８〜４５．１％ＩＡＣＳの範囲と低い数値しか得られておらず、また、特許文献３には導電率の数値が示されていない。 Although Patent Documents 2 and 3 all show improvement in bending workability, there is no description about Cu—Co—Si based alloys. In addition, Patent Document 2 has a conductivity of 31.8 to 45. Only a low value in the range of 1% IACS is obtained, and Patent Document 3 does not show a value of conductivity.

特許第５５３４６１０号公報Japanese Patent No. 5534610 特許第５９０３８３８号公報Japanese Patent No. 5903838 特許第６０８０８２２号公報Japanese Patent No. 6080822

本発明の目的は、Ｃｕ−Ｎｉ−Ｓｉ系合金よりも高い導電率を有するＣｕ−Ｃｏ−Ｓｉ系合金を用い、優れた曲げ加工性と高強度を高いレベルで両立させることができる銅合金板材およびその製造方法を提供することにある。 An object of the present invention is to use a Cu—Co—Si alloy having a higher conductivity than a Cu—Ni—Si alloy, and to achieve both excellent bending workability and high strength at a high level. And its manufacturing method.

本発明者は、Ｃｕ−Ｎｉ−Ｓｉ系よりも高い導電率を有するＣｕ−Ｃｏ−Ｓｉ系の合金組成を有する銅合金素材を用い、圧延を行なうことによって銅合金板材を製造するに当たり、圧延方向に平行な縦断面に対し、電子後方散乱回折（ＥＢＳＤ）法によって結晶方位解析を行なったところ、前記縦断面における信頼性指数（ＣＩ値）が小さい測定スポット領域の面積率を低く制御するとともに、前記縦断面の表層部と中央部のそれぞれにおける信頼性指数（ＣＩ値）の平均値の比（ＣＩＳ／ＣＩＣ比）の適正化を図ることによって、加工組織を発達させることができ、その結果、曲げ加工性を確保しつつ、強度を向上させることができることを見出し、本発明を完成させるに至った。The present inventor uses a copper alloy material having a Cu—Co—Si based alloy composition having a higher conductivity than the Cu—Ni—Si based, and rolls the copper alloy plate material in the rolling direction. When crystal orientation analysis was performed on a longitudinal section parallel to the above by electron backscatter diffraction (EBSD) method, the area ratio of the measurement spot region where the reliability index (CI value) in the longitudinal section was small was controlled to be low, and the area ratio was controlled to be low. by achieve an appropriate ratio of the average value of the reliability index (CI value) in each of the surface portion and the central portion of the longitudinal section (CI S / CI C ratio), it is possible to develop processed structure, its As a result, they have found that the strength can be improved while ensuring the bending workability, and have completed the present invention.

上記目的を達成するため、本発明の要旨構成は、以下のとおりである。
（Ｉ）Ｃｏを０．３〜２．５質量％およびＳｉを０．１〜０．７質量％含有し、残部がＣｕおよび不可避不純物からなる合金組成を有する銅合金板材であって、該銅合金板材の圧延方向に平行な縦断面に対し、電子後方散乱回折（ＥＢＳＤ）法によって行なった結晶方位解析は、信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率が４０％以下であり、かつ、前記縦断面を、板材の両表面をそれぞれ含む１対の表層部と、該１対の表層部に挟まれて位置する中央部とに区分し、前記１対の表層部の前記信頼性指数（ＣＩ値）の平均値をＣＩＳとし、前記中央部の前記信頼性指数（ＣＩ値）の平均値をＣＩＣとするとき、ＣＩＣに対するＣＩＳの比（ＣＩＳ／ＣＩＣ比）が、０．８以上２．０以下であることを特徴とする銅合金板材。
（ＩＩ）Ｃｏを０．３〜２．５質量％およびＳｉを０．１〜０．７質量％含有し、さらにＣｒを０．０５〜１．０質量％、Ｎｉを０．０５〜０．７質量％、Ｆｅを０．０２〜０．５質量％、Ｍｇを０．０１〜０．３質量％、Ｍｎを０．０１〜０．５質量％、Ｚｎを０．０１〜０．１５質量％およびＺｒを０．０１〜０．１５質量％からなる群から選択される少なくとも１種の任意添加成分を含有し、残部がＣｕおよび不可避不純物からなる合金組成を有する銅合金板材であって、該銅合金板材の長手方向に平行な縦断面に対し、電子後方散乱回折（ＥＢＳＤ）法によって行なった結晶方位解析は、信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率が４０％以下であり、かつ、前記縦断面を、板材の両表面をそれぞれ含む１対の表層部と、該１対の表層部に挟まれて位置する中央部とに区分し、前記１対の表層部の前記信頼性指数（ＣＩ値）の平均値をＣＩＳとし、前記中央部の前記信頼性指数（ＣＩ値）の平均値をＣＩＣとするとき、ＣＩＣに対するＣＩＳの比（ＣＩＳ／ＣＩＣ比）が、０．８以上２．０以下であることを特徴とする銅合金板材。
（ＩＩＩ）前記任意添加成分は、合計で１．５質量％以下含有する、上記（ＩＩ）に記載の銅合金板材。
（ＩＶ）前記圧延方向と平行に引っ張ったときの引張強度が６００ＭＰａ以上であり、導電率が５０％ＩＡＣＳ超えであり、かつ、日本伸銅協会（ＪＣＢＡ）Ｔ３０７：２００７に準拠するＷ曲げ試験をＧｏｏｄｗａｙ方向にｒ／ｔ＝０で行った後の、曲げ加工部の屈曲外面における二乗平均平方根粗さＲｑが７．０μｍ以下である、上記（Ｉ）〜（ＩＩＩ）のいずれか１項に記載の銅合金板材。
（Ｖ）上記（Ｉ）〜（ＩＶ）のいずれか１項に記載の銅合金板材を製造する方法であって、前記銅合金板材の前記合金組成と実質的に同じ合金組成を有する銅合金素材に、鋳造工程［工程１］、第１面削工程［工程２］、均質化熱処理工程［工程３］、熱間圧延工程［工程４］、冷却工程［工程５］、第２面削工程［工程６］、第１冷間圧延工程［工程７］、溶体化熱処理工程［工程８］、時効熱処理工程［工程９］、第２冷間圧延工程［工程１０］および焼鈍工程［工程１１］を順次行ない、前記均質化熱処理工程［工程３］における昇温速度を１０〜１１０℃／秒および保持温度を９５０〜１２５０℃とし、前記冷却工程［工程５］における板材の表層部での冷却開始温度を６８０〜８５０℃および平均冷却速度を５〜２０℃/秒とし、前記時効熱処理工程［工程９］における到達温度を４５０〜６５０℃および保持時間を５００〜２００００秒とし、そして、前記第２冷間圧延工程［工程１０］は、１パスあたりの加工率が１０％以上４０％以下であり、かつ、圧延ロール径をＲ、加工量をΔｈおよび最終板厚をｈとするとき、パラメータＭは、下記の（１）式で表され、６以上４０以下であることを特徴とする銅合金板材の製造方法。
Ｍ＝｛（Ｒ・Δｈ）０．５｝／ｈ ・・・・（１）
（ＶＩ）前記溶体化熱処理工程［工程８］の後、時効熱処理工程［工程９］の前に、追加の冷間圧延工程［工程１２］をさらに行なう、上記（Ｖ）に記載の銅合金板材の製造方法。In order to achieve the above object, the gist structure of the present invention is as follows.
(I) A copper alloy plate material containing 0.3 to 2.5% by mass of Co and 0.1 to 0.7% by mass of Si and having an alloy composition in which the balance is Cu and unavoidable impurities. The crystal orientation analysis performed by the electron backscatter diffraction (EBSD) method for the longitudinal section parallel to the rolling direction of the alloy plate material is the total measurement of the measurement spot region where the reliability index (CI value) is 0.2 or less. The area ratio to the spot area is 40% or less, and the vertical cross section is formed into a pair of surface layer portions including both surfaces of the plate material and a central portion located between the pair of surface layer portions. when the indicator is, the average value of the reliability index (CI value) of the surface layer portion of the pair and CI S, the average value of the reliability index (CI value) of the central portion and CI C, CI C copper alloy sheet ratio CI S (CI S / CI C ratio), which is characterized in that 0.8 to 2.0 relative to.
(II) Co is contained in an amount of 0.3 to 2.5% by mass and Si is contained in an amount of 0.1 to 0.7% by mass, Cr is contained in an amount of 0.05 to 1.0% by mass, and Ni is contained in an amount of 0.05 to 0. 7% by mass, Fe 0.02 to 0.5% by mass, Mg 0.01 to 0.3% by mass, Mn 0.01 to 0.5% by mass, Zn 0.01 to 0.15% by mass A copper alloy plate containing at least one optional additive component selected from the group consisting of% and Zr of 0.01 to 0.15% by mass and having an alloy composition in which the balance is Cu and unavoidable impurities. The crystal orientation analysis performed by the electron backscattering diffraction (EBSD) method on the longitudinal section parallel to the longitudinal direction of the copper alloy plate shows that the reliability index (CI value) is 0.2 or less in the measurement spot region. The area ratio to the total measurement spot area is 40% or less, and the vertical cross section is sandwiched between a pair of surface layer portions including both surfaces of the plate material and the pair of surface layer portions. divided into bets, the average value of the reliability index (CI value) of the surface layer portion of the pair and CI S, the average value of the reliability index (CI value) of the central portion when the CI C, the ratio of the CI S for CI C (CI S / CI C ratio), the copper alloy sheet which is characterized in that 0.8 to 2.0.
(III) The copper alloy plate material according to (II) above, wherein the optional additive component is contained in an amount of 1.5% by mass or less in total.
(IV) Perform a W bending test in which the tensile strength when pulled parallel to the rolling direction is 600 MPa or more, the conductivity exceeds 50% IACS, and the W bending test conforms to the Japan Copper and Brass Association (JCBA) T307: 2007. The item according to any one of (I) to (III) above, wherein the root mean square roughness Rq on the bent outer surface of the bent outer surface after the process at r / t = 0 in the Goodway direction is 7.0 μm or less. Copper alloy plate material.
(V) A method for producing a copper alloy plate according to any one of (I) to (IV) above, wherein the copper alloy material has substantially the same alloy composition as the alloy composition of the copper alloy plate. In addition, the casting process [process 1], the first surface cutting process [process 2], the homogenizing heat treatment process [process 3], the hot rolling process [process 4], the cooling process [process 5], and the second surface cutting process [step 5]. Step 6], 1st cold rolling step [step 7], solution heat treatment step [step 8], aging heat treatment step [step 9], 2nd cold rolling step [step 10] and annealing step [step 11]. The heating rate in the homogenizing heat treatment step [step 3] was set to 10 to 110 ° C./sec and the holding temperature was set to 950 to 1250 ° C., and the cooling start temperature at the surface layer portion of the plate material in the cooling step [step 5]. The temperature was 680 to 850 ° C. and the average cooling rate was 5 to 20 ° C./sec, the reaching temperature in the aging heat treatment step [step 9] was 450 to 650 ° C. and the holding time was 500 to 20000 seconds, and the second cooling was performed. In the inter-rolling step [step 10], when the machining rate per pass is 10% or more and 40% or less, the rolling roll diameter is R, the machining amount is Δh, and the final plate thickness is h, the parameter M is , A method for producing a copper alloy plate, which is represented by the following formula (1) and is 6 or more and 40 or less.
M = {(R · Δh) 0.5 } / h ・ ・ ・ ・ (1)
(VI) The copper alloy plate material according to (V) above, wherein an additional cold rolling step [step 12] is further performed after the solution heat treatment step [step 8] and before the aging heat treatment step [step 9]. Manufacturing method.

本発明の銅合金板材は、Ｃｏを０．３〜２．５質量％およびＳｉを０．１〜０．７質量％含有し、さらに必要に応じて、Ｃｒを０．０５〜１．０質量％、Ｎｉを０．０５〜０．７質量％、Ｆｅを０．０２〜０．５質量％、Ｍｇを０．０１〜０．３質量％、Ｍｎを０．０１〜０．５質量％、Ｚｎを０．０１〜０．１５質量％およびＺｒを０．０１〜０．１５質量％からなる群から選択される少なくとも１種の任意添加成分を含有し、残部がＣｕおよび不可避不純物からなる合金組成を有する銅合金板材であって、銅合金板材の圧延方向に平行な縦断面に対し、電子後方散乱回折（ＥＢＳＤ）法によって行なった結晶方位解析は、信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率が４０％以下であり、かつ、前記縦断面を、板材の両表面をそれぞれ含む１対の表層部と、１対の表層部に挟まれて位置する中央部とに区分し、１対の表層部の信頼性指数（ＣＩ値）の平均値をＣＩＳとし、中央部の信頼性指数（ＣＩ値）の平均値をＣＩＣとするとき、ＣＩＣに対するＣＩＳの比（ＣＩＳ／ＣＩＣ比）が、０．８以上２．０以下であることによって、Ｃｕ−Ｎｉ−Ｓｉ系合金よりも高い導電率を有するとともに、優れた曲げ加工性と高強度を高いレベルで両立させることができる。The copper alloy plate material of the present invention contains 0.3 to 2.5% by mass of Co and 0.1 to 0.7% by mass of Si, and further contains 0.05 to 1.0% by mass of Cr, if necessary. %, Ni is 0.05 to 0.7% by mass, Fe is 0.02 to 0.5% by mass, Mg is 0.01 to 0.3% by mass, Mn is 0.01 to 0.5% by mass, An alloy containing at least one optional additive component selected from the group consisting of 0.01 to 0.15% by mass of Zn and 0.01 to 0.15% by mass of Zr, with the balance being Cu and unavoidable impurities. A crystal orientation analysis performed by the electron backscattering diffraction (EBSD) method on a vertical cross section of a copper alloy plate having a composition parallel to the rolling direction has a reliability index (CI value) of 0. The area ratio of the measurement spot region of 2 or less to the total measurement spot region is 40% or less, and the vertical cross section includes a pair of surface layer portions including both surfaces of the plate material and a pair of surface layer portions. divided into a central portion is positioned sandwiched, the average value of the reliability index of the surface layer portion of the pair (CI value) and CI S, the average value of the reliability index of the central portion (CI value) CI C when the ratio of CI S for CI C (CI S / CI C ratio), by 0.8 to 2.0, which has a higher conductivity than Cu-Ni-Si alloy, It is possible to achieve both excellent bending workability and high strength at a high level.

また、本発明の銅合金板材の製造方法は、上記銅合金板材の合金組成と実質的に同じ合金組成を有する銅合金素材に、鋳造工程［工程１］、第１面削工程［工程２］、均質化熱処理工程［工程３］、熱間圧延工程［工程４］、冷却工程［工程５］、第２面削工程［工程６］、第１冷間圧延工程［工程７］、溶体化熱処理工程［工程８］、時効熱処理工程［工程９］、第２冷間圧延工程［工程１０］および焼鈍工程［工程１１］を順次行ない、前記均質化熱処理工程［工程３］における昇温速度を１０〜１１０℃／秒および保持温度を９５０〜１２５０℃とし、前記冷却工程［工程５］における板材の表層部での冷却開始温度を６８０〜８５０℃および平均冷却速度を５〜２０℃/秒とし、前記時効熱処理工程［工程９］における到達温度を４５０〜６５０℃および保持時間を５００〜２００００秒とし、そして、前記第２冷間圧延工程［工程１０］は、１パスあたりの加工率が１０％以上４０％以下であり、かつ、圧延ロール径をＲ、加工量をΔｈおよび最終板厚をｈとするとき、パラメータＭは、下記の（１）式で表され、６以上４０以下であることによって、上述した銅合金板材を製造することができる。 Further, the method for producing a copper alloy plate material of the present invention is a casting step [step 1] and a first surface milling step [step 2] on a copper alloy material having substantially the same alloy composition as the alloy composition of the copper alloy plate material. , Homogenization heat treatment step [step 3], hot rolling step [step 4], cooling step [step 5], second surface milling step [step 6], first cold rolling step [step 7], solution heat treatment The step [step 8], the aging heat treatment step [step 9], the second cold rolling step [step 10], and the annealing step [step 11] are sequentially performed, and the temperature rise rate in the homogenization heat treatment step [step 3] is set to 10. The cooling start temperature at the surface layer of the plate material in the cooling step [step 5] was 680 to 850 ° C., and the average cooling rate was 5 to 20 ° C./sec. The ultimate temperature in the aging heat treatment step [step 9] is 450 to 650 ° C., the holding time is 500 to 20000 seconds, and the second cold rolling step [step 10] has a processing rate of 10% per pass. When the rolling roll diameter is R, the machining amount is Δh, and the final plate thickness is h, the parameter M is represented by the following equation (1) and is 6 or more and 40 or less. The above-mentioned copper alloy plate material can be produced.

図１は、本発明の銅合金板材を、圧延方向に平行な縦断面にて、ＥＢＳＤ法によって結晶方位解析を行ない、信頼性指数（ＣＩ値）を求める方法を説明するための模式図である。FIG. 1 is a schematic diagram for explaining a method of obtaining a reliability index (CI value) by performing crystal orientation analysis of the copper alloy plate material of the present invention in a vertical cross section parallel to the rolling direction by the EBSD method. .. 図２は、本発明の実施形態に従う２種類の銅合金板材に対し、Ｗ曲げ試験をＧｏｏｄｗａｙ方向にｒ／ｔ＝０で行った後の、曲げ加工部の屈曲外面状態を、走査型電子顕微鏡（ＳＥＭ）を用いて観察したときのＳＥＭ写真であって、（ａ）が実施例１２（Ｒｑ＝５．７μｍ）である場合、（ｂ）が実施例９（Ｒｑ＝３．０μｍ）である場合を示す。FIG. 2 shows a scanning electron microscope showing the bent outer surface state of the bent portion after performing a W bending test at r / t = 0 in the Goodway direction on two types of copper alloy plate materials according to the embodiment of the present invention. In the SEM photograph when observed using (SEM), when (a) is Example 12 (Rq = 5.7 μm), (b) is Example 9 (Rq = 3.0 μm). Show the case.

以下、本発明の銅合金板材の好ましい実施形態について、詳細に説明する。
本発明に従う銅合金板材は、Ｃｏを０．３〜２．５質量％およびＳｉを０．１〜０．７質量％含有し、残部がＣｕおよび不可避不純物からなる合金組成を有する銅合金板材であって、該銅合金板材の圧延方向に平行な縦断面に対し、電子後方散乱回折（ＥＢＳＤ）法によって行なった結晶方位解析は、信頼性指数（ＣＩ値）の数値が０．２以下となる面積率が４０％以下であり、かつ、前記縦断面を、板材の両表面をそれぞれ含む１対の表層部と、該１対の表層部に挟まれて位置する中央部とに区分し、前記１対の表層部の前記信頼性指数（ＣＩ値）の平均値をＣＩＳとし、前記中央部の前記信頼性指数（ＣＩ値）の平均値をＣＩＣとするとき、ＣＩＣに対するＣＩＳの比（ＣＩＳ／ＣＩＣ比）が、０．８以上２．０以下である。Hereinafter, preferred embodiments of the copper alloy plate material of the present invention will be described in detail.
The copper alloy plate material according to the present invention is a copper alloy plate material having an alloy composition containing 0.3 to 2.5% by mass of Co and 0.1 to 0.7% by mass of Si, and the balance is Cu and unavoidable impurities. Therefore, in the crystal orientation analysis performed by the electron backscatter diffraction (EBSD) method for the vertical cross section parallel to the rolling direction of the copper alloy plate material, the value of the reliability index (CI value) is 0.2 or less. The area ratio is 40% or less, and the vertical cross section is divided into a pair of surface layer portions including both surfaces of the plate material and a central portion located between the pair of surface layer portions. the average value of the reliability index (CI value) of the surface layer portion of the pair and CI S, the average value of the reliability index (CI value) of the central portion when the CI C, the CI S for CI C the ratio (CI S / CI C ratio) is 0.8 or more and 2.0 or less.

（Ｉ）銅合金板材の組成
まず、本発明の銅合金板材の組成を限定した理由について説明する。
本発明の銅合金板材は、Ｃｏを０．３〜２．５質量％およびＳｉを０．１〜０．７質量％含有させたものである。(I) Composition of Copper Alloy Plate First, the reason for limiting the composition of the copper alloy plate of the present invention will be described.
The copper alloy plate material of the present invention contains 0.3 to 2.5% by mass of Co and 0.1 to 0.7% by mass of Si.

＜Ｃｏ：０．３〜２．５質量％＞
Ｃｏ（コバルト）は、Ｃｕの母相（マトリクス）中に、単体またはＳｉとの化合物からなる第二相粒子の析出物として、例えば５０〜５００ｎｍ程度の大きさで微細析出し、この析出物が転位移動を抑制することにより析出硬化させ、さらに、粒成長が抑制されて結晶粒の微細化によって材料強度を上昇させるとともに、曲げ加工性も向上させる作用を有する重要な成分である。かかる作用を発揮するには、Ｃｏ含有量を０．３質量％以上とすることが必要である。また、Ｃｏは、Ｎｉに比べて固溶した際の導電率の低下割合が小さいが、Ｃｏ含有量が２．５質量％を超えると、導電率の低下が顕著になって、５０％ＩＡＣＳ超えの導電率が得られなくなることから、Ｃｏ含有量は２．５質量％以下にする必要がある。例えば、一般的なＣｕ−Ｎｉ−Ｓｉ系合金（Ｃｕ−２．３質量％Ｎｉ−０．６５質量％Ｓｉ）の場合、導電率は３８％ＩＡＣＳ程度であるが、Ｃｏ含有量を０．３〜２．５質量％の範囲とする本発明の銅合金板材は、導電率が５０％ＩＡＣＳ超えと高い数値が得られる。また、本発明の銅合金板材の引張強度は、製造条件にもよるが、特定の製造条件を採用することによって、時効析出後に６００ＭＰａ程度が得られ、Ｃｕ-Ｎｉ-Ｓｉ系合金からなる銅合金板材と同等レベルの高強度が得られる。なお、引張強度と導電率の両特性をバランスよく満足させるには、Ｃｏ含有量は、０．８〜１．６質量％の範囲であることが好ましい。このため、Ｃｏ含有量は０．３〜２．５質量％の範囲とする。<Co: 0.3 to 2.5% by mass>
Co (cobalt) is finely precipitated in the matrix of Cu as a precipitate of second-phase particles composed of a simple substance or a compound with Si, for example, having a size of about 50 to 500 nm, and this precipitate is formed. It is an important component having an action of precipitation hardening by suppressing dislocation movement, further suppressing grain growth, increasing material strength by refining crystal grains, and improving bending workability. In order to exert such an effect, it is necessary to set the Co content to 0.3% by mass or more. Further, Co has a smaller rate of decrease in conductivity when dissolved in a solid solution than Ni, but when the Co content exceeds 2.5% by mass, the decrease in conductivity becomes remarkable and exceeds 50% IACS. The Co content needs to be 2.5% by mass or less because the conductivity of the above cannot be obtained. For example, in the case of a general Cu-Ni-Si alloy (Cu-2.3 mass% Ni-0.65 mass% Si), the conductivity is about 38% IACS, but the Co content is 0.3. The copper alloy plate material of the present invention having a conductivity in the range of ~ 2.5% by mass can obtain a high value with a conductivity exceeding 50% IACS. Further, the tensile strength of the copper alloy plate material of the present invention depends on the manufacturing conditions, but by adopting specific manufacturing conditions, about 600 MPa can be obtained after aging precipitation, and the copper alloy made of a Cu—Ni—Si based alloy can be obtained. High strength equivalent to that of plate material can be obtained. In order to satisfy both the tensile strength and the conductivity in a well-balanced manner, the Co content is preferably in the range of 0.8 to 1.6% by mass. Therefore, the Co content is in the range of 0.3 to 2.5% by mass.

＜Ｓｉ：０．１〜０．７質量％＞
Ｓｉ（ケイ素）は、Ｃｕの母相（マトリクス）中に、ＣｏやＣｒなどとともに化合物からなる第二相粒子の析出物として微細析出し、この析出物が転位移動を抑制することにより析出硬化させ、さらに、粒成長が抑制されて結晶粒の微細化によって材料強度を上昇させる作用を有する重要な成分である。かかる作用を発揮するには、Ｓｉ含有量を０．１質量％以上とすることが必要である。また、Ｓｉ含有量が０．７質量％を超えると、導電率の低下が顕著になって、５０％ＩＡＣＳ超えの導電率が得られなくなることから、Ｓｉ含有量は０．７質量％以下にする必要がある。このため、Ｓｉ含有量は０．１〜０．７質量％の範囲とする。なお、引張強度と導電率の両特性をバランスよく満足させるには、Ｓｉ含有量は、０．２〜０．５質量％の範囲であることが好ましい。<Si: 0.1 to 0.7% by mass>
Si (silicon) is finely precipitated in the matrix of Cu as a precipitate of second-phase particles composed of a compound together with Co and Cr, and this precipitate is precipitated and hardened by suppressing dislocation movement. Furthermore, it is an important component having an action of suppressing grain growth and increasing the material strength by refining the crystal grains. In order to exert such an effect, the Si content needs to be 0.1% by mass or more. Further, when the Si content exceeds 0.7% by mass, the decrease in conductivity becomes remarkable and the conductivity exceeding 50% IACS cannot be obtained. Therefore, the Si content is 0.7% by mass or less. There is a need to. Therefore, the Si content is in the range of 0.1 to 0.7% by mass. In order to satisfy both the tensile strength and the conductivity in a well-balanced manner, the Si content is preferably in the range of 0.2 to 0.5% by mass.

＜任意添加成分＞
本発明の銅合金板材は、ＣｏおよびＳｉを必須の基本含有成分とするが、さらに、任意の副添加成分として、さらにＣｒを０．０５〜１．０質量％、Ｎｉを０．０５〜０．７質量％、Ｆｅを０．０２〜０．５質量％、Ｍｇを０．０１〜０．３質量％、Ｍｎを０．０１〜０．５質量％、Ｚｎを０．０１〜０．１５質量％およびＺｒを０．０１〜０．１５質量％からなる群から選択される少なくとも１種の任意添加成分を含有することができる。<Arbitrary additive component>
The copper alloy plate material of the present invention contains Co and Si as essential basic components, and further, as optional sub-additive components, Cr is 0.05 to 1.0% by mass and Ni is 0.05 to 0. .7% by mass, Fe 0.02 to 0.5% by mass, Mg 0.01 to 0.3% by mass, Mn 0.01 to 0.5% by mass, Zn 0.01 to 0.15 It can contain at least one optional additive component selected from the group consisting of 0.01 to 0.15% by weight of mass% and Zr.

（Ｃｒ：０．０５〜１．０質量％）
Ｃｒ（クロム）は、Ｃｕの母相（マトリクス）中に、化合物や単体として、例えば５０〜５００ｎｍ程度の大きさの析出物の形で微細析出し、この析出物が転位移動を抑制することにより析出硬化させ、さらに、粒成長が抑制されて結晶粒の微細化によって材料強度を上昇させるとともに、曲げ加工性をも向上させる作用を有する成分である。この作用を発揮するには、Ｃｒ含有量を０．０５質量％以上とすることが好ましい。また、Ｃｒ含有量が１．０質量％以下であれば、導電率の低下割合が小さく、５０％ＩＡＣＳ超えの導電率が得られる傾向がある。このため、Ｃｒ含有量は、０．０５〜１．０質量％とすることが好ましい。(Cr: 0.05 to 1.0% by mass)
Cr (chromium) is finely precipitated in the matrix of Cu as a compound or a single substance in the form of a precipitate having a size of, for example, about 50 to 500 nm, and this precipitate suppresses dislocation movement. It is a component that has the effect of precipitation hardening, further suppressing grain growth, increasing material strength by refining crystal grains, and improving bending workability. In order to exert this effect, the Cr content is preferably 0.05% by mass or more. Further, when the Cr content is 1.0% by mass or less, the rate of decrease in conductivity is small, and the conductivity tends to exceed 50% IACS. Therefore, the Cr content is preferably 0.05 to 1.0% by mass.

（Ｎｉ：０．０５〜０．７質量％）
Ｎｉ（ニッケル）は、Ｃｕの母相（マトリクス）中に、化合物や単体として、例えば５０〜５００ｎｍ程度の大きさの析出物の形で微細析出し、この析出物が転位移動を抑制することにより析出硬化させ、さらに、粒成長が抑制されて結晶粒の微細化によって材料強度を上昇させるとともに、曲げ加工性も向上させる作用を有する成分である。この作用を発揮するには、Ｎｉ含有量を０．０５質量％以上とすることが好ましい。また、Ｎｉ含有量が０．７質量％以下であれば、導電率の低下割合が小さく、５０％ＩＡＣＳ超えの導電率が得られる傾向がある。このため、Ｎｉ含有量は、０．０５〜０．７質量％とすることが好ましい。(Ni: 0.05 to 0.7% by mass)
Ni (nickel) is finely precipitated in the matrix of Cu as a compound or a single substance in the form of a precipitate having a size of, for example, about 50 to 500 nm, and this precipitate suppresses dislocation movement. It is a component that has the effect of precipitation hardening, further suppressing grain growth, increasing material strength by refining crystal grains, and improving bending workability. In order to exert this effect, the Ni content is preferably 0.05% by mass or more. Further, when the Ni content is 0.7% by mass or less, the rate of decrease in conductivity is small, and the conductivity tends to exceed 50% IACS. Therefore, the Ni content is preferably 0.05 to 0.7% by mass.

（Ｆｅ：０．０２〜０．５質量％）
Ｆｅ（鉄）は、導電率、強度、応力緩和特性、めっき性等の製品特性を改善する作用を有する成分である。かかる作用を発揮させるには、Ｆｅ含有量を０．０２質量％以上とすることが好ましい。また、Ｆｅ含有量を０．５質量％よりも多くすると、それ以上の向上効果が期待できないばかりか、導電率が低下する傾向がある。このため、Ｆｅ含有量は、０．０２〜０．５質量％とすることが好ましい。(Fe: 0.02 to 0.5% by mass)
Fe (iron) is a component having an action of improving product characteristics such as conductivity, strength, stress relaxation characteristics, and plating properties. In order to exert such an effect, the Fe content is preferably 0.02% by mass or more. Further, when the Fe content is more than 0.5% by mass, not only the further improvement effect cannot be expected, but also the conductivity tends to decrease. Therefore, the Fe content is preferably 0.02 to 0.5% by mass.

（Ｍｇ：０．０１〜０．３質量％）
Ｍｇ（マグネシウム）は、耐応力緩和特性を向上させる作用を有する成分である。かかる作用を発揮させるには、Ｍｇ含有量を０．０１質量％以上とすることが好ましい。また、Ｍｇ含有量を０．３質量％よりも多くすると、導電性が低下する傾向がある。このため、Ｍｇ含有量は、０．０１〜０．３質量％とすることが好ましい。(Mg: 0.01 to 0.3% by mass)
Mg (magnesium) is a component having an action of improving stress relaxation resistance. In order to exert such an action, the Mg content is preferably 0.01% by mass or more. Further, when the Mg content is more than 0.3% by mass, the conductivity tends to decrease. Therefore, the Mg content is preferably 0.01 to 0.3% by mass.

（Ｍｎ：０．０１〜０．５質量％）
Ｍｎ（マンガン）は、母相に固溶して圧延加工性を向上させると共に、粒界反応型析出の急激な発達を抑制し、粒界反応型析出によって生じる不連続性析出セル組織の制御を可能にする作用を有する成分である。かかる作用を発揮させるには、Ｍｎ含有量を０．０１質量％以上とすることが好ましい。また、Ｍｎ含有量を０．５質量％よりも多くすると、それ以上の向上効果が期待できないばかりか、導電率の低下や曲げ加工性の劣化が生じるおそれがある。このため、Ｍｎ含有量は０．０１〜０．５質量％とすることが好ましい。(Mn: 0.01 to 0.5% by mass)
Mn (manganese) dissolves in the matrix phase to improve rolling processability, suppresses the rapid development of grain boundary reaction type precipitation, and controls the discontinuous precipitation cell structure caused by grain boundary reaction type precipitation. It is a component that has an action that enables it. In order to exert such an effect, the Mn content is preferably 0.01% by mass or more. Further, if the Mn content is more than 0.5% by mass, not only the improvement effect cannot be expected, but also the conductivity may be lowered and the bending workability may be deteriorated. Therefore, the Mn content is preferably 0.01 to 0.5% by mass.

（Ｚｎ：０．０１〜０．１５質量％）
Ｚｎ（亜鉛）は、曲げ加工性を改善するとともに、Ｓｎめっきやはんだめっきの密着性やマイグレーション特性を改善する作用を有する成分である。かかる作用を発揮させるには、Ｚｎ含有量を０．０１質量％以上とすることが好ましい。また、Ｚｎ含有量を０．１５質量％よりも多くすると、導電性が低下する傾向がある。このため、Ｚｎ含有量は、０．０１〜０．１５質量％とすることが好ましい。(Zn: 0.01 to 0.15% by mass)
Zn (zinc) is a component having an action of improving bending workability and improving adhesion and migration characteristics of Sn plating and solder plating. In order to exert such an effect, the Zn content is preferably 0.01% by mass or more. Further, when the Zn content is more than 0.15% by mass, the conductivity tends to decrease. Therefore, the Zn content is preferably 0.01 to 0.15% by mass.

（Ｚｒ：０．０１〜０．１５質量％）
Ｚｒ（ジルコニウム）は、主に結晶粒を微細化させて、強度や曲げ加工性を向上させる作用を有する成分である。かかる作用を発揮させるには、Ｚｒ含有量を０．０１質量以上とすることが好ましい。また、Ｚｒ含有量を０．１５質量％よりも多くすると、化合物を形成し、導電率およびプレス打ち抜き加工性が著しく低下する傾向がある。このため、Ｚｒ含有量は、０．０１〜０．１５質量％とすることが好ましい。(Zr: 0.01 to 0.15% by mass)
Zr (zirconium) is a component that mainly has the effect of refining crystal grains to improve strength and bendability. In order to exert such an action, the Zr content is preferably 0.01 mass or more. Further, when the Zr content is more than 0.15% by mass, a compound is formed, and the conductivity and press punching workability tend to be significantly lowered. Therefore, the Zr content is preferably 0.01 to 0.15% by mass.

（任意添加成分の合計含有量：１．５質量％以下）
上述したＣｒ、Ｎｉ、Ｆｅ、Ｍｇ、Ｍｎ、ＺｎおよびＺｒからなる群から選択される任意添加成分を２種以上含有する場合には、任意添加成分の合計含有量を１．５質量％以下とすることが好ましい。任意添加成分の合計含有量が１．５質量％以下であれば、プレス打ち抜き加工性や導電率が大きく低下することはないからである。(Total content of optional additive components: 1.5% by mass or less)
When two or more optional additive components selected from the group consisting of Cr, Ni, Fe, Mg, Mn, Zn and Zr described above are contained, the total content of the optional additive components is 1.5% by mass or less. It is preferable to do so. This is because if the total content of the optional additive components is 1.5% by mass or less, the press punching workability and the conductivity do not significantly decrease.

＜残部：Ｃｕおよび不可避不純物＞
上述した必須含有成分および任意添加成分以外は、残部がＣｕ（銅）および不可避不純物からなる。なお、ここでいう「不可避不純物」とは、おおむね金属製品において、原料中に存在するものや、製造工程において不可避的に混入するもので、本来は不要なものであるが、微量であり、金属製品の特性に影響を及ぼさないため許容されている不純物である。不可避不純物として挙げられる成分としては、例えば、銀（Ａｇ）、スズ（Ｓｎ）、酸素（Ｏ）等が挙げられる。なお、これらの成分含有量の上限は、上記成分毎に０．０５質量％、上記成分の総量で０．２０質量％とすればよい。<Remaining: Cu and unavoidable impurities>
Except for the above-mentioned essential components and optional additives, the balance consists of Cu (copper) and unavoidable impurities. The "unavoidable impurities" referred to here are generally those that are present in the raw materials of metal products and those that are unavoidably mixed in the manufacturing process, which are originally unnecessary, but are in trace amounts and are metals. It is an acceptable impurity because it does not affect the properties of the product. Examples of the components listed as unavoidable impurities include silver (Ag), tin (Sn), oxygen (O) and the like. The upper limit of the content of these components may be 0.05% by mass for each of the above components and 0.20% by mass for the total amount of the above components.

（ＩＩ）ＥＢＳＤ法の信頼性指数ＣＩ
本発明の銅合金板材は、銅合金板材の圧延方向に平行な縦断面に対し、電子後方散乱回折（ＥＢＳＤ）法によって行なった結晶方位解析は、信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率が４０％以下であり、かつ、前記縦断面を、板材の両表面をそれぞれ含む１対の表層部と、該１対の表層部に挟まれて位置する中央部とに区分し、前記１対の表層部の前記信頼性指数（ＣＩ値）の平均値をＣＩＳとし、前記中央部の前記信頼性指数（ＣＩ値）の平均値をＣＩＣとするとき、ＣＩＣに対するＣＩＳの比（ＣＩＳ／ＣＩＣ）が、０．８以上２．０以下である。(II) Reliability index CI of EBSD method
The copper alloy plate material of the present invention has a reliability index (CI value) of 0.2 or less in the crystal orientation analysis performed by the electron backscatter diffraction (EBSD) method for a vertical cross section parallel to the rolling direction of the copper alloy plate material. The area ratio of the measurement spot region to the total measurement spot region is 40% or less, and the vertical cross section is formed on a pair of surface layer portions including both surfaces of the plate material and the pair of surface layer portions. was divided into a central portion positioned pinched, the average value of the reliability index (CI value) of the surface layer portion of the pair and CI S, the average value of the reliability index (CI value) of the central portion when to the CI C, the ratio of the CI S for CI C (CI S / CI C ) is 0.8 to 2.0.

本発明者は、Ｃｕ−Ｎｉ−Ｓｉ系合金よりも高い導電率を有するＣｕ−Ｃｏ−Ｓｉ系合金を用い、優れた曲げ加工性と高強度を高いレベルで両立させるための検討を行なったところ、圧延された板材、特に板材の表層部において導入される歪みが大きいほど、曲げ加工性が悪化することが判明した。 The present inventor has conducted a study to achieve both excellent bending workability and high strength at a high level by using a Cu—Co—Si alloy having a higher conductivity than a Cu—Ni—Si alloy. It was found that the greater the strain introduced in the rolled plate material, particularly the surface layer portion of the plate material, the worse the bending workability.

また、この板材に導入される歪みの大小を評価できる手法についてさらに鋭意検討を行なったところ、銅合金板材の圧延方向に平行な縦断面に対し、電子後方散乱回折（ＥＢＳＤ）法によって行なった結晶方位解析にて、各測定スポット領域における信頼性指数ＣＩを算出し、信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率が４０％以下である場合に、比較的歪みの少ない圧延組織が維持されており、曲げ加工性が悪化せずに確保できる傾向があることを見出した。しかしながら、前記面積率が４０％以下であっても、高いレベルの曲げ加工性が得られていない場合もあった。 In addition, as a result of further diligent studies on a method that can evaluate the magnitude of strain introduced into this plate material, crystals performed by electron backscatter diffraction (EBSD) method on a vertical cross section parallel to the rolling direction of the copper alloy plate material. In the orientation analysis, the reliability index CI in each measurement spot area is calculated, and the area ratio of the measurement spot area with the reliability index (CI value) of 0.2 or less to the total measurement spot area is 40% or less. In some cases, it was found that the rolled structure with relatively little strain is maintained, and the bending workability tends to be secured without deterioration. However, even if the area ratio is 40% or less, a high level of bending workability may not be obtained in some cases.

そのため、本発明者は、さらに鋭意検討を行なったところ、前記縦断面における、表層部の信頼性指数（ＣＩ値）の平均値ＣＩＳの、中央部の信頼性指数（ＣＩ値）の平均値ＣＩＣに対するＣＩＳの比（ＣＩＳ／ＣＩＣ比）を０．８以上２．０以下とすることによって、優れた曲げ加工性と高強度を高いレベルで両立させることを可能にした。前記ＣＩＳ／ＣＩＣ比が０．８よりも小さいと、板材の表層部が中央部（内部）に比べて表面歪みが大きくなりすぎるため、板材の引張強度に対する曲げ加工性の割合が低くなって、引張強度と曲げ加工性をバランスよく両立させることができなくなるからである。また、前記ＣＩＳ／ＣＩＣ比が２．０よりも大きいと、板材の引張強度に対する曲げ加工性の割合は高くなるものの、板材の中央部（内部）の歪みの分布の偏りが大きくなって、プレス加工時における形状のばらつきが発生する可能性が高まるからである。このため、ＣＩＳ／ＣＩＣ比は、０．８以上２．０以下とし、好ましくは、１．０〜１．８とする。Therefore, the present inventor has further conducted intensive was conducted study, in the vertical section, the average CI S reliability index of the surface layer portion (CI value), the average value of the reliability index of the central portion (CI value) by the ratio of CI S a (CI S / CI C ratio) of 0.8 to 2.0 for CI C, it made it possible to achieve both excellent bending property and high strength at a high level. When the CI S / CI C ratio is smaller than 0.8, the surface strain of the surface layer portion of the plate material becomes too large as compared with the central portion (inside), so that the ratio of bending workability to the tensile strength of the plate material becomes low. This is because it is not possible to achieve both tensile strength and bending workability in a well-balanced manner. Further, when the CI S / CI C ratio is larger than 2.0, the ratio of the bending workability to the tensile strength of the plate material becomes high, but the bias of the strain distribution in the central portion (inside) of the plate material becomes large. This is because the possibility of shape variation during press working increases. Therefore, the CI S / CI C ratio is 0.8 or more and 2.0 or less, preferably 1.0 to 1.8.

なお、信頼性指数（ＣＩ値）の算出方法は、電子後方散乱回折（ＥＢＳＤ）法によって測定した結晶方位を、解析ソフトを用いて、各測定スポット領域（スポットサイズ：０．５μｍ×０．５μｍ）のＣＩ値を計算した。銅合金板材の圧延方向に平行な縦断面、換言すれば、銅合金板材の圧延方向に対して垂直な断面は、ＥＢＳＤ法による測定前に、耐水研磨紙、ダイヤモンド砥粒を用いて機械研磨を行った後、コロイダルシリカ溶液を用いて仕上げ研磨を行った。そして、ＥＢＳＤ法により、測定面積６４×１０４μｍ２（８００μｍ×８００μｍ）、スキャンステップは０．１μｍの条件で測定を行った。スキャンステップは微細な結晶粒を測定するため、０．１μｍステップで行った。解析では、６４×１０４μｍ２のＥＢＳＤ測定結果から、解析にて逆極点図ＩＰＦ（Inverse Pole Figure）を確認した。電子線は、走査電子顕微鏡のＷフィラメントからの熱電子を発生源とした。なお、測定時のプローブ径は、約０．０１５μｍである。ＥＢＳＤ法の測定装置には、（株）ＴＳＬソリューションズ製 ＯＩＭ５．０（商品名）を用いた。In the calculation method of the reliability index (CI value), the crystal orientation measured by the electron backscatter diffraction (EBSD) method is measured in each measurement spot region (spot size: 0.5 μm × 0.5 μm) using analysis software. ) CI value was calculated. The vertical cross section parallel to the rolling direction of the copper alloy plate, in other words, the cross section perpendicular to the rolling direction of the copper alloy plate, should be machine-polished using water-resistant abrasive paper and diamond abrasive grains before measurement by the EBSD method. After that, finish polishing was performed using a colloidal silica solution. Then, by the EBSD method, the measurement was performed under the conditions of a measurement area of 64 × 10 4 μm 2 (800 μm × 800 μm) and a scan step of 0.1 μm. The scan step was performed in 0.1 μm steps in order to measure fine crystal grains. In the analysis, the reverse pole figure IPF (Inverse Pole Figure) was confirmed by the analysis from the EBSD measurement result of 64 × 10 4 μm 2 . The electron beam originated from thermions from the W filament of the scanning electron microscope. The probe diameter at the time of measurement is about 0.015 μm. OIM5.0 (trade name) manufactured by TSL Solutions Co., Ltd. was used as the measuring device for the EBSD method.

図１は、本発明の銅合金板材１０を、圧延方向に平行な縦断面にて、ＥＢＳＤ法によって結晶方位解析（マッピング）を行ない、信頼性指数（ＣＩ値）を求める方法を説明するための模式図である。各測定スポット領域は、図1に示すように、圧延方向に平行な縦断面にて、一方の表層部１１ａから中央部１２を通って他方の表層部１１ｂまで電子線を走査させ、走査した全測定スポット領域に対して、信頼性指数（ＣＩ値）が０．２以下である測定スポット領域が占める面積率を算出した。 FIG. 1 is for explaining a method of obtaining a reliability index (CI value) by performing crystal orientation analysis (mapping) of the copper alloy plate material 10 of the present invention in a vertical cross section parallel to the rolling direction by the EBSD method. It is a schematic diagram. As shown in FIG. 1, each measurement spot region is scanned by scanning an electron beam from one surface layer portion 11a through the central portion 12 to the other surface layer portion 11b in a vertical cross section parallel to the rolling direction. The area ratio occupied by the measurement spot area having the reliability index (CI value) of 0.2 or less with respect to the measurement spot area was calculated.

また、本発明でいう、板材の表層部１１ａおよび１１ｂは、板材両面からそれぞれ板厚の１／８厚さに相当する板材部分を意味し、また、中央部１２は、１対の表層部１１ａおよび１１ｂの挟まれた板材部分を意味する。 Further, the surface layer portions 11a and 11b of the plate material in the present invention mean plate material portions corresponding to 1/8 of the plate thickness from both sides of the plate material, and the central portion 12 is a pair of surface layer portions 11a. And 11b means the sandwiched plate material portion.

さらに、板材の表層部の信頼性指数（ＣＩ値）の平均値ＣＩＳと、板材の中央部の信頼性指数（ＣＩ値）の平均値ＣＩＣの算出方法は、板材の厚さ方向（図1の上下方向）に対して板材の縦断面上を所定間隔（例えば２０μｍ間隔）で走査する１０本の線を引き、それぞれの線上のＣＩ値の分布から、板材の表層部と中央部のそれぞれの信頼性指数（ＣＩ値）の平均値を求めた。測定には各条材について、１０視野の測定を行い、その平均値を値として用いた。このＥＢＳＤ法の信頼性指数（ＣＩ値）は、ＥＢＳＤ装置の解析ソフトＯＩＭ Ａｎａｌｙｓｉｓにて測定される値であって、評価・解析した結果の結晶パターンが良好ではない、すなわち加工組織であり、加工に伴う歪みが大きいほど、ＣＩ値は低下する。Further, the average value CI S reliability index of the surface layer portion of the plate member (CI value), method of calculating the average value CI C reliability index of the central portion of the plate member (CI value), the thickness direction (FIG plate material Ten lines are drawn on the vertical cross section of the plate material at predetermined intervals (for example, 20 μm intervals) with respect to the vertical direction of 1), and from the distribution of CI values on each line, the surface layer portion and the central portion of the plate material are respectively. The average value of the reliability index (CI value) of was calculated. For the measurement, 10 fields of view were measured for each strip, and the average value was used as a value. The reliability index (CI value) of this EBSD method is a value measured by the analysis software OIM Analysis of the EBSD device, and the crystal pattern as a result of evaluation / analysis is not good, that is, it is a processed structure and is processed. The greater the strain associated with it, the lower the CI value.

（ＩＩＩ）引張強度
本発明では、圧延方向と平行に引っ張ったときの引張強度が６００ＭＰａ以上であることが好ましい。引張強度の測定は、圧延平行方向から切り出したＪＩＳ Ｚ２２４１：２０１１に規定されている１３Ｂ号の３本の試験片で行い、引張強度は、３本の試験片から得られた引張強度の平均値とした。(III) Tensile Strength In the present invention, the tensile strength when pulled in parallel with the rolling direction is preferably 600 MPa or more. The tensile strength was measured with three test pieces of No. 13B specified in JIS Z2241: 2011 cut out from the direction parallel to rolling, and the tensile strength was the average value of the tensile strengths obtained from the three test pieces. And said.

（ＩＶ）導電率（ＥＣ）
本発明の銅合金板材は、導電率が５０％ＩＡＣＳ超えであることが好ましい。導電率は、２０℃（±０．５℃）に保たれた恒温槽中で四端子法により計測した比抵抗の数値から算出することができる。(IV) Conductivity (EC)
The copper alloy plate material of the present invention preferably has a conductivity of more than 50% IACS. The conductivity can be calculated from the numerical value of the specific resistance measured by the four-terminal method in a constant temperature bath kept at 20 ° C. (± 0.5 ° C.).

（Ｖ）二乗平均平方根粗さＲｑ
本発明の銅合金板材は、日本伸銅協会（ＪＣＢＡ）Ｔ３０７：２００７に準拠するＷ曲げ試験をＧｏｏｄｗａｙ方向にｒ／ｔ＝０で行った後の、曲げ加工部の屈曲外面における二乗平均平方根粗さＲｑが７．０μｍ以下であることが好ましい。前記二乗平均平方根粗さＲｑが７．０μｍ以下であれば、曲げ加工部の屈曲外面の表面粗さが十分に小さく、曲げ加工性が良好である傾向があるからである。各供試材に対して日本伸銅協会技術標準ＪＣＢＡ−Ｔ３０７：２００７の試験方法に準拠して曲げ加工を行った。圧延方向と試験片の長手方向が平行になるように、各供試材から幅１０ｍｍ×長さ３０ｍｍの試験片を複数採取し、曲げ角度が９０度、曲げ半径が０ｍｍのＷ型の治具を用い、Ｗ曲げ試験を行った。そして、曲げ部の外周部に対して、９０°Ｗ曲げ試験片の曲げ表面をレーザー顕微鏡にて０．１μｍピッチにて凹凸を測定した。二乗平均平方根粗さＲｑは、ＪＩＳ Ｂ０６０１：２０１３に準拠し、下記の（２）式に代入することによって算出する。曲げ部の表面粗さが小さいということは、材料の曲げ加工性が良好であることを示している。(V) Root mean square roughness Rq
The copper alloy plate material of the present invention has a root mean square roughness on the bent outer surface of the bent portion after a W bending test based on the Japan Copper and Brass Association (JCBA) T307: 2007 is performed in the Goodway direction at r / t = 0. The Rq is preferably 7.0 μm or less. This is because when the root mean square roughness Rq is 7.0 μm or less, the surface roughness of the bent outer surface of the bent portion tends to be sufficiently small and the bendability tends to be good. Each test material was bent according to the test method of the Japan Copper and Brass Association technical standard JCBA-T307: 2007. A W-shaped jig with a bending angle of 90 degrees and a bending radius of 0 mm by collecting multiple test pieces with a width of 10 mm and a length of 30 mm from each test material so that the rolling direction and the longitudinal direction of the test piece are parallel. Was used to perform a W bending test. Then, the unevenness of the bent surface of the 90 ° W bending test piece was measured with a laser microscope at a pitch of 0.1 μm with respect to the outer peripheral portion of the bent portion. The root mean square roughness Rq is calculated by substituting it into the following equation (2) in accordance with JIS B0601: 2013. The fact that the surface roughness of the bent portion is small indicates that the bending workability of the material is good.

ただし、ｌは基準長さである。 However, l is a reference length.

（ＶＩ）本発明の一実施例による銅合金板材の製造方法
上述した銅合金板材は、合金組成や製造プロセスを組み合わせて制御することにより、実現できる。以下、本発明の銅合金板材の好適な製造方法について説明する。(VI) Method for Manufacturing Copper Alloy Plate Material According to One Example of the Present Invention The above-mentioned copper alloy plate material can be realized by controlling the alloy composition and the production process in combination. Hereinafter, a suitable manufacturing method for the copper alloy plate material of the present invention will be described.

このような本発明の一実施例による銅合金板材の製造方法は、上述した銅合金板材の前記合金組成と実質的に同じ合金組成を有する銅合金素材に、鋳造工程［工程１］、第１面削工程［工程２］、均質化熱処理工程［工程３］、熱間圧延工程［工程４］、水冷工程［工程５］、第２面削工程［工程６］、第１冷間圧延工程［工程７］、溶体化熱処理工程［工程８］、時効熱処理工程［工程９］、第２冷間圧延工程［工程１０］および焼鈍工程［工程１１］を順次行ない、前記均質化熱処理工程［工程３］における昇温速度を１０〜１１０℃／秒および保持温度を９５０〜１２５０℃とし、前記冷却工程［工程５］における板材の表層部での冷却開始温度を６８０〜８５０℃および平均冷却速度を５〜２０℃/秒とし、前記時効熱処理工程［工程９］における到達温度を４５０〜６５０℃および保持時間を５００〜２００００秒とし、そして、前記第２冷間圧延工程［工程１０］は、１パスあたりの加工率が１０％以上４０％以下であり、かつ、圧延ロール径をＲ、加工量をΔｈおよび最終板厚をｈとするとき、パラメータＭは、下記の（１）式で表され、６以上４０以下である。
Ｍ＝｛（Ｒ・Δｈ）０．５｝／ｈ ・・・・（１）Such a method for producing a copper alloy plate material according to an embodiment of the present invention comprises a casting step [step 1], first, in a copper alloy material having substantially the same alloy composition as the above-mentioned alloy composition of the copper alloy plate material. Face milling step [step 2], homogenization heat treatment step [step 3], hot rolling step [step 4], water cooling step [step 5], second face milling step [step 6], first cold rolling step [step 6] Step 7], solution heat treatment step [step 8], aging heat treatment step [step 9], second cold rolling step [step 10] and annealing step [step 11] are sequentially performed, and the homogenization heat treatment step [step 3] is performed. ], The temperature rise rate is 10 to 110 ° C./sec, the holding temperature is 950 to 1250 ° C., the cooling start temperature at the surface layer portion of the plate material in the cooling step [step 5] is 680 to 850 ° C., and the average cooling rate is 5. The temperature reached in the aging heat treatment step [step 9] was 450 to 650 ° C. and the holding time was 500 to 20000 seconds, and the second cold rolling step [step 10] was one pass. When the processing rate per unit is 10% or more and 40% or less, the rolling roll diameter is R, the processing amount is Δh, and the final plate thickness is h, the parameter M is expressed by the following equation (1). It is 6 or more and 40 or less.
M = {(R · Δh) 0.5 } / h ・ ・ ・ ・ (1)

本発明の銅合金板材の製造方法は、特に、均質化熱処理工程［工程３］および時効熱処理工程［工程９］を制御するとともに、（熱間圧延工程［工程４］後の）冷却工程［工程５］および第２（最終）冷間圧延工程［工程１０］を制御することが重要である。すなわち、均質化熱処理工程［工程３］における昇温速度を１０〜１１０℃／秒および保持温度を９５０〜１２５０℃とし、また、熱間圧延工程［工程４］後に行なう冷却工程［工程５］における板材の表層部での冷却開始温度を６８０〜８５０℃および平均冷却速度を５〜２０℃/秒とし、さらに時効熱処理工程［工程９］における到達温度を４５０〜６５０℃および保持時間を５００〜２００００秒とし、そして、第２（最終）冷間圧延工程［工程１０］において、１パスあたりの加工率を１０％以上４０％以下とし、かつ、Ｍ＝｛（Ｒ・Δｈ）０．５｝／ｈで表されるパラメータＭを６以上４０以下とすることが必要である。The method for producing a copper alloy plate material of the present invention particularly controls a homogenizing heat treatment step [step 3] and an aging heat treatment step [step 9], and also controls a cooling step [step (after the hot rolling step [step 4]). 5] and the second (final) cold rolling step [step 10] are important to control. That is, the heating rate in the homogenizing heat treatment step [step 3] is 10 to 110 ° C./sec, the holding temperature is 950 to 1250 ° C., and the cooling step [step 5] performed after the hot rolling step [step 4]. The cooling start temperature at the surface layer of the plate material is 680 to 850 ° C, the average cooling rate is 5 to 20 ° C / sec, the ultimate temperature in the aging heat treatment step [Step 9] is 450 to 650 ° C, and the holding time is 500 to 20000. Seconds, and in the second (final) cold rolling process [process 10], the processing rate per pass is 10% or more and 40% or less, and M = {(R · Δh) 0.5 } / It is necessary that the parameter M represented by h is 6 or more and 40 or less.

（ｉ）鋳造工程[工程１]
鋳造工程は、大気下で高周波溶解炉により表１に示す合金成分を有する銅合金素材を溶解し、これを鋳造することによって所定形状（例えば厚さ３００ｍｍ、幅５００ｍｍ、長さ３０００ｍｍ）の鋳塊を製造する。なお、銅合金素材の合金組成は、製造の各工程において、添加成分によっては溶解炉に付着したり揮発したりして製造される銅合金板材の合金組成とは必ずしも完全には一致しない場合があるが、銅合金板材の合金組成と実質的に同じ合金組成を有している。(I) Casting process [Step 1]
In the casting process, a copper alloy material having the alloy components shown in Table 1 is melted in the atmosphere by a high-frequency melting furnace, and the ingot having a predetermined shape (for example, thickness 300 mm, width 500 mm, length 3000 mm) is cast by casting the ingot. To manufacture. In addition, the alloy composition of the copper alloy material may not always completely match the alloy composition of the copper alloy plate material produced by adhering to or volatilizing in the melting furnace depending on the additive components in each manufacturing process. However, it has substantially the same alloy composition as the alloy composition of the copper alloy plate material.

（ｉｉ）第１面削工程［工程２］
第１面削工程は、銅合金素材を溶解する鋳造工程（工程１）で得た鋳塊の表面に形成した酸化膜を除去するため、鋳塊の表裏の両面をそれぞれ０．５ｍｍ以上の厚さ分だけ削り取る工程である。(Ii) First surface cutting step [Step 2]
In the first surface cutting step, in order to remove the oxide film formed on the surface of the ingot obtained in the casting step (step 1) for melting the copper alloy material, both the front and back surfaces of the ingot have a thickness of 0.5 mm or more. This is the process of scraping off the amount.

（ｉｉｉ）均質化熱処理工程[工程３]
均質化熱処理工程は、昇温速度を１０〜１１０℃／秒および保持温度を９５０〜１２５０℃とする。均質化熱処理工程の昇温速度が１０℃／秒未満もしくは１１０℃／秒超えであるか、または保持温度が９５０℃未満だと、鋳造時に生じる晶出物の固溶が不十分となり、製造された銅合金板材において、満足レベルの強度と導電率が得られなくなる。一方、均質化熱処理工程の保持温度が１２５０℃超えだと、結晶粒界近傍が部分的に液相化し、熱間圧延時の割れが発生しやすくなって、製造できない場合があるからである。(Iii) Homogenization heat treatment step [Step 3]
In the homogenizing heat treatment step, the heating rate is 10 to 110 ° C./sec and the holding temperature is 950 to 1250 ° C. If the heating rate of the homogenizing heat treatment step is less than 10 ° C./sec or more than 110 ° C./sec, or the holding temperature is less than 950 ° C., the solid solution of the crystals generated during casting becomes insufficient and the product is manufactured. In the copper alloy plate material, a satisfactory level of strength and conductivity cannot be obtained. On the other hand, if the holding temperature in the homogenizing heat treatment step exceeds 1250 ° C., the vicinity of the grain boundaries is partially liquid-phased, and cracks during hot rolling are likely to occur, so that production may not be possible.

（ｉｖ）熱間圧延工程[工程４]
熱間圧延工程は、均質化熱処理の直後の鋳塊に対して、所定の厚さになるまで熱間圧延を施して熱延板を作製する工程である。熱間圧延条件は、例えば、圧延温度は６００〜１１００℃、圧延回数は４回以上、合計圧延加工率は６０％以上であることが好ましい。なおここでいう「圧延加工率」とは、圧延前の断面積から圧延後の断面積を引いた値を圧延前の断面積で除して１００を乗じ、パーセントで表した値である。すなわち、下記式で表される。
［圧延加工率］＝｛（［圧延前の断面積］−［圧延後の断面積］）／［圧延前の断面積］｝×１００（％）(Iv) Hot rolling process [Step 4]
The hot-rolling step is a step of hot-rolling the ingot immediately after the homogenization heat treatment until it reaches a predetermined thickness to produce a hot-rolled plate. The hot rolling conditions are preferably, for example, a rolling temperature of 600 to 1100 ° C., a number of rolling times of 4 or more, and a total rolling ratio of 60% or more. The "rolling processing ratio" here is a value expressed as a percentage by dividing the value obtained by subtracting the cross-sectional area after rolling from the cross-sectional area before rolling by the cross-sectional area before rolling and multiplying by 100. That is, it is expressed by the following formula.
[Rolling rate] = {([Cross-sectional area before rolling]-[Cross-sectional area after rolling]) / [Cross-sectional area before rolling]} x 100 (%)

（ｖ）冷却工程［工程５］
冷却工程は、また、熱間圧延工程（工程４）後に行なうものであって、冷却工程における板材（熱延板）の表層部（板材の表面から板厚の１／８厚さに相当する板材部分）での冷却開始温度を６８０〜８５０℃および平均冷却速度を５〜２０℃/秒とすることが必要である。冷却開始温度が６８０℃未満もしくは平均冷却速度が５℃／秒未満だと、冷却中に溶質元素の粗大析出が進み、製造された銅合金板材において、満足レベルの強度と導電率が得られなくからである。一方、冷却開始温度が８５０℃超えもしくは平均冷却速度が２０℃／秒超えだと、圧延組織の形成が不十分となり、最終工程後の曲げ加工性に悪影響を及ぼす。加えて、平均冷却速度が２０℃／秒超えだと、表面の析出が少なすぎて、溶体化工程にて表面の結晶粒粗大化が進行し、歪みを蓄積しやすくなり、目標とするＣＩ値の分布を満たさず、曲げ加工性が低下する。(V) Cooling step [Step 5]
The cooling step is also performed after the hot rolling step (step 4), and is a plate material corresponding to 1/8 of the plate thickness from the surface of the plate material (hot rolled plate) in the cooling step. It is necessary that the cooling start temperature in the part) is 680 to 850 ° C. and the average cooling rate is 5 to 20 ° C./sec. If the cooling start temperature is less than 680 ° C or the average cooling rate is less than 5 ° C / sec, coarse precipitation of solute elements progresses during cooling, and the produced copper alloy plate material cannot obtain a satisfactory level of strength and conductivity. Because. On the other hand, if the cooling start temperature exceeds 850 ° C. or the average cooling rate exceeds 20 ° C./sec, the formation of the rolled structure becomes insufficient, which adversely affects the bending workability after the final process. In addition, if the average cooling rate exceeds 20 ° C./sec, the precipitation on the surface is too small, the crystal grains on the surface are coarsened in the solution step, and strain is likely to be accumulated, so that the target CI value is obtained. Does not satisfy the distribution of, and the bending workability is lowered.

（ｖｉ）第２面削工程[工程６]
第２面削工程は、熱延材の表面の酸化膜の除去のため、熱延材の表裏の両面をそれぞれ０．５ｍｍ以上の厚さ分だけ削り取る工程である。(Vi) Second surface cutting step [Step 6]
The second surface cutting step is a step of scraping both the front and back surfaces of the hot-rolled material by a thickness of 0.5 mm or more in order to remove the oxide film on the surface of the hot-rolled material.

（ｖｉｉ）第１冷間圧延工程[工程７]
第１冷間圧延工程は、第２面削工程後に、所定の厚さになるまで冷間圧延を施して冷延板を作製する工程である。冷間圧延条件は、例えば、圧延回数２回以上、合計圧延加工率５０％以上とすることが好ましい。(Vii) First cold rolling step [Step 7]
The first cold rolling step is a step of producing a cold rolled plate by performing cold rolling until a predetermined thickness is obtained after the second face cutting step. The cold rolling conditions are preferably, for example, two or more rolling times and a total rolling processing rate of 50% or more.

（ｖｉｉｉ）溶体化熱処理工程[工程８]
溶体化熱処理工程は、昇温速度１〜１５０℃／秒、到達温度８００〜１０００℃、保持時間１〜３００秒、冷却速度１〜２００℃／秒にて熱処理を施す工程である。(Viii) Solution heat treatment step [Step 8]
The solution heat treatment step is a step of performing heat treatment at a heating rate of 1 to 150 ° C./sec, an ultimate temperature of 800 to 1000 ° C., a holding time of 1 to 300 seconds, and a cooling rate of 1 to 200 ° C./sec.

（ｉｘ）追加の冷間圧延工程[工程１２]
追加の冷間圧延工程は、前記溶体化熱処理工程［工程８］の後、時効熱処理工程［工程９］の前に、必要に応じて行なう工程であって、必須の工程ではない。追加の冷間圧延工程を行なうことによって、曲げ加工性を損なわずに引張強度をより一層向上させることができる。圧延条件は、例えば、圧延回数１回以上、合計圧延加工率１０〜７０％とすることが好ましい。(Ix) Additional cold rolling step [Step 12]
The additional cold rolling step is a step performed as necessary after the solution heat treatment step [step 8] and before the aging heat treatment step [step 9], and is not an essential step. By performing an additional cold rolling step, the tensile strength can be further improved without impairing the bending workability. The rolling conditions are preferably, for example, one or more rolling times and a total rolling processing rate of 10 to 70%.

（ｘ）時効熱処理工程[工程９]
時効熱処理工程は、到達温度を４５０〜６５０℃および保持時間を５００〜２００００秒とすることが必要である。到達温度が４５０℃未満もしくは保持時間が５００秒未満の場合、時効析出量が不十分で強度、導電率が不足する。一方、到達温度が６５０℃超えもしくは２００００秒超えだと、析出物の粗大化が生じて、強度が不十分となる。(X) Aging heat treatment step [Step 9]
The aging heat treatment step requires an ultimate temperature of 450 to 650 ° C. and a holding time of 500 to 20000 seconds. When the reaching temperature is less than 450 ° C. or the holding time is less than 500 seconds, the amount of age precipitation is insufficient and the strength and conductivity are insufficient. On the other hand, if the reached temperature exceeds 650 ° C. or 20000 seconds, coarsening of the precipitate occurs and the strength becomes insufficient.

（ｘｉ）第２（最終）冷間圧延工程[工程１０]
第２（最終）冷間圧延工程は、１パスあたりの圧延加工率を１０％以上４０％以下とし、かつ、Ｍ＝｛（Ｒ・Δｈ）０．５｝／ｈで表されるパラメータＭを６以上４０以下とすることが必要である。１パスあたりの圧延加工率が１０％未満だと、加工硬化量が少なく十分な引張強さが得られず、また、１パスあたりの圧延加工率が４０％超えだと、板材全体に大きなせん断歪みが入り曲げ加工性が低下するからである。また、パラメータＭが６未満であると、表面に歪みが蓄積して目標のＣＩ値分布を満たさないからであり、一方、パラメータＭが４０を超えると、圧延設備への負荷が極めて大きくなり現実的ではないからである。第２冷間圧延条件としては、例えば、圧延回数２回以上、合計圧延加工率が１０％以上とすることが好ましい。パラメータＭは、ＲやΔｈが小さくなり、あるいはｈが大きくなるほど小さくなる。特にＣＩ値への顕著な影響として、Ｒが小さくなることで、材料とロールの接触長が減少し、表面近傍のみがせん断されることで、歪量が相対的に高くなり、内部まで均一な歪状態にならないためＣＩＳ/ＣＩＣが低くなる傾向がある。一方、パラメータＭは、ＲやΔｈが大きくなり、あるいはｈが小さくなるほど大きくなる。特にＣＩ値への顕著な影響として、Δｈ、すなわち加工量が多くなるとＣＩ値が０．２以下となる面積率が低下し、加工性が低下する傾向がある。したがって、圧延ロール径Ｒ、加工量Δｈおよび最終板厚ｈを適正に設定することにより、ＣＩ値、ＣＩＳ/ＣＩＣ、さらには強度と曲げ加工性を制御することが可能となる。(Xi) Second (final) cold rolling step [Step 10]
In the second (final) cold rolling step, the rolling process rate per pass is set to 10% or more and 40% or less, and the parameter M represented by M = {(R · Δh) 0.5 } / h is set. It is necessary to make it 6 or more and 40 or less. If the rolling processing rate per pass is less than 10%, the amount of work hardening is small and sufficient tensile strength cannot be obtained, and if the rolling processing rate per pass exceeds 40%, large shearing occurs over the entire plate material. This is because distortion is introduced and bending workability is lowered. Further, if the parameter M is less than 6, strain accumulates on the surface and does not satisfy the target CI value distribution. On the other hand, if the parameter M exceeds 40, the load on the rolling equipment becomes extremely large, which is a reality. Because it is not the target. As the second cold rolling conditions, for example, it is preferable that the number of rolling times is 2 or more and the total rolling processing rate is 10% or more. The parameter M becomes smaller as R and Δh become smaller, or becomes larger as h becomes larger. In particular, as a significant effect on the CI value, as R becomes smaller, the contact length between the material and the roll decreases, and only the vicinity of the surface is sheared, so that the amount of strain becomes relatively high and the inside is uniform. The CI S / CI C tends to be low because it does not become distorted. On the other hand, the parameter M becomes larger as R and Δh become larger, or as h becomes smaller. In particular, as a significant effect on the CI value, Δh, that is, as the amount of processing increases, the area ratio at which the CI value becomes 0.2 or less decreases, and the workability tends to decrease. Therefore, by appropriately setting the rolling roll diameter R, the machining amount Δh, and the final plate thickness h, it is possible to control the CI value, the CI S / CI C , and the strength and bending workability.

（ｘｉｉ）焼鈍工程［工程１１］
焼鈍工程は、第２（最終）冷間圧延工程後に行なう熱処理である。焼鈍条件としては、例えば、到達温度２００〜６００℃、保持時間１〜３６００秒とすることが好ましい。(Xii) Annealing step [Step 11]
The annealing step is a heat treatment performed after the second (final) cold rolling step. The annealing conditions are preferably, for example, an ultimate temperature of 200 to 600 ° C. and a holding time of 1 to 3600 seconds.

（ＶＩＩ）銅合金板材の用途
本発明の銅合金板材は、例えば車載部品用や電気・電子機器用のリードフレーム、コネクタ、端子材、リレー、スイッチ、ソケットなどに用いるのに適している。(VII) Applications of Copper Alloy Plate Material The copper alloy plate material of the present invention is suitable for use in lead frames, connectors, terminal materials, relays, switches, sockets, etc. for in-vehicle parts and electrical / electronic devices, for example.

以上、本発明の実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、本発明の概念および特許請求の範囲に含まれるあらゆる態様を含み、本発明の範囲内で種々に改変することができる。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, but includes all aspects included in the concept of the present invention and the scope of claims, and varies within the scope of the present invention. Can be modified to.

次に、本発明の効果をさらに明確にするために、本発明例および比較例について説明するが、本発明はこれら実施例に限定されるものではない。 Next, in order to further clarify the effect of the present invention, examples of the present invention and comparative examples will be described, but the present invention is not limited to these examples.

（本発明例１〜１６および比較例１〜９）
表１に示す合金組成を有する銅合金素材を溶解する鋳造工程（工程１）で得た鋳塊（サイズ：（厚さ３００ｍｍ、幅５００ｍｍ、長さ３０００ｍｍ）の表面に形成した酸化膜を除去するために表裏の両面をそれぞれ０．５ｍｍ以上の厚さ分だけ削り取る第１面削工程（工程２）を行った後に、表２に示す昇温速度および保持温度の条件で均質化熱処理工程（工程３）を行い、次いで、圧延温度６００〜１１００℃、圧延回数４回以上、合計加工率６０％以上の条件下で熱間圧延工程（工程４）を行った後、表２に示す表層部での冷却開始温度および冷却速度の条件で冷却工程（工程５）を行った。次いで、表面の酸化膜の除去のため、熱延材の表裏の両面をそれぞれ０．５ｍｍ以上の厚さ分だけ削り取る第２面削工程（工程６）を行った後に、圧延回数２回以上、合計加工率５０％以上の条件下で第１冷間圧延工程（工程７）を行い、その後、昇温速度１〜１５０℃／秒、到達温度８００〜１０００℃、保持時間１〜３００秒、冷却速度１〜２００℃／秒の条件で溶体化熱処理工程（工程８）を行う。次いで、表２に示す到達温度および保持時間の条件で時効熱処理工程（工程９）を行った後に、表２に示す１パス当たりの加工率およびパラメータＭとなるように、圧延回数２回以上、合計加工率５％以上の条件下で第２冷間圧延工程（工程１０）を行った。その後、到達温度２００〜６００℃、保持時間１〜３６００秒にて焼鈍工程（工程１１）を行った。なお、本発明例３、４、６〜８および１２ならびに比較例１、３、８および９については、溶体化熱処理工程の後、時効熱処理工程の前に、追加の冷間圧延工程（工程１２）を合計圧延加工率５〜７０％でさらに行なった。このようにして、本発明の銅合金板材を作製した。(Examples 1 to 16 of the present invention and Comparative Examples 1 to 9)
The oxide film formed on the surface of the ingot (size: (thickness 300 mm, width 500 mm, length 3000 mm)) obtained in the casting step (step 1) for melting the copper alloy material having the alloy composition shown in Table 1 is removed. Therefore, after performing the first surface milling step (step 2) in which both the front and back surfaces are scraped by a thickness of 0.5 mm or more, a homogenizing heat treatment step (step 2) is performed under the conditions of the heating rate and holding temperature shown in Table 2. 3) was performed, and then the hot rolling step (step 4) was performed under the conditions of a rolling temperature of 600 to 1100 ° C., a number of rolling times of 4 times or more, and a total processing rate of 60% or more, and then on the surface layer portion shown in Table 2. The cooling step (step 5) was carried out under the conditions of the cooling start temperature and the cooling rate of the above. Next, in order to remove the oxide film on the surface, both the front and back surfaces of the hot-rolled material were scraped by a thickness of 0.5 mm or more. After performing the second surface milling step (step 6), the first cold rolling step (step 7) is performed under the conditions that the number of rolling times is 2 or more and the total processing rate is 50% or more, and then the temperature rise rate 1 to 1 The solution heat treatment step (step 8) is carried out under the conditions of 150 ° C./sec, reaching temperature 800 to 1000 ° C., holding time 1 to 300 seconds, and cooling rate 1 to 200 ° C./sec. Next, the reached temperature and the reached temperature shown in Table 2 and After performing the aging heat treatment step (step 9) under the condition of holding time, the conditions are such that the number of rolling times is 2 or more and the total processing rate is 5% or more so that the processing rate and parameter M per pass shown in Table 2 are obtained. The second cold rolling step (step 10) was then carried out, and then the annealing step (step 11) was carried out at an ultimate temperature of 200 to 600 ° C. and a holding time of 1 to 3600 seconds. , 6-8 and 12 and Comparative Examples 1, 3, 8 and 9 are subjected to an additional cold rolling step (step 12) after the solution heat treatment step and before the aging heat treatment step, with a total rolling ratio of 5 to 5. Further carried out at 70%. In this way, the copper alloy plate material of the present invention was produced.

［各種測定および評価方法］
上記本発明例および比較例に係る銅合金板材を用いて、下記に示す特性評価を行った。各特性の評価条件は下記の通りである。[Various measurement and evaluation methods]
The following characteristic evaluations were carried out using the copper alloy plate materials according to the above-mentioned Examples of the present invention and Comparative Examples. The evaluation conditions for each characteristic are as follows.

［１］銅合金板材の組成の測定方法
合金組成は、ＩＣＰ分析により測定した。[1] Method for measuring the composition of the copper alloy plate The alloy composition was measured by ICP analysis.

［２］ＥＢＳＤ測定方法
作製した各供試材（銅合金板材）の圧延方向に平行な縦断面に対し、耐水研磨紙、ダイヤモンド砥粒を用いて機械研磨を行った後、コロイダルシリカ溶液を用いて仕上げ研磨を行った。そして、ＥＢＳＤ法により、測定面積６４×１０４μｍ２（８００μｍ×８００μｍ）、スキャンステップは０．１μｍの条件で測定を行った。スキャンステップは微細な結晶粒を測定するため、０．１μｍステップで行った。解析では、６４×１０４μｍ２のＥＢＳＤ測定結果から、解析にて逆極点図 ＩＰＦ（Inverse Pole Figure）を確認した。電子線は、走査電子顕微鏡のＷフィラメントからの熱電子を発生源とした。なお、測定時のプローブ径は、約０．０１５μｍである。ＥＢＳＤ法の測定装置には、（株）ＴＳＬソリューションズ製 ＯＩＭ５．０（商品名）を用いた。[2] EBSD measurement method The vertical cross section of each of the prepared test materials (copper alloy plate material) parallel to the rolling direction is mechanically polished with water-resistant abrasive paper and diamond abrasive grains, and then a colloidal silica solution is used. Finish polishing was performed. Then, by the EBSD method, the measurement was performed under the conditions of a measurement area of 64 × 10 4 μm 2 (800 μm × 800 μm) and a scan step of 0.1 μm. The scan step was performed in 0.1 μm steps in order to measure fine crystal grains. In the analysis, the reverse pole figure IPF (Inverse Pole Figure) was confirmed by the analysis from the EBSD measurement result of 64 × 10 4 μm 2 . The electron beam originated from thermions from the W filament of the scanning electron microscope. The probe diameter at the time of measurement is about 0.015 μm. OIM5.0 (trade name) manufactured by TSL Solutions Co., Ltd. was used as the measuring device for the EBSD method.

［３］信頼性指数ＣＩの測定方法
信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率は、図１に示すように、圧延方向に平行な縦断面にて、一方の表層部１１ａから中央部１２を通って他方の表層部１１ｂまで電子線を走査させ、走査した全測定スポット領域から算出した。また、供試材の表層部の信頼性指数（ＣＩ値）の平均値ＣＩＳと、供試材の中央部の信頼性指数（ＣＩ値）の平均値ＣＩＣの算出方法は、板材の厚さ方向（図1の上下方向）に対して板材の縦断面上を所定間隔（例えば２０μｍ間隔）で走査する１０本の線を引き、それぞれの線上のＣＩ値の分布から、板材の表層部と中央部のそれぞれの信頼性指数（ＣＩ値）の平均値を求めた。測定には各条材について、１０視野の測定を行い、その平均値を値として用いた。このＥＢＳＤ法の信頼性指数（ＣＩ値）は、ＥＢＳＤ装置の解析ソフトＯＩＭ Ａｎａｌｙｓｉｓにて測定される値である。[3] Measurement method of reliability index CI The area ratio of the measurement spot region having the reliability index (CI value) of 0.2 or less to the total measurement spot region is parallel to the rolling direction as shown in FIG. The electron beam was scanned from one surface layer portion 11a through the central portion 12 to the other surface layer portion 11b in a vertical cross section, and calculated from the entire scanned spot area. Further, the average value CI S reliability index of the surface layer portion of the sample material (CI value), method of calculating the average value CI C reliability index of the central portion of the test material (CI value), the sheet thickness Draw 10 lines that scan the vertical cross section of the plate material at predetermined intervals (for example, 20 μm intervals) in the vertical direction (vertical direction in FIG. 1), and from the distribution of CI values on each line, the surface layer portion of the plate material The average value of each reliability index (CI value) in the central part was calculated. For the measurement, 10 fields of view were measured for each strip, and the average value was used as a value. The reliability index (CI value) of this EBSD method is a value measured by the analysis software OIM Analysis of the EBSD device.

［４］引張強度
引張強度の測定は、圧延平行方向から切り出したＪＩＳ Ｚ２２４１：２０１１に規定されている１３Ｂ号の３本の試験片で行い、引張強度は、３本の試験片から得られた引張強度の平均値とした。なお、本実施例では、引張強度が６００ＭＰａ以上を合格レベルとした。[4] Tensile strength The tensile strength was measured with three test pieces of No. 13B specified in JIS Z2241: 2011 cut out from the rolling parallel direction, and the tensile strength was obtained from the three test pieces. The average tensile strength was used. In this example, the tensile strength of 600 MPa or more was set as the pass level.

［５］導電率（ＥＣ）の測定方法
導電率は、２０℃（±０．５℃）に保たれた恒温槽中で四端子法により計測した比抵抗の数値から算出することができる。なお、端子間距離は１００ｍｍとした。本実施例では、導電率が５０％ＩＡＣＳ超えの場合を合格レベルとした。[5] Method for measuring conductivity (EC) Conductivity can be calculated from the numerical value of specific resistance measured by the four-terminal method in a constant temperature bath kept at 20 ° C. (± 0.5 ° C.). The distance between the terminals was set to 100 mm. In this example, the case where the conductivity exceeds 50% IACS was regarded as the pass level.

［６］二乗平均平方根粗さＲｑの測定方法
各供試材に対して、日本伸銅協会技術標準ＪＣＢＡ−Ｔ３０７：２００７の試験方法に準拠して曲げ加工を行った。と試験片の長手方向が平行になるように、各供試材から幅１０ｍｍ×長さ３０ｍｍの試験片を複数採取し、曲げ角度が９０度、曲げ半径が０ｍｍのＷ型の治具を用い、Ｗ曲げ試験を行った。そして、曲げ部の外周部に対して、９０°Ｗ曲げ試験片の曲げ表面をレーザー顕微鏡にて０．１μｍピッチにて凹凸を測定した。二乗平均平方根粗さＲｑは、ＪＩＳ Ｂ０６０１：２０１３に準拠し、下記の（２）式に代入することによって算出した。なお、本実施例では、二乗平均平方根粗さＲｑが、７．０μｍ以下である場合を合格レベルとした。[6] Method for measuring root mean square roughness Rq Each test material was bent according to the test method of the Japan Copper and Brass Association technical standard JCBA-T307: 2007. A plurality of test pieces having a width of 10 mm and a length of 30 mm were collected from each test material so that the longitudinal directions of the test pieces were parallel to each other, and a W-shaped jig having a bending angle of 90 degrees and a bending radius of 0 mm was used. , W bending test was performed. Then, the unevenness of the bent surface of the 90 ° W bending test piece was measured with a laser microscope at a pitch of 0.1 μm with respect to the outer peripheral portion of the bent portion. The root mean square roughness Rq was calculated by substituting it into the following equation (2) in accordance with JIS B0601: 2013. In this embodiment, the pass level was defined as the case where the root mean square roughness Rq was 7.0 μm or less.

表１〜３の結果から、本発明例１〜１６の銅合金板材はいずれも、合金組成が本発明の適正範囲内であり、信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率が４０％以下であり、かつＣＩＳ／ＣＩＣ比が０．８以上２．０以下であるため、引張強度と曲げ加工性のバランス性能が優れており、導電率も５０％ＩＡＣＳ超えであった。From the results in Tables 1 to 3, the copper alloy plates of Examples 1 to 16 of the present invention all have a measurement spot whose alloy composition is within the appropriate range of the present invention and whose reliability index (CI value) is 0.2 or less. region, the area ratio to the total measurement spot area is not more than 40%, and CI for S / CI C ratio is 0.8 to 2.0, processability balance performance and tensile bending strength is superior The conductivity was also over 50% IACS.

一方、比較例１〜９の銅合金板材はいずれも、合金組成、前記面積率およびＣＩＳ／ＣＩＣ比の少なくとも１つが本発明の適正範囲外であるため、引張強度と曲げ加工性の少なくとも一方が合格レベルに達していなかった。On the other hand, none of the copper alloy sheet of Comparative Example 1-9, the alloy composition, since at least one of the area ratio and CI S / CI C ratio is outside the appropriate range of the present invention, at least the bending workability and tensile strength One did not reach the passing level.

１０ 銅合金板材
１１ａ、１１ｂ 銅合金板材の表層部
１２ 銅合金板材の中央部10 Copper alloy plate material 11a, 11b Surface layer part of copper alloy plate material 12 Central part of copper alloy plate material

Claims (6)

Ｃｏを０．３〜２．５質量％およびＳｉを０．１〜０．７質量％含有し、残部がＣｕおよび不可避不純物からなる合金組成を有する銅合金板材であって、
該銅合金板材の圧延方向に平行な縦断面に対し、電子後方散乱回折（ＥＢＳＤ）法によって行なった結晶方位解析は、
信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率が４０％以下であり、かつ、
前記縦断面を、板材の両表面をそれぞれ含む１対の表層部と、該１対の表層部に挟まれて位置する中央部とに区分し、前記１対の表層部の前記信頼性指数（ＣＩ値）の平均値をＣＩＳとし、前記中央部の前記信頼性指数（ＣＩ値）の平均値をＣＩＣとするとき、ＣＩＣに対するＣＩＳの比（ＣＩＳ／ＣＩＣ比）が、０．８以上２．０以下であることを特徴とする銅合金板材。A copper alloy plate containing 0.3 to 2.5% by mass of Co and 0.1 to 0.7% by mass of Si, and having an alloy composition in which the balance is Cu and unavoidable impurities.
The crystal orientation analysis performed by the electron backscatter diffraction (EBSD) method on the vertical cross section parallel to the rolling direction of the copper alloy plate material is
The area ratio of the measurement spot area having a reliability index (CI value) of 0.2 or less to the total measurement spot area is 40% or less, and
The vertical cross section is divided into a pair of surface layer portions including both surfaces of the plate material and a central portion located sandwiched between the pair of surface layer portions, and the reliability index of the pair of surface layer portions ( when the average value of the CI value) and CI S, the average value of the reliability index (CI value) of the central portion and CI C, the ratio of the CI S for CI C (CI S / CI C ratio), A copper alloy plate material characterized by being 0.8 or more and 2.0 or less. Ｃｏを０．３〜２．５質量％およびＳｉを０．１〜０．７質量％含有し、さらにＣｒを０．０５〜１．０質量％、Ｎｉを０．０５〜０．７質量％、Ｆｅを０．０２〜０．５質量％、Ｍｇを０．０１〜０．３質量％、Ｍｎを０．０１〜０．５質量％、Ｚｎを０．０１〜０．１５質量％およびＺｒを０．０１〜０．１５質量％からなる群から選択される少なくとも１種の任意添加成分を含有し、残部がＣｕおよび不可避不純物からなる合金組成を有する銅合金板材であって、
該銅合金板材の長手方向に平行な縦断面に対し、電子後方散乱回折（ＥＢＳＤ）法によって行なった結晶方位解析は、
信頼性指数（ＣＩ値）が０．２以下である測定スポット領域の、全測定スポット領域に占める面積率が４０％以下であり、かつ、
前記縦断面を、板材の両表面をそれぞれ含む１対の表層部と、該１対の表層部に挟まれて位置する中央部とに区分し、前記１対の表層部の前記信頼性指数（ＣＩ値）の平均値をＣＩＳとし、前記中央部の前記信頼性指数（ＣＩ値）の平均値をＣＩＣとするとき、ＣＩＣに対するＣＩＳの比（ＣＩＳ／ＣＩＣ比）が、０．８以上２．０以下であることを特徴とする銅合金板材。It contains 0.3 to 2.5% by mass of Co and 0.1 to 0.7% by mass of Si, and 0.05 to 1.0% by mass of Cr and 0.05 to 0.7% by mass of Ni. , Fe 0.02 to 0.5% by mass, Mg 0.01 to 0.3% by mass, Mn 0.01 to 0.5% by mass, Zn 0.01 to 0.15% by mass and Zr. A copper alloy plate material containing at least one optional additive component selected from the group consisting of 0.01 to 0.15% by mass and having an alloy composition in which the balance is Cu and unavoidable impurities.
The crystal orientation analysis performed by the electron backscatter diffraction (EBSD) method on the vertical cross section parallel to the longitudinal direction of the copper alloy plate material is
The area ratio of the measurement spot area having a reliability index (CI value) of 0.2 or less to the total measurement spot area is 40% or less, and
The vertical cross section is divided into a pair of surface layer portions including both surfaces of the plate material and a central portion located sandwiched between the pair of surface layer portions, and the reliability index of the pair of surface layer portions ( when the average value of the CI value) and CI S, the average value of the reliability index (CI value) of the central portion and CI C, the ratio of the CI S for CI C (CI S / CI C ratio), A copper alloy plate material characterized by being 0.8 or more and 2.0 or less. 前記任意添加成分は、合計で１．５質量％以下含有する、請求項２に記載の銅合金板材。 The copper alloy plate material according to claim 2, wherein the optional additive component is contained in an amount of 1.5% by mass or less in total. 前記圧延方向と平行に引っ張ったときの引張強度が６００ＭＰａ以上であり、
導電率が５０％ＩＡＣＳ超えであり、かつ、
日本伸銅協会（ＪＣＢＡ）Ｔ３０７：２００７に準拠するＷ曲げ試験をＧｏｏｄｗａｙ方向にｒ／ｔ＝０で行った後の、曲げ加工部の屈曲外面における二乗平均平方根粗さＲｑが７．０μｍ以下である、請求項１〜３のいずれか１項に記載の銅合金板材。The tensile strength when pulled parallel to the rolling direction is 600 MPa or more.
Conductivity exceeds 50% IACS and
After performing a W bending test based on the Japan Copper and Brass Association (JCBA) T307: 2007 in the Goodway direction at r / t = 0, the root mean square roughness Rq on the bent outer surface of the bent portion is 7.0 μm or less. The copper alloy plate material according to any one of claims 1 to 3. 請求項１〜４のいずれか１項に記載の銅合金板材を製造する方法であって、
前記銅合金板材の前記合金組成と実質的に同じ合金組成を有する銅合金素材に、鋳造工程［工程１］、第１面削工程［工程２］、均質化熱処理工程［工程３］、熱間圧延工程［工程４］、冷却工程［工程５］、第２面削工程［工程６］、第１冷間圧延工程［工程７］、溶体化熱処理工程［工程８］、時効熱処理工程［工程９］、第２冷間圧延工程［工程１０］および焼鈍工程［工程１１］を順次行ない、
前記均質化熱処理工程［工程３］における昇温速度を１０〜１１０℃／秒および保持温度を９５０〜１２５０℃とし、
前記冷却工程［工程５］における板材の表層部での冷却開始温度を６８０〜８５０℃および平均冷却速度を５〜２０℃/秒とし、
前記時効熱処理工程［工程９］における到達温度を４５０〜６５０℃および保持時間を５００〜２００００秒とし、そして、
前記第２冷間圧延工程［工程１０］は、１パスあたりの加工率が１０％以上４０％以下であり、かつ、圧延ロール径をＲ、加工量をΔｈおよび最終板厚をｈとするとき、パラメータＭは、下記の（１）式で表され、６以上４０以下であることを特徴とする銅合金板材の製造方法。
Ｍ＝｛（Ｒ・Δｈ）０．５｝／ｈ ・・・・（１）The method for producing a copper alloy plate according to any one of claims 1 to 4.
A copper alloy material having substantially the same alloy composition as the alloy composition of the copper alloy plate material is subjected to a casting step [step 1], a first surface milling step [step 2], a homogenizing heat treatment step [step 3], and hot. Rolling step [step 4], cooling step [step 5], second surface milling step [step 6], first cold rolling step [step 7], solution heat treatment step [step 8], aging heat treatment step [step 9] ], The second cold rolling step [step 10] and the annealing step [step 11] are sequentially performed.
The heating rate in the homogenizing heat treatment step [Step 3] was 10 to 110 ° C./sec, and the holding temperature was 950 to 1250 ° C.
The cooling start temperature at the surface layer of the plate material in the cooling step [step 5] was 680 to 850 ° C., and the average cooling rate was 5 to 20 ° C./sec.
The ultimate temperature in the aging heat treatment step [step 9] was 450 to 650 ° C. and the holding time was 500 to 20000 seconds.
In the second cold rolling step [step 10], when the machining rate per pass is 10% or more and 40% or less, the rolling roll diameter is R, the machining amount is Δh, and the final plate thickness is h. , Parameter M is represented by the following equation (1), and is a method for producing a copper alloy plate material, which is 6 or more and 40 or less.
M = {(R · Δh) 0.5 } / h ・ ・ ・ ・ (1) 前記溶体化熱処理工程［工程８］の後、時効熱処理工程［工程９］の前に、追加の冷間圧延工程［工程１２］をさらに行なう、請求項５に記載の銅合金板材の製造方法。 The method for producing a copper alloy plate material according to claim 5, wherein an additional cold rolling step [step 12] is further performed after the solution heat treatment step [step 8] and before the aging heat treatment step [step 9].
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