JPWO2020072597A5 - - Google Patents

Claims (26)

a plurality of drying channels comprising a roughened layer configured to inhibit the movement of water vapor to the drying channels and having a feature size of less than 1000 nm and a hydrophobic chemical modification disposed on the roughened layer; and an evaporative cooling system comprising a porous ceramic body including a plurality of wetting channels configured to allow movement of water vapor. 2. The evaporative cooling system of claim 1, wherein said plurality of dry channels and said plurality of wet channels have a configuration selected from the group consisting of parallel flow, counter flow, and cross flow. 2. The evaporative cooling system of claim 1, wherein said evaporative cooling system is an indirect evaporative cooling system. 2. The evaporative cooling system of claim 1, wherein said porous ceramic body is selected from the group consisting of oxides, composites, clay bodies, stoneware, earthenware, porcelain, bone china, and combinations thereof. The evaporative cooling system of claim 1, wherein the porous ceramic body has pore sizes between 10 nm and 1000 nm. The evaporative cooling system of claim 1, wherein said porous ceramic body has a pore volume of 1-80%. The evaporative cooling system of claim 1, wherein the roughened layer has a roughness of 0.1 nm to 1000 nm. The roughened layer is alumina, silica, titania, beryllia, ceria, zirconia, cupric oxide, cuprous oxide, barium oxide, germanium oxide, yttria, strontium oxide, hafnium oxide, magnesium oxide, niobium oxide, oxide 2. The evaporative cooling system of claim 1, selected from the group consisting of tin, tantalum oxide, tungsten oxide, aluminum oxyhydroxide, and combinations thereof. 2. The evaporative cooling system of claim 1, wherein the roughened layer comprises a sol-gel coating or a dispersion of metal oxide particles. 10. The evaporative cooling system of claim 9, wherein said metal oxide particles have a diameter between 2 nm and 20 μm. The evaporative cooling system of claim 1, wherein said roughened layer has a thickness of 100 nm to 5 mm. Said hydrophobic chemical modification is an organosilane or thiol molecule terminated with either a methyl group, an aryl group, a branched alkyl chain, a linear alkyl chain, a perfluoro chain, or a hydrophobic polymer; siloxanes, alkyl phosphates salt, alkyl phosphate, alkane-phosphonic acid, alkane-phosphonate ester, alkane-hydroxamic acid, alkane-carboxylic acid, fatty acid, natural wax, synthetic wax, and combinations thereof. The evaporative cooling system of claim 1. 2. The evaporative cooling system of claim 1, wherein the hydrophobic chemical modifier is covalently bound to or adsorbed on the roughened layer. 2. The evaporative cooling system of claim 1, wherein the evaporative cooling system is incorporated into at least one of a building exterior wall, a building roof, and a building interior. providing a porous ceramic body;
forming a roughened layer having a feature size of less than 1000 nm within a first region of the porous ceramic body; and chemically modifying the roughened layer within the first region;
A method of manufacturing an evaporative cooling system, comprising: 16. The method of claim 15, further comprising forming a roughened layer in a second region of said porous ceramic body. The step of providing the porous ceramic body is selected from the group consisting of extrusion, co-extrusion, press molding, casting, foam molding, additive manufacturing, and multi-material additive manufacturing. 16. The method of claim 15, comprising forming a ceramic according to the method. Alumina, silica, titania, beryllia, ceria, zirconia, cupric oxide, cuprous oxide, barium oxide, germanium oxide, yttria, strontium oxide, hafnium oxide, magnesium oxide, niobium oxide, tin oxide , tantalum oxide, tungsten oxide, aluminum oxyhydroxide, and combinations thereof. The step of forming the roughened layer includes
dissolving the sol-gel precursor in an organic solvent;
initiating a hydrolysis reaction to form a network gel;
16. The method of claim 15, comprising: applying the network gel to a porous ceramic body; and heating the porous ceramic body. 20. The method of claim 19, wherein forming the roughened layer further comprises providing metal oxide particles. 21. The method of claim 20, further comprising providing metal oxide particles in the sol-gel precursor prior to dissolving the sol-gel precursor in an organic solvent. 21. The method of claim 20, further comprising providing metal oxide particles in the sol-gel precursor after dissolving the sol-gel precursor in the organic solvent. 21. The method of claim 20, further comprising providing metal oxide particles during the hydrolysis reaction. 21. The method of claim 20, further comprising densifying and recrystallizing the network gel by hydrothermal reaction. The step of forming the roughened layer includes
20. The method of claim 19, comprising applying a dispersion of metal oxide particles to the porous ceramic body. 16. The method of claim 15, wherein chemically modifying the roughened layer comprises covalently bonding molecules to the roughened layer or adsorbing molecules to the roughened layer.