JPWO2020070880A1 - Measuring device and component mounting machine - Google Patents

Abstract

The base portion (13) in which the light emitting portion (14) and the light receiving portion (15) that output parallel light are fixed in a predetermined positional relationship, and the base portion is tilted to change the irradiation angle of the parallel light. It is provided with a tilting mechanism unit (25). While the measurement target is held in a constant posture at a position where the thickness of the measurement target (42) is within the width of the parallel light (16), the tilt mechanism portion tilts the base portion to obtain the parallel light. While changing the irradiation angle, observe that the measured value of the width of the portion of the parallel light shaded by the measurement target increases or decreases to obtain the minimum value of the measured value, and based on the minimum value of the measured value. Measure the thickness dimension of the measurement target or the amount of deformation in the thickness direction, or the tilt angle of the measurement target in the thickness direction based on the tilt angle of the base portion when the measured value becomes the minimum. To measure.

Description

This specification discloses a technique relating to a measuring device and a component mounting machine for measuring any of the thickness dimension of a measurement target, the amount of deformation in the thickness direction, and the inclination angle in the thickness direction.

For example, among electronic components mounted on a circuit board, there are electronic components with leads in which a plurality of leads are arranged in rows on two or four sides of the component body. In such electronic components with leads, if some of the leads are bent (deformed), when the leads of the electronic component are soldered to the pads of the circuit board, some of the leads will be attached to the pads of the circuit board. It may not adhere sufficiently and may cause a poor connection.

Therefore, a method for detecting the bending of a lead has been proposed in Patent Document 1 (Japanese Unexamined Patent Publication No. 1-260349). In this detection method, as shown in FIG. 8, the parallel laser light 52 is irradiated from the floodlight 51 toward the receiver 53, and the rows of the leads 54 of the electronic components are positioned within the width of the parallel laser light 52. Further, the positions of the floodlight 51 and the receiver 53 can be switched between a diagonally downward irradiation position in which the parallel laser light 52 is irradiated from diagonally below the row of the leads 54 and an obliquely upward irradiation position in which the parallel laser light 52 is irradiated from diagonally above. Then, in advance, a row of unbent leads 54 of a standard sample component is positioned within the width of the parallel laser light 52, and a row of the parallel laser light 52 is led from the floodlight 51 located at the obliquely downward irradiation position. The light of the portion of the parallel laser light 52 that is not shielded by the row of leads 54 is received by the receiver 53, and the detected value of the received amount is stored in the storage device as a standard value. I will do it. Similarly, the amount of light received by the light receiver 53 when the parallel laser light 52 is irradiated from diagonally above the row of the leads 54 from the floodlight 51 moved to the diagonally upward irradiation position is detected, and the detected value is set as a standard value. It is stored in the storage device as. After that, during production, the row of leads 54 of the electronic component to be inspected is positioned within the width of the parallel laser beam 52, and the procedure is the same as for the standard sample component without bending of the lead 54 described above. , The light receiving amount of the receiver 53 is detected at two locations, the diagonally downward irradiation position and the diagonally upward irradiation position, and the detected value of the received light amount is compared with the standard value stored in the memory, and the difference between the two is within the permissible error range. It is determined whether or not the lead 54 is bent depending on whether or not the lead 54 is bent.

Japanese Unexamined Patent Publication No. 1-260349

It is conceivable to mount the reed bending detection device of Patent Document 1 on a component mounting machine and inspect the presence or absence of bending of the reed of an electronic component supplied from the component supply device during production, but the following problems There is.

In the component mounting machine, the electronic components supplied from the component supply device are attracted by the suction nozzle during production, and the rows of the leads 54 of the electronic components are positioned within the width of the parallel laser beam 52. During production, the rows of leads 54 of the electronic components that are attracted to the suction nozzle are not always exactly horizontal and may be slightly tilted, but the rows of leads 54 that are positioned within the width of the parallel laser beam 52 If it is tilted, the width of the light-shielded portion of the parallel laser beam 52 in the row of the leads 54 changes, and the amount of light received by the receiver 53 changes. Therefore, if the row of leads 54 is tilted, even if the row of leads 54 is not bent, the amount of light received by the receiver 53 may be the same as that of the row of leads 54 with bending. Therefore, it may be erroneously determined whether or not the lead 54 is bent, and there is a problem in the detection reliability of the bend of the lead 54.

In order to solve the above problem, in a measuring device that measures any of the thickness dimension of the measurement target, the amount of deformation in the thickness direction, and the tilt angle in the thickness direction, parallel light wider than the thickness dimension of the measurement target is emitted. Based on the light receiving state of the light receiving unit, the light emitting unit that irradiates the measurement target, the light receiving unit that receives the light of the portion of the parallel light emitted from the light emitting unit that is not blocked by the measurement target, and the light receiving state of the light receiving unit. A measurement control unit that measures the width of a portion of the parallel light that is shielded from light by the measurement target, a base unit that fixes the light projecting unit and the light receiving unit in a predetermined positional relationship, and the base unit. It is provided with a tilting mechanism unit that changes the irradiation angle of the parallel light by tilting, and a holding unit that holds the measurement object in a constant posture at a position where the thickness of the measurement object falls within the width of the parallel light. The measurement control unit tilts the base unit by the tilting mechanism unit to change the irradiation angle of the parallel light, and the measured value of the width of the portion of the parallel light shielded by the measurement target increases or decreases. The minimum value of the measured value is obtained by observing the measurement, and the thickness dimension of the measurement target or the amount of deformation in the thickness direction is measured based on the minimum value of the measured value, or the measured value is the minimum. The tilt angle in the thickness direction of the measurement target is measured based on the tilt angle of the base portion at that time.

In this configuration, while changing the irradiation angle of the parallel light emitted from the light projecting unit toward the measurement target, it is observed that the measured value of the width of the portion of the parallel light shaded by the measurement target increases or decreases. Then, the minimum value of the measured value is obtained. At this time, even if the measurement target is tilted, when the irradiation angle of the parallel light matches the tilt angle of the measurement target, the measured value of the width of the portion of the parallel light shaded by the measurement target becomes the minimum. Therefore, the thickness dimension of the measurement target or the amount of deformation in the thickness direction is measured based on the minimum value of the measured value, or the measurement is performed based on the inclination angle of the base portion when the measured value is minimized. By measuring the inclination angle of the object in the thickness direction, even if the object to be measured is inclined, the thickness dimension of the object to be measured, the amount of deformation in the thickness direction, and the thickness direction are not affected by the inclination. The tilt angle can be measured with high accuracy.

FIG. 1 is a perspective view of a measuring device showing an embodiment. FIG. 2 is a front view of the measuring device. FIG. 3 is a top view of the measuring device. FIG. 4 is a rear view of the main part including the tilting mechanism part. FIG. 5 is a diagram illustrating a light receiving state of the light receiving portion when the lead row is slightly tilted with respect to the irradiation direction of the parallel laser light. FIG. 6 is a diagram illustrating a light receiving state of the light receiving portion when the irradiation angle of the parallel laser beam coincides with the tilt angle of the lead row due to the tilt of the base portion. FIG. 7 is a block diagram showing a configuration of a control system of a component mounting machine equipped with a measuring device. FIG. 8 is a diagram illustrating a lead bending detection method of Patent Document 1.

Hereinafter, an embodiment disclosed in the present specification will be described with reference to the drawings.

First, the configuration of the measuring device 10 will be described with reference to FIGS. 1 to 6.

The base 11 of the measuring device 10 is provided with a mounting frame 12 for mounting and fixing to the component mounting machine 40 (see FIG. 7). A plate-shaped base portion 13 is arranged on the base 11, and a light emitting portion 14 and a light receiving portion 15 are fixed to the upper surface of the base portion 13 in a predetermined positional relationship.

Although not shown, the light projecting unit 14 converts the laser light generated by the laser light source into parallel laser light 16 having a predetermined width in the vertical direction with a special lens and outputs the laser light in a direction parallel to the upper surface of the base unit 13. .. In the parallel laser light output direction of the light projecting unit 14, an optical path bending member 17 such as a mirror or a prism that bends the optical path of the parallel laser light 16 at a right angle is arranged. The vertical width of the parallel laser beam 16 is set to be wider than the thickness dimension (vertical dimension) of the measurement target. In this embodiment, the measurement target is a row of leads 42 of electronic components (see FIGS. 5 and 6).

On the other hand, in front of the light receiving surface of the light receiving unit 15, an optical path bending member 18 such as a mirror or a prism that bends the optical path of the parallel laser light 16 bent at a right angle by the optical path bending member 17 of the light projecting unit 14 is arranged. The parallel laser beam 16 bent at a right angle by the optical path bending member 18 is received by the light receiving unit 15. As a result, the optical path of the parallel laser beam 16 between the light projecting unit 14 and the light receiving unit 15 is bent in a П shape by the two optical path bending members 17 and 18, and also with the optical path bending member 17 of the light projecting unit 14. The optical path of the parallel laser beam 16 passing between the light receiving portion 15 and the optical path bending member 18 is set to be parallel to the upper surface of the base portion 13. A measurement target is inserted into the parallel laser beam 16 between the two optical path bending members 17 and 18, and the thickness dimension of the measurement target or the amount of deformation (bending amount) in the thickness direction is measured.

The light receiving unit 15 is configured to use a one-dimensional image sensor element such as a CCD or CMOS as a light receiving element so that it can measure both the width and the position of the portion of the parallel laser light 16 that is shielded from light by the measurement target. You may. Alternatively, the light receiving unit 15 collects the parallel laser light 16 to be received by a lens and receives the light by a light receiving element such as a photodiode, depending on the width of the portion of the parallel laser light 16 that is shielded from light by the measurement target. Utilizing the characteristic that the light receiving amount of the light receiving element decreases, the light receiving amount is detected, and the width of the portion of the parallel laser beam 16 that is shielded from light by the measurement target is measured from the detected value of the light receiving amount. It may be configured as.

A support substrate 21 is attached to the lower surface side of the base portion 13 to which the light emitting portion 14 and the light receiving portion 15 are fixed via, for example, four angle adjusting portions 22. Each angle adjusting portion 22 is composed of bolts and nuts, and the operator can adjust each angle adjusting portion 22 with a tool such as a spanner to adjust the angle of the base portion 13 with respect to the support substrate 21. There is. The base portion 13 and the support substrate 21 are integrally supported on the base 11 via a shaft 23 (see FIG. 4) so as to be tilted integrally in the vertical direction.

As shown in FIG. 4, the measuring device 10 is provided with a tilting mechanism portion 25 that changes the irradiation angle of the parallel laser beam 16 by tilting the base portion 13. The tilting mechanism portion 25 includes a motor 26 provided on the base 11, a cam 27 such as an eccentric cam and an elliptical cam rotated by the motor 26, and a cam follower 28 provided on the support substrate 21 of the base portion 13. By rotating the cam 27, the cam follower 28 is reciprocated in the vertical direction, which is the tilting direction of the base portion 13, so that the base portion 13 is reciprocally tilted in the vertical direction with the shaft 23 as a fulcrum. The rotation transmission system between the motor 26 and the cam 27 is configured by meshing a gear 30 fitted to the rotation shaft of the motor 26 and a gear 31 that rotates integrally with the cam 27. The motor 26 is a stepping motor, a servomotor, or the like provided with a rotation angle sensor such as an encoder that detects the rotation angle. During the measurement operation, the cam 27 is rotated once based on the output signal of the rotation angle sensor to rotate the base portion 13. Is tilted one reciprocatingly in the vertical direction from the angle before tilting to return to the angle before tilting and stopped.

The measuring device 10 is provided with a reference position portion 34 (see FIG. 1) capable of recognizing an image from above at a portion where a constant positional relationship with the parallel laser beam 16 is maintained. In this embodiment, a predetermined position on the upper surface side of the optical path bending member 17 on the light emitting portion 14 side and the upper surface of the optical path bending member 18 on the light receiving portion 15 side, which are portions where a constant positional relationship with the parallel laser beam 16 is maintained. Reference position portions 34 are provided at two predetermined positions on the side so that the direction of the parallel laser beam 16 between the two optical path bending members 17 and 18 in the XY direction (horizontal direction) can be specified.

The measurement control unit 35 (see FIG. 7) that controls the operation of the light receiving unit 15, the light receiving unit 15, and the motor 26 of the tilting mechanism unit 25 is composed of a microcomputer or the like, and the tilting mechanism unit 25 moves the base unit 13 in the vertical direction. While changing the irradiation angle of the parallel laser light 16 by tilting, observe that the measured value of the width of the portion of the parallel laser light 16 shaded by the measurement target increases or decreases, and obtain the minimum value of the measured value. , The amount of deformation in the thickness dimension or thickness direction of the measurement target is measured based on the minimum value of the measured value.

The measuring device 10 configured as described above is detachably attached to a predetermined position of the component mounting machine 40 (see FIG. 7). The component mounting machine 40 is interchangeably set with component supply devices 41 such as a tape feeder, a tray feeder, and a stick feeder that supply various electronic components to be mounted on a circuit board. The electronic component supplied from the component supply device 41 includes an electronic component with a lead in which a plurality of leads 42 are arranged in a row on two or four sides of the component body.

The component mounting machine 40 is mounted by replaceably mounting a conveyor 43 that conveys a circuit board and a holding portion (not shown) such as a suction nozzle or a chuck that picks up and holds electronic components supplied by the component supply device 41. An image of the head (not shown), the mounting head moving device 44 that moves the mounting head in the XY directions (front-back and left-right directions) and the Z direction (vertical direction), and the electronic components picked up and held by the holding portion from below. It is provided with a component imaging camera 45 for imaging components and a mark imaging camera 46 for imaging a reference position mark or the like on a circuit board from above. The component imaging camera 45 is fixed upward at a predetermined position of the component mounting machine 40. The mark imaging camera 46 is mounted downward on the mounting head side, and is integrally moved with the mounting head by the mounting head moving device 44. The position of the measuring device 10 in the component mounting machine 40 is set so that the parallel laser beam 16 of the measuring device 10 is located within the movable range of the holding portion of the mounting head.

The control unit 47 of the component mounting machine 40 is composed of one or a plurality of computers, and controls the operation of each of the above-described functions of the component mounting machine 40. When the electronic component supplied from the component supply device 41 is an electronic component with a lead, the control unit 47 of the component mounting machine 40 picks up the electronic component by the holding unit of the mounting head and moves it to the measuring device 10 side. The two optical path bending members 17 and 18 of the measuring device 10 are moved with reference to the position of the reference position portion 34 by imaging the reference position portion 34 of the measuring device 10 with the mark imaging camera 46 and recognizing the image. The position of the parallel laser beam 16 between them is measured, and the mounting head is moved above the parallel laser beam 16 based on the measured value to measure the lead of the electronic component held by the holding portion of the mounting head. The row of 42 was held within the width of the parallel laser beam 16 and held at a constant angle (that is, the row of leads 42 was held at a constant angle so that the row of leads 42 did not tilt even if the base portion 13 of the measuring device 10 was tilted. In the state), a measurement execution command signal is transmitted from the control unit 47 of the component mounting machine 40 to the measurement control unit 35 of the measurement device 10, and the thickness dimension of the lead 42 or the amount of deformation in the thickness direction is measured as follows. To do.

When the measurement control unit 35 of the measuring device 10 receives the measurement execution command signal from the control unit 47 of the component mounting machine 40, it outputs the parallel laser light 16 from the light projecting unit 14 and activates the motor 26 of the tilting mechanism unit 25. Then, the cam 27 is rotated once to tilt the base portion 13 one reciprocatingly in the vertical direction from the angle before tilting with the shaft 23 as a fulcrum, thereby tilting the parallel laser beam 16 one reciprocatingly in the vertical direction from the angle before tilting. Let it return to the angle before tilting and stop. As a result, as shown in FIGS. 5 to 6, the measurement control unit 35 captures the light receiving signal of the light receiving unit 15 while changing the irradiation angle of the parallel laser light 16, and the row of leads 42 of the parallel laser light 16. Observe that the measured value of the width of the light-shielded portion increases or decreases, obtain the minimum value of the measured value, and measure the thickness dimension of the lead 42 or the amount of deformation in the thickness direction based on the minimum value of the measured value. To do.

For example, even if the rows of leads 42 are not bent, as shown in FIG. 5, when the rows of leads 42 are tilted with respect to the irradiation direction (optical axis) of the parallel laser light 16, the parallel laser light The width of the light-shielded portion of the 16 rows of the leads 42 increases according to the tilt angle of the rows of the leads 42. As shown in FIG. 6, the tilt of the irradiation direction (optical axis) of the parallel laser beam 16 increases. When the angle coincides with the tilt angle of the row of leads 42, the width of the portion of the parallel laser beam 16 shaded by the row of leads 42 is minimized. Therefore, the measurement control unit 35 tilts the parallel laser beam 16 one reciprocatingly in the vertical direction from the angle before tilting, and the measured value of the width of the portion of the parallel laser beam 16 shielded by the row of leads 42 increases or decreases. The minimum value of the measured value is obtained by observing the measurement, and the thickness dimension (or the amount of deformation in the thickness direction) of the lead 42 is measured based on the minimum value of the measured value, and the measured value is the thickness of the lead 42. If it is within the tolerance range of the dimensions, it is determined that the row of the leads 42 is normal (the thickness dimension of the leads 42 is within the tolerance range and the leads 42 are not bent), while the measured value is the lead 42. If it is out of the tolerance range of the thickness dimension, it is determined that the row of the leads 42 is abnormal (the lead 42 is bent or the thickness dimension of the lead 42 is inappropriate). The normal / abnormal determination result of the row of the leads 42 is transmitted from the measurement control unit 35 to the control unit 47 of the component mounting machine 40.

It should be noted that the measurement control unit 35 transmits the measured value of the width of the portion of the parallel laser beam 16 shaded by the row of the leads 42 to the control unit 47 of the component mounting machine 40, and the control unit 47 of the component mounting machine 40. Finds the minimum value of the measured value, measures the thickness dimension (or the amount of deformation in the thickness direction) of the lead 42 based on the minimum value of the measured value, and the measured value is the tolerance of the thickness dimension of the lead 42. The normality / abnormality of the row of the leads 42 may be determined based on whether or not the lead 42 is within the range. Alternatively, the measurement control unit 35 performs a process of obtaining the minimum value of the measured value, and the measurement control unit 35 transmits the minimum value of the measured value to the control unit 47 of the component mounting machine 40 to control the component mounting machine 40. Depending on whether or not the measured value of the thickness dimension (or the amount of deformation in the thickness direction) of the lead 42 obtained from the minimum value of the measured value in the part 47 is within the allowable error range of the thickness dimension of the lead 42, the lead 42 It is also possible to judge the normality / abnormality of the column of.

For each row of leads 42 on each side of the electronic component, the normality / abnormality of the row of leads 42 is determined by the method described above. As a result, when the control unit 47 of the component mounting machine 40 determines that there is an abnormality in the row of the leads 42 on any side of the electronic component, the control unit 47 moves the mounting head above the predetermined disposal location to perform the electronic component. Dispose of the parts at the designated disposal site.

On the other hand, when the control unit 47 of the component mounting machine 40 determines that the rows of all the leads 42 of the electronic components are normal, the control unit 47 moves the mounting head above the component imaging camera 45 to move the mounting head to the mounting head. By imaging the electronic component held in the holding unit with the component imaging camera 45 and recognizing the image, the amount of deviation in the position and angle of the electronic component is measured, and the mounting head is moved above the circuit board. The lead 42 of the electronic component is soldered to the land of the circuit board after correcting the deviation amount of the position and the angle of the electronic component.

According to the present embodiment described above, the tilting mechanism unit 25 of the measuring device 10 captures the light receiving signal of the light receiving unit 15 while changing the irradiation angle of the parallel laser light 16, and the row of leads 42 of the parallel laser light 16. Observe that the measured value of the width of the portion shaded by is increased or decreased to obtain the minimum value of the measured value, and based on the minimum value of the measured value, the thickness dimension (or the amount of deformation in the thickness direction) of the lead 42. Therefore, even if the row of leads 42 is tilted with respect to the optical axis of the parallel laser beam 16, the thickness dimension of the leads 42 or the amount of deformation in the thickness direction can be measured without being affected by the tilt. It can be measured with high accuracy.

In this embodiment, the measurement target is the row of the leads 42 of the electronic component, but it may be a predetermined portion of the body portion of the electronic component.

Further, in this embodiment, the measuring device 10 is attached to the component mounting machine 40 for use, but it may be used for a device other than the component mounting machine 40. Therefore, the measurement target is not limited to a predetermined portion of the electronic component, and an article other than the electronic component may be the measurement target.

The irradiation direction of the parallel laser beam 16 of the measuring device 10 is not limited to the substantially horizontal direction, and may be a direction other than the substantially horizontal direction such as the vertical direction. Generally, the thickness direction of the measurement target is the width direction of the parallel laser beam (the direction perpendicular to the irradiation direction).

Further, the tilt angle of the base portion 13 (parallel laser) when the measured value of the width of the shaded portion of the row of the leads 42 of the parallel laser beam 16 is observed to increase or decrease and the measured value becomes the minimum. The inclination angle in the thickness direction of the measurement target may be measured based on the irradiation angle of the light 16). At this time, the method of measuring the tilt angle of the base portion 13 (irradiation angle of the parallel laser beam 16) is based on the output signal of a rotation angle sensor such as an encoder that detects the rotation angle of the motor 26 of the tilt mechanism unit 25. The tilt angle of 13 may be measured, or a sensor for detecting the tilt angle of the base portion 13 may be provided.

Further, in this embodiment, the optical path of the parallel laser beam 16 between the light projecting unit 14 and the light receiving unit 15 is bent in a П shape by the two optical path bending members 17, 18, but the optical path bending member 17, 18 may be eliminated so that the light emitting unit 14 and the light receiving unit 15 face each other so that the optical path of the parallel laser light between the light emitting unit 14 and the light receiving unit 15 becomes a straight line.

In addition, the present invention is not limited to the above embodiment, and various aspects such as changing the configuration of the tilting mechanism portion 25 and using parallel light of a type other than laser light, etc., within a range that does not deviate from the gist. Needless to say, it can be changed and implemented.

10 ... Measuring device, 11 ... Base, 13 ... Base part, 14 ... Light projecting part, 15 ... Light receiving part, 16 ... Parallel laser light (parallel light), 17, 18 ... Optical path bending member, 21 ... Support substrate, 22 ... Angle adjustment unit, 23 ... Axis, 25 ... Tilt mechanism unit, 26 ... Motor, 27 ... Cam, 28 ... Cam follower, 34 ... Reference position part, 35 ... Measurement control unit, 40 ... Parts mounting machine, 41 ... Parts supply device , 42 ... Lead (measurement target), 44 ... Mounting head moving device, 46 ... Mark imaging camera, 47 ... Control unit of component mounting machine

Claims (9)

In a measuring device that measures any of the thickness dimension of the measurement target, the amount of deformation in the thickness direction, and the inclination angle in the thickness direction.
A light projecting unit that irradiates the measurement target with parallel light that is wider than the thickness of the measurement target.
A light receiving unit that receives light from a portion of the parallel light emitted from the light projecting unit that is not shielded by the measurement target, and a light receiving unit.
A measurement control unit that measures the width of a portion of the parallel light that is shielded from light by the measurement target based on the light receiving state of the light receiving unit.
A base portion in which the light emitting portion and the light receiving portion are fixed in a predetermined positional relationship, and
A tilting mechanism that changes the irradiation angle of the parallel light by tilting the base, and a tilting mechanism that changes the irradiation angle of the parallel light.
A holding portion for holding the measurement target in a constant posture at a position where the thickness of the measurement target falls within the width of the parallel light is provided.
The measurement control unit tilts the base portion by the tilting mechanism unit to change the irradiation angle of the parallel light, and the measured value of the width of the portion of the parallel light shielded by the measurement target is increased or decreased. The minimum value of the measured value is obtained by observing the measurement, and the thickness dimension of the measurement target or the amount of deformation in the thickness direction is measured based on the minimum value of the measured value, or the measured value is the minimum. A measuring device that measures the tilt angle in the thickness direction of the measurement target based on the tilt angle of the base portion at the time of failure. The measuring device according to claim 1, wherein the measurement control unit tilts the base unit one reciprocatingly from the angle before tilting to return to the angle before tilting and stops when obtaining the minimum value of the measured value. The measuring device according to claim 1 or 2, further comprising an angle adjusting unit for adjusting the angle of the base portion before tilting. The base portion is supported on the base so as to be tiltable via a shaft.
The tilting mechanism portion includes a motor provided on the base, a cam rotated by the motor, and a cam follower provided on the base portion side, and the cam follower is moved to the base portion by the rotation of the cam. The measuring device according to any one of claims 1 to 3, wherein the base portion is reciprocally tilted with the axis as a fulcrum by reciprocating in the tilting direction. A component mounting machine equipped with the measuring device according to any one of claims 1 to 4.
The measuring device is mounted so that the irradiation direction of the parallel light is the horizontal direction and the width direction of the parallel light is the vertical direction before the base portion is tilted.
The holding portion is a suction nozzle or chuck attached to the mounting head.
The measurement target is a predetermined portion of the suction nozzle or an electronic component held by the chuck.
The tilting mechanism in a state where the mounting head is moved above the parallel light to accommodate a predetermined portion of the suction nozzle or an electronic component held by the chuck within the width of the parallel light and held at a constant angle. A component mounting machine that measures any of the thickness dimension of a predetermined portion of an electronic component, the amount of deformation in the thickness direction, and the tilt angle in the thickness direction by tilting the base portion by the unit. The component mounting machine according to claim 5, wherein the measurement target is a lead row of the electronic component. A mark imaging camera that captures the reference position mark on the circuit board is provided so as to move integrally with the mounting head.
The measuring device is provided with a reference position portion capable of recognizing an image from above at a portion where a constant positional relationship with the parallel light is maintained.
By imaging the reference position portion with the mark imaging camera and recognizing the image, the position of the parallel light is measured with reference to the position of the reference position portion, and the mounting head is paralleled based on the measured value. The component mounting machine according to claim 5 or 6, wherein a predetermined portion of an electronic component held by the suction nozzle or the chuck is moved upward of the light so as to be within the width of the parallel light. The component mounting machine according to claim 7, wherein the reference position portion is provided at two locations, a position on the light emitting portion side and a position on the light receiving portion side. When it is determined that the measured value of the predetermined portion of the electronic component measured by the measurement control unit is out of the permissible error range, the mounting head is moved above the predetermined disposal location to move the electronic component. The component mounting machine according to any one of claims 5 to 8, which is disposed at a predetermined disposal location.

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