JPWO2019244833A1 - Power module device - Google Patents

Abstract

Provided is a technology capable of protecting a power module even when a voltage exceeding the rated insulation withstand voltage of the power module is applied to the power module without being influenced by the insulation withstand voltage of the insulating sheet inside the power module. The purpose is. The power module device includes a power module 23, a wiring conductor 1, a heat sink 11, an insulating sheet 10 that insulates the module base plate 3 and the heat sink 11, and an capacitance connected between the wiring conductor 1 and the module base plate 3. It includes a member having a capacitance or a parasitic capacitance. The parasitic capacitance C1 of the insulating sheet 2 in the module and the capacitance or parasitic capacitance of the member having the capacitance or the parasitic capacitance are connected in parallel, and the parasitic capacitance C1 of the insulating sheet 2 in the module and the parasitic capacitance C2 of the insulating sheet 10 are in series. The capacitance or parasitic capacitance of a member that is connected and has a capacitance or parasitic capacitance and the parasitic capacitance C2 of the insulating sheet 10 are connected in series.

Description

The present invention relates to a structure for ensuring the withstand voltage of a power module.

In the power module, an insulating sheet is arranged between the power unit and the heat dissipation base plate. The withstand voltage capacity of a conventional power module is determined by the thickness of an insulating sheet arranged between the power unit and the heat dissipation base plate (see, for example, Patent Document 1).

International Publication No. 2012/086417

When a voltage exceeding the rated insulation withstand voltage of the power module is applied to the power module, dielectric breakdown of the power module occurs due to deterioration of the insulating sheet inside the power module. The insulation withstand voltage is the upper limit of the voltage that can be applied to the insulating member without causing dielectric breakdown.

Since the insulation withstand voltage required for different overhead wire voltages of railways is also different, in the insulation withstand voltage test of railway vehicles, the power module is selected according to each required insulation withstand voltage. For example, when the overhead line voltage [U] is DC 600 V or more and 1200 V or less, the insulation withstand voltage is [2 × U + 1500] = 2700 V or more and 3900 V or less according to the international standard IEC3007-1 regarding railways. Therefore, it is necessary to select a power module whose insulation withstand voltage exceeds 3900 V or more.

In power modules used in railroad vehicles, the higher the insulation withstand voltage, the higher the price. Therefore, in order to reduce the cost of the product, it is effective to use an inexpensive power module having a lower dielectric strength.

However, for example, it is assumed that an inexpensive power module having an insulation withstand voltage of 2.5 kV is used when an insulation withstand voltage test of a 4 kV railway vehicle is performed. When a voltage of 4 kV is applied to this power module, dielectric breakdown of the power module occurs.

The power module described in Patent Document 1 has a problem that the insulation withstand voltage of the power module depends on the thickness of the insulating sheet used. Specifically, in order to suppress the occurrence of dielectric breakdown, it is necessary to make the insulating sheet inside the power module thicker, but the thicker the insulating sheet, the greater the thermal resistance of the insulating sheet, and the power module. The heat dissipation of is deteriorated.

Therefore, the present invention protects the power module even when a voltage exceeding the rated insulation withstand voltage of the power module is applied to the power module without being influenced by the insulation withstand voltage of the insulating sheet inside the power module. The purpose is to provide technology that can be used.

The power module device according to the present invention includes a power module having an in-module insulating sheet, a module base plate, and a module terminal, a wiring conductor that supplies power to the module terminals, and a heat sink that dissipates heat generated by the power module. , Capacitance or parasitic capacitance arranged between the module base plate and the heat sink and connected between the wiring conductor and the module base plate with an insulating sheet that insulates the module base plate and the heat sink. Is electrically connected to the member having a capacitance or a member having a parasitic capacitance, or electrically in parallel with the insulating sheet, and is connected between the module base plate and the heat sink, and has heat. The module is provided with a resistor physically and mechanically fixed to the heat sink, and the parasitic capacitance of the insulating sheet in the module and the capacitance or parasitic capacitance of the member having the capacitance or the parasitic capacitance are connected in parallel. The parasitic capacitance of the inner insulating sheet and the parasitic capacitance of the insulating sheet are connected in series, and the capacitance or the parasitic capacitance of the member having the capacitance or the parasitic capacitance and the parasitic capacitance of the insulating sheet are connected in series, and the resistor is connected. Is connected in parallel with the parasitic capacitance of the insulating sheet in the module, or in parallel with the parasitic capacitance of the insulating sheet.

According to the present invention, since a member having a capacitance or a parasitic capacitance is connected between the wiring conductor and the module base plate, the capacitance or the parasitic capacitance of the member having the capacitance or the parasitic capacitance is used to generate power. The power module can be protected even when a voltage exceeding the rated insulation withstand voltage of the module is applied to the power module. In addition, since the insulation withstand voltage of the power module is determined by the capacitance or parasitic capacitance of the member having capacitance or parasitic capacitance and the parasitic capacitance of the insulation sheet, it depends on the insulation withstand voltage of the insulation sheet inside the module. Can be suppressed.

Objectives, features, aspects, and advantages of the present invention will become more apparent with the following detailed description and accompanying drawings.

It is sectional drawing of the power module apparatus which concerns on Embodiment 1. FIG. It is a top view of the power module apparatus which concerns on Embodiment 1. FIG. It is a perspective view of the capacitor included in the power module apparatus which concerns on Embodiment 1. FIG. It is sectional drawing which shows the position of the resistor in the power module apparatus which concerns on Embodiment 1. FIG. It is sectional drawing which shows the position of the resistor in the power module apparatus which concerns on Embodiment 1. FIG. It is a schematic diagram of the parasitic capacitance of the insulating sheet in a module and the parasitic capacitance of an insulating sheet. It is explanatory drawing for demonstrating FIG. It is a schematic diagram of the parasitic capacitance of the insulating sheet in a module, the parasitic capacitance of an insulating sheet, and the capacitance of a capacitor. It is explanatory drawing for demonstrating FIG. It is sectional drawing of the power module apparatus which concerns on Embodiment 2. FIG. It is sectional drawing of the mounting structure of the printed circuit board provided in the power module apparatus which concerns on Embodiment 2. FIG. It is a top view of the printed circuit board provided in the power module apparatus which concerns on Embodiment 2. FIG. It is a perspective view of the fixing part included in the power module apparatus which concerns on Embodiment 2. FIG. It is sectional drawing of the power module apparatus which concerns on Embodiment 3. FIG. It is sectional drawing of the power module apparatus which concerns on Embodiment 4. FIG. It is a perspective view of the 1st resistor provided in the power module apparatus which concerns on Embodiment 4. FIG. It is a perspective view of the 2nd resistor provided in the power module apparatus which concerns on Embodiment 4. FIG. It is a schematic diagram of the parasitic capacitance of the insulating sheet in a module, the parasitic capacitance of an insulating sheet, and the resistance value of the first and second resistors. It is explanatory drawing for demonstrating FIG. FIG. 5 is a plan view of a printed circuit board included in the power module device according to the fifth embodiment. It is sectional drawing of the power module apparatus which concerns on Embodiment 5. It is sectional drawing of another example of the power module apparatus which concerns on Embodiment 5. FIG.

<Embodiment 1>
Embodiment 1 of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of the power module device according to the first embodiment. FIG. 2 is a plan view of the power module device according to the first embodiment. FIG. 3 is a perspective view of a capacitor included in the power module device according to the first embodiment. FIG. 4 is a cross-sectional view showing the position of the resistor 13 in the power module device according to the first embodiment. FIG. 5 is a cross-sectional view showing the position of the resistor 13a in the power module device according to the first embodiment.

Since the power module device has the structure of the power module unit 24, the power module unit 24 will be described. As shown in FIGS. 1 and 2, the power module unit 24 includes a power module 23, a wiring conductor 1, a heat sink 11, an additional base plate 4, an insulating sheet 10, a capacitor 12, and a resistor 13.

The power module 23 includes a module terminal 22, a substrate 26, a chip 27, an in-module insulation sheet 2, and a module base plate 3. The power module 23 includes a power unit 25. Specifically, the power unit 25 includes a module terminal 22, a conductor 28, a chip 27, a substrate 26, and an in-module insulating sheet 2. The module terminal 22 and the chip 27 are electrically connected via a conductor 28. The chip 27 is mounted on the substrate 26. An in-module insulation sheet 2 that satisfies the required insulation distance is arranged between the substrate 26 and the module base plate 3.

The wiring conductor 1 is electrically connected to the module terminal 22 and supplies electric power to the chip 27 via the module terminal 22. The additional base plate 4 is electrically and thermally connected to the module base plate 3. The additional base plate 4 dissipates heat generated by the power module 23. An insulating sheet 10 is arranged between the additional base plate 4 and the heat sink 11. The insulating sheet 10 insulates the additional base plate 4 and the heat sink 11, and has an insulation withstand voltage equal to or higher than the insulation withstand voltage required for the insulation withstand voltage test. The heat sink 11 dissipates heat from the additional base plate 4 via the insulating sheet 10.

As shown in FIGS. 1 and 2, the wiring conductor 1 is fixed to the power module 23 by fastening the screw 5 passed through the screw through hole 15 formed in the wiring conductor 1 to the module terminal 22. By fastening the screw through hole 17 formed in the module base plate 3 and the screw 6 passed through the spacer 7 to the screw hole 18 formed in the additional base plate 4, the power module 23 is mechanically and electrically connected to the additional base plate 4. It is fixed.

With the insulating bush 9 inserted through the screw through hole 21 formed in the additional base plate 4, the screw through hole formed in the insulating sheet 10, and the hole 20a formed in the heat sink 11, the screw 8 is inserted into the screw in the insulating bush 9. The additional base plate 4 is fixed to the insulating sheet 10 and the heat sink 11 by passing through the through hole 19 and fastening to the screw hole 20 formed under the hole 20a in the heat sink 11. An insulating bush 9 is inserted into the screw hole 20 in order to secure a creepage distance between the additional base plate 4 and the screw 8. The points where the creepage distance is required are indicated by the arrows in FIG.

As shown in FIG. 1, the capacitor 12 is electrically connected between the wiring conductor 1 and the module base plate 3. As shown in FIG. 3, the capacitor 12 includes a main body portion 12a, one end 12b, and the other end 12c. One end 12b and the other end 12c of the capacitor 12 are bent at a right angle. The bent portion of one end 12b of the capacitor 12 is soldered to the wiring conductor 1. The bent portion of the other end 12c of the capacitor is soldered to the spacer 7. The main body 12a of the capacitor 12 is placed on the additional base plate 4, and the main body 12a of the capacitor 12 is mechanically fixed to the additional base plate 4 with a fixing agent.

Since the additional base plate 4 has no electrical connection and has a floating potential, the module base plate is electrically connected in parallel with respect to the capacitance component formed between the module base plate 3 and the heat sink 11. By adding a resistor 13 (see FIGS. 1, 4 and 7 (a)) that satisfies the insulation withstand voltage test between 3 and the heat sink 11, the end of the substrate 26 and the module base plate 3 can be obtained. The electric charge stored in the capacitive component formed between the two is discharged. Further, when a DC voltage is applied in the dielectric strength test, the power module 23 is prevented from being destroyed. Alternatively, the insulation withstand voltage test is satisfied between the wiring conductor 1 and the module base plate 3 electrically connected in parallel with respect to the capacitance component formed between the wiring conductor 1 and the module base plate 3. Resistors 13a (see FIGS. 5 and 7 (b)) may be added. Alternatively, the resistor 13 and the resistor 13a may be added.

Next, the operation and effect of the withstand voltage structure of the power module 23 according to the first embodiment will be described in comparison with the problems of the prior art. FIG. 6 is a schematic view of the parasitic capacitance C1 of the power module 23 and the parasitic capacitance C2 of the insulating sheet 10. FIG. 7 is an explanatory diagram for explaining FIG. 6. Specifically, FIG. 7A is an example when the resistor 13 is added, and FIG. 7B is an example when the resistor 13a is added. FIG. 8 is a schematic view of the parasitic capacitance C1 of the power module 23, the parasitic capacitance C2 of the insulating sheet 10, and the capacitance C3 of the capacitor 12. FIG. 9 is an explanatory diagram for explaining FIG. 8. Specifically, FIG. 9A is an example when the resistor 13 is added, and FIG. 9B is an example when the resistor 13a is added.

Parasitic capacitance is generated by connecting two conductive members via an insulating layer. When the thickness of the insulating member arranged between the two conductive members is d (mm), the area of the insulating member is S, and the dielectric constant of the insulating member is ε _s , the parasitic capacitance C is the formula. It becomes like (1). ε ₀ is the permittivity of the vacuum, which is 8.855 × 10 ^-12 .

As shown in FIG. 6, the power module unit 24 has parasitic capacitances C1 and C2. When a high insulation withstand voltage determined by the parasitic capacitance C1 of the power module 23 is required, the insulation withstand voltage of the power module 23 needs to be thickened. However, the thicker the insulating sheet 2 in the module, the greater the thermal resistance of the insulating sheet 2 in the module, and the worse the heat dissipation of the power module 23. Therefore, it is not realistic to obtain the insulation withstand voltage by thickening the insulation sheet 2 in the module.

As shown in FIGS. 6 and 7 (a) and 7 (b), the heat sink 11 is thermally connected to the module base plate 3 of the power module 23 via the insulating sheet 10 to obtain the parasitic capacitance C1 of the power module 23. It is in series with the parasitic capacitance C2 of the insulating sheet 10. When an external high voltage is applied to both ends of the power module 23 and the heat sink 11, the voltage is divided by the parasitic capacitance C1 of the insulating sheet 2 inside the module and the parasitic capacitance C2 of the insulating sheet 10.

Assuming that the applied external high voltage is U, the total charge of the external high voltage U is Q, the voltage applied to the insulating sheet 2 in the module is U1, and the voltage applied to the insulating sheet 10 is U2. Equations (2) and (3) hold.

From the equations (2) and (3), the smaller the capacitance of the parasitic capacitances (C1, C2), the higher the applied voltage (U1, U2).

Generally, the parasitic capacitance C2 of the insulating sheet 10 is much larger than the parasitic capacitance C1 of the insulating sheet 2 in the module. Therefore, when an external high voltage is applied to both ends of the power module 23 and the heat sink 11, most of the external high voltage is applied to the internal insulation sheet 2 of the module, and the power module 23 is deteriorated due to the deterioration of the internal insulation sheet 2. Will be destroyed.

Further, by increasing the thickness d of the insulating sheet 10, the parasitic capacitance C2 of the insulating sheet 10 can be reduced to the parasitic capacitance C1 or less of the insulating sheet 2 in the module. However, by increasing the thickness d of the insulating sheet 10, the thermal resistance of the insulating sheet 10 also increases, the heat dissipation of the power module 23 deteriorates, and a larger heat sink is required. Further, in recent years when miniaturization of the device is required, it is difficult to increase the thickness d of the insulating sheet 10.

On the other hand, in the first embodiment, as shown in FIG. 1, the heat sink 11 is connected to the module base plate 3 of the power module 23 via the additional base plate 4 and the insulating sheet 10, and the power module 23 is connected. By connecting the capacitor 12 between the wiring conductor 1 connected to the module terminal 22 and the module base plate 3, the power module 23 is protected from a voltage higher than the insulation withstand voltage of the power module 23.

As shown in FIGS. 8 and 9 (a) and 9 (b), assuming that the capacitance of the capacitor 12 is C3, the parasitic capacitance C1 of the insulating sheet 2 in the module and the capacitance C3 of the capacitor are connected in parallel, and the module The parasitic capacitance C1 of the inner insulating sheet 2 and the parasitic capacitance C2 of the insulating sheet 10 are connected in series, and the capacitance C3 of the capacitor 12 and the parasitic capacitance C2 of the insulating sheet 10 are connected in series.

The external high voltage applied to the power module unit 24 is U, the total charge of the external high voltage U is Q, the voltage applied to the capacitor 12 is U1, and the voltage applied to the insulating sheet 10 is U2. Then, the equation (4) and the equation (5) are established.

Further, since the power module 23 is parallel to the capacitor 12, the voltage U1 is also applied to both ends of the power module 23. From equations (4) and (5), the smaller the parasitic capacitance, the higher the applied voltage.

Since the parasitic capacitance C1 of the insulating sheet 2 in the module is much smaller than the parasitic capacitance C2 of the insulating sheet 10, when the capacitor 12 is not arranged, most of the external high voltage is applied to the power module 23 when the surge voltage is superimposed. , The power module 23 is destroyed. Therefore, the capacitance C3 of the capacitor 12 is selected as follows.

Since it is necessary to make the sum of the parasitic capacitance C1 of the insulating sheet 2 in the module and the capacitance C3 of the capacitor 12 larger than the parasitic capacitance C2 of the insulating sheet 10, it is selected so that at least C3> C2-C1 holds. By doing so, when a voltage higher than the insulation withstand voltage of the power module 23 is applied to the power module unit 24, the parasitic capacitance C1 of the insulating sheet 2 in the module, the parasitic capacitance C2 of the insulating sheet 10 and the capacitance of the capacitor 12 C3 satisfies the above equation (4), and it is possible to divide the voltage between the parasitic capacitance C1 + the capacitance C3 and the parasitic capacitance C2.

Further, a member having a capacitance is added between the module base plate 3 which is electrically parallel to the parasitic capacitance C2 of the insulating sheet 10 and which is electrically serial to the capacitor 12 and the heat sink 11. Consider the case of doing. Let C4 be the capacitance of the member having the capacitance. In this case, if C1 + C3 ≦ C2 + C4, the capacitance C4 is selected so that the withstand voltage of the capacitance C4 is higher than the voltage applied to the power module unit 24. By doing so, when a voltage higher than the insulation withstand voltage of the power module 23 is applied to the power module unit 24, the high voltage is divided between C1 + C3 and C2 + C4, and the power is supplied from a voltage higher than the insulation withstand voltage of the power module 23. The module 23 can also be protected.

Next, selection of the resistance value Rd of the resistors 13 and 13a will be described. Here, the case of the resistor 13a will be described. As shown in FIG. 9B, a resistor 13a having a resistance value Rd smaller than the insulation resistance value of a member having a capacitance or a parasitic capacitance that is electrically parallel to the resistor 13a is selected. Further, since a large voltage is applied to the resistor 13a, it is necessary to select a resistor 13a having an appropriate resistance value Rd. In the first embodiment, the resistor 13a is electrically connected in parallel with the capacitor 12 and electrically connected to the wiring conductor 1 and the module base plate 3. Further, the main body of the resistor 13a is thermally and mechanically fixed to the heat sink 11. Here, the member having a capacitance or a parasitic capacitance that is electrically parallel is the capacitor 12.

For example, when the parasitic capacitance C1 of the insulation sheet 2 in the module is set to 500 pF, the impedance of the insulation sheet 2 in the module is Rz. Rz = 1 / 2πfC, and the frequency of the dielectric strength test is assumed to be 60 Hz.

Therefore, Rz = 1 / (2π × 60Hz × 500 × 10 ^-12 F) = 5.3MΩ. Assuming that the parasitic capacitance C2 of the insulating sheet 10 is 1000 pF, the capacitance C3 of the capacitor 12 is as shown in the equation (6). Further, the resistance value Rd <5.3 MΩ of the resistor 13a.

If the external high voltage is 3900V, there is no problem if a capacitor 12 having a withstand voltage of 3900V or more is selected. That is, if the capacitance C3 of the capacitor 12 is set to 500 pF or more, the power module 23 can be protected from an external high voltage.

Further, when an external high voltage of 3900 V is applied to the power module unit 24 and the resistance value Rd of the resistor 13a is 50 kΩ, if 2000 V is applied to the resistor 13a, the power applied to the resistor 13a is applied. P = V ² / Rd = 2000 ² V / 50 kΩ = 80 W. Further, the resistor 13a generates heat because it discharges the electric charge stored in the capacitance C3 of the capacitor 12 and the parasitic capacitance C1 of the insulating sheet 2 in the module. Assuming that the capacitance of the capacitor 12 is 500 pF, the discharge time τ = RC = 50 kΩ × 1000 pF = 50 μsec.

The high voltage applied to the power module device from the outside is an extremely short time application such as a lightning surge. Further, since the insulation withstand voltage test is generally performed in 1 minute, it is sufficient that the resistor 13a can withstand an overload (overpower) for 1 minute. However, the voltage applied to the power module unit 24 in the withstand voltage test is about 10 times larger than the voltage normally applied to the power module unit 24, and the heat generation of the resistor 13a during the withstand voltage test must be taken into consideration. It doesn't become.

If a resistor with a resistance value of 50 kΩ can withstand an overload of 2000 V, it is necessary to increase the size of the resistor. As the size of the resistor increases, not only the manufacturing cost increases, but also the vibration resistance and weight become severe. However, in the first embodiment, since the heat dissipation of the resistor 13a is improved by thermally and mechanically fixing the main body of the resistor 13a to the heat sink 11, the voltage applied to the resistor 13a is extremely short. It's time. Therefore, the rated power of the resistor 13a may be designed based on the power consumption of the resistor 13a, and the resistor 13a can be miniaturized. Since the voltage applied to the resistor 13a during steady use of the power module device is sufficiently lower than that during the insulation withstand voltage test, the steady power consumption of the resistor 13a is small and there is no problem. ..

For example, the withstand voltage of the exterior of the metal clad resistor and the main body inside the metal clad resistor is 3000 V or more and 4500 V or less, and the market distribution amount is large. Therefore, the metal clad resistor can be used as the resistor 13a. An example of the exterior of the metal clad resistor is shown in FIG.

Further, by adding a resistor 13 that satisfies the insulation withstand voltage test between the module base plate 3 that is electrically connected in series with the resistor 13a and the heat sink 11, the capacitance C3 and the parasitic capacitance C1 The electric charge stored in the can be discharged. In this case, the resistance value Rd of the resistor 13 is the same as the resistance value Rd of the resistor 13a.

Further, as shown in FIG. 9A, a resistor that eliminates the resistor 13a and satisfies the insulation withstand voltage test between the module base plate 3 that is electrically parallel to the parasitic capacitance C2 and the heat sink 11. By adding 13, the electric charge stored in the capacitance C3 and the parasitic capacitance C1 can be discharged. In this case, the resistance value Rd of the resistor 13 is the same as the resistance value Rd of the resistor 13a. The main body of the resistor 13 is thermally and mechanically fixed to the heat sink 11.

Further, by increasing the capacitance C3 of the capacitor 12, the power module 23 is insulated even when the voltage applied to both ends of the power module unit 24 is twice or more than the dielectric breakdown withstand voltage of the power module 23. It becomes possible to protect from destruction.

As described above, in the power module device according to the first embodiment, since the capacitor 12 is connected between the wiring conductor 1 and the module base plate 3, the capacitance C3 of the capacitor 12 is used and the rating of the power module 23 is used. The power module 23 can be protected even when a voltage exceeding the insulation withstand voltage is applied to the power module 23.

Further, since the insulation withstand voltage of the power module 23 is determined by the capacitance C3 of the capacitor 12 and the parasitic capacitance C2 of the insulation sheet 10, it is possible to suppress the influence of the insulation withstand voltage of the insulation sheet 2 in the module.

Since the insulation withstand voltage test of a railway vehicle includes an AC voltage withstand voltage test and a DC voltage withstand voltage test, when a DC voltage is applied, the resistor cannot be arranged in the power module unit 24 and is static. If there is no discharge route for electric discharge, the power module 23 may be destroyed. In order to suppress the risk of the power module 23 being destroyed, not only the capacitor 12 but also the resistor 13a is required. Further, by eliminating the resistor 13a and adding a resistor 13 that satisfies the insulation withstand voltage test between the module base plate 3 that is electrically connected in series and the heat sink 11, the capacitance C3 and the parasitic capacitance C1 can be obtained. The stored charge can be discharged.

This makes it possible to use a cheaper power module having a lower dielectric strength than the conventional one, instead of a high withstand voltage and expensive power module for railway vehicles. Therefore, the manufacturing cost of the product can be suppressed and the size can be reduced. Further, since the area of the additional base plate 4 is larger than the area of the module base plate 3, the additional base plate 4 functions as a heat spreader. As a result, the heat dissipation of the power module 23 is improved. The same effect as described above can be obtained by stacking or combining several insulating sheets 10 and additional base plates 4.

<Embodiment 2>
Next, the power module device according to the second embodiment will be described. FIG. 10 is a cross-sectional view of the power module device according to the second embodiment. FIG. 11 is a cross-sectional view of the mounting structure of the printed circuit board 43 included in the power module device according to the second embodiment. FIG. 12 is a plan view of the printed circuit board 43 included in the power module device according to the second embodiment. FIG. 13 is a perspective view of a fixing part 52 included in the power module device according to the second embodiment. In the second embodiment, the same components as those described in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 10, in the second embodiment, the capacitor 12 is replaced with the printed circuit board 43 as compared with the first embodiment.

As shown in FIG. 11, the printed circuit board 43 includes a component surface 41 which is a front surface and a solder surface 42 which is a back surface. A copper foil pattern 48 is attached to a part of the component surface 41 of the printed circuit board 43 and etched. A copper foil pattern 49 is attached to a part of the solder surface 42 of the printed circuit board 43 and etched.

The printed circuit board 43 is fixed to the wiring conductor 1 and the module base plate 3 by using the conductive fixing parts 52 and 53. The fixing parts 52 and 53 have the same structure. As shown in FIGS. 11 to 13, a screw through hole 46 is formed at one end of the copper foil pattern 48, and the screw 50 penetrates the screw through hole 58 and the screw through hole 46 at one end of the fixing part 52. One end of the fixing part 52 is fixed to the printed circuit board 43 by being fastened to the nut 55.

An insulation distance that satisfies the required insulation withstand voltage is secured between the head of the screw 50 and the copper foil pattern 49 attached to the solder surface 42.

As shown in FIGS. 10 to 13, a screw through hole is also formed at one end of the wiring conductor 1, and the screw 44 has a screw through hole 57 at the other end of the fixing part 52 and a screw through hole of the wiring conductor 1. The other end of the fixing part 52 is fixed to the wiring conductor 1 by penetrating and fastening to the nut 54. As a result, the printed circuit board 43 and the wiring conductor 1 are fixed via the fixing parts 52.

As shown in FIGS. 11 and 12, a screw through hole 47 is formed at one end of the copper foil pattern 49, and the screw 51 penetrates the screw through hole 57 and the screw through hole 47 at one end of the fixing part 53. One end of the fixing part 53 is fixed to the printed circuit board 43 by being fastened to the nut 56. An insulation distance that satisfies the required insulation withstand voltage is secured between the head of the screw 51 and the copper foil pattern 48 attached to the component surface 41.

As shown in FIGS. 10 and 13, the screw 5 penetrates the screw through hole 58 at the other end of the fixing part 53 and the spacer 7 and is fastened to the module base plate 3, whereby the fixing part 53 and other parts are added. The end is fixed to the module base plate 3. As a result, the printed circuit board 43 and the power module 23 are fixed via the fixing parts 53.

Next, the operation and effect of the withstand voltage structure of the power module 23 according to the second embodiment will be described with reference to FIGS. 8, 10 and 11.

As in the case of the first embodiment, as shown in FIGS. 8, 10 and 11, the additional base plate 4 and the heat sink 11 are insulated from each other via the insulating sheet 10, so that the parasitic capacitance C2 is present. There is. As shown in FIG. 11, a parasitic capacitance exists between the copper foil pattern 48 attached to the component surface 41 and the copper foil pattern 49 attached to the solder surface 42 via the insulating layer 43a of the printed circuit board 43. There is. Here, let the parasitic capacitance of the printed circuit board 43 be C3. The area of the insulating layer 43a of the printed circuit board 43 is Sp, the distance between the copper foil pattern 48 attached to the component surface 41 and the copper foil pattern 49 attached to the solder surface 42 is dp, and the insulating layer 43a is Eq. (7) holds when the permittivity of is ε _sp . ε ₀ is the permittivity of the vacuum, which is 8.855 × 10 ^-12 .

The parasitic capacitance C3 of the printed circuit board 43 is selected to be larger than the difference between the parasitic capacitance C2 of the insulating sheet 10 and the parasitic capacitance C1 of the insulating sheet 2 in the module. For example, the parasitic capacitance C1 of the power module 23 is 100 pF, the parasitic capacitance C2 of the insulating sheet 10 is 1000 pF, the relative permittivity of the printed circuit board 43 is 5, and the distance between the component surface 41 of the printed circuit board 43 and the solder surface 42 is 1 mm. In the case of, since the dielectric constant of air is 8.855 × 10 ^-12 , the parasitic capacitance C3 of the printed circuit board 43 satisfies the equations (8) and (9).

Equation (10) is established by equations (8) and (9).

If dp = 0.5 mm and sp = 100 cm- ² , the copper foil patterns 48 and 49 are 10 cm × 10 cm according to the equation (10), that is, if the area of the copper foil patterns 48 and 49 is 100 cm ² . The parasitic capacitance C3 of the printed circuit board 43 is 900 pF.

By adopting such a structure, when a high voltage is applied to both ends of the power module 23 and the heat sink 11 via the wiring conductor 1, the parasitic capacitance C3 of the printed circuit board 43 and the parasitic capacitance of the insulating sheet 2 in the module Since the voltage is divided by the combined parasitic capacitance C1 + C3 with C1 and the parasitic capacitance C2 of the insulating sheet 10, it is possible to protect the power module 23 from the insulation breakdown voltage.

Further, by increasing the parasitic capacitance C3 of the printed circuit board 43, the power module 23 is insulated even when the voltage applied to both ends of the power module unit 24 is twice or three times or more the dielectric breakdown withstand voltage of the power module 23. It becomes possible to protect from destruction.

As in the case of the first embodiment, the resistor 13 is electrically parallel to the printed circuit board 43 or electrically parallel to the insulating sheet 10 and electrically between the module base plate 3 and the heat sink 11. It is connected. The resistance value Rd of the resistor 13 is selected in the same manner as in the case of the first embodiment.

Further, the main body of the resistor 13 is thermally and mechanically fixed to the heat sink 11. By doing so, the heat dissipation of the resistor 13 is improved, so that the power rating of the resistor 13 may be designed with a short-time rating, and the resistor 13 can be miniaturized. As the resistor 13, a commercially available resistor 13 can be used. For example, the withstand voltage of the exterior of the metal clad resistor and the main body inside the metal clad resistor is 3000 V or more and 4500 V or less, and the market distribution amount is large. Therefore, the metal clad resistor can be used as the resistor 13. Here, the member having a capacitance or a parasitic capacitance that is electrically parallel is the printed circuit board 43.

As described above, in the power module device according to the second embodiment, since the printed circuit board 43 is electrically connected between the wiring conductor 1 and the module base plate 3, the parasitic capacitance C3 of the printed circuit board 43 is used for power. The power module 23 can be protected even when a voltage exceeding the rated insulation withstand voltage of the module 23 is applied to the power module 23.

Further, since the insulation withstand voltage of the power module 23 is determined by the parasitic capacitance C3 of the printed circuit board 43 and the parasitic capacitance C2 of the insulation sheet 10, it is suppressed that it is affected by the insulation withstand voltage of the insulation sheet 2 in the module of the power module 23. it can.

Since the insulation withstand voltage test of a railway vehicle includes an AC voltage withstand voltage test and a DC voltage withstand voltage test, when a DC voltage is applied, the resistor cannot be arranged in the power module unit 24 and is static. If there is no discharge route for electric discharge, the power module 23 may be destroyed. A resistor 13 is required to reduce the risk of the power module 23 being destroyed.

This makes it possible to use a cheaper power module having a lower dielectric strength than the conventional one, instead of a high withstand voltage and expensive power module for railway vehicles. Therefore, the manufacturing cost of the product can be suppressed and the size can be reduced. Further, since the area of the additional base plate 4 is larger than the area of the module base plate 3, the additional base plate 4 functions as a heat spreader. As a result, the heat dissipation of the power module 23 is improved.

<Embodiment 3>
Next, the power module device according to the third embodiment will be described. FIG. 14 is a cross-sectional view of the power module device according to the third embodiment. In the third embodiment, the same components as those described in the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 14, in the third embodiment, the capacitor 12 is replaced with the insulating material 63 as compared with the first embodiment.

Since the additional base plate 4 and the heat sink 11 are insulated via the insulating sheet 10 as in the case of the first embodiment, the parasitic capacitance C2 of the insulating sheet 10 exists. In the third embodiment, the power module unit 24 includes a wiring conductor 61 in place of the wiring conductor 1, and an additional base plate 62 in place of the additional base plate 4. The thickness of one end of the wiring conductor 61 is thick, and the thickness of one end of the additional base plate 62 is also thick. An insulating material 63 is placed between the thickened portion of the wiring conductor 61 and the thickened portion of the additional base plate 62, which are fixed with an adhesive.

As shown in FIGS. 8 and 14, there is a parasitic capacitance C3 of the insulating material 63 between the thickened portion of the wiring conductor 61 and the thickened portion of the additional base plate 62.

An insulating material 63 whose parasitic capacitance C3 of the insulating material 63 is larger than the difference between the parasitic capacitance C2 of the insulating sheet 10 and the parasitic capacitance C1 of the insulating sheet 2 in the module is selected. For example, the parasitic capacitance C1 of the insulating sheet 2 in the module is 100 pF, the parasitic capacitance C2 of the insulating sheet 10 is 1000 pF, the relative permittivity of the insulating material 63 is 5, the thickened portion of the wiring conductor 61 and the thickened base plate 62. Since the dielectric constant of air is 8.85 × 10 ^-12 when the distance from the portion is 1 mm, the parasitic capacitance C3 of the insulating material 63 satisfies the equations (8) and (9).

Equation (10) is established by equations (8) and (9).

If, in the case of ^{dp = 0.5mm, sp = 100cm -2} , the formula (10), the area of the thickened portion of the thickened portion an additional base plate 62 of the wiring conductor 61 if 100 cm ^2, the insulating material 63 The parasitic capacitance C3 is 900 pF.

By adopting such a structure, when a high voltage is applied to both ends of the power module 23 and the heat sink 11 via the wiring conductor 61, the parasitic capacitance C3 of the insulating material 63 and the parasitic capacitance of the insulating sheet 2 in the module Since the voltage is divided by the combined parasitic capacitance C1 + C3 with C1 and the parasitic capacitance C2 of the insulating sheet 10, the power module 23 can be protected from the breakdown voltage.

Further, by increasing the parasitic capacitance C3 of the insulating material 63, the power module 23 is insulated even when the voltage applied to both ends of the power module unit 24 is twice or three times or more the dielectric breakdown withstand voltage of the power module 23. It is possible to protect from destruction.

As in the case of the first embodiment, the resistor 13 is connected between the module base plate 3 and the heat sink 11 in electrical parallel with the insulating material 63 or electrically in parallel with the insulating sheet 10. There is. The resistance value Rd of the resistor 13 is selected in the same manner as in the case of the first embodiment.

Further, the main body of the resistor 13 is thermally and mechanically fixed to the heat sink 11. By doing so, the heat dissipation of the resistor 13 is improved, so that the power rating of the resistor 13 may be designed with a short-time rating, and the resistor 13 can be miniaturized. As the resistor 13, a commercially available resistor 13 can be used. For example, the withstand voltage of the exterior of the metal clad resistor and the main body inside the metal clad resistor is 3000 V or more and 4500 V or less, and the market distribution amount is large. Therefore, the metal clad resistor can be used as the resistor 13. Here, the member having a capacitance or a parasitic capacitance that is electrically parallel is the insulating material 63.

As described above, in the withstand voltage structure of the power module 23 according to the third embodiment, since the insulating material 63 is connected between the wiring conductor 1 and the module base plate 3, the parasitic capacitance C3 of the insulating material 63 is used. The power module 23 can be protected even when a voltage exceeding the rated insulation withstand voltage of the power module 23 is applied to the power module 23.

Further, since the insulating withstand voltage of the power module 23 is determined by the parasitic capacitance C3 of the insulating material 63 and the parasitic capacitance C2 of the insulating sheet 10, it is suppressed that it is affected by the insulating withstand voltage of the insulating sheet 2 in the module of the power module 23. it can.

Since the insulation withstand voltage test of a railway vehicle includes an AC voltage withstand voltage test and a DC voltage withstand voltage test, when a DC voltage is applied, the resistor cannot be arranged in the power module unit 24 and is static. If there is no discharge route for electric discharge, the power module 23 may be destroyed. A resistor 13 is required to reduce the risk of the power module 23 being destroyed.

This makes it possible to use a cheaper power module having a lower dielectric strength than the conventional one, instead of a high withstand voltage and expensive power module for railway vehicles. Therefore, the manufacturing cost of the product can be suppressed and the size can be reduced. Further, since the area of the additional base plate 4 is larger than the area of the module base plate 3, the additional base plate 4 functions as a heat spreader. As a result, the heat dissipation of the power module 23 is improved.

<Embodiment 4>
Next, the power module device according to the fourth embodiment will be described. FIG. 15 is a cross-sectional view of the power module device according to the fourth embodiment. FIG. 16 is a perspective view of a resistor 71 included in the power module device according to the fourth embodiment. FIG. 17 is a perspective view of a resistor 72 included in the power module device according to the fourth embodiment. FIG. 18 is a schematic view of the parasitic capacitance C1 of the insulating sheet 2 in the module, the parasitic capacitance C2 of the insulating sheet 10, the resistance value R71 of the resistor 71, and the resistance value R72 of the resistor 72. FIG. 19 is an explanatory diagram for explaining FIG. 18. In the fourth embodiment, the same components as those described in the first to third embodiments are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 15, in the fourth embodiment, the capacitor 12 is replaced with the resistor 71 as compared with the first embodiment. Further, a resistor 72 is added between the module base plate 3 which is electrically connected to the resistor 71 and the heat sink 11.

As shown in FIGS. 15 and 16, the resistor 71 is connected between the wiring conductor 1 and the module base plate 3. The resistor 71 includes a main body portion 73a, one end 74b, and the other end 74c. One end 74b of the resistor 71 and the wiring conductor 1 are electrically connected. The other end 74c of the resistor 71 and the module base plate 3 are electrically connected.

As shown in FIGS. 15 and 17, the resistor 72 is connected between the module base plate 3 and the heat sink 11. The resistor 72 includes a main body portion 75a, one end 76b, and the other end 76c. One end 76b of the resistor 72 and the module base plate 3 are electrically connected. The other end 76c of the resistor 72 and the heat sink 11 are electrically connected. The resistor 71 corresponds to the first resistor, and the resistor 72 corresponds to the second resistor.

In order to dissipate heat from the resistor 71 and the resistor 72, the main body 73a of the resistor 71 and the main body 75a of the resistor 72 are thermally and mechanically fixed on the heat sink 11. Further, the resistor 71, the resistor 72, and the power module 23 are placed on the heat sink 11 at a distance satisfying the required insulation distance.

As in the case of the first embodiment, as shown in FIGS. 15 to 19, the additional base plate 4 and the heat sink 11 are insulated from each other via the insulating sheet 10, so that the parasitic capacitance C2 exists. Since the conductor and the module base plate are insulated from each other via the insulating sheet in the power module, the parasitic capacitance C1 exists.

Assuming that the parasitic capacitance C1 is 500 pF and the parasitic capacitance C2 is 1000 pF, the impedance of the insulating sheet 2 in the module is Rz. Rz = 1 / 2πfC, and the frequency of the dielectric strength test is assumed to be 60 Hz.

Therefore, Rz = 1 / (2π × 60Hz × 500 × 10 ^-12 F) = 5.3MΩ. Further, a resistance value of less than 5.3 MΩ is selected as the resistance value R71 of the resistor 71 and the resistance value R72 of the resistor 72.

For example, when an external high voltage of 3900 V is applied to the power module unit 24 and the resistance value R71 of the resistor 71 and the resistance value R72 of the resistor 72 are set to 50 kΩ, it is assumed that the resistor 71 and the resistor 72 have 3900 V. Is applied, the power applied to the resistor 71 and the resistor 72 is P = V ² / (R71 + R72) = 3900 ² V / (50 kΩ + 50 kΩ) = 152 W. 76W is applied to each of the resistor 71 and the resistor 72. Since considerable heat is generated from the resistor 71 and the resistor 72 during the insulation withstand voltage test, the resistor 71 and the resistor 72 are made of metal and placed on the heat sink 11 to generate heat of the resistor 71 and the resistor 72. Can diverge.

In the above case, a resistor having an insulation withstand voltage of 76 W or more as the rated power of the resistor 71 and the resistor 72 and an insulation withstand voltage or more required for the insulation withstand voltage test is selected. Further, the rated power of the resistor 71 and the resistor 72 is determined in consideration of the heat generated by the resistor 71 and the resistor 72. The high voltage applied to the power module device from the outside is an extremely short time application such as a lightning surge. Further, since the insulation withstand voltage test is generally performed in 1 minute, it is sufficient that the resistor 71 and the resistor 72 can withstand an overload (overpower) for 1 minute. By thermally coupling the resistor to the heat sink, the heat dissipation of the resistor is improved, and since the voltage applied to the resistor is extremely short, the rated power of the resistor 13a is actually the power consumption of the resistor. The resistor can be miniaturized by designing with. Since the voltage applied to the resistor during steady use of the power module device is sufficiently lower than that during the insulation withstand voltage test, the steady power consumption of the resistor is small and there is no problem.

For example, the withstand voltage of the exterior of the metal clad resistor and the main body inside the metal clad resistor is 3000 V or more and 4500 V or less, and the market distribution amount is large. Therefore, the metal clad resistor can be used as resistors 71 and 72. An example of the exterior of the metal clad resistor is shown in FIG.

As described above, in the power module apparatus according to the fourth embodiment, the resistor 71 is connected between the wiring conductor 1 and the module base plate 3, and the resistor 72 is connected between the module base plate 3 and the heat sink 11. Therefore, the resistance voltage division of the resistor 71 and the resistor 72 can be used to protect the power module 23 even when a voltage exceeding the rated insulation withstand voltage of the power module 23 is applied to the power module 23.

Further, since the withstand voltage of the power module 23 is determined by the resistor 71 and the resistor 72, it is possible to suppress the influence of the withstand voltage of the insulation sheet 2 in the module of the power module 23. This makes it possible to use a cheaper power module having a lower dielectric strength than the conventional one, instead of a high withstand voltage and expensive power module for railway vehicles. Therefore, the manufacturing cost of the product can be suppressed and the size can be reduced. Further, since the area of the additional base plate 4 is larger than the area of the module base plate 3, the additional base plate 4 functions as a heat spreader. As a result, the heat dissipation of the power module 23 is improved. Further, since the resistance voltage divider is used, the same effect as described above can be obtained even if the dielectric strength test is changed to a DC voltage.

<Embodiment 5>
Next, the power module device according to the fifth embodiment will be described. FIG. 20 is a plan view of the printed circuit board 81 included in the power module device according to the fifth embodiment. FIG. 21 is a cross-sectional view of the power module device according to the fifth embodiment. FIG. 22 is a cross-sectional view of another example of the power module device according to the fifth embodiment. In the fifth embodiment, the same components as those described in the first to fourth embodiments are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIGS. 21 and 22, since the additional base plate 4 and the heat sink 11 are insulated via the insulating sheet 10 as in the case of the first embodiment, the parasitic capacitance C2 of the insulating sheet 10 exists. There is. In the fifth embodiment, the wiring conductor 1 is replaced with the printed circuit board 81 as compared with the first embodiment.

As shown in FIG. 20, a copper foil pattern 82a is attached and etched on one side of the component surface 82 of the printed circuit board 81. A copper foil pattern 82b is attached and etched on one side of the component surface 82 of the printed circuit board 81 and the other side separated from the component surface 82. A capacitor 84 is mounted between the copper foil pattern 82a and the copper foil pattern 82b.

The capacitor 84 includes a main body portion 84a, one end 84b and the other end 84c. One end 84b of the capacitor 84 is electrically connected to the copper foil pattern 82a. The other end 84c of the capacitor 84 is electrically connected to the copper foil pattern 82b. The copper foil pattern 82a of the printed circuit board 81 is electrically connected to the module terminal 22 and supplies electric power to the chip 27 via the module terminal 22. The copper foil pattern 82a corresponds to the first copper foil pattern, and the copper foil pattern 82b corresponds to the second copper foil pattern.

As shown in FIGS. 20 and 21, the copper foil pattern 82a of the printed circuit board 81 is a power module 23 by fastening a screw 5 passed through a screw through hole 83a formed in the copper foil pattern 82a to the module terminal 22. It is electrically and mechanically fixed to the. The copper foil pattern 82b of the printed circuit board 81 is electrically connected to the additional base plate 4 by fastening the hexagonal spacer 87 passed through the screw through hole 83b formed in the copper foil pattern 82b to the additional base plate 4 via the module base plate 3. And mechanically connected. By adopting such a structure, the vibration resistance is further enhanced.

Further, by adopting such a structure, when a high voltage is applied to both ends of the power module 23 and the heat sink 11 via the copper foil pattern 82a of the printed circuit board 81, the capacitance C3 of the capacitor 84 and the module Since the voltage is divided by the combined parasitic capacitance C1 + C3 with the parasitic capacitance C1 of the inner insulating sheet 2 and the parasitic capacitance C2 of the insulating sheet 10, the power module 23 can be protected from the breakdown voltage.

Further, by increasing the capacitance C3 of the capacitor 84, the power module 23 is insulated even when the voltage applied to both ends of the power module unit 24 is twice or more than the dielectric breakdown withstand voltage of the power module 23. It becomes possible to protect from destruction.

As in the case of the first embodiment, the resistor 13a is electrically parallel to the capacitance C3 of the capacitor 84 as shown in FIG. 21, or the resistor 13a is eliminated as shown in FIG. 22. The resistor 13 is electrically connected in parallel with the insulating sheet 10 between the module base plate 3 and the heat sink 11.

The resistance values Rd of the resistors 13a and 13 are selected in the same manner as in the first embodiment. Further, the main bodies of the resistors 13a and 13 are thermally and mechanically fixed to the heat sink 11. By doing so, the heat dissipation of the resistors 13a and 13 is improved. Therefore, the power rating of the resistors 13a and 13 may be designed with a short-time rating, and the resistors 13a and 13 can be miniaturized. Generally, commercially available resistors 13a and 13 can be used. For example, the withstand voltage of the exterior of the metal clad resistor and the main body inside the metal clad resistor is 3000 V or more and 4500 V or less, and the market distribution amount is large. Therefore, the metal clad resistor can be used as the resistors 13a and 13.

Further, the resistor 13 and the resistor 13a can be arranged, and in this case, the same effect can be obtained. Here, the member having a capacitance or a parasitic capacitance that is electrically parallel is the capacitor 84.

As described above, in the power module apparatus according to the fifth embodiment, the copper foil pattern 82a of the printed circuit board 81 is electrically and mechanically connected to the module terminal 22, and the copper foil pattern 82b of the printed circuit board 81 is the module base plate 3. Since the capacitor 84 was connected between the copper foil pattern 82a and the copper foil pattern 82b by being electrically and mechanically connected to the capacitor 84, the capacitance C3 of the capacitor 84 was used to obtain the rated insulation withstand voltage of the power module 23. The power module 23 can be protected even when an excess voltage is applied to the power module 23.

Further, since the insulation withstand voltage of the power module 23 is determined by the capacitance C3 of the capacitor 84 and the parasitic capacitance C2 of the insulation sheet 10, it is suppressed that it is affected by the insulation withstand voltage of the insulation sheet 2 in the module of the power module 23. it can.

Since the insulation withstand voltage test of a railway vehicle includes an AC voltage withstand voltage test and a DC voltage withstand voltage test, when a DC voltage is applied, the resistor cannot be arranged in the power module unit 24 and is static. If there is no discharge route for electric discharge, the power module 23 may be destroyed. In order to suppress the risk of the power module 23 being destroyed, not only the capacitor 84 but also the resistor 13 is required.

This makes it possible to use a cheaper power module having a lower dielectric strength than the conventional one, instead of a high withstand voltage and expensive power module for railway vehicles. Therefore, the manufacturing cost of the product can be suppressed and the size can be reduced. Further, since the area of the additional base plate 4 is larger than the area of the module base plate 3, the additional base plate 4 functions as a heat spreader. As a result, the heat dissipation of the power module 23 is improved.

Although the present invention has been described in detail, the above description is exemplary in all aspects and the invention is not limited thereto. It is understood that a myriad of variations not illustrated can be envisioned without departing from the scope of the invention.

In the present invention, each embodiment can be freely combined, and each embodiment can be appropriately modified or omitted within the scope of the invention.

1 Wiring conductor, 2 Insulation sheet in module, 3 Module base plate, 4 Additional base plate, 10 Insulation sheet, 11 Heat sink, 12 Capacitor, 13, 13a resistor, 22 Module terminal, 23 Power module, 43 Printed circuit board, 63 Insulation material, 71,72 resistors, 81 printed circuit boards, 82a, 82b copper foil patterns, 84 capacitors.

The power module device according to the present invention includes a power module having an insulating sheet inside the module, a module base plate, and a module terminal, a wiring conductor that supplies power to the module terminals, and a heat sink that dissipates heat generated by the power module. , Capacitance or parasitic capacitance arranged between the module base plate and the heat sink and connected between the wiring conductor and the module base plate with an insulating sheet that insulates the module base plate and the heat sink. A member having a capacitance or a resistor electrically connected in parallel with the member having a capacitance or a parasitic capacitance, or electrically connected in parallel with the insulating sheet, and the parasitic capacitance of the insulating sheet in the module. The capacitance or the parasitic capacitance of the member having the capacitance or the parasitic capacitance is connected in parallel, the parasitic capacitance of the insulating sheet in the module and the parasitic capacitance of the insulating sheet are connected in series, and the capacitance or the parasitic capacitance is connected. The capacitance or parasitic capacitance of the member to be held and the parasitic capacitance of the insulating sheet are connected in series, and the resistor is connected in parallel with the parasitic capacitance of the insulating sheet in the module or in parallel with the parasitic capacitance of the insulating sheet. It is a thing.

Claims (6)

A power module having an in-module insulation sheet, a module base plate, and module terminals,
A wiring conductor that supplies power to the module terminals,
A heat sink that dissipates heat generated by the power module,
An insulating sheet that is arranged between the module base plate and the heat sink and that insulates the module base plate and the heat sink.
A member having a capacitance or a parasitic capacitance connected between the wiring conductor and the module base plate,
Electrically parallel to the member having capacitance or parasitic capacitance, or electrically parallel to the insulating sheet, connected between the module base plate and the heat sink, and thermally and mechanically. A resistor fixed to the heat sink and
With
The parasitic capacitance of the insulating sheet in the module and the capacitance or parasitic capacitance of the member having the capacitance or the parasitic capacitance are connected in parallel, and the parasitic capacitance of the insulating sheet in the module and the parasitic capacitance of the insulating sheet are connected in series. , The capacitance or parasitic capacitance of the member having the capacitance or parasitic capacitance and the parasitic capacitance of the insulating sheet are connected in series, and the resistor is parallel to the parasitic capacitance of the insulating sheet in the module, or the insulating sheet. A power module device connected in parallel with the parasitic capacitance of. The member having the capacitance or parasitic capacitance is a capacitor.
The power module device according to claim 1, wherein the capacitor has a capacitance. The member having the capacitance or the parasitic capacitance is a printed circuit board.
The power module device according to claim 1, wherein the printed circuit board has a parasitic capacitance. The member having a capacitance or a parasitic capacitance is an insulating material.
The power module device according to claim 1, wherein the insulating material has a parasitic capacitance. A power module having an in-module insulation sheet, a module base plate, and module terminals,
A wiring conductor that supplies power to the module terminals,
A heat sink that dissipates heat generated by the power module,
An insulating sheet that is arranged between the module base plate and the heat sink and that insulates the module base plate and the heat sink.
A first resistor connected between the wiring conductor and the module base plate and thermally and mechanically fixed to the heat sink.
A second resistor connected between the module base plate and the heat sink and thermally and mechanically fixed to the heat sink.
With
The parasitic capacitance of the insulating sheet in the module and the first resistor are connected in parallel, the parasitic capacitance of the insulating sheet in the module and the parasitic capacitance of the insulating sheet are connected in series, and the parasitic capacitance of the second resistor and the insulating sheet is connected. A power module device whose capacitance is connected in parallel. A power module having an in-module insulation sheet, a module base plate, and module terminals,
A printed circuit board having a first copper foil pattern electrically and mechanically connected to the module terminals and a second copper foil pattern electrically and mechanically connected to the module base plate.
A heat sink that dissipates heat generated by the power module,
An insulating sheet that is arranged between the module base plate and the heat sink and that insulates the module base plate and the heat sink.
A capacitor connected between the first copper foil pattern and the second copper foil pattern,
A resistor connected between the module base plate and the heat sink and thermally and mechanically fixed to the heat sink, electrically in parallel with the capacitor or electrically in parallel with the insulating sheet. When,
With
The parasitic capacitance of the insulating sheet in the module and the capacitance of the capacitor are connected in parallel, the parasitic capacitance of the insulating sheet in the module and the parasitic capacitance of the insulating sheet are connected in series, and the capacitance of the capacitor and the insulating sheet are connected in series. A power module device in which the parasitic capacitances of the above are connected in series, and the resistor is connected in parallel with the parasitic capacitance of the insulating sheet in the module or in parallel with the parasitic capacitance of the insulating sheet.

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