JPWO2019188203A5 - - Google Patents

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Publication number
JPWO2019188203A5
JPWO2019188203A5 JP2020509823A JP2020509823A JPWO2019188203A5 JP WO2019188203 A5 JPWO2019188203 A5 JP WO2019188203A5 JP 2020509823 A JP2020509823 A JP 2020509823A JP 2020509823 A JP2020509823 A JP 2020509823A JP WO2019188203 A5 JPWO2019188203 A5 JP WO2019188203A5
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Japan
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layer
magnetic
protective layer
tunnel junction
hard mask
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JP2020509823A
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Japanese (ja)
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JP7173614B2 (ja
JPWO2019188203A1 (ja
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Priority claimed from PCT/JP2019/009734 external-priority patent/WO2019188203A1/ja
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JP2020509823A 2018-03-30 2019-03-11 磁気トンネル接合素子、磁気トンネル接合素子の製造方法、及び、磁気メモリ Active JP7173614B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018070254 2018-03-30
JP2018070254 2018-03-30
PCT/JP2019/009734 WO2019188203A1 (ja) 2018-03-30 2019-03-11 磁気トンネル接合素子、磁気トンネル接合素子の製造方法、及び、磁気メモリ

Publications (3)

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JPWO2019188203A1 JPWO2019188203A1 (ja) 2021-04-08
JPWO2019188203A5 true JPWO2019188203A5 (https=) 2022-03-15
JP7173614B2 JP7173614B2 (ja) 2022-11-16

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JP2020509823A Active JP7173614B2 (ja) 2018-03-30 2019-03-11 磁気トンネル接合素子、磁気トンネル接合素子の製造方法、及び、磁気メモリ

Country Status (3)

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US (1) US11963458B2 (https=)
JP (1) JP7173614B2 (https=)
WO (1) WO2019188203A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114641868B (zh) * 2019-10-31 2026-03-17 国立大学法人东北大学 隧道结层叠膜、磁存储元件和磁存储器
KR102931786B1 (ko) * 2020-07-28 2026-02-25 삼성전자주식회사 자기 메모리 소자

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010034153A (ja) 2008-07-25 2010-02-12 Toshiba Corp 磁気ランダムアクセスメモリおよびその書き込み方法
US8722543B2 (en) * 2010-07-30 2014-05-13 Headway Technologies, Inc. Composite hard mask with upper sacrificial dielectric layer for the patterning and etching of nanometer size MRAM devices
US9245608B2 (en) * 2011-09-22 2016-01-26 Qualcomm Incorporated Thermally tolerant perpendicular magnetic anisotropy coupled elements for spin-transfer torque switching device
JP2013115399A (ja) 2011-12-01 2013-06-10 Sony Corp 記憶素子、記憶装置
JP2013140891A (ja) 2012-01-05 2013-07-18 Toshiba Corp 磁気抵抗効果素子の製造方法
JP6139444B2 (ja) 2014-03-18 2017-05-31 株式会社東芝 磁気抵抗効果素子、磁気抵抗効果素子の製造方法及び磁気メモリ
US9620706B2 (en) * 2014-12-02 2017-04-11 Qualcomm Incorporated Magnetic etch stop layer for spin-transfer torque magnetoresistive random access memory magnetic tunnel junction device
US10672420B2 (en) 2015-03-05 2020-06-02 Sony Corporation Storage device, storage apparatus, magnetic head, and electronic apparatus
US9337415B1 (en) * 2015-03-20 2016-05-10 HGST Netherlands B.V. Perpendicular spin transfer torque (STT) memory cell with double MgO interface and CoFeB layer for enhancement of perpendicular magnetic anisotropy
US20160351799A1 (en) 2015-05-30 2016-12-01 Applied Materials, Inc. Hard mask for patterning magnetic tunnel junctions
US11245069B2 (en) * 2015-07-14 2022-02-08 Applied Materials, Inc. Methods for forming structures with desired crystallinity for MRAM applications
JP6806375B2 (ja) * 2015-11-18 2021-01-06 国立大学法人東北大学 磁気トンネル接合素子及び磁気メモリ
JP2017183560A (ja) 2016-03-31 2017-10-05 ソニー株式会社 メモリ素子、及びメモリ素子の製造方法
US10586579B2 (en) * 2018-03-20 2020-03-10 Regents Of The University Of Minnesota Electric field switchable magnetic devices

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