JPWO2018235734A1 - Conductive composition, conductor using the same, and laminated structure - Google Patents
Conductive composition, conductor using the same, and laminated structure Download PDFInfo
- Publication number
- JPWO2018235734A1 JPWO2018235734A1 JP2019525567A JP2019525567A JPWO2018235734A1 JP WO2018235734 A1 JPWO2018235734 A1 JP WO2018235734A1 JP 2019525567 A JP2019525567 A JP 2019525567A JP 2019525567 A JP2019525567 A JP 2019525567A JP WO2018235734 A1 JPWO2018235734 A1 JP WO2018235734A1
- Authority
- JP
- Japan
- Prior art keywords
- silver powder
- conductive composition
- conductor
- elastomer
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 110
- 239000004020 conductor Substances 0.000 title claims abstract description 68
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 124
- 229920001971 elastomer Polymers 0.000 claims abstract description 68
- 239000000806 elastomer Substances 0.000 claims abstract description 59
- 239000002245 particle Substances 0.000 claims abstract description 48
- 239000011164 primary particle Substances 0.000 claims abstract description 33
- 239000011163 secondary particle Substances 0.000 claims abstract description 22
- 238000009826 distribution Methods 0.000 claims abstract description 14
- 230000001186 cumulative effect Effects 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 15
- 239000007787 solid Substances 0.000 claims description 8
- 230000008602 contraction Effects 0.000 abstract description 15
- 239000000463 material Substances 0.000 description 31
- 238000000034 method Methods 0.000 description 19
- 229920001400 block copolymer Polymers 0.000 description 18
- 239000010410 layer Substances 0.000 description 14
- 239000000047 product Substances 0.000 description 13
- 238000003756 stirring Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- -1 glycol ethers Chemical class 0.000 description 10
- 238000004898 kneading Methods 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000005060 rubber Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 8
- 239000003921 oil Substances 0.000 description 8
- 235000019198 oils Nutrition 0.000 description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 7
- 230000002776 aggregation Effects 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 229920000728 polyester Polymers 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 238000007650 screen-printing Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000004220 aggregation Methods 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000000194 fatty acid Substances 0.000 description 6
- 229930195729 fatty acid Natural products 0.000 description 6
- 150000004665 fatty acids Chemical class 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000003208 petroleum Substances 0.000 description 5
- 239000004753 textile Substances 0.000 description 5
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 4
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229960004488 linolenic acid Drugs 0.000 description 4
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000004381 surface treatment Methods 0.000 description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 241001465754 Metazoa Species 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000002270 dispersing agent Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000010734 process oil Substances 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 241000557876 Centaurea cineraria Species 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004902 Softening Agent Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229920003244 diene elastomer Polymers 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000002480 mineral oil Substances 0.000 description 2
- 235000010446 mineral oil Nutrition 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- UOHMMEJUHBCKEE-UHFFFAOYSA-N prehnitene Chemical compound CC1=CC=C(C)C(C)=C1C UOHMMEJUHBCKEE-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 150000003839 salts Chemical group 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920000428 triblock copolymer Polymers 0.000 description 2
- 235000015112 vegetable and seed oil Nutrition 0.000 description 2
- 239000008158 vegetable oil Substances 0.000 description 2
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- LAVARTIQQDZFNT-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-yl acetate Chemical compound COCC(C)OCC(C)OC(C)=O LAVARTIQQDZFNT-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical class CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical compound C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000019482 Palm oil Nutrition 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 235000019483 Peanut oil Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 235000019484 Rapeseed oil Nutrition 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 230000036982 action potential Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000003240 coconut oil Substances 0.000 description 1
- 235000019864 coconut oil Nutrition 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000004643 cyanate ester Substances 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000000944 linseed oil Substances 0.000 description 1
- 235000021388 linseed oil Nutrition 0.000 description 1
- 238000010550 living polymerization reaction Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- CLNYHERYALISIR-UHFFFAOYSA-N nona-1,3-diene Chemical compound CCCCCC=CC=C CLNYHERYALISIR-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002540 palm oil Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000000312 peanut oil Substances 0.000 description 1
- 239000010665 pine oil Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 238000005486 sulfidation Methods 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000003784 tall oil Substances 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
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Abstract
[課題]伸縮の繰り返しや伸張を大きくした場合であっても、電気抵抗の安定性に優れた導電体を得ることができる導電性組成物を提供する。[解決手段]エラストマーと銀粉とを含む導電性組成物であって、前記銀粉が表面処理されたものであり、前記銀粉は、その平均一次粒子径が1.0μm以下で、かつみかけ空隙率が50〜95%であり、導電性組成物中において、前記銀粉の二次粒子の粒度分布における累積95%粒子径(D95粒子径)が、3.0〜25.0μmであることを特徴とする。[Problem] To provide a conductive composition capable of obtaining a conductor having excellent stability of electric resistance even when expansion and contraction are repeated or expansion is increased. [Solution] A conductive composition containing an elastomer and silver powder, wherein the silver powder is surface-treated, and the silver powder has an average primary particle diameter of 1.0 μm or less and an apparent porosity. 50 to 95%, and the cumulative 95% particle diameter (D95 particle diameter) in the particle size distribution of the secondary particles of the silver powder in the conductive composition is 3.0 to 25.0 μm. ..
Description
本発明は、導電性組成物、および導電性組成物を固化させた導電体、該導電体の層を有する積層構造体、並びに該導電体または積層構造体を備えた電子部品に関する。 The present invention relates to a conductive composition, a conductor obtained by solidifying the conductive composition, a laminated structure having a layer of the conductor, and an electronic component provided with the conductor or the laminated structure.
プリント配線板等の電極等のパターン状の導電体を形成する材料として、有機バインダーに金属粉末を混合したペースト状の導電性組成物が用いられている。従来の導電性組成物によれば、パターン状に塗布した後に固化させることにより所望の導電体を形成することができるが、得られる導電体は一般的に高い硬度を有する。そのため、フレキシブルプリント配線板においては、固化した導電体が耐屈曲性を有するような導電性組成物が求められている。 As a material for forming a patterned conductor such as an electrode of a printed wiring board or the like, a paste-like conductive composition in which a metal powder is mixed with an organic binder is used. According to the conventional conductive composition, a desired conductor can be formed by applying it in a pattern and then solidifying it, but the obtained conductor generally has high hardness. Therefore, in a flexible printed wiring board, there is a demand for a conductive composition in which a solidified conductor has bending resistance.
一方、近年のウェアラブルデバイス分野の成長に伴い、導電体に伸縮性を付与することも求められている。特に、体との密着度が高いウェアラブルデバイスほど、高度な伸縮性が要求される。 On the other hand, along with the recent growth in the field of wearable devices, it is required to impart elasticity to the conductor. In particular, a wearable device having a higher degree of close contact with the body is required to have higher elasticity.
このような要求に対して、例えば、金属粉末を含有させる有機バインダーとしてエラストマーを用い、導電体に屈曲性だけでなく伸縮性を持たせた導電性組成物が提案されている(特許文献1参照等)。 In response to such a demand, for example, a conductive composition has been proposed in which an elastomer is used as an organic binder containing a metal powder, and a conductor has stretchability as well as flexibility (see Patent Document 1). etc).
しかしながら、上記のような導電性組成物を使用した導電体であっても、伸縮を繰り返したり、導電体がある程度伸ばされると抵抗値が急激に増大したり、場合によっては断線してしまうことがあり、伸縮の繰り返しや伸ばした場合であっても、電気抵抗の安定性に優れた導電体を得ることができる導電性組成物が求められている。 However, even a conductor using the above-mentioned conductive composition may repeatedly expand and contract, or the resistance value may sharply increase when the conductor is stretched to some extent, or in some cases, the wire may be broken. Therefore, there is a demand for a conductive composition capable of obtaining a conductor having excellent stability of electric resistance even when it is repeatedly stretched and stretched.
そこで、本発明の目的は、伸縮の繰り返しや伸張を大きくした場合であっても、電気抵抗の安定性に優れた導電体を得ることができる導電性組成物を提供することである。 Therefore, an object of the present invention is to provide a conductive composition capable of obtaining a conductor excellent in stability of electric resistance even when repeated stretching and expansion are increased.
また、本発明の他の目的は、このような導電性組成物を固化させた導電体、該導電体の層を有する積層構造体、並びに該導電体または積層構造体を備えた電子部品を提供することである。 Another object of the present invention is to provide a conductor obtained by solidifying such a conductive composition, a laminated structure having a layer of the conductor, and an electronic component provided with the conductor or the laminated structure. It is to be.
本発明者らは、エラストマーに配合する導電性金属粉として、表面処理が施された特定の平均一次粒子径を有する銀粉を、組成物中で特定の凝集状態とすることにより、伸縮を繰り返した場合や、例えば400%以上に大きく伸張した場合であっても、電気抵抗の安定性に優れた導電体を得ることができる導電性組成物を実現できるとの知見を得た。本発明は係る知見に基づくものである。 The inventors repeated expansion and contraction by making a surface-treated silver powder having a specific average primary particle diameter, which is a conductive metal powder to be mixed with an elastomer, into a specific agglomerated state in the composition. It has been found that a conductive composition that can obtain a conductor having excellent stability of electric resistance can be realized even in the case where it is greatly expanded to 400% or more. The present invention is based on such findings.
すなわち、本発明の導電性組成物は、エラストマーと銀粉とを含む導電性組成物であって、
前記銀粉が表面処理されたものであり、
前記銀粉は、その平均一次粒子径が1.0μm以下で、かつみかけ空隙率が50〜95%であり、
導電性組成物中において、前記銀粉の二次粒子の粒度分布における累積95%粒子径(D95粒子径)が、3.0〜25.0μmであることを特徴とするものである。That is, the conductive composition of the present invention is a conductive composition containing an elastomer and silver powder,
The silver powder is surface-treated,
The silver powder has an average primary particle size of 1.0 μm or less and an apparent porosity of 50 to 95%,
In the conductive composition, the cumulative 95% particle size (D95 particle size) in the particle size distribution of the secondary particles of the silver powder is 3.0 to 25.0 μm.
本発明の実施態様においては、前記銀粉が、導電性組成物全体に対して固形分量で60〜95質量%含まれることが好ましい。 In the embodiment of the present invention, it is preferable that the silver powder is contained in an amount of 60 to 95 mass% in terms of solid content with respect to the entire conductive composition.
また、本発明の別の実施態様による導電体は、上記導電性組成物を固化させたものである。 Further, a conductor according to another embodiment of the present invention is obtained by solidifying the above-mentioned conductive composition.
また、本発明の別の実施態様による積層構造体は、基材上に上記導電体の層を有するものである。 A laminated structure according to another embodiment of the present invention has the above-mentioned conductor layer on a base material.
また、本発明の別の実施態様による電子部品は、上記導電体の層または上記積層構造体を備えたものである。 An electronic component according to another embodiment of the present invention includes the conductor layer or the laminated structure.
本発明の導電性組成物によれば、エラストマーに配合する導電性金属粉として、表面処理が施された特定の平均一次粒子径を有する銀粉を、組成物中で特定の凝集状態とすることにより、伸縮の繰り返しや伸張を大きくした場合であっても、電気抵抗の安定性に優れた導電体を得ることができる。 According to the conductive composition of the present invention, as the conductive metal powder to be blended with the elastomer, the surface-treated silver powder having a specific average primary particle diameter is brought into a specific agglomerated state in the composition. Even when the expansion and contraction are repeated or the expansion is increased, a conductor having excellent stability of electric resistance can be obtained.
本発明の導電性組成物は、エラストマーと銀粉とを含むものであり、エラストマーに特定の銀粉を配合することにより、屈曲した場合に限らず伸縮した場合や大きく伸張した場合であっても電気抵抗の安定性に優れる導電体等を得ることができる。その結果、本発明の導電性組成物は、このような特性を利用して、体外デバイス、体表デバイス、電子皮膚デバイス、体内デバイス等のウェアラブルデバイス用の導電体の形成に好適に用いることができる。以下、本発明の導電性組成物が含有する各成分について詳述する。 The conductive composition of the present invention contains an elastomer and silver powder, and by blending a specific silver powder in the elastomer, the electrical resistance is not limited to the case of bending but also the case of stretching or greatly expanding. It is possible to obtain a conductor having excellent stability. As a result, the conductive composition of the present invention can be suitably used for forming a conductor for a wearable device such as an extracorporeal device, a body surface device, an electronic skin device, and an internal device by utilizing such characteristics. it can. Hereinafter, each component contained in the conductive composition of the present invention will be described in detail.
<銀粉>
本発明の導電性組成物を構成する銀粉は、表面処理されたものであり、その平均一次粒子径が1.0μm以下、好ましくは0.1〜1.0μmであり、みかけ空隙率が50〜95%、好ましくは60〜95%のものを使用する。このような銀粉を用いて、組成物中での銀粉の二次粒子の粒度分布が後記するような範囲となるような凝集状態とすることにより、伸縮の繰り返しや伸張を大きくした場合であっても、電気抵抗の安定性を維持することができる。なお、本発明において、銀粉の平均一次粒子径とは、粉体状態にある銀粉を走査型電子顕微鏡にて10,000倍の倍率で観察し、ランダムに10個の一次粒子を抽出し、その粒子径を測定した際のそれらの粒子径の平均値を意味する。また、銀粉のみかけ空隙率は、銀粉の一次粒子が連結して適度な空隙が存在する凝集構造(二次粒子)の状態を表す指標となるものであり、以下のようにして測定することができる。
すなわち、
銀の密度をρ0(g/cm3)とし、
質量M(g)の銀粉に、1kg重の荷重をかけたときの銀粉体積をV(cm3)とした場合に、みかけ密度ρ(g/cm3)は、
ρ=M/V
と定義され、みかけ密度から、下記式によりみかけ空隙率(P)を算出することができる。
P=(1−ρ/ρ0)×100
なお、銀の密度ρ0は10.49g/cm3であり、1kg重荷重時の銀粉体積Vは、荷重を付加してから1時間経過した後の銀粉体積とする。<Silver dust>
The silver powder constituting the conductive composition of the present invention is surface-treated and has an average primary particle diameter of 1.0 μm or less, preferably 0.1 to 1.0 μm and an apparent porosity of 50 to 50 μm. 95%, preferably 60 to 95% is used. When such silver powder is used, the expansion and contraction are repeated and the expansion is increased by forming an aggregated state in which the particle size distribution of the secondary particles of the silver powder in the composition is within the range described below. Also, the stability of electric resistance can be maintained. In the present invention, the average primary particle diameter of the silver powder means that the silver powder in a powder state is observed with a scanning electron microscope at a magnification of 10,000 times, and 10 primary particles are randomly extracted. It means the average value of the particle diameters when the particle diameters are measured. Further, the apparent porosity of silver powder is an index showing the state of an agglomeration structure (secondary particles) in which primary particles of silver powder are connected to each other and have appropriate voids, and can be measured as follows. it can.
That is,
The density of silver is ρ 0 (g / cm 3 ),
When the volume of silver powder when a load of 1 kg is applied to the silver powder of mass M (g) is V (cm 3 ), the apparent density ρ (g / cm 3 ) is
ρ = M / V
The apparent porosity (P) can be calculated from the apparent density by the following formula.
P = (1-ρ / ρ 0 ) × 100
The silver density ρ 0 is 10.49 g / cm 3 , and the silver powder volume V under a heavy load of 1 kg is the silver powder volume 1 hour after the load is applied.
上記したみかけ空隙率Pは、本発明において、エラストマーと混合する前の銀粉の一次粒子どうしの凝集状態を表す指標となる。銀粉に対して一定荷重をかけると充填された銀粉の圧縮が進む。このとき、銀粉が凝集状態ではなく一次粒子どうしが分離している状態の場合は、圧縮後のみかけ空隙率は小さくなる。一方、銀粉が凝集状態を形成している場合は、凝集内部の空隙のため、みかけ空隙率は大きくなる。これにより、銀粉の一次粒子どうしの凝集状態をみかけ空隙率として評価することができる。 In the present invention, the above-mentioned apparent porosity P is an index representing the state of aggregation of the primary particles of the silver powder before mixing with the elastomer. When a constant load is applied to the silver powder, the compression of the filled silver powder proceeds. At this time, when the silver powder is not in an aggregated state but the primary particles are separated from each other, the apparent porosity after compression is small. On the other hand, when the silver powder forms an aggregated state, the apparent porosity increases due to the voids inside the aggregate. Thereby, the aggregation state of the primary particles of the silver powder can be evaluated as the apparent porosity.
また、本発明において、銀粉の一次粒子の形状は、略球状であることが好ましく、略球状の一次粒子が三次元かつランダムに連結した二次粒子の形態で導電性組成物中に存在することで、上記したように、導電性組成物の固化物が大きく伸張した際にも一次粒子どうしの接点を減少することなく銀粉が導電性組成物の固化物中のエラストマーの伸張変形に追随できる。 Further, in the present invention, the shape of the silver powder primary particles is preferably substantially spherical, and the substantially spherical primary particles are present in the conductive composition in the form of secondary particles in which they are three-dimensionally and randomly linked. Thus, as described above, the silver powder can follow the extension deformation of the elastomer in the solidified material of the conductive composition without reducing the contact points between the primary particles even when the solidified material of the conductive composition greatly expands.
なお、銀粉の一次粒子の形状は、略球状であるものに限定されるものではなく、本発明の効果を損なわない範囲で略球状以外の形状の銀粉が含まれていてもよいことは言うまでもない。 The shape of the primary particles of the silver powder is not limited to the one having a substantially spherical shape, and it goes without saying that a silver powder having a shape other than a substantially spherical shape may be included within a range not impairing the effects of the present invention. .
平均一次粒子径およびみかけ空隙率が上記範囲にあるような銀粉は、市販されているものを使用することができ、また、市販されている銀粉を、分級機等を用いて特定の平均一次粒子径およびみかけ空隙率を有する銀粉に分級することで得てもよい。 As the silver powder having an average primary particle diameter and an apparent porosity in the above range, a commercially available one can be used, and the commercially available silver powder can be a specific average primary particle using a classifier or the like. It may be obtained by classifying into a silver powder having a diameter and an apparent porosity.
本発明において使用する銀粉(すなわち、導電性組成物として調製される前の銀粉)は、その平均二次粒子径が5.0〜40.0μmであることが好ましく、より好ましくは10.0超〜40.0μmであり、さらに好ましくは15.0超〜40.0μmである。平均二次粒子径が上記範囲にあることで、銀粉を組成物中に分散させた際に、後記するような特定範囲の粒子径に調整し易くなる。なお、導電性組成物として調製される前の銀粉の平均二次粒子径とは、粉体状態にある銀粉をレーザー回折散乱式粒度分布測定法によって測定した粒子径の平均値(D50)を意味する。 The silver powder used in the present invention (that is, the silver powder before being prepared as a conductive composition) preferably has an average secondary particle diameter of 5.0 to 40.0 μm, more preferably more than 10.0. ˜40.0 μm, and more preferably more than 15.0 to 40.0 μm. When the average secondary particle diameter is within the above range, when the silver powder is dispersed in the composition, it becomes easy to adjust the particle diameter within a specific range as described later. The average secondary particle size of the silver powder before being prepared as a conductive composition means the average value (D50) of the particle sizes of the silver powder in a powder state measured by a laser diffraction scattering type particle size distribution measuring method. To do.
また、本発明において使用する銀粉(導電性組成物として調製される前の銀粉)は、JIS K 6217−4(2017)に準拠して測定されたDBP吸油量が30〜200ml/100gであることが好ましい。銀粉のDBP吸油量とは、JIS K 6217−4に準拠して、100gの銀粉に吸収されるフタル酸ジブチルの量を測定した値を意味し、本発明においては、銀粉の一次粒子の連結度合いや凝集の程度を示す指標としている。DBP吸油量が上記範囲にある銀粉を使用することで、銀粉を組成物中に分散させた際に、後記するような特定範囲の粒子径に調整し易くなる。 The silver powder (silver powder before being prepared as a conductive composition) used in the present invention has a DBP oil absorption of 30 to 200 ml / 100 g measured according to JIS K 6217-4 (2017). Is preferred. The DBP oil absorption of silver powder means a value obtained by measuring the amount of dibutyl phthalate absorbed by 100 g of silver powder in accordance with JIS K 6217-4, and in the present invention, the degree of connection of primary particles of silver powder. It is used as an index showing the degree of aggregation. By using the silver powder having the DBP oil absorption in the above range, it becomes easy to adjust the particle diameter to a specific range as described later when the silver powder is dispersed in the composition.
本発明の導電性組成物は、上記した銀粉を用いてエラストマー中に分散させたものであり、導電性組成物中において銀粉の二次粒子の粒度分布における累積95%粒子径(D95粒子径)が、3.0〜25.0μmの範囲としたものである。本発明は、後述するような表面処理された特定の平均一次粒子径を有する銀粉であって、かつ特定の凝集状態(即ち、特定のみかけ空隙率)にある、好ましくは特定のDBP吸油量を有する銀粉をエラストマーに配合して組成物とした際に、組成物中での銀粉の凝集状態を制御する(即ち、二次粒子の粒度分布における累積95%粒子径を特定の範囲とする)ことにより、導電性組成物を固化させた硬化物の導電性を改善したものであり、伸縮の繰り返しや伸張を大きくした場合であっても、電気抵抗の安定性に優れた導電体とすることができる。 The conductive composition of the present invention is obtained by dispersing the above-mentioned silver powder in an elastomer, and the cumulative 95% particle size (D95 particle size) in the particle size distribution of the secondary particles of the silver powder in the conductive composition. Is in the range of 3.0 to 25.0 μm. The present invention is a silver powder having a surface-treated specific average primary particle diameter as described later, and in a specific aggregation state (that is, specific apparent porosity), preferably a specific DBP oil absorption amount. Controlling the aggregation state of the silver powder in the composition when the silver powder is mixed with the elastomer to form a composition (that is, the cumulative 95% particle size in the particle size distribution of the secondary particles is within a specific range). According to the present invention, the conductivity of the cured product obtained by solidifying the conductive composition is improved, and even when the expansion and contraction are repeated or the expansion is made large, it is possible to obtain a conductor having excellent stability of electric resistance. it can.
本発明の導電性組成物を構成する銀粉は、エラストマーと混合ないし混練した際にも、複数の一次粒子が三次元かつランダムに連結した一定の凝集状態を維持しながら、導電性組成物中に分散すると考えられる。即ち、特定のみかけ空隙率を有する銀粉をエラストマーに混合ないし混練すると、銀粉の一次粒子の凝集した二次粒子のうち、粒子径の大きい二次粒子は崩壊してある程度小さくなる。その際の二次粒子の粒度分布における累積95%粒子径が3.0〜25.0μmとなるように調整することにより、銀粉の二次粒子にみかけ上の空隙が適度に残存し、その空隙にエラストマーが入り込むため、本発明特有の効果を発揮し得るものと考えられる。 The silver powder constituting the conductive composition of the present invention, even when mixed or kneaded with an elastomer, while maintaining a constant agglomerated state in which a plurality of primary particles are three-dimensionally and randomly linked, in the conductive composition It is thought to be dispersed. That is, when silver powder having a specific apparent porosity is mixed or kneaded with the elastomer, among the secondary particles obtained by aggregating the primary particles of the silver powder, the secondary particles having a large particle size collapse and become small to some extent. By adjusting so that the cumulative 95% particle size in the particle size distribution of the secondary particles at that time is 3.0 to 25.0 μm, apparent voids appropriately remain in the secondary particles of the silver powder. It is considered that since the elastomer enters the above, the effect peculiar to the present invention can be exhibited.
この本発明特有の効果が奏される詳細なメカニズムは明らかではないが、以下のように考えられる。即ち、後述するような表面処理された平均一次粒子径が1.0μm以下である銀粉であって、かつみかけ空隙率が50〜95%であり、好ましくはDBP吸油量が上記した範囲にある銀粉をエラストマーに配合し分散させて組成物を調製する際に、適度に銀粉の凝集を崩壊させて、D95粒子径が3.0〜25.0μmとなるように組成物を撹拌ないし混練することにより、銀粉の二次粒子は、みかけ上の空隙が適度に存在し、かかる空隙にエラストマーが十分に入り込むことから、導電性組成物の固化物が大きく伸張した際にも一次粒子どうしの接点が減少することなく、銀粉がエラストマーの伸張変形に追随できるものと考えられる。 Although the detailed mechanism by which the effect peculiar to the present invention is exhibited is not clear, it is considered as follows. That is, a silver powder having a surface-treated average primary particle diameter of 1.0 μm or less as described below, and an apparent porosity of 50 to 95%, preferably a DBP oil absorption amount in the above range. When the composition is prepared by blending and dispersing in an elastomer, by appropriately disintegrating the aggregation of the silver powder and stirring or kneading the composition so that the D95 particle diameter becomes 3.0 to 25.0 μm. In the secondary particles of silver powder, apparent voids are appropriately present, and the elastomer sufficiently enters the voids, so that the contact points between the primary particles are reduced even when the solidified material of the conductive composition is greatly expanded. It is considered that the silver powder can follow the elongation deformation of the elastomer without doing so.
導電性組成物中における銀粉の二次粒子の粒度分布における累積95%粒子径(D95粒子径)は、銀粉とエラストマーとを混合ないし混練して得られた導電性組成物をレーザー回折散乱式粒度分布測定法により測定することができる。具体的には、測定溶媒としてプロピレングリコールモノメチルエーテルアセテートを用い、導電性組成物を3000質量%となるように測定溶媒(プロピレングリコールモノメチルエーテルアセテート)で希釈し、スパチュラなどで銀粉の二次粒子が崩壊しないよう適度に撹拌した後速やかに、測定範囲0.020μm〜1000.00μmで、粒子の屈折率を1.33、溶媒の屈折率を1.40として、粒度分布を測定し、当該粒度分布の累積95%の粒子径として算出された値をD95粒子径として定義する。 The cumulative 95% particle size (D95 particle size) in the particle size distribution of the secondary particles of the silver powder in the conductive composition is the laser diffraction scattering particle size of the conductive composition obtained by mixing or kneading the silver powder and the elastomer. It can be measured by a distribution measuring method. Specifically, propylene glycol monomethyl ether acetate is used as the measurement solvent, the conductive composition is diluted with the measurement solvent (propylene glycol monomethyl ether acetate) to 3000% by mass, and the secondary particles of silver powder are separated with a spatula or the like. Immediately after stirring appropriately so as not to disintegrate, the particle size distribution was measured immediately with a measurement range of 0.020 μm to 1000.00 μm, a particle refractive index of 1.33, and a solvent refractive index of 1.40. The value calculated as the cumulative 95% particle diameter of is defined as the D95 particle diameter.
このように、本発明の導電性組成物によれば、D95粒子径が上記範囲になるように表面処理された銀粉が導電性組成物中に分散されているので、かかる導電性組成物からなる固化物が伸縮の繰り返しや大きく伸張した場合であっても、電気抵抗の安定性に優れた導電体を得ることができるものと考えられる。 As described above, according to the conductive composition of the present invention, the silver powder surface-treated so that the D95 particle diameter is within the above range is dispersed in the conductive composition, and thus the conductive composition is formed. It is considered that even when the solidified product repeats expansion and contraction or greatly expands, it is possible to obtain a conductor having excellent stability of electric resistance.
通常の銀粉ではエラストマー中に分散させると、導電性組成物中の銀粉の凝集状態が崩壊しすぎるので、かかる導電性組成物の固化物が大きく伸張した際には、この伸張変形によって銀粉の一次粒子どうしの接点は減少してしまう。この点、上述したような本発明の特徴的構成によれば、導電性組成物中の銀粉の二次粒子には、みかけ上の空隙が適度に存在し、かかる空隙にエラストマーが十分に入り込むので、このような導電性組成物からなる固化物が大きく伸張した際にも一次粒子どうしの接点を減少することなく銀粉がエラストマーの伸張変形に追随できるものと考えられる。 When ordinary silver powder is dispersed in an elastomer, the aggregated state of the silver powder in the conductive composition collapses too much, so when the solidified material of the conductive composition is greatly expanded, the primary deformation of the silver powder is caused by this expansion deformation. The points of contact between particles are reduced. In this respect, according to the characteristic configuration of the present invention as described above, apparent voids are appropriately present in the secondary particles of the silver powder in the conductive composition, and the elastomer sufficiently enters the voids. It is considered that the silver powder can follow the elongation deformation of the elastomer without reducing the contact points between the primary particles even when the solidified product of such a conductive composition is greatly expanded.
本発明の導電性組成物中において、銀粉が上記のような形態で存在するためには、銀粉が表面処理によってエラストマーと親和性が高く、かつ銀粉の一次粒子が互いに連結し空隙が適度に存在する凝集構造(二次粒子)を有している必要がある。 In the conductive composition of the present invention, in order for the silver powder to be present in the form as described above, the silver powder has a high affinity with the elastomer by the surface treatment, and the primary particles of the silver powder are connected to each other and the voids are appropriately present. Must have an aggregate structure (secondary particles) to
そのため、本発明においては、上述したDBP吸油量および銀粉とエラストマーとの親和性を調整するため、表面処理された銀粉を使用する。この銀粉の表面処理としては、分散液を含む溶液中に銀粉を投入して撹拌する湿式法や、銀粉を撹拌しながら分散液を含む溶液噴霧する乾式法などの方法が挙げられる。さらに、界面活性剤を併用して表面処理をしてもよい。 Therefore, in the present invention, the surface-treated silver powder is used in order to adjust the DBP oil absorption and the affinity between the silver powder and the elastomer described above. Examples of the surface treatment of the silver powder include a wet method in which the silver powder is put into a solution containing the dispersion liquid and stirred, and a dry method in which the solution containing the dispersion liquid is sprayed while stirring the silver powder. Further, the surface treatment may be carried out by using a surfactant together.
このような表面処理に使用する分散剤としては、例えば、脂肪酸、有機金属、ゼラチン等の保護コロイドを用いることができるが、不純物混入のおそれや疎水基との吸着性の向上を考慮すると、脂肪酸またはその塩であることが好ましい。また、この分散剤としては、脂肪酸またはその塩を界面活性剤でエマルション化したものを用いてもよい。好ましい分散剤としては、炭素原子数6〜24の脂肪酸であり、ステアリン酸、オレイン酸、ミリスチン酸、パルミチン酸、リノール酸、ラウリン酸、リノレン酸等をより好ましく使用することができる。これらの脂肪酸は、導電性組成物を用いた配線層や電極への悪影響が少ないと考えられる。上記した脂肪酸は、単独で使用してもよくまた複数を組み合わせて使用してもよい。 As the dispersant used for such a surface treatment, for example, a protective colloid such as a fatty acid, an organic metal, or gelatin can be used. However, considering the possibility of contamination of impurities and the improvement of the adsorption property with a hydrophobic group, the fatty acid is Alternatively, it is preferably a salt thereof. As the dispersant, a fatty acid or salt thereof emulsified with a surfactant may be used. Preferred dispersants are fatty acids having 6 to 24 carbon atoms, and stearic acid, oleic acid, myristic acid, palmitic acid, linoleic acid, lauric acid, linolenic acid and the like can be more preferably used. It is considered that these fatty acids have little adverse effect on the wiring layer and the electrode using the conductive composition. The above fatty acids may be used alone or in combination of two or more.
以上説明したような銀粉は後記するエラストマーおよび必要に応じて溶剤を配合、撹拌ないし混練することにより、銀粉の二次粒子のD95粒子径が3.0〜25.0μmの範囲になるように調整する。例えば、ディゾルバーやバタフライミキサー等の撹拌機やロールミルやビーズミル等の混練機を用いて撹拌ないし混練を行うことができるが、その際の撹拌機および/または混練機の回転速度、撹拌羽や混練装置の形状、撹拌ないし混練時間、撹拌ないし混練時の温度、ビーズ充填率やロール間隔など、種々の条件により調整することができる。 The silver powder as described above is adjusted so that the D95 particle diameter of the secondary particles of the silver powder is in the range of 3.0 to 25.0 μm by mixing the elastomer described below and a solvent as necessary and stirring or kneading. To do. For example, stirring or kneading can be performed using a stirrer such as a dissolver or a butterfly mixer, or a kneader such as a roll mill or a bead mill. At that time, the stirring speed of the stirrer and / or the kneader, stirring blades, or a kneading device The shape, the stirring or kneading time, the temperature during stirring or kneading, the bead filling rate, the roll interval, and the like can be adjusted according to various conditions.
この導電性組成物中における銀粉の配合量は、導電性組成物に含まれる全固形分量を基準として、60〜95質量%であることが好ましい。60質量%以上であると、低い抵抗値の導電体を容易に得ることができる。95質量%以下であると、伸縮時に断線がより生じにくくなる。
なお、本発明の導電性組成物は、本発明の効果を損なわない範囲で、銀粉以外のカーボン等の他の導電粉を併用してもよい。The content of silver powder in the conductive composition is preferably 60 to 95 mass% based on the total solid content of the conductive composition. When it is 60% by mass or more, a conductor having a low resistance value can be easily obtained. When the content is 95% by mass or less, disconnection is less likely to occur during expansion and contraction.
The conductive composition of the present invention may be used in combination with other conductive powder such as carbon other than silver powder as long as the effect of the present invention is not impaired.
<エラストマー>
本発明による導電性組成物に含まれるエラストマーは、室温においてゴム弾性を有する材料であれば特に制限なく使用することができ、例えばゴム、熱可塑性エラストマー、官能基含有エラストマー、ブロック共重合体等を好適に使用することができる。<Elastomer>
The elastomer contained in the conductive composition according to the present invention can be used without particular limitation as long as it is a material having rubber elasticity at room temperature, and examples thereof include rubber, thermoplastic elastomers, functional group-containing elastomers and block copolymers. It can be used preferably.
ゴムとしては、ジエン系ゴム、非ジエン系ゴムの何れでもよく、公知慣用のものを単独または二種以上を混合して用いることができる。 As the rubber, any of diene rubber and non-diene rubber may be used, and known and commonly used rubber may be used alone or in combination of two or more kinds.
また、熱可塑性エラストマーとしては、スチレン系エラストマー、オレフィン系エラストマー、ウレタン系エラストマー、ポリエステル系エラストマー、ポリアミド系エラストマー、アクリル系エラストマー、シリコーン系エラストマーなどが挙げられ、単独または二種以上を混合して用いることができる。 Examples of the thermoplastic elastomer include styrene-based elastomers, olefin-based elastomers, urethane-based elastomers, polyester-based elastomers, polyamide-based elastomers, acrylic-based elastomers, silicone-based elastomers, etc., which may be used alone or in combination of two or more. be able to.
官能基含有エラストマーとしては、伸縮性の観点から、ウレタン系、オレフィン系が好ましく、耐溶剤性の観点から、(メタ)アクリロイル基や酸無水物基、カルボキシル基、エポキシ基などの官能基を有するものが好ましい。 As the functional group-containing elastomer, urethane type and olefin type are preferable from the viewpoint of elasticity, and (meth) acryloyl group, acid anhydride group, carboxyl group, epoxy group and other functional groups are preferable from the viewpoint of solvent resistance. Those are preferable.
ブロック共重合体としては、ハードセグメントとソフトセグメントとのブロック共重合体であれば用いることができ、単独または二種以上を混合して用いることができる。 As the block copolymer, any block copolymer of a hard segment and a soft segment can be used, and they can be used alone or in combination of two or more kinds.
上述したエラストマーのなかでも、ブロック共重合体は、結晶性が低く分子間力が弱いため、他のゴムと比較してガラス転移点(以下、Tgと略す。)が低く、銀粉と混合した場合には柔軟で伸びがよく、好ましい。そのため、ブロック共重合体はウェアラブルデバイス用の導電体の形成に好適である。特に、Tgが150℃未満のハードセグメントと、Tgが0℃未満のソフトセグメントとのブロック共重合体がより好適である。なお、ガラス転移点Tgは示差走査熱量測定(DSC)により測定される。 Among the above-mentioned elastomers, the block copolymer has low crystallinity and weak intermolecular force, and therefore has a low glass transition point (hereinafter abbreviated as Tg) as compared with other rubbers, and when mixed with silver powder. Is preferable because it is flexible and has good elongation. Therefore, the block copolymer is suitable for forming a conductor for wearable devices. In particular, a block copolymer of a hard segment having a Tg of less than 150 ° C. and a soft segment having a Tg of less than 0 ° C. is more preferable. The glass transition point Tg is measured by differential scanning calorimetry (DSC).
このようなブロック共重合体におけるハードセグメントとソフトセグメントとの比率は20:80〜50:50の範囲であることが好ましい。この範囲内にあれば、導電性組成物を固化した導電体の伸長時に断線が生じにくくなるため好ましい。より好ましくは、25:75〜40:60である。 The ratio of hard segment to soft segment in such a block copolymer is preferably in the range of 20:80 to 50:50. Within this range, wire breakage is less likely to occur during the expansion of the conductor obtained by solidifying the conductive composition, which is preferable. More preferably, it is 25:75 to 40:60.
ここで、ブロック共重合体におけるハードセグメントとしては、メチル(メタ)アクリレート単位やスチレン単位などが挙げられる。また、ソフトセグメント単位としては、n−ブチルアクリレートやブタジエン単位などが挙げられる。ブロック共重合体は、ポリメチル(メタ)アクリレート/ポリn−ブチル(メタ)アクリレート/ポリメチル(メタ)アクリレートのトリブロック共重合体であることが好ましい。ブロック共重合体は1種を単独で用いてもよく、2種以上を組み合わせて用いてもよい。なお、本願明細書において(メタ)アクリレートとは、アクリレートおよびメタクリレートを総称する用語であり、他の類似の表現についても同様である。 Here, examples of the hard segment in the block copolymer include a methyl (meth) acrylate unit and a styrene unit. Examples of soft segment units include n-butyl acrylate and butadiene units. The block copolymer is preferably a triblock copolymer of polymethyl (meth) acrylate / polyn-butyl (meth) acrylate / polymethyl (meth) acrylate. The block copolymers may be used alone or in combination of two or more. In addition, in this specification, (meth) acrylate is a general term for acrylate and methacrylate, and the same applies to other similar expressions.
ブロック共重合体は、市販品であってよい。市販品の例は、アルケマ社製のリビング重合を用いて製造されるアクリル系トリブロックコポリマーである。具体的には、ポリスチレン−ポリブタジエン−ポリメチルメタアクリレートに代表されるSBMタイプ、ポリメチルメタアクリレート−ポリブチルアクリレート−ポリメチルメタアクリレートに代表されるMAMタイプ、およびカルボン酸変性処理または親水基変性処理されたMAM NタイプまたはMAM Aタイプを使用することができる。SBMタイプの例は、E41、E40、E21およびE20である。MAMタイプの例は、M51、M52、M53およびM22である。MAM Nタイプの例は、52Nおよび22Nである。MAM Aタイプの例は、SM4032XM10である。市販品の別の例は、クラレ社製のクラリティである。このクラリティは、メタクリル酸メチルおよびアクリル酸ブチルから誘導されるブロック共重合体である。 The block copolymer may be a commercially available product. An example of a commercially available product is an acrylic triblock copolymer manufactured using living polymerization manufactured by Arkema. Specifically, SBM type represented by polystyrene-polybutadiene-polymethylmethacrylate, MAM type represented by polymethylmethacrylate-polybutylacrylate-polymethylmethacrylate, and carboxylic acid modification treatment or hydrophilic group modification treatment. MAM N type or MAM A type can be used. Examples of SBM types are E41, E40, E21 and E20. Examples of MAM types are M51, M52, M53 and M22. Examples of MAM N types are 52N and 22N. An example of a MAM A type is SM4032XM10. Another example of a commercial product is Clarity manufactured by Kuraray. This clarity is a block copolymer derived from methyl methacrylate and butyl acrylate.
上記のような(メタ)アクリレートポリマーブロックを含むブロック共重合体は、例えば、特表2007−516326号公報または特表2005−515281号公報に記載される方法により得ることができる。 The block copolymer containing the (meth) acrylate polymer block as described above can be obtained, for example, by the method described in JP 2007-516326 A or JP 2005-515281 A.
ブロック共重合体の重量平均分子量は、好ましくは20,000〜400,000であり、より好ましくは50,000〜300,000である。重量平均分子量が20,000以上であることで、目的とする強靭性および柔軟性の効果が得られ、導電性組成物をフィルム状に成形乾燥したときや基板に塗布して乾燥したときに優れたタック性が得られる。また、重量平均分子量が400,000以下であることで、導電性組成物が良好な粘度を有し、より高い印刷性および加工性を達成できる。また、重量平均分子量が50,000以上である場合には、外部からの衝撃に対する緩和性において優れた効果が得られる。 The weight average molecular weight of the block copolymer is preferably 20,000 to 400,000, more preferably 50,000 to 300,000. When the weight average molecular weight is 20,000 or more, the desired effects of toughness and flexibility are obtained, and it is excellent when the conductive composition is formed into a film and dried, and when applied to a substrate and dried. The tackiness is obtained. Further, when the weight average molecular weight is 400,000 or less, the conductive composition has a good viscosity, and higher printability and processability can be achieved. Further, when the weight average molecular weight is 50,000 or more, an excellent effect is obtained in the relaxation property against external impact.
ブロック共重合体の、国際標準化機構の国際規格ISO 37の測定方法による引っ張り破断伸び率は、好ましくは100〜600%である。引っ張り破断伸び率が100〜600%だと、導電体の伸縮性および電気抵抗の安定性により優れる。より好ましくは300〜600%である。
引っ張り破断伸び率(%)=(破断点伸び(mm)−初期寸法mm)/(初期寸法mm)×100The tensile elongation at break of the block copolymer according to the measuring method of International Standard ISO 37 of the International Organization for Standardization is preferably 100 to 600%. When the tensile elongation at break is 100 to 600%, the stretchability of the conductor and the stability of electric resistance are excellent. More preferably, it is 300 to 600%.
Tensile elongation at break (%) = (elongation at break (mm) -initial dimension mm) / (initial dimension mm) x 100
上記したエラストマーのうちゴムや官能基含有エラストマーには、通常、硫黄系加硫剤や非硫黄系加硫剤などが用いられる。本発明のような銀粉とエラストマーを含む導電性組成物では、エラストマー中の加硫剤に含まれる硫黄により、配線中の銀粉が酸化や硫化によって腐食する恐れがあり、かかる観点からは、本発明においては硫黄系加硫剤を含まないことが好ましい。 Of the above-mentioned elastomers, a sulfur-based vulcanizing agent or a non-sulfur-based vulcanizing agent is usually used for the rubber or the functional group-containing elastomer. In the conductive composition containing the silver powder and the elastomer as in the present invention, the silver contained in the vulcanizing agent in the elastomer may corrode the silver powder in the wiring due to oxidation or sulfidation. In, it is preferable not to include a sulfur-based vulcanizing agent.
本発明の導電性組成物は、導電性に悪影響を及ぼさない範囲内で(本発明特有の効果を損なわない範囲内で)若干量の硫黄化合物を配合してもよい。 The conductive composition of the present invention may contain a slight amount of a sulfur compound within a range that does not adversely affect the conductivity (a range that does not impair the effects specific to the present invention).
また、エラストマーには、軟化剤、可塑剤等の公知の添加剤が含まれていてもよい。軟化剤としては、鉱物油系軟化剤と植物油系軟化剤が挙げられ、例えば、鉱物油系軟化剤として、パラフィン系プロセスオイル、ナフテン系プロセスオイル、芳香族系プロセスオイルなどの各種オイルである。植物油系軟化剤としては、ひまし油、錦実油、あまに油、なたね油、大豆油、パーム油、やし油、落花生油、パイン油、トール油等が挙げられ、これら軟化剤はは、単独あるいは二種以上を併用してもよい。軟化剤の添加量により、所望のゴム弾性や伸張性を調整することができる。 Further, the elastomer may contain known additives such as a softening agent and a plasticizer. Examples of the softener include mineral oil-based softeners and vegetable oil-based softeners. Examples of the mineral oil-based softeners include various oils such as paraffin-based process oil, naphthene-based process oil, and aromatic-based process oil. Examples of vegetable oil-based softeners include castor oil, brocade oil, linseed oil, rapeseed oil, soybean oil, palm oil, coconut oil, peanut oil, pine oil, tall oil, and the like, and these softeners may be used alone or You may use 2 or more types together. Desired rubber elasticity and extensibility can be adjusted by the addition amount of the softening agent.
以上説明したようなエラストマーは、導電性組成物中に含まれる全固形分量を基準として、それぞれ5〜40質量%の割合で配合することが好ましく、14〜28質量%であることがより好ましい。特に、上記したようなブロック共重合体を含有する場合には、他のエラストマーを含めた全エラストマーに対して、これらブロック共重合体の配合量が85〜100質量%であることが好ましい。配合量が上記範囲内にあると、形成された塗膜の伸縮性がより良好となる。
なお、本発明の導電性組成物は、本発明の効果を損なわない範囲で、エラストマー以外の熱可塑性樹脂等の他の有機バインダーを併用してもよい。The elastomer as described above is preferably blended in a proportion of 5 to 40% by mass, and more preferably 14 to 28% by mass, based on the total solid content of the conductive composition. In particular, when the block copolymer as described above is contained, it is preferable that the blending amount of these block copolymers is 85 to 100 mass% with respect to the total elastomer including other elastomers. When the content is within the above range, the stretchability of the formed coating film becomes better.
The conductive composition of the present invention may be used in combination with other organic binders such as thermoplastic resins other than the elastomer, as long as the effects of the present invention are not impaired.
本発明の導電性組成物は、組成物の調整のため、または基板に塗布するための粘度調整のため、有機溶剤を使用することができる。 The conductive composition of the present invention can use an organic solvent for adjusting the composition or for adjusting the viscosity for applying to the substrate.
このような有機溶剤としては、ケトン類、芳香族炭化水素類、グリコールエーテル類、グリコールエーテルアセテート類、エステル類、アルコール類、脂肪族炭化水素、石油系溶剤などが挙げることができる。より具体的には、メチルエチルケトン、シクロヘキサノン等のケトン類;トルエン、キシレン、テトラメチルベンゼン等の芳香族炭化水素類;セロソルブ、メチルセロソルブ、ブチルセロソルブ、カルビトール、メチルカルビトール、ブチルカルビトール、プロピレングリコールモノメチルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールジエチルエーテル、トリエチレングリコールモノエチルエーテル等のグリコールエーテル類;酢酸エチル、酢酸ブチル、ジエチレングリコールモノエチルエーテルアセテート、ジプロピレングリコールメチルエーテルアセテート、プロピレングリコールメチルエーテルアセテート、プロピレングリコールエチルエーテルアセテート、プロピレングリコールブチルエーテルアセテートなどのエステル類;エタノール、プロパノール、エチレングリコール、プロピレングリコール等のアルコール類;オクタン、デカン等の脂肪族炭化水素;石油エーテル、石油ナフサ、水添石油ナフサ、ソルベントナフサ等の石油系溶剤などである。このような有機溶剤は、単独でまたは2種以上の混合物として用いられる。この中でも、塗布性の観点より、ジエチレングリコールモノエチルエーテルアセテートが好ましい。 Examples of such an organic solvent include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum-based solvents, and the like. More specifically, ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene and tetramethylbenzene; cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl. Glycol ethers such as ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, diethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate , Propylene glycol ethyl ether acetate, propylene glycol butyl ether Esters such as cetate; alcohols such as ethanol, propanol, ethylene glycol, propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, solvent naphtha, etc. is there. Such organic solvents are used alone or as a mixture of two or more kinds. Among these, diethylene glycol monoethyl ether acetate is preferable from the viewpoint of coatability.
本発明の導電性組成物は、熱硬化成分をさらに含んでよい。熱硬化成分の例は、硬化反応による分子量増加、架橋形成によりフィルム形成可能なポリエステル樹脂(ウレタン変性体、エポキシ変性体、アクリル変性体等)、エポキシ樹脂、ウレタン樹脂、フェノール樹脂、メラミン樹脂、ビニル系樹脂およびシリコーン樹脂である。 The conductive composition of the present invention may further contain a thermosetting component. Examples of the thermosetting component are polyester resin (urethane modified product, epoxy modified product, acrylic modified product, etc.), epoxy resin, urethane resin, phenol resin, melamine resin, vinyl which can increase the molecular weight by curing reaction and can form a film by cross-linking. Resins and silicone resins.
本発明の導電性組成物は、本発明の効果を損なわない範囲で、その他の成分を含んでいてもよい。例えば、カップリング剤、光重合開始剤等の添加剤を含んでいてよい。 The conductive composition of the present invention may contain other components as long as the effects of the present invention are not impaired. For example, it may contain additives such as a coupling agent and a photopolymerization initiator.
本発明の導電性組成物は、例えば、溶剤に溶解したエラストマーと上記した銀粉とを混練することで製造することができる。混練方法としては、例えばロールミルといった撹拌混合装置を使用する方法が挙げられる。具体的には、エラストマーを有機溶剤に溶解した固形分50質量%の樹脂溶液を調製し、この樹脂溶液に銀粉を配合し、攪拌機にて予備撹拌混合した後、3本ロールミルにて混練することで、導電性組成物を得ることができる。使用するエラストマーの種類や有機溶剤の配合割合によって、液状の導電性組成物としたり、ペースト状(半固形状)の導電性組成物とすることができる。 The conductive composition of the present invention can be produced, for example, by kneading an elastomer dissolved in a solvent and the above-mentioned silver powder. Examples of the kneading method include a method using a stirring and mixing device such as a roll mill. Specifically, prepare a resin solution having a solid content of 50% by mass in which an elastomer is dissolved in an organic solvent, add silver powder to the resin solution, preliminarily stir and mix with a stirrer, and then knead with a three-roll mill. Then, a conductive composition can be obtained. Depending on the type of elastomer used and the blending ratio of the organic solvent, a liquid conductive composition or a paste (semi-solid) conductive composition can be obtained.
本発明において、上述したような導電性組成物は、例えば基材上にパターン塗布し、熱処理を行うことで、導電体を形成することができる。この熱処理としては、乾燥処理や熱硬化処理などが挙げられる。 In the present invention, the conductive composition as described above can be formed into a conductor by, for example, pattern coating on a substrate and heat treatment. Examples of this heat treatment include drying treatment and thermosetting treatment.
このように、本発明の導電性組成物によれば、伸縮性および電気抵抗の安定性に優れた導電体を得ることができる。また、上記のような銀粉を用いることによって、塗布適性も向上する。 As described above, according to the conductive composition of the present invention, it is possible to obtain a conductor having excellent stretchability and stability of electric resistance. Further, the suitability for coating is also improved by using the silver powder as described above.
<導電体の層およびその用途>
上述した導電性組成物は、固化させて導電体とすることができる。例えば、導電性組成物からなる塗布膜を形成し、乾燥、固化させることにより導電体の層とすることができる。導電性組成物の固化は、導電性組成物を乾燥または熱処理することで行われる。熱処理の例は、熱風乾燥または熱硬化である。熱処理に先立ち、成形を行ってもよい。例えば、導電体の層は、基材上に上記の導電性組成物を所望の形状となるように塗布した後、固化させることにより導電体の層を得ることができる。導電体の層は、使用される用途に応じた種々の形状であってよい。例えば、導体回路および配線などに好適に適用できる。<Conductor layer and its application>
The conductive composition described above can be solidified into a conductor. For example, a conductive film can be formed by forming a coating film of a conductive composition, drying and solidifying. Solidification of the conductive composition is performed by drying or heat-treating the conductive composition. Examples of heat treatment are hot air drying or heat curing. Molding may be performed prior to the heat treatment. For example, as the conductor layer, the conductor layer can be obtained by applying the above-mentioned conductive composition on a base material so as to have a desired shape and then solidifying. The layer of conductor may be of various shapes depending on the application for which it will be used. For example, it can be suitably applied to conductor circuits and wiring.
導体回路を製造する場合、上記の導電性組成物を基材上に印刷または塗布して塗膜パターンを形成するパターン形成工程と、パターニングされた塗膜を固化させる工程とを含む。塗膜パターンの形成には、マスキング法またはレジストを用いる方法等を使用できる。 In the case of producing a conductor circuit, the method includes a pattern forming step of forming a coating film pattern by printing or applying the above conductive composition on a substrate, and a step of solidifying the patterned coating film. A masking method, a method using a resist, or the like can be used to form the coating film pattern.
パターン形成工程としては、印刷方法およびディスペンス方法が挙げられる。印刷方法としては、例えば、グラビア印刷、オフセット印刷、スクリーン印刷等が挙げられ、微細な回路を形成する場合、スクリーン印刷が好ましい。また、大面積の塗布方法としては、グラビア印刷およびオフセット印刷が適している。ディスペンス方法とは、導電性組成物の塗布量をコントロールしてニードルから押し出しパターンを形成する方法であり、アース配線等の部分的なパターン形成や凹凸のある部分へのパターン形成に適している。 The pattern forming step includes a printing method and a dispensing method. Examples of the printing method include gravure printing, offset printing, screen printing, and the like, and screen printing is preferable when forming a fine circuit. Further, gravure printing and offset printing are suitable as a large area coating method. The dispensing method is a method of forming a pattern extruded from a needle by controlling the coating amount of the conductive composition, and is suitable for partial pattern formation such as ground wiring or pattern formation on an uneven portion.
導電性組成物を塗布する基材としては、電気絶縁性のものであれば特に制限なく使用することができ、紙−フェノール樹脂、紙−エポキシ樹脂、ガラス布−エポキシ樹脂、ガラス−ポリイミド、ガラス布/不織布−エポキシ樹脂、ガラス布/紙−エポキシ樹脂、合成繊維−エポキシ樹脂、フッ素樹脂・ポリエチレン・ポリフェニレンエーテル、ポリフェニレンオキシド・シアネートエステル等の複合材を用いた全てのグレード(FR−4等)の銅張積層板、ポリエチレンテレフタレート(PET)、ポリブチレンテレフタレート、ポリエチレンナフタレートなどのポリエステル、ポリイミド、ポリフェニレンスルフィド、ポリアミドなどのプラスチックからなるシートまたはフィルム、ウレタン、シリコンゴム、アクリルゴム、ブタジエンゴムなどの架橋ゴムからなるシートまたはフィルム、ポリエステル系、ポリウレタン系、ポリオレフィン系、スチレン系ブロックコポリマー系などの熱可塑性エラストマーからなるシートまたはフィルムなどが挙げられる。これらの中でも、屈曲性がある材料だけでなく、伸縮性を有する材料(例えばゴムや熱可塑性エラストマー)を基材として用いることにより、後記するような用途に導電体を適用できるようになる。伸縮性を有する材料としては、上記したエラストマー成分と同様のものを使用することができる。 The base material to which the conductive composition is applied can be used without particular limitation as long as it is an electrically insulating material. Paper-phenol resin, paper-epoxy resin, glass cloth-epoxy resin, glass-polyimide, glass Cloth / nonwoven fabric-epoxy resin, glass cloth / paper-epoxy resin, synthetic fiber-epoxy resin, fluororesin / polyethylene / phenylene ether, polyphenylene oxide / cyanate ester, etc. Copper clad laminate, sheet or film made of polyester such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, polyimide, polyphenylene sulfide, polyamide, urethane, silicone rubber, acrylic rubber, butadiene rubber Sheet or film comprising a crosslinked rubber, such as, polyester, polyurethane, polyolefin, such as a sheet or film made of a thermoplastic elastomer such as styrene-based block copolymer systems. Among these, by using not only a material having flexibility but also a material having elasticity (for example, rubber or thermoplastic elastomer) as a base material, the conductor can be applied to the use described below. As the stretchable material, the same material as the above-mentioned elastomer component can be used.
本発明による導電体の層は、上記したように伸縮の繰り返しや伸ばした場合であっても、電気抵抗の安定性に優れているため、導体回路および配線以外にも、体外デバイス、体表デバイス、電子皮膚デバイス、体内デバイス等のウェアラブルデバイス用の導電体の形成に好適に用いることができる。また、導電体の層をフレキシブルプリント基板の電極に適用することもできる。さらに、本発明の導電性組成物は、アクチュエーター電極等の導電体の層を形成するのにも適している。また、従来は伸縮性や電気抵抗の安定性が足りずに実現が困難であったデザインの導電体の形成にも適している。例えば、以下のようなものが挙げられる。 Since the conductor layer according to the present invention is excellent in stability of electric resistance even after repeated expansion and contraction or extension as described above, in addition to a conductor circuit and wiring, an extracorporeal device and a body surface device. It can be preferably used for forming a conductor for wearable devices such as electronic skin devices and in-body devices. Further, the conductor layer can be applied to the electrodes of the flexible printed circuit board. Furthermore, the conductive composition of the present invention is also suitable for forming a layer of a conductor such as an actuator electrode. Further, it is also suitable for forming a conductor having a design which has been difficult to realize due to lack of elasticity and stability of electric resistance in the past. For example, the following may be mentioned.
<ウェアラブル生体センサー>
人間を含めた動植物から発生する活動電位/生体情報を取得/伝達する為に身に着けるウェアラブル生体センサー用配線材料として、本発明の導電体を適用することができる。センサーの装着箇所は、人間を含めた動植物の表層組織に密着ないしは近接する場所であることが必須となるが、表層組織は伸び縮みが発生する。従来の硬質基板やフレキシブル基板では、伸び縮みする装着箇所への追従性が無く、センサーの装着箇所も限定的となり、結果として得られる生体情報も限られていた。本発明の導電体によれば、人間を含めた動植物の表層組織にもセンサー用配線材料を適用できるため、伸び縮みが発生する箇所にも装着可能なウェアラブル生体センサーとすることができる。<Wearable biometric sensor>
The conductor of the present invention can be applied as a wiring material for wearable biosensors that can be worn to acquire / transmit action potential / biological information generated from animals and plants including humans. It is essential that the sensor is attached to a place close to or close to the surface tissues of animals and plants including humans, but the surface tissues expand and contract. In conventional hard substrates and flexible substrates, there is no ability to follow the expanding and contracting mounting position, the mounting position of the sensor is limited, and the biometric information obtained as a result is also limited. According to the conductor of the present invention, since the wiring material for a sensor can be applied to the surface layer tissues of animals and plants including humans, it is possible to provide a wearable biosensor that can be attached to a place where expansion and contraction occur.
ウェアラブル生体センサーに使う配線は、スクリーン印刷或いはディスペンス工法によって配線形成が可能であることから、信号配線の微細化も可能となり、センサーデバイスの小型化に寄与すると考えられる。 The wiring used for the wearable biometric sensor can be formed by screen printing or a dispensing method, so that it is possible to miniaturize the signal wiring and contribute to downsizing of the sensor device.
<スマートテキスタイル用配線材料>
近年、布帛生地をセンサーとして用いるいわゆる「スマートテキスタイル」という分野広がりを見せつつある。本発明の導電体を用いて伸縮性があり熱圧着等が可能な基材上に配線形成を行なった配線板ないしセンサーは、伸縮時での電気抵抗の安定性に優れているため、伸縮性を持つ布帛生地の表面に貼りつけることで、エレクトロニクス・デバイスの機能を持った布帛生地、すなわちスマートテキスタイルの開発が可能となる。スマートテキスタイルとしては、感圧センサーやタッチセンサー、アンテナ配線等の機能を布帛生地に付与することができる。<Wiring material for smart textiles>
In recent years, the field of so-called "smart textiles" using textile materials as sensors is expanding. A wiring board or a sensor in which wiring is formed on a base material that has elasticity and is capable of thermocompression bonding using the conductor of the present invention has excellent stability of electric resistance during expansion and contraction. By adhering to the surface of the cloth material having the above, it becomes possible to develop the cloth material having the function of the electronic device, that is, the smart textile. As a smart textile, functions such as a pressure sensor, a touch sensor, and antenna wiring can be added to the cloth material.
<3D造形成形品用配線>
従来のFIM(フィルム・インサート・モールド成型)工法による電子機器の筐体等向けのプラスチック成型品では、ポリカーボネート等のプラスチックフィルムをベース基材とし、意匠印刷の後、熱プレス加工したものが採用されている。本発明の導電体を伸縮性の基材上に設けた積層構造体からなる導体配線は伸長時の断線が無く、抵抗値変化が抑制されている特性を持つため、プラスチック成型品の意匠印刷時に導体配線を形成し、その後の熱プレス(部分的に伸びが発生)による成型加工を行なうことで3D形状の配線を内蔵したエレクトロニクス・デバイスを実現することができる。<Wiring for 3D molded products>
In the conventional FIM (Film / Insert / Mold Molding) method, plastic molded products for housings of electronic devices are made by using a plastic film such as polycarbonate as a base material, design printing, and then hot pressing. ing. Since the conductor wiring of the laminated structure in which the conductor of the present invention is provided on a stretchable base material does not have a disconnection at the time of extension and has the characteristic that the resistance value change is suppressed, it is possible to print the design of a plastic molded product. An electronic device having a 3D-shaped wiring built therein can be realized by forming a conductor wiring and then performing a molding process by hot pressing (expansion partially occurs).
また、上記したようなエラストマー等のような伸縮性の基材を用いて熱プレス加工を行なうことで、柔らかい筐体内に柔らかい配線を備えた伸縮変形可能なエレクトロニクス・デバイスを実現することができる。感圧センサーやタッチセンサー、またはアンテナ配線用等として好適に利用することができる。 Further, by performing hot pressing using a stretchable base material such as the elastomer as described above, it is possible to realize a stretchable and deformable electronic device having soft wiring inside a soft casing. It can be suitably used as a pressure sensor, a touch sensor, or for antenna wiring.
<伸縮変形可能な配線シートないし配線基板>
本発明の導電体の層を伸縮性の基材上に設けた積層構造体からなる導体配線は、伸縮変形可能な配線板シートとして利用することができる。例えば、このような導体配線を成型加工品などの立体的形状を持つ対象物の表面へ、配線の断線を発生させること無く、伸張ないし変形させながら対象物に貼りつけることが可能となる。したがって、本発明の導電体の層を伸縮性の基材上に設けた積層構造体は、感圧センサーやタッチセンサー、またはアンテナ配線用として好適に利用することができる。<Expandable and deformable wiring sheet or wiring board>
The conductor wiring formed of a laminated structure in which the conductor layer of the present invention is provided on a stretchable base material can be used as a stretchable and deformable wiring board sheet. For example, it is possible to attach such a conductor wiring to the surface of a target object having a three-dimensional shape such as a molded product while stretching or deforming it without causing wire breakage. Therefore, the laminated structure in which the conductor layer of the present invention is provided on the stretchable base material can be suitably used for a pressure-sensitive sensor, a touch sensor, or an antenna wiring.
<フレキシブル配線シートないし配線基板>
従来の導電性ペーストを使ったフレキシブル配線シートないし配線基板では、爪折りという極端な折り曲げを行なった際、配線の断線が発生するという事象が発生する。この点本発明の導電体を使用した場合、伸び特性を持たせた導電材料であることから、これまでの導電ペーストでは対応仕切れなかった領域の折り曲げ性にも対応することができ、爪折り時でも、配線の断線は発生しないフレキシブル配線シートないし配線基板を実現することができる。<Flexible wiring sheet or wiring board>
In a conventional flexible wiring sheet or wiring board using a conductive paste, when an extreme bending such as a claw folding is performed, a phenomenon occurs in which a wire breakage occurs. In this respect, when the conductor of the present invention is used, since it is a conductive material having elongation characteristics, it is possible to deal with the bendability of a region which cannot be separated by the conventional conductive paste. However, it is possible to realize a flexible wiring sheet or a wiring board in which disconnection of wiring does not occur.
次に実施例を挙げて、本発明をさらに詳細に説明するが、本発明は、これら実施例に限定されるものではない。 Next, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.
<銀粉の準備>
導電性組成物を調製するための銀粉として、以下の3種の銀粉を準備した。
銀粉A:平均一次粒子径0.3μm、みかけ空隙率が92%の銀粉であって、リノレン酸で表面処理が施されたもの。
銀粉B:平均一次粒子径0.5μm、みかけ空隙率が63%の銀粉であって、リノレン酸で表面処理が施されたもの。
銀粉C:平均一次粒子径1.3μm、みかけ空隙率が44%の銀粉であって、リノレン酸で表面処理が施されたもの。<Preparation of silver dust>
The following three types of silver powder were prepared as the silver powder for preparing the conductive composition.
Silver powder A: Silver powder having an average primary particle size of 0.3 μm and an apparent porosity of 92%, which has been surface-treated with linolenic acid.
Silver powder B: Silver powder having an average primary particle diameter of 0.5 μm and an apparent porosity of 63%, which has been surface-treated with linolenic acid.
Silver powder C: Silver powder having an average primary particle diameter of 1.3 μm and an apparent porosity of 44%, which has been surface-treated with linolenic acid.
なお、銀粉の平均一次粒子径は、走査型電子顕微鏡(日本電子株式会社製、JSM−6360L)を用いて10,000倍にて銀粉を観察し、ランダムに抽出した10個の銀粉粒子の粒子径を測定し、その平均値とした。
また、各銀粉のみかけ空隙率Pは以下のようにして算出した。すなわち、銀粉を円筒状の容器に充填し、容器を数回振動させて銀粉の上面が一定の高さになるまで銀粉を補充し、容器に充填された銀粉の量をM(g)とし、容器内径にあわせた外径を有する円柱を用いて銀粉の上面に1kg重の荷重をかけ、1時間放置した後の銀粉体積(円筒状容器の底面積と、容器底から銀粉の上面までの高さの積)をV(cm3)として、ρ=M/Vで定義されるみかけ密度ρ(g/cm3)を算出し、銀の真密度ρ0(10.49g/cm3)を用いて、下記式:
P=(1−ρ/ρ0)×100
で表される銀粉のみかけ空隙率P(%)を算出した。The average primary particle diameter of the silver powder is 10 particles of the silver powder, which are randomly extracted by observing the silver powder at 10,000 times with a scanning electron microscope (JSM-6360L manufactured by JEOL Ltd.). The diameter was measured and used as the average value.
The apparent porosity P of each silver powder was calculated as follows. That is, the silver powder is filled in a cylindrical container, the container is vibrated several times to replenish the silver powder until the upper surface of the silver powder reaches a certain height, and the amount of the silver powder filled in the container is M (g), Using a cylinder with an outer diameter that matches the inner diameter of the container, apply a load of 1 kg to the upper surface of the silver powder, and then leave for 1 hour. The volume of the silver powder (the bottom area of the cylindrical container and the height from the container bottom to the upper surface of the silver powder). (The product of the heights) is V (cm 3 ), the apparent density ρ (g / cm 3 ) defined by ρ = M / V is calculated, and the true density of silver ρ 0 (10.49 g / cm 3 ) is used. The following formula:
P = (1-ρ / ρ 0 ) × 100
The apparent porosity P (%) of silver powder represented by
<導電性組成物の調製>
導電性組成物を調製するためのエラストマーとして、以下の2種を準備した。
・エラストマーA(クラレ株式会社製、LA2330)
・エラストマーB(クラレ株式会社製、LA2250)
・ポリエステルC(東洋紡株式会社製、バイロン290)
上記したエラストマーAおよびBについては、エラストマーをジエチレングリコールモノエチルエーテルアセテートに溶解させて、固形分50質量%となるように樹脂溶液を調製した。また、ポリエステルCについては、ジエチレングリコールモノエチルエーテルアセテートに溶解させて、固形分30質量%となるように樹脂溶液を調製した。<Preparation of conductive composition>
The following two types were prepared as elastomers for preparing a conductive composition.
Elastomer A (LA2330 manufactured by Kuraray Co., Ltd.)
Elastomer B (LA2250 manufactured by Kuraray Co., Ltd.)
・ Polyester C (Byron 290, manufactured by Toyobo Co., Ltd.)
Regarding the above-mentioned elastomers A and B, the elastomer was dissolved in diethylene glycol monoethyl ether acetate to prepare a resin solution having a solid content of 50% by mass. Further, the polyester C was dissolved in diethylene glycol monoethyl ether acetate to prepare a resin solution having a solid content of 30% by mass.
上記した銀粉とエラストマーまたはポリエステルの樹脂溶液とを、下記表1に示した組成に従って配合し、攪拌機にて予備撹拌混合した後、3本ロールミル(EXAKT社製、EXAKT50)を用いて、3本ロールミルの混練回数、回転速度、ロール間隔等の条件を変えて混練することで、実施形態に係る導電性組成物を得た。なお、表1中、エラストマーまたはポリエステルと銀粉の配合量の数値は質量部を表す。 The silver powder and the resin solution of the elastomer or polyester were blended according to the composition shown in Table 1 below, and after premixing and stirring with a stirrer, a three roll mill (EXAKT50, manufactured by EXAKT) was used. The conductive composition according to the embodiment was obtained by changing the conditions such as the number of times of kneading, the rotation speed, and the roll interval. In Table 1, the numerical value of the blending amount of the elastomer or polyester and the silver powder represents parts by mass.
得られた導電性組成物中に含まれる銀粉の二次粒子D95粒子径を測定した。D95粒子径は以下のようにして行った。先ず、導電性組成物を3000質量%のプロピレングリコールモノメチルエーテルアセテートで希釈して溶液を調製した。当該溶液を、レーザー回折散乱式粒度分布測定装置(マイクロトラック・ベル社製、TM3000)を用いて、粒子の屈折率を1.33、溶媒の屈折率を1.40として、0.020μm〜1000.00μmの測定範囲で、粒度分布の測定を行い、当該粒度分布から、累積95%の粒子径を求め、D95粒子径とした。 The secondary particle D95 particle diameter of the silver powder contained in the obtained conductive composition was measured. The D95 particle size was measured as follows. First, the conductive composition was diluted with 3000% by mass of propylene glycol monomethyl ether acetate to prepare a solution. Using a laser diffraction / scattering particle size distribution analyzer (TM3000, manufactured by Microtrac Bell), the solution was set to have a particle refractive index of 1.33 and a solvent refractive index of 1.40, and the solution was 0.020 μm to 1000 μm. The particle size distribution was measured in the measurement range of 0.000 μm, and the cumulative 95% particle size was determined from the particle size distribution, and the particle size was defined as D95 particle size.
<導電性組成物の評価>
(1)比抵抗の測定
各導電性組成物を、基材にスクリーン印刷で塗布し、80℃で30分間熱処理して導電体を得た。基材としては、PETフィルムを使用した。得られた導電体の両端の抵抗値を4端子法で測定し、さらに線幅、線長および厚さを測定し、比抵抗(体積抵抗率)を求めた。結果を表1に示す。<Evaluation of conductive composition>
(1) Measurement of specific resistance Each conductive composition was applied to a substrate by screen printing and heat-treated at 80 ° C for 30 minutes to obtain a conductor. A PET film was used as the substrate. The resistance values at both ends of the obtained conductor were measured by the 4-terminal method, and the line width, line length and thickness were further measured to determine the specific resistance (volume resistivity). The results are shown in Table 1.
(2)20%伸縮試験での最大抵抗値の測定
各導電性組成物を、基材にスクリーン印刷で塗布し、80℃で30分間熱処理して、線幅1mm、厚さ20μm、長さ40mmの導電体を基材上に形成した。基材としては、ウレタンフィルム(武田産業株式会社製、TG88−I、厚さ70μm)を使用した。2.5%の伸縮状態(撓みが無い状態)から20%の伸縮を250秒かけて100往復繰り返しながら、導電体の抵抗値を測定した。その間の最大の抵抗値を表1に示す。(2) Measurement of maximum resistance value in 20% stretch test Each conductive composition was applied to a substrate by screen printing and heat-treated at 80 ° C. for 30 minutes to obtain a line width of 1 mm, a thickness of 20 μm, and a length of 40 mm. Was formed on the base material. As the base material, a urethane film (TG88-I, manufactured by Takeda Sangyo Co., Ltd., thickness 70 μm) was used. The resistance value of the conductor was measured by repeating 100% reciprocation for 250 seconds from the 2.5% expansion / contraction state (no bending) to 250% expansion / contraction. The maximum resistance value in the meantime is shown in Table 1.
(3)50%伸縮試験での断線の有無
各導電性組成物を、基材にスクリーン印刷で塗布し、80℃で30分間熱処理して、線幅1mm、厚さ20μm、長さ40mmの導電体を基材上に形成した。基材としては、ウレタンフィルム(武田産業株式会社製、TG88−I、厚さ70μm)を使用した。0%の非伸縮状態から50%の伸縮を700秒かけて100往復繰り返し、断線の有無を評価した。測定結果を表1に示す。(3) Presence or absence of disconnection in 50% expansion / contraction test Each conductive composition was applied to a substrate by screen printing and heat-treated at 80 ° C. for 30 minutes to obtain a conductive line width of 1 mm, thickness of 20 μm, and length of 40 mm. A body was formed on the substrate. As the base material, a urethane film (TG88-I, manufactured by Takeda Sangyo Co., Ltd., thickness 70 μm) was used. The presence or absence of disconnection was evaluated by repeating 100 cycles of 0% non-stretching state and 50% stretching over 700 seconds. The measurement results are shown in Table 1.
(4)400%伸張時の抵抗値
各導電性組成物を、それぞれ基材にスクリーン印刷で塗布し、80℃で30分間熱処理して、線幅1mm、厚さ20μm、長さ40mmの導電体を基材上に形成した。基材としては、ウレタンフィルム(武田産業株式会社製、TG88−I、厚さ70μm)を使用した。5mm/秒の速度で25%伸張した後、15秒保持して断線の有無を評価した。この操作を繰り返し、導電体が400%伸長するまで行った。評価結果を表1に示す。(4) Resistance value at 400% extension Each conductive composition was applied to each substrate by screen printing and heat-treated at 80 ° C. for 30 minutes to obtain a conductor having a line width of 1 mm, a thickness of 20 μm and a length of 40 mm. Was formed on the substrate. As the base material, a urethane film (TG88-I, manufactured by Takeda Sangyo Co., Ltd., thickness 70 μm) was used. After stretching 25% at a speed of 5 mm / sec, it was held for 15 seconds to evaluate the presence or absence of wire breakage. This operation was repeated until the conductor stretched 400%. The evaluation results are shown in Table 1.
表1に示す結果から明らかなように、平均一次粒径が1.0μm以下、みかけ空隙率が50〜95%である銀粉とエラストマーとを用いて、D95粒子径が3.0〜25μmとなるように撹拌ないし混練した導電性組成物(実施例1〜4)は、伸縮の繰り返しや伸ばした場合であっても、電気抵抗の安定性に優れ、断線のない導電体を得ることができることが分かる。 As is clear from the results shown in Table 1, using silver powder and elastomer having an average primary particle size of 1.0 μm or less and an apparent porosity of 50 to 95%, the D95 particle size is 3.0 to 25 μm. The electrically conductive compositions (Examples 1 to 4) stirred or kneaded as described above are excellent in stability of electric resistance even when repeated expansion and contraction or elongation, and a conductor free from disconnection can be obtained. I understand.
一方、平均一次粒径が1.0μm以下、みかけ空隙率が50〜95%である銀粉とエラストマーとを用いた場合であっても、D95粒子径が3.0〜25μmの範囲にない導電性組成物(比較例2)は、初期の導電性は良好であるものの、伸縮の繰り返しや伸ばした場合に、導電性が急激に低下してしまうことが分かる。また、平均一次粒径が1.0μm以下、みかけ空隙率が50〜95%の範囲にない銀粉を用いた場合(比較例1および比較例3)は、初期の導電性も不十分であり、伸縮の繰り返しや伸ばした場合も導電性が急激に低下してしまうことが分かる。 On the other hand, even when the silver powder and the elastomer having an average primary particle diameter of 1.0 μm or less and an apparent porosity of 50 to 95% are used, the D95 particle diameter is not in the range of 3.0 to 25 μm. It can be seen that the composition (Comparative Example 2) has good initial conductivity, but the conductivity rapidly decreases when repeated expansion and contraction or elongation. Moreover, when the average primary particle diameter is 1.0 μm or less and the silver powder having an apparent porosity not in the range of 50 to 95% is used (Comparative Example 1 and Comparative Example 3), the initial conductivity is also insufficient, It can be seen that the conductivity decreases sharply even after repeated stretching and stretching.
Claims (5)
前記銀粉が表面処理されたものであり、
前記銀粉は、その平均一次粒子径が1.0μm以下で、かつみかけ空隙率が50〜95%であり、
導電性組成物中において、前記銀粉の二次粒子の粒度分布における累積95%粒子径(D95粒子径)が、3.0〜25.0μmであることを特徴とする、導電性組成物。A conductive composition comprising an elastomer and silver powder,
The silver powder is surface-treated,
The silver powder has an average primary particle size of 1.0 μm or less and an apparent porosity of 50 to 95%,
In the conductive composition, the cumulative 95% particle size (D95 particle size) in the particle size distribution of the secondary particles of the silver powder is 3.0 to 25.0 μm, the conductive composition.
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012102304A1 (en) * | 2011-01-26 | 2012-08-02 | ナミックス株式会社 | Electroconductive paste and method for manufacturing same |
WO2017026420A1 (en) * | 2015-08-07 | 2017-02-16 | 太陽インキ製造株式会社 | Electroconductive composition, conductor, and flexible printed wiring board |
WO2017026130A1 (en) * | 2015-08-07 | 2017-02-16 | 太陽インキ製造株式会社 | Conductive composition, conductor and base |
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-
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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WO2017026420A1 (en) * | 2015-08-07 | 2017-02-16 | 太陽インキ製造株式会社 | Electroconductive composition, conductor, and flexible printed wiring board |
WO2017026130A1 (en) * | 2015-08-07 | 2017-02-16 | 太陽インキ製造株式会社 | Conductive composition, conductor and base |
Non-Patent Citations (1)
Title |
---|
TOKURIKI TECHNICAL DATA「シルベスト E-20」, JPN6018032183, 10 August 2018 (2018-08-10), ISSN: 0004706047 * |
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