JPWO2018100733A1 - Component mounting machine - Google Patents

Abstract

The component mounter of the present disclosure includes a component supply device, a board holding device, a vertical articulated robot, a vertical movement device, and a control device. The vertical movement device relatively moves the component supply device and the component sampling unit in the vertical direction, and relatively moves the substrate holding device and the component sampling unit in the vertical direction. The control device controls the robot so that the component sampling unit is positioned immediately above the component supplied from the component supply device, and then moves the component sampling unit in the vertical direction so that the component sampling unit collects the component in the vertical direction. Controls the device and the parts collection unit. Thereafter, the control device controls the robot so that the component sampled by the component sampling unit is positioned immediately above a predetermined mounting position on the board, and then moves the component sampling unit in the vertical direction to mount the component at the mounting position. The vertical direction moving device and the part collecting unit are controlled.

Description

  This specification discloses a component mounter.

  Among component mounting systems, those using multi-joint robots have been proposed (for example, Patent Document 1). Further, as an articulated robot, there is known a vertically articulated robot in which a plurality of arms are connected via joints of a horizontal axis and each arm is operated by a motor attached to each joint (for example, Patent Document 2) ). In general, a vertical articulated robot includes a cylindrical base portion that supports a proximal end arm of a plurality of arms. The base pivots in the horizontal direction about the vertical axis.

JP, 2011-210960, A (Drawing 2 (b)) JP, 2015-85454, A (Drawing 1)

  The conventional vertical articulated robot positions the tip of the arm at a predetermined coordinate of three-dimensional coordinates by combining the axial rotational motions of a plurality of arms. Therefore, the tip end of the arm approaches from a predetermined angle with respect to a predetermined coordinate. In such a vertically articulated robot, when the component collecting unit is attached to the tip of the arm and the component collecting unit collects the components or mounts the collected components on the substrate, problems easily occur. For example, when parts are sampled, if the height of the parts deviates from the normal height, the positional relationship between the parts sampling unit and the parts deviates from the normal positional relationship. Specifically, when the normal positional relationship is determined such that the center of the parts collecting unit and the center of the parts coincide with each other, the parts collecting unit approaches the parts from obliquely above, so the height of the parts If there is a variation in, it deviates from the normal positional relationship. Such a deviation also occurs when mounting the sampled component at a predetermined position on the substrate. From these things, it was difficult to improve the mounting accuracy of the components.

  The component mounting machine of the present disclosure has been made to solve the above-described problems, and its main object is to improve the mounting accuracy of components.

The component mounting machine of the present disclosure
A parts supply device for supplying parts;
A substrate holding device for holding a substrate;
It has a plurality of arms rotatably connected around a horizontal axis, and a part collecting portion provided on the distal end arm of the plurality of arms and a proximal end arm of the plurality of arms around the vertical axis A vertical articulated robot having a rotatably supported base portion;
A vertical direction moving device for relatively moving the component supply device and the component collecting unit in the vertical direction, and relatively moving the substrate holding device and the component collecting unit in the vertical direction;
After controlling the robot so that the component collecting unit is positioned immediately above the component supplied from the component supply device, the component collecting unit moves the component collecting unit in the vertical direction to collect the component. After controlling the vertical movement device and the component collecting unit, and then controlling the robot so that the component collected by the component collecting unit is located immediately above the predetermined mounting position of the substrate, the component collecting is performed. A control unit that controls the vertical movement device and the component collecting unit to move the unit in the vertical direction and mount the component at the mounting position;
Is provided.

  In this component mounting machine, the vertical movement device relatively moves the component supply device and the component collecting unit in the vertical direction, and moves the substrate holding device and the component collecting unit in the vertical direction. Further, the control device controls the robot so that the component collecting unit is positioned immediately above the component supplied from the component supply device, and then vertically moves the component collecting unit in the vertical direction to collect the component by the component collecting unit. Control the direction movement device and the part sampling unit. After that, the control device controls the robot so that the part sampled by the part sampling unit is positioned immediately above the predetermined mounting position of the substrate, and then moves the part sampling unit in the vertical direction to mount the part at the mounting location Control the vertical movement device and the component sampling unit. Thus, when picking up a part, the part picking unit approaches the part from immediately above the part. Further, when the component is mounted on the substrate, the component collected by the component collecting unit approaches the mounting position of the substrate from immediately above. Therefore, even when the height of the part deviates from the normal height when picking up the part, it is easy to maintain the positional relation between the part collecting unit and the part in the normal positional relation. In addition, when the component is mounted on the substrate, even if the height of the component is deviated from the regular height or unevenness is present on the surface of the substrate, the mounting position of the component and the substrate collected by the component collecting unit It is easy to maintain the positional relationship of in the regular positional relationship. Therefore, the mounting accuracy of the parts is improved.

FIG. 1 is a configuration diagram schematically showing the configuration of a component mounter 10; FIG. 7 is a block diagram showing an electrical connection of the control device 60. The flowchart of a component mounting process routine. Operation | movement explanatory drawing (S120-S130) until the nozzle 53 adsorbs | sucks the components P. FIG. FIG. 14 is an operation explanatory view when the nozzle 53 moves obliquely downward from the initial position to the supply position coordinates of the part P and sucks; Operation | movement explanatory drawing of (S140-S150) until the nozzle 53 which adsorb | sucked the component P mounts | wears with the board | substrate S the component P. FIG. FIG. 8 is an operation explanatory view until the nozzle 53 which has adsorbed the component P moves obliquely downward from the initial position and mounts the component P on the substrate S; Explanatory drawing of the vertical articulated robot 140. FIG. FIG. 2 is a configuration diagram showing an outline of a configuration of a component mounter 110. The block diagram which shows the outline of a structure of the optical shaping apparatus 200. FIG.

  Preferred embodiments of the component mounter of the present disclosure are described below with reference to the drawings. FIG. 1 is a schematic diagram showing the configuration of the component mounter 10, and FIG. 2 is an explanatory diagram showing an electrical connection of the control device 60. As shown in FIG. The vertical direction in FIG. 1 is the Z-axis direction.

  The component mounter 10 of this embodiment includes a component supply device 20, a substrate holding device 30, a vertical articulated robot 40, a Z-axis direction moving device 50, a nozzle 53, and a control device 60 (see FIG. 2). Equipped with

  The component supply device 20 is a device that supplies components to the vertical articulated robot 40, and in this case, supplies a plurality of components P side by side on the tray 22. The tray 22 is supported by a plurality of legs 26 erected on a base 24. The coordinates (supply position coordinates) of the center point of each part P disposed on the tray 22 are input to the control device 60 in advance.

  The substrate holding device 30 is a device for holding a substrate S on which a plurality of components P are mounted. Here, a flat substrate S is placed on a table 32. The table 32 is provided on a stage 33 supported by a plurality of legs 36 erected on a base 34. The coordinates (mounting position coordinates) of the mounting position of each component P on the substrate S are input to the control device 60 in advance. The component P is mounted on the substrate S such that the center point of the component P coincides with the mounting position.

  The vertical articulated robot 40 is provided with four robot movable parts (a shoulder 42, a lower arm 43, an upper arm 44, and a wrist 45). The four robot movable parts are connected on a cylindrical base part 41. Specifically, a shoulder 42 is pivotably connected to the upper surface of the base portion 41 via a first joint 41j around the upper and lower shafts 41a. The lower end portion of the lower arm 43 is rotatably connected to the shoulder 42 through a second joint 42j about a horizontal axis 42a. The base end of the upper arm 44 is rotatably connected to the upper end of the lower arm 43 via the third joint 43 j around the horizontal axis 43 a. A wrist 45 is rotatably connected to the tip of the upper arm 44 about a shaft 44 a extending in a direction orthogonal to the longitudinal direction of the upper arm 44 via a fourth joint 44 j. A Z-axis movement device 50 is rotatably coupled to the wrist 45 about the axis 44 a along with the wrist 45. The first joint 41 j incorporates a first motor 41 m that rotationally drives the shoulder 41, and the second joint 42 j incorporates a second motor 42 m that rotationally drives the lower arm 43. The third joint 43j incorporates a third motor 43m that rotationally drives the upper arm 44, and the fourth joint 44j incorporates a fourth motor 44m rotationally driving the wrist 45. The first to fourth motors 41m to 44m respectively include first to fourth encoders 41e to 44e (see FIG. 2). In this embodiment, a servomotor is used as the motor, and a rotary encoder is used as the encoder.

  The Z-axis direction moving device 50 includes a device main body 51 and a Z-axis slider 52. The apparatus main body 51 is a substantially rectangular member in this case, and is fixed to the list 45. Therefore, the device body 51 is rotatable around the shaft 44a. The Z-axis slider 52 is slidably attached to the front surface of the device main body 51 along the longitudinal direction of the device main body 51. The Z-axis slider 52 is driven by a Z-axis drive device 54 (for example, a linear motor or a ball screw mechanism) attached to the main body 51 of the apparatus.

  The nozzle 53 is provided on the lower surface of the suction head 55. The nozzle 53 sucks the component P or releases the sucked component P by adjusting the pressure at the nozzle tip. The nozzle 53 is attached to the suction head 55 in a detachable and axially rotatable manner. The suction head 55 is fixed to the Z-axis slider 52. Therefore, the nozzle 53 slides together with the suction head 55 and the Z-axis slider 52.

  The control device 60 is a device that controls the operation of the vertical articulated robot 40 and the operation of the Z-axis direction moving device 50. The control apparatus 60 is provided with CPU61, ROM62, HDD63, and RAM64, as shown in FIG. First to fourth drive circuits 41d to 44d, first to fourth position detection circuits 41p to 44p, Z-axis drive circuit 54d, Z-axis position detection circuit 54p, input device 70, and output device 72 are connected to the CPU 61. ing. The first to fourth drive circuits 41d to 44d and the Z-axis drive circuit 54d are provided corresponding to the first to fourth motors 41m to 46m and the Z-axis drive device 54, respectively. The first to fourth drive circuits 41d to 44d and the Z-axis drive circuit 54d output electric signals based on command signals from the CPU 61 to the corresponding first to fourth motors 41m to 44m and the Z-axis drive device 54. Do. The first to fourth position detection circuits 41p to 44p are for detecting the position of each robot movable portion, and are provided corresponding to the first to fourth encoders 41e to 44e. The Z-axis position detection circuit 54p is for detecting the Z-axis position of the nozzle 53, and is provided corresponding to the Z-axis encoder 54e. The first to fourth position detection circuits 41p to 44p detect angular positions of the first to fourth motors 41m to 44m based on detection signals inputted from the corresponding first to fourth encoders 41e to 44e, respectively. Output to the CPU 61. The Z-axis position detection circuit 54p detects the Z-axis position of the nozzle 53 based on the detection signal input from the Z-axis encoder 54e, and outputs the detected position to the CPU 61. The input device 70 is a keyboard or a mouse on which an operator performs an input operation. The output device 72 is a display that displays various data as visual information such as an image.

  Next, a component mounting process routine executed by the control device 60 of the articulated robot 40 according to the present embodiment will be described. When the operator instructs start of the component mounting process routine via the input device 70, the control device 60 reads the program of the component mounting process routine from the ROM 62 and executes it. FIG. 3 is a flowchart of the component mounting process routine.

  When starting the component mounting process routine, the CPU 61 of the control device 60 first inputs various data (S100). Various data include supply position coordinates and mounting position coordinates. The supply position coordinates and the mounting position coordinates are represented by three-dimensional coordinates. The CPU 61 stores the input various data in the HDD 63.

  Subsequently, the CPU 61 reads the supply position coordinate of the component P to be mounted on the substrate S this time and the mounting position coordinate of the component P (S110). Subsequently, the CPU 61 arranges the nozzle 53 immediately above the component P (S120). Specifically, the CPU 61 controls the vertical articulated robot 40 so that the center of the tip of the nozzle 53 is located immediately above the supply position coordinate of the part P. Subsequently, the CPU 61 lowers the nozzle 53 in the Z-axis direction to cause the nozzle 53 to suck the component P (S130). Specifically, the CPU 61 controls the Z-axis direction moving device 50 so that the tip of the nozzle 53 reaches the upper surface of the component P, and the pressure of the nozzle 53 so that negative pressure is supplied to the tip of the nozzle 53 Control.

  FIG. 4 is an operation explanatory view of (S120 to S130) until the nozzle 53 sucks the component P. As shown in FIG. The solid line in FIG. 4 shows how to pick up a component P1 of normal size, and the dotted line in FIG. 4 shows how to pick up a component P2 that is larger than the regular size. The part P2 larger than the normal size has a size larger than the normal size due to manufacturing tolerances and the like. When suctioning a regular-sized component P1 (solid line) on the tray 22, the nozzle 53 moves from the initial position so that the tip center of the nozzle 53 is directly above the supply position coordinate (X in FIG. 4) of the component P1. . Thereafter, the nozzle 53 descends in the vertical direction until the tip of the nozzle 53 contacts the upper surface of the component P1. Therefore, the nozzle 53 sucks the component P1 in a state where the tip center of the nozzle 53 matches the XY coordinates of the supply position coordinate of the component P1. On the other hand, when suctioning a component P2 (dotted line) larger than the normal size, the nozzle 53 is moved from the initial position so that the tip center of the nozzle 53 is directly above the normal supply position coordinates. Thereafter, the nozzle 53 is lowered in the vertical direction until the tip of the nozzle 53 contacts the upper surface of the component P2. Therefore, the nozzle 53 sucks the component P2 in a state where the center of the tip of the nozzle 53 matches the XY coordinates of the supply position coordinate of the component P2. The same is true for parts smaller than the normal size.

  Here, an operation when the nozzle 53 moves obliquely downward from the initial position to the supply position coordinates of the part P and sucks it will be described. FIG. 5 is an explanatory view of the operation at that time. The solid line in FIG. 5 shows how to pick up a component P1 of normal size, and the dotted line in FIG. 5 shows how to pick up a component P2 that is larger than the regular size. When a regular-sized component P1 (solid line) on the tray 22 is suctioned, the nozzle 53 moves from the initial position so that the tip center of the nozzle 53 matches the supply position coordinates (X in FIG. 5) of the component P1. Move diagonally downward to. Therefore, the nozzle 53 sucks the component P1 in a state where the center of the tip of the nozzle 53 coincides with the XY coordinates of the supply position of the component P1. On the other hand, when suctioning a component P2 (dotted line) larger than the normal size, the nozzle 53 is the same as the above, with respect to the component P2 so that the tip center of the nozzle 53 from the initial position matches the regular supply position coordinates. Move diagonally downward. However, since the part P2 is taller than the normal size, the nozzle 53 hits the upper surface of the part P2 before the center of the tip of the nozzle 53 reaches the normal supply position coordinates. In this case, the tip center of the nozzle 53 sucks the component P2 at a position deviated from the XY coordinates of the supply position. The same is true for parts smaller than the normal size.

  Now, returning to FIG. 3, after S130, the CPU 61 arranges the nozzle 53 which has adsorbed the component P just above the predetermined mounting position coordinate of the substrate S (S140). Specifically, the CPU 61 controls the vertical articulated robot 40 so that the center of the tip of the nozzle 53 is right above the mounting position coordinate. Subsequently, the CPU 61 lowers the nozzle 53 which has attracted the component P in the Z-axis direction, and mounts the component P on the substrate S (S150). Specifically, the CPU 61 controls the Z-axis direction moving device 50 so that the lower surface of the component P is in contact with the substrate S, and then positive pressure or atmospheric pressure is supplied to the tip of the nozzle 53 to The pressure of the nozzle 53 is controlled to be away from the Thereafter, the CPU 61 determines whether or not all the parts P to be mounted on the substrate S have been mounted (S160), and if the parts P to be mounted still remain, the steps S110 to S150 are performed again and the next part Attach P to substrate S. On the other hand, if all the components P to be mounted on the substrate S have been mounted in S160, the CPU 61 ends the component mounting processing routine.

  FIG. 6 is an operation explanatory view (S140 to S150) until the nozzle 53 which has suctioned the component P mounts the component P on the substrate S. The solid line in FIG. 6 shows the state when the regular-sized component P1 is mounted, and the dotted line in FIG. 6 shows the situation when the component P2 larger than the regular size is sucked. When mounting a component P1 of a normal size (solid line) on the substrate S, the nozzle 53 moves from the initial position so that the tip center of the nozzle 53 is directly above the mounting position coordinate (X in FIG. 6) of the component P1. . In the initial position, the component P1 is attracted to the nozzle 53 in a state where the center of the component P1 coincides with the center of the tip of the nozzle 53. Thereafter, the nozzle 53 descends in the vertical direction until the lower surface of the component P1 sucked by the nozzle 53 comes in contact with the substrate S, and releases the component P1. Therefore, the component P1 is mounted on the substrate S in a state where the center of the component P1 coincides with the XY coordinates of the mounting position. On the other hand, when suctioning a component P2 (dotted line) larger than the normal size, the nozzle 53 is arranged such that the tip center of the nozzle 53 is directly above the normal mounting position coordinates from the initial position. Thereafter, the nozzle 53 descends in the vertical direction until the lower surface of the component P2 sucked by the nozzle 53 comes in contact with the substrate S, and releases the component P2. Therefore, the component P2 is mounted on the substrate S in a state where the center position of the component P2 matches the XY coordinates of the mounting position. The same is true for parts smaller than the normal size.

  Here, an operation from when the nozzle 53 which has adsorbed the component P moves obliquely downward from the initial position to mount the component P on the substrate S will be described. FIG. 7 is an explanatory view of the operation at that time. The solid line in FIG. 7 shows how to pick up a component P1 of normal size, and the dotted line in FIG. 7 shows how to pick up a component P2 that is larger than the regular size. When a component P1 (solid line) of a normal size is attached to the substrate S, the nozzle 53 continues until the center of the component P1 absorbed by the nozzle 53 from the initial position coincides with the XY coordinates of the mounting position (× in FIG. 7). , And move obliquely downward relative to the part P1 to release the part P1. Therefore, the component P1 is mounted on the substrate S in a state where the center of the component P1 coincides with the XY coordinates of the mounting position. On the other hand, when the component P2 (dotted line) larger than the normal size is attached to the substrate S, the nozzle 53 performs the same operation as described above. However, since the component P2 is taller than the normal size, the lower surface of the component P2 reaches the substrate S before the tip center of the nozzle 53 reaches the XY coordinates of the mounting position. Here, since it is assumed that the tip center of the nozzle 53 coincides with the center of the part P2, the center of the part P2 deviates from the XY coordinates of the mounting position. The same is true for parts smaller than the normal size.

  In the component mounter 10 described above, the Z-axis direction moving device 50 moves the nozzle 53 in the vertical direction with respect to the component supply device 20, and moves the nozzle 53 in the vertical direction with respect to the substrate holding device 30. Further, after the control device 60 controls the robot 40 so that the nozzle 53 is positioned immediately above the component P supplied from the component supply device 20, the nozzle 53 is moved in the vertical direction and the nozzle 53 sucks the component P ( Control the Z-axis direction moving device 50 and the nozzle 53 so as to Thereafter, the control device 60 controls the robot 40 so that the component P adsorbed by the nozzle 53 is positioned immediately above the predetermined mounting position of the substrate S, and then moves the nozzle 53 in the vertical direction to mount the component P The Z axis direction moving device 50 and the nozzle 53 are controlled to be mounted on the Thus, when the component P is suctioned, the nozzle 53 approaches the component P from immediately above the component P. Further, when the component P is mounted on the substrate S, the component P absorbed by the nozzle 53 approaches the mounting position of the substrate S from directly above. Therefore, when the component P is suctioned, even if the height of the component P deviates from the normal height, the positional relationship between the nozzle 53 and the component P can be easily maintained in the normal positional relationship. In addition, when the component P is attached to the substrate S, even if the height of the component P varies from the normal height or unevenness exists on the surface of the substrate S, the component P and the substrate absorbed by the nozzle 53 It is easy to maintain the positional relationship with the mounting position of S in a regular positional relationship. Therefore, the mounting accuracy of the part P is improved.

  In addition, since the Z-axis direction moving device 50 is a device that directly moves the nozzle 53 in the vertical direction, it is not necessary to provide the component supplying device 20 or the substrate holding device 30 with the vertical direction moving device. Absent).

  It is needless to say that the present invention is not limited to the above-mentioned embodiment at all, and can be implemented in various modes within the technical scope of the present invention.

  For example, in the embodiment described above, the Z-axis direction moving device 50 is adopted as the vertical direction moving device, but instead, the nozzle 53 is indirectly moved by moving the base portion 41 of the vertical articulated robot 40 in the vertical direction. It is possible to employ a device that moves the light in the vertical direction. An example is shown in FIG. Similar to the vertical articulated robot 40, the vertical articulated robot 140 shown in FIG. 8 includes four robot movable parts (the shoulder 42, the lower arm 43, the upper arm 44, and the wrist 45). Are divided into a lower portion 411 and an upper portion 412. The upper portion 412 is vertically moved relative to the lower portion 411 by the lifting device 413. The suction head 55 provided with the nozzle 53 is slidably fixed to the head holding member 56, and is attached to the wrist 45 via the head holding member 56. In the embodiment described above, even when the vertical articulated robot 140 is employed instead of the vertical articulated robot 40 provided with the Z-axis direction moving device 50, the component mounting processing routine similar to that of the embodiment described above (FIG. 3) Can be performed, and the same effect can be obtained.

  Alternatively, as with the component mounter 110 shown in FIG. 9, the component supply device 20 including the tray lifting device 28 (first vertical direction moving unit) and the table lifting device 38 (second vertical direction moving unit) The substrate holding device 30 may be employed. The tray lifting device 28 is a device capable of lifting and lowering the tray 22 in the vertical direction with respect to the base 24. The table lifting device 38 is a device capable of lifting and lowering the table 32 in the vertical direction with respect to the stage 33. In this case, the tray lifting device 28 moves the tray 22 in the vertical direction with respect to the nozzle 53, and the table lifting device 38 moves the table 32 in the vertical direction with respect to the nozzle 53. Also in this case, the component mounting process routine (FIG. 3) similar to that of the above-described embodiment can be executed, and the same effect can be obtained. In the component mounting machine 110, the vertical articulated robot 40 according to the above-described embodiment is employed. However, since it is not necessary to move the nozzle 53 in the vertical direction, the suction head 55 is used instead of the Z axis direction moving device 50. A head holding member 56 (see FIG. 8) that holds the slide in an immovable manner may be employed.

  Further, instead of the substrate holding device 30 of the component mounter 110 shown in FIG. 9, an optical shaping apparatus 200 shown in FIG. 10 may be employed. The optical shaping apparatus 200 includes a table 232, a stage 233, a resin layer forming unit 240, and a wiring layer forming unit 250. The table 232 is mounted so as to be movable up and down in the Z-axis direction with respect to the stage 233 by the table lifting device 234. The stage 233 is movably provided along the Y-axis rail 235 by a Y-axis actuator (not shown). The resin layer forming unit 240 includes an ink head 241 capable of discharging a UV curable resin ink, and a UV light irradiation device 242 capable of irradiating the resin ink discharged from the ink head 241 with UV light. The resin layer forming unit 240 forms a resin layer on the table 232 using the ink head 241 and the UV light irradiation device 242. The wiring layer forming unit 250 includes an ink head 251 capable of discharging the conductive particle-containing ink, and a laser irradiation device 252 for irradiating the conductive particle-containing ink discharged from the ink head 251 with a laser to make the ink conductive. The wiring layer forming unit 250 manufactures the substrate S by laminating the wiring layer on the resin layer formed on the table 232 using the ink head 251 and the laser irradiation device 252. With respect to the substrate S formed on the table 232 of the optical forming device 200, the vertical articulated robot 40 sucks the component P supplied from the component supply device 130 (see FIG. 9) to the nozzle 53, and the component P Is mounted on a predetermined position of the substrate S. Here, the gap between the ink head 241 and the printing surface of the resin layer forming unit 240 is adjusted by the table lifting device 234 so as to have a constant interval. Since the printing surface on the table 232 becomes higher as the lamination of the resin layer proceeds, the height of the table 232 is lowered as the number of laminations of the resin layer increases so that the gap becomes a constant interval. As described above, the optical shaping apparatus 200 includes the table lifting device 234 for gap adjustment. Therefore, the optical shaping device 200 can be used as the substrate holding device 30 of FIG. 9, and the table lifting device 234 can be used as the second vertical direction moving unit.

  In the embodiment described above, the nozzle 53 for sucking the component P or releasing the component P which has been sucked is adopted as the component collecting unit, but the invention is not particularly limited to the nozzle 53. For example, a plurality of openable and closable fingers may be employed as the component collecting unit. In that case, the part P can be gripped or released by opening and closing a plurality of fingers.

  In the embodiment described above, an apparatus for supplying the component P using the tray 22 is illustrated as the component supply apparatus, but the invention is not particularly limited thereto. For example, an apparatus for supplying parts by a tape feeder may be employed.

  The laser irradiation apparatus of the present disclosure may be configured as follows.

  In the component mounting machine of the present disclosure, the vertical movement device is a device for directly moving the component collecting portion in the vertical direction, in which case it is necessary to provide the component supply device and the substrate holding device with the vertical movement device. Not (but may be provided).

  In the component mounting machine of the present disclosure, the vertical direction moving device may be a device that moves the component collecting unit in the vertical direction by moving the base portion in the vertical direction. In this case, it is not necessary to provide the vertical direction moving device in the component supply device or the substrate holding device (however, it may be provided).

  In the component mounting machine of the present disclosure, the vertical movement device may include a first vertical movement unit for moving the component supply device in the vertical direction, and a second vertical movement unit for moving the substrate holding device in the vertical direction. May be provided. In this case, it is not necessary to provide the vertical articulated robot with the vertical movement device (however, it may be provided). In such a component mounting machine, the substrate holding device is an optical shaping apparatus for manufacturing the substrate on a work table using an ink head and a UV irradiating unit, and the second vertical direction moving unit is the optical shaping apparatus Among the above, the table elevating unit may be configured to adjust the distance between the ink head and the substrate held by the work table or the in-process product of the substrate. By so doing, the table elevating part of the optical shaping apparatus can be used as the second vertical direction moving part.

  The present invention is applicable to a component mounter.

DESCRIPTION OF SYMBOLS 10 Parts mounting machine, 20 parts supply apparatus, 22 trays, 24 bases, 26 legs, 28 tray lifting apparatuses, 30 board holding apparatuses, 33 stages, 34 bases, 36 legs, 38 table lifting apparatuses, 40 vertical articulated robots, 41 Base part, 411 lower part, 412 upper part, 413 lifting device, 41a vertical axis, 41d first drive circuit, 41e first encoder, 41j first joint, 41m first motor, 41p first position detection circuit, 42 shoulder, 42a horizontal Axis, 42j second joint, 42m second motor, 43 lower arm, 43a horizontal axis, 43j third joint, 43m third motor, 44 upper arm, 44a axis, 44j fourth joint, 44m fourth motor, 45 list, 50 Z axis direction moving device, 51 device body, 52 Z axis slider, 53 nozzle, 54 Axis drive device, 54d Z axis drive circuit, 54e Z axis encoder, 54p Z axis position detection circuit, 55 suction head, 56 head holding member, 60 control device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 70 input device , 72 output device, 110 component mounting machine, 130 component supply device, 140 vertical articulated robot, 200 optical shaping device, 232 table, 233 stage, 234 table lifting device, 235 Y axis rail, 240 resin layer forming unit, 241 ink Head, 242 UV light irradiation device, 250 wiring layer forming unit, 251 ink head, 252 laser irradiation device, P, P1, P2 parts, S substrate.

Claims (5)

A parts supply device for supplying parts;
A substrate holding device for holding a substrate;
It has a plurality of arms rotatably connected around a horizontal axis, and a part collecting portion provided on the distal end arm of the plurality of arms and a proximal end arm of the plurality of arms around the vertical axis A vertical articulated robot having a rotatably supported base portion;
A vertical direction moving device for relatively moving the component supply device and the component collecting unit in the vertical direction, and relatively moving the substrate holding device and the component collecting unit in the vertical direction;
After controlling the robot so that the component collecting unit is positioned immediately above the component supplied from the component supply device, the component collecting unit moves the component collecting unit in the vertical direction to collect the component. After controlling the vertical movement device and the component collecting unit, and then controlling the robot so that the component collected by the component collecting unit is located immediately above the predetermined mounting position of the substrate, the component collecting is performed. A control unit that controls the vertical movement device and the component collecting unit to move the unit in the vertical direction and mount the component at the mounting position;
Mounter equipped with The vertical direction moving device is a device that directly moves the component collecting unit in the vertical direction.
The component mounting machine according to claim 1. The vertical direction moving device is a device that moves the component collecting unit in the vertical direction by moving the base portion in the vertical direction.
The component mounting machine according to claim 1. The vertical direction moving device includes a first vertical direction moving portion that moves the component supply device in the vertical direction, and a second vertical direction moving portion that moves the substrate holding device in the vertical direction.
The component mounting machine according to claim 1. The substrate holding device is an optical forming device that manufactures the substrate on a work table using an ink head and a UV irradiation unit,
The second vertical direction moving unit is a table elevating unit that adjusts a distance between the ink head and the substrate held on the work table or an in-process product of the substrate in the optical shaping apparatus.
The component mounting machine according to claim 4.