JPWO2018061109A1 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JPWO2018061109A1 JPWO2018061109A1 JP2018541775A JP2018541775A JPWO2018061109A1 JP WO2018061109 A1 JPWO2018061109 A1 JP WO2018061109A1 JP 2018541775 A JP2018541775 A JP 2018541775A JP 2018541775 A JP2018541775 A JP 2018541775A JP WO2018061109 A1 JPWO2018061109 A1 JP WO2018061109A1
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- metal
- gas
- film
- substrate
- fluorine
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- 239000004065 semiconductor Substances 0.000 title claims description 21
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 127
- 239000002184 metal Substances 0.000 claims abstract description 127
- 239000010410 layer Substances 0.000 claims abstract description 99
- 239000000758 substrate Substances 0.000 claims abstract description 71
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 39
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000011737 fluorine Substances 0.000 claims abstract description 37
- 150000004767 nitrides Chemical class 0.000 claims abstract description 29
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 19
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 19
- 239000012792 core layer Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 49
- 230000003647 oxidation Effects 0.000 claims description 13
- 238000007254 oxidation reaction Methods 0.000 claims description 13
- 239000010936 titanium Substances 0.000 claims description 13
- 229910001512 metal fluoride Inorganic materials 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 claims description 3
- 230000009467 reduction Effects 0.000 claims description 2
- 238000000859 sublimation Methods 0.000 claims description 2
- 230000008022 sublimation Effects 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 abstract description 15
- 230000004888 barrier function Effects 0.000 abstract description 10
- 238000009792 diffusion process Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000007789 gas Substances 0.000 description 309
- 239000010408 film Substances 0.000 description 189
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 80
- 235000012431 wafers Nutrition 0.000 description 78
- 230000008569 process Effects 0.000 description 38
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000003860 storage Methods 0.000 description 15
- 239000011261 inert gas Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 230000007246 mechanism Effects 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000010926 purge Methods 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000003779 heat-resistant material Substances 0.000 description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 5
- 239000012159 carrier gas Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 229910010282 TiON Inorganic materials 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- -1 for example Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 229910010283 TiONx Inorganic materials 0.000 description 2
- 229910003087 TiOx Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical compound CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZQXCQTAELHSNAT-UHFFFAOYSA-N 1-chloro-3-nitro-5-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC(Cl)=CC(C(F)(F)F)=C1 ZQXCQTAELHSNAT-UHFFFAOYSA-N 0.000 description 1
- 229910016569 AlF 3 Inorganic materials 0.000 description 1
- KLZUFWVZNOTSEM-UHFFFAOYSA-K Aluminium flouride Chemical compound F[Al](F)F KLZUFWVZNOTSEM-UHFFFAOYSA-K 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910021582 Cobalt(II) fluoride Inorganic materials 0.000 description 1
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- YZCKVEUIGOORGS-UHFFFAOYSA-N Hydrogen atom Chemical compound [H] YZCKVEUIGOORGS-UHFFFAOYSA-N 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- GPBUGPUPKAGMDK-UHFFFAOYSA-N azanylidynemolybdenum Chemical compound [Mo]#N GPBUGPUPKAGMDK-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- YCYBZKSMUPTWEE-UHFFFAOYSA-L cobalt(ii) fluoride Chemical compound F[Co]F YCYBZKSMUPTWEE-UHFFFAOYSA-L 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910052805 deuterium Inorganic materials 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- CTNMMTCXUUFYAP-UHFFFAOYSA-L difluoromanganese Chemical compound F[Mn]F CTNMMTCXUUFYAP-UHFFFAOYSA-L 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- NBJFDNVXVFBQDX-UHFFFAOYSA-I molybdenum pentafluoride Chemical compound F[Mo](F)(F)(F)F NBJFDNVXVFBQDX-UHFFFAOYSA-I 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- DBJLJFTWODWSOF-UHFFFAOYSA-L nickel(ii) fluoride Chemical compound F[Ni]F DBJLJFTWODWSOF-UHFFFAOYSA-L 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- YRGLXIVYESZPLQ-UHFFFAOYSA-I tantalum pentafluoride Chemical compound F[Ta](F)(F)(F)F YRGLXIVYESZPLQ-UHFFFAOYSA-I 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XROWMBWRMNHXMF-UHFFFAOYSA-J titanium tetrafluoride Chemical compound [F-].[F-].[F-].[F-].[Ti+4] XROWMBWRMNHXMF-UHFFFAOYSA-J 0.000 description 1
- UJQMXWLZKHSSHS-UHFFFAOYSA-K trifluoroniobium Chemical compound [F-].[F-].[F-].[Nb+3] UJQMXWLZKHSSHS-UHFFFAOYSA-K 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- RBORBHYCVONNJH-UHFFFAOYSA-K yttrium(iii) fluoride Chemical compound F[Y](F)F RBORBHYCVONNJH-UHFFFAOYSA-K 0.000 description 1
- AKJVMGQSGCSQBU-UHFFFAOYSA-N zinc azanidylidenezinc Chemical compound [Zn++].[N-]=[Zn].[N-]=[Zn] AKJVMGQSGCSQBU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
Abstract
Description
Claims (10)
- 絶縁膜上に、第1の金属元素を含む金属窒化膜が形成された基板に対して、酸化ガスを供給して前記金属窒化膜の表面を酸化し、前記金属窒化膜の表面に金属酸化層を形成する工程と、 前記金属酸化層が形成された基板に対して、前記第1の金属元素とは異なる第2の金属元素およびフッ素を含むフッ素含有金属原料ガスを供給して、前記基板上に第2の金属元素を含む金属膜を形成する工程と、 を有し、 前記金属膜を形成する工程は、 前記基板に対して、第1の還元ガスと、前記フッ素含有金属原料ガスとを供給して、前記基板上に第2の金属元素を含む金属核層を形成する工程と、 前記金属核層が形成された基板に対して、前記第1の還元ガスとは異なる第2の還元ガスと、前記フッ素含有金属原料ガスとを用いて、前記金属核層の上に金属バルク層を形成する工程と、 を含み、前記金属膜は前記金属核層と前記金属バルク層を含む半導体装置の製造方法。
- 前記金属膜を形成する工程では、前記金属酸化層と、前記フッ素含有金属原料ガスに含まれるフッ素が結合し、金属フッ化酸化物として前記基板上から昇華させる請求項1に記載の半導体装置の製造方法。
- 前記金属酸化層を形成する工程では、次に行う金属膜を形成する工程で前記金属フッ化酸化物が前記基板上から昇華するために必要な所定の膜厚となるまで前記金属窒化膜の表面を酸化する請求項2に記載の半導体装置の製造方法。
- 前記金属核層を形成する工程では、前記第1の還元ガスと、前記フッ素含有金属原料ガスとを、互いに混合しないよう交互に前記基板に対して供給する請求項1に記載の半導体装置の製造方法。
- 前記金属バルク層を形成する工程では、前記第2の還元ガスと、前記フッ素含有金属原料ガスとを、混合させて前記基板に対して供給する請求項1に記載の半導体装置の製造方法。
- 前記金属バルク層を形成する工程では、前記第2の還元ガスと、前記フッ素含有金属原料ガスとを、互いに混合しないよう交互に前記基板に対して供給する請求項1に記載の半導体装置の製造方法。
- 前記金属窒化膜は、チタン含有窒化膜、タンタル含有窒化膜のいずれかである請求項1に記載の半導体装置の製造方法。
- 前記金属膜は、タングステン膜であり、前記フッ素含有金属原料ガスはタングステン六フッ化物である請求項1に記載の半導体装置の製造方法。
- 絶縁膜上に、第1の金属元素を含む金属窒化膜が形成された基板に対して、酸化ガスを供給して前記金属窒化膜の表面を酸化し、前記金属窒化膜の表面に金属酸化層を形成する工程(A)と、 前記金属酸化層が形成された基板に対して、前記第1の金属元素とは異なる第2の金属元素およびフッ素を含むフッ素含有金属原料ガスとを前記基板に対して供給し、前記金属酸化膜と、前記フッ素含有金属原料ガスに含まれるフッ素とを結合させて金属フッ化酸化物として前記基板上から昇華させる工程(B)と、 前記金属フッ化酸化物として前記金属酸化膜を昇華させた後に前記金属窒化膜が表面に露出した基板に対して、前記フッ素含有金属原料ガスを供給して前記基板上に前記第2の金属元素を含む金属膜を形成する工程(C)と、 を含む半導体装置の製造方法。
- 前記工程(B)および前記工程(C)では、さらに、前記基板に対して還元ガスを供給する請求項9に記載の半導体装置の製造方法。
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PCT/JP2016/078629 WO2018061109A1 (ja) | 2016-09-28 | 2016-09-28 | 半導体装置の製造方法 |
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JPWO2018061109A1 true JPWO2018061109A1 (ja) | 2019-02-07 |
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WO (1) | WO2018061109A1 (ja) |
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WO2022130559A1 (ja) * | 2020-12-17 | 2022-06-23 | 株式会社Kokusai Electric | 半導体装置の製造方法、プログラム及び基板処理装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002030436A (ja) * | 2000-03-29 | 2002-01-31 | Applied Materials Inc | タングステンcvdにおけるフッ素汚染の減少 |
JP2004536960A (ja) * | 2001-03-28 | 2004-12-09 | アプライド マテリアルズ インコーポレイテッド | フッ素を含まないタングステン核生成によるw−cvd |
JP2014019912A (ja) * | 2012-07-19 | 2014-02-03 | Tokyo Electron Ltd | タングステン膜の成膜方法 |
JP2016128606A (ja) * | 2015-12-24 | 2016-07-14 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置、プログラムおよび記録媒体 |
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- 2016-09-28 JP JP2018541775A patent/JP6639691B2/ja active Active
- 2016-09-28 WO PCT/JP2016/078629 patent/WO2018061109A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002030436A (ja) * | 2000-03-29 | 2002-01-31 | Applied Materials Inc | タングステンcvdにおけるフッ素汚染の減少 |
JP2004536960A (ja) * | 2001-03-28 | 2004-12-09 | アプライド マテリアルズ インコーポレイテッド | フッ素を含まないタングステン核生成によるw−cvd |
JP2014019912A (ja) * | 2012-07-19 | 2014-02-03 | Tokyo Electron Ltd | タングステン膜の成膜方法 |
JP2016128606A (ja) * | 2015-12-24 | 2016-07-14 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理装置、プログラムおよび記録媒体 |
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JP6639691B2 (ja) | 2020-02-05 |
WO2018061109A1 (ja) | 2018-04-05 |
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