JPWO2018043035A1 - Resin composition, resin sheet, and semiconductor device - Google Patents

Abstract

A resin composition contains a thermosetting component, a thermoplastic resin, a filler, and a triazine compound, and the said triazine compound is represented by following General formula (1). In general formula (1), R 1 is a hydrogen atom or an alkyl group, R 2 is a hydrogen atom or an alkyl group, and X is an alkyl group, a phenyl group, a hydroxyl group, an alkoxy group, and an alkoxysilyl group And at least one group selected from the group consisting of [Chemical formula 1]

Description

  The present invention relates to a resin composition, a resin sheet, and a semiconductor device.

DESCRIPTION OF RELATED ART Conventionally, the adhesive sheet which uses a resin composition for an adhesive bond layer is known.
For example, in Patent Document 1, a support such as polyethylene terephthalate, a resin composition layer formed on the support, and a protective film such as a polypropylene film for protecting the resin composition layer are laminated in this order. An adhesive film is disclosed. The resin composition described in Patent Document 1 contains a multifunctional epoxy resin, a curing agent, a phenoxy resin, and an inorganic filler.

Patent No. 5195454 gazette

  The resin composition used for the adhesive layer is required to reduce the water absorption rate and to improve the adhesive strength.

  An object of the present invention is to provide a resin composition and a resin sheet capable of reducing the water absorption rate and improving the adhesive strength. Another object of the present invention is to provide a semiconductor device having a semiconductor element sealed using the resin sheet.

  The resin composition according to one aspect of the present invention contains a thermosetting component, a thermoplastic resin, a filler, and a triazine compound, and the triazine compound is represented by the following general formula (1) It is characterized by

(In the general formula (1),
R ₁ is a hydrogen atom or an alkyl group,
R ₂ is a hydrogen atom or an alkyl group,
X is a group containing at least one selected from the group consisting of an alkyl group, a phenyl group, a hydroxyl group, an alkoxy group, and an alkoxysilyl group. )

In the resin composition according to one aspect of the present invention, R ₁ and R ₂ are hydrogen atoms, and X is
It is preferably a group containing an alkoxysilyl group.

In the resin composition according to one aspect of the present invention, R ₁ and R ₂ are preferably alkyl groups, and X is preferably a group containing a hydroxyl group.

  In the resin composition according to one aspect of the present invention, the triazine compound is preferably represented by the following general formula (2).

(In the general formula (2),
R ₁ is a hydrogen atom or an alkyl group,
R ₂ is a hydrogen atom or an alkyl group,
R ₃ is at least one group selected from the group consisting of an alkyl group, a hydroxyl group, an alkoxy group, and an alkoxysilyl group,
n is an integer of 1 or more and 3 or less,
A plurality of R ₃ are identical to or different from one another;
L ₁ is a chain linking group containing at least one group selected from the group consisting of an alkylene group and an arylene group. )

  In the resin composition according to one aspect of the present invention, the triazine compound is preferably represented by the following general formula (3).

(In the general formula (3),
R ₁ is a hydrogen atom or an alkyl group,
R ₂ is a hydrogen atom or an alkyl group,
R ₃ is a hydroxyl group or an alkoxysilyl group,
L ₂ is an organic chain having 1 to 8 carbon atoms. )

In the resin composition according to one aspect of the present invention, R ₁ and R ₂ are preferably hydrogen atoms, and R ₃ is preferably an alkoxysilyl group.

In the resin composition according to one aspect of the present invention, R ₁ and R ₂ are preferably alkyl groups, and R ₃ is preferably a hydroxyl group.

  In the resin composition according to an aspect of the present invention, the triazine compound is preferably contained in an amount of 0.1% by mass or more and 15% by mass or less based on the total amount of the resin composition.

  In the resin composition according to one aspect of the present invention, the thermosetting component preferably contains an epoxy resin and a curing agent.

  In the resin composition according to one aspect of the present invention, the thermoplastic resin is preferably a phenoxy resin.

  In the resin composition according to one aspect of the present invention, the filler is preferably a silica filler.

  The resin composition according to one aspect of the present invention is preferably used for a power semiconductor device.

  The resin sheet according to one aspect of the present invention is characterized by containing the resin composition according to one aspect of the present invention described above.

  A semiconductor device according to an aspect of the present invention includes a semiconductor element sealed with a resin sheet according to an aspect of the present invention.

  According to the present invention, it is possible to provide a resin composition and a resin sheet capable of reducing the water absorption rate and improving the adhesive strength. Further, according to the present invention, it is possible to provide a semiconductor device having a semiconductor element sealed using the resin sheet.

It is the cross-sectional schematic of the laminated body which concerns on one Embodiment.

[Resin composition]
The resin composition which concerns on this embodiment contains a thermosetting component, a thermoplastic resin, a filler, and a triazine compound.

(Triazine compound)
The triazine compound is represented by the following general formula (1).

(In the general formula (1),
R ₁ is a hydrogen atom or an alkyl group,
R ₂ is a hydrogen atom or an alkyl group,
X is a group containing at least one selected from the group consisting of an alkyl group, a phenyl group, a hydroxyl group, an alkoxy group, and an alkoxysilyl group. )

In the general formula (1), R ₁ and R ₂ are the same as or different from each other.
In the general formula (1), the alkyl group in R ₁ and R ₂ is, for example, any group selected from the group consisting of methyl group, ethyl group, isopropyl group, propyl group and butyl group Preferably, it is a methyl group.
In the general formula (1), R ₁ and R ₂ are more preferably hydrogen atoms.

The group represented by X in the general formula (1) may further have various functional groups. The functional group possessed by X is preferably at least one functional group selected from the group consisting of a functional group having a carbon-carbon double bond, a group having an ether bond, an aldehyde group, and a carboxyl group. When X contains a chain-like linking group, it is preferable that the functional group is contained in at least one of the main chain and the branched chain of the linking group. The chained linking group in X is preferably a chained linking group containing at least one group selected from the group consisting of an alkylene group and an arylene group. The group represented by X may have a plurality of functional groups, and the plurality of functional groups are identical to or different from one another.
In addition, at least one group selected from the group consisting of a hydroxyl group and an alkoxysilyl group is preferably bonded to the end of the group represented by X, and a hydroxyl group, a methoxysilyl group, and trimethoxy More preferably, at least one group selected from the group consisting of silyl groups is bonded.

In the general formula (1), R ₁ and R ₂ are hydrogen atoms, and X is more preferably a group containing an alkoxysilyl group.

In the general formula (1), R ₁ and R ₂ are alkyl groups, and X is more preferably a group containing a hydroxyl group.

  It is preferable that the triazine compound which concerns on this embodiment is represented by following General formula (2).

(In the general formula (2),
R ₁ is a hydrogen atom or an alkyl group,
R ₂ is a hydrogen atom or an alkyl group,
R ₃ is at least one group selected from the group consisting of an alkyl group, a hydroxyl group, an alkoxy group, and an alkoxysilyl group,
n is an integer of 1 or more and 3 or less,
A plurality of R ₃ are identical to or different from one another;
L ₁ is a chain linking group containing at least one group selected from the group consisting of an alkylene group and an arylene group. )

R ₁ and R ₂ in the general formula (2) are the same as or different from each other.
The alkyl group in R ₁ and R ₂ in the general formula (2) has the same meaning as the alkyl group in the general formula (1).

The alkylene group as L ₁ is preferably an alkylene group having 1 to 10 carbon atoms, and the arylene group as L ₁ is preferably a phenylene group.
L ₁ may further have various functional groups. The functional group possessed by L ₁ is at least one selected from the group consisting of a functional group having a carbon-carbon double bond, a hydroxyl group, an alkoxy group, an alkoxysilyl group, a group having an ether bond, an aldehyde group, and a carboxyl group Is preferably a group of When L ₁ has such a functional group, the functional group is preferably contained in at least _one of the main chain and the branched chain of L ₁ . L ₁ may have a plurality of functional groups, and the plurality of functional groups are identical to or different from one another.

R ₃ in the general formula (2) is preferably a group having a functional group capable of reacting with another compound, or a functional group itself capable of reacting with another compound, and the functional group is particularly preferably It is not limited. The functional group possessed by R ₃ is preferably any one group selected from the group consisting of a hydroxyl group, an alkoxy group, and an alkoxysilyl group. The alkoxysilyl group is preferably, for example, a methoxysilyl group or a trimethoxysilyl group. The group having a hydroxyl group is more preferably a functional group having a primary alcohol or secondary alcohol.

  It is preferable that the triazine compound which concerns on this embodiment is represented by following General formula (3).

(In the general formula (3),
R ₁ is a hydrogen atom or an alkyl group,
R ₂ is a hydrogen atom or an alkyl group,
R ₃ is a hydroxyl group or an alkoxysilyl group,
L ₂ is an organic chain having 1 to 8 carbon atoms. )

R ₁ and R ₂ in the general formula (3) are the same as or different from each other.
The alkyl group in R ₁ and R ₂ in the general formula (3) has the same meaning as the alkyl group in the general formula (1).

The organic chain of L ₂ is preferably a chain-like linking group containing at least one group selected from the group consisting of an alkylene group having 1 to 8 carbon atoms and an arylene group, and an alkylene group having 2 to 6 carbon atoms More preferably, it is a chain-like linking group containing at least one group selected from the group consisting of and arylene groups. The arylene group as L ₂ is preferably a phenylene group.
L ₂ may further have various functional groups. The functional group of L ₂ is at least one selected from the group consisting of a functional group having a carbon-carbon double bond, a hydroxyl group, an alkoxy group, an alkoxysilyl group, a group having an ether bond, an aldehyde group, and a carboxyl group Is preferably a group of When L ₂ has such a functional group, the functional group is preferably contained in at least one of the main chain and branched chain of L ₂ . L ₂ may have a plurality of functional groups, and the plurality of functional groups are identical to or different from one another.
R ₃ in the general formula (3) is preferably a group having a functional group capable of reacting with another compound, or a functional group itself capable of reacting with another compound, and the functional group is particularly preferably It is not limited. The functional group possessed by the terminal of R ₃ is more preferably a trimethoxysilyl group.

When R ₁ and R ₂ in the general formula (3) are hydrogen atoms (the compound in this case may be referred to as the first aspect of the triazine compound), the organic chain of L ₂ has 1 carbon atom It is preferable that it is an alkylene group of -8, and it is more preferable that it is a C2-C6 alkylene group. In the first embodiment of the triazine compound, L ₂ may further have various functional groups, and may have a functional group having a carbon-carbon double bond, a hydroxyl group, an alkoxy group, an alkoxysilyl group or an ether bond. It is preferable to have at least one group selected from the group consisting of groups having one, an aldehyde group, and a carboxyl group. Furthermore, in the first aspect of the triazine compound, R ₃ in the general formula (3) preferably has a functional group capable of reacting with another compound, and the functional group is not particularly limited. In the first embodiment of the triazine compound, the functional group possessed by the terminal of R ₃ is more preferably a trimethoxysilyl group.

In the general formula (3), when R ₁ and R ₂ are alkyl groups (the compound in this case may be referred to as a second embodiment of the triazine compound), the alkyl group in R ₁ is a methyl group, It is preferably any group selected from the group consisting of an ethyl group, an isopropyl group, a propyl group, and a butyl group, and more preferably a methyl group. In the second embodiment of the triazine compound, L ₂ in the general formula (3) is a chain linking group containing at least one group selected from the group consisting of an alkylene group having 1 to 8 carbon atoms and an arylene group It is more preferable that it is a chain-like linking group containing at least one group selected from the group consisting of an alkylene group having 2 to 6 carbon atoms and an arylene group. In the second embodiment of the triazine compound, L ₂ may further have various functional groups, and the functional group possessed by L ₂ is a functional group having a carbon-carbon double bond, a hydroxyl group, an alkoxy group And at least one group selected from the group consisting of an alkoxysilyl group, a group having an ether bond, an aldehyde group, and a carboxyl group. When L ₂ has such a functional group, the functional group is preferably contained in at least one of the main chain and branched chain of L ₂ . Furthermore, in the second aspect of the triazine compound, R ₃ in the general formula (3) preferably has a functional group capable of reacting with another compound, and the functional group is not particularly limited. In the second embodiment of the triazine compound, the functional group possessed by the terminal of R ₃ is more preferably a hydroxyl group.

  The first aspect and the second aspect of the triazine compound described above are merely examples of the triazine compound in the present embodiment, and the present invention is not limited to the resin composition using the triazine compound of such an aspect.

The molecular weight of the triazine compound is preferably 150 or more and 450 or less.
The molecular weight of the triazine compound is also preferably 150 or more and 300 or less.
The molecular weight of the triazine compound is also preferably 300 or more and 450 or less.

  The triazine compound according to the present embodiment does not have an epoxy group.

The content of the triazine compound in the resin composition is preferably 0.1% by mass or more and 15% by mass or less on the basis of the total amount of the resin composition, from the viewpoint of reduction of water absorption and improvement of adhesion.
The content of the triazine compound in the resin composition is more preferably 0.4% by mass or more and 12% by mass or less based on the total amount of the resin composition, and 0.5% by mass or more and 10% by mass or less The content is more preferably 1.4% by mass or more and 10% by mass or less.

(Thermosetting component)
The thermosetting component has a property of being three-dimensional reticulated when heated and firmly adhering the adherend. As the thermosetting component in the present embodiment, various conventionally known thermosetting components can be used without particular limitation.
The thermosetting component of the present embodiment contains a thermosetting resin and a curing agent.
The thermosetting resin is preferably, for example, at least one resin selected from the group consisting of epoxy, phenol, resorcinol, urea, melamine, furan, unsaturated polyester, silicone and the like, and is an epoxy resin. Is more preferred.
The thermosetting component in the present embodiment preferably contains an epoxy resin and a curing agent.

As the epoxy resin, conventionally known various epoxy resins are used.
From the viewpoint of appropriate adhesiveness after heat curing, an epoxy resin having a weight average molecular weight of about 300 or more and about 2,000 or less is preferable, and an epoxy resin having a weight average molecular weight of 300 or more and 500 or less is more preferable. An epoxy resin obtained by blending a normal liquid epoxy resin having a weight average molecular weight of 330 or more and 400 or less and a normal solid epoxy resin having a weight average molecular weight of 400 or more and 2,000 or less (preferably 500 or more and 1,500 or less) is more preferable. The weight average molecular weight in the present specification is a standard polystyrene equivalent value measured by gel permeation chromatography (GPC).
The epoxy equivalent of the epoxy resin preferably used in the present embodiment is usually 50 to 5000 g / eq.
Specific examples of the epoxy resin in the present embodiment include glycidyl ethers of phenols (eg, bisphenol A, bisphenol F, resorcinol, phenyl novolac, cresol novolac, etc.), alcohols (eg, butanediol, polyethylene) Glycidyl ethers of glycols and polypropylene glycols, glycidyl ethers of carboxylic acids (eg, phthalic acid, isophthalic acid, tetrahydrophthalic acid, etc.), epoxy resins of glycidyl type or alkyl glycidyl type (eg, nitrogen atoms such as aniline isocyanurate) And glycidyl group-substituted epoxy resins), as well as so-called alicyclic epoxides and the like.
Alicyclic epoxides include, for example, resins into which an epoxy is introduced by, for example, oxidizing a carbon-carbon double bond in the molecule, and specifically, for example, vinylcyclohexane diepoxide, 3,4-epoxy Examples include cyclohexylmethyl-3,4-dicyclohexanecarboxylate, and 2- (3,4-epoxy) cyclohexyl-5,5-spiro (3,4-epoxy) cyclohexane-m-dioxane and the like.
Moreover, as an epoxy resin in this embodiment, a biphenyl type epoxy resin and a naphthalene type epoxy resin are mentioned.
In addition, as the epoxy resin in the present embodiment, a dicyclopentadiene skeleton-containing epoxy resin having a dicyclopentadiene skeleton and a reactive epoxy group in the molecule may be used.
These epoxy resins can be used singly or in combination of two or more. For example, as one aspect of the epoxy resin in the present embodiment, an aspect in which a glycidyl ether of bisphenol A (bisphenol A type epoxy resin), a biphenyl type epoxy resin, and a naphthalene type epoxy resin are used in combination can be mentioned.

When a thermosetting resin is an epoxy resin, a hardening agent will not be specifically limited if it is a hardening agent which has the function to harden | cure an epoxy resin. Examples of the curing agent for epoxy resin include at least one curing agent selected from the group consisting of phenolic curing agents, amine curing agents, dicyandiamide curing agents, and acid anhydride curing agents. Further, as a curing agent for epoxy resin, for example, a heat-activated latent epoxy resin curing agent is preferable. The thermally activated latent epoxy resin curing agent is a type of curing agent that does not react with the epoxy resin at room temperature, is activated by heating above a certain temperature, and reacts with the epoxy resin.
The curing agent can be used singly or in combination of two or more.

The following methods (a) to (d) may be mentioned as methods for activating the heat-activated latent epoxy resin curing agent.
(A) “Method for producing active species (anion, cation) by chemical reaction by heating”
(B) “Method of compatibilizing and dissolving with epoxy resin at high temperature and initiating curing reaction” (in this method, the heat-activated latent epoxy resin curing agent is stabilized in the epoxy resin at around room temperature) It is dispersed.)
(C) "Method of eluting the curing agent with molecular sieve encapsulation type at high temperature to start curing reaction"
(D) “Microcapsule method”

  These heat-activated latent epoxy resin curing agents can be used singly or in combination of two or more. Among the above-mentioned heat-activated latent epoxy resin curing agents, dicyandiamide, an imidazole compound, or a mixture thereof is more preferable.

  The curing agent as described above is preferably used in a proportion of usually 0.1 parts by mass or more and 20 parts by mass or less, more preferably 0.5 parts by mass or more and 15 parts by mass or less with respect to 100 parts by mass of the epoxy resin. The ratio is more preferably 1 part by mass or more and 10 parts by mass or less.

  The resin composition preferably contains the thermosetting component in an amount of 1% by mass or more and 30% by mass or less, and more preferably 2% by mass or more and 20% by mass or less, based on the total amount of the resin composition. preferable.

(Thermoplastic resin)
The thermoplastic resin is not particularly limited. The thermoplastic resin is preferably at least one resin selected from the group consisting of, for example, phenoxy resin, acrylic resin, methacrylic resin, polyester resin, and urethane resin, and is more preferably phenoxy resin. A thermoplastic resin can be used individually by 1 type or in combination of 2 or more types.
The weight average molecular weight of the thermoplastic resin is preferably 8000 or more and 150000 or less, more preferably 10000 or more and 100000 or less, and still more preferably 20000 or more and 80000 or less.
The phenoxy resin is preferably a phenoxy resin having at least one skeleton selected from the group consisting of a bisphenol A skeleton, a bisphenol F skeleton, a biphenyl skeleton, and a naphthalene skeleton, and has a bisphenol A skeleton and a bisphenol F skeleton. It is more preferable that it is a phenoxy resin.
The content of the thermoplastic resin in the resin composition is preferably 1% by mass to 30% by mass, and more preferably 2% by mass to 20% by mass, based on the total amount of the resin composition.

(Filler)
The filler is preferably an inorganic filler. Examples of the material of the inorganic filler include silica, alumina, talc, calcium carbonate, titanium white, bengala, silicon carbide, and boron nitride. The shape of the inorganic filler may be powdery, spherical, granular, plate-like, needle-like, and fibrous. In addition, as an inorganic filler, glass fiber etc. are mentioned.
Among these fillers, silica fillers are preferable.
The fillers may be used alone or in combination of two or more.
The content of the filler in the resin composition is preferably 5% by mass or more and 75% by mass or less, and more preferably 10% by mass or more and 70% by mass or less, based on the total amount of the resin composition.

As an example of the resin composition which concerns on this embodiment, the resin composition which contains only a thermosetting component, a thermoplastic resin, a filler, and a triazine compound is mentioned.
Moreover, as another example of the resin composition which concerns on this embodiment, the resin composition containing a thermosetting component, a thermoplastic resin, a filler, a triazine compound, and another component is mentioned as follows.

(Other ingredients)
In the present embodiment, the resin composition may further contain other components.
As other components, a coupling agent etc. are mentioned, for example.
The coupling agent preferably has a group that reacts with the above-described thermoplastic resin or the functional group of the thermosetting component, and more preferably has a group that reacts with the functional group of the thermosetting component.

  The coupling agent is considered that the organic functional group in the coupling agent reacts with the thermosetting component (preferably an epoxy resin) during the curing reaction, and the adhesiveness and adhesion are improved without impairing the heat resistance of the cured product. The water resistance (wet heat resistance) is also improved.

  As a coupling agent, a silane type (silane coupling agent) is preferable from the versatility, cost merit, etc. of the coupling agent. In addition, the coupling agent as described above is usually blended in a ratio of 0.1 parts by mass or more and 20 parts by mass or less, preferably 0.3 parts by mass or more, with respect to 100 parts by mass of the thermosetting component. It mix | blends in the ratio of mass part or less, More preferably, it mix | blends in the ratio of 0.5 mass part or more and 10 mass parts or less.

  The resin composition may further contain a crosslinking agent (e.g., an organic polyvalent isocyanate compound, an organic polyvalent imine compound, etc.) in order to control initial adhesion before curing and cohesion.

  Examples of the organic polyvalent isocyanate compound include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, and trimers of these polyvalent polyisocyanate compounds, And terminal isocyanate urethane prepolymers obtained by reacting these polyvalent isocyanate compounds with polyol compounds. More specific examples of the organic polyvalent isocyanate compound include, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate Isocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4 Examples include '-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, and lysine isocyanate.

  Specific examples of the organic polyhydric imine compound include, for example, N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri-β-aziridinyl propionate, Examples thereof include tetramethylolmethane-tri-β-aziridinyl propionate, and N, N′-toluene-2,4-bis (1-aziridine carboxamide) triethylenemelamine. The crosslinking agent as described above is generally blended in a ratio of 0.1 parts by mass or more and 20 parts by mass or less, preferably 0.2 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the above-mentioned thermoplastic resin It is blended in the ratio of

Another example of the resin composition according to the present embodiment includes the triazine compound according to the first aspect or the second aspect, a thermosetting component, a thermoplastic resin, and a filler, As a thermosetting component, the resin composition containing an epoxy resin and a hardening | curing agent is mentioned.
Another example of the resin composition according to the present embodiment includes the triazine compound according to the first aspect or the second aspect, a thermosetting component, a thermoplastic resin, and a filler, As a thermoplastic resin, the resin composition containing a phenoxy resin is mentioned.
Another example of the resin composition according to the present embodiment includes the triazine compound according to the first aspect or the second aspect, a thermosetting component, a thermoplastic resin, and a filler, As a thermosetting component, the resin composition which contains an epoxy resin and a hardening | curing agent and contains a phenoxy resin as a thermoplastic resin is mentioned.

  It is preferable that the resin composition concerning this embodiment is used for a power semiconductor element. The resin composition according to the present embodiment is more preferably used in a power semiconductor device using at least one of silicon nitride and gallium nitride.

[Resin sheet]
The resin sheet according to the present embodiment contains the resin composition according to the present embodiment.
The resin sheet according to the present embodiment can be obtained by forming the resin composition according to the present embodiment into a sheet. The method for forming the resin composition into a sheet can be a conventionally known method for forming a sheet, and is not particularly limited. The resin sheet according to the present embodiment may be a long sheet, or may be provided in a rolled-up state. The resin sheet according to the present embodiment taken up in a roll shape can be used by being unrolled from a roll and cut into a desired size.

  The thickness of the resin sheet according to the present embodiment is, for example, preferably 10 μm or more, and more preferably 20 μm or more. The thickness is preferably 500 μm or less, more preferably 400 μm or less, and still more preferably 300 μm or less.

[Laminate]

The cross-sectional schematic of the laminated body 1 which concerns on this embodiment is shown by FIG.
The laminate 1 of the present embodiment has a first release material 2, a second release material 4, and a resin sheet 3 provided between the first release material 2 and the second release material 4. The resin sheet 3 contains the resin composition according to the present embodiment.

The first peeling material 2 and the second peeling material 4 have peeling properties, and there is a difference between the peeling force of the first peeling material 2 to the resin sheet 3 and the peeling force of the second peeling material 4 to the resin sheet 3 Is preferred. The materials of the first release material 2 and the second release material 4 are not particularly limited. The first release material 2 and the second release material 4 may be, for example, a member to which release treatment itself is applied, a member to which release treatment has been applied, or a member to which a release agent layer is laminated, etc. . Specifically, when the first release material 2 and the second release material 4 are not subjected to release treatment, the material of the first release material 2 and the second release material 4 is, for example, an olefin resin, And fluorine resins.
The first release material 2 and the second release material 4 can be release materials including a release substrate and a release agent layer formed by applying a release agent on the release substrate. Handling is facilitated by using a release material provided with a release substrate and a release agent layer. Moreover, the 1st peeling material 2 and the 2nd peeling material 4 may be equipped with the release agent layer only in the single side | surface of a peeling base material, and may be equipped with the peeling agent layer on both surfaces of a peeling base material.

  Examples of the release substrate include a paper substrate, a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on the paper substrate, and a plastic film. Examples of the paper base include glassine paper, coated paper, cast coated paper and the like. Examples of the plastic film include polyester films (for example, polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate), and polyolefin films (for example, polypropylene and polyethylene). Among these, polyester films are preferred.

  As the release agent, for example, a silicone-based release agent composed of a silicone resin; a polyvinyl carbamate, and a long chain alkyl group-containing compound based release agent composed of a compound containing a long chain alkyl group such as an alkylurea derivative; Alkyd resin-based release agents composed of resins (eg, non-convertible alkyd resins, and convertible alkyd resins, etc.); olefin resins (eg, polyethylene (eg, high density polyethylene, low density polyethylene, and linear low density) Olefin resin release agent composed of polyethylene etc.), propylene homopolymer having isotactic structure or syndiotactic structure, and crystalline polypropylene resin such as propylene-α-olefin copolymer, etc .; Natural rubber And synthetic rubbers (eg, butadiene rubber, isoprene rubber) Rubber-based release agents composed of rubbers such as styrene-butadiene rubber, methyl methacrylate-butadiene rubber, acrylonitrile-butadiene rubber, etc .; and acrylics composed of acrylic resins such as (meth) acrylic acid ester copolymers Various release agents such as resin-based release agents can be mentioned, and these can be used singly or in combination of two or more. Among these, silicone-based release agents or alkyd resin-based release agents are preferable. Further, it is preferable to use different release agents for the first release material and the second release material.

The thicknesses of the first release material 2 and the second release material 4 are not particularly limited. Usually, it is preferably 1 μm to 500 μm, and more preferably 3 μm to 100 μm.
The thickness of the release agent layer is not particularly limited. When the release agent layer is formed by applying a solution containing a release agent, the thickness of the release agent layer is preferably 0.01 μm or more and 3 μm or less, and more preferably 0.03 μm or more and 1 μm or less.

  The method for producing the laminate 1 is not particularly limited. For example, the laminate 1 is manufactured through the following steps. First, the resin composition is applied onto the first release material 2 to form a coating film. Next, the coated film is dried to form the resin sheet 3. Next, the laminated body 1 is obtained by bonding the resin sheet 3 and the 2nd peeling material 4 together at normal temperature.

[Semiconductor device]
The semiconductor device according to the present embodiment includes the semiconductor element sealed with the resin composition or the resin sheet according to the present embodiment.
The sealing of the semiconductor element using the resin sheet of the present embodiment can be performed, for example, as follows. The resin sheet is placed to cover the semiconductor element, and the semiconductor element is sealed by pressure bonding using a vacuum laminating method.
When using the layered product 1 of this embodiment, after exfoliating one exfoliation material of layered product 1, a resin sheet is laid so that a semiconductor element may be covered. Thereafter, the other release material is removed. Thereafter, the semiconductor element is sealed by pressure bonding using a vacuum laminating method.

  According to the resin composition and the resin sheet according to the present embodiment, it is possible to reduce the water absorption rate and to improve the adhesive strength. By using the resin composition and the resin sheet according to the present embodiment, the semiconductor element can be sealed by the sealing resin layer having a low water absorption, and the adhesive strength between the semiconductor element and the sealing resin layer is improved. be able to. The resin composition and the resin sheet according to the present embodiment can be suitably used for a power semiconductor device, particularly a power semiconductor device using at least one of silicon nitride and gallium nitride.

[Modification of the embodiment]
The present invention is not limited to the above-described embodiment, but includes modifications and improvements as long as the object of the present invention can be achieved.

  Although the said embodiment demonstrated the laminated body 1 which has the resin sheet 3 provided between the 1st peeling material 2, the 2nd peeling material 4, and the 1st peeling material 2 and the 2nd peeling material 4, As another embodiment, it may be a laminate having a release material only on one side of the resin sheet.

  Although the said embodiment demonstrated the semiconductor sealing use, the resin composition of this invention, and the resin sheet of this invention are also the insulating materials for circuit boards (for example, hard printed wiring board material, the material for flexible wiring boards, and, It can be used as an interlayer insulating material for a buildup substrate, etc., an adhesive film for a buildup, and an adhesive.

  Hereinafter, the present invention will be described in more detail by way of examples. The present invention is not limited to these examples.

-Preparation of resin composition The material used for preparation of the resin composition is as follows.

(Thermoplastic resin)
Phenoxy resin: bisphenol A / bisphenol F skeleton mixed type (weight average molecular weight = 60000 to 70000)

(Thermosetting component)
-Epoxy resin Liquid bisphenol A epoxy resin (epoxy equivalent: 189 g / eq)
Biphenyl type epoxy resin (epoxy equivalent: 272 g / eq, softening point: 52 ° C.)
Naphthalene type epoxy resin (epoxy equivalent: 165 g / eq, softening point: 92 ° C.)
Hardening agent Biphenyl type phenol resin (functional group equivalent: 218 g / eq, softening point: 82 ° C.)
2-ethyl-4-methylimidazole

(Filler)
Silica filler: SC-2050MA (average particle size: 0.5 μm) manufactured by Admatex Co., Ltd.

(Triazine compound)
Hydroxyl group-containing triazine compound: manufactured by Shikoku Kasei Co., Ltd. VD-4 (melting point: 97 ° C, 5% weight loss temperature: 243 ° C)
Trimethoxysilyl group-containing triazine compound: VD-5 (melting point 171 ° C, 5% weight loss temperature: 229 ° C) manufactured by Shikoku Kasei Co., Ltd.

  Resin compositions according to Examples 1 to 6 and Comparative Example 1 were prepared at the mixing ratios shown in Table 1.

Curing Conditions of Resin Composition The prepared resin composition was heated at 100 ° C. for 30 minutes and further heated at 180 ° C. for 30 minutes to obtain a resin cured product.

[Peeling strength]
It measured on condition of the following using the tension tester made from Shimadzu Corporation (apparatus name: autograph AG-IS).
In the sample used for measurement of peel strength, first, the resin composition is attached to the surface of a silicon chip (12 mm × 12 mm), and a copper foil (JIS H3100 C1100P, 0.15 mm × 10 mm × 50 mm) is attached to the resin composition. The resin composition was cured under the above-mentioned curing conditions.
Sample configuration: Copper foil / hardened resin / silicon chip Peeling speed: 50 mm / min Peeling angle: 90 degrees Temperature: 23 ° C
Humidity: 50% RH

[Water absorption rate]
The weight of the cured resin after the test of JEDEC Lv. 1 (85 ° C., 85% RH, 168 hours) is b, and the weight of the cured resin of the initial (before the test) is a. Unit:%) was calculated.
Water absorption rate = {(b-a) / a} x 100

Table 1 shows the evaluation results of peel strength and water absorption.
The resin compositions according to Examples 1 to 6 were able to reduce the water absorption and improve the peel strength as compared with the resin composition according to Comparative Example 1.

  DESCRIPTION OF SYMBOLS 1 ... Laminated body, 2 ... 1st peeling material, 3 ... Resin sheet, 4 ... 2nd peeling material.

Claims (14)

Containing a thermosetting component, a thermoplastic resin, a filler, and a triazine compound,
The said triazine compound is represented by following General formula (1). The resin composition characterized by the above-mentioned.

(In the general formula (1),
R ₁ is a hydrogen atom or an alkyl group,
R ₂ is a hydrogen atom or an alkyl group,
X is a group containing at least one selected from the group consisting of an alkyl group, a phenyl group, a hydroxyl group, an alkoxy group, and an alkoxysilyl group. ) In the resin composition according to claim 1,
R ₁ and R ₂ are hydrogen atoms,
A resin composition characterized in that X is a group containing an alkoxysilyl group. In the resin composition according to claim 1,
R ₁ and R ₂ are alkyl groups,
A resin composition characterized in that X is a group containing a hydroxyl group. In the resin composition according to claim 1,
The said triazine compound is represented by following General formula (2). The resin composition characterized by the above-mentioned.

(In the general formula (2),
R ₁ is a hydrogen atom or an alkyl group,
R ₂ is a hydrogen atom or an alkyl group,
R ₃ is at least one group selected from the group consisting of an alkyl group, a hydroxyl group, an alkoxy group, and an alkoxysilyl group,
n is an integer of 1 or more and 3 or less,
A plurality of R ₃ are identical to or different from one another;
L ₁ is a chain linking group containing at least one group selected from the group consisting of an alkylene group and an arylene group. ) In the resin composition according to claim 1,
The said triazine compound is represented by following General formula (3). The resin composition characterized by the above-mentioned.

(In the general formula (3),
R ₁ is a hydrogen atom or an alkyl group,
R ₂ is a hydrogen atom or an alkyl group,
R ₃ is a hydroxyl group or an alkoxysilyl group,
L ₂ is an organic chain having 1 to 8 carbon atoms. ) In the resin composition according to claim 4 or 5,
R ₁ and R ₂ are hydrogen atoms,
A resin composition characterized in that R ₃ is an alkoxysilyl group. In the resin composition according to claim 4 or 5,
R ₁ and R ₂ are alkyl groups,
R ₃ is a resin composition which is a hydroxyl group. The resin composition according to any one of claims 1 to 7,
A resin composition characterized in that the triazine compound is contained in an amount of 0.1% by mass or more and 15% by mass or less based on the total amount of the resin composition. The resin composition according to any one of claims 1 to 8.
The said thermosetting component contains an epoxy resin and a hardening | curing agent. The resin composition characterized by the above-mentioned. The resin composition according to any one of claims 1 to 9,
The resin composition, wherein the thermoplastic resin is a phenoxy resin. The resin composition according to any one of claims 1 to 10,
The said filler is a silica filler. The resin composition characterized by the above-mentioned.   The resin composition according to any one of claims 1 to 11, which is used for a power semiconductor device.   A resin sheet comprising the resin composition according to any one of claims 1 to 12.   A semiconductor device comprising the semiconductor element sealed with the resin sheet according to claim 13.

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