JPWO2017142020A1 - フラックス - Google Patents
フラックス Download PDFInfo
- Publication number
- JPWO2017142020A1 JPWO2017142020A1 JP2017536366A JP2017536366A JPWO2017142020A1 JP WO2017142020 A1 JPWO2017142020 A1 JP WO2017142020A1 JP 2017536366 A JP2017536366 A JP 2017536366A JP 2017536366 A JP2017536366 A JP 2017536366A JP WO2017142020 A1 JPWO2017142020 A1 JP WO2017142020A1
- Authority
- JP
- Japan
- Prior art keywords
- flux
- mass
- ethylenediamine
- solder
- bridge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/333—Polymers modified by chemical after-treatment with organic compounds containing nitrogen
- C08G65/33303—Polymers modified by chemical after-treatment with organic compounds containing nitrogen containing amino group
- C08G65/33306—Polymers modified by chemical after-treatment with organic compounds containing nitrogen containing amino group acyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
(1)ポリオキシアルキレンエチレンジアミンを15質量%以上35質量%以下、有機酸を2質量%以上15質量%以下、ベース材を10質量%以上30質量%以下、アミンを3質量%以上30質量%以下、溶剤を20質量%以上40質量%以下含有することを特徴とするフラックス。
本実施の形態のフラックスは、ポリオキシアルキレンエチレンジアミン、有機酸、ベース材、アミン及び溶剤を含有する。
本例では、フラックスに含まれる各組成の配合量を見極めるため、以下の表に示す組成で実施例と比較例のフラックスを調合して、次のようにブリッジ抑制評価を行った。
電極径が180μm、電極間が300μmピッチの基板に、以下の表に示す各実施例及び比較例の割合で調合したフラックスを塗布した(フラックス組成中の数字は質量%を示す)。なお、本実施例において、ポリオキシアルキレンエチレンジアミンとしてポリオキシプロピレンエチレンジアミンまたはポリオキシエチレンポリオキシプロピレンエチレンジアミンを選択して添加した。各実施例及び比較例のフラックスが塗布された基板に、合金組成がSn−3Ag−0.5Cuのはんだを用いた直径250μmのはんだボールを搭載し、ピーク温度240℃ではんだ付けした。実施例及び比較例のフラックスを塗布された後にはんだ付けされた各基板について、ブリッジが発生したかどうか評価した。
(B)判定基準
○:電極にブリッジが発生しなかった
×:電極にブリッジが1箇所以上発生した
(i)ポリオキシアルキレンエチレンジアミンを15質量%以上35質量%以下、有機酸を2質量%以上15質量%以下、ベース材を10質量%以上30質量%以下、アミンを3質量%以上30質量%以下、溶剤を20質量%以上40質量%以下含有するフラックスは、従来のフラックスでははんだのブリッジが生じてしまうほど狭小なピッチの電極に対しても、ブリッジを抑制することができる。
21C、31C はんだブリッジ
22A フラックス溜まり
Claims (2)
- ポリオキシアルキレンエチレンジアミンを15質量%以上35質量%以下、有機酸を2質量%以上15質量%以下、ベース材を10質量%以上30質量%以下、アミンを3質量%以上30質量%以下、溶剤を20質量%以上40質量%以下含有する
ことを特徴とするフラックス。
- 前記ポリオキシアルキレンエチレンジアミンは、
ポリオキシプロピレンエチレンジアミン、ポリオキシエチレンエチレンジアミン、ポリオキシメチルエチレンエチレンジアミン、又はポリオキシエチレンポリオキシプロピレンエチレンジアミンの少なくともいずれかである
ことを特徴とする請求項1に記載のフラックス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/054737 WO2017141404A1 (ja) | 2016-02-18 | 2016-02-18 | フラックス |
JPPCT/JP2016/054737 | 2016-02-18 | ||
PCT/JP2017/005713 WO2017142020A1 (ja) | 2016-02-18 | 2017-02-16 | フラックス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6222415B1 JP6222415B1 (ja) | 2017-11-01 |
JPWO2017142020A1 true JPWO2017142020A1 (ja) | 2018-02-22 |
Family
ID=59624910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017536366A Active JP6222415B1 (ja) | 2016-02-18 | 2017-02-16 | フラックス |
Country Status (7)
Country | Link |
---|---|
US (1) | US10583533B2 (ja) |
EP (1) | EP3417987B1 (ja) |
JP (1) | JP6222415B1 (ja) |
KR (1) | KR101935758B1 (ja) |
CN (1) | CN108698173B (ja) |
TW (2) | TW201800172A (ja) |
WO (2) | WO2017141404A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6274344B1 (ja) | 2017-05-25 | 2018-02-07 | 千住金属工業株式会社 | フラックス |
JP6583391B2 (ja) * | 2017-11-14 | 2019-10-02 | 千住金属工業株式会社 | フラックス、やに入りはんだおよびフラックスコートペレット |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3970238A (en) * | 1971-11-26 | 1976-07-20 | Lake Chemical Company | Soldering of stainless steels |
JPS518579A (en) | 1974-07-10 | 1976-01-23 | Matsushita Electric Works Ltd | Kairoshadankino hikihazushisochi |
US5851311A (en) | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
US6159304A (en) * | 1997-07-03 | 2000-12-12 | Matsushita Electric Industrial Co., Ltd. | Solder paste |
WO1999001251A1 (fr) * | 1997-07-03 | 1999-01-14 | Matsushita Electric Industrial Co., Ltd. | Pate a souder |
US6524398B2 (en) | 2000-04-13 | 2003-02-25 | Fry's Metals, Inc. | Low-residue, low-solder-ball flux |
US8431648B2 (en) * | 2006-03-31 | 2013-04-30 | Milliken & Company | Coated substrates and polymer dispersions suitable for use in making the same |
US20080156852A1 (en) * | 2006-12-29 | 2008-07-03 | Prakash Anna M | Solder flux composition and process of using same |
JP2011200887A (ja) * | 2010-03-24 | 2011-10-13 | Renesas Electronics Corp | はんだ付け用フラックスおよび、はんだ付け用フラックスを用いた半導体装置の製造方法 |
US10259083B2 (en) | 2013-09-12 | 2019-04-16 | Senju Metal Industry Co., Ltd. | Cleaning flux, cleaning solder paste, and solder joint |
CN104084713A (zh) * | 2014-06-20 | 2014-10-08 | 宁国新博能电子有限公司 | 一种用于铜线处理的免清洗助焊剂 |
-
2016
- 2016-02-18 WO PCT/JP2016/054737 patent/WO2017141404A1/ja active Application Filing
- 2016-08-08 TW TW105125128A patent/TW201800172A/zh unknown
-
2017
- 2017-02-16 CN CN201780011762.3A patent/CN108698173B/zh active Active
- 2017-02-16 WO PCT/JP2017/005713 patent/WO2017142020A1/ja active Application Filing
- 2017-02-16 JP JP2017536366A patent/JP6222415B1/ja active Active
- 2017-02-16 US US15/999,473 patent/US10583533B2/en active Active
- 2017-02-16 EP EP17753275.1A patent/EP3417987B1/en active Active
- 2017-02-16 KR KR1020187026557A patent/KR101935758B1/ko active IP Right Grant
- 2017-07-12 TW TW106123307A patent/TWI659054B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP3417987A1 (en) | 2018-12-26 |
KR101935758B1 (ko) | 2019-01-04 |
CN108698173A (zh) | 2018-10-23 |
TW201800172A (zh) | 2018-01-01 |
KR20180105728A (ko) | 2018-09-28 |
JP6222415B1 (ja) | 2017-11-01 |
TW201831577A (zh) | 2018-09-01 |
US20190210167A1 (en) | 2019-07-11 |
EP3417987A4 (en) | 2019-10-23 |
US10583533B2 (en) | 2020-03-10 |
WO2017141404A1 (ja) | 2017-08-24 |
CN108698173B (zh) | 2019-03-08 |
TWI659054B (zh) | 2019-05-11 |
EP3417987B1 (en) | 2021-12-29 |
WO2017142020A1 (ja) | 2017-08-24 |
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