JPWO2017085864A1 - 対基板作業機、および挿入方法 - Google Patents
対基板作業機、および挿入方法 Download PDFInfo
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- JPWO2017085864A1 JPWO2017085864A1 JP2017551491A JP2017551491A JPWO2017085864A1 JP WO2017085864 A1 JPWO2017085864 A1 JP WO2017085864A1 JP 2017551491 A JP2017551491 A JP 2017551491A JP 2017551491 A JP2017551491 A JP 2017551491A JP WO2017085864 A1 JPWO2017085864 A1 JP WO2017085864A1
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- Prior art keywords
- lead
- component
- hole
- leads
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 238000012966 insertion method Methods 0.000 title claims description 7
- 238000003384 imaging method Methods 0.000 claims abstract description 26
- 238000012423 maintenance Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 description 31
- 230000037431 insertion Effects 0.000 description 31
- 230000007246 mechanism Effects 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 238000005286 illumination Methods 0.000 description 7
- 210000000078 claw Anatomy 0.000 description 6
- WABPQHHGFIMREM-BKFZFHPZSA-N lead-212 Chemical compound [212Pb] WABPQHHGFIMREM-BKFZFHPZSA-N 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- 235000014676 Phragmites communis Nutrition 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WABPQHHGFIMREM-NOHWODKXSA-N lead-200 Chemical compound [200Pb] WABPQHHGFIMREM-NOHWODKXSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0421—Feeding with belts or tapes with treatment of the terminal leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
図1に、部品実装機10を示す。部品実装機10は、回路基材12に対する部品の実装作業を実行するための装置である。部品実装機10は、装置本体20、基材搬送保持装置22、部品装着装置24、マークカメラ26、パーツカメラ28、部品供給装置30、ばら部品供給装置32、カットアンドクリンチ装置(図7参照)34、制御装置(図11参照)36を備えている。なお、回路基材12として、回路基板、三次元構造の基材等が挙げられ、回路基板として、プリント配線板、プリント回路板等が挙げられる。
部品実装機10では、上述した構成によって、基材搬送保持装置22に保持された回路基材12に対して部品の装着作業が行われる。部品実装機10では、種々の部品を回路基材12に装着することが可能であるが、リード部品を回路基材12に装着する場合について、以下に説明する。
Claims (5)
- 複数のリードを有するリード部品を保持する保持具と、
前記保持具を移動させる移動装置と、
前記保持具に保持されたリード部品を撮像する撮像装置と、
前記移動装置の作動を制御する制御装置と
を備え、
前記制御装置が、
前記撮像装置によるリード部品の撮像データに基づいて、前記移動装置の作動を制御することで、前記保持具に保持されたリード部品の複数のリードを、先端が基板の近くに位置する順番で、その基板に形成された貫通穴に挿入させることを特徴とする対基板作業機。 - 前記保持具が、リード部品の部品本体部を保持することを特徴とする請求項1に記載の対基板作業機。
- 前記撮像装置が、
前記保持具に保持されたリード部品を下降させつつ撮像することを特徴とする請求項1または請求項2に記載の対基板作業機。 - 前記保持具に保持されるリード部品の複数のリードが、予め異なる長さに切断されていることを特徴とする請求項1ないし請求項3のいずれか1つに記載の対基板作業機。
- 複数のリードを有するリード部品を保持する保持具と、前記保持具を移動させる移動装置とを備えた対基板作業機において、前記保持具により保持されたリード部品のリードを基板の貫通穴に挿入する挿入方法であって、
前記保持具に保持されたリード部品の複数のリードを、先端が前記基板の近くに位置する順番で、その基板に形成された貫通穴に挿入させることを特徴とする挿入方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/082696 WO2017085864A1 (ja) | 2015-11-20 | 2015-11-20 | 対基板作業機、および挿入方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2017085864A1 true JPWO2017085864A1 (ja) | 2018-09-06 |
Family
ID=58719213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017551491A Pending JPWO2017085864A1 (ja) | 2015-11-20 | 2015-11-20 | 対基板作業機、および挿入方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11304350B2 (ja) |
EP (1) | EP3379912A4 (ja) |
JP (1) | JPWO2017085864A1 (ja) |
CN (1) | CN108283026A (ja) |
WO (1) | WO2017085864A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10813259B2 (en) * | 2015-11-18 | 2020-10-20 | Fuji Corporation | Board work machine and insertion method |
CN108580709B (zh) * | 2018-04-02 | 2023-06-23 | 广东钺河智能科技有限公司 | 一种编码器全自动组装机 |
JP7095109B2 (ja) * | 2018-11-05 | 2022-07-04 | 株式会社Fuji | 作業機、および演算方法 |
EP4025031A4 (en) * | 2019-08-30 | 2022-09-07 | Fuji Corporation | WORK MACHINE |
CN111405842B (zh) * | 2020-05-15 | 2020-10-30 | 大连日佳电子有限公司 | 一种三引脚电子元器件的引脚自适应定位插装方法及系统 |
TWI776229B (zh) * | 2020-09-08 | 2022-09-01 | 台達電子工業股份有限公司 | 自動插件設備 |
CN114158249B (zh) * | 2020-09-08 | 2024-04-26 | 台达电子工业股份有限公司 | 自动插件设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5784129A (en) * | 1980-11-14 | 1982-05-26 | Nippon Electric Co | Method of cutting lead wire of electronic part |
JPH06244595A (ja) * | 1993-02-18 | 1994-09-02 | Fuji Mach Mfg Co Ltd | 電子部品装着装置 |
JPH0758498A (ja) * | 1993-08-16 | 1995-03-03 | Tdk Corp | 電子部品の挿入方法及び装置 |
WO2015029209A1 (ja) * | 2013-08-30 | 2015-03-05 | ヤマハ発動機株式会社 | 部品実装装置、その制御方法および部品実装装置用プログラム |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US250815A (en) * | 1881-12-13 | Cable-railway gripe | ||
JPS56118391A (en) * | 1980-02-25 | 1981-09-17 | Hitachi Ltd | Method and device for inserting electronic part |
JP3387881B2 (ja) * | 1999-03-17 | 2003-03-17 | ティーディーケイ株式会社 | 電子部品挿入ヘッドおよび電子部品挿入装置 |
JP2002271093A (ja) * | 2001-03-07 | 2002-09-20 | Fuji Mach Mfg Co Ltd | 電気部品装着システム |
US7405433B2 (en) * | 2005-02-22 | 2008-07-29 | Avago Technologies Ecbu Ip Pte Ltd | Semiconductor light emitting device |
CN102625577A (zh) * | 2011-01-30 | 2012-08-01 | 比亚迪股份有限公司 | 电子元器件的定位装置、定位方法以及电子设备 |
JP6019409B2 (ja) | 2013-11-13 | 2016-11-02 | パナソニックIpマネジメント株式会社 | 電子部品実装装置及び電子部品実装方法 |
CN104661511B (zh) * | 2015-02-03 | 2017-11-07 | 深圳市北美通科技有限公司 | 一种自动插件方法 |
-
2015
- 2015-11-20 US US15/776,259 patent/US11304350B2/en active Active
- 2015-11-20 EP EP15908804.6A patent/EP3379912A4/en active Pending
- 2015-11-20 JP JP2017551491A patent/JPWO2017085864A1/ja active Pending
- 2015-11-20 CN CN201580084685.5A patent/CN108283026A/zh active Pending
- 2015-11-20 WO PCT/JP2015/082696 patent/WO2017085864A1/ja active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5784129A (en) * | 1980-11-14 | 1982-05-26 | Nippon Electric Co | Method of cutting lead wire of electronic part |
JPH06244595A (ja) * | 1993-02-18 | 1994-09-02 | Fuji Mach Mfg Co Ltd | 電子部品装着装置 |
JPH0758498A (ja) * | 1993-08-16 | 1995-03-03 | Tdk Corp | 電子部品の挿入方法及び装置 |
WO2015029209A1 (ja) * | 2013-08-30 | 2015-03-05 | ヤマハ発動機株式会社 | 部品実装装置、その制御方法および部品実装装置用プログラム |
Also Published As
Publication number | Publication date |
---|---|
EP3379912A4 (en) | 2018-11-14 |
WO2017085864A1 (ja) | 2017-05-26 |
US11304350B2 (en) | 2022-04-12 |
CN108283026A (zh) | 2018-07-13 |
US20190269051A1 (en) | 2019-08-29 |
EP3379912A1 (en) | 2018-09-26 |
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