JPWO2017006392A1 - Light emitting device - Google Patents

Abstract

The light emitting unit (140) is formed on the substrate (100) and includes a first electrode (110), an organic layer (120), and a second electrode (130). The organic layer (120) is located between the first electrode (110) and the second electrode (130). The plurality of first terminals (112) are formed on the substrate (100), and all of them are electrically connected to the first electrode (110). The plurality of second terminals (132) are formed on the substrate (100), and all of them are electrically connected to the second electrode (130). The first wiring (210) is disposed on the substrate (100) and is electrically connected to the plurality of first terminals (112). The second wiring (220) is disposed on the substrate (100) and is electrically connected to the plurality of second terminals (132). And the part located in the same surface of the board | substrate (100) among the 1st wiring (210) and the 2nd wiring (220) does not mutually overlap.

Description

  The present invention relates to a light emitting device.

  In recent years, a light emitting device having an organic EL (Organic Electroluminescence) element in a light emitting portion has been developed. The organic EL element has a configuration in which an organic layer is sandwiched between a first electrode and a second electrode. In order to cause the organic layer to emit light, it is necessary to apply a voltage between the first electrode and the second electrode. For this purpose, it is necessary to provide the light emitting device with a first terminal electrically connected to the first electrode and a second terminal electrically connected to the second electrode.

  When the light emitting portion has a certain area, there is a possibility that in-plane distribution occurs in the luminance of the light emitting portion due to the resistance of the electrode. In order to suppress this in-plane distribution, for example, a plurality of first terminals are provided by providing a first terminal for each side of a rectangular light emitting section, and the plurality of first terminals are different from each other of the first electrodes. Preferably, a plurality of second terminals are provided, and the plurality of second terminals are connected to different portions of the second electrode. On the other hand, in order to connect the plurality of first terminals and the plurality of second terminals to the control unit of the light emitting device, each of the plurality of first terminals is connected to a lead wiring or the like, and each of the plurality of second terminals is connected. It is necessary to connect lead wiring to the cable. In this case, a plurality of first terminals and second terminals are formed in the light emitting device, and the number of lead wires and the like increases, so that the work for connecting the control unit and the lead wires becomes complicated, and the light emitting device It will be complicated.

  On the other hand, Patent Document 1 describes that the second terminals are arranged at four corners of a rectangular substrate and the first terminals are arranged at portions along the side of the substrate. In Patent Document 1, the terminals respectively installed at the four corners are connected to each other via the second conductive layer formed on the light emitting part, and the terminals respectively installed on the four sides are also formed on the light emitting part. The first conductive layers are connected to each other. The first metal layer and the second metal layer are, for example, a metal sheet having a thickness of 1 μm to 1 mm, or a sputtered film. Note that an insulating layer is formed between the first conductive layer and the second conductive layer in a region overlapping with the light emitting portion.

  In Patent Document 2, in a display device having an EL light emitting layer in a pixel, a plurality of first terminals are arranged along the first side of the substrate, and a plurality of second terminals are arranged along the second side of the substrate. It is described that the plurality of first terminals are arranged in a zigzag pattern, and the plurality of second terminals are arranged in a zigzag pattern.

JP 2011-96374 A JP 2002-334777 A

  As described above, when the light emitting unit has a certain area, the connection structure for connecting the control unit of the light emitting unit and the light emitting unit is simplified while preventing in-plane distribution in the luminance of the light emitting unit. Difficult to do. In the method described in Patent Document 1, it is necessary to add a film forming process in order to form the first conductive layer, the insulating layer, and the second conductive layer. One of the objects of the present invention is to provide a novel structure capable of satisfying these two.

The invention according to claim 1 is a substrate;
A light emitting unit formed on the substrate and having a first electrode, a second electrode, and an organic layer located between the first electrode and the second electrode;
A plurality of first terminals formed on the substrate and electrically connected to the first electrode;
A plurality of second terminals formed on the substrate and electrically connected to the second electrode;
A first wiring disposed on the substrate and connected to the plurality of first terminals;
A second wiring disposed on the substrate and connected to the plurality of second terminals;
With
Portions of the first wiring and the second wiring that are located on the same surface of the substrate are light emitting devices that do not overlap each other.

  The above-described object and other objects, features, and advantages will become more apparent from the preferred embodiments described below and the accompanying drawings.

It is a top view which shows the structure of the light-emitting device which concerns on embodiment. It is a figure which shows the state which attached the 1st wiring and the 2nd wiring to the light-emitting device. It is the figure which removed the sealing part from FIG. It is the figure which removed the 2nd electrode from FIG. It is the figure which removed the insulating layer and the organic layer from FIG. It is a top view which shows the modification of FIG. 6 is a plan view showing a configuration of a light emitting device according to Modification Example 1. FIG. It is AA sectional drawing of FIG. It is the figure which attached the 1st wiring and the 2nd wiring to the light-emitting device shown in FIG. 12 is a plan view showing a configuration of a light emitting device according to Modification 2. FIG. It is the figure which looked at the light-emitting device shown in FIG. 10 from the light-emitting surface side. FIG. 11 is a diagram in which a second wiring and a first terminal region 212 are added to FIG. It is the figure which added the 1st wiring to FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a plan view showing a configuration of a light emitting device 10 according to the embodiment. FIG. 2 is a diagram illustrating a state in which the first wiring 210 and the second wiring 220 are attached to the light emitting device 10. FIG. 3 is a view in which the sealing portion 160 is removed from FIG. FIG. 4 is a view in which the second electrode 130 is removed from FIG. FIG. 5 is a diagram in which the insulating layer 150 and the organic layer 120 are removed from FIG.

  The light emitting device 10 according to this embodiment includes a substrate 100, a light emitting unit 140, a plurality of first terminals 112, a plurality of second terminals 132, a first wiring 210, and a second wiring 220. The light emitting unit 140 is formed on the substrate 100 and includes a first electrode 110, an organic layer 120, and a second electrode 130. The organic layer 120 is located between the first electrode 110 and the second electrode 130. The plurality of first terminals 112 are formed on the substrate 100, and all of the first terminals 112 are electrically connected to the first electrode 110. The plurality of second terminals 132 are formed on the substrate 100, and all of them are electrically connected to the second electrode 130. The first wiring 210 is disposed on the substrate 100 and is electrically connected to the plurality of first terminals 112. The second wiring 220 is disposed on the substrate 100 and is electrically connected to the plurality of second terminals 132. And the part located in the same surface of the board | substrate 100 among the 1st wiring 210 and the 2nd wiring 220 does not mutually overlap. Details will be described below.

When the light-emitting device 10 is a bottom emission type described later, the substrate 100 is formed of a light-transmitting material such as glass or a light-transmitting resin. However, when the light emitting device 10 is a top emission type described later, the substrate 100 may be formed of a material that does not have translucency. The substrate 100 is, for example, a polygon such as a rectangle. Here, the substrate 100 may have flexibility. In the case where the substrate 100 has flexibility, the thickness of the substrate 100 is, for example, not less than 10 μm and not more than 1000 μm. In particular, when the substrate 100 is made of a glass material and has flexibility, the thickness of the substrate 100 is, for example, 200 μm or less. In the case where the substrate 100 is made of a resin material and is flexible, the material of the substrate 100 includes, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. Is formed. In the case where the substrate 100 includes a resin material, an inorganic barrier film such as SiN _x or SiON is formed on at least the light emitting surface (preferably both surfaces) of the substrate 100 in order to suppress moisture from passing through the substrate 100. ing.

  The planar shape of the substrate 100 is a polygon, for example, a rectangle. However, the planar shape of the substrate 100 may be a circle or an ellipse. In the example shown in each figure, the substrate 100 is rectangular.

  A light emitting unit 140 is formed on the substrate 100. The light emitting unit 140 is a surface light source and has a structure for generating light emission, for example, an organic EL element. This organic EL element has a configuration in which a first electrode 110, an organic layer 120, and a second electrode 130 are laminated in this order.

  The first electrode 110 is a transparent electrode having optical transparency. The transparent conductive material constituting the transparent electrode is a metal-containing material, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). is there. The thickness of the first electrode 110 is, for example, not less than 10 nm and not more than 500 nm. The first electrode 110 is formed using, for example, a sputtering method or a vapor deposition method. The first electrode 110 may be a carbon nanotube or a conductive organic material such as PEDOT / PSS.

  The second electrode 130 is made of, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In or an alloy of a metal selected from the first group. Contains a metal layer. In this case, the second electrode 130 has a light shielding property. The thickness of the second electrode 130 is, for example, not less than 10 nm and not more than 500 nm. However, the second electrode 130 may be formed using the material exemplified as the material of the first electrode 110. The second electrode 130 is formed using, for example, a sputtering method or a vapor deposition method.

  Note that the materials of the first electrode 110 and the second electrode 130 described above are used when light is transmitted through the substrate 100, that is, when light emission from the light emitting device 10 is performed through the substrate 100 (that is, bottom emission type). It is an example. In other cases, light may pass through the side opposite to the substrate 100. That is, the light emission from the light emitting device 10 is performed without passing through the substrate 100 (top emission type). In the top emission type, one of two types of stacked structures of a reverse product type and a forward product type can be adopted. In the reverse product type, the material of the first electrode 110 and the material of the second electrode 130 are opposite to those of the bottom emission type. That is, the material of the second electrode 130 is used as the material of the first electrode 110, and the material of the first electrode 110 is used as the material of the second electrode 130. On the other hand, in the sequential product type, the material of the first electrode 110 is formed on the material of the second electrode 130, the organic layer 120 is further formed thereon, and the second electrode 130 is further formed thinly thereon. Thus, the light is extracted from the side opposite to the substrate 100. The material for forming the thin film is, for example, the material exemplified as the material of the second electrode 130 or an MgAg alloy. When the second electrode 130 is formed of Al or Ag, the thickness of the second electrode 130 is preferably 30 nm or less. The light emitting device 10 according to the present embodiment may be of any structure of a bottom emission type and the two types of top emission types described above.

  The organic layer 120 has a configuration in which, for example, a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 120 may be formed by a vapor deposition method. In addition, at least one layer of the organic layer 120, for example, a layer in contact with the first electrode 110, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 are formed by vapor deposition. Moreover, all the layers of the organic layer 120 may be formed using the apply | coating method.

  The edge of the first electrode 110 is covered with an insulating layer 150. The insulating layer 150 is made of, for example, a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that becomes a light emitting region of the light emitting unit 140. By providing the insulating layer 150, it is possible to suppress a short circuit between the first electrode 110 and the second electrode 130 at the edge of the first electrode 110. The insulating layer 150 is formed by applying a resin material to be the insulating layer 150 and then exposing and developing the resin material. This step is performed, for example, after forming the first electrode 110 and before forming the organic layer 120.

  The light emitting unit 140 is sealed by the sealing unit 160. The sealing portion 160 is formed using, for example, a metal such as glass or aluminum, or a resin. The sealing portion 160 is a polygon or a circle similar to that of the substrate 100 and has a shape in which a recess is provided at the center. The edge of the sealing portion 160 is fixed to the substrate 100 with an adhesive. Thereby, the space surrounded by the sealing portion 160 and the substrate 100 is sealed. And the light emission part 140 is located in this sealed space.

  The sealing part 160 may be a sealing film. The sealing film is formed of, for example, an insulating material, more specifically, an inorganic material such as aluminum oxide or titanium oxide. The thickness of the sealing film is preferably 300 nm or less. Moreover, the thickness of the sealing film is, for example, 50 nm or more. The sealing film is formed using, for example, an ALD (Atomic Layer Deposition) method, but may be formed using other film forming methods such as a CVD method or a sputtering method.

  The light emitting device 10 has a first terminal 112 and a second terminal 132 in a region of the substrate 100 located outside the sealing portion 160. The first terminal 112 is electrically connected to the first electrode 110, and the second terminal 132 is electrically connected to the second electrode 130. The first terminal 112 and the second terminal 132 are formed using, for example, Au, An, or Al. The first terminal 112 and the second terminal 132 may be formed of a metal multilayer film.

  Both the first terminal 112 and the second terminal 132 are disposed along the edge of the substrate 100. Specifically, the first terminal 112 and the second terminal 132 are both arranged along at least two sides (preferably all sides) of the substrate 100. In the example illustrated in FIGS. 1 to 5, the second terminal 132 is disposed in a region including the central portion of each side of the substrate 100, and the first terminal 112 is disposed near a corner portion of the substrate 100. Yes.

  More specifically, when viewed in a direction along the side of the substrate 100, the first terminal 112 is disposed so as to sandwich the second terminal 132 for each side of the substrate 100. Further, the first terminal 112 (first first terminal 112) and the second terminal 132 (first second terminal 132) arranged along the first side of the substrate 100 are included in the edge of the substrate 100. A first terminal 112 (second first terminal 112) and a second terminal 132 which are located between the portion serving as the first side and the light emitting unit 140 and are disposed along the second side of the substrate 100. The (second second terminal 132) is located between the light emitting unit 140 and the portion of the edge of the substrate 100 that becomes the second side.

  Further, on all sides of the substrate 100, the second terminals 132 arranged along a certain side are located closer to the light emitting unit 140 than the first terminals 112 arranged along the side. For example, the first second terminal 132 is located closer to the light emitting unit 140 than the first first terminal 112, and the second second terminal 132 is closer to the light emitting unit 140 than the second first terminal 112. Located nearby. The difference between the distance from the light emitting unit 140 to the first terminal 112 and the distance from the light emitting unit 140 to the second terminal 132 is equal to or greater than the width of the first wiring 210. Thereby, a space through which the first wiring 210 is passed is provided between the second terminal 132 and the edge of the substrate 100.

  In the example shown in FIGS. 4 and 5, a first lead wire 114 is provided between the first terminal 112 and the first electrode 110, and a second lead is provided between the second terminal 132 and the second electrode 130. A wiring 134 is provided. Since both the first lead wiring 114 and the second lead wiring 134 are formed in the same process as the first electrode 110, they are formed using the same transparent electrode material as the first electrode 110. The first terminal 112 is formed on the first lead wire 114, and the second terminal 132 is formed on the second lead wire 134.

  The first lead wiring 114 is located at the corner of the substrate 100. The first electrode 110, the first terminal 112, and the first lead wiring 114 are formed as one transparent conductive layer. On the other hand, the second terminal 132 is separated from the transparent conductive layer. In other words, the transparent conductive layer to be the first electrode 110, the first terminal 112, and the first lead-out wiring 114 is a part of a polygonal edge having the same number of sides as the substrate 100 (however, a corner portion). (Not). And the 2nd lead-out wiring 134 is arrange | positioned in this removed part.

  As shown in FIG. 2, the plurality of first terminals 112 are connected to each other using the first wiring 210, and the plurality of second terminals 132 are connected to each other using the second wiring 220. The first wiring 210 and the second wiring 220 are, for example, tape-shaped members. The first wiring 210 and the first terminal 112 are fixed to each other using, for example, a conductive adhesive. The second wiring 220 and the second terminal 132 are also fixed to each other using, for example, a conductive adhesive. However, the structure for connecting the first wiring 210 to the first terminal 112 and the structure for connecting the second wiring 220 to the second terminal 132 are not limited thereto.

  At least a surface (first surface) of the first wiring 210 and the second wiring 220 that faces the substrate 100 has conductivity. On the other hand, the surface (second surface) opposite to the substrate 100 of the first wiring 210 and the second wiring 220 has an insulating property except for a first terminal region 212 and a second terminal region 222 described later. It is preferable. For example, the first wiring 210 and the second wiring 220 are formed using a thin metal (for example, copper) or a material obtained by plating a metal (for example, a surface of copper plated with gold or tin). ing. By performing the plating process, the first wiring 210 and the second wiring 220 can be easily connected to the first conductive member 310 and the second conductive member 320 described later using solder or the like. When one surface of the first wiring 210 and the second wiring 220 has an insulating property, the first wiring 210 and the second wiring 220 may be formed by forming an insulating layer on one surface of the metal tape using, for example, a coating method. Good.

  The first wiring 210 and the second wiring 220 may be conductive cloth adhesive tape.

  In the example shown in the drawing, the plurality of first terminals 112 are arranged so that they can be connected by one stroke, and the plurality of second terminals 132 are also arranged so that they can be connected by one stroke. Therefore, the first wiring 210 can be connected to all the first terminals 112 by extending so as to connect the adjacent first terminals 112. The second wiring 220 can be connected to all the second terminals 132 by extending so as to connect the adjacent second terminals 132. In addition, the part located in the corner | angular part of the board | substrate 100 among the 1st wiring 210 and the 2nd wiring 220 is folded in order to bend the 1st wiring 210 and the 2nd wiring 220. FIG.

  The first wiring 210 and the second wiring 220 are both disposed on the same surface of the substrate 100 as the light emitting unit 140. As described above, the first terminal 112 is disposed farther from the light emitting unit 140 than the second terminal 132. Therefore, even if the first terminals 112 are connected to each other using the first wiring 210, the first wiring 210 is located between the second wiring 220 and each side of the substrate 100. For this reason, the first wiring 210 does not overlap the second wiring 220.

  The first wiring 210 is provided with a first terminal region 212, and the second wiring 220 is provided with a second terminal region 222. One end of the first conductive member 310 is connected to the first terminal region 212, and one end of the second conductive member 320 is connected to the second terminal region 222. The first conducting member 310 and the second conducting member 320 are, for example, lead wires or lead frames. The other end of the first conducting member 310 and the other end of the second conducting member 320 are both connected to a terminal of a control unit that controls the light emitting unit 140 (for example, a terminal of a control circuit board). The first terminal region 212 is a region that conducts vertically in the first wiring 210, and the second terminal region 222 is a region that conducts the first surface and the second surface in the second wiring 220. The control unit of the light emitting unit 140 is electrically connected to the plurality of first terminals 112 via one first conducting member 310 and also connected to the plurality of first terminals via one second conducting member 320. The two terminals 132 are electrically connected.

  The first terminal region 212 is located in a portion of the first wiring 210 that does not overlap the first terminal 112 (for example, the end of the first wiring 210), and the second terminal region 222 is the second wiring 220. Among these, the second terminal 132 is not overlapped (for example, the end of the second wiring 220). However, at least part of the first terminal region 212 may overlap with the first terminal 112, and at least part of the second terminal region 222 may overlap with the second terminal 132.

  FIG. 6 is a plan view showing a modification of FIG. In this modification, the end portion that becomes the first terminal region 212 of the first wiring 210 is located on the sealing portion 160. In addition, the end portion that becomes the second terminal region 222 of the second wiring 220 is also located on the sealing portion 160.

  Next, a method for manufacturing the light emitting device 10 will be described. First, the first electrode 110 is formed on the substrate 100. In this step, the first lead wiring 114 and the second lead wiring 134 are also formed. Next, the insulating layer 150, the organic layer 120, and the second electrode 130 are formed in this order. In addition, the first terminal 112 and the second terminal 132 are formed at any timing after the first lead wiring 114 and the second lead wiring 134 are formed. Next, the light emitting unit 140 is sealed using the sealing unit 160. Thereafter, the first wiring 210 is connected to the plurality of first terminals 112, and the second wiring 220 is connected to the plurality of second terminals 132. Then, the first conduction member 310 is connected to the first terminal region 212 of the first wiring 210, and the second conduction member 320 is connected to the second terminal region 222 of the second wiring 220. This connection is performed using, for example, solder or a spring pin.

  As described above, according to the present embodiment, the plurality of first terminals 112 and the plurality of second terminals 132 are formed on the substrate 100. The plurality of first terminals 112 are connected to each other by the first wiring 210, and the second terminal 132 is connected to each other by the second wiring 220. For this reason, by connecting the first conductive member 310 to the first wiring 210 and connecting the second conductive member 320 to the second wiring 220, a voltage (for example, for an anode) is applied from the plurality of first terminals 112 to the first electrode 110. And a voltage (for example, a potential for a cathode) can be supplied from the plurality of second terminals 132 to the second electrode 130. Therefore, it is possible to suppress the occurrence of in-plane distribution in the luminance of the light emitting unit 140.

  Further, the first wiring 210, the second wiring 220, the first conduction member 310, and the second conduction member 320 may be one each. For this reason, the structure which connects the control part of the light emission part 140 to the light emission part 140 can also be simplified. Moreover, the manufacturing cost of the light-emitting device 10 when including the process of attaching the first conducting member 310 and the second conducting member 320 is also reduced.

(Modification 1)
FIG. 7 is a plan view illustrating a configuration of the light emitting device 10 according to the first modification, and corresponds to FIG. 1 in the embodiment. 8 is a cross-sectional view taken along the line AA in FIG. FIG. 9 is a diagram in which the first wiring 210 and the second wiring 220 are attached to the light emitting device 10 shown in FIG. The light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the embodiment except for the following points.

  First, the second terminal 132 is located on the sealing portion 160. And the light emission part 140 and the sealing part 160 are widened toward the edge of the board | substrate 100 compared with embodiment. In other words, a region (non-light emitting region) where the light emitting portion 140 is not formed in the substrate 100 is narrow. The second terminal 132 and the second lead wiring 134 are connected to each other via the conductive portion 136. The conductive portion 136 is a metal foil such as a copper foil, for example, and is disposed along the side surface of the sealing portion 160. However, the conductive portion 136 may be formed by a vapor deposition method or the like.

  Also according to this modification, as in the embodiment, it is possible to suppress the occurrence of in-plane distribution in the luminance of the light emitting unit 140, and to simplify the structure for connecting the control unit of the light emitting unit 140 to the light emitting unit 140. it can. In addition, since the second terminal 132 is disposed on the sealing portion 160, a region (non-light emitting region) where the light emitting portion 140 is not formed in the substrate 100 can be narrowed.

(Modification 2)
FIG. 10 is a plan view illustrating a configuration of a light emitting device 10 according to the second modification, and corresponds to FIG. 1 in the embodiment. FIG. 11 is a view of the light emitting device 10 as viewed from the light emitting surface side (that is, a view as viewed from the side opposite to FIG. 10). 12 is a diagram in which the second wiring 220 and the first terminal region 212 are added to FIG. 10, and FIG. 13 is a diagram in which the first wiring 210 is added to FIG. The light emitting device 10 according to this modification has the same configuration as the light emitting device 10 according to the embodiment except for the following points.

  First, the first terminal 112 is provided on the surface of the substrate 100 opposite to the light emitting unit 140. Also in this case, the first terminal 112 is located near the edge of the substrate 100 and does not overlap the light emitting unit 140. The first terminal 112 is electrically connected to the first lead wiring 114 through the through hole 116. For this reason, the first wiring 210 is also disposed on the surface of the substrate 100 opposite to the light emitting unit 140. However, the first terminal region 212 is separated from the first wiring 210 and is disposed on the same surface of the substrate 100 as the light emitting unit 140. Note that the first lead wiring 114 shown in FIG. 1 and the like is covered with an insulating layer 150.

  The second terminal 132 is located near the edge of the substrate 100. Accordingly, as in the first modification, the sealing unit 160 and the light emitting unit 140 are wider than the embodiment. In other words, a region (non-light emitting region) where the light emitting portion 140 is not formed in the substrate 100 is narrow.

  Since the second terminal 132 is located near the edge of the substrate 100, the second wiring 220 overlaps with the first terminal 112 and the first wiring 210 through the substrate 100. However, since the substrate 100 is formed of an insulating material, the second wiring 220 is not short-circuited to the first terminal 112 or the first wiring 210.

  Also according to this modification, as in the embodiment, it is possible to suppress the occurrence of in-plane distribution in the luminance of the light emitting unit 140, and to simplify the structure for connecting the control unit of the light emitting unit 140 to the light emitting unit 140. it can. In addition, since the second terminal 132 is disposed on the surface of the substrate 100 opposite to the light emitting unit 140, a region of the substrate 100 where the light emitting unit 140 is not formed (non-light emitting region) can be narrowed.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

Claims (8)

A substrate,
A light emitting unit formed on the substrate and having a first electrode, a second electrode, and an organic layer located between the first electrode and the second electrode;
A plurality of first terminals formed on the substrate and electrically connected to the first electrode;
A plurality of second terminals formed on the substrate and electrically connected to the second electrode;
A first wiring disposed on the substrate and connected to the plurality of first terminals;
A second wiring disposed on the substrate and connected to the plurality of second terminals;
With
A portion of the first wiring and the second wiring that are located on the same surface of the substrate does not overlap each other. The light-emitting device according to claim 1.
The light emitting device, wherein the first wiring and the second wiring are conductive tapes having at least one surface conductive. The light-emitting device according to claim 2.
A surface of the conductive tape opposite to the one surface is a light emitting device having no conductivity. The light emitting device according to claim 3.
A first terminal region that is provided on a portion of the opposite surface of the conductive tape of the first wiring that does not overlap the first terminal, and is electrically connected to the one surface;
A second terminal region that is provided on a portion of the opposite surface of the conductive tape of the second wiring that does not overlap with the second terminal, and is electrically connected to the one surface;
A light emitting device comprising: The light-emitting device according to claim 4.
A first connecting member that electrically connects the first terminal region to a control unit that controls the light emitting unit;
A second connecting member for electrically connecting the second terminal region to the control unit;
A light emitting device comprising: In the light-emitting device as described in any one of Claims 1-5,
The first wiring extends so as to connect the adjacent first terminals,
The light emitting device, wherein the second wiring extends so as to connect the adjacent second terminals. The light-emitting device according to claim 6.
The substrate is polygonal;
The first first terminal and the first second terminal are located between the first side of the substrate and the light emitting unit,
The second light emitting device, wherein the second first terminal and the second second terminal are located between the second side of the substrate and the light emitting unit. The light-emitting device according to claim 7.
The first second terminal is located closer to the light emitting unit than the first first terminal;
The second second terminal is located closer to the light emitting unit than the second first terminal,
The portion of the second wiring located between the light emitting portion and the first side is located between the portion of the first wiring located between the light emitting portion and the first side and the light emitting portion. Light emitting device.

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