JPWO2016157597A1 - Endoscope - Google Patents

Abstract

The image sensor 30 and the first area 40a are electrically connected to the image sensor 30. At both side portions 40a1 and 40a2, at least one first cut piece 40bz in the second area and at least one first in the third area. Flexible substrate 40 with two cut pieces 40 cz left, and at least one cutting line of the first cut piece 40 bz and the second cut piece 40 cz extends in the extending direction E of the image sensor 30. In addition to being located in the region T of the outer shape projection portion, the first region 40a is left in the latter half portion that is spaced apart from the image pickup device 30 by a certain distance E1 in the extending direction E.

Description

  The present invention relates to an endoscope including an image pickup unit including an image pickup element and a flexible substrate electrically connected to the image pickup element.

An endoscope in which an imaging unit is provided in a distal end side (hereinafter simply referred to as a distal end side) in an insertion direction of an insertion portion to be inserted into a subject is well known.

  In general, the imaging unit includes an observation optical system for observing the inside of the subject and an imaging device for imaging a subject in the subject obtained by the observation optical system.

  The imaging device is mounted with a solid-state imaging device (hereinafter simply referred to as an imaging device), a cover glass that is attached to the imaging surface of the imaging device and protects the imaging surface, and electronic components such as capacitors, resistors, and transistors The lead wire is electrically connected to the flexible substrate in which one end in the extending direction is electrically connected to the bonding portion of the image sensor and the lead wire connecting portion in the other end in the extending direction of the flexible substrate. A signal cable for transmitting the electrical signal of the subject image captured by the imaging element to an external device of an endoscope such as an image processing device or a monitor is included in the main part.

  The flexible substrate prevents the electronic component mounted on the flexible substrate and other components of the lead wire connecting portion from contacting each other and reduces the size of the imaging device. When the outer shape of the image sensor is projected behind the insertion direction on the back surface of the image sensor, the image sensor has a size that falls within the region of the outer shape projection unit in the extending direction of the image sensor.

  In addition, in the manufacturing process, the flexible substrate is located inside the region of the outer shape projection portion in the extending direction of the image pickup device and along the mounting region actually used and the extending direction of the mounting region. It extends from the side and is composed of other areas used for inspection of the imaging device itself and for holding when assembling the imaging device.

In the other area, an inspection land for contacting an inspection socket is arranged, and the structure of the image sensor can be confirmed before manufacturing, and the outer shape of the image sensor is projected in the extending direction. At this time, it has a size that protrudes from the region of the outer shape projection portion in the extending direction of the imaging element.

It should be noted that after the inspection of the image sensor and after the holding, the other area is cut to leave only the mounting area as a flexible substrate in the imaging apparatus.

  In addition, in International Publication No. WO2010 / 150825, in a flexible substrate used in an imaging apparatus, a side along the extending direction of a mounting area inside the area of the outer shape projection portion in the extending direction of the imaging element. A configuration of an imaging unit is disclosed in which an inspection area to be cut after an inspection of an imaging element is provided on one of the sections, thereby ensuring a large inspection area on a flexible substrate.

In the flexible substrate of the imaging unit disclosed in International Publication No. WO2010 / 150825, the inspection area extends from only one of both side portions along the extending direction of the mounting area. In order to secure a sufficient number, the connection part of the inspection area with respect to the mounting area becomes longer in the extending direction.

As a result, in the flexible substrate of the imaging unit disclosed in International Publication No. WO2010 / 150825, the connection part of the inspection region is likely to be close to the back surface of the imaging element in order to shorten the rigid length of the imaging unit. When the area to be cut of the flexible substrate is cut with a cutter or the like, the blade of the cutter is likely to hit the back surface of the image sensor.

Here, as described above, the flexible substrate is positioned so that the mounting region is located inside the region of the outer shape projection unit in the extending direction of the outer shape of the imaging element.

Therefore, when cutting the connection part of the inspection area of the flexible substrate, the cutting line is taken into consideration so that a cut piece of the inspection area after cutting does not protrude greatly from the outer shape of the image sensor. However, it is necessary to be positioned so as to overlap within the outer shape of the image sensor.

For this reason, in order not to damage the back of the image sensor, the operator must not only perform the cutting work carefully, but also must perform the cutting work while avoiding the image sensor, so that the cutting work is difficult, There has been a problem that it is difficult to perform an accurate cutting operation along a desired cutting line.

Furthermore, when an accurate cutting operation cannot be performed, the cut piece protrudes from the region of the outer shape projection portion in the extending direction of the image sensor, and particularly when the diameter of the insertion portion of the endoscope is reduced, the cut piece becomes an inner portion. There was a possibility of interfering with other built-in objects of the insertion part of the endoscope.

Further, the above problem is the same when, for example, a hard substrate made of ceramic is electrically connected to increase the area where wiring is possible by increasing the number of mounted components.

The present invention has been made in view of the above problems, and an object of the present invention is to realize an endoscope incorporating a small imaging unit having a configuration in which a flexible substrate can be easily and accurately cut. .

  In the endoscope according to one aspect of the present invention, the imaging element and one end in the extending direction of the first area are electrically connected to the imaging element, and the both sides along the extending direction of the first area are provided. , At least one first cut piece of the second region extending and cut from one of the both side portions, and at least one second cut piece of the third region extending and cut from the other of the both side portions, And at least one cutting line of the first cut piece and the second cut piece is in the region of the outer shape projection portion in the extending direction of the imaging element. The image pickup unit is located and is left in the second half part spaced apart from the image pickup element in the extending direction by a predetermined distance in the first region.

The figure which shows the external appearance of the endoscope which comprises the imaging unit of this Embodiment. Partial sectional view of the distal end side of the insertion section along the line II-II in FIG. The figure which expands and shows the flexible substrate of FIG. 2 with a hard substrate, an image pick-up element, and a cover glass. The figure which expands and shows the state of the flexible substrate before cut | disconnecting 2nd area | region and 3rd area | region from the 1st area | region of the flexible substrate of FIG. 1 with a hard substrate, an image pick-up element, and a cover glass. The figure which expands and shows the site | part enclosed by the V line in FIG. The figure which shows the flexible substrate of FIG. 5 with a hard substrate and an image pick-up element from the back surface side in FIG. The figure which shows the flexible substrate of FIG. 3 with a hard substrate, an image pick-up element, and a cover glass from the VII direction in FIG. The figure which shows the modification in which the 1st area | region of the flexible substrate of FIG. 7 was electrically connected to the upper side of an image pick-up element. The figure which shows the state of the flexible board | substrate except the hard board | substrate from FIG. 7 with an image pick-up element and a cover glass. The figure which shows the state where the extending direction of the flexible substrate of FIG. 9 inclines the predetermined angle from the insertion direction with an image pick-up element and a cover glass In both sides of the first region in FIG. 3, the second region and the third region extend from positions close to the back surface of the image sensor, and each cutting line is a region of the outer shape projection unit in the extending direction of the image sensor. The figure which shows the structure of a flexible substrate in the case of being located in the outer side of an image sensor, a cover glass, and the blade of a cutter In both sides of the first region in FIG. 3, the second region and the third region extend from a position close to the back surface of the imaging device, and the cutting line of the second region is located within the outer shape of the imaging device. The figure which shows the structure of the flexible substrate in case with an image pick-up element, a cover glass, and the blade of a cutter The figure which shows the flexible substrate after cut | disconnecting the 2nd area | region of FIG. 12, and a 3rd area | region along a cutting line with an image pick-up element and a cover glass. The figure which shows the modification with which the 2nd cut piece of FIG. 3 is left in the position close | similar to the back surface of an image sensor in the side part of a 1st area | region with an image sensor and a cover glass. The figure which shows the modification with which the 2nd cut piece of FIG. 14 remains longer in the extending direction than a 1st cut piece with an image pick-up element and a cover glass. The figure which shows the modification with which the cutting line of the 1st cutting piece of FIG. 3 overlapped with the hard substrate, and an image pick-up element and a cover glass The figure which shows the modification of the imaging unit in the endoscope which comprises the imaging unit of this Embodiment from the same direction as FIG. The figure which shows the cross section of the imaging unit in alignment with the XVII-XVII line in FIG. 17 in the state before cutting | disconnection from the 1st area | region to the 2nd area | region and the 3rd area | region. The figure which shows the modification different from FIG. 17 of the imaging unit in the endoscope which comprises the imaging unit of this Embodiment.

Embodiments of the present invention will be described below with reference to the drawings. The drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of the thickness of each member, and the like are different from the actual ones. Of course, the part from which the relationship and ratio of a mutual dimension differ is contained.
FIG. 1 is a diagram showing an external appearance of an endoscope including the imaging unit of the present embodiment, and FIG. 2 is a partial cross-sectional view of the insertion portion along the line II-II in FIG.

As shown in FIG. 1, an endoscope 1 includes an insertion portion 2 that is inserted into a subject, an operation portion 3 that is connected to the proximal end side in the insertion direction S of the insertion portion 2, and the operation portion. 3 comprises a universal cord 8 extended from 3 and a connector 9 provided at the extended end of the universal cord 8 to constitute a main part.

Note that the endoscope 1 is electrically connected to an external device such as an image processing device or a lighting device via the connector 9.

The operation section 3 is provided with an up / down bending operation knob 4 for bending a bending section 12 described later of the insertion section 2 in the up / down direction and a left / right bending operation knob 6 for bending the bending section 12 in the left / right direction.

The operation unit 3 is provided with a fixed lever 5 for fixing the rotation position of the up / down bending operation knob 4 and a fixing knob 7 for fixing the rotation position of the left / right bending operation knob 6.

The insertion portion 2 includes a distal end portion 11, a bending portion 12, and a flexible tube portion 13 in order from the distal end side, and is formed in an elongated shape.

The bending portion 12 is bent in four directions, for example, up, down, left, and right by the turning operation of the up / down bending operation knob 4 or the left / right bending operation knob 6, thereby providing an observation optical system (described later) provided in the distal end portion 11. 20 (see FIG. 2) can be changed, and the insertability of the distal end portion 11 in the subject can be improved.

Further, the flexible tube portion 13 is connected to the proximal end side in the insertion direction S of the bending portion 12.

As shown in FIG. 2, an imaging unit 100 is provided inside the distal end side of the insertion portion 2.

The imaging unit 100 observes the inside of the subject held by the lens frame 22 and is partially exposed to the distal end surface of the distal end portion 11, and the subject obtained by the observation optical system 20. And an image pickup device 80 for picking up an image of the subject inside.

Note that the observation optical system 20 may be composed of only one lens, or may be composed of a plurality of lenses.

The imaging device 80 includes an imaging device 30, a cover glass 31 that is attached to the imaging surface of the imaging device 30 and protects the imaging surface, and an electronic component 41 such as a capacitor, a resistor, and a transistor via a hard substrate 90. A flexible substrate 40 that is mounted and electrically connected to one end 40as (see FIG. 3) in the extending direction E substantially parallel to the insertion direction S to the bonding portion of the image pickup device 30, and the flexible substrate 40 The signal cable 50 in which the lead wire 51 is electrically connected to the lead wire connecting portion 42 at the other end in the extending direction E of the substrate 90, the proximal end in the insertion direction S of the lens frame 22, and the distal end side of the signal cable 50 In between, the image sensor 30, the cover glass 31, the flexible substrate 40, and the heat contraction tube 60 which covers and seals the lead wire 51 are comprised, and the principal part is comprised.

The signal cable 50 is inserted into the insertion unit 2, the operation unit 3, the universal cord 8, and the connector 9, and an electric signal of a subject image captured by the image sensor 30 is connected to an image processing apparatus or monitor to which the connector 9 is connected. To the external device of the endoscope.

In addition to the signal cable 50, in the insertion section 2, as shown in FIG. 2, a treatment instrument insertion channel 190 that also serves as a suction conduit, and an air supply / not-illustration that supplies fluid to the observation optical system 20 are not shown. Built-in objects such as a water conduit and a front water supply conduit (not shown) for supplying fluid into the subject are provided.

Next, the configuration of the flexible substrate 40 in FIG. 2 will be described with reference to FIGS. FIG. 3 is an enlarged view of the flexible substrate of FIG. 2 together with the hard substrate, the imaging device, and the cover glass. FIG. 4 is a diagram illustrating the first to second regions and the third region of the flexible substrate of FIG. It is a figure which expands and shows the state of the flexible substrate before cut | disconnecting an area | region with a hard substrate, an image pick-up element, and a cover glass.

5 is an enlarged view of a portion surrounded by the V line in FIG. 4, and FIG. 6 is a diagram showing the flexible substrate of FIG. 5 together with a hard substrate and an image sensor from the back side in FIG. FIG.

7 is a diagram showing the flexible substrate of FIG. 3 together with the hard substrate, the image sensor and the cover glass from the VII direction in FIG. 3, and FIG. 8 is a diagram showing the first region of the flexible substrate of FIG. FIG. 10 is a diagram illustrating a modification example in which the image sensor is electrically connected to the upper side of the image sensor.

9 is a diagram showing the state of the flexible substrate excluding the hard substrate from FIG. 7 together with the image sensor and the cover glass, and FIG. 10 is an extending direction of the flexible substrate of FIG. It is a figure which shows the state inclined from the predetermined angle from the image sensor and the cover glass.

As shown in FIG. 3, the flexible substrate 40 includes a first region 40 a having a predetermined length along the extending direction E and having a predetermined width in the width direction H described later.

In the first region 40 a, one end 40 as in the extending direction E is electrically connected to the image sensor 30.

Specifically, as shown in FIGS. 6 to 8, one end 40 as of the first region 40 a is electrically connected to a bonding portion (not shown) of the image sensor 30 via an inner lead 48.

Note that the connection position of the one end 40as to the bonding portion of the image sensor 30, that is, the extension position in the extending direction E of the first region 40a is on the lower side (DOWN side) of the image sensor 30 as shown in FIG. As shown in FIG. 8, it may be on the upper side (UP side) of the image sensor 30.

Further, as shown in FIGS. 3 to 5, the first region 40a has a side portion 40a2 in which the center Q2 in the width direction H connecting side portions 40a1 and 40a2 described later is more than the center Q1 in the width direction H of the image sensor 30. One end 40as is electrically connected to the image sensor 30 so as to be shifted to the side.

Further, as shown in FIGS. 7 and 8, the one end 40 as of the first region 40 a causes the heat of the imaging device 30 to be applied to the flexible substrate 40 with respect to the back surface 30 h opposite to the imaging surface of the imaging device 30. In order to make it easy to escape, it is bonded by a thermosetting adhesive 120 having good thermal conductivity.

As shown in FIGS. 2 to 8, a hard substrate 90 made of ceramic or the like and having a width smaller than that of the first region 40 a in the width direction H is formed on the surface 40 af of the first region 40 a. 40a is electrically connected.

3 to 8, the hard substrate 90 is formed longer than the first region 40a in the extending direction E, but the hard substrate 90 may be formed shorter than the first region 40a. Absent.

The above-described electronic component 41 and the lead wire connecting portion 42 are mounted on the hard substrate 90. The hard substrate 90 increases the number of electronic components 41 mounted on the flexible substrate 40, improves the cutting performance when cutting a second region 40b and a third region 40c described later from the first region 40a, and the like. For this reason, it is electrically connected to the first region 40a.

As shown in FIGS. 9 and 10, the electronic component 41 and the lead wire connecting portion 42 (the lead wire connecting portion 42 is not shown in FIGS. 9 and 10) can be directly used without using the hard substrate 90. You may mount in the 1st area | region 40a of the flexible substrate 40. FIG.

As shown in FIG. 10, the first region 40 a has a predetermined extension direction E with respect to the insertion direction S so that the first region 40 a can be easily located in a region T (see FIG. 3) described later. It may be positioned so that the angle θ is inclined. Although not shown, even when the hard substrate 90 is electrically connected to the first region 40a, the first region 40a may be inclined at an angle θ.

Further, as shown in FIGS. 3 and 4, in the first region 40a, the second region extended from the side portion 40a1 and cut from the first region 40a on the side portion 40a1 side along the extending direction E. The first cut piece 40bz of 40b is left, and the second cut piece 40cz of the third region 40c extending from the side portion 40a2 and cut from the first region 40a is left on the side portion 40a2. . The first cut piece 40bz and the second cut piece 40cz are left at an equidistant position in the extending direction E from the imaging element 30.

The second region 40b and the third region 40c before cutting are regions used for inspection of the image sensor 30, for example, and are integrally formed as a large region 40d as shown in FIG. The second region 40b and the third region 40c may be regions used for holding when the imaging device 80 is assembled.

Furthermore, the reason why the first cut piece 40bz and the second cut piece 40cz remain after the cutting of the second region 40b and the third region 40c on both side portions 40a1 and 40a2 is that the second region 40b and the third region 40c are cut. Is manually performed along the cutting lines C1 and C2, which will be described later, so that a cut piece having a size of about 1/100 mm in the width direction H is unavoidably caused by a work error. Because.

A plurality of inspection lands 45 are formed in the region 40d. As shown in FIG. 4, for example, the inspection wiring pattern 40 bp composed of three lines is drawn out from the side portion 40 a 1 of the first area 40 a through the second area 40 b, and is composed of, for example, three lines. The inspection wiring pattern 40cp is drawn from the side portion 40a2 of the first region 40a through the third region 40c, is electrically connected to each inspection land 45, and is inserted into an inspection socket or the like to be imaged. Check the operation.

The plurality of inspection wiring patterns 40bp and 40cp may be formed on the back surface 40du of the region 40d.

That is, in the present embodiment, the inspection wiring patterns 40bp and 40cp are not only from one side along the extending direction E of the first region 40a as in the prior art, but both side portions 40a1, It is drawn from 40a2.

This prevents the cut pieces 40bz and 40cz from remaining longer in the extending direction E, as shown in FIG.

Further, as shown in FIG. 6, through the inspection wiring pattern 40ap1 and the via hole 44c formed on the back surface 40au of the first region 40a and electrically connected to the inspection wiring pattern 40bp through the via hole 44b. The inspection wiring pattern 40ap2 electrically connected to the inspection wiring pattern 40cp is aligned with the left and right in the width direction H, that is, the second region 40b side and the second in the width direction H of the inner leads 48a and 48b. They are distributed on the back surface 40au to the three regions 40c side.

The inspection wiring patterns 40ap1 and 40ap2 may be formed on the surface 40af of the first region 40a.

Accordingly, since the inspection wiring patterns 40ap1 and 40ap2 are distributed in the width direction H in the first region 40a narrow in the width direction H, the inspection wiring patterns 40ap1 and 40ap2 are efficiently saved in a space-saving manner. In addition to being formed in one region 40a, the wiring shapes of the inspection wiring patterns 40ap1 and 40ap2 are simplified.

Note that when the wiring pattern used for inspection is drawn from the base end side, the wiring pattern for inspection and the wiring pattern for actual use are arranged side by side, and the wiring becomes complicated. Therefore, it is not necessary to distribute the inspection pattern in the H direction. Effective for space.

Note that the mounting wiring pattern (not shown) formed in the via holes 44b and 44c and the first region 40a has a variation in size in the width direction H in the first region 40a, or a hard substrate for the first region 40a. Even in the case where there is a variation in the connection position of 90, the width of the first region 40a in the width direction H so as not to be cut off when the second region 40b and the third region 40c are cut from the first region 40a. It is formed in the central area.

As shown in FIG. 4, the flexible substrate 40 has an extension direction of the image sensor 30 by the area 40 d when the outer shape of the image sensor 30 is projected along the extension direction E before the area 40 d is cut. Although it is formed in a size that protrudes from the region T of the outer shape projection portion to E, as shown in FIGS. 3 to 5, after cutting the second region 40 b and the third region 40 c, the first cut piece 40 bz is The cutting line C1 is left so as to be positioned in the region T of the outer shape projection portion in the outer shape extending direction of the image sensor 30, and the second cutting piece 40cz has the cutting line C2 outside the region T in the width direction H. It is left to be located in the position.

Although not shown, the second cut piece 40cz may be left so that the cutting line C2 is positioned in the region T of the outer shape projection portion in the direction in which the image sensor 30 extends in the outer shape.

In the present embodiment, the first cut piece 40bz is left so that the cutting line C1 is positioned in the region T of the outer shape projection portion in the outer shape extending direction of the imaging element 30, and the second cut piece 40cz is cut. The reason why the line C2 is left so as to be shifted from the region T to the outside in the width direction H is that the center Q2 in the width direction H of the first region 40a is in the width direction H of the image sensor 30 as described above. This is because the position is shifted to the side 40a2 side in the width direction H from the center Q1.

In addition, the 1st cut piece 40bz may be comprised from the 2 or more cut piece, and the 2nd cut piece 40cz may be comprised from the 2 or more cut piece.

In addition, the first cut piece 40bz and the second cut piece 40cz are left in the rear half part separated from the back surface of the imaging element 30 by a constant interval E1 in the extending direction E in the side portions 40a1 and 40a2 of the first region 40a. ing.

In the configuration of the present embodiment, when at least one of the cutting lines C1 and C2 is located in the region T, the cut pieces of the cutting line on the side located in the region T are both Only one cut piece 40bz needs to be left in the rear half of the flexible substrate that is separated from the back surface 30h of the image sensor 30 by a certain distance E1 in the extending direction E at the side portion 40a1.

Further, in the present embodiment, the position where the first cut piece 40bz is left in the side portion 40a1 is the other internal structure of the insertion portion 2 when the imaging unit 100 is disposed in the insertion portion 2. This is a position where the first cut piece 40bz is non-interfering.

Specifically, as shown in FIG. 2, the treatment instrument insertion channel 190 includes a tube 192, a connection base 191 in which the distal end side in the insertion direction S of the tube 192 is fixed to the outer periphery, and insertion of the connection base 191. In the case where the front base 193 is fixed to the outer periphery on the distal end side in the direction S, the front base 193 is provided on the outer periphery in the middle of the insertion direction S of the connection base 191 and the distal end of the tube 192 in the insertion direction S is attached. The projecting portion 191t to be applied is disposed at a position in the insertion portion 2 that avoids the first cut piece 40bz or the second cut piece 40cz.

In this embodiment, as an example of a built-in object on the distal end side of the insertion portion 2 of the endoscope 1 that does not interfere with the first cut piece 40bz, the connection base 191 of the treatment instrument insertion channel 190 is provided. Although the protruding portion 191t is mentioned, the present invention is not limited to this, and it is needless to say that a built-in object on the distal end side of the other insertion portion 2 may be used.

Further, depending on the position of other built-in objects, the center Q2 of the first region 40a is shifted to the side 40a1 side in the width direction H with respect to the center Q1 of the image sensor 30, contrary to the present embodiment. The second cut piece 40cz may be positioned in the region T so as not to interfere with other built-in objects.

Next, the operation and effect of the present embodiment will be described with reference to FIGS. 11 to 13 together with FIGS. 2 to 5 described above. FIG. 11 shows that, on both sides of the first region in FIG. 3, the second region and the third region extend from a position close to the back surface of the image sensor, and each cutting line is wider than the outer shape of the image sensor. The figure which shows the structure of the flexible board | substrate in the case of being located outside with an image pick-up element, a cover glass, and the blade of a cutter, FIG. 12 is a 2nd area | region and 3rd in the both sides of the 1st area | region of FIG. The configuration of the flexible substrate in the case where the region extends from a position close to the back surface of the image sensor and the cutting line of the second region is located within the outer shape of the image sensor, the image sensor, the cover glass, and the cutter FIG. 13 shows the flexible substrate after cutting the second region and the third region of FIG. 12 along the cutting line, together with the image sensor and the cover glass.

When cutting the second region 40b and the third region 40c along the cutting lines C1 and C2 from the flexible substrate 40 shown in FIG. 4 as shown in FIGS. 3 to 5, as shown in FIG. Even if the second region 40b and the third region 40c are extended from the positions close to the back surface 30h of the image sensor 30 in both side portions 40a1 and 40a2, the centers Q1 and Q2 coincide with each other and the cutting line C1 and In the case where C2 is located outside the region T, the cutter blade D does not come into contact with the back surface 30h of the image sensor 30 during cutting.

However, as shown in FIG. 12, when the cutting line C1 is located in the region T, that is, when the center Q2 is displaced from the center Q1 in the width direction H toward the side portion 40a2, When cutting the second region 40 b, the blade D may come into contact with the back surface 30 h of the image sensor 30.

Since the cutting line C2 is located outside the width direction H of the region T, the blade D comes into contact with the back surface 30h of the image sensor 30 along with the cutting of the third region 40c as in FIG. There is no end.

Furthermore, in FIGS. 11 and 12, since the second region 40b and the third region 40c are extended from a position close to the back surface 30h of the image sensor 30, as shown in FIG. 13, the cutting line C1 , When cut along C2, each cut piece 40bz, 40cz remains from the distal end to the proximal end along the extending direction E in the side portions 40a1, 40a2 of the first region 40a. Thus, when the imaging unit 100 is disposed inside the distal end side of the insertion portion 2, for example, the first cut piece 40bz interferes with the protruding portion 191t. This is more remarkable as the diameter of the distal end side of the insertion portion 2 is reduced.

However, in the present embodiment, as shown in FIGS. 4 and 5, the second region 40 b and the third region 40 c extend from the back surface 30 h of the image sensor 30 in both side portions 40 a 1 and 40 a 2 of the first region 40 a. For example, even if the cutting line C1 is located in the region T, when the second region 40b along the cutting line C1 is cut, it extends from the position separated by a certain interval E1 in the current direction E. The blade D does not come into contact with the back surface 30h of the image sensor 30.

Further, as shown in FIG. 3, since the first cut piece 40bz is also left in the rear half of the side portion 40a1 of the first region 40a, the imaging unit 100 is disposed in the distal end side of the insertion portion 2 of the endoscope 1. At this time, even if the diameter of the distal end side of the insertion portion 2 is reduced, the first cut piece 40b does not interfere with other built-in objects of the protruding portion 191t.

As described above, it is possible to provide the imaging unit 100 having a configuration in which the flexible substrate 40 can be easily and accurately cut, and the endoscope 1 including the imaging unit 100.

Hereinafter, a modification will be described with reference to FIG. FIG. 14 is a view showing a modification in which the second cut piece of FIG. 3 is left at a position close to the back surface of the image sensor at the side of the first region, together with the image sensor and the cover glass.

As shown in FIG. 14, when the cutting line C2 is located outside the region T in the width direction H, that is, from the position where the third region 40c is close to the back surface 30h of the image sensor 30 in the side portion 40a2. When extending, as shown in FIGS. 11 to 13 described above, even if the third region 40c is cut along the cutting line C2, the back surface 30h of the imaging device 30 is not damaged by the blade D. .

Therefore, the second cut piece 40cz may be left at a position close to the back surface 30h of the imaging element 30 in the side portion 40a2.

That is, in the side part 40a1 and the side part 40a2, the first cut piece 40bz and the second cut piece 40cz may be provided at asymmetric positions with respect to the center Q2.

In other words, when the cutting lines C1 and C2 of the cutting pieces 40bz and 40cz are located in the region T, the cutting pieces 40b and 40cz extend in a direction extending from the back surface 30h of the imaging element 30 by a certain distance E1. When it is necessary to remain apart from E and deviate from the region T, the cut pieces 40bz and 40cz may be left close to the back surface 30h of the image sensor 30.

Hereinafter, another modification will be described with reference to FIG. FIG. 15 is a diagram illustrating a modification in which the second cut piece of FIG. 14 remains longer in the extending direction than the first cut piece, together with the imaging element and the cover glass.

As shown in FIG. 15, in the case where the cutting line C2 of the second cutting piece 40cz is located outside the region T in the width direction H, the second cutting piece 40cz extends beyond the first cutting piece 40bz. It may be formed long in the existing direction E (E6> E5).

In addition, it is not limited to this case, The length in the extending direction E may differ between the 1st cut piece 40bz and the 2nd cut piece 40cz.

Hereinafter, still another modification will be described with reference to FIG. FIG. 16 is a diagram illustrating a modification in which the cutting line of the first cutting piece of FIG. 3 is positioned so as to overlap the hard substrate, together with the image sensor and the cover glass.

As shown in FIG. 16, the cutting line C <b> 1 is formed by the hard substrate 90 due to variations in the size of the first region 40 a and the hard substrate 90 in the width direction H, variations in the connection position of the hard substrate 90 with respect to the first region 40 a, and the like. The operator may not be able to visually recognize the cutting line C1.

The reason why the second region 40b is cut after the hard substrate 90 is electrically connected to the first region 40a is that the hard region 90 is electrically connected because the first region 40a has a very small area. This is because it is easier to perform the cutting work after the treatment. In other words, it is difficult to electrically connect the hard substrate 90 after cutting the flexible substrate 40 in consideration of the size.

In this case, a cutting line C ′ may be set along the side surface 90 b along the extending direction E of the hard substrate 90, and the second region 40 b may be cut along the cutting line C ′.

According to such a configuration, the cutting operation can be performed with the blade D along the hard side surface 90b, so that the first cut piece 40bz after the cutting as in the above-described embodiment hardly occurs, and the cutting is accurate. Not only can the work be performed, but the first cut piece 40bz is not generated, so that the width of the flexible substrate 40 in the width direction H can be set to a desired size.

The same applies to the case where the cutting line C2 is positioned so as to overlap the hard substrate 90.

Hereinafter, another modification will be described with reference to FIGS. FIG. 17 is a diagram illustrating a modification of the imaging unit in the endoscope including the imaging unit of the present embodiment from the same direction as FIG. 7, and FIG. 18 is an imaging unit along the line XVII-XVII in FIG. It is a figure which shows the cross section of the 2nd area | region and 3rd area | region from the 1st area | region in the state before cutting | disconnection.

As shown in FIGS. 17 and 18, in the hard substrate 90 ′ on which the electronic component 41 is mounted, as shown in FIG. 18, at least the second region 40 b extends from the first region 40 a. Notches 90k ′ each having a predetermined length in the width direction H, the extending direction E, and the height direction may be formed.

According to such a configuration, when the operator cuts the second region 40b along the cutting line C1, if the cutting is performed along the notch 90k ′, even if the cutting position varies, When one cut piece 40bz projects the outer shape of the image sensor 30 along the extending direction E, the one cut piece 40bz does not protrude from the region T of the outer shape projection portion in the extending direction E of the image sensor 30.

Therefore, the notch 90k 'may be formed in a portion where the third region 40c extends from the first region 40a in the hard substrate 90', although not shown. In this case, when the operator cuts the third region 40c along the cutting line C2, if the cutting is performed along the notch 90k ′, even if the cutting position varies, the second cutting piece 40cz does not move. When the outer shape of the image sensor 30 is projected along the extending direction E, the image sensor 30 does not protrude from the region T of the outer shape projection portion in the extending direction E of the image sensor 30.

Further, since the cutout 90k ′ is used when cutting at least one of the second region 40b and the third region 40c, the length of the cutout 90k ′ in the extending direction E is the same as that of the second region 40b. It may be formed to a length necessary for cutting at least one of the third regions 40c, and may be formed over the entire length in the extending direction E with respect to the hard substrate 90 ′.

Further, the depth in the width direction H of the cutout 90k ′ is a depth that does not damage the hard substrate 90 ′ by the cutter blade D when cutting at least one of the second region 40b and the third region 40c. Also, the width in the height direction may be greater than or equal to the width that assumes variation in the cutting position when cutting at least one of the second region 40b and the third region 40c.

In FIG. 18, the cross-sectional shape of the notch 90 k ′ is L-shaped, but it may be any shape such as an R-shape.

Furthermore, another modification will be described below with reference to FIG. FIG. 19 is a diagram illustrating a modified example different from that of FIG. 17 of the imaging unit in the endoscope including the imaging unit of the present embodiment.

In the present embodiment described above, the hard substrate 90 is shown as an example having a rectangular parallelepiped shape, but is not limited thereto, and may have another shape.

For example, as shown in FIG. 19, cable connection lands (not shown) to which the lead wires 51 are electrically connected by solder or the like are arranged on the upper surface and the bottom surface on the base end side in the extending direction E of the hard substrate 90 ″. In the configuration in which the rib 90r ″ is provided, even if the hard substrate 90 ″ has a shape in which the rib 90r ″ on the upper surface is positioned higher than the mounting surface of the electronic component 41 of the hard substrate 90 ″. I do not care. According to such a configuration, when the lead wire 51 is soldered to the cable connection land arranged on the rib 90r ″ with the soldering iron G, the contact of the soldering iron G with the electronic component 41 is prevented. can do.

The ribs 90r ″ may be formed with different lengths in the extending direction E on the upper surface and the bottom surface of the hard substrate 90 ″, or may be formed at different positions.

Further, the hard substrate 90 ″ has a step 90h ′ that prevents the occurrence of a short circuit due to the solder flowing out between the rib 90r ″ in the extending direction E and the electronic component 41 and coming into contact with the electronic component 41. It may be a shape in which 'is formed.

  Also, the bottom surface may have a shape in which a step 90h ″ that prevents the solder from flowing out and the occurrence of a short circuit between the flexible substrate and the hard substrate is formed.

This application is filed on the basis of the priority claim of Japanese Patent Application No. 2015-069348 filed in Japan on March 30, 2015, and the above contents include the description, claims, and drawings of the present application. Is quoted in

DESCRIPTION OF SYMBOLS 1 ... Endoscope 2 ... Insertion part 30 ... Imaging element 40 ... Flexible board | substrate 40a ... 1st area | region 40a1 of a flexible board | substrate ... One side part 40a2 of the 1st area | region of a flexible board | substrate ... Flexible board | substrate The other side portion 40as of the first region of the first end 40b in the extending direction of the first region of the flexible substrate ... The second region 40bz of the flexible substrate ... The first cut piece 40c of the flexible substrate ... flexible The third region 40 cz of the conductive substrate ... the second cut piece 90 of the flexible substrate ... the hard substrate 100 ... the imaging unit 190 ... the treatment instrument insertion channel C1 ... the cutting line C2 ... the cutting line E ... the extending direction E1 ... a constant interval H ... width direction Q1 ... center Q2 in the width direction of the image sensor ... center T in the width direction of the first area ... area of the outer shape projection portion in the extending direction of the image sensor

In the endoscope according to one aspect of the present invention, the imaging element and one end in the extending direction of the first area are electrically connected to the imaging element, and the both sides along the extending direction of the first area are provided. a second region first cut pieces of one of which is one extending from the cutting of the both sides, one second cutting piece and the remaining third region which is extending disconnected from the other of said side portions A flexible substrate and a hard substrate connected to the first region , wherein at least one cutting line of the first cut piece and the second cut piece is the extension of the imaging element. It is located in the area of the outer shape projection part in the direction of the current direction, and is left in the latter half part that is spaced apart from the image sensor in the direction of extension by a certain distance in the first area.

Claims (7)

An image sensor;
One end of the first region extending in the extending direction is electrically connected to the image sensor, and the second region extends from one side of the first region and cuts the both sides along the extending direction of the first region. A flexible substrate in which at least one first cut piece of the region and at least one second cut piece of the third region extending from the other of the two side portions and cut are left;
Comprising
At least one cutting line of the first cut piece and the second cut piece is located in a region of the outer shape projection portion in the extending direction of the image pickup device, and in the first region from the image pickup device to the An endoscope incorporating an imaging unit, which is left in a rear half part spaced apart at a constant interval in the extending direction. 2. The image pickup unit according to claim 1, wherein the second area and the third area before cutting are areas used for inspection of the image pickup element and have a wiring pattern. Endoscope. The center in the width direction connecting the both side portions of the first region is shifted to the second cut piece side from the center in the width direction of the image sensor,
In the first cut piece, the cutting line is located inside a region of the outer shape projection portion in the extending direction of the image sensor, and the second cut piece is formed by the cutting line of the image sensor. The endoscope incorporating the imaging unit according to claim 1, wherein the endoscope is located outside a region of the outer shape projection unit in the extending direction. The first cut piece and the second cut piece are left at an equidistant position from the imaging device in the extending direction of the both side portions of the first region. An endoscope incorporating the imaging unit according to any one of 3 above. The internal length of the imaging unit according to any one of claims 1 to 4, wherein the first cut piece and the second cut piece have the same length in the extending direction. Endoscope. The endoscope incorporating the imaging unit according to any one of claims 1 to 5, wherein a hard substrate is electrically connected to the first region.   At least one of the first cut piece and the second cut piece left in the second half of the first region is a built-in object provided in the insertion portion in the insertion portion to be inserted into the subject. The endoscope incorporating the imaging unit according to claim 6, wherein the endoscope is provided at a position avoiding the first cut piece or the second cut piece.

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