JP6512522B2 - Endoscope - Google Patents

Description

  The present invention is an endoscope having a cylinder at the tip end of the insertion portion, and an imaging element, a wiring board on which a heat generating component is disposed, and a tubular member are provided inside the cylinder. About.

  Endoscopes are widely used in the medical and industrial fields. The subject is imaged by an imaging device disposed at the tip of the insertion portion of the endoscope, and the subject image is displayed on the monitor of the apparatus main body.

  At the front end, active components such as integrated circuit components that supply drive signals to the imaging device are also disposed. The active component is a heat generating component that generates heat when performing a predetermined operation with the received power. When the heat generated by the heat generating component is transferred to the imaging device and the temperature of the imaging device rises, the imaging device may be degraded or the image quality may be degraded due to thermal noise.

  Japanese Patent Application Laid-Open No. 2013-233343 discloses an endoscope in which the back surface of an imaging device is closely fixed to the outer surface of a forceps pipe with an adhesive in order to dissipate heat generated by the imaging device which is a heating device. .

  However, in the endoscope having the above configuration, if the heating element is disposed at the tip end portion in addition to the imaging element, the imaging element serves as a heat radiation path of the heat generated by the heating element, and the temperature may increase. there were.

JP, 2013-233343, A

  An object of the present invention is to provide an endoscope in which the heat generated by the heat generating component may not adversely affect the imaging device.

  The endoscope according to the embodiment of the present invention has a cylindrical body at the distal end portion of the insertion portion, and the imaging device, the flexible wiring board, and the distal end portion are inserted inside the cylindrical body. An endoscope provided with a tubular member, the wiring board including an intermediate portion connected to the imaging device and an extending portion extending from a side of the intermediate portion; The extended portion in which the heat generating component is disposed is in contact with the tubular member.

  According to the embodiment of the present invention, it is possible to provide an endoscope in which the heat generated by the heat generating component may not adversely affect the imaging device.

It is an outline view of an endoscope of a 1st embodiment. It is a schematic diagram of the front-end | tip part of the endoscope of 1st Embodiment. It is sectional drawing of the front-end | tip part of the endoscope of 1st Embodiment. It is a rear view of an imaging device for explaining the manufacturing method of the endoscope of a 1st embodiment. It is a bottom view of an imaging device for explaining a manufacturing method of an endoscope of a 1st embodiment. It is a perspective view of the wiring board for demonstrating the manufacturing method of the endoscope of 1st Embodiment. It is a block diagram of the front-end | tip part of the endoscope of 1st Embodiment. It is a block diagram of the front-end | tip part of the endoscope of the modification 1 of 1st Embodiment. It is sectional drawing of the front-end | tip part of the endoscope of 2nd Embodiment. It is a block diagram of the front-end | tip part of the endoscope of 2nd Embodiment.

First Embodiment
First, an endoscope 2 according to a first embodiment of the present invention will be described with reference to FIG.

  The drawings are schematic, and it should be noted that the relationship between the thickness and width of each part, the thickness ratio of each part, etc. is different from the actual one, and There are also cases where parts with different dimensional relationships and proportions are included. Also, some components may not be shown.

  As shown in FIG. 1, the endoscope system 1 includes an endoscope 2, a processor 5A, a light source device 5B, and a monitor 5C. The endoscope 2 captures an in-vivo image of the subject by inserting the elongated insertion portion 3 into a body cavity of the subject, and outputs an imaging signal.

  At the proximal end side of the insertion portion 3 of the endoscope 2, an operation portion 4 provided with various buttons for operating the endoscope 2 is disposed. The operation unit 4 has a treatment tool insertion port 4A of a forceps tube (channel) 22 (see FIG. 2) for inserting treatment tools such as a biological forceps, an electric knife and a test probe into a body cavity of a subject.

  The insertion portion 3 includes a distal end portion 3A in which the imaging element 50 is disposed, a bendable curved portion 3B continuously provided on the proximal end side of the distal end portion 3A, and a continuous end provided on the proximal end side of the curved portion 3B. And the flexible tube portion 3C. The bending portion 3B is bent by the operation of the operation unit 4. The endoscope 2 may be a so-called flexible endoscope, but may be a so-called rigid endoscope in which the insertion portion 3 is rigid.

  A signal cable 61 connected to the imaging device 50 of the distal end 3A is inserted into the universal cord 4B disposed on the proximal end side of the operation unit 4.

  The universal cord 4B is connected to the processor 5A and the light source device 5B via the connector 4C. The processor 5A controls the entire endoscope system 1, performs signal processing on an imaging signal output from the imaging element 50, and outputs an image signal. The monitor 5C displays an image signal output by the processor 5A.

  The light source device 5B includes, for example, a white LED. The light emitted from the light source device 5B is guided to the distal end portion 3A through the universal cord 4B and the light guides 24 and 25 (see FIG. 3) inserted through the insertion portion 3 to illuminate the subject.

  As shown in FIGS. 2 and 3, the endoscope 2 has a cylindrical body 20 at the distal end portion 3A of the insertion portion 3, and an imaging element 50 and a flexible wiring board 30 inside the cylindrical body 20. And a suction pipe 21 and a forceps pipe 22 which are tubular members through which the distal end portion 3A is inserted. In addition, in FIG. 2, only the suction pipe 21 and the forceps pipe 22 are shown among the components arrange | positioned by the inside of the cylinder 20. As shown in FIG.

  The outer surface of the cylindrical body 20 is covered with a shell resin layer (not shown). On the other hand, the inside of the cylindrical body 20 is sealed by a sealing resin 26. The sealing resin 26 is selected from resins excellent in moisture resistance, such as epoxy resin or silicone resin.

  An illumination optical system 24 T emits the illumination light guided by the opening 21 H of the suction tube 21, the opening 22 H of the forceps tube 22, the opening 23 T of the water supply / traffic tube 23, and the light guides 24 and 25 on the tip surface of the insertion portion 3. , 25T, and the tip surface of the objective optical system 52 for forming an object image on the imaging device 50. The suction pipe 21 and the water supply / air supply pipe 23 pass through the insertion portion 3 and the universal cord 4B and are connected to a suction pump and a water supply / air supply pump (not shown). That is, the suction pipe 21, the forceps pipe 22, and the water supply / air supply pipe 23 have an opening at the tip end surface through which the tip end portion 3A is inserted.

  Wiring board 30 includes middle portion 31 including tip region 31A, and extension portions 32 and 33 extending from both sides of middle portion 31, respectively. A chip capacitor 49 is disposed in the middle portion 31, an imaging device 30 is disposed in the distal end region 31 A, a drive IC 41 is disposed in the extension portion 32, and a drive IC 42 is disposed in the extension portion 33.

  As shown to FIG. 4A and FIG. 4B, the main surface of middle part 31 of wiring board 30 in the middle of manufacture before being inserted in cylindrical body 20 of tip 3A and the main surfaces of extended parts 32 and 33 are the same planes It is above. However, the front end region 31A of the middle portion 31 of the wiring board 30 is bent, and the cover glass 53 is bonded to the back surface of the imaging device 50 disposed on the light receiving surface.

  The imaging device 50 is a substantially rectangular chip on which a light receiving unit 51 such as a CCD or a CMOS sensor is formed. Note that the imaging device 50 may be a backside illumination type. An objective optical system 52 including a plurality of lenses is disposed on the light receiving surface of the imaging device 50 via a cover glass 53.

  The wiring board 30 has a substantially cross shape including the middle portion 31 and the extending portions 32 and 33 extending from the side of the middle portion 31. The wiring board 30 may be a single-sided wiring board, a multilayer wiring board, or an electronic component built-in wiring board.

  The flexible wiring board 30 uses, for example, a polyimide as a base, and a wiring pattern made of, for example, copper is disposed on both sides. In the wiring board 30, the front end region 31A is bonded to the back surface of the imaging element 50, and the cable 61 is connected to the rear end region.

  The main surface of the tip region 31A of the middle portion 31 of the wiring board 30 is bent 90 degrees with respect to the main surface of the middle portion 31. Then, although not shown, an external electrode disposed on the back surface of the imaging device 50 and a tip electrode of the wiring board 30 are joined. The electrical connection between the imaging element 50 and the wiring board 30 is not limited to the above configuration, and for example, a flying lead protruding from the tip end face of the wiring board 30 is joined to the external electrode of the light receiving surface of the imaging element 50 May be If the flying leads are bent 90 degrees, the end region 31A of the wiring board 30 may not be bent with respect to the middle portion 31.

  On the other hand, the main surface of the extending portion 32 is bent with respect to the main surface (the first main surface 30SA and the second main surface 30SB) of the middle portion 31 and the bending angle θ1 (see FIG. 5) is a suction pipe 21 is defined by contact. The main surface of the extended portion 33 is also bent with respect to the main surface of the intermediate portion 31, and the bending angle θ2 (see FIG. 5) is defined by contact with the insulator tube 22.

  The wiring board 30 is provided with a plurality of electronic components. The electronic component 49 with a small amount of heat generation, for example, a chip capacitor which is a passive component, is disposed on the first main surface 30SA of the middle portion 31 of the wiring board 30, while the drive ICs 41 and 42 which are active components. Are disposed on the second main surface 30SB of the extension portions 32 and 33. The driving IC is an integrated circuit (Integrated Circuit) component sometimes called a peripheral IC.

  Although the arrangement position of the drive ICs 41 and 42 is far from the arrangement position of the imaging device 50, since the extension portions 32 and 33 are bent, the diameter and the length of the tip portion 3A are small.

  The drive IC 41 is a high heat generation component having the largest amount of heat generation at the time of driving among the plurality of electronic components disposed on the wiring board 30. The drive IC 42 is a heat generation component having the same amount of heat generation as the drive IC 41 or a large amount of heat generation next to the drive IC 41. The drive ICs 41 and 42, which are heat-generating components, are disposed in the extension portions 32 and 33 so as to be apart from the distal end region 31A in which the imaging element 50 is disposed.

  Then, as shown in FIG. 3, the first main surface 30SA of the extending portion 32 is in contact with the outer surface of the suction pipe 21, and the first main surface 30SA of the extending portion 32 is with the outer surface of the insulator tube 22. It abuts.

  The suction tube 21 and the insulator tube 22 are preferably made of a material having high thermal conductivity, such as metal. However, since the suction pipe 21 and the like pass through the tip end portion 3A and have an opening on the tip end surface, the air cooling effect ensures good heat dissipation efficiency even if the material has a relatively low thermal conductivity, for example, a resin material such as PTFE. .

  As shown in FIG. 5, the wiring board 30 is inserted into the inside of the cylindrical body 20 in which the suction pipe 21 and the insulator pipe 22 have already been inserted while bending the extending portions 32 and 33. In FIG. 5, the signal cable 61 and the like are not shown.

  As shown in FIG. 3, the extending portions 32 and 33 are urged by the repulsive force of the bent portion of the wiring board 30 and abut on the suction pipe 21 and the insulator pipe 22. In other words, the bending angles θ1 and θ2 with respect to the main surface of the intermediate portion 31 of the main surfaces of the extending portions 32 and 33 are defined by abutting on the tubular members (the suction pipe 21 and the forceps pipe 22).

  In addition, since the flexible extending portions 32, 33 are biased, they are not in line contact but in surface contact when in contact with the tubular member. The extended portions 32 and 33 in surface contact with the tubular member have a large heat transfer area, so that the heat dissipation efficiency is good.

  As shown in FIG. 6, in the endoscope 2, the heat generated by the drive ICs 41 and 42 as heat generating components is dissipated through the suction pipe 21 and the forceps pipe 22. That is, the imaging device 50 is not located in the heat transfer path of the heat generated by the heat generating component.

  Therefore, the heat generated by the drive ICs 41 and 42 is transferred through the contact portion with the suction pipe 21 and the insulator pipe 22. The heat generated by the drive ICs 41 and 42 is hardly transferred to the imaging device 50, and therefore, there is no risk of adversely affecting the imaging device 50.

  That is, in the endoscope 2, there is no possibility that the image pickup element 50 is deteriorated due to excessive temperature rise, and the image quality is not deteriorated by thermal noise.

  In addition, at least one of the length, the shape, or the bending angle may be different between the extending portion 32 and the extending portion 33 extended from the side surface of the middle portion 31 of the wiring board 30. Further, since the wiring board 30 is a single flexible wiring board, the boundary between the intermediate portion 31 and the extending portions 32 and 33 is not clearly defined.

  Further, in the case where only the drive IC 41 is the high heat generation component that may affect the imaging element 50, the extension portion 33 is unnecessary. That is, the extending portions do not need to be extended from both side surfaces of the intermediate portion 31, respectively. In other words, the wiring board may include at least one extension.

  On the other hand, when there are three or more heat generating parts, three or more extending parts may be extended, or a plurality of heat generating parts may be provided in one extending part. . In addition, each extending portion may be in contact with any one of the tubular members through which the distal end portion 3A is inserted. Furthermore, a plurality of extension parts may be in contact with one tubular member.

  The wiring board 30 preferably has a heat transfer pattern along the heat transfer path of the heat-generating component, in addition to the wiring pattern for electrical connection. That is, the wiring board 30 does not contribute to the electrical connection. For example, it is preferable that the heat transfer pattern of the ground potential be disposed around the wiring pattern. The heat transfer pattern is made of a high thermal conductivity material such as copper or gold which is the same as the wiring pattern.

  For example, in a subtraction method in which unnecessary portions of the copper film on the surface of the substrate are removed to leave necessary portions as wiring patterns, the copper film is removed only in a frame shape along the outer periphery of the wiring pattern, leaving its periphery Thus, a heat transfer pattern can be formed.

  An endoscope having a wiring board with a heat transfer pattern from the heat transfer path of the heat generating component, ie, the portion where the heat generating component is disposed to the portion in contact with the tubular member, makes the heat generated by the heat generating component more efficient. The heat can be transferred to the tubular member.

  Here, as shown in FIG. 3, in the endoscope 2, the distal end side of the extension portions 32 and 33 of the wiring board 30 more than the contact portion with the tubular members (suction tube 21 and forceps tube 22), Drive ICs 41 and 42, which are heat generating components, are disposed. In other words, the drive ICs 41 and 42 are not disposed between the end side of the middle portion 31 of the extension portions 32 and 33 and the contact portion.

  For this reason, in the endoscope 2, there is no possibility that the heat generated by the heat-generating component, in particular, adversely affects the imaging element 50.

  In order to prevent heat generated by the heat-generating component from being transferred to the middle portion between the end of the middle portion 31 of the extension portions 32 and 33 and the contact portion, the heat transfer pattern is formed Preferably not.

Modification of First Embodiment
Next, an endoscope 2A of a modification of the first embodiment will be described. Since the endoscope 2A is similar to the endoscope 2, the components having the same functions are denoted by the same reference numerals and the description thereof will be omitted.

  As shown in FIG. 7, the endoscope 2A has a light emitting element 41A which is a heat-generating component at the distal end 3A of the insertion portion.

  The endoscope 2A has an imaging element 50A with a large number of pixels, which has a large amount of signal to be transmitted to the processor 5A. For this reason, in the electric signal transmission via the signal cable 61, the thickness of the cable becomes large, and it is not easy to reduce the diameter of the insertion portion.

  In the endoscope 2A, for transmission of the image signal output from the imaging element 50A, not optical signal transmission but optical signal transmission by a light signal through a thin optical fiber is used.

  Therefore, a light emitting element 41A for converting an electrical signal into an optical signal is disposed at the distal end 3A of the insertion portion. In the endoscope 2A, the clock signal supplied to the imaging device 50A is also transmitted to the distal end 3A via the same optical fiber as the image signal transmission. For this reason, a light receiving element 42A for converting an optical signal into an electric signal is disposed at the tip 3A.

  A light emitting element 41A such as an LED is a heat generating component. Therefore, although not shown, the light emitting element 41A is disposed in the extending portion 32, and the extending portion 32 is in contact with the suction pipe 21.

  The heat generated by the light emitting element 41A is transferred to the suction tube 21, so there is no risk of adversely affecting the imaging element 50A.

  The light receiving element 42A such as a photodiode is not an element generating a large amount of heat. For this reason, the light receiving element 42A does not have to be disposed in the extended portion in contact with the insulator tube 22 or the like, but may be disposed. Further, when the endoscope 2A further includes a drive IC with a large amount of heat generation, it is needless to say that it is preferable to dispose the drive IC in the extended portion in contact with the tubular member.

  The endoscope 2A has an imaging element 50A with a large number of pixels, but has a small diameter for transmitting a signal through an optical fiber. And although it has the light emitting element 41A which is a heating element, the imaging element 50A is not located in the thermal radiation path of the heat which the light emitting element 41A generated. Therefore, the image pickup element 50A is not deteriorated by the heat generated by the light emitting element 41A or the image quality is not deteriorated by the thermal noise.

  In the case where a plurality of heat generating components are disposed at the distal end portion 3A, the above effect is achieved if at least one heat generating component having the largest amount of heat generation is disposed in the extended portion in contact with the tubular member. Is obtained. The heat generating component is not limited to the drive IC or the light emitting element.

Second Embodiment
Next, an endoscope 2B of a second embodiment will be described. Since the endoscope 2B is similar to the endoscope 2, the components having the same functions are denoted by the same reference numerals and the description thereof will be omitted.

  As shown in FIG. 8, the wiring board 30B of the endoscope 2B is a cylindrical body whose distal end side is made of metal further than the portion where the drive ICs 41 and 42 which are heat generating components of the extending portions 32B and 33B are disposed. It is in surface contact with the inner surface of 20.

  For this reason, as shown in FIG. 9, the heat generated by the drive ICs 41 and 42 is transferred not only through the abutting tubular members (the suction pipe 21 and the insulator pipe 22) but also through the cylindrical body 20.

  In addition, it is preferable that the conductor film of the ground potential which consists of copper, for example is arrange | positioned by the front end side of extension part 32B, 33B. Heat is transferred more efficiently through the copper film with high thermal conductivity.

  The endoscope 2B has the effect of the endoscope 2 or the like, and further, there is no possibility that the heat generated by the drive ICs 41, 42 degrades the image pickup element 50 or the thermal noise degrades the image quality.

  The present invention is not limited to the above-described embodiment or modification, and various changes, modifications, and the like can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Endoscope system 2, 2A, 2B ... Endoscope 3 ... Insertion part 3A ... Tip part 20 ... Tube body 21 ... Suction pipe 22 ... Forceps pipe 23 ... Air pipe 24 ... Light guide 26 ... Sealing resin 30 ... Wiring board 31 Intermediate portion 31A Tip region 32, 33 Extension portion 41, 42 Drive IC
50: Imaging device

Claims (6)

An endoscope having a cylindrical body at the distal end portion of the insertion portion, in which an imaging element, a flexible wiring board, and a tubular member through which the distal end portion is inserted are disposed. A mirror,
The wiring board includes an intermediate portion connected to the imaging element, and an extending portion extending from a side of the intermediate portion;
The extended portion in which the heat generating component is disposed is in contact with the tubular member;
An endoscope characterized in that the heat-generating component is disposed on the tip side of a contact portion of the extension portion with the tubular member.   The main surface of the extension portion is bent relative to the main surface of the middle portion, and the bending angle is defined by abutting on the tubular member. An endoscope.   The front end side is surface-contacting with the inner surface of the said cylinder rather than the part by which the said heat-emitting component of the said extending part is arrange | positioned, The any one of the Claims 1 or 3 characterized by the above-mentioned. Endoscope described.   The endoscope according to any one of claims 1, 3 and 4, wherein the heat generating component is an integrated circuit component that supplies a drive signal to the imaging device.   The endoscope according to any one of claims 1 to 4, wherein the heat generating component is a light emitting element that converts an electrical signal from the image pickup device into an optical signal. . The wiring board includes the extending portion extending from each side of the middle portion;
The endoscope according to any one of claims 1 to 6, wherein the heat generating component is disposed in each of the extension portions.

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