JP6557162B2 - Endoscope - Google Patents

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JP6557162B2
JP6557162B2 JP2016034400A JP2016034400A JP6557162B2 JP 6557162 B2 JP6557162 B2 JP 6557162B2 JP 2016034400 A JP2016034400 A JP 2016034400A JP 2016034400 A JP2016034400 A JP 2016034400A JP 6557162 B2 JP6557162 B2 JP 6557162B2
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circuit board
endoscope
image sensor
imaging device
solid
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JP2017148298A (en
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亮 北野
亮 北野
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Fujifilm Corp
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Priority to EP17156422.2A priority patent/EP3210523A1/en
Priority to CN201710099444.9A priority patent/CN107115088B/en
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/005—Flexible endoscopes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2476—Non-optical details, e.g. housings, mountings, supports
    • G02B23/2484—Arrangements in relation to a camera or imaging device
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00002—Operational features of endoscopes
    • A61B1/00025—Operational features of endoscopes characterised by power management
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/00071—Insertion part of the endoscope body
    • A61B1/0008—Insertion part of the endoscope body characterised by distal tip features
    • A61B1/00096—Optical elements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00131—Accessories for endoscopes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00163—Optical arrangements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/005—Flexible endoscopes
    • A61B1/0051—Flexible endoscopes with controlled bending of insertion part
    • A61B1/0055—Constructional details of insertion parts, e.g. vertebral elements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • A61B1/051—Details of CCD assembly
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/06—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor with illuminating arrangements
    • A61B1/0661—Endoscope light sources
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2423—Optical details of the distal end
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2446—Optical details of the image relay
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B23/00—Telescopes, e.g. binoculars; Periscopes; Instruments for viewing the inside of hollow bodies; Viewfinders; Optical aiming or sighting devices
    • G02B23/24—Instruments or systems for viewing the inside of hollow bodies, e.g. fibrescopes
    • G02B23/2407—Optical details
    • G02B23/2461—Illumination
    • G02B23/2469—Illumination using optical fibres

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Description

本発明は、内視鏡に関する。   The present invention relates to an endoscope.

内視鏡の挿入部の先端部に搭載される撮像装置は、一般に、イメージセンサと、イメージセンサが実装される回路基板とを備え、挿入部に挿通された複数の電線が回路基板に接続される。   An imaging device mounted at the distal end portion of an insertion portion of an endoscope generally includes an image sensor and a circuit board on which the image sensor is mounted, and a plurality of wires inserted through the insertion portion are connected to the circuit board. The

特許文献１に記載された撮像装置は、イメージセンサと回路基板とを覆うケース部材（カバー部材）を有している。   The imaging device described in Patent Literature 1 includes a case member (cover member) that covers the image sensor and the circuit board.

特開２０１５−５８１１８号公報JP-A-2015-58118

イメージセンサと回路基板との接続を保護し、且つ、回路基板と電線との接続の耐久性を高める上では、イメージセンサから回路基板と電線との接続部までを含む範囲を剛性の高いケース部材で覆うことが望ましい。しかし、イメージセンサと回路基板の全体をケース部材で覆う構成においては、イメージセンサに対する回路基板の取り付け位置に誤差が生じると、イメージセンサと回路基板をケース部材に収容できなくなる場合がある。なお、取り付け位置の誤差を見込んでケース部材の寸法を大きめに選定すると、撮像装置の大型化を招き、内視鏡の挿入部の細径化を阻害してしまうため好ましくない。   In order to protect the connection between the image sensor and the circuit board and increase the durability of the connection between the circuit board and the electric wire, the case member having a high rigidity is included in the range including the connection portion between the image sensor and the circuit board and the electric wire. It is desirable to cover with. However, in the configuration in which the entire image sensor and the circuit board are covered with the case member, if an error occurs in the mounting position of the circuit board with respect to the image sensor, the image sensor and the circuit board may not be accommodated in the case member. Note that it is not preferable to select a large case member size in consideration of an attachment position error because the size of the imaging apparatus is increased and the diameter of the insertion portion of the endoscope is hindered.

本発明は、上述した事情に鑑みなされたものであり、イメージセンサに対する回路基板の取り付け位置に誤差が生じてもこのイメージセンサと回路基板をケース部材に収容可能な内視鏡を提供することを目的とする。   The present invention has been made in view of the above-described circumstances, and provides an endoscope capable of accommodating the image sensor and the circuit board in a case member even if an error occurs in the mounting position of the circuit board with respect to the image sensor. Objective.

本発明は下記構成からなる。
体腔内に挿入される挿入部の先端部に撮像装置を備えた内視鏡であって、
前記撮像装置は、
受像面が前記挿入部の長手方向に交差するよう配置され、前記受像面にて結像された光学画像を光電変換する固体撮像素子と、
前記固体撮像素子の前記受像面とは反対側の端子が設けられた面に対向し、前記固体撮像素子の前記端子と電気的に接続する接続面を有したリジッド回路基板と、
前記固体撮像素子及び前記回路基板の一部を覆うカバー部を含むケース部材と、を有し、
前記リジッド回路基板は、前記挿入部の長手方向に直交する幅方向の長さがそれぞれ異なる幅広部及び幅狭部を有し、
前記カバー部は、一対の側壁と前記一対の側壁に架け渡された天井壁を有し、前記一対の側壁には、前記幅方向に見て、前記リジッド回路基板の前記幅広部と直交する方向で前記幅広部と対応する位置に第１切欠部が設けられた、内視鏡。 The present invention has the following configuration.
An endoscope including an imaging device at a distal end portion of an insertion portion to be inserted into a body cavity
The imaging device
A solid-state imaging device that is arranged so that an image receiving surface intersects with a longitudinal direction of the insertion portion, and photoelectrically converts an optical image formed on the image receiving surface;
A rigid circuit board having a connection surface facing a surface provided with a terminal opposite to the image receiving surface of the solid-state image sensor and electrically connected to the terminal of the solid-state image sensor;
A case member including a cover portion covering a part of the solid-state imaging device and the circuit board,
The rigid circuit board has a wide part and a narrow part with different lengths in the width direction perpendicular to the longitudinal direction of the insertion part,
The cover portion has a pair of side walls and a ceiling wall spanned between the pair of side walls, and the pair of side walls has a direction orthogonal to the wide portion of the rigid circuit board when viewed in the width direction. An endoscope in which a first cutout is provided at a position corresponding to the wide portion.

本発明によれば、リジッド回路基板は幅広部及び幅狭部を有し、ケース部材のカバー部の一対の側壁には、挿入部の長手方向に直交する幅方向に見て、幅広部と直交する方向でこの幅広部と対応する位置に第１切欠部が設けられているため、イメージセンサに対する回路基板の取り付け位置に誤差が生じても、イメージセンサと回路基板をケース部材に収容できる。その結果、取り付け位置の誤差を見込んでケース部材の寸法を大きめに選定する必要がないため、内視鏡の挿入部の細径化が可能であり、かつ、ケース部材による撮像装置の耐久性を高めることができる。 According to the present invention, the rigid circuit board has a wide portion and a narrow portion, and the pair of side walls of the cover portion of the case member is orthogonal to the wide portion when viewed in the width direction orthogonal to the longitudinal direction of the insertion portion. Since the first cutout portion is provided at a position corresponding to the wide portion in the direction in which the image sensor is mounted, the image sensor and the circuit board can be accommodated in the case member even if an error occurs in the mounting position of the circuit board with respect to the image sensor. As a result, it is not necessary to select a large case member dimension in view of the attachment position error, so that the diameter of the insertion portion of the endoscope can be reduced, and the durability of the imaging device by the case member can be increased. Can be increased.

本発明の実施形態を説明するための、内視鏡システムの一例の構成図である。It is a lineblock diagram of an example of an endoscope system for explaining an embodiment of the present invention. 図１の内視鏡の挿入部の先端部に搭載された撮像装置の斜視図である。It is a perspective view of the imaging device mounted in the front-end | tip part of the insertion part of the endoscope of FIG. 図１の内視鏡の挿入部の先端部に搭載された撮像装置の別角度の斜視図である。It is a perspective view of another angle of the imaging device mounted in the front-end | tip part of the insertion part of the endoscope of FIG. 図２の撮像装置の下面図である。It is a bottom view of the imaging device of FIG. 図２の撮像装置の内部の斜視図である。FIG. 3 is a perspective view of the inside of the imaging device of FIG. 2. 図２の撮像装置の断面図である。It is sectional drawing of the imaging device of FIG. 図１の内視鏡の挿入部の先端部及び湾曲部の横断面図である。It is a cross-sectional view of the front-end | tip part and bending part of the insertion part of the endoscope of FIG. 図１の内視鏡の挿入部の先端部及び湾曲部の縦断面図である。It is a longitudinal cross-sectional view of the front-end | tip part and bending part of the insertion part of the endoscope of FIG.

図１は、本発明の実施形態を説明するための、内視鏡システムの一例を示す。   FIG. 1 shows an example of an endoscope system for explaining an embodiment of the present invention.

内視鏡システム１は、内視鏡２と、光源ユニット３と、プロセッサユニット４とを備える。内視鏡２は、被検体内に挿入される挿入部６と、挿入部６に連なる操作部７と、操作部７から延びるユニバーサルコード８とを有し、挿入部６は、先端部１０と、先端部１０に連なる湾曲部１１と、湾曲部１１と操作部７とを繋ぐ軟性部１２とで構成されている。   The endoscope system 1 includes an endoscope 2, a light source unit 3, and a processor unit 4. The endoscope 2 includes an insertion portion 6 that is inserted into a subject, an operation portion 7 that is continuous with the insertion portion 6, and a universal cord 8 that extends from the operation portion 7. The bending portion 11 is connected to the distal end portion 10, and the flexible portion 12 connects the bending portion 11 and the operation portion 7.

先端部１０には、観察部位を照明するための照明光を出射する照明光学系や、観察部位を撮像する撮像装置及び撮像光学系などが設けられている。湾曲部１１は挿入部６の長手軸と直交する方向に湾曲可能に構成されており、湾曲部１１の湾曲動作は操作部７にて操作される。また、軟性部１２は、挿入部６の挿入経路の形状に倣って変形可能な程に比較的柔軟に構成されている。   The distal end portion 10 is provided with an illumination optical system that emits illumination light for illuminating the observation site, an imaging device and an imaging optical system that image the observation site, and the like. The bending portion 11 is configured to be able to bend in a direction orthogonal to the longitudinal axis of the insertion portion 6, and the bending operation of the bending portion 11 is operated by the operation portion 7. Further, the flexible portion 12 is configured to be relatively flexible so as to be deformable following the shape of the insertion path of the insertion portion 6.

操作部７には、先端部１０の撮像装置の撮像動作を操作するボタンや、湾曲部１１の湾曲動作を操作するノブなどが設けられている。また、操作部７には、電気メスなどの処置具が導入される導入口１３が設けられており、挿入部６の内部には、導入口１３から先端部１０に達し、処置具が挿通される処置具チャンネル１４が設けられている。   The operation unit 7 is provided with buttons for operating the imaging operation of the imaging device at the distal end 10, a knob for operating the bending operation of the bending unit 11, and the like. The operation unit 7 is provided with an introduction port 13 through which a treatment instrument such as an electric knife is introduced. The treatment unit is inserted into the insertion unit 6 from the introduction port 13 to the distal end portion 10. A treatment instrument channel 14 is provided.

ユニバーサルコード８の末端にはコネクタ９が設けられ、内視鏡２は、コネクタ９を介して、先端部１０の照明光学系から出射される照明光を生成する光源ユニット３、及び先端部１０の撮像装置によって取得される映像信号を処理するプロセッサユニット４と接続される。プロセッサユニット４は、入力された映像信号を処理して観察部位の映像データを生成し、生成した映像データをモニタ５に表示させ、また記録する。   A connector 9 is provided at the end of the universal cord 8, and the endoscope 2 generates the illumination light emitted from the illumination optical system of the distal end portion 10 via the connector 9, and the distal end portion 10. It is connected to a processor unit 4 that processes a video signal acquired by the imaging device. The processor unit 4 processes the input video signal to generate video data of the observation site, and displays and records the generated video data on the monitor 5.

挿入部６及び操作部７並びにユニバーサルコード８の内部にはライトガイドや電線群が収容されている。光源ユニット３にて生成された照明光がライトガイドを介して先端部１０の照明光学系に導光され、先端部１０の撮像装置とプロセッサユニット４との間で信号や電力が電線群を介して伝送される。   A light guide and a wire group are accommodated in the insertion portion 6, the operation portion 7, and the universal cord 8. Illumination light generated by the light source unit 3 is guided to the illumination optical system of the distal end portion 10 through the light guide, and signals and power are transmitted between the imaging device of the distal end portion 10 and the processor unit 4 via the electric wire group. Is transmitted.

図２から図６は、挿入部６の先端部１０に搭載された撮像装置の構成を示す。   2 to 6 show the configuration of the imaging device mounted on the distal end portion 10 of the insertion portion 6.

撮像装置２０は、ＣＣＤ（Charge Coupled Device）イメージセンサやＣＭＯＳ（Complementaly Metal Oxide Semiconductor）イメージセンサなどのイメージセンサ（固体撮像素子）２１と、イメージセンサ２１の受像面２１ａに被写体像を結像させる撮像光学系を収納した鏡筒２２と、イメージセンサ２１及び鏡筒２２を保持したセンサホルダ２３と、イメージセンサ２１が実装された回路基板２４と、イメージセンサ２１及び回路基板２４の一部を覆うケース部材２８と、を備える。   The imaging device 20 is an image sensor (solid-state imaging device) 21 such as a charge coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor, and an imaging that forms a subject image on an image receiving surface 21 a of the image sensor 21. A lens barrel 22 containing an optical system, a sensor holder 23 holding the image sensor 21 and the lens barrel 22, a circuit board 24 on which the image sensor 21 is mounted, and a case covering a part of the image sensor 21 and the circuit board 24 And a member 28.

センサホルダ２３は、撮像光学系の光軸Ｂ（図６）に沿って移動可能に鏡筒２２を保持しており、鏡筒２２が移動されて撮像光学系に対するイメージセンサ２１の位置が調整可能となっている。鏡筒２２は、イメージセンサ２１の位置決めがなされた後に、例えば接着剤などによってセンサホルダ２３に固定される。   The sensor holder 23 holds the lens barrel 22 so as to be movable along the optical axis B (FIG. 6) of the imaging optical system, and the position of the image sensor 21 relative to the imaging optical system can be adjusted by moving the lens barrel 22. It has become. After the image sensor 21 is positioned, the lens barrel 22 is fixed to the sensor holder 23 with, for example, an adhesive.

イメージセンサ２１は、その受像面２１ａが挿入部６の長手方向に交差して配置され、受像面２１ａにて結像された光学画像を光電変換する。受像面２１ａの法線方向に見た場合のイメージセンサ２１の外径は１ｍｍ四方以下である。イメージセンサ２１の受像面２１ａとは反対側の背面には信号や電力が入出力される複数の端子２６が設けられている。   The image sensor 21 is arranged such that the image receiving surface 21a intersects the longitudinal direction of the insertion portion 6, and photoelectrically converts an optical image formed on the image receiving surface 21a. The outer diameter of the image sensor 21 when viewed in the normal direction of the image receiving surface 21a is 1 mm square or less. A plurality of terminals 26 through which signals and power are input and output are provided on the back surface of the image sensor 21 opposite to the image receiving surface 21a.

回路基板２４は、センサ接続部３０と、電線接続部３１とを有する。センサ接続部３０は、イメージセンサ２１の受像面２１ａとは反対側の端子２６が設けられた面に対向し、イメージセンサ２１の端子２６と電気的に接続する接続面３０ａを有している。   The circuit board 24 includes a sensor connection part 30 and a wire connection part 31. The sensor connection unit 30 has a connection surface 30 a that faces the surface on which the terminal 26 opposite to the image receiving surface 21 a of the image sensor 21 is provided and is electrically connected to the terminal 26 of the image sensor 21.

センサ接続部３０の接続面３０ａには複数のランド２５が形成されている。センサ接続部３０はイメージセンサ２１の背面に添えられ、イメージセンサ２１の背面に設けられた端子２６がセンサ接続部３０のランド２５に接続されている。   A plurality of lands 25 are formed on the connection surface 30 a of the sensor connection unit 30. The sensor connection unit 30 is attached to the back surface of the image sensor 21, and a terminal 26 provided on the back surface of the image sensor 21 is connected to the land 25 of the sensor connection unit 30.

回路基板２４は、挿入部６の長手方向に直交する幅方向（図４の矢印Ｗの方向）に見てＬ字状に形成されたリジッド回路基板であって、センサ接続部３０と電線接続部３１とは略直交している。すなわち、本実施形態では、回路基板２４を構成する２つの脚部のうちの一方がセンサ接続部３０を構成し、他方が電線接続部３１を構成している。センサ接続部３０は、イメージセンサ２１の背面に添えられてイメージセンサ２１の受像面２１ａと平行に配置されている。電線接続部３１は受像面２１ａと略垂直に配置され、イメージセンサ２１の背後で受像面２１ａの法線方向に延びている。なお、回路基板２４はフレキシブル回路基板であってもよい。   The circuit board 24 is a rigid circuit board formed in an L shape when viewed in the width direction (the direction of the arrow W in FIG. 4) orthogonal to the longitudinal direction of the insertion portion 6, and includes the sensor connection portion 30 and the wire connection portion. 31 is substantially orthogonal. That is, in the present embodiment, one of the two legs constituting the circuit board 24 constitutes the sensor connection part 30 and the other constitutes the electric wire connection part 31. The sensor connection unit 30 is attached to the back surface of the image sensor 21 and is arranged in parallel with the image receiving surface 21 a of the image sensor 21. The wire connection portion 31 is disposed substantially perpendicular to the image receiving surface 21 a and extends in the normal direction of the image receiving surface 21 a behind the image sensor 21. The circuit board 24 may be a flexible circuit board.

電線接続部３１にもまた複数のランド３２が形成されており、電線接続部３１の基板面に沿って平面状に並べられた複数の電線２７それぞれの端末部の先端部分に露出された中心導体が電線接続部３１のランド３２に接続されている。回路基板２４及び回路基板２４に実装されたイメージセンサ２１は、複数の電線２７を介してプロセッサユニット４に接続されている。なお、複数の電線２７によって伝送ケーブルが構成されている。   A plurality of lands 32 are also formed in the wire connection portion 31, and the central conductor exposed at the tip portion of each end portion of the plurality of wires 27 arranged in a plane along the substrate surface of the wire connection portion 31. Is connected to the land 32 of the wire connecting portion 31. The circuit board 24 and the image sensor 21 mounted on the circuit board 24 are connected to the processor unit 4 via a plurality of electric wires 27. In addition, the transmission cable is comprised by the some electric wire 27. FIG.

回路基板２４は、挿入部６の長手方向に直交する幅方向（図４の矢印Ｗの方向）の長さがそれぞれ異なる幅広部２４Ａ及び幅狭部２４Ｂを有している。幅広部２４Ａは、電線接続部３１の電線２７が接続される側の端部３１ａからセンサ接続部３０の近傍に至る部分に形成されている。回路基板２４の幅広部２４Ａ以外の部分が幅狭部２４Ｂを形成し、センサ接続部３０は幅狭部２４Ｂに属する。   The circuit board 24 has a wide portion 24A and a narrow portion 24B having different lengths in the width direction (the direction of the arrow W in FIG. 4) orthogonal to the longitudinal direction of the insertion portion 6. The wide portion 24 </ b> A is formed in a portion from the end portion 31 a on the side where the electric wire 27 of the electric wire connecting portion 31 is connected to the vicinity of the sensor connecting portion 30. A portion other than the wide portion 24A of the circuit board 24 forms a narrow portion 24B, and the sensor connection portion 30 belongs to the narrow portion 24B.

ケース部材２８は、複数の電線２７を保持する保持部３３と、イメージセンサ２１及び回路基板２４の一部を覆うカバー部３４とを有する。   The case member 28 includes a holding portion 33 that holds the plurality of electric wires 27 and a cover portion 34 that covers a part of the image sensor 21 and the circuit board 24.

カバー部３４は、一対の側壁３５及び一対の側壁３５に架け渡された天井壁３６によって構成されている。   The cover portion 34 includes a pair of side walls 35 and a ceiling wall 36 that spans the pair of side walls 35.

一対の側壁３５は、イメージセンサ２１の受像面２１ａの法線に沿う回路基板２４の一対の側面に沿って設けられている。一対の側壁３５の各々には、挿入部６の長手方向に直交する幅方向（図４の矢印Ｗの方向）に見て、回路基板２４の幅広部２４Ａと干渉せずに、幅広部２４Ａと直交する方向で幅広部２４Ａと対応する位置に第１切欠部５１が設けられている。また、回路基板２４の幅狭部２４Ｂの一部は、イメージセンサ２１側に延びる一対の側壁３５によって隙間Ｄ（図４）を介して幅方向（矢印Ｗ方向）に挟まれている。一対の側壁３５は、イメージセンサ２１側の各先端部が接着剤などによってセンサホルダ２３に固定される。   The pair of side walls 35 are provided along the pair of side surfaces of the circuit board 24 along the normal line of the image receiving surface 21 a of the image sensor 21. In each of the pair of side walls 35, the wide portion 24 </ b> A and the wide portion 24 </ b> A do not interfere with the wide portion 24 </ b> A of the circuit board 24 when viewed in the width direction (the direction of the arrow W in FIG. 4) perpendicular to the longitudinal direction of the insertion portion 6. A first notch 51 is provided at a position corresponding to the wide portion 24 </ b> A in the orthogonal direction. A part of the narrow portion 24B of the circuit board 24 is sandwiched in the width direction (arrow W direction) via a gap D (FIG. 4) by a pair of side walls 35 extending to the image sensor 21 side. As for a pair of side wall 35, each front-end | tip part by the side of the image sensor 21 is fixed to the sensor holder 23 with an adhesive agent.

天井壁３６は、回路基板２４の電線接続部３１のランド３２が形成されている基板面、及びランド３２に接続された電線２７の端末部を覆っている。天井壁３６の、回路基板２４の接続面３０ａが設けられた脚部、すなわちセンサ接続部３０の端部側には、第２切欠部５２が設けられている。第２切欠部５２は、天井壁３６のセンサ接続部３０に対応する位置からイメージセンサ２１側に設けられている。   The ceiling wall 36 covers the substrate surface of the circuit board 24 where the lands 32 of the electric wire connection portion 31 are formed, and the terminal portions of the electric wires 27 connected to the lands 32. A second notch 52 is provided on the leg of the ceiling wall 36 where the connection surface 30 a of the circuit board 24 is provided, that is, on the end side of the sensor connection 30. The second cutout portion 52 is provided on the image sensor 21 side from a position corresponding to the sensor connection portion 30 of the ceiling wall 36.

保持部３３は、カバー部３４の一対の側壁３５それぞれに設けられた一対の延長側壁３７によって構成されている。一対の延長側壁３７は、イメージセンサ２１の受像面２１ａの法線に沿ってカバー部３４の後方に延びており、回路基板２４の電線接続部３１の基板面に沿って平面状に並ぶ複数の電線２７を並び方向に挟んで配置されている。   The holding portion 33 includes a pair of extended side walls 37 provided on each of the pair of side walls 35 of the cover portion 34. The pair of extended side walls 37 extend behind the cover portion 34 along the normal line of the image receiving surface 21 a of the image sensor 21, and are arranged in a plurality of planes along the substrate surface of the wire connection portion 31 of the circuit board 24. It arrange | positions on both sides of the electric wire 27 in the row direction.

一対の延長側壁３７それぞれの先端部には押え片３８が設けられており、押え片３８は、一対の延長側壁３７の間に挟まれた複数の電線２７に電線接続部３１の基板面とは反対側から重なって配置されている。これにより、電線接続部３１の基板面上での複数の電線２７の平面状の並びが、電線接続部３１の後方においても維持される。   A holding piece 38 is provided at the tip of each of the pair of extended side walls 37, and the holding piece 38 is connected to the plurality of electric wires 27 sandwiched between the pair of extended side walls 37 from the substrate surface of the electric wire connecting portion 31. Arranged from the opposite side. Thereby, the planar arrangement of the plurality of electric wires 27 on the substrate surface of the electric wire connection portion 31 is maintained even behind the electric wire connection portion 31.

複数の電線２７に重なった押え片３８は、カバー部３４の天井壁３６よりも電線接続部３１側に寄って配置されており、押え片３８と天井壁３６との間には段差が形成されている。   The pressing piece 38 that overlaps the plurality of electric wires 27 is arranged closer to the electric wire connecting portion 31 than the ceiling wall 36 of the cover portion 34, and a step is formed between the pressing piece 38 and the ceiling wall 36. ing.

図７及び図８は、撮像装置２０が搭載された挿入部６の先端部１０、及び湾曲部１１の構成を示す。   7 and 8 show the configuration of the distal end portion 10 and the bending portion 11 of the insertion portion 6 on which the imaging device 20 is mounted.

先端部１０には、上記の撮像装置２０と、処置具チャンネル１４の先端部とが設けられており、また、ライトガイド４０を介して光源ユニット３から導光される照明光を出射する照明光学系なども設けられる。   The distal end portion 10 is provided with the imaging device 20 and the distal end portion of the treatment instrument channel 14, and illumination optics that emits illumination light guided from the light source unit 3 through the light guide 40. A system is also provided.

イメージセンサ２１及び鏡筒２２を保持したセンサホルダ２３は、例えばステンレス鋼材などの金属材料からなる先端硬質部４１に形成された収容孔に収容され、先端硬質部４１に固定されている。処置具チャンネル１４の先端部や照明光学系もまた、先端硬質部４１に形成された収容孔にそれぞれ収容され、先端硬質部４１に固定されている。   The sensor holder 23 holding the image sensor 21 and the lens barrel 22 is housed in a housing hole formed in the hard tip portion 41 made of a metal material such as stainless steel, and is fixed to the hard tip portion 41. The distal end portion of the treatment instrument channel 14 and the illumination optical system are also accommodated in accommodation holes formed in the distal end hard portion 41 and fixed to the distal end hard portion 41.

先端硬質部４１に固定されたセンサホルダ２３によって保持されているイメージセンサ２１の受像面２１ａは挿入部６の長手軸Ａに対して略垂直に配置されており、受像面２１ａに対して略垂直な電線接続部３１は長手軸Ａに沿って配置されている。   The image receiving surface 21a of the image sensor 21 held by the sensor holder 23 fixed to the distal end hard portion 41 is disposed substantially perpendicular to the longitudinal axis A of the insertion portion 6 and is substantially perpendicular to the image receiving surface 21a. The wire connection part 31 is arranged along the longitudinal axis A.

湾曲部１１は、長手軸Ａに沿って並ぶ複数の環状の駒４２を含み、これらの駒４２により、撮像装置２０の回路基板２４に接続された複数の電線２７や処置具チャンネル１４やライトガイド４０などを収容する管体として構成されている。   The bending portion 11 includes a plurality of annular pieces 42 arranged along the longitudinal axis A. With these pieces 42, the plurality of electric wires 27 connected to the circuit board 24 of the imaging device 20, the treatment instrument channel 14, and the light guide. 40 etc. are comprised as a tubular body.

隣り合う二つの駒４２は、長手軸Ａに略直交する軸線上に配置された一対のピン４３によって軸線まわりに回動可能に連結されている。隣り合う二つの駒４２の個々の回動が合わさることによって、湾曲部１１は全体として湾曲する。   Two adjacent pieces 42 are connected to each other by a pair of pins 43 arranged on an axis substantially orthogonal to the longitudinal axis A so as to be rotatable around the axis. The bending portion 11 is bent as a whole by combining the individual rotations of the two adjacent pieces 42.

湾曲部１１は、操作部７から軟性部１２（図１参照）を経て湾曲部１１に挿通された一対のワイヤ４４によって動作される。操作部７での操作に伴い、一対のワイヤ４４のうち一方のワイヤ４４が牽引され、他方のワイヤ４４が繰り出され、これにより湾曲部１１は動作されて湾曲する。   The bending portion 11 is operated by a pair of wires 44 inserted from the operation portion 7 through the flexible portion 12 (see FIG. 1) into the bending portion 11. In accordance with the operation at the operation unit 7, one wire 44 of the pair of wires 44 is pulled, and the other wire 44 is drawn out, whereby the bending unit 11 is operated to bend.

湾曲部１１を構成する複数の駒４２のうち、先端部１０側の先頭の駒４２が先端部１０の先端硬質部４１に接合され、先端部１０と湾曲部１１とは接続されている。センサホルダ２３が先端硬質部４１に固定された撮像装置２０の回路基板２４及びケース部材２８は、挿入部６において挿入部６の軸方向に先端部１０に隣接する部位である先頭の駒４２の内側に配置されている。   Of the plurality of pieces 42 constituting the bending portion 11, the leading piece 42 on the tip portion 10 side is joined to the tip hard portion 41 of the tip portion 10, and the tip portion 10 and the bending portion 11 are connected. The circuit board 24 and the case member 28 of the imaging device 20 in which the sensor holder 23 is fixed to the distal end hard portion 41 are formed on the leading piece 42 that is a portion adjacent to the distal end portion 10 in the insertion portion 6 in the axial direction. Arranged inside.

先頭の駒４２と先頭の駒４２に隣り合う駒４２とを連結している一対のピン４３それぞれの頭部４３ａは、これらの駒４２の内径側に突出している。一対のピン４３の間は、挿入部６の軸方向と直交する一対のピン４３の対向方向に狭窄しており、対向方向と平行な方向の挿入部６の内径が一対のピン４３の配置箇所を挿入部６の軸方向に挟み込む前後の箇所より小さい狭窄部となっている。   The heads 43 a of the pair of pins 43 that connect the top piece 42 and the piece 42 adjacent to the top piece 42 protrude to the inner diameter side of these pieces 42. The space between the pair of pins 43 is narrowed in the opposing direction of the pair of pins 43 orthogonal to the axial direction of the insertion portion 6, and the inner diameter of the insertion portion 6 in the direction parallel to the opposing direction is the location where the pair of pins 43 are disposed. Is a narrowed portion smaller than the portion before and after the insertion portion 6 is sandwiched in the axial direction.

先頭の駒４２の内側に配置されているケース部材２８の保持部３３は、挿入部６の内部の狭窄部である一対のピン４３の間に配置されており、一対のピン４３の間で、回路基板２４の電線接続部３１に接続された複数の電線２７を保持している。   The holding portion 33 of the case member 28 disposed inside the top piece 42 is disposed between a pair of pins 43 that are narrow portions inside the insertion portion 6, and between the pair of pins 43, A plurality of electric wires 27 connected to the electric wire connection portion 31 of the circuit board 24 are held.

上記説明した本実施形態によれば、回路基板２４は、挿入部６の長手方向に直交する幅方向（図４の矢印Ｗの方向）の長さがそれぞれ異なる幅広部２４Ａ及び幅狭部２４Ｂを有し、ケース部材２８のカバー部３４の一対の側壁３５には、回路基板２４の幅広部２４Ａと対応する位置に第１切欠部５１が設けられている。このため、イメージセンサ２１に対する回路基板２４の取り付け位置に、図４に示す矢印Ｗの方向の誤差が生じても、回路基板２４の幅広部２４Ａとケース部材２８とが干渉せずに、イメージセンサ２１と回路基板２４をケース部材２８に収容できる。また、ケース部材２８のカバー部３４の天井壁３６には、センサ接続部３０に対応する位置からイメージセンサ２１側に第２切欠部５２が設けられている。このため、イメージセンサ２１に対する回路基板２４の取り付け位置に、図４に示す矢印Ｗに垂直な天井壁３６方向の誤差が生じても、回路基板２４とケース部材２８とが干渉せずに、イメージセンサ２１と回路基板２４をケース部材２８に収容できる。その結果、取付位置の誤差を見込んでケース部材２８の寸法を大きめに選定する必要がないため、内視鏡２の挿入部６の細径化が可能であり、かつ、ケース部材２８による撮像装置２０の耐久性を高めることができる。特に本実施形態ではイメージセンサ２１の外径が１ｍｍ四方以下であり、撮像装置２０の寸法に高い精度が求められるが、上述したように回路基板２４とケース部材２８とが干渉しないため、撮像装置２０を高い精度で小型化できる。   According to the present embodiment described above, the circuit board 24 includes the wide portion 24A and the narrow portion 24B having different lengths in the width direction (direction of the arrow W in FIG. 4) orthogonal to the longitudinal direction of the insertion portion 6. The first cutout 51 is provided at a position corresponding to the wide portion 24 </ b> A of the circuit board 24 on the pair of side walls 35 of the cover portion 34 of the case member 28. Therefore, even if an error in the direction of the arrow W shown in FIG. 4 occurs at the position where the circuit board 24 is attached to the image sensor 21, the wide portion 24A of the circuit board 24 and the case member 28 do not interfere with each other, and the image sensor 21 and the circuit board 24 can be accommodated in the case member 28. Further, a second notch 52 is provided on the ceiling wall 36 of the cover portion 34 of the case member 28 from the position corresponding to the sensor connection portion 30 on the image sensor 21 side. Therefore, even if an error in the direction of the ceiling wall 36 perpendicular to the arrow W shown in FIG. 4 occurs in the mounting position of the circuit board 24 with respect to the image sensor 21, the circuit board 24 and the case member 28 do not interfere with each other, and the image The sensor 21 and the circuit board 24 can be accommodated in the case member 28. As a result, since it is not necessary to select a larger dimension of the case member 28 in view of an attachment position error, the diameter of the insertion portion 6 of the endoscope 2 can be reduced, and the imaging device using the case member 28 The durability of 20 can be increased. In particular, in the present embodiment, the outer diameter of the image sensor 21 is 1 mm square or less, and high accuracy is required for the dimensions of the imaging device 20. However, as described above, the circuit board 24 and the case member 28 do not interfere with each other. 20 can be miniaturized with high accuracy.

また、回路基板２４には、複数の電線２７が幅広部２４Ａに接続されているので、回路基板２４と電線２７との電気的接続部であるランド３２の面積を小さくする必要がない。よって、回路基板２４に対する複数の電線２７の接続強度の低下を招くことはない。   In addition, since the plurality of electric wires 27 are connected to the wide portion 24 </ b> A on the circuit board 24, it is not necessary to reduce the area of the land 32 that is an electrical connection portion between the circuit board 24 and the electric wires 27. Therefore, the connection strength of the plurality of electric wires 27 to the circuit board 24 is not reduced.

また、回路基板２４の幅狭部２４Ｂの一部がケース部材２８の一対の側壁３５によって隙間Ｄ（図４）を介して挟まれているので、イメージセンサ２１に対する回路基板２４の取り付け時に、図４に示す矢印Ｗの方向に隙間Ｄ分の誤差が生じても、この誤差は隙間Ｄの存在により許容される。   In addition, since a part of the narrow portion 24B of the circuit board 24 is sandwiched between the pair of side walls 35 of the case member 28 via the gap D (FIG. 4), the circuit board 24 is attached to the image sensor 21 when the circuit board 24 is attached. Even if an error corresponding to the gap D occurs in the direction of the arrow W shown in FIG. 4, this error is allowed due to the presence of the gap D.

なお、本実施形態では、回路基板２４がＬ字状に形成されているが、その他の形状、例えば平板状の回路基板２４を採用することも可能である。   In the present embodiment, the circuit board 24 is formed in an L shape, but other shapes, for example, a flat circuit board 24 may be employed.

以上説明したとおり、本明細書に開示された内視鏡は、体腔内に挿入される挿入部の先端部に撮像装置を備えた内視鏡であって、上記撮像装置は、受像面にて結像された光学画像を光電変換する固体撮像素子と、上記固体撮像素子の上記受像面とは反対側の端子が設けられた面に対向し、上記固体撮像素子の上記端子と電気的に接続する接続面を有した回路基板と、上記固体撮像素子及び上記回路基板の一部を覆うケース部材と、を有し、上記回路基板は、上記挿入部の長手方向に直交する幅方向の長さがそれぞれ異なる幅広部及び幅狭部を有し、上記ケース部材には、上記幅方向に見て、上記回路基板の上記幅広部と直交する方向で上記幅広部と対応する位置に第１切欠部が設けられている。   As described above, the endoscope disclosed in the present specification is an endoscope provided with an imaging device at the distal end portion of an insertion portion to be inserted into a body cavity, and the imaging device is configured on an image receiving surface. A solid-state image sensor that photoelectrically converts the formed optical image and a surface provided with a terminal opposite to the image receiving surface of the solid-state image sensor, and electrically connected to the terminal of the solid-state image sensor A circuit board having a connection surface and a case member that covers a part of the solid-state imaging device and the circuit board, and the circuit board has a length in a width direction orthogonal to a longitudinal direction of the insertion portion. Each of the case member has a first notch at a position corresponding to the wide portion in a direction orthogonal to the wide portion of the circuit board as viewed in the width direction. Is provided.

また、上記回路基板の上記幅広部に、伝送ケーブルが電気的に接続される。   A transmission cable is electrically connected to the wide portion of the circuit board.

また、上記固体撮像素子は、上記受像面が上記挿入部の長手方向に交差するよう配置され、上記回路基板が、上記幅方向に見てＬ字状に形成され、上記回路基板を構成する２つの脚部のうちの１つに上記接続面が設けられ、上記ケース部材の上記接続面が設けられた脚部の端部側には第２切欠部が設けられている。   Further, the solid-state imaging device is arranged so that the image receiving surface intersects the longitudinal direction of the insertion portion, and the circuit board is formed in an L shape when viewed in the width direction, and constitutes the circuit board. One of the two leg portions is provided with the connection surface, and a second notch portion is provided on an end portion side of the case member on which the connection surface is provided.

また、上記回路基板の上記幅狭部の少なくとも一部が、上記ケース部材によって隙間を介して上記幅方向に挟まれている。   Further, at least a part of the narrow portion of the circuit board is sandwiched in the width direction by the case member via a gap.

また、上記固体撮像素子の上記受像面の法線方向に見た場合の上記固体撮像素子の外径は１ｍｍ四方以下である。   Moreover, the outer diameter of the solid-state image sensor when viewed in the normal direction of the image receiving surface of the solid-state image sensor is 1 mm square or less.

１ 内視鏡システム
２ 内視鏡
２０ 撮像装置
２１ イメージセンサ
２１ａ 受像面
２２ 鏡筒（撮像光学系）
２３ センサホルダ
２４ 回路基板
２４Ａ 幅広部
２４Ｂ 幅狭部
２６ 端子
２７ 電線
２８ ケース部材
３０ センサ接続部
３０ａ 接続面
３１ 電線接続部
３３ 保持部
３４ カバー部
５１ 第１切欠部
５２ 第２切欠部 DESCRIPTION OF SYMBOLS 1 Endoscope system 2 Endoscope 20 Imaging device 21 Image sensor 21a Image-receiving surface 22 Lens barrel (imaging optical system)
23 sensor holder 24 circuit board 24A wide part 24B narrow part 26 terminal 27 electric wire 28 case member 30 sensor connection part 30a connection surface 31 electric wire connection part 33 holding part 34 cover part 51 first notch part 52 second notch part

Claims (5)

体腔内に挿入される挿入部の先端部に撮像装置を備えた内視鏡であって、
前記撮像装置は、
受像面が前記挿入部の長手方向に交差するよう配置され、前記受像面にて結像された光学画像を光電変換する固体撮像素子と、
前記固体撮像素子の前記受像面とは反対側の端子が設けられた面に対向し、前記固体撮像素子の前記端子と電気的に接続する接続面を有したリジッド回路基板と、
前記固体撮像素子及び前記回路基板の一部を覆うカバー部を含むケース部材と、を有し、
前記リジッド回路基板は、前記挿入部の長手方向に直交する幅方向の長さがそれぞれ異なる幅広部及び幅狭部を有し、
前記カバー部は、一対の側壁と前記一対の側壁に架け渡された天井壁を有し、前記一対の側壁には、前記幅方向に見て、前記リジッド回路基板の前記幅広部と直交する方向で前記幅広部と対応する位置に第１切欠部が設けられた、内視鏡。 An endoscope including an imaging device at a distal end portion of an insertion portion to be inserted into a body cavity,
The imaging device
A solid-state imaging device that is arranged so that an image receiving surface intersects with a longitudinal direction of the insertion portion, and photoelectrically converts an optical image formed on the image receiving surface;
A rigid circuit board having a connection surface facing a surface provided with a terminal opposite to the image receiving surface of the solid-state image sensor and electrically connected to the terminal of the solid-state image sensor;
A case member including a cover portion covering a part of the solid-state imaging device and the circuit board,
The rigid circuit board has a wide part and a narrow part with different lengths in the width direction perpendicular to the longitudinal direction of the insertion part,
The cover portion has a pair of side walls and a ceiling wall spanned between the pair of side walls, and the pair of side walls has a direction orthogonal to the wide portion of the rigid circuit board when viewed in the width direction. An endoscope in which a first cutout is provided at a position corresponding to the wide portion. 請求項１に記載の内視鏡であって、
前記リジッド回路基板の前記幅広部には、伝送ケーブルが電気的に接続される、内視鏡。 The endoscope according to claim 1, wherein
An endoscope, wherein a transmission cable is electrically connected to the wide portion of the rigid circuit board. 請求項１又は２に記載の内視鏡であって、
前記リジッド回路基板は、前記幅方向に見てＬ字状に形成され、
前記リジッド回路基板を構成するＬ字の２つの脚部のうちの１つに前記接続面が設けられ、
前記天井壁の前記接続面が設けられた脚部の端部側には第２切欠部が設けられた、内視鏡。 The endoscope according to claim 1 or 2,
The rigid circuit board is formed in an L shape when viewed in the width direction,
The connection surface is provided on one of two L-shaped leg portions constituting the rigid circuit board,
An endoscope in which a second cutout portion is provided on an end side of a leg portion provided with the connection surface of the ceiling wall . 請求項１から３のいずれか１項に記載の内視鏡であって、
前記回路基板の前記幅狭部の少なくとも一部は、前記一対の側壁によって隙間を介して前記幅方向に挟まれた、内視鏡。 The endoscope according to any one of claims 1 to 3,
An endoscope in which at least a part of the narrow portion of the circuit board is sandwiched in the width direction by a pair of side walls through a gap. 請求項１から４のいずれか１項に記載の内視鏡であって、
前記固体撮像素子の前記受像面の法線方向に見た場合の前記固体撮像素子の外径は１ｍｍ四方以下である、内視鏡。 The endoscope according to any one of claims 1 to 4,
An endoscope, wherein the solid-state image sensor has an outer diameter of 1 mm square or less when viewed in the normal direction of the image receiving surface of the solid-state image sensor.
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Publication number Priority date Publication date Assignee Title
WO2018198266A1 (en) * 2017-04-27 2018-11-01 オリンパス株式会社 Endoscope, imaging module, and method for manufacturing imaging module
CN110445959B (en) * 2018-05-04 2021-05-07 致伸科技股份有限公司 Method for assembling camera module

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2737650B1 (en) 1995-08-07 1997-11-28 Tokendo Sarl VIDEOENDOSCOPE
JP2000210252A (en) * 1999-01-25 2000-08-02 Sony Corp Solid imaging device
JP2000232957A (en) * 1999-02-15 2000-08-29 Olympus Optical Co Ltd Endoscopic device
JP4377821B2 (en) 2005-01-17 2009-12-02 オリンパス株式会社 Endoscope electrical connector, endoscope, and assembly method of electrical connector
EP2407084B1 (en) 2005-01-17 2017-09-27 Olympus Corporation Electric connector for an endoscope
JP5154783B2 (en) * 2006-11-14 2013-02-27 オリンパス株式会社 Manufacturing method of imaging module
US9901244B2 (en) * 2009-06-18 2018-02-27 Endochoice, Inc. Circuit board assembly of a multiple viewing elements endoscope
EP2371262B1 (en) * 2009-07-23 2017-03-29 Olympus Corporation Endoscope apparatus
US20140320621A1 (en) * 2009-09-16 2014-10-30 Medigus Ltd. Small diameter video camera heads and visualization probes and medical devices containing them
JP5452282B2 (en) * 2010-02-26 2014-03-26 オリンパス株式会社 Solid-state imaging device
US8698887B2 (en) * 2010-04-07 2014-04-15 Olympus Corporation Image pickup apparatus, endoscope and manufacturing method for image pickup apparatus
EP2613687B1 (en) * 2010-09-08 2016-11-02 Covidien LP Catheter with imaging assembly
JP2012055489A (en) * 2010-09-08 2012-03-22 Fujifilm Corp Imaging device for electronic endoscope and manufacturing method of imaging device
JP5436470B2 (en) * 2011-01-31 2014-03-05 富士フイルム株式会社 Imaging device and electronic endoscope provided with the same
CN103491854B (en) * 2011-02-07 2016-08-24 恩多卓斯创新中心有限公司 Multicomponent cover for many cameras endoscope
JP5192559B2 (en) * 2011-02-24 2013-05-08 富士フイルム株式会社 Endoscope
TWM421800U (en) * 2011-08-05 2012-02-01 Limit Optics Co Ltd Endoscope device having flexible printed circuit board
WO2013105921A1 (en) * 2011-12-12 2013-07-18 Optoelectronics Co., Ltd. Miniature imaging and decoding module
WO2014065099A1 (en) * 2012-10-23 2014-05-01 オリンパス株式会社 Imaging device, endoscope, semiconductor device, and method of manufacturing semiconductor device
JP2015058118A (en) 2013-09-18 2015-03-30 パナソニック株式会社 Endoscope
JP6431698B2 (en) 2014-06-16 2018-11-28 オリンパス株式会社 Imaging unit, wiring board with cable, and method of manufacturing wiring board with cable
JP6072366B1 (en) * 2015-03-10 2017-02-01 オリンパス株式会社 Endoscopic imaging device
CN107431782A (en) * 2015-03-30 2017-12-01 奥林巴斯株式会社 Camera device and endoscope
CN106356663B (en) * 2015-07-14 2020-04-24 富士康(昆山)电脑接插件有限公司 Cable assembly with improved cable retention

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