JP2020163008A - Endoscope - Google Patents

Abstract

To provide an endoscope capable of protecting the image pickup device from high heat.SOLUTION: An endoscope according to the embodiment comprises: an insertion part (2) that has a distal section (201), a curvature section, and a soft section in this order from the distal side; a driver IC (46) that is embedded in the distal section (201) and connected to an image pickup device (44); and a heat dissipation cord (51) of which first end is fixed to a surface of the driver IC (46) and of which second end is arranged in the curvature section. The heat generated by the image pickup device (44) is transferred to the heat dissipation cord (51) through the driver IC (46). The heat transferred to the heat dissipation cord (51) is dissipated from the distal section (201) of the insertion part (2) to the curvature section of the insertion part (2). As a result, the image pickup device (44) can be protected from high heat.SELECTED DRAWING: Figure 3

Description

The present invention relates to an endoscope.

Conventionally, for example, in the medical field, an endoscope having an insertion portion to be inserted into an object to be inserted has been used. The insertion part has an elongated tubular shape. A light source and an image sensor are built in the tip side of the insertion portion. The light emitted by the light source illuminates the inside of the object to be inserted, and the image sensor images the inside of the object to be inserted. The image inside the image to be inserted is displayed on a display device, for example. The user observes the inside of the object to be inserted by visually observing the displayed image.

The endoscope device described in Patent Document 1 includes an LED (light source) that emits light and generates heat, an LED substrate on which the LED is mounted, and a plurality of optical lenses that guide light to a CCD (imaging element). The insertion portion includes an optical system receiver and a mirror frame. The optical system receiver holds an LED substrate and one optical lens. The mirror frame is connected to the optical system receiver and holds other optical lenses. A sheet-shaped heat radiating member extends from the mirror frame toward the base end side of the insertion portion.
The heat generated by the LED is transmitted to the LED substrate, the optical system receiver, the mirror frame, and the heat radiating member in this order, and is dissipated to the base end side of the insertion portion.

Japanese Unexamined Patent Publication No. 2014-208267

In the endoscope device described in Patent Document 1, a tubular lens frame is continuously provided in the mirror frame. The lens frame holds another optical lens so as to close the opening on the tip end side of the lens frame. Further, a CCD is held at the center of the lens frame in the axial length direction.
Generally, the image sensor is more sensitive to heat than the light source. Patent Document 1 describes that the CCD is protected from the heat generated by the LED by forming the lens frame and the optical lens held in the lens frame with a material having low thermal conductivity. However, there is no mention of heat dissipation of the CCD itself.

The present invention has been made in view of such circumstances, and a main object thereof is to provide an endoscope capable of protecting an image pickup device from high heat.

The endoscope according to the present embodiment includes an insertion portion having a tip portion, a curved portion, and a flexible portion in order from the tip side, a driver IC built in the tip portion and connected to an image sensor, and a first. One end is fixed to the surface of the driver IC, and the second end is provided with a heat radiation cable arranged in the curved portion.

In the present embodiment, the first end of the heat radiation cable is fixed to the surface of the driver IC. The driver IC is built in the tip of the insertion portion. The second end of the heat dissipation cable is arranged in the curved portion of the insertion portion.
The image sensor is connected to the driver IC. Therefore, the heat generated by the image sensor is transferred to the heat dissipation cable through the driver IC. Further, the heat generated by the driver IC is transmitted to the heat dissipation cable. The heat transferred to the heat dissipation cable is dissipated from the tip of the insertion portion to the curved portion of the insertion portion. As a result, the image sensor can be protected from high heat. In addition, the driver IC can be protected from high heat.

In the endoscope according to the present embodiment, the heat radiation cable is housed in a first tube having one end arranged in the flexible portion and penetrating the curved portion.

In the present embodiment, the heat radiation cable is housed in the first tube. Therefore, it is possible to prevent the other members arranged in the insertion portion and the heat radiation cable from interfering with each other.
One end of the first tube is arranged in the soft portion of the insertion portion. The first tube penetrates the curved portion. Therefore, the first tube follows the bending of the curved portion, and the heat radiation cable also follows the bending of the curved portion in the first tube. Therefore, it is possible to suppress the twisting of the heat radiation cable due to the bending of the curved portion. The other end of the first tube is arranged at the tip of the insertion portion.

The endoscope according to the present embodiment includes a second tube shorter than the heat radiation cable between the heat radiation cable and the first tube, and the second tube is located on the first end side of the heat radiation cable. It is fixed.

In the present embodiment, the second tube is interposed between the first end side of the heat radiation cable and the first tube. Therefore, it is possible to prevent the first end side of the heat radiation cable from being unnecessarily deformed or misaligned inside the first tube and damage the fixed portion of the heat radiation cable to the driver IC.

In the endoscope according to the present embodiment, the heat radiating rope is a rope formed by knitting a plurality of wires.

In the present embodiment, the heat radiating rope is a rope formed by knitting a plurality of wires. Therefore, the terminal processing of the heat dissipation cable is easy. Further, by unraveling a plurality of wires constituting the first end of the heat radiation cable, the contact area between the heat radiation cable and the driver IC can be easily expanded.

In the endoscope according to the present embodiment, the heat radiation cable has an exodermis.

In the present embodiment, the heat radiation cable has an exodermis. The exodermis can, for example, insulate or reinforce the heat dissipation cable.

The endoscope according to the present embodiment accommodates the driver IC and the first end of the heat radiation cable, and a shield pipe extending the heat radiation cable and a cable connected to the driver IC from one opening. The image pickup device is arranged in the other opening of the shield pipe, and the inside of the shield pipe is filled with a mold resin.

In the present embodiment, the driver IC and the first end of the heat radiation cable are housed in the shield pipe. Therefore, the heat generated on the outside of the shield pipe is suppressed from being transferred to the driver IC. A heat dissipation cable and a cable connected to the driver IC extend from one opening of the shield pipe. The image sensor is located in the other opening of the shield pipe. The inside of the shield pipe is filled with mold resin.

The heat generated by the image sensor is mainly transmitted to the heat dissipation cable through the driver IC or the mold resin, but also to the cable. The heat generated by the driver IC is directly transmitted to the heat dissipation cable directly or through the mold resin, but is also transferred to the cable. The heat transferred to the heat dissipation cable or cable is dissipated along the heat dissipation cable or cable.
As a result, the image sensor and the driver IC can be more reliably protected from high heat.

The endoscope according to the present embodiment includes a tubular heat radiating member, a light source arranged on an end surface of the heat radiating member, a tip cylinder surrounding the heat radiating member and the shield pipe, and an outer surface of the shield pipe. , A resin layer arranged between the tip cylinder and the inner surface thereof is provided.

In the present embodiment, the heat generated by the light source is transmitted to the heat radiating member, and is transferred from the heat radiating member to the tip cylinder. Since the resin layer is arranged between the inner surface of the tip cylinder and the outer surface of the shield pipe, heat transfer from the tip cylinder to the shield pipe is suppressed.

According to the endoscope of the present embodiment, the image pickup device can be protected from high heat.

It is an external view of the endoscope which concerns on embodiment. It is sectional drawing of the insertion part. It is sectional drawing of the insertion part by line III-III in FIG. It is an exploded perspective view of a cap and a tip cylinder. It is a partial cross-sectional perspective view of an image pickup unit. It is sectional drawing of the heat insulating cylinder.

Hereinafter, the present invention will be described in detail with reference to the drawings showing the embodiments thereof.

FIG. 1 is an external view of the endoscope according to the embodiment.
In the figure, 1 is an endoscope, and the endoscope 1 is a flexible mirror for the upper gastrointestinal tract or the lower gastrointestinal tract. The endoscope 1 includes an operation unit 11, a connector unit 12, and an insertion unit 2.
The operation unit 11 has a rigid housing. An operation knob 111 operated by the user is provided on the outer surface of the housing of the operation unit 11. Further, a channel inlet 113 closed by a forceps plug 112 is provided on the outer surface of the housing of the operation unit 11.

The connector unit 12 is connected to one side of the operation unit 11 via the universal cord 121. Power lines and signal lines (not shown) are wired from the connector portion 12 to the insertion portion 2. By connecting the connector unit 12 to a power supply device, a display device, or the like (not shown), the power line and the signal line of the endoscope 1 are electrically connected to the power supply device, the display device, and the like.

The insertion portion 2 has an elongated tubular shape and extends from the other side of the operation portion 11. In the following, the side of the insertion unit 2 near the operation unit 11 / the side far from the operation unit 11 is referred to as the base end side / tip end side. A break prevention portion 13 for protecting the base end portion of the insertion portion 2 is provided between the insertion portion 2 and the operation portion 11.
The insertion portion 2 has a tip portion 201, a curved portion 202, and a soft portion 203 in this order from the tip side. The tip 201 is the shortest and hardest. The curved portion 202 has flexibility. The flexible portion 203 is the longest and the most flexible.

FIG. 2 is a cross-sectional view of the insertion portion 2.
The soft portion 203 of the insertion portion 2 is covered with a flexible flexible tube 21.
The curved portion 202 of the insertion portion 2 includes a curved tube 22 that is flexible and can be curved / straightened. The curved pipe 22 is formed by connecting a plurality of so-called curved pieces in the axial length direction. Each curved piece constituting the curved pipe 22 is made of, for example, stainless steel.
The base end portion of the curved pipe 22 is covered with the tip end portion of the flexible pipe 21.

A plurality of operating wires 23, 23, ... Are connected to the curved pipe 22. For this purpose, the connecting portion 231 is projected inward on the inner surface of the curved pipe 22. A plurality of connecting portions 231,231, ... Are arranged side by side in the axial length direction and the circumferential direction of the curved pipe 22. Each connecting portion 231 holds an appropriate portion in the length direction of the operating wire 23.
The operating wire 23 extends over the entire length of each of the flexible tube 21 and the curved tube 22. The operation wires 23, 23, ... Each base end portion is connected to the operation unit 11 (see FIG. 1). By operating the operation knob 111 of the operation unit 11, the operation wires 23, 23, ... Are individually moved forward and backward. As a result, the curved pipe 22 is deformed flexibly.

FIG. 3 is a cross-sectional view of the insertion portion 2 taken along the line III-III in FIG. FIG. 3 is also an enlarged cross-sectional view of the tip portion 201 of the insertion portion 2.
As shown in FIGS. 2 and 3, the tip portion 201 of the insertion portion 2 includes a cap 24 and a tip cylinder 3.

FIG. 4 is an exploded perspective view of the cap 24 and the tip cylinder 3.
The tip cylinder 3 is hard. As shown in FIGS. 2 to 4, the tip cylinder 3 includes cylinder bodies 31 and 32. The cylinder body 31 has a bottomed tubular shape, and is made of, for example, brass. The tubular body 32 has a tubular shape and is made of, for example, brass. The cylinder bodies 31 and 32 are integrated by directing the bottom wall 311 of the cylinder body 31 toward the tip end side and coaxially fitting the tip end portion of the cylinder body 32 to the base end portion of the cylinder body 31. The tip of the curved tube 22 is coaxially connected to the base end of the cylinder body 32.
On the outer surface of the bottom wall 311 of the cylinder body 31, a cylinder portion 312 is projected toward the tip side. The bottom wall 311 located inside the tubular portion 312 is open.

The cap 24 has a bottomed tubular shape and is made of, for example, a synthetic resin. As shown in FIG. 2, a partition wall 241 is projected from the inner surface of the bottom wall of the cap 24 toward the base end side. The partition wall 241 divides the inside of the cap 24 into two parts.
The cylinder portion 312 of the cylinder body 31 of the tip cylinder 3 is internally fitted between one surface of the partition wall 241 of the cap 24 and the inner peripheral surface of the cap 24.

The tip of the channel tube 25 is arranged between the other surface of the partition wall 241 of the cap 24 and the inner peripheral surface of the cap 24. The channel tube 25 penetrates through the through hole 313 (see FIG. 4) provided in the bottom wall 311 of the cylinder body 31 and extends over the entire length of the insertion portion 2. The base end portion of the channel tube 25 is connected to the channel inlet 113 of the operation unit 11 shown in FIG.

As shown in FIGS. 2 and 3, the insertion portion 2 includes a cover tube 26. The cover tube 26 covers the outer peripheral surfaces of the curved tube 22 and the tip cylinder 3 respectively.
The peripheral wall of the cap 24 is fitted inwardly into the tip end portion of the cover tube 26, so that the bottom wall of the cap 24 closes the opening on the tip end side of the cover tube 26.

The imaging unit 4 is housed in the tip 201.
FIG. 5 is a partial cross-sectional perspective view of the imaging unit 4.
As shown in FIGS. 2 to 5, the image pickup unit 4 includes a heat insulating cylinder 41, a lens holding cylinder 42, and a heat radiating member 43.
As shown in FIGS. 2 and 3, the heat insulating cylinder 41 is arranged at the center of the tip cylinder 3 in the axial length direction.

FIG. 6 is a cross-sectional view of the heat insulating cylinder 41.
The heat insulating cylinder 41 shown in FIGS. 2 to 6 has an element holding cylinder 411 and a shield pipe 412. The element holding cylinder 411 and the shield pipe 412 are integrated by fitting the tip end portion of the shield pipe 412 coaxially with the base end portion of the element holding cylinder 411. The outer peripheral surfaces of the integrated element holding cylinder 411 and the shield pipe 412 are covered with the resin layer 413. The resin layer 413 has a heat insulating property, and is, for example, a polyimide tape. The element holding cylinder 411 is made of, for example, a modified polyphenylene ether resin. The shield pipe 412 is made of, for example, stainless steel. The plate thickness of the shield pipe 412 is, for example, 0.15 mm.

The element holding cylinder 411 holds the image sensor 44.
The image sensor 44 is, for example, a CMOS image sensor or a CCD image sensor. The image sensor 44 has a plate shape. A cover lens 441 is integrally provided on the image sensor 44. The cover lens 441 has a cover glass, a color filter, a microlens, and the like, and covers the light receiving surface of the image pickup element 44.
The image sensor 44 is fitted in the base end portion of the element holding cylinder 411, and closes the opening (the other opening) on the base end side of the shield pipe 412.

The base end portion of the lens holding cylinder 42 is coaxially fitted inside the tip end portion of the element holding cylinder 411 of the heat insulating cylinder 41.
Imaging lenses 421, 421, ... Are fitted at a plurality of positions of the tip end portion, the base end portion, and the central portion in the longitudinal direction of the lens holding cylinder 42. The openings at both ends of the lens holding cylinder 42 are closed by the imaging lenses 421 and 421.

The heat radiating member 43 shown in FIGS. 2 to 5 has a thick tubular shape. The heat radiating member 43 is made of, for example, brass. The heat radiating member 43 is externally fitted from the middle of the lens holding cylinder 42 in the longitudinal direction to the middle of the element holding cylinder 411 of the heat insulating cylinder 41 in the longitudinal direction. The heat radiating member 43 is inside the cylinder portion 312 of the cylinder body 31 of the tip cylinder 3 so that the outer peripheral surface of the heat radiating member 43 is in contact with the inner peripheral surface of the cylinder portion 312 of the cylinder body 31 of the tip cylinder 3 as a whole. It is fitted.

By fitting and fixing the heat radiating member 43 to the tip cylinder 3, the lens holding cylinder 42 fixed to the heat radiating member 43 and the heat insulating cylinder 41 fixed to the lens holding cylinder 42 are fixed to the tip cylinder 3. The lens.
The element holding cylinder 411 and the shield pipe 412 of the heat insulating cylinder 41 are each surrounded by the tip cylinder 3. A resin layer 413 is arranged between the outer surface of each of the element holding cylinder 411 and the shield pipe 412 and the inner surface of the tip cylinder 3.

An annular light source substrate 45 having high thermal conductivity is attached to the heat radiating member 43. Specifically, one surface of the light source substrate 45 is adhered to the tip surface of the heat radiating member 43 by using, for example, an adhesive having high thermal conductivity. The thermal conductivity of the light source substrate 45 is, for example, 2.0 W / (m · K).
Two light sources 451 and 451 are mounted on the other surface of the light source substrate 45. Each light source 451 is, for example, an LED.

Two windows 242 and 242 are provided on the bottom wall of the cap 24. Illumination lenses 240 and 240 are fitted in the windows 242 and 242. The illumination lenses 240 and 240 face the light sources 451 and 451.
An opening 243 is provided in the bottom wall of the cap 24. The opening 243 is located between the windows 242 and 242. The tip of the lens holding cylinder 42 is coaxially fitted in the opening 243.
A channel outlet 244 is provided on the bottom wall of the cap 24. The channel outlet 244 communicates with the opening on the proximal end side of the channel tube 25.

As shown in FIGS. 2, 3, 5, and 6, the driver IC 46 is housed in the shield pipe 412 of the heat insulating cylinder 41.
The driver IC 46 is, for example, a CMOS-IC. The driver IC 46 is electrically connected to the image pickup device 44 via the flexible printed circuit board 461 and drives the image pickup device 44.

The driver IC 46 is electrically connected to one end of the cable 47 via the flexible printed circuit board 461. The cable 47 has a structure in which the above-mentioned power line and signal line are covered with a sheath, and has flexibility capable of following the deformation of each of the flexible tube 21 and the curved tube 22. The cable 47 extends from the opening (one opening) on the base end side of the shield pipe 412 toward the base end side of the curved pipe 22 and extends to the connector portion 12.

A part of the power line included in the cable 47 is drawn out from the tip of the cable 47, penetrates the heat insulating cylinder 41 and the heat radiating member 43, and is connected to the light sources 451 and 451 via the light source substrate 45 (not shown). ..
The cable 47 is used for supplying power from the power supply device to the image sensor 44 and the light sources 451 and 451 and outputting a signal from the image sensor 44 to the display device.

As shown in FIGS. 3, 5, and 6, the imaging unit 4 includes a heat dissipation cable 51.
The heat radiating rope 51 is a rope formed by knitting a plurality of metal (for example, copper) wire rods. The heat dissipation cable 51 has an exodermis 511. The exodermis 511 covers the surface of the heat radiation cable 51 over substantially the entire length of the heat radiation cable 51. The outer skin 511 has an insulating property, and is, for example, a coating made of silicon. The exodermis 511 also has the effect of reinforcing the heat radiation cable 51.

However, the first end 512 of the heat radiation cable 51 is not covered with the outer skin 511 and is exposed. The first end 512 is fixed to the surface of the casing of the driver IC 46 by, for example, an adhesive having high thermal conductivity. In order to increase the contact area between the first end 512 and the driver IC 46, the heat radiation cable 51 at the first end 512 is formed into a flat shape by unraveling the wire.

The first end 512 of the heat radiating cable 51 is housed in the shield pipe 412. The heat radiation cable 51 extends from the opening on the base end side of the shield pipe 412 toward the base end side of the curved pipe 22. The second end of the heat dissipation cable 51 is arranged in the curved portion 202 (see FIG. 1).

The heat radiation cable 51 is housed in the first tube 52. The first tube 52 is longer than the heat radiation cable 51, and the heat radiation cable 51 is inserted with play. For example, the length of the heat radiation cable 51 is 100 mm, and the length of the first tube 52 is 300 mm.
The first tube 52 penetrates the curved tube 22. The first end 512 of the heat radiation cable 51 projects from the tip of the first tube 52. The tip end portion of the first tube 52 is arranged in the vicinity of the base end portion of the shield pipe 412. The base end portion of the first tube 52 is arranged in the soft portion 203 (see FIG. 1).

A second tube 53 is interposed between the first end 512 side of the heat radiation cable 51 and the tip end portion of the first tube 52. The second tube 53 is shorter than the heat radiation cable 51 and is fixed to the heat radiation cable 51 so as to be adjacent to the first end 512 of the heat radiation cable 51. For example, the length of the second tube 53 is 10 mm.

The second tube 53 fills the gap between the heat radiation cable 51 and the first tube 52 in the vicinity of the first end 512. Therefore, it is possible to prevent the heat radiation cable 51 near the first end 512 from being unnecessarily deformed or misaligned inside the first tube 52. Therefore, it is possible to prevent the fixed portion between the first end 512 and the driver IC 46 from being damaged due to the deformation or misalignment of the heat radiation cable 51.
If the gap between the heat radiation cable 51 and the first tube 52 is sufficiently small, the second tube 53 may be omitted.

As shown in FIG. 2, the inside of the shield pipe 412 is filled with the mold resin 48. In FIG. 2, the mold resin 48 is shown by hatching with a broken line. The illustration of the mold resin 48 in FIGS. 3, 5, and 6 is omitted.
The mold resin 48 has high insulation and thermal conductivity. The thermal conductivity of the mold resin 48 is, for example, 2.4 W / (m · K). The mold resin 48 is, for example, a highly thermally conductive resin containing a thermally conductive filler. The driver IC 46, the flexible printed circuit board 461, the first end 512 of the heat radiation cable 51, and the portion of the cable 47 connected to the flexible printed circuit board 461 are molded by the mold resin 48.

As shown in FIG. 6, two through holes 414 and 414 are provided on the peripheral surface of the shield pipe 412. The through holes 414 and 414 are arranged to face each other at the base end portion of the shield pipe 412. Before covering the integrated element holding cylinder 411 and the shield pipe 412 with the resin layer 413, the mold resin 48 is filled through the through holes 414 and 414. Since the opening on the tip end side of the shield pipe 412 is closed by the image sensor 44, the air in the shield pipe 412 escapes from the opening on the base end side of the shield pipe 412 as the mold resin 48 is filled. As a result, the mold resin 48 can be filled in the shield pipe 412 without any gap.

The user of the endoscope 1 shown in FIG. 1 inserts the insertion portion 2 into the digestive tract from the distal end side. The flexible portion 203 flexibly deforms according to the shape of the digestive tract.
The user bends the curved pipe 22 by operating the operation knob 111. As a result, the curved portion 202 is bent, so that the tip portion 201 of the insertion portion 2 faces in the direction desired by the user.
The light emitted by the light sources 451 and 451 illuminates the inside of the digestive tract through the illumination lenses 240 and 240.

The image sensor 44 images the inside of the digestive tract. More specifically, the light reflected inside the digestive tract enters the image sensor 44 through the imaging lenses 421, 421, .... The image sensor 44 outputs an electric signal corresponding to the incident light to the driver IC 46 via the flexible printed circuit board 461. The driver IC 46 outputs the input electric signal to the outside of the endoscope 1 (for example, a display device) via the cable 47 and the connector portion 12.

The display device displays an image corresponding to the input electric signal. The displayed image shows the inside of the digestive tract. The user observes the inside of the digestive tract by visually observing the displayed image.
The user inserts a treatment tool (not shown) into the channel tube 25 from the channel inlet 113 via the forceps plug 112 of the operation unit 11. The tip of the treatment tool exits the inside of the gastrointestinal tract through the channel tube 25 and from the channel outlet 244 of the cap 24. The user performs appropriate treatment (for example, collection of a sample) using a treatment tool while observing the inside of the digestive tract.

The light sources 451 and 451 generate heat. The heat generated by the light sources 451 and 451 is transmitted in this order through the light source substrate 45, the heat radiating member 43, the tip cylinder 3, and the curved tube 22, and is dissipated to the base end side of the curved tube 22. Alternatively, the heat generated by the light sources 451 and 451 is dissipated from the tip tube 3 or the curved tube 22 to the outside of the endoscope 1 through the cover tube 26. As a result, the light sources 451 and 451 can be protected from high heat.
In addition, in order to increase the thermal conductivity of the curved tube 22, for example, a sheet-shaped heat radiating member may be arranged on the surface of the curved tube 22.

The image sensor 44 and the driver IC 46 generate heat.
The heat generated by the image sensor 44 is transmitted to the driver IC 46 through the flexible printed circuit board 461, and is mainly transmitted from the driver IC 46 to the heat dissipation cable 51, but also to the cable 47.
The heat generated by the driver IC 46 is mainly transmitted to the heat dissipation cable 51, but is also transmitted to the cable 47.
Alternatively, the heat generated by the image sensor 44 (or the driver IC 46) is transferred to the heat dissipation cable 51 or the cable 47 through the mold resin 48.

The heat transferred to the heat radiating cable 51 (or cable 47) is dissipated to the proximal end side of the heat radiating cable 51 (or cable 47) along the heat radiating cable 51 (or cable 47).
Generally, the image sensor 44 and the driver IC 46 are more sensitive to heat than the light source 451. However, a heat insulating cylinder 41 is interposed between the heat radiating path of the light source 451 and the heat radiating path of the image sensor 44. Therefore, it is possible to suppress the heat passing through the heat dissipation path of the light source 451 from being transferred to the image sensor 44 and the driver IC 46.
As a result, the image sensor 44 and the driver IC 46 can be protected from high heat.

The heat dissipation cable 51 is protected by a first tube 52. Therefore, it is suppressed that the other member (for example, the channel tube 25 or the cable 47) arranged in the insertion portion 2 and the heat radiation cable 51 interfere with each other.
The first tube 52 penetrates the curved portion 202. Therefore, the first tube 52 follows the bending of the curved portion 202, and the heat radiation cable 51 also follows the bending of the curved portion 202 in the first tube 52. Therefore, it is possible to suppress the twisting of the heat radiation cable 51 due to the bending of the curved portion 202.
Since there is a gap between the heat radiating cable 51 and the first tube 52, the heat transferred to the heat radiating cable 51 is suppressed from being transferred to the outside of the first tube 52.

If the thermal conductivity of each of the element holding cylinder 411 and the shield pipe 412 constituting the heat insulating cylinder 41 is sufficiently low, the resin layer 413 may be omitted.
The length of the heat radiation cable 51 is not limited to 100 mm, and may be, for example, 50 mm. The shorter the heat dissipation cable 51, the higher the economy, and the longer the heat dissipation cable 51, the better the heat dissipation effect. However, it has been experimentally found that when the length of the heat radiating cable 51 exceeds 100 mm, the heat radiating effect is not dramatically improved.

The heat radiation cable 51 is not limited to the braided wire, and may be, for example, a stranded wire or a single wire. However, the heat radiation cable 51 of the braided wire has an advantage that the terminal treatment on the proximal end side is not required as compared with the stranded wire. Further, the heat radiation cable 51 of the braided wire has an advantage that the contact area with the driver IC 46 can be easily expanded as compared with the single wire.
The heat radiation cable 51 is not limited to the metal, and may be made of, for example, carbon fiber.
The endoscope 1 is not limited to those used in the medical field.

The embodiments disclosed this time should be considered as exemplary in all respects and not restrictive. The scope of the present invention is not intended to include the meaning described above, but is intended to include the meaning equivalent to the scope of claims and all modifications within the scope of claims.

1 Endoscope 2 Insertion part 201 Tip part 202 Curved part 203 Flexible part 243 Aperture 3 Tip cylinder 412 Shield pipe 413 Resin layer 43 Heat dissipation member 44 Image sensor 451 Light source 46 Driver IC
47 Cable 48 Molded resin 51 Heat dissipation cable 511 Exodermis 512 1st end 52 1st tube 53 2nd tube

Claims (7)

An insertion part having a tip part, a curved part, and a soft part in order from the tip side,
A driver IC built into the tip and connected to the image sensor,
An endoscope having a first end fixed to the surface of the driver IC and a second end having a heat radiation cable arranged in the curved portion. The endoscope according to claim 1, wherein one end of the heat radiation cable is arranged in the flexible portion and is housed in a first tube penetrating the curved portion. A second tube shorter than the heat radiation cable is provided between the heat radiation cable and the first tube.
The endoscope according to claim 2, wherein the second tube is fixed to the first end side of the heat radiation cable. The endoscope according to any one of claims 1 to 3, wherein the heat radiating rope is a rope formed by knitting a plurality of wires. The endoscope according to any one of claims 1 to 4, wherein the heat radiation cable has an exodermis. A shield pipe that accommodates the driver IC and the first end of the heat radiation cable, and extends the heat radiation cable and the cable connected to the driver IC from one opening.
The image sensor is arranged in the other opening of the shield pipe.
The endoscope according to any one of claims 1 to 5, wherein the inside of the shield pipe is filled with a mold resin. Cylindrical heat dissipation member and
A light source arranged on the end face of the heat radiating member and
A tip cylinder that surrounds the heat radiating member and the shield pipe,
The endoscope according to claim 6, further comprising a resin layer arranged between the outer surface of the shield pipe and the inner surface of the tip cylinder.

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