JPWO2016098375A1 - 半導体ウェーハの検査装置及び半導体ウェーハの検査方法 - Google Patents
半導体ウェーハの検査装置及び半導体ウェーハの検査方法 Download PDFInfo
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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Abstract
Description
プローバ10は、プローバ本体12と、プローバ本体12に隣接されたローダ部14とから構成される。なお、図1では、ローダ部14の内部の概略構造を示すため、ローダ部14を透視して示している。
図2は、プローバ本体12(図1参照)の内部に配置された検査部16の側面図である。
図1に示すローダ部14は、ロードポート44に載せられた容器(収納部)46、搬送アーム(搬送手段)48、サブチャックユニット50、プリアライメントユニット52、及びオーブン(予備加熱手段)54等から構成される。
図4は、実施形態のプローバ10による半導体ウェーハWの検査方法を示したフローチャートである。
Claims (11)
- 半導体ウェーハが載置される載置面を有するテーブルと、
前記テーブルの前記載置面に載置された前記半導体ウェーハの半導体デバイスに接触されて前記半導体デバイスの電気的特性を検査するプローブと、
前記プローブによって前記半導体デバイスの電気的特性を検査するために、前記テーブルの前記載置面を本加熱する加熱手段と、
前記テーブルの前記載置面に載置される前の前記半導体ウェーハを予備加熱する予備加熱手段と、
を備えたことを特徴とする半導体ウェーハの検査装置。 - 前記プローブによる検査前の前記半導体ウェーハが収納された収納部と、
前記収納部から前記予備加熱手段に前記半導体ウェーハを搬送するとともに、前記予備加熱手段によって予備加熱された前記半導体ウェーハを前記テーブルの前記載置面に搬送する搬送手段と、
を備える請求項1に記載の半導体ウェーハの検査装置。 - 前記予備加熱手段は、前記半導体ウェーハが前記搬送手段によって保持された状態で、前記予備加熱する請求項2に記載の半導体ウェーハの検査装置。
- 前記予備加熱手段は、
前記半導体ウェーハの出入り口を備えた箱体と、
前記箱体の内部空気を加熱するヒータと、
を備える請求項1、2又は3に記載の半導体ウェーハの検査装置。 - 前記加熱手段による前記テーブルの前記載置面の本加熱の温度を第1の温度とし、前記予備加熱手段による前記半導体ウェーハの予備加熱の温度を第2の温度としたとき、前記第2の温度は、前記第1の温度以下である請求項1から4のいずれか1項に記載の半導体ウェーハの検査装置。
- テーブルの載置面に載置された半導体ウェーハの半導体デバイスにプローブを接触させて前記半導体デバイスの電気的特性を検査する検査工程と、
前記検査工程の前に、前記テーブルの前記載置面を本加熱する加熱工程と、
前記テーブルの前記載置面に載置される前の前記半導体ウェーハを予備加熱する予備加熱工程と、
を備えたことを特徴とする半導体ウェーハの検査方法。 - 前記プローブによる検査前の前記半導体ウェーハが収納された収納部から前記予備加熱工程の予備加熱手段に前記半導体ウェーハを搬送する第1の搬送工程と、
前記予備加熱手段によって予備加熱された前記半導体ウェーハを前記テーブルの前記載置面に搬送する第2の搬送工程と、
を備える請求項6に記載の半導体ウェーハの検査方法。 - 前記予備加熱工程は、前記半導体ウェーハを保持手段によって保持した状態で前記予備加熱を行い、
前記第2の搬送工程は、前記保持手段によって前記半導体ウェーハを保持した状態を維持したまま、前記半導体ウェーハを前記テーブルの前記載置面に搬送する請求項7に記載の半導体ウェーハの検査方法。 - 前記予備加熱工程は、
箱体の出入り口から前記箱体の内部空間に前記半導体ウェーハを搬入し、ヒータによって加熱された前記内部空間の気体によって前記半導体ウェーハを予備加熱する請求項6、7又は8に記載の半導体ウェーハの検査方法。 - 前記予備加熱工程は、前記テーブルの前記載置面から前記半導体ウェーハを離間させて保持し、前記載置面からの対流又は輻射によって伝達される熱によって前記半導体ウェーハを予備加熱した後、前記半導体ウェーハを前記載置面に載置させる請求項6に記載の半導体ウェーハの検査方法。
- 前記加熱工程による前記テーブルの前記載置面の本加熱の温度を第1の温度とし、前記予備加熱工程による前記半導体ウェーハの予備加熱の温度を第2の温度としたとき、前記第2の温度は、前記第1の温度以下である請求項6から10のいずれか1項に記載の半導体ウェーハの検査方法。
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GB201415972D0 (en) | 2014-09-10 | 2014-10-22 | Ketonex Ltd | Process |
US10840121B2 (en) | 2016-10-31 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for unpacking semiconductor wafer container |
US11127612B2 (en) * | 2018-04-25 | 2021-09-21 | Micron Technology, Inc. | Testing semiconductor devices based on warpage and associated methods |
CN108766905A (zh) * | 2018-04-27 | 2018-11-06 | 江苏澳芯微电子有限公司 | 一种验证晶圆老化的烘烤装置、系统及其方法 |
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JPS5749248A (en) | 1980-09-09 | 1982-03-23 | Fujitsu Ltd | Substrate heating and retaining device |
JPH11330171A (ja) * | 1998-05-11 | 1999-11-30 | Sony Corp | ウェーハプローバ及びそれにおけるウェーハの搬送処理方法 |
JP2000323536A (ja) * | 1999-05-13 | 2000-11-24 | Nec Corp | 半導体ウェーハの検査装置 |
US6280081B1 (en) * | 1999-07-09 | 2001-08-28 | Applied Materials, Inc. | Methods and apparatus for calibrating temperature measurements and measuring currents |
US7138629B2 (en) * | 2003-04-22 | 2006-11-21 | Ebara Corporation | Testing apparatus using charged particles and device manufacturing method using the testing apparatus |
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JP5120018B2 (ja) * | 2007-05-15 | 2013-01-16 | 東京エレクトロン株式会社 | プローブ装置 |
JP5615852B2 (ja) * | 2012-01-27 | 2014-10-29 | 東京エレクトロン株式会社 | 電子デバイス試験システム |
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