JPWO2016076094A1 - Joining member joining method, metal composition - Google Patents

Abstract

A paste-like metal composition is provided between the first joining member and the second joining member (installation step). Next, while compressing the metal composition at normal temperature from the thickness direction, the metal composition is heated using a reflow apparatus, for example, according to the temperature profile (heating process). This heating step is applied to the metal composition from a temperature range equal to or higher than the melting point of the Sn powder at a time t2 to t1 (s) from when the heating temperature rises above the melting point of the Sn powder until it decreases below the melting point of the Sn powder. S · P ≧ 15 (kK · s · N / m2) with respect to the metal composition, where S (kK · s) is the amount of heat generated and P (N / m2) is the pressure applied to the metal composition. Apply heat treatment to fill.

Description

  The present invention relates to a joining member joining method for joining two joining members and a metal composition used in the joining method.

  Conventionally, high-temperature lead solder has been widely used to join electronic components and the like. However, high temperature lead solder contains lead which is harmful to the human body.

  Therefore, in order to achieve lead-free, development of materials that replace high-temperature lead solder has been advanced. For example, Patent Document 1 discloses a solder paste. This solder paste contains Sn powder, CuNi alloy powder, and a flux that reduces the oxide film covering each of the Sn powder and CuNi alloy powder.

  And the joining method of patent document 1 provides solder paste on the land provided on the printed wiring board. And after mounting a multilayer ceramic capacitor on a land via a solder paste, it heats using a reflow apparatus.

  The Sn powder and alloy powder contained in the solder paste react when heated to produce an intermetallic compound. Thereby, the metal member containing an intermetallic compound joins the land provided on the printed wiring board and the external electrode provided on the multilayer ceramic capacitor.

International Publication No. 2011/027659 Pamphlet

However, when the solder paste of Patent Document 1 is heated, H ₂ O gas is generated or flux is volatilized due to the oxidation-reduction reaction of the flux in the solder paste, and a large amount of gas is generated. As a result, a large amount of voids (bubbles) are generated in the intermetallic compound member having the intermetallic compound as the main phase. Therefore, the bonding method of Patent Document 1 has a problem that the bonding strength is reduced by a large amount of voids.

  The objective of this invention is providing the joining method and metal composition of a joining member which can improve joining strength.

  The joining method of the joining member of this invention has an installation process and a heating process.

  In the installation step, a metal composition containing CuNi alloy powder or CuMn alloy powder and Sn powder is provided between the two joining members.

In the heating step, S is defined as the amount of heat applied to the metal composition from the temperature range above the melting point of the Sn powder until the heating temperature rises above the melting point of the Sn powder and then falls below the melting point of the Sn powder. When the pressure applied to the composition is P, the metal composition is subjected to heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ).

  In the heat treatment for the metal composition, an intermetallic compound containing at least two selected from the group consisting of Sn, Cu and Ni, or Sn, Cu by a reaction of CuNi alloy powder or CuMn alloy powder and Sn powder in the heat treatment for the metal composition And an intermetallic compound phase having as its main phase an intermetallic compound containing at least two selected from the group consisting of Mn.

A metal composition subjected to heat treatment satisfying S · P <15 (kK · s · N / m ² ) has a low bonding strength but satisfies S · P ≧ 15 (kK · s · N / m ² ). In the metal composition subjected to the above, the bonding strength increases rapidly.

The reason for this is considered that heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ) can suppress the generation of voids (bubbles) in the intermetallic compound phase.

  Therefore, according to the bonding method of the present invention, the generation of voids can be suppressed and the bonding strength can be improved.

  The pressure P is preferably in the range of 1 MPa to 30 MPa.

  In the bonding method of the present invention, the metal composition may not include a flux that reduces the oxide film covering each of the Sn powder, the CuNi alloy powder or the CuMn alloy powder, and the bonding member. According to the joining method of the present invention, the metal composition can join two joining members without including a flux.

  In the joining method of the present invention, it is preferable that the metal composition does not contain a flux that reduces the Sn powder, the CuNi alloy powder or the CuMn alloy powder, and the oxide film covering each of the joining members. According to the bonding method of the present invention, the bonding strength when the flux is not included is higher than the bonding strength when the flux is included.

  In the bonding method of the present invention, the metal composition is preferably formed into a paste.

  In this joining method, the fluidity of the metal component is increased, and the molten Sn and the CuNi alloy powder or CuMn alloy powder are easily brought into contact with each other. That is, it becomes easy for the molten Sn and CuNi alloy powder or CuMn alloy powder to react.

  Moreover, in the joining method of this invention, it is preferable that at least the surface of a joining member is comprised with Cu or Ni.

  In this joining method, when the metal composition is heated, at the same time, an alloy layer is formed between the joining member and the metal composition by a reaction between Cu or Ni constituting the surface of the joining member and molten Sn. The Therefore, the joining member and the metal composition are firmly joined.

  Moreover, in the joining method of this invention, it is preferable that a joining member is an electrode terminal and a metal composition has electroconductivity.

  In this joining method, a metal composition can be used for joining electrode terminals.

Moreover, the metal composition of the present invention includes CuNi alloy powder or CuMn alloy powder and Sn powder,
The amount of heat applied to the metal composition from the temperature range above the melting point of the Sn powder is added to the metal composition during the time from when the heating temperature rises above the melting point of the Sn powder to below the melting point of the Sn powder. When the pressure is P,
CuNi alloy powder or CuMn alloy powder reacts with Sn powder by heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ), and contains at least two selected from the group consisting of Sn, Cu and Ni An intermetallic compound phase having an intermetallic compound or an intermetallic compound containing at least two selected from the group consisting of Sn, Cu and Mn as a main phase is formed.

  In this configuration, the metal composition of the present invention is used in the bonding method of the bonding member of the present invention. Therefore, the metal composition of this invention has the same effect as the joining method of the joining member of this invention.

  According to the present invention, it is possible to suppress the generation of voids and improve the bonding strength.

It is sectional drawing which shows typically the installation process performed with the joining method of the joining member which concerns on 1st Embodiment of this invention. It is sectional drawing which shows typically the heating process performed with the joining method of the joining member which concerns on 1st Embodiment of this invention. It is sectional drawing which shows typically the joining structure 100 obtained with the joining method of the joining member which concerns on 1st Embodiment of this invention. It is a figure which shows the temperature profile of the heating process performed with the joining method of the joining member which concerns on 1st Embodiment of this invention. It is sectional drawing which shows typically the installation process performed with the joining method of the joining member which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows typically the heating process performed with the joining method of the joining member which concerns on 2nd Embodiment of this invention. It is sectional drawing which shows typically the joining structure 200 obtained with the joining method of the joining member which concerns on 2nd Embodiment of this invention.

  Hereinafter, the joining method of the joining member which concerns on 1st Embodiment of this invention is demonstrated.

  FIG. 1 is a cross-sectional view schematically showing an installation process performed by the joining method for joining members according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view schematically showing a heating step performed by the joining member joining method according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view schematically showing a joining structure 100 obtained by the joining method for joining members according to the first embodiment of the present invention. FIG. 4 is a view showing a temperature profile of a heating process performed by the joining member joining method according to the first embodiment of the present invention.

  First, the metal composition 105, the first joining member 101, and the second joining member 102 are prepared. The metal composition 105 is formed into a paste. As shown in FIG. 1, the metal composition 105 is used, for example, to join the first joining member 101 and the second joining member 102.

  The first bonding member 101 may be, for example, a single electrode member such as a bus bar, or an electrode member formed on the surface of an element body such as a surface electrode of an electronic component such as a multilayer ceramic capacitor. It may be.

  The second joining member 102 may be, for example, a single electrode member such as a bus bar. If the first joining member is a surface electrode of an electronic component, the printed wiring board on which the electronic component is mounted. It is an electrode member provided on the surface.

  The bus bar is an electrode terminal through which a large current flows. The metal composition 105 can be used for joining bus bars. In addition, at least surfaces of the first bonding member 101 and the second bonding member 102 are plated and covered with a Cu film.

  The metal composition 105 includes a metal component 110 and an organic component 108. The metal component 110 is composed of Sn powder 106 and CuNi alloy powder 107. In the present embodiment, in the metal composition 105, the content of the metal component 110 is 100/110 parts by weight, and the content of the organic component 108 is 10/110 parts by weight. Further, in the metal component 110, the content of the Sn powder 106 is 65 parts by weight, and the content of the CuNi alloy powder 107 is 35 parts by weight.

  The CuNi alloy powder 107 can react with the Sn powder 106 that is melted by heating the metal composition 105 to generate an intermetallic compound. In the present embodiment, details of the intermetallic compound will be described later.

  In addition, it is preferable that the compounding ratio of Sn powder 106 and CuNi alloy powder 107 exists in the range of Sn powder: CuNi alloy powder = 5: 95-50: 50 by weight ratio. If the blending amount of the Sn powder 106 is too large, an unreacted Sn component may remain excessively after the reaction. On the other hand, if the amount of the CuNi alloy powder 107 is too large, an unreacted CuNi alloy component may remain excessively after the reaction.

  Moreover, it is preferable that the average particle diameter (D50) of Sn powder 106 exists in the range of 5-50 micrometers. Furthermore, the average particle diameter (D50) of the CuNi alloy powder 107 is preferably in the range of 0.1 to 80 μm. In this embodiment, Sn powder having an average particle diameter of 20 μm and CuNi alloy powder having an average particle diameter of 5 μm were used. For example, SFR-Sn-10 (manufactured by Nippon Atomize) is used as the Sn powder 106.

  If the average particle diameter of the Sn powder 106 is smaller than 5 μm, the Sn powder 106 may not melt. On the other hand, when the average particle size of the Sn powder 106 is larger than 50 μm, the composition variation in the reaction product may increase.

  Further, if the average particle size of the CuNi alloy powder 107 is smaller than 0.1 μm, the wettability of the CuNi alloy powder 107 and the Sn powder 106 may be deteriorated and separated. On the other hand, if the average particle size of the CuNi alloy powder 107 is larger than 80 μm, the unreacted CuNi alloy powder 107 may remain excessively after the reaction.

  Next, the organic component 108 includes a flux, a solvent, a thixotropic agent, and the like. The flux contains rosin and an activator. The flux functions to remove oxide films on the surfaces of the first bonding member 101, the second bonding member 102, the Sn powder 106, and the CuNi alloy powder 107.

  The rosin is, for example, a modified rosin modified with rosin and a rosin resin composed of a derivative such as rosin, a synthetic resin composed of the derivative, or a mixture thereof. For example, polymerized rosin R-95 (manufactured by Arakawa Chemical) is used as the rosin.

  Examples of the activator include amine hydrohalides, organic halogen compounds, organic acids, organic amines, and polyhydric alcohols. For example, adipic acid (manufactured by Wako Pure Chemical Industries) is used as the activator. In addition, sebacic acid (manufactured by Wako Pure Chemical Industries) may be used as the active agent.

  The solvent adjusts the viscosity of the metal composition 105. Examples of the solvent include alcohols, ketones, esters, ethers, aromatics, and hydrocarbons. For example, hexyl diglycol (HeDG) (manufactured by Toho Chemical) is used as the solvent.

  The thixotropic agent is maintained as a binder so that the metal component 110 and the organic component 108 are uniformly mixed and then they are not separated. Examples of the thixotropic agent include hydrogenated castor oil, carnauba wax, amides, hydroxy fatty acids, dibenzylidene sorbitol, bis (p-methylbenzylidene) sorbitol, beeswax, stearamide, hydroxystearic acid ethylenebisamide, and the like.

  Next, in order to obtain the joining structure 100 shown in FIG. 3, as shown in FIG. 1, a paste-like metal composition 105 is provided between the first joining member 101 and the second joining member 102 (installation step). .

  Next, while compressing the metal composition 105 at room temperature shown in FIG. 1 from the thickness direction, the metal composition 105 is heated using, for example, a reflow apparatus according to the temperature profile shown in FIG. 4 (heating process).

When the metal composition 105 by heating reaches above the melting point _{T m} of a Sn, Sn powder 106 melts as shown in FIG. Melting point _{T m} of a Sn is 231.9 ° C..

Note that the solvent contained in the organic component 108 is combusted or decomposed between the start of heating and the elapse of time t ₁ .

An intermetallic compound is produced by a reaction between the molten Sn and the CuNi alloy powder 107. This reaction can be performed, for example, by liquid phase diffusion bonding (“TLP bonding: Transient Liquid”).
Phase Diffusion Bonding ”). The produced intermetallic compound is an alloy containing at least two selected from the group consisting of Cu, Ni and Sn. Specifically, intermetallic compounds are, for example, _{Cu 6 Sn 5, Ni 3 Sn} 4, Cu 2 NiSn like.

Next, as shown in FIG. 4, after the time t _2, the reflow apparatus stops heating. Thereby, the reaction between the molten Sn and the CuNi alloy powder 107 is completed, and the metal composition 105 changes from the metal paste to the intermetallic compound phase 109 containing the CuNi alloy powder 107 as shown in FIG.

  Further, when the metal composition 105 is heated, simultaneously, a CuSn alloy layer as shown in FIG. 3 is caused by a chemical reaction between the Cu film covering the surfaces of the first bonding member 101 and the second bonding member 102 and molten Sn. 25 is generated. The CuSn alloy layer 25 is, for example, Cu₃Sn, Cu₆Sn ₅Consists of.

Incidentally, after the time t _2, the metal composition 105 continue to cool to room temperature.

Here, the above heating step is performed by adding Sn powder to the time (t ₂ -t ₁ ) (s) from when the heating temperature rises to the melting point T _m (K) or higher of the Sn powder and then falls below the melting point of the Sn powder. When the amount of heat applied to the metal composition 105 from the temperature range of the melting point _Tm or higher is S (kK · s) and the pressure applied to the metal composition 105 is P (N / m ² ), the metal composition 105 In contrast, heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ) is performed.

The peak temperature in the heat treatment is a temperature equal to or higher than the melting point (231.9 ° C.) of the first metal Sn, and is, for example, 250 ° C. to 300 ° C. The heating time _{(t 2 -t 1) (s} ) is, for example, 30 to 180 seconds.

As shown in FIG. 4, the amount of heat S (kK · s) imparted to the metal composition 105 from the temperature range of the Sn powder melting point _Tm or higher is expressed by the following mathematical formula. f _T (t) is a temperature function indicating the temperature of the joint (metal composition 105) at a predetermined time t. The unit kK of the heat quantity S is an abbreviation for “kilo kelvin”.

  If the pressure is less than 1 MPa, the metal composition 105 is depressurized. If the pressure is higher than 30 MPa, the first bonding member 101 and the second bonding member 102 may be damaged. Therefore, the pressure P is in the range of 1 MPa to 30 MPa. It is preferable that The pressure P is set by a pressure jig described later.

  The joining structure 100 which joins the 1st joining member 101 and the 2nd joining member 102 by the above joining method is obtained. The intermetallic compound containing at least two selected from the group consisting of Cu, Ni and Sn has a high melting point (for example, 400 ° C. or higher). Therefore, the metal composition 105 (refer FIG. 3) comprised with this intermetallic compound has high heat resistance.

  Further, as shown in FIG. 3, a CuSn alloy layer 25 is generated. Therefore, the first bonding member 101, the second bonding member 102, and the metal composition 105 are firmly bonded.

  Further, since the metal composition 105 is formed in a paste shape, the fluidity of the metal component 110 is increased, and the molten Sn and the CuNi alloy powder 107 are easily brought into contact with each other. That is, the molten Sn and the CuNi alloy powder 107 are likely to react.

  Hereinafter, the joining method of the joining member which concerns on the comparative example of 1st Embodiment of this invention is demonstrated.

The joining member joining method according to the comparative example of the first embodiment differs from the joining member joining method according to the first embodiment in that S · P <15 (kK · s) with respect to the metal composition 105. -It is the point which performs the heat processing which satisfy | fills N / m < ² >). Since the other points are the same, the description is omitted.

  Hereinafter, experimental examples in which a plurality of samples are produced by the joining method of the first embodiment and the joining method of the comparative example while changing the amount of heat S and the pressure P described above and the joining strength of each sample are evaluated will be described in detail. The evaluation was performed with reference to the tensile shear bond strength test method (JIS K6850) of the adhesive.

  More specifically, first, a pair of oxygen-free copper plates was prepared as the first bonding member 101 and the second bonding member 102. Each oxygen-free copper plate has a width of 10 mm, a thickness of 2 mm, and a length of 20 mm. Apply 2.5 mg of paste (metal composition 105) within a range of 5 mm from the end of each oxygen-free copper plate, stack each oxygen-free copper plate, and apply two pressure-sensitive oxygen pressures of 1 MPa to 15 MPa with a pressure jig. Added to the copper plate joint. Two oxygen-free copper plates (samples) were placed in an oven heated to 230 ° C. to 400 ° C., and the joint was heated together with the pressure jig. After pressing and heating for a predetermined time, the sample was removed from the pressing jig to obtain a bonded copper plate (bonding structure 100). As shown in FIG. 4, the temperature of the joint during heating was measured, and S and P were obtained.

  In this experimental example, the bonding strength of each sample was evaluated by tensile shear strength (MPa). The tensile shear strength (MPa) was measured by pulling the end of the first joining member 101 and the end of the second joining member 102 in opposite directions as indicated by the arrows in FIG.

  Table 1 shows S · P values of 48 samples prepared by changing the heat quantity S and the pressure P described above. Table 2 shows the tensile shear strength (MPa) of each of the 48 samples.

  In addition, “-” in Table 2 indicates that the tensile shear strength was extremely weak and the tensile shear strength could not be measured.

From the experiment, it was revealed that the tensile shear strength was less than 9 MPa in the sample of the comparative example subjected to the heat treatment satisfying S · P <15 (kK · s · N / m ² ).

On the other hand, in the sample subjected to the heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ), it was revealed that the tensile shear strength rapidly increased to 10 MPa or more.

The reason for the above results is that the heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ) can suppress the generation of voids (bubbles) in the intermetallic compound phase 109. It is thought that. That is, it is considered that the metal composition 105 generated by the heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ) has a dense structure with few voids.

Therefore, according to the bonding method of the present embodiment, by performing heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ), generation of voids can be suppressed and bonding strength can be improved.

  However, since the organic component 108 of the paste-like metal composition 105 before the reaction contains a flux, an extremely slight void 99 remains in the metal composition 105 as shown in FIG.

  Hereinafter, the joining method of the joining member which concerns on 2nd Embodiment of this invention is demonstrated.

  FIG. 5: is sectional drawing which shows typically the installation process performed with the joining method of the joining member which concerns on 2nd Embodiment of this invention. FIG. 6: is sectional drawing which shows typically the heating process performed with the joining method of the joining member which concerns on 2nd Embodiment of this invention. FIG. 7 is a cross-sectional view schematically showing a joint structure 200 obtained by the joint member joining method according to the second embodiment of the present invention.

  The difference between the bonding method of the bonding member according to the second embodiment and the bonding method of the bonding member according to the first embodiment is that the organic component 208 of the paste-like metal composition 205 before the reaction does not contain a flux. It is. In the present embodiment, in the metal composition 205, the content of the metal component 110 is 100/110 parts by weight, and the content of the organic component 208 is 10/110 parts by weight. Since the other points are the same, the description is omitted.

Therefore, also in the bonding method of the second embodiment, the metal composition 205 at room temperature shown in FIG. 5 is heated from the thickness direction using a reflow apparatus, for example, according to the temperature profile shown in FIG. Then, heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ) is performed on the metal composition 205. The pressure P is preferably in the range of 1 MPa to 30 MPa.

  In addition, since the organic component 208 of the paste-like metal composition 205 before the reaction does not contain a flux, the flux is not completely present in the intermetallic compound phase 209 after the reaction.

  Hereinafter, the joining method of the joining member which concerns on the comparative example of 2nd Embodiment of this invention is demonstrated.

The joining member joining method according to the comparative example of the second embodiment is different from the joining member joining method according to the second embodiment in that S · P <15 (kK · s) with respect to the metal composition 205. -It is the point which performs the heat processing which satisfy | fills N / m < ² >). Since the other points are the same, the description is omitted.

  Hereinafter, an experimental example in which a plurality of samples are produced by the joining method of the second embodiment and the joining method of the comparative example by changing the heat quantity S and the pressure P described above, and the joining strength of each sample is evaluated will be described in detail. The evaluation was performed with reference to the tensile shear bond strength test method (JIS K6850) of the adhesive.

  More specifically, first, a pair of oxygen-free copper plates was prepared as the first bonding member 101 and the second bonding member 102. Each oxygen-free copper plate has a width of 10 mm, a thickness of 2 mm, and a length of 20 mm. Apply 2.5 mg of paste (metal composition 105) within a range of 5 mm from the end of each oxygen-free copper plate, stack each oxygen-free copper plate, and apply two pressure-sensitive oxygen pressures of 1 MPa to 15 MPa with a pressure jig. Added to the copper plate joint. Two oxygen-free copper plates (samples) were placed in an oven heated to 230 ° C. to 400 ° C., and the joint was heated together with the pressure jig. After pressing and heating for a predetermined time, the sample was removed from the pressing jig to obtain a bonded copper plate (bonding structure 200). As shown in FIG. 4, the temperature of the joint during heating was measured, and S and P were obtained.

  In this experimental example, the bonding strength of each sample was evaluated by tensile shear strength (MPa). The tensile shear strength (MPa) was measured by pulling the end of the first joining member 101 and the end of the second joining member 102 in opposite directions as indicated by the arrows in FIG.

  Table 3 shows S · P values of 48 samples prepared by changing the heat quantity S and the pressure P described above. The contents of Table 3 are the same as the contents of Table 1. Table 4 shows the tensile shear strength (MPa) of each of the 48 samples.

  Note that “−” in Table 4 indicates that the tensile shear strength was extremely weak and the tensile shear strength could not be measured.

From the experiment, it was clarified that the sample of the comparative example subjected to the heat treatment satisfying S · P <15 (kK · s · N / m ² ) had an extremely weak tensile shear strength and could not measure the tensile shear strength. It was.

On the other hand, in the sample subjected to the heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ), it was revealed that the tensile shear strength rapidly increases to 4 MPa or more. That is, by performing heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ), the metal composition 205 joins the first joining member 101 and the second joining member 102 without including flux. It became clear that we could do it. Moreover, it became clear that the joining strength when the flux shown in Table 4 is not included is higher than the joining strength when the flux shown in Table 2 is included.

The reason for the above results is that the heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ) can suppress the generation of voids (bubbles) in the intermetallic compound phase 209. It is thought that. That is, it is considered that the metal composition 205 produced by the heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ) has a dense structure with few voids.

  Therefore, according to the joining method of this embodiment, generation | occurrence | production of a void can be suppressed and joining strength can be improved.

<< Other embodiments >>
In the present embodiment, the metal composition 105 is in the form of a paste, but is not limited thereto. In implementation, the metal composition may be, for example, a sheet-like solid or putty-like form.

  In the present embodiment, the material of the Sn powder 106 is Sn alone, but is not limited thereto. In implementation, the material of the Sn powder 106 is an alloy containing Sn (specifically, Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg). , Pd, Si, Sr, Te, and an alloy containing Sn and at least one selected from the group consisting of P may be used.

  In this embodiment, the material of the CuNi alloy powder 107 is a CuNi alloy, but is not limited thereto. In implementation, instead of the CuNi alloy powder 107, for example, a CuMn alloy powder may be used. In this case, an intermetallic compound containing at least two selected from the group consisting of Cu, Mn, and Sn is generated by the reaction between the molten Sn and the CuMn alloy powder.

Moreover, although at least the surface of the 1st joining member 101 and the 2nd joining member 102 is covered with Cu film | membrane by the plating process, it does not restrict to this. In implementation, for example, at least the surfaces of the first bonding member 101 and the second bonding member 102 may be covered with a Ni film by plating. In this case, a NiSn alloy layer is formed instead of the CuSn alloy layer 25. The NiSn alloy layer is made of, for example, Ni ₃ Sn ₄ , Ni ₃ Sn ₂ , or Ni ₃ Sn.

  In the heating process of the embodiment described above, far infrared heating, high frequency induction heating, a hot plate, or the like may be used in addition to hot air heating.

  Finally, the description of the embodiment should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the scope of the claims.

25 ... CuSn alloy layer 99 ... Void (bubble)
DESCRIPTION OF SYMBOLS 100 ... Joining structure 101 ... 1st joining member 102 ... 2nd joining member 105 ... Metal composition 106 ... Sn powder 107 ... CuNi alloy powder 108 ... Organic component 109 ... Intermetallic compound phase 110 ... Metal component 200 ... Joining structure 205 ... Metal composition 208 ... Organic component 209 ... Intermetallic phase

Claims (8)

An installation step of providing a metal composition containing CuNi alloy powder or CuMn alloy powder and Sn powder between two joining members;
The amount of heat applied to the metal composition from the temperature range above the melting point of the Sn powder in the time from when the heating temperature rises above the melting point of the Sn powder to below the melting point of the Sn powder is S, A heating step of applying heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ) to the metal composition, where P is a pressure applied to the metal composition,
The heating step includes a metal including at least two selected from the group consisting of Sn, Cu, and Ni by a reaction between the CuNi alloy powder or the CuMn alloy powder and the Sn powder in the heat treatment of the metal composition. A joining method for a joining member, wherein an intermetallic compound phase having an intermetallic compound or an intermetallic compound containing at least two selected from the group consisting of Sn, Cu and Mn as a main phase is formed.   The said pressure P is a joining method of the joining member of Claim 1 which exists in the range of 1 Mpa or more and 30 Mpa or less.   The method according to claim 2, wherein the metal composition does not include a flux that reduces the Sn powder, the CuNi alloy powder or the CuMn alloy powder, and an oxide film covering each of the bonding members. .   The joining of the joining member according to claim 1 or 2, wherein the metal composition includes a flux that reduces the Sn powder, the CuNi alloy powder or the CuMn alloy powder, and an oxide film covering each of the joining members. Method.   The said metal composition is the joining method of the joining member of any one of Claim 1 to 4 shape | molded by the paste form.   The joining member joining method according to any one of claims 1 to 5, wherein at least a surface of the joining member is made of Cu or Ni. The joining member is an electrode terminal;
The joining method of the joining member according to claim 1, wherein the metal composition has conductivity. A metal composition comprising CuNi alloy powder or CuMn alloy powder and Sn powder,
The amount of heat applied to the metal composition from the temperature range above the melting point of the Sn powder in the time from when the heating temperature rises above the melting point of the Sn powder to below the melting point of the Sn powder is S, When the pressure applied to the metal composition is P,
The CuNi alloy powder or the CuMn alloy powder reacts with the Sn powder by heat treatment satisfying S · P ≧ 15 (kK · s · N / m ² ), and at least 2 selected from the group consisting of Sn, Cu and Ni An intermetallic compound phase comprising a main phase of an intermetallic compound containing a seed or an intermetallic compound containing at least two selected from the group consisting of Sn, Cu and Mn is formed.

Images