WO2017168925A1 - Joint - Google Patents
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- WO2017168925A1 WO2017168925A1 PCT/JP2017/000474 JP2017000474W WO2017168925A1 WO 2017168925 A1 WO2017168925 A1 WO 2017168925A1 JP 2017000474 W JP2017000474 W JP 2017000474W WO 2017168925 A1 WO2017168925 A1 WO 2017168925A1
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- WIPO (PCT)
- Prior art keywords
- metal
- heat transfer
- contact
- alloy
- joined body
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 155
- 239000002184 metal Substances 0.000 claims abstract description 155
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 39
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 23
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000008018 melting Effects 0.000 claims abstract description 11
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 7
- 238000012546 transfer Methods 0.000 claims description 95
- 229910045601 alloy Inorganic materials 0.000 claims description 41
- 239000000956 alloy Substances 0.000 claims description 41
- 238000005304 joining Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 18
- 229910002482 Cu–Ni Inorganic materials 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 11
- 229910017566 Cu-Mn Inorganic materials 0.000 claims description 8
- 229910017871 Cu—Mn Inorganic materials 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 238000000034 method Methods 0.000 description 21
- 238000007747 plating Methods 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 20
- 229910000679 solder Inorganic materials 0.000 description 15
- 239000000463 material Substances 0.000 description 13
- 229910052759 nickel Inorganic materials 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000011888 foil Substances 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 238000001000 micrograph Methods 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 229910017767 Cu—Al Inorganic materials 0.000 description 3
- 229910017813 Cu—Cr Inorganic materials 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910017868 Cu—Ni—Co Inorganic materials 0.000 description 1
- 229910017881 Cu—Ni—Fe Inorganic materials 0.000 description 1
- 229910018651 Mn—Ni Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Definitions
- a joined body of the present invention is a joined body in which a first member and a second member are joined via a joined portion, and the joined portion includes a first metal and the first metal.
- the joined portion includes a first metal and the first metal.
- the heat transfer part containing the said 2nd metal exists between, and the said 1st member is in contact with the said junction part and the said heat transfer part, It is characterized by the above-mentioned.
- the present invention is not limited to the following configurations, and can be applied with appropriate modifications without departing from the scope of the present invention.
- the present invention also includes a combination of two or more desirable configurations of the present invention described below.
- FIG. 1 is a cross-sectional view schematically showing an example of the joined body of the present invention.
- a joined body 1 shown in FIG. 1 is formed by joining a first member (for example, an electrode) 11 and a second member (for example, an electrode) 12 via a joint portion 10.
- the heat transfer unit 20 exists between the first member 11 and the second member 12, and the first member 11 is in contact with both the joining unit 10 and the heat transfer unit 20.
- the heat transfer section preferably has a through hole and / or a notch, and more preferably has a through hole.
- the number of through holes provided in one heat transfer unit may be one or plural.
- the number of notches provided in one heat transfer part may be one or plural.
- One heat transfer part may have both a through-hole and a notch. If the heat transfer part has a through hole and / or a notch, a joint exists in the through hole and / or in the notch. Therefore, since the first member can be fixed by the joint portion existing in the through hole and / or in the cutout portion, compared to the case where the heat transfer portion having the same area in contact with the first member and having a plate shape is provided. In addition, the bonding between the first member and the bonding portion can be strengthened.
- the plurality of heat transfer portions have through holes and / or notches, it is not necessary that all the heat transfer portions have through holes and / or notches, and neither the through holes nor the notches are present.
- the heat transfer part which does not have may exist, and the heat transfer part which has a through-hole, and the heat transfer part which has a notch part may be mixed.
- the first member is an electrode of an electronic component and the second member is an electrode on a substrate.
- electronic components include semiconductor chips (IGBT (Insulated Gate Bipolar Transistor), MOSFETs (Metal Oxide Semiconductor Field Effect Transistor), Schottky barrier diodes, LEDs, etc.), capacitors, inductors, thermistors, resistors, varistors, resistors, and the like. In these, a semiconductor chip is preferable.
- the joined body of the present invention is particularly suitable as a configuration of an electronic apparatus such as a semiconductor device of a type in which a semiconductor chip is die-bonded.
- the second member may be an electrode foil.
- Example 2 Comparative Example 1 and Comparative Example 2 Except that the thickness of the Cu-10Ni plate was fixed to 0.1 mm and the length and width were changed to the values shown in Table 1, joined bodies were prepared in the same manner as in Example 1, and Examples 2 to 5 The joined bodies of Comparative Example 1 and Comparative Example 2 were obtained.
- Example 5 Comparative Example 1 and Comparative Example 2, a Cu-10Ni plate having a 1 mm ⁇ 1 mm through hole at the center of the plate was used.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Abstract
This joint is a joint by which a first member and a second member are joined via a joining part, the joint characterized in that the joining part contains an intermetallic compound of a first metal, and a second metal having a higher melting point than the first metal; the first metal is Sn or an Sn alloy; the second metal is a Cu alloy; a heat conducting part containing the second metal exists between the first member and the second member; and the first member is in contact with the joining part and the heat conducting part.
Description
本発明は、第１部材と第２部材とが接合部を介して接合された接合体に関する。
The present invention relates to a joined body in which a first member and a second member are joined via a joining portion.
電子部品の実装の際に用いる導電性材料としては、Ｓｎ－Ｐｂ系はんだ又はＳｎ－Ａｇ－Ｃｕ系はんだ等のはんだ材料が広く用いられてきた。
As a conductive material used for mounting electronic components, a solder material such as Sn—Pb solder or Sn—Ag—Cu solder has been widely used.
この用途に用いられる導電性材料として、特許文献１には、第１金属と、第１金属よりも融点が高く、第１金属と反応して金属間化合物を生成する第２金属とからなる金属成分を含む導電性材料が開示されている。特許文献１に記載の導電性材料では、第１金属はＳｎ又はＳｎを７０重量％以上含む合金であり、第２金属はＣｕ－Ｍｎ合金又はＣｕ－Ｎｉ合金であり、第１金属と第２金属とは、３１０℃以上の融点を示す金属間化合物を生成することを特徴としている。特許文献１には、導電性材料がフラックス成分を含み、該導電性材料をソルダペーストとして用いることが開示されている。さらに、特許文献１には、該導電性材料を用いて接続対象物を接続する方法も開示されている。
As a conductive material used for this application, Patent Document 1 discloses a metal composed of a first metal and a second metal having a melting point higher than that of the first metal and reacting with the first metal to generate an intermetallic compound. A conductive material containing components is disclosed. In the conductive material described in Patent Document 1, the first metal is Sn or an alloy containing 70 wt% or more of Sn, and the second metal is a Cu—Mn alloy or a Cu—Ni alloy. A metal is characterized by producing an intermetallic compound having a melting point of 310 ° C. or higher. Patent Document 1 discloses that a conductive material contains a flux component, and that the conductive material is used as a solder paste. Furthermore, Patent Document 1 also discloses a method of connecting a connection object using the conductive material.
また、ソルダペーストを用いない接合方法として、特許文献２には、第１の接合対象物と第２の接合対象物とをインサート材を用いて接合する方法が開示されている。第１の接合対象物及び／又は第２の接合対象物は、インサート材を構成する合金よりも融点の低いＳｎ又はＳｎを含む合金から構成される第１金属を有し、インサート材は、Ｎｉ、Ｍｎ、Ａｌ及びＣｒから選ばれる少なくとも１種と、Ｃｕとを含む合金である第２金属を主成分としている。特許文献２に記載の接合方法では、第１の接合対象物と第２の接合対象物との間に、インサート材を配置した状態で熱処理を行い、第１の接合対象物及び／又は第２の接合対象物が有する第１金属と、インサート材を構成する第２金属との金属間化合物を生成させることにより、第１の接合対象物と第２の接合対象物を接合することを特徴としている。特許文献２には、表面積の小さい板状等の形態でインサート材を供給することが開示されている。
As a joining method that does not use solder paste, Patent Document 2 discloses a method of joining a first joining object and a second joining object using an insert material. The first joining object and / or the second joining object has a first metal composed of Sn or an alloy containing Sn having a melting point lower than that of the alloy constituting the insert material, and the insert material is made of Ni. The main component is a second metal which is an alloy containing Cu, and at least one selected from Mn, Al and Cr. In the joining method described in Patent Document 2, heat treatment is performed in a state where an insert material is disposed between the first joining object and the second joining object, and the first joining object and / or the second joining object are disposed. The first joining object and the second joining object are joined by generating an intermetallic compound of the first metal included in the joining object and the second metal constituting the insert material. Yes. Patent Document 2 discloses that the insert material is supplied in the form of a plate having a small surface area.
特許文献１及び特許文献２に記載の方法によれば、第１金属（例えばＳｎ）と第２金属（例えばＣｕ－Ｎｉ合金）とが加熱されることによって、第１金属と第２金属とが反応して金属間化合物（例えば（Ｃｕ，Ｎｉ）６Ｓｎ５）が形成され、この金属間化合物を含む接合部を介して接合対象物が接合される。
According to the method described in Patent Document 1 and Patent Document 2, the first metal (for example, Sn) and the second metal (for example, Cu—Ni alloy) are heated, so that the first metal and the second metal are formed. By reacting, an intermetallic compound (for example, (Cu, Ni) 6 Sn 5 ) is formed, and an object to be joined is joined through a joint portion containing the intermetallic compound.
特許文献１及び特許文献２に記載の方法では、第１金属と第２金属とが速やかに反応することにより融点の高い金属間化合物の形成が促進されるため、融点の低い第１金属の残留量を少なくすることができる。その結果、従来のはんだ材料を用いる方法と比べて接合部の耐熱性を高くすることができる。
In the methods described in Patent Literature 1 and Patent Literature 2, since the first metal and the second metal react rapidly, the formation of an intermetallic compound having a high melting point is promoted, so that the first metal having a low melting point remains. The amount can be reduced. As a result, the heat resistance of the joint can be increased as compared with the conventional method using a solder material.
しかし、特許文献１及び特許文献２に記載の方法では、従来のはんだ材料を用いる方法と比べて接合部の熱伝導性が低いことが判明した。したがって、例えば、特許文献１及び特許文献２に記載の方法を用いて電子部品を基板に実装した場合、電子部品で発生した熱が接合部に充分に伝わらず、電子部品に熱がこもってしまうおそれがある。
However, it has been found that the methods described in Patent Document 1 and Patent Document 2 have a lower thermal conductivity of the joint than the conventional method using a solder material. Therefore, for example, when an electronic component is mounted on a substrate using the methods described in Patent Document 1 and Patent Document 2, the heat generated in the electronic component is not sufficiently transferred to the joint portion, and the electronic component is heated. There is a fear.
本発明は上記の問題を解決するためになされたものであり、耐熱性及び熱伝導性に優れる接合体を提供することを目的とする。
The present invention has been made to solve the above problems, and an object of the present invention is to provide a bonded body excellent in heat resistance and thermal conductivity.
上記目的を達成するため、本発明の接合体は、第１部材と第２部材とが接合部を介して接合された接合体であって、上記接合部は、第１金属と、上記第１金属よりも融点の高い第２金属との金属間化合物を含み、上記第１金属は、Ｓｎ又はＳｎ合金であり、上記第２金属は、Ｃｕ合金であり、上記第１部材と上記第２部材との間には、上記第２金属を含む伝熱部が存在し、上記第１部材は、上記接合部及び上記伝熱部と接していることを特徴とする。
In order to achieve the above object, a joined body of the present invention is a joined body in which a first member and a second member are joined via a joined portion, and the joined portion includes a first metal and the first metal. Including an intermetallic compound with a second metal having a melting point higher than that of the metal, wherein the first metal is Sn or an Sn alloy, the second metal is a Cu alloy, and the first member and the second member The heat transfer part containing the said 2nd metal exists between, and the said 1st member is in contact with the said junction part and the said heat transfer part, It is characterized by the above-mentioned.
本発明の接合体では、融点の高い金属間化合物（例えば（Ｃｕ，Ｎｉ）６Ｓｎ５）を含む接合部を介して第１部材と第２部材とが接合されている。そのため、特許文献１及び特許文献２に記載の方法により得られる接合体と同様に耐熱性を高くすることができる。
In the joined body of the present invention, the first member and the second member are joined via a joined portion containing an intermetallic compound having a high melting point (for example, (Cu, Ni) 6 Sn 5 ). Therefore, the heat resistance can be increased similarly to the joined body obtained by the methods described in Patent Document 1 and Patent Document 2.
さらに、本発明の接合体では、第１部材が、金属間化合物を含む接合部とだけでなく、第２金属を含む伝熱部とも接している。第２金属であるＣｕ合金は、（Ｃｕ，Ｎｉ）６Ｓｎ５等の金属間化合物よりも熱伝導率が高いため、第１部材と伝熱部との間の熱伝導性を高くすることができる。その結果、第１部材側で発生した熱が伝熱部にスムーズに伝わるため、効率良く放熱することができる。
Furthermore, in the joined body of the present invention, the first member is in contact with not only the joint including the intermetallic compound but also the heat transfer section including the second metal. Since the Cu alloy as the second metal has a higher thermal conductivity than an intermetallic compound such as (Cu, Ni) 6 Sn 5, it may increase the thermal conductivity between the first member and the heat transfer section. it can. As a result, the heat generated on the first member side is smoothly transferred to the heat transfer section, so that heat can be radiated efficiently.
これに対し、特許文献１のようにペーストを用いる方法では、ペーストに含まれる第１金属と第２金属とが速やかに反応して金属間化合物が形成されるため、第１金属及び第２金属の残留量は少ない。したがって、得られる接合体において、第１部材に該当する箇所は金属間化合物と接するものの、第２金属とは接していない。また、特許文献２のようにインサート材を用いる方法では、第１の接合対象物が有する第１金属とインサート材を構成する第２金属とが反応して金属間化合物が形成されるため、インサート材を構成する第２金属と第１の接合対象物との間には金属間化合物が存在する。したがって、仮にインサート材の一部が接合部の内部に残存する場合であっても、得られる接合体において、第１部材に該当する箇所は第２金属とは接していない。
On the other hand, in the method using a paste as in Patent Document 1, the first metal and the second metal contained in the paste react quickly to form an intermetallic compound, so that the first metal and the second metal are formed. The residual amount of is small. Therefore, in the obtained joined body, the portion corresponding to the first member is in contact with the intermetallic compound, but is not in contact with the second metal. Moreover, in the method using an insert material like patent document 2, since the 1st metal which a 1st joining object has and the 2nd metal which comprises an insert material react, an intermetallic compound is formed, insert An intermetallic compound exists between the second metal constituting the material and the first object to be joined. Therefore, even if a part of the insert material remains inside the joint, the portion corresponding to the first member in the obtained joined body is not in contact with the second metal.
以上のように、本発明の接合体では、第１部材を接合部及び伝熱部の両方と接触させることによって、耐熱性及び熱伝導性を高くすることができる。
As described above, in the joined body of the present invention, heat resistance and thermal conductivity can be increased by bringing the first member into contact with both the joint and the heat transfer section.
本発明の接合体において、上記第１部材と接している上記伝熱部は、上記第２部材とも接していることが好ましい。
伝熱部が第１部材だけでなく第２部材とも接していると、第１部材側で発生した熱が伝熱部を介して第２部材側へスムーズに伝わるため、さらに効率良く放熱することができる。 In the joined body of the present invention, it is preferable that the heat transfer section in contact with the first member is also in contact with the second member.
When the heat transfer part is in contact with not only the first member but also the second member, the heat generated on the first member side is smoothly transferred to the second member side via the heat transfer part, so that heat can be radiated more efficiently. Can do.
伝熱部が第１部材だけでなく第２部材とも接していると、第１部材側で発生した熱が伝熱部を介して第２部材側へスムーズに伝わるため、さらに効率良く放熱することができる。 In the joined body of the present invention, it is preferable that the heat transfer section in contact with the first member is also in contact with the second member.
When the heat transfer part is in contact with not only the first member but also the second member, the heat generated on the first member side is smoothly transferred to the second member side via the heat transfer part, so that heat can be radiated more efficiently. Can do.
本発明の接合体において、上記第１部材は、貫通孔を有する伝熱部と接しており、上記貫通孔内に存在する接合部とも接していることが好ましい。
この場合、貫通孔内に存在する接合部によって第１部材を固定できるため、第１部材と接している面積が同じで形状が板状である伝熱部を設ける場合と比べて、第１部材と接合部との接合を強固にすることができる。 In the joined body of the present invention, it is preferable that the first member is in contact with a heat transfer portion having a through hole, and is also in contact with a joint portion existing in the through hole.
In this case, since the first member can be fixed by the joint portion existing in the through hole, the first member is compared with the case where the heat transfer portion having the same area in contact with the first member and having a plate shape is provided. And the joint part can be strengthened.
この場合、貫通孔内に存在する接合部によって第１部材を固定できるため、第１部材と接している面積が同じで形状が板状である伝熱部を設ける場合と比べて、第１部材と接合部との接合を強固にすることができる。 In the joined body of the present invention, it is preferable that the first member is in contact with a heat transfer portion having a through hole, and is also in contact with a joint portion existing in the through hole.
In this case, since the first member can be fixed by the joint portion existing in the through hole, the first member is compared with the case where the heat transfer portion having the same area in contact with the first member and having a plate shape is provided. And the joint part can be strengthened.
本発明の接合体において、上記第１部材は、複数の伝熱部と接しており、複数の伝熱部間に存在する接合部とも接していることが好ましい。
この場合、複数の伝熱部間に存在する接合部によって第１部材を固定できるため、第１部材と接している面積が同じで形状が板状である伝熱部を設ける場合と比べて、第１部材と接合部との接合を強固にすることができる。 In the joined body of the present invention, it is preferable that the first member is in contact with a plurality of heat transfer portions, and is also in contact with a joint portion existing between the plurality of heat transfer portions.
In this case, since the first member can be fixed by the joint portion existing between the plurality of heat transfer portions, compared with the case where the heat transfer portion having the same area in contact with the first member and the plate shape is provided, Bonding between the first member and the bonding portion can be strengthened.
この場合、複数の伝熱部間に存在する接合部によって第１部材を固定できるため、第１部材と接している面積が同じで形状が板状である伝熱部を設ける場合と比べて、第１部材と接合部との接合を強固にすることができる。 In the joined body of the present invention, it is preferable that the first member is in contact with a plurality of heat transfer portions, and is also in contact with a joint portion existing between the plurality of heat transfer portions.
In this case, since the first member can be fixed by the joint portion existing between the plurality of heat transfer portions, compared with the case where the heat transfer portion having the same area in contact with the first member and the plate shape is provided, Bonding between the first member and the bonding portion can be strengthened.
本発明の接合体において、上記第２金属は、Ｃｕ－Ｎｉ合金又はＣｕ－Ｍｎ合金であることが好ましい。
Ｃｕ－Ｎｉ合金又はＣｕ－Ｍｎ合金は第１金属と速やかに反応して金属間化合物を形成するため、接合強度を高くすることができる。 In the joined body of the present invention, the second metal is preferably a Cu—Ni alloy or a Cu—Mn alloy.
Since the Cu—Ni alloy or Cu—Mn alloy reacts quickly with the first metal to form an intermetallic compound, the bonding strength can be increased.
Ｃｕ－Ｎｉ合金又はＣｕ－Ｍｎ合金は第１金属と速やかに反応して金属間化合物を形成するため、接合強度を高くすることができる。 In the joined body of the present invention, the second metal is preferably a Cu—Ni alloy or a Cu—Mn alloy.
Since the Cu—Ni alloy or Cu—Mn alloy reacts quickly with the first metal to form an intermetallic compound, the bonding strength can be increased.
本発明の接合体においては、上記第１部材が電子部品の電極、上記第２部材が基板上の電極であることが好ましい。上記電子部品は、半導体チップであることが好ましい。
本発明の接合体は、半導体チップをダイボンドするタイプの半導体装置等の電子機器の構成として特に適している。 In the joined body of the present invention, it is preferable that the first member is an electrode of an electronic component and the second member is an electrode on a substrate. The electronic component is preferably a semiconductor chip.
The joined body of the present invention is particularly suitable as a configuration of an electronic apparatus such as a semiconductor device of a type in which a semiconductor chip is die-bonded.
本発明の接合体は、半導体チップをダイボンドするタイプの半導体装置等の電子機器の構成として特に適している。 In the joined body of the present invention, it is preferable that the first member is an electrode of an electronic component and the second member is an electrode on a substrate. The electronic component is preferably a semiconductor chip.
The joined body of the present invention is particularly suitable as a configuration of an electronic apparatus such as a semiconductor device of a type in which a semiconductor chip is die-bonded.
本発明によれば、耐熱性及び熱伝導性に優れる接合体を提供することができる。
ADVANTAGE OF THE INVENTION According to this invention, the conjugate | zygote excellent in heat resistance and heat conductivity can be provided.
以下、本発明の接合体について説明する。
しかしながら、本発明は、以下の構成に限定されるものではなく、本発明の要旨を変更しない範囲において適宜変更して適用することができる。
なお、以下において記載する本発明の個々の望ましい構成を２つ以上組み合わせたものもまた本発明である。 Hereinafter, the joined body of the present invention will be described.
However, the present invention is not limited to the following configurations, and can be applied with appropriate modifications without departing from the scope of the present invention.
Note that the present invention also includes a combination of two or more desirable configurations of the present invention described below.
しかしながら、本発明は、以下の構成に限定されるものではなく、本発明の要旨を変更しない範囲において適宜変更して適用することができる。
なお、以下において記載する本発明の個々の望ましい構成を２つ以上組み合わせたものもまた本発明である。 Hereinafter, the joined body of the present invention will be described.
However, the present invention is not limited to the following configurations, and can be applied with appropriate modifications without departing from the scope of the present invention.
Note that the present invention also includes a combination of two or more desirable configurations of the present invention described below.
図１は、本発明の接合体の一例を模式的に示す断面図である。
図１に示す接合体１は、第１部材（例えば電極）１１と第２部材（例えば電極）１２とが接合部１０を介して接合されてなる。第１部材１１と第２部材１２との間には伝熱部２０が存在し、第１部材１１は、接合部１０及び伝熱部２０の両方と接している。 FIG. 1 is a cross-sectional view schematically showing an example of the joined body of the present invention.
A joined body 1 shown in FIG. 1 is formed by joining a first member (for example, an electrode) 11 and a second member (for example, an electrode) 12 via ajoint portion 10. The heat transfer unit 20 exists between the first member 11 and the second member 12, and the first member 11 is in contact with both the joining unit 10 and the heat transfer unit 20.
図１に示す接合体１は、第１部材（例えば電極）１１と第２部材（例えば電極）１２とが接合部１０を介して接合されてなる。第１部材１１と第２部材１２との間には伝熱部２０が存在し、第１部材１１は、接合部１０及び伝熱部２０の両方と接している。 FIG. 1 is a cross-sectional view schematically showing an example of the joined body of the present invention.
A joined body 1 shown in FIG. 1 is formed by joining a first member (for example, an electrode) 11 and a second member (for example, an electrode) 12 via a
図１に示すように、第１部材及び第２部材は、いずれも、少なくとも１つの主面を有する板状等の形状を有することが好ましく、伝熱部も、少なくとも１つの主面を有する板状等の形状を有することが好ましい。この場合、第１部材の一主面と第２部材の一主面とが接合部を介して接合される。そして、第１部材の一主面と第２部材の一主面との間に伝熱部が存在し、第１部材の一主面が、伝熱部の一主面と面で接する。具体的には、第１部材と接触する部分の伝熱部の面積を第１部材の一主面の面積よりも小さくすることにより、第１部材の一主面を接合部及び伝熱部の両方に接触させることができる。
As shown in FIG. 1, both the first member and the second member preferably have a plate-like shape having at least one main surface, and the heat transfer section also has a plate having at least one main surface. It is preferable to have a shape such as a shape. In this case, the one main surface of the first member and the one main surface of the second member are joined via the joint portion. And a heat-transfer part exists between one main surface of the 1st member, and one main surface of the 2nd member, and one main surface of the 1st member contacts a main surface of the heat-transfer part. Specifically, the main surface of the first member is made smaller than the area of the main surface of the first member by making the area of the heat transfer portion of the portion in contact with the first member smaller than the area of the main surface of the first member. Both can be contacted.
図２は、本発明の接合体の別の一例を模式的に示す断面図である。
図２に示す接合体２は、第１部材１１と接している伝熱部２０が第２部材１２とも接している以外は、図１に示す接合体１と同じ構成を有している。 FIG. 2 is a cross-sectional view schematically showing another example of the joined body of the present invention.
The joinedbody 2 shown in FIG. 2 has the same configuration as the joined body 1 shown in FIG. 1 except that the heat transfer section 20 in contact with the first member 11 is also in contact with the second member 12.
図２に示す接合体２は、第１部材１１と接している伝熱部２０が第２部材１２とも接している以外は、図１に示す接合体１と同じ構成を有している。 FIG. 2 is a cross-sectional view schematically showing another example of the joined body of the present invention.
The joined
図２のように、伝熱部が第１部材及び第２部材の両方と接する場合、第１部材及び第２部材は、いずれも、少なくとも１つの主面を有する板状等の形状を有することが好ましく、伝熱部は、少なくとも２つの主面を有する板状等の形状を有することが好ましい。図１と同様、第１部材の一主面と第２部材の一主面とが接合部を介して接合される。そして、第１部材の一主面と第２部材の一主面との間に伝熱部が存在し、第１部材の一主面が、伝熱部の一方主面と面で接し、第２部材の一主面が、伝熱部の他方主面と面で接する。具体的には、第１部材と接触する部分の伝熱部の面積を第１部材の一主面の面積よりも小さくすることにより、第１部材の一主面を接合部及び伝熱部の両方に接触させることができ、第２部材と接触する部分の伝熱部の面積を第２部材の一主面の面積よりも小さくすることにより、第２部材の一主面を接合部及び伝熱部の両方に接触させることができる。
As shown in FIG. 2, when the heat transfer section is in contact with both the first member and the second member, each of the first member and the second member has a shape such as a plate having at least one main surface. It is preferable that the heat transfer section has a plate shape or the like having at least two main surfaces. As in FIG. 1, the one principal surface of the first member and the one principal surface of the second member are joined via the joint portion. And the heat transfer part exists between the one main surface of the first member and the one main surface of the second member, the one main surface of the first member is in contact with the one main surface of the heat transfer part, One main surface of the two members is in contact with the other main surface of the heat transfer section. Specifically, the main surface of the first member is made smaller than the area of the main surface of the first member by making the area of the heat transfer portion of the portion in contact with the first member smaller than the area of the main surface of the first member. The main surface of the second member can be made to contact the joint portion and the heat transfer by making the area of the heat transfer portion of the portion in contact with the second member smaller than the area of the main surface of the second member. It can be in contact with both of the hot parts.
本発明の接合体において、接合部は、第１金属（例えばＳｎ）と第２金属（例えばＣｕ－Ｎｉ合金）との金属間化合物（例えば（Ｃｕ，Ｎｉ）６Ｓｎ５）を含んでいる。
金属間化合物は、融点以上まで加熱されて溶融した第１金属が第２金属と反応することにより生成する。後述するように、接合部は、例えば、第１金属ペーストと第２金属部材とを反応させることにより形成することができる。 In the joined body of the present invention, the joint includes an intermetallic compound (for example, (Cu, Ni) 6 Sn 5 ) of a first metal (for example, Sn) and a second metal (for example, a Cu—Ni alloy).
The intermetallic compound is generated when the first metal that has been heated and melted to the melting point or higher reacts with the second metal. As will be described later, the joint portion can be formed, for example, by reacting the first metal paste and the second metal member.
金属間化合物は、融点以上まで加熱されて溶融した第１金属が第２金属と反応することにより生成する。後述するように、接合部は、例えば、第１金属ペーストと第２金属部材とを反応させることにより形成することができる。 In the joined body of the present invention, the joint includes an intermetallic compound (for example, (Cu, Ni) 6 Sn 5 ) of a first metal (for example, Sn) and a second metal (for example, a Cu—Ni alloy).
The intermetallic compound is generated when the first metal that has been heated and melted to the melting point or higher reacts with the second metal. As will be described later, the joint portion can be formed, for example, by reacting the first metal paste and the second metal member.
第１金属は、Ｓｎ又はＳｎ合金であり、例えば、Ｓｎ単体、又は、Ｃｕ、Ｎｉ、Ａｇ、Ａｕ、Ｓｂ、Ｚｎ、Ｂｉ、Ｉｎ、Ｇｅ、Ａｌ、Ｃｏ、Ｍｎ、Ｆｅ、Ｃｒ、Ｍｇ、Ｍｎ、Ｐｄ、Ｓｉ、Ｓｒ、Ｔｅ及びＰからなる群より選ばれる少なくとも１種とＳｎとを含む合金が挙げられる。中でも、Ｓｎ、Ｓｎ－３Ａｇ－０．５Ｃｕ、Ｓｎ－３．５Ａｇ、Ｓｎ－０．７５Ｃｕ、Ｓｎ－５８Ｂｉ、Ｓｎ－０．７Ｃｕ－０．０５Ｎｉ、Ｓｎ－５Ｓｂ、Ｓｎ－２Ａｇ－０．５Ｃｕ－２Ｂｉ、Ｓｎ－５７Ｂｉ－１Ａｇ、Ｓｎ－３．５Ａｇ－０．５Ｂｉ－８Ｉｎ、Ｓｎ－９Ｚｎ、又は、Ｓｎ－８Ｚｎ－３Ｂｉが好ましい。
上記表記において、例えば、「Ｓｎ－３Ａｇ－０．５Ｃｕ」は、Ａｇを３重量％、Ｃｕを０．５重量％含有し、残部をＳｎとする合金であることを示している。 The first metal is Sn or Sn alloy, for example, Sn alone, Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn An alloy containing Sn and at least one selected from the group consisting of Pd, Si, Sr, Te, and P is given. Among them, Sn, Sn-3Ag-0.5Cu, Sn-3.5Ag, Sn-0.75Cu, Sn-58Bi, Sn-0.7Cu-0.05Ni, Sn-5Sb, Sn-2Ag-0.5Cu- 2Bi, Sn-57Bi-1Ag, Sn-3.5Ag-0.5Bi-8In, Sn-9Zn, or Sn-8Zn-3Bi is preferable.
In the above notation, for example, “Sn-3Ag-0.5Cu” indicates an alloy containing 3% by weight of Ag, 0.5% by weight of Cu, and the balance being Sn.
上記表記において、例えば、「Ｓｎ－３Ａｇ－０．５Ｃｕ」は、Ａｇを３重量％、Ｃｕを０．５重量％含有し、残部をＳｎとする合金であることを示している。 The first metal is Sn or Sn alloy, for example, Sn alone, Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn An alloy containing Sn and at least one selected from the group consisting of Pd, Si, Sr, Te, and P is given. Among them, Sn, Sn-3Ag-0.5Cu, Sn-3.5Ag, Sn-0.75Cu, Sn-58Bi, Sn-0.7Cu-0.05Ni, Sn-5Sb, Sn-2Ag-0.5Cu- 2Bi, Sn-57Bi-1Ag, Sn-3.5Ag-0.5Bi-8In, Sn-9Zn, or Sn-8Zn-3Bi is preferable.
In the above notation, for example, “Sn-3Ag-0.5Cu” indicates an alloy containing 3% by weight of Ag, 0.5% by weight of Cu, and the balance being Sn.
第２金属は、Ｃｕ合金であり、例えば、Ｃｕ－Ｎｉ合金、Ｃｕ－Ｍｎ合金、Ｃｕ－Ａｌ合金又はＣｕ－Ｃｒ合金が挙げられる。これらの中では、Ｃｕ－Ｎｉ合金又はＣｕ－Ｍｎ合金が好ましい。
Ｃｕ－Ｎｉ合金は、Ｎｉの割合が５重量％以上３０重量％以下であるＣｕ－Ｎｉ合金が好ましく、例えば、Ｃｕ－５Ｎｉ、Ｃｕ－１０Ｎｉ、Ｃｕ－１５Ｎｉ、Ｃｕ－２０Ｎｉ、Ｃｕ－２５Ｎｉ、又は、Ｃｕ－３０Ｎｉが挙げられる。Ｃｕ－Ｎｉ合金には、Ｃｕ－Ｎｉ－Ｃｏ合金、Ｃｕ－Ｎｉ－Ｆｅ合金等のように第３成分を含む合金も含まれる。
Ｃｕ－Ｍｎ合金は、Ｍｎの割合が５重量％以上３０重量％以下であるＣｕ－Ｍｎ合金が好ましく、例えば、Ｃｕ－５Ｍｎ、Ｃｕ－１０Ｍｎ、Ｃｕ－１５Ｍｎ、Ｃｕ－２０Ｍｎ、Ｃｕ－２５Ｍｎ、又は、Ｃｕ－３０Ｍｎが挙げられる。
Ｃｕ－Ａｌ合金は、Ａｌの割合が５重量％以上１０重量％以下であるＣｕ－Ａｌ合金が好ましく、例えば、Ｃｕ－５Ａｌ、又は、Ｃｕ－１０Ａｌが挙げられる。
Ｃｕ－Ｃｒ合金は、Ｃｒの割合が５重量％以上１０重量％以下であるＣｕ－Ｃｒ合金が好ましく、例えば、Ｃｕ－５Ｃｒ、又は、Ｃｕ－１０Ｃｒが挙げられる。
なお、第２金属は、Ｃｕ－Ｍｎ－Ｎｉ等のようにＭｎ及びＮｉを同時に含んでいてもよく、また、Ｐ等の第３成分を含んでいてもよい。
上記表記において、例えば、「Ｃｕ－５Ｎｉ」は、Ｎｉを５重量％含有し、残部をＣｕとする合金であることを示している。Ｍｎについても同様である。 The second metal is a Cu alloy, and examples thereof include a Cu—Ni alloy, a Cu—Mn alloy, a Cu—Al alloy, and a Cu—Cr alloy. Among these, a Cu—Ni alloy or a Cu—Mn alloy is preferable.
The Cu—Ni alloy is preferably a Cu—Ni alloy with a Ni content of 5 wt% or more and 30 wt% or less, for example, Cu-5Ni, Cu-10Ni, Cu-15Ni, Cu-20Ni, Cu-25Ni, or Cu-30Ni. The Cu—Ni alloy includes alloys containing a third component such as a Cu—Ni—Co alloy and a Cu—Ni—Fe alloy.
The Cu—Mn alloy is preferably a Cu—Mn alloy having a Mn ratio of 5 wt% or more and 30 wt% or less, such as Cu-5Mn, Cu-10Mn, Cu-15Mn, Cu-20Mn, Cu-25Mn, or Cu-30Mn.
The Cu—Al alloy is preferably a Cu—Al alloy having an Al ratio of 5% by weight or more and 10% by weight or less, and examples thereof include Cu-5Al and Cu-10Al.
The Cu—Cr alloy is preferably a Cu—Cr alloy having a Cr ratio of 5 wt% or more and 10 wt% or less, and examples thereof include Cu-5Cr and Cu-10Cr.
The second metal may contain Mn and Ni at the same time, such as Cu—Mn—Ni, or may contain a third component such as P.
In the above notation, for example, “Cu-5Ni” indicates an alloy containing 5% by weight of Ni and the balance being Cu. The same applies to Mn.
Ｃｕ－Ｎｉ合金は、Ｎｉの割合が５重量％以上３０重量％以下であるＣｕ－Ｎｉ合金が好ましく、例えば、Ｃｕ－５Ｎｉ、Ｃｕ－１０Ｎｉ、Ｃｕ－１５Ｎｉ、Ｃｕ－２０Ｎｉ、Ｃｕ－２５Ｎｉ、又は、Ｃｕ－３０Ｎｉが挙げられる。Ｃｕ－Ｎｉ合金には、Ｃｕ－Ｎｉ－Ｃｏ合金、Ｃｕ－Ｎｉ－Ｆｅ合金等のように第３成分を含む合金も含まれる。
Ｃｕ－Ｍｎ合金は、Ｍｎの割合が５重量％以上３０重量％以下であるＣｕ－Ｍｎ合金が好ましく、例えば、Ｃｕ－５Ｍｎ、Ｃｕ－１０Ｍｎ、Ｃｕ－１５Ｍｎ、Ｃｕ－２０Ｍｎ、Ｃｕ－２５Ｍｎ、又は、Ｃｕ－３０Ｍｎが挙げられる。
Ｃｕ－Ａｌ合金は、Ａｌの割合が５重量％以上１０重量％以下であるＣｕ－Ａｌ合金が好ましく、例えば、Ｃｕ－５Ａｌ、又は、Ｃｕ－１０Ａｌが挙げられる。
Ｃｕ－Ｃｒ合金は、Ｃｒの割合が５重量％以上１０重量％以下であるＣｕ－Ｃｒ合金が好ましく、例えば、Ｃｕ－５Ｃｒ、又は、Ｃｕ－１０Ｃｒが挙げられる。
なお、第２金属は、Ｃｕ－Ｍｎ－Ｎｉ等のようにＭｎ及びＮｉを同時に含んでいてもよく、また、Ｐ等の第３成分を含んでいてもよい。
上記表記において、例えば、「Ｃｕ－５Ｎｉ」は、Ｎｉを５重量％含有し、残部をＣｕとする合金であることを示している。Ｍｎについても同様である。 The second metal is a Cu alloy, and examples thereof include a Cu—Ni alloy, a Cu—Mn alloy, a Cu—Al alloy, and a Cu—Cr alloy. Among these, a Cu—Ni alloy or a Cu—Mn alloy is preferable.
The Cu—Ni alloy is preferably a Cu—Ni alloy with a Ni content of 5 wt% or more and 30 wt% or less, for example, Cu-5Ni, Cu-10Ni, Cu-15Ni, Cu-20Ni, Cu-25Ni, or Cu-30Ni. The Cu—Ni alloy includes alloys containing a third component such as a Cu—Ni—Co alloy and a Cu—Ni—Fe alloy.
The Cu—Mn alloy is preferably a Cu—Mn alloy having a Mn ratio of 5 wt% or more and 30 wt% or less, such as Cu-5Mn, Cu-10Mn, Cu-15Mn, Cu-20Mn, Cu-25Mn, or Cu-30Mn.
The Cu—Al alloy is preferably a Cu—Al alloy having an Al ratio of 5% by weight or more and 10% by weight or less, and examples thereof include Cu-5Al and Cu-10Al.
The Cu—Cr alloy is preferably a Cu—Cr alloy having a Cr ratio of 5 wt% or more and 10 wt% or less, and examples thereof include Cu-5Cr and Cu-10Cr.
The second metal may contain Mn and Ni at the same time, such as Cu—Mn—Ni, or may contain a third component such as P.
In the above notation, for example, “Cu-5Ni” indicates an alloy containing 5% by weight of Ni and the balance being Cu. The same applies to Mn.
接合部に金属間化合物が含まれていることは、接合体の断面を金属顕微鏡を用いて観察することによって簡易的に確認することができる。詳細には、接合部に対して、エネルギー分散型Ｘ線分析（ＥＤＸ）等による組成分析と、微小部Ｘ線回折等による結晶構造解析とを行うことによって、接合部に含まれる金属が（Ｃｕ，Ｎｉ）６Ｓｎ５等の金属間化合物であることを確認することができる。
It can be simply confirmed by observing the cross section of the bonded body using a metal microscope that the bonded portion contains an intermetallic compound. Specifically, by performing composition analysis by energy dispersive X-ray analysis (EDX) or the like and crystal structure analysis by minute part X-ray diffraction or the like on the joint, the metal contained in the joint (Cu , Ni) 6 Sn 5 or the like.
接合部の耐熱性を確保する観点から、接合部には第１金属が残留していないことが好ましいが、接合体が２４０℃程度に加熱されても再溶融しなければ、接合部に第１金属が残留していてもよい。
From the viewpoint of securing the heat resistance of the joint, it is preferable that the first metal does not remain in the joint. However, if the joined body is not remelted even when heated to about 240 ° C., the first joint Metal may remain.
本発明の接合体において、伝熱部は、第２金属を含んでいる。第２金属としては、接合部で説明したＣｕ合金が挙げられる。
後述するように、伝熱部は、例えば、接合部を形成する際に用いる第２金属を第１金属と反応させずに残存させることにより形成することができる。そのため、伝熱部を構成する第２金属は、接合部を構成する金属間化合物に含まれる第２金属と同じ金属元素を含むことが好ましい。 In the joined body of the present invention, the heat transfer part includes a second metal. Examples of the second metal include the Cu alloy described in the joint portion.
As will be described later, the heat transfer section can be formed, for example, by allowing the second metal used when forming the joint to remain without reacting with the first metal. Therefore, it is preferable that the 2nd metal which comprises a heat-transfer part contains the same metal element as the 2nd metal contained in the intermetallic compound which comprises a junction part.
後述するように、伝熱部は、例えば、接合部を形成する際に用いる第２金属を第１金属と反応させずに残存させることにより形成することができる。そのため、伝熱部を構成する第２金属は、接合部を構成する金属間化合物に含まれる第２金属と同じ金属元素を含むことが好ましい。 In the joined body of the present invention, the heat transfer part includes a second metal. Examples of the second metal include the Cu alloy described in the joint portion.
As will be described later, the heat transfer section can be formed, for example, by allowing the second metal used when forming the joint to remain without reacting with the first metal. Therefore, it is preferable that the 2nd metal which comprises a heat-transfer part contains the same metal element as the 2nd metal contained in the intermetallic compound which comprises a junction part.
伝熱部に第２金属が含まれていることは、接合体の断面を金属顕微鏡を用いて観察することによって簡易的に確認することができる。詳細には、伝熱部に対して、ＥＤＸ等による組成分析を行うことによって、伝熱部に含まれる金属がＣｕ－Ｎｉ合金等の第２金属であることを確認することができる。
The fact that the second metal is contained in the heat transfer part can be easily confirmed by observing the cross section of the joined body using a metal microscope. Specifically, by performing a composition analysis on the heat transfer portion by EDX or the like, it is possible to confirm that the metal contained in the heat transfer portion is a second metal such as a Cu—Ni alloy.
伝熱部は、第２金属であるＣｕ合金のみからなることが好ましいが、Ｃｕ合金の表面には、Ａｕ、Ａｇ、Ｎｉ、Ｐｄ、Ｃｕ又はこれらの金属を含む合金からなるめっき層が形成されていてもよい。上記めっき層を構成する金属は第２金属であるＣｕ合金とは反応せず、第１部材と伝熱部との間に金属間化合物が形成されないため、熱伝導性が低下するおそれがない。
The heat transfer part is preferably made of only the Cu alloy as the second metal, but a plated layer made of Au, Ag, Ni, Pd, Cu or an alloy containing these metals is formed on the surface of the Cu alloy. It may be. The metal constituting the plating layer does not react with the Cu alloy, which is the second metal, and no intermetallic compound is formed between the first member and the heat transfer portion, so that there is no possibility that the thermal conductivity is lowered.
伝熱部は、第１部材と接している限り、他の部分が接合部から露出していてもよいが、接合部の内部に存在することが好ましい。すなわち、図１に示すように、伝熱部の第１部材と接していない部分は、接合部と接していることが好ましい。また、図２に示すように、伝熱部が第２部材とも接している場合には、伝熱部の第１部材及び第２部材と接していない部分は、接合部と接していることが好ましい。
As long as the heat transfer part is in contact with the first member, the other part may be exposed from the joint part, but it is preferable to exist inside the joint part. That is, as shown in FIG. 1, it is preferable that the portion of the heat transfer portion that is not in contact with the first member is in contact with the joint portion. In addition, as shown in FIG. 2, when the heat transfer portion is also in contact with the second member, the portion of the heat transfer portion that is not in contact with the first member and the second member may be in contact with the joint portion. preferable.
伝熱部が第１部材と接する形態は特に限定されず、第１部材と線又は点で接していてもよいが、図１及び図２に示すように、第１部材と面で接することが好ましい。また、伝熱部が第２部材とも接する場合においても、伝熱部が第２部材と接する形態は特に限定されず、第２部材と線又は点で接していてもよいが、図２に示すように、第２部材と面で接することが好ましい。伝熱部が第１部材又は第２部材と面で接すると、第１部材又は第２部材との接触面積が大きくなるため、熱伝導性を高くすることができる。
The form in which the heat transfer section is in contact with the first member is not particularly limited, and may be in contact with the first member by a line or a point, but as shown in FIGS. 1 and 2, the first member may be in contact with the surface. preferable. Further, even when the heat transfer section is in contact with the second member, the form in which the heat transfer section is in contact with the second member is not particularly limited, and may be in contact with the second member with a line or a point, as shown in FIG. Thus, it is preferable to contact the second member on the surface. When the heat transfer portion is in contact with the first member or the second member on the surface, the contact area with the first member or the second member is increased, so that the thermal conductivity can be increased.
伝熱部の形状も特に限定されず、例えば、板状、柱状、メッシュ状、箔状、線状（ワイヤ状）、球状、粉状等が挙げられる。これらの中では、第１部材又は第２部材と面で接することができる板状、柱状、メッシュ状又は箔状が好ましい。
The shape of the heat transfer section is not particularly limited, and examples thereof include a plate shape, a column shape, a mesh shape, a foil shape, a linear shape (wire shape), a spherical shape, and a powder shape. Among these, a plate shape, a column shape, a mesh shape, or a foil shape capable of contacting the first member or the second member on the surface is preferable.
伝熱部は、貫通孔及び／又は切り欠き部を有していることが好ましく、貫通孔を有していることがより好ましい。１つの伝熱部に設けられる貫通孔の数は、１つでもよいし、複数でもよい。同様に、１つの伝熱部に設けられる切り欠き部の数は、１つでもよいし、複数でもよい。１つの伝熱部が、貫通孔及び切り欠き部の両方を有していてもよい。
伝熱部が貫通孔及び／又は切り欠き部を有していると、貫通孔内及び／又は切り欠き部に接合部が存在することになる。したがって、貫通孔内及び又は切り欠き部に存在する接合部によって第１部材を固定できるため、第１部材と接している面積が同じで形状が板状である伝熱部を設ける場合と比べて、第１部材と接合部との接合を強固にすることができる。 The heat transfer section preferably has a through hole and / or a notch, and more preferably has a through hole. The number of through holes provided in one heat transfer unit may be one or plural. Similarly, the number of notches provided in one heat transfer part may be one or plural. One heat transfer part may have both a through-hole and a notch.
If the heat transfer part has a through hole and / or a notch, a joint exists in the through hole and / or in the notch. Therefore, since the first member can be fixed by the joint portion existing in the through hole and / or in the cutout portion, compared to the case where the heat transfer portion having the same area in contact with the first member and having a plate shape is provided. In addition, the bonding between the first member and the bonding portion can be strengthened.
伝熱部が貫通孔及び／又は切り欠き部を有していると、貫通孔内及び／又は切り欠き部に接合部が存在することになる。したがって、貫通孔内及び又は切り欠き部に存在する接合部によって第１部材を固定できるため、第１部材と接している面積が同じで形状が板状である伝熱部を設ける場合と比べて、第１部材と接合部との接合を強固にすることができる。 The heat transfer section preferably has a through hole and / or a notch, and more preferably has a through hole. The number of through holes provided in one heat transfer unit may be one or plural. Similarly, the number of notches provided in one heat transfer part may be one or plural. One heat transfer part may have both a through-hole and a notch.
If the heat transfer part has a through hole and / or a notch, a joint exists in the through hole and / or in the notch. Therefore, since the first member can be fixed by the joint portion existing in the through hole and / or in the cutout portion, compared to the case where the heat transfer portion having the same area in contact with the first member and having a plate shape is provided. In addition, the bonding between the first member and the bonding portion can be strengthened.
第１部材と第２部材との間には、伝熱部が１つだけ存在していてもよいが、複数の伝熱部が存在することが好ましい。複数の伝熱部が存在すると、複数の伝熱部間に接合部が存在することになる。したがって、複数の伝熱部間に存在する接合部によって第１部材を固定できるため、第１部材と接している面積が同じで形状が板状である伝熱部を設ける場合と比べて、第１部材と接合部との接合を強固にすることができる。
Only one heat transfer section may exist between the first member and the second member, but it is preferable that a plurality of heat transfer sections exist. If there are a plurality of heat transfer portions, there will be joints between the plurality of heat transfer portions. Therefore, since the first member can be fixed by the joint portion existing between the plurality of heat transfer portions, compared with the case where the heat transfer portion having the same area in contact with the first member and having a plate shape is provided. The bonding between the one member and the bonding portion can be strengthened.
なお、複数の伝熱部が存在する場合、すべての伝熱部が第１部材と接していることが好ましいが、第１部材と接していない伝熱部が存在してもよい。また、複数の伝熱部が第２部材と接している場合、すべての伝熱部が第２部材とも接していることが好ましいが、第２部材と接している伝熱部と第２部材と接していない伝熱部が混在していてもよい。
When there are a plurality of heat transfer units, it is preferable that all the heat transfer units are in contact with the first member, but there may be a heat transfer unit that is not in contact with the first member. Further, when the plurality of heat transfer parts are in contact with the second member, it is preferable that all the heat transfer parts are also in contact with the second member, but the heat transfer part in contact with the second member and the second member Heat transfer portions that are not in contact with each other may be mixed.
また、複数の伝熱部が貫通孔及び／又は切り欠き部を有する場合、すべての伝熱部が貫通孔及び／又は切り欠き部を有している必要はなく、貫通孔も切り欠き部も有しない伝熱部が存在してもよく、貫通孔を有する伝熱部と切り欠き部を有する伝熱部とが混在していてもよい。
In addition, when the plurality of heat transfer portions have through holes and / or notches, it is not necessary that all the heat transfer portions have through holes and / or notches, and neither the through holes nor the notches are present. The heat transfer part which does not have may exist, and the heat transfer part which has a through-hole, and the heat transfer part which has a notch part may be mixed.
本発明の接合体においては、第１部材が電子部品の電極、第２部材が基板上の電極であることが好ましい。電子部品としては、例えば、半導体チップ（ＩＧＢＴ（Ｉｎｓｕｌａｔｅｄ Ｇａｔｅ Ｂｉｐｏｌａｒ Ｔｒａｎｓｉｓｔｏｒ）、ＭＯＳＦＥＴ（Ｍｅｔａｌ Ｏｘｉｄｅ Ｓｅｍｉｃｏｎｄｕｃｔｏｒ Ｆｉｅｌｄ Ｅｆｆｅｃｔ Ｔｒａｎｓｉｓｔｏｒ）、ショットキーバリアダイオード、ＬＥＤ等）、コンデンサ、インダクタ、サーミスタ、抵抗器、バリスタ、その他チップ状の積層フィルタ等が挙げられ、これらの中では半導体チップが好ましい。
本発明の接合体は、半導体チップをダイボンドするタイプの半導体装置等の電子機器の構成として特に適している。なお、第２部材は電極箔であってもよい。 In the joined body of the present invention, it is preferable that the first member is an electrode of an electronic component and the second member is an electrode on a substrate. Examples of electronic components include semiconductor chips (IGBT (Insulated Gate Bipolar Transistor), MOSFETs (Metal Oxide Semiconductor Field Effect Transistor), Schottky barrier diodes, LEDs, etc.), capacitors, inductors, thermistors, resistors, varistors, resistors, and the like. In these, a semiconductor chip is preferable.
The joined body of the present invention is particularly suitable as a configuration of an electronic apparatus such as a semiconductor device of a type in which a semiconductor chip is die-bonded. The second member may be an electrode foil.
本発明の接合体は、半導体チップをダイボンドするタイプの半導体装置等の電子機器の構成として特に適している。なお、第２部材は電極箔であってもよい。 In the joined body of the present invention, it is preferable that the first member is an electrode of an electronic component and the second member is an electrode on a substrate. Examples of electronic components include semiconductor chips (IGBT (Insulated Gate Bipolar Transistor), MOSFETs (Metal Oxide Semiconductor Field Effect Transistor), Schottky barrier diodes, LEDs, etc.), capacitors, inductors, thermistors, resistors, varistors, resistors, and the like. In these, a semiconductor chip is preferable.
The joined body of the present invention is particularly suitable as a configuration of an electronic apparatus such as a semiconductor device of a type in which a semiconductor chip is die-bonded. The second member may be an electrode foil.
図３は、電子部品が基板上に実装された電子機器の一例を模式的に示す図である。図３では、電子部品の電極、及び、基板上の電極は省略している。
図３に示す電子機器３０では、半導体チップ等の電子部品３１が、金属間化合物を含む接合部１０を介して基板３２にダイボンドされている。電子部品３１と基板３２との間には伝熱部２０が存在し、電子部品３１は、接合部１０及び伝熱部２０の両方と接している。さらに、電子部品３１は、樹脂３３によってモールドされている。なお、図３には示していないが、電子部品３１は、ワイヤボンディング等によって基板３２の端子と接続されていることが好ましい。 FIG. 3 is a diagram schematically illustrating an example of an electronic device in which an electronic component is mounted on a substrate. In FIG. 3, the electrodes of the electronic components and the electrodes on the substrate are omitted.
In theelectronic device 30 shown in FIG. 3, an electronic component 31 such as a semiconductor chip is die-bonded to the substrate 32 through the joint portion 10 containing an intermetallic compound. The heat transfer unit 20 exists between the electronic component 31 and the substrate 32, and the electronic component 31 is in contact with both the joint 10 and the heat transfer unit 20. Furthermore, the electronic component 31 is molded with a resin 33. Although not shown in FIG. 3, the electronic component 31 is preferably connected to the terminal of the substrate 32 by wire bonding or the like.
図３に示す電子機器３０では、半導体チップ等の電子部品３１が、金属間化合物を含む接合部１０を介して基板３２にダイボンドされている。電子部品３１と基板３２との間には伝熱部２０が存在し、電子部品３１は、接合部１０及び伝熱部２０の両方と接している。さらに、電子部品３１は、樹脂３３によってモールドされている。なお、図３には示していないが、電子部品３１は、ワイヤボンディング等によって基板３２の端子と接続されていることが好ましい。 FIG. 3 is a diagram schematically illustrating an example of an electronic device in which an electronic component is mounted on a substrate. In FIG. 3, the electrodes of the electronic components and the electrodes on the substrate are omitted.
In the
本発明の接合体において、第１部材が電子部品の電極、第２部材が基板上の電極である場合、第１部材である電子部品の電極の表面には、Ａｕ、Ａｇ、Ｎｉ、Ｐｄ、Ｃｕ又はこれらの金属を含む合金からなるめっき層が形成されていてもよい。電極側から１層目がＮｉ、２層目がＡｕであるＮｉ／Ａｕめっき層、電極側から１層目がＮｉ、２層目がＰｄ、３層目がＡｕであるＮｉ／Ｐｄ／Ａｕめっき層等の複数層からなるめっき層が形成されていてもよい。第１部材である電子部品の電極の表面に上記めっき層が形成されている場合、めっき層を構成する金属は第２金属であるＣｕ合金とは反応せず、第１部材と伝熱部との間に金属間化合物が形成されないため、熱伝導性が低下するおそれがない。
同様に、第２部材である基板上の電極の表面には、Ａｕ、Ａｇ、Ｎｉ、Ｐｄ、Ｃｕ又はこれらの金属を含む合金からなるめっき層が形成されていてもよい。Ｎｉ／Ａｕめっき層、Ｎｉ／Ｐｄ／Ａｕめっき層等の複数層からなるめっき層が形成されていてもよい。第２部材である基板上の電極の表面に上記めっき層が形成されている場合、めっき層を構成する金属を含有する金属間化合物が基板と接合部との界面に形成される可能性があるが、接合体の特性に影響するものではない。
また、第２部材である基板上の電極の表面には、Ｓｎ又はＳｎ合金からなるめっき層が形成されていてもよい。めっき層を構成するＳｎ又はＳｎ合金は、金属間化合物の形成に寄与するものの、通常、めっき層の厚みは接合部の厚みに比べて非常に小さいため、めっき層が接合体の特性に与える影響は小さい。一方、第１部材である電子部品の電極の表面には、Ｓｎ又はＳｎ合金からなるめっき層が形成されていないことが好ましい。
なお、第１部材が電子部品の電極、第２部材が基板上の電極である場合に限らず、第１部材及び第２部材の表面には、上述のめっき層がそれぞれ形成されていてもよい。 In the joined body of the present invention, when the first member is an electrode of an electronic component and the second member is an electrode on a substrate, Au, Ag, Ni, Pd, A plating layer made of Cu or an alloy containing these metals may be formed. Ni / Au plating layer in which the first layer from the electrode side is Ni, the second layer is Au, the first layer from the electrode side is Ni, the second layer is Pd, and the third layer is Au / Ni / Pd / Au plating A plating layer composed of a plurality of layers such as a layer may be formed. When the plating layer is formed on the surface of the electrode of the electronic component as the first member, the metal constituting the plating layer does not react with the Cu alloy as the second metal, and the first member, the heat transfer portion, Since no intermetallic compound is formed during this period, there is no possibility that the thermal conductivity is lowered.
Similarly, a plating layer made of Au, Ag, Ni, Pd, Cu, or an alloy containing these metals may be formed on the surface of the electrode on the substrate that is the second member. A plating layer composed of a plurality of layers such as a Ni / Au plating layer and a Ni / Pd / Au plating layer may be formed. When the plating layer is formed on the surface of the electrode on the substrate as the second member, an intermetallic compound containing a metal constituting the plating layer may be formed at the interface between the substrate and the joint. However, it does not affect the characteristics of the joined body.
Moreover, the plating layer which consists of Sn or Sn alloy may be formed in the surface of the electrode on the board | substrate which is a 2nd member. Although Sn or Sn alloy constituting the plating layer contributes to the formation of intermetallic compounds, since the thickness of the plating layer is usually much smaller than the thickness of the joint, the effect of the plating layer on the properties of the joined body Is small. On the other hand, it is preferable that a plating layer made of Sn or an Sn alloy is not formed on the surface of the electrode of the electronic component that is the first member.
In addition, the above-mentioned plating layer may be formed in the surface of the 1st member and the 2nd member not only when the 1st member is an electrode of an electronic component and the 2nd member is an electrode on a board | substrate, respectively. .
同様に、第２部材である基板上の電極の表面には、Ａｕ、Ａｇ、Ｎｉ、Ｐｄ、Ｃｕ又はこれらの金属を含む合金からなるめっき層が形成されていてもよい。Ｎｉ／Ａｕめっき層、Ｎｉ／Ｐｄ／Ａｕめっき層等の複数層からなるめっき層が形成されていてもよい。第２部材である基板上の電極の表面に上記めっき層が形成されている場合、めっき層を構成する金属を含有する金属間化合物が基板と接合部との界面に形成される可能性があるが、接合体の特性に影響するものではない。
また、第２部材である基板上の電極の表面には、Ｓｎ又はＳｎ合金からなるめっき層が形成されていてもよい。めっき層を構成するＳｎ又はＳｎ合金は、金属間化合物の形成に寄与するものの、通常、めっき層の厚みは接合部の厚みに比べて非常に小さいため、めっき層が接合体の特性に与える影響は小さい。一方、第１部材である電子部品の電極の表面には、Ｓｎ又はＳｎ合金からなるめっき層が形成されていないことが好ましい。
なお、第１部材が電子部品の電極、第２部材が基板上の電極である場合に限らず、第１部材及び第２部材の表面には、上述のめっき層がそれぞれ形成されていてもよい。 In the joined body of the present invention, when the first member is an electrode of an electronic component and the second member is an electrode on a substrate, Au, Ag, Ni, Pd, A plating layer made of Cu or an alloy containing these metals may be formed. Ni / Au plating layer in which the first layer from the electrode side is Ni, the second layer is Au, the first layer from the electrode side is Ni, the second layer is Pd, and the third layer is Au / Ni / Pd / Au plating A plating layer composed of a plurality of layers such as a layer may be formed. When the plating layer is formed on the surface of the electrode of the electronic component as the first member, the metal constituting the plating layer does not react with the Cu alloy as the second metal, and the first member, the heat transfer portion, Since no intermetallic compound is formed during this period, there is no possibility that the thermal conductivity is lowered.
Similarly, a plating layer made of Au, Ag, Ni, Pd, Cu, or an alloy containing these metals may be formed on the surface of the electrode on the substrate that is the second member. A plating layer composed of a plurality of layers such as a Ni / Au plating layer and a Ni / Pd / Au plating layer may be formed. When the plating layer is formed on the surface of the electrode on the substrate as the second member, an intermetallic compound containing a metal constituting the plating layer may be formed at the interface between the substrate and the joint. However, it does not affect the characteristics of the joined body.
Moreover, the plating layer which consists of Sn or Sn alloy may be formed in the surface of the electrode on the board | substrate which is a 2nd member. Although Sn or Sn alloy constituting the plating layer contributes to the formation of intermetallic compounds, since the thickness of the plating layer is usually much smaller than the thickness of the joint, the effect of the plating layer on the properties of the joined body Is small. On the other hand, it is preferable that a plating layer made of Sn or an Sn alloy is not formed on the surface of the electrode of the electronic component that is the first member.
In addition, the above-mentioned plating layer may be formed in the surface of the 1st member and the 2nd member not only when the 1st member is an electrode of an electronic component and the 2nd member is an electrode on a board | substrate, respectively. .
本発明の接合体において、第１部材及び／又は伝熱部にめっき層が形成されている場合、Ｓｎを含有する金属間化合物がＣｕ合金と第１部材との間に形成されていなければ、「第１部材は伝熱部と接する」と考えることができる。
In the joined body of the present invention, when the plating layer is formed on the first member and / or the heat transfer part, if the intermetallic compound containing Sn is not formed between the Cu alloy and the first member, It can be considered that “the first member is in contact with the heat transfer section”.
本発明の接合体において、第１部材及び第２部材は、電極等の板状体に限定されるものではなく、例えば、第１部材がＣｕ線等の金属線、第２部材が基板上の電極又は電子部品の電極等であってもよい。また、本発明の接合体は、電子機器以外の接合体であってもよい。
In the joined body of the present invention, the first member and the second member are not limited to plate-like bodies such as electrodes. For example, the first member is a metal wire such as a Cu wire, and the second member is on a substrate. It may be an electrode or an electrode of an electronic component. Further, the joined body of the present invention may be a joined body other than an electronic device.
本発明の接合体は、好ましくは、以下のように製造される。
図４Ａ～図４Ｄは、本発明の接合体の製造方法の一例を模式的に示す断面図である。図４Ａ～図４Ｄは、図１に示す接合体１を製造する方法の一例であり、第１部材１１及び第２部材１２として板状体を使用している。 The joined body of the present invention is preferably manufactured as follows.
4A to 4D are cross-sectional views schematically showing an example of the method for producing a joined body of the present invention. 4A to 4D show an example of a method for manufacturing the joined body 1 shown in FIG. 1, and plate-like bodies are used as thefirst member 11 and the second member 12.
図４Ａ～図４Ｄは、本発明の接合体の製造方法の一例を模式的に示す断面図である。図４Ａ～図４Ｄは、図１に示す接合体１を製造する方法の一例であり、第１部材１１及び第２部材１２として板状体を使用している。 The joined body of the present invention is preferably manufactured as follows.
4A to 4D are cross-sectional views schematically showing an example of the method for producing a joined body of the present invention. 4A to 4D show an example of a method for manufacturing the joined body 1 shown in FIG. 1, and plate-like bodies are used as the
まず、図４Ａに示すように、第１金属を含むペースト（以下、第１金属ペーストという）１Ａを第２部材１２の上面に塗布する。
第１金属ペーストは、第１金属とフラックスとを含み、例えば、市販のソルダペーストを用いることができる。塗布方法としては、例えば、スクリーン印刷、ディスペンサーによる塗布等の方法が挙げられる。 First, as shown in FIG. 4A, a paste containing a first metal (hereinafter referred to as a first metal paste) 1 </ b> A is applied to the upper surface of thesecond member 12.
The first metal paste includes a first metal and a flux, and for example, a commercially available solder paste can be used. Examples of the application method include screen printing and application using a dispenser.
第１金属ペーストは、第１金属とフラックスとを含み、例えば、市販のソルダペーストを用いることができる。塗布方法としては、例えば、スクリーン印刷、ディスペンサーによる塗布等の方法が挙げられる。 First, as shown in FIG. 4A, a paste containing a first metal (hereinafter referred to as a first metal paste) 1 </ b> A is applied to the upper surface of the
The first metal paste includes a first metal and a flux, and for example, a commercially available solder paste can be used. Examples of the application method include screen printing and application using a dispenser.
次に、図４Ｂに示すように、第２金属からなる部材（以下、第２金属部材という）２Ａを第１金属ペースト１Ａ上に載置する。図４Ｂでは、第２金属からなる板状体を第１金属ペースト１Ａ上に載置している。
後述するように、第１部材１１の底面を第１金属ペースト１Ａ及び第２金属部材２Ａの両方と接触させるため、第１部材と接触する部分の第２金属部材の面積は、第１部材の底面の面積よりも小さい。 Next, as shown in FIG. 4B, a member made of a second metal (hereinafter referred to as a second metal member) 2A is placed on thefirst metal paste 1A. In FIG. 4B, the plate-like body made of the second metal is placed on the first metal paste 1A.
As will be described later, in order to bring the bottom surface of thefirst member 11 into contact with both the first metal paste 1A and the second metal member 2A, the area of the second metal member in the portion in contact with the first member is It is smaller than the area of the bottom.
後述するように、第１部材１１の底面を第１金属ペースト１Ａ及び第２金属部材２Ａの両方と接触させるため、第１部材と接触する部分の第２金属部材の面積は、第１部材の底面の面積よりも小さい。 Next, as shown in FIG. 4B, a member made of a second metal (hereinafter referred to as a second metal member) 2A is placed on the
As will be described later, in order to bring the bottom surface of the
続いて、図４Ｃに示すように、第１金属ペースト１Ａ及び第２金属部材２Ａの両方と接するように、第１金属ペースト１Ａ及び第２金属部材２Ａ上に第１部材１１を載置する。
Subsequently, as shown in FIG. 4C, the first member 11 is placed on the first metal paste 1A and the second metal member 2A so as to be in contact with both the first metal paste 1A and the second metal member 2A.
その後、第２金属部材２Ａが第１部材１１と接した状態で加熱する。加熱は、第１部材及び第２部材を加圧した状態で行うことが好ましい。温度が第１金属（例えばＳｎ）の融点以上に達すると、第１金属が溶融する。さらに加熱が続くと、図４Ｄに示すように、第１金属と第２金属（例えばＣｕ－Ｎｉ合金）とが反応して金属間化合物（例えば（Ｃｕ，Ｎｉ）６Ｓｎ５）が生成し、接合部１０となる。また、未反応の第２金属が伝熱部２０となって残存し、第１部材１１の底面と接することになる。以上により、接合体１を製造することができる。
Thereafter, the second metal member 2 </ b> A is heated in contact with the first member 11. The heating is preferably performed in a state where the first member and the second member are pressurized. When the temperature reaches or exceeds the melting point of the first metal (for example, Sn), the first metal is melted. When the heating continues, as shown in FIG. 4D, the first metal and the second metal (for example, Cu—Ni alloy) react to form an intermetallic compound (for example, (Cu, Ni) 6 Sn 5 ), It becomes the junction 10. Further, the unreacted second metal remains as the heat transfer section 20 and comes into contact with the bottom surface of the first member 11. As described above, the joined body 1 can be manufactured.
図５Ａ～図５Ｄは、本発明の接合体の製造方法の別の一例を模式的に示す断面図である。図５Ａ～図５Ｄは、図２に示す接合体２を製造する方法の一例である。
図５Ａ～図５Ｄに示す方法では、図４Ａ～図４Ｄに示す方法で用いたものよりも厚い第２金属部材２Ａを第１金属ペースト１Ａ上に載置し（図５Ｂ参照）、第２金属部材２Ａが第１部材１１及び第２部材１２の両方と接した状態で加熱する（図５Ｃ及び図５Ｄ参照）。加熱は、第１部材及び第２部材を加圧した状態で行うことが好ましい。未反応の第２金属が伝熱部２０となって残存し、第１部材の底面及び第２部材の上面の両方と接することになる。以上により、接合体２を製造することができる。 5A to 5D are cross-sectional views schematically showing another example of the method for manufacturing a joined body of the present invention. 5A to 5D show an example of a method for manufacturing the joinedbody 2 shown in FIG.
In the method shown in FIGS. 5A to 5D, asecond metal member 2A thicker than that used in the method shown in FIGS. 4A to 4D is placed on the first metal paste 1A (see FIG. 5B), and the second metal is used. The member 2A is heated in contact with both the first member 11 and the second member 12 (see FIGS. 5C and 5D). The heating is preferably performed in a state where the first member and the second member are pressurized. The unreacted second metal remains as the heat transfer section 20 and comes into contact with both the bottom surface of the first member and the top surface of the second member. As described above, the joined body 2 can be manufactured.
図５Ａ～図５Ｄに示す方法では、図４Ａ～図４Ｄに示す方法で用いたものよりも厚い第２金属部材２Ａを第１金属ペースト１Ａ上に載置し（図５Ｂ参照）、第２金属部材２Ａが第１部材１１及び第２部材１２の両方と接した状態で加熱する（図５Ｃ及び図５Ｄ参照）。加熱は、第１部材及び第２部材を加圧した状態で行うことが好ましい。未反応の第２金属が伝熱部２０となって残存し、第１部材の底面及び第２部材の上面の両方と接することになる。以上により、接合体２を製造することができる。 5A to 5D are cross-sectional views schematically showing another example of the method for manufacturing a joined body of the present invention. 5A to 5D show an example of a method for manufacturing the joined
In the method shown in FIGS. 5A to 5D, a
図６（ａ）～図６（ｆ）は、第２金属部材の平面視形状の例を模式的に示す平面図である。図６（ａ）～図６（ｆ）では、第２部材１２の上面に塗布した第１金属ペースト１Ａ上に第２金属部材２Ａ～２Ｆを載置した状態の平面図を示している。
第２金属部材の平面視形状は特に限定されず、図６（ａ）に示す第２金属部材２Ａのような四角形をはじめとする多角形であってもよいし、図６（ｂ）に示す第２金属部材２Ｂのような円形であってもよい。また、図６（ｃ）に示す第２金属部材２Ｃ、図６（ｄ）に示す第２金属部材２Ｄ及び図６（ｅ）に示す第２金属部材２Ｅのように、１又は複数の貫通孔を有する形状であってもよい。貫通孔に代えて、あるいは、貫通孔に加えて、１又は複数の切り欠き部を有する形状であってもよい。さらに、図６（ｆ）に示す第２金属部材２Ｆのように、複数の部材からなってもよい。これらの中では、第２金属部材の平面視形状は、１又は複数の貫通孔及び／又は切り欠き部を有する形状であることが好ましく、１又は複数の貫通孔を有する形状であることがより好ましい。また、複数の部材からなることも好ましい。いずれの形状であっても、第１部材と接合部との接合を強固にすることができるだけでなく、第１金属と第２金属との反応箇所が多くなるため、第１金属の残留率を低くすることができる。 FIGS. 6A to 6F are plan views schematically showing examples of the shape of the second metal member in plan view. FIGS. 6A to 6F are plan views showing a state in which thesecond metal members 2A to 2F are placed on the first metal paste 1A applied to the upper surface of the second member 12. FIG.
The shape of the second metal member in plan view is not particularly limited, and may be a polygon such as a quadrangle such as thesecond metal member 2A shown in FIG. 6 (a), or shown in FIG. 6 (b). It may be circular like the second metal member 2B. In addition, one or a plurality of through-holes such as the second metal member 2C shown in FIG. 6C, the second metal member 2D shown in FIG. 6D, and the second metal member 2E shown in FIG. The shape which has this may be sufficient. Instead of the through-hole or in addition to the through-hole, a shape having one or a plurality of notches may be used. Furthermore, like the 2nd metal member 2F shown in FIG.6 (f), you may consist of a some member. Among these, the planar view shape of the second metal member is preferably a shape having one or a plurality of through holes and / or notches, and more preferably a shape having one or a plurality of through holes. preferable. Moreover, it is also preferable that it consists of a some member. In any shape, not only can the bonding between the first member and the bonding portion be strengthened, but also the number of reaction sites between the first metal and the second metal increases, so the residual ratio of the first metal is reduced. Can be lowered.
第２金属部材の平面視形状は特に限定されず、図６（ａ）に示す第２金属部材２Ａのような四角形をはじめとする多角形であってもよいし、図６（ｂ）に示す第２金属部材２Ｂのような円形であってもよい。また、図６（ｃ）に示す第２金属部材２Ｃ、図６（ｄ）に示す第２金属部材２Ｄ及び図６（ｅ）に示す第２金属部材２Ｅのように、１又は複数の貫通孔を有する形状であってもよい。貫通孔に代えて、あるいは、貫通孔に加えて、１又は複数の切り欠き部を有する形状であってもよい。さらに、図６（ｆ）に示す第２金属部材２Ｆのように、複数の部材からなってもよい。これらの中では、第２金属部材の平面視形状は、１又は複数の貫通孔及び／又は切り欠き部を有する形状であることが好ましく、１又は複数の貫通孔を有する形状であることがより好ましい。また、複数の部材からなることも好ましい。いずれの形状であっても、第１部材と接合部との接合を強固にすることができるだけでなく、第１金属と第２金属との反応箇所が多くなるため、第１金属の残留率を低くすることができる。 FIGS. 6A to 6F are plan views schematically showing examples of the shape of the second metal member in plan view. FIGS. 6A to 6F are plan views showing a state in which the
The shape of the second metal member in plan view is not particularly limited, and may be a polygon such as a quadrangle such as the
第２金属部材の形状は板状に限定されず、例えば、柱状、メッシュ状、箔状、線状（ワイヤ状）、球状、粉状等であってもよい。これらの中では、板状、柱状、メッシュ状、又は箔状が好ましい。上記形状の第２金属部材を用いると、粉状の第２金属部材を用いる場合よりも未反応の部分を伝熱部として多く残すことができるため、熱伝導性を向上することができる。
The shape of the second metal member is not limited to a plate shape, and may be, for example, a columnar shape, a mesh shape, a foil shape, a linear shape (wire shape), a spherical shape, a powdery shape, or the like. In these, plate shape, column shape, mesh shape, or foil shape is preferable. When the second metal member having the above-described shape is used, more unreacted portions can be left as the heat transfer portion than when the powdery second metal member is used, so that the thermal conductivity can be improved.
第１部材の形状が板状である場合、第１部材と接触する部分の面積が、第１部材の底面の面積よりも小さい第２金属部材を使用する。この場合、加熱後に形成される接合部と第１部材とが接合されるだけでなく、加熱前も第１金属ペーストの粘着力によって第１部材がずれることなく保持される。
When the shape of the first member is plate-like, a second metal member is used in which the area of the portion that contacts the first member is smaller than the area of the bottom surface of the first member. In this case, not only the joining portion formed after heating and the first member are joined, but also the first member is held without being displaced by the adhesive force of the first metal paste before heating.
一方、第１部材と接触する部分の第２金属部材の面積が小さすぎると、未反応の第２金属が伝熱部として残存しにくくなり、熱伝導性向上の効果が充分に得られなくなる。そのため、第１部材と接触する部分の第２金属部材の面積は、第１部材の底面の面積の３２％以上であることが好ましく、５０％以上であることがより好ましい。また、第１部材と接触する部分の第２金属部材の面積は、第１部材の底面の面積の９０％以下であることが好ましく、８０％以下であることがより好ましい。
On the other hand, if the area of the second metal member in contact with the first member is too small, the unreacted second metal is unlikely to remain as a heat transfer portion, and the effect of improving thermal conductivity cannot be sufficiently obtained. Therefore, the area of the second metal member at the portion in contact with the first member is preferably 32% or more and more preferably 50% or more of the area of the bottom surface of the first member. In addition, the area of the second metal member at the portion in contact with the first member is preferably 90% or less, more preferably 80% or less of the area of the bottom surface of the first member.
以上のように、第１金属ペースト及び第２金属部材を用いる場合、第１金属粉末及び第２金属粉末を含むペーストを用いる場合に比べて、緻密な接合部を得ることができる。ペーストを用いる場合、第１金属粉末と第２金属粉末とが反応すると、第１金属の流動によって金属間化合物が形成されるため、加熱前に第１金属の粒子が存在していた箇所に空隙（ボイド）が形成されてしまう。これに対し、板状等の第２金属部材を用いると、ペースト中の第１金属の粒子は第２金属部材に被覆されて一体化するため、空隙がほとんど形成されず、緻密な接合部となる。
As described above, when the first metal paste and the second metal member are used, a dense joint can be obtained as compared with the case where the paste containing the first metal powder and the second metal powder is used. When the paste is used, when the first metal powder and the second metal powder react, an intermetallic compound is formed by the flow of the first metal, so that voids are present in the locations where the first metal particles existed before heating. (Void) is formed. On the other hand, when a second metal member such as a plate is used, the first metal particles in the paste are covered and integrated with the second metal member, so that almost no voids are formed, Become.
さらに、第１金属ペーストを塗布した後に第２金属部材を載置する方法では、第１金属ペーストがフラックス成分を含有しているため、従来のはんだ箔やはんだクラッドを用いる方法のようにフラックスのみを塗布する工程を別途行う必要がない。したがって、接合体の製造工程を簡略化することができる。
Further, in the method of placing the second metal member after applying the first metal paste, since the first metal paste contains a flux component, only the flux is used as in the conventional method using solder foil or solder clad. There is no need to separately perform the step of coating. Therefore, the manufacturing process of the joined body can be simplified.
以下、本発明の接合体をより具体的に開示した実施例を示す。なお、本発明は、これらの実施例のみに限定されるものではない。
Examples in which the joined body of the present invention is disclosed more specifically are shown below. In addition, this invention is not limited only to these Examples.
［接合体の作製］
（実施例１）
（１）ソルダペーストの印刷
第２部材としてのＣｕ板（厚み２００μｍ）上に、市販のソルダペースト（ＳＡＣ３０５：Ｓｎ－３Ａｇ－０．５Ｃｕ）をスクリーン印刷により塗布した。印刷サイズは５ｍｍ角とし、メタル版厚み０．１ｍｍで印刷した。 [Preparation of joined body]
Example 1
(1) Printing solder paste A commercially available solder paste (SAC305: Sn-3Ag-0.5Cu) was applied by screen printing on a Cu plate (thickness 200 μm) as the second member. The printing size was 5 mm square, and printing was performed with a metal plate thickness of 0.1 mm.
（実施例１）
（１）ソルダペーストの印刷
第２部材としてのＣｕ板（厚み２００μｍ）上に、市販のソルダペースト（ＳＡＣ３０５：Ｓｎ－３Ａｇ－０．５Ｃｕ）をスクリーン印刷により塗布した。印刷サイズは５ｍｍ角とし、メタル版厚み０．１ｍｍで印刷した。 [Preparation of joined body]
Example 1
(1) Printing solder paste A commercially available solder paste (SAC305: Sn-3Ag-0.5Cu) was applied by screen printing on a Cu plate (thickness 200 μm) as the second member. The printing size was 5 mm square, and printing was performed with a metal plate thickness of 0.1 mm.
（２）Ｃｕ合金板の実装
Ｃｕ合金板として、長さ４．５ｍｍ×幅４．５ｍｍ×厚み０．１ｍｍのＣｕ－１０Ｎｉ板をソルダペーストの中央部に実装した。 (2) Mounting of Cu alloy plate As a Cu alloy plate, a Cu-10Ni plate having a length of 4.5 mm, a width of 4.5 mm, and a thickness of 0.1 mm was mounted at the center of the solder paste.
Ｃｕ合金板として、長さ４．５ｍｍ×幅４．５ｍｍ×厚み０．１ｍｍのＣｕ－１０Ｎｉ板をソルダペーストの中央部に実装した。 (2) Mounting of Cu alloy plate As a Cu alloy plate, a Cu-10Ni plate having a length of 4.5 mm, a width of 4.5 mm, and a thickness of 0.1 mm was mounted at the center of the solder paste.
（３）チップの実装
第１部材として、厚み３００μｍ、５ｍｍ角のＳｉチップをソルダペーストの中央部に実装した。なお、Ｓｉチップの接合部分にはＡｕめっき処理を施した。 (3) Chip mounting As a first member, a 300 μm thick, 5 mm square Si chip was mounted in the center of the solder paste. In addition, the Au plating process was performed to the junction part of Si chip | tip.
第１部材として、厚み３００μｍ、５ｍｍ角のＳｉチップをソルダペーストの中央部に実装した。なお、Ｓｉチップの接合部分にはＡｕめっき処理を施した。 (3) Chip mounting As a first member, a 300 μm thick, 5 mm square Si chip was mounted in the center of the solder paste. In addition, the Au plating process was performed to the junction part of Si chip | tip.
（４）加熱
窒素雰囲気にて、２６０℃で５分間、１０ＭＰａで加圧して加熱した。以上により、実施例１の接合体を得た。 (4) In a heated nitrogen atmosphere, heating was performed by pressurizing at 10 MPa at 260 ° C. for 5 minutes. Thus, a joined body of Example 1 was obtained.
窒素雰囲気にて、２６０℃で５分間、１０ＭＰａで加圧して加熱した。以上により、実施例１の接合体を得た。 (4) In a heated nitrogen atmosphere, heating was performed by pressurizing at 10 MPa at 260 ° C. for 5 minutes. Thus, a joined body of Example 1 was obtained.
（実施例２～実施例５、比較例１及び比較例２）
Ｃｕ－１０Ｎｉ板の厚みを０．１ｍｍに固定し、長さ及び幅を表１に示す値に変更した以外は、実施例１と同様に接合体を作製し、実施例２～実施例５、比較例１及び比較例２の接合体を得た。なお、実施例５、比較例１及び比較例２では、板中央部に１ｍｍ×１ｍｍサイズの貫通孔を有するＣｕ－１０Ｎｉ板を用いた。 (Examples 2 to 5, Comparative Example 1 and Comparative Example 2)
Except that the thickness of the Cu-10Ni plate was fixed to 0.1 mm and the length and width were changed to the values shown in Table 1, joined bodies were prepared in the same manner as in Example 1, and Examples 2 to 5 The joined bodies of Comparative Example 1 and Comparative Example 2 were obtained. In Example 5, Comparative Example 1 and Comparative Example 2, a Cu-10Ni plate having a 1 mm × 1 mm through hole at the center of the plate was used.
Ｃｕ－１０Ｎｉ板の厚みを０．１ｍｍに固定し、長さ及び幅を表１に示す値に変更した以外は、実施例１と同様に接合体を作製し、実施例２～実施例５、比較例１及び比較例２の接合体を得た。なお、実施例５、比較例１及び比較例２では、板中央部に１ｍｍ×１ｍｍサイズの貫通孔を有するＣｕ－１０Ｎｉ板を用いた。 (Examples 2 to 5, Comparative Example 1 and Comparative Example 2)
Except that the thickness of the Cu-10Ni plate was fixed to 0.1 mm and the length and width were changed to the values shown in Table 1, joined bodies were prepared in the same manner as in Example 1, and Examples 2 to 5 The joined bodies of Comparative Example 1 and Comparative Example 2 were obtained. In Example 5, Comparative Example 1 and Comparative Example 2, a Cu-10Ni plate having a 1 mm × 1 mm through hole at the center of the plate was used.
表１に、実施例１～実施例５、比較例１及び比較例２の接合体を作製する際に印刷したソルダペーストのサイズ、Ｃｕ合金板の成分及びサイズ、Ｃｕ合金の接触面積比率、並びに、Ｓｎ／（Ｓｎ＋Ｃｕ合金）の重量比率をまとめて示す。
Table 1 shows the size of the solder paste printed when producing the joined bodies of Examples 1 to 5, Comparative Example 1 and Comparative Example 2, the composition and size of the Cu alloy plate, the contact area ratio of the Cu alloy, and , Sn / (Sn + Cu alloy) is shown collectively.
［接合体の評価］
（接合体の断面観察）
得られた接合体の断面を金属顕微鏡を用いて観察し、接合部及び伝熱部の成分を特定した。表１に、接合部及び伝熱部の成分を示す。表１中、ＩＭＣは金属間化合物を意味する。 [Evaluation of joined body]
(Cross-section observation of joined body)
The cross section of the obtained joined body was observed using a metal microscope, and the components of the joined portion and the heat transfer portion were specified. Table 1 shows the components of the joint and the heat transfer section. In Table 1, IMC means an intermetallic compound.
（接合体の断面観察）
得られた接合体の断面を金属顕微鏡を用いて観察し、接合部及び伝熱部の成分を特定した。表１に、接合部及び伝熱部の成分を示す。表１中、ＩＭＣは金属間化合物を意味する。 [Evaluation of joined body]
(Cross-section observation of joined body)
The cross section of the obtained joined body was observed using a metal microscope, and the components of the joined portion and the heat transfer portion were specified. Table 1 shows the components of the joint and the heat transfer section. In Table 1, IMC means an intermetallic compound.
図７は、実施例１の接合体の金属顕微鏡写真であり、図８は、比較例１の接合体の金属顕微鏡写真である。
図７に示す実施例１の接合体では、第１部材であるＳｉチップと第２部材であるＣｕ板との間に、金属間化合物（ＩＭＣ）を含む接合部と、Ｃｕ－Ｎｉ合金を含む伝熱部とが確認できる。一方、図８に示す比較例１の接合体では、第１部材であるＳｉチップと第２部材であるＣｕ板との間に、金属間化合物（ＩＭＣ）を含む接合部のみが確認できる。 FIG. 7 is a metal micrograph of the joined body of Example 1, and FIG. 8 is a metal micrograph of the joined body of Comparative Example 1.
In the joined body of Example 1 shown in FIG. 7, a joint including an intermetallic compound (IMC) and a Cu—Ni alloy are included between the Si chip as the first member and the Cu plate as the second member. The heat transfer part can be confirmed. On the other hand, in the joined body of Comparative Example 1 shown in FIG. 8, only the joint portion containing the intermetallic compound (IMC) can be confirmed between the Si chip as the first member and the Cu plate as the second member.
図７に示す実施例１の接合体では、第１部材であるＳｉチップと第２部材であるＣｕ板との間に、金属間化合物（ＩＭＣ）を含む接合部と、Ｃｕ－Ｎｉ合金を含む伝熱部とが確認できる。一方、図８に示す比較例１の接合体では、第１部材であるＳｉチップと第２部材であるＣｕ板との間に、金属間化合物（ＩＭＣ）を含む接合部のみが確認できる。 FIG. 7 is a metal micrograph of the joined body of Example 1, and FIG. 8 is a metal micrograph of the joined body of Comparative Example 1.
In the joined body of Example 1 shown in FIG. 7, a joint including an intermetallic compound (IMC) and a Cu—Ni alloy are included between the Si chip as the first member and the Cu plate as the second member. The heat transfer part can be confirmed. On the other hand, in the joined body of Comparative Example 1 shown in FIG. 8, only the joint portion containing the intermetallic compound (IMC) can be confirmed between the Si chip as the first member and the Cu plate as the second member.
（接合強度）
得られた接合体のシアー強度を、ボンディングテスタを用いて測定し、接合強度を評価した。シアー強度の測定は、横押し速度：０．１ｍｍ・ｓ－１、室温の条件下で行った。
シアー強度が５Ｎ以上のものを○（良）、５Ｎ未満のものを×（不可）と評価した。表１に、接合強度の値と評価結果を示す。 (Joint strength)
The shear strength of the obtained joined body was measured using a bonding tester, and the joining strength was evaluated. The shear strength was measured under the conditions of a lateral pressing speed: 0.1 mm · s −1 and room temperature.
A shear strength of 5N or higher was evaluated as ◯ (good), and a shear strength of less than 5N was evaluated as × (impossible). Table 1 shows the values of the bonding strength and the evaluation results.
得られた接合体のシアー強度を、ボンディングテスタを用いて測定し、接合強度を評価した。シアー強度の測定は、横押し速度：０．１ｍｍ・ｓ－１、室温の条件下で行った。
シアー強度が５Ｎ以上のものを○（良）、５Ｎ未満のものを×（不可）と評価した。表１に、接合強度の値と評価結果を示す。 (Joint strength)
The shear strength of the obtained joined body was measured using a bonding tester, and the joining strength was evaluated. The shear strength was measured under the conditions of a lateral pressing speed: 0.1 mm · s −1 and room temperature.
A shear strength of 5N or higher was evaluated as ◯ (good), and a shear strength of less than 5N was evaluated as × (impossible). Table 1 shows the values of the bonding strength and the evaluation results.
（熱伝導性）
得られた接合体を室温の実験台に置き、さらに、Ｓｉチップの上に、予め１８０℃に加温したＳＵＳ板（１０ｍｍ角×１ｍｍ厚）を載せて、３分間放置した。その後、加温したＳＵＳ板を取り除き、３０秒間放冷した。放冷後、Ｓｉチップ上部の表面温度を表面温度計で計測した。表面温度が低いほど放熱性に優れるため、熱伝導性に優れると言える。
Ｓｉチップ上部の表面温度が１３０℃以下のものを○（良）、１３０℃を超えるものを×（不可）と評価した。表１に、表面温度の値と評価結果を示す。 (Thermal conductivity)
The obtained bonded body was placed on a laboratory bench at room temperature, and a SUS plate (10 mm square × 1 mm thickness) preheated to 180 ° C. was placed on the Si chip and left for 3 minutes. Thereafter, the heated SUS plate was removed and allowed to cool for 30 seconds. After cooling, the surface temperature of the upper part of the Si chip was measured with a surface thermometer. Since the lower the surface temperature, the better the heat dissipation, it can be said that the heat conductivity is excellent.
When the surface temperature of the upper part of the Si chip was 130 ° C. or lower, it was evaluated as ○ (good), and when the surface temperature exceeded 130 ° C., it was evaluated as × (impossible). Table 1 shows the surface temperature values and the evaluation results.
得られた接合体を室温の実験台に置き、さらに、Ｓｉチップの上に、予め１８０℃に加温したＳＵＳ板（１０ｍｍ角×１ｍｍ厚）を載せて、３分間放置した。その後、加温したＳＵＳ板を取り除き、３０秒間放冷した。放冷後、Ｓｉチップ上部の表面温度を表面温度計で計測した。表面温度が低いほど放熱性に優れるため、熱伝導性に優れると言える。
Ｓｉチップ上部の表面温度が１３０℃以下のものを○（良）、１３０℃を超えるものを×（不可）と評価した。表１に、表面温度の値と評価結果を示す。 (Thermal conductivity)
The obtained bonded body was placed on a laboratory bench at room temperature, and a SUS plate (10 mm square × 1 mm thickness) preheated to 180 ° C. was placed on the Si chip and left for 3 minutes. Thereafter, the heated SUS plate was removed and allowed to cool for 30 seconds. After cooling, the surface temperature of the upper part of the Si chip was measured with a surface thermometer. Since the lower the surface temperature, the better the heat dissipation, it can be said that the heat conductivity is excellent.
When the surface temperature of the upper part of the Si chip was 130 ° C. or lower, it was evaluated as ○ (good), and when the surface temperature exceeded 130 ° C., it was evaluated as × (impossible). Table 1 shows the surface temperature values and the evaluation results.
（総合判定）
接合強度及び熱伝導性の評価結果がすべて○のものを○（良）、１つでも×があるものを×（不可）とした。表１に、総合判定の結果を示す。 (Comprehensive judgment)
The evaluation results of the bonding strength and thermal conductivity were all “good” (good), and those having at least one “x” were evaluated as x (impossible). Table 1 shows the result of the comprehensive determination.
接合強度及び熱伝導性の評価結果がすべて○のものを○（良）、１つでも×があるものを×（不可）とした。表１に、総合判定の結果を示す。 (Comprehensive judgment)
The evaluation results of the bonding strength and thermal conductivity were all “good” (good), and those having at least one “x” were evaluated as x (impossible). Table 1 shows the result of the comprehensive determination.
表１より、実施例１～実施例５、比較例１及び比較例２の接合体は、いずれも充分な接合強度を有していることが確認された。
From Table 1, it was confirmed that the joined bodies of Examples 1 to 5, Comparative Example 1 and Comparative Example 2 all had sufficient joint strength.
さらに、金属間化合物（ＩＭＣ）を含む接合部とＣｕ合金（Ｃｕ－１０Ｎｉ）を含む伝熱部との両方に第１部材が接している実施例１～実施例５の接合体は、熱伝導性に優れていることが確認された。
これに対し、Ｃｕ合金板のサイズが小さい比較例１及び比較例２の接合体では、Ｃｕ合金を含む伝熱部が形成されず、熱伝導性が充分でないことが確認された。なお、比較例２の接合体では、Ｓｎが残留しているため、耐熱性も充分でないと考えられる。 Further, the joined bodies of Examples 1 to 5 in which the first member is in contact with both the joined part containing the intermetallic compound (IMC) and the heat transfer part containing the Cu alloy (Cu-10Ni) are thermally conductive. It was confirmed that it was excellent in performance.
On the other hand, in the joined bodies of Comparative Example 1 and Comparative Example 2 in which the size of the Cu alloy plate was small, it was confirmed that the heat transfer portion containing the Cu alloy was not formed and the thermal conductivity was not sufficient. In the joined body of Comparative Example 2, since Sn remains, it is considered that the heat resistance is not sufficient.
これに対し、Ｃｕ合金板のサイズが小さい比較例１及び比較例２の接合体では、Ｃｕ合金を含む伝熱部が形成されず、熱伝導性が充分でないことが確認された。なお、比較例２の接合体では、Ｓｎが残留しているため、耐熱性も充分でないと考えられる。 Further, the joined bodies of Examples 1 to 5 in which the first member is in contact with both the joined part containing the intermetallic compound (IMC) and the heat transfer part containing the Cu alloy (Cu-10Ni) are thermally conductive. It was confirmed that it was excellent in performance.
On the other hand, in the joined bodies of Comparative Example 1 and Comparative Example 2 in which the size of the Cu alloy plate was small, it was confirmed that the heat transfer portion containing the Cu alloy was not formed and the thermal conductivity was not sufficient. In the joined body of Comparative Example 2, since Sn remains, it is considered that the heat resistance is not sufficient.
（実施例６～実施例８及び比較例３）
Ｃｕ－１０Ｎｉ板の長さを４．０ｍｍ、幅を３．５ｍｍに固定し、厚みを表２に示す値に変更した以外は、実施例１と同様に接合体を作製し、実施例６～実施例８及び比較例３の接合体を得た。
得られた接合体について、上記と同じ方法で評価した。表２に、各評価結果を示す。 (Examples 6 to 8 and Comparative Example 3)
A joined body was produced in the same manner as in Example 1 except that the length of the Cu-10Ni plate was fixed to 4.0 mm, the width was fixed to 3.5 mm, and the thickness was changed to the values shown in Table 2. The joined body of Example 8 and Comparative Example 3 was obtained.
The obtained joined body was evaluated by the same method as described above. Table 2 shows the evaluation results.
Ｃｕ－１０Ｎｉ板の長さを４．０ｍｍ、幅を３．５ｍｍに固定し、厚みを表２に示す値に変更した以外は、実施例１と同様に接合体を作製し、実施例６～実施例８及び比較例３の接合体を得た。
得られた接合体について、上記と同じ方法で評価した。表２に、各評価結果を示す。 (Examples 6 to 8 and Comparative Example 3)
A joined body was produced in the same manner as in Example 1 except that the length of the Cu-10Ni plate was fixed to 4.0 mm, the width was fixed to 3.5 mm, and the thickness was changed to the values shown in Table 2. The joined body of Example 8 and Comparative Example 3 was obtained.
The obtained joined body was evaluated by the same method as described above. Table 2 shows the evaluation results.
表２より、Ｃｕ合金板の厚みを変更した場合であっても、金属間化合物を含む接合部とＣｕ合金を含む伝熱部との両方に第１部材が接している実施例６～実施例８の接合体は、実施例１～実施例５の接合体と同様、熱伝導性に優れていることが確認された。
一方、Ｃｕ合金板の厚みが小さい比較例３の接合体では、Ｃｕ合金を含む伝熱部が形成されず、比較例２の接合体と同様、熱伝導性が充分でないことが確認された。また、Ｓｎが残留しているため、耐熱性も充分でないと考えられる。 From Table 2, even when the thickness of the Cu alloy plate is changed, the first member is in contact with both the joint portion containing the intermetallic compound and the heat transfer portion containing the Cu alloy. As in the joined bodies of Examples 1 to 5, it was confirmed that the joined body of 8 was excellent in thermal conductivity.
On the other hand, in the joined body of Comparative Example 3 in which the thickness of the Cu alloy plate was small, a heat transfer portion containing a Cu alloy was not formed, and it was confirmed that the thermal conductivity was not sufficient as in the joined body of Comparative Example 2. Further, since Sn remains, it is considered that the heat resistance is not sufficient.
一方、Ｃｕ合金板の厚みが小さい比較例３の接合体では、Ｃｕ合金を含む伝熱部が形成されず、比較例２の接合体と同様、熱伝導性が充分でないことが確認された。また、Ｓｎが残留しているため、耐熱性も充分でないと考えられる。 From Table 2, even when the thickness of the Cu alloy plate is changed, the first member is in contact with both the joint portion containing the intermetallic compound and the heat transfer portion containing the Cu alloy. As in the joined bodies of Examples 1 to 5, it was confirmed that the joined body of 8 was excellent in thermal conductivity.
On the other hand, in the joined body of Comparative Example 3 in which the thickness of the Cu alloy plate was small, a heat transfer portion containing a Cu alloy was not formed, and it was confirmed that the thermal conductivity was not sufficient as in the joined body of Comparative Example 2. Further, since Sn remains, it is considered that the heat resistance is not sufficient.
１，２ 接合体
１Ａ 第１金属ペースト
２Ａ，２Ｂ，２Ｃ，２Ｄ，２Ｅ，２Ｆ 第２金属部材
１０ 接合部（金属間化合物を含む接合部）
２０ 伝熱部（第２金属を含む伝熱部）
１１ 第１部材（電極）
１２ 第２部材（電極）
３０ 電子機器
３１ 電子部品（半導体チップ）
３２ 基板
３３ 樹脂 DESCRIPTION OFSYMBOLS 1, 2 Joint 1A 1st metal paste 2A, 2B, 2C, 2D, 2E, 2F 2nd metal member 10 Joint part (joint part containing an intermetallic compound)
20 Heat transfer section (heat transfer section including second metal)
11 First member (electrode)
12 Second member (electrode)
30Electronic equipment 31 Electronic components (semiconductor chips)
32Substrate 33 Resin
１Ａ 第１金属ペースト
２Ａ，２Ｂ，２Ｃ，２Ｄ，２Ｅ，２Ｆ 第２金属部材
１０ 接合部（金属間化合物を含む接合部）
２０ 伝熱部（第２金属を含む伝熱部）
１１ 第１部材（電極）
１２ 第２部材（電極）
３０ 電子機器
３１ 電子部品（半導体チップ）
３２ 基板
３３ 樹脂 DESCRIPTION OF
20 Heat transfer section (heat transfer section including second metal)
11 First member (electrode)
12 Second member (electrode)
30
32
Claims (7)
- 第１部材と第２部材とが接合部を介して接合された接合体であって、
前記接合部は、第１金属と、前記第１金属よりも融点の高い第２金属との金属間化合物を含み、
前記第１金属は、Ｓｎ又はＳｎ合金であり、
前記第２金属は、Ｃｕ合金であり、
前記第１部材と前記第２部材との間には、前記第２金属を含む伝熱部が存在し、
前記第１部材は、前記接合部及び前記伝熱部と接していることを特徴とする接合体。 It is a joined body in which the first member and the second member are joined via the joining portion,
The joint includes an intermetallic compound of a first metal and a second metal having a melting point higher than that of the first metal,
The first metal is Sn or Sn alloy,
The second metal is a Cu alloy,
Between the first member and the second member, there is a heat transfer part including the second metal,
The first member is in contact with the joint and the heat transfer section. - 前記第１部材と接している前記伝熱部は、前記第２部材とも接している請求項１に記載の接合体。 The joined body according to claim 1, wherein the heat transfer section in contact with the first member is also in contact with the second member.
- 前記第１部材は、貫通孔を有する伝熱部と接しており、前記貫通孔内に存在する接合部とも接している請求項１又は２に記載の接合体。 The joined body according to claim 1, wherein the first member is in contact with a heat transfer portion having a through hole, and is also in contact with a joint portion existing in the through hole.
- 前記第１部材は、複数の伝熱部と接しており、複数の伝熱部間に存在する接合部とも接している請求項１～３のいずれか１項に記載の接合体。 The joined body according to any one of claims 1 to 3, wherein the first member is in contact with a plurality of heat transfer portions, and is also in contact with a joint portion existing between the plurality of heat transfer portions.
- 前記第２金属は、Ｃｕ－Ｎｉ合金又はＣｕ－Ｍｎ合金である請求項１～４のいずれか１項に記載の接合体。 The joined body according to any one of claims 1 to 4, wherein the second metal is a Cu-Ni alloy or a Cu-Mn alloy.
- 前記第１部材が電子部品の電極、前記第２部材が基板上の電極である請求項１～５のいずれか１項に記載の接合体。 The joined body according to any one of claims 1 to 5, wherein the first member is an electrode of an electronic component, and the second member is an electrode on a substrate.
- 前記電子部品は、半導体チップである請求項６に記載の接合体。 The joined body according to claim 6, wherein the electronic component is a semiconductor chip.
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| JP2018508405A JP6724979B2 (en) | 2016-03-28 | 2017-01-10 | Zygote |
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| JP2016-064407 | 2016-03-28 | ||
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018085366A (en) * | 2016-11-21 | 2018-05-31 | トヨタ自動車株式会社 | Method of manufacturing semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014180690A (en) * | 2013-03-19 | 2014-09-29 | Nippon Steel Sumikin Materials Co Ltd | Sheet-like high-temperature solder joint material, and die bonding method using the same |
| WO2015105161A1 (en) * | 2014-01-10 | 2015-07-16 | 日立化成株式会社 | Heat conducting member and electronic component |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014180690A (en) * | 2013-03-19 | 2014-09-29 | Nippon Steel Sumikin Materials Co Ltd | Sheet-like high-temperature solder joint material, and die bonding method using the same |
| WO2015105161A1 (en) * | 2014-01-10 | 2015-07-16 | 日立化成株式会社 | Heat conducting member and electronic component |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018085366A (en) * | 2016-11-21 | 2018-05-31 | トヨタ自動車株式会社 | Method of manufacturing semiconductor device |
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| JPWO2017168925A1 (en) | 2019-01-31 |
| JP6724979B2 (en) | 2020-07-15 |
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