JPWO2016046932A1 - Mounting apparatus and mounting method - Google Patents

Abstract

The mounting apparatus 12 images the reference mark 47 as the reference position formed on the guide frame 43 of the feeder 44 and the feed hole 41 of the tape 40 as the housing member, and the reference mark 47 and the reference mark 47 are based on the captured image. A positional deviation amount (positional relationship) with respect to the feed hole 41 is derived and stored in the HDD 73, and the periodicity of whether or not this positional deviation has periodicity based on the stored positional deviation amounts for a plurality of rounds of the sprocket. Make a decision. The mounting device 12 corrects the position of the tape 40 based on the periodicity when the positional deviation has a periodicity.

Description

  The present invention relates to a mounting apparatus and a mounting method.

  Conventionally, as a mounting device, for example, the position of a component supply hole of a component supply tape is photographed immediately after component adsorption using a camera, and the total component feeding position is measured for each component supply device, and this is stored and stored. A device that gives a correction amount for each feed has been proposed (see, for example, Patent Document 1). In this apparatus, the correction position for picking up the components can be performed with high accuracy. Further, as the mounting device, the detection image of the electronic component is captured by the optical reader, the center of gravity position of the electronic component is calculated based on the detection image, the positional deviation from the reference position of the detection image is calculated, and the calculation result A mechanism has been proposed in which the take-out mechanism is moved to the position of the center of gravity of the electronic component (see, for example, Patent Document 2). In this device, the center of gravity of the electronic component can be reliably held.

JP 7-79096 A Japanese Utility Model Publication No. 6-232594

  However, in the apparatus of Patent Document 1 described above, the part feed position for one round of the sprocket is measured and a correction amount is given for each part feed, but depending on the mode of misalignment between the part supply tape and the sampling position. In some cases, an appropriate correction amount could not be given with one round of data. In addition, the apparatus of Patent Document 2 has a problem that it takes time to collect the components because the image capturing, the calculation of the center of gravity position, and the correction of the moving position of the extracting mechanism are performed when the components are collected. As described above, it has been required to perform an appropriate process when collecting parts.

  The present invention has been made in view of such a problem, and a main object of the present invention is to provide a mounting apparatus and a mounting method that can cope more appropriately when collecting components.

  The present invention adopts the following means in order to achieve the main object described above.

The mounting apparatus of the present invention is
A mounting device that collects components by a sampling unit and mounts them on a board,
A storage unit for storing information;
An imaging unit that images a reference position formed on a feeder that feeds a housing member that houses a part by a sprocket and a part of the housing member;
A deriving unit for deriving a positional relationship related to a positional deviation between the reference position and the housing member based on the captured image and storing the positional relationship in the storage unit;
Based on the stored positional relationship for a plurality of circumferences, periodicity determination is made as to whether or not the positional relationship has periodicity, and when there is periodicity, the position of the sampling unit and the accommodating member is Correction based on periodicity is performed, or based on the stored positional relationship for a plurality of rounds, it is determined whether or not the positional relationship falls within a predetermined reference range, and the positional relationship is outside the reference range Sometimes a processing unit that outputs defect information,
It is equipped with.

  In this apparatus, the reference position formed on the feeder and a part of the housing member are imaged, and the positional relationship regarding the positional deviation between the reference position and the housing member is derived and stored based on the captured image. Based on the stored positional relationship for a plurality of rounds, periodicity determination is performed as to whether or not this positional relationship has periodicity. And when this positional relationship has periodicity, correction based on periodicity is performed with respect to any position of a collection part and an accommodating member. Alternatively, in this device, it is determined whether or not the positional relationship falls within a predetermined reference range based on the stored positional relationship for a plurality of turns, and when the positional relationship is outside the reference range, failure information is output. In this way, in this device, since the positions of the sprockets for a plurality of rounds are obtained, it is possible to grasp the periodicity of the positional deviation and the presence or absence of suddenness, and accordingly, correction of the positional deviation and notification of malfunctions are performed. It can be carried out. Therefore, with this device, it is possible to cope with the situation more appropriately when collecting parts.

1 is a schematic explanatory diagram of a mounting system 10. FIG. Explanatory drawing of the mounting head 20, the imaging unit 17, and the component supply unit 18. FIG. Explanatory drawing which looked at the tape 40 and the imaging unit 17 from the side surface. Explanatory drawing of the components supply unit 18. FIG. The block diagram showing the electrical connection relation of the mounting apparatus. 7 is an explanatory diagram of positional relationship correction value information 76 stored in the HDD 73. FIG. The flowchart which shows an example of a components supply process routine. FIG. 6 is a relationship diagram illustrating an example of a relationship between a sprocket 45 and a positional deviation amount of a part P. Explanatory drawing of the malfunction information display screen 60 displayed on the display part 51. FIG. Explanatory drawing of the error information display screen 61 displayed on the display part 51. FIG.

  Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of the mounting system 10. FIG. 2 is an explanatory diagram of the mounting head 20, the imaging unit 17, and the component supply unit 18. FIG. 3 is an explanatory view of the tape 40 and the imaging unit 17 as viewed from the side. FIG. 4 is an explanatory diagram of the component supply unit 18. FIG. 5 is a block diagram showing an electrical connection relationship of the mounting apparatus 12. FIG. 6 is an explanatory diagram of the positional relationship correction value information 76 stored in the HDD 73. The mounting system 10 of the present embodiment includes a mounting device 12 that mounts a component P (see FIG. 2) on a substrate S, and a management computer 80 that manages information related to the mounting process. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. The mounting process includes a process of placing, mounting, inserting, joining, and bonding the component P on the substrate S.

  As shown in FIG. 1, the mounting apparatus 12 includes a board transfer unit 14, a mounting unit 16, an imaging unit 17, a component supply unit 18, an operation panel 19, and a control device 70 (see FIG. 5). . The substrate transport unit 14 transports the substrate S in the X-axis direction by a pair of front and rear conveyor belts.

  The mounting unit 16 adsorbs (collects) the component P and places it on the substrate S, and includes a mounting head 20, an X-axis slider 26, and a Y-axis slider 28. The mounting head 20 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 28 moves in the front-rear direction. The mounting head 20 is equipped with a plurality of suction nozzles 21 for sucking the component P. The suction nozzle 21 is moved up and down by a Z-axis motor (not shown).

  The imaging unit 17 captures an image and is disposed in front of a head holding body that holds the mounting head 20 via a support member (not shown). As a result, the imaging unit 17 moves in the XY direction as the mounting head 20 moves in the XY direction. As shown in FIGS. 2 and 3, the imaging unit 17 is configured to take an image of the upper surface of a tape 40 (see FIG. 2) as a housing member that houses the component P. 35 (see FIG. 5). The imaging element 30 photoelectrically converts light incident through a lens (not shown) and outputs a signal, and is arranged with the light receiving surface inclined. The imaging unit 17 images the upper surface of the tape 40 by an optical path 38 inclined downward from the front side of the mounting head 20 so as not to hinder the collection and arrangement of the component P by the mounting head 20. The image processing unit 35 receives charges generated by the image sensor 30 and performs known processing such as gamma correction processing, contrast processing, and sharpness processing, for example, and generates image data based on the charges. As shown in FIG. 2, the imaging unit 17 has a feed hole 41, a cavity 42 and a part P formed in the tape 40 and a reference mark 47 formed on the guide frame 43 as an imaging range 36.

  The component supply unit 18 supplies the component P to the mounting unit 16 and has a plurality of feeders 44. A reel 48 around which a tape 40 accommodating a component P is wound is attached to the feeder 44 so as to be rotatable. As shown in FIG. 4, the feeder 44 includes a sprocket 45, a drive motor 46, a reel 48, and a controller 49, and is detachably mounted in a front slot of the mounting apparatus 12. The sprocket 45 is a kind of external gear and plays a role of feeding the tape 40 unwound from the reel 48 backward. The drive motor 46 is a stepping motor that rotationally drives the sprocket 45. The controller 49 is configured as a microprocessor centered on a CPU, and is electrically connected so as to be capable of bidirectional communication with the control device 70. As shown in FIG. 2, the tape 40 is formed with a feed hole 41 and a cavity 42 that accommodates the component P, which are arranged along the longitudinal direction of the tape 40. In the feed hole 41, teeth of the sprocket 45 are fitted. The tape 40 has the feed hole 41 formed only on one side, but may be formed on both the left and right sides. The tape 40 moves along guide frames 43 provided on the left and right sides of the feeder 44 and extending in the front-rear direction. A circular reference mark 47 as a reference position is formed on the guide frame 43. The reference mark 47 is not particularly limited to a circle as long as the position can be specified, and may have various shapes. The mounting device 12 is set so as to obtain the amount of positional deviation of the tape 40 based on the positional relationship between the feed hole 41 that is a part of the tape 40 and the reference mark 47. A sampling position 37 where the mounting head 20 collects the component P is defined in the feeder 44. In the feeder 44, when the drive motor 46 rotates the sprocket 45, the feed hole 41 of the tape 40 is fed backward by the sprocket 45, and the parts P accommodated in the tape 40 are sequentially fed out to the sampling position 37. Since the part P that has reached the collection position 37 is collected by the suction nozzle 21, the part P is not accommodated in the cavity 42 behind the collection position 37.

  The operation panel 19 includes a display unit 51 that displays a screen and an operation unit 52 that receives an input operation from an operator. The display unit 61 is configured as a liquid crystal display, and displays the operating state and setting state of the mounting apparatus 12 on the screen. The operation unit 52 is provided with various keys so that an operator's instruction can be key-inputted.

  As shown in FIG. 5, the control device 70 is configured as a microprocessor centered on a CPU 71, and includes a ROM 72 that stores processing programs, an HDD 73 that stores various data, a RAM 74 that is used as a work area, an external device and an electrical An input / output interface 75 for exchanging signals is provided, and these are connected via a bus. The control device 70 is connected to the substrate transfer unit 14, the mounting unit 16, the imaging unit 17, the component supply unit 18 and the like so as to be capable of bidirectional communication, and exchanges signals with these units. As shown in FIG. 6, positional relationship correction value information 76 is stored in the HDD 73 that stores the information. FIG. 6 also shows the positional deviation amount of the fourth round when not corrected and the positional deviation quantity of the fourth round as a result of correction by the correction value. The positional relationship correction value information 76 includes a positional deviation amount obtained from a positional relationship between the reference mark 47 and the feed hole 41 (hereinafter also simply referred to as a positional relationship) and a periodicity obtained based on the positional deviation amount. Are included in association with each position of the sprocket 45. The misregistration amount is an amount indicating how much the tape 40 (component P) is deviated from the original position. This displacement amount may be any value as long as it represents a relative distance. For example, it may be the feed amount of the tape 40 based on the rotation angle of the sprocket, or the rotation angle of the sprocket. Good. Alternatively, the number of pixels of an image captured by the imaging unit 17 may be used. The positional relationship correction value information 76 includes positional relationships for a plurality of rounds. The correction value is a value for correcting at least one of the mounting head 20 and the tape 40 at a position where the component P is correctly picked up by the suction nozzle 21 based on the positional deviation amount. Here, the feed amount of the tape 40 by the sprocket 45 is corrected. It is determined as the value to be. The correction value may be a value for correcting the position of the mounting head 20 by the amount of the positional deviation. This correction value is determined based on the average value of the positional deviation amounts.

  Next, the operation of the mounting system 10 of the present embodiment configured as described above, in particular, the movement of the component supply unit 18 will be described. FIG. 7 is a flowchart illustrating an example of a component supply processing routine executed by the CPU 71 of the control device 70. This routine is stored in the HDD 73 of the control device 70, and is executed by a mounting start instruction by the operator. This routine is executed by the CPU 71 using, for example, the mounting unit 16, the imaging unit 17, the component supply unit 18, and the operation panel 19 of the mounting apparatus 11. The CPU 71 executes a mounting process routine for controlling the mounting unit 16 so as to mount the component P on the board S in parallel with this routine.

  When this routine is started, the CPU 71 first acquires a reference range according to the correction condition and the component type (step S100). In addition to the correction value of the feed amount of the tape 40, the correction condition includes an accumulation number indicating how many turns of the sprocket 45 in the correction of the feed amount of the tape 40 are accumulated in the calculation of the correction value. Here, it is assumed that the initial accumulation number for correction value calculation is set to 3 laps, and the second and subsequent correction value calculation accumulation counts are set to 12 laps. The initial value of the correction value is set to a predetermined value using a predetermined reference tape, and the subsequent correction values are included in the positional relationship correction value information 76 calculated by the processing described later. Is set to a value. The predetermined reference range is, for example, a range having a threshold value lower than an allowable range in which it is difficult (impossible) to collect the component P by the mounting head 20, that is, the position of the tape 40 is shifted depending on the component type. The collection of P may be determined empirically within a possible range. In addition, the reference range may be set to be smaller for a smaller part, and may be set to be larger for a relatively large part. If the reference range is determined in this way, the collection of the parts P can be more stabilized without affecting the productivity. The correction value for the second and subsequent times may be calculated using the entire accumulated data, or may be calculated using data of the latest several rounds (for example, 3 rounds). The calculation of the correction value for the second and subsequent times may be performed at an appropriately set timing.

  Next, the CPU 71 causes the component supply unit 18 to perform the process of sending the tape 40 using the correction value, and then stops the tape 40 when the tape 40 is sent by a predetermined feed amount (step S110). When the tape 40 is stopped, the CPU 71 causes the imaging unit 17 to perform an imaging process for capturing an image of the imaging range 36 (step S120). The imaging range 36 includes a feed hole 41 and a reference mark 47, and the captured image includes these. At this time, the CPU 71 performs a process of collecting the component P by the suction nozzle 21 of the mounting head 20 in a mounting process routine executed in parallel. Next, the CPU 71 derives a positional relationship (a positional shift amount) related to a positional shift between the reference mark 47 and the tape 40 (feed hole 41) based on the captured image and stores it in the positional relationship correction value information 76 of the HDD 73. (Step S130). Here, as shown in FIG. 2, the positional deviation amount is a deviation amount in the front-rear direction between the center of the feed hole 41 and the center of the reference mark 47 corresponding to the positional deviation of the sprocket 45. For example, if the reference distance L is when the tape 40 is in the correct position, the positional deviation amount is a positive value L1 when the tape 40 is being fed a lot, and a negative value when the tape 40 is being fed a little. Let L2. Further, the CPU 71 derives the positional deviation amount for each position of the sprocket 45, and the value obtained by subtracting the positional deviation amount (integrated positional deviation amount) before the current sprocket position is used as the positional deviation of the current sprocket position. Amount. That is, the CPU 71 obtains a positional deviation amount that corresponds to the current sprocket position. For example, when the position deviation based on the captured image is value 1, value 3, and value 6 corresponding to sprocket positions (teeth) No. 1, No. 2, and No. 3, respectively, It is assumed that a value 1, a value 2, and a value 3 are obtained by subtracting the integrated amount (see the first round in FIG. 6).

  Next, the CPU 71 determines whether or not the stored number of misregistration amounts has reached the accumulated number (step S140). This determination is made based on whether or not the positional deviation amount data included in the positional relationship correction value information 76 is stored (three rounds here). When the stored number has not reached the accumulated number, the CPU 71 determines whether or not the production is completed based on whether or not all the parts P are arranged on the substrate S (step S230). The processes after S110 are repeatedly executed. That is, the tape 40 is fed out, and the amount of displacement of the feed hole 41 corresponding to the position of the sprocket 45 is derived. On the other hand, when the stored number reaches the accumulated number in step S140, the CPU 71 performs periodicity determination for determining whether the positional deviation has periodicity (step S150). In the periodicity determination, for example, it is possible to determine that a positional deviation has occurred at a specific position of the sprocket 45, and the difference between the maximum value and the minimum value of the accumulated positional deviation amount is approximately within a predetermined value (for example, , In FIG. 6, etc. It should be noted that the processing of steps S150 to S210 is performed for all sprocket 45 positions. This predetermined value may be determined empirically to a value that can be determined to be a periodic displacement. For example, when a large amount of misalignment is shown over a plurality of circumferences at a specific position of the sprocket 45, this corresponds to a case where specific teeth of the sprocket 45 are distorted. Further, the periodicity determination can be performed based on whether or not the change in the positional deviation amount repeats an increasing tendency and a decreasing tendency over a plurality of turns. This case corresponds to a case where the entire sprocket 45 is distorted. FIG. 8 is a relationship diagram illustrating an example of the relationship between the sprocket 45 and the positional deviation amount of the component P. This relationship diagram illustrates the data included in the positional relationship correction value information 76 of FIG. 6, and is a plot of misalignment amounts over a plurality of circumferences corresponding to the tooth positions of each sprocket 45. FIG. 8 also shows a correction value, which is an average value of the amount of misalignment, and the amount of misalignment on the fourth round as a result of correction using this correction value. As shown in FIG. 8, in the case where the amount of misalignment is substantially the same over a plurality of circumferences and shows a tendency to increase and decrease over a certain period, the misalignment such as distortion of the sprocket 45 may occur. It can be determined that there is periodicity. On the other hand, although not shown, it can be determined that the positional deviation has no periodicity when the positional deviation occurs suddenly.

  When there is no periodicity in the positional deviation of the tape 40, the CPU 71 performs a failure determination for determining whether or not the accumulated positional deviation amount is out of a predetermined reference range (step S160). When the amount of positional deviation is outside the predetermined reference range, the CPU 71 causes the operation panel 19 to report defect information (step S170). FIG. 9 is an explanatory diagram of the defect information display screen 60 displayed on the display unit 51 of the operation panel 19. On the defect information display screen 60, an information display column 62 for displaying the contents of the defect is arranged. The information display column 62 includes information indicating that a non-periodic, that is, sudden displacement has occurred in the tape 40. Here, the mounting apparatus 12 informs the operator that there is a problem with the tape 40 and continues the mounting process. The worker who has confirmed this can continue the mounting process while confirming the state, or can stop the component supply unit 18 and confirm the state of the tape 40 as necessary. At this time, the CPU 71 may display defect information when the amount of positional deviation is outside the reference range, and may stop the production line when the amount of positional deviation is outside the allowable range that is difficult to collect. In this way, when the misalignment deteriorates over time, the operator can first cope with the problem by notifying the problem. Further, since the mounting apparatus 12 stops the mounting process, it is possible to prevent a mounting failure of the component P in advance.

  On the other hand, when the positional deviation has periodicity in step S150, the CPU 71 determines whether or not the positional deviation with periodicity is within a predetermined allowable range (step S180). This allowable range may be set to the same content as the reference range described above, for example. When the positional deviation is outside the predetermined allowable range, the CPU 71 informs the operation panel 19 of error information (step S190), and performs the processing after step S230. That is, the CPU 71 continues the mounting process. FIG. 10 is an explanatory diagram of an error information display screen 61 displayed on the display unit 51 of the operation panel 19. On the error information display screen 61, an information display column 62 for displaying the content of the error is arranged. The information display column 62 includes information indicating that a periodic positional deviation has occurred in the tape 40. Here, the mounting apparatus 12 notifies the operator of the possibility that the sprocket 45 is defective, and the mounting process is continued. The worker who has confirmed this can perform appropriate measures such as continuing the mounting process while confirming the state, or stopping the component supply unit 18 and performing maintenance of the feeder 44 as necessary.

  On the other hand, when the positional deviation with periodicity is within the allowable range in step S180, the CPU 71 determines whether or not there is a sudden deviation among the positional deviations for a plurality of circumferences (step S200). The determination of suddenness may be performed based on, for example, standard deviations of positional deviations for a plurality of rounds. Specifically, this determination can be made based on whether or not there is a case where the value of 3σ obtained from the positional deviation amounts for a plurality of rounds exceeds a predetermined value. This predetermined value may be determined empirically to a value that can be determined as a sudden displacement. When the positional deviation is not sudden, a correction value is calculated based on the average value of the positional deviation amounts (step S210). It is assumed that the correction value is a value for correcting the feed amount of the tape 40 by the sprocket 45. This correction value may be, for example, an average value of positional deviation amounts as shown in the positional relationship correction value information 76 in FIG. When the positional deviation has periodicity, it tends to indicate the relatively same positional deviation amount according to the position of the sprocket 45, and therefore the correction value can be an average value of the positional deviation amounts. In the case of sudden displacement, it is difficult to perform correction because the occurrence of displacement cannot be predicted. On the other hand, when there is a misregistration in step S200, the CPU 71 calculates a correction value based on the average value excluding the misregistration amount (step S220). The correction value may be, for example, an average value excluding the amount of misregistration. Specifically, for example, the sprocket position 11 in FIG. 6 and the data having the suddenness indicated by the arrow in FIG. 8 corresponding thereto may not be used. In this way, a more desirable correction value (7.5) can be obtained as compared with the value using the data having suddenness (see 6.3 of sprocket position 11 in FIG. 6 and the dotted circle in FIG. 8). Can do. In addition, the positional deviation having suddenness may correspond to, for example, the one farthest from the average value.

  After step S220, S210 or S170, or when the amount of positional deviation is outside the predetermined reference range at step S160, the CPU 71 determines whether or not production is completed at step S230. The processes after S110 are repeatedly executed. That is, the CPU 71 sends out the tape 40 using the correction value based on the derived positional deviation amount, and derives the positional deviation amount of the feed hole 41 with respect to the reference mark 47. When the number of misregistration amounts reaches a predetermined accumulation number, the CPU 71 calculates a correction value based on the average value of misregistration amounts, and sends the tape 40 using the correction value. As shown in FIG. 8, the positional deviation of the tape 40 becomes smaller in the fourth turn using the correction value based on the accumulated positional deviation amount. On the other hand, when the production is completed in step S230, the CPU 71 ends this routine as it is.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The mounting unit 16 of the present embodiment corresponds to the collection unit of the present invention, the HDD 73 corresponds to the storage unit, the imaging unit 17 corresponds to the imaging unit, and the CPU 71 corresponds to the derivation unit and the processing unit. In the present embodiment, an example of the mounting method of the present invention is also clarified by describing the operation of the mounting apparatus 12.

  In the mounting apparatus 12 of this embodiment described above, the reference mark 47 as the reference position formed on the guide frame 43 of the feeder 44 and the feed hole 41 of the tape 40 as the housing member are imaged and the captured image is captured. The positional deviation amount (positional relationship) between the reference mark 47 and the feed hole 41 is derived on the basis of this and is stored in the HDD 73. Is this positional deviation periodic based on the stored positional deviation amounts for a plurality of rounds? The periodicity judgment of no is performed. Then, this apparatus performs correction based on the periodicity for the position of the tape 40 when the positional deviation has a periodicity. Alternatively, in this device, it is determined whether or not the misalignment amount falls within a predetermined reference range based on the stored misalignment amounts for a plurality of turns, and when the misalignment amount is outside the reference range, defect information is displayed. Output. In this way, in this device, since the positions of the sprockets for a plurality of rounds are obtained, it is possible to grasp the periodicity of the positional deviation and the presence or absence of suddenness, and accordingly, correction of the positional deviation and notification of malfunctions are performed. It can be carried out. Therefore, in this apparatus, when the component P is sampled by the mounting head 20, it is possible to cope more appropriately.

  Also, in this device, when there is a sudden misalignment, correction using the misaligned amount of misalignment is not performed, so that a more appropriate misalignment can be corrected, and when collecting parts Can be dealt with more appropriately. Further, in this apparatus, when the positional deviation is not periodic in the periodicity determination and the positional deviation is out of the reference range in the defective determination, the defect information is output. Can more appropriately deal with the parts collection process. Furthermore, in this apparatus, since the feed amount of the tape 40 by the sprocket 45 is corrected at the time of correction, the positional deviation of the tape 40 can be corrected relatively easily. In this apparatus, since the reference range corresponding to the type of the component P accommodated in the tape 40 is used when determining the failure, the more appropriate reference range is used, and therefore, when the component is collected, a more appropriate countermeasure is taken. can do. In addition, since the positional deviation amount in the feeding direction of the tape 40 is derived, correction and malfunction output can be performed with respect to the feeding direction of the tape 40.

  The mounting apparatus is required to mount a chip smaller than 0.3 × 0.15 mm at a high speed. In addition, the mounting apparatus may pick up an image after picking up the component P, and may perform processing (pickup offset processing) for correcting the suction position at the tip of the suction nozzle 21 based on the picked-up image. In this process, it is possible to correct a suction position shift such as a thermal displacement during the mounting of the substrate S. However, if the feed position on the feeder 44 side is not stable, it may not be possible to accurately collect the component P. there were. On the other hand, in the mounting apparatus 12 of the present embodiment, the parts P can be collected more accurately by correcting the feeding position of the tape 40.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, it is determined whether or not there is suddenness in step S200, but this may be omitted. In the above-described embodiment, the correction value is calculated without using the misregistration amount, but this may be omitted. Even in this case, it is possible to cope more appropriately when the component P is collected depending on the presence or absence of periodicity.

  In the above-described embodiment, the defect information is output when the positional deviation is not periodic in the periodicity determination and the positional deviation is out of the reference range in the defective determination. However, the present invention is not limited to this. For example, the periodicity determination is omitted, and it is determined whether or not the positional deviation amount falls within the reference range based on the positional relationship for a plurality of rounds, and when the positional deviation amount is outside the reference range, fault information is output. It is good. In this apparatus, when the component P is collected using the output defect information, it is possible to cope with it more appropriately.

  In the above-described embodiment, the CPU 71 notifies the defect information when the positional deviation is out of the reference range. However, the present invention is not limited to this. For example, the CPU 71 accommodates the same type of component P and the positional deviation is the reference. It is good also as what makes the mounting unit 16 extract | collect the component P accommodated in the other tape 40 which is in the range (from the other feeder 44). With this apparatus, it is possible to collect the component P with less misalignment. In addition, the operator can remove the feeder 44 having a large positional deviation and deal with the positional deviation while the parts are being supplied by the other feeder 44.

  In the embodiment described above, the feeding amount of the tape 40 is corrected when the correction is performed. However, for example, the position of the mounting head 20 may be corrected. Even with this device, it is possible to deal with the problem more appropriately when collecting parts. In the above-described embodiment, the positional deviation in the feeding direction of the tape 40 is derived. However, the present invention is not particularly limited thereto, and the positional deviation in the direction orthogonal to the feeding direction of the tape 40 (left and right direction) is derived. It may be a thing. Or it is good also considering the direction of position shift as all directions. In deriving a positional deviation other than the feeding direction of the tape 40, the positional deviation can be corrected by correcting the position of the mounting head 20. Even with such an apparatus, it is possible to cope with the situation more appropriately when parts are collected.

  In the embodiment described above, the feed hole 41 is used as the position reference of the tape 40. However, the position is not particularly limited as long as the position of the tape 40 can be specified. For example, the reference position may be the cavity 42. The component P housed in the cavity 42 may be used. Even with such an apparatus, the positional deviation of the tape 40 can be grasped. It is more preferable that the reference position of the tape 40 is the feed hole 41 because the suction nozzle 21 can be prevented from being reflected during imaging.

  In the above-described embodiment, the imaging unit 17 has been described as being disposed on the mounting head 20, but is not particularly limited thereto, and may be fixed to the upper part of the component supply unit 18. In the above-described embodiment, the imaging unit 17 captures an image by the optical path 38 that is obliquely downward from the front of the mounting head 20. However, as long as the reference position can be captured, in what direction the optical path is It may be.

  In the above-described embodiment, it is determined whether or not the positional deviation is within the allowable range when there is periodicity. However, as this allowable range, a reference range when there is no periodicity may be used. Even in this case, it is possible to cope more appropriately when collecting parts.

  In the above-described embodiment, the imaging unit 17 has been described as imaging the descending end (near the collection position 37) of the suction nozzle 21, but the reference mark 47 (reference position) and the position of the tape 40 can be specified. For example, it is not limited to this. In order to stabilize the sampling position of the suction nozzle 21, it is preferable to image the vicinity of the sampling position 37.

  In the above-described embodiment, the defect information and error information are displayed and output on the display unit 51. However, the defect information and error information may be notified by voice using a speaker or the like.

  The present invention can be used in the field of mounting electronic components.

DESCRIPTION OF SYMBOLS 10 mounting system, 12 mounting apparatus, 14 board conveyance unit, 16 mounting unit, 17 imaging unit, 18 component supply unit, 19 operation panel, 20 mounting head, 21 suction nozzle, 26 X axis slider, 28 Y axis slider, 30 imaging Element, 35 Image processing section, 36 Imaging range, 37 Collection position, 38 Optical path, 40 Tape, 41 Feed hole, 42 Cavity, 43 Guide frame, 44 Feeder, 45 Sprocket, 46 Drive motor, 47 Reference mark, 48 Reel, 49 Controller, 51 Display section, 52 Operation section, 60 Defect information display screen, 61 Error information display screen, 62 Information display column, 70 Control device, 71 CPU, 72 ROM, 73 HDD, 74 RAM, 75 I / O interface, 76 Position Relation correction value information, 80 Management computer, L reference distance, P component, S board.

Claims (8)

A mounting device that collects components by a sampling unit and mounts them on a board,
A storage unit for storing information;
An imaging unit that images a reference position formed on a feeder that feeds a housing member that houses a part by a sprocket and a part of the housing member;
A deriving unit for deriving a positional relationship related to a positional deviation between the reference position and the housing member based on the captured image and storing the positional relationship in the storage unit;
Based on the stored positional relationship for a plurality of circumferences, periodicity determination is made as to whether or not the positional relationship has periodicity, and when there is periodicity, the position of the sampling unit and the accommodating member is Correction based on periodicity is performed, or based on the stored positional relationship for a plurality of rounds, it is determined whether or not the positional relationship falls within a predetermined reference range, and the positional relationship is outside the reference range Sometimes a processing unit that outputs defect information,
Mounting device.   When determining the periodicity, the processing unit determines whether or not the positional relationship has suddenness based on the stored positional relationship for a plurality of turns, and when there is suddenness, determines the positional relationship with the suddenness. The mounting apparatus according to claim 1, wherein the correction used is not performed.   The said process part outputs the said malfunction information, when the said positional relationship does not have periodicity by the said periodicity determination, and the said positional relationship is outside the said reference range by the said malfunction determination, The said malfunction information is output. Mounting device.   The mounting device according to claim 1, wherein the processing unit corrects a position of the sampling unit when performing the correction, or corrects a feed amount of the housing member by the sprocket. .   5. The mounting device according to claim 1, wherein the processing unit uses the reference range according to a type of a component housed in the housing member when determining the defect.   6. The processing unit according to claim 1, wherein when the positional relationship is outside the reference range in the defect determination, the processing unit causes the sampling unit to sample a component housed in another housing member that houses the same type of component. The mounting apparatus of any one of Claims.   The said derivation | leading-out part derives | leads-out the positional relationship regarding the said position shift in one or more directions among the feed direction of the said accommodating member, and the orthogonal direction orthogonal to this feed direction. Mounting equipment. A mounting method in which components are sampled by a sampling unit and mounted on a board.
(A) imaging a reference position formed on a feeder that feeds a housing member that houses a component by a sprocket and a part of the housing member;
(B) deriving a positional relationship relating to a positional deviation between the reference position and the housing member based on the captured image and storing it in a storage unit that stores information;
(C) Based on the stored positional relationship for a plurality of circumferences, a periodicity determination is made as to whether or not the positional relationship has periodicity, and when there is periodicity, the positional relationship between the sampling unit and the housing member On the other hand, the correction based on the periodicity is performed, or it is determined whether the positional relationship falls within a predetermined reference range based on the stored positional relationship for a plurality of turns, and the positional relationship is determined to be the reference range. A step of outputting defect information when outside,
Implementation method including