JP5845414B2 - Electronic component mounting apparatus and feeder state monitoring method in electronic component mounting apparatus - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that mounts electronic components supplied by a tape feeder on a substrate, and a feeder state monitoring method in an electronic component mounting apparatus that monitors the operating state of the tape feeder.

  2. Description of the Related Art As a component supply device in an electronic component mounting apparatus, a tape feeder that draws a carrier tape that holds an electronic component from a tape reel and feeds the pitch in synchronization with a component mounting timing is often used. A so-called splicing method is employed in which a carrier tape itself is joined by a joining tape when a reel replacement operation is performed when a component breakage occurs during a mounting operation using a tape feeder. According to this method, since the end portion of the already mounted carrier tape and the beginning portion of the new carrier tape are joined, the head for performing tape alignment by attaching the beginning portion of the new tape to the tape feeder. The dispensing operation can be omitted (see, for example, Patent Document 1). In the prior art shown in this patent document, a sensor is used to monitor whether or not the feed holes provided at a constant pitch on the carrier tape are shielded by the joining tape, and the shielding length where the feed holes are shielded is used for splicing. It is considered that the splicing seam is detected because it substantially matches the standard length set as the prescribed length of the joining tape. By detecting the joint portion in this way, it is determined that the component supply reel is replaced and the component lot is switched, and this result is recorded as component usage history data.

JP 2007-59653 A

  By the way, in recent years, the above-mentioned splicing method has been widely used for component supply in electronic component mounting lines, and the usage environment of mounting equipment has also changed with the times. It is not always practical to construct a mounting facility assuming a skilled worker who is familiar with the basic rules in (1). For example, regarding the above-mentioned splicing operation, it is necessary to use a joining tape used for joining the carrier tapes to a specified length, and when a joining tape greatly deviating from the specified length is used. In fact, splicing seams pass through the tape feeder but are not detected as seams, resulting in incorrect component usage history data being recorded.

  Such an event is not reported as an apparatus error, and the operation of the apparatus is continued and occurs in any of a large number of tape feeders. Therefore, if the operator who monitors the mounting line is unskilled, this is the case. It is extremely difficult to accurately grasp the situation and take appropriate measures. As described above, in the parts supply by the tape feeder adopting the splicing method, the splicing seam detection method does not always match the actual work situation at the production site, and a practically effective coping method has been demanded. .

  Therefore, the present invention provides an electronic component mounting apparatus and an electronic component mounting capable of effectively dealing with a problem caused by a method of detecting a seam portion in component supply by a tape feeder that employs a splicing method. An object of the present invention is to provide a feeder state monitoring method in an apparatus.

  In the electronic component mounting apparatus of the present invention, a carrier tape holding an electronic component is mounted on a tape feeder arranged in a component supply unit, and the already-mounted carrier tape and a newly supplied carrier tape are joined to the tape feeder. An electronic component mounting apparatus for picking up the electronic component supplied to a pickup position by a mounting head and mounting it on a substrate by pitch-feeding the carrier tape while repeating splicing work to be joined by a tape, the tape feeder The feed hole detection unit detects a feed hole formed in the carrier tape at a predetermined pitch, and a shielding length in which the feed hole is shielded by the joining tape in the splicing operation. A shielding length calculation unit for calculating based on the result, and the calculated A communication unit that transmits a shielding length to a device control unit of the electronic component mounting apparatus, wherein the device control unit sets the transmitted shielding length in advance for each type of the carrier tape. In comparison with the above, it is determined whether or not the number of times that the shielding length has deviated from the specified allowable range exceeds a preset specified number of times. Is notified.

  According to the feeder state monitoring method in the electronic component mounting apparatus of the present invention, a carrier tape holding an electronic component is mounted on a tape feeder arranged in a component supply unit, and the carrier tape is newly supplied with the already mounted carrier tape. In an electronic component mounting apparatus that picks up the electronic component supplied to the pickup position by a mounting head and mounts it on a substrate by repeating the splicing operation of splicing the carrier tape with the joining tape while repeating it. A feeder state monitoring method for monitoring an operating state of the tape feeder, wherein the tape feeder detects a feed hole formed at a predetermined pitch in the carrier tape, and the feeding in the splicing operation. Hole in the bonding tape A shielding length calculation step of calculating the shielding length shielded based on the detection result in the feed hole detection step, and transmitting the calculated shielding length to the device control unit of the electronic component mounting apparatus. The communication process and the device control unit compare the transmitted shielding length with a prescribed allowable range set in advance for each type of the carrier tape, and the number of times the shielding length deviates from the prescribed allowable range. A determination step for determining whether or not a predetermined number of times set in advance has been exceeded, and a notification step for notifying the fact by the notification unit if it is determined in the determination step that the predetermined number of times has been exceeded.

  According to the present invention, the shielding length in which the feed hole is shielded by the joining tape in the splicing operation is calculated based on the detection result of the feed hole detection unit, and the calculated shielding length is previously calculated for each type of the carrier tape. Compared with the set specified allowable range, it is determined whether the number of times that the shielding length deviates from the specified allowable range exceeds the preset specified number of times, and if it is determined that the specified number of times has been exceeded, the notification unit By notifying that effect, it becomes possible to accurately grasp the situation and take appropriate measures, and in the parts supply by the tape feeder adopting the splicing method, the problem caused by the detection method of the seam portion On the other hand, it can be effectively dealt with realistically.

The top view of the electronic component mounting apparatus of one embodiment of this invention The fragmentary sectional view of the electronic component mounting device of one embodiment of the present invention The side view of the tape feeder of one embodiment of the present invention Explanatory drawing of the joint part of the tape splicing in the tape feeder of one embodiment of this invention Structure explanatory drawing of the pickup position of the tape feeder of one embodiment of the present invention The block diagram which shows the structure of the control system of the tape feeder of one embodiment of this invention Flow chart of feeder state monitoring processing in the electronic component mounting apparatus of one embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure of the electronic component mounting apparatus 1 will be described with reference to FIGS. FIG. 2 partially shows the AA cross section in FIG. In FIG. 1, two rows of substrate transport mechanisms 2 are arranged in the X direction (substrate transport direction) in the center of the base 1a. The substrate transport mechanism 2 transports the substrate 3 supplied from the upstream device and subjected to component mounting work by the device in the X direction and positions it at the component mounting work position. Component supply units 4 are arranged on both sides of the substrate transport mechanism 2, and a plurality of tape feeders 5 are arranged in parallel in each component supply unit 4. The tape feeder 5 has a function of supplying an electronic component to a component suction position by a suction nozzle 9a of a mounting head 9 described below by pitch-feeding a carrier tape holding the electronic component.

  A Y-axis movement table 7 having a linear drive mechanism is disposed at one end in the X direction on the upper surface of the base 1a. The Y-axis movement table 7 is similarly provided with a linear drive mechanism. Two X-axis moving tables 8 are coupled so as to be movable in the Y direction. A mounting head 9 is mounted on each of the two X-axis moving tables 8 so as to be movable in the X direction. The mounting head 9 is a multiple-type head having a plurality of holding heads. At the lower end of each holding head, as shown in FIG. 9a is attached.

  By driving the Y-axis movement table 7 and the X-axis movement table 8, the mounting head 9 moves in the X direction and the Y direction. Thus, the two mounting heads 9 take out the electronic component 16 (see FIG. 3) from the tape feeder 5 of the corresponding component supply unit 4 by the suction nozzle 9a, and transfer and mount it on the substrate 3 positioned by the substrate transport mechanism 2. To do. The Y-axis moving table 7, the X-axis moving table 8, and the mounting head 9 constitute a component mounting mechanism 12 that transfers and mounts the electronic component 16 on the substrate 3 by moving the mounting head 9 that holds the electronic component 16.

  A component recognition camera 6 is disposed between the component supply unit 4 and the corresponding substrate transport mechanism 2. When the mounting head 9 that has taken out the electronic component 16 from the component supply unit 4 moves above the component recognition camera 6, the component recognition camera 6 captures and recognizes the electronic component 16 that is held by the mounting head 9. . Mounted on the mounting head 9 are substrate recognition cameras 10 that are positioned on the lower surface side of the X-axis moving table 8 and move together with the mounting head 9. As the mounting head 9 moves, the substrate recognition camera 10 moves above the substrate 3 positioned by the substrate transport mechanism 2 and images and recognizes the substrate 3. In the component mounting operation on the substrate 3 by the mounting head 9, the mounting position correction is performed in consideration of the recognition result of the electronic component 16 by the component recognition camera 6 and the substrate recognition result by the substrate recognition camera 10.

  As shown in FIG. 2, a carriage 11 in which a plurality of tape feeders 5 are previously mounted on a feeder base 11 a is set in the component supply unit 4. The position of the carriage 11 is fixed in the component supply unit 4 by clamping the feeder base 11a to the fixed base 1b provided on the base 1a by the clamp mechanism 11b. The carriage 11 holds a supply reel 13 for storing a carrier tape 15 holding electronic components in a wound state. The carrier tape 15 drawn out from the supply reel 13 is pitch-fed by the tape feeder 5 to the pickup position by the suction nozzle 9a.

  Next, the configuration and function of the tape feeder 5 will be described with reference to FIG. As shown in FIG. 3, the tape feeder 5 includes a main body 5a and a mounting portion 5b protruding downward from the lower surface of the main body 5a. In a state where the tape feeder 5 is mounted with the lower surface of the main body portion 5a along the feeder base 11a, the connector portion 5c provided in the mounting portion 5b is fitted into the feeder base 11a. Accordingly, the tape feeder 5 is fixedly mounted on the component supply unit 4 and the tape feeder 5 is electrically connected to the device control unit 25 of the electronic component mounting apparatus 1.

  Inside the main body 5a, a tape running path 5d for guiding the carrier tape 15 drawn from the supply reel 13 and taken into the main body 5a is provided continuously from the rear end to the front end of the main body 5a. ing. In the electronic component mounting apparatus 1 shown in the present embodiment, the end portion of the first carrier tape 15A already attached to the tape feeder 5 and the beginning portion of the second carrier tape 15B newly attached when the component runs out are used. A splicing method is employed in which the splicing method is used for joining by the joint portion J using the joining tape, and the carrier tape 15 is continuously supplied to the tape feeder 5 without interruption due to replacement of the supply reel 13.

  That is, in the electronic component mounting apparatus 1 shown in the present embodiment, the carrier tape 15 holding the electronic component 16 is mounted on the tape feeder 5 arranged in the component supply unit 4, and the first carrier already mounted in the tape feeder 5. The carrier tape 15 is pitch-fed while repeating the splicing operation in which the tape 15A and the newly supplied second carrier tape 15B are joined by the joining tape, so that the electronic component 16 supplied to the pickup position is mounted on the mounting head 9. Is taken out and mounted on the substrate 3.

  In the carrier tape 15, a base pocket 15a constituting the tape body is provided with a component pocket 15b, which is a concave portion for housing the electronic component 16, and a feed hole 15d for pitch feeding the carrier tape 15 at a predetermined pitch. It becomes the composition. The upper surface of the base tape 15a is sealed with a top tape 15e so as to cover the component pocket 15b in order to prevent the electronic component 16 from falling off the component pocket 15b.

  In the main body 5a, a tape feeding portion 17 for pitch feeding the carrier tape 15 is incorporated. The tape feeder 17 includes a tape feed motor 19 that rotationally drives a sprocket 20 provided at the tip of the tape running path 5d, and a feeder controller 18 that controls the tape feed motor 19. In a state where the tape feeder 5 is mounted on the feeder base 11a, the feeder controller 18 is connected to the apparatus controller 25.

  The sprocket 20 is provided with feed pins 20a (see FIG. 5) that fit into the feed holes 15d at a constant pitch. With these feed pins 20a engaged with the feed holes 15d, the tape feed motor 19 is operated. By driving and intermittently rotating the sprocket 20, the carrier tape 15 is pitch-fed downstream. The front side of the sprocket 20 is a pickup position where the electronic component 16 is taken out by vacuum suction from the component pocket 15b by the suction nozzle 9a of the mounting head 9.

  On the upper surface side of the main body 5a in the vicinity of the sprocket 20, a pressing member 21 for pressing and guiding the carrier tape 15 from the upper surface side is disposed. The holding member 21 is provided with a suction opening 22 corresponding to the pickup position by the suction nozzle 9a. The upstream end of the suction opening 22 is a top tape peeling portion 22a for peeling the top tape 15e. That is, in the process in which the carrier tape 15 travels below the pressing member 21, the top tape 15e circulates around the top tape peeling portion 22a and is drawn to the upstream side, so that the top tape 15e is the base tape on the upstream side of the pickup position. It is peeled off from 15a, folded back to the upstream side, sent into a tape collecting part provided in the main body part 5a, and collected. As a result, the electronic component 16 in the component pocket 15 b is exposed upward in the suction opening 22 and can be picked up by the mounting head 9.

  Next, with reference to FIG. 4, the joint part J which joins the tail part of the 1st carrier tape 15A and the head part of the 2nd carrier tape 15B newly mounted | worn by splicing operation is demonstrated. In the splicing operation, the first carrier tape 15A and the second carrier tape 15B held in a state of being aligned by the dedicated tool are simultaneously cut at the same cutting position. Then, in the state where the end face of the end portion of the first carrier tape 15A and the end face of the head portion of the second carrier tape 15B are abutted with each other, tape connection is performed using a joining tape. Here, an example is shown in which a plurality of joining tapes 26a, 26b, and 26c previously cut to a predetermined length and width are simultaneously attached to the joint portion J.

  These joining tapes 26a, 26b, and 26c are affixed in advance to the transfer board in a predetermined arrangement. By cutting the transfer board into a predetermined length L, the joining tapes 26a, 26b, and 26c have the same length. Cut at L. Then, by aligning and attaching the transfer mount to the joint portion J, the joining tapes 26a and 26c are attached to the upper surface and the lower surface of the joint portion J, respectively, and the joining tape 26b is provided on the feed hole side of the joint portion J. The first carrier tape 15A and the second carrier tape 15B are connected to each other. In this state, in the range where the joining tapes 26a, 26b, and 26c are adhered at the joint portion J, the lower surface side of the feed hole 15d is shielded by the joining tape 26c.

  Next, a feed hole detection function for detecting the feed hole 15d shielded at the joint portion J will be described with reference to FIG. This feed hole detection is performed for the purpose of detecting that the joint portion J that joins the two carrier tapes 15 has reached before the pickup position in the process of continuously feeding the carrier tapes 15 by the tape feeder 5. Is called. By detecting the joint portion J in this manner, it is detected that the carrier tape 15 supplied from the supply reel 13 is newly switched and the component lot used for mounting is switched. Then, by recording the detection result of the joint portion J in this way, the component usage history data in the tape feeder 5 can be acquired.

  In FIG. 5A, an optical sensor 24 is provided on the upstream side of the suction opening 22, and an opening 23 is provided immediately above the sensor 24. The light from the sensor 24 passes through the feed hole 15 d and the opening 23 of the carrier tape 15, so that the feed hole 15 d is detected by the feed hole detection unit 27. That is, when the normal portion of the carrier tape 15 passes above the sensor 24, the timing at which the feed hole 15d is positioned between the sensor 24 and the opening 23 as shown in FIGS. The light from the sensor 24 is transmitted upward through the feed hole 15d and the opening 23, whereby the feed hole 15d is detected. The feed hole detection signal is repeatedly output at intervals corresponding to the feed hole pitch.

  On the other hand, when the joint portion J in which the lower surface of the feed hole 15d is blocked by the joining tape 26c passes above the sensor 24, the feed hole 15d is not detected in the range where the joining tape 26c is adhered. Therefore, by continuously monitoring the feed hole detection signal from the sensor 24, it is detected that the joint portion J where the carrier tape 15 is joined has passed the position of the sensor 24.

  Furthermore, in the present embodiment, the detection result of the feed hole detection unit 27 is used not only to detect the joint portion J but also to detect the shielding length in which the feed hole 15d is shielded by the joining tape 26c at the joint portion J. It is done. That is, in the range where the feed hole 15d is shielded, as shown in FIGS. 5B and 5B, the inspection light projected from the sensor 24 is always shielded by the joining tape 26c and sent from the feed hole detection unit 27. Hole detection signal is not output. The feed hole 15d is shielded by the bonding tape 26c based on the feed hole non-detection feed count in which the feed hole detection signal non-output state continues and the carrier tape 15 pitch feed count set in advance for each tape type. The shield length L can be obtained.

  This shielding length L is one of the factors for determining the suitability of the splicing work, and is required to be within a prescribed allowable range set in advance for each type of carrier tape 15. Therefore, in the present embodiment, every time the joint portion J is detected in each tape feeder 5, the shielding length L is transmitted to the device control unit 25 together with the detection result of the joint portion J, and the device control unit 25 The state of splicing work is determined.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 6, the apparatus control unit 25 includes a CPU having an arithmetic processing function, and controls the following units based on various control programs and data stored in the storage unit 30. In addition to the mounting operation program, the storage unit 30 stores mounting data 30a, splicing tape length data 30b, and abnormality notification data 30c. The mounting data 30a is mounting coordinate data indicating the type and mounting position of electronic components to be mounted for each board type to be produced.

  The splicing tape length data 30b is data relating to the length of the joining tape used in the splicing operation for splicing the carrier tape 15 pitch-fed by the tape feeder 5, and here, for each type of the carrier tape 15, a reference range And the specified tolerance is set. The reference range is a tape length serving as a reference for determining that the joint portion J has been detected by the tape feeder 5, and is written in the memory of the feeder control unit 18 of the tape feeder 5. That is, if the shielding length L calculated in the tape feeder 5 is within this reference range, it is determined that the joint portion J has been detected, and the tape feeder 5 outputs that effect.

  On the other hand, the specified permissible range is set to determine whether or not the splicing work is appropriate. For example, when the transmitted shielding length L exceeds the reference range, it is determined that the joint portion J has been detected, but some abnormal work or state in splicing (for example, non-standard joining tape It is desirable to assume that the use has occurred and take some measures. In other words, the specified permissible range in the present embodiment is an abnormal situation in which the carrier tape 15 is spliced in a state where it is practically acceptable and the apparatus should be stopped immediately, but the situation must be observed by a skilled worker. Whether the threshold range is determined by the automatic determination function of the electronic component mounting apparatus 1. This prescribed permissible range is set empirically based on accumulated data of occurrence of abnormalities in the device.

  The abnormality notification data 30c is data that defines an item that should be notified when an event requiring a specific treatment occurs in the operating state of the electronic component mounting apparatus 1. Here, the number of times that the length of the connecting tape used for splicing of the carrier tape 15 deviates from the above-mentioned specified allowable range is one of the targets of monitoring, and when this number exceeds the specified number of times, an abnormality is notified. The data is set to do.

  The mechanism drive unit 31 is controlled by the device control unit 25 to drive the board transport mechanism 2 and the component mounting mechanism 12. At this time, the mounting data 30a stored in the storage unit 30 is referred to, and thereby component mounting work for the board 3 is executed. Further, the device control unit 25 controls the plurality of tape feeders 5 mounted on the component supply unit 4. The feeder control unit 18 (see FIG. 3) provided in each tape feeder 5 is connected to the device control unit 25 via the communication unit 50, and the feeder control unit 18 receives a higher order command from the device control unit 25. Accordingly, the tape feed motor 19, the feed hole detection unit 27, and the shielding length calculation unit 28 are controlled.

  The tape feed motor 19 pitch-feeds the carrier tape 15 by intermittently rotating the sprocket 20. The feed hole detection unit 27 performs feed hole detection processing for detecting the feed holes 15 d formed at a predetermined pitch in the carrier tape 15 based on the detection result of the sensor 24. Based on the detection result of the feed hole detector 27, the shield length calculator 28 performs a process of calculating a shield length L in which the feed hole 15d is shielded by the bonding tape 26c in the splicing operation. In other words, the shielding length L is calculated based on the number of feed holes when no feed hole detection signal is output from the feed hole detection unit 27 and the number of pitch feeds of the carrier tape 15. The calculated shielding length L is transmitted to the device control unit 25 via the communication unit 50.

  The apparatus control unit 25 monitors the shielding length L transmitted from the tape feeder 5, thereby performing a process of constantly monitoring the adequacy of the splicing operation of the carrier tape 15 in the tape feeder 5. That is, the transmitted shielding length L is compared with the specified allowable range set in advance for each type of the carrier tape 15 and stored in the storage unit 30 as the splicing tape length data 30b. Next, it is determined whether or not the number of times that the shielding length L has deviated from the specified allowable range has exceeded the specified number of times set in advance and stored in the storage unit 30 as the abnormality notification data 30c. If it is determined that the number of times of deviation from the prescribed allowable range exceeds the prescribed number of times, the operator is notified of this by displaying the number of times on the display unit 34.

  The recognition processing unit 32 performs recognition processing on the imaging results obtained by the component recognition camera 6 and the board recognition camera 10. Thereby, identification and position recognition of the electronic component 16 in the state held by the mounting head 9 and position recognition of the mounting point of the substrate 3 are performed, and the recognition result is transmitted to the apparatus control unit 25. The operation / input unit 33 is an input device such as a keyboard or a touch panel, and performs input operations such as operation commands and data input to the electronic component mounting apparatus 1. The display unit 34 is a display device such as a liquid crystal panel, and displays a guidance screen at the time of an input operation by the operation / input unit 33 and also displays an abnormality notification screen in the operating state of the device. This abnormality notification screen includes abnormality notification when the number of times that the length of the connecting tape (shielding length L) used for splicing described above deviates from the specified allowable range exceeds the specified number of times. Therefore, when it is determined that the number of times that the shielding length L has deviated from the specified allowable range exceeds the specified number, the display unit 34 functions as a notification unit that notifies that fact.

  Next, a feeder state monitoring method for monitoring the operating state of the tape feeder 5 in the electronic component mounting apparatus 1 will be described with reference to FIG. Here, a method is shown in which the adequacy of the splicing work repeatedly executed in each tape feeder 5 is monitored based on the detection result of the shielding length L described above.

  First, in the operating state of the electronic component mounting apparatus 1, the feed holes 15d formed at a predetermined pitch in the carrier tape 15 are detected in each tape feeder 5 on which the component supply unit 4 is mounted (feed hole detection step) (ST1). . That is, the inspection light is projected from the sensor 24 shown in FIG. 5, the detection signal is received by the transmission hole detection unit 27, and it is determined whether or not the transmission hole 15d is shielded by the bonding tape 26c. Is detected.

  Next, the shielding length calculation unit 28 calculates the shielding length L in which the feed hole 15d is shielded by the joining tape 26c in the splicing operation (shielding length calculation step) ( ST2). In this shielding length calculation step, the joint portion J by the spline operation is detected by comparing the calculated shielding length L with the reference value written in the memory of the feeder controller 18.

  The calculated shielding length L is transmitted to the device control unit 25 of the electronic component mounting device 1 (communication step) (ST3). In this communication process, the detection result of the joint portion J is transmitted to the device control unit 25 together with the shielding length L. Then, the transmitted shielding length L is set in advance for each type of the carrier tape 15 by the device control unit 25, and compared with the specified allowable range stored as the splicing tape length data 30b. The number of times of deviating from the specified allowable range is counted (ST4).

  Next, it is determined whether or not the counted number exceeds a predetermined number that is preset and stored as abnormality notification data 30c (determination step) (ST5). If the specified number of times has not been exceeded, the process returns to (ST4) to continue counting the number of times. In this determination step, if it is determined that the specified number of times has been exceeded, the notification unit notifies the fact (notification step) (ST6). That is, the device control unit 25 causes the display unit 34 to display the number of times exceeding the specified number. Then, a skilled worker who is called by confirming this display observes the work status in the apparatus and determines whether or not the splicing work is appropriate.

  As described above, the feeder state monitoring method in the electronic component mounting apparatus according to the present embodiment uses the detection result of the feed hole detection unit 27 as the shielding length L in which the feed hole 15d is shielded by the joining tape 26c in the splicing operation. The calculated shielding length L is compared with a prescribed allowable range set in advance for each type of the carrier tape 15, and the number of times that the shielding length L deviates from the prescribed allowable range is preset. It is determined whether or not the specified number of times has been exceeded, and if it is determined that the specified number of times has been exceeded, the notification unit notifies the fact.

  As a result, the following problems that occurred when an unskilled worker used a bonding tape with an irregular length due to inadequate management of the bonding tape used in splicing work in the conventional device. It can be effectively prevented. That is, in the case where a joining tape that is significantly different from the specified length is used in the conventional apparatus, the shielding length L is actually the carrier tape even though the splicing seam J passes through the tape feeder 5. As a result of deviating from the reference range set to, the joint portion J may not be detected. For this reason, in the method of managing the component usage history based on the detection result of the joint portion J, there is a problem that erroneous component usage history data is recorded.

  On the other hand, in the electronic component mounting apparatus 1 shown in the present embodiment, the calculated shielding length L is compared with a specified allowable range set in advance for each type of the carrier tape 15, and the shielding length L is calculated. Since it is determined whether or not the number of times of deviation from the specified allowable range exceeds a preset number of times set, and the fact that the splicing is appropriate is notified by notifying that, the resident worker is unskilled. Even in this case, it is possible to call an expert worker as necessary, accurately grasp the situation, and take appropriate measures. Therefore, in the component supply by the tape feeder that employs the splicing method, it is possible to effectively deal effectively with the problem caused by the detection method of the joint portion J.

  INDUSTRIAL APPLICABILITY The electronic component mounting apparatus and feeder state monitoring method in the electronic component mounting apparatus of the present invention are practically effective for problems caused by the seam portion detection method in component supply by a tape feeder that employs a splicing method. The present invention has an effect of being able to cope with the problem, and is useful for a component supply method for taking out a component from the tape feeder of the component supply unit and supplying the component to the mounting head.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Board | substrate 4 Component supply part 5 Tape feeder 9 Mounting head 12 Component mounting mechanism 15 Carrier tape 15d Feed hole 16 Electronic component 26a, 26b, 26c Joining tape L Shielding length

Claims (4)

The carrier tape holding the electronic components is mounted on a tape feeder arranged in the component supply unit, and the splicing operation is repeated in which the already-mounted carrier tape and the newly supplied carrier tape are joined by the joining tape in the tape feeder. An electronic component mounting apparatus for picking up the electronic component supplied to the pickup position by mounting it on a substrate by pitch-feeding the carrier tape while mounting it on a substrate,
The tape feeder is configured to detect a feed hole detecting unit that detects feed holes formed at a predetermined pitch on the carrier tape, and a shielding length in which the feed hole is shielded by a bonding tape in the splicing operation. A shielding length calculation unit that calculates based on a detection result of the unit, and a communication unit that transmits the calculated shielding length to a device control unit of the electronic component mounting apparatus,
The device control unit compares the transmitted shielding length with a specified allowable range set in advance for each type of the carrier tape, and the number of times the shielding length deviates from the specified allowable range is set in advance. Determine whether the specified number of times has been exceeded,
If it is determined that the prescribed number of times has been exceeded, the electronic component mounting apparatus is notified by a notification unit. The shielding length calculation unit detects a spliced portion by the splicing operation by comparing the calculated shielding length with a reference value,
2. The electronic component mounting apparatus according to claim 1, wherein the communication unit transmits a detection result of the joint portion together with the shielding length to the device control unit. The carrier tape holding the electronic components is mounted on a tape feeder arranged in the component supply unit, and the splicing operation is repeated in which the already-mounted carrier tape and the newly supplied carrier tape are joined by the joining tape in the tape feeder. In the electronic component mounting apparatus for picking up the electronic component supplied to the pickup position by pitching the carrier tape and mounting the electronic component on the substrate, the feeder state monitoring method monitors the operating state of the tape feeder. There,
In the tape feeder, a feed hole detection step for detecting feed holes formed at a predetermined pitch in the carrier tape;
A shielding length calculation step of calculating a shielding length in which the feed hole is shielded by the bonding tape in the splicing operation based on a detection result in the feed hole detection step;
A communication step of transmitting the calculated shielding length to a device control unit of the electronic component mounting device;
The device control unit compares the transmitted shielding length with a specified allowable range set in advance for each type of the carrier tape, and the number of times the shielding length deviates from the specified allowable range is set in advance. A determination step for determining whether or not the specified number of times has been exceeded;
A feeder state monitoring method in an electronic component mounting apparatus, comprising: a notifying step of notifying the fact by a notifying unit if it is determined that the prescribed number of times has been exceeded in the determining step. In the shielding length calculation unit step, by detecting the splicing operation by detecting the joint portion by comparing the calculated shielding length with a reference value,
The feeder state monitoring method in the electronic component mounting apparatus according to claim 3, wherein in the communication step, the detection result of the joint portion is transmitted to the device control unit together with the shielding length.

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