JPWO2015182482A1 - Pellicle mount device - Google Patents

Abstract

The pellicle film has a through hole that supports the pellicle film on one end surface side in the thickness direction and penetrates between the groove provided on the other end surface in the thickness direction and the outer peripheral surface and the wall surface of the groove. A pellicle including a pellicle frame, a master having a light irradiation surface irradiated with exposure light, a bonding chamber in which the pellicle is bonded, and the pellicle and the master in the bonding chamber include the pellicle frame A pellicle mount comprising: a bonding unit including an exhaust pipe for exhausting the inside of the groove through the through hole of the pellicle frame in a state where the other end surface and the light irradiation surface are arranged to face each other apparatus.

Description

  The present invention relates to a pellicle mount device.

High integration and miniaturization of semiconductor devices (semiconductor devices) are accelerating year by year.
For example, currently, a pattern with a line width of about 45 nm is formed by excimer exposure, but in recent years, with the further miniaturization of semiconductor devices, the formation of a pattern with a line width of 32 nm or less is required. Such microfabrication is difficult to handle with conventional excimer exposure. Therefore, it has been studied to change the exposure light to EUV (Extreme Ultra Violet) light having a shorter wavelength.

EUV light has the property of being easily absorbed by any substance.
Therefore, in photolithography using EUV light as exposure light (hereinafter also referred to as “EUV lithography”), exposure is performed using a reflective optical system. Specifically, the EUV light is reflected by an original (mask) reflecting the exposure pattern, and the resist is exposed by the EUV light as reflected light. At this time, if a foreign substance adheres to the original, the EUV light is absorbed by the foreign substance or the EUV light is scattered, so that a desired pattern may not be exposed.
Therefore, it is considered to protect the EUV light irradiation surface of the original plate with a pellicle, specifically, mounting (mounting) the pellicle on the EUV light irradiation surface side of the original plate.
The configuration of the pellicle includes a pellicle film for protecting the EUV light irradiation surface of the original plate, and a pellicle frame that supports the pellicle film.

  A pellicle film used for EUV lithography is required to have high transparency to EUV light and not to be decomposed or deformed by irradiation with EUV light. As a pellicle film satisfying such requirements, a silicon crystal film such as a single crystal silicon film (see, for example, References 1 and 2), an aluminum nitride film (see, for example, Reference 3) laminated on a metal mesh, a graphene film ( For example, refer to Document 4).

Literature 1: JP 2010-256434 A Literature 2: JP 2009-116284 A Literature 3: JP 2005-43895 A Literature 4: International Publication No. 2011/160861

Conventionally, when mounting (mounting) a pellicle including a pellicle film and a pellicle frame, including a pellicle for EUV lithography, to the original plate, that is, when the pellicle and the original plate are bonded together, the film surface of the pellicle film In some cases, contact may be made by an apparatus, a jig, a hand, or the like.
However, since the pellicle film has the property of being easily broken, careful handling is required for handling the pellicle film. Among the pellicle films, the pellicle film containing an inorganic material (for example, the pellicle film described in Documents 1 to 4) is not only a film that is not self-supporting, but also causes mechanical scratches and dust generation. Therefore, further attention is required for the handling.
Further, with the miniaturization of semiconductor devices, further attention is required to prevent foreign matters from adhering to the pellicle film.

  From the above viewpoint, when mounting the pellicle on the original by bonding the pellicle and the original, the two are attached to the film surface of the pellicle film so that the device, jig, hand, etc. are not in contact as much as possible. We examined a pellicle mount device to match.

This invention is made | formed in view of the above, and makes it a subject to achieve the following objectives.
That is, an object of the present invention is to provide a pellicle mounting apparatus that can bond a pellicle and an original plate together without attaching the pellicle to the original plate as much as possible. Is to provide.

Specific means for solving the above problems are as follows.
<1> A pellicle film and a through hole that supports the pellicle film on one end surface side in the thickness direction and penetrates between a groove and an outer peripheral surface provided on the other end surface in the thickness direction and the wall surface of the groove A bonding chamber in which bonding is performed between a pellicle including a pellicle frame having a hole and an original plate having a light irradiation surface irradiated with exposure light;
In the state where the pellicle and the original plate are disposed in the bonding chamber so that the other end surface of the pellicle frame and the light irradiation surface face each other, the inside of the groove is formed through the through hole of the pellicle frame. An exhaust pipe for exhausting;
A pellicle mount device comprising a bonding unit including:

<2> The pellicle mount device according to <1>, wherein the bonding unit includes an introduction tube for introducing a gas into the bonding chamber and pressurizing the bonding chamber.
<3> The introduction pipe includes a first introduction pipe that introduces a gas from a side of the original plate facing the pellicle and the pellicle disposed in the bonding chamber,
The bonding unit further includes:
The pellicle mount device according to <2>, including a gas dispersion member for dispersing the gas introduced from the first introduction pipe.
<4> The bonding unit includes a communication member that is connected to one end of the exhaust pipe in the bonding chamber and communicates the exhaust pipe and the through hole of the pellicle frame. 3> The pellicle mount device according to any one of 3>.
<5> The pellicle mount device according to <4>, wherein the communication member is provided so as to be movable in a direction in which an outer peripheral surface of the pellicle frame is pushed.
<6> The pellicle mount device according to <4> or <5>, wherein the communication member has an open end that can be inserted into the through hole.

<7> The laminating unit supports, in the laminating chamber, at least a part of a peripheral edge of the surface opposite to the light irradiation surface of the original and the outer peripheral surface of the original, The pellicle mount device according to any one of <1> to <6>, including an original plate support member that does not support the central portion of the surface.
<8> The original plate has an opening that exposes the light irradiation surface of the original plate, and supports at least a part of the peripheral end of the surface opposite to the light irradiation surface of the original plate and the outer peripheral surface of the original plate. And accommodated in an original case that does not support the central portion of the opposite surface and carried into the bonding chamber,
The pellicle mount device according to any one of <1> to <7>, wherein the bonding unit includes an original case support member that supports the original case containing the original in the bonding chamber.
<9> The pellicle mount device according to any one of <1> to <8>, further including an inspection unit that performs an appearance inspection of the pellicle and the original plate after the bonding.

<10> First measuring means for measuring the shape of the pellicle frame of the pellicle before being bonded to the original plate;
Second measuring means for measuring the shape of the pellicle frame of the pellicle after being bonded to the original plate;
The pellicle mount device according to any one of <1> to <9>, comprising:
<11> Alignment means for aligning the original plate and the pellicle before bonding the original plate and the pellicle;
Based on the measurement result of the shape of the pellicle frame before the pasting and the measurement result of the shape of the pellicle frame after the pasting, control means for feedforward controlling the alignment by the alignment means;
The pellicle mount device according to <10>, comprising:
<12> Based on the difference between the measurement result of the shape of the pellicle frame before the bonding and the measurement result of the shape of the pellicle frame after the bonding, the distortion amount of the pellicle frame due to the bonding is calculated. The pellicle mount device according to <10>, further comprising a calculation unit that performs the calculation.
<13> A direction in which the bonding unit is connected to one end of the exhaust pipe in the bonding chamber, communicates the exhaust pipe with the through-hole of the pellicle frame, and pushes the outer peripheral surface of the pellicle frame Including a communication member provided movably in the
The pellicle mount device according to <12>, wherein the calculation unit is a control unit that feed-forward-controls the amount of pushing of the pellicle frame by the communication member based on the amount of distortion.

  According to the present invention, there is provided a pellicle mount device capable of bonding the pellicle and the original plate together without attaching the pellicle to the original plate as much as possible when mounting the pellicle on the original plate. The

It is the schematic perspective view which looked at the example of the pellicle frame in this embodiment from the direction which can observe the end surface of the thickness direction. It is the schematic perspective view which looked at the pellicle frame shown in FIG. 1 from the direction which can observe the other end surface of thickness direction. It is the sectional view on the AA line of FIG. It is the schematic perspective view which looked at the modification of the pellicle frame in this embodiment from the direction which can observe the other end surface of thickness direction. It is a schematic sectional drawing which shows an example of the pellicle in this embodiment. It is a schematic block diagram which shows an example of the bonding unit in the pellicle mount apparatus of this embodiment. It is a schematic sectional drawing which shows an example of the bonding unit in the pellicle mount apparatus of this embodiment. In an example of this embodiment, it is a fragmentary sectional view which shows notionally one mode that one of exhaust pipes is connected to the penetration hole of a pellicle frame. In the modification of this embodiment, it is a fragmentary sectional view which shows notably a mode that one of the exhaust pipes is connected to the through-hole of a pellicle frame. In the modification of this embodiment, it is a schematic sectional drawing which shows the mechanism which supports the original plate in a bonding chamber. In the modification of this embodiment, it is a schematic sectional drawing which shows the mechanism which supports the original plate in a bonding chamber. In the modification of this embodiment, it is a schematic sectional drawing which shows the mechanism which supports the original plate in a bonding chamber. In the modification of this embodiment, it is a schematic sectional drawing which shows the mechanism which supports the original plate in a bonding chamber. It is a schematic process drawing which shows the flow of the bonding process in an example of this embodiment. It is a schematic process drawing which shows the flow of the bonding process in an example of this embodiment. It is a schematic process drawing which shows the flow of the bonding process in an example of this embodiment. It is a schematic process drawing which shows the flow of the bonding process in an example of this embodiment. It is a schematic block diagram which shows an example of the pellicle mount apparatus of this embodiment. It is a flowchart which shows an example of the mounting flow of the pellicle to the original plate by the pellicle mounting apparatus which concerns on an example of this embodiment. It is a schematic sectional drawing of an EUV exposure apparatus which is an example of the exposure apparatus provided with the exposure original plate manufactured by this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the present invention is not limited to a specific embodiment such as a drawing. In addition, elements common to the drawings may be denoted by the same reference numerals, and redundant description may be omitted. In the drawings, some hidden lines may be omitted in order to make the structure easy to see.

  The pellicle mount device according to the present embodiment includes a pellicle film, a groove and an outer peripheral surface that support the pellicle film on the one end surface side in the thickness direction and are provided on the other end surface in the thickness direction, and a wall surface of the groove A pellicle including a pellicle frame having a through-hole penetrating therethrough, a master having a light irradiation surface irradiated with exposure light, a bonding chamber in which bonding is performed, and the pellicle and the pellicle in the bonding chamber An exhaust pipe for exhausting the inside of the groove through the through hole of the pellicle frame in a state where the original plate is disposed so that the other end surface of the pellicle frame and the light irradiation surface are opposed to each other. Including a laminating unit.

The pellicle in this embodiment includes a pellicle film and a pellicle frame. This pellicle frame supports a pellicle film on one end surface side in the thickness direction. The pellicle frame has a groove provided on the other end surface in the thickness direction. Further, the pellicle frame has a through-hole penetrating between the outer peripheral surface and the wall surface of the groove.
In the bonding unit according to the present embodiment, the pellicle and the original plate are grooved through the through-hole of the pellicle frame by the exhaust pipe in a state where the other end surface of the pellicle frame and the light irradiation surface of the original plate face each other. The inside of is exhausted. Thereby, a pressing force can be exerted between the pellicle frame of the pellicle and the original plate. For this reason, both can be bonded together without making contact with the film surface of the pellicle film as much as possible (by an apparatus, jig, hand, etc.).
Therefore, according to the pellicle mounting apparatus of the present embodiment, when the pellicle and the original plate are bonded together and the pellicle is mounted (mounted) on the original plate, both can be bonded without contacting the film surface of the pellicle film as much as possible. The effect is played.
In the present embodiment, the “force for pressing” is synonymous with the force for attracting each other.

  In this specification, the resultant product obtained by bonding the pellicle and the original plate (that is, the original plate with the pellicle mounted) is also referred to as “original plate with pellicle” or “exposure original plate”. The pellicle mounting apparatus according to the present embodiment can also be referred to as a “manufacturing apparatus for an original plate with a pellicle” or an “exposure original plate manufacturing apparatus”.

  Furthermore, according to the pellicle mount apparatus of this embodiment, when the pellicle and the original plate are bonded together, it is possible to suppress adhesion of foreign matter to the pellicle film and tearing of the pellicle film due to contact with the pellicle film surface.

By the way, in recent years, with the miniaturization of semiconductor devices, there is an increasing demand for suppressing the adhesion of foreign matter to the pellicle.
Further, pattern formation with a line width of 32 nm or less is performed, for example, by EUV lithography. A pellicle film containing an inorganic material used for EUV lithography tends to be less likely to be self-supporting than a pellicle film containing an organic material, and is likely to cause scratches and dust generation even by mechanical contact. For this reason, when a pellicle including a pellicle film containing an inorganic material is mounted on the original plate, there is a great demand for mounting the pellicle without making contact with the film surface of the pellicle film as much as possible. Here, “self-supporting” indicates that the film shape can be maintained independently.
According to the pellicle mount apparatus of the present embodiment, it is possible to meet these demands accompanying the miniaturization of semiconductor devices.
Specifically, the pellicle mount apparatus according to the present embodiment is particularly suitable for lithography pellicles using exposure light having a short wavelength (for example, EUV light, light having a shorter wavelength than EUV light, etc.), especially inorganic materials. It is suitable for mounting (mounting) a pellicle having a pellicle film containing a system material on an original plate.

In this embodiment, EUV (Extreme Ultra Violet) light refers to light having a wavelength of 5 nm to 30 nm.
The wavelength of EUV light is preferably 5 nm to 13.5 nm.
In the present embodiment, EUV light and light having a shorter wavelength than EUV light are collectively referred to as “EUV light or the like”.

In the present embodiment, the “end surface in the thickness direction” of the pellicle frame may be simply referred to as “end surface”.
Further, in the present embodiment, “one end surface and the other end surface in the thickness direction” needless to say, one of the end surfaces in the thickness direction and the other of the end surfaces in the thickness direction, respectively.

Further, in this embodiment, the pellicle and the original plate are arranged in the bonding chamber so that the other end surface (end surface provided with the groove) of the pellicle frame and the light irradiation surface of the original plate face each other.
Here, the pellicle frame in the present embodiment is provided with the groove (that is, the groove leading to the through hole) not only on the other end surface (the surface facing the original plate) but also on one end surface (the surface facing the pellicle film). It may be done. That is, the pellicle frame in the present embodiment may have the groove (that is, a groove that communicates with the through hole) on both one end surface and the other end surface in the thickness direction.
The pellicle including the pellicle frame having the groove on both the one end surface and the other end surface in the thickness direction has an advantage that it can be manufactured without contacting the film surface of the pellicle film as much as possible. This is because the groove on the one end surface side that is the surface facing the pellicle film can be exhausted (depressurized) through the through hole. The detailed mechanism is the same as the mechanism when the pellicle and the original plate are bonded together.
In the specific example described later, a case where a pellicle including a pellicle frame having the groove on both one end surface and the other end surface in the thickness direction and an original plate are bonded together will be described. However, the groove may be provided on at least the other end surface (opposite surface of the original plate) of the pellicle frame.

In addition, the pellicle in the present embodiment may be composed only of a pellicle film and a pellicle frame, but may include other elements as necessary.
Other elements include an adhesive layer disposed so as to be in contact with the other end surface (opposite surface of the original plate) of the pellicle frame, an adhesive layer disposed between the pellicle film and the pellicle frame, and the pellicle film and the pellicle frame. And a support substrate that is disposed between and in contact with the pellicle film.

Further, the original plate (mask) in the present embodiment is not particularly limited as long as it has a light irradiation surface on which light is irradiated.
Here, as the original plate, for example, an original plate (mask) including a support substrate, a reflective layer laminated on the support substrate, and an absorber layer formed on the reflective layer can be used. In this original plate, the surface on which the reflection layer and the absorber layer are provided is the light irradiation surface. The absorber layer partially absorbs light such as EUV light, whereby a desired image is formed on the sensitive substrate (for example, a semiconductor substrate with a photoresist film). The reflective layer can be a multilayer film of molybdenum (Mo) and silicon (Si). The absorber layer can be a material having high absorbability such as EUV light, such as chromium (Cr) or tantalum nitride.

In this embodiment, it is preferable that the bonding unit further includes an introduction tube for introducing a gas into the bonding chamber and pressurizing the bonding chamber.
Since the inside of the bonding chamber can be pressurized by this introduction tube, the difference (differential pressure) between the pressure of the entire atmosphere in which the pellicle and the original plate are arranged and the pressure inside the groove can be increased. it can. For this reason, the pressing force generated between the pellicle and the original plate can be increased, and both can be bonded together more easily.

In the present embodiment, the introduction pipe includes the pellicle disposed in the bonding chamber and a first introduction pipe for introducing gas from a side of the original plate facing the pellicle, and the bonding More preferably, the unit further includes a gas dispersion member for dispersing the gas introduced from the first introduction pipe.
In this aspect, the influence on the pellicle membrane due to the gas flow introduced by the first introduction pipe is reduced.

  When the introduction pipe includes the first introduction pipe, the introduction pipe may include a second introduction pipe that is another introduction pipe other than the first introduction pipe in addition to the first introduction pipe.

In this embodiment, it is preferable that the bonding unit includes a communication member that is connected to one end of the exhaust pipe and communicates the exhaust pipe and the through hole of the pellicle frame in the bonding chamber.
Thereby, when exhausting the inside of the groove through the through-hole of the pellicle frame, the exhaust efficiency can be further improved.

The shape of the communication member may be any shape as long as the exhaust pipe and the through hole can communicate with each other.
Examples of the shape of the communicating member include a shape having an open end that contacts the outer peripheral surface of the pellicle frame, and the diameter of the open end is larger than the diameter of the through hole. In this case, it becomes easier to align the opening end of the communication member with the through hole.
In addition, examples of the shape of the communication member include a shape having an open end whose diameter is smaller than the diameter of the through hole. In this case, since the open end can be inserted into the through hole, the open end of the communicating member and the through hole can be more securely connected.

As described above, examples of the shape of the communication member include a shape having an open end that can be inserted into the through hole of the pellicle frame. In this case, the open end of the communication member and the through hole can be more securely connected.
As an example in this case, the through hole of the pellicle frame has a tapered shape whose diameter increases toward the outer peripheral surface of the pellicle frame, and the communication member has a tapered shape that can be inserted into the tapered through hole. An example having an open end is given.

Moreover, it is preferable that the said communication member is provided so that a movement in the direction which pushes in the outer peripheral surface of the said pellicle frame is possible.
Thereby, a communicating member and a pellicle frame can be connected more firmly. Furthermore, even if the pellicle frame is distorted and deformed in the exhaust direction by exhausting the inside of the groove through the through-hole of the pellicle frame, the pellicle frame is pushed in advance by the communication member. Can be suppressed (corrected).
In this case, needless to say, the communication member may be provided not only in the direction in which the outer peripheral surface of the pellicle frame is pushed in but also in the opposite direction (return direction; that is, a method of moving away from the outer peripheral surface).

Further, in the present embodiment, the bonding unit supports at least a part of a peripheral end portion of the surface opposite to the light irradiation surface of the original plate and an outer peripheral surface of the original plate in the bonding chamber, It is preferable to include an original plate support member that does not support the central portion of the opposite surface.
In this aspect, the original plate and the pellicle can be bonded so as not to contact the central portion of the surface opposite to the light irradiation surface of the original plate.
The peripheral end of the opposite surface is preferably a region within 5 mm (more preferably within 3 mm) from the peripheral end of the opposite surface.

In the present specification, the light irradiation surface of the original plate may be referred to as the “front surface” of the original plate.
In the present specification, the surface opposite to the light irradiation surface of the original plate may be referred to as the “back surface” of the original plate.

The aspect in which the laminating unit includes the original support member is particularly suitable when the original is an EUV original (EUV mask) used for EUV lithography.
That is, in the EUV exposure apparatus used for EUV lithography, when the original is fixed in the exposure apparatus, unlike the conventional chuck system, the back of the original is fixed so as to be in direct contact with the mask stage by the electrostatic chuck system. The For this reason, the present inventors have found that when a foreign substance adheres to the central portion of the back surface of the original plate, the unevenness of the foreign matter impairs the flatness of the original plate and makes normal exposure impossible.
In contrast to this phenomenon, in the aspect in which the laminating unit includes the above-described original plate supporting member, the original plate and the pellicle can be bonded together without contacting the central portion on the back surface of the original plate. Adherence of foreign matter is suppressed.

Further, in the present embodiment, the original plate has an opening for exposing the light irradiation surface of the original plate, and at least a peripheral end portion of a surface opposite to the light irradiation surface of the original plate and an outer peripheral surface of the original plate. Supporting a part, it is accommodated in the original case that does not support the central part of the opposite surface and is carried into the bonding chamber,
Preferably, the bonding unit includes an original case support member that supports the original case containing the original in the bonding chamber.
Also in this aspect, the same effect as the aspect in which the bonding unit includes the original plate support member is exhibited. The preferable range of the central portion and the preferable range of the peripheral end portion in this aspect are the same as the preferable range of the central portion and the preferable range of the peripheral end portion in the aspect in which the bonding unit includes the original support member, respectively.

A part of a known mask case can be used as the original case.
For example, EUV pods etc. are mentioned as a well-known mask case.
A part of the mask case that can be used as the original plate case includes a cover member of an inner pod that includes a base plate and a cover member.
For the EUV pod, inner pod, cover member and the like, for example, International Publication No. 2013/186929 pamphlet can be referred to as appropriate.

It is preferable that the pellicle mount device of the present embodiment further includes an inspection unit that performs an appearance inspection of the pellicle and the original plate after the bonding.
Examples of the appearance inspection include inspection of foreign matter attached to at least one of the pellicle and the original plate, measurement of the shape of the pellicle frame, measurement of misalignment between the pellicle frame and the original plate, and the like.
Note that “alignment” between the pellicle frame and the original plate can also be referred to as “superposition”.

The pellicle mounting apparatus according to the present embodiment includes a first measuring unit that measures a shape of the pellicle frame of the pellicle before being bonded to the original plate, and a shape of the pellicle frame of the pellicle after being bonded to the original plate. And a second measuring means for measuring.
In this aspect, it is possible to examine the presence / absence of the deformation of the pellicle frame and the amount of deformation due to the bonding (particularly, exhaust inside the groove of the pellicle frame).

When the pellicle mount apparatus according to the present embodiment includes the first measurement unit and the second measurement unit, the pellicle mount apparatus according to the present embodiment aligns the original and the pellicle before bonding the original and the pellicle. And a control for feedforward control of alignment by the alignment means based on the measurement result of the shape of the pellicle frame before bonding and the measurement result of the shape of the pellicle frame after bonding And means.
In this aspect, the control means allows for the deformation of the pellicle frame due to the bonding, and the alignment deviation (positioning deviation) due to the deformation is reduced in advance by the alignment means in advance. Be controlled).
In this aspect, the control means may be omitted, and the alignment adjustment by the alignment means may be performed manually.

When the pellicle mount device of the present embodiment includes the first measurement unit and the second measurement unit, the pellicle mount device of the present embodiment can measure the shape of the pellicle frame before the pasting and the pasted result of the pasting. It is preferable that a calculation unit that calculates a distortion amount of the pellicle frame due to the pasting based on a difference from a measurement result of the shape of the pellicle frame is provided.
In this aspect, the amount of distortion of the pellicle frame due to bonding (for example, the amount of distortion of the pellicle frame due to exhaust of the groove through the through hole) is anticipated by the calculation means, and the amount of pushing of the pellicle frame by the communication member is determined in advance Control can be performed so that the distortion of the frame is reduced (preferably minimized).

When the pellicle mount apparatus according to the present embodiment includes the calculation unit, the pellicle mount apparatus according to the present embodiment is configured such that the bonding unit is connected to one end of the exhaust pipe in the bonding chamber, A communication member that communicates with the through-hole of the pellicle frame and is movable in a direction to push in the outer peripheral surface of the pellicle frame, and the calculation means uses the communication member based on the amount of distortion. It is preferable that the control unit performs feedforward control on the amount of pushing of the pellicle frame.
In this aspect, the calculation means can control not only the distortion amount but also the push amount of the pellicle frame.

<Specific example>
Next, an example of this embodiment will be described with reference to FIGS. 1 to 20, but the present invention is not limited to the following example.

(Specific example of pellicle frame)
1 and 2 are schematic perspective views showing an example of a pellicle frame of a pellicle that is one of objects to be bonded in the pellicle mount apparatus of the present embodiment.
FIG. 1 is a schematic perspective view seen from a direction in which one end face in the thickness direction of a pellicle frame according to an example can be observed. FIG. 2 is a schematic perspective view seen from a direction in which the other end face in the thickness direction of the same pellicle frame can be observed. FIG.
FIG. 3 is a partial cross-sectional view of the pellicle frame according to the above example, and in detail, is a cross-sectional view taken along line AA of FIG.

As shown in FIGS. 1 and 2, the shape of the pellicle frame 100 is a rectangular frame shape. When the pellicle frame 100 is a member of the pellicle, the exposure light passes through the opening 50 surrounded by the pellicle frame 100.
The outer shape of the pellicle frame 100 is determined by one end surface 10 in the thickness direction of the pellicle frame 100, the other end surface 20, an outer peripheral surface 30 composed of four surfaces, and an inner peripheral surface 40 composed of four surfaces.
The shape viewed from the thickness direction of the pellicle frame 100 is a rectangular shape as described above, but the shape viewed from the thickness direction of the pellicle frame of the present embodiment is not limited to a rectangular shape, and is a shape other than a rectangular shape. (For example, a trapezoidal shape, a shape having a protrusion on the outer side of the frame, etc.) may be used.

As shown in FIGS. 1 and 3, the one end face 10 is provided with a groove 12.
In this embodiment, the shape of the groove 12 viewed from the thickness direction of the pellicle frame 100 is an endless shape that goes around the shape of the pellicle frame 100.
A modification of the shape of the groove viewed from the thickness direction of the pellicle frame will be described later.

The pellicle frame 100 has a through hole 14A and a through hole 14B.
The through hole 14A and the through hole 14B penetrate between the bottom surface of the groove 12 and the outer peripheral surface 30, respectively.

Here, each of the through holes 14 </ b> A and 14 </ b> B may penetrate between the side surface of the groove 12 and the outer peripheral surface 30.
Further, either one of the through holes 14A and 14B may be omitted. That is, in the pellicle frame 100, two through holes (through holes 14A and 14B) are connected to one groove (groove 12), but this embodiment is not limited to this mode. In the present embodiment, it is only necessary that at least one through hole is connected to one groove (groove 12, groove 22).

Further, as shown in FIGS. 2 and 3, a groove 22 is provided on the other end surface 20 opposite to the one end surface 10.
In this embodiment, the shape of the groove 22 is also an endless shape that goes around the shape of the pellicle frame 100 when viewed from the thickness direction, similarly to the shape of the groove 12.

The pellicle frame 100 has a through hole 24A and a through hole 24B.
The through hole 24 </ b> A and the through hole 24 </ b> B penetrate between the bottom surface of the groove 22 and the outer peripheral surface 30.
The variations of the through holes 24A and 24B are the same as the variations of the through holes 14A and 14B.

  The pellicle frame 100 described above supports the pellicle film on the one end face 10 side or the other end face 20 side. That is, the above-described pellicle frame 100 is one of the constituent members of the pellicle according to an example of this embodiment.

In the following, the case where the pellicle film is supported on the one end face 10 side of the pellicle frame 100 will be mainly described. In this case, the other end surface 20 of the pellicle frame 100 is a surface facing the original plate.
However, the pellicle frame in the present embodiment only needs to be provided with a groove on at least the end surface facing the original plate. Therefore, contrary to the above case, the pellicle film is formed on the other end surface 20 side of the pellicle frame 100. The one end surface 10 of the pellicle frame 100 may be a surface facing the original plate.
Further, the groove on the end surface on the side where the pellicle film is supported and the through hole leading to the groove may be omitted. That is, any one of the combination of the groove 12, the through hole 14A, and the through hole 14B, and the combination of the groove 22, the through hole 24A, and the through hole 24B, on the side where the pellicle film is supported. Combinations related to the end faces may be omitted.

Hereinafter, a case where a pellicle (for example, a pellicle 201 and a pellicle 200 described later) in which a pellicle film is supported on the one end face 10 side of the pellicle frame 100 is mounted on the original plate will be described.
In the pellicle frame 100, a groove 22 is provided on the other end surface 20 which is a surface facing the original plate, and through holes 24A and 24B connected to the groove 22 are provided. For this reason, when the master is fixed to the other end face 20, the pressure between the pellicle frame 100 and the master is reduced by reducing the pressure inside the groove 22 through the through holes 24A and 24B (for example, by exhaust means such as a vacuum pump). Can be depressurized. By this pressure reduction, a pressing force can be exerted between the pellicle frame 100 and the original plate, so that the pellicle and the original plate can be bonded together without contacting the film surface of the pellicle film as much as possible.

Further, a pellicle (for example, a pellicle 201 and a pellicle 200 described later) in which a pellicle film is supported on the one end surface 10 side of the pellicle frame 100 is provided with a groove not only on the other end surface 20 but also on the one end surface 10. Therefore, there is an advantage that it can be manufactured without contacting the pellicle film as much as possible based on the same principle as when the pellicle and the original plate are bonded together.
Further, since the pellicle frame 100 has grooves (grooves 12 and 22) on both the one end face 10 and the other end face 20, it has an advantage that the selection range of the end face to be bonded to the pellicle film and the original plate is wide. .

The dimension of the pellicle frame 100 can be set to the following dimensions, for example.
The length L1 in the long side direction of the pellicle frame 100 can be set to, for example, 135 mm to 153 mm, preferably 140 mm to 152 mm, and more preferably 145 mm to 151 mm.
The length L2 of the pellicle frame 100 in the short side direction can be set to, for example, 100 mm to 130 mm, preferably 105 mm to 125 mm, and more preferably 110 mm to 120 mm.
The length L1 in the long side direction and the length L2 in the short side direction may be the same dimension. That is, the shape of the pellicle frame 100 may be a square shape.
The frame width (frame width) W of the pellicle frame 100 can be, for example, 1.0 mm to 5.0 mm, preferably 1.2 mm to 3.5 mm, and more preferably 1.5 mm to 2.5 mm. The frame width may be the same or different for the four sides of the rectangular pellicle frame 100.
Moreover, the length of the long side direction of the opening part 50 enclosed by the pellicle frame 100 can be 130 mm-152 mm, for example, 135 mm-151 mm are preferable, and 140 mm-150 mm are more preferable.
Moreover, the width | variety of the opening part 50 can be 95 mm-130 mm, for example, 100 mm-125 mm are preferable, and 105 mm-120 mm are more preferable.
The thickness t of the pellicle frame can be, for example, 0.5 mm to 5.0 mm, preferably 0.5 mm to 3.0 mm, and more preferably 0.5 mm to 2.0 mm.

The width of the groove 12 and the groove 22 can be appropriately set in consideration of the pressure loss reduction in the groove, the relationship with the frame width of the pellicle frame, etc., but can be set to, for example, 10 μm to 1.0 mm, 50 μm ˜700 μm is preferable, 100 μm to 600 μm is more preferable, and 200 μm to 500 μm is particularly preferable.
Further, the depth of the groove 12 and the groove 22 can be appropriately set in consideration of the pressure loss reduction in the groove, the relationship with the thickness of the pellicle frame, etc., but can be set to 10 μm to 1.0 mm, for example, 50 μm ˜700 μm is preferable, 100 μm to 600 μm is more preferable, and 200 μm to 500 μm is particularly preferable.

The widths of the through holes 14A, 14B, 24A, and 24B can be appropriately set in consideration of the pressure loss reduction at the through holes, the relationship with the thickness of the pellicle frame, and the like, for example, 10 μm to 1.0 mm. 50 μm to 700 μm are preferable, 100 μm to 600 μm are more preferable, and 200 μm to 500 μm are particularly preferable.
In addition, the lengths of the through holes 14A, 14B, 24A, and 24B can be appropriately set in consideration of pressure loss reduction in the through holes, etc., but can be set to 0.5 mm to 10 mm, for example, 0.7 mm ˜5.0 mm is preferable, and 1.0 mm to 2.0 mm is more preferable.
Here, the width of the through hole refers to the flow path width of the flow path formed of the through hole (or the diameter when the cross section of the through hole is circular), and the length of the through hole refers to the flow of the through hole. Refers to the length of the channel.

The material of the pellicle frame 100 is not particularly limited, and can be a normal material used for the pellicle frame.
Specific examples of the material of the pellicle frame 100 include aluminum, aluminum alloys (5000 series, 6000 series, 7000 series, etc.), stainless steel, silicon, silicon alloys, iron, iron alloys, carbon steel, tool steel, ceramics, and metal. -Ceramic composite materials, resins and the like. Among these, aluminum and aluminum alloys are more preferable from the viewpoint of light weight and rigidity.

The pellicle frame 100 may have a protective film on the surface thereof.
As the protective film, a protective film having resistance to hydrogen radicals and EUV light present in the exposure atmosphere is preferable.
An example of the protective film is an oxide film.
The oxide film can be formed by a known method such as anodic oxidation.
The oxide film may be colored with a black dye. When the pellicle frame 100 has an oxide film colored with a black dye, the detection of foreign matter on the pellicle frame 100 becomes easier.
In addition, for other configurations of the pellicle frame 100, for example, configurations of known pellicle frames such as JP2014-021217A and JP2010-146027A can be referred to as appropriate.

Next, a modified example of the pellicle frame will be described.
In the pellicle frame 100 shown in FIGS. 1 to 3, one groove is provided for one end face. However, in the present embodiment, two or more grooves may be provided for one end face. When two or more grooves are provided for one end face, the through hole is preferably connected to each of the two or more grooves (see, for example, FIG. 4).
Further, when the pellicle frame has a rectangular shape, it is preferable that grooves be present on the four sides of the pellicle frame from the viewpoint of more effectively exerting a pressing force between the pellicle frame and another member.
Here, in the aspect that “grooves exist on the four sides of the pellicle frame”, for example,
A mode in which one groove is provided over the four sides of the pellicle frame (for example, see FIGS. 1 and 2),
A mode in which one or more grooves are provided for each of the four sides of the pellicle frame (for example, see FIG. 4),
A mode in which one groove extending over two sides of the pellicle frame is provided and one groove extending over the remaining two sides is provided,
Etc. are included.

FIG. 4 is a schematic perspective view of a pellicle frame 101 according to a modification of the present embodiment as viewed from a direction in which the other end surface in the thickness direction can be observed.
As shown in FIG. 4, the other end surface 20 of the pellicle frame 101 is provided with four grooves, that is, grooves 22A, 22B, 22C, and 22D. The pellicle frame 101 is provided with through holes 26A, 26B, 26C, and 26D that pass through between the bottom surfaces of the grooves 22A, 22B, 22C, and 22D and the outer peripheral surface 30, respectively.
In the pellicle frame 101, each groove has a shape that extends over two sides centering on a corner portion of the pellicle frame 101 and has an end part in the middle of the two sides. However, the shape of the groove of this embodiment may be any.
In the pellicle frame 101, a through hole is connected to one end of each groove. However, in this embodiment, the position of the through hole connected to the groove may be any part. In short, the through hole only needs to penetrate between the wall surface of the groove and the outer peripheral surface of the pellicle frame.

Although not shown in FIG. 4, a groove is provided on one end surface of the pellicle frame 101, similarly to the one end surface 10 of the pellicle frame 100, and the wall surface and outer peripheral surface of the groove on the one end surface side are further provided. And a through hole is provided. However, the shape of the groove on the one end surface side of the pellicle frame 101 may be the same shape as the shape of the groove on the other end surface side of the pellicle frame 101.
In the pellicle frame 101, configurations other than those described above are the same as the configuration of the pellicle frame 100, and a preferable range is also the same.

(Specific example of pellicle)
FIG. 5 is a schematic cross-sectional view showing an example of a pellicle used in the pellicle mount device of this embodiment.
As shown in FIG. 5, the pellicle 201 includes a pellicle film 130 and the pellicle frame 100 described above. In the pellicle 201, the pellicle frame 100 supports the pellicle film 130 on the one end face 10 side in the thickness direction. The pellicle frame 100 has at least a groove 22 provided on the other end surface 20 in the thickness direction, and through holes 24A and 24B penetrating between the outer peripheral surface 30 and the wall surface of the groove 22. Further, a groove 12 is provided on one end surface 10 in the thickness direction of the pellicle frame 100, and further, through holes 14A and 14B) penetrating between the wall surface of the groove 12 and the outer peripheral surface 30 are provided. ing.

The configuration of the pellicle 201 is a configuration in which the pellicle frame member 110 including the pellicle frame 100 and the pellicle film member 120 including the pellicle film 130 are bonded together.
Here, the pellicle frame member 110 includes the pellicle frame 100 described above, an adhesive layer 102 in contact with one end surface 10 of the pellicle frame 100, an adhesive layer 104 in contact with the other end surface 20 of the pellicle frame 100, and an adhesive. A release liner 106 in contact with the layer 104.
On the other hand, the pellicle film member 120 includes a pellicle film 130 and a support substrate 122 that supports the pellicle film 130.
In the pellicle 201, the pellicle frame member 110 and the pellicle film member 120 are bonded together so that the support substrate 122 and the adhesive layer 102 are in contact with each other. The pellicle 201 having such a structure can be manufactured without contacting the pellicle film 130 as much as possible by evacuating (depressurizing) the inside of the groove 12 through the through holes 14A and 14B.

In the pellicle 201, the material of the pellicle film 130 is not particularly limited, and may be an organic material, an inorganic material, or a mixed material of an organic material and an inorganic material.
Examples of the organic material include a fluorine-based polymer.
Examples of the inorganic material include crystalline silicon (eg, single crystal silicon, polycrystalline silicon, etc.), diamond-like carbon (DLC), graphite, amorphous carbon, graphene, silicon carbide, silicon nitride, aluminum nitride, and the like.
The pellicle film 130 may contain one of the above materials alone or two or more of them.

The configuration of the pellicle film 130 may be a single layer configuration or a configuration including two or more layers.
The thickness of the pellicle film (total thickness in the case of two or more layers) can be, for example, 10 nm to 200 nm, preferably 10 nm to 100 nm, more preferably 10 nm to 70 nm, and particularly preferably 10 to 50 nm.

The support substrate 122 is a member for supporting the pellicle film 130.
Similar to the pellicle frame 100, the support substrate 122 is a frame-shaped member. That is, the support substrate 122 is a substrate having a rectangular opening at the center.
The shape and size of the opening of the support substrate 122 are substantially the same as the shape and size of the opening 50 surrounded by the pellicle frame 100 described above.
However, the size of the opening of the support substrate 122 and the size of the opening 50 do not have to be completely the same. For example, the size of the opening of the support substrate 122 may be smaller than the size of the opening 50. Then, the size of the opening of the support substrate 122 may be larger than the size of the opening 50. However, the difference in length of one side of the opening is preferably within 2 mm (preferably within 1 mm).

  Examples of the material of the support substrate 122 include aluminum, aluminum alloys (5000 series, 6000 series, 7000 series, etc.), stainless steel, silicon, silicon alloys, iron, iron alloys, carbon steel, tool steel, ceramics, and metal-ceramic composites. Examples thereof include materials and resins. Of these, silicon and silicon alloys are preferable.

  The thickness of the support substrate 122 can be, for example, 0.03 to 5.0 mm, preferably 0.05 to 3.0 mm, more preferably 0.15 to 2.0 mm, and 0.3 mm to 1.0 mm. Is particularly preferred.

In the pellicle 201, the pellicle film 130 is supported by the support substrate 122 described above.
Even if the pellicle film member of this aspect is a film in which the pellicle film is difficult to stand on its own (for example, a pellicle film containing an inorganic material such as a silicon crystal film, a thin pellicle film, etc.), This has the advantage that the pellicle can be manufactured while maintaining the film shape of the pellicle film.

The pellicle film member 120 including the support substrate 122 and the pellicle film 130 is, for example, first on a silicon wafer (for example, an 8-inch silicon wafer) as a material of the support substrate 122 (a support substrate before an opening is provided). Next, a silicon crystal film is formed as the pellicle film 130, and then the silicon wafer is etched from the silicon crystal non-formation surface side of the silicon wafer to remove the silicon wafer at the center to open the opening. Can be produced. When manufacturing the pellicle 201, an excess portion of the silicon wafer (an excess portion protruding from the outer periphery of the pellicle frame 100) is cut (removed) during the manufacturing stage of the pellicle 201.
As the pellicle film 130, in addition to the silicon crystal film, other films such as a laminated film having a structure of silicon nitride film / silicon crystal film / silicon nitride film can also be used. Further, as the support substrate 122, other substrates other than the silicon wafer can be used.
Even when other materials (film, substrate) are used, the pellicle film member can be produced by the same method as described above.

In the pellicle 201, the adhesive layer 102 is a layer that bonds the support substrate 122 and the pellicle frame 100, and includes an adhesive.
In this embodiment, “adhesive” refers to an adhesive in a broad sense, and the concept of “adhesive” includes an adhesive.
As an adhesive contained in the adhesive layer 102, an acrylic resin adhesive, an epoxy resin adhesive, a polyimide resin adhesive, a silicone resin adhesive, an inorganic adhesive, a double-sided adhesive tape, a silicone resin adhesive, an acrylic adhesive And polyolefin pressure-sensitive adhesives.
Among these, acrylic resin adhesives, epoxy resin adhesives, polyimide resin adhesives, silicone resin adhesives, and inorganic adhesives are preferable.
Although there is no restriction | limiting in particular in the thickness of the adhesive bond layer 102, 1 micrometer-500 micrometers are preferable, 10 micrometers-400 micrometers are more preferable, and 20 micrometers-300 micrometers are especially preferable.

In the pellicle 201, the adhesive layer 104 is a layer for bonding the original and the pellicle frame 100 when the pellicle is attached to the original by the pellicle mounting device of the present embodiment (that is, bonding the pellicle and the original). Yes, including adhesive.
Examples of the adhesive contained in the adhesive layer 104 include the same adhesives as those contained in the adhesive layer 102. Among them, double-sided pressure-sensitive adhesive tapes, silicone resin pressure-sensitive adhesives, acrylic pressure-sensitive adhesives, and polyolefin-based pressure-sensitive adhesives. Is preferred.
Although there is no restriction | limiting in particular in the thickness of the adhesive bond layer 104, 1 micrometer-500 micrometers are preferable, 10 micrometers-400 micrometers are more preferable, and 20 micrometers-300 micrometers are especially preferable.

In the pellicle 201, the adhesive layer 104 is provided on a portion other than the groove 22 on the other end surface 20 of the pellicle frame 100. As a result, the exhaust of the groove 22 through the through holes 24A and 24B can be efficiently performed.
Similarly, the above-described adhesive layer 102 is provided in a portion other than the groove 12 in the one end face 10 of the pellicle frame 100.

The release liner 106 is used to prevent foreign matter from adhering to the adhesive layer 104 before the pellicle is attached to the original plate (that is, before bonding the pellicle and the original plate) by the pellicle mount device of the present embodiment. It is a member.
The release liner 106 is removed (peeled) from the pellicle 201 before the pellicle is attached to the original. A pellicle 200 (FIG. 6 and the like) described later is a pellicle obtained by removing the release liner 106 from the pellicle 201.
The removal of the release liner 106 from the pellicle 201 may be performed in the pellicle mount apparatus of the present embodiment, or may be performed in advance outside the pellicle mount apparatus of the present embodiment.

The release liner is a member also called a release film or a separator.
As the release liner, a known one such as a PET (polyethylene terephthalate) film having a release layer such as a silicone compound can be used without particular limitation.
In the pellicle 201, the shape of the release liner 106 viewed from the thickness direction is a shape extending over the pellicle frame 100 and the opening 50 (an opening surrounded by the pellicle frame 100), that is, a flat plate shape having no opening. . However, the release liner 106 may have any shape. The release liner may be a frame-shaped member (a member having an opening) that contacts only the surface of the adhesive layer 104. Further, the release liner may be a member larger than the pellicle frame 100, for example, a member having a size that protrudes outside the pellicle frame 100 when viewed from the thickness direction of the pellicle frame 100. .

  Although there is no restriction | limiting in particular in the thickness of the release liner 106, 5 micrometers-500 micrometers are preferable, 10 micrometers-400 micrometers are more preferable, and 20 micrometers-300 micrometers are especially preferable.

In the pellicle 201, the preferable range of the thickness of each member is as described above.
The thickness of each member is preferably adjusted so that the total thickness of the pellicle 200 is 5.0 mm or less (more preferably 3.0 μm or less, more preferably 2.0 mm or less).

  At least one of the constituent members of the pellicle 201 (excluding the release liner 106) may be formed with an alignment mark for improving alignment (positioning) accuracy with the original.

(Specific example of the bonding unit)
6 and 7 are schematic configuration diagrams showing an example of a bonding unit in the pellicle mount device of the present embodiment. The bonding unit is a unit that functions as a pellicle mount device as a single unit.
FIG. 6 is a schematic cross-sectional view focusing on the state in which the pellicle and the original plate are bonded in the bonding chamber of the bonding unit. In FIG. 6, the detailed configuration in the bonding chamber is not shown.
FIG. 7 is a schematic cross-sectional view focusing on the detailed configuration in the bonding chamber and the state in which the pellicle film member is carried into the bonding chamber. In FIG. 7, the detailed configuration of the pellicle is not shown.

As shown in FIG. 6, the pellicle 200 and the original plate 250 are disposed in the bonding chamber 310 of the bonding unit 300.
Here, the pellicle 200 is obtained by removing the release liner 106 from the pellicle 201 described above. The removal of the release liner 106 from the pellicle 201 may be performed in the pellicle mount apparatus of the present embodiment, or may be performed in advance outside the pellicle mount apparatus of the present embodiment.

The original 250 has a front surface 252 (a surface irradiated with exposure light; a light irradiation surface) and a back surface 254 (a surface opposite to the front surface 252).
As the original 250, for example, an EUV original (EUV mask) including a support substrate, a reflective layer laminated on the support substrate, and an absorber layer formed on the reflective layer is used. In this original plate, the surface on which the reflection layer and the absorber layer are provided is the front surface 252 (light irradiation surface). The surface opposite to the front surface 252 (the surface of the support substrate) is the back surface 254. In this example, the absorber layer partially absorbs EUV light, whereby a desired image is formed on a sensitive substrate (for example, a semiconductor substrate with a photoresist film). The reflective layer can be a multilayer film of molybdenum (Mo) and silicon (Si). The absorber layer can be a material having high absorbability such as EUV light, such as chromium (Cr) or tantalum nitride.

In the bonding chamber 310, the pellicle 200 and the original plate 250 are arranged such that the adhesive layer 104 of the pellicle 200 and the front surface 252 of the original plate 250 face each other.
A groove 22 is provided on the end surface (the other end surface 20) of the pellicle 200 that faces the original plate 250 of the pellicle frame 100. The adhesive layer 104 is provided on a portion other than the groove 22 on the other end surface 20 of the pellicle frame 100.
In the bonding chamber 310, the exhaust pipe (not shown in FIG. 6; exhaust pipes 312A and 312B in FIG. 7) exhausts (depressurizes) the groove 22 through the through hole 24B (arrow E2), and Exhaust (reduced pressure) inside the groove 22 is performed through the through hole 24A (arrow E1). By these exhausts (reduced pressure), an attractive force F (that is, a pressing force) between the pellicle 200 and the original plate 250 can be exerted. By the action of this force F, the two can be bonded together without contacting the pellicle film 130 as much as possible.
At this time, it is preferable to pressurize the inside of the bonding chamber 310 by introducing a gas into the bonding chamber 310 using an introduction pipe (not shown). Thereby, since the difference (differential pressure) between the pressure of the atmosphere inside the bonding chamber 310 in which the pellicle 200 and the original plate 250 are arranged and the pressure inside the groove 22 can be further increased, the force F Can work more effectively.

The force F (force applied to the entire pellicle frame) is preferably 1N or more, and more preferably 2N or more.
The force F (force applied to the entire pellicle frame) is more preferably 10N or more, and particularly preferably 20N or more.
The upper limit of the force F (force applied to the entire pellicle frame) is not particularly limited, but is, for example, 500 N, preferably 400 N from the viewpoint of productivity.

Next, the configuration of the bonding unit 300 will be described with reference to FIG.
As shown in FIG. 7, the bonding unit 300 includes a bonding chamber 310, a first introduction pipe 322 and a second introduction pipe for introducing gas into the bonding chamber 310 and pressurizing the inside of the bonding chamber 310. 326 and exhaust pipes 312A and 312B for exhausting the inside of the groove 22 through the through holes 24A and 24B of the pellicle frame 100 of the pellicle 200.

Here, when the pellicle 200 and the original plate 250 are disposed in the bonding chamber 310, the first introduction tube 322 is from the side facing the pellicle 200 (pellicle film 130) (in this example, from the upper surface of the bonding chamber 310). ) It is arranged at a position where gas can be introduced. The bonding unit 300 may include a plurality of first introduction pipes 322.
On the other hand, when the pellicle 200 and the original plate 250 are disposed in the bonding chamber 310, the second introduction pipe 326 is disposed below the original plate 250 and at a position where gas can be introduced from the side surface of the bonding chamber 310. . The second introduction pipe 326 is not limited to this position, and can be provided at any position where gas can be introduced into the bonding chamber 310. Further, the bonding unit 300 may include a plurality of second introduction pipes 326.

The other ends of the first introduction pipe 322 and the second introduction pipe 326 can be connected to gas supply means such as a cylinder (via other pipes if necessary).
In addition, a valve (not shown) for switching whether to introduce gas may be provided in the middle of the first introduction pipe 322 and the second introduction pipe 326. This valve may be an adjusting valve provided with a mechanism for adjusting the gas flow rate or the like.
The gas supplied through the first introduction pipe 322 and the second introduction pipe 326 is not particularly limited. For example, dry air, inert gas, or the like can be used.

  Each of the exhaust pipes 312A and 312B can be connected to the through-hole of the pellicle frame of the pellicle 200 via a communication member connected to one end.

FIG. 8 is a partial cross-sectional view conceptually showing how the exhaust pipe 312B, which is one of the exhaust pipes in FIG. 7, is connected to the through-hole of the pellicle frame.
As shown in FIG. 8, a communication member 314 that connects the through hole 24B of the pellicle frame 100 and the exhaust pipe 312B is connected to one end of the exhaust pipe 312B. When the bonding unit 300 includes the communication member 314, the exhaust efficiency is further improved when the inside of the groove 22 through the through hole 24B is exhausted. The communication member 314 is not necessarily a member independent of the exhaust pipe 312B. That is, the exhaust pipe 312B and the communication member 314 may be a single member that is integrally formed.

  The shape of the communication member 314 has an open end that comes into contact with the outer peripheral surface of the pellicle frame 100, and the diameter of the open end is larger than the diameter of the through hole. Since the shape of the communication member 314 is such a shape, the opening end of the communication member 314 and the through hole 14B can be easily aligned. More specifically, the shape of the communication member 314 is a tapered shape whose diameter increases as the distance from one end of the exhaust pipe 312B increases.

Further, the communication member 314 is provided so as to be movable in the direction in which the outer peripheral surface of the pellicle frame 100 is pushed in (direction of arrow J2). Thereby, the communication member 314 and the pellicle frame 100 can be more securely connected. Furthermore, even if the pellicle frame 100 is distorted and deformed in the exhaust direction (the direction of the arrow E2) by exhausting the inside of the groove 22 through the through-hole 24B of the pellicle frame 100, the pellicle frame 100 is previously formed by the communication member 314. The distortion deformation of the pellicle frame 100 can be corrected by pushing the outer peripheral surface of the pellicle frame.
As a matter of course, the communication member 314 is also movable in the direction opposite to the arrow J2 (in the returning direction).

FIG. 9 is a partial cross-sectional view conceptually showing a state where one of the exhaust pipes is connected to the through-hole of the pellicle frame in a modification of the present embodiment, and corresponds to the partial cross-sectional view of FIG. 8 in the above example. FIG.
As shown in FIG. 9, the through-hole 124 </ b> B of the pellicle frame 103 according to the modification has a tapered shape whose diameter increases toward the outer peripheral surface of the pellicle frame 103. The communication member 316 according to the modification has a tapered shape that can be inserted into a tapered portion of the through hole 124B.
According to this modification, the exhaust pipe 312B and the through hole 124B can be more firmly connected by inserting the communication member 316 into the tapered portion of the through hole 124B (see arrow J12).
In the above modification, points other than those described above are the same as those in the above example, and preferred embodiments are also the same.
In addition, even if it is a case where a communicating member and a through-hole are shapes other than a taper shape, if it is a structure which can insert a communicating member in a through-hole, the effect similar to the said modification will be show | played. For example, even when the communication member is a cylindrical member and the through hole is a columnar space, the communication member is inserted into the through hole by making the diameter of the communication member smaller than the diameter of the through hole. can do.

  In the present embodiment, the communication member may be omitted. In short, in this embodiment, what is necessary is just to become the structure which can connect an exhaust pipe and a through-hole.

Next, returning to FIG. 7, the other ends (not shown) of the exhaust pipes 312 </ b> A and 312 </ b> B are disposed outside the bonding chamber 310. Each of these other ends can be connected to an evacuation means such as a vacuum pump (via other piping if necessary).
A valve (not shown) for switching whether or not to exhaust the groove 22 may be provided in the middle of the exhaust pipes 312A and 312B. This valve may be an adjusting valve provided with a mechanism for adjusting the gas flow rate or the like.

  In the bonding unit 300, two exhaust pipes are provided in accordance with the number (two) of through holes connected to the grooves 22 of the pellicle frame 100. However, the number of exhaust pipes in this embodiment is two. Needless to say, it is not limited to. The number of exhaust pipes is not particularly limited, but it is preferable to match the number of exhaust pipe end portions with the number of through holes. A branched exhaust pipe may be used as the exhaust pipe. In short, in this embodiment, each end of the exhaust pipe can be connected to each through-hole connected to the groove provided on the end surface of the pellicle frame facing the pellicle film member. It is preferable.

As shown in FIG. 7, an original support member 330 that supports the original 250 is provided in the bonding chamber 310.
The original plate supporting member 330 supports the original plate 250 in contact with a part of the outer peripheral surface of the original plate 250 and not in contact with the back surface 254 of the original plate 250. However, as a modification of the original plate support member 330, an original plate support member that contacts a part of the outer peripheral surface of the original plate and also contacts a part of the peripheral end of the back surface 254 may be used.
As in these examples, the bonding unit 300 is in contact with the peripheral end of the back surface 254 of the original 250 and at least a part of the outer peripheral surface of the original 250 in the bonding chamber 310, and is in contact with the center of the back 254. It is preferable to provide an original plate supporting member that supports the original plate 250 without doing so. As a result, the original and the pellicle can be bonded together without contacting the central portion on the back surface of the original plate, so that the adhesion of foreign matter to the central portion on the back surface of the original plate is suppressed.

  Similarly, when the original 250 is carried into the bonding chamber 310, the peripheral edge of the back surface 254 of the original 250 and at least a part of the outer peripheral surface of the original 250 are brought into contact with the central portion of the back 254, It is preferably carried out by being held by holding means (not shown) that supports the original 250. An example of such holding means is a hand member provided in the transport robot.

The central part of the back surface 254 is preferably an area wider than the effective exposure area of the original 250.
Moreover, the distance from the outer periphery of the center part of the back surface 254 to the peripheral edge of the back surface is preferably 5 mm or less, and more preferably 3 mm or less.

  Moreover, it is preferable that the peripheral edge part of the back surface 254 is an area | region within 5 mm (more preferably within 3 mm) from the peripheral edge of a back surface.

Next, with reference to FIGS. 10 to 13, a modified example of the mechanism for supporting the original plate 250 in the bonding chamber 310 will be described as a modified example of the present embodiment.
In these modified examples, the preferable ranges of the central portion and the peripheral end portion of the back surface are the same as the above-described example.

In the modification shown in FIG. 10, the original 250 may be carried (accommodated) into the bonding chamber 310 while being accommodated in an original case 260 having an opening for exposing the front surface 252 of the original 250. In this case, the bonding unit 300 includes an original case support member 332 (mounting board) that supports an original case 260 containing the original 250 in the bonding chamber 310. In this modification, the original plate 250 and the pellicle 200 are bonded together while the original plate 250 is still housed in the original case 260.
In this modification, the original case 260 can be carried into the bonding chamber 310 using a holding means (for example, a hand member provided in the transfer robot) that can hold the original case 260. The holding means for holding the original case 260 may contact any portion outside the original case 260.
In this modification, a part of the peripheral end portion of the back surface 254 of the original plate 250 is in contact with the protrusion 262 provided on the original plate case 260, and the central portion of the back surface 254 is not in contact with anything.
As a result, the original and the pellicle can be bonded together without contacting the central portion on the back surface of the original plate, so that the adhesion of foreign matter to the central portion on the back surface of the original plate is suppressed.
The material and shape of the protrusions 262 are not particularly limited, but the material is preferably a flexible material that hardly generates dust or a conductive material. An example of such a material is carbon-polyimide compound.
The position where the protrusion 262 is provided is not particularly limited, but is preferably four corners of the back surface 254 of the original 250.

In the modification shown in FIG. 11, the original 250 is placed on the placement board 334 in the bonding chamber 310. In this modification, a part of the peripheral end portion of the back surface 254 of the original plate 250 is in contact with the protrusion 362 provided on the mounting board 334, and the central portion of the back surface 254 is not in contact with anything.
As a result, the original and the pellicle can be bonded together without contacting the central portion on the back surface of the original plate, so that the adhesion of foreign matter to the central portion on the back surface of the original plate is suppressed.
The preferable material of the protrusion 362 is the same as the preferable material of the protrusion 262.
A preferable aspect of the position where the protrusion 362 is provided is the same as the preferable aspect of the position where the protrusion 262 is provided.

In the modification shown in FIG. 12, the original 250 is arranged in the bonding chamber 310 so that the original 250 is on the lower side and the rear 254 is on the upper side, unlike the previous examples. In this modification, an original support member 336 that supports the original 250 so as to contact the outer peripheral surface of the original 250 and not to contact the back surface 254 of the original 250 is provided in the bonding chamber 310. In the case of this modification, the pellicle 200 is also carried into the bonding chamber 310 with the pellicle film 130 facing downward, unlike the previous examples. The point that the pellicle 200 is attached to the front surface 252 of the original 250 is the same as in the previous examples.
In this modification, the original and the pellicle can be bonded to each other without contacting not only the central part of the back of the original but also the peripheral edge, and therefore adhesion of foreign matter to the back of the original is suppressed.

  13 uses the original plate support member 337 in which the original plate support member 336 in FIG. 12 contacts a part of the outer peripheral surface of the original plate 250 and also contacts the peripheral end portion of the front surface 252 of the original plate 250. Except this, it is the same as the modification shown in FIG.

Next, returning to FIG. 7, the original support member 330 can move the original 250 in the horizontal direction (more specifically, the X direction and the Y direction orthogonal to each other, and the θ direction that is the rotation direction). Thus, the alignment (positioning) adjustment between the pellicle 200 and the original plate 250 may be performed.
That is, the original support member 330 in this case functions as an alignment unit.
In addition, it is preferable that the original plate support member, the placing board, and the original case support member in each of the above-described modified examples also function as alignment means.

A plurality of sensors 340 are further provided in the bonding chamber 310.
The sensor 340 is a member for reading the position of the pellicle 200 (pellicle frame 100) in the bonding chamber 310. The sensor 340 reads, for example, the position of an alignment mark that may be provided on a part of the pellicle 200, the position of the outer peripheral end of the pellicle frame 100, the position of the inner peripheral end of the pellicle frame 100, and the like.
The plurality of sensors 340 are provided so as to be movable in accordance with the position of the reading target (alignment mark, position of the outer peripheral edge of the pellicle frame 100, position of the inner peripheral edge of the pellicle frame 100).
Reading by the sensor 340 may be performed by image recognition.
A fiber sensor is preferably used as the sensor 340.

  For the alignment mechanism (movement of the original support substrate, reading of the position by the center, etc.) in the bonding unit, a known alignment mechanism of a known apparatus such as an exposure apparatus (for example, a stepper) or a chip mounter apparatus is applied. You can also.

In addition, a gas dispersion member 324 for dispersing the gas introduced from the first introduction pipe 322 is provided in the bonding chamber 310. The gas dispersion member 324 is a cover-shaped member that covers the end portion (gas introduction port) of the first introduction pipe 322 and a part of the inner wall surface above the bonding chamber 310. A plurality of holes (not shown) are provided on the side of the gas dispersion member 324 facing the pellicle film 130. The gas introduced from the first introduction pipe 322 first reaches the space formed by the inner wall surface above the bonding chamber 310 and the gas dispersion member 324, and is then dispersed by the plurality of holes.
Thereby, the influence on the pellicle film 130 due to the gas flow from the first introduction pipe 322 is reduced. From the viewpoint of further reducing the influence of the gas flow on the pellicle film, it is preferable that the plurality of holes be provided in such a manner that the central portion of the pellicle film 130 is not exposed to gas.

Although not shown, the bonding chamber 310 is provided with a member entrance.
Each member is carried into and out of the bonding chamber 310 through the member entrance. Specifically, the pellicle 200 before bonding and the original plate 250 before bonding are respectively carried into the bonding chamber 310 through the member entrance. Further, the pellicle 200 and the original plate 250 after bonding are carried out of the bonding chamber 310 through the member entrance. Further, the bonding unit 300 is provided with a shutter (not shown) for opening and closing the member entrance.

The loading of the original 250 into the bonding chamber 310 is as described above.
The pellicle 200 is preferably carried into the bonding chamber 310 by a hand member (not shown) that contacts the outer peripheral surface of the pellicle frame 100 and does not contact the pellicle film 130 and the adhesive layer 104. In the bonding chamber 310, the pellicle frame 100 is supported by a support member (not shown) that contacts the outer peripheral surface of the pellicle frame 100 and does not contact the pellicle film 130 and the adhesive layer 104.

Next, an example of the flow of the bonding process by the bonding unit 300 (bonding chamber 310) described above will be described with reference to FIGS.
14 to 17, in order to make the flow of the bonding process easier to understand, a part of the configuration of the bonding unit 300 and a part of the configuration of the bonding chamber 310 are omitted.

First, as shown in FIG. 14, the original 250 and the pellicle 200 are loaded into the bonding chamber 310, respectively.
Next, as shown in FIGS. 14 and 15, the exhaust pipes 312A and 312B are connected to the through holes 24A and 24B of the pellicle frame 100 of the pellicle 200, respectively (arrows J1 and J2). Details of this connection are as described above.

Next, alignment (positioning) adjustment between the pellicle 200 and the original 250 is performed.
Next, as shown in FIG. 16, the inside of the groove 22 of the pellicle frame 100 is exhausted (depressurized) through the exhaust pipes 312 </ b> A and 312 </ b> B and the through hole of the pellicle frame 100. This evacuation (decompression) is performed by an evacuation means (for example, a vacuum pump) connected to an end of each exhaust pipe outside the bonding chamber 310. As described above with reference to FIG. 6, this exhaust causes an attractive force F (that is, a pressing force) between the pellicle 200 and the original plate 250 to be bonded together.
As a result, the pellicle 200 and the original plate 250 can be bonded together without making contact with the film surface of the pellicle film as much as possible.

Next, as shown in FIG. 17, gas is introduced into the bonding chamber 310 through the first introduction pipe 322. The introduced gas is dispersed in the bonding chamber 310 by the gas dispersion member 324. At this time, the gas is preferably dispersed so that the gas does not hit at least the central portion of the pellicle film 130 (see arrow G1).
By introducing the gas into the bonding chamber 310, the pressure in the bonding chamber 310 is increased, and the pressure of the atmosphere in the entire bonding chamber 310 in which the pellicle and the original plate are arranged and the pressure in the groove 22 are The difference (differential pressure) increases. Due to this differential pressure, the force F is increased and the pellicle 200 and the original plate 250 are pressed more strongly against each other. In addition, although illustration is abbreviate | omitted in FIG. 17, in addition to gas introduction (pressurization) by the 1st introduction pipe | tube 322, gas introduction (pressurization) by a 2nd introduction pipe | tube can also be performed.

The degree of pressurization and depressurization is the force F (pellicle) between the pellicle and the original plate generated by the difference (differential pressure) between the overall pressure in the bonding chamber 310 and the pressure inside the groove. The force applied to the entire frame is adjusted so as to be within the above-described preferable range (for example, about 2N).
For example, the pressure in the bonding chamber 310 is adjusted to be, for example, about 0.15 MPa.

(Specific example of pellicle mounting device)
The pellicle mount device according to the present embodiment may be a device including only a bonding unit (for example, the bonding unit 300), or may be a device including a bonding unit and another unit.
FIG. 18 is a schematic configuration diagram of a pellicle mount device that is an example of the pellicle mount device of the present embodiment and includes a bonding unit and another unit.

  As shown in FIG. 18, the pellicle mount apparatus 600 includes a transfer robot 400 as a transfer means, an original plate loader 610, a pellicle loader 620, the above-described bonding unit 300, an inspection unit 650, an unloader 630, Is provided.

  The transfer robot 400 is a transfer means for transferring a material (pellicle and original plate) and a product (original plate with pellicle (exposure original plate)) to each unit (including each loader and unloader; the same applies hereinafter).

  Needless to say, the original plate loader 610 and the pellicle loader 620 are units in which the original plate 250 and the pellicle 200 are set, respectively.

The bonding unit 300 is as described above.
The bonding unit 300 preferably includes first measurement means for measuring the shape of the pellicle frame of the pellicle frame member before being bonded to the pellicle film member.
Examples of the shape of the pellicle frame include the length L1 in the long side direction described above, the length L2 in the short side direction (see FIG. 1), the orthogonality of the pellicle frame, and the like.
Further, as the first measuring means, the above-described sensor 340 having a function of measuring the shape of the pellicle frame can be cited. Further, a means for detecting contact with the pellicle frame may be provided in the bonding unit 300 as the first measuring means.

Moreover, it is preferable that the bonding unit 300 includes an alignment unit that performs alignment (position alignment) between the pellicle and the original plate before bonding the pellicle and the original plate. Examples of the alignment means include an original plate support member and an original case support member provided so as to be movable in the horizontal direction (X direction, Y direction, and θ direction) as described above.
In the pellicle mount device 600, the robot arm of the transfer robot 400 having a function of adjusting the position in the horizontal direction can be used in an auxiliary manner as an alignment unit.

The inspection unit 650 is a unit for inspecting the appearance of the pellicle and the original plate after bonding.
Examples of the appearance inspection include detection of foreign matters attached to at least one of the pellicle and the original plate, measurement of the shape of the pellicle frame, and measurement of alignment between the pellicle and the original plate.
In particular, the inspection unit 650 preferably includes second measurement means for measuring the shape of the pellicle frame of the pellicle after being bonded to the original.
Examples of the second measuring means include the same examples as the first measuring means.

  The unloader 630 is a unit that accommodates the finally manufactured original plate with a pellicle (exposure original plate).

The pellicle mount device 600 further includes a control unit 660.
The control means 660 includes a measurement result of the shape of the pellicle frame before bonding (measurement result by the first measurement means), a measurement result of the shape of the pellicle frame after bonding (measurement result by the second measurement means), The control means performs feed-forward control (FF control) on alignment based on the alignment means.
However, the control means 660 may be omitted.

The pellicle mount device 600 further includes a calculation unit 670.
The calculation means 670 includes a measurement result of the shape of the pellicle frame before bonding (measurement result by the first measurement means), a measurement result of the shape of the pellicle frame after bonding (measurement result by the second measurement means), Is a calculation means for calculating the amount of distortion of the pellicle frame due to bonding in the bonding unit. The calculating means 670 further has a function of performing feedforward control (FF control) on the amount of pushing of the pellicle frame 100 by the communication member 314 based on the amount of distortion.
However, the calculation means 670 may be omitted.

Further, the pellicle mount apparatus 600 includes the above-described units, but units other than the bonding unit 300 may be omitted as appropriate.
That is, units other than the bonding unit 300 can be provided as an apparatus different from the pellicle mounting apparatus including the bonding unit 300.

Further, the pellicle mount device 600 may include other units other than the above-described units.
For example, when a pellicle with a release liner (for example, the aforementioned pellicle 201 provided with the release liner 106) is set in the pellicle mount device 600, a release liner release unit may be provided.
When a pellicle that is not provided with an adhesive layer for bonding to the original plate (for example, a pellicle obtained by removing the adhesive layer 104 from the pellicle 200) is set in the pellicle mount device 600, adhesion to the original plate is performed. An adhesive layer forming unit (adhesive application unit) for forming an adhesive layer may be provided.

In addition, the pellicle mount apparatus according to the present embodiment may include a reversing mechanism that vertically flips each member (pellicle and original plate).
Further, the EUV original plate (for example, the original plate 250) is generally stored in a container called an EUV pod, and is transported. Then, before mounting the pellicle, the EUV pod is opened and the original is taken out. As the original case 260, a cover member of an inner pod among EUV pods can be used.
In addition, the operation of inverting or opening the EUV pod may be performed at any time when the pellicle is mounted.

(Example of pellicle mounting flow by the pellicle mounting device 600)
Next, with reference to FIG. 19, an example of a pellicle mounting flow (that is, a flow of mounting a pellicle to the original) by the pellicle mounting device is shown. The pellicle mounting flow can also be rephrased as a manufacturing flow of an original plate with a pellicle.
Note that among the steps in FIG. 19, steps surrounded by a broken line (steps 702, 706, and 708) mean steps that can be omitted in this example.

As shown in FIG. 19, first, in step 700, the pellicle is set to the pellicle loader, and the original is set to the original loader. Next, the pellicle and the original are each carried into a bonding chamber by robot conveyance.
Next, as step 702, the shape of the pellicle frame of the pellicle (the shape before bonding) is measured by the first measuring means in the bonding chamber.
Next, as step 704, the pellicle and the original plate are aligned by the alignment means in the bonding chamber. Next, the pellicle and the original plate are bonded together in the bonding chamber.
Next, in step 706, the pellicle and the original plate are transported to the appearance inspection unit, and the shape of the pellicle frame (the shape after bonding) is measured by the second measuring means in the appearance inspection unit.
Here, if necessary, feedforward control (hereinafter also referred to as “FF1 (alignment correction)”) of the alignment unit in step 704 is performed based on the measurement result by the first measurement unit and the measurement result by the second measurement unit. . FF1 (alignment correction) is performed by the control unit 660.

Next, as step 708, based on the measurement result by the first measurement means and the measurement result by the second measurement means, the distortion amount of the pellicle frame due to bonding is calculated. The calculation of the distortion amount is performed by the calculation unit 670.
Here, if necessary, based on the calculated distortion amount, feed-forward control (hereinafter referred to as “FF2 (distortion correction)”) is performed on the pressing amount of the pellicle frame 100 by the communication member 314 in the bonding process in step 704. (Also called). In this example, FF2 (distortion correction) is also performed by the calculation unit 670. However, as a modification, a control unit that performs FF2 (distortion correction) may be provided separately from a calculation unit that calculates a distortion amount.

  Next, in step 710, the pellicle and the original plate (that is, the original plate with the pellicle (exposure original plate)) are transferred to the unloader and stored.

As mentioned above, although an example of the pellicle mounting flow by the pellicle mounting apparatus has been shown, the present embodiment is not limited to this example.
For example, as described above, in the pellicle mount device 600, the control unit 660 and the calculation unit 670 may be omitted. That is, FF1 (alignment correction) and FF2 (distortion correction) may be performed manually instead of being automatically performed by the control means.
In the pellicle mount device 600, the control unit 660 and the calculation unit 670 may be the same control unit. That is, FF1 (alignment correction), distortion amount calculation, and FF2 (distortion correction) may be performed by one control unit.
Furthermore, as described above, the pellicle mount apparatus according to the present embodiment may be an apparatus including only a bonding unit. That is, even by performing only the bonding process in step 704, the pellicle and the original plate can be bonded to each other and attached to the original plate without contacting the pellicle film as much as possible.

(Specific example of an exposure apparatus equipped with a pellicle original plate (exposure original plate))
An original plate with a pellicle (exposure original plate) manufactured according to this embodiment is used in an exposure apparatus.
FIG. 20 is a schematic cross-sectional view of an EUV exposure apparatus 800 that is an example of an exposure apparatus that includes an example of an original plate with a pellicle manufactured according to this embodiment.
As shown in FIG. 20, the EUV exposure apparatus 800 includes a light source 831 that emits EUV light, an exposure original plate 850 that is an example of an exposure original plate according to the present embodiment, and an EUV light emitted from the light source 831. And an illumination optical system 837 that leads to
The exposure original plate 850 includes a pellicle 810 including a pellicle film 812 and a pellicle frame 814, and an original plate 833 (EUV mask). The exposure original plate 850 is arranged such that EUV light emitted from the light source 831 passes through the pellicle film 812 and is irradiated onto the original plate 833.
The original 833 reflects the irradiated EUV light in a pattern.

The pellicle 810 corresponds to the pellicle 200 described above.
The pellicle film 812 corresponds to the pellicle film 130 described above.
The pellicle frame 814 corresponds to a composite of the above-described support substrate 122, the above-described adhesive layer 102, the above-described pellicle frame 100, and the above-described adhesive layer 104.

In the EUV exposure apparatus 800, filter windows 820 and 825 are installed between the light source 831 and the illumination optical system 837 and between the illumination optical system 837 and the original 833, respectively.
Further, the EUV exposure apparatus 800 includes a projection optical system 838 that guides the EUV light reflected by the original 833 to the sensitive substrate 834.

  In the EUV exposure apparatus 800, the EUV light reflected by the original 833 is guided onto the sensitive substrate 834 through the projection optical system 838, and the sensitive substrate 834 is exposed in a pattern. Note that exposure by EUV is performed under reduced pressure conditions.

The EUV light source 831 emits EUV light toward the illumination optical system 837.
The EUV light source 831 includes a target material, a pulse laser irradiation unit, and the like. EUV is obtained by irradiating this target material with a pulse laser to generate plasma. When the target material is Xe, EUV having a wavelength of 13 to 14 nm is obtained. The wavelength of the light emitted from the EUV light source is not limited to 13 to 14 nm, and may be light having a wavelength suitable for the purpose within a wavelength range of 5 to 30 nm.

The illumination optical system 837 collects the light emitted from the EUV light source 831, makes the illuminance uniform, and irradiates the original 833.
The illumination optical system 837 includes a plurality of multilayer mirrors 832 for adjusting the EUV optical path, an optical coupler (optical integrator), and the like. The multilayer film mirror is a multilayer film in which molybdenum (Mo) and silicon (Si) are alternately stacked.

The method for attaching the filter windows 820 and 825 is not particularly limited, and examples thereof include a method of attaching via an adhesive or the like, and a method of mechanically fixing in the EUV exposure apparatus.
The filter window 820 disposed between the light source 831 and the illumination optical system 837 captures scattered particles (debris) generated from the light source, and the scattered particles (debris) are elements inside the illumination optical system 837 (for example, a multilayer film). Avoid sticking to the mirror 832).
On the other hand, the filter window 825 disposed between the illumination optical system 837 and the original 833 captures particles (debris) scattered from the light source 831 side and prevents the scattered particles (debris) from adhering to the original 833. .

  Further, the foreign matter adhering to the original plate absorbs or scatters EUV light, which causes poor resolution on the wafer. Therefore, the pellicle 810 is mounted so as to cover the EUV irradiation area of the original 833. The EUV light passes through the pellicle film 812 and is irradiated on the original 833.

The EUV light reflected by the original 833 passes through the pellicle film 812 and is irradiated onto the sensitive substrate 834 through the projection optical system 838.
The projection optical system 838 condenses the light reflected by the original 833 and irradiates the sensitive substrate 834. The projection optical system 838 includes a plurality of multilayer mirrors 835 and 836 for preparing an EUV optical path.

  The sensitive substrate 834 is a substrate on which a resist is applied on a semiconductor wafer, and the resist is exposed in a pattern by EUV reflected by the original 833. By developing this resist and etching the semiconductor wafer, a desired pattern is formed on the semiconductor wafer.

The disclosure of Japanese Patent Application No. 2014-109482 filed on May 27, 2014 is incorporated herein by reference in its entirety.
All documents, patent applications, and technical standards mentioned in this specification are to the same extent as if each individual document, patent application, and technical standard were specifically and individually stated to be incorporated by reference, Incorporated herein by reference.

Claims (13)

The pellicle film has a through hole that supports the pellicle film on one end surface side in the thickness direction and penetrates between the groove provided on the other end surface in the thickness direction and the outer peripheral surface and the wall surface of the groove. A bonding chamber in which a pellicle including a pellicle frame and a master having a light irradiation surface irradiated with exposure light are bonded;
In the state where the pellicle and the original plate are disposed in the bonding chamber so that the other end surface of the pellicle frame and the light irradiation surface face each other, the inside of the groove is formed through the through hole of the pellicle frame. An exhaust pipe for exhausting;
A pellicle mount device comprising a bonding unit including:   2. The pellicle mount device according to claim 1, wherein the bonding unit includes an introduction tube for introducing a gas into the bonding chamber to pressurize the bonding chamber. The introduction pipe includes a first introduction pipe for introducing a gas from a side facing the pellicle of the pellicle and the original plate arranged in the bonding chamber,
The bonding unit further includes:
The pellicle mount device according to claim 2, further comprising a gas dispersion member for dispersing the gas introduced from the first introduction pipe.   The said bonding unit is connected to the end of the said exhaust pipe in the said bonding chamber, The communication member which connects the said exhaust pipe and the said through-hole of the said pellicle frame is included. The pellicle mount device according to any one of the above.   The pellicle mount device according to claim 4, wherein the communication member is provided so as to be movable in a direction in which an outer peripheral surface of the pellicle frame is pushed.   The pellicle mount device according to claim 4, wherein the communication member has an open end that can be inserted into the through hole.   The laminating unit supports, in the laminating chamber, at least a part of a peripheral end portion of the surface opposite to the light irradiation surface of the original plate and an outer peripheral surface of the original plate, and a center of the opposite surface. The pellicle mount device according to any one of claims 1 to 6, further comprising an original plate support member that does not support the portion. The original plate has an opening for exposing the light irradiation surface of the original plate, and supports at least a part of a peripheral end portion of the surface opposite to the light irradiation surface of the original plate and an outer peripheral surface of the original plate, Housed in the original case that does not support the center of the opposite surface and carried into the bonding chamber,
The pellicle mount device according to any one of claims 1 to 7, wherein the bonding unit includes an original case support member that supports the original case containing the original in the bonding chamber.   Furthermore, the pellicle mounting apparatus of any one of Claims 1-8 provided with the test | inspection unit which performs the external appearance test | inspection of the said pellicle and the said original plate after the said bonding. First measuring means for measuring the shape of the pellicle frame of the pellicle before being bonded to the original plate;
Second measuring means for measuring the shape of the pellicle frame of the pellicle after being bonded to the original plate;
The pellicle mount device according to any one of claims 1 to 9, further comprising: Alignment means for aligning the original plate and the pellicle before bonding the original plate and the pellicle;
Based on the measurement result of the shape of the pellicle frame before the pasting and the measurement result of the shape of the pellicle frame after the pasting, control means for feedforward controlling the alignment by the alignment means;
The pellicle mount device according to claim 10, comprising:   Calculation means for calculating a distortion amount of the pellicle frame due to the bonding based on a difference between the measurement result of the shape of the pellicle frame before the bonding and the measurement result of the shape of the pellicle frame after the bonding The pellicle mount device according to claim 10, comprising: The bonding unit is connected to one end of the exhaust pipe in the bonding chamber, communicates with the exhaust pipe and the through-hole of the pellicle frame, and can move in a direction to push in the outer peripheral surface of the pellicle frame Including a communication member provided in the
The pellicle mounting apparatus according to claim 12, wherein the calculating means is control means for performing feedforward control of the amount of pushing of the pellicle frame by the communication member based on the amount of distortion.