JPWO2015181898A1 - Component mounting apparatus and tape feeder - Google Patents

Abstract

The component mounting apparatus includes a head unit that takes out a component from a tape feeder installed in a component supply unit and mounts the component on a substrate, an imaging device that is mounted on the head unit and includes a camera and a lighting device, and a first that images a substrate. A control apparatus that executes an imaging process and a second imaging process that images the tape feeder, and a processing apparatus that executes a process for obtaining the height of the tape feeder based on image data obtained by the second imaging process. The illumination device has a first illumination state in which light from all light sources is irradiated onto the object, and light from a specific direction inclined with respect to a vertical axis by irradiating only light from some light sources onto the object. The illumination state can be switched to the second illumination state in which the object is irradiated. The control device controls the lighting device to the first lighting state during the first imaging process, and controls the lighting device to the second lighting state during the second imaging process.

Description

  The present invention relates to a component mounting apparatus that sucks and mounts a component supplied by a tape feeder on a substrate, and a tape feeder mounted on the component mounting apparatus.

  2. Description of the Related Art A component mounting apparatus that takes out a component supplied by a tape feeder with a head unit and mounts the component on a substrate is known. In this type of component mounting apparatus, a component is taken out from the tape feeder by placing a head unit above the tape feeder and lifting and lowering the head mounted on the head unit to suck the component. In this case, if the height of the tape feeder is not the expected height due to differences in the individual tape feeders or mounting errors, it is conceivable that there will be an obstacle to component adsorption.

  Therefore, it is conceivable to measure the height of the tape feeder and to control the head elevation movement based on the measurement result. In this case, in order to measure the height of the tape feeder, a method as disclosed in Patent Document 1 can be used. This method is a method for measuring the height of the substrate surface in the component mounting apparatus. The laser beam (spot light) is irradiated obliquely from above on the upper surface of the substrate, and the irradiation position is imaged with a camera. In this method, the height of the substrate is obtained from the irradiation position on the image. This method uses the geometrical relationship that the irradiation position of the laser beam shifts in accordance with the height of the substrate, and obtains the height of the substrate from the amount of deviation. Such a method is based on the tape feeder. It can also be applied to height measurement. Specifically, a laser light source is mounted on the head unit, laser light is irradiated obliquely from above the top surface of the tape feeder, and the irradiation position on the image is captured by a substrate recognition camera. To find the height of the tape feeder.

  However, in this case, since it is necessary to mount the laser light source on the head unit, the increase in the size and weight of the head unit hinders the rapid movement of the head unit, leading to a decrease in mounting speed. Further, since a new laser light source is required, it also causes a high cost.

JP 2013-140082 A

  The present invention makes it possible to measure the height of a tape feeder with a simple configuration without encouraging an increase in the size and weight of the head unit, and without significantly increasing the cost. The purpose is to make it possible to more reliably take out the parts.

  In order to achieve this object, a component mounting apparatus according to one aspect of the present invention includes a component supply unit in which a tape feeder having a component take-out unit on the upper surface is installed, and a tape installed in the component supply unit. A head unit that takes out a component from the feeder, transports the component and mounts it on a substrate placed at a predetermined mounting work position, and a camera that is mounted on the head unit and images a target object located below the head unit; And an imaging device including an illumination device that irradiates an object with illumination light for imaging from above, the head unit and the imaging device, and the substrate as the object in order to recognize the position of the substrate In order to obtain a first imaging process for imaging the upper surface by the imaging device and the height of the tape feeder installed in the component supply unit, the tape feeder is A control device that executes a second imaging process that images the top surface of the object as an image by the imaging device, and a process that executes a process for obtaining the height of the tape feeder based on the image data obtained by the second imaging process A first illumination state that includes a plurality of light sources arranged around the optical axis of the camera and irradiates the object with light from all light sources; By irradiating only the light of some light sources among the plurality of light sources to the object, illumination is performed in a second illumination state in which the object is irradiated with light from a specific direction inclined with respect to a vertical axis. The state can be switched, and the control device controls the illumination device to the first illumination state during the first imaging process, and controls the illumination device during the second imaging process. Control to the second lighting state It is.

1 is a perspective view showing a component mounting apparatus according to a first embodiment of the present invention. It is a front view which shows a head unit and its drive mechanism. It is a side view which shows the tape feeder (tape feeder which concerns on this invention) installed in the component supply part and the said component supply part. It is a perspective view which shows the front-end | tip part upper surface of a tape feeder. It is the schematic diagram which looked at the board | substrate recognition unit (illuminating device) from the lower side (arrow A direction of FIG. 2). It is the schematic diagram (2nd illumination state) which looked at the board | substrate recognition unit from the lower side. It is a block diagram which shows the control system of a component mounting apparatus. It is a flowchart which shows an example of the height measurement control of the tape feeder by a control apparatus. It is explanatory drawing of the height measurement principle of a tape feeder. It is explanatory drawing of the height measurement principle of a tape feeder. It is a schematic diagram which shows the image (sphere image) which the board | substrate recognition unit acquired. It is a perspective view which shows the front-end | tip part upper surface of the tape feeder which concerns on a modification. It is a schematic diagram which shows the image (image of a cylindrical body) which the board | substrate recognition unit acquired. It is a side surface schematic diagram which shows the component mounting apparatus which concerns on 2nd Embodiment of this invention. It is explanatory drawing of the height measurement principle of the tape feeder in the component mounting apparatus which concerns on 2nd Embodiment.

  Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

(First embodiment)
1 and 2 schematically show a component mounting apparatus M according to the present invention. FIG. 1 is a perspective view of the whole, and FIG. 2 is a front view of a head unit 5 and its drive mechanism. ing. In the drawings, XYZ rectangular coordinate axes are shown in order to clarify the directional relationship between the drawings. The X direction is a direction parallel to the horizontal plane, the Y direction is a direction orthogonal to the X direction on the horizontal plane, and the Z direction is a direction orthogonal to the X method and the Y direction.

  The component mounting apparatus M includes a base 1, a substrate transport mechanism 2 that is disposed on the base 1 and transports a substrate P such as a printed wiring board (PWB), and component supply units 3 and 4. A component mounting head unit 5, a head unit driving mechanism for driving the head unit 5, and a component recognition unit 6 are provided.

  The substrate transport mechanism 2 includes a pair of conveyors that transport the substrate P in the X direction on the base 1. These conveyors receive the substrate P from the front of FIG. 1 (X1 direction side) and convey it to a predetermined mounting work position (position shown in the figure), and hold the substrate P by a holding device (not shown). Then, after the mounting operation, the board P is carried out to the back side (X2 direction side) in FIG.

  The component supply units 3 and 4 are arranged on both outer sides (both sides in the Y direction) of the substrate transport mechanism 2. Of the component supply units 3 and 4, a tray feeder 4 a is installed in the component supply unit 4 located on the Y1 direction side of the substrate transport mechanism 2. The tray feeder 4a includes a tray storage unit 401 in which a plurality of trays T on which package type components such as a QFP (Quad Flat Package) and a BGA (Ball Grid Array) are respectively mounted in a matrix are stored in multiple stages. The tray T in the storage unit 401 includes a loading / unloading mechanism 402 for loading / unloading the tray T into / from a component supply position (the position of the tray T in FIG. 1) on the substrate transport mechanism 2 side. The components are supplied by pulling out the arranged trays T to the component supply position.

  On the other hand, a plurality of tape feeders 3 a are arranged in parallel along the substrate transport mechanism 2 in the component supply unit 3 located on the Y2 direction side of the substrate transport mechanism 2. Each tape feeder 3a supplies a small piece of electronic component (chip component) such as an IC, a transistor, or a capacitor using the tape as a carrier.

  As shown in FIGS. 3 and 4, the tape feeder 3 a accommodates parts at regular intervals, a box-shaped feeder main body 30 flat in the X direction, a tape feeding mechanism incorporated in the feeder main body 30, and the like. And a reel 31 around which the tape is wound.

  The tape feeder 3a is detachably fixed to a feeder mounting base 38 provided in the component supply unit 3. The tape feeder 3a using a motor as a drive source pulls the tape out of the reel 31 while pulling the tape from the reel 31. The components are sequentially supplied to the component take-out portion 33 provided in the vicinity of the front end of the feeder main body portion 30 by sending it forward (substrate transfer mechanism 2 side / Y1 direction side) through the inside. The component take-out part 33 is an opening formed in the upper surface 32a of the feeder main body 30, and the parts are taken out by the head unit 5 through this opening.

  Note that a sphere 34 (corresponding to the mirror surface portion of the present invention) is fixed at a position between the front end portion of the upper surface 32a of the tape feeder 3a and the component take-out portion 33. The sphere 34 is, for example, a steel ball having a mirror-like surface, and is fixed to the upper surface 32a by means such as welding or adhesion. The sphere 34 is used for the height measurement process of the tape feeder 3a, and this will be described in detail later.

  The feeder mounting base 38 includes, for example, a front end positioning portion 39a having a substantially vertical positioning surface, and a support portion 39b having a substantially horizontal support surface located on the rear side (Y2 direction side) and extending in the Y direction. ing. In the tape feeder 3a, the front surface 32b of the feeder main body portion 30 is abutted against the positioning surface of the front end positioning portion 39a, and the feeder main body portion 30 (lower surface 32c) is supported by the support portion 39b. The part 30 is fixed to the support part 39b by a clamping device (not shown), so that the part 30 is detachably installed on the feeder mounting base 38 (part supply part 3).

  A plurality of positioning pins 321 project from the front surface 32b of the feeder main body 30, and these positioning pins 321 are inserted into positioning holes (not shown) formed in the front end positioning portion 39a so that the feeder is attached. The tape feeder 3a is positioned in each of the X, Y, and Z directions with respect to the base 38.

  In addition, the code | symbol 37 in FIG. 3 is a cover member with which the component supply part 3 is provided, and it is provided so that the area | region ahead of the component extraction part 33 among the upper surfaces 32a of the tape feeder 3a may be covered from upper direction. .

  The head unit 5 takes out components from the component supply units 3 and 4 and mounts them on the substrate P, and is disposed above the substrate transport mechanism 2 and the component supply units 3 and 4.

  The head unit 5 is movable in the X direction and the Y direction within a certain area by a head unit driving mechanism. The head unit driving mechanism is fixed to a pair of elevated frames 1a provided on the base 1, and a pair of fixed rails 7 extending in parallel to each other in the Y direction, and a unit extending in the X direction supported by these fixed rails 7. A support member 11 and a ball screw shaft (not shown) screwed into the unit support member 11 and driven by a Y-axis servomotor 9 are included. The head unit driving mechanism includes a fixed rail 14 fixed to the unit support member 11 to support the head unit 5 so as to be movable in the X direction, and a screw source inserted into the head unit 5 to drive the X-axis servo motor 15 as a driving source. And a ball screw shaft 13 driven as follows. That is, the head unit drive mechanism moves the head unit 5 in the X direction via the ball screw shaft 13 by driving the X axis servo motor 15, and moves the ball screw shaft (not shown) by driving the Y axis servo motor 9. Then, the unit support member 11 is moved in the Y direction. As a result, the head unit driving mechanism moves the head unit 5 in the X direction and the Y direction within a certain region.

  The head unit 5 includes a plurality of (in this example, six) shaft-shaped heads 16 for mounting components, a frame member that supports the head 16 so as to be movable up and down (moving in the Z direction), and the head 16. And a head drive mechanism using a servo motor as a drive source for rotation. With this configuration, the head unit 5 takes out the components from the component supply units 3 and 4 by the respective heads 16 and conveys the components onto the substrate P, and mounts the components on a predetermined position on the substrate P.

  Each head 16 is provided with a component suction nozzle at its tip. Although not shown, each nozzle can communicate with any of a negative pressure generator, a positive pressure generator, and the atmosphere via a switching valve. That is, the nozzle of each head 16 sucks a component by receiving a negative pressure and then releases the suction state of the component by receiving a positive pressure.

  The head unit 5 further includes a substrate recognition unit 18. The substrate recognition unit 18 images a fiducial mark written on the upper surface of the substrate P in order to recognize the position of the substrate P arranged at the mounting work position. The board recognition unit 18 is used to measure the height of each tape feeder 3a installed in the component supply unit 3 in addition to the recognition of the board P. In this case, the board recognition unit 18 images the sphere 34 provided on the upper surface 32a of the tape feeder 3a.

  The board recognition unit 18 includes an area sensor camera 20 such as a CCD camera provided with an area sensor 20a (see FIG. 5) in which a plurality of imaging elements are two-dimensionally arranged, and an illumination device 21 provided with a plurality of LEDs as light sources. Including. The area sensor camera 20 is fixed downward to the frame portion of the head unit 5 so that the substrate P and the tape feeder 3a can be imaged, and the illumination device 21 is provided at the lower end portion of the area sensor camera 20. .

  The lighting device 21 is a ring-shaped lighting device in which a plurality of LEDs 22 are arranged around the optical axis O of the area sensor camera 20. Specifically, as shown in FIG. 5, the illumination device 21 includes an inner illumination unit 23 in which a plurality of LEDs 22 are arranged on a circumference around the optical axis O, and the outer illumination unit 21. And an outer illumination unit 24 in which a plurality of LEDs 22 are arranged on a circumference centered on the center. That is, the illuminating device 21 includes two illuminating portions 23 and 24 that are arranged in a ring shape inside and outside on a concentric circle with the optical axis O as the center.

  Out of these illumination units 23 and 24, the outer illumination unit 24 is configured to be capable of individually controlling lighting by dividing the LEDs 22 arranged in the circumferential direction into two regions. Specifically, the outer illumination unit 24 includes a first region Ea including a part of the LEDs 22 located on the Y1 direction side (a region surrounded by a broken line in FIG. 5) and a second region Eb including the other LEDs 22. The first lighting state in which all the LEDs 22 of both the illumination units 23 and 24 are lit by the control of the control device 40 (illumination control unit 45) described later. As shown in FIG. 6, it is configured to be switchable to a second illumination state in which only the LED 22 in the first region Ea of the outer illumination unit 24 is lit.

  The first region Ea of the outer illumination unit 24 is a region of about 60 ° in terms of an angle conversion value centered on the optical axis O, for example. More specifically, it is a region of approximately 60 ° set so that a straight line that intersects the optical axis O and parallel to the Y direction passes through the center.

  On the other hand, the component recognition unit 6 captures the component from the lower side in order to recognize the suction state of the component taken out from the component supply unit 4 by the head unit 5. Each is installed.

  Although not shown in detail, the component recognition unit 6 includes a line sensor camera 26 (see FIG. 7) such as a CCD camera having a line sensor in which a plurality of image sensors are arranged one-dimensionally (in a line), and a plurality of image sensors. And an illumination device 27 having LEDs (see FIG. 7). With this configuration, the component recognition unit 6 captures an image of the component from the lower side when the suction component of each head 16 passes above the component recognition unit 6 in accordance with the movement of the head unit 5 after the component suction. .

  The component mounting apparatus M further includes a control device 40 as shown in FIG. 7 for controlling the operation thereof. The control device 40 is configured based on a well-known microcomputer, and as a functional configuration thereof, a main control unit 41 that comprehensively controls the operation of the entire component mounting apparatus, and stores various processing programs and various data. A storage control unit 42, a drive control unit 44 that controls driving of the substrate transport mechanism 2, the head unit 5, and the like, a camera control unit 44 that controls the substrate recognition unit 18 (the area sensor camera 20 and the illumination device 21), and illumination control The area sensor camera 20 and the line sensor camera 26 based on the control of the main controller 41, the camera controller 47 and the illumination controller 48 that control the unit 45, the component recognition unit 6 (line sensor camera 26 and lighting device 27). Image processing units 46 and 49 for performing predetermined image processing on the image signal output from the Al has a connected constructed as a signal exchange is possible with each other.

  The main control unit 41 controls the drive control unit 43, the camera control units 44 and 47, and the illumination control units 45 and 48 according to the mounting program stored in the storage unit 42, and is processed by the image processing units 46 and 49. Based on the image data and the like, image recognition of the substrate P and components and various arithmetic processes for the recognition are performed. In particular, during the component mounting operation, the substrate recognition unit 18 images the fiducial mark on the upper surface of the substrate P (corresponding to the first imaging process of the present invention), and the mounting operation position is based on the image data. On the other hand, the process of recognizing the position of the board P placed on the board P is performed. On the other hand, before the component mounting operation, the board recognition unit 18 images the sphere 34 of the tape feeder 3a (in the second imaging process of the present invention). (Corresponding), processing for obtaining the height of each tape feeder 3a installed in the component supply unit 3 is executed based on the image data. That is, in this example, the control device 40 also functions as a processing device that determines the height of the tape feeder.

  Next, after describing a series of component mounting operations based on the control of the control device 40, the height measurement control of the tape feeder will be described with reference to FIGS.

  In the component mounting operation, first, the control device 40 controls the board transport mechanism 2 to carry the board 3 into the mounting work position and position and fix it. Then, the head unit 5 is moved above the substrate P, the fiducial mark written on the substrate P is imaged by the substrate recognition unit 18, and the position of the substrate P is recognized based on the image data. In this case, the control device 40 controls the lighting device 21 to the first lighting state. That is, all the LEDs 22 of the illumination units 23 and 24 are turned on to image the fiducial mark.

  When the recognition of the position of the substrate P is completed, the control device 40 moves the head unit 5 onto the component supply units 3 and 4 and raises and lowers the head 16 to sequentially suck the components. Thereafter, the control device 40 causes the suction unit of each head 16 to take an image by passing the head unit 5 above the component recognition unit 6, and recognizes the suction state of each component based on the image data.

  When the recognition of the components ends, the control device 40 moves the head unit 5 onto the substrate P, and sequentially mounts the components adsorbed on each head 16 onto the substrate 3. At this time, if necessary, the control device 40 corrects the mounting position and orientation of the component based on the recognition result of the substrate P and the recognition result of the suction component.

  The above is one cycle of the component mounting operation based on the control of the control device 40. In such component mounting operation, the height of the tape feeder 3a installed in the component supply unit 3 when it is installed in the component supply unit 3 due to differences in individuality, mounting errors, or deformation due to aging. May not be at the planned height, and in such a case, there is a risk that the component adsorption by the head 16 may be hindered. Therefore, the control device 40 executes a process of measuring the heights of all the tape feeders 3a installed in the component supply unit 3 before the first production start of the substrate P.

  FIG. 8 is an example showing the control of the height measurement process by the control device 40. In this measurement process, for example, after all the tape feeders 3a are installed in the component supply unit 3 by a preparatory work called “setup”, an operator gives an execution command to the control device 40 by operating an input device (not shown). Is started.

  When the execution command is input, the control device 40 resets the feeder counter and then sets an initial value “1” to the counter (step S1). Next, the head unit 5 is moved, the board recognition unit 18 is placed above the first preset tape feeder 3a of the component supply unit 3, and the tape feeder 3a is imaged (steps S3 and S5).

  Specifically, as shown in FIG. 9, the center of the sphere 34 is precisely the area sensor camera right above the sphere 34 (omitted for convenience in FIG. 9) fixed to the upper surface 32a of the tape feeder 3a. The substrate recognition unit 18 is arranged so as to be positioned on the optical axis 20, and a certain area including the sphere 34 is imaged by the substrate recognition unit 18 in this state. In this case, the control device 40 controls the lighting device 21 to the second lighting state. That is, the tape feeder 3a is imaged in a state where only the LED 22 in the first area Ea of the outer illumination unit 24 is lit.

  When the imaging of the tape feeder 3a is completed, the control device 40 obtains the height of the tape feeder 3a based on the image data (step S7). The measurement principle is as follows. That is, as shown in FIG. 9, in the second illumination state, in the outer illumination unit 24 that is ring-shaped illumination, only the LED 22 in the first region Ea on the Y1 direction side is turned on. As shown by a broken line arrow in the figure, illumination light from a specific direction (illumination light directed from the Y1 direction side to the Y2 direction side) inclined with respect to the vertical axis (optical axis O) is irradiated onto the sphere 34. The reflected light is reflected by the sphere 34 to form a bright spot 36 (one of the optical images of the present invention) called highlight on the surface of the sphere 34 as shown in FIG. Then, when the height of the tape feeder 3a shown in FIG. 9 is the standard height ha, if the height of the tape feeder 3a is deviated from the standard height ha as shown in FIG. The position of the bright spot 36 is shifted in the Y direction by the amount. Therefore, the control device 40 determines the amount of deviation in the Y direction of the bright spot 36, that is, the amount of deviation L1 in the Y direction of the bright spot 36 from the standard bright spot position when the tape feeder 3a is at the standard height ha. The deviation amount L1 is calculated and converted into the deviation amount in the vertical direction (Z direction) of the tape feeder 3a based on the geometrical relationship such as the irradiation angle of the illumination light, and based on the converted value and the standard height ha. The height of the tape feeder 3a is obtained.

  The storage unit 42 includes a conversion formula for converting the standard height ha of the tape feeder 3a, the standard bright spot position in the Y direction, and the shift amount L1 of the bright spot 36 in the Y direction into a vertical shift amount. Data is stored, and in the process of step S7, the control device 40 obtains the height of the tape feeder 3a based on the image data acquired in the process of step S5 and the data stored in the storage unit 42.

  The specific height measuring method of the tape feeder 3a is not limited to this embodiment. For example, the correlation between the position of the bright spot 36 and the height of the tape feeder 3a is examined in advance and stored in the storage unit 42. The height of the tape feeder 3a may be obtained based on the correlation data and the position of the bright spot 36 obtained from the image.

  When the height of the tape feeder 3a is obtained, the control device 40 determines whether or not the height measurement of all (N) tape feeders 3a installed in the component supply unit 3 has been completed (step S9). . If the determination is NO, the control device 40 increments the feeder counter by “1”, then proceeds to step S3, and repeats steps S3 to S7 for the next tape feeder 3a. When the height measurement of all the tape feeders 3a is finally completed (YES in step S9), the control device 40 ends the flowchart and then starts, for example, a mounting operation.

  The height data of each tape feeder 3a obtained in this way is stored in the storage unit 42. Then, in the component mounting operation, when the component is taken out from the tape feeder 3a by the head 16, the control device 40 controls the vertical movement amount of the head 16 based on the height data of each tape feeder 3a. As a result, the parts are taken out from the tape feeders 3a more appropriately.

  As described above, in the component mounting apparatus M, the illumination device 21 of the board recognition unit 18 includes the first illumination state in which all the LEDs 22 of the ring-shaped illumination units 23 and 24 are lit, and the illumination units 23 and 24. By turning on only some of the LEDs 22 (the LEDs 22 in the first region Ea), it is possible to switch to a second illumination state in which illumination light is emitted from a specific direction inclined with respect to the vertical direction. When measuring the height of the tape feeder 3a, the control device 40 images the sphere 34 in a state where the illumination device 21 is controlled to the second illumination state, and the position of the bright spot 36 formed on the sphere 34 is the tape feeder. The height of the tape feeder 3a is obtained based on a simple method using a geometrical relationship of shifting in the horizontal direction according to the height of 3a. According to such a configuration of the component mounting apparatus M, the height of the tape feeder 3a can be measured without separately providing a dedicated laser light source. Accordingly, it is possible to measure the height of the tape feeder 3a with a simple configuration without encouraging an increase in the size and weight of the head unit 5 and without a significant increase in cost, and in turn the head from the tape feeder 3a. It is possible to more reliably take out the parts by 16.

  In particular, the component mounting apparatus M is configured such that a sphere 34 having a mirror-like surface is fixed to the upper surface 32a of the tape feeder 3a and images a bright spot 36 formed on the surface of the sphere 34. When measuring the height of the tape feeder 3a, there is an advantage that the height of the tape feeder 3a can be measured with relatively high accuracy while sharing the illumination device 21 of the substrate recognition unit 18. That is, since the light source of the illuminating device 21 is the LED 22, it is more easily diffused than the laser light source. For example, when the sphere 34 is not provided, the position of the bright spot 36 formed on the upper surface 32a of the tape feeder 3a is determined from the image. It becomes difficult to specify, and the accuracy of the height measurement of the tape feeder 3a may be deteriorated. On the other hand, according to the configuration including the sphere 34, incident light (illumination light) is strongly reflected on the surface of the sphere 34 toward the area sensor camera 20, and as a result, a bright spot 36 formed on the surface of the sphere 34. Will be clearly reflected in the image. Therefore, the position of the bright spot 36 can be easily and accurately specified from the image. Therefore, it is possible to accurately measure the height of the tape feeder 3a at a level comparable to that when a laser light source is used, while sharing the illumination device 21 of the substrate recognition unit 18.

  In this component mounting apparatus M, the sphere 34 having a mirror-like surface is fixed to the upper surface 32a of the tape feeder 3a as the mirror-like portion of the present invention, but a hemisphere is fixed instead of the sphere 34. Also good. Further, instead of the sphere 34 or the hemisphere, a columnar body 35 having a mirror surface and extending in the Y direction or a columnar body having a semicircular cross section may be fixed as shown in FIG. Also in such a configuration, the incident light (illumination light) is strongly reflected on the substrate recognition unit 18 side (area sensor camera 20 side) on the surface of the cylindrical body 35, and as a result, the brightness formed on the surface of the cylindrical body 35. The point 36 is clearly reflected in the image. Therefore, by obtaining the height of the tape feeder 3a based on the position of the bright spot 36, the height of the tape feeder 3a can be obtained with high accuracy as in the case where the sphere 34 is provided. In this case, as shown in FIG. 13, an elongated strip-shaped bright spot 36 extending in the axial direction of the cylindrical body 35 is formed.

  The mirror-like portion of the present invention needs to reflect incident light (illumination light) strongly to the substrate recognition unit 18 side (area sensor camera 20 side). For this purpose, an upwardly curved shape having a mirror-like surface is suitable, and an arcuate surface such as the sphere 34 or the cylindrical body 35 as in the first embodiment is ideal. is there. However, any shape having a mirror-like surface that can promote the reflection of light toward the substrate recognition unit 18 is applicable even if the surface is not an arc-shaped surface.

  In the component mounting apparatus M, in the second illumination state, only the LEDs 22 in the first area Ea of the outer illumination unit 24a among the LEDs 22 of the illumination apparatus 21 are turned on. Thus, a shutter member that can be opened / closed except for the first region Ea may be provided, and the illumination device 21 may be switched between the first illumination state and the second illumination state by opening / closing the shutter member. That is, with all the LEDs 22 lit, a state in which the light of all the LEDs 22 is irradiated by opening and closing the shutter member (first illumination state) and a state in which the light of the LEDs 22 in the first region Ea is irradiated (see FIG. You may make it switch to a 2nd lighting state.

  In the component mounting apparatus M, the first region Ea is set on the Y1 direction side in the outer illumination section 24 of the lighting device 21, but may be set on the Y2 direction side as a matter of course. That is, during the second imaging process, the tape feeder 3a may be irradiated with illumination light that is inclined with respect to the vertical axis (optical axis O) and is directed from the Y2 direction to the Y1 direction. In short, in the second imaging process, the first region Ea may be set so that the illumination light is irradiated onto the tape feeder 3a from a specific direction inclined with respect to the vertical axis (optical axis O). This also applies to the second embodiment described below.

(Second Embodiment)
Next, the component mounting apparatus M of 2nd Embodiment of this invention is demonstrated using FIG. 14, FIG. The basic configuration of the component mounting apparatus M according to the second embodiment is the same as that of the component mounting apparatus M according to the first embodiment, and therefore, parts common to the first embodiment are denoted by the same reference numerals. The description will be omitted, and differences from the first embodiment will be described in detail below.

  In the component mounting apparatus M of the first embodiment, the sphere 34 provided in the tape feeder 3a is imaged by the board recognition unit 18, and the height of the tape feeder 3a is obtained based on the position of the bright spot 36 formed on the sphere 34. On the other hand, in the component mounting apparatus M of the second embodiment, the height of the tape feeder 3a is determined based on the shadow position of the cover member 37 (corresponding to the shadow forming portion of the present invention) formed on the upper surface 32a of the tape feeder 3a. I ask for it. Therefore, the sphere 34 and the cylindrical body 35 are not provided in the tape feeder 3a.

  More specifically, in the component mounting apparatus M according to the second embodiment, in the process of step S5 shown in FIG. 8, the control device 40, as shown in FIG. The substrate recognition unit 18 is arranged so that the optical axis O of the area sensor camera 20 is positioned at the end of the cover member 37 on the Y2 direction side, and the upper surface 32a of the tape feeder 3a is imaged by the substrate recognition unit 18 in this state. In this case, the control device 40 controls the lighting device 21 to the second lighting state.

  As shown in the figure, under the second illumination state, only the LED 22 in the first area Ea on the Y1 direction side of the outer illumination unit 24 that is ring-shaped illumination is turned on, and as a result, a vertical axis (light Illumination light from a specific direction inclined with respect to the axis O) (illumination light traveling from the Y1 direction side to the Y2 direction side) is applied to the cover member 37, and a shadow (book) of the cover member 378 is applied to the upper surface 32a of the tape feeder 3a. One of the optical images of the invention is formed. And when the height of the tape feeder 3a shown in FIG. 14 is the standard height ha, if the height of the tape feeder 3a is deviated from the standard height ha as shown in FIG. The position of the shadow tip is shifted in the Y direction by that amount. In other words, the length of the shadow in the Y direction changes. Therefore, the control device 40 obtains the amount of deviation of the shadow tip in the Y direction, that is, the amount of deviation L2 of the shadow tip from the standard shadow tip position when the tape feeder 3a is at the standard height ha, and this amount of deviation L2 Is converted into a deviation amount in the vertical direction (Z direction) of the tape feeder 3a based on a geometrical relationship such as an illumination angle of illumination light, and the height of the tape feeder 3a is calculated based on the converted value and the standard height ha. I ask for it.

  In the second embodiment, the storage unit 42 uses the standard height ha of the tape feeder 3a, the standard shadow tip position, and the horizontal shift amount Y2 of the shadow tip as the vertical shift amount. Data such as a conversion formula to be converted is stored. Therefore, in the process of step S7 in FIG. 8, the control device 40 acquires the image data acquired in the process of step S5 and the standard shadow stored in the storage unit 42. The height of the tape feeder 3a is obtained based on data such as the tip position.

  The specific height measuring method of the tape feeder 3a is not limited to this embodiment. For example, the correlation between the shadow position (tip position) and the height of the tape feeder 3a is checked in advance to store the storage unit. The height of the tape feeder 3a may be obtained based on the correlation data and the shadow position obtained from the image.

  According to the component mounting apparatus M of the second embodiment as described above, the height of the tape feeder 3a is measured without providing a dedicated laser light source, as with the component mounting apparatus M of the first embodiment. Can do. Accordingly, as with the component mounting apparatus M of the first embodiment, the height of the tape feeder 3a can be increased with a simple configuration without encouraging an increase in the size and weight of the head unit 5 and without a significant increase in cost. It is possible to perform the measurement, and more reliably to take out the component by the head 16 from the tape feeder 3a.

  Further, there is an advantage that the height of the tape feeder 3a can be measured without providing a special member for height measurement on the tape feeder 3a side.

  In the component mounting apparatus M of the second embodiment, the cover member 37 provided in the component supply unit 3 is used as the shadow forming unit of the present invention, and the shadow member is formed at the position of the shadow formed on the upper surface of the tape feeder 3a by the cover member 37. Although the height of the tape feeder 3a is obtained based on this, the height of the tape feeder 3a may be obtained based on the position of a shadow formed by the other part of the component supply unit 3. In that case, in addition to using an existing component such as the cover member 37 as a shadow forming member, a dedicated shadow forming unit for forming a shadow may be provided in the component supply unit 3. In addition to forming a shadow by the member of the component supply unit 3 as described above, a projection or the like is provided as a shadow forming unit on the upper surface 32a of the tape feeder 3a, and the shadow is formed based on the position of the shadow formed by the projection. You may comprise so that the tape feeder 3a may be formed.

  As mentioned above, although 1st, 2nd embodiment of this invention was described, the component mounting apparatus M and the tape feeder 3a in the said embodiment are illustrations of preferable embodiment of the component mounting apparatus and tape feeder which concern on this invention. Specific configurations of the component mounting apparatus M and the tape feeder 3a can be appropriately changed without departing from the gist of the present invention.

  The present invention described above is summarized as follows.

  A component mounting apparatus according to one aspect of the present invention includes a component supply unit in which a tape feeder having a component extraction unit on an upper surface is installed, and takes out the component from the tape feeder installed in the component supply unit, and conveys the component A head unit to be mounted on a substrate placed at a predetermined mounting work position, a camera mounted on the head unit and imaging an object located below the head unit, and illumination light for imaging from above An imaging device including an illumination device that irradiates an object, and the head unit and the imaging device are controlled to recognize the position of the substrate. In order to obtain the height of the tape feeder installed in the image pickup process and the component supply unit, the upper surface of the image pickup device is the tape feeder as the object. And a control device that executes a second imaging process for capturing an image by the image processing apparatus, and a processing device that executes a process for obtaining the height of the tape feeder based on the image data obtained by the second imaging process. Includes a plurality of light sources arranged around the optical axis of the camera, and a first illumination state that irradiates the object with light from all light sources, and a part of the plurality of light sources. By irradiating the object with only light from the light source, the illumination state can be switched to a second illumination state in which the object is irradiated with light from a specific direction inclined with respect to a vertical axis, and the control is performed. The apparatus controls the lighting device to the first lighting state during the first imaging process, and controls the lighting device to the second lighting state during the second imaging process. A component mounting apparatus characterized by that.

  According to this component mounting apparatus, by switching the illumination state of the illumination device (switching between the first illumination state and the second illumination state), the first light is emitted from the light source onto the substrate and images the surface of the substrate. The imaging process is performed by irradiating the object with only light from a part of the light source, thereby irradiating the upper surface of the tape feeder with light from a specific direction inclined with respect to the vertical axis, and imaging the tape feeder. The two imaging processes can be performed using a common imaging apparatus. That is, the illuminating device used for substrate recognition can be shared as a light source for measuring the height of the tape feeder. Therefore, it is possible to measure the height of the tape feeder without separately providing a dedicated light source (laser light source). Therefore, according to this component mounting apparatus, it is possible to measure the height of the tape feeder with a simple configuration without encouraging an increase in the size and weight of the head unit, and without significantly increasing the cost. It becomes possible to more reliably take out the parts from the tape feeder.

  In this case, the lighting device turns on all of the plurality of light sources in the first lighting state, and turns on only some of the plurality of light sources in the second lighting state. Is preferred.

  According to this configuration, it is possible to switch between the first illumination state and the second illumination state with a simple configuration in which the light source is simply turned on or off.

  In the component mounting apparatus, the processing device obtains a height of the tape feeder based on a position of an optical image formed on the upper surface of the tape feeder by the illumination light among images captured by the imaging device. is there.

  With this configuration, the height of the tape feeder can be determined relatively easily from the geometric relationship between the position of the optical image and the illumination light irradiation direction (the specific direction).

  For example, the processing apparatus obtains the height of the tape feeder based on the position of the bright spot with the bright spot formed on the upper surface of the tape feeder by the reflection of the illumination light as the optical image.

  According to this configuration, it is possible to obtain the height of the tape feeder by a simple process based on the above geometrical relationship by utilizing the fact that the position of the bright spot is shifted in the horizontal direction according to the height of the tape feeder. Become.

  In addition, when including a tape feeder installed in the component supply unit and having a component take-out unit on the upper surface, the reflection of the illumination light is promoted on the upper surface of the tape feeder during the second imaging process. It is preferable that a mirror-like part for assisting the formation of the dots is provided.

  According to this configuration, it becomes possible to form the bright spot on the upper surface of the tape feeder better, which is advantageous in increasing the accuracy of measuring the height of the tape feeder.

  In this case, it is preferable that the mirror-like portion has a shape that curves upward.

  According to this configuration, it is possible to more strongly reflect the illumination light irradiated from the oblique direction on the upper surface of the tape feeder to the camera side, so that the bright spot reflected in the image becomes clear, and the bright spot on the image becomes clear. The position can be specified more accurately.

  The component mounting apparatus includes a shadow forming unit configured to form a shadow on an upper surface of a tape feeder installed in the component supply unit by the illumination light during the second imaging process. However, the height of the tape feeder may be obtained based on the position of the shadow using the shadow as the optical image.

  According to this configuration, it is possible to obtain the height of the tape feeder by a simple process from the above geometric relationship by utilizing the fact that the position of the shadow is shifted in the horizontal direction according to the height of the tape feeder.

  In this case, it is preferable that the shadow forming portion is a cover member that covers a part of the upper surface of the tape feeder.

  According to this configuration, it is possible to form the shadow on the tape feeder with a reasonable configuration without providing a dedicated shadow forming unit.

  In addition, when including the tape feeder provided in the said component supply part and provided with a component taking-out part on the upper surface, the said shadow formation part may be provided in the said tape feeder.

  According to this configuration, by providing the shadow forming unit corresponding to the structure of the tape feeder, it is possible to form an optimum shadow for height measurement, which is advantageous in increasing measurement accuracy.

  On the other hand, the tape feeder according to one aspect of the present invention is the above-described component mounting apparatus, and more specifically, the processing apparatus uses the bright spot formed on the upper surface of the tape feeder by the reflection of illumination light as the optical image. A tape feeder that is installed in the component supply unit of a component mounting apparatus configured to obtain the height of a tape feeder based on the position of a point and supplies components, and the second surface is provided on the upper surface of the tape feeder. A mirror-like portion that assists the formation of the bright spot by promoting the reflection of the illumination light during the imaging process is provided.

  According to this tape feeder, when used in the component mounting apparatus, the bright spot can be satisfactorily formed on the upper surface of the tape feeder. Therefore, it is useful for the component mounting apparatus that obtains the height of the tape feeder based on the position of the bright spot.

  In this case, it is preferable that the mirror-like portion has a shape that curves upward.

  According to this configuration, it is possible to more strongly reflect the illumination light irradiated on the upper surface of the tape feeder from an oblique direction to the camera side, so that the bright spot reflected in the image becomes clear. Accordingly, it is possible to increase the height measurement accuracy of the tape feeder in the component mounting apparatus.

  Further, the tape feeder according to another aspect of the present invention is based on the position of the above-described component mounting apparatus, and more specifically, the processing apparatus uses the shadow formed on the upper surface of the tape feeder as the optical image. A tape feeder that is installed in the component supply unit of the component mounting apparatus for obtaining the height of the tape feeder and supplies components, and is installed in the component supply unit by the illumination light during the second imaging process. A shadow forming portion for forming a shadow on the upper surface of the tape feeder.

  According to this tape feeder, when used in the component mounting apparatus, it is possible to satisfactorily form the shadow on the upper surface of the tape feeder. Therefore, it is useful for the component mounting apparatus that obtains the height of the tape feeder based on the position of the shadow.

Claims (12)

A component supply unit in which a tape feeder having a component take-out unit on the upper surface is installed;
A head unit that takes out a component from a tape feeder installed in the component supply unit, transports the component, and mounts it on a substrate placed at a predetermined mounting work position;
An imaging device including a camera that is mounted on the head unit and that images an object located below it from above, and an illumination device that irradiates the object with illumination light for imaging from above;
In order to control the head unit and the imaging device and recognize the position of the substrate, a first imaging process for imaging the upper surface by the imaging device with the substrate as the object and the component supply unit are installed. In order to obtain the height of the tape feeder, a control device that executes a second imaging process in which the imaging device captures the upper surface of the tape feeder as the object;
A processing device that executes processing for obtaining the height of the tape feeder based on the image data obtained by the second imaging processing,
The illumination device includes a plurality of light sources arranged around the optical axis of the camera, and includes a first illumination state that irradiates the object with light from all light sources, and the plurality of light sources. By irradiating the object with only the light of a part of the light source, the illumination state can be switched to the second illumination state in which the object is irradiated with light from a specific direction inclined with respect to a vertical axis. ,
The control device controls the illumination device to the first illumination state during the first imaging process, and controls the illumination device to the second illumination state during the second imaging process. A component mounting apparatus characterized by: The component mounting apparatus according to claim 1,
The lighting device turns on all of the plurality of light sources in the first lighting state and turns on only some of the plurality of light sources in the second lighting state. Mounting device. In the component mounting apparatus according to claim 1 or 2,
The processing apparatus determines a height of the tape feeder based on a position of an optical image formed on an upper surface of the tape feeder by the illumination light among images captured by the imaging apparatus. In the component mounting apparatus according to claim 3,
The processing apparatus uses the bright spot formed on the upper surface of the tape feeder by the reflection of the illumination light as the optical image to determine the height of the tape feeder based on the position of the bright spot. apparatus. In the component mounting apparatus according to claim 4,
Including a tape feeder installed in the component supply unit and provided with a component take-out unit on the upper surface;
A component mounting apparatus, characterized in that a mirror-like part is provided on the upper surface of the tape feeder to assist the formation of the bright spot by promoting reflection of the illumination light during the second imaging process. . In the component mounting apparatus according to claim 5,
The component mounting apparatus according to claim 1, wherein the mirror-like portion has a shape that curves upward. In the component mounting apparatus according to claim 3,
A shadow forming unit for forming a shadow on the upper surface of the tape feeder installed in the component supply unit by the illumination light during the second imaging process;
The processing apparatus determines the height of a tape feeder based on the position of the shadow, using the shadow as the optical image. In the component mounting apparatus according to claim 7,
The component mounting apparatus, wherein the shadow forming unit is a cover member that covers a part of the upper surface of the tape feeder. In the component mounting apparatus according to claim 7,
Including a tape feeder installed in the component supply unit and provided with a component take-out unit on the upper surface;
The component mounting apparatus, wherein the shadow forming member is provided on the tape feeder. A tape feeder that is installed in the component supply unit of the component mounting apparatus according to claim 4 and supplies components,
A tape feeder provided on the upper surface of the tape feeder is provided with a mirror-like portion that assists the formation of the bright spot by promoting the reflection of the illumination light during the second imaging process. . The tape feeder according to claim 10, wherein
The tape feeder is characterized in that the mirror-like portion is curved upward. A tape feeder that is installed in the component supply unit of the component mounting apparatus according to claim 7 and supplies components.
A tape feeder comprising a shadow forming unit for forming a shadow on the upper surface of the tape feeder installed in the component supply unit by the illumination light during the second imaging process.

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