JPWO2015170373A1 - Component mounter - Google Patents

Abstract

The present invention is a component mounting machine equipped with a component mounting device having a plurality of feeder devices in a detachable manner, a component transfer device having a mounting nozzle, a mounting head, and a head driving mechanism. One feeder device has a nozzle holding portion that detachably holds a specific mounting nozzle that can collect electronic components of a predetermined component type supplied by itself, and the component transfer device is mounted up to the nozzle holding portion. A specific mounting nozzle is mounted on the head, and an electronic component of a predetermined component type is collected at the supply position by the specific mounting nozzle and mounted on the substrate. As a result, the production efficiency of the substrate on which the electronic component of the predetermined component type is mounted can be improved, and the operator's setup change work can be reduced.

Description

  The present invention relates to a component mounter that mounts a large number of electronic components on a board, and more specifically, an arrangement position and structure of a nozzle holding portion that detachably holds a mounting nozzle that collects and mounts the electronic components on the board. About.

  As a device for producing a substrate on which a large number of electronic components are mounted, there are a solder printer, a component mounting machine, a reflow furnace, a board inspection machine, and the like, and these are often connected to construct a board production line. Of these, the component mounting machine generally includes a substrate transfer device, a component supply device, and a component transfer device. The substrate transfer device carries in and out the substrate and positions the substrate. The component supply device supplies electronic components of a plurality of component types. The component supply device includes a feeder device that supplies small chip components and the like from a tape wound around a reel, and a tray device that supplies relatively large electronic components from a tray. The component transfer device mounts electronic components on a substrate. The component transfer device includes a mounting nozzle that collects an electronic component from the component supply device and mounts the electronic component on the substrate, a mounting head that is mounted so that the mounting nozzle can be replaced, and a head drive mechanism that drives the mounting head.

  In this type of component mounting machine, a plurality of types of mounting nozzles are prepared according to the size and shape of various electronic components supplied from a component supply device, and are mounted on the mounting head in a replaceable manner. The plurality of types of mounting nozzles are generally supplied from a nozzle changer disposed on the upper surface of the machine base. When the type of substrate to be produced is changed, the type of mounted nozzle held by the nozzle changer may be excessive or insufficient. In this case, the worker replaces the mounting nozzle on the nozzle changer by the setup change work. Patent Documents 1 and 2 disclose technical examples of a component mounting machine that equips a mounting head with a plurality of types of mounting nozzles in a replaceable manner.

  The circuit component supply system disclosed in Patent Document 1 by the applicant of the present application includes a supply device that accommodates and supplies circuit components and a component holder (mounting nozzle) in the same form, and a movable member that detachably holds the component holder. (Mounting head) and moving the moving member by moving the receiving member to receive the component holder from the supply device, and applying the same movement to the component holding member held by the moving member to move the circuit component from the supplying device. And a moving member moving device (head driving mechanism) to be received. Thereby, the efficiency of the whole circuit component supply including replacement | exchange of a component holder can be improved.

  The electronic component mounting apparatus of Patent Document 2 is provided with an assembly in which a plurality of electronic component feeders are arranged in a fixed state or detachable with respect to the electronic component mounting apparatus body, and a suction nozzle of the mounting head (mounting head) The electronic component is received from the electronic component feeder by the (mounting nozzle) and mounted on the substrate, and one or a plurality of suction nozzle holders are detachably provided at appropriate positions of the assembly. Thus, an efficient movement path of the mounting head can be selected from the suction nozzle holder to the electronic component feeder, and the mounting time of the electronic component is shortened as the moving distance is shortened. That is, a plurality of types of mounting nozzles are held by the component supply device instead of being held by the nozzle changer on the machine base, so that the moving distance of the mounting head is shortened.

Japanese Patent Laid-Open No. 11-186791 JP 11-340692 A

  By the way, in order to supply a specific electronic component having a special shape by the feeder device, a special-shaped mounting nozzle (special nozzle) may be required. In this case, even if the types of substrates on which the specific electronic components are mounted are limited and the special nozzle is not used regularly, it is necessary to provide a special holding portion in the nozzle changer to hold the special nozzle. As a result, the frequency of exchanging the special nozzle in the setup change operation is increased, and there is a problem that a laborious work for the operator is required. Alternatively, there is a problem in that the dedicated holding portion of the nozzle changer cannot be effectively used, and the number of types of mounted nozzles is limited. Furthermore, when the number of types of mounting nozzles is insufficient, there arises a problem that it is necessary to entrust the mounting operation of the specific electronic component to another component mounting machine. These problems may lead to a decrease in substrate production efficiency.

  With respect to these problems, the technique of Patent Document 1 is mainly applied to a tray apparatus, and thus cannot be applied to a feeder apparatus. Moreover, although the technique of patent document 2 has changed the position which hold | maintains a mounting nozzle, since it does not necessarily increase the number of types of mounting nozzles, it does not solve a problem. In addition, in Patent Document 2, when the assembly of electronic component feeders is replaced at once in the setup change operation, the suction nozzle holder provided at an appropriate position of the assembly is also replaced. For this reason, the suction nozzle that can be used regularly that does not need to be replaced is also removed, which is inefficient.

  The present invention has been made in view of the problems of the background art described above, and by holding the specific mounting nozzle in the feeder device, it is possible to improve the board production efficiency and reduce the number of operator's setup change work. Providing a machine is an issue to be solved.

  The invention of a component mounter that solves the above-described problems is a component supply device that detachably includes a plurality of feeder devices that feed out a tape holding a plurality of electronic components in a row and sequentially supply the electronic components to respective supply positions. A mounting nozzle that collects the electronic component at the supply position and mounts the electronic component on the substrate, a mounting head that is replaceably equipped with the mounting nozzle, and a component transfer device that includes a head drive mechanism that drives the mounting head; The at least one feeder device has a nozzle holding part that detachably holds a specific mounting nozzle capable of collecting electronic components of a predetermined component type supplied by itself. The component transfer device is equipped with the specific mounting nozzle in the mounting head driven up to the nozzle holding unit, and the predetermined mounting nozzle is used for the predetermined mounting at the supply position. Varieties electronic components are taken is attached to the substrate.

  According to this, at least one feeder apparatus has a nozzle holding part which detachably holds a specific mounting nozzle capable of collecting an electronic component of a predetermined component type supplied by itself, and has an electronic component of a predetermined component type And a specific mounting nozzle can be supplied as a set. On the other hand, in the component transfer device, the mounting head is equipped with a specific mounting nozzle at the nozzle holding portion, and an electronic component of a predetermined component type can be collected and mounted on the substrate by the specific mounting nozzle at the supply position. Therefore, the mounting head can move a short distance from the nozzle holder to the supply position in a short time, and can collect electronic components of a predetermined component type. Further, even if the electronic component of a predetermined component type has a special shape, a suitable specific mounting nozzle is always supplied, so that the mounting operation is not entrusted to another component mounting machine. In addition, the nozzle changer on the machine base need not be provided with a holding unit dedicated to the specific mounting nozzle, and a plurality of holding units of the nozzle changer can be effectively used. As these comprehensive effects, it is possible to improve the production efficiency of a substrate on which electronic components of a predetermined component type are mounted.

  Furthermore, when changing the type of board to be produced, if a feeder device that supplies electronic components of a predetermined component type is attached to and detached from the component supply device main body, the specific mounting nozzle is automatically attached and removed. Become. This eliminates the need to hold or remove the specific mounting nozzle on the nozzle changer, thereby reducing the operator's setup change work.

It is a perspective view which shows the structure which has arrange | positioned two component mounting machines of 1st Embodiment on the common base. It is a perspective view which shows the structure of the mounting head of a component transfer apparatus. It is side surface partial sectional drawing which illustrates typically the detailed structure of a specific feeder apparatus. It is an enlarged plan view which shows the nozzle holding part arrange | positioned at the front-end | tip of the upper part of a specific feeder apparatus, and the supply position of the vicinity. In the application example of 1st Embodiment, it is a side fragmentary sectional view which illustrates the detailed structure of a specific feeder apparatus typically. It is an enlarged plan view which shows the front-end | tip part of the upper part of the specific feeder apparatus used for the component mounting machine of 2nd Embodiment.

  A component mounter 1 according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing a configuration in which two component mounters 1 of the first embodiment are arranged on a common base 21. The component mounter 1 is configured by assembling a substrate transport device 3, a component supply device 4, a component transfer device 5, a component camera 6, a nozzle changer 7, a control computer, and the like on the machine base 2. The X-axis direction in the figure is a direction in which the substrate K is carried in and out, and the Y-axis direction is a direction orthogonal to the X-axis direction in the horizontal plane.

  The board transfer device 3 is disposed near the center in the longitudinal direction (Y-axis direction) of the component mounting machine 2. The substrate transfer device 3 is a so-called double conveyor type device in which a first transfer device 31 and a second transfer device 32 are arranged in parallel. The first transport device 31 includes a pair of guide rails arranged in parallel on the machine base 2 in parallel in the X-axis direction, and a pair of conveyor belts (not shown) that are guided by the guide rails and place and transport the substrate K. ) Etc. Further, the first transport device 31 is provided with a clamp device (not shown) that pushes up and positions the substrate K transported to the component mounting position from the machine base 2 side. The second transport device 32 is configured in the same manner as the first transport device 31.

  The component supply device 4 is provided at the front portion in the longitudinal direction of the component mounter 1 (left front side in FIG. 2). The component supply device 4 includes a plurality of feeder devices 41 that are detachably attached in a row on a main body (not shown). Individual feeder devices 41 can be individually replaced. Moreover, all the feeder apparatuses 41 can also be replaced | exchanged collectively with a main-body part. The feeder device 41 includes a feeder main body 42 and a supply reel 43 that is rotatably and detachably attached to a rear portion of the feeder main body 42 (front side of the component mounting machine 1). A tape 44 holding a plurality of electronic components in a row is wound around the supply reel 43. The tip of the tape 44 is fed out, and different electronic components are supplied for each type of tape 44. The detailed structure of the feeder device 41 will be described later.

  The component transfer device 5 is a so-called XY robot type device that can move in the X-axis direction and the Y-axis direction. The component transfer device 5 is disposed from the rear portion in the longitudinal direction of the component mounter 1 (the right back side in FIG. 2) to the upper portion of the front component supply device 4. The component transfer device 5 includes a head driving mechanism 51, a mounting head 52, a mounting nozzle 53, and the like. The head drive mechanism 51 drives the mounting head 52 in the X-axis direction and the Y-axis direction in the horizontal plane. The head driving mechanism 51 can be configured by appropriately adopting various known techniques.

  FIG. 2 is a perspective view showing the structure of the mounting head 52 of the component transfer apparatus 5. The mounting head 52 includes a head main body 521, an X-axis slider 522, a nozzle holder 523, a substrate recognition camera 524, and the like. The head main body 521 is a box-like member, and has a pressure adjustment mechanism and a nozzle drive mechanism that are not visible in the drawing. The pressure adjusting mechanism includes a first pressure source for mounting the mounting nozzle 53 on the nozzle holder 523 and a second pressure source for sucking electronic components by the mounted mounting nozzle 53. The pressures of the first pressure source and the second pressure source are configured to be adjusted and controlled to a negative pressure and a positive pressure independently of each other. The nozzle drive mechanism drives the mounting nozzle 53 mounted on the nozzle holder 523 up and down and rotationally drives it around the axis.

  The X-axis slider 522 is a member that assembles the back surface of the head main body 521 to the head driving mechanism 51. The nozzle holder 523 has a substantially cylindrical shape and is disposed downward on the lower surface of the head main body 521. In the lower part of the nozzle holder 523, a negative pressure chamber for adsorbing and mounting the mounting nozzle 53 by negative pressure and a nozzle communication path communicating with the mounted mounting nozzle 53 are formed. The negative pressure chamber communicates with the first pressure source via an air flow path, an on-off valve, and the like. The nozzle communication path communicates with the second pressure source via an air flow path, an on-off valve, and the like. The nozzle holder 523 can be equipped with a plurality of types of mounting nozzles 53 in a replaceable manner.

  The substrate recognition camera 524 is arranged on the lower surface of the head main body 521 so as to be aligned with the nozzle holder 523. The substrate recognition camera 524 images a fiducial mark or an identification code attached to the substrate K. As the substrate recognition camera 524, a CCD camera or the like can be used.

  The mounting nozzle 53 includes a disk-shaped suction stand 531, a cylindrical connecting portion 532, and a thin cylindrical nozzle suction portion 533. A supply hole that penetrates in the vertical direction and communicates with the inside of the nozzle suction portion 533 via the connecting portion 532 is formed in the center of the suction stand 531. The suction stand 531 is disposed to face the lower surface of the nozzle holder 523. When the negative pressure chamber of the nozzle holder 523 is adjusted to a negative pressure, the upper surface of the suction table 53 is sucked into the negative pressure chamber. As a result, the mounting nozzle 53 is mounted on the mounting head 52. At this time, the supply hole of the mounting base 271 communicates with the nozzle communication path of the nozzle holder 523, whereby the pressure of the second pressure source is supplied to the nozzle suction part 533. Further, when the negative pressure in the negative pressure chamber is eliminated, the mounting nozzle 53 is released from the mounting head 52.

  The nozzle suction portion 533 has an opening at the lower end of the thin cylindrical shape. The nozzle suction part 533 picks up and collects the electronic component in the opening when the inside becomes negative pressure, and releases the electronic component from the opening when the inside becomes positive pressure. Corresponding to the size of the electronic component to be attracted, the fitting range is limited for the diameter of the narrow cylindrical shape of the nozzle suction portion 533 and the size of the opening. Generally, the size of the opening of the nozzle suction part 533 is about 50 to 80% of the size of the electronic component. Therefore, a plurality of types of mounting nozzles 53 having different nozzle suction portions 533 are used. Usually, a plurality of general-purpose mounting nozzles 53 in which the size of the nozzle suction part 533 is set in stages are held in a nozzle changer 7 described later.

  Returning to FIG. 1, the component camera 6 is provided upward on the upper surface of the machine base 2 between the substrate transfer device 3 and the component supply device 4. The component camera 6 captures and detects the state of an electronic component that is sucked and collected at the lower end of the mounting nozzle 53 while the mounting head 52 moves from the component supply device 4 onto the substrate K. When the component camera 6 detects an error in the suction position of the electronic component, a deviation in the rotation angle, a bending of the lead, etc., the component mounting operation is finely adjusted as necessary, and the electronic component that is difficult to mount is discarded.

  The nozzle changer 7 is disposed at a position adjacent to the component camera 6 on the machine base 2. The nozzle changer 7 holds the mounting nozzles 53 in a plurality of nozzle holding holes, in the example of FIG. The number of nozzle holding holes of the nozzle changer 7 and the arrangement position on the machine base 2 can be changed as appropriate.

  The control computer is linked to the substrate transfer device 3, the component supply device 4, the component transfer device 5, and the component camera 6 by control lines, and issues commands while appropriately exchanging information. A terminal device 8 for an operator to access the control computer is disposed at the front portion of the cover 22 above the machine base 2. The control computer controls the component mounting operation based on a preset component mounting sequence. The component mounting sequence designates the type, quantity, mounting order, and the like of electronic components mounted on the board by the component mounter 1. Furthermore, the component mounting sequence also designates the slot position on the main body of the feeder device 41 for collecting electronic components, the mounting coordinate position on the substrate K, the type of mounting nozzle 53 used for mounting, and the like.

  The component transfer device 5 performs the following series of component mounting operations in accordance with control from the control computer. First, the component transfer device 5 drives the mounting head 52 to a certain feeder device 41 of the component supply device 4 to suck the electronic component to the lower end of the mounting nozzle 53. Next, when the component transfer device 5 drives the mounting head 52 to the component camera 6, the component camera 6 captures an electronic component suction state. Thirdly, the component transfer device 5 drives the mounting head 52 to the substrate K and mounts the electronic component at a predetermined mounting coordinate position on the substrate K. When the mounting nozzle 53 needs to be replaced, the component transfer device 5 drives the mounting head 52 to the nozzle changer 7 to release the mounted nozzle 53 and suck the new mounting nozzle 53. Equipped.

  Next, the detailed structure of the feeder apparatus 41 is demonstrated. The feeder device 41 has a flat shape that is long in the vertical direction and the front-back direction and narrow in the width direction. The feeder device 41 is installed by being inserted into one of a plurality of slots engraved in parallel with the upper surface of the main body of the component supply device 4 from the front of the component mounter 1. Here, the tip (front) of the feeder device 41 to be inserted is directed to the rear part of the component mounter 1, and the front and rear names of the feeder device 41 and the component mounter 1 are reversed.

  In the first embodiment, a part of the plurality of feeder devices 41 is a specific feeder device 41 </ b> S having a nozzle holding unit 46. FIG. 3 is a partial side cross-sectional view for schematically explaining the detailed structure of the specific feeder device 41S. FIG. 4 is an enlarged plan view showing the nozzle holding portion 46 disposed at the top end of the specific feeder device 41S and the supply position 45 in the vicinity thereof.

  As shown in FIGS. 3 and 4, at least one specific feeder device 41 </ b> S has a nozzle holding portion 46 at the top end. Many ordinary feeder apparatuses 41 do not have the nozzle holding part 46. The nozzle holding part 46 is formed by an annular part 461 arranged horizontally and a nozzle holding hole 462 at the center of the annular part 461. When holding the specific mounting nozzle 53 </ b> S, the nozzle holding part 46 places the suction table 531 on the annular part 461 and accommodates the connecting part 532 and the nozzle suction part 533 in the nozzle holding hole 462.

  The specific feeder device 41S may further be provided with a nozzle lock mechanism. The nozzle lock mechanism locks the separation of the specific mounting nozzle 53S from the nozzle holding portion 46 when the specific feeder device 41S is detached from the main body of the component supply device 4. The nozzle lock mechanism can be configured by a combination of a locking member and a biasing member, for example. The locking member locks the upper surface of the suction table 531 of the specific mounting nozzle 53S held by the nozzle holding portion 46 at the locking position and releases it at the separation position. While the specific feeder device 41S is attached to the main body of the component supply device 4, the biasing member biases the locking member to the disengaged position. And if specific feeder apparatus 41S is removed from the main-body part of the components supply apparatus 4, a biasing member will urge a locking member to a locking position.

  The specific feeder device 41 </ b> S has a supply position 45 in the vicinity of the rear side of the nozzle holding unit 46. A substantially rectangular tape feeding hole 47 is formed between the nozzle holding portion 46 and the supply position 45. As can be seen from the tape 44 feeding method described later, the tape feeding hole 47 is a path for discharging the bottom tape 442 fed forward. Further, the specific feeder device 41 </ b> S has a nozzle holding portion 46 ahead of the supply position 45 for feeding the tape 44.

  The tape 44 includes a top tape 441 and a bottom tape 442 (shown in FIG. 3). The bottom tape 442 is formed of a flexible material such as paper or resin. As shown in FIG. 4, the bottom tape 442 is provided with a large number of rectangular storage recesses 443 at equal pitches in the length direction. One electronic component P is stored in each storage recess 443. A top tape 441 is detachably attached to the surface of the bottom tape 442. The top tape 441 is formed of a transparent polymer film or the like. The top tape 441 and the bottom tape 442 hold the electronic component P in the housing recess 443.

  Near the side edges on both sides of the top tape 441 and the bottom tape 442, a number of engagement holes 444 are formed in parallel with the side edges at regular intervals in the length direction. The sprocket of the tape feeding mechanism engages with the engagement hole 444 and is driven to rotate. As a result, the tape 44 is unwound from the supply reel 43 and reaches the supply position 45. At the supply position 45, the top tape 441 is peeled from the bottom tape 442, and the electronic component P can be supplied.

  At this time, as shown in FIG. 3, the top tape 441 is returned obliquely upward and rearward from the supply position 45 by a tape peeling mechanism (not shown). On the other hand, the bottom tape 442 is fed downward from the tape feeding hole 47 on the front side of the supply position 45. Thereafter, the bottom tape 442 is guided by a guide member (not shown), passes through the lower side and the front side of the nozzle holding portion 46 as shown in FIG. 3, and is finally discharged downward. With this configuration, the discharge path of the tape 44 of the specific feeder device 41 </ b> S having the nozzle holding portion 46 can be aligned with that of the ordinary feeder device 41.

  The nozzle holding unit 46 detachably holds a specific mounting nozzle 53S that can collect an electronic component P of a predetermined component type supplied by the specific feeder device 41S itself. The specific mounting nozzle 53S preferably has a special structure suitable for the electronic component P having a special shape, and the nozzle holder 523 can be equipped even if it has a special structure. For example, a specific mounting nozzle 53S having a large nozzle suction portion 533 adapted to a special large electronic component P, a specific mounting nozzle 53S that uses a pinching function by a pair of fingers when sucking the electronic component P, and the like are applicable. Therefore, the specific mounting nozzle 53S is different in structure from the plurality of general-purpose mounting nozzles 53 held by the nozzle changer 7. Further, the inner diameter of the nozzle holding hole 462 of the nozzle holding portion 46 of the specific feeder device 41 </ b> S is different from the inner diameter of the nozzle holding hole of the nozzle changer 7. Furthermore, there may be a structural difference other than a difference in inner diameter between the nozzle holding portion 46 of the specific feeder device 41S and the nozzle holding hole of the nozzle changer 7.

  Next, the operation of the component mounter 1 according to the first embodiment configured as described above will be described. Consider a case where a board on which a large number of electronic components including electronic components P of a predetermined component type are mounted is produced. In this case, a large number of ordinary feeder devices 41 and at least one specific feeder device 41S are attached to the main body portion of the component supply device 4 by a setup change operation. When the control computer starts control based on the component mounting sequence, the component transfer apparatus 5 starts the component mounting operation by driving the mounting head 52. While the electronic component is collected from the normal feeder device 41, the component transfer device 5 advances the component mounting operation while replacing the mounting nozzle 53 mounted on the mounting head 52 with the nozzle changer 7.

  When it is time to collect the electronic component P of a predetermined component type from the specific feeder device 41S in the component mounting sequence, the component transfer device 5 first drives the mounting head 52 to the nozzle changer 7 to mount the mounted component. The nozzle 53 is released. Next, the component transfer device 5 drives the mounting head 52 to the nozzle holding portion 46 of the specific feeder device 41S, and equips the specific mounting nozzle 53S. Third, the component transfer device 5 drives the mounting head 52 and the specific mounting nozzle 53S to the nearby supply position 45 and collects the electronic component P of a predetermined component type. Fourthly, the component transfer device 5 drives the mounting head 52 and the specific mounting nozzle 53S to the component camera 6 for photographing, and further drives to the substrate K to mount the electronic component P of a predetermined component type.

  After that, if there is a specific electronic component to be mounted using the specific mounting nozzle 53S in the other feeder device 41, the component transfer device 5 performs the mounting operation for all of the specific electronic components. When this is finished, the component transfer device 5 drives the mounting head 52 again to the nozzle holding portion 46 of the specific feeder device 41S, and returns the specific mounting nozzle 53S to the nozzle holding portion 46. Next, the component transfer device 5 drives the mounting head 52 to the nozzle changer 7 to equip any of the mounting nozzles 53 on the nozzle changer 7 and continues the component mounting operation thereafter.

  The component mounting machine 1 according to the first embodiment is a component supply device having a plurality of detachable feeder devices 41 that feed out the tape 44 holding a plurality of electronic components in a row and sequentially supply the electronic components to respective supply positions. 4, a mounting nozzle 53 that picks up an electronic component at a supply position and mounts the electronic component on the substrate K, a mounting head 52 that is replaceably mounted on the mounting nozzle 53, and a head drive mechanism 51 that drives the mounting head 52. The component mounting machine 1 provided with the apparatus 5 in the machine base 2, and at least one specific feeder device 41 </ b> S attaches / detaches a specific mounting nozzle 53 </ b> S capable of collecting an electronic component P of a predetermined component type supplied by itself. The component transfer device 5 includes a specific mounting nozzle 53S on the mounting head 52 that has been driven up to the nozzle holding unit 46. Were taken electronic component P predetermined portion breeds supply position by 3S is mounted on a substrate K.

  According to this, at least one specific feeder apparatus 41S has the nozzle holding part 46 which hold | maintains the specific mounting nozzle 53S which can extract | collect the electronic component P of the predetermined component type which self supplies, and is predetermined, and is predetermined. The electronic component P of the component type and the specific mounting nozzle 53S can be supplied as a set. On the other hand, the component transfer device 5 equips the mounting head 52 with the specific mounting nozzle 53S by the nozzle holding unit 46, and collects an electronic component P of a predetermined component type at the supply position 45 by the specific mounting nozzle 53S. Can be installed. Therefore, the mounting head 52 can move the short distance from the nozzle holding unit 46 to the supply position 45 in a short time, and collect the electronic component P of a predetermined component type. Further, even if the electronic component P of the predetermined component type has a special shape, the compatible specific mounting nozzle 53S is always supplied, so that the mounting operation is not entrusted to another component mounting machine. In addition, the nozzle changer 7 on the machine base 2 does not need to be provided with a holding unit dedicated to the specific mounting nozzle, and a plurality of holding units of the nozzle changer 7 can be effectively used. As these comprehensive effects, the production efficiency of the substrate K on which the electronic component P of a predetermined component type is mounted can be improved.

  Furthermore, when changing the type of the substrate K to be produced, if the specific feeder device 41S for supplying the electronic component P of the predetermined component type is attached to and detached from the main body of the component supply device 4, the specific mounting nozzle 53S is automatically Will be attached and removed. This eliminates the need to hold or remove the specific mounting nozzle 53S on the nozzle changer 7, thereby reducing the operator's setup change work.

  In the first embodiment, the component transfer device 5 returns the specific mounting nozzle 53S to the nozzle holding unit 46 after the specific mounting nozzle 53S has mounted the electronic component P of a predetermined component type on the substrate K. According to this, the specific feeder device 41S is always maintained in a state where the electronic component P of the predetermined component type and the specific mounting nozzle 53S are set. For this reason, there is no need to re-hold the specific mounting nozzle 53S in the nozzle holding part 46 of the specific feeder device 41S, and the effect of reducing the operator's setup change work becomes remarkable and reliable.

  Furthermore, in the first embodiment, at least one specific feeder device 41 </ b> S has a nozzle holding part 46 in the vicinity of the supply position 45. According to this, the distance that the mounting head 52 moves from the nozzle holder 46 to the supply position 45 is minimized, and the production efficiency of the substrate K can be significantly improved.

  Further, in the first embodiment, at least one specific feeder device 41S has a nozzle holding portion 46 in front of the supply position 45 to feed out the tape 44, and the tape 44 sandwiches a plurality of electronic components P. And a top tape 441 and a bottom tape 442 that are separated from each other at the supply position 45 to enable supply of the electronic component P. The top tape 441 is returned backward from the supply position 45 and discharged, The bottom tape 442 is discharged from the supply position 45 through the lower side and the front side of the nozzle holding part 46.

  According to this, the discharged top tape 441 and bottom tape 442 do not interfere when the component transfer device 5 equips the mounting head 52 with the specific mounting nozzle 53 </ b> S by the nozzle holding portion 46. Therefore, the production efficiency of the substrate K can be remarkably improved.

  Furthermore, in the first embodiment, at least one specific feeder device 41S is further provided with a nozzle lock mechanism that locks the separation of the specific mounting nozzle 53S from the nozzle holding portion 46 when the specific feeder device 41S is detached from the main body of the component supply device 4. be able to. According to this, even when the removed specific feeder device 41S is carried, even if it is tilted or shaken, the specific mounting nozzle 53S will not be detached, and there is no possibility of damage or loss due to dropping.

  Furthermore, in the first embodiment, the machine base 2 further includes a nozzle changer 7 that holds the mounting nozzles 53 other than the specific mounting nozzle 53S in a replaceable manner. According to this, a plurality of general-purpose mounting nozzles 53 that are suitable for many electronic components can be held in the nozzle changer 7 and used together with the specific mounting nozzle 53S that is suitable for a specific electronic component P. Therefore, in the setup change operation, the frequency of replacing the mounting nozzle 53 on the nozzle changer 7 is reduced, and the operator's setup change operation is significantly reduced.

  Next, an application example of the first embodiment in which the discharge route of the bottom tape 442T in the specific feeder device 41T is changed will be described. FIG. 5 is a side partial cross-sectional view schematically illustrating the detailed structure of the specific feeder device 41T in the application example of the first embodiment. In the application example shown in FIG. 5, the structure and arrangement of the nozzle holder 46 and the supply position 45 of the specific feeder device 41T are the same as those in FIG. However, after the bottom tape 442T constituting the tape 44 is fed downward from the tape feed hole 47, the bottom tape 442T passes through the lower side of the nozzle holding portion 46 and is discharged as it is.

  Furthermore, as indicated by a broken line in FIG. 5, the bottom tape 442U may be discharged downward from the tape supply hole 47 and then returned obliquely downward to be discharged. The effect that neither the bottom tape 442T nor the bottom tape 442U obstructs the mounting of the specific mounting nozzle 53S on the mounting head 52 by the nozzle holding portion 46 is the same as in the first embodiment.

  Next, the difference between the component mounting machine of the second embodiment and the first embodiment will be mainly described. In the second embodiment, the overall configuration of the component mounter is the same as that of the first embodiment, and only the structure of the specific feeder device 41V is different. FIG. 6 is an enlarged plan view showing an upper end portion of the specific feeder device 41V used in the component mounter of the second embodiment. In this specific feeder device 41V, a nozzle temporary placement portion 48, a nozzle holding portion 46, a tape feeding hole 47, and a supply position 45 are provided close to each other in order from the top end side. The temporary nozzle placement portion 48 has the same shape as the nozzle holding hole of the nozzle changer 7 and is formed so as to hold the mounting nozzles 53 other than the specific mounting nozzle 53S.

  In the operation of the component mounting machine according to the second embodiment, when it is time to collect a specific electronic component P from the specific feeder device 41V, the component transfer device 5 first sets the mounting head 52 to the temporary nozzle of the specific feeder device 41V. Driven to the placement unit 48, the equipped mounting nozzle 53 is released and temporarily placed on the nozzle temporary placement unit 48. Next, the component transfer device 5 drives the mounting head 52 to the nearby nozzle holding portion 46 and equips the specific mounting nozzle 53S. Third, the component transfer device 5 drives the mounting head 52 and the specific mounting nozzle 53S to the nearby supply position 45 and collects the electronic component P of a predetermined component type. Fourthly, the component transfer device 5 drives the mounting head 52 and the specific mounting nozzle 53S to the component camera 6 for photographing, and further drives to the substrate K to mount the specific electronic component P.

  After completing the mounting of the electronic component P of the predetermined component type, the component transfer device 5 drives the mounting head 52 again to the nozzle holding portion 46 of the specific feeder device 41 </ b> V to move the specific mounting nozzle 53 </ b> S to the nozzle holding portion 46. return. Next, the component transfer device 5 drives the mounting head 52 to the nozzle temporary placement unit 48 to equip the mounting nozzle 53 during temporary placement again, and thereafter continues the component mounting operation.

  The nozzle temporary placement section 48 is not limited to the purpose of temporarily placing the mounting nozzle 53, but also serves as a substitute for replacing the mounting nozzle 53 on the nozzle changer 7. That is, at the time of the setup change operation, the operator does not replace the mounting nozzle 53 directly on the nozzle changer 7 but holds the mounting nozzle 53 to be replaced in the nozzle temporary placement portion 48 of the newly installed specific feeder device 41V. You can let it go. In this case, the component transfer device 5 equips the mounting head 52 with the mounting nozzle 53 not only from the nozzle changer 7 but from the specific feeder device 41V only for the first time.

  In the component mounter 1 of the second embodiment, at least one specific feeder device 41V further includes a temporary nozzle placement portion 48 that can hold the mounting nozzle 53 other than the specific mounting nozzle 53S in the vicinity of the nozzle holding portion 46. According to this, when mounting the specific mounting nozzle 53S on the mounting head 52, the mounting nozzle 53 used so far can be temporarily placed on the nearby nozzle temporary placement portion 48, and the production efficiency of the substrate K is significantly improved. it can.

  In addition, the component supply apparatus 4 may be provided in both the front part and the rear part of the longitudinal direction of a component mounting machine, or may have two mounting heads in which the component transfer apparatus 5 is driven independently. Good. The present invention can be implemented without being bound by the structure of the component mounting machine. Furthermore, the present invention can have various applications and modifications other than those described.

1: Component mounter 2: Machine base 3: Board transfer device 4: Component supply device 41: Feeder device 41S, 41T, 41V: Specific feeder device 42: Feeder main body 43: Supply reel 44: Tape 441: Top tape 442, 442T 442U: Bottom tape 45: Supply position 46: Nozzle holding portion 47: Tape feed hole 48: Temporary nozzle placement portion 5: Component transfer device 51: Head drive mechanism 52: Mounting head 523: Nozzle holder 53: Mounting nozzle 53S: Specific mounting nozzle 531: Suction table 532: Connection unit 533: Nozzle suction unit 6: Component camera 7: Nozzle changer 8: Terminal device

Claims (7)

A component supply device having a plurality of feeder devices that detachably feed a tape holding a plurality of electronic components in a row and sequentially supply the electronic components to respective supply positions;
A mounting nozzle that picks up the electronic component at the supply position and mounts the electronic component on a substrate, a mounting head that replaceably mounts the mounting nozzle, and a component transfer device that includes a head drive mechanism that drives the mounting head. A component mounting machine provided on a table,
At least one feeder device has a nozzle holding portion that detachably holds a specific mounting nozzle capable of collecting an electronic component of a predetermined component type supplied by itself,
The component transfer device is equipped with the specific mounting nozzle in the mounting head driven to the nozzle holding unit, and the electronic component of the predetermined component type is collected and mounted on the substrate by the specific mounting nozzle at the supply position. Component mounting machine.   The component mounting apparatus according to claim 1, wherein the component mounting apparatus returns the specific mounting nozzle to the nozzle holding unit after the specific mounting nozzle has mounted the electronic component of the predetermined component type on the substrate.   The component mounting machine according to claim 1, wherein the at least one feeder device includes the nozzle holding unit in the vicinity of the supply position. The at least one feeder device has the nozzle holding portion in front of the supply position to feed out the tape,
The tape is composed of a top tape and a bottom tape that sandwich and hold the plurality of electronic components and are capable of supplying the electronic components by being peeled from each other at the supply position.
The top tape is ejected back from the supply position.
The component mounting machine according to claim 3, wherein the bottom tape is discharged from the supply position through a lower side of the nozzle holding portion, or returned back from the supply position and discharged.   The component mounting according to any one of claims 1 to 4, wherein the at least one feeder device further includes a temporary nozzle placement portion capable of holding a mounting nozzle other than the specific mounting nozzle in the vicinity of the nozzle holding portion. Machine.   The said at least 1 feeder apparatus further has a nozzle lock mechanism which locks | releases the said specific attachment nozzle from the said nozzle holding part, if it removes from the main body of the said component supply apparatus. The component mounting machine described in 1.   The component mounting machine according to any one of claims 1 to 6, further comprising a nozzle changer that holds a mounting nozzle other than the specific mounting nozzle in a replaceable manner.

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