JPWO2015122011A1 - Board work system - Google Patents

Abstract

To provide an on-board working system capable of smoothly transporting even a circuit board in which shrinkage of the board width or warping of the board occurs due to reflow processing. The on-board working system 10 re-injects the circuit board CB reflow-processed by the reflow apparatus 15 into the component mounting line 12, and mounts components. The production management computer 23 reads the board ID recording units 21 </ b> A and 21 </ b> B of the circuit board CB with the barcode reader 22, and searches the registered job list stored in the storage unit 24 for the board width data of the corresponding board type. . The production management computer 23 sets the rail width of the component mounting line 12 based on the board width of the search result. Further, when the circuit board CB after the reflow processing is reintroduced into the component mounting line 12, the production management computer 23 determines whether the component mounting line 12 of the component mounting line 12 is based on the contraction amount and warpage amount of the substrate width after the reflow processing. Change the rail width again.

Description

  The present invention relates to an on-board working system for mounting a component by re-introducing a reflow-treated circuit board into a component mounting line.

  For the on-board work system that produces component-mounted circuit boards on which a large number of components (such as electronic components) are mounted, for example, a component printing line is constructed by connecting a solder printer, component mounter, reflow device, etc. with a transport device. There is something to be done. In this type of on-board work system, depending on the type of component-mounted circuit board to be produced and the number of various devices that make up the component-mounted line, all that is required is to insert the circuit board once into the component-mounted line. There are cases where components cannot be mounted on a circuit board.

  For example, a circuit board includes a double-sided mounting board on which components are mounted on both a top surface and a bottom surface. When mounting a component on this double-sided mounting board, for example, the circuit board is inserted into the component mounting line, the component is mounted only on the top surface, and then the circuit board is input again into the component mounting line to the bottom surface. Mount the parts. In addition, for example, in a substrate working system in which only one solder printing machine or reflow device is provided in a component mounting line, a series of mounting steps of solder printing, component mounting, and reflow processing are performed on one circuit board. When performing multiple times on the surface, it is necessary to put the circuit board into the component mounting line multiple times. On the other hand, Patent Document 1 discloses a technique in which a circuit board is introduced into the same component mounting line a plurality of times. In the on-board work system of Patent Document 1, the number of times that a circuit board is added to a component mounting line after adding a circuit board ID (such as a barcode) to the circuit board is managed.

JP 2013-55171 A

  By the way, in the above-described on-board working system, for example, when producing a double-sided mounting board, components are first mounted on the top surface of the circuit board by a component mounting machine, and then the circuit board is reflowed by a reflow apparatus. The substrate width of the double-sided mounting substrate contracts when heat is applied by reflow processing. Alternatively, the double-sided mounting board has a difference in contraction rate due to heat in the vertical direction and the horizontal direction of the circuit board due to differences in internal structure and materials, and warpage occurs when heat is applied by reflow processing. As a result, there is a possibility that problems such as the inability to smoothly carry the circuit board after re-insertion occur. For example, in the on-board work system, a gap is provided for smoothly carrying the circuit board to be carried and the conveyor of the carrying device facing each other in a direction orthogonal to the carrying direction. However, this gap widens by the amount of contraction or warpage when the width of the circuit board to be re-inserted is shortened or the circuit board is warped. When the gap widens, the circuit board being transported rotates significantly beyond the allowable range with the direction orthogonal to the board plane as the axis of rotation due to vibration, etc., and the inclination of the circuit board relative to the transport direction increases, and the circuit is connected at the connection part between the devices. Problems such as the substrate being caught and the conveyance temporarily stopped.

  The present invention has been made in view of the above-described problems, and provides an on-board working system capable of smoothly transporting even a circuit board in which substrate width shrinkage or substrate warpage has occurred due to reflow processing. The purpose is to do.

  A board work system according to the technology disclosed in the present application made in view of the above problems is a board work system for mounting a component by re-introducing a reflow-treated circuit board into a component mounting line, Based on the control data in which at least one of the shrinkage amount of the board width after the reflow process and the warp amount of the circuit board after the reflow process are set, the rail width of the conveyor on which the circuit board is re-inserted is set. A control unit is provided.

  According to the technique disclosed in the present application, it is possible to provide an on-board working system capable of smoothly transporting even a circuit board in which a substrate width contraction or a substrate warp has occurred due to reflow processing.

It is a schematic block diagram of the substrate working system of this embodiment. It is a figure for demonstrating the registration job list 1 memorize | stored in the memory | storage part of a production management computer. It is a flowchart which shows the processing operation of the board | substrate mounting of a to-substrate work system. FIG. 5 is a cross-sectional view taken along a plane perpendicular to the substrate transport direction, which is a component mounting position where a mounting operation of a component of the mounting machine is performed. It is a figure for demonstrating the registration job list 2 memorize | stored in the memory | storage part of a production management computer. It is a top view which shows the connection part of a board | substrate handling apparatus and a mounting machine. It is a top view which shows the connection part of another board | substrate handling apparatus and a mounting machine.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a schematic configuration of an on-board working system 10 of the present embodiment. 1, the component mounting line 12 has one production line, and the circuit board CB is transported from the left side to the right side of the component mounting line 12 in FIG. The work related to the mounting is performed by various devices. In the component mounting line 12, a plurality of mounting machines 11 for mounting components on the circuit board CB and a mounting related machine (an apparatus other than the mounting machine) for performing work related to component mounting are arranged. The mounting related machines here are, for example, a solder printer 13, an inspection apparatus 14, a reflow apparatus 15, and the like.

  A board handling device 17 is connected upstream and downstream of the component mounting line 12 of each of the mounting machine 11 and the mounting related machine. Each of the board handling devices 17 transports the circuit board CB, waits for it, or turns it upside down. The board handling device 17 includes, for example, a pair of belt conveyors extending in the conveyance direction of the circuit board CB and a drive motor as a drive source. The board handling device 17 supplies the circuit board CB every time the downstream mounting machine 11 can accept the circuit board CB, for example. The board handling device 17 transports the circuit board CB in a horizontal state. Each of the mounting machine 11 and the mounting related machine performs a predetermined mounting process with the upper surface of the circuit board CB in a horizontal state as a processing target surface for mounting components and the like. For example, each mounting machine 11 is equipped with a feeder 18 that supplies components such as electronic components. Each of the mounting machines 11 mounts the components supplied from the feeder 18 on the circuit board CB which is sucked by the suction nozzle of the mounting head 63 (see FIG. 6) and conveyed to the component mounting line 12. Similarly, other mounting-related machines (such as the solder printer 13 and the reflow device 15) perform a predetermined mounting process on the circuit board CB.

  Further, when all the components cannot be mounted on the circuit board CB by only once entering the component mounting line 12, the on-board working system 10 includes, for example, a mounting process for mounting components on the circuit board CB in a plurality of steps. It is divided into two. In the substrate working system 10, the circuit board CB is reintroduced into the component mounting line 12 for each of a plurality of mounting processes, and the components to be mounted in the mounting process are mounted on the circuit board CB. At this time, the operator may perform the work of re-inserting the circuit board CB carried out from the component mounting line 12 into the component mounting line 12. Alternatively, the conveyor from the outlet to the inlet of the component mounting line 12 is connected, and the circuit board CB carried out from the component mounting line 12 is automatically re-introduced. You may comprise so that it may carry out from the line 12. FIG.

  For example, the circuit board CB is a double-sided mounting board that mounts components on both the top surface and the bottom surface. In the production of the circuit board CB that is a double-sided mounting board, for example, the circuit board CB is passed through the component mounting line 12 twice to mount components on each of the top surface and the bottom surface. The circuit board CB has a board identification information recording section (hereinafter referred to as “board ID recording section”) 21A in which board identification information (hereinafter referred to as “board ID”) is recorded on both the top surface and the bottom surface. , 21B are provided. The board ID recording unit 21A is provided on the outer side of the mounting area where components are mounted on the top surface. In addition, the board ID recording unit 21B is provided outside the mounting area on the bottom surface where components are mounted. The substrate ID recording units 21A and 21B are recorded on the substrate surface, for example, a barcode representing a substrate ID, such as a barcode or a two-dimensional code. The substrate ID recording units 21A and 21B may be, for example, an electronic tag that electronically stores the substrate ID, a magnetic tape that magnetically records, or the like. As the substrate IDs recorded in the substrate ID recording units 21A and 21B, different substrate IDs associated with the top surface and the bottom surface of the same substrate type are set.

  A bar code reader 22 that reads a board ID (for example, a bar code) recorded in the board ID recording units 21A and 21B is provided on the side (left side in FIG. 1) of the circuit board CB of the component mounting line 12. It has been. The barcode reader 22 is provided on the upper part of the component mounting line 12, and reads the board ID of the circuit board CB to be conveyed, that is, the board surface to be processed, among the board ID recording units 21A and 21B.

  Further, the substrate work system 10 includes a production management computer 23 that manages the production of the component mounting line 12. The storage unit 24 of the production management computer 23 stores control programs and production jobs. The storage unit 24 is configured by a storage medium such as a RAM, a ROM, and a hard disk, for example. The production management computer 23 executes the control program stored in the storage unit 24 based on the production job control data. The “production job” here is control data in which all mounting processes necessary for producing the circuit board CB which is a double-sided mounting board are set. Accordingly, a plurality of “mounting processes” are set for one production job. For example, the mounting process is a group of a series of processes performed on one of the top surface and the bottom surface of the circuit board CB in one production line of the component mounting line 12. The production management computer 23 determines a mounting process based on the type of the circuit board CB, that is, the type of the production job and the processing target surface (top surface or bottom surface). The production management computer 23 may manage each mounting process as a separate production job.

  FIG. 2 shows an example of a registered job list stored in the storage unit 24 of the production management computer 23. The registration job list 1 shown in FIG. 2 includes a production job “JOB-AA” for producing the component mounting circuit board “AA” and a production for producing the component mounting circuit board “AB” as part of the list. The job “JOB-AB” is exemplified. The registered job list 1 includes data corresponding to the items of the component mounting circuit board to be produced, the production job name, the mounting process, the board ID, the mounting order, the processing target surface, the board width W, the shrinkage amount, and the warpage amount. Is set. Note that some of the items in the registered job list 1 shown in FIG. 2 are shown, and necessary control data is set according to the work contents of each device. Further, in the storage unit 24, other control data associated with each item of the registered job list 1, for example, in the case of the mounting machine 11, sequence data indicating a mounting position of an electronic component and a component table for each board type ( BOM data) is stored for each production job.

  Here, when producing the double-sided mounting board, the circuit board CB in which the component is mounted on either the top surface or the bottom surface by the mounting machine 11 is used as the reflow device 15 ( (See FIG. 1). At this time, the circuit board CB contracts the substrate width W or warps due to the heat applied by the reflow process. Therefore, in the registered job list 1 stored in the storage unit 24, the contraction amount and warpage amount of the substrate after the reflow process are set for each substrate type (production job) to be produced.

  The board IDs provided on the top surface and the bottom surface of the circuit board CB are associated with the mounting process, and the order of execution is set as “mounting order” in each mounting process. The production management computer 23 searches the registered job list 1 for a corresponding production job and mounting process based on the board ID read by the barcode reader 22. Further, the production management computer 23 reduces the contraction when the “mounting order” of the mounting process of the search result is the second time or later, that is, when the process is re-entered into the component mounting line 12 after the reflow process and executed on the circuit board CB. Control is performed to change the lane width of each device on the component mounting line 12 based on the amount and the warp amount.

FIG. 3 shows an example of the processing operation of the substrate work system 10.
In the following description, for example, a case where a component mounted circuit board of “AA” in the registered job list 1 shown in FIG. 2 is produced will be described. The on-board work system 10 executes the top surface (mounting process AA-1) and the bottom surface (mounting process AA-2) in the order of mounting the production job name “JOB-AA”.

  First, in step S1, the circuit board CB is carried into the component mounting line 12 with the top surface of the board ID “AA-1” facing upward. The production management computer 23 controls the board handling device 17 provided upstream of the solder printer 13 to stop the circuit board CB at a predetermined position, and from the board ID recording unit 21A of the circuit board CB by the barcode reader 22. The board ID “AA-1” is read.

  Next, in step S <b> 2, the production management computer 23 searches the data corresponding to the board ID “AA-1” read from the registered job list 1 of the storage unit 24 to determine a production job and a mounting process. In this case, the production management computer 23 determines the mounting process as “AA-1”. The production management computer 23 determines a setup change method or the like according to the production job (substrate type to be produced) when a value indicating the first time is set in the order of execution of the corresponding mounting process in the registered job list 1. However, the operator may be notified.

  Next, in step S3, the production management computer 23 determines, based on the mounting order, whether or not the mounting process determined in step S2 is performed after the circuit board CB is re-inserted. Since “1” is set in the mounting order of the mounting process to be performed, the production management computer 23 performs control to set the rail width of the component mounting line 12 based on the board width W (in this case, “200 mm”). (Step S4). The rail width of the component mounting line 12 is the rail width of the transfer device and the board handling device 17 included in the mounting machine 11 and the mounting related machine.

  Next, in step S5, the production management computer 23 causes the mounting machine 11 and the mounting related machine to perform the mounting process “AA-1”. Each of the mounting machine 11 and the mounting related machine performs a predetermined mounting process based on the control data of the mounting process “AA-1”, and mounts components on the top surface of the circuit board CB. The circuit board CB passes through the production line of the component mounting line 12, and the mounting on the top surface is completed. Note that step S11 indicated by a broken line in FIG. 3 is a step that is omitted in the processing based on the mounting order, and detailed contents will be described later.

  Next, the substrate work system 10 performs the mounting of the bottom surface. For example, the operator puts the circuit board CB unloaded from the component mounting line 12 onto the component mounting line 12 with the bottom surface provided with the board ID recording unit 21B of the board ID “AA-2” facing upward. Re-injection (step S1). Next, in step S2, the production management computer 23 searches the data corresponding to the read board ID (in this case, “AA-2”) from the registered job list 1 in the storage unit 24, and executes the mounting process “ AA-2 ".

  Next, in step S3, the production management computer 23 determines that the circuit board CB has been re-inserted after the reflow process because “2” is set in the mounting order of the mounting process to be performed. The production management computer 23 determines the rail width of the component mounting line 12 (the rail width of the board handling device 17 and the like) based on the shrinkage amount (in this case, “0.4 mm”) and the warpage amount (in this case, “1 mm”). Control to change is performed (step S7). For example, the production management computer 23 performs control to narrow the rail width of each device constituting the component mounting line 12 by the contraction amount. Further, the production management computer 23 calculates a reduction amount of the substrate width W due to the warpage of the substrate based on the warpage amount and the substrate width W, and narrows the rail width by the reduction amount of the calculation result. In the production job, a reduction amount of the substrate width W due to the warp of the substrate may be calculated in advance and the reduction amount may be set. In addition, one value may be set for the production job in consideration of the shrinkage amount and the reduction amount. Further, in the production job, only one of the shrinkage amount and the warpage amount may be set according to the type of the circuit board CB. In this case, the production management computer 23 changes the rail width by only one of the shrinkage amount and the warpage amount. In addition, the shrinkage amount and the warpage amount may be set in advance in the production job, or an operator may produce a circuit board on a trial basis on the spot and set a value obtained by actually measuring the produced circuit board in the production job. Good.

  By the above-described control, the component mounting line 12 is adjusted to a rail width that matches the actual board width W of the circuit board CB that has contracted and warped due to the reflow process. Conventionally, by re-inserting the circuit board CB after the reflow process, the inclination of the circuit board CB being transported is increased, the circuit board CB is caught at the connecting portion between the devices, and the transport is temporarily stopped. There was a risk of problems. On the other hand, in the substrate work system 10 of the present embodiment, the rail width of the component mounting line 12 is automatically adjusted according to shrinkage and warpage, so that the board is smoothly conveyed. In step S8, each of the mounting machine 11 and the mounting related machine performs a predetermined mounting process based on the control data of the mounting process “AA-2” on the bottom surface of the circuit board CB, and the component mounting circuit board “AA”. Is produced.

<Rail width adjustment>
Next, as an example of setting and changing the rail width by the production management computer 23, a conveyor provided in the mounting machine 11 will be described. FIG. 4 shows a cross-sectional view taken along a plane perpendicular to the substrate transport direction, which is a component mounting position where a component mounting operation of the mounting machine 11 is performed. The mounting machine 11 includes a conveyor 31 that conveys the circuit board CB carried into the mounting machine 11. The conveyor 31 is placed on a pair of conveyor belts 33 that are separated from each other by a predetermined distance in a direction orthogonal to the conveyance direction of the circuit board CB, and conveys the circuit board CB to a component mounting position.

  Further, the conveyor 31 includes a stopper 35 having an L-shaped cross section extending in the transport direction, and a clamper 36 facing the stopper 35 in the vertical direction with the circuit board CB interposed therebetween at the mounting position. When the conveyor 31 drives the conveyor belt 33 to convey the circuit board CB to the mounting position, the conveyer 31 raises the clamper 36 upward in FIG. 4 and sandwiches the circuit board CB between the clamper 36 and the stopper 35. Position in place.

  The mounting machine 11 is provided with a gap 38 between the side edge of the circuit board CB to be transported and the inner peripheral surface of the stopper 35 for smooth transport. The gap 38 widens when the substrate width W of the circuit board CB contracts due to the reflow process. Further, for example, when the circuit board CB is warped such that the center of the board (the center in the left-right direction in FIG. 4) protrudes in a direction perpendicular to the board plane (downward in FIG. 4), the circuit board CB The distance between the side edges is shortened. Accordingly, the gap 38 between the circuit board CB and the stopper 35 is widened as in the case where the board width W contracts. When the gap 38 is widened, the circuit board CB being transported rotates significantly beyond the allowable range with the direction orthogonal to the substrate plane as a rotation axis due to vibration and the like, and the inclination of the circuit board CB with respect to the transport direction becomes large. There is a case where the circuit board CB is caught at the connecting portion of the handling device 17 and the conveyance is temporarily stopped. For this reason, the production management computer 23 uses the rail width of the conveyor 31 (the distance in the direction orthogonal to the conveying direction of the conveyor belt 33, the stopper 35, and the clamper 36) as the board width set in the production job of the circuit board CB to be produced. It adjusts according to the amount of shrinkage after W or reflow processing. As a result, the conveyor 31 can smoothly carry the substrate.

<Preparation height of backup pin>
Further, the mounting machine 11 is provided with a lifting platform 43 that can be moved up and down by a drive unit (for example, an air cylinder) 41. On the lifting platform 43, a backup base 44 that can be replaced with the lifting platform 43 according to the type (size, etc.) of the circuit board CB is provided. A plurality of backup pins 46 are erected on the upper surface of the backup base 44. When mounting the component, the mounting machine 11 drives the drive unit 41 to raise the lifting platform 43 and brings the backup pin 46 into contact with the lower surface of the circuit board CB whose position is fixed by the stopper 35 and the clamper 36. The circuit board CB is supported so as not to be bent during mounting.

  The mounting machine 11 raises the backup pin 46 in advance before the circuit board CB is conveyed to the mounting position above the backup pin 46. For example, as shown in FIG. 4, it is assumed that heights (hereinafter referred to as “preparation heights”) H1 and H2 for raising the backup pin 46 in advance are set. The preparation height H1 is lower than the preparation height H2 from the reference position of the drive unit 41. In this case, the backup pin 46 waiting in advance at the preparation height H1 has a longer time to rise to a position in contact with the lower surface of the circuit board CB than in the case of waiting at the preparation height H2. As a result, the number of circuit boards CB produced per unit time is reduced.

  However, when the electronic component 51 is mounted on the lower surface, if the preparation height is increased too much, the backup pin 46 hits the electronic component 51 on the lower surface of the circuit board CB carried into the mounting position, so that smoothness is achieved. The transfer work cannot be performed. That is, the optimum heights H1 and H2 differ depending on whether the electronic component 51 is mounted on the lower surface of the circuit board CB or not. For this reason, the production management computer 23 uses the mounting order set in the registered job list 1 to mount the circuit board CB on the component mounting line in a state in which the mounting process to be performed next is the surface on which the electronic component 51 is mounted. 12 is determined whether or not it is a mounting process to be re-introduced, and the heights H1 and H2 of the mounting machine 11 are controlled based on the determination result. For example, in the data related to the registered job list 1 stored in the storage unit 24, data related to the component height of each of the various electronic components 51 is set. In the case of the mounting process after re-injection, the production management computer 23 determines the component height of the electronic component 51 mounted on the lower surface of the circuit board CB based on the data of the registered job list 1, and the component height The mounting machine 11 is controlled so as to have the preparation heights H1 and H2 corresponding to the height. For example, the production management computer 23 determines the preparation heights H1 and H2 according to the component with the highest component height among the components mounted on the lower surface. Thereby, the mounting machine 11 can raise the backup pin 46 in advance to the appropriate preparation heights H1 and H2 even if the circuit board CB has the electronic component 51 mounted on the lower surface, thereby improving the production efficiency.

<Production jobs for which the mounting order is not set>
Next, the process in which the production management computer 23 adjusts the rail width in the registered job list 2 in which the mounting order shown in FIG. 5 is not set will be described. In the following description, description will be made with reference to the flowchart of FIG. 3, but the description of the steps for performing the same processing as the processing by the registered job list 1 in which the mounting order is set will be omitted as appropriate.

  The registration job list 2 shown in FIG. 5 includes a production job “JOB-AC” for producing the component mounting circuit board “AC” and a production for producing the component mounting circuit board “AD” as a part of the list. An example of the job “JOB-AD” is shown. The registered job list 2 includes data corresponding to the items of the component mounting circuit board to be produced, the production job name, the mounting process, the board ID, the presence / absence of execution, the surface to be processed, the board width W, the shrinkage amount, and the warpage amount. Is set. Unlike the registered job list 1 shown in FIG. 2, the registered job list 2 is set with “execution presence / absence” data in place of the items in the mounting order. In the registered job list 2 described above, for example, a case where a component-mounted circuit board of “AC” is produced will be described. The on-board working system 10 is implemented from an arbitrary mounting process among the mounting process “AC-1” and the mounting process “AC-2” corresponding to the production job name “JOB-AC”. For example, the mounting process “AC-2” corresponding to the bottom surface is performed.

  First, the circuit board CB is carried into the component mounting line 12 with the bottom surface facing upward (see step S1 in FIG. 3). The production management computer 23 reads the board ID “AC-2” from the board ID recording unit 21 </ b> B of the circuit board CB using the barcode reader 22. Next, the production management computer 23 searches the registered job list 2 for data corresponding to the board ID “AC-2” and determines the mounting process as “AC-2” (step S2).

  Next, in step S3, the production management computer 23 determines whether or not the mounting process determined in step S2 is to be performed after re-inserting the circuit board CB, based on the data of the “execution presence / absence” item. Judgment. In the “execution presence / absence” item, a value indicating whether or not the corresponding mounting process has been performed is set. The production management computer 23 determines whether or not re-injection is performed depending on whether or not there is a mounting process included in the same production job (in this case, JOB-AC). Since the production processes “AC-1” and “AC-2” corresponding to the production job “JOB-AC” have not been performed, the production management computer 23 determines the rail width of the component mounting line 12 based on the board width W. Control to set is performed (step S4). Next, the production management computer 23 causes the mounting process “AC-2” to be performed on the mounting machine 11 and the mounting-related machine, and mounts components on the bottom surface of the circuit board CB (step S5).

  Next, in step S11, when all the circuit boards CB pass through the production line of the component mounting line 12 and the mounting is completed, the production management computer 23 executes “implementation” corresponding to the mounting process “AC-2” in the registered job list 2. The presence / absence data is changed from unexecuted to implemented (see FIG. 5).

  Next, the circuit board CB having components mounted on the bottom surface is re-inserted with the top surface facing upward. When step S3 is executed through steps S1 and S2 in FIG. 3, the production management computer 23 has already performed the mounting process “AC-2” included in the production job JOB-AC, and thus the circuit board CB. Is determined to be re-input. Then, in step S7, the production management computer 23 changes the rail width of each device in accordance with the shrinkage amount and warpage amount of the mounting process “AC-2”, and causes a predetermined mounting process to be performed (step S8). Thereby, according to the board | substrate work system 10 of this embodiment, it becomes possible to adjust the rail width of the component mounting line 12 automatically according to shrinkage | contraction and curvature, and to implement board | substrate conveyance smoothly.

  In addition, in the registered job lists 1 and 2, both “installation order” and “execution presence / absence” data may be set. For example, in the registered job lists 1 and 2 described above, the mounting process is associated with each of the top surface and the bottom surface on a one-to-one basis, but a plurality of mounting processes may be associated with one surface. For example, the production management computer 23 performs appropriate mounting by performing a mounting process in which “mounting order” is early and “execution is not performed” among a plurality of mounting processes performed on the top surface. The process can be performed. Further, the production management computer 23 can determine whether or not the circuit board CB is re-inserted based on the “mounting order” or “mounting / non-mounting”.

As mentioned above, according to this embodiment described in detail, there exist the following effects.
<Effect 1> In the registered job lists 1 and 2 stored in the storage unit 24, the production management computer 23 determines the rail width of the component mounting line 12 based on the board width W set for each board type to be produced (see FIG. The rail width of the conveyor 31 shown in FIG. In addition, when the circuit board CB is reintroduced into the component mounting line 12, the production management computer 23 determines the rail width of the component mounting line 12 based on the contraction amount and warpage amount of the substrate width W after the reflow process. To change. Thereby, according to the substrate work system 10 of this embodiment, in order to automatically adjust the rail width of the component mounting line 12 to an appropriate width, in the circuit board CB in which the shrinkage or warpage of the board width W occurs due to the reflow process. Even if it exists, it becomes possible to convey smoothly. As a result, according to the substrate work system 10, there is no problem such that the circuit board CB is caught by another member in the middle of conveyance and stopped, and the production efficiency is improved.

<Effect 2> The circuit board CB of the above embodiment is a double-sided mounting board in which components are mounted on both the top surface and the bottom surface of one circuit board. In this double-sided mounting substrate, after mounting a component on one surface, it is necessary to mount the component on the opposite surface, and thus shrinkage and warpage of the substrate width W due to reflow processing becomes a problem. Therefore, it is particularly effective to apply the counter-board working system 10 of this embodiment to the production of the circuit board CB that is a double-sided mounting board.

<Effect 3> In the registered job list 1, “mounting order” indicating which of the top surface and the bottom surface should be mounted according to the type of production job is set. The production management computer 23 determines, based on this “mounting order”, whether or not the next mounting process to be performed on the component mounting line 12 is a mounting process to be performed after the circuit board CB is reintroduced (FIG. 5). 3 step S3). If the production management computer 23 determines that the mounting process is to be performed after re-inputting, the production management computer 23 changes the rail width of the component mounting line 12 based on the shrinkage amount and the warpage amount (step S7). In such a configuration, when producing a component-mounted circuit board whose mounting order is determined in advance, it is possible to set an appropriate rail width depending on whether or not re-insertion is performed.

<Effect 4> Substrate ID recording portions 21A and 21B (for example, barcodes) indicating the substrate ID are added to the top surface and the bottom surface of the circuit substrate CB, respectively. In the registered job list 2 illustrated in FIG. 5, “execution presence / absence” data is associated with each board ID (mounting process). The production management computer 23 determines the presence / absence of re-insertion of the circuit board CB based on the execution / non-execution data corresponding to the board ID read by the barcode reader 22 (step S3 based on the registered job list 2). If the production management computer 23 determines that the circuit board CB has been re-inserted, the production management computer 23 changes the rail width of the component mounting line 12 based on the shrinkage amount and the warpage amount. With such a configuration, it is possible to read the board ID from the board ID recording units 21A and 21B provided on the circuit board CB, determine whether or not to re-insert, and set an appropriate rail width.

<Effect 5> The mounting machine 11 raises the lifting platform 43 when mounting components, and a backup pin 46 is brought into contact with the lower surface of the circuit board CB, the position of which is fixed by the stopper 35 and the clamper 36. The substrate CB is supported so as not to bend. The mounting machine 11 raises the backup pin 46 to the preparation heights H <b> 1 and H <b> 2 before the circuit board CB is transported to the mounting position above the backup pin 46. The production management computer 23 determines whether or not the next mounting process is a mounting process in which the circuit board CB is reintroduced into the component mounting line 12 in a state where the surface on which the electronic component 51 is mounted is the lower surface. Based on the determination result, the preparation heights H1 and H2 of the mounting machine 11 are controlled. As a result, the mounting machine 11 removes the backup pin 46 from the standby state before the circuit board CB is carried into the mounting position with respect to the circuit board CB (the board that is not re-inserted) on which nothing is mounted on the lower surface. It becomes possible to raise to appropriate preparation height H1, H2. Further, in the case of the mounting process after re-injection, the production management computer 23 determines the component height of the electronic component 51 mounted on the lower surface of the circuit board CB based on the data of the job list 1, and the component The mounting machine 11 is controlled so that the preparation heights H1 and H2 correspond to the height. Thereby, the mounting machine 11 raises the backup pin 46 to the preparation heights H1 and H2 corresponding to the component height of the mounted electronic component 51 even if the circuit board CB has the electronic component 51 mounted on the lower surface. It becomes possible to make it. As a result, the processing time for raising the backup pin 46 to a position where it comes into contact with the lower surface of the circuit board CB is shortened, and the production efficiency is improved.

  Incidentally, the production management computer 23 is an example of a control unit. The distance in the direction orthogonal to the conveying direction of the conveyor belt 33, the stopper 35, and the clamper 36 is an example of the rail width of the conveyor 31. The registered job lists 1 and 2 are examples of control data. The board ID recording units 21A and 21B are an example of a recording unit. The board ID is an example of identification information. The barcode reader 22 is an example of a reading unit.

Note that the present invention is not limited to the above-described embodiment, and it goes without saying that various improvements and modifications can be made without departing from the spirit of the present invention.
For example, in the above embodiment, the on-board working system 10 includes a plurality of mounting machines 11 and mounting related machines (such as the solder printer 13 and the reflow device 15) that perform work related to component mounting. The mounting machine 11 may be used. In this case, the control unit of the mounting machine 11 may determine whether or not the circuit board CB is re-inserted, and change the rail width of the mounting machine 11.

  In the on-board working system 10 of the above-described embodiment, the component mounting line 12 has one production line, and the circuit board CB is re-introduced to the same component mounting line 12, but the present invention is not limited to this configuration. . For example, the on-board working system 10 may have a plurality of component mounting lines 12 and the circuit board CB may be re-input to the component mounting lines 12 different from the previous one. In this case, each component mounting line 12 may include a production management computer 23, and each production management computer 23 itself may store control data (such as a registered job list). It is good also as a structure which acquires control data by communicating with the production management computer 23. FIG. In addition, a general production management computer that supervises each production management computer 23 of each of the plurality of component mounting lines 12 is separately provided, and the control data is acquired by communication between the central production management computer and each production management computer 23. It is good.

  In the above-described embodiment, the on-board working system 10 performs the control to change the rail width of each device in accordance with the contents of the registered job list 1 (production job mounting process, etc.), but the component mounting line 12 The rail width of each device may be managed based on the connection order of the devices in the transport direction. Specifically, for example, the on-board working system 10 includes a mounting machine 11 connected to the rear stage of the reflow device 15 in FIG. 1 via a substrate handling device 17, and the mounting machine 11 is reflowed by the reflow device 15. It is assumed that the processed circuit board CB is carried in by the board handling device 17. In the mounting machine 11 at the subsequent stage of the reflow device 15, regardless of the “mounting order” value of the registered job list 1, that is, regardless of whether or not the circuit board CB is re-input to the component mounting line 12. Since the circuit board CB after the reflow process is always carried in, it is preferable to narrow the rail width based on the contraction amount of the board width W. Therefore, the on-board work system 10 may change the rail width of each device in accordance with the connection order using the data related to the connection order of the devices on the component mounting line 12 as “control data”.

  Further, the circuit board CB may be a single-sided mounting board. For example, in the on-board working system 10 in which only one solder printer 13 is provided on the component mounting line 12, a series of mounting processes of solder printing, component mounting, and reflow processing are performed on one surface of the circuit board CB. However, in the case where it is performed a plurality of times, the circuit board CB needs to be input to the component mounting line 12 a plurality of times. For this reason, even if it is a case where a single-sided mounting board | substrate is produced with the to-substrate working system 10 of the said embodiment, it becomes possible to acquire the same effect as the case where a double-sided mounting board | substrate is produced.

Further, the circuit board system 10 according to the above embodiment does not require determination by the board ID if the circuit board CB is inserted in accordance with the mounting order of the registration job list 1. Setting is not required.
Further, the circuit board CB is provided with the board ID recording portions 21A and 21B on each of the top face and the bottom face, but only one of the faces may be provided. In this case, the on-board working system 10 has, for example, a board ID recording provided on only one side of the circuit board CB by providing barcode readers 22 both above and below the line on the carry-in side of the component mounting line 12. The portions 21A and 21B may be configured to be readable on either the upper surface or the lower surface when transported.
The component mounting line 12 may be a multi-lane production line having a plurality of production lines and performing a plurality of production jobs in parallel.

<Adjustment of rail width in each device>
In the above embodiment, the board work system 10 adjusts the rail width based on the control data such as the registered job list 1, but each of the mounting machine 11, the mounting related machine, and the board handling device 17 is transported. A function of adjusting the rail width by actually measuring the substrate width of the substrate CB may be provided. In the following description, operations of the mounting machine 11 and the substrate handling apparatus 17 will be described as an example. FIG. 6 shows a connecting portion between the board handling device 17 and the mounting machine 11. FIG. 6 schematically shows the substrate handling device 17 and the mounting machine 11. In order to avoid the drawing from becoming complicated, a portion covering the upper surface of the circuit board CB of the stopper 35 of the mounting machine 11 and the clamper 36. These members are omitted as appropriate. The circuit board CB is conveyed from the left side (upstream side) board handling device 17 to the right side (downstream side) mounting machine 11 along the X-axis direction in the drawing.

  In the mounting machine 11, a mounting head 63 attached to a slider 61 so as to be movable in the X-axis direction and the Y-axis direction is provided on the upper part of the circuit board CB to be transported. The mounting machine 11 sucks a component supplied from the feeder 18 (see FIG. 1) with a suction nozzle (not shown) of the mounting head 63 and mounts it on the circuit board CB. In addition, the mounting head 63 is provided with a mark camera 64 facing the lower side for capturing an error in the holding position of the circuit board CB, the board ID recording unit 21A (see FIG. 1), and the like.

  First, the mounting machine 11 changes the substrate type, for example, by switching the production job, and when the circuit board CB having a different board width W is carried from the conveyor 71 of the board handling device 17 in the previous stage, The rail width W2 of the stopper 35 is widened. For example, the mounting machine 11 controls the conveyor 31 so as to widen the rail width W2 to the maximum value that can be set. For example, the mounting machine 11 moves the upper conveyor belt 33 and the stopper 35 in FIG. 6 upward. The board handling device 17 temporarily stops the conveyor 71 when the front end portion of the circuit board CB is carried into the subsequent mounting machine 11. The mounting machine 11 moves the mounting head 63 and images the substrate end (portion surrounded by a broken line in the drawing) of the tip portion of the circuit board CB by the mark camera 64. The mounting machine 11 detects the board end of the circuit board CB by performing image processing on the imaging data of the mark camera 64.

  When the mounting machine 11 detects the board end of the circuit board CB, the mounting machine 11 notifies the board handling apparatus 17 to that effect. When the board handling device 17 receives the notification, the board handling device 17 temporarily pulls the circuit board CB carried out toward the mounting machine 11 back to its own device side. When the circuit board CB is pulled back to the upstream side by the board handling device 17, the mounting machine 11 calculates the XY coordinates and board width W of the board edge based on the position of the board edge detected from the imaging data of the mark camera 64. The rail width W2 is adjusted. When the board handling apparatus 17 receives from the mounting machine 11 that the adjustment of the rail width W2 has been completed, the board handling apparatus 17 resumes the conveyance of the circuit board CB toward the mounting machine 11.

  In such a configuration, for example, the production management computer 23 of the board-to-board work system 10 adjusts the rail width for each device constituting the component mounting line 12 when the device configuration of the component mounting line 12 is changed. Queries the presence of the function. The production management computer 23 independently adjusts the rail width for a device having a function of adjusting the rail width among the plurality of devices constituting the component mounting line 12. On the other hand, the production management computer 23 adjusts the rail width for an apparatus that does not have an adjustment function. As a result, the production management computer 23 can more smoothly carry out the smooth conveyance of the circuit board CB by changing the device to be controlled in accordance with the presence or absence of the rail width adjustment function. Note that the detection method of the substrate edge and the substrate width W of the circuit board CB is not limited to the image processing using the mark camera 64 described above. For example, the mounting machine 11 may detect a board end or board width W of the circuit board CB by providing a sensor (a reflection type optical sensor or the like) on the inner wall portion of the stopper 35.

  In the mounting machine 11 shown in FIG. 6, the base end portion of the circuit board CB is imaged by the mark camera 64 with the rail width W2 of the conveyor 31 being widened. For example, as shown in FIG. A cutout portion 67 may be provided at the carry-in entrance, and the circuit board CB inserted into the cutout portion 67 may be imaged by the mark camera 64. The notch 67 is formed by notching the inner wall portion on the upstream side (conveyor 71 side) of the stopper 35. The shape of the notch 67 viewed from above the device is tapered toward the downstream side in the transport direction (X-axis direction).

  Here, when the base end portion of the circuit board CB is imaged by the mark camera 64 in a state where the inner wall portion of the stopper 35 and the outer peripheral portion of the circuit board CB are close to each other, the outer edge of the board end in the imaging data becomes unclear. . For this reason, the mounting machine 11 may not be able to detect the board edge accurately unless the image is taken with the stopper 35 positioned away from the circuit board CB. On the other hand, in the mounting machine 11 shown in FIG. 7, the base end of the circuit board CB inserted from the board handling device 17 into the notch 67 of the stopper 35 is imaged by the mark camera 64 without increasing the rail width W2. To do. In such a configuration, by providing the notch portion 67, the substrate end of the circuit board CB in the image data photographed by the mark camera 64 becomes clear, and even if the stopper 35 is in a position close to the circuit board CB, the accuracy is high. It is possible to detect the base end part well. Note that the cutout portion 67 may be processed so that a color having a high contrast with respect to the circuit board CB is added and the outer edge of the board edge becomes clearer.

  Further, in such a mounting machine 11, after the production management computer 23 presets the rail width W2 according to the presence or absence of the reflow process, the board end of the circuit board CB into which the mounting machine 11 is independently carried is set. It is possible to detect and finely adjust the rail width W2 again. At this time, since the rail width W2 of the mounting machine 11 is adjusted in advance by the production management computer 23, the circuit board CB carried from the board handling device 17 is more reliably inserted into the notch 67. It becomes. Therefore, according to this mounting machine 11, the rail width W2 adjusted in advance by the production management computer 23 according to the contraction and warpage of the circuit board CB is quickly adjusted to the appropriate rail width W2 according to the actual transport position. can do.

  In addition, the timing which the mounting machine 11 shown in FIG. 7 adjusts the rail width W2 is arbitrary. For example, the mounting machine 11 detects the board end of the circuit board CB and adjusts the rail width W2 while carrying the circuit board CB conveyed from the board handling device 17 into the notch 67 of the stopper 35. Also good. Alternatively, the mounting machine 11 stops the conveyance of the circuit board CB with respect to the board handling device 17 in a state where the board end of the circuit board CB is carried into the notch 67, and the rail width W2 of the mounting machine 11 is stopped. Adjustments may be made.

<Changing the rail width of the rear device by the front device>
Further, in the mounting machine 11 shown in FIGS. 6 and 7 described above, the board width W with respect to the circuit board CB which is in a state straddling both the conveyors 31 and 71 when being transported from the board handling device 17 in the previous stage. However, the present invention is not limited to this. For example, the mounting machine 11 transmits the board width W detected from the imaging data of the mark camera 64 to the subsequent board handling apparatus 17 and other mounting machines 11 while the circuit board CB is being conveyed by the conveyor 31, and the subsequent apparatus. You may implement control which changes the rail width of the conveyors 31 and 71 of this. Alternatively, the production management computer 23 may receive the board width W detected by the mounting machine 11 and control the rail widths of other devices of the component mounting line 12 based on the received board width W. . Even in such a configuration, the substrate work system 10 can smoothly carry the circuit board CB. Further, according to the substrate working system 10, the rail widths of all the subsequent devices can be adjusted to appropriate values only by detecting the substrate width W by the most upstream (first stage) mounting machine 11 of the component mounting line 12. It is also possible to do.

  10 board-to-board working system, 12 component mounting line, 23 production management computer, 21A, 21B board ID recording unit, 31 conveyor, 46 backup pin, 64 mark camera, CB circuit board, H1, H2 preparation height, W board width, W2 Rail width.

Claims (7)

A board-to-board system that re-injects a circuit board that has undergone reflow processing into a component mounting line and mounts components.
The rail of the conveyor on which the circuit board is re-introduced based on the control data in which at least one of the contraction amount of the board width after the reflow process and the warp amount of the circuit board after the reflow process are set A substrate working system comprising a control unit for setting a width.   2. The on-board working system according to claim 1, wherein the circuit board is a double-sided mounting board in which components are mounted on both the top surface and the bottom surface of one circuit board. The control data is set as mounting order data indicating from which surface of the top surface and the bottom surface of the double-sided mounting board the component should be mounted,
The control unit determines whether or not the next mounting process to be performed on the component mounting line is a mounting process to be performed after re-inserting the double-sided mounting board based on the mounting order data, and re-input The board-to-board operation according to claim 2, wherein when it is determined that the mounting process is performed later, the rail width of the conveyor is changed based on at least one of the contraction amount and the warpage amount. system. The circuit board is provided with a recording unit having identification information for identifying the circuit board,
A reading unit that reads the identification information from the recording unit;
Based on the identification information read by the reading unit, the control unit determines whether or not the circuit board put into the component mounting line has been put back on, and the circuit board is turned on again 4. The rail width of the conveyor is changed based on at least one of the contraction amount and the warpage amount when it is determined that the rail has been operated. 5. The on-board working system as described. The circuit board is a double-sided mounting board in which components are mounted on both the top surface and the bottom surface with respect to one circuit board,
When mounting a component on the upper surface of the double-sided mounting substrate, it rises toward the lower surface of the double-sided mounting substrate, and has a backup pin that supports the double-sided mounting substrate from the lower surface,
The control unit, based on at least one of the mounting order data and the identification information, whether the mounting process to be performed next is a mounting process to be performed after re-inserting the double-sided mounting board, or It is determined whether or not the double-sided mounting board is re-inserted. Based on the determination result, the position of the backup pin is determined before the double-sided mounting board is transported to the top of the backup pin. 5. The substrate working system according to claim 3, wherein a preparation height for raising the height in advance is determined. The conveyor is one in which a plurality of conveyors are connected in series along the conveying direction of the circuit board,
A measurement unit for measuring the substrate width of the circuit board;
The control unit changes the rail width of the rear conveyor in advance according to the board width of the circuit board measured by the measurement unit when the circuit board is transported on the front conveyor. The board | substrate working system in any one of Claim 1 thru | or 5. The conveyor is one in which a plurality of conveyors are connected in series along the conveying direction of the circuit board,
A measurement unit for measuring the substrate width of the circuit board;
The control unit temporarily stops the conveyance of the circuit board with respect to the circuit board that is in a state straddling both conveyors when the circuit board is conveyed from the preceding conveyor to the subsequent conveyor, or the circuit 6. The substrate work according to claim 1, wherein the rail width of the conveyor at the subsequent stage is changed according to the substrate width measured by the measurement unit while conveying the substrate. system.

Images