JP7417806B2 - Re-injection support device - Google Patents

Re-injection support device Download PDF

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JP7417806B2
JP7417806B2 JP2019105792A JP2019105792A JP7417806B2 JP 7417806 B2 JP7417806 B2 JP 7417806B2 JP 2019105792 A JP2019105792 A JP 2019105792A JP 2019105792 A JP2019105792 A JP 2019105792A JP 7417806 B2 JP7417806 B2 JP 7417806B2
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board
loading
location
information
workpiece
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JP2020201537A (en
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俊之 木納
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Panasonic Intellectual Property Management Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/083Quality monitoring using results from monitoring devices, e.g. feedback loops
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

Description

本発明は、生産ラインの途中から抜取ったワークを生産ラインに再投入する作業を支援する再投入支援装置に関する。 TECHNICAL FIELD The present invention relates to a re-injection support device that supports the work of re-introducing a workpiece extracted from the middle of a production line into the production line.

印刷装置や部品搭載装置などの複数の生産装置を連結して構成された生産ラインである部品実装ラインでは、上流側から搬入されたワークである基板を下流側に順次搬送しながら半田印刷や部品搭載などの作業工程を実行して、基板に部品を実装した実装基板が生産される。部品実装ラインには検査装置が組み込まれており、各作業工程後の基板を対象として、所定の検査項目について作業結果の良否判定が行われる(例えば特許文献1参照)。 The component mounting line is a production line that connects multiple production devices such as printing equipment and component mounting equipment.The component mounting line is a production line that connects multiple production devices such as printing equipment and component mounting equipment.The component mounting line is a production line that connects multiple production equipment such as printing equipment and component mounting equipment. By performing work processes such as mounting, a mounted board with components mounted on the board is produced. An inspection device is installed in the component mounting line, and the quality of the work results is determined for predetermined inspection items for the board after each work process (for example, see Patent Document 1).

特許文献1に記載の部品実装ラインでは、検査装置で基板の修正が必要と判定されると、その検査装置の下流側に組み込まれた基板受渡装置からその基板を抜取り、必要な修正作業が行われた後にその基板をその検査装置の上流側に組み込まれた基板受渡装置に再投入するオフライン修正処理が実行される。オフライン修正処理では、基板の修正が必要と判定されるとその基板を抜取る基板受渡装置とその基板を再投入する基板受渡装置が特定される。そして、特定された基板受渡装置のみ扉部材のロック機構が解除されて基板の取り出し、再投入が可能な状態となる。これにより、誤って異なる基板を抜取ったり、誤って異なる基板受渡装置に基板を再投入したりすることが防止される。 In the component mounting line described in Patent Document 1, when an inspection device determines that a board needs to be corrected, the board is extracted from a board transfer device installed downstream of the inspection device, and the necessary correction work is performed. After that, an off-line correction process is executed in which the board is reinserted into the board transfer device installed upstream of the inspection device. In the offline correction process, when it is determined that a board needs to be corrected, a board transfer device that removes the board and a board transfer device that reloads the board are identified. Then, the locking mechanism of the door member of only the identified substrate transfer device is released, and the substrate can be taken out and reinserted. This prevents erroneously removing a different board or erroneously reinserting a board into a different board transfer device.

特開2009-21466号公報JP2009-21466A

ところで、検査装置で確認が必要と判定されて部品実装ラインから抜取られた基板は、基板の修正作業の内容や抜取られてからの経過時間などの様々な状況の変化に応じて、再投入する場所を変えたり、再投入を中止したりする必要がある。しかしながら、特許文献1を含む従来技術では、部品実装ラインから抜取った基板は所定の処理を行って部品実装ラインに再投入する前提で誤操作の防止対策を実行しているため、抜取り後の様々な状況に応じて適切に誤操作を防止するためにはさらなる改善の余地があった。 By the way, boards that have been removed from the component mounting line after being determined by the inspection equipment to require confirmation may be re-inserted depending on various circumstances such as the details of the board modification work or the amount of time that has passed since the board was removed. It is necessary to change the location or cancel re-injection. However, in the conventional technology including Patent Document 1, measures are taken to prevent erroneous operations on the premise that the board extracted from the component mounting line is subjected to predetermined processing and then reintroduced to the component mounting line. There was room for further improvement in order to appropriately prevent erroneous operations depending on the situation.

そこで本発明は、生産ラインの途中から抜取ったワークを適切に生産ラインに再投入できるように支援する再投入支援装置を提供することを目的とする。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a re-injection support device that assists in appropriately re-introducing a workpiece taken out from the middle of a production line into the production line.

本発明の再投入支援装置は、生産ラインの途中から抜取ったワークを生産ラインに再投入する作業を支援する再投入支援装置であって、再投入予定のワークのワーク識別情報と前記生産ラインにおける再投入場所を特定可能な再投入場所情報を取得する情報取得手段と、前記情報取得手段による前記ワーク識別情報と前記再投入場所情報の取得を条件に、前記再投入場所情報で特定された再投入場所からのワークの再投入を可能な状態にする再投入処理部と、を備え、前記再投入場所には、開閉カバーが設けられており、前記再投入処理部は、前記開閉カバーをアンロック状態とすることで、前記再投入場所からの前記ワークの再投入を可能な状態とし、前記再投入処理部は、ワーク識別情報よりそのワーク識別情報で特定されたワークが生産ラインに再投入可能かどうかを判断する再投入可否判断部を有し、前記再投入可否判断部は、前記再投入予定のワークに生産ラインに現在適用されている生産プログラムが適合するかどうかで判断する。 The re-injection support device of the present invention is a re-input support device that supports the work of re-introducing a workpiece picked out from the middle of a production line into the production line, and includes work identification information of a workpiece scheduled to be re-introduced and information on the production line. information acquisition means for acquiring re-insertion place information that can identify the re-insertion place; and on the condition that the information acquisition means acquires the work identification information and the re-insertion place information, a re-insertion processing section that makes it possible to re-inject the work from a re-insertion place, the re-insertion place is provided with an opening/closing cover, and the re-inserting processing section opens the opening/closing cover. By setting the unlocked state, the workpiece can be re-injected from the re-input location , and the re-input processing unit causes the workpiece identified by the workpiece identification information to be input to the production line from the workpiece identification information. It has a re-input possibility determining unit that determines whether re-input is possible, and the re-input possibility determining unit determines whether a production program currently applied to the production line is compatible with the work scheduled to be re-input. .

本発明によれば、生産ラインの途中から抜取ったワークを適切に生産ラインに再投入で
きるように支援することができる。
According to the present invention, it is possible to support workpieces extracted from the middle of a production line to be appropriately reintroduced to the production line.

本発明の一実施の形態の部品実装ラインの構成説明図Configuration explanatory diagram of a component mounting line according to an embodiment of the present invention 本発明の一実施の形態の部品実装ラインが備える検査装置とコンベアの構成説明図A configuration explanatory diagram of an inspection device and a conveyor included in a component mounting line according to an embodiment of the present invention 本発明の一実施の形態の部品実装ラインが備える検査装置とコンベアの構成説明図A configuration explanatory diagram of an inspection device and a conveyor included in a component mounting line according to an embodiment of the present invention 本発明の一実施の形態の部品実装ラインの情報処理系の構成を示すブロック図A block diagram showing the configuration of an information processing system of a component mounting line according to an embodiment of the present invention 本発明の一実施の形態の基板抜取り装置の動作を説明するフロー図A flow diagram illustrating the operation of the substrate extracting device according to an embodiment of the present invention 本発明の一実施の形態の基板抜取り処理のフロー図Flowchart of substrate extraction processing according to an embodiment of the present invention 本発明の一実施の形態の基板抜取り処理のフロー図Flowchart of substrate extraction processing according to an embodiment of the present invention 本発明の一実施の形態の基板抜取り処理で表示される(a)要確認基板発生通知画面の例を示す図(b)基板ID読み取り要求画面の例を示す図(a) A diagram showing an example of a confirmation-required board generation notification screen displayed during the board sampling process according to an embodiment of the present invention (b) A diagram showing an example of a board ID reading request screen 本発明の一実施の形態の基板抜取り処理で表示される(a)運転再開確認画面の例を示す図(b)再投入不可警告画面の例を示す図(a) A diagram showing an example of an operation restart confirmation screen displayed during the board extraction process according to an embodiment of the present invention (b) A diagram showing an example of a re-insertion impossible warning screen 本発明の一実施の形態の基板抜取り処理で表示される(a)基板無し警告画面の例を示す図(b)不明基板有り警告画面の例を示す図(a) A diagram showing an example of a no-board warning screen displayed during the board sampling process according to an embodiment of the present invention (b) A diagram showing an example of an unknown board warning screen 本発明の一実施の形態の基板再投入処理のフロー図Flowchart of substrate re-insertion processing according to an embodiment of the present invention 本発明の一実施の形態の基板再投入処理のフロー図Flowchart of substrate re-insertion processing according to an embodiment of the present invention 本発明の一実施の形態の基板再投入処理で表示される(a)基板ID読み取り要求画面の例を示す図(b)再投入不可警告画面の例を示す図(a) Diagram showing an example of a board ID reading request screen displayed during board re-insertion processing according to an embodiment of the present invention (b) Diagram showing an example of a re-insertion not possible warning screen 本発明の一実施の形態の基板再投入処理で表示される(a)再投入場所の選択要求画面の例を示す図(b)不適切警告画面の例を示す図(a) A diagram showing an example of a re-insertion location selection request screen displayed in the board re-insertion process according to an embodiment of the present invention (b) A diagram showing an example of an inappropriateness warning screen 本発明の一実施の形態の基板再投入処理で表示される(a)基板再投入許可通知画面の例を示す図(b)基板再投入要求画面の例を示す図(a) A diagram showing an example of a board re-insertion permission notification screen displayed in the board re-insertion process according to an embodiment of the present invention (b) A diagram showing an example of a board re-insertion request screen

本発明の一実施の形態を図面を参照して説明する。まず図1を参照して、部品実装ライン1の構成について説明する。部品実装ライン1は、基板(ワーク)に部品を実装して実装基板を生産する機能を有する生産ラインである。部品実装ライン1には、基板搬送方向の上流側(紙面左側)から下流側(紙面右側)に向けて、ローダM1、第1コンベアM2、印刷装置M3、印刷検査装置M4、第2コンベアM5、部品搭載装置M6~M8、第3コンベアM9、搭載検査装置M10、第4コンベアM11、リフロー装置M12、第5コンベアM13、リフロー後検査装置M14、第6コンベアM15、アンローダM16などの生産装置が直列に連結されている。 An embodiment of the present invention will be described with reference to the drawings. First, the configuration of the component mounting line 1 will be explained with reference to FIG. The component mounting line 1 is a production line that has the function of mounting components on a board (work) to produce a mounted board. The component mounting line 1 includes a loader M1, a first conveyor M2, a printing device M3, a print inspection device M4, a second conveyor M5, from the upstream side (left side in the paper) to the downstream side (right side in the paper) in the board transport direction. Production equipment such as component mounting devices M6 to M8, third conveyor M9, mounting inspection device M10, fourth conveyor M11, reflow device M12, fifth conveyor M13, post-reflow inspection device M14, sixth conveyor M15, and unloader M16 are connected in series. is connected to.

各生産装置は、有線または無線の通信ネットワーク2を介して情報処理装置3に接続されている。コンピュータである情報処理装置3には、各生産装置から作業されている基板と作業位置を特定する情報、基板に実施された作業の情報などが送信される。また、情報処理装置3には、部品実装ライン1に現在適用されている生産プログラムの情報などが記憶されている。 Each production device is connected to an information processing device 3 via a wired or wireless communication network 2. Information identifying the board being worked on and the work position, information on the work performed on the board, etc. are transmitted from each production device to the information processing device 3, which is a computer. Further, the information processing device 3 stores information on a production program currently applied to the component mounting line 1, and the like.

図1において、ローダM1は、下流側の生産装置に基板B(図3参照)を供給する。印刷装置M3は、基板Bに部品接合用の半田をスクリーン印刷する半田印刷作業を実行する。印刷検査装置M4は、基板Bに印刷された半田の状態を検査する印刷検査作業を実行する。部品搭載装置M6~M8は、半田が印刷された基板Bに部品を搭載する部品搭載作業を実行する。 In FIG. 1, a loader M1 supplies a substrate B (see FIG. 3) to downstream production equipment. The printing device M3 performs a solder printing operation of screen printing solder for joining components onto the board B. The print inspection device M4 performs a print inspection operation to inspect the state of solder printed on the board B. The component mounting devices M6 to M8 perform a component mounting operation of mounting components onto the board B on which solder is printed.

搭載検査装置M10は、基板Bに搭載された部品の状態を検査する搭載検査作業を実行する。リフロー装置M12は、基板Bを加熱して半田を融解させた後に硬化させ、基板Bの電極と部品の端子とを半田接合するリフロー作業を実行する。リフロー後検査装置M14は、リフロー後の基板Bにおける部品の状態を検査するリフロー後検査作業を実行する。アンローダM16は、上流側から搬送された基板Bを回収する。 The mounting inspection device M10 performs a mounting inspection work that inspects the state of components mounted on the board B. The reflow device M12 heats the board B to melt and harden the solder, and performs a reflow operation in which the electrodes of the board B and the terminals of the components are soldered together. The post-reflow inspection device M14 performs a post-reflow inspection work that inspects the state of components on the board B after reflow. The unloader M16 collects the substrate B transported from the upstream side.

図1において、第1コンベアM2、第2コンベアM5、第3コンベアM9、第4コンベアM11、第5コンベアM13、第6コンベアM15は、上流側の生産装置から搬出された基板Bを下流側の生産装置に搬送する搬送コンベアを備えている。これらのコンベアの全部もしくは一部は搬送コンベア上の基板Bの抜取りや搬送コンベアへの基板Bの再投入が可能な構造になっている。さらに基板Bの抜取りや再投入可能なコンベアは、後述する基板抜取り処理、抜取った基板Bを部品実装ライン1に再投入する基板再投入処理に対応した機能を備えている。 In FIG. 1, a first conveyor M2, a second conveyor M5, a third conveyor M9, a fourth conveyor M11, a fifth conveyor M13, and a sixth conveyor M15 transport substrates B carried out from upstream production equipment to downstream It is equipped with a conveyor that transports it to production equipment. All or some of these conveyors have a structure that allows the board B to be removed from the transport conveyor and the board B to be reinserted into the transport conveyor. Furthermore, the conveyor capable of extracting and reinserting the board B has functions corresponding to a board extracting process and a board reinserting process in which the extracted board B is reinjected into the component mounting line 1, which will be described later.

また、第1コンベアM2は、搬送コンベアによって搬送されてきた基板Bに付されたバーコードや2次元コードなどの基板ラベルLb(図3参照)を読み取って基板Bを特定する基板ID(ワーク識別情報)を読み取る内蔵リーダ(図示省略)を備えている。第1コンベアM2は、ローダM1から供給された基板Bの基板ラベルLbから基板IDを読み取って、情報処理装置3に送信する。 In addition, the first conveyor M2 reads a board label Lb (see FIG. 3) such as a bar code or two-dimensional code attached to the board B transported by the transport conveyor, and uses a board ID (work identification) to identify the board B. It is equipped with a built-in reader (not shown) that reads the information. The first conveyor M2 reads the board ID from the board label Lb of the board B supplied from the loader M1, and transmits it to the information processing device 3.

部品実装ライン1では、基板Bに付された基板ラベルLbや生産装置に付されたバーコードや2次元コードなどの装置ラベルLm(図2参照)を読み取るリーダ4が使用される。リーダ4が備える読み取り部4aは、基板ラベルLbを読み取って基板IDを認識し、装置ラベルLmを読み取って生産装置を特定する装置IDを認識する。認識された基板ID、装置IDは、生産装置または情報処理装置3に無線で送信される。また、リーダ4は、生産装置または情報処理装置3から送信される各種情報を無線で受信して、表示画面4bに表示する。リーダ4は、作業者が携帯する他、生産装置の近くに複数配備されている(図2参照)。 In the component mounting line 1, a reader 4 is used that reads a board label Lb attached to a board B and a device label Lm (see FIG. 2) such as a bar code or two-dimensional code attached to a production device. A reading unit 4a included in the reader 4 reads the board label Lb to recognize the board ID, and reads the device label Lm to recognize the device ID that specifies the production device. The recognized board ID and device ID are wirelessly transmitted to the production device or information processing device 3. Further, the reader 4 wirelessly receives various information transmitted from the production device or the information processing device 3 and displays it on the display screen 4b. In addition to being carried by a worker, a plurality of readers 4 are installed near the production equipment (see FIG. 2).

次に図2、図3を参照して、印刷検査装置M4、搭載検査装置M10、リフロー後検査装置M14などの検査装置の構成について説明する。印刷検査装置M4、搭載検査装置M10、リフロー後検査装置M14は、検査対象が半田印刷後の基板B、部品搭載後の基板B、リフロー後の基板Bであり、検査目的に特化したカメラ、センサ、照明等を備えた固有の検査ヘッド11を備えている。なお各検査装置において、開閉カバー6や搬送コンベア9など基板Bの搬送や再投入に関係する部分は同様の構成である。以下、搭載検査装置M10を例に説明する。搭載検査装置M10において、作業者が作業を行う前面には、装置ラベルLmが付されている。また、搭載検査装置M10の前面には、搭載検査装置M10による検査結果など各種情報を表示する表示部5が配置されている。 Next, with reference to FIGS. 2 and 3, the configurations of inspection devices such as the print inspection device M4, the mounting inspection device M10, and the post-reflow inspection device M14 will be described. The print inspection device M4, the mounting inspection device M10, and the post-reflow inspection device M14 inspect a board B after solder printing, a board B after mounting components, and a board B after reflow, and are equipped with a camera specialized for inspection purposes, It has its own inspection head 11 with sensors, lighting, etc. Note that in each inspection device, parts related to transporting and reinserting the substrate B, such as the opening/closing cover 6 and the transport conveyor 9, have the same configuration. The on-board inspection device M10 will be described below as an example. In the mounted inspection device M10, a device label Lm is attached to the front surface where an operator works. Furthermore, a display section 5 that displays various information such as inspection results by the on-board inspection device M10 is arranged on the front side of the on-board inspection device M10.

図3において、搭載検査装置M10は、前面に開閉カバー6を備えており、内部に開閉カバーロック部7、開閉カバー検出部8を備えている。開閉カバー6が閉じられた状態で開閉カバーロック部7がロック状態になると、開閉カバー6が開閉できないようにロックされる。また、開閉カバーロック部7がアンロック状態になると、作業者は開閉カバー6を自在に開閉することができる。開閉カバー検出部8はマイクロスイッチなどのセンサであり、開閉カバー6が閉じられた状態か、開いている状態かを検出する。 In FIG. 3, the mounting inspection device M10 is equipped with an opening/closing cover 6 on the front, and an opening/closing cover locking section 7 and an opening/closing cover detecting section 8 inside. When the opening/closing cover lock part 7 is in the locked state with the opening/closing cover 6 closed, the opening/closing cover 6 is locked so that it cannot be opened or closed. Moreover, when the opening/closing cover lock part 7 is in the unlocked state, the operator can freely open/close the opening/closing cover 6. The opening/closing cover detection unit 8 is a sensor such as a microswitch, and detects whether the opening/closing cover 6 is in a closed state or an open state.

搭載検査装置M10の内部には、一対の搬送コンベア9が配置されている。搬送コンベア9は、上流側の第3コンベアM9から搬出された基板Bを受け取り、検査作業位置P1まで搬送し、検査後の基板Bを下流側の第4コンベアM11に搬出する。搬送コンベア9には、検査作業位置P1まで搬送された基板Bを検出する光センサなどの基板検出部10
が配置されている。搬送コンベア9が基板Bを検査作業位置P1に停止させる際は、搬送されている基板Bを基板検出部10が検出すると基板Bの搬送が停止される。作業者は、開閉カバー6を開けて、基板Bを検査作業位置P1に再投入することができる。すなわち、搭載検査装置M10における検査作業位置P1は、基板Bの再投入が可能な作業位置である。
A pair of conveyors 9 are arranged inside the loading inspection device M10. The conveyor 9 receives the substrate B carried out from the third conveyor M9 on the upstream side, conveys it to the inspection work position P1, and carries out the inspected substrate B to the fourth conveyor M11 on the downstream side. The conveyor 9 includes a substrate detection unit 10 such as an optical sensor that detects the substrate B conveyed to the inspection work position P1.
is located. When the conveyor 9 stops the substrate B at the inspection work position P1, when the substrate detection section 10 detects the substrate B being conveyed, the conveyance of the substrate B is stopped. The operator can open the open/close cover 6 and reinsert the board B into the inspection work position P1. That is, the inspection work position P1 in the mounted inspection apparatus M10 is a work position where the board B can be reinserted.

図3において、搭載検査装置M10の内部には、検査ヘッド11が設置されている。検査ヘッド11は、基板Bに搭載された部品の状態を検査するカメラ、3Dセンサの他、撮像用の照明などを備えている。搭載検査装置M10は、検査ヘッド11による検査結果に基づいて、部品の有無、部品の搭載状態を判断する。 In FIG. 3, an inspection head 11 is installed inside the mounted inspection device M10. The inspection head 11 includes a camera for inspecting the state of the components mounted on the board B, a 3D sensor, and lighting for imaging. The mounting inspection device M10 determines the presence or absence of components and the mounting state of the components based on the inspection results obtained by the inspection head 11.

次に図2、図3を参照して、基板Bの抜取り処理に対応した第2コンベアM5、第4コンベアM11、第6コンベアM15の構成について説明する。なお、第2コンベアM5、第4コンベアM11、第6コンベアM15は同様の構成である。以下、搭載検査装置M10の下流に位置する第4コンベアM11を例に説明する。第4コンベアM11において、作業者が作業を行う前面には、装置ラベルLmが付されている。また、第4コンベアM11の前面には、第4コンベアM11における基板抜取り処理、基板再投入処理の指示など各種情報を表示する表示部12が配置されている。 Next, with reference to FIGS. 2 and 3, the configurations of the second conveyor M5, fourth conveyor M11, and sixth conveyor M15 corresponding to the extraction process of the substrate B will be described. Note that the second conveyor M5, the fourth conveyor M11, and the sixth conveyor M15 have the same configuration. The fourth conveyor M11 located downstream of the mounting inspection device M10 will be described below as an example. In the fourth conveyor M11, a device label Lm is attached to the front surface where an operator works. Furthermore, a display unit 12 is arranged in front of the fourth conveyor M11 to display various information such as instructions for substrate extraction processing and substrate re-insertion processing in the fourth conveyor M11.

図3において、第4コンベアM11は、上面に開閉カバー13を、内部に開閉カバーロック部14、開閉カバー検出部15を備えている。開閉カバー13、開閉カバーロック部14、開閉カバー検出部15の機能は、搭載検査装置M10が備える開閉カバー6、開閉カバーロック部7、開閉カバー検出部8と同様であり、詳細な説明を省略する。 In FIG. 3, the fourth conveyor M11 includes an opening/closing cover 13 on its upper surface, an opening/closing cover locking section 14, and an opening/closing cover detecting section 15 inside. The functions of the opening/closing cover 13, opening/closing cover locking section 14, and opening/closing cover detection section 15 are the same as those of the opening/closing cover 6, opening/closing cover locking section 7, and opening/closing cover detecting section 8 included in the on-board inspection device M10, and detailed explanations are omitted. do.

第4コンベアM11の内部には、一対の搬送コンベア16が配置されている。搬送コンベア16は、上流側の搭載検査装置M10から搬出された基板Bを受け取り、抜取り作業位置P2まで搬送し、抜取り作業位置P2にある基板Bを下流側のリフロー装置M12に搬出する。搬送コンベア16には、抜取り作業位置P2まで搬送された基板Bを検出する光センサなどの基板検出部17が配置されている。 A pair of transport conveyors 16 are arranged inside the fourth conveyor M11. The transport conveyor 16 receives the substrate B carried out from the upstream mounting inspection device M10, transports it to the sampling operation position P2, and carries out the substrate B at the sampling operation position P2 to the downstream reflow apparatus M12. A substrate detection unit 17 such as an optical sensor is arranged on the conveyor 16 to detect the substrate B conveyed to the sampling work position P2.

搬送コンベア16が基板Bを抜取り作業位置P2に停止させる際は、搬送されている基板Bを基板検出部17が検出すると基板Bの搬送が停止される。搬送コンベア16は、基板抜取り処理、基板再投入処理を行わない場合は、搭載検査装置M10から受け取った基板Bを抜取り作業位置P2に停止させることなくリフロー装置M12に搬出する。 When the conveyor 16 stops the substrate B at the extraction work position P2, when the substrate detection section 17 detects the substrate B being conveyed, the conveyance of the substrate B is stopped. When the substrate sampling process and the substrate reinsertion process are not performed, the conveyor 16 carries out the substrate B received from the mounting inspection apparatus M10 to the reflow apparatus M12 without stopping it at the sampling operation position P2.

図1において、印刷装置M3、部品搭載装置M6~M8は、作業位置を有する搬送コンベア、開閉カバーと開閉カバーロック部を備えており、基板Bの再投入が可能である。すなわち、部品実装ライン1を構成する第1コンベアM2、印刷装置M3、印刷検査装置M4、第2コンベアM5、部品搭載装置M6~M8、第3コンベアM9、搭載検査装置M10、第4コンベアM11、第5コンベアM13、リフロー後検査装置M14、第6コンベアM15は、部品実装ライン1(生産ライン)に基板Bを再投入可能な再投入場所である。 In FIG. 1, the printing device M3 and the component mounting devices M6 to M8 are equipped with a conveyor having a working position, an opening/closing cover, and an opening/closing cover lock part, and the board B can be reloaded. That is, the component mounting line 1 includes a first conveyor M2, a printing device M3, a printing inspection device M4, a second conveyor M5, component mounting devices M6 to M8, a third conveyor M9, a mounting inspection device M10, a fourth conveyor M11, The fifth conveyor M13, the post-reflow inspection device M14, and the sixth conveyor M15 are re-input locations where the board B can be re-injected into the component mounting line 1 (production line).

次に図4を参照して、部品実装ライン1の情報処理系の構成について説明する。ここでは、部品実装ライン1の基板抜取り処理、基板再投入処理に関係する構成について説明する。情報処理装置3には、抜取り基板情報20、基板ロケーション情報21が記憶されている。抜取り基板情報20(抜取りワーク情報)には、部品実装ライン1(生産ライン)の途中から抜取られた基板B(ワーク)の基板ID(ワーク識別情報)、抜取られた時刻、抜取られた場所(抜取り場所)、部品実装ライン1で実施された作業の情報、抜取られた時に部品実装ライン1で適用されていた生産プログラムの情報などが含まれている。こ
れらの情報を含んだ抜取り基板情報は後述する基板抜取り処理によって自動的に作成される。
Next, with reference to FIG. 4, the configuration of the information processing system of the component mounting line 1 will be described. Here, the configuration related to the board extraction process and the board re-insertion process of the component mounting line 1 will be described. The information processing device 3 stores sampled board information 20 and board location information 21. The sampled board information 20 (sampled work information) includes the board ID (workpiece identification information) of the board B (workpiece) sampled from the middle of the component mounting line 1 (production line), the time at which it was sampled, and the location where it was sampled ( information about the work performed on the component mounting line 1, and information about the production program that was being applied on the component mounting line 1 when the sample was extracted. Sampling board information including this information is automatically created by a board sampling process described later.

また、抜取られた基板Bに対してリペア作業が行われた場合、抜取られた後にその基板B(ワーク)に実施された作業の情報を抜取り基板情報20に追加することができる。また、目視検査やリペア作業の結果、人手ではなくて部品搭載装置M6~M8での再装着が必要と判断された場合は、再装着が必要な部品の情報も抜取り基板情報20に追加することができる。これらの情報の追加は、リペア作業を行った作業者がキーボードや情報端末等の入力装置(図示省略)より行う。情報処理装置3は、生産装置からの問い合わせに応じて、抜取り基板情報20に含まれる該当情報を返信する。 Further, when repair work is performed on the extracted board B, information on the work performed on the board B (work) after being extracted can be added to the extracted board information 20. Additionally, as a result of visual inspection and repair work, if it is determined that remounting is required using component mounting devices M6 to M8 rather than manually, information on the components that require remounting shall also be added to the sampled board information 20. Can be done. These pieces of information are added by the operator who has performed the repair work using an input device (not shown) such as a keyboard or an information terminal. The information processing device 3 replies with the relevant information included in the sampled board information 20 in response to an inquiry from the production device.

図4において、基板ロケーション情報21には、部品実装ライン1(生産ライン)における各基板Bの所在が基板IDに関連付けられて記憶されている。具体的には、第1コンベアM2の内蔵リーダでローダM1から供給された基板Bの基板IDが読み取られると、その情報が基板ロケーション情報21に記録される。その後、各生産装置から基板Bが下流側の生産装置に搬送される際に基板ロケーション情報21が新しい情報に更新される。すなわち、基板Bの所在が新しい情報に更新される。また、基板抜取り処理によって抜取られた基板Bの情報は、基板ロケーション情報21から削除される。また、基板再投入処理によって基板Bが再投入されると、再投入された基板Bの情報が基板ロケーション情報21に追加、更新される。 In FIG. 4, the board location information 21 stores the location of each board B in the component mounting line 1 (production line) in association with the board ID. Specifically, when the board ID of the board B supplied from the loader M1 is read by the built-in reader of the first conveyor M2, the information is recorded in the board location information 21. Thereafter, when the substrate B is transported from each production device to the downstream production device, the substrate location information 21 is updated to new information. That is, the location of board B is updated with new information. Furthermore, information on the board B extracted by the board extraction process is deleted from the substrate location information 21. Furthermore, when the board B is reinserted in the board re-insertion process, information on the reinserted board B is added to and updated to the substrate location information 21.

図4において、第4コンベアM11は、ネットワーク通信部30、搬送処理部31、抜取り処理部32、再投入処理部33、無線通信部35を備えている。ネットワーク通信部30は通信インターフェースであり、通信ネットワーク2を介して情報処理装置3、他の生産装置との間でデータの送受信を行う。無線通信部35は無線通信装置であり、無線によってリーダ4との間でデータの送受信を行う。なお、リーダ4は、第4コンベアM11と有線で接続されていてもよい。また、リーダ4は、第4コンベアM11と情報処理装置3が備える無線通信装置と通信ネットワーク2とを介してデータの送受信を行ってもよい。 In FIG. 4, the fourth conveyor M11 includes a network communication section 30, a conveyance processing section 31, a sampling processing section 32, a reinsertion processing section 33, and a wireless communication section 35. The network communication unit 30 is a communication interface, and transmits and receives data between the information processing device 3 and other production devices via the communication network 2. The wireless communication unit 35 is a wireless communication device, and transmits and receives data to and from the reader 4 wirelessly. Note that the reader 4 may be connected to the fourth conveyor M11 by wire. Further, the reader 4 may transmit and receive data via the fourth conveyor M11, a wireless communication device included in the information processing device 3, and the communication network 2.

図4において、搬送処理部31は、上流側の搭載検査装置M10による基板Bの検査結果、基板検出部17による基板Bの検出結果、抜取り処理部32からの指令、再投入処理部33からの指令に基づいて、搬送コンベア16を制御して基板Bを搬送させる。具体的には、搭載検査装置M10による検査結果が良好である基板Bの場合、搬送処理部31は、受け取った基板Bを抜取り作業位置P2に停止させること無くリフロー装置M12に搬出させる。 In FIG. 4, the transport processing unit 31 receives the inspection results of the board B by the upstream mounting inspection device M10, the detection results of the board B by the board detection unit 17, the commands from the sampling processing unit 32, and the input processing unit 33. Based on the command, the transport conveyor 16 is controlled to transport the substrate B. Specifically, if the substrate B has a good inspection result by the mounting inspection device M10, the transport processing section 31 transports the received substrate B to the reflow device M12 without stopping it at the sampling work position P2.

搭載検査装置M10による検査結果が不良であり、抜取り処理部32から抜取り指令がなされた基板Bの場合、搬送処理部31は、受け取った基板Bを抜取り作業位置P2に停止させる。抜取り作業位置P2に停止させると、抜取り処理部32に基板停止完了信号を出力する。また、再投入処理部33から再投入準備指令を受けた場合、搬送処理部31は、抜取り作業位置P2に有る基板Bを下流側に搬送させて抜取り作業位置P2を空けた後、再投入処理部33に基板搬出完了信号を出力する。また、搬送処理部31は、第4コンベアM11にある基板Bをリフロー装置M12に搬出させると、情報処理装置3にその旨を送信する。 If the inspection result by the mounting inspection device M10 is bad and the sampling processing section 32 has issued a sampling instruction for the substrate B, the transport processing section 31 stops the received substrate B at the sampling operation position P2. When stopped at the sampling work position P2, a substrate stop completion signal is output to the sampling processing section 32. Further, when receiving a re-insertion preparation command from the re-insertion processing section 33, the transport processing section 31 transports the substrate B located at the extraction work position P2 to the downstream side to free up the extraction operation position P2, and then performs the re-insertion processing. A board unloading completion signal is output to the unit 33. Furthermore, when the transport processing unit 31 causes the substrate B on the fourth conveyor M11 to be carried out to the reflow apparatus M12, it transmits a notification to that effect to the information processing apparatus 3.

図4において、抜取り処理部32は、上流側の検査装置(搭載検査装置M10)による検査結果に基づいて、目視検査やリペアが必要かどうかを判断するために抜取りが必要と判断された基板B(以下、「要確認基板」と称する。)を、作業者が第4コンベアM11から抜取るための抜取り処理を実行させる。また、抜取り処理部32は、第4コンベアM
11から要確認基板が抜取られた後、第4コンベアM11の運転を再開させる抜取り後運転再開処理を実行させる。
In FIG. 4, the sampling processing unit 32 selects a board B that is judged to need to be sampled in order to determine whether visual inspection or repair is necessary, based on the inspection results by the upstream inspection device (onboard inspection device M10). (Hereinafter, referred to as a "substrate requiring confirmation") is caused to perform a sampling process for the operator to remove it from the fourth conveyor M11. Further, the sampling processing section 32 includes a fourth conveyor M.
After the board requiring confirmation is removed from M11, a post-extracting operation restart process is executed to restart the operation of the fourth conveyor M11.

抜取り処理において抜取り処理部32は、要確認基板が上流側から搬送コンベア16に受け渡されると、上流側の装置(ここでは、搭載検査装置M10)に基板Bの搬出禁止指令を送信し、要確認基板を抜取り作業位置P2に停止させる。また、抜取り処理部32は、要確認基板が発生した旨を表示部12に表示させる(図8(a)参照)。 In the sampling process, when the confirmation-required board is delivered to the conveyor 16 from the upstream side, the sampling processing unit 32 transmits a command to prohibit the removal of the board B to the upstream device (here, the mounting inspection device M10), The confirmation board is stopped at the extraction work position P2. Further, the sampling processing unit 32 causes the display unit 12 to display that a board requiring confirmation has occurred (see FIG. 8(a)).

なお、抜取り処理部32は、無線通信部35を介して作業者が携帯するリーダ4の表示画面4bに要確認基板が発生した旨を表示させてもよい。この場合、抜取り処理部32は、要確認基板を抜取らせる場所(ここでは、第4コンベアM11)も合わせて表示画面4bに表示させる。以下、抜取り処理部32が表示部12に各種情報を表示させる例で説明する。 Note that the sampling processing section 32 may display, via the wireless communication section 35, on the display screen 4b of the reader 4 carried by the worker, that a board requiring confirmation has occurred. In this case, the sampling processing unit 32 also displays on the display screen 4b the location (here, the fourth conveyor M11) from which the confirmation-required board is extracted. An example in which the sampling processing section 32 causes the display section 12 to display various information will be described below.

要確認基板が抜取り作業位置P2に停止すると、抜取り処理部32は、開閉カバーロック部14をアンロック状態とし(安全装置を解除)、要確認基板の抜取り準備が整った旨を表示部12に表示させる(図8(b)参照)。 When the board requiring confirmation has stopped at the extraction work position P2, the extraction processing section 32 unlocks the opening/closing cover lock section 14 (releases the safety device), and displays a message on the display section 12 to the effect that the board requiring confirmation is ready to be extracted. (See FIG. 8(b)).

運転再開処理において抜取り処理部32は、抜取られた要確認基板を第4コンベアM11に戻すか否かを入力するための画面を表示部12に表示させる(図9(a)参照)。要確認基板を戻さない場合、抜取り処理部32は、開閉カバー13が閉じられると、抜取り作業位置P2に基板Bが有るか否かを判断する。抜取り作業位置P2に基板Bが有る場合、抜取り処理部32は、不明な基板Bが有る旨の警告を表示部12に表示させる(図10(b)参照)。抜取り作業位置P2に基板Bが無い場合、抜取り処理部32は、開閉カバーロック部14をロック状態とし(安全装置を有効化)、上流側の装置に基板Bの搬出開始指令を送信して運転を再開させる。 In the operation restart process, the sampling processing unit 32 causes the display unit 12 to display a screen for inputting whether or not to return the extracted board requiring confirmation to the fourth conveyor M11 (see FIG. 9(a)). If the board requiring confirmation is not returned, the sampling processing section 32 determines whether or not the board B is present at the sampling operation position P2 when the opening/closing cover 13 is closed. If there is a substrate B at the sampling operation position P2, the sampling processing section 32 causes the display section 12 to display a warning that there is an unknown substrate B (see FIG. 10(b)). If there is no board B at the sampling work position P2, the sampling processing section 32 locks the opening/closing cover lock section 14 (enables the safety device), sends a command to start unloading the substrate B to the upstream device, and starts operation. to be restarted.

要確認基板を戻す場合、リーダ4の読み取り部4aによって読み取られた基板IDを受信すると、抜取り処理部32は、リーダ4から送信された基板IDが抜取られた要確認基板の基板IDと一致するか否かを判断する。基板IDが一致しない場合、抜取り処理部32は、再投入できない旨の警告を表示部12に表示させる(図9(b)参照)。 When returning a board requiring confirmation, upon receiving the board ID read by the reading unit 4a of the reader 4, the extraction processing unit 32 determines that the board ID transmitted from the reader 4 matches the board ID of the board requiring confirmation that was extracted. Determine whether or not. If the board IDs do not match, the extraction processing unit 32 causes the display unit 12 to display a warning that the board cannot be reinserted (see FIG. 9(b)).

基板IDが一致した場合、開閉カバー13が閉じられると、抜取り処理部32は、抜取り作業位置P2に基板Bが有るか否かを判断する。抜取り作業位置P2に基板Bが無い場合、抜取り処理部32は、要確認基板が抜取り作業位置P2に戻されていない旨の警告を表示部12に表示させる(図10(a)参照)。抜取り作業位置P2に基板Bが有る場合、抜取り処理部32は、開閉カバーロック部14をロック状態とし、上流側の装置に基板Bの搬出開始指令を送信して運転を再開させる。このように、第4コンベアM11(生産装置)とリーダ4は、生産ラインの途中から要確認基板(ワーク)を抜取る基板抜取り装置40を構成する。 When the board IDs match, when the open/close cover 13 is closed, the sampling processing section 32 determines whether the board B is present at the sampling operation position P2. If the board B is not present at the sampling position P2, the sampling processing unit 32 causes the display unit 12 to display a warning that the board requiring confirmation has not been returned to the sampling position P2 (see FIG. 10(a)). When the substrate B is present at the extraction work position P2, the extraction processing section 32 locks the opening/closing cover locking section 14, sends a command to start unloading the substrate B to the upstream device, and restarts the operation. In this way, the fourth conveyor M11 (production device) and the reader 4 constitute a substrate extraction device 40 that extracts a substrate (workpiece) requiring confirmation from the middle of the production line.

図4において、再投入処理部33は、生産ライン(部品実装ライン1)の途中から抜取った要確認基板(ワーク)を生産ラインに再投入するための再投入処理を実行させる。また、再投入処理部33は、内部処理部として再投入可否判断部34を備えている。以下、再投入される要確認基板を「再投入基板」と称する。再投入処理において再投入処理部33は、無線通信部35を介してリーダ4の表示画面4bに再投入基板の基板ID(ワーク識別情報)を読み取る旨を表示させる(図13(a)参照)。 In FIG. 4, the re-insertion processing section 33 executes a re-insertion process for reintroducing the board (workpiece) requiring confirmation that has been extracted from the middle of the production line (component mounting line 1) into the production line. Further, the re-input processing unit 33 includes a re-input permission determination unit 34 as an internal processing unit. Hereinafter, the re-entered board requiring confirmation will be referred to as a "re-entered board." In the re-loading process, the re-loading processing unit 33 displays on the display screen 4b of the reader 4 via the wireless communication unit 35 that the board ID (work identification information) of the re-loading board is to be read (see FIG. 13(a)). .

リーダ4の読み取り部4aによって読み取られた基板IDを受信すると、再投入可否判断部34は、抜取り基板情報20(抜取りワーク情報)に基づいて、その再投入基板が生
産ラインに再投入可能か否かを判断する。すなわち、再投入可否判断部34は、基板ID(ワーク識別情報)よりその基板IDが付された再投入基板(ワーク)が生産ラインに再投入可能かどうかを判断する。
Upon receiving the board ID read by the reading unit 4a of the reader 4, the re-input possibility determining unit 34 determines whether the re-input board can be re-introduced to the production line based on the extracted board information 20 (sampled work information). to judge. In other words, the re-input possibility determining unit 34 determines based on the board ID (workpiece identification information) whether the re-input board (work) to which the board ID is attached can be re-introduced to the production line.

具体的には、再投入可否判断部34は、抜取り基板情報20に含まれる再投入基板が抜取られた時刻に基づいて、再投入基板が生産ラインから抜取られてから経過した時間(経過時間)が所定の時間を超過していない場合、または返却期限を超過していない場合は、再投入可能と判断する。所定の経過時間、返却期限は、印刷装置M3において基板Bに半田がスクリーン印刷されてから部品の搭載を終えるまでの許容時間などに基づいて設定される。これによって、半田が乾燥して実装不良となる可能性が有る再投入基板の生産ラインへの再投入を防止することができる。 Specifically, the re-insertion permission determination unit 34 determines the time (elapsed time) that has passed since the re-inserted board was removed from the production line, based on the time when the re-inserted board was removed, which is included in the extracted board information 20. If the predetermined time has not exceeded or the return deadline has not passed, it is determined that the item can be re-inserted. The predetermined elapsed time and return deadline are set based on the allowable time from when solder is screen printed on the board B in the printing device M3 to when the mounting of components is finished. This makes it possible to prevent the board from being reintroduced to the production line, where the solder may dry and lead to defective mounting.

また、再投入可否判断部34は、抜取り基板情報20に含まれる再投入基板が抜取られた時の生産プログラムに基づいて、生産ラインに現在適用されている生産プログラムがその再投入基板に適合する場合は、再投入可能と判断する。例えば、再投入基板が抜取られた後に生産ラインで生産する実装基板の種類を変更する段取り替えが行われた場合は、生産プログラムが変更されることがある。生産プログラムが変更されている場合、再投入可否判断部34は、再投入不可能と判断する。これによって、再投入された再投入基板に作業できずに生産ラインが停止したり、再投入基板に異なる部品を搭載したりすることを防止することができる。 Further, the re-insertion possibility determining unit 34 determines, based on the production program at the time when the re-inserted board is extracted, which is included in the extracted board information 20, that the production program currently applied to the production line is compatible with the re-inserted board. If so, it is determined that re-input is possible. For example, if a setup change is made to change the type of mounting board to be produced on the production line after the re-input board is removed, the production program may be changed. If the production program has been changed, the re-input possibility determining unit 34 determines that re-input is not possible. As a result, it is possible to prevent the production line from stopping due to the inability to work on the reinserted board, or to prevent different parts from being mounted on the reinserted board.

再投入可否判断部34によって再投入不可と判断されると、再投入処理部33は、リーダ4の表示画面4bに基板IDが読み取られた再投入基板は再投入不可である旨の警告をリーダ4の表示画面4bに表示させる(図13(b)参照)。再投入可否判断部34によって再投入可能と判断されると、再投入処理部33は、抜取り基板情報20に基づいて、再投入基板の再投入場所(再投入する生産装置)をリーダ4の表示画面4bに表示させる(図14(a)参照)。すなわち、再投入処理部33は、基板ID(ワーク識別情報)よりその基板IDが付された再投入基板(ワーク)の再投入場所を通知する。 When the re-insertion determination unit 34 determines that re-insertion is not possible, the re-insertion processing unit 33 displays a warning on the display screen 4b of the reader 4 to the effect that the re-inserted board whose board ID has been read cannot be re-inserted. 4 on the display screen 4b (see FIG. 13(b)). When the re-insertion possibility determination unit 34 determines that re-insertion is possible, the re-insertion processing unit 33 displays on the reader 4 the re-insertion location (production equipment to be re-inserted) of the re-inserted board based on the extracted board information 20. It is displayed on the screen 4b (see FIG. 14(a)). That is, the re-insertion processing unit 33 notifies the re-insertion location of the re-inserted board (work) to which the board ID is attached based on the board ID (work identification information).

再投入処理部33は、抜取り基板情報20に含まれる再投入基板が抜取られた場所(生産装置)、抜取られた後にその再投入基板(ワーク)に実施された作業の情報、再装着が必要な部品の情報などに基づいて、再投入場所(生産装置)を決定する。また、再投入処理部33は、再投入可能な場所が複数存在する場合は、複数の再投入場所を通知する。なお、再投入処理部33は、リーダ4に再投入場所を表示させることに加えて、再投入場所である生産装置に再投入場所報知指令を送信し、その生産装置の表示部(例えば、第4コンベアM11の表示部12)や表示灯(図示省略)を点滅させてその生産装置が再投入場所であることを報知させてもよい。 The re-insertion processing unit 33 includes information on the location (production equipment) from which the re-inserted board was extracted, which is included in the extracted board information 20, information on the work performed on the re-inserted board (workpiece) after it was extracted, and information on the need for re-insertion. The re-input location (production equipment) is determined based on information about the parts. Furthermore, if there are multiple places where the product can be re-inserted, the re-insertion processing unit 33 notifies the plurality of re-insertion locations. In addition to displaying the re-input location on the reader 4, the re-input processing unit 33 transmits a re-input location notification command to the production equipment that is the re-input location, and displays the display unit of the production equipment (for example, the The display unit 12) of the fourth conveyor M11 or an indicator light (not shown) may be blinked to notify that the production equipment is at the re-input location.

再投入処理部33は、再投入場所を通知した後、リーダ4の読み取り部4aによって読み取られた装置ID(再投入場所情報)を受信すると、受信した装置IDが通知した再投入場所の装置IDと一致するか否かを判断する。装置IDが一致しない場合、再投入処理部33は、再投入場所が不適切である旨の警告をリーダ4の表示画面4bに表示させる(図14(b)参照)。装置IDが再投入場所のいずれかと一致する場合、再投入処理部33は、一致した再投入場所である生産装置に再投入準備指令を送信する。 After notifying the reloading location, the reloading processing unit 33 receives the device ID (reloading location information) read by the reading unit 4a of the reader 4, and then converts the received device ID to the device ID of the notified reloading location. Determine whether it matches or not. If the device IDs do not match, the re-insertion processing section 33 displays a warning to the effect that the re-insertion location is inappropriate on the display screen 4b of the reader 4 (see FIG. 14(b)). If the device ID matches any of the re-input locations, the re-input processing unit 33 transmits a re-input preparation command to the production device at the matched re-input location.

ここで、第4コンベアM11を例に、再投入準備指令を受信した生産装置が実行する再投入受け入れ処理について説明する。再投入準備指令を受信すると、第4コンベアM11は、上流側の装置(ここでは、搭載検査装置M10)に基板Bの搬出禁止指令を送信する。第4コンベアM11は、装置内の基板Bを下流側に搬出させて抜取り作業位置P2に再投入基板を受け入れ可能になると、開閉カバーロック部14をアンロック状態とする。こ
れにより再投入受け入れ処理が完了し、第4コンベアM11は、再投入準備指令を送信した再投入処理部33に再投入準備完了報告を送信する。
Here, using the fourth conveyor M11 as an example, the re-input acceptance process executed by the production device that has received the re-input preparation command will be described. Upon receiving the reinsertion preparation command, the fourth conveyor M11 transmits a command to prohibit the removal of the substrate B to the upstream device (here, the mounting inspection device M10). When the fourth conveyor M11 carries out the substrate B in the apparatus to the downstream side and becomes able to receive the reinserted substrate at the extraction work position P2, the fourth conveyor M11 unlocks the opening/closing cover lock part 14. This completes the reloading acceptance process, and the fourth conveyor M11 transmits a reloading preparation completion report to the reloading processing unit 33 that sent the reloading preparation command.

再投入準備完了報告を受信すると、再投入処理部33は、再投入の準備が完了した旨をリーダ4の読み取り部4aに表示させる(図15(a)参照)。なお、再投入処理部33は、再投入の準備が完了した旨を再投入場所の表示部に表示させてもよい。このように、再投入処理部33は、再投入場所(生産装置)に対して再投入基板(ワーク)の再投入を受け入れる準備を指示し、再投入の準備が完了したらその旨を通知する。また、再投入処理部33は、再投入場所において再投入場所から基板B(ワーク)が搬出され、再投入場所への基板Bの搬入を禁止する状態になったら再投入の準備が完了したものと判断する。 Upon receiving the re-insertion preparation completion report, the re-insertion processing section 33 causes the reading section 4a of the reader 4 to display that the re-insertion preparation is complete (see FIG. 15(a)). Note that the re-insertion processing section 33 may display on the display section of the re-insertion location that preparations for re-insertion have been completed. In this manner, the re-input processing unit 33 instructs the re-input location (production equipment) to prepare to accept the re-input of the re-input board (workpiece), and notifies the re-input processing unit 33 when the re-input preparation is completed. Further, the re-loading processing unit 33 determines that the preparation for re-loading is completed when the board B (work) is taken out from the re-loading location and the state prohibits the board B from being carried into the re-loading location. I judge that.

再投入場所である生産装置、例えば第4コンベアM11では、再投入の準備が完了した後に、作業者によって再投入場所の開閉カバー13が開けられ、その後、開閉カバー13が閉じられると、再投入後運転再開処理が実行される。再投入後運転再開処理では、まず、抜取り作業位置P2に再投入基板が有るか否かが判断される。抜取り作業位置P2に再投入基板が無い場合、再投入基板が抜取り作業位置P2に再投入されていない旨の警告が表示部12に表示される(図15(b)参照)。抜取り作業位置P2に基板Bが有る場合、第4コンベアM11は開閉カバーロック部14をロック状態にして、上流側の装置に基板Bの搬出開始指令を送信して運転が再開される。 In the production equipment that is the re-input location, for example, the fourth conveyor M11, after the preparation for re-input is completed, the operator opens the opening/closing cover 13 of the re-input location, and then, when the opening/closing cover 13 is closed, the re-input Post-operation restart processing is executed. In the operation restart processing after reinsertion, first, it is determined whether or not there is a reinsertion board at the extraction work position P2. If there is no re-inserted board at the extraction work position P2, a warning to the effect that no re-inserted board has been reinserted into the extraction work position P2 is displayed on the display unit 12 (see FIG. 15(b)). When the substrate B is present at the sampling operation position P2, the fourth conveyor M11 locks the opening/closing cover lock portion 14, transmits a command to start carrying out the substrate B to the upstream device, and restarts the operation.

このように、リーダ4は、要確認基板および再投入予定のワーク(再投入基板)に付されたワーク識別情報(基板ID)と生産ライン(部品実装ライン1)における再投入場所(生産装置)に付された再投入場所情報(装置ID)を取得する情報取得手段である。情報取得手段と抜取り処理部32は、生産ラインの途中から要確認基板(ワーク)を抜取る作業を支援する抜取り支援装置を構成する。また、再投入処理部33は、情報取得手段によるワーク識別情報と再投入場所情報の取得を条件に、再投入場所情報で特定された再投入場所からのワークの再投入を可能な状態にする。 In this way, the reader 4 checks the workpiece identification information (board ID) attached to the board requiring confirmation and the work scheduled to be re-injected (re-input board) and the re-input location (production equipment) on the production line (component mounting line 1). This is information acquisition means for acquiring re-insertion location information (device ID) attached to the device. The information acquisition means and the sampling processing unit 32 constitute a sampling support device that supports the work of extracting a board (workpiece) requiring confirmation from the middle of the production line. Further, the re-loading processing unit 33 makes it possible to re-load the work from the re-loading location specified by the re-loading location information, on the condition that the information acquisition means acquires the workpiece identification information and the re-loading location information. .

このように、情報取得手段であるリーダ4と第4コンベアM11は、生産ラインの途中から抜取ったワークを生産ラインに再投入する作業を支援する再投入支援装置を構成する。また、第4コンベアM11と同じ構成・機能を有する第2コンベアM5、第6コンベアM15とこれに付属するリーダ4も再投入支援装置を構成する。なお情報取得手段(リーダ4)は、再投入支援装置毎に設けてもよいが、複数の再投入支援装置で共用あるいは他の装置と共用とすることもできる。 In this way, the reader 4 and the fourth conveyor M11, which are information acquisition means, constitute a re-injection support device that supports the work of re-introducing a workpiece extracted from the middle of the production line into the production line. Further, the second conveyor M5 and the sixth conveyor M15, which have the same configuration and function as the fourth conveyor M11, and the reader 4 attached thereto also constitute a re-insertion support device. Note that the information acquisition means (reader 4) may be provided for each re-injection support device, but it can also be shared by a plurality of re-injection support devices or shared with other devices.

次に図5のフローに沿って、基板抜取り装置40(抜取り支援装置)における基板抜取り動作について説明する。基板抜取り動作において、基板抜取り装置40の搬送処理部31は、上流側から受け取った基板Bを抜取り作業位置P2まで搬送させる(ST2が到着となるまでST1を実行)。抜取り作業位置P2に到着した基板Bが検査装置での検査結果が不良である要確認基板の場合(ST3が要確認)、抜取り処理部32は基板抜取り処理(ST4)を実行する。 Next, the substrate extraction operation in the substrate extraction device 40 (extraction support device) will be explained along the flowchart of FIG. 5. In the substrate extracting operation, the transport processing unit 31 of the substrate extracting device 40 transports the substrate B received from the upstream side to the extracting work position P2 (ST1 is executed until ST2 is reached). If the board B that has arrived at the sampling work position P2 is a board that requires confirmation and has a defective inspection result in the inspection device (confirmation required in ST3), the sampling processing section 32 executes a substrate sampling process (ST4).

抜取り作業位置P2に到着した基板Bが検査装置での検査結果が良品で抜取りが不要な場合(ST3が不要)、搬送処理部31は基板Bを抜取り作業位置P2に停止させずに下流側に搬出させる。基板抜取り装置40から基板Bが搬出された後、実装基板の生産が終了していない場合は(ST5がNo)、(ST1)に戻って次の基板Bの搬送が実行される。 If the board B that has arrived at the sampling work position P2 is inspected by the inspection device as a good product and sampling is not necessary (ST3 is unnecessary), the transport processing unit 31 moves the board B to the downstream side without stopping at the sampling work position P2. Have it removed. After the board B is unloaded from the board extraction device 40, if the production of the mounted board is not completed (No in ST5), the process returns to (ST1) and transport of the next board B is executed.

次に図6~7のフローに沿って、図8~10を参照しながら、基板抜取り装置40における基板抜取り処理(ST4)の詳細について説明する。図6において、要確認基板が抜
取り作業位置P2に到達して基板搬送が停止すると(ST11)、抜取り処理部32は、要確認基板発生通知画面50(図8(a))を基板抜取り装置40の表示部、または、作業者が携帯するリーダ4の表示画面4b(以下、両方を含めて「表示装置」と称する。)に表示させる(ST12)。要確認基板発生通知画面50において「OK」ボタン50aが操作されると(ST13で応答有り)、抜取り処理部32は、基板抜取り装置40の安全装置を解除させる(ST14)。これによって、基板抜取り装置40の開閉カバー13が開閉可能となる。
Next, the details of the substrate extraction process (ST4) in the substrate extraction device 40 will be explained along the flowcharts of FIGS. 6 to 7 and with reference to FIGS. 8 to 10. In FIG. 6, when the board requiring confirmation reaches the sampling work position P2 and the board transport is stopped (ST11), the sampling processing unit 32 sends the board extraction notification screen 50 (FIG. 8(a)) to the board extraction device 40. (ST12). When the "OK" button 50a is operated on the confirmation board generation notification screen 50 (response is received in ST13), the extraction processing unit 32 releases the safety device of the board extraction device 40 (ST14). As a result, the opening/closing cover 13 of the board extraction device 40 can be opened and closed.

次いで抜取り処理部32は、基板ID読み取り要求画面51(図8(b))を表示装置に表示させる(ST15)。作業者が開閉カバー13を開けて要確認基板を取り出してリーダ4で基板IDを取得すると(ST16で基板ID取得)、情報処理装置3において抜取られた要確認基板に関する抜取り基板情報20が作成される(ST17)。 Next, the sampling processing unit 32 displays the board ID reading request screen 51 (FIG. 8(b)) on the display device (ST15). When the operator opens the opening/closing cover 13, takes out the board requiring confirmation, and obtains the board ID using the reader 4 (obtaining the board ID in ST16), the information processing device 3 creates the extracted board information 20 regarding the board requiring confirmation that has been extracted. (ST17).

図7において、次いで抜取り処理部32は、運転再開確認画面52(図9(a))を表示装置に表示させる(ST18)。運転再開確認画面52において「基板を戻す」ボタン52aが操作され(ST19で基板を戻す)、基板IDが取得されると(ST20で基板ID取得)、抜取り処理部32は、取得された基板IDに基づいて再投入可能な基板Bであるか否かを判断する(ST21)。 In FIG. 7, the sampling processing unit 32 then displays the operation restart confirmation screen 52 (FIG. 9(a)) on the display device (ST18). When the "return board" button 52a is operated on the operation restart confirmation screen 52 (return the board in ST19) and obtain the board ID (obtain the board ID in ST20), the sampling processing unit 32 returns the obtained board ID. Based on this, it is determined whether the board B can be reloaded (ST21).

取得された基板IDが抜取られた要確認基板と一致せずに再投入不可能と判断すると(ST21で不可能)、抜取り処理部32は、抜取り再投入不可警告画面53(図9(b))を表示装置に表示させる(ST22)。抜取り再投入不可警告画面53において「やり直す」ボタン53bが操作されると(ST23でやり直し)、(ST18)に戻って表示装置に運転再開確認画面52が表示される。 If the obtained board ID does not match the extracted board requiring confirmation and it is determined that re-insertion is not possible (impossible in ST21), the extraction processing unit 32 displays the extraction-re-insertion impossible warning screen 53 (FIG. 9(b)). ) is displayed on the display device (ST22). When the "try again" button 53b is operated on the extraction/re-insertion impossible warning screen 53 (redo in ST23), the process returns to (ST18) and the operation restart confirmation screen 52 is displayed on the display device.

取得された基板IDが抜取られた要確認基板と一致して再投入可能と判断され(ST21で可能)、または、抜取り再投入不可警告画面53において「続行」ボタン53aが操作され(ST23で続行可能)、次いで開閉カバー13が閉じされると(ST24でカバー閉)、抜取り処理部32は、抜取り作業位置P2に基板Bが有るか否かを判断する(ST25)。抜取り作業位置P2に基板Bが戻されていない場合(ST25で基板無し)、抜取り処理部32は、基板無し警告画面54(図10(a))を表示装置に表示させる(ST26)。基板無し警告画面54において「やり直す」ボタン54bが操作されると(ST27でやり直し)、(ST18)に戻って表示装置に運転再開確認画面52が表示される。 The obtained board ID matches the extracted board requiring confirmation and it is determined that re-insertion is possible (possible in ST21), or the "Continue" button 53a is operated on the removal-re-insertion impossible warning screen 53 (continue in ST23). (possible), then when the opening/closing cover 13 is closed (cover closed in ST24), the sampling processing unit 32 determines whether or not the substrate B is present at the sampling operation position P2 (ST25). If the substrate B has not been returned to the extraction work position P2 (no substrate in ST25), the extraction processing unit 32 causes the display device to display a no-substrate warning screen 54 (FIG. 10(a)) (ST26). When the "try again" button 54b is operated on the no-board warning screen 54 (redo in ST27), the process returns to (ST18) and the operation restart confirmation screen 52 is displayed on the display device.

図7において、運転再開確認画面52において「基板を戻さない」ボタン52bが操作され(ST19で基板を戻さない)、開閉カバー13が閉じされると(ST28でカバー閉)、抜取り処理部32は、抜取り作業位置P2に基板Bが有るか否かを判断する(ST29)。抜取り作業位置P2に無いはずの基板Bが有る場合(ST29で基板有り)、抜取り処理部32は、不明基板有り警告画面55(図10(b))を表示装置に表示させる(ST30)。抜取り作業位置P2から基板Bが取り除かれ、不明基板有り警告画面55において「再開」ボタン55aが操作されると、(ST18)に戻って表示装置に運転再開確認画面52が表示される。 In FIG. 7, when the "Do not return the board" button 52b is operated on the operation restart confirmation screen 52 (do not return the board in ST19) and the opening/closing cover 13 is closed (cover is closed in ST28), the extraction processing unit 32 , it is determined whether the board B is present at the sampling work position P2 (ST29). If there is a board B that should not be present at the sampling work position P2 (substrate present in ST29), the sampling processing unit 32 causes the display device to display an unknown substrate presence warning screen 55 (FIG. 10(b)) (ST30). When the board B is removed from the sampling work position P2 and the "resume" button 55a is operated on the unknown board warning screen 55, the process returns to (ST18) and the operation restart confirmation screen 52 is displayed on the display device.

基板を戻す場合(ST19で戻す)で抜取り作業位置P2に要確認基板が戻された場合(ST25で基板有り)、基板無し警告画面54において「続行」ボタン54aが操作された場合(ST27で続行)、基板を戻さない場合(ST19で戻さない)で抜取り作業位置P2に基板Bが無いことが確認された場合(ST29で基板無し)、情報処理装置3において基板ロケーション情報21が現在の基板抜取り装置40の状況に更新される(ST31)。これによって、部品実装ライン1(生産ライン)にある基板Bの情報が、基板
ロケーション情報21として適切に反映される。
When returning the board (returning in ST19), if a board requiring confirmation is returned to the extraction work position P2 (there is a board in ST25), or if the "Continue" button 54a is operated on the no-board warning screen 54 (continue in ST27). ), if the board is not returned (not returned in ST19) and it is confirmed that there is no board B at the extraction work position P2 (there is no board in ST29), the board location information 21 in the information processing device 3 is set to the current board extraction position. The status of the device 40 is updated (ST31). As a result, the information on the board B on the component mounting line 1 (production line) is appropriately reflected as the board location information 21.

次いで抜取り処理部32は、基板抜取り装置40の安全装置を有効化させる(ST32)。これによって、基板抜取り装置40の開閉カバー13が開閉できないようにロックされる。次いで搬送処理部31による基板搬送処理が再開され(ST33)、基板抜取り処理(ST4)が終了する。 Next, the extraction processing unit 32 activates the safety device of the board extraction device 40 (ST32). As a result, the opening/closing cover 13 of the board extraction device 40 is locked so that it cannot be opened or closed. Next, the substrate transport process by the transport processing section 31 is restarted (ST33), and the substrate extraction process (ST4) is completed.

次に図11~12のフローに沿って、図13~15を参照しながら、再投入支援装置による基板再投入処理について説明する。図11において、まず再投入支援装置の再投入処理部33は、再投入基板の基板ID読み取り要求画面56(図13(a))を表示装置に表示させる(ST41)。再投入基板の基板ID読み取り要求画面56において「キャンセル」ボタン56aが操作されると、基板再投入処理が中止される。 Next, the substrate reloading process by the reloading support device will be described along the flowcharts of FIGS. 11 to 12 and with reference to FIGS. 13 to 15. In FIG. 11, first, the reloading processing unit 33 of the reloading support device causes the display device to display the board ID reading request screen 56 (FIG. 13(a)) of the reloaded board (ST41). When the "Cancel" button 56a is operated on the board ID reading request screen 56 for the re-loaded board, the board re-load process is canceled.

再投入基板の基板ID読み取り要求画面56において「OK」ボタン56bが操作され、リーダ4によって再投入しようとしている再投入基板の基板IDが取得される(ST42で基板ID取得)、再投入可否判断部34は、抜取り基板情報20と取得された基板IDに基づいて、再投入基板が生産ライン(部品実装ライン1)に再投入可能か否かを判断する(ST43)。再投入基板が再投入不可能と判断されると(ST43で不可能)、再投入処理部33は、再投入不可警告画面57(図13(b))を表示装置に表示させる(ST44)。再投入不可警告画面57において「閉じる」ボタン57aが操作されると、(ST41)に戻って表示装置に再投入基板の基板ID読み取り要求画面56が表示される。 The "OK" button 56b is operated on the board ID reading request screen 56 for the re-loaded board, and the reader 4 acquires the board ID of the re-loaded board (obtains the board ID in ST42), and determines whether or not the re-load is possible. The unit 34 determines whether the re-input board can be re-introduced to the production line (component mounting line 1) based on the extracted board information 20 and the acquired board ID (ST43). When it is determined that the re-insertion board cannot be re-inserted (impossible in ST43), the re-insertion processing unit 33 causes the display device to display a re-insertion impossible warning screen 57 (FIG. 13(b)) (ST44). When the "close" button 57a is operated on the re-insertion impossible warning screen 57, the process returns to (ST41) and the board ID reading request screen 56 for the re-inserted board is displayed on the display device.

図11において、再投入基板が再投入可能と判断されると(ST43で可能)、再投入処理部33は、再投入場所(装置)の選択要求画面58(図14(a))を表示装置に表示させる(ST45)。再投入場所(装置)の選択要求画面58には、再投入可能位置として「コンベア#2」(第2コンベアM5)、「検査装置#1」(印刷検査装置M4)が表示されている。例えば、搭載検査装置M10で部品欠落による不良と判定されて生産ラインから抜取られ、欠落した部品を手作業で搭載せずに部品搭載装置M6~M8で搭載すると判断された基板Bを生産ラインに戻す場合は、部品搭載装置M6~M8より上流側の生産装置(第2コンベアM5、印刷検査装置M4)が再投入可能位置として設定される。 In FIG. 11, when it is determined that the re-insertion board can be re-inserted (possible in ST43), the re-insertion processing unit 33 displays the re-insertion location (device) selection request screen 58 (FIG. 14(a)) on the display device. (ST45). On the re-insertion location (apparatus) selection request screen 58, "conveyor #2" (second conveyor M5) and "inspection device #1" (print inspection device M4) are displayed as possible re-insertion locations. For example, a board B that is determined to be defective due to missing parts by the mounting inspection device M10 and removed from the production line, and which is determined to be mounted by the component mounting devices M6 to M8 without manually mounting the missing components, is placed on the production line. When returning, the production equipment (second conveyor M5, print inspection device M4) upstream from the component mounting devices M6 to M8 is set as a position where it can be reloaded.

リーダ4によって再投入しようとしている生産装置の装置IDが取得されると(ST46で装置ID取得)、再投入処理部33は、取得された装置IDで特定された再投入場所が適切か否かを判断する(ST47)。装置IDが取得された生産装置が不適切な場合(ST47で不適切)、再投入処理部33は、不適切警告画面59(図14(b))を表示装置に表示させ(ST48)、(ST46)に戻って装置IDが取得されるまで待機する。 When the reader 4 acquires the device ID of the production device to be re-injected (device ID acquired in ST46), the re-input processing unit 33 determines whether the re-input location specified by the acquired device ID is appropriate. is determined (ST47). If the production device for which the device ID has been acquired is inappropriate (inappropriate in ST47), the re-input processing unit 33 causes the display device to display the inappropriateness warning screen 59 (FIG. 14(b)) (ST48). The process returns to ST46) and waits until the device ID is obtained.

不適切警告画面59には、再投入可能位置として「コンベア#3」(第3コンベアM9)、「検査装置#2」(搭載検査装置M10)が表示されている。例えば、搭載検査装置M10で部品欠落による不良と判定されて生産ラインから抜取られ、欠落した部品を手作業で搭載した基板を生産ラインに戻す場合で、再投入後にその基板Bの搭載検査を実行する場合は、搭載検査装置M10、または搭載検査装置M10より上流側の生産装置(第3コンベアM9)が再投入可能位置として設定される。 The inappropriateness warning screen 59 displays "conveyor #3" (third conveyor M9) and "inspection device #2" (mounted inspection device M10) as possible re-input positions. For example, when a board that is determined to be defective due to missing parts by the mounting inspection device M10 and removed from the production line is returned to the production line with the missing parts manually mounted, a mounting inspection is performed on that board B after reintroducing it. In this case, the mounting inspection device M10 or the production device (third conveyor M9) upstream of the mounting inspection device M10 is set as the re-loading possible position.

図11、図12において、装置IDが取得された生産装置が適切と判断されると(ST47で適切)、再投入処理部33は、選択された再投入場所(生産装置)にその旨を報知させる(ST49)。例えば、選択された生産装置は、表示部にその旨を表示させて点滅させたり、表示灯を点灯させたりして報知する。次いで選択された生産装置において、再
投入受け入れ処理が実行される(ST50)。具体的には、再投入場所から基板Bが排出され、再投入場所への基板Bの搬入が禁止され、安全装置が解除されて開閉カバーが開閉可能な状態にされる。
In FIGS. 11 and 12, when the production equipment whose equipment ID has been acquired is determined to be appropriate (appropriate in ST47), the re-input processing unit 33 notifies the selected re-input location (production equipment) to that effect. (ST49). For example, the selected production device is notified by displaying and blinking the selected production device on the display unit or by lighting an indicator light. Next, a re-input acceptance process is executed in the selected production equipment (ST50). Specifically, the board B is ejected from the re-loading location, the board B is prohibited from being carried into the re-loading location, the safety device is released, and the opening/closing cover is made openable and closable.

図12において、再投入場所の再投入受け入れ処理が完了すると、再投入処理部33は、基板投入許可通知画面60(図15(a))を表示装置に表示させる(ST51)。作業者が再投入場所の開閉カバーを開け、再投入基板を搬送コンベアに載置(再投入)し、開閉カバーを閉じると(ST52でカバー閉)、再投入場所(装置)に再投入基板が有るか否かが判断される(ST53)。再投入場所に再投入基板が無い場合(ST53で無し)、再投入処理部33は、基板再投入要求画面61(図15(b))を表示装置に表示させ(ST54)、(ST52)に戻って再投入場所に再投入基板が再投入されるまで待機する。 In FIG. 12, when the re-insertion acceptance process at the re-insertion location is completed, the re-insertion processing unit 33 causes the display device to display the board insertion permission notification screen 60 (FIG. 15(a)) (ST51). When the operator opens the reloading area cover, places the reloaded board on the conveyor (reloads it), and closes the reloaded cover (close cover in ST52), the reloaded board is placed in the reloaded area (equipment). It is determined whether or not there is one (ST53). If there is no reloading board at the reloading location (NO in ST53), the reloading processing section 33 displays the board reloading request screen 61 (FIG. 15(b)) on the display device (ST54), and then (ST52). Return to the re-insertion location and wait until the re-inserted board is reinserted.

再投入場所(装置)に再投入基板が有ると(ST53で有り)、情報処理装置3において基板ロケーション情報21が現在の状況に更新される(ST55)。次いで再投入処理部33は、再投入場所の安全装置を有効化させる(ST56)。これによって、再投入場所の開閉カバーが開閉できないようにロックされる。次いで再投入場所(生産装置)の運転が再開され(ST57)、基板再投入処理が終了する。このように、生産ライン(部品実装ライン1)の途中から抜取ったワーク(基板B)を適切に生産ラインに再投入できるように支援することができる。 If there is a re-input board at the re-input location (apparatus) (YES in ST53), the board location information 21 in the information processing device 3 is updated to the current status (ST55). Next, the re-injection processing section 33 activates the safety device at the re-injection location (ST56). As a result, the opening/closing cover at the reloading location is locked so that it cannot be opened or closed. Next, the operation of the re-inserting place (production equipment) is restarted (ST57), and the substrate re-inserting process is completed. In this way, it is possible to support the workpiece (board B) extracted from the middle of the production line (component mounting line 1) so that it can be properly reintroduced into the production line.

上記説明したように、本実施の形態の再投入支援装置は、再投入予定のワーク(基板B)のワーク識別情報(基板ID)と生産ライン(部品実装ライン1)における再投入場所(生産装置)を特定可能な再投入場所情報(装置ID)を取得する情報取得手段(リーダ4)と、情報取得手段によるワーク識別情報と再投入場所情報の取得を条件に、再投入場所情報で特定された再投入場所からのワークの再投入を可能な状態にする再投入処理部33と、を備えている。これによって、生産ラインの途中から抜取ったワークを適切に生産ラインに再投入できるように支援することができる。 As explained above, the re-input support device of this embodiment uses the work identification information (board ID) of the work to be re-injected (board B) and the re-input location (production equipment ) is specified by the re-insertion location information, on the condition that the information acquisition means (reader 4) acquires the re-insertion location information (equipment ID) that can identify the and a re-input processing section 33 that makes it possible to re-inject the workpiece from the re-input location. As a result, it is possible to support workpieces taken out from the middle of the production line to be properly reintroduced to the production line.

なお、本実施の形態では、第2コンベアM5、第4コンベアM11、第6コンベアM15を再投入支援装置として機能させたが、第1コンベアM2、印刷装置M3、印刷検査装置M4、第2コンベアM5、部品搭載装置M6~M8、第3コンベアM9の全部もしくは一部に、再投入処理部33、再投入可否判断部34と同じ機能を持たせ、これらを再投入支援装置として機能させてもよい。 In addition, in this embodiment, the second conveyor M5, the fourth conveyor M11, and the sixth conveyor M15 functioned as a re-feed support device, but the first conveyor M2, the printing device M3, the print inspection device M4, and the second conveyor M5, component mounting devices M6 to M8, and third conveyor M9 may all or partially have the same functions as the reloading processing section 33 and the reloading possibility determining section 34, and may function as a reloading support device. good.

本発明の再投入支援装置は、生産ラインの途中から抜取ったワークを適切に生産ラインに再投入できるように支援することができるという効果を有し、部品を基板に実装する分野において有用である。 The re-injection support device of the present invention has the effect of being able to assist in appropriately re-introducing a workpiece taken out from the middle of a production line into the production line, and is useful in the field of mounting parts on a board. be.

1 部品実装ライン(生産ライン)
4 リーダ(情報取得手段)
B 基板(ワーク)
M2 第1コンベア(再投入場所)
M3 印刷装置(再投入場所)
M4 印刷検査装置(再投入場所)
M5 第2コンベア(再投入場所)
M6~M8 部品搭載装置(再投入場所)
M9 第3コンベア(再投入場所)
M10 搭載検査装置(再投入場所)
M11 第4コンベア(再投入場所)
M13 第5コンベア(再投入場所)
M14 リフロー後検査装置(再投入場所)
M15 第6コンベア(再投入場所)
1 Component mounting line (production line)
4 Reader (information acquisition means)
B Substrate (work)
M2 1st conveyor (re-loading location)
M3 Printing device (reloading location)
M4 Printing inspection device (re-loading location)
M5 2nd conveyor (re-loading location)
M6 to M8 parts loading device (reloading location)
M9 3rd conveyor (re-loading location)
M10 onboard inspection device (re-loading location)
M11 4th conveyor (re-loading location)
M13 5th conveyor (re-loading location)
M14 Post-reflow inspection device (re-loading location)
M15 6th conveyor (re-loading location)

Claims (8)

生産ラインの途中から抜取ったワークを生産ラインに再投入する作業を支援する再投入支援装置であって、
再投入予定のワークのワーク識別情報と前記生産ラインにおける再投入場所を特定可能な再投入場所情報を取得する情報取得手段と、
前記情報取得手段による前記ワーク識別情報と前記再投入場所情報の取得を条件に、前記再投入場所情報で特定された再投入場所からのワークの再投入を可能な状態にする再投入処理部と、を備え、
前記再投入場所には、開閉カバーが設けられており、
前記再投入処理部は、前記開閉カバーをアンロック状態とすることで、前記再投入場所からの前記ワークの再投入を可能な状態とし、
前記再投入処理部は、ワーク識別情報よりそのワーク識別情報で特定されたワークが生産ラインに再投入可能かどうかを判断する再投入可否判断部を有し、
前記再投入可否判断部は、前記再投入予定のワークに生産ラインに現在適用されている生産プログラムが適合するかどうかで判断する、再投入支援装置。
A re-injection support device that supports the work of re-introducing a workpiece extracted from the middle of a production line into the production line,
information acquisition means for acquiring workpiece identification information of a work scheduled to be re-introduced and re-input location information that can identify a re-input location on the production line;
a re-loading processing unit that enables the workpiece to be re-loaded from a re-loading location specified by the re-loading location information on the condition that the information acquisition means acquires the workpiece identification information and the re-loading location information; , comprising:
The re-insertion location is provided with an opening/closing cover,
The re-insertion processing unit makes it possible to re-inject the workpiece from the re-insertion location by unlocking the opening/closing cover,
The re-input processing unit includes a re-input permission determination unit that determines from work identification information whether the workpiece identified by the workpiece identification information can be re-introduced to the production line;
The re-input support device is a re-input support device that determines whether or not a production program currently applied to the production line is suitable for the work scheduled to be re-introduced .
前記再投入可否判断部は、生産ラインから抜取られてからの経過時間または返却期限を超過しているかどうかで判断する、請求項記載の再投入支援装置。 2. The re-insertion support device according to claim 1 , wherein the re-insertion permission determination unit makes the judgment based on the elapsed time since the product was removed from the production line or whether a return deadline has been exceeded. 前記再投入可否判断部は、少なくとも抜取られた時刻、場所、生産ラインで実施された作業の情報のいずれかを含む抜取りワーク情報に基づいて判断する、請求項1または2に記載の再投入支援装置。 The re-input support according to claim 1 or 2 , wherein the re-input possibility determining unit makes the determination based on sampled work information including at least one of the time and place of sampling, and information on work performed on the production line. Device. 前記再投入処理部は、ワーク識別情報よりそのワーク識別情報のワークの再投入場所を通知する、請求項1記載の再投入支援装置。 2. The re-loading support device according to claim 1, wherein the re-loading processing unit notifies the re-loading location of the work corresponding to the work identification information based on the work identification information. 前記再投入処理部は、再投入可能な場所が複数存在する場合は複数の再投入場所を通知する、請求項記載の再投入支援装置。 5. The re-loading support device according to claim 4 , wherein the re-loading processing unit notifies the plurality of re-loading locations when there are multiple re-loading locations. 前記再投入処理部は、少なくとも抜取られた場所、抜取られた後にそのワークに実施された作業の情報、再装着が必要な部品の情報のいずれかを含む抜取りワーク情報に基づいてワークの再投入場所を通知する、請求項または記載の再投入支援装置。 The reinsertion processing unit reloads the workpiece based on sampled work information including at least one of the location where the workpiece was extracted, information on work performed on the workpiece after the workpiece was extracted, and information on parts that need to be reinstalled. The re-injection support device according to claim 4 or 5 , which notifies the location. 前記再投入処理部は、前記再投入場所に対してワークの再投入を受け入れる準備を指示し、再投入の準備が完了したらその旨を通知させる、請求項1記載の再投入支援装置。 2. The re-loading support device according to claim 1, wherein the re-loading processing section instructs the re-loading location to prepare to accept the re-loading of the workpiece, and notifies the re-loading location when the preparation for re-loading is completed. 前記再投入処理部は、少なくとも前記再投入場所からワークが搬出され、前記再投入場所へのワークの搬入を禁止する状態になったら再投入の準備が完了したものと判断する、請求項記載の再投入支援装置。 8. The re-loading processing section determines that preparations for re-loading are complete when at least the workpiece is taken out from the re-loading location and the workpiece is prohibited from being carried into the re-loading location . Re-injection support device.
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