JP4026636B2 - Component mounting state inspection method and component mounting inspection apparatus using the method - Google Patents

Description

  The present invention relates to a method and apparatus for inspecting whether a mounting state of each component is correct by using a printed circuit board (hereinafter referred to as “component mounting substrate” or simply “substrate”) mounted with a plurality of components as an inspection target. About.

  Conventionally, a component mounter called a “mounter” has been used to automate the component mounting process. In the control unit of the mounter, data (generally referred to as “mount data”) indicating which component is mounted in which position on which position and in what direction is registered in advance. Also, a plurality of component supply devices called “feeders” are installed in the vicinity of the main body of the mounter. The control unit controls the component mounting head unit based on the mount data, takes out the component from the feeder corresponding to each mounting position, and then installs the component at the corresponding mounting position.

  According to the mounter described above, the component mounting operation can be automatically completed in a short time even when a substrate on which components are mounted at a high density is manufactured. However, the process of replenishing each feeder with a component or replacing a component in the feeder in accordance with a change in a board to be manufactured (generally referred to as “setup change”) is performed manually. For this reason, if the clerk supplies an incorrect part to the feeder, the correct part cannot be supplied to subsequent boards. In addition, if there is an error in the orientation of the component when set in the feeder, the subsequent board cannot be mounted with the component directed in the correct direction.

  In view of such circumstances, every time a component is replenished or replaced, the component mounting board is prototyped to check whether each component is mounted as designed.

  The check using the prototype is performed by a method in which a staff member checks each component on the prototype board one by one with the design drawing. Since minimal components are mounted on a substrate in recent years at a high density, the above-described check operation requires patience and takes time. In addition, since this work must be performed every time parts are replenished or set up, there is a problem that the period during which the assembly work by the mounter is interrupted becomes long and the efficiency is low.

  Also, in the conventional field, when a defective substrate is generated in the mounting process after the check, the prototype substrate is stored for the purpose of confirming whether or not the check operation has been performed with sufficient care. However, in such a method, all the prototyped substrates must be stored, and the substrates that can be shipped are wasted. Further, there arises a problem that a space for storing the substrate must be secured.

The present invention has been made paying attention to the above-described problems, and an object thereof is to efficiently perform an operation for determining whether or not a component mounted state on a board is appropriate.
A second object of the present invention is to prevent the waste of resources in the substrate manufacturing process by eliminating the need to store the substrate used for the above-described suitability determination.

The component mounting state inspection method according to the present invention includes, for each component on the board to be inspected, an inspection data storage unit in which at least a mounting position, a mounting direction, and component identification information are registered as inspection data, A sample image storage unit in which sample images of each part are registered, an image input unit that inputs an image of a substrate to be inspected, an operation unit and a display unit, and an inspection target image input from the image input unit The parts on the inspection target image are extracted by collating with the image, and the position and direction of the extracted parts are collated with the inspection data registered in the inspection data storage unit, thereby A visual inspection for a specific board is performed using a component mounting inspection apparatus including a control processing unit that automatically inspects the mounting state.
Of the inspection data, the mounting position and mounting direction can be created using board design data such as CAD data. Alternatively, the design data itself can be used. In addition, the part product number, the name of the part type, and the like can be registered as the part identification information .

The component mounting inspection apparatus normally extracts a component on the inspection target image by comparing the inspection target image input from the image input unit with a sample image, and determines the position and direction of the extracted component as inspection data. Is set to automatically inspect the mounting state of each component on the board. However, when it becomes necessary to inspect whether there is a mistake in the components or the direction of the components due to component replenishment or changeover of the mounter, a visual inspection is performed by the following processing.

In this visual inspection, in the control processing unit, an image obtained by imaging the specific substrate is input from the image input unit and displayed on the display unit, and one component in the image is stored in the inspection data storage unit. Step A for reading the registered inspection data and the sample image registered in the sample image storage unit ; displayed on the display unit based on the mounting position in the inspection data read from the inspection data storage unit in step A step B is subjected to focus display on substrate inspection target part in the image; inspection data and sample image read out in the step a, both the check column for determining mounting conditions, displayed on the same screen as the image display of the board Then , each step of Step C; for receiving an operation from the operation unit for the check field is repeatedly executed.

In the mounting status determination check column, a sample image in the same screen as the first check column for inputting the result of the suitability determination of each information included in the inspection data for the component being displayed of interest is displayed. And a second check field for inputting the direction of the component determined as a reference.

In the control processing unit of the component mounting inspection apparatus, for each component on the board, the suitability of the mounting state is recognized based on the input to the first check column, and the recognition result is displayed in a list on the display unit, and An image for confirming whether or not the direction of the input component matches the correct mounting direction is generated for the component input to the second check field and displayed on the display unit.

For example, if a map image of a board in which good judgment parts and bad judgment parts are plotted in different colors is created and displayed on the display unit , which part on the board is faulty mounted. It can be easily grasped.

Since the image of the board can be obtained by dividing it into a plurality of areas or displayed in an enlarged manner, even if it is a minute part, the color and shape of the part can be confirmed. According to the above inspection method, while inspecting the registered inspection data and sample images of each component in order on the same screen as the image display of the board , the attention display is performed on the component to be inspected, and this attention displayed component is displayed. Since the result of suitability determination for each piece of information in the inspection data displayed at the same time is input, it is possible to easily check for component misplacement, misalignment, mounting direction error, and the like .

Furthermore, in the above inspection method, in addition to determining whether or not the component is mounted, the direction of the component determined based on the sample image is input, and whether or not the input component direction matches the correct mounting direction. Since the image for confirmation is displayed, even if the checker did not correctly recognize the direction of the part and the mounting direction could not be determined correctly, the check error was detected on the result display screen after inspection. It becomes possible to do.

  Note that the following Patent Document 1 describes that, for a part determined to be defective on the board, the result of the inspection is displayed together with an image of the actual part and a layout diagram showing the position of the part on the board. ing.

Japanese Patent No. 3273401

  However, the display screen described in Patent Document 1 is displayed as reference information for correcting a defective part, and is executed for a part for which a defect determination has been made in advance. On the other hand, in the present invention, by repeatedly executing Steps A, B, and C for a board whose quality is not clear, the suitability of the mounting state of each component is sequentially determined efficiently. The problem to be solved is different from Patent Document 1. Also, even in Patent Document 1, a command menu is displayed on the same screen as the image display of the board so as to receive an input. This menu is for deleting or correcting an already set defective code. Thus, unlike the present invention, the determination result is not input by the check method.

Such component mounting inspection apparatus in the present invention, per each part of the substrate to be inspected, at least the mounting position, respectively, the mounting direction, and the inspection identification information of the part is registered as an inspection data data storage unit, each A sample image storage unit in which sample images of parts are registered, an image input unit for inputting an image of a substrate to be inspected, an operation unit and a display unit, and an inspection target image input from the image input unit are the sample images. The parts on the inspection image are extracted by collating with each other, and the position and direction of the extracted parts are collated with the inspection data registered in the inspection data storage unit, thereby mounting each part on the substrate. And a control processing unit for automatically inspecting the state . The control processing unit is set to be able to switch from the automatic inspection mode to the visual inspection mode, and when switched to the visual inspection mode, displays the inspection target image input from the image input unit on the display unit , Steps A, B, and C described above are repeatedly executed.

The check column for mounting state determination uses the sample image on the same screen as the first check column for inputting the result of the suitability determination of each information included in the inspection data for the component currently being displayed. And a second check field for inputting the determined direction of the part.

The control processing unit recognizes the suitability of the mounting state for each component on the board based on the input from the first check column, and based on the recognition result, the map of the board marking the suitability of the mounting state of each component An image is created and displayed on the display unit, and whether or not the input direction matches the correct mounting direction at a position corresponding to the component input in the second check field in the map image. Display control means for performing a display for confirmation is included.

In a further preferred aspect of the component mounting inspection apparatus, the control processing unit creates inspection result information that associates the date and time when the visual inspection mode is executed with the screen displayed on the display unit by the display control unit. The image forming apparatus further includes a creating unit and a storage unit that accumulates the inspection result information.

According to the above aspect, each time the inspection in the visual inspection mode is executed, the date and time of the inspection and the inspection result information are accumulated. Therefore, it is not necessary to store the board used for the inspection for quality control, and it is possible to prevent the board having a good mounting state from being wasted.

According to the present invention, in a component mounting inspection apparatus that normally performs automatic inspection, when it is necessary to visually check the mounting state of each component on the board, such as after component replenishment to the mounter or after setup change, The inspection data and sample image registered for this part are displayed together with the actual part image, and the check result displayed on the same screen is used to determine the appropriateness of the inspection target part for each piece of information in the inspection data. Since the input is performed, it is possible to efficiently and accurately determine the mounting state of each component. Furthermore, regarding the mounting direction of the component, in addition to determining suitability, the direction of the component determined based on the sample image is input, and the direction of the input component is confirmed to confirm whether or not the correct mounting direction is met. Even if the mounting direction cannot be determined correctly because the checker did not correctly recognize the direction of the component, it is possible to detect the check error on the result display screen after inspection. Become.
Thus, according to the present invention, it is possible to reduce the burden on the worker for the check work and improve the accuracy of the check.

Furthermore, in this invention, every time the visual inspection mode is executed , inspection result information is created by associating the date and time of the execution with the display screen displayed on the display unit, and this is accumulated , so that the inspection is performed. Even if the used substrate is not stored, past inspection results can be confirmed. Therefore, even if the substrate is used in the visual inspection mode, it can be shipped as long as the substrate is determined to be good, and resources can be avoided from being wasted.

FIG. 1 shows the configuration of a substrate inspection apparatus according to an embodiment of the present invention.
This board inspection apparatus has a function of processing an image obtained by imaging the board 1 to be inspected and automatically discriminating the mounting state of components on the board and the suitability of soldering. 3, the light projecting unit 4, the control processing unit 5, the X-axis table unit 6, the Y-axis table unit 7, and the like.

  The Y-axis table unit 7 includes a conveyor 7A that supports the substrate 1, and the conveyor 7A is moved by a motor (not shown) to move the substrate 1 in the Y-axis direction (a direction orthogonal to the drawing sheet). To move. The X-axis table unit 6 supports the imaging unit 3 and the light projecting unit 4 above the Y-axis table unit 7 and moves them in the X-axis direction (left-right direction in the figure).

  The light projecting unit 4 is composed of three annular light sources 8, 9, and 10 having different diameters. These light sources 8, 9, and 10 emit red (R), green (G), and blue (B) color lights, respectively, and the substrate is aligned with the center directly above the observation position. As viewed from 1, they are arranged so as to be located in directions corresponding to different elevation angles.

  The imaging unit 3 includes a CCD camera for generating a color image, and is positioned so that its optical axis corresponds to the center of each light source 8, 9, and 10 and is along the vertical direction. As a result, reflected light from the substrate 1 to be observed enters the imaging unit 3, is converted into color signals R, G, and B of the three primary colors and is input to the control processing unit 5.

  The control processing unit 5 includes a computer including a CPU as a control unit 11, an image input unit 12, a memory 13, an imaging controller 14, an image processing unit 15, an illumination control unit 16, an XY table controller 17, an inspection unit 18, and inspection data storage. The unit 19 includes a CAD data storage unit 20, an input unit 21, a CRT display unit 22, a printer 23, a transmission / reception unit 24, an external memory device 25, and the like.

  The image input unit 12 includes an amplifier circuit that amplifies R, G, and B image signals from the imaging unit 3 and an A / D conversion circuit that converts these image signals into digital signals. The memory 13 stores digital gray image data for each color, binary image data obtained by processing these gray images, hue data, and the like. The memory 13 also stores inspection data read from the inspection data storage unit 19 to be described later, inspection result information, and the like.

  The imaging controller 14 includes an interface for connecting the imaging unit 3 to the control unit 11. The imaging controller 14 drives the imaging unit 3 based on a command from the control unit 11 and adjusts the output level of each color light. Control. The illumination control unit 16 is for adjusting the light quantity of each light source of the light projecting unit 4. In this embodiment, the light amounts of the light sources 8, 9, and 10 are adjusted so that white illumination is performed by mixing red, green, and blue color lights.

  The XY table controller 17 includes an interface for connecting the X-axis table unit 6 and the Y-axis table unit 7 to the control unit 11, and based on commands from the control unit 11, the X-axis table unit 6 and the Y-axis table unit 7. Controls the movement movement.

  The inspection data storage unit 19 is a storage unit for storing substrate inspection data. The inspection data is filed for each board, and the inspection data for each component on the board is stored in the file. The inspection data for each part also includes a plurality of types of data. In this embodiment, for each component, component mounting information including information on a component part number, a component name, a mounting position, and a mounting direction is set. In addition to the component mounting information, the inspection data includes link information for calling a sample image of the component, setting data for the inspection region, the type of program executed in the inspection region, and parameters according to the image processing to be executed (for example, Threshold value for binarization processing, filter for edge extraction, etc.), determination reference value for determining the suitability of the extracted feature quantity, and the like.

  When the substrate is imaged by dividing it into a plurality of imaging target regions, setting data (such as the coordinates of the XY table units 6 and 7) necessary for matching the field of view of the imaging unit 3 with each imaging target region is inspected. Stored in a data file.

  Further, in the inspection data storage unit 19, in addition to inspection data files for various substrates, a component library in which standard inspection data for each component is registered is registered. The sample image is stored in the parts library. Of the inspection data, component mounting information is extracted from CAD data in principle, but other inspection data is extracted from a component library or taught by a staff member using an image of a non-defective board.

  The CAD data storage unit 20 is a storage unit for storing CAD data of various substrates. The CAD data registered here can be used not only to create the inspection data, but also to carry out visual component mounting inspections to be described later.

  After receiving the input of the board name of the board 1 to be inspected, the control unit 11 reads the inspection data file corresponding to the board 1 to be inspected from the inspection data storage unit 19 and sets it in the memory 13. The image processing unit 15 and the inspection unit 18 execute processing based on the inspection data in the read file.

  At the time of inspection, the image processing unit 15 processes a color image with each gradation of R, G, and B stored in the memory 13 and extracts a characteristic portion of the region to be inspected. Further, the image processing unit 15 calculates a feature amount such as a gravity center position and an area for the feature portion. The inspection unit 18 determines the suitability of the part to be inspected by comparing the calculated feature amount with the corresponding inspection data.

  The control unit 11 determines whether or not the substrate to be inspected 1T is a non-defective product by integrating the results of various determination processes in the inspection unit 18. The final determination result is output to the CRT display unit 22, the printer 23, or the transmission / reception unit 24.

The input unit 21 is used to input various conditions for inspection, inspection information, and the like, and includes a keyboard and a mouse. The input unit 21 is also used for the purpose of inputting a determination result in a visual inspection to be described later.
The CRT display unit 22 (hereinafter simply referred to as “display unit 22”) receives supply of image data, inspection results, and the like from the control unit 11 and displays them on the display screen. The printer 23 also receives inspection results and the like from the control unit 11 and prints them out in a predetermined format.

  The transmission / reception unit 24 is for exchanging data with other devices. For example, for the substrate 1T to be inspected determined to be defective, the transmission / reception unit 24 transmits the identification information and the content of the defect to the subsequent correction device. Thus, the defective portion can be promptly corrected. The external memory device 25 is a device for reading / writing data from / to a storage medium such as a flexible disk, a CD-R, or a magneto-optical disk, and stores the inspection results and externally stores programs and setting data necessary for the inspection. Used to capture from.

  In the above configuration, the image processing unit 15 and the inspection unit 18 are configured by a dedicated processor in which a program for executing the above-described processes is incorporated. However, a dedicated processor is not necessarily provided, and the functions of the image processing unit 15 and the inspection unit 18 may be provided to the control unit 11. The inspection data storage unit 19 and the CAD data storage unit 20 can be set in a nonvolatile memory device such as a hard disk. Further, the storage units 19 and 20 can be set in the same memory device.

In the board inspection apparatus having the above configuration, when inspecting the mounting state of the parts on the board that has undergone the component mounting process by the mounter, the inspection target image is collated with the sample image, and the parts on the inspection target image are detected. Extraction is performed, and the position and direction of the extracted component are collated with the component mounting information. If no part is extracted by the collation process using the sample image, it is determined that the part is missing.
Further, when the soldered substrate is inspected with the soldered substrate as an inspection target, the specular reflection light from the soldering portion of the substrate is captured using the arrangement of the light source of the light projecting unit 4. An image is created, and a process of collating the color distribution pattern in each inspection area with the model data in the inspection data is executed.

  As described above, the board inspection apparatus of this embodiment can automatically inspect the mounting state and soldering state of components using the inspection data registered in the inspection data storage unit 19. In addition to this, the board inspection apparatus of this embodiment is also used for the purpose of visually inspecting whether or not a component is correctly mounted on a specific board as an inspection target.

  The visual inspection described above is mainly performed using a substrate that is first created after the setup change when the setup change of the mounter is performed. In this inspection, an image of an actual component is displayed together with component mounting information and a sample image, and an input of a result of determining the mounting state of the component on the display screen is accepted. When this input is completed, the inspection result data is edited using the input data for each component and displayed on the display unit 22 or stored in the memory 13.

  As described above, since the board inspection apparatus of this embodiment has a function for automatically inspecting the mounting state of components, inspection after component replenishment and setup change is also performed using this automatic inspection function. Should be possible. Nevertheless, the visual inspection is performed prior to full-scale operation of the mounter, and therefore it is desirable to carefully check whether there is any mistake in the components. In recent boards, micro components are mounted with high density. However, it is difficult to print the part number on a package as in the past, so the component type is determined based on the color and shape of the components. It is necessary to judge. In order to prevent misidentification of parts with similar colors and shapes in automatic inspection, it is necessary to complicate the conditions and inspection criteria for color extraction, but such setting is very difficult, Rather, it is better to check with the human eye.

  In addition, if a rigorous check is performed on the board that was originally manufactured, then the inspection will be conducted on the assumption that the correct parts should be supplied to each mounting position until the parts are replenished or replaced. Can be executed. Therefore, it is not necessary to obtain high accuracy in determining whether parts are successful, and automatic inspection can be used. Thus, while the initial component mounting inspection is a visual inspection, the component mounting inspection after full-scale operation is automatically performed, so that the inspection can be performed efficiently and with high accuracy, and the quality of the board Can be increased.

  In addition to the above, it is necessary to manage the inspection results separately from the normal inspection from the viewpoint of quality control, and to be able to respond quickly when creating a new board for which inspection data is not yet registered This is also the reason for visual inspection. In this embodiment, in consideration of these reasons, the inspection result is stored in the memory 13 so that the inspection can be performed accurately and efficiently and the past inspection result can be confirmed as necessary. I am doing so.

FIG. 2 shows an example of the inspection screen for visual inspection.
In this embodiment, the inspected substrate 1 is imaged while being divided into a plurality of imaging target regions, and the inspection screen 30 includes an image 31 of the substrate input from the imaging unit 3 (hereinafter referred to as “processing target image 31”). In addition, a map image 32 of the entire board is displayed. The map image 32 has a configuration in which a plurality of rectangles 321 schematically representing components are arranged according to the arrangement state of each component, and a region 322 corresponding to the processing target image being displayed is surrounded by a thick frame.

  As shown in FIG. 2 (1), only the processing target image 31 and the map image 32 are displayed on the inspection screen immediately after entering the visual inspection mode. When the inspection is started, as shown in FIG. 2B, display information is added and each part on the processing target image 31 is marked. In this example, the X mark 311 indicating that the component is being checked is added to the component to be checked, while the circle mark 312 is added to the component that has already been checked. An unchecked part is marked with a x mark 313 having a color different from that of the mark 311.

Next, information added to the inspection screen 30 will be described.
In this embodiment, three display fields 33, 34, and 35 are set vertically next to the right side of the processing target image, the mounting position and mounting direction are set in the first display field 33, and the part number is displayed in the second display field 34. Are displayed in the third display field 35, respectively. Information in these display fields 33 to 35 is derived from the component mounting information. The mounting position is represented by X and Y coordinates of the center point of the component. The mounting direction is represented by an angle θ formed by the principal axis of the component with respect to the X axis.

  Further, a sample image 36 of the component is displayed below the display column 35, and a check column 37 is set below the sample image 36. The check column 37 is provided with a plurality of check boxes 371 to 374 relating to three items of mounting, product number, and direction. Further, below the check column 37, a selection button 38 for selecting the next part, and a check box 39 for designating a part having the same part number as the next part (hereinafter referred to as "same part number selection box 39"). .) Is provided.

  Among the check boxes in the check column 37, the “mount” check box 371 is operated when the position of the component of interest matches the mounting position displayed in the display column 33. The “product number” check box 372 is operated when the component under consideration corresponds to the product number in the display field 34. Since the x mark 311 on the processing target image 31 is displayed at a position corresponding to the component mounting position, the checker can easily determine whether the component mounting position is appropriate based on the positional relationship between the mark and the component. be able to.

  Regarding the mounting direction of components, in addition to the check box 373 for “direction difference”, four check boxes 374 for specifying “upper”, “lower”, “left”, and “right” are set. The check box 373 is operated when the direction of the component under attention is not correct. On the other hand, the check box 374 is used to input the direction of the component recognized by the checker, and is operated regardless of the appropriateness of the direction. This check box 374 is set because the checker does not correctly recognize the direction of the part and determines that the direction is correct but the direction is incorrect. This is to cope with a case where it is determined as “none”.

Note that the direction of the component at the time of determination is determined with reference to the sample image 36. In this example, “up” is checked when the component on the processing target image 31 faces the same direction as the sample image 36, and “down” is checked when the component is vertically inverted from the sample image 36. . Also, with respect to the sample image 36, “right” is checked when the component is rotated 90 degrees clockwise, and “left” is checked when the part is rotated 90 degrees counterclockwise. . In addition, when the part is in a state of being inclined at a predetermined angle without facing right above or right side, two check boxes 374 such as “up” and “right” are operated according to the direction of the part.
However, in this example, it is not necessary to input the direction in particular for parts (chip parts and the like) having symmetrical shapes in the vertical and horizontal directions.

  3 and 4 show the processing procedure of the control processing unit at the time of visual inspection of component mounting. Hereinafter, the detailed processing of the inspection will be described along the flow shown in these drawings.

  This inspection procedure starts in response to an operation for switching the operation mode of the apparatus to the visual inspection mode. In the first ST1 (ST is an abbreviation for “step”. The same applies to the following), a login screen is displayed on the display unit 22, and an input of a password or the like is accepted. In the next ST2, the user name logged in is recognized based on the input in ST1, and the user name is stored in the memory 13 as a checker name.

  In ST3, the input of the name of the board to be inspected is received and stored in the memory 13. In next ST4, it is checked whether or not the inspection data of the substrate to be inspected is stored in the inspection data storage unit 19 based on the inputted substrate name. If the inspection data is stored, the process proceeds to ST5, and the component mounting information of each component is read from the corresponding inspection data. Furthermore, in ST6, based on the link information set for each component, a sample image of each component is read from the component library. Note that the information read in ST 5 and 6 is also temporarily stored in the memory 13.

  If it is determined in ST4 that the inspection data corresponding to the substrate to be inspected is not stored, the process proceeds to ST7, and whether or not the CAD data corresponding to the substrate is stored in the CAD data storage unit 20 is determined. Determine. If this ST7 is “YES”, the process proceeds to ST9, where the component mounting information of each component is read from the corresponding CAD data and stored in the memory 13.

  On the other hand, when a new board is inspected, or when a mounting process is shared by a plurality of mounters and a processed board is inspected by one of the mounters, CAD data corresponding to the board is stored. There may not be. In such a case, the process proceeds to ST8, a list of CAD data stored in a place other than the CAD data storage unit 20 is displayed, and an operation for selecting necessary CAD data is accepted. Thereafter, the process proceeds to ST9, and a process of reading the mounting information of each component from the selected CAD data is executed.

  In ST8, a storage medium set in the external memory device 25 or a higher-level device connected via the transmission / reception unit 24 can be a call destination of CAD data. In addition, when selecting CAD data, a plurality of data files can be selected.

  When the component mounting information of the CAD data is read in ST9, the process proceeds to ST6. In ST6 in this case, the part library is accessed based on the part number information of each part, and the corresponding sample image is read out and stored in the memory 13. Although not specified in the flowchart, there is a possibility that there is a part for which the corresponding library data is not registered when a board for which inspection data is not created is to be inspected. For such a part, reading of the sample image is skipped.

  In this way, when the mounting information and the sample image are read and set in the memory 13 for each component on the board, the process proceeds to ST10, and the first imaging target area is imaged. In the next ST11, the processing target image 31 obtained by the imaging process in ST10 is displayed on the display unit 22 together with the map image 32.

  When the above display is made, in ST12, an operation for selecting a part on the processing target image 31 is accepted. This selection operation is performed as a mouse click operation. If a predetermined position on the image is clicked here, the process proceeds to ST13, and the component whose mounting position is closest to the clicked position is set as the focused component.

  In ST14, the mark 311 is attached to the target part, and the mark 313 is attached to the other part. As a result, when the component of interest is specified, in subsequent ST15, the mounting information and sample image of the component of interest are read from the memory 13 and displayed on the display unit 22 together with the check field 37.

  In the next ST16, an operation for the check column 37 is accepted. Although the detailed procedure is not shown for this process, the operation of the check box is recognized, and the determination result reflecting the check state at the time of the operation is stored according to the operation of selecting the next part. For example, when the check boxes 371 and 372 are operated, the determination results of “mounting OK” and “product number OK” are stored, but the next part selection is performed without operating these boxes 371 and 372. In such a case, determination results such as “unmounted” and “part number difference” are stored.

  If the same product number selection box 39 is not operated and only the selection button 38 is operated, ST17 becomes “NO” and the process proceeds to ST18. In ST18, it is determined whether or not the check process for the processing target image being displayed has been completed. If there is an unprocessed part on the displayed image, ST18 is “NO” and the process proceeds to ST19, and the target of attention is changed to one of the unprocessed parts. Thereafter, ST14 to 16 are executed for the new target component. In ST14 in this case, a mark 312 is attached to the component that has been checked in the previous process.

Similarly, when all the components in the displayed image have been checked, ST18 becomes “YES” and the process proceeds to ST25 to determine whether or not all the imaging target areas have been processed. Here, if there is an area for which the check process has not been executed, the process proceeds to ST26, the next imaging target area is imaged, and the process returns to ST12.
Hereinafter, similarly, images for each imaging target area are created in order, and processing for displaying mounting information, a sample image 36, a check column 37, etc. for each component on these images, and processing for receiving the check operation Are executed in order.

  Next, after a check acceptance process for a predetermined part is performed, if the selection button 38 is operated in a state where the same product number selection box 39 on the inspection screen 30 is selected, ST17 is “YES”. Then, the process proceeds to ST20, and it is determined whether or not the displayed processing target image 31 includes an unprocessed part having the same product number as the part processed immediately before. If this determination is “YES”, the process proceeds to ST24, and the corresponding unprocessed part is set as the next target of interest. After this, ST14-16 are performed about a new attention component. In the following, by repeating the same flow, it is possible to sequentially check parts of the same product number included in the same processing target image.

  When all the parts having the same product number on the processing target image are checked, ST17 becomes “YES” and ST20 becomes “NO” in accordance with the next selection operation. In this case, the process proceeds to ST21, and it is determined whether or not there is an area including unprocessed parts of the same product number in other imaging target areas. If this ST21 is "YES", it will progress to ST22 and will image by matching the visual field of the imaging part 3 with the applicable imaging object area | region. Furthermore, in ST23, the processing target image 31 obtained by the new imaging is displayed together with the map image 32. Thereafter, in ST24 described above, the target of attention is transferred to the corresponding part, and then the process returns to ST14.

  Thereafter, by repeating the same processing, it is possible to sequentially check the parts related to a specific product number on the substrate. When the check of the last part among these parts with the same part number is completed, ST17 becomes “YES”, ST20 becomes “NO”, and ST21 becomes “NO”, and the process returns to ST18. Therefore, after that, it is possible to proceed with the same check process while paying attention to the parts of other product numbers.

  When the processing for all the components on the board is completed in this way, ST25 becomes “YES”, and the process proceeds to ST27. In ST27, inspection result information is created based on the determination results for each component accumulated in the memory 13 so far, and is stored in the memory 13 as a file, and the same inspection result information is output to the display unit 22. Thereby, the screen of the display unit 22 is switched from the inspection screen 30 to a screen showing an inspection result (hereinafter referred to as “inspection result output screen”).

  Thereafter, in ST28, a command input for logoff is accepted. Thereby, a series of processes related to the inspection is completed.

  Although not shown in the above procedure, in this inspection, it is possible to accept the cancel operation of the checker at an arbitrary time and stop the inspection. Also in this case, inspection history data is created and stored in the memory 13 or displayed.

  FIG. 5 shows an example of an inspection result output screen displayed on the display unit 22 in ST27. In this example, two screens 40 and 41 shown in FIGS. 5 (1) and 5 (2) are set. Of these, the first inspection result output screen 40 is an initial screen, and the date and time when the inspection was executed, the name of the board to be inspected, the name of the person in charge of the check, and the number of parts that were checked (hereinafter referred to as “number of checked parts” ") Is displayed in a list. In addition, the registered component mounting information and the input determination result are displayed for the component determined to be defective.

  When the “image display” button 42 below the list display is operated, the screen 40 is switched to the second screen 41 in FIG. On this screen 41, a map image 43 of the board to be inspected is shown, and the parts 431 to 433 color-coded on the map image 43 according to the discrimination result (similar to the rectangle in the example of FIG. 2). ) Is arranged. In this example, the good determination component 431 is displayed in blue, and the defective determination component 432 is displayed in red. Furthermore, for the part 431 to which the direction of the part is input, the side corresponding to the operated check box 374 is displayed in yellow. A component 433 that has not been checked for some reason, such as a cancel operation, is displayed in white. A “return” button 44 for returning the display to the original initial screen 40 is provided below the map image 43.

  The inspection result output screens 40 and 41 can be appropriately read and displayed on the display unit 22 even after the inspection is completed. FIG. 6 is an example of a screen displaying a list of the history data of the inspection results. In this screen 50, the inspection execution date and time, the number of check parts, and the number of corrections are extracted from each inspection result information and displayed in a list. The operator can call up the inspection result initial screen 40 shown in FIG. 5A by selecting a predetermined column on the screen 50 and operating the lower display button 51.

  Thus, if the history of inspections performed in the past is accumulated, read out and displayed as appropriate, it is not necessary to store the board created first after component replenishment or changeover as in the prior art. This eliminates the need to prepare a storage space for the substrate and saves resources.

  Further, according to the inspection result image display screen 41 shown in FIG. 5 (2), the check result for each component can be easily confirmed, so that there is no possibility of overlooking a defective part or a check missing component. In addition, when the checker erroneously determines that the direction is correct for a component having an inappropriate mounting direction, the checker's recognition difference can be clarified by the yellow portion in the map image 43. Thus, by assembling a system capable of verifying a check mistake, it is possible to correct a checker's error and prevent a subsequent check mistake.

  In the above embodiment, the checker selects the part to be checked first, and then the process for each part is executed in order. However, the process for selecting the part to be checked can be completely automated. Good.

1 is a block diagram of a substrate inspection apparatus to which the present invention is applied. It is explanatory drawing which shows the example of the test | inspection screen at the time of visual inspection. It is a flowchart which shows the process sequence of the control process part at the time of visual inspection. FIG. 4 is a continuation flowchart of FIG. 3. It is explanatory drawing which shows the example of a display of test result information. It is explanatory drawing which shows the example of a display of the log | history information of a test result.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 3 Imaging part 5 Control processing part 11 Control part 12 Image input part 13 Memory 15 Image processing part 19 Inspection data storage part 20 CAD data storage part 21 Input part 22 CRT display part 30 Inspection screen

Claims (3)

For each component on the board to be inspected, an inspection data storage unit in which at least a mounting position, a mounting direction, and component identification information are registered as inspection data, and a sample image storage in which sample images of the respective components are registered An image input unit that inputs an image of a substrate to be inspected, an operation unit and a display unit, and the inspection target image input from the image input unit is collated with the sample image, thereby A control processing unit for automatically inspecting the mounting state of each component on the substrate by extracting the component and collating the position and direction of the extracted component with the inspection data registered in the inspection data storage unit A method for performing a visual inspection on a specific board using a component mounting inspection apparatus,
In the control processing unit, an image obtained by imaging the specific substrate is input from an image input unit and displayed on the display unit, and an inspection registered in the inspection data storage unit for one component in the image Step A for reading out data and a sample image registered in the sample image storage unit ; In the image of the substrate displayed on the display unit based on the mounting position in the inspection data read from the inspection data storage unit in Step A test step B performing display focused on target part of; the test data and the sample image read out in the step a, both the check column for determining the mounted state, is displayed on the same screen as the image display of said substrate, said Steps C; for receiving an operation from the operation unit for the check column are repeatedly executed,
In the mounting status determination check column, a sample image in the same screen as the first check column for inputting the result of the suitability determination of each information included in the inspection data for the component being displayed of interest is displayed. And a second check field for inputting the result of determining the direction of the part as a reference,
The control processing unit of the component mounting inspection apparatus recognizes whether or not the mounting state is appropriate for each component on the board based on the input to the first check field, and determines whether the mounting state of each component is appropriate based on the recognition result. A map image of the board marked with is created and displayed on the display unit, and the direction of the input component is correct at the position corresponding to the component input in the second check field in the map image. Display to confirm whether it matches the mounting direction,
A method for inspecting a component mounting board. For each component of the substrate to be inspected, at least a mounting position respectively, mounting direction, and parts identification information are test data storage unit that is registered as an inspection data, the sample image sample image of each component is registered A storage unit, an image input unit that inputs an image of a substrate to be inspected, an operation unit and a display unit, and the inspection target image input from the image input unit are collated with the sample image, thereby checking the inspection target image. A control processing unit for automatically inspecting the mounting state of each component on the board by extracting the component of the component and collating the position and direction of the extracted component with the inspection data registered in the inspection data storage unit. A component mounting inspection apparatus comprising:
The control processing unit is set so as to be able to switch from the automatic inspection mode to the visual inspection mode. When the control processing unit is switched to the visual inspection mode, the inspection target image input from the image input unit is displayed on the display unit. And reading out the inspection data registered in the inspection data storage unit and the sample image registered in the sample image storage unit for one part in the image ; the inspection read out from the inspection data storage unit in step A A step B for displaying the inspection target component in the board image displayed on the display unit based on the mounting position in the data ; a check for mounting state determination using the inspection data and the sample image read in the step A column and both displayed on the same screen as the image display of the board receives an operation from the operation portion with respect to the check column step ; Repeatedly perform the steps of,
In the mounting status determination check column, a sample image in the same screen as the first check column for inputting the result of the suitability determination of each information included in the inspection data for the component being displayed of interest is displayed. And a second check field for inputting the result of determining the direction of the part as a reference,
For each component on the board, the control processing unit recognizes whether or not the mounting state is appropriate based on the input in the first check column, and based on the recognition result, the board that has been marked as appropriate for the mounting state is marked. A map image is created and displayed on the display unit, and whether or not the input direction matches the correct mounting direction at a position corresponding to the component input in the second check field in the map image A component mounting inspection apparatus including display control means for performing display for confirming whether or not . The control processing unit includes an inspection result information creating unit that creates inspection result information in which the date and time when the visual inspection mode is executed and the screen displayed on the display unit by the display control unit are associated with each other. The component mounting inspection apparatus according to claim 2, further comprising storage means for storing .

Images