JPWO2015071929A1 - Component imaging apparatus and surface mounter using the same - Google Patents

Abstract

The component imaging device has a function of imaging the tip of an extension terminal of an electronic component having an extension terminal. The component imaging apparatus has an imaging optical axis disposed in a first direction that penetrates the bottom surface of the component main body, an imaging unit having a predetermined imaging area along the imaging optical axis, and an inclination with respect to the imaging optical axis And an illumination unit that has an illumination optical axis that intersects the imaging optical axis and that emits directional illumination light along the illumination optical axis, and controls the imaging unit and the illumination unit to control the imaging light. A control unit configured to acquire a recognition image of the distal end of the extension terminal that passes through the detection region where the imaging region and the illumination light intersect, which is formed by the intersection of the axis and the illumination optical axis.

Description

  The present invention relates to a component imaging device that images an electronic component having an extension terminal such as a lead or a hemispherical or spherical ball terminal, and an electronic component surface mounter using the component imaging device.

  In a surface mounter that mounts electronic components on a printed wiring board, the components that image the electronic components in order to detect defects in the shape of the electronic components, the arrangement of leads and ball terminals, and deformation of the leads by image processing An imaging device is provided. This type of component imaging apparatus includes an illumination unit and an imaging unit that are arranged below a movement path of an electronic component. The illumination unit illuminates the bottom surface of the electronic component main body and the leads and hemispherical or spherical ball terminals extending in a direction perpendicular to the bottom surface. The imaging unit receives reflected light from the illuminated electronic component. An image obtained by this light reception becomes a recognition image of the electronic component and is a target of the image processing.

  As the illumination unit, an illumination unit that emits omnidirectional illumination light is generally used so as not to cause a shadow on an electronic component to be imaged. However, when the illumination light is irradiated onto the electronic component, a recognition image in which the electronic component is entirely illuminated is acquired, and it may be difficult to recognize the component based on the image processing. For example, when acquiring a recognition image of the lead tip of an electronic component with a lead or the ball terminal tip of an electronic component with a ball terminal, an optical image of the bottom part of the component body or the base of the lead in the case of an electronic component with a lead is obtained. Reflection may make it difficult to recognize the position of the tip of the lead or the tip of the ball terminal.

  Patent Document 1 discloses a component mounting apparatus having a function of irradiating electronic components with leads with a polygon mirror and performing three-dimensional measurement of the electronic components by a light cutting method. According to this apparatus, since the three-dimensional shape of the electronic component can be grasped, the lead tip position can be measured. However, a dedicated member for three-dimensional measurement is required, and the apparatus cost is increased due to the large scale.

  Patent Document 2 discloses a component mounting apparatus that includes a first illumination unit that illuminates the bottom surface of an electronic component and a second illumination unit that illuminates the lead of the electronic component at an irradiation angle close to horizontal. According to this apparatus, if only the second illumination unit is turned on and imaging is performed, a recognition image of the lead tip can be acquired without reflecting the bottom surface of the electronic component. However, it is necessary to arrange the second illumination unit so that only the lead is irradiated with illumination light, and there is a problem in that the degree of freedom of arrangement of the lighting fixture is significantly limited.

  In addition, based on the technique disclosed in Patent Document 1 and Patent Document 2, when acquiring a recognition image of the tip of a ball terminal of an electronic component having a ball terminal, the recognition image of the lead tip of the electronic component with a lead is acquired. Each case has similar problems.

JP 2012-173188 A JP 2012-182333 A

  An object of the present invention is to provide a component imaging device capable of acquiring a recognition image that can easily measure the lead tip position and the ball terminal tip position, and a surface mounter of an electronic component using the component imaging device. And

  A component imaging apparatus according to an aspect of the present invention includes a component main body and an extension terminal extending from the component main body, and the extension terminal extends in a direction perpendicular to the bottom surface of the component main body. A component imaging apparatus having a function of imaging an extension terminal tip of an electronic component having an output terminal tip, wherein an imaging optical axis is arranged in a first direction passing through a bottom surface of the component body, and the imaging optical axis An imaging unit having a predetermined imaging area along the imaging optical axis, an illumination optical axis that is inclined with respect to the imaging optical axis and intersects the imaging optical axis, and has directivity along the illumination optical axis The detection unit formed by the intersection of the imaging optical axis and the illumination optical axis by controlling the illumination unit that irradiates light, the imaging unit and the illumination unit, and the detection that the imaging region and the illumination light intersect A control for acquiring a recognition image of the tip of the extension terminal passing through the region. It comprises a part, a.

  A surface mounter according to another aspect of the present invention includes a component holding member that holds a mounting component, a lifting mechanism that moves the component holding member up and down in a vertical direction, and a moving device that moves the component holding member in a horizontal direction. A mounting unit that transports the mounting component from a component supply unit and mounts the mounting component on a substrate; and the component imaging device that images the mounting component held by the component holding member as the electronic component; A detection unit for detecting a position of the extension terminal tip of the mounting component based on an image of the mounting component imaged by the imaging unit; and a position of the extension terminal tip of the mounting component And a control device that adjusts the horizontal mounting position on the substrate based on the detection result.

  The objects, features and advantages of the present invention will become more apparent from the following detailed description and the accompanying drawings.

FIG. 1 is a plan view of a surface mounter using a component imaging apparatus according to the present invention. FIG. 2 is an overall perspective view of the component imaging apparatus. FIG. 3 is a schematic diagram schematically showing the configuration of the component imaging apparatus. FIG. 4 is a diagram illustrating an imaging state of a lead tip of an electronic component by the component imaging apparatus according to the basic embodiment of the present invention. FIG. 5 is a diagram illustrating an imaging state of a lead tip of an electronic component by the component imaging apparatus according to the comparative example. 6A is a side view of an example of an electronic component with leads, and FIG. 6B is a bottom view thereof. 7A is a side view of an example of an electronic component with leads, FIG. 7B is a side view of different angles, and FIG. 7C is a bottom view thereof. FIG. 8A is a side view of an example of an electronic component with leads, and FIG. 8B is a bottom view thereof. FIG. 9A is a side view of an example of an electronic component with leads, and FIG. 9B is a bottom view thereof. FIG. 10 is a photograph of an example of an electronic component with leads. 11A is a recognition image acquired by the component imaging device according to the comparative example, and FIG. 11B is a photograph of the recognition image acquired by the component imaging device according to the present invention. FIG. 12 is a block diagram showing the configuration of the surface mounter. FIG. 13 is a flowchart of the component recognition operation by the component imaging apparatus according to the present invention. FIG. 14A is a diagram showing an imaging state by the component imaging apparatus according to the first embodiment of the present invention, and FIG. 14B is a diagram showing an acquired recognition image. FIG. 15A is a diagram illustrating another imaging state by the component imaging apparatus according to the first embodiment, FIG. 15B is an acquired recognition image, and FIG. 15C is a composite recognition image. It is. FIG. 16 is a flowchart of the component recognition operation performed by the component imaging apparatus according to the first embodiment. FIG. 17A is a diagram showing an imaging situation by the component imaging device according to the second embodiment, and FIG. 17B is a diagram showing another imaging situation by the component imaging device. FIG. 18A is a diagram showing an imaging situation by the component imaging device according to the third embodiment, and FIG. 18B is a diagram showing another imaging situation by the component imaging device. FIG. 19A is a diagram illustrating an imaging state by the component imaging device according to the fourth embodiment, FIG. 19B is a diagram illustrating the lead detection width, and FIG. 19C is the component imaging device. FIG. 19D is a diagram showing another imaging situation, and FIG. 19D is a diagram showing the lead detection width. FIG. 20A is a diagram showing an imaging situation by the component imaging device according to the fifth embodiment, and FIG. 20B is a diagram showing another imaging situation by the component imaging device. FIG. 21A is a diagram showing an imaging situation by the component imaging device according to the sixth embodiment, and FIG. 21B is a diagram showing another imaging situation by the component imaging device. FIG. 22A is an explanatory diagram of the lead detection area, FIG. 22B is a diagram illustrating an imaging state of the component imaging device according to the seventh embodiment, and FIG. 22C is the component imaging device. It is a figure which shows the other imaging condition. FIG. 23 is a flowchart showing the operation of the component recognition calibration process. FIG. 24A is a perspective view of an imaging optical axis adjustment target, FIG. 24B is a diagram showing an imaging state of the adjustment target, and FIG. 24C is a diagram showing a recognition image thereof. . FIG. 25A is a diagram illustrating an imaging state of an adjustment target for adjusting the illumination optical axis, and FIG. 25B is a diagram illustrating a recognition image thereof. FIG. 26 is a diagram illustrating a modification of the imaging unit.

  Hereinafter, embodiments of a component imaging device and a surface mounter according to the present invention will be described in detail with reference to the drawings. In this embodiment, an example in which the component imaging apparatus according to the present invention is assembled to a surface mounter will be described.

  The surface mounter 1 includes a base 2, a transport unit 3, a component supply unit 4, a component moving unit 5 (mounting unit), and a detection unit 10. The base 2 is formed in a quadrangular shape in plan view and supports each part of the surface mounter 1. The transport unit 3 is provided so as to cross over the base 2 in the left-right direction (X direction) in FIG. 1 and transports the printed wiring board 7 (substrate). The component supply unit 4 is provided at both ends of the base 2 so as to sandwich the conveyance unit 3, and supplies electronic components (mounting components) to be mounted on the printed wiring board 7. The component moving unit 5 is provided above the base 2 and conveys the electronic component from the component supplying unit 4 toward the printed wiring board 7 on the conveying unit 3 and mounts the electronic component on the printed wiring board 7. . The detection unit 10 images an electronic component with a component imaging device 11 described later, and performs recognition of the electronic component or detection of the lead tip position of the electronic component based on a recognition image obtained by the imaging. In FIG. 1, the direction in which the transport unit 3 extends (the transport direction of the printed wiring board 7) is indicated as the X direction, and the horizontal direction orthogonal to the X direction is indicated as the Y direction.

  The conveyance part 3 is comprised by a pair of conveyor 6 arrange | positioned at intervals in the Y direction. The pair of conveyors 6 are belt conveyors, and convey the printed wiring board 7 in the X direction while supporting both ends of the printed wiring board 7 in the Y direction. An electronic component supply device is attached to the component supply unit 4. FIG. 1 shows an example in which a large number of tape feeders 12 are mounted as the electronic component supply device. A component imaging device 11 is disposed between the side of the conveyor 6 and the component supply unit 4.

  The component moving unit 5 includes a Y rail unit 13, an X rail unit 14, and a head unit 15. A pair of Y rail units 13 are provided on both ends of the base 2 in the X direction across the transport unit 3. The X rail unit 14 is supported by the Y rail unit 13 so as to be movable in the Y direction. The head unit 15 is supported by the X rail unit 14 so as to be movable in the X direction. The head unit 15 includes a plurality of suction heads (not shown).

  These suction heads include a suction nozzle 16 (component holding member; see FIG. 3) that can protrude from its lower end surface, and a suction head drive device 20 (see FIG. 12) described later. The suction head has a function of sucking and holding the electronic component by the suction nozzle 16 and releasing the suction at a position near the upper side of the substrate 2 to mount the electronic component on the substrate 2. Further, the suction head has a function of moving the suction nozzle 16 up and down by the suction head drive device 20 and a function of rotating the suction nozzle 16 about the vertical axis. Since the head unit 15 is movable in the Y direction and the X direction by the Y rail unit 13 and the X rail unit 14, the suction nozzle 16 can be freely moved to a desired position in the horizontal direction.

  The component imaging device 11 images the electronic component sucked by the suction nozzle 16 from below, and acquires a recognition image of the electronic component. FIG. 2 is an overall perspective view of the component imaging apparatus 11, and FIG. 3 is a schematic diagram schematically showing the configuration of the component imaging apparatus 11. The component imaging device 11 is placed on the housing 30, the camera 31 (imaging unit) and the lens unit 33 housed in the housing 30, and the top plate 30 </ b> T of the housing 30, and emits omnidirectional illumination light. An illumination unit 35 and a laser illumination unit 40 (illumination unit) that is attached to the upper peripheral edge of the illumination unit 35 and emits directional illumination light are provided.

  An electronic component that is an object to be imaged in the component imaging device 11 is, for example, a semiconductor component such as a DIP (Dual inline Package) in which a large number of leads protrude downward from the package portion, or a QFP (Quad Flat Package). Further, a semiconductor component in which a large number of leads extend from the package part to the side of the package part and then bends downward and protrudes downward, such as BGA (Ball Grid Allay), is spherical or hemispherical from the bottom of the package part. This is a semiconductor component in which the ball terminal protrudes downward. 2 and 3 exemplify an electronic component 17 including a component main body B having a rectangular parallelepiped shape and a lead L extending from a side surface of the component main body B. The lead L includes a lead tip La (FIG. 4) that extends vertically downward with respect to the flat bottom surface Ba of the component main body B. In addition, a CSP (Chip size package) or the like is also an imaging target. The electronic component 17 is moved in the X direction so as to pass over the component imaging device 11 while being sucked by the suction nozzle 16, and the component imaging device 11 acquires an image of the electronic component 17 during the passage. .

  A light image of an electronic component illuminated by the illumination unit 35 or the laser illumination unit 40 is incident on the camera 31. The camera 31 includes a line sensor 32, and the line sensor 32 converts the optical image into an electrical signal. The image sensor array direction of the line sensor 32 is the Y direction. The imaging optical axis A2 of the camera 31 is disposed in the Z direction (first direction) that is a direction penetrating the bottom surface Ba of the component main body B. Note that the imaging optical axis A2 may be arranged to be inclined with respect to the Z direction.

  The lens unit 33 includes an imaging lens (not shown), and forms an optical image of the electronic component 17 on the light receiving surface of the line sensor 32.

  The illumination unit 35 is an illumination device for illuminating the electronic component 17 from all directions below the electronic component 17. The illumination unit 35 has an octagonal dome shape when viewed from above, and a large number of illumination LEDs are mounted on the inner wall surface thereof. Each LED is generally directed to the imaging optical axis A2. As a result, the illumination unit 35 emits illumination light 35L from the entire circumference of the imaging optical axis A2 toward the imaging optical axis A2. When this illumination unit 35 operates, the non-directional illumination light 35L is irradiated to the electronic component 17 that passes across the imaging optical axis A2.

  The laser illumination unit 40 has an illumination optical axis A1 that is inclined with respect to the imaging optical axis A2 and intersects the imaging optical axis A2, and emits directional illumination light 40L along the illumination optical axis A1. The laser illumination unit 40 includes a light source unit 41 including a laser element that emits laser light, and an optical system unit 42 that converts the laser light into linear parallel light and outputs the parallel light. A semiconductor laser is preferably used as the laser element. As the optical system unit 42, a unit including a cylindrical lens can be exemplified.

  The illumination unit 35 that emits the omnidirectional illumination light 35L is exclusively used when the component imaging apparatus 11 acquires a recognition image of a general-purpose component that does not include a lead. On the other hand, the laser illumination unit 40 that emits directional illumination light 40L is used when the component imaging apparatus 11 acquires a recognition image of the electronic component 17 including the lead L that extends downward, particularly the lead tip La of the lead L. Is done. This is because when the omnidirectional illumination light 35L is used for imaging the lead tip La, not only the lead tip La but also other parts are reflected in the recognition image, and the accurate position of the lead tip La is displayed. This is because recognition may not be possible. Hereinafter, this point will be described in detail.

  FIG. 4 is a diagram illustrating an imaging state of the lead tip La of the electronic component 17 by the component imaging device 11 according to the basic embodiment of the present invention. In FIG. 4, the electronic component 17 is assumed to move in the direction of arrow A3 (X direction). The camera 31 has a predetermined imaging region 31A in a height region in the Z direction through which the electronic component 17 passes by movement along the imaging optical axis A2. The imaging region 31A has a lens so that an optical image of the moving electronic component 17 is formed on the imaging element of the line sensor 32 shown in FIG. 4 and an image can be obtained with a desired density. It is determined by the optical specifications of the unit 33, the Z-direction arrangement position, and the size of the image sensor. The laser illumination unit 40 irradiates illumination light 40L made of linear parallel light along an illumination optical axis A1 that crosses the imaging optical axis A2 in an oblique direction.

  By setting the irradiation direction of the illumination light 40L as described above, a region where the imaging region 31A that is a partial region on the imaging optical axis A2 intersects the illumination light 40L is generated. This intersection area becomes a detection area where a recognition image can be acquired. In other words, only the portion illuminated in this detection area and shining when viewed from vertically below is recognized by the camera 31 as an optical image.

  An intersection (point p1) between the imaging optical axis A2 and the illumination optical axis A1 is aligned with a portion to be detected by the electronic component 17. In the present embodiment, the portion to be detected is the lead tip La of the lead L. A horizontal plane in the moving direction A3 of the electronic component 17 including the intersection is a recognition surface for the electronic component 17. The illumination light 40L is emitted from the obliquely lower side of the electronic component 17 toward the intersection. Therefore, the illumination light 40L illuminates the lead tip La (point p1) of the lead L existing in the imaging region 31A.

  The illumination optical axis A1 is not set to an angle close to horizontal so that only the lead L can be illuminated. For this reason, the illumination light 40 </ b> L is a vertical intermediate portion (point p <b> 2) of another lead L adjacent to the lead L in the imaging region 31 </ b> A, and a root portion of another lead L adjacent to the other lead ( Illuminate point p3). Accordingly, reflected light is generated at the points p1, p2, and p3. However, the reflected light incident on the camera 31 is only the reflected light from the point p1. That is, the illumination light 40L is directional light and is projected from an oblique direction, and passes through a portion (detection region) illuminated by the illumination light 40L in the imaging region 31A. Only the lead tip La of the point p1. For this reason, the camera 31 can capture an optical image of the lead tip La with a good contrast. Incidentally, even if the conveyance of the electronic component 17 in the arrow A3 direction proceeds slightly from the state of FIG. 4 and the illumination part at the point p2 enters the imaging region 31A, the reflected light does not enter the camera 31. This is because the lead L extends vertically downward and the camera 31 is disposed vertically below the lead L. In addition, the intersection area | region is extended in the Y direction horizontally by setting the irradiation direction of the illumination light 40L as this embodiment (refer FIG. 3). As shown in FIG. 3, the image pickup elements are arranged in the Y direction by moving the lead L (lead tip La) of the lead 17 on both sides of the electronic component 17 only once by the arrow A3 (FIG. 4) of the electronic component 17. Images are taken by the line sensor 32.

  FIG. 5 is a diagram illustrating an imaging state of the lead tip La of the electronic component 17 by the component imaging apparatus according to the comparative example. Here, a case where the lead tip La is imaged using the non-directional illumination light 35L emitted from the illumination unit 35 is illustrated. In this case, the illumination light 35L uniformly illuminates the leads L of the electronic component 17 and the bottom surface Ba of the component main body B. For this reason, even if the imaging area of the camera 31 is limited as in FIG. 4, all reflected light existing in the imaging area is incident on the camera 31. Specifically, not only the reflected light of the lead tip La (point p1) of the lead L but also the reflected light from the wide portion (points p41, p42) at the base of the lead L is incident on the camera 31. For this reason, the camera 31 cannot capture only the optical image of the lead tip La with good contrast. Therefore, it is difficult to recognize the position of the lead tip La from the recognition image acquired by the imaging.

  FIGS. 6 to 9 show examples of electronic components that tend to make it difficult to recognize the lead tip La when the non-directional illumination light 35L is used. FIG. 6A is a side view of an electronic component 171 provided with an L-shaped lead L1, and FIG. 6B is a bottom view thereof. The lead L1 includes a root portion L11 extending horizontally from the side surface of the component body B1, and a hanging portion L12 extending vertically downward from the projecting tip of the root portion L11 with respect to the bottom surface Ba1. When such an electronic component 171 is irradiated with the illumination light 35L, not only the lead tip La1 but also the root portion L11 is illuminated. For this reason, in addition to the optical image of the lead tip La1, the optical image of the root portion L11 is reflected in the recognition image.

  FIG. 7A is a side view of an electronic component 172 having an L-shaped lead L2 with a varying lead width, FIG. 7B is a side view of a different angle, and FIG. It is a bottom view. The lead L2 includes a root portion L21 having a wide lead width and a protruding portion L22 having a narrow lead width. The root portion L21 has an L-shape that extends horizontally from the side surface of the component main body B2 and is bent downward. The protruding portion L22 is connected to the tip of the root portion L21 and extends vertically downward with respect to the bottom surface Ba2. When such an electronic component 172 is irradiated with the illumination light 35L, not only the lead tip La2 but also the horizontal portion of the root portion L21 and the stepped portion at the boundary between the root portion L21 and the protruding portion L22 will shine.

  FIG. 8A is a side view of an electronic component 173 provided with a T-shaped lead L3, and FIG. 8B is a bottom view thereof. The lead L3 includes a root portion L31 extending horizontally from the side surface of the component main body B3, and a hanging portion L32 extending vertically downward from the intermediate position of the root portion L31 with respect to the bottom surface Ba3. When such an electronic component 173 is irradiated with the illumination light 35L, not only the lead tip La3 but also the root portion L31 will shine.

  FIG. 9A is a side view of an electronic component 174 provided with a linear lead L4, and FIG. 9B is a bottom view thereof. The lead L4 extends directly downward from the bottom surface Ba4 of the component main body B4. When such an electronic component 172 is irradiated with the illumination light 35L, not only the lead tip La4 but also the flat bottom surface Ba4 shines in a mirror shape.

  For comparison between the case where the directional illumination light 40L is used (FIG. 4; this embodiment) and the case where the omnidirectional illumination light 35L is used (FIG. 5; comparative example), An example of imaging is shown. FIG. 10 is a photograph of an example of the electronic component 17 to be imaged. This electronic component 17 is the same as the electronic component 17 illustrated in FIGS. The lead L extends vertically downward from the side surface of the component body B to the bottom surface Ba, and includes a root portion LB having a wide lead width and a protrusion LT having a narrow lead width. The type is the same as the type shown in FIG.

  FIG. 11A is a recognition image acquired by the configuration of the comparative example, and FIG. 11B is a photograph of the recognition image acquired by the present embodiment. In the recognition image of the comparative example, the base portion LB and the stepped portion at the boundary between the base portion LB and the protruding portion LT are shining strongly, and the bottom surface Ba of the component main body B is also shining weakly. . For this reason, it is difficult to recognize the position of the lead tip La. For example, the position of the lead tip La cannot be recognized unless image processing is performed with a threshold value for distinguishing between “white” and “black” on the identification image set independently for the electronic component. On the other hand, in the recognition image of the present embodiment, only the light image of the white dot-shaped lead tip La appears on the black background image with a clear contrast. Therefore, the position recognition of the lead tip La can be completed by simple image processing.

  Next, the control configuration of the surface mounter 1 will be described based on the block diagram of FIG. The surface mounter 1 further includes a control device 8 (control unit) that controls the operation of each part of the surface mounter 1, an X rail unit drive device 18, a head unit drive device 19, and a suction head drive device 20. ing. The X rail unit driving device 18 generates a driving force for moving the X rail unit 14 (FIG. 1) on the Y rail unit 13 in the Y direction. The head unit driving device 19 generates a driving force that moves the head unit 15 in the X direction on the X rail unit 14. The suction head driving device 20 generates a driving force for moving the suction nozzle up and down in each suction head provided in the head unit 15 and rotating the suction nozzle about the vertical axis. These driving devices 18 and 19 constitute a part of the “moving mechanism” of the present invention, and the suction head driving device 20 constitutes the “elevating mechanism” of the present invention.

  The control device 8 functionally includes a main control unit 21, a storage unit 22, an axis control unit 23, a conveyor control unit 24, a camera control unit 25, an illumination control unit 26, and an image processing unit 27. The main controller 21 performs various controls in the surface mounter 1 in an integrated manner. In this embodiment, the main control unit 21 controls the axis control unit 23, the camera control unit 25, and the illumination control unit 26, respectively, so that the electronic component 17 (lead tip La) is detected by the component moving unit 5. While moving so that it may pass through an area | region, the camera 31 and the illumination unit 35, or the laser illumination unit 40 are operated, and control which acquires the recognition image of the electronic component 17 or the lead front-end | tip La is performed.

  The storage unit 22 stores various information related to the printed wiring board 7 and the electronic component 17. The information regarding the electronic component 17 is, for example, information such as the type of electronic component, the number and arrangement of leads L, and the height position of the lead tip La.

  The axis control unit 23 controls the operation of the X rail unit 14, the head unit 15, and the suction head by controlling the X rail unit drive device 18, the head unit drive device 19, and the suction head drive device 20. . The conveyor control unit 24 controls the conveyance of the printed wiring board 7 by controlling the operation and stop of the pair of conveyors 6 constituting the conveyance unit 3.

  The camera control unit 25 controls the imaging operation of the camera 31. For example, the camera control unit 25 controls the shutter timing, shutter speed (exposure amount), and the like of the camera 31.

  The illumination control unit 26 controls the light emission operations of the illumination unit 35 and the laser illumination unit 40. The illumination control unit 26 acquires component information for the electronic component taken out from the tape feeder 12 with reference to the storage unit 22, and determines which of the illumination unit 35 or the laser illumination unit 40 is turned on. Then, the illumination control unit 26 operates the selected illumination unit in a predetermined routine.

  The image processing unit 27 applies a known image processing technique to the recognized image acquired by the camera 31 (line sensor 32), and extracts various types of inspection information from the recognized image. For example, based on the inspection information extracted by the image processing unit 27, it is possible to determine whether or not the suction displacement of the electronic component 17 by the suction nozzle 16 and the bending of the lead L are within an allowable range, and the lead tip La is allowed to float. It is determined whether or not it is within the range.

  FIG. 13 is a flowchart of the component recognition operation by the component imaging apparatus 11 of the present embodiment. Here, the case of obtaining the suction displacement by the suction nozzle 16 of the electronic component 17 is illustrated. First, an electronic component (an electronic component transported by the head unit 15) for which a recognition image is acquired by the illumination control unit 26 is recognition of the component itself, or the lead tip La of the electronic component 17 is detected. It is determined whether it is recognition (step S1). Since the electronic component 17 having the leads L is mounted with a plurality of lead tips La inserted into the lead holes of the printed wiring board 7, the suction displacement of the electronic components 17 starts from the correct position of the lead tip La with respect to the suction nozzle 16. Therefore, the lead tip La needs to be recognized. On the other hand, the electronic component 17 that does not have the lead L is mounted so that the center of the electronic component 17 coincides with the predetermined mounting position. It is determined by the amount of deviation from the position, and it is necessary to recognize the part itself.

  In the case of recognition of the component itself, the illumination control unit 26 turns on the illumination unit 35 that emits omnidirectional illumination light 35L. In addition, the camera control unit 25 causes the camera 31 to perform an imaging operation (step S2). Then, the image processor 27 analyzes the recognition image acquired by the camera 31 to obtain the electronic component suction displacement (step S3).

  On the other hand, in the case of recognition of the lead tip La, the illumination control unit 25 turns on the laser illumination unit 40 that emits directional illumination light 40L. In addition, the camera control unit 25 causes the camera 31 to execute an imaging operation (step S4). Then, when the image processing unit 27 analyzes the recognition image acquired by the camera 31, the electronic component suction displacement is obtained based on the position information of the lead tip La (step S5).

  Hereinafter, various embodiments of the present invention will be exemplified. In the first to third embodiments shown in FIGS. 14 to 18, various embodiments when acquiring recognition images of the electronic components 17 having the leads L having different lengths are shown in FIGS. 19 to 22. The seventh embodiment shows various embodiments when the detection width of the lead L is variable.

<First Embodiment>
FIGS. 14A and 15A are diagrams illustrating an imaging state by the component imaging apparatus according to the first embodiment, and FIGS. 14B and 15B are recognitions acquired by the respective imaging. FIG. 15C is a diagram showing a composite recognition image. The electronic component 175 to be imaged in the first embodiment includes a component main body B5, and a first lead L51 and a second lead L2 having different projecting heights downward from the bottom surface of the component main body B5 (upward in FIG. 10). including. In the first embodiment, an example corresponding to imaging of the electronic component 175 in terms of software using the apparatus configuration of the basic embodiment and the control apparatus 8 illustrated in FIG. 12 will be described.

  The first lead L51 is a long lead in which the protrusion height in the Z direction (first direction) of the lead tip La51 is at a relatively high position (first position). On the other hand, the second lead L52 is a short lead in which the projecting height of the lead tip La52 is at a relatively low position (second position). Such first leads L51 and second leads L2 are arranged in the horizontal direction on both side surfaces of the component main body B5.

  In the imaging of the electronic component 175, the main control unit 21 obtains a recognition image of the lead tip La51 of the first lead L51 and a second recognition image of the lead tip La52 of the second lead L52. Perform recognition operation. That is, the main control unit 21 executes the recognition operation the number of times corresponding to the protrusion height type of the lead. In the first recognition operation, as shown in FIG. 14A, a detection region (recognition surface) where the imaging region along the imaging optical axis A2 of the camera 31 intersects with the illumination light 40L of the laser illumination unit 40, After the height of the electronic component 175 held by the suction nozzle 16 (component holding member) is adjusted by the suction head drive device 20 (elevating mechanism) so that the lead tip La51 of the first lead L51 passes, the electronic The component 175 is moved by the head unit 15. In the second recognition operation, as shown in FIG. 15A, the electronic component 175 held by the suction nozzle 16 so that the lead tip La52 of the second lead L52 passes through the detection region (recognition surface). Is adjusted by the suction head drive device 20, the electronic component 175 is moved by the head unit 15.

  As shown in FIG. 14B, the recognition image acquired by the first recognition operation is an image in which only the optical image I-La51 of the lead tip La51 of the first lead L51 is shown. A broken line I-B5 indicates a portion corresponding to the outer shape of the component main body B5, but this portion is out of the recognition surface and does not appear in the recognition image. The same applies to the lead tip La52. Further, the recognition image acquired by the second recognition operation is an image in which only the optical image I-La52 of the lead tip La52 of the second lead L52 is shown, as shown in FIG. By synthesizing the recognition image of FIG. 14B and the recognition image of FIG. 15B, both the optical image I-La51 and the optical image I-La52 are reflected as shown in FIG. It is possible to create one recognition image.

  FIG. 16 is a flowchart of a component recognition process executed by the control device 8 in the first embodiment. When the main control unit 21 starts the electronic component recognition process, electronic component information, specifically, the component type, the number and arrangement of leads, and the protruding height are read from the storage unit 22 (step S11). When the electronic component is, for example, an electronic component 175 having leads with different protrusion heights, and the recognition image of the lead tip is acquired, the illumination control unit 26 turns on the laser illumination unit 40. Further, the axis controller 23 controls the head unit drive device 19 so that, as shown in FIG. 14A, the suction nozzle 16 so that the lead tip La51 of the first lead L51 matches the recognition surface. The Z direction position (head lowering position) is set (step S12).

  Thereafter, while the electronic component 175 is moved in the X direction by the head unit 15, the camera 31 and the laser illumination unit 40 are operated by the camera control unit 25 and the illumination control unit 26, and an operation for capturing a recognition image of the lead tip La 51 is performed. It is executed (step S13; first recognition operation). The recognition image acquired by this imaging operation is an image including only the optical image I-La51 of the lead tip La51 shown in FIG.

  The main control unit 21 then determines whether or not there are other lead tips with different protrusion heights that should be recognized by the electronic component 175 (step S14). In this case, since the second lead L52 remains (YES in step S14), the main control unit 21 determines to perform an imaging operation for the lead tip La52 (step S15). Then, as shown in FIG. 15A, the axis control unit 23 sets the Z direction position (head lowering position) of the suction nozzle 16 so that the lead tip La52 and the recognition surface coincide with each other (step S12). ). Thereafter, an operation of capturing a recognition image of the lead tip La52 is executed (step S13; second recognition operation). The recognition image acquired by this imaging operation is an image including only the optical image I-La52 of the lead tip La52 shown in FIG.

  When there is no other lead tip having a different protruding height to be recognized in the electronic component 175 (NO in step S14), a plurality of recognition images obtained by a plurality of imaging operations in step S13 by the image processing unit 27 is subsequently performed. Is processed, and one recognition image is formed. In the case of the electronic component 175, the recognition images acquired by the first and second recognition operations are combined to create a combined recognition image shown in FIG. Further, the image processing unit 27 obtains a parameter for evaluating the bending or floating of the lead, a parameter for evaluating the adequacy of the suction state by the suction nozzle 16, and the like based on the composite recognition image. Based on these parameters, the main control unit 21 determines whether or not the electronic component 175 can be mounted on the printed wiring board 7 (step S16).

  According to the first embodiment described above, the recognition images of the lead tips La1 and La2 of the first and second leads L51 and L52 having different protruding heights are acquired and synthesized to form one recognition image. Is done. Therefore, even in the component imaging device according to the present invention in which the region where the image is acquired is limited to the detection region where the illumination light 40L and the imaging region of the camera 31 intersect, the electronic device having leads with different protrusion heights Recognition images of the lead tips La1 and La2 of the component 175 can be reliably acquired. Even when there are three or more types of leads with different protruding heights, the recognition acquired by multiple recognition operations in which the height of the electronic component 175 in the Z direction is changed for each type and the lead tip is made to coincide with the recognition surface. Image processing for synthesizing images is performed.

Second Embodiment
FIG. 17A and FIG. 17B are diagrams illustrating an imaging state by the component imaging apparatus according to the second embodiment. In 2nd Embodiment, the example corresponding to imaging of the electronic component 175 provided with the 1st lead L51 and the 2nd lead L2 from which protrusion height differs by hardware devices is shown. In the basic embodiment and the first embodiment, an example in which one laser illumination unit 40 is arranged has been shown. The component imaging apparatus according to the second embodiment includes a first laser illumination unit 401 (an illumination unit at one height position) and a second laser illumination unit that are arranged with different height positions in the Z direction (first direction). 402 (illumination unit at another height).

  The first and second laser illumination units 401 and 402 have illumination optical axes that intersect the imaging optical axis A2 at the same angle, and irradiate directional illumination light 401L and 402L along the illumination optical axis, respectively. . By aligning the height position of the lead tip La1 of the first lead L51 with the horizontal recognition surface including the intersection of the imaging optical axis A2 and the illumination optical axis of the illumination light 401L, the illumination light 401L is emitted from the first lead L51. Irradiation is performed using the lead tip La1 as a target. Further, by aligning the height position of the lead tip La2 of the second lead L52 with the horizontal recognition surface including the intersection of the imaging optical axis A2 and the illumination optical axis of the illumination light 402L, the illumination light 402L is supplied to the second lead. Irradiation is performed using the lead tip La2 of L52 as a target. The control configuration of the component imaging device of the second embodiment is, for example, a configuration in which the control device 8 shown in FIG. 12 is applied and the lighting control unit 26 controls the lighting operation of the first and second laser illumination units 401 and 402. It can be.

  As in the first embodiment, the main control unit 21 obtains a recognition image of the lead tip La51 of the first lead L51 and a second recognition image of the lead tip La52 of the second lead L52. Perform recognition operation. During the first recognition operation, as shown in FIG. 17A, the illumination control unit 26 operates the first laser illumination unit 401 while stopping the second laser illumination unit 402. As a result, only the lead tip La51 is illuminated by the illumination light 401L, and a recognition image including only the optical image of the lead tip La51 is acquired in the first recognition operation.

  Next, during the second recognition operation, as shown in FIG. 17B, the illumination control unit 26 operates the second laser illumination unit 402 while stopping the first laser illumination unit 401. Thus, only the lead tip La52 of the second lead L52 is illuminated by the illumination light 402L, and a recognition image including only the optical image of the lead tip La52 is acquired in the second recognition operation. Thereafter, the recognition images acquired by the first and second recognition operations are combined by image processing of the image processing unit 27, and a combined recognition image similar to the image shown in FIG. 15C is created.

  According to the second embodiment, the difference in height direction between one illumination unit of the first laser illumination unit 401 and the second laser illumination unit 402 in which illumination light is parallel to each other (one height position and another height position). If the absolute value of the difference between the height position of the lead tip La51 of the first lead L51 and the height position of the lead tip La52 of the second lead L52 matches the absolute value of the difference between If the height position of the lead tip La1 of the first lead L51 is aligned with the horizontal recognition surface including the intersection of the optical axis A2 and the illumination optical axis of the illumination light 401L, the imaging optical axis A2 and the illumination optical axis of the illumination light 402L The height position of the lead tip La2 of the second lead L52 coincides with the horizontal recognition surface including the intersection with. Therefore, it is not necessary to adjust the position of the suction nozzle 16 in the Z direction according to the protruding height of the lead tip as in the first embodiment. Then, the recognition images of the lead tip La1 and the lead tip La2 are acquired by one recognition operation in which the head unit 15 moves the electronic component 175 in the X direction while irradiating both the illumination light 401L and the illumination light 402L. .

<Third Embodiment>
FIG. 18A and FIG. 18B are diagrams illustrating an imaging state by the component imaging apparatus according to the third embodiment. Also in the third embodiment, an example corresponding to imaging of the electronic component 175 including the first lead L51 and the second lead L2 having different projecting heights is shown by hardware. The component imaging apparatus of the third embodiment is the same as that of the first embodiment in that it is composed of one laser illumination unit 40, but differs in that the laser illumination unit 40 includes a mechanism that moves in the Z direction.

  The component imaging apparatus according to the third embodiment includes a support member 51 that supports the laser illumination unit 40, and a lifting device 52 that adjusts the height position of the laser illumination unit 40 in the Z direction by moving the support member 51 (illumination). Part lifting mechanism). The control configuration of the component imaging apparatus according to the third embodiment may be configured such that, for example, the control device 8 illustrated in FIG. 12 is applied and the operation of the lifting device 52 is controlled by the axis control unit 23.

  As in the first embodiment, the main control unit 21 obtains a recognition image of the lead tip La51 of the first lead L51 and a second recognition image of the lead tip La52 of the second lead L52. Perform recognition operation. During the first recognition operation, as shown in FIG. 18A, the illumination light 40L is irradiated with the intersection of the imaging optical axis A2 and the horizontal line that is the movement path of the lead tip La51 of the first lead L51 as a target. In addition, the lifting device 52 sets the position of the support member 51 in the Z direction. Accordingly, only the lead tip La51 is illuminated with the directional illumination light 40L, and a recognition image including only the optical image of the lead tip La51 is acquired in the first recognition operation.

  Next, during the second recognition operation, as shown in FIG. 18B, the lifting device 52 targets the intersection of the imaging optical axis A2 and the horizontal line that is the movement path of the lead tip La52 of the second lead L52 as a target. The support member 51 is moved in the Z direction to a position where the illumination light 40L can be irradiated. As a result, only the lead tip La52 is illuminated by the illumination light 40L, and a recognition image including only the optical image of the lead tip La52 is acquired in the second recognition operation. Thereafter, the recognition images acquired by the first and second recognition operations are combined by image processing of the image processing unit 27, and a combined recognition image similar to the image shown in FIG. 15C is created.

<Fourth embodiment>
Hereinafter, a component imaging device including various detection width adjustment mechanisms for adjusting the detection width (lead detection width) of the lead L of the electronic component 17 will be exemplified. Here, the lead detection width refers to a range set as an area for imaging the lead L in the direction from the lead tip La to the root of the normal lead L. For example, if a short range in the vicinity of the lead tip La is set as the lead detection width, the lead tip La deviates from the recognition surface only by a slight bend or float in the lead L. It will come off. Therefore, the lead tip La of the lead L is not shown in the recognition image, and it is determined that the electronic component 17 cannot be mounted. On the other hand, when a relatively long range from the lead tip La is set as the lead detection width, the lead tip La of the lead L is reflected in the recognition image even if the lead L is slightly bent or floated. In this way, by adjusting the lead detection width, it is possible to perform inspection according to the lead defect tolerance, for example, the lead bending tolerance specification. Note that a region where the imaging region 31A, which is a partial region of the imaging optical axis A2, and the illumination light 40L intersect is a detection region where a recognition image can be acquired, and the lead detection width is set by the detection region. That is, if the point where the illumination light 40L intersects the imaging region 31A can be expanded in the vertical direction, the recognition surface including the intersecting point for recognizing the lead tip La will expand in the vertical direction, and the lead detection width. Can be spread.

  In addition, the protruding height of the lead L may vary depending on the type of the electronic component 17. For example, in the case of an electronic component having a short protrusion height of the lead L, if the lead detection width is set wider than the protrusion height of the lead L, a recognition image in which the bottom surface of the component main body B is shined is captured. May end up. Even in such a case, an imaging operation suitable for each electronic component can be performed by changing the lead detection width according to the protrusion height of the lead of the electronic component to be imaged.

  The detection width adjustment mechanism that adjusts the lead detection width is preferably a mechanism that adjusts the illumination width of the illumination light 40 </ b> L emitted by the laser illumination unit 40. By adjusting the illumination width, the width in which the illumination light 40L can be applied to the lead L, that is, the lead detection width can be easily adjusted. The fourth embodiment shows a specific example in which the lead detection width is variable by the illumination width adjusting mechanism.

  FIGS. 19A and 19C are diagrams illustrating an imaging state by the component imaging apparatus according to the fourth embodiment, and FIGS. 19B and 19D are lead detection widths in each imaging. FIG. The component imaging apparatus according to the fourth embodiment includes a light source unit 41 having a laser element, and a laser illumination including an optical system unit 42 having a cylindrical lens 42L (optical lens) that converts laser light into linear parallel light. A unit 40 is included. Further, the component imaging apparatus includes a lens moving mechanism including a lens support member 53 and a lens driving device 54.

  The lens support member 53 is a member that supports the cylindrical lens 42L at the periphery thereof. The lens driving device 54 moves the lens support member 53 so that the cylindrical lens 42L moves along the illumination optical axis A1. The control configuration of the component imaging apparatus according to the fourth embodiment may be configured such that, for example, the control device 8 illustrated in FIG. 12 is applied and the operation of the lens driving device 54 is controlled by the axis control unit 23.

  By selecting the position of the cylindrical lens 42L on the illumination optical axis, the convergence width of the illumination light 40L, that is, the illumination width can be adjusted. FIG. 19A shows a state in which the cylindrical lens 42L is arranged at a predetermined default position. This default position is the position where the cylindrical lens 42L is closest to the light source unit 41 on the optical path. Since the laser element of the light source unit 41 emits diffused light, when the cylindrical lens 42L is close to the light source unit 41, it enters the refractive surface of the cylindrical lens 42L when the diffusion degree of the diffused light is small. Accordingly, the illumination width of the illumination light 40L, that is, the width of the output light beam in the cross-sectional direction having the refractive surface of the cylindrical lens 42L is reduced.

  FIG. 19B shows an example in which the lead L is irradiated with illumination light 40L having a narrow illumination width. In this case, the region where the illumination light 40L intersects the lead L is the lead detection width. The lead detection width is a relatively short width upward from the lead tip La of the lead L.

  FIG. 19C shows a state in which the lens driving device 54 has moved the lens support member 53 so that the cylindrical lens 42L is further away from the light source unit 41 than the default position on the optical path. In this case, the diffused light emitted from the laser element has a relatively high degree of diffusion and enters the refractive surface of the cylindrical lens 42L. Accordingly, the illumination light 40LW emitted from the cylindrical lens 42L has a relatively large illumination width.

  FIG. 19D shows an example in which the lead L is irradiated with illumination light 40LW having a wide and narrow illumination width. The lead detection width by the illumination light 40LW is a relatively long width upward from the lead tip La of the lead L. As described above, according to the fourth embodiment, by adjusting the position of the cylindrical lens 42L on the illumination optical axis, the imaging region 31A, which is a partial region on the imaging optical axis A2, and the illumination light 40L intersect each other. The detection area in which the recognition image can be acquired can be enlarged or reduced in the vertical direction, and the lead detection width can be freely adjusted. Accordingly, various types of electronic components and lead inspection specifications can be handled.

<Fifth Embodiment>
FIG. 20A and FIG. 20B are diagrams illustrating an imaging state by the component imaging apparatus according to the fifth embodiment. The component imaging apparatus of the fifth embodiment includes an angle adjustment mechanism that adjusts the inclination of the illumination optical axis A1 of the laser illumination unit 40 for adjusting the lead detection width. The angle adjustment mechanism includes a holding member 55 that holds the laser illumination unit 40 and an elevating device 56 that adjusts the height position of the laser illumination unit 40 in the Z direction by moving the holding member 55. The control configuration of the component imaging apparatus according to the fifth embodiment may be configured such that, for example, the control device 8 illustrated in FIG. 12 is applied and the operation of the lifting device 56 is controlled by the axis control unit 23.

  The holding member 55 includes a mechanism that not only holds the laser illumination unit 40 but also shifts the tilt angle of the laser illumination unit 40 in conjunction with the movement of the holding member 55 in the Z direction. Specifically, as shown in FIG. 20A, when the holding member 55 is present at the lower position, the intersection angle of the illumination optical axis A1 with the imaging optical axis A2 is α1. The illumination optical axis A1 at this time is directed to a point on the imaging optical axis A2 through which the lead tip La passes. On the other hand, as shown in FIG. 20B, even if the holding member 55 is raised to the upper position by the elevating device 56, the crossing angle α2 (α1) at which the illumination optical axis A1 can point to the point remains unchanged. The inclination angle of the laser illumination unit 40 is shifted so that> α2).

  The illumination light 40L is parallel light having a width in the vertical direction. Since the illumination width is constant in the present embodiment, the illumination width with respect to the lead L becomes closer to the intersection angle α closer to the imaging optical axis A2. As it becomes small. That is, the width of the lead L irradiated by the illumination light 40L at the cross angle α2 is shorter than the width of the lead L irradiated by the illumination light 40L at the cross angle α1. Thus, according to the fifth embodiment, the lead detection width can be freely adjusted by adjusting the intersection angle α of the illumination optical axis A1 with the imaging optical axis A2.

<Sixth Embodiment>
FIG. 21A and FIG. 21B are diagrams illustrating an imaging state by the component imaging apparatus according to the sixth embodiment. The component imaging apparatus of the sixth embodiment includes a laser illumination module 40M (illumination unit) formed by modularizing three laser illumination units 403, 404, and 405 as the detection width adjusting mechanism. The three laser illumination units 403, 404, and 405 have illumination optical axes that intersect at the same angle with respect to the imaging optical axis A2, and are arranged at different height positions in the Z direction. The control configuration of the component imaging apparatus according to the sixth embodiment may be a configuration in which, for example, the control device 8 illustrated in FIG. 12 is applied and the operation of the laser illumination module 40M is controlled by the illumination control unit 26.

  The first laser illumination unit 403 (first illumination unit) of the laser illumination module 40M irradiates the illumination light 403L with the tip region (first region) near the lead tip La of the lead L as a target. The second laser illumination unit 404 (second illumination unit) irradiates the illumination light 404L with the intermediate region (second region) of the lead L as a target. The third laser illumination unit 405 irradiates the illumination light 405L with a region near the root of the lead L as a target.

  When the illumination width with respect to the lead L is made narrow, the illumination control unit 26 turns on only the first laser illumination unit 403 and targets only the tip region near the lead tip La as shown in FIG. Irradiation light 403L is irradiated. In this case, the lead detection width is narrow. On the other hand, when the illumination width for the lead L is wide, the illumination control unit 26 turns on all three laser illumination units 403, 404, and 405 as shown in FIG. Illumination light 404L, 405L, and 406L are irradiated with the tip region, the intermediate region, and the vicinity of the root as targets. Of course, the first and second laser illumination units 403 and 404 can be turned on. In this case, the lead detection width can be made wider than that in the case of FIG.

<Seventh embodiment>
Subsequently, a seventh embodiment of adjusting the lead detection width by software using the apparatus configuration of the basic embodiment shown in FIG. 4 and the control device 8 shown in FIG. 12 is an embodiment for adjusting the lead detection width. The embodiment will be described with reference to FIGS. 22 (A) to 22 (C). FIG. 22A is an explanatory diagram of the lead detection region, and FIGS. 22B and 22C are diagrams illustrating an imaging state by the component imaging apparatus according to the seventh embodiment.

Referring to FIG. 22A, lead detection, which is an area in the Z direction where the lead L can be imaged, where θ is the inclination angle of the illumination optical axis A1 with respect to the imaging optical axis A2 and T is the illumination width of the illumination light. The area is
T / sinθ
Can be determined by The previous fourth to sixth embodiments are embodiments in which this lead detection area is variable by hardware. On the other hand, in the seventh embodiment, the lead detection width is adjusted by making the lead detection area unchanged and adjusting the length of the lead L entering the lead detection area.

  As described above, the electronic component 17 is held by the suction nozzle 16 (component holding member). The suction nozzle 16 can be adjusted in height in the Z direction by a suction head drive device 20 (FIG. 12; elevating mechanism). FIG. 22B shows an example in which the holding position of the electronic component 17 by the suction nozzle 16 is set at a relatively lower position, so that the lead L enters the lead detection region relatively deeply. In this case, the lead detection width extending upward from the lead tip La is a relatively wide width.

  On the other hand, in FIG. 22C, the holding position of the electronic component 17 by the suction nozzle 16 is set to a relatively upper position as compared with the case of FIG. 22B, whereby the lead L is relatively shallow and the lead detection region. An example of entering is shown. In this case, the lead detection width is relatively narrow, and only the vicinity of the lead tip La is to be imaged. Thus, according to the seventh embodiment, the lead detection width can be freely adjusted by adjusting the holding position of the electronic component 17 by the suction nozzle 16 without requiring a mechanism for adjusting the illumination width. .

<Example of calibration operation>
Next, the calibration operation of the component imaging apparatus 11 will be described with reference to the block diagram of FIG. 12 and the flowchart of FIG. This calibration operation is executed when the surface mounter 1 is shipped from the factory, for example.

  First, the main control unit 21 reads initial operating condition data from the storage unit 22 (step S21). The initial operation condition data is, for example, initial operation conditions of the laser illumination unit 40, the head unit 15, and the camera 31 (line sensor 32). In the case of the laser illumination unit 40, the data includes the installation position, the amount of laser light, the illumination width, the width of the illumination light, the number of laser elements, and the like. The head unit 15 is data such as the moving speed in the X direction and the height of the suction nozzle 16 in the Z direction. Further, in the camera 31, data such as an F value and a shutter speed. In particular, when a unit driven by a DC power source is adopted as the laser illumination unit 40, it is difficult to finely adjust the amount of light on the laser illumination unit 40 side by pulse control, so the amount of light necessary for imaging depends on the shutter speed. Adjusted.

  Next, the main control unit 21 sets the operating conditions of each device of the surface mounter 1 including the laser illumination unit 40, the head unit 15, and the camera 31 described above based on the read initial operating condition data (step S22). Then, the main control unit 21 causes the head unit 15 (the suction nozzle 16) to suck the lead-attached electronic component or the calibration dummy component to be recognized (step S23). Subsequently, the main control unit 21 moves the head unit 15 so that the sucked electronic component passes through the detection area, and operates the laser illumination unit 40 and the camera 31 synchronously to perform trial recognition of the electronic component. An image is captured (step S24).

  After that, it is confirmed whether or not the trial recognition image shows the lead tip La of the lead L included in the electronic component in a recognizable state (step S25). If the lead tip La cannot be recognized (NO in step S25), the initial operating condition data read in step S21 is changed (step S26). Then, the changed operating condition data is newly set (step S23), and the same processing is repeated. On the other hand, if the lead tip La can be clearly recognized (YES in step S25), the calibration is terminated.

<Example of alignment adjustment between illumination optical axis and imaging optical axis>
An example of a mechanical optical axis adjustment method for aligning the illumination optical axis A1 and the imaging optical axis A2 is shown. 24A is a perspective view of the adjustment target 60 of the imaging optical axis A2, FIG. 24B is a diagram showing an imaging state of the adjustment target 60 with the camera 31, and FIG. It is a figure which shows the recognition image I-60 obtained by imaging.

  The adjustment target 60 is a square flat plate member, and includes a black ground surface 61 on a surface to be imaged and a white recognition line 62 drawn on a line that divides the ground surface 61 into left and right halves. Yes. The recognition line 62 is composed of a long white line and a short line arranged at a distance from both ends. In adjusting the optical axis, the operator first causes the adjustment target 60 to be adsorbed by the adsorption nozzle 16.

  Next, adjustment is performed to match the image sensor array direction of the line sensor 32 with the recognition line 62. Specifically, as illustrated in FIG. 24B, the adjustment target 60 is imaged by the camera 31 while the illumination unit 35 is turned on to emit the non-directional illumination light 35L. Then, as shown in FIG. 24C, the operator adjusts so that the light image I-62 of the white recognition line 62 is completely observed up to the short lines at both ends in the recognition image I-60. The position of the target 60 around the central axis of the suction nozzle 16 is adjusted.

  Thereafter, the intersection position of the illumination optical axis A1 of the laser illumination unit 40 is aligned with the imaging optical axis A2 aligned with the recognition line 62 as described above. FIG. 25A is a diagram illustrating an imaging state of the adjustment target 60 for adjusting the illumination optical axis A1, and FIG. 25B is a diagram illustrating the recognition image I-60A.

  While the illumination unit 35 is turned off, the laser illumination unit 40 is turned on, and the adjustment target 60 is illuminated by the illumination light 40L. At this time, if the illumination optical axis A1 (illumination light 40L) is not properly directed to the recognition line 62 of the adjustment target 60, the optical image I-62A of the recognition line 62 is incomplete in the recognition image I-60A. Reflected in. As shown in FIG. 25B, the operator adjusts the installation position of the laser illumination unit 40 so that the complete light image I-62A is observed in the recognition image I-60A. With the above operation, the alignment between the illumination optical axis A1 and the imaging optical axis A2 is completed.

  While various embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and for example, the following modified embodiments can be adopted.

  (1) In the above embodiment, the example in which the component imaging device 11 according to the present invention is assembled to the surface mounter 1 has been described. The component imaging device 11 can be applied to various devices that require imaging of the electronic component 17 other than the surface mounter 1. For example, the present invention can be applied to a component inspection apparatus that inspects the electronic component 17. Moreover, in the said embodiment, the components imaging device 11 which concerns on this invention was applied to the imaging recognition of the lead front-end | tip La of the electronic component 17 with a lead. The present invention can also be applied to the case where an electronic component having a hemispherical or spherical ball terminal provided on the bottom surface Ba of the component main body B as the electronic component 17 is imaged and recognized.

  (2) In the said embodiment, the camera 31 provided with the line sensor 32 was illustrated as an imaging part. Instead of the line sensor 32, a two-dimensional area sensor can also be used. FIG. 26 is a diagram illustrating an optical path when the two-dimensional area sensor 32A is used as the imaging unit. When the two-dimensional area sensor 32A is used, a device for limiting the imaging region along the imaging optical axis is required. Two slit plates 341 and 342 are disposed on the imaging optical axis A2 between the two-dimensional area sensor 32A and the imaging region of the electronic component 17. The light that enters the two-dimensional area sensor 32A is only the light that has passed through the slits of the slit plates 341 and 342. Therefore, according to such a configuration, even if the two-dimensional area sensor 32A is used, it is possible to perform imaging similar to the line sensor 32. In FIG. 26, two slit plates 341 and 342 are illustrated as separate members, but instead, a linear slit box having an entrance slit and an exit slit may be applied.

  (3) Since the application example to the surface mounter 1 has been described in the above embodiment, the moving mechanism including the Y rail unit 13, the X rail unit 14, and the head unit 15 is illustrated as the moving mechanism. This is an example, and the moving mechanism may be any mechanism that can hold the electronic component 17 and carry it in the air. Moreover, although the example which moves the electronic component 17 was shown in the said embodiment, you may make it move the imaging region (detection region) side by moving the camera 31 without moving the electronic component 17. .

  The specific embodiments described above mainly include inventions having the following configurations.

  A component imaging apparatus according to an aspect of the present invention includes a component main body and an extension terminal extending from the component main body, and the extension terminal extends in a direction perpendicular to the bottom surface of the component main body. A component imaging apparatus having a function of imaging an extension terminal tip of an electronic component having an output terminal tip, wherein an imaging optical axis is arranged in a first direction passing through a bottom surface of the component body, and the imaging optical axis An imaging unit having a predetermined imaging area along the imaging optical axis, an illumination optical axis that is inclined with respect to the imaging optical axis and intersects the imaging optical axis, and has directivity along the illumination optical axis The detection unit formed by the intersection of the imaging optical axis and the illumination optical axis by controlling the illumination unit that irradiates light, the imaging unit and the illumination unit, and the detection that the imaging region and the illumination light intersect A control for acquiring a recognition image of the tip of the extension terminal passing through the region. It comprises a part, a.

  According to this configuration, a detection region is formed in which an imaging region included in the imaging unit and illumination light having directivity emitted from the illumination unit intersect. When the extended terminal tip passes through the detection area, a recognition image of the extended terminal tip is acquired. For this reason, parts other than the extension terminal front-end | tip of an electronic component do not appear in the said recognition image. That is, even if the illumination light is applied to other parts of the electronic component other than the tip of the extension terminal, the light image is not captured by the imaging unit unless the irradiated part is within the detection region. Therefore, according to the component imaging apparatus, it is possible to acquire a recognition image in which the contrast between the extension terminal tip and other portions is clarified.

  In the component imaging apparatus, it is preferable that the imaging unit includes a line sensor, and the illumination unit includes a laser element that emits laser light and an optical system that converts the laser light into linear light. According to this configuration, an imaging unit having a predetermined imaging area along the imaging optical axis can be realized with a simple configuration.

  In the component imaging apparatus, the electronic component includes a lead extending from the component main body as the extension terminal, and the extension terminal tip to be imaged is a bottom surface of the component main body in the lead. The lead tip can be configured to extend in a direction perpendicular to the lead. According to this configuration, when the lead tip passes through the detection area, a recognition image of the lead tip is acquired. Therefore, according to the component imaging apparatus, a recognition image in which the contrast between the lead tip and other portions is clarified can be acquired.

  Alternatively, the electronic component includes a hemispherical or spherical ball terminal extending from the component main body as the extension terminal, and the extension terminal tip to be imaged is the component main body in the ball terminal. It can be set as the structure which is a ball terminal front-end | tip in the direction perpendicular | vertical with respect to the bottom face. According to this configuration, when the tip of the ball terminal passes through the detection area, a recognition image of the tip of the ball terminal is acquired. Therefore, according to the component imaging device, it is possible to acquire a recognition image in which the contrast between the tip of the ball terminal and the other part is clarified.

  In the above-described component imaging device, the electronic component is an electronic component in which the leads having a plurality of protruding heights with different protruding heights in the first direction of the lead tips are arranged in a direction orthogonal to the first direction. The control unit performs a recognition operation for acquiring the recognition image by passing the tip of the lead through the detection region a plurality of times according to the protrusion heights of the leads having the plurality of protrusion heights. In addition, a plurality of the recognition images obtained by a plurality of recognition operations can be combined to execute image processing for forming one recognition image.

  According to this configuration, the recognition images of the lead tips of the leads having a plurality of protrusion heights having different protrusion heights are acquired and combined to form one recognition image. Therefore, even in the component imaging device according to the present invention in which the detection area is limited, it is possible to reliably acquire a recognition image of the lead tip of an electronic component having leads with different protrusion heights.

  As a specific embodiment, the illuminating unit includes a plurality of illuminating units at different height positions in the first direction, and the illuminating units at the plurality of height positions each have a plurality of different projecting heights. The lead end of the lead having a protruding height is used as a target and is arranged so as to irradiate illumination light, and the control unit has an illumination unit at one height position among the illumination units at the plurality of height positions. When operating, it can be set as the structure which stops the illumination part of the other height position among the illumination parts of a some height position.

  According to this configuration, it is possible to instantaneously correspond to the recognition operation for the lead tip of each protruding height by switching the operation of the plurality of illumination units arranged at different height positions.

  Alternatively, the component imaging device includes a support member that supports the illumination unit, and an illumination unit lifting mechanism that adjusts a height position of the illumination unit in the first direction by moving the support member. The illumination unit elevating mechanism further adjusts the height position in the first direction of the illumination unit in a plurality of recognition operations targeting the tip of the lead having a plurality of different projecting heights. The support member can be configured to move so as to irradiate illumination light with the tip of the lead having a protrusion height as a target.

  According to this configuration, by adjusting the height position of the illumination unit in the first direction by the illumination unit elevating mechanism, it is possible to correspond to each of the recognition operations of the lead tips having different protrusion heights.

  In the component imaging apparatus, it is preferable that the component imaging apparatus further includes a detection width adjustment mechanism that adjusts a detection width of the lead in the first direction by adjusting an illumination width of illumination light emitted from the illumination unit.

  According to this configuration, the lead detection width can be made variable according to the protrusion height of the lead of the electronic component to be imaged. Alternatively, the lead detection width can be adjusted in accordance with the lead defect tolerance, for example, the lead bending tolerance specification. Further, by adjusting the illumination width, it is possible to easily adjust the width in which the illumination light can be applied to the lead, that is, the lead detection width.

  In the component imaging device including the detection width adjustment mechanism, the illumination unit includes a laser element that emits laser light and an optical lens that adjusts an illumination width by the laser light, and the detection width adjustment mechanism includes the optical lens. Can be configured to include a lens moving mechanism that adjusts the illumination width by moving the lens along the illumination optical axis.

  According to this configuration, the illumination width by the laser light can be adjusted by selecting the position of the optical lens on the illumination optical axis.

  In the component imaging device including the detection width adjustment mechanism, the detection width adjustment mechanism may include an angle adjustment mechanism that adjusts the illumination width by adjusting an intersection angle of the illumination optical axis with respect to the imaging optical axis. It can be set as the structure containing.

  According to this configuration, the illumination width can be reduced as the crossing angle becomes closer to a right angle with respect to the imaging optical axis.

  Alternatively, in the component imaging device including the detection width adjustment mechanism, the illumination unit includes a first illumination unit and a second illumination unit having different height positions in the first direction, and the first illumination unit is configured to be the lead. The second illumination unit irradiates illumination light with a first region, which is a predetermined region in the height direction, as a target, and a second region, which is a region different from the first region of the lead, as a target. The control unit is configured to operate only one of the first illumination unit and the second illumination unit, and to irradiate illumination light using only the first region or the second region as a target. , Control the narrow illumination width, operate both the first illumination unit and the second illumination unit, irradiate illumination light with both the first region and the second region as targets, Wide lighting It can be configured to perform the control to.

  According to this configuration, switching between the narrow illumination width and the wide illumination width can be instantaneously performed by the lighting control of the first illumination unit and the second illumination unit.

  The component imaging apparatus further includes an illumination unit that emits omnidirectional illumination light, and the control unit operates the illumination unit when the recognition image acquisition target is the tip of the extension terminal. When the recognition image acquisition target is a general-purpose component including a component main body that does not include the extension terminal, it is desirable to operate the illumination unit. According to this configuration, the component imaging device can recognize both the extended terminal tip and the general-purpose component.

  A surface mounter according to another aspect of the present invention includes a component holding member that holds a mounting component, a lifting mechanism that moves the component holding member up and down, and a moving mechanism that moves the component holding member in a horizontal direction. A mounting unit that transports the mounting component from a component supply unit and mounts the mounting component on a substrate; and the component imaging device that images the mounting component held by the component holding member as the electronic component; A detection unit for detecting a position of the extension terminal tip of the mounting component based on an image of the mounting component imaged by the imaging unit; and a position of the extension terminal tip of the mounting component And a control device that adjusts the horizontal mounting position on the substrate based on the detection result.

  A surface mounter according to still another aspect of the present invention includes a component holding member that holds a mounting component, a lifting mechanism that moves the component holding member up and down, and a movement that moves the component holding member in a horizontal direction. A mounting unit that transports the mounting component from a component supply unit and mounts the mounting component on a substrate; and the component imaging apparatus that images the mounting component held by the component holding member as the electronic component And a detection unit for detecting the position of the lead tip of the mounting component based on the image of the mounting component imaged by the imaging unit, and a detection result of the position of the lead tip of the mounting component. And a control device that adjusts the mounting position in the horizontal direction on the substrate, and the control device moves the component holding member up and down by the lifting mechanism, and the imaging optical axis and the illumination width of the illumination light, Determined by By adjusting the penetration length of the lead to the lead detection area, it adjusts the detection width in the first direction of the lead.

  According to this configuration, the detection width of the lead can be adjusted by adjusting the height position of the mounting component in the first direction by the lifting mechanism without requiring a mechanism for adjusting the illumination width.

  A surface mounter according to still another aspect of the present invention includes a component holding member that holds a mounting component, a lifting mechanism that moves the component holding member up and down, and a movement that moves the component holding member in a horizontal direction. A mounting unit that transports the mounting component from a component supply unit and mounts the mounting component on a substrate; and the component imaging apparatus that images the mounting component held by the component holding member as the electronic component And a detection unit for detecting the position of the lead tip of the mounting component based on the image of the mounting component imaged by the imaging unit, and a detection result of the position of the lead tip of the mounting component. And a control device that adjusts the mounting position in the horizontal direction on the substrate, and the control device uses the lifting mechanism to change the detection region in each recognition operation at a plurality of height positions. The lead tips of the projection height is to pass, moving the component holding member in the vertical direction.

  According to this configuration, the lead tips having a plurality of different projecting heights of the mounting components can pass through the detection region by the vertical movement of the component holding member by the lifting mechanism. Therefore, each recognition operation according to the protrusion height of the lead tip can be smoothly performed.

  As described above, according to the present invention, it is possible to provide a component imaging device capable of acquiring a recognition image that can easily measure the lead tip position, and a surface mounter for electronic components using the component imaging device. it can.

Claims (15)

The extension of an electronic component comprising a component main body and an extension terminal extending from the component main body, wherein the extension terminal includes an extension terminal tip extending in a direction perpendicular to a bottom surface of the component main body. A component imaging device having a function of imaging a terminal tip,
An imaging optical axis disposed in a first direction passing through the bottom surface of the component main body, and an imaging unit having an imaging area determined in advance along the imaging optical axis;
An illumination unit that has an illumination optical axis that is inclined with respect to the imaging optical axis and intersects the imaging optical axis, and irradiates illumination light having directivity along the illumination optical axis;
The extension terminal that controls the imaging unit and the illuminating unit and passes through the detection region formed by the intersection of the imaging optical axis and the illumination optical axis, where the imaging region and the illumination light intersect. A control unit for acquiring a recognition image of the tip;
A component imaging device comprising: The component imaging apparatus according to claim 1,
The imaging unit includes a line sensor,
The component imaging device, wherein the illumination unit includes a laser element that emits laser light and an optical system that converts the laser light into linear light. In the component imaging device according to claim 1 or 2,
The electronic component includes a lead extending from the component main body as the extending terminal,
The component imaging device, wherein the tip of the extended terminal to be imaged is a lead tip that extends in a direction perpendicular to a bottom surface of the component main body of the lead. In the component imaging device according to claim 1 or 2,
The electronic component includes a hemispherical or spherical ball terminal extending from the component main body as the extending terminal,
The component imaging device, wherein the tip of the extended terminal to be imaged is a ball terminal tip in a direction perpendicular to a bottom surface of the component main body of the ball terminal. In the component imaging device according to claim 3,
The electronic component is an electronic component in which the leads having a plurality of protruding heights with different protruding heights in the first direction of the lead tips are arranged in a direction orthogonal to the first direction,
The controller is
A recognition operation for acquiring the recognition image by passing the tip of the lead through the detection region is executed a plurality of times in accordance with the protrusion heights of the leads having the plurality of protrusion heights, and obtained by a plurality of recognition operations. A component imaging device that executes image processing for combining a plurality of the recognized images and forming one recognized image. In the component imaging device according to claim 5,
The illuminating unit includes a plurality of illuminating units at different height positions in the first direction, and the illuminating units at the plurality of height positions each have a plurality of projecting heights with different projecting heights. It is arranged to irradiate each illumination light with the lead tip of
When operating the illumination unit at one height position among the illumination units at the plurality of height positions, the control unit activates the illumination unit at another height position among the illumination units at the plurality of height positions. The component imaging device to be stopped. In the component imaging device according to claim 5,
A support member for supporting the illumination unit;
An illumination unit elevating mechanism that adjusts the height position of the illumination unit in the first direction by moving the support member;
The illumination unit elevating mechanism adjusts the height position of the illumination unit in the first direction and performs a plurality of different projection heights in a plurality of recognition operations targeting the lead tips having different projection heights. A component imaging apparatus in which the support member is moved so as to irradiate illumination light with the tip of the lead as a target. In the component imaging device according to claim 3,
The component imaging device further comprising a detection width adjustment mechanism that adjusts a detection width of the lead in the first direction by adjusting an illumination width of illumination light emitted from the illumination unit. In the component imaging device according to claim 8,
The illumination unit includes a laser element that emits laser light, and an optical lens that adjusts an illumination width of the laser light,
The component imaging apparatus, wherein the detection width adjusting mechanism includes a lens moving mechanism that adjusts the illumination width by moving the optical lens along the illumination optical axis. In the component imaging device according to claim 8,
The component imaging apparatus, wherein the detection width adjustment mechanism includes an angle adjustment mechanism that adjusts the illumination width by adjusting a crossing angle of the illumination optical axis with respect to the imaging optical axis. In the component imaging device according to claim 8,
The illumination unit includes a first illumination unit and a second illumination unit having different height positions in the first direction, and the first illumination unit targets a first region that is a predetermined region in the height direction of the lead. The second illumination unit is arranged to irradiate illumination light, targeting a second region that is a region different from the first region of the lead,
The controller is
Only one of the first illuminating unit and the second illuminating unit is operated, and only one of the first region and the second region is irradiated with illumination light to obtain a narrow illumination width. Control,
Control is performed by operating both the first illumination unit and the second illumination unit, and irradiating illumination light with both the first region and the second region as targets, thereby forming a wide illumination width. A component imaging device. In the component imaging device according to any one of claims 1 to 11,
It further includes an illumination unit that emits omnidirectional illumination light,
The controller is
When the acquisition target of the recognition image is the extension terminal tip, operate the illumination unit,
A component imaging apparatus that operates the illumination unit when the recognition image acquisition target is a general-purpose component including a component main body that does not include the extension terminal. A component holding member for holding a component for mounting; a lifting mechanism for moving the component holding member up and down; and a moving mechanism for moving the component holding member in a horizontal direction. A mounting part for transporting and mounting on a substrate;
The component imaging device according to any one of claims 1 to 12, which images the mounting component held by the component holding member as the electronic component.
Based on the image of the mounting component imaged by the imaging unit, a detection unit that detects the position of the extension terminal tip of the mounting component;
Based on the detection result of the position of the extension terminal tip of the mounting component, a control device that adjusts the horizontal mounting position on the substrate;
A surface mounting machine. A component holding member for holding a component for mounting; a lifting mechanism for moving the component holding member up and down; and a moving mechanism for moving the component holding member in a horizontal direction. A mounting part for transporting and mounting on a substrate;
The component imaging apparatus according to claim 3, wherein the mounting component held by the component holding member is imaged as the electronic component.
A detection unit for detecting a position of the lead tip of the mounting component based on an image of the mounting component imaged by the imaging unit;
A control device that adjusts the mounting position in the horizontal direction on the substrate based on the detection result of the position of the lead tip of the mounting component;
The control device includes:
The first holding direction of the lead is adjusted by moving the component holding member up and down by the lifting mechanism and adjusting a length of the lead entering a lead detection region determined by the imaging optical axis and the illumination width of the illumination light. Surface mounter that adjusts detection width in A component holding member for holding a component for mounting; a lifting mechanism for moving the component holding member up and down; and a moving mechanism for moving the component holding member in a horizontal direction. A mounting part for transporting and mounting on a substrate;
The component imaging apparatus according to claim 5, wherein the mounting component held by the component holding member is imaged as the electronic component.
A detection unit for detecting a position of the lead tip of the mounting component based on an image of the mounting component imaged by the imaging unit;
A control device that adjusts the mounting position in the horizontal direction on the substrate based on the detection result of the position of the lead tip of the mounting component;
The control device includes:
Surface mounting that moves the component holding member in the vertical direction so that the leading ends of the protrusions having different projection heights pass through the detection area in the respective recognition operations at a plurality of height positions by the elevating mechanism. Machine.

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