JPWO2015059749A1 - Pickup device and push-up pot - Google Patents

Abstract

The present specification discloses a pickup device including a push-up pot for pushing up a semiconductor chip attached to the upper surface of a film from below. In the pickup device, an identification mark is attached to the side surface portion of the push-up pot. The present specification also discloses a push-up pot that is used to push up a semiconductor chip attached to the upper surface of a film from below in a pickup device. The push-up pot has an identification mark on the side surface.

Description

  The present specification relates to a pickup device and a push-up pot.

  Japanese Patent Application Laid-Open No. 2012-156413 discloses a pickup device that includes a push-up pot for pushing up a semiconductor chip attached to the upper surface of a film from below.

  Conventionally, in the pickup device as described above, the push-up pot is identified by the operator visually. If the push-up pot can be automatically identified, the labor of the operator can be further reduced.

  In order to automatically identify the push-up pot, a method of attaching an identification mark on the upper surface of the push-up pot can be considered. With such a configuration, an image pickup device for picking up an image of a semiconductor chip attached to the upper surface of the film is used to image the identification mark on the upper surface of the push-up pot, and the push-up pot is identified by image recognition. be able to. However, if an identification mark is attached to the upper surface of the push-up pot, the image of the semiconductor chip will be reflected through the film when the semiconductor chip attached to the upper surface of the film is imaged. There is a risk of misrecognition during processing. The present specification discloses a technique that enables a push-up pot to be identified without causing misrecognition in image processing of a semiconductor chip.

  The present specification discloses a pickup device including a push-up pot for pushing up a semiconductor chip attached to the upper surface of a film from below. In the pickup device, an identification mark is attached to the side surface portion of the push-up pot.

  According to the above pickup device, the identification mark for identifying the push-up pot is attached not to the upper surface portion of the push-up pot but to the side surface portion. By adopting such a configuration, it is possible to prevent the identification mark of the push-up pot from being reflected through the film when imaging the semiconductor chip attached to the upper surface of the film from above. According to the above-described pickup device, it is possible to identify the push-up pot without causing problems in the operation of the pickup device.

  The present specification also discloses a push-up pot that is used to push up a semiconductor chip attached to the upper surface of a film from below in a pickup device. The push-up pot has an identification mark on the side surface.

The perspective view which shows typically the structure of the pick-up apparatus 2 of an Example. The perspective view which shows typically the structure of the semiconductor wafer 21 of an Example. The perspective view which shows typically the structure of the pushing-up pot 3 of an Example. FIG. 4 is a longitudinal sectional view showing a state in which the upper surface of the push-up pot 3 is in contact with the lower surface of the dicing sheet 23 in the pickup device 2 of the embodiment. FIG. 6 is a longitudinal sectional view showing a state in which the suction device 7 sucks the semiconductor chip 22 in the pickup device 2 of the embodiment. The side view which shows typically the structure which images the identification mark 33 of the push-up pot 3 with the imaging device 6 in the pick-up apparatus 2 of an Example. The side view which shows typically another structure which images the identification mark 33 of the pushing-up pot 3 with the imaging device 6 in the pick-up apparatus 2 of an Example. The side view which shows typically another structure which images the identification mark 33 of the pushing-up pot 3 with the imaging device 6 in the pick-up apparatus 2 of an Example.

  In the pickup device according to an embodiment, the identification mark is a two-dimensional code. With such a configuration, the push-up pot can be identified using a conventionally used two-dimensional code identification technique.

  The pickup device according to an embodiment further includes an imaging device for imaging the semiconductor chip attached to the upper surface of the film from above, and a polarizer capable of imaging the identification mark from the imaging device. Yes. With such a configuration, it is possible to take an image of the identification mark of the push-up pot by using an image pickup device for picking up an image of a semiconductor chip conventionally provided in the pickup device.

  The pickup device according to an embodiment further includes an imaging device for imaging the semiconductor chip attached to the upper surface of the film from above, and the side surface of the push-up pot directly from the imaging device. An inclined portion that can be imaged is formed, and the identification mark is attached to the inclined portion. With such a configuration, it is possible to take an image of the identification mark of the push-up pot by using an image pickup device for picking up an image of a semiconductor chip conventionally provided in the pickup device.

(Example)
Hereinafter, embodiments will be described with reference to the accompanying drawings. The pickup device 2 according to the embodiment is a device for picking up a target semiconductor chip from a plurality of semiconductor chips. As shown in FIG. 1, the pickup device 2 mainly includes a push-up pot 3 disposed below the semiconductor wafer 21, and an imaging device 6 and a suction device 7 disposed above the semiconductor wafer 21. The operation of each component of the pickup device 2 is controlled by a control device (not shown).

  As shown in FIG. 2, the semiconductor wafer 21 is diced and cut into a plurality of semiconductor chips 22. The semiconductor wafer 21 is attached to the upper surface of the dicing sheet 23. The semiconductor chip 22 is, for example, an IGBT or a MOSFET obtained by processing a semiconductor wafer 21 such as silicon. The plurality of semiconductor chips 22 are arranged on the dicing sheet 23 in an array when diced. The dicing sheet 23 is in the form of a film and is made of a thermoplastic resin such as PET. The dicing sheet 23 is supported by a support member (not shown) arranged around the dicing sheet 23.

  As shown in FIG. 1, the push-up pot 3 can be moved in the x, y, and z directions by the moving mechanism 9. The movement mechanism 9 includes a base 91, an x-direction movement table 92 disposed on the base 91, a y-direction movement table 93 disposed on the x-direction movement table 92, and a y-direction movement table 93. A z-direction moving mechanism 94 is provided. The x-direction moving table 92 can be moved relative to the base 91 in the x direction by the operation of a driving device (not shown). The y-direction moving table 93 can be moved relative to the x-direction moving table 92 in the y direction by the operation of a driving device (not shown). The z-direction moving mechanism 94 can be moved relative to the y-direction moving table 93 in the z direction by the operation of a driving device (not shown). The push-up pot 3 is supported by the z-direction moving mechanism 94.

  When the pickup device 2 picks up the semiconductor chip 22, the push-up pot 3 moves to a position directly below the semiconductor chip 22 to be picked up by driving the x-direction moving table 92 and the y-direction moving table 93. Thereafter, by driving the z-direction moving mechanism 94, the push-up pot 3 rises toward the dicing sheet 23 to which the semiconductor chip 22 is adhered, and the upper surface of the push-up pot 3 comes into contact with the lower surface of the dicing sheet 23. On the upper surface of the push-up pot 3, a mechanism for generating a negative pressure by sucking air is provided. With the upper surface of the push-up pot 3 in contact with the lower surface of the dicing sheet 23, a negative pressure is generated on the upper surface of the push-up pot 3, so that the lower surface of the dicing sheet 23 is in close contact with the upper surface of the push-up pot 3.

  As shown in FIGS. 3 to 5, a push-up pin 4 is accommodated in the push-up pot 3. As shown in FIGS. 4 and 5, a pin hole 41 is formed at the center of the upper surface of the push-up pot 3. The push-up pin 4 and the pin hole 41 are arranged coaxially, and the push-up pin 4 can protrude from the pin hole 41.

  The push-up pin 4 is a generally rod-shaped member and extends toward the semiconductor chip 22 along the vertical direction (z direction). The push-up pin 4 can be moved up and down relatively with respect to the push-up pot 3, and moves up and down by the operation of a driving device (not shown). As shown in FIG. 4, the push-up pin 4 pushes up the semiconductor chip 22 to be picked up by raising the push-up pin 4 in a state where the lower surface of the dicing sheet 23 is in close contact with the upper surface of the push-up pot 3. The semiconductor chip 22 to be picked up is pushed upward by the push-up pins 4 and peeled off from the dicing sheet 23.

  The imaging device 6 is configured to be able to image the semiconductor chip 22 attached to the upper surface of the dicing sheet 23 from above. As the imaging device 6, for example, a known CCD camera can be used. The imaging device 6 can move in the x, y, and z directions, respectively, and moves by the operation of a driving device (not shown). The imaging device 6 is disposed above the semiconductor chip 22 when imaging the semiconductor chip 22. The imaging device 6 images the semiconductor chip 22 to be picked up and acquires the image. A control device (not shown) processes the image picked up by the image pickup device 6 so that the position and posture of the semiconductor chip 22 to be picked up can be detected. Further, the imaging device 6 can be retracted from above the semiconductor chip 22 when the semiconductor chip 22 is not imaged.

  The adsorption device 7 adsorbs the semiconductor chip 22 by a negative pressure generated by air suction. For example, a known collet can be used as the adsorption device 7. The suction device 7 is movable in the x, y, and z directions, and is moved by the operation of a drive device (not shown). The suction device 7 is disposed above the semiconductor chip 22 when sucking the semiconductor chip 22. The suction device 7 sucks the semiconductor chip 22 pushed upward by the push-up pins 4 from above. Further, the suction device 7 can be retracted from above the semiconductor chip 22 when the semiconductor chip 22 is not sucked.

  Below, operation | movement of the pick-up apparatus 2 is demonstrated. When the dicing sheet 23 to which the semiconductor chip 22 is attached is set, the pickup device 2 moves the imaging device 6 above the semiconductor chip 22 to be picked up, and images the semiconductor chip 22 by the imaging device 6. Then, image processing of the semiconductor chip 22 is performed.

  The imaging device 6 retracts from above the semiconductor chip 22 after imaging the semiconductor chip 22. Instead of the imaging device 6, the suction device 7 moves and the suction device 7 is disposed above the semiconductor chip 22. Further, the push-up pot 3 is arranged below the semiconductor chip 22 by the moving mechanism 9. Further, by driving the moving mechanism 9, the push-up pot 3 rises and the upper surface of the push-up pot 3 comes into contact with the lower surface of the dicing sheet 23, and the upper surface of the push-up pot 3 and the lower surface of the dicing sheet 23 are brought into close contact by negative pressure.

  Thereafter, the pickup device 2 raises the push-up pin 4 of the push-up pot 3 and pushes up the semiconductor chip 22. As shown in FIG. 5, the pushed-up semiconductor chip 22 is sucked by the suction device 7 above the semiconductor chip 22.

  Hereinafter, identification of the push-up pot 3 in the pickup device 2 will be described. In the pickup device 2, the push-up pot 3 is imaged by the imaging device 6 in a state where the dicing sheet 23 to which the semiconductor chip 22 is stuck is not set, and the push-up pot 3 is identified. As shown in FIG. 6, an identification mark 33 is attached to the side surface portion of the push-up pot 3. The identification mark 33 includes information such as the type of the push-up pot 3 and the identification number of the push-up pot 3, for example. In the example shown in FIG. 6, the side surface portion of the push-up pot 3 is formed in a cylindrical surface shape, and an identification mark 33 is attached along the cylindrical surface. Further, a polarizer 34 that can image the identification mark 33 from the imaging device 6 is disposed on the side of the push-up pot 3. In the example shown in FIG. 6, the polarizer 34 is a mirror. In addition, as the polarizer 34, it is also possible to use other polarizers, such as a prism, instead of using a mirror. The imaging device 6 images the identification mark 33 via the polarizer 34 and performs image processing on the identification mark 33, whereby the push-up pot 3 currently used in the pickup device 2 can be identified.

  Note that, as shown in FIGS. 7 and 8, the pickup device 2 may be configured not to include the polarizer 34. In the embodiment shown in FIG. 7, a depression is formed in the side surface portion of the push-up pot 3, and the inclined surface 35 formed by this depression can be directly imaged from the imaging device 6. By attaching the identification mark 33 to the inclined surface 35, the identification mark 33 can be imaged from the imaging device 6 and recognized. In the embodiment shown in FIG. 8, a protruding portion is formed on the side surface portion of the push-up pot 3, and the inclined surface 36 formed by this protruding portion can be directly imaged from the imaging device 6. By attaching the identification mark 33 to the inclined surface 36, the identification mark 33 can be recognized by imaging the identification mark 33 from the imaging device 6.

  As described above, in the pickup device 2, the identification mark 33 is attached to the side surface instead of the upper surface of the push-up pot 3. As shown in FIG. 4, when the imaging device 6 images the semiconductor chip 22, the push-up pot 3 may be positioned in the vicinity of the dicing sheet 23. If the identification mark 33 is attached to the upper surface of the push-up pot 3, when the imaging device 6 images the semiconductor chip 22, the identification mark 33 of the push-up pot 3 is reflected through the dicing sheet 23, and the semiconductor There is a risk of erroneous recognition in the image processing of the chip 22. By attaching the identification mark 33 to the side surface portion of the push-up pot 3 as in the above embodiment, the identification mark 33 of the push-up pot 3 is passed over the dicing sheet 23 when the imaging device 6 images the semiconductor chip 22. It can be prevented from being reflected.

  The identification mark 33 may be applied to the push-up pot 3 by, for example, marking the identification mark 33 on a member that forms the side surface of the push-up pot 3, or the seal on which the identification mark 33 is drawn is placed on the push-up pot 3. You may affix on a side part.

  As the identification mark 33 attached to the push-up pot 3, various types of marks can be used. For example, a one-dimensional code such as a barcode may be used as the identification mark 33, or a two-dimensional code such as a QR code (registered trademark) may be used. Alternatively, as the identification mark 33, one or more geometric shapes, for example, a combination such as a circle, a triangle, or a square may be used.

  In the above-described embodiment, the configuration in which the identification mark 33 of the push-up pot 3 is imaged using the imaging device 6 for imaging the semiconductor chip 22 attached to the upper surface of the dicing sheet 23 has been described. Unlike this, an imaging device for imaging the identification mark 33 of the push-up pot 3 may be provided separately from the imaging device 6. In this case, an imaging device for imaging the identification mark 33 may be disposed on the side of the push-up pot 3.

  Representative and non-limiting specific examples of the present invention have been described in detail with reference to the drawings. This detailed description is intended merely to present those skilled in the art with the details for practicing the preferred embodiments of the present invention and is not intended to limit the scope of the invention. Also, the disclosed additional features and inventions can be used separately from or in conjunction with other features and inventions to provide further improved pick-up devices and push-up pots.

  Further, the combinations of features and steps disclosed in the above detailed description are not indispensable when practicing the present invention in the broadest sense, and are only for explaining representative specific examples of the present invention. It is described. Moreover, various features of the representative embodiments described above, as well as various features of what is recited in the claims, are described herein in providing additional and useful embodiments of the present invention. They do not have to be combined in the specific examples or in the order listed.

  All the features described in the specification and / or claims are described in the disclosure and the claims at the beginning of the application separately from the configuration of the features described in the embodiments and / or claims. It is intended that the specific details provided be disclosed separately and independently of one another. Further, all numerical ranges and descriptions regarding groups or groups are intended to disclose intermediate configurations thereof as a limitation to the specific matters described in the original disclosure and the claims.

  Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

Claims (5)

A pickup device including a push-up pot for pushing up a semiconductor chip attached to the upper surface of a film from below,
A pickup device in which an identification mark is attached to a side surface portion of the push-up pot.   2. The pickup device according to claim 1, wherein the identification mark is a two-dimensional code. An imaging device for imaging from above the semiconductor chip attached to the upper surface of the film;
The pickup device according to claim 1, further comprising a polarizer that enables imaging of the identification mark from the imaging device. It further comprises an imaging device for imaging from above the semiconductor chip attached to the upper surface of the film,
An inclined portion that can be directly imaged from the imaging device is formed on the side surface portion of the push-up pot,
The pickup device according to claim 1, wherein the identification mark is attached to the inclined portion. A push-up pot used to push up the semiconductor chip attached to the upper surface of the film from below in the pickup device,
A push-up pot with an identification mark on the side.

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