JPWO2015022900A1 - 電子機器、電子機器の制御方法、及び制御プログラム - Google Patents

電子機器、電子機器の制御方法、及び制御プログラム Download PDF

Info

Publication number
JPWO2015022900A1
JPWO2015022900A1 JP2015531789A JP2015531789A JPWO2015022900A1 JP WO2015022900 A1 JPWO2015022900 A1 JP WO2015022900A1 JP 2015531789 A JP2015531789 A JP 2015531789A JP 2015531789 A JP2015531789 A JP 2015531789A JP WO2015022900 A1 JPWO2015022900 A1 JP WO2015022900A1
Authority
JP
Japan
Prior art keywords
region
moving image
imaging
unit
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015531789A
Other languages
English (en)
Japanese (ja)
Inventor
聡志 土谷
聡志 土谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of JPWO2015022900A1 publication Critical patent/JPWO2015022900A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/63—Control of cameras or camera modules by using electronic viewfinders
    • H04N23/631—Graphical user interfaces [GUI] specially adapted for controlling image capture or setting capture parameters
    • H04N23/632—Graphical user interfaces [GUI] specially adapted for controlling image capture or setting capture parameters for displaying or modifying preview images prior to image capturing, e.g. variety of image resolutions or capturing parameters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/44—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/51—Control of the gain
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/53—Control of the integration time
    • H04N25/533—Control of the integration time by using differing integration times for different sensor regions
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/57—Control of the dynamic range
    • H04N25/58—Control of the dynamic range involving two or more exposures
    • H04N25/581—Control of the dynamic range involving two or more exposures acquired simultaneously
    • H04N25/583—Control of the dynamic range involving two or more exposures acquired simultaneously with different integration times
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/199—Back-illuminated image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/134—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on three different wavelength filter elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Human Computer Interaction (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2015531789A 2013-08-12 2014-08-07 電子機器、電子機器の制御方法、及び制御プログラム Pending JPWO2015022900A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013167308 2013-08-12
JP2013167308 2013-08-12
PCT/JP2014/070874 WO2015022900A1 (ja) 2013-08-12 2014-08-07 電子機器、電子機器の制御方法、及び制御プログラム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018196396A Division JP7063788B2 (ja) 2013-08-12 2018-10-18 電子機器

Publications (1)

Publication Number Publication Date
JPWO2015022900A1 true JPWO2015022900A1 (ja) 2017-03-02

Family

ID=52468286

Family Applications (5)

Application Number Title Priority Date Filing Date
JP2015531789A Pending JPWO2015022900A1 (ja) 2013-08-12 2014-08-07 電子機器、電子機器の制御方法、及び制御プログラム
JP2018196396A Active JP7063788B2 (ja) 2013-08-12 2018-10-18 電子機器
JP2020191181A Active JP7192843B2 (ja) 2013-08-12 2020-11-17 撮像素子及び電子機器
JP2022196223A Active JP7544116B2 (ja) 2013-08-12 2022-12-08 撮像素子及び撮像装置
JP2024139612A Pending JP2024159886A (ja) 2013-08-12 2024-08-21 撮像素子

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP2018196396A Active JP7063788B2 (ja) 2013-08-12 2018-10-18 電子機器
JP2020191181A Active JP7192843B2 (ja) 2013-08-12 2020-11-17 撮像素子及び電子機器
JP2022196223A Active JP7544116B2 (ja) 2013-08-12 2022-12-08 撮像素子及び撮像装置
JP2024139612A Pending JP2024159886A (ja) 2013-08-12 2024-08-21 撮像素子

Country Status (5)

Country Link
US (6) US10321083B2 (https=)
EP (1) EP3035667B1 (https=)
JP (5) JPWO2015022900A1 (https=)
CN (2) CN105474627B (https=)
WO (1) WO2015022900A1 (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3035667B1 (en) * 2013-08-12 2024-06-19 Nikon Corporation Electronic device
JP2015065270A (ja) * 2013-09-25 2015-04-09 ソニー株式会社 固体撮像装置およびその製造方法、並びに電子機器
JP6343163B2 (ja) * 2014-04-07 2018-06-13 キヤノン株式会社 集積回路装置
EP3358820B1 (en) * 2015-09-30 2021-06-09 Nikon Corporation Imaging device, image processing device and display device
JP6521085B2 (ja) * 2015-09-30 2019-05-29 株式会社ニコン 撮像装置、および制御装置
WO2017170716A1 (ja) * 2016-03-31 2017-10-05 株式会社ニコン 撮像装置、画像処理装置、および電子機器
WO2017170725A1 (ja) * 2016-03-31 2017-10-05 株式会社ニコン 撮像装置、被写体検出装置、および電子機器
JPWO2017170726A1 (ja) * 2016-03-31 2019-02-28 株式会社ニコン 撮像装置および電子機器
JPWO2017170718A1 (ja) * 2016-03-31 2019-02-28 株式会社ニコン 撮像装置、被写体検出装置、および電子機器
WO2017170723A1 (ja) 2016-03-31 2017-10-05 株式会社ニコン 撮像装置、画像処理装置、および電子機器
WO2017170719A1 (ja) * 2016-03-31 2017-10-05 株式会社ニコン 撮像装置、および電子機器
JP2017220892A (ja) * 2016-06-10 2017-12-14 オリンパス株式会社 画像処理装置及び画像処理方法
JP6808993B2 (ja) * 2016-06-17 2021-01-06 株式会社ニコン 撮像素子、電子機器、撮像方法、およびプログラム
JP6727998B2 (ja) * 2016-09-08 2020-07-22 キヤノン株式会社 画像処理装置、画像処理方法及びプログラム
CN109691079B (zh) 2016-09-16 2021-05-14 索尼半导体解决方案公司 成像装置和电子设备
JP6838725B2 (ja) * 2016-10-20 2021-03-03 日立Astemo株式会社 カメラ装置
CN106791471B (zh) * 2016-12-29 2021-07-20 宇龙计算机通信科技(深圳)有限公司 图像优化方法、图像优化装置和终端
KR102499033B1 (ko) * 2018-01-31 2023-02-13 삼성전자주식회사 스택형 이미지 센서 및 스택형 이미지 센서를 포함하는 전자 장치
JP7051565B2 (ja) * 2018-05-01 2022-04-11 キヤノン株式会社 撮像装置及びその制御方法、撮像システム
CN108711397A (zh) * 2018-08-13 2018-10-26 京东方科技集团股份有限公司 显示面板的光学调节方法、光学调节装置及显示装置
JP7004851B2 (ja) * 2018-12-26 2022-02-10 富士フイルム株式会社 撮像装置、撮像装置の画像データ処理方法、及びプログラム
CN110740272B (zh) * 2019-10-31 2021-05-14 Oppo广东移动通信有限公司 图像采集方法、摄像头组件及移动终端
JP7324866B2 (ja) * 2019-12-19 2023-08-10 富士フイルム株式会社 撮像装置
CN115552882A (zh) * 2020-05-28 2022-12-30 富士胶片株式会社 影像制作方法
JP7099560B2 (ja) * 2021-01-19 2022-07-12 株式会社ニコン 撮像素子及び撮像装置
JP2023013368A (ja) * 2021-07-16 2023-01-26 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
WO2023186529A1 (en) * 2022-03-31 2023-10-05 Sony Group Corporation Sensor device and method for operating a sensor device
JPWO2024009750A1 (https=) * 2022-07-06 2024-01-11
CN120937385A (zh) * 2023-03-28 2025-11-11 株式会社尼康 摄像元件及摄像装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007228019A (ja) * 2006-02-21 2007-09-06 Olympus Corp 撮像装置
JP2007295525A (ja) * 2006-03-27 2007-11-08 Seiko Epson Corp 撮像装置、撮像システム及び撮像方法
WO2012081175A1 (ja) * 2010-12-16 2012-06-21 パナソニック株式会社 画像生成装置、画像生成システム、方法、およびプログラム
JP2013084744A (ja) * 2011-10-07 2013-05-09 Sony Corp 固体撮像素子および電子機器

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09200617A (ja) 1996-01-12 1997-07-31 Nikon Corp 撮像装置
US7742088B2 (en) * 2002-11-19 2010-06-22 Fujifilm Corporation Image sensor and digital camera
JP2004282227A (ja) * 2003-03-13 2004-10-07 Seiko Epson Corp 光モジュール及びその製造方法並びに電子機器
KR100871688B1 (ko) * 2004-02-27 2008-12-08 삼성전자주식회사 고체 촬상 장치 및 그 구동 방법
JP4349232B2 (ja) 2004-07-30 2009-10-21 ソニー株式会社 半導体モジュール及びｍｏｓ型固体撮像装置
US8034109B2 (en) * 2005-02-24 2011-10-11 Morphogeny, Llc Linked slideable and interlockable rotatable components
CN1993749B (zh) * 2005-07-20 2011-06-15 柯尼卡美能达精密光学株式会社 光拾取装置以及光信息记录介质的记录·再现装置
CN101460917B (zh) * 2006-06-02 2011-09-28 三星电子株式会社 具有多分段背光的高动态对比度显示系统
JP4614925B2 (ja) * 2006-07-28 2011-01-19 三洋電機株式会社 画素情報読出方法および撮像装置
US7944482B2 (en) 2006-07-28 2011-05-17 Sanyo Electric Co., Ltd. Pixel information readout method and image pickup apparatus
KR101338353B1 (ko) * 2007-05-30 2013-12-06 삼성전자주식회사 영상 촬상 장치 및 방법
JP2010016621A (ja) 2008-07-03 2010-01-21 Sony Corp 画像データ処理装置と画像データ処理方法およびプログラムと記録媒体
US20100023173A1 (en) * 2008-07-24 2010-01-28 Wen Chen Wu Irrigation system and method
US8179466B2 (en) * 2009-03-11 2012-05-15 Eastman Kodak Company Capture of video with motion-speed determination and variable capture rate
JP5398341B2 (ja) * 2009-05-11 2014-01-29 キヤノン株式会社 物体認識装置及び物体認識方法
US8848802B2 (en) * 2009-09-04 2014-09-30 Stmicroelectronics International N.V. System and method for object based parametric video coding
JP5012875B2 (ja) * 2009-11-10 2012-08-29 富士通株式会社 高速動画像撮影装置、高速動画像撮影方法
KR20110076729A (ko) * 2009-12-18 2011-07-06 삼성전자주식회사 전자 셔터를 이용한 다단계 노출 이미지 획득 방법 및 이를 이용한 촬영 장치
JP2011205374A (ja) * 2010-03-25 2011-10-13 Fujifilm Corp 表示装置
JP2012080297A (ja) * 2010-09-30 2012-04-19 Fujifilm Corp 撮像装置及びその撮像制御方法
JP5653207B2 (ja) 2010-12-27 2015-01-14 アルパイン株式会社 消費電力制御システム
JP5696513B2 (ja) 2011-02-08 2015-04-08 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP2012175234A (ja) 2011-02-18 2012-09-10 Sony Corp 撮像装置、撮像素子、および撮像制御方法、並びにプログラム
AU2012255691B2 (en) * 2011-05-16 2016-12-08 Garrett Thermal Systems Limited Surveillance system
US8757274B2 (en) * 2011-07-01 2014-06-24 Halliburton Energy Services, Inc. Well tool actuator and isolation valve for use in drilling operations
JP2013016675A (ja) * 2011-07-05 2013-01-24 Sony Corp 固体撮像装置、電子機器、及び、固体撮像装置の製造方法
JP5686765B2 (ja) 2011-07-21 2015-03-18 キヤノン株式会社 撮像装置およびその制御方法
JP5791571B2 (ja) 2011-08-02 2015-10-07 キヤノン株式会社 撮像素子及び撮像装置
JP5809936B2 (ja) * 2011-11-08 2015-11-11 オリンパス株式会社 撮像装置
JP2013118492A (ja) * 2011-12-02 2013-06-13 Samsung Yokohama Research Institute Co Ltd 画像処理装置、撮像装置、及び画像処理方法
CN102999918B (zh) * 2012-04-19 2015-04-22 浙江工业大学 全景视频序列图像的多目标对象跟踪系统
BR112014027066A2 (pt) 2012-05-02 2017-06-27 Nikon Corp dispositivo de formação de imagem
EP3018893A4 (en) * 2013-07-04 2016-11-30 Nikon Corp ELECTRONIC DEVICE, CONTROL METHOD FOR ELECTRONIC DEVICE AND CONTROL PROGRAM
EP3035667B1 (en) 2013-08-12 2024-06-19 Nikon Corporation Electronic device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007228019A (ja) * 2006-02-21 2007-09-06 Olympus Corp 撮像装置
JP2007295525A (ja) * 2006-03-27 2007-11-08 Seiko Epson Corp 撮像装置、撮像システム及び撮像方法
WO2012081175A1 (ja) * 2010-12-16 2012-06-21 パナソニック株式会社 画像生成装置、画像生成システム、方法、およびプログラム
JP2013084744A (ja) * 2011-10-07 2013-05-09 Sony Corp 固体撮像素子および電子機器

Also Published As

Publication number Publication date
JP2024159886A (ja) 2024-11-08
US20160198115A1 (en) 2016-07-07
US20230388674A1 (en) 2023-11-30
EP3035667A1 (en) 2016-06-22
EP3035667A4 (en) 2017-03-22
CN110213508A (zh) 2019-09-06
WO2015022900A1 (ja) 2015-02-19
CN105474627A (zh) 2016-04-06
EP3035667B1 (en) 2024-06-19
JP2021036719A (ja) 2021-03-04
JP7063788B2 (ja) 2022-05-09
CN110213508B (zh) 2021-10-15
US11356629B2 (en) 2022-06-07
US10805566B2 (en) 2020-10-13
CN105474627B (zh) 2019-06-04
JP7544116B2 (ja) 2024-09-03
US11758303B2 (en) 2023-09-12
US10321083B2 (en) 2019-06-11
US20190253655A1 (en) 2019-08-15
US20200366862A1 (en) 2020-11-19
US12425708B2 (en) 2025-09-23
JP2019036988A (ja) 2019-03-07
JP7192843B2 (ja) 2022-12-20
US20250380042A1 (en) 2025-12-11
US20220264048A1 (en) 2022-08-18
JP2023024534A (ja) 2023-02-16

Similar Documents

Publication Publication Date Title
JP7544116B2 (ja) 撮像素子及び撮像装置
JP6372488B2 (ja) 電子機器
JP6075393B2 (ja) 電子機器及び制御プログラム
JP6375607B2 (ja) 電子機器、電子機器の制御方法、及び制御プログラム
JP6561428B2 (ja) 電子機器、制御方法、及び制御プログラム
JP7782752B2 (ja) 電子機器
JP6409883B2 (ja) 電子機器及び制御プログラム
JP7176591B2 (ja) 電子機器
JP2018148590A (ja) 電子機器、及び撮像素子
JP2018207504A (ja) 電子機器
JP2019092219A (ja) 撮像装置、撮像装置の制御方法、及び制御プログラム

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170327

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170327

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180403

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180508

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180821

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20190312