JPWO2015022889A1 - Electronic components - Google Patents

Abstract

It is an object of the present invention to provide an electronic component that can suppress an increase in temperature of an element while suppressing an increase in the size of the element. The coil (L) includes a parallel portion (20) configured by connecting two coil conductors arranged in the vertical direction in parallel, and a parallel configuration configured by connecting three coil conductors arranged in the vertical direction in parallel. A part (22) is provided. The ratio of the number of parallel parts (20) in the total of the number of parallel parts (20) and the number of parallel parts (22) in the region (A1) when viewed in plan from the right side is viewed in plan from the right side. Sometimes higher than the ratio of the number of parallel parts (20) in the total of the number of parallel parts (20) and the number of parallel parts (22) in the region (A2).

Description

  The present invention relates to an electronic component, and more particularly to a laminated coil component.

  As an invention related to a conventional electronic component, for example, an electronic component described in Patent Document 1 is known. The electronic component has a built-in coil formed by connecting a plurality of coil conductors with via-hole conductors. Further, two coil conductors adjacent in the stacking direction have the same shape and are connected in parallel by via-hole conductors. In the electronic component described in Patent Document 1 as described above, since the DC resistance value of the coil is small, heat generation in the coil is suppressed, and the temperature rise of the electronic component is suppressed.

  However, in the electronic component described in Patent Document 1, all the coil conductors are connected in parallel by two. Therefore, there has been a problem that the length of the electronic component in the stacking direction becomes long.

JP-A-11-260644 (FIG. 36)

  Therefore, an object of the present invention is to provide an electronic component that can suppress an increase in temperature of the element while suppressing an increase in size of the element.

  An electronic component according to an aspect of the present invention is a rectangular parallelepiped laminate formed by laminating a plurality of insulator layers in a laminating direction, and the outer edges of the plurality of insulator layers are continuously formed. A laminated body having a first side surface, and a coil provided in the laminated body, and a plurality of coil conductors connected by via-hole conductors penetrating the insulator layer, A spiral coil that proceeds in the stacking direction, at least a first external electrode provided on the first side surface, and provided on the other side in the stacking direction with respect to the first external electrode, and A second external electrode provided on at least the first side surface, and the coil is configured by connecting at least part of the m coil conductors arranged in the stacking direction in parallel. 1 parallel section, and A second parallel part configured by connecting at least a part of the n coil conductors arranged in the stacking direction in parallel, m and n are natural numbers, and n is larger than m, It occupies the total of the number of the first parallel parts and the number of the second parallel parts in the first region overlapping with the first external electrode when viewed from the normal direction of the first side surface The ratio of the number of the first parallel portions in the second region that does not overlap the first external electrode and the second external electrode when seen in a plan view from the normal direction of the first side surface It is characterized by being higher than the ratio of the number of the first parallel parts in the total of the number of the first parallel parts and the number of the second parallel parts.

  ADVANTAGE OF THE INVENTION According to this invention, the temperature rise of an element can be suppressed, suppressing the enlargement of an element.

It is an external appearance perspective view of an electronic component. It is a disassembled perspective view of the laminated body of an electronic component. FIG. 2 is a cross-sectional structural view taken along line AA of the electronic component in FIG. 1. It is a disassembled perspective view of the laminated body of the electronic component which concerns on 2nd Embodiment. It is a disassembled perspective view of the laminated body of the electronic component which concerns on 2nd Embodiment. FIG. 2 is a cross-sectional structural view taken along line AA of the electronic component in FIG. 1. FIG. 2 is a cross-sectional structural view taken along line AA of the electronic component in FIG. 1. It is an exploded perspective view of a part of a layered product of electronic parts concerning the 1st modification. It is an exploded perspective view of a part of a layered product of electronic parts concerning the 2nd modification.

(First embodiment)
(Configuration of electronic parts)
The configuration of the electronic component 10a according to the first embodiment will be described below with reference to the drawings. FIG. 1 is an external perspective view of the electronic components 10a to 10f. FIG. 2 is an exploded perspective view of the multilayer body 12 of the electronic component 10a. FIG. 3 is a sectional structural view taken along line AA of the electronic component 10a of FIG. In FIG. 3, hatching of the laminate 12 is omitted in order to prevent the drawing from becoming complicated. Hereinafter, the stacking direction is defined as the vertical direction, and the directions in which the two sides of the stacked body 12 extend when viewed from above are defined as the front-rear direction and the left-right direction.

  As shown in FIGS. 1 and 2, the electronic component 10a includes a multilayer body 12, external electrodes 14a and 14b, a coil L, and via-hole conductors v1 to v3 and v57 to v60.

  The laminated body 12 has a rectangular parallelepiped shape, and is configured by laminating insulator layers 16a to 16z and 16aa to 16nn in this order from the upper side to the lower side. The laminate 12 has an upper surface, a lower surface, a front surface, a back surface, a right surface, and a left surface. The insulator layers 16a to 16z and 16aa to 16nn have a rectangular shape as shown in FIG. 2, and are made of, for example, a magnetic material made of Ni—Cu—Zn based ferrite. Hereinafter, the upper surface of the insulator layers 16a to 16z and 16aa to 16nn is referred to as a front surface, and the lower surface of the insulator layers 16a to 16z and 16aa to 16nn is referred to as a back surface. The upper surface of the stacked body 12 is the surface of the insulator layer 16a. The lower surface of the stacked body 12 is the back surface of the insulating layer 16nn. The front surface, the back surface, the right surface, and the left surface of the laminate 12 are formed by connecting the outer edges of the insulator layers 16a to 16z and 16aa to 16nn.

  The external electrode 14a is provided across the upper surface and four side surfaces (front surface, back surface, right surface, and left surface) adjacent to the upper surface. That is, the external electrode 14a covers the entire upper surface and covers part of the four side surfaces. However, the external electrode 14a may be provided at least on the front surface.

  The external electrode 14b is provided below the external electrode 14a, and is provided across four side surfaces (front surface, back surface, right surface, and left surface) adjacent to the lower surface and the lower surface. That is, the external electrode 14b covers the entire lower surface and covers part of the four side surfaces. However, the external electrode 14b may be provided at least on the front surface.

  The coil L has a spiral shape that proceeds downward while rotating counterclockwise when viewed from above, and includes coil conductors 18a to 18z, 18aa to 18hh, and via-hole conductors v4 to v56. Yes. The coil conductors 18a to 18z, 18aa to 18hh and the via hole conductors v4 to v56 are made of, for example, a conductive material containing Ag as a main component.

  As shown in FIG. 2, the coil conductors 18a to 18z and 18aa to 18hh are overlapped with each other in a rectangular shape (annular) along the outer edges of the insulator layers 16a to 16z and 16aa to 16nn when viewed from above. A track R is formed. That is, the two left and right sides of the track R are parallel to the two left and right sides of the insulator layers 16a to 16z and 16aa to 16nn, and the two sides before and after the track R are insulating layer insulating. It is parallel to the two sides before and after the body layers 16a to 16z and 16aa to 16nn.

  The coil conductors 18a to 18z and 18aa to 18hh are linear conductors provided on the surfaces of the insulator layers 16d to 16z and 16aa to 16kk, respectively, and circulate counterclockwise. The coil conductors 18a to 18z and 18aa to 18hh have a length corresponding to ½ circumference. Specifically, the coil conductors 18a, 18b, 18e, 18f, 18i to 18k, 18o to 18q, 18u to 18w, 18aa, 18bb, 18ee, and 18ff overlap the left side and the rear side of the track R. Yes. The coil conductors 18c, 18d, 18g, 18h, 18l to 18n, 18r to 18t, 18x to 18z, 18cc, 18dd, 18gg, and 18hh overlap the right side and the front side of the track R. In the following, when the coil conductors 18a to 18z and 18aa to 18hh are viewed from above, the counterclockwise upstream end is referred to as an upstream end, and the counterclockwise downstream end is referred to as a downstream end. .

  The via-hole conductor v4 penetrates the insulator layer 16d in the vertical direction, and connects the upstream end of the coil conductor 18a and the upstream end of the coil conductor 18b. The via-hole conductor v5 penetrates the insulator layer 16d in the vertical direction, and connects the downstream end of the coil conductor 18a and the downstream end of the coil conductor 18b. Thereby, the two coil conductors 18a and 18b which are arranged in the vertical direction and have the same shape are connected in parallel to each other to form a parallel portion 20a.

  The via-hole conductor v6 penetrates the insulator layer 16e in the vertical direction, and connects the downstream end of the coil conductor 18b and the upstream end of the coil conductor 18c.

  The via-hole conductors v7 and v8 are connected in parallel to the coil conductors 18c and 18d, similarly to the via-hole conductors v4 and v5. Thereby, the coil conductors 18c and 18d constitute a parallel portion 20b.

  The via-hole conductor v9 passes through the insulating layer 16g in the vertical direction, and connects the downstream end of the coil conductor 18d and the upstream end of the coil conductor 18e.

  The via-hole conductors v10 and v11 are connected in parallel to the coil conductors 18e and 18f, similarly to the via-hole conductors v4 and v5. Thereby, the coil conductors 18e and 18f constitute a parallel portion 20c.

  The via-hole conductor v12 penetrates the insulator layer 16i in the vertical direction, and connects the downstream end of the coil conductor 18f and the upstream end of the coil conductor 18g.

  The via-hole conductors v13 and v14 are connected in parallel to the coil conductors 18g and 18h, similarly to the via-hole conductors v4 and v5. Thereby, the coil conductors 18g and 18h constitute a parallel portion 20d.

  The via-hole conductor v15 penetrates the insulating layer 16k in the vertical direction, and connects the downstream end of the coil conductor 18h and the upstream end of the coil conductor 18i.

  The via-hole conductor v16 passes through the insulating layer 161 in the vertical direction, and connects the upstream end of the coil conductor 18i and the upstream end of the coil conductor 18j. The via-hole conductor v17 penetrates the insulator layer 16l in the vertical direction and connects the downstream end of the coil conductor 18i and the downstream end of the coil conductor 18j. The via-hole conductor v18 passes through the insulator layer 16m in the vertical direction, and connects the upstream end of the coil conductor 18j and the upstream end of the coil conductor 18k. The via-hole conductor v19 passes through the insulating layer 16m in the vertical direction, and connects the downstream end of the coil conductor 18j and the downstream end of the coil conductor 18k. Thus, the three coil conductors 18i, the coil conductors 18j, and the coil conductors 18k that are arranged in the vertical direction and have the same shape are connected in parallel to each other to form a parallel portion 22a.

  The via-hole conductor v20 penetrates the insulator layer 16n in the vertical direction, and connects the downstream end of the coil conductor 18k and the upstream end of the coil conductor 18l.

  The via-hole conductors v21 to v24 connect the coil conductors 18l, 18m, and 18n in parallel as in the via-hole conductors v16 to v19. Thereby, the coil conductors 18l, 18m, and 18n constitute the parallel portion 22b.

  The via-hole conductor v25 penetrates the insulator layer 16q in the vertical direction, and connects the downstream end of the coil conductor 18n and the upstream end of the coil conductor 18o.

  The via-hole conductors v26 to v29 connect the coil conductors 18o, 18p, and 18q in parallel as in the via-hole conductors v16 to v19. Thereby, the coil conductors 18o, 18p, and 18q constitute a parallel portion 22c.

  The via-hole conductor v30 penetrates the insulating layer 16t in the vertical direction, and connects the downstream end of the coil conductor 18q and the upstream end of the coil conductor 18r.

  The via-hole conductors v31 to v34 connect the coil conductors 18r, 18s, and 18t in parallel in the same manner as the via-hole conductors v16 to v19. Thereby, the coil conductors 18r, 18s, and 18t constitute a parallel portion 22d.

  The via-hole conductor v35 penetrates the insulator layer 16w in the vertical direction, and connects the downstream end of the coil conductor 18t and the upstream end of the coil conductor 18u.

  The via-hole conductors v36 to v39 connect the coil conductors 18u, 18v, and 18w in parallel as in the via-hole conductors v16 to v19. Thereby, the coil conductors 18u, 18v, and 18w constitute a parallel portion 22e.

  The via-hole conductor v40 passes through the insulating layer 16z in the vertical direction, and connects the downstream end of the coil conductor 18w and the upstream end of the coil conductor 18x.

  The via-hole conductors v41 to v44 connect the coil conductors 18x, 18y, and 18z in parallel as in the via-hole conductors v16 to v19. Thereby, the coil conductors 18x, 18y, and 18z constitute a parallel portion 22f.

  The via-hole conductor v45 passes through the insulating layer 16cc in the vertical direction, and connects the downstream end of the coil conductor 18z and the upstream end of the coil conductor 18aa.

  The via-hole conductor v46 passes through the insulator layer 16dd in the vertical direction, and connects the upstream end of the coil conductor 18aa and the upstream end of the coil conductor 18bb. The via-hole conductor v47 penetrates the insulating layer 16dd in the vertical direction, and connects the downstream end of the coil conductor 18aa and the downstream end of the coil conductor 18bb. Thus, the two coil conductors 18aa and 18bb having the same shape arranged in the vertical direction are connected in parallel to each other to form a parallel portion 20e.

  The via-hole conductor v48 passes through the insulating layer 16ee in the vertical direction, and connects the downstream end of the coil conductor 18bb and the upstream end of the coil conductor 18cc.

  The via-hole conductors v49 and v50 are connected in parallel with the coil conductors 18cc and 18dd, similarly to the via-hole conductors v46 and v47. Thus, the coil conductors 18cc and 18dd constitute a parallel portion 20f.

  The via-hole conductor v51 passes through the insulator layer 16gg in the vertical direction, and connects the downstream end of the coil conductor 18dd and the upstream end of the coil conductor 18ee.

  The via-hole conductors v52 and v53 are connected in parallel with the coil conductors 18ee and 18ff, similarly to the via-hole conductors v46 and v47. Thereby, the coil conductors 18ee and 18ff constitute a parallel portion 20g.

  The via-hole conductor v54 penetrates the insulator layer 16ii in the vertical direction, and connects the downstream end of the coil conductor 18ff and the upstream end of the coil conductor 18gg.

  The via-hole conductors v55 and v56 are connected in parallel with the coil conductors 18gg and 18hh, similarly to the via-hole conductors v46 and v47. Thereby, the coil conductors 18gg and 18hh constitute a parallel portion 20h.

  As described above, the coil L is provided with the parallel portions 20a to 20h and 22a to 22f. Below, the parallel parts 20a-20h and 22a-22f may be named generically, and the parallel parts 20 and 22 may be called.

  The via-hole conductors v1 to v3 respectively penetrate the insulator layers 16a to 16c in the vertical direction and are connected to each other to constitute one via-hole conductor. The via-hole conductors v1 to v3 connect the external electrode 14a and the upstream end of the coil conductor 18a.

  The via-hole conductors v57 to v60 respectively penetrate the insulator layers 16kk to 16nn in the vertical direction, and are connected to each other to constitute one via-hole conductor. The via-hole conductors v57 to v60 connect the external electrode 14b and the downstream end of the coil conductor 18hh.

  In the electronic component 10a configured as described above, as shown in FIG. 3, regions overlapping the external electrodes 14a and 14b when viewed in plan from the front side (normal direction of the front surface) are defined as regions A1 and A3, respectively. . In addition, a region that does not overlap the external electrodes 14a and 14b when viewed from the front is defined as a region A2. Here, the region overlapping the external electrode 14a when viewed from the front side is a region from the upper surface of the multilayer body 12 to the lower end of the portion of the external electrode 14a that is folded back to the front, back, right, and left surfaces. is there. Further, the region overlapping with the external electrode 14b when viewed in plan from the front side is a region from the lower surface of the multilayer body 12 to the upper end of the portion of the external electrode 14b that is folded back to the front surface, the back surface, the right surface, and the left surface. .

  In the region A1, the number of parallel parts 20 is larger than the number of parallel parts 22, and the number of coil conductors constituting the parallel part 20 is larger than the number of coil conductors constituting the parallel part 22. In this embodiment, the coil L is comprised only by the parallel part 20 in area | region A1.

  In the region A3, the number of parallel parts 20 is larger than the number of parallel parts 22, and the number of coil conductors constituting the parallel part 20 is larger than the number of coil conductors constituting the parallel part 22. In this embodiment, the coil L is comprised only by the parallel part 20 in area | region A3.

  On the other hand, in the region A2, the number of parallel parts 22 is larger than the number of parallel parts 20, and the number of coil conductors constituting the parallel part 22 is larger than the number of coil conductors constituting the parallel part 20. In the present embodiment, the coil L is composed of two parallel portions 20 and six parallel portions 22, and specifically, is composed of parallel portions 20d, 20e, and 22a to 22f in the region A2. Therefore, the region A2 includes four coil conductors that constitute the parallel portions 20d and 20e, and 18 coil conductors that constitute the parallel portions 22a to 22f.

  In the areas A1 to A3, the parallel parts 20 and 22 are arranged as described above, so that the first of the number of parallel parts 20 occupying the total of the number of parallel parts 20 and the number of parallel parts 22 in the area A1. The ratio is higher than the second ratio of the number of parallel parts 20 in the total of the number of parallel parts 20 and the number of parallel parts 22 in the region A2. In the present embodiment, the first ratio is 1 (= 3/3), and the second ratio is 0.25 (= 2/8). Further, the third ratio of the number of parallel parts 20 in the total of the number of parallel parts 20 and the number of parallel parts 22 in the area A3 is the number of parallel parts 20 and the number of parallel parts 22 in the area A2. It is higher than the 2nd ratio of the number of the parallel parts 20 which occupies for the sum total. In the present embodiment, the third ratio is 1 (= 3/3), and the second ratio is 0.25 (= 2/8).

(Method for manufacturing electronic parts)
A method for manufacturing the electronic component 10a configured as described above will be described with reference to the drawings.

First, ceramic green sheets to be the insulator layers 16a to 16z and 16aa to 16nn shown in FIG. 2 are formed. Specifically, ferric oxide (Fe ₂ O ₃ ), zinc oxide (ZnO), copper oxide (CuO), and nickel oxide (NiO) were weighed at a predetermined ratio, and each material was put into a ball mill as a raw material. Wet preparation. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

  A binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material, and a dispersing agent are added to the ferrite ceramic powder, followed by mixing with a ball mill, and then defoaming is performed under reduced pressure. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce ceramic green sheets to be the insulator layers 16a to 16z and 16aa to 16nn.

  Next, the via-hole conductors v1 to v60 are formed on the ceramic green sheets to be the insulator layers 16a to 16z and 16aa to 16nn, respectively. Specifically, via holes are formed by irradiating the ceramic green sheets to be the insulator layers 16a to 16z and 16aa to 16nn with a laser beam. Next, the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.

  Next, coil conductors 18a to 18z and 18aa to 18hh are formed on the ceramic green sheets to be the insulator layers 16d to 16z and 16aa to 16kk. Specifically, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied to the ceramic green sheets to be the insulator layers 16d to 16z and 16aa to 16kk by a screen printing method or a photo. Coil conductors 18a to 18z and 18aa to 18hh are formed by application by a method such as lithography. Note that the step of forming the coil conductors 18a to 18z and 18aa to 18hh and the step of filling the via hole with the conductive paste may be performed in the same step.

  Next, as shown in FIG. 2, ceramic green sheets to be the insulator layers 16 a to 16 z and 16 aa to 16 nn are arranged in this order and stacked and pressure bonded. The ceramic green sheets to be the ceramic green sheets to be the insulator layers 16a to 16z and 16aa to 16nn are laminated and pressure-bonded one by one and temporarily bonded, and then the unfired mother laminated body is hydrostatically pressed. The pressure is applied by pressure to perform main pressure bonding. Thereby, an unfired mother laminated body is obtained.

  Next, the mother laminated body is cut into a laminated body 12 having a predetermined size with a cutting blade. Thereby, the unfired laminated body 12 is obtained. The unbaked laminate 12 is subjected to binder removal processing and baking. The binder removal treatment is performed, for example, in a low oxygen atmosphere at 500 ° C. for 2 hours. Firing is performed, for example, under conditions of 870 ° C. to 900 ° C. for 2.5 hours.

  Next, the laminated body 12 is barrel-processed and chamfered. Thereafter, an electrode paste whose main component is silver is applied and baked on the surface of the laminate 12 by, for example, a dipping method or the like, thereby forming silver electrodes to be the external electrodes 14a and 14b. The silver electrode is baked at 800 ° C. for 1 hour.

  Finally, external electrodes 14a and 14b are formed by performing Ni plating and Sn plating on the surface of the silver electrode. Through the above steps, an electronic component 10a as shown in FIG. 1 is completed.

(effect)
According to the electronic component 10a configured as described above, an increase in the temperature of the element can be suppressed while suppressing an increase in the size of the element. More specifically, in the electronic component described in Patent Literature 1, all the coil conductors are connected in parallel by two. Thus, when all the coil conductors are connected in parallel by the same number, the temperature rise of the electronic component can be suppressed, but the length of the electronic component in the stacking direction becomes long.

  Therefore, in the electronic component 10a, in the regions A1 and A3 where heat dissipation is relatively high, priority is given to suppression of the increase in size of the element over suppression of temperature rise of the device, and in the region A2 where heat dissipation is relatively low, the size of the element is large. Priority is given to suppression of the temperature rise of an element rather than suppression of crystallization. More specifically, the regions A1 and A3 are regions that overlap the external electrodes 14a and 14b when viewed from the front side. The region A2 is a region that does not overlap the external electrodes 14a and 14b when viewed from the front side. Since the external electrodes 14a and 14b are generally made of metal, they have high heat dissipation. Therefore, in the electronic component 10a, the heat dissipation in the regions A1 and A3 is higher than the heat dissipation in the region A2.

  In addition, three coil conductors are connected in parallel in the parallel portions 22a to 22f, and two coil conductors are connected in parallel in the parallel portions 20a to 20h. Therefore, the DC resistance value in the parallel portions 22a to 22f is smaller than the DC resistance value in the parallel portions 20a to 20h. That is, the heat generation amount in the parallel portions 22a to 22f is smaller than the heat generation amount in the parallel portions 20a to 20h.

  Moreover, in the parallel parts 20a-20h, two coil conductors are connected in parallel, and in the parallel parts 22a-22f, three coil conductors are connected in parallel. Therefore, the vertical width of the parallel portions 20a to 20h is smaller than the vertical width of the parallel portions 22a to 22f. Thus, in the parallel part 20, priority is given to suppression of the enlargement of an element rather than suppression of the temperature rise of an element. In the parallel part 22, priority is given to suppression of the temperature rise of an element rather than suppression of the enlargement of an element.

  Therefore, in the electronic component 10a, the first ratio of the number of parallel parts 20 in the total of the number of parallel parts 20 and the number of parallel parts 22 in the area A1 is parallel to the number of parallel parts 20 in the area A2. It is higher than the second ratio of the number of parallel parts 20 in the total with the number of parts 22. Furthermore, the third ratio of the number of parallel parts 20 in the total of the number of parallel parts 20 and the number of parallel parts 22 in the area A3 is the number of parallel parts 20 and the number of parallel parts 22 in the area A2. It is higher than the 2nd ratio of the number of the parallel parts 20 which occupies for the sum total.

Thereby, in area | region A1, A3, since the ratio of the parallel part 20 becomes relatively high, priority is given to suppression of the enlargement of an element rather than suppression of the temperature rise of an element, and in area | region A2, the ratio of the parallel part 20 is relative. Therefore, the suppression of the temperature rise of the element is prioritized over the suppression of the enlargement of the element. As described above, according to the characteristics of the regions A1 to A3 of the multilayer body 12, in the electronic component 10a, priority is given to either suppression of element enlargement or suppression of element temperature rise in each of the regions A1 to A3. ing.

  Moreover, in the electronic component 10a, the impedance of the coil L can be adjusted by adjusting the number of parallel parts 20a-20h and the number of parallel parts 22a-22f. Specifically, the impedance of the coil L can be increased by increasing the number of parallel parts 20a to 20h or decreasing the number of parallel parts 22a to 22h. Moreover, the impedance of the coil L can be made low by decreasing the number of parallel parts 20a-20h or increasing the number of parallel parts 22a-22h.

(Computer simulation)
The inventor of the present application performed a computer simulation described below in order to clarify the effect of the electronic component 10a. More specifically, a first model having the structure shown in FIG. 2 was created, and a second model having a structure in which the parallel part 20 and the parallel part 22 in FIG. 2 were interchanged was created. That is, in the second model, the parallel portion 20 in which two coil conductors are connected in parallel is sandwiched from above and below by the parallel portion 22 in which three coil conductors are connected in parallel. In addition, a third model in which all the coils are configured by the parallel part 20 is created, and a fourth model in which all the coils are configured by the parallel part 22 is created. The conditions of the first model to the fourth model are described below. In the first model to the fourth model, the number of turns of the coil is 16 turns. Further, the length in the left-right direction and the length in the front-rear direction of the first model to the fourth model are 0.5 mm. The shapes and dimensions of the external electrodes 14a and 14b of the first model to the fourth model are the same.

Number of turns of the parallel part 20 on the upper side of the first model: Number of coil conductors of the parallel part 20 on the upper side of 4 turns: Number of turns of the parallel part 22: Number of coil conductors of the 8-turn parallel part 22: Parallel on the lower side of 48 turns Number of turns of section 20: Number of coil conductors of parallel section 20 on the lower side of 4 turns: 16

Number of turns of the parallel part 22 on the upper side of the second model: Number of coil conductors of the parallel part 22 on the upper side of 4 turns: Number of turns of the parallel part 20: Number of coil conductors of the 8-turn parallel part 20: Parallel on the lower side of 32 turns Number of turns of section 22: Number of coil conductors of parallel section 222h on the lower side of 4 turns: 24

Number of turns of third model parallel part 20: Number of coil conductors of 16-turn parallel part 20: 32

Number of turns of the fourth model parallel part 22: Number of coil conductors of the parallel part 22 on the upper side by 16 turns: 48

  The inventor of the present application calculated the vertical lengths of the first to fourth models as described above. In addition, the inventor of the present application caused the computer to calculate the temperature rise when a current of 1.3 A was passed for the first model to the fourth model. Table 1 is a table showing simulation results. Table 1 shows values obtained by dividing the temperature rise, vertical length, inductance value, and temperature rise of the first to fourth models by the inductance value. The temperature rise is based on the temperature rise of the second model (100). The value obtained by dividing the temperature rise by the inductance value is also based on the value obtained by dividing the temperature rise of the second model by the inductance value (100).

  According to Table 1, the 3rd model is comprised only with the parallel part 20 with a large emitted-heat amount and the small width | variety of an up-down direction. For this reason, in the third model, it can be seen that the temperature rise is increased instead of the length in the vertical direction being shortened. On the other hand, the fourth model is composed of only the parallel portions 22 that generate a small amount of heat and have a large vertical width. Therefore, it can be seen that in the fourth model, the length in the vertical direction is increased instead of the decrease in temperature.

  Therefore, in the first model and the second model, the coil includes the parallel part 20 and the parallel part 22. As a result, the temperature rises of the first model and the second model are both lower than the temperature rise of the third model and higher than the temperature rise of the fourth model. In addition, the vertical lengths of the first model and the second model were longer than the vertical length of the third model and shorter than the vertical length of the fourth model. That is, in the first model and the second model, the suppression of the increase in the size of the element and the suppression of the temperature rise of the element can be balanced as compared with the third model and the fourth model.

  Next, the first model and the second model are compared. The vertical length of the first model is equal to the vertical length of the second model. However, the temperature rise of the first model is smaller than the temperature rise of the second model. Therefore, the parallel parts 20 and 22 are not simply mixed and arranged as in the second model, but the parallel parts 20 and 22 according to the characteristics of the regions A1 to A3 as in the first model. By arranging, in the first model, it is understood that the temperature rise of the element can be suppressed while maintaining the length in the vertical direction. For the above reasons, in the first model, both suppression of the increase in size of the element and suppression of increase in the temperature of the element are more effectively achieved than in the second model.

  Further, according to Table 1, the first model was the smallest with respect to the value obtained by dividing the temperature rise by the inductance value. Therefore, it can be seen that the first model effectively suppresses the temperature rise of the element per 1 μH (per unit inductance value).

(Second Embodiment)
Below, the structure of the electronic component 10b which concerns on 2nd Embodiment is demonstrated, referring drawings. 4A and 4B are exploded perspective views of the multilayer body 12 of the electronic component 10b according to the second embodiment. FIG. 1 is used as an external perspective view of the electronic component 10b.

  As shown in FIGS. 4A and 4B, the electronic component 10b includes a multilayer body 12, external electrodes 14a and 14b, a coil L, and via-hole conductors v1 to v3 and v74 to v77.

  The laminated body 12 has a rectangular parallelepiped shape, and as shown in FIGS. 4A and 4B, the insulating layers 16a to 16z and 16aa to 16mm are laminated in this order from the upper side to the lower side. Since the laminate 12 and the insulator layers 16a to 16z and 16aa to 16mm of the electronic component 10b are the same as the laminate 12 and the insulator layers 16a to 16z and 16aa to 16nn of the electronic component 10a, the description thereof is omitted. Further, since the external electrodes 14a and 14b of the electronic component 10b are the same as the external electrodes 14a and 14b of the electronic component 10a, description thereof is omitted.

  The coil L has a spiral shape that travels downward while rotating counterclockwise when viewed from above, and includes coil conductors 18a to 18z, 18aa to 18gg, and via-hole conductors v4 to v73. Yes. The coil conductors 18a to 18z and 18aa to 18gg and the via hole conductors v4 to v73 are made of, for example, a conductive material containing Ag as a main component.

  As shown in FIG. 2, the coil conductors 18a to 18z and 18aa to 18gg overlap each other in a rectangular shape (annular) along the outer edges of the insulator layers 16a to 16z and 16aa to 16mm, as shown in FIG. A track R is formed. That is, the two right and left sides of the track R are parallel to the two left and right sides of the insulator layers 16a to 16z and 16aa to 16 mm, and the two sides before and after the track R are insulating layer insulating. It is parallel to the two sides before and after the body layers 16a to 16z and 16aa to 16mm.

  The coil conductors 18a to 18z and 18aa to 18gg are linear conductors provided on the surfaces of the insulator layers 16d to 16z and 16aa to 16jj, respectively, and circulate counterclockwise. Each of the coil conductors 18a to 18z and 18aa to 18gg has a length corresponding to a half circumference, and the coil portions 18a-1 to 18z-1, 18aa-1 to 18gg-1 and the coil portions 18a-2 to 18z-2, 18aa-2 to 18gg-2.

  Coil portions 18a-1, 18d-2, 18e-1, 18h-2, 18i-1, 18j-1, 18n-2, 18o-1, 18p-1, 18t-2, 18u-1, 18v-1, 18z-2, 18aa-1, 18dd-2, and 18ee-1 overlap with the rear side of the track R. Coil portions 18a-2, 18b-1, 18e-2, 18f-1, 18i-2, 18j-2, 18k-1, 18o-2, 18p-2, 18q-1, 18u-2, 18v-2, 18w-1, 18aa-2, 18bb-1, 18ee-2, 18ff-1 overlap the left side of the trajectory R. Coil portions 18b-2, 18c-1, 18f-2, 18g-1, 18k-2, 18l-1, 18m-1, 18q-2, 18r-1, 18s-1, 18w-2, 18x-1, 18y-1, 18bb-2, 18cc-1, 18ff-2, and 18gg-1 overlap the front side of the track R. Coil portions 18c-2, 18d-1, 18g-2, 18h-1, 18l-2, 18m-2, 18n-1, 18r-2, 18s-2, 18t-1, 18x-2, 18y-2, 18z-1, 18cc-2, 18dd-1, and 18gg-2 overlap the right side of the track R. In the following, when the coil conductors 18a to 18z and 18aa to 18gg are viewed from above, the counterclockwise upstream end is referred to as an upstream end, and the counterclockwise downstream end is referred to as a downstream end. .

  The via-hole conductor v4 passes through the insulating layer 16d in the vertical direction, and connects the downstream end of the coil portion 18a-1, the upstream end of the coil portion 18a-2, and the upstream end of the coil portion 18b-1. . The via-hole conductor v5 penetrates the insulator layer 16d in the vertical direction, and connects the downstream end of the coil portion 18a-2 to the downstream end of the coil portion 18b-1 and the upstream end of the coil portion 18b-2. . Thereby, the two coil parts 18a-2 and coil part 18b-1 which are located in a line up and down are mutually connected in parallel, and comprise the parallel part 20a.

  The via-hole conductors v6 and v7 connect the coil portions 18b-2 and 18c-1 in parallel in the same manner as the via-hole conductors v4 and v5. Thereby, coil part 18b-2, 18c-1 comprises the parallel part 20b.

  The via-hole conductors v8 and v9 connect the coil portions 18c-2 and 18d-1 in parallel in the same manner as the via-hole conductors v4 and v5. Thereby, coil part 18c-2, 18d-1 comprises the parallel part 20c.

  The via-hole conductors v10 and v11 connect the coil portions 18d-2 and 18e-1 in parallel as in the via-hole conductors v4 and v5. Thereby, coil part 18d-2 and 18e-1 comprise the parallel part 20d.

  The via-hole conductors v12 and v13 connect the coil portions 18e-2 and 18f-1 in parallel in the same manner as the via-hole conductors v4 and v5. Thereby, coil part 18e-2 and 18f-1 comprise the parallel part 20e.

  The via-hole conductors v14 and v15 connect the coil portions 18f-2 and 18g-1 in parallel as in the via-hole conductors v4 and v5. Thereby, coil part 18f-2, 18g-1 comprises the parallel part 20f.

  The via-hole conductors v16 and v17 connect the coil portions 18g-2 and 18h-1 in parallel in the same manner as the via-hole conductors v4 and v5. Thereby, coil part 18g-2, 18h-1 comprises the parallel part 20g.

  The via-hole conductor v18 passes through the insulating layer 16k in the vertical direction, and connects the downstream end of the coil portion 18h-1, the upstream end of the coil portion 18h-2, and the upstream end of the coil portion 18i-1. . The via-hole conductor v19 passes through the insulating layer 16k in the vertical direction, and connects the downstream end of the coil portion 18h-2 to the downstream end of the coil portion 18i-1 and the upstream end of the coil portion 18i-2. . The via-hole conductor v20 passes through the insulating layer 16l in the vertical direction, and connects the upstream end of the coil portion 18i-1 and the upstream end of the coil portion 18j-1. The via-hole conductor v21 penetrates the insulating layer 16l in the vertical direction, and the downstream end of the coil part 18i-1, the upstream end of the coil part 18i-2, the downstream end of the coil part 18j-1, and the coil part 18j-2. Is connected to the upstream end. As a result, the three coil portions 18h-2, the coil portion 18i-1, and the coil portion 18j-1 arranged in the vertical direction are connected in parallel to each other to form a parallel portion 22a.

  The via-hole conductors v21 to v24 connect the coil portions 18i-2, 18j-2, and 18k-1 in parallel as in the via-hole conductors v18 to v21. Thereby, coil part 18i-2, 18j-2, 18k-1 comprises the parallel part 22b.

  The via-hole conductors v25 to v28 connect the coil portions 18k-2, 18l-1, and 18m-1 in parallel as in the via-hole conductors v18 to v21. Thereby, coil part 18k-2, 18l-1, 18m-1 comprises the parallel part 22c.

  The via-hole conductors v28 to v31 connect the coil portions 18l-2, 18m-2, and 18n-1 in parallel as in the via-hole conductors v18 to v21. Thereby, coil part 181-2, 18m-2, 18n-1 comprises the parallel part 22d.

  The via-hole conductors v32 to v35 connect the coil portions 18n-2, 18o-1, and 18p-1 in parallel as in the via-hole conductors v18 to v21. Thereby, coil part 18n-2, 18o-1, 18n-1 comprises the parallel part 22e.

  The via-hole conductors v35 to v38 connect the coil portions 18o-2, 18p-2, and 18q-1 in parallel in the same manner as the via-hole conductors v18 to v21. Thereby, coil part 18o-2, 18p-2, 18q-1 comprises the parallel part 22f.

  The via-hole conductors v39 to v42 connect the coil portions 18q-2, 18r-1, and 18s-1 in parallel in the same manner as the via-hole conductors v18 to v21. Thereby, coil part 18q-2, 18r-1, 18s-1 comprises the parallel part 22g.

  The via-hole conductors v42 to v45 connect the coil portions 18r-2, 18s-2, and 18t-1 in parallel as in the via-hole conductors v18 to v21. Thereby, coil part 18r-2, 18s-2, 18t-1 comprises the parallel part 22h.

  The via-hole conductors v46 to v49 connect the coil portions 18t-2, 18u-1, and 18v-1 in parallel as in the via-hole conductors v18 to v21. Thereby, coil part 18t-2, 18u-1, 18t-1 comprises the parallel part 22i.

  The via-hole conductors v49 to v52 connect the coil portions 18u-2, 18v-2, and 18w-1 in parallel as in the via-hole conductors v18 to v21. Thereby, coil part 18u-2, 18v-2, 18w-1 comprises the parallel part 22j.

  The via-hole conductors v53 to v56 connect the coil portions 18w-2, 18x-1, and 18y-1 in parallel as in the via-hole conductors v18 to v21. Thereby, coil part 18w-2, 18x-1, 18y-1 comprises the parallel part 22k.

  The via-hole conductors v56 to v59 connect the coil portions 18x-2, 18y-2, and 18z-1 in parallel as in the via-hole conductors v18 to v21. Thereby, coil part 18x-2, 18y-2, 18z-1 comprises the parallel part 22l.

  The via-hole conductor v60 penetrates the insulator layer 16cc in the vertical direction, and connects the downstream end of the coil portion 18z-1 and the upstream end of the coil portion 18z-2 and the upstream end of the coil portion 18aa-1. . The via-hole conductor v61 passes through the insulating layer 16cc in the vertical direction, and connects the downstream end of the coil portion 18z-2 to the downstream end of the coil portion 18aa-1 and the upstream end of the coil portion 18aa-2. . Thereby, the two coil parts 18z-2 and coil part 18aa-1 which are located in a line up and down are mutually connected in parallel, and comprise the parallel part 20h.

  The via-hole conductors v62 and v63 connect the coil portions 18aa-2 and 18bb-1 in parallel as in the via-hole conductors v60 and v61. Thereby, coil part 18aa-2, 18bb-1 comprises the parallel part 20i.

  The via-hole conductors v64 and v65 connect the coil portions 18bb-2 and 18cc-1 in parallel as in the via-hole conductors v60 and v61. Thereby, coil part 18bb-2 and 18cc-1 comprise the parallel part 20j.

  The via-hole conductors v66 and v67 connect the coil portions 18cc-2 and 18dd-1 in parallel as in the via-hole conductors v60 and v61. Thereby, coil part 18cc-2, 18dd-1 comprises the parallel part 20k.

  The via-hole conductors v68 and v69 connect the coil portions 18dd-2 and 18ee-1 in parallel as in the via-hole conductors v60 and v61. Thereby, coil part 18dd-2 and 18ee-1 comprise the parallel part 20l.

  The via-hole conductors v70 and v71 are connected in parallel to the coil portions 18ee-2 and 18ff-1 similarly to the via-hole conductors v60 and v61. Thereby, coil part 18ee-2 and 18ff-1 comprise the parallel part 20m.

  The via-hole conductors v72 and v73 are connected in parallel to the coil portions 18ff-2 and 18gg-1 similarly to the via-hole conductors v60 and v61. Thereby, coil part 18ff-2, 18gg-1 comprises 20 n of parallel parts.

  As described above, the coil L is provided with the parallel portions 20a to 20n and 22a to 22l. And in parallel part 20a-20n, a part (coil part) of the two coil conductors located in a line with the up-down direction is connected in parallel. In parallel parts 22a-22l, a part (coil part) of three coil conductors arranged in the up-and-down direction is connected in parallel. In addition, coil conductors corresponding to the parallel portions 20a to 20n and 22a to 22l do not overlap in portions other than the coil portions connected in parallel when viewed from above.

  The via-hole conductors v1 to v3 respectively penetrate the insulator layers 16a to 16c in the vertical direction and are connected to each other to constitute one via-hole conductor. The via-hole conductors v1 to v3 connect the external electrode 14a and the upstream end of the coil conductor 18a.

  Each of the via-hole conductors v74 to v77 penetrates the insulating layers 16jj to 16mm in the vertical direction and is connected to each other to constitute one via-hole conductor. The via-hole conductors v74 to v77 connect the external electrode 14b and the downstream end of the coil conductor 18gg.

  In the electronic component 10b configured as described above, like the electronic component 10a, the coil L is configured by only the parallel portions 20a to 20c in the region A1. Moreover, the coil L is comprised only by the parallel parts 20l-20n in area | region A3. On the other hand, the coil L is comprised by parallel part 20d-20g, 22a-22l, 20h-20k in area | region A2. Therefore, the first ratio of the number of parallel parts 20 in the total of the number of parallel parts 20 and the number of parallel parts 22 in the area A1 is the number of parallel parts 20 and the number of parallel parts 22 in the area A2. It is higher than the 2nd ratio of the number of the parallel parts 20 which occupies for the sum total. Furthermore, the third ratio of the number of parallel parts 20 in the total of the number of parallel parts 20 and the number of parallel parts 22 in the area A3 is the number of parallel parts 20 and the number of parallel parts 22 in the area A2. It is higher than the 2nd ratio of the number of the parallel parts 20 which occupies for the sum total.

  According to the electronic component 10b configured as described above, similarly to the electronic component 10a, an increase in the temperature of the element can be suppressed while suppressing an increase in the size of the element.

  Moreover, in the electronic component 10b, occurrence of a short circuit between the coil conductors is suppressed. More specifically, in the coil conductors 18a to 18z and 18aa to 18gg, the potentials of the coil portions that are not connected in parallel in the adjacent ones are different. Therefore, in the coil conductors 18a to 18z and 18aa to 18gg, when adjacent coil portions that are not connected in parallel face each other through the insulator layer, ion migration may occur between these coil portions. As a result, a short circuit may occur between the coil conductors.

  Therefore, the coil conductors 18a to 18z and 18aa to 18gg included in each of the parallel portions 20a to 20n and 22a to 22l do not overlap in portions other than the coil portions connected in parallel when viewed from above. Thereby, in the coil conductors 18a to 18z and 18aa to 18gg adjacent in the vertical direction, the coil portions that are not connected in parallel do not face each other through the insulator layer. As a result, the portions that are not connected in parallel are opposed to each other via the plurality of insulating layers, so that occurrence of a short circuit in the coil conductors 18a to 18z and 18aa to 18gg is suppressed.

(Third embodiment)
Below, the structure of the electronic component 10c which concerns on 3rd Embodiment is demonstrated, referring drawings. FIG. 4C is a cross-sectional structural view taken along line AA of the electronic component 10c of FIG.

  The electronic component 10c differs from the electronic component 10a in the number of parallel parts 20 and the number of parallel parts 22 provided in each of the regions A1 to A3.

  In the electronic component 10c, the parallel part 20a and the parallel part 22a are provided in the region A1 so as to be arranged in this order from the upper side to the lower side. Thereby, the parallel part 20a is provided in the uppermost side among the parallel parts 20a and 22a provided in area | region A1. Further, in the area A1, the number of parallel parts 20 (one) is equal to the number of parallel parts 22 (one).

  In the region A3, the parallel portion 22h and the parallel portion 20d are provided in this order from the upper side to the lower side. Thereby, the parallel part 20d is provided in the lowest side among the parallel parts 20d and 22h provided in area | region A3. In the region A3, the number of parallel parts 20 (one) is equal to the number of parallel parts 22 (one).

  In the region A2, the parallel portion 20b, the parallel portions 22b to 22g, and the parallel portion 20c are provided in this order from the upper side to the lower side. Thereby, the parallel part 20b is provided in the uppermost side among the parallel parts 20b, 20c, and 22b-22g provided in area | region A2. Among the parallel portions 20b, 20c, and 22b to 22g provided in the region A2, the parallel portion 20c is provided on the lowermost side. Further, the number (6) of the parallel parts 22 in the region A2 is larger than the number (1) of the parallel parts 22 in the region A1. The number (6) of the parallel parts 22 in the region A2 is larger than the number (1) of the parallel parts 22 in the region A3.

  A set of at least one or more parallel portions 20 that are continuously arranged in the vertical direction is defined as a first group. Specifically, the parallel unit 20a belongs to the first group G11. The parallel unit 20b belongs to the first group G12. The parallel unit 20c belongs to the first group G13. The parallel unit 20d belongs to the first group G14.

  A set of at least one or more parallel portions 22 that are continuously arranged in the vertical direction is defined as a second group. Specifically, the parallel unit 22a belongs to the second group G21. The parallel units 22b to 22g belong to the second group G22. The parallel unit 22h belongs to the second group G23.

  The total of the number of the first groups G11 to G14 and the number of the second groups G21 to G23 as described above is 4 or more, and 7 in the present embodiment. The first groups G11 to G14 and the second groups G21 to G23 are alternately arranged in the vertical direction. In the present embodiment, the first group G11, the second group G21, the first group G12, the second group G22, the first group G13, the second group G23, and the first group G14 are arranged in this order from the upper side. It is lined down.

  According to the electronic component 10c configured as described above, similarly to the electronic component 10a, an increase in the temperature of the element can be suppressed while suppressing an increase in the size of the element.

  Moreover, according to the electronic component 10c, the temperature rise of an element can be suppressed, suppressing the enlargement of an element also for the following reasons. In the electronic component 10c, the external electrode 14a covers the upper surface. Therefore, in the area A1, the heat dissipation becomes higher as it approaches the upper surface. Therefore, in the vicinity of the upper end of the region A1, it is possible to prioritize the suppression of the element size over the suppression of the temperature rise of the element. Therefore, among the parallel portions 20a and 22a provided in the region A1, the parallel portion 20a in which the suppression of the increase in the size of the element is given priority over the suppression of the increase in the temperature of the element is provided on the uppermost side. Thereby, according to the electronic component 10c, the temperature rise of an element can be suppressed, suppressing the enlargement of an element. Note that, in the region A3, for the same reason as the region A1, the increase in the temperature of the element is suppressed while the increase in the size of the element is suppressed.

  Moreover, according to the electronic component 10c, the temperature rise of an element can be suppressed, suppressing the enlargement of an element also for the following reasons. In the electronic component 10c, the external electrode 14a is provided on the upper side of the region A2. Therefore, in the area A2, the heat dissipation increases as it goes upward. Therefore, in the vicinity of the upper end of the region A2, it is possible to prioritize the suppression of the element size over the suppression of the temperature rise of the element. Therefore, among the parallel portions 20b, 20c, and 22b to 22g provided in the region A2, the parallel portion 20b in which the suppression of the increase in the size of the element is given priority over the suppression of the temperature rise of the element is provided on the uppermost side. Yes. Thereby, according to the electronic component 10c, the temperature rise of an element can be suppressed, suppressing the enlargement of an element.

(Fourth embodiment)
The configuration of the electronic component 10d according to the fourth embodiment will be described below with reference to the drawings. 4D is a cross-sectional structure diagram taken along the line AA of the electronic component 10d in FIG.

  The electronic component 10d differs from the electronic component 10c in the number of parallel parts 20 and the number of parallel parts 22 provided in each of the regions A1 to A3.

  In the electronic component 10d, the parallel parts 20a and 20b and the parallel parts 22a and 22b are provided in the region A1 so as to be arranged in this order from the upper side to the lower side. Thereby, the parallel part 20a is provided in the uppermost side among the parallel parts 20a, 20b, 22a, and 22b provided in area | region A1. In the region A1, the number of parallel parts 20 (two) is equal to the number of parallel parts 22 (two).

  In the area A3, parallel portions 22h and 22i and parallel portions 20d and 20e are provided in this order from the upper side to the lower side. Thereby, the parallel part 20e is provided in the lowest side among the parallel parts 20d, 20e, 22h, and 22i provided in area | region A3. In the region A3, the number of parallel parts 20 (two) is equal to the number of parallel parts 22 (two).

  In the region A2, the parallel portion 20c and the parallel portions 22c to 22g are provided in this order from the upper side to the lower side. Thereby, the parallel part 20c is provided in the uppermost side among the parallel parts 20c and 22c-22g provided in area | region A2. Further, the number (5) of the parallel parts 22 in the region A2 is larger than the number (2) of the parallel parts 22 in the region A1. The number (5) of the parallel parts 22 in the region A2 is larger than the number (2) of the parallel parts 22 in the region A3. Furthermore, the number (two) of the parallel parts 20 in the region A1 is larger than the number (one) of the parallel parts 20 in the region A2. The number (two) of the parallel parts 20 in the region A3 is larger than the number (one) of the parallel parts 20 in the region A2.

  According to the electronic component 10d configured as described above, similarly to the electronic components 10a and 10c, an increase in the temperature of the element can be suppressed while suppressing an increase in the size of the element.

(First modification)
Hereinafter, an electronic component 10e according to a first modification will be described with reference to the drawings. FIG. 5 is an exploded perspective view of a part of the multilayer body 12 of the electronic component 10e according to the first modification. FIG. 1 is used for an external perspective view of the electronic component 10e.

  In the electronic components 10a to 10d, at least a part of the two coil conductors arranged in the vertical direction is connected in parallel to constitute the parallel portion 20, and at least a part of the three coil conductors arranged in the vertical direction are connected in parallel. The parallel part 22 is comprised by this.

  On the other hand, in the electronic component 10e, at least a part of two coil conductors arranged in the vertical direction is connected in parallel to form the parallel portion 20, and at least a part of the four coil conductors arranged in the vertical direction are connected in parallel. The parallel part 22 is comprised by this. About the parallel part 20 of the electronic component 10e, since it is the same as the parallel part 20 of the electronic component 10b, description is abbreviate | omitted.

  The coil conductors 18a to 18i are linear conductors that are provided on the surfaces of the insulator layers 16a to 16i and circulate counterclockwise. Each of the coil conductors 18a to 18i has a length corresponding to a half circumference, and includes coil portions 18a-1 to 18i-1 and coil portions 18a-2 to 18i-2.

  The coil portions 18a-2, 18b-1, 18c-1, 18d-1, and 18i-2 overlap the rear side of the track R. The coil portions 18b-2, 18c-2, 18d-2, and 18e-1 overlap the left side of the track R. The coil portions 18e-2, 18f-1, 18g-1, and 18h-1 overlap the front side of the track R. The coil portions 18 a-1, 18 f-2, 18 g-2, 18 h-2, and 18 i-1 overlap the right side of the track R. Hereinafter, when the coil conductors 18a to 18j are viewed from above, the counterclockwise upstream end is referred to as an upstream end, and the counterclockwise downstream end is referred to as a downstream end.

  The coil portions 18a-2, 18b-1, 18c-1, and 18d-1 constitute a parallel portion 22a by being connected in parallel by via-hole conductors. The coil portions 18b-2, 18c-2, 18d-2, and 18e-1 are connected in parallel by via-hole conductors to constitute a parallel portion 22b. The coil portions 18e-2, 18f-1, 18g-1, and 18h-1 are connected in parallel by via-hole conductors to constitute a parallel portion 22c. The coil portions 18f-2, 18g-2, 18h-2, and 18i-1 constitute a parallel portion 22d by being connected in parallel by via-hole conductors.

  The parallel part 22 as described above may be replaced with the parallel part 22 of the electronic component 10b. Note that the insulator layers 16a to 16j in FIG. 5 and the insulator layers 16a to 16j in FIGS. 2 and 4A are denoted by the same reference numerals for convenience, but are not the same insulator layer.

(Second modification)
Hereinafter, an electronic component 10f according to a second modification will be described with reference to the drawings. FIG. 6 is an exploded perspective view of a part of the multilayer body 12 of the electronic component 10f according to the second modification. FIG. 1 is used for an external perspective view of the electronic component 10f.

  The electronic component 10 f is different from the electronic component 10 e in the structure of the parallel portion 22. More specifically, the coil conductors 18a to 18i are linear conductors that are provided on the surfaces of the insulator layers 16a to 16i and circulate counterclockwise. Each of the coil conductors 18a to 18i has a length corresponding to a half circumference, and includes coil portions 18a-1 to 18i-1 and coil portions 18a-2 to 18i-2.

  The coil portions 18a-1, 18b-1, 18g-2, 18h-2, 18i-1, and 18j-1 overlap the rear side of the track R. The coil portions 18a-2, 18b-2, 18c-1, 18d-1, 18i-2, and 18j-2 overlap the left side of the track R. The coil portions 18c-2, 18d-2, 18e-1, and 18f-1 overlap the front side of the track R. The coil portions 18e-2, 18f-2, 18g-1, and 18h-1 overlap the right side of the track R. Hereinafter, when the coil conductors 18a to 18j are viewed from above, the counterclockwise upstream end is referred to as an upstream end, and the counterclockwise downstream end is referred to as a downstream end.

  The coil portions 18a-2, 18b-2, 18c-1, and 18d-1 constitute a parallel portion 22a by being connected in parallel by via-hole conductors. The coil portions 18c-2, 18d-2, 18e-1, and 18f-1 constitute a parallel portion 22b by being connected in parallel by via-hole conductors. The coil portions 18e-2, 18f-2, 18g-1, and 18h-1 are connected in parallel by via-hole conductors to constitute a parallel portion 22c. The coil portions 18g-2, 18h-2, 18i-1, and 18j-1 are connected in parallel by via-hole conductors to constitute a parallel portion 22d.

  The parallel part 22 as described above may be replaced with the parallel part 22 of the electronic component 10b. Note that the insulator layers 16a to 16j in FIG. 6 and the insulator layers 16a to 16j in FIGS. 2 and 4A are denoted by the same reference numerals for convenience, but are not the same insulator layer.

(Other embodiments)
The electronic component according to the present invention is not limited to the electronic components 10a to 10f, and can be changed within the scope of the gist thereof.

  In addition, you may combine the structure of the electronic components 10a-10f.

  In the electronic components 10a to 10d, the parallel part 20 is configured by connecting at least part of two coil conductors in parallel, and the parallel part 22 is configured by connecting at least part of three coil conductors in parallel. ing. However, the number of coil conductors connected in parallel is not limited to this. The parallel part 20 is configured by connecting at least part of m coil conductors in parallel, and the parallel part 22 is configured by connecting at least part of n coil conductors in parallel. At this time, m and n are natural numbers, and n needs to be larger than m. Further, when m = 1, only one coil conductor is provided in the parallel portion 20. In this case, the coil conductors are not connected in parallel, but for convenience, they are referred to as a parallel portion 20 in which one coil conductor is connected in parallel.

  In addition, in the electronic components 10a, 10b, 10e, and 10f, the parallel part 22 may be provided in area | region A1. Further, in the electronic components 10a, 10b, 10e, and 10f, the parallel portion 20 may not be provided in the region A2.

  A lead conductor that relays the connection between both ends of the coil L and the external electrodes 14a and 14b may be provided on the insulator layer. For example, in the electronic component 10a shown in FIG. 2, the coil L is connected to the external electrode 14a via the via-hole conductors v1 to v3, and the coil L is connected to the external electrode 14b via the via-hole conductors v57 to v60. Instead of the via-hole conductors v1 to v3, a lead conductor drawn from the upstream end of the coil conductor 18a to the right side of the insulator layer 16d may be provided. Similarly, in place of the via-hole conductors v57 to v60, a lead conductor drawn out from the downstream end of the coil conductor 18hh to the rear side of the insulator layer 16kk may be provided. In this case, the lead conductor protrudes not from the coil L but from the annular track R. That is, when the whole overlaps the track R, it is a coil conductor, and when at least a part protrudes from the track R, it is a lead conductor.

  Note that the parallel units 20 and 22 may extend over two regions. For example, two coils of the parallel part 22 may be provided in the area A1, and one coil of the parallel part 22 may be provided in the area A2. In this case, the number of parallel parts 22 provided in the areas A1 and A2 may be expressed as a fraction. Specifically, it is assumed that 1/3 of the parallel part 22 is provided in the region A1, and 2/3 of the parallel part 22 is provided in the region A2. The same applies to the parallel unit 20.

  As described above, the present invention is useful for electronic components, and is particularly excellent in that the temperature rise of the device can be suppressed while suppressing the increase in size of the device.

A1 to A3 region L coil 10a to 10f Electronic component 12 Laminated body 14a and 14b External electrode 16a to 16z and 16aa to 16nn Insulator layer 18a to 18z and 18aa to 18hh Coil conductors 20a to 20n and 22a to 22l Parallel portion

Claims (10)

A rectangular parallelepiped laminated body constituted by laminating a plurality of insulator layers in the laminating direction, and a laminate having a first side surface formed by connecting outer edges of the plurality of insulator layers;
A coil that is provided in the laminated body and is configured by connecting a plurality of coil conductors with via-hole conductors that penetrate the insulator layer, and is a spiral coil that advances in the laminating direction while circling When,
At least a first external electrode provided on the first side surface;
A second external electrode provided on the other side in the stacking direction from the first external electrode and provided on at least the first side surface;
With
The coil includes a first parallel portion configured by connecting at least a part of the m coil conductors arranged in the stacking direction in parallel, and at least a part of the n coil conductors arranged in the stacking direction connected in parallel. And a second parallel part configured is provided,
m and n are natural numbers;
n is greater than m,
It occupies the total of the number of the first parallel parts and the number of the second parallel parts in the first region overlapping with the first external electrode when viewed from the normal direction of the first side surface The ratio of the number of the first parallel portions in the second region that does not overlap the first external electrode and the second external electrode when seen in a plan view from the normal direction of the first side surface Higher than the ratio of the number of the first parallel parts to the total of the number of the first parallel parts and the number of the second parallel parts;
Electronic parts characterized by It occupies the total of the number of the first parallel parts and the number of the second parallel parts in the third region overlapping the second external electrode when viewed in plan from the normal direction of the first side surface The ratio of the number of the first parallel portions in the second region that does not overlap the first external electrode and the second external electrode when seen in a plan view from the normal direction of the first side surface Higher than the ratio of the number of the first parallel parts to the total of the number of the first parallel parts and the number of the second parallel parts;
The electronic component according to claim 1. The coil is composed of only the first parallel portion in the first region;
The electronic component according to claim 1, wherein: In the first parallel portion, m coil conductors having the same shape are connected in parallel,
In the second parallel portion, n coil conductors having the same shape are connected in parallel;
The electronic component according to any one of claims 1 to 3, wherein: In the first parallel portion, some of the m coil conductors arranged in the stacking direction are connected in parallel,
In the second parallel portion, some of the n coil conductors arranged in the stacking direction are connected in parallel,
The coil conductor corresponding to the first parallel part does not overlap in any part other than the part connected in parallel when viewed in plan from the stacking direction,
The coil conductor corresponding to the second parallel part does not overlap in any part other than the part connected in parallel when viewed in plan from the stacking direction,
The electronic component according to any one of claims 1 to 3, wherein: The coil conductor forms an annular track when viewed in plan from the stacking direction;
The electronic component according to claim 1, wherein: The laminated body has a first surface located on one side in the laminating direction and a second surface located on the other side in the laminating direction,
The first external electrode is provided across the first surface and the first side surface,
The second external electrode is provided across the second surface and the first side surface;
The electronic component according to claim 1, wherein: Among the first parallel part and the second parallel part provided in the first region, the first parallel part is provided on the most one side in the stacking direction,
The electronic component according to claim 7. Among the first parallel part and the second parallel part provided in the second region, the first parallel part is provided on the most one side in the stacking direction,
The electronic component according to claim 7, wherein: A set of at least one or more first parallel portions arranged in the stacking direction is defined as a first group,
A set of at least one or more second parallel parts arranged in the stacking direction is defined as a second group,
The sum of the number of the first group and the number of the second group is 4 or more,
The first group and the second group are alternately arranged in the stacking direction,
The electronic component according to claim 1, wherein:

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