JPWO2014171215A1 - Resin composition and use thereof - Google Patents

Abstract

An object of the present invention is to provide a resin composition containing a near-infrared absorber in which yellowing is suppressed. The resin composition of the present invention comprises a near-infrared absorber, an epoxy compound, and a resin. The near-infrared absorber is the following general formula (1): [R1 is a monovalent group represented by -CH2CH2-R11, R11 is a hydrogen atom, having 1 to 20 carbon atoms] An alkyl group or a fluorinated alkyl group having 1 to 20 carbon atoms is shown. ] The fine particle which consists of a phosphonic acid copper salt represented by these.

Description

  The present invention relates to a resin composition and its use, and more particularly to a resin composition comprising a near-infrared absorber, an epoxy compound, and a resin, and its use.

  Conventionally, laminated glass has been used in various applications such as vehicles such as automobiles, buildings, and solar cells. As an interlayer film for laminated glass, a polyvinyl butyral resin film, an ionomer resin film, and the like are known.

  By the way, the sun rays include ultraviolet rays, infrared rays and the like in addition to visible rays. Among infrared rays, infrared rays having a wavelength close to visible light are called near infrared rays. Near-infrared rays are also called heat rays and are one of the causes of temperature rise inside vehicles and buildings.

  In order to suppress the temperature rise, it is conceivable to impart heat ray absorptivity to laminated glass used in vehicles and buildings while maintaining visible light transmittance. For example, a copper salt composition containing a phosphonic acid copper salt, a polysiloxane component, a plasticizer, and a dispersant is known (see, for example, Patent Document 1). In general, when a resin composition obtained by mixing a metal salt with a resin is exposed to a high temperature, the visible light transmittance may be reduced or yellowed. However, Patent Document 1 provides an infrared absorption film in which the resin composition containing the copper salt composition and the resin is excellent in visible light transmission and stability even when exposed to high temperatures. It is disclosed that it is possible.

  In the resin composition described in Patent Document 1, yellowing when exposed to a high temperature is suppressed as compared with a resin composition composed only of a phosphonic acid copper salt and a resin, but dehydrates and condenses a silane compound. Since processes are required, there is a problem that the number of processes increases.

2009-242650

  This invention is made | formed in view of the said prior art, and aims at providing the resin composition containing the near-infrared absorber by which yellowing was suppressed.

  As a result of repeated earnest studies to achieve the above-mentioned problems, the present inventors have found that a resin composition comprising a specific near-infrared absorber, an epoxy compound, and a resin can solve the above-mentioned problems. The present invention has been completed.

  That is, the resin composition of the present invention is a resin composition comprising a near infrared absorber, an epoxy compound, and a resin, and the near infrared absorber is a phosphonic acid copper salt represented by the following general formula (1). It is characterized by being microparticles consisting of.

[In General Formula (1), R ¹ is a monovalent group represented by —CH ₂ CH ₂ —R ¹¹ , and R ¹¹ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups. ]
It is preferable that the molecular weight of the epoxy compound is 100 to 4000.

  The resin is at least one selected from polyvinyl acetal resin, ethylene-vinyl acetate copolymer, (meth) acrylic acid resin, polyester resin, polyurethane resin, vinyl chloride resin, polyolefin resin, polycarbonate resin, and norbornene resin. A resin is preferable, and a polyvinyl butyral resin or an ethylene-vinyl acetate copolymer is more preferable.

It is preferable to contain 0.05-50 mass parts of near-infrared absorbers per 100 mass parts of said resin.
It is preferable that 0.005-5.0 mass parts of epoxy compounds are contained per 100 mass parts of the resin.

The interlayer film for laminated glass of the present invention is formed from the resin composition.
The laminated glass of the present invention has the interlayer film for laminated glass.

  In the resin composition of the present invention, yellowing is suppressed.

Next, the present invention will be specifically described.
The resin composition of the present invention is a resin composition comprising a near-infrared absorber, an epoxy compound, and a resin, and the near-infrared absorber is a phosphonic acid copper salt represented by the general formula (1) described later. It is the fine particle which becomes.

The resin composition of the present invention is also referred to as a copper salt fine particle dispersed resin.
[Near infrared absorber]
The near-infrared absorber used in the present invention is fine particles composed of a phosphonic acid copper salt represented by the following general formula (1).

  The fine particles comprising the phosphonic acid copper salt represented by the following general formula (1) may be formed only from the phosphonic acid copper salt represented by the following general formula (1), and represented by the following general formula (1). The phosphonic acid copper salt may be formed from other components.

[In General Formula (1), R ¹ is a monovalent group represented by —CH ₂ CH ₂ —R ¹¹ , and R ¹¹ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups. ]
R ¹¹ is preferably a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. Specifically, as R ¹¹ , hydrogen atom, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group Tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group and the like are preferable. In addition, as a phosphonic acid copper salt represented by General formula (1), it may be used individually by 1 type, or 2 or more types may be used.

In the present specification, the “phosphonic acid copper salt represented by the general formula (1)” is also simply referred to as “phosphonic acid copper salt”.
Although there is no limitation in particular as a manufacturing method of the microparticles | fine-particles which consist of a phosphonic acid copper salt used for this invention, For example, it can manufacture with the following method.

  As a method for producing fine particles comprising copper phosphonate, a step of mixing a phosphonic acid compound represented by the following general formula (2) and a copper salt in a solvent to obtain a reaction mixture (hereinafter also referred to as a reaction step). ), A method having a step of obtaining fine particles composed of a copper phosphonate by removing the solvent in the reaction mixture (hereinafter also referred to as a solvent removal step).

[In General Formula (2), R ¹ is a monovalent group represented by —CH ₂ CH ₂ —R ¹¹ , and R ¹¹ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups. ]
As the phosphonic acid compound represented by the general formula (2), those in which R ¹¹ is a hydrogen atom or an alkyl group having 1 to 20 carbon atoms are preferable. Examples of the phosphonic acid compound represented by the general formula (2) include ethylphosphonic acid, propylphosphonic acid, butylphosphonic acid, pentylphosphonic acid, hexylphosphonic acid, heptylphosphonic acid, octylphosphonic acid, nonylphosphonic acid, and decylphosphonic acid. Examples thereof include alkylphosphonic acids such as acid, undecylphosphonic acid, dodecylphosphonic acid, tridecylphosphonic acid, tetradecylphosphonic acid, pentadecylphosphonic acid, hexadecylphosphonic acid, heptadecylphosphonic acid, and octadecylphosphonic acid. In addition, as a phosphonic acid compound represented by General formula (2), it may be used individually by 1 type, or 2 or more types may be used.

  As the copper salt, a copper salt capable of supplying divalent copper ions is usually used. The copper salt may be a copper salt other than the phosphonic acid copper salt represented by the general formula (1). Examples of the copper salt include copper of organic acids such as anhydrous copper acetate, anhydrous copper formate, anhydrous copper stearate, anhydrous copper benzoate, anhydrous ethyl acetoacetate copper, anhydrous pyrophosphate, anhydrous naphthenic acid copper, and anhydrous copper citrate. Salt, hydrate or hydrate of copper salt of organic acid; copper salt of inorganic acid such as copper oxide, copper chloride, copper sulfate, copper nitrate, basic copper carbonate, hydrate of copper salt of inorganic acid Or a hydrate; copper hydroxide is mentioned. In addition, as a copper salt, you may use individually by 1 type, or may use 2 or more types.

As the copper salt, anhydrous copper acetate and copper acetate monohydrate are preferably used in terms of solubility and removal of by-products.
When producing fine particles comprising a phosphonic acid copper salt, a dispersant may be used in the reaction step. Examples of the dispersant include at least one phosphate ester compound selected from a phosphate ester compound represented by the general formula (3a) and a phosphate ester compound represented by the general formula (3b), the phosphoric acid The phosphoric acid in an ester compound, ie, the compound which neutralized the hydroxyl group with the base is mentioned. In addition, as a base used for neutralization, inorganic bases, such as lithium hydroxide, sodium hydroxide, potassium hydroxide, cesium hydroxide, magnesium hydroxide, calcium hydroxide, are mentioned.

[In General Formulas (3a) and (3b), R ²¹ , R ²² and R ²³ are monovalent groups represented by — (CH ₂ CH ₂ O) _n R ⁵⁵ , and n is from 2 to 65. It is an integer and R ⁵⁵ represents an alkyl group having 6 to 25 carbon atoms or an alkylphenyl group having 6 to 25 carbon atoms. However, R ²¹ , R ²² and R ²³ may be the same or different. ]
The n is an integer of 2 to 65, preferably an integer of 4 to 65, more preferably 4 to 45, and particularly preferably an integer of 4 to 35. When n is less than 2, transparency may be insufficient when a laminated glass or the like is produced. On the other hand, when n exceeds 65, the amount of the phosphoric acid ester compound necessary for obtaining laminated glass having sufficient transparency tends to increase, resulting in high costs.

R ⁵⁵ is an alkyl group having 6 to 25 carbon atoms or an alkylphenyl group having 6 to 25 carbon atoms, preferably an alkyl group having 6 to 25 carbon atoms, and an alkyl group having 8 to 20 carbon atoms. Are more preferable, and 12 to 20 alkyl groups are particularly preferable. When R ⁵⁵ is a group having less than 6 carbon atoms, transparency may be insufficient when a laminated glass or the like is produced. Further, when R ⁵⁵ is a group having more than 25 carbon atoms, the amount of the phosphate ester compound necessary for obtaining a laminated glass having sufficient transparency tends to increase, resulting in high costs. .

  When a dispersing agent is used when obtaining fine particles comprising the phosphonic acid copper salt, the phosphoric acid ester compound represented by the general formula (3a) and the phosphoric acid ester compound represented by the general formula (3b) Although at least one is preferably used, it is more preferable to use both the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b). It is preferable to use the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) because they tend to be excellent in transparency and heat resistance of laminated glass and the like. When both the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) are used, the phosphate ester compound represented by the general formula (3a) The ratio of the phosphoric acid ester compound represented by the general formula (3b) is not particularly limited, but is usually 10:90 to 90:10 in molar ratio ((3a) :( 3b)).

  Moreover, as a phosphate ester compound represented by the said general formula (3a), it may be used individually by 1 type, or 2 or more types may be used, and the phosphate ester compound represented by the said General formula (3b) May be used alone or in combination of two or more.

  As at least one phosphate ester compound selected from the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b), commercially available phosphoric acid Ester compounds such as DLP-10, DDP-6, DDP-8, DDP-10, TDP-6, TDP-8, TDP-10 (manufactured by Nikko Chemicals), Plysurf A212C, Plysurf A215C Plysurf AL12H, plysurf AL, plysurf A208F, plysurf A208N, plysurf A208B, plysurf A219B, plysurf A210D (above, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) and the like can also be used. Moreover, the phosphoric acid in these phosphate ester compounds, ie, the compound which neutralized the hydroxyl group with the appropriate base can also be used. Examples of the base used for neutralization include inorganic bases such as lithium hydroxide, sodium hydroxide, potassium hydroxide, cesium hydroxide, magnesium hydroxide, and calcium hydroxide.

  In addition, when manufacturing the microparticles | fine-particles which consist of a phosphonic acid copper salt, it is preferable to use 0.5-1.5 mol of phosphonic acid compounds represented by General formula (2) per 1 mol of said copper salts, It is more preferable to use 8 to 1.2 mol. Further, the dispersant is at least one phosphate ester compound selected from a phosphate ester compound represented by the general formula (3a) and a phosphate ester compound represented by the general formula (3b), and / or When the phosphoric acid ester compound is a compound obtained by neutralizing a hydroxyl group with a base, 5 to 100 parts by mass, preferably 10 to 50 parts by mass, are used per 100 parts by mass of the copper salt. More preferred.

  Examples of the solvent include alcohols such as methanol, ethanol, isopropyl alcohol, and n-butyl alcohol, tetrahydrofuran (THF), dimethylformamide (DMF), water, and the like. The solvent preferably includes at least one solvent selected from methanol, ethanol, isopropyl alcohol, n-butanol, N, N-dimethylformamide (DMF), and tetrahydrofuran (THF). Further, from the viewpoint of reactivity, it preferably contains at least one solvent selected from methanol, ethanol, THF, and DMF, and more preferably contains at least one solvent selected from methanol and ethanol. As said solvent, only these solvents may be included and the other solvent may be included. The solvent includes at least one solvent selected from methanol, ethanol, isopropyl alcohol, n-butanol, DMF, and THF (preferably at least one solvent selected from methanol, ethanol, THF, and DMF). , More preferably at least one solvent selected from methanol and ethanol), and other solvents are usually contained in an amount of 0 to 50 parts by mass, preferably 0 to 30 parts by mass. Also good. When two or more kinds of solvents are used as the solvent, specific examples thereof include denatured ethanol containing ethanol and a small amount of other solvents. Denatured ethanol usually contains 3 to 50 parts by mass, preferably 3 to 30 parts by mass of other solvents with respect to 100 parts by mass of ethanol. Examples of the modified ethanol include methanol-modified ethanol, isopropyl alcohol-modified ethanol, and toluene-modified ethanol.

  The reaction step is usually 0 to 80 ° C., preferably 10 to 60 ° C., more preferably room temperature to 60 ° C., particularly preferably 20 to 40 ° C., usually 0.5 to 60 hours, preferably Is carried out for 0.5 to 30 hours, more preferably 0.5 to 20 hours, particularly preferably 1 to 15 hours.

  In the reaction step, the phosphonic acid compound represented by the general formula (2) reacts with the copper salt, and fine phosphonic acid copper salt that does not dissolve in the solvent is generated by the reaction. At least one phosphate ester compound selected from the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) acts as a good dispersant during the reaction. Therefore, the phosphonic acid copper salt can maintain high dispersibility and suppress aggregation.

  In the reaction step, not only the reaction between the phosphonic acid compound represented by the general formula (2) and the copper salt, but also, for example, the phosphate ester compound represented by the general formula (3a) and the general formula (3b) At least one type of phosphate ester compound selected from the phosphate ester compounds represented by) may react with a part of the copper salt. Further, a part of the raw material may remain without reacting.

  In the method for producing fine particles composed of the phosphonic acid copper salt, the fine particles composed of the phosphonic acid copper salt are usually obtained by removing at least a part of the solvent from the reaction mixture.

In the solvent removal step, at least a part of the solvent is removed from the reaction mixture. In the solvent removal step, in addition to the solvent, the liquid components in the reaction mixture may be removed together.
As a solvent removal process, the method of removing a solvent as a fraction by distilling a reaction mixture is mentioned.

Distillation is preferably performed under reduced pressure from the viewpoint of preventing thermal deterioration of the reaction mixture.
When performing vacuum distillation, although it changes also with kinds of solvent, as conditions for vacuum distillation, it is normally performed by the pressure of 0.01-15 kPa. In addition, although the outflow temperature of a fraction changes with kinds and pressures of a solvent, it is 30-150 degreeC normally.

  As another method for removing the solvent, the reaction mixture is allowed to stand to precipitate fine particles composed of copper phosphonate, and the supernatant (solvent) is removed, or the reaction mixture is centrifuged. By this, the method of precipitating the microparticles | fine-particles which consist of phosphonic acid copper salt and removing a supernatant liquid (solvent) is mentioned.

In addition, as a method of removing a solvent, you may carry out combining these methods.
In addition, after the solvent removal step, for the purpose of removing impurities contained in the phosphonic acid copper salt fine particles, the phosphonic acid copper salt fine particles are dispersed in the dispersion medium, and then the dispersion medium is removed. A process may be provided.

  As the fine particles comprising the phosphonic acid copper salt, fine particles comprising an phosphonic acid copper salt having an average particle diameter of 1 to 1000 nm are usually used. As an average particle diameter, in order to ensure the dispersibility to a monomer and the transparency of a resin composition, it is more preferable that it is 5-300 nm.

[Epoxy compound]
The resin composition of the present invention contains an epoxy compound. The epoxy compound is a compound having one or more epoxy groups in the molecule.

There is no limitation in particular as an epoxy compound used for this invention, 1 type may be used or 2 or more types may be used.
As the epoxy compound, a compound having 1 to 25 epoxy groups in one molecule is preferable, a compound having 1 to 10 is more preferable, and a compound having 1 to 4 is even more preferable.

  The epoxy compound preferably has a molecular weight of 100 to 4000, more preferably 120 to 1600, and still more preferably 130 to 600. If the molecular weight is too small, the epoxy compound may volatilize when the resin is dried or molded. If the molecular weight is too large, the amount of the epoxy compound added may increase, resulting in a change in the resin characteristics or an increase in cost.

As said epoxy compound, it is preferable that at least 1 epoxy group exists in a molecule terminal.
Examples of the epoxy compound used in the present invention include epoxy compounds represented by the following formulas (I) to (XVII).

  Since the resin composition of the present invention contains an epoxy compound, yellowing during heating can be suppressed. In particular, the epoxy compounds represented by the formulas (I) to (XVII), preferably the formulas (I) to (IV), (VI) to (XI), (XIII) to (XV), (XVII). Use of the epoxy compound is preferable because yellowing when the resin composition is held at a high temperature for a long time is sufficiently suppressed. It is more preferable to use an epoxy compound represented by the formula (I), (III), (IV), (VI) to (X), (XIII) to (XV), or (XVII). It is more preferable to use an epoxy compound represented by (IV), (VI) to (VIII), (X), (XIII), (XIV), and the compounds represented by formulas (III), (IV), (VIII), ( It is particularly preferable to use an epoxy compound represented by XIII).

[resin]
In the present invention, a resin is used. The resin used in the present invention is not particularly limited as long as it can disperse the above-described near-infrared absorber. For example, the following resins can be used.

  The resin used in the present invention is selected from polyvinyl acetal resin, ethylene-vinyl acetate copolymer, (meth) acrylic acid resin, polyester resin, polyurethane resin, vinyl chloride resin, polyolefin resin, polycarbonate resin, and norbornene resin. It is preferable that at least one type of resin can disperse the near-infrared absorber well and is excellent in visible light transmittance.

  The resin used in the present invention is more preferably at least one resin selected from polyvinyl acetal resin and ethylene-vinyl acetate copolymer, polyvinyl butyral resin (PVB), and ethylene-vinyl acetate copolymer Particularly preferred is at least one resin selected from a coalescence, and most preferred is a polyvinyl butyral resin or an ethylene-vinyl acetate copolymer. When the polyvinyl acetal resin is used, the dispersibility of the above-mentioned near-infrared absorber is excellent. When an optical material is produced using the resin composition of the present invention, the resin of the present invention is excellent in adhesion to glass or the like. It is preferable because the composition is flexible and deformation of the near-infrared absorber due to a change in temperature hardly occurs. Moreover, as polyvinyl acetal resin, it is preferable to use polyvinyl butyral resin (PVB) from the viewpoints of glass adhesion, dispersibility, transparency, heat resistance, light resistance, and the like.

  The polyvinyl acetal resin may be a blend of two or more types depending on the required physical properties, or may be a polyvinyl acetal resin obtained by acetalizing by combining aldehydes during acetalization. The molecular weight, molecular weight distribution, and degree of acetalization of the polyvinyl acetal resin are not particularly limited, but the degree of acetalization is generally 40 to 85%, and the preferred lower limit is 60% and the upper limit is 75%.

  The polyvinyl acetal resin can be obtained by acetalizing a polyvinyl alcohol resin with an aldehyde. The polyvinyl alcohol resin is generally obtained by saponifying polyvinyl acetate, and a polyvinyl alcohol resin having a saponification degree of 80 to 99.8 mol% is generally used. The preferable lower limit of the viscosity average polymerization degree of the polyvinyl alcohol resin is 200, and the upper limit is 3000. If it is less than 200, the penetration resistance of the resulting laminated glass may be lowered. When it exceeds 3000, the moldability of the resin composition may be deteriorated, and the rigidity of the resin composition is excessively increased, resulting in poor processability. A more preferred lower limit is 500 and an upper limit is 2200. The viscosity average polymerization degree and saponification degree of the polyvinyl alcohol resin can be measured based on, for example, JISK 6726 “Testing method for polyvinyl alcohol”.

  The aldehyde is not particularly limited, and examples thereof include aldehydes having 1 to 10 carbon atoms, and more specifically, for example, n-butyraldehyde, isobutyraldehyde, n-valeraldehyde, 2-ethylbutylartaldehyde. N-hexylaldehyde, n-octylaldehyde, n-nonylaldehyde, n-decylaldehyde, formaldehyde, acetaldehyde, benzaldehyde and the like. Of these, n-butyraldehyde, n-hexylaldehyde, n-valeraldehyde and the like are preferable. More preferred is butyraldehyde having 4 carbon atoms.

Use of an ethylene-vinyl acetate copolymer is preferable from the viewpoints of excellent dispersibility of the above-mentioned near-infrared absorber and glass adhesion, dispersibility, transparency, heat resistance, light resistance, and the like.
(Resin composition)
The resin composition of this invention is a resin composition which consists of a near-infrared absorber, an epoxy compound, and resin as mentioned above.

  The resin composition of this invention should just be a composition which consists of a near-infrared absorber, an epoxy compound, and resin as mentioned above, and it does not specifically limit as the manufacturing method. Examples of the method for producing the resin composition of the present invention include resins such as toluene, ethanol / toluene mixed solvent, methanol, methanol / toluene mixed solvent, methylene chloride, chloroform and the like, resins, epoxy compounds or solutions thereof, and near infrared absorbers. A method of adding a dispersion, dissolving the resin by stirring, ultrasonic irradiation, etc., obtaining a dispersion, and removing the solvent from the dispersion can be mentioned. In addition, the said near-infrared absorber dispersion liquid can be prepared by disperse | distributing a near-infrared absorber in toluene, methanol, a methylene chloride, chloroform, triethylene glycol bis (2-ethylhexanoate), etc. Moreover, when adding the solution of an epoxy compound, toluene, methanol, ethanol, a methylene chloride, chloroform, these mixed solvents, etc. can be used as a solvent.

  The resin composition of the present invention preferably contains 0.05 to 50 parts by mass, more preferably 0.1 to 25 parts by mass of the near infrared absorber per 100 parts by mass of the resin. If the amount is less than 0.05 parts by mass, sufficient near infrared absorption characteristics may not be obtained. If the amount is more than 50 parts by mass, the transparency and adhesiveness of the resin may be significantly reduced.

  The resin composition of the present invention preferably contains 0.005 to 5.0 parts by mass, more preferably 0.01 to 3.0 parts by mass of the epoxy compound per 100 parts by mass of the resin. It is still more preferable to contain 0.03-1.0 mass part. If the amount is less than 0.005 parts by mass, yellowing may not be sufficiently suppressed. If the amount is more than 5.0 parts by mass, yellowing occurs due to decomposition of the epoxy compound itself, or transparent due to precipitation of the epoxy compound. May decrease.

The resin composition of the present invention is excellent in near-infrared absorbing ability and can be suitably used as an intermediate film for structural materials such as laminated glass because yellowing such as coloring during heating is suppressed.
Moreover, various additives may be contained in the resin composition of the present invention. Examples of the additive include a plasticizer, a dispersant, an antioxidant, an ultraviolet absorber, and a light stabilizer. These additives may be added when the resin composition of the present invention is produced, or may be added when the above-described near infrared absorber, epoxy compound, and resin are produced.

[Use of resin composition]
The resin composition of the present invention is usually used for applications where it is desired to absorb near infrared rays.
The resin film formed from the resin composition of the present invention has excellent near-infrared absorption ability and is suitable as an intermediate film for structural materials such as an interlayer film for laminated glass because yellowing such as coloring during heating is suppressed. It is possible to use.

  Moreover, the laminated glass of this invention has the said intermediate film for laminated glasses. There is no limitation in particular as glass which comprises the laminated glass of this invention, A conventionally well-known thing can be used.

EXAMPLES Next, although an Example is shown and this invention is demonstrated further in detail, this invention is not limited by these.
[Production Example 1]
(Preparation of copper salt dispersion)
To a 500 ml eggplant flask, 5.84 g (29.25 mmol) of copper acetate monohydrate and 170 g of ethanol were added and stirred at 30 ° C. for 1 hour to obtain a solution (solution A).

In a separate container, 1.46 g of Prisurf A219B (Daiichi Kogyo Seiyaku Co., Ltd.) and 4.04 g of n-butylphosphonic acid were dissolved in 110 g of ethanol to obtain a solution (liquid B).
The obtained B liquid was dripped over 20 minutes with respect to A liquid. After stirring this reaction liquid at 30 degreeC for 7 hours, the reaction mixture was obtained by leaving still for 24 hours. In the obtained reaction mixture, a part of the copper salt was precipitated (1) and separated into two layers of a suspension layer (1) (lower layer) and a colorless transparent layer (1) (upper layer). . The colorless transparent layer (1) was removed from the reaction mixture with a pipette. The reaction mixture was then divided into a copper salt precipitate (1) and a suspension layer (1) (suspension).

  A part of the suspension layer (1) is centrifuged (3000 rpm / 15 minutes) to form a precipitate (2), a suspension layer (2) (lower layer), and a colorless transparent layer (2) (upper layer). The colorless and transparent layer (2) was removed with a pipette. In addition, the sum total of the colorless transparent layer (1) and the colorless transparent layer (2) was 165 g.

The copper salt precipitation (1), precipitation (2), suspension layer (1) that was not centrifuged, and suspension layer (2) were combined and put into an evaporator (water bath 60 ° C.), and the solvent was distilled off. did.
Toluene (100 g) was added thereto, and the mixture was made constant, and distilled off with an evaporator until the acetic acid odor disappeared. A blue-green solid with a yield of 6.59 g (yield 90%) was obtained. Toluene 140g was added to this, ultrasonic irradiation was performed for 12 hours, and n-butylphosphonic acid copper salt toluene dispersion liquid (1) was obtained.

[Production Example 2]
(Preparation of copper salt dispersion)
To a 500 ml eggplant flask, 7.00 g (35.06 mmol) of copper acetate monohydrate and 140 g of methanol were added and stirred at 20 ° C. for 1 hour to obtain a solution (solution A).

In a separate container, 1.75 g of PRISURF A219B (Daiichi Kogyo Seiyaku Co., Ltd.) and 4.82 g of n-butylphosphonic acid were dissolved in 100 g of methanol to obtain a solution (liquid B).
B liquid was dripped over 3 hours with respect to A liquid. The reaction was stirred at 20 ° C. for 10 hours.

  Thereafter, the solvent was distilled off from the reaction solution with an evaporator (water bath 60 ° C.). 100 g of toluene was added to the solid content from which the solvent had been distilled off, and the solvent was distilled off with an evaporator until a constant weight was obtained and the acetic acid odor disappeared. A blue-green solid with a yield of 8.75 g (100% yield) was obtained. To this, 211 g of toluene was added, and ultrasonic irradiation was performed for 6 hours to obtain an n-butylphosphonic acid copper salt toluene dispersion (2).

[Example 1]
(Preparation of copper salt fine particle dispersed resin)
To a 300 ml Erlenmeyer flask, 1.90 g of triethylene glycol bis (2-ethylhexanoate) (3GO, plasticizer), 250 ml of toluene, and 5.00 g of polyvinyl butyral (PVB) were added.

A solution prepared by dissolving 5.0 mg of triglycidyl isocyanurate (an epoxy compound represented by the formula (I)) in 3 ml of chloroform was added thereto.
3.16 g (containing 0.583 mmol of copper salt) of the above n-butylphosphonic acid copper salt toluene dispersion was added thereto, stirred at 20 ° C. for 10 hours, and then irradiated with ultrasonic waves for 1.5 hours. Was dissolved uniformly.

  This dispersion was spread on a Teflon (registered trademark) vat and air-dried at 20 ° C. for 12 hours. Furthermore, vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (1) (resin composition (1)) in which copper salt fine particles were dispersed.

(Evaluation)
<Preparation of resin sheet (1)>
After the PVB resin (1) in which the copper salt fine particles are dispersed is preheated at 120 ° C. and 3 MPa for 1 minute using a 0.8 mm thick formwork and a compression molding machine manufactured by Shinfuji Metal Industry Co., Ltd. , And pressed at 15 MPa for 3 minutes to obtain a resin sheet (1).

<Production of resin sheet (2)>
The resin sheet (1) was further preheated at 200 ° C. and 3 MPa for 1 minute using a 0.8 mm-thick mold and a compression molding machine manufactured by Shindo Metal Industry Co., Ltd., and then at 10 MPa for 5 minutes. The resin sheet (2) was obtained by pressing.

<Preparation of measurement sample (1)>
Both surfaces of the resin sheet (1) were sandwiched between slide glasses (thickness 1.2 to 1.5 mm), and a laminated glass (1) was formed on a 70 ° C. plate.

  The laminated glass (1) was heated in an autoclave under a nitrogen atmosphere at a pressure of 1.5 MPa and 130 ° C. for 0.5 hours to obtain a measurement sample (1) in which slide glasses were disposed on both surfaces of the resin sheet. .

<Preparation of measurement sample (2)>
Except that the resin sheet (1) was replaced with the resin sheet (2), the measurement was performed in the same manner as the preparation of the measurement sample (1) to obtain a measurement sample (2) in which slide glasses were disposed on both surfaces of the resin sheet. .

<Evaluation of heat resistance>
The spectra of the measurement samples (1) and (2) were measured by the following methods, respectively.
The spectrum of the measurement sample was measured using a spectrophotometer (U-4000 type, manufactured by Hitachi, Ltd.) in the wavelength range of 250 to 2500 nm. Tristimulus values (X, Y, Z) were calculated using a C light source.

The measurement sample (1) had a YI (yellowness index) of 4.8, and the measurement sample (2) had a YI of 9.4. The YI value was calculated according to the following formula.
YI = (128X−106Z) / Y
When the difference between the YI of the measurement sample (1) and the YI of the measurement sample (2) (YI of the measurement sample (2) −YI of the measurement sample (1)) is ΔYI, ΔYI was 4.6.

<Evaluation of long-term heat resistance>
The long-term heat resistance test was conducted by the following method. The measurement sample (2) was put in an oven at 100 ° C. and stored for 1000 hours, and then the spectrum was measured to obtain YI.

YI after 1000 hours was 12.2, and ΔYI was 2.8 (12.2−9.4), where ΔYI was the difference from YI before the long-term heat resistance test.
[Comparative Example 1]
(Preparation of copper salt fine particle dispersed resin)
PVB resin (c1) (resin composition (c1)) in which copper salt fine particles were dispersed was carried out in the same manner as in Example 1 except that 5.0 mg of triglycidyl isocyanurate was not used in a solution of 3 ml of chloroform. Obtained.

(Evaluation)
<Preparation of resin sheet (c1)>
Resin made in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (c1) in which copper salt fine particles are dispersed. A sheet (c1) was obtained.

<Preparation of resin sheet (c2)>
Except having replaced the resin sheet (1) with the resin sheet (c1), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (c2).

<Preparation of measurement sample (c1)>
A measurement sample (c1) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (c1).

<Preparation of measurement sample (c2)>
A measurement sample (c2) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (c2).

<Evaluation of heat resistance>
The spectrum of the measurement sample (c1) and the measurement sample (c2) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

YI of the measurement sample (c1) was 3.7, and YI of the measurement sample (c2) was 9.3. ΔYI of the measurement sample (c1) and the measurement sample (c2) was 5.6.
<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (c2).

YI after 1000 hours was 16.7, and ΔYI was 7.4 (16.7−9.3), where ΔYI was the difference from YI before the long-term heat resistance test.
[Example 2]
(Preparation of copper salt fine particle dispersed resin)
A solution in which 5.0 mg of triglycidyl isocyanurate was dissolved in 3 ml of chloroform was replaced with a solution in which 1.5 mg of 1,7-octadiene diepoxide (epoxy compound represented by formula (II)) was dissolved in 1 ml of toluene. Was performed in the same manner as in Example 1 to obtain a PVB resin (2) (resin composition (2)) in which copper salt fine particles were dispersed.

(Evaluation)
<Preparation of resin sheet (3)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (2) in which copper salt fine particles are dispersed. Sheet (3) was obtained.

<Preparation of resin sheet (4)>
Except having replaced the resin sheet (1) with the resin sheet (3), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (4).

<Preparation of measurement sample (3)>
A measurement sample (3) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (3).

<Preparation of measurement sample (4)>
A measurement sample (4) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (4).

<Evaluation of heat resistance>
The spectra of the measurement sample (3) and the measurement sample (4) were measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

YI of the measurement sample (3) was 6.0, and YI of the measurement sample (4) was 9.3. ΔYI of the measurement sample (3) and the measurement sample (4) was 3.3.
<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that measurement sample (2) was replaced with measurement sample (4).

YI after 1000 hours was 14.3, and ΔYI was 5.0 (14.3-9.3), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 3
(Preparation of copper salt fine particle dispersed resin)
To a 300 ml Erlenmeyer flask, 1.90 g of triethylene glycol bis (2-ethylhexanoate), 250 ml of toluene, and 5.00 g of polyvinyl butyral (PVB) were added.

To this was added a solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane (epoxy compound represented by the formula (III)) in 1 ml of toluene.
To this was added 3.65 g of the above n-butylphosphonic acid copper salt toluene dispersion (2) (containing 0.583 mmol of copper salt), stirred at 20 ° C. for 10 hours, and then irradiated with ultrasonic waves for 1.5 hours. Was dissolved uniformly.

  This dispersion was spread on a Teflon (registered trademark) vat and air-dried at 20 ° C. for 12 hours. Further, vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (3) (resin composition (3)) in which copper salt fine particles were dispersed.

(Evaluation)
<Preparation of resin sheet (5)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (3) in which copper salt fine particles are dispersed. A sheet (5) was obtained.

<Preparation of resin sheet (6)>
Except having replaced the resin sheet (1) with the resin sheet (5), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (6).

<Preparation of measurement sample (5)>
A measurement sample (5) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (5).

<Preparation of measurement sample (6)>
A measurement sample (6) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (6).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (5) and the measurement sample (6) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

YI of the measurement sample (5) was 5.6, and YI of the measurement sample (6) was 7.2. ΔYI of the measurement sample (5) and the measurement sample (6) was 1.6.
<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (6).

YI after 1000 hours was 10.3, and ΔYI was 3.1 (10.3-7.2) when the difference from YI before the long-term heat resistance test was ΔYI.
Example 4
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was used, and 11.3 mg of 1,2-epoxytetradecane (an epoxy compound represented by the formula (IV)) was added to 1 ml of toluene. A PVB resin (4) (resin composition (4)) in which copper salt fine particles were dispersed was obtained in the same manner as in Example 3 except that the solution was changed to a solution dissolved in.

(Evaluation)
<Preparation of resin sheet (7)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (4) in which copper salt fine particles are dispersed. A sheet (7) was obtained.

<Production of resin sheet (8)>
Except having replaced the resin sheet (1) with the resin sheet (7), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (8).

<Preparation of measurement sample (7)>
A measurement sample (7) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (7).

<Preparation of measurement sample (8)>
A measurement sample (8) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (8).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (7) and the measurement sample (8) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.

YI of the measurement sample (7) was 6.4, and YI of the measurement sample (8) was 7.9. ΔYI of the measurement sample (7) and the measurement sample (8) was 1.5.
<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (8).

YI after 1000 hours was 11.3, and ΔYI was 3.4 (11.3-7.9), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 5
(Preparation of copper salt fine particle dispersed resin)
A solution of 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane dissolved in 1 ml of toluene was dissolved in 5.0 mg of trans-stilbene oxide (an epoxy compound represented by the formula (V)) in 3 ml of toluene. The PVB resin (5) (resin composition (5)) in which the copper salt fine particles were dispersed was obtained in the same manner as in Example 3 except that the solution was replaced with the above solution.

(Evaluation)
<Preparation of resin sheet (9)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (5) in which copper salt fine particles are dispersed. Sheet (9) was obtained.

<Preparation of resin sheet (10)>
Except having replaced the resin sheet (1) with the resin sheet (9), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (10).

<Preparation of measurement sample (9)>
A measurement sample (9) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (9).

<Preparation of measurement sample (10)>
A measurement sample (10) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (10).

<Evaluation of heat resistance>
The spectrum of the measurement sample (9) and the measurement sample (10) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

YI of the measurement sample (9) was 6.8, and YI of the measurement sample (10) was 11.0. ΔYI of the measurement sample (9) and the measurement sample (10) was 4.2.
<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (10).

YI after 1000 hours was 17.2, and ΔYI was 6.2 (17.2-11.0), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 6
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was treated with glycidyl (2S)-(+)-p-toluenesulfonate (epoxy represented by the formula (VI)). Compound) PVB resin (6) (resin composition (6)) in which copper salt fine particles were dispersed was obtained in the same manner as in Example 3 except that 5.0 mg was replaced with a solution of 3 ml of toluene.

(Evaluation)
<Preparation of resin sheet (11)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (6) in which copper salt fine particles are dispersed. A sheet (11) was obtained.

<Preparation of resin sheet (12)>
Except having replaced the resin sheet (1) with the resin sheet (11), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (12).

<Preparation of measurement sample (11)>
A measurement sample (11) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (11).

<Preparation of measurement sample (12)>
A measurement sample (12) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (12).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (11) and the measurement sample (12) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (11) was 6.6, and YI of the measurement sample (12) was 12.0. ΔYI of the measurement sample (11) and the measurement sample (12) was 5.4.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (12).

YI after 1000 hours was 16.3, and ΔYI was 4.3 (16.3-12.0), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 7
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was represented by Epolite 40E (ethylene glycol diglycidyl ether) (manufactured by Kyoeisha Chemical Co., Ltd.) (formula (VII)). The epoxy compound is obtained in the same manner as in Example 3 except that 5.0 mg of toluene is dissolved in 3 ml of toluene to obtain a PVB resin (7) (resin composition (7)) in which copper salt fine particles are dispersed. It was.

(Evaluation)
<Preparation of resin sheet (13)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (7) in which copper salt fine particles are dispersed. A sheet (13) was obtained.

<Preparation of resin sheet (14)>
Except having replaced the resin sheet (1) with the resin sheet (13), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (14).

<Preparation of measurement sample (13)>
A measurement sample (13) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (13).

<Preparation of measurement sample (14)>
A measurement sample (14) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (14).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (13) and the measurement sample (14) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (13) was 6.3, and YI of the measurement sample (14) was 11.8. ΔYI of the measurement sample (13) and the measurement sample (14) was 5.5.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (14).

YI after 1000 hours was 16.0, and ΔYI was 4.2 (16.0-11.8), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 8
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was converted to Epolite 100MF (trimethylolpropane triglycidyl ether) (manufactured by Kyoeisha Chemical Co., Ltd.) (formula (VIII)). (Epoxy compound represented) PVB resin (8) (resin composition (8)) in which copper salt fine particles were dispersed was carried out in the same manner as in Example 3 except that 5.0 mg was replaced with a solution of 3 ml of toluene. Obtained.

(Evaluation)
<Production of resin sheet (15)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (8) in which copper salt fine particles are dispersed. A sheet (15) was obtained.

<Preparation of resin sheet (16)>
Except having replaced the resin sheet (1) with the resin sheet (15), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (16).

<Preparation of measurement sample (15)>
A measurement sample (15) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (15).

<Preparation of measurement sample (16)>
A measurement sample (16) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (16).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (15) and the measurement sample (16) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (15) was 6.6, and YI of the measurement sample (16) was 12.8. ΔYI of the measurement sample (15) and the measurement sample (16) was 6.2.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (16).

YI after 1000 hours was 16.7, and ΔYI was 3.9 (16.7-12.8) when the difference from YI before the long-term heat resistance test was ΔYI.
Example 9
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was added to Epolite 4000 (hydrogenated bisphenol A diglycidyl ether) (manufactured by Kyoeisha Chemical Co., Ltd.) (formula (IX) PVB resin (9) (resin composition (9)) in which copper salt fine particles are dispersed, except that 5.0 mg of the epoxy compound is replaced with a solution obtained by dissolving 5.0 mg of toluene in 3 ml of toluene. Got.

(Evaluation)
<Preparation of resin sheet (17)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (9) in which copper salt fine particles are dispersed. A sheet (17) was obtained.

<Preparation of resin sheet (18)>
Except having replaced the resin sheet (1) with the resin sheet (17), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (18).

<Preparation of measurement sample (17)>
A measurement sample (17) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (17).

<Preparation of measurement sample (18)>
A measurement sample (18) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (18).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (17) and the measurement sample (18) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (17) was 6.2, and YI of the measurement sample (18) was 11.5. ΔYI of the measurement sample (17) and the measurement sample (18) was 5.3.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (18).

YI after 1000 hours was 16.2, and ΔYI was 4.7 (16.2-11.5), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 10
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was converted to 5.0 mg of 1,4-butanediol diglycidyl ether (an epoxy compound represented by the formula (X)). A PVB resin (10) (resin composition (10)) in which copper salt fine particles were dispersed was obtained in the same manner as in Example 3 except that the solution was replaced with a solution in which 3 ml of methanol was dissolved.

(Evaluation)
<Preparation of resin sheet (19)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (10) in which copper salt fine particles are dispersed. A sheet (19) was obtained.

<Preparation of resin sheet (20)>
Except having replaced the resin sheet (1) with the resin sheet (19), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (20).

<Preparation of measurement sample (19)>
A measurement sample (19) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (19).

<Preparation of measurement sample (20)>
A measurement sample (20) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (20).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (19) and the measurement sample (20) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (19) was 6.8, and YI of the measurement sample (20) was 11.0. ΔYI of the measurement sample (19) and the measurement sample (20) was 4.2.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (20).

YI after 1000 hours was 15.3, and ΔYI was 4.3 (15.3-11.0), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 11
(Preparation of copper salt fine particle dispersed resin)
A solution of 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane dissolved in 1 ml of toluene was dissolved in 5.0 mg of benzyl glycidyl ether (an epoxy compound represented by the formula (XI)) in 3 ml of toluene. Except having replaced with the solution, it carried out similarly to Example 3 and obtained PVB resin (11) (resin composition (11)) in which the copper salt fine particles were disperse | distributed.

(Evaluation)
<Production of resin sheet (21)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (11) in which copper salt fine particles are dispersed. A sheet (21) was obtained.

<Production of resin sheet (22)>
Except having replaced the resin sheet (1) with the resin sheet (21), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (22).

<Preparation of measurement sample (21)>
A measurement sample (21) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (21).

<Preparation of measurement sample (22)>
A measurement sample (22) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (22).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (21) and the measurement sample (22) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (21) was 6.8, and YI of the measurement sample (22) was 11.2. ΔYI of the measurement sample (21) and the measurement sample (22) was 4.4.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (22).

YI after 1000 hours was 16.5, and ΔYI was 5.3 (16.5-11.2), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 12
(Preparation of copper salt fine particle dispersed resin)
A solution of 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane dissolved in 1 ml of toluene was added with 5.0 mg of glycidyl 4-tert-butylbenzoate (an epoxy compound represented by the formula (XII)). Except having replaced with the solution melt | dissolved in toluene 3ml, it carried out similarly to Example 3 and obtained PVB resin (12) (resin composition (12)) in which the copper salt fine particles were disperse | distributed.

(Evaluation)
<Preparation of resin sheet (23)>
Except that the PVB resin (1) in which the copper salt fine particles are dispersed is replaced with the PVB resin (12) in which the copper salt fine particles are dispersed, the same procedure as in <Preparation of resin sheet (1)> in Example 1 is carried out. A sheet (23) was obtained.

<Production of resin sheet (24)>
Except having replaced the resin sheet (1) with the resin sheet (23), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (24).

<Preparation of measurement sample (23)>
A measurement sample (23) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (23).

<Preparation of measurement sample (24)>
A measurement sample (24) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (24).

<Evaluation of heat resistance>
The spectra of the measurement sample (23) and the measurement sample (24) were measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (23) was 6.8, and YI of the measurement sample (24) was 11.8. ΔYI of the measurement sample (23) and the measurement sample (24) was 5.0.

<Evaluation of long-term heat resistance>
YI was obtained in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (24).

YI after 1000 hours was 17.4, and ΔYI was 5.6 (17.4-11.8), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 13
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was represented by Epolite 80MF (glycerin diglycidyl ether) (manufactured by Kyoeisha Chemical Co., Ltd.) (formula (XIII)). (Epoxy compound) PVB resin (13) (resin composition (13)) in which copper salt fine particles were dispersed was obtained in the same manner as in Example 3 except that 5.0 mg was replaced with a solution in 3 ml of methanol. .

(Evaluation)
<Production of resin sheet (25)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (13) in which copper salt fine particles are dispersed. A sheet (25) was obtained.

<Production of resin sheet (26)>
Except having replaced the resin sheet (1) with the resin sheet (25), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (26).

<Preparation of measurement sample (25)>
A measurement sample (25) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (25).

<Preparation of measurement sample (26)>
A measurement sample (26) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (26).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (25) and the measurement sample (26) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (25) was 6.3, and YI of the measurement sample (26) was 11.8. ΔYI of the measurement sample (25) and the measurement sample (26) was 5.5.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (26).

YI after 1000 hours was 15.7, and ΔYI was 3.9 (15.7-11.8), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 14
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was added to Epolite 400E (polyethylene glycol # 400 diglycidyl ether) (manufactured by Kyoeisha Chemical Co., Ltd.) (formula (XIV) PVB resin (14) in which copper salt fine particles are dispersed (resin composition (14)) except that the epoxy compound represented by formula (1) is replaced with a solution obtained by dissolving 10.0 mg in 3 ml of methanol. Got.

(Evaluation)
<Preparation of resin sheet (27)>
Except that the PVB resin (1) in which the copper salt fine particles are dispersed is replaced with the PVB resin (14) in which the copper salt fine particles are dispersed, the same procedure as in <Preparation of the resin sheet (1)> in Example 1 is carried out. A sheet (27) was obtained.

<Production of resin sheet (28)>
Except having replaced the resin sheet (1) with the resin sheet (27), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (28).

<Preparation of measurement sample (27)>
A measurement sample (27) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (27).

<Preparation of measurement sample (28)>
A measurement sample (28) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (28).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (27) and the measurement sample (28) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (27) was 6.4, and YI of the measurement sample (28) was 12.2. ΔYI of the measurement sample (27) and the measurement sample (28) was 5.8.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (28).

YI after 1000 hours was 16.7, and ΔYI was 4.5 (16.7-12.2), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 15
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was added to Epolite 1600 (1,6-hexanediol diglycidyl ether) (manufactured by Kyoeisha Chemical Co., Ltd.) (formula ( PVV resin (15) (resin composition (15) in which copper salt fine particles are dispersed, except that the epoxy compound represented by XV) is replaced with a solution obtained by dissolving 5.0 mg of methanol in 3 ml of methanol. )).

(Evaluation)
<Production of resin sheet (29)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (15) in which copper salt fine particles are dispersed. A sheet (29) was obtained.

<Preparation of resin sheet (30)>
Except having replaced the resin sheet (1) with the resin sheet (29), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (30).

<Preparation of measurement sample (29)>
A measurement sample (29) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (29).

<Preparation of measurement sample (30)>
A measurement sample (30) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (30).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (29) and the measurement sample (30) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (29) was 6.5, and YI of the measurement sample (30) was 12.2. ΔYI of the measurement sample (29) and the measurement sample (30) was 5.7.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (30).

YI after 1000 hours was 16.9, and ΔYI was 4.7 (16.9-12.2), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 16
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was prepared as Epolite M-1230 (manufactured by Kyoeisha Chemical Co., Ltd.) (an epoxy compound represented by the formula (XVI)). A PVB resin (16) (resin composition (16)) in which copper salt fine particles were dispersed was obtained in the same manner as in Example 3 except that 5.0 mg was replaced with a solution of 3 ml of toluene.

  Epolite M-1230 is a mixture of an alkyl glycidyl ether having an alkyl group having 12 carbon atoms and an alkyl glycidyl ether having an alkyl group having 13 carbon atoms. The number of 13 is 56 mol%.

(Evaluation)
<Preparation of resin sheet (31)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (16) in which copper salt fine particles are dispersed. A sheet (31) was obtained.

<Production of resin sheet (32)>
Except having replaced the resin sheet (1) with the resin sheet (31), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (32).

<Preparation of measurement sample (31)>
A measurement sample (31) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (31).

<Preparation of measurement sample (32)>
A measurement sample (32) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (32).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (31) and the measurement sample (32) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (31) was 7.5, and YI of the measurement sample (32) was 13.2. ΔYI of the measurement sample (31) and the measurement sample (32) was 5.7.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (32).

YI after 1000 hours was 18.6, and ΔYI was 5.4 (18.6-13.2), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 17
(Preparation of copper salt fine particle dispersed resin)
An epoxy compound represented by the formula (XVII) obtained by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene was used as an EPOlite 3002 (N) (manufactured by Kyoeisha Chemical Co., Ltd.) ) A PVB resin (17) (resin composition (17)) in which copper salt fine particles were dispersed was obtained in the same manner as in Example 3 except that 10.0 mg was replaced with a solution of 3 ml of toluene.

(Evaluation)
<Production of resin sheet (33)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (17) in which copper salt fine particles are dispersed. A sheet (33) was obtained.

<Preparation of resin sheet (34)>
Except having replaced the resin sheet (1) with the resin sheet (33), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (34).

<Preparation of measurement sample (33)>
A measurement sample (33) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (33).

<Preparation of measurement sample (34)>
A measurement sample (34) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (34).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (33) and the measurement sample (34) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (33) was 7.3, and YI of the measurement sample (34) was 13.0. ΔYI of the measurement sample (33) and the measurement sample (34) was 5.7.

<Evaluation of long-term heat resistance>
YI was obtained in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (34).

YI after 1000 hours was 17.7, and ΔYI was 4.7 (17.7-13.0), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 18
(Preparation of copper salt fine particle dispersed resin)
A solution of 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane dissolved in 1 ml of toluene and a solution of 7.0 mg of 2,2-bis (4-glycidyloxyphenyl) propane dissolved in 3 ml of toluene The PVB resin (18) (resin composition (18)) in which the copper salt fine particles were dispersed was obtained in the same manner as in Example 3 except that the above was replaced.

(Evaluation)
<Production of resin sheet (35)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (18) in which copper salt fine particles are dispersed. A sheet (35) was obtained.

<Production of resin sheet (36)>
Except having replaced the resin sheet (1) with the resin sheet (35), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (36).

<Preparation of measurement sample (35)>
A measurement sample (35) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (35).

<Preparation of measurement sample (36)>
A measurement sample (36) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (36).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (35) and the measurement sample (36) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (35) was 8.1, and YI of the measurement sample (36) was 12.5. ΔYI of the measurement sample (35) and the measurement sample (36) was 4.4.

<Evaluation of long-term heat resistance>
YI was obtained in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (36).

YI after 1000 hours was 16.5, and ΔYI was 4.0 (16.5-12.5), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 19
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene and a solution prepared by dissolving 14.0 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 3 ml of toluene A PVB resin (19) (resin composition (19)) in which copper salt fine particles were dispersed was obtained in the same manner as in Example 3, except that the above was replaced.

(Evaluation)
<Preparation of resin sheet (37)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (19) in which copper salt fine particles are dispersed. A sheet (37) was obtained.

<Preparation of resin sheet (38)>
Except having replaced the resin sheet (1) with the resin sheet (37), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (38).

<Preparation of measurement sample (37)>
A measurement sample (37) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (37).

<Preparation of measurement sample (38)>
A measurement sample (38) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (38).

<Evaluation of heat resistance>
The spectra of the measurement sample (37) and the measurement sample (38) were measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  The YI of the measurement sample (37) was 8.0, and the YI of the measurement sample (38) was 13.2. ΔYI of the measurement sample (37) and the measurement sample (38) was 5.2.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (38).

YI after 1000 hours was 17.5, and ΔYI was 4.3 (17.5-13.2), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 20
(Preparation of copper salt fine particle dispersed resin)
A solution prepared by dissolving 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 1 ml of toluene and a solution prepared by dissolving 23.36 mg of 2,2-bis (4-glycidyloxyphenyl) propane in 3 ml of toluene The PVB resin (20) (resin composition (20)) in which the copper salt fine particles were dispersed was obtained in the same manner as in Example 3 except that the above was replaced.

(Evaluation)
<Preparation of resin sheet (39)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (20) in which copper salt fine particles are dispersed. A sheet (39) was obtained.

<Production of resin sheet (40)>
Except having replaced the resin sheet (1) with the resin sheet (39), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (40).

<Preparation of measurement sample (39)>
A measurement sample (39) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (39).

<Preparation of measurement sample (40)>
A measurement sample (40) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (40).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (39) and the measurement sample (40) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (39) was 7.7, and YI of the measurement sample (40) was 12.8. ΔYI of the measurement sample (39) and the measurement sample (40) was 5.1.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1, except that the measurement sample (2) was replaced with the measurement sample (40).

YI after 1000 hours was 17.5, and ΔYI was 4.7 (17.5-12.8), where ΔYI was the difference from YI before the long-term heat resistance test.
Example 21
(Preparation of copper salt fine particle dispersed resin)
Except that the solution in which 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane was dissolved in 1 ml of toluene was replaced with a solution in which 10.0 mg of Epolite 100MF was dissolved in 3 ml of toluene, the same as in Example 3. The PVB resin (21) (resin composition (21)) in which the copper salt fine particles were dispersed was obtained.

(Evaluation)
<Preparation of resin sheet (41)>
Resin made in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (21) in which copper salt fine particles are dispersed. A sheet (41) was obtained.

<Preparation of resin sheet (42)>
Except having replaced the resin sheet (1) with the resin sheet (41), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (42).

<Preparation of measurement sample (41)>
A measurement sample (41) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (41).

<Preparation of measurement sample (42)>
A measurement sample (42) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (42).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (41) and the measurement sample (42) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (41) was 10.9, and YI of the measurement sample (42) was 15.7. ΔYI of the measurement sample (41) and the measurement sample (42) was 4.8.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (42).

YI after 1000 hours was 19.6, and ΔYI was 3.9 (19.6 to 15.7) when the difference from YI before the long-term heat resistance test was ΔYI.
[Example 22]
(Preparation of copper salt fine particle dispersed resin)
Except that the solution in which 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane was dissolved in 1 ml of toluene was replaced with a solution in which 20.0 mg of Epolite 100MF was dissolved in 3 ml of toluene, the same as in Example 3. The PVB resin (22) (resin composition (22)) in which copper salt fine particles were dispersed was obtained.

(Evaluation)
<Preparation of resin sheet (43)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (22) in which copper salt fine particles are dispersed. A sheet (43) was obtained.

<Production of resin sheet (44)>
Except having replaced the resin sheet (1) with the resin sheet (43), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (44).

<Preparation of measurement sample (43)>
A measurement sample (43) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1, except that the resin sheet (1) was replaced with a resin sheet (43).

<Preparation of measurement sample (44)>
A measurement sample (44) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (44).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (43) and the measurement sample (44) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (43) was 10.4, and YI of the measurement sample (44) was 14.3. ΔYI of the measurement sample (43) and the measurement sample (44) was 3.9.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (44).

YI after 1000 hours was 18.2, and ΔYI was 3.9 (18.2-14.3) when the difference from YI before the long-term heat resistance test was ΔYI.
Example 23
(Preparation of copper salt fine particle dispersed resin)
Except that the solution in which 6.8 mg of 2,2-bis (4-glycidyloxyphenyl) propane was dissolved in 1 ml of toluene was replaced with a solution in which 30.0 mg of Epolite 100MF was dissolved in 3 ml of toluene, the same as in Example 3. The PVB resin (23) (resin composition (23)) in which the copper salt fine particles were dispersed was obtained.

(Evaluation)
<Production of resin sheet (45)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (23) in which copper salt fine particles are dispersed. A sheet (45) was obtained.

<Preparation of resin sheet (46)>
Except having replaced the resin sheet (1) with the resin sheet (45), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (46).

<Preparation of measurement sample (45)>
A measurement sample (45) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (45).

<Preparation of measurement sample (46)>
A measurement sample (46) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (46).

<Evaluation of heat resistance>
Spectroscopy of the measurement sample (45) and the measurement sample (46) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.

  YI of the measurement sample (45) was 10.4, and YI of the measurement sample (46) was 14.7. ΔYI of the measurement sample (45) and the measurement sample (46) was 4.3.

<Evaluation of long-term heat resistance>
YI was determined in the same manner as in the section <Evaluation of long-term heat resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (46).

  YI after 1000 hours was 18.1, and ΔYI was 3.4 (18.1 to 14.7) when the difference from YI before the long-term heat resistance test was ΔYI.

Claims (8)

It is a resin composition comprising a near infrared absorber, an epoxy compound, and a resin,
The resin composition, wherein the near-infrared absorber is a fine particle composed of a phosphonic acid copper salt represented by the following general formula (1).

[In General Formula (1), R ¹ is a monovalent group represented by —CH ₂ CH ₂ —R ¹¹ , and R ¹¹ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups. ]   The resin composition of Claim 1 whose molecular weight of the said epoxy compound is 100-4000.   The resin is at least one selected from polyvinyl acetal resin, ethylene-vinyl acetate copolymer, (meth) acrylic acid resin, polyester resin, polyurethane resin, vinyl chloride resin, polyolefin resin, polycarbonate resin, and norbornene resin. The resin composition according to claim 1, which is a resin.   The resin composition according to claim 1 or 2, wherein the resin is a polyvinyl butyral resin or an ethylene-vinyl acetate copolymer.   The resin composition as described in any one of Claims 1-4 which contains 0.05-50 mass parts of near-infrared absorbers per 100 mass parts of said resin.   The resin composition as described in any one of Claims 1-5 which contains 0.005-5.0 mass part of epoxy compounds per 100 mass parts of said resin.   The intermediate film for laminated glasses formed from the resin composition as described in any one of the said Claims 1-6.   Laminated glass having the interlayer film for laminated glass according to claim 7.