WO2014175231A1 - Resin composition and use thereof - Google Patents

Resin composition and use thereof Download PDF

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Publication number
WO2014175231A1
WO2014175231A1 PCT/JP2014/061202 JP2014061202W WO2014175231A1 WO 2014175231 A1 WO2014175231 A1 WO 2014175231A1 JP 2014061202 W JP2014061202 W JP 2014061202W WO 2014175231 A1 WO2014175231 A1 WO 2014175231A1
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WIPO (PCT)
Prior art keywords
resin
measurement sample
resin sheet
evaluation
group
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PCT/JP2014/061202
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French (fr)
Japanese (ja)
Inventor
巨樹 岩間
町田 克一
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株式会社クレハ
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Publication of WO2014175231A1 publication Critical patent/WO2014175231A1/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/49Phosphorus-containing compounds
    • C08K5/51Phosphorus bound to oxygen
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10614Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer comprising particles for purposes other than dyeing
    • B32B17/10633Infrared radiation absorbing or reflecting agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10761Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing vinyl acetal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10005Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
    • B32B17/1055Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
    • B32B17/10788Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing ethylene vinylacetate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0091Complexes with metal-heteroatom-bonds

Definitions

  • the present invention relates to a resin composition and its use, and more particularly to a resin composition comprising a near-infrared absorber, a phosphoric acid triester, and a resin, and its use.
  • laminated glass is used in various applications such as vehicles such as automobiles, buildings, and solar cells.
  • an interlayer film for laminated glass a polyvinyl butyral resin film, an ionomer resin film, and the like are known.
  • the sun rays include ultraviolet rays, infrared rays and the like in addition to visible rays.
  • infrared rays infrared rays having a wavelength close to visible light are called near infrared rays.
  • Near-infrared rays are also called heat rays and are one of the causes of temperature rise inside vehicles and buildings.
  • Patent Document 1 a copper salt composition containing a phosphonic acid copper salt, a polysiloxane component, a plasticizer, and a dispersant is known (see, for example, Patent Document 1).
  • Patent Document 1 provides an infrared absorption film in which the resin composition containing the copper salt composition and the resin is excellent in visible light transmission and stability even when exposed to high temperatures. It is disclosed that it is possible.
  • the present invention has been made in view of the above prior art, and an object thereof is to provide a resin composition containing a near-infrared absorber, which is excellent in light resistance and heat resistance.
  • the resin composition of the present invention is a resin composition comprising a near-infrared absorber, a phosphate triester, and a resin
  • the near-infrared absorber is a phosphonic acid represented by the following general formula (1). It is fine particles made of a copper salt, and the phosphoric acid triester is a phosphoric acid triester represented by the following general formula (2).
  • R 1 is a monovalent group represented by —CH 2 CH 2 —R 11
  • R 11 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups.
  • each R is independently an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 35 carbon atoms, a phenyl group, or a phenyl group having a substituent, The number is 15 or less.
  • each R is preferably independently a phenyl group having a substituent.
  • the resin composition further contains a phosphorus-based antioxidant.
  • the resin is at least one selected from polyvinyl acetal resin, ethylene-vinyl acetate copolymer, (meth) acrylic acid resin, polyester resin, polyurethane resin, vinyl chloride resin, polyolefin resin, polycarbonate resin, and norbornene resin.
  • a resin is preferable, and a polyvinyl butyral resin or an ethylene-vinyl acetate copolymer is more preferable.
  • the interlayer film for laminated glass of the present invention is formed from the resin composition.
  • the laminated glass of the present invention has the interlayer film for laminated glass.
  • the resin composition of the present invention has excellent light resistance and excellent heat resistance.
  • the resin composition of the present invention is a resin composition comprising a near-infrared absorber, a phosphate triester, and a resin, and the near-infrared absorber is a copper phosphonate represented by the following general formula (1). It is fine particles made of a salt, and the phosphate triester is a phosphate triester represented by the following general formula (2).
  • the resin composition of the present invention is also referred to as a copper salt fine particle dispersed resin.
  • the near-infrared absorber used in the present invention is fine particles composed of a phosphonic acid copper salt represented by the following general formula (1).
  • the fine particles comprising the phosphonic acid copper salt represented by the following general formula (1) may be formed only from the phosphonic acid copper salt represented by the following general formula (1), and represented by the following general formula (1).
  • the phosphonic acid copper salt may be formed from other components.
  • R 1 is a monovalent group represented by —CH 2 CH 2 —R 11
  • R 11 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups.
  • R 11 is preferably a hydrogen atom or an alkyl group having 1 to 20 carbon atoms.
  • R 11 hydrogen atom, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group Tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group and the like are preferable.
  • a phosphonic acid copper salt represented by General formula (1) it may be used individually by 1 type, or 2 or more types may be used.
  • the “phosphonic acid copper salt represented by the general formula (1)” is also simply referred to as “phosphonic acid copper salt”.
  • phosphonic acid copper salt there is no limitation in particular as a manufacturing method of the microparticles
  • a step of mixing a phosphonic acid compound represented by the following general formula (4) and a copper salt in a solvent to obtain a reaction mixture (hereinafter also referred to as a reaction step). )
  • a method having a step of obtaining fine particles composed of a copper phosphonate by removing the solvent in the reaction mixture (hereinafter also referred to as a solvent removal step).
  • R 1 is a monovalent group represented by —CH 2 CH 2 —R 11
  • R 11 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups.
  • the phosphonic acid compound represented by the general formula (4) those in which R 11 is a hydrogen atom or an alkyl group having 1 to 20 carbon atoms are preferable.
  • Examples of the phosphonic acid compound represented by the general formula (4) include ethylphosphonic acid, propylphosphonic acid, butylphosphonic acid, pentylphosphonic acid, hexylphosphonic acid, heptylphosphonic acid, octylphosphonic acid, nonylphosphonic acid, and decylphosphonic acid.
  • Examples thereof include alkylphosphonic acids such as acid, undecylphosphonic acid, dodecylphosphonic acid, tridecylphosphonic acid, tetradecylphosphonic acid, pentadecylphosphonic acid, hexadecylphosphonic acid, heptadecylphosphonic acid, and octadecylphosphonic acid.
  • a phosphonic acid compound represented by General formula (4) it may be used individually by 1 type, or 2 or more types may be used.
  • the copper salt a copper salt capable of supplying divalent copper ions is usually used.
  • the copper salt may be a copper salt other than the phosphonic acid copper salt represented by the general formula (1).
  • Examples of the copper salt include copper of organic acids such as anhydrous copper acetate, anhydrous copper formate, anhydrous copper stearate, anhydrous copper benzoate, anhydrous ethyl acetoacetate copper, anhydrous pyrophosphate, anhydrous naphthenic acid copper, and anhydrous copper citrate.
  • Salt, hydrate or hydrate of copper salt of organic acid copper salt of inorganic acid such as copper oxide, copper chloride, copper sulfate, copper nitrate, basic copper carbonate, hydrate of copper salt of inorganic acid Or a hydrate; copper hydroxide is mentioned.
  • copper salt you may use individually by 1 type, or may use 2 or more types.
  • anhydrous copper acetate and copper acetate monohydrate are preferably used in terms of solubility and removal of by-products.
  • a dispersant may be used in the reaction step.
  • the dispersant include at least one phosphate ester compound selected from a phosphate ester compound represented by the general formula (3a) and a phosphate ester compound represented by the general formula (3b), the phosphoric acid
  • the phosphoric acid in an ester compound, ie, the compound which neutralized the hydroxyl group with the base is mentioned.
  • inorganic bases such as lithium hydroxide, sodium hydroxide, potassium hydroxide, cesium hydroxide, magnesium hydroxide, calcium hydroxide, are mentioned.
  • R 21 , R 22 and R 23 are monovalent groups represented by — (CH 2 CH 2 O) n R 55 , and n is from 2 to 65.
  • R 55 is an integer
  • R 55 represents an alkyl group having 6 to 25 carbon atoms or an alkylphenyl group having 6 to 25 carbon atoms.
  • R 21 , R 22 and R 23 may be the same or different.
  • N is an integer of 2 to 65, preferably an integer of 4 to 65, more preferably 4 to 45, and particularly preferably an integer of 4 to 35.
  • n is less than 2
  • transparency may be insufficient when a laminated glass or the like is produced.
  • n exceeds 65 the amount of the phosphoric acid ester compound necessary for obtaining laminated glass having sufficient transparency tends to increase, resulting in high costs.
  • R 55 is an alkyl group having 6 to 25 carbon atoms or an alkylphenyl group having 6 to 25 carbon atoms, preferably an alkyl group having 6 to 25 carbon atoms, and preferably an alkyl group having 8 to 20 carbon atoms. Is more preferable, and 12 to 20 alkyl groups are particularly preferable.
  • R 55 is a group having less than 6 carbon atoms, transparency may be insufficient when a laminated glass or the like is produced. Further, when R 55 is a group having more than 25 carbon atoms, the amount of the phosphate ester compound necessary for obtaining a laminated glass having sufficient transparency tends to increase, resulting in high costs. .
  • the phosphoric acid ester compound represented by the general formula (3a) and the phosphoric acid ester compound represented by the general formula (3b) Although at least one is preferably used, it is more preferable to use both the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b). It is preferable to use the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) because they tend to be excellent in transparency and heat resistance of laminated glass and the like.
  • the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) are used, the phosphate ester compound represented by the general formula (3a) And the ratio of the phosphoric acid ester compound represented by the general formula (3b) is not particularly limited, but is usually 10:90 to 90:10 in molar ratio ((3a) :( 3b)).
  • a phosphate ester compound represented by the said general formula (3a) it may be used individually by 1 type, or 2 or more types may be used, and the phosphate ester compound represented by the said General formula (3b) May be used alone or in combination of two or more.
  • phosphate ester compound selected from the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) commercially available phosphoric acid Ester compounds such as DLP-10, DDP-6, DDP-8, DDP-10, TDP-6, TDP-8, TDP-10 (manufactured by Nikko Chemicals Co., Ltd.), Plysurf A212C, Plysurf A215C Plysurf AL12H, plysurf AL, plysurf A208F, plysurf A208N, plysurf A208B, plysurf A219B, plysurf A210D (above, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) and the like can also be used.
  • DLP-10, DDP-6, DDP-8, DDP-10, TDP-6, TDP-8, TDP-10 manufactured by Nikko Chemicals Co., Ltd.
  • the phosphoric acid in these phosphate ester compounds ie, the compound which neutralized the hydroxyl group with the appropriate base can also be used.
  • the base used for neutralization include inorganic bases such as lithium hydroxide, sodium hydroxide, potassium hydroxide, cesium hydroxide, magnesium hydroxide, and calcium hydroxide.
  • the dispersant is at least one phosphate ester compound selected from a phosphate ester compound represented by the general formula (3a) and a phosphate ester compound represented by the general formula (3b), and / or
  • phosphoric acid in the phosphoric ester compound that is, a compound obtained by neutralizing a hydroxyl group with a base
  • 5 to 100 parts by mass is preferably used per 100 parts by mass of the copper salt, and 10 to 50 parts by mass is preferably used. More preferred.
  • the solvent examples include alcohols such as methanol, ethanol, isopropyl alcohol and n-butanol, tetrahydrofuran (THF), N, N-dimethylformamide (DMF), water and the like.
  • the solvent preferably includes at least one solvent selected from methanol, ethanol, isopropyl alcohol, n-butanol, N, N-dimethylformamide (DMF), and tetrahydrofuran (THF). Further, from the viewpoint of reactivity, it preferably contains at least one solvent selected from methanol, ethanol, THF, and DMF, and more preferably contains at least one solvent selected from methanol and ethanol. As said solvent, only these solvents may be included and the other solvent may be included.
  • the solvent examples include at least one solvent selected from methanol, ethanol, isopropyl alcohol, n-butanol, DMF, and THF (preferably at least one solvent selected from methanol, ethanol, THF, and DMF). More preferably at least one solvent selected from methanol and ethanol), and other solvents are usually contained in an amount of 0 to 50 parts by weight, preferably 0 to 30 parts by weight. Also good.
  • specific examples thereof include denatured ethanol containing ethanol and a small amount of other solvents.
  • Denatured ethanol usually contains 3 to 50 parts by mass, preferably 3 to 30 parts by mass of other solvents with respect to 100 parts by mass of ethanol.
  • the modified ethanol examples include methanol-modified ethanol, isopropyl alcohol-modified ethanol, and toluene-modified ethanol.
  • the reaction step is usually 0 to 80 ° C., preferably 10 to 60 ° C., more preferably room temperature to 60 ° C., particularly preferably 20 to 40 ° C., usually 0.5 to 60 hours, preferably Is carried out for 0.5 to 30 hours, more preferably 0.5 to 20 hours, particularly preferably 1 to 15 hours.
  • the phosphonic acid compound represented by the general formula (4) reacts with the copper salt, and fine phosphonic acid copper salt that does not dissolve in the solvent is generated by the reaction.
  • At least one phosphate ester compound selected from the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) acts as a good dispersant during the reaction. Therefore, the phosphonic acid copper salt can maintain high dispersibility and suppress aggregation.
  • the reaction step not only the reaction between the phosphonic acid compound represented by the general formula (4) and the copper salt, but also, for example, the phosphate ester compound represented by the general formula (3a) and the general formula (3b) At least one type of phosphate ester compound selected from the phosphate ester compounds represented by) may react with a part of the copper salt. Further, a part of the raw material may remain without reacting.
  • the fine particles composed of the copper phosphonate are usually obtained by removing at least a part of the solvent from the reaction mixture.
  • the solvent removal step at least a part of the solvent is removed from the reaction mixture.
  • the liquid components in the reaction mixture may be removed together.
  • Distillation is preferably performed under reduced pressure from the viewpoint of preventing thermal deterioration of the reaction mixture.
  • the conditions for vacuum distillation are usually 0.01 to 15 kPa.
  • the outflow temperature of the fraction varies depending on the type of solvent and the pressure, but is usually 30 to 150 ° C.
  • the reaction mixture is allowed to stand to precipitate fine particles composed of copper phosphonate, and the supernatant (solvent) is removed, or the reaction mixture is centrifuged.
  • fine-particles which consist of phosphonic acid copper salt and removing a supernatant liquid (solvent) is mentioned.
  • the phosphonic acid copper salt fine particles are dispersed in the dispersion medium, and then the dispersion medium is removed.
  • a process may be provided.
  • fine particles composed of the copper phosphonate fine particles composed of a copper phosphonate having an average particle diameter of 1 to 1000 nm are usually used.
  • the average particle size is more preferably 5 to 300 nm in order to ensure dispersibility in the monomer and transparency of the resin composition.
  • the phosphate triester used in the present invention is a phosphate triester represented by the following general formula (2).
  • each R is independently an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 35 carbon atoms, a phenyl group, or a phenyl group having a substituent, The number is 15 or less.
  • 1 type may be used or 2 or more types may be used.
  • Each R is preferably independently a phenyl group or a phenyl group having a substituent, and more preferably a phenyl group having a substituent.
  • the alkyl group having 1 to 20 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, Examples include a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, and an octadecyl group.
  • the alkyl group may have a branched structure.
  • the alkenyl group having 2 to 35 carbon atoms is preferably an alkenyl group having 4 to 25 carbon atoms.
  • Examples of the alkenyl group include an allyl group, a butenyl group, a hexenyl group, an octenyl group, a decenyl group, and an oleyl group. Note that the alkenyl group may have a branched structure.
  • the substituent that the phenyl group having the substituent has usually has 15 or less carbon atoms.
  • the phenyl group having a substituent may be any phenyl group having at least one substituent, and examples thereof include a phenyl group having 1 to 5 substituents, and a phenyl group having 1 to 3 substituents is preferable. A phenyl group having two substituents is more preferable.
  • the substituent is preferably present at least at the 1-position or the 3-position of the phenyl group, and preferably at least at the 1-position.
  • at least one of an alkyl group, an alkoxy group, an oxycarbonylalkyl group, a nitro group, a cyano group, an ester group, a halogen, a phenyl group, a benzyl group, a phenoxy group, and a hydrogen atom is an alkyl group, an alkoxy group, Oxycarbonylalkyl group, nitro group, ester group, cyano group, phenyl group substituted by halogen, etc.
  • at least one hydrogen atom on the benzene ring is alkyl group, alkoxy group, oxycarbonylalkyl group, nitro group, ester group , A benzyl group substituted with a cyano group, halogen, etc., a phenoxy group wherein at least one of the hydrogen
  • the substituent is preferably an alkyl group having 15 or less carbon atoms.
  • the alkyl group having 15 or less carbon atoms is more preferably an alkyl group having 1 to 5 carbon atoms, which is advantageous in terms of availability and price, and specifically includes a methyl group, an ethyl group, a propyl group, a butyl group, and a pentyl group. Is preferred.
  • the alkyl group having 15 or less carbon atoms is preferably a branched alkyl group for the purpose of suppressing hydrolysis of the phosphate ester.
  • the branched alkyl group include an isopropyl group as the propyl group, a sec-butyl group, an isobutyl group, and a tert-butyl group as the butyl group, and the pentyl group as Examples include 1-methylbutyl group, 2-methylbutyl group, 3-methylbutyl group, 1-ethylpropyl group, 1,1-dimethylpropyl group, 1,2-dimethylpropyl group, and 2,2-dimethylpropyl group.
  • phenyl group having the substituent for example, groups represented by the following formulas (i), (ii), and (iii) are preferable, and a group represented by (i) is more preferable.
  • phosphoric acid triester used in the present invention include phosphoric acid triesters represented by the following formulas (I) to (VII). (I) and (V) are preferred, and (I ) Is more preferable.
  • the resin composition of the present invention contains the phosphoric acid triester, coloring and reduction in visible light transmittance due to irradiation with light such as sunlight are suppressed, and yellowing during heating and the like is suppressed. Can be suppressed, which is preferable.
  • a resin is used.
  • the resin used in the present invention is not particularly limited as long as it can disperse the above-described near-infrared absorber.
  • the following resins can be used.
  • the resin used in the present invention is selected from polyvinyl acetal resin, ethylene-vinyl acetate copolymer, (meth) acrylic acid resin, polyester resin, polyurethane resin, vinyl chloride resin, polyolefin resin, polycarbonate resin, and norbornene resin. It is preferable that at least one type of resin can disperse the near-infrared absorber well and is excellent in visible light transmittance.
  • the resin used in the present invention is more preferably at least one resin selected from polyvinyl acetal resin and ethylene-vinyl acetate copolymer, polyvinyl butyral resin (PVB), and ethylene-vinyl acetate copolymer Particularly preferred is at least one resin selected from a coalescence, and most preferred is a polyvinyl butyral resin or an ethylene-vinyl acetate copolymer.
  • the polyvinyl acetal resin is used, the dispersibility of the above-mentioned near-infrared absorber is excellent.
  • the resin of the present invention is excellent in adhesion to glass or the like.
  • the composition is flexible and deformation of the near-infrared absorber due to a change in temperature hardly occurs.
  • polyvinyl acetal resin it is preferable to use polyvinyl butyral resin (PVB) from the viewpoints of glass adhesion, dispersibility, transparency, heat resistance, light resistance, and the like.
  • the polyvinyl acetal resin may be a blend of two or more kinds depending on the required physical properties, or may be a polyvinyl acetal resin obtained by acetalizing a combination of aldehydes during acetalization.
  • the molecular weight, molecular weight distribution, and degree of acetalization of the polyvinyl acetal resin are not particularly limited, but the degree of acetalization is generally 40 to 85%, with a preferred lower limit being 60% and an upper limit being 75%.
  • the polyvinyl acetal resin can be obtained by acetalizing a polyvinyl alcohol resin with an aldehyde.
  • the polyvinyl alcohol resin is generally obtained by saponifying polyvinyl acetate, and a polyvinyl alcohol resin having a saponification degree of 80 to 99.8 mol% is generally used.
  • the preferable lower limit of the viscosity average polymerization degree of the polyvinyl alcohol resin is 200, and the upper limit is 3000. If it is less than 200, the penetration resistance of the resulting laminated glass may be lowered. When it exceeds 3000, the moldability of the resin composition may be deteriorated, and the rigidity of the resin composition is excessively increased, resulting in poor processability.
  • a more preferred lower limit is 500 and an upper limit is 2200.
  • the viscosity average degree of polymerization and the degree of saponification of the polyvinyl alcohol resin can be measured based on, for example, JISK 6726 “Polyvinyl alcohol test method”.
  • the aldehyde is not particularly limited, and examples thereof include aldehydes having 1 to 10 carbon atoms, and more specifically, for example, n-butyraldehyde, isobutyraldehyde, n-valeraldehyde, 2-ethylbutylartaldehyde. N-hexylaldehyde, n-octylaldehyde, n-nonylaldehyde, n-decylaldehyde, formaldehyde, acetaldehyde, benzaldehyde and the like. Of these, n-butyraldehyde, n-hexylaldehyde, n-valeraldehyde and the like are preferable. More preferred is butyraldehyde having 4 carbon atoms.
  • the resin composition of the present invention may further contain a phosphorus-based antioxidant in addition to the near-infrared absorber, the phosphoric acid triester, and the resin.
  • the phosphorus-based antioxidant has at least one structure represented by the following general formula (A) in the molecule and has a structure represented by the following general formula (B) bonded to a phosphorus atom in the molecule. At least one phosphorus-based antioxidant selected from non-phosphorus-based antioxidants is preferred. As a phosphorus antioxidant, 1 type may be used or 2 or more types may be used.
  • R 2 to R 4 are each independently an alkyl group having 1 or 2 carbon atoms
  • R 5 to R 8 are each independently a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. Indicates. However, when two or more structures represented by the general formula (A) are present in the molecule, R 5 to R 8 of the structure represented by one general formula (A) are represented by the other general formula (A). Crosslinks with R 5 to R 8 having the structure shown may be formed.
  • R represents an alkyl group.
  • a phosphorus system having one or more structures represented by the general formula (A) bonded to a phosphorus atom in the molecule and having no structure represented by the general formula (B) bonded to a phosphorus atom in the molecule.
  • the antioxidant is also referred to as a specific phosphorus antioxidant.
  • the specific phosphorus-based antioxidant preferably has two or more structures represented by the general formula (A) bonded to a phosphorus atom in the molecule. That is, the phosphorus antioxidant has two or more structures represented by the general formula (A) bonded to the phosphorus atom in the molecule and is expressed by the general formula (B) bonded to the phosphorus atom. It is preferable that it is a phosphorus antioxidant which does not have a structure in a molecule
  • the specific phosphorus-based antioxidant has at least one phosphorus atom in the molecule.
  • the phosphorus atom constituting the specific phosphorus-based antioxidant usually has a +3 valence.
  • R 2 to R 4 are each independently an alkyl group having 1 or 2 carbon atoms.
  • R 5 to R 8 are each independently a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, preferably a hydrogen atom or an alkyl group having 1 to 7 carbon atoms.
  • R 5 to R 8 of the structure represented by one general formula (A) are represented by the other general formula (A).
  • Crosslinks with R 5 to R 8 having a structure as described above may be formed.
  • R 5 to R 8 of the structure represented by one general formula (A) form a bridge with R 5 to R 8 of the structure represented by the other general formula (A), Includes a single bond and an alkylene group having 1 to 4 carbon atoms, and a single bond is preferable.
  • the substituent at the ortho position of the oxygen atom that is, the group composed of the carbon atom and R 2 to R 4 is a bulky alkyl group, specifically a tertiary alkyl group. is there.
  • R 2 to R 4 are each independently an alkyl group having 1 or 2 carbon atoms, preferably a methyl group.
  • R 6 is preferably an alkyl group having 1 to 7 carbon atoms.
  • R 6 is preferably a bulky alkyl group, specifically, preferably a secondary or tertiary alkyl group, more preferably a tertiary alkyl group, and a t-butyl group. It is particularly preferred.
  • R 5 and R 7 are preferably each independently a hydrogen atom or an alkyl group having 1 to 2 carbon atoms.
  • R 8 is preferably a hydrogen atom or an alkyl group having 1 to 7 carbon atoms.
  • R 8 is preferably a bulky alkyl group, specifically a tertiary alkyl group, and more preferably a t-butyl group.
  • the specific phosphorus-based antioxidant is not particularly limited, and for example, a commercially available product can be used.
  • Specific phosphorus-based antioxidants include, for example, IRGAFOS 168 (manufactured by BASF) (the following formula 21), GSY-P101 (manufactured by Sakai Chemical Industry) (the following formula 22), Sumilizer GP (manufactured by Sumitomo Chemical) (the following formula 23) ) Can be used.
  • the phosphorus-based antioxidant represented by the formula 21 is commercially available from Johoku Chemical Industry under the trade name JP-650. As specific phosphorus antioxidant, 1 type may be used or 2 or more types may be used.
  • the specific phosphorus-based antioxidant preferably has two or more structures represented by the general formula (A) bonded to a phosphorus atom in the molecule as described above, and IRGAFOS 168 is generally bonded to a phosphorus atom.
  • the structure represented by formula (A) has three structures in the molecule, GSY-P101 has four structures represented by the general formula (A) bonded to the phosphorus atom in the molecule,
  • the molecule has two structures represented by the general formula (A) bonded to atoms.
  • R 8 having a structure represented by one general formula (A) is bridged with R 8 having a structure represented by the other general formula (A) by a single bond.
  • the specific phosphorus-based antioxidant used in the present invention includes a phosphorus atom having one phosphorus atom in the molecule and three structures represented by the general formula (A) bonded to the phosphorus atom in the molecule.
  • a system antioxidant is most preferable from the viewpoint of suppression of yellowing.
  • the specific phosphorus-based antioxidant used in the present invention does not have a structure represented by the general formula (B) bonded to a phosphorus atom in the molecule.
  • this inventor discovered that yellowing would occur easily when it has this structure. Although the detailed reason for which yellowing is likely to occur is unknown, the present inventors are one of the causes of yellowing that the structure represented by the general formula (B) is hydrolyzed by heating. Presumed to be.
  • a specific phosphorus antioxidant has one or more structures represented by the general formula (A) bonded to the phosphorus atom in the molecule, and is represented by the general formula (B) bonded to the phosphorus atom.
  • A the general formula
  • B the general formula
  • other structures are not particularly limited, but a hindered phenol structure may be included in the molecule.
  • the resin composition of the present invention is a resin composition comprising a near-infrared absorber, a phosphate triester, and a resin.
  • the resin composition of the present invention is excellent in light resistance and heat resistance. It is preferable that the resin composition of the present invention further contains a phosphorus-based antioxidant. It is preferable to contain a phosphorus-based antioxidant because even if the amount of phosphoric acid triester used is relatively small, the light resistance and heat resistance tend to be excellent, and the transparency of the resin composition tends to be excellent.
  • the resin composition of the present invention may be a composition comprising a near-infrared absorber, a phosphate triester, and a resin as described above, and preferably contains a phosphorus-based antioxidant,
  • the manufacturing method is not particularly limited.
  • the method for producing the resin composition of the present invention include resins such as toluene, ethanol / toluene mixed solvent, methanol / toluene mixed solvent, methylene chloride, chloroform and the like, resin triester, near infrared absorber dispersion, Examples thereof include a method of adding an optional phosphorus-based antioxidant, dissolving the resin by stirring, ultrasonic irradiation, etc., obtaining a dispersion, and removing the solvent from the dispersion.
  • the near-infrared absorbent dispersion can be prepared by dispersing the near-infrared absorbent in toluene, methanol, methylene chloride, chloroform, triethylene glycol bis (2-ethylhexanoate) or the like.
  • the resin composition of the present invention preferably contains 0.05 to 50 parts by mass, more preferably 0.1 to 25 parts by mass of a near infrared absorber per 100 parts by mass of the resin. If the amount is less than 0.05 parts by mass, sufficient near infrared absorption characteristics may not be obtained. If the amount is more than 50 parts by mass, the transparency and adhesiveness of the resin may be significantly reduced.
  • the resin composition of the present invention preferably contains 0.05 to 5.0 parts by mass, more preferably 0.1 to 3.0 parts by mass of the phosphoric acid triester per 100 parts by mass of the resin. preferable. If it is less than 0.05 parts by mass, it may not be possible to sufficiently suppress coloring or a decrease in visible light transmittance. If it is more than 5.0 parts by mass, it may be colored due to decomposition of the phosphate triester. The phosphoric acid triester may precipitate in the resin and the transparency of the resin film may be impaired.
  • the resin composition of the present invention contains the phosphorus antioxidant
  • the resin composition of the present invention has excellent near-infrared absorptivity, and is suitable as an intermediate film for structural materials such as laminated glass because coloring when irradiated with light and reduction in visible light transmittance are suppressed. Can be used. Further, since the resin composition of the present invention is also suppressed in coloring during heating, that is, yellowing, it can be suitably used as an intermediate film for structural materials such as laminated glass from this viewpoint. It is.
  • additives may be contained in the resin composition of the present invention.
  • the additive include a plasticizer, a dispersant, a crosslinking agent, a chelating agent, an antioxidant, an ultraviolet absorber, a light stabilizer, and a color tone correction agent. These additives may be added when manufacturing the resin composition of the present invention, and are added when manufacturing the above-mentioned near-infrared absorber, phosphate triester, resin, and phosphorus antioxidant, respectively. May be.
  • the resin composition of the present invention is usually used for applications where it is desired to absorb near infrared rays.
  • the resin film formed from the resin composition of the present invention has excellent near-infrared absorption ability, excellent light resistance, and is suppressed in terms of coloring during heating, that is, yellowing, so that it is a structural material such as an interlayer film for laminated glass It can be suitably used as an intermediate film for use.
  • the laminated glass of the present invention has the interlayer film for laminated glass.
  • glass which comprises the laminated glass of this invention A conventionally well-known thing can be used.
  • Example 1 Preparation of copper salt fine particle dispersed resin
  • 3GO triethylene glycol bis (2-ethylhexanoate)
  • plasticizer 250 ml
  • PVB polyvinyl butyral
  • the dispersion was spread on a Teflon (registered trademark) vat and air-dried at 20 ° C for 12 hours. Furthermore, vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (1) (resin composition (1)) in which copper salt fine particles were dispersed.
  • Teflon registered trademark
  • vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (1) (resin composition (1)) in which copper salt fine particles were dispersed.
  • the resin sheet (1) was further preheated at 200 ° C. and 3 MPa for 1 minute using a 0.8 mm-thick mold and a compression molding machine manufactured by Shindo Metal Industry Co., Ltd., and then at 10 MPa for 5 minutes.
  • the resin sheet (2) was obtained by pressing.
  • the laminated glass (1) was heated in an autoclave under a nitrogen atmosphere at a pressure of 1.5 MPa and 130 ° C. for 0.5 hours to obtain a measurement sample (1) in which slide glasses were disposed on both surfaces of the resin sheet. .
  • the haze of the measurement sample (1) was 8.7%, and the haze of the measurement sample (2) was 5.2%.
  • the spectrum of the measurement sample was measured using a spectrophotometer (U-4000, manufactured by Hitachi, Ltd.) in the wavelength range of 250 to 2500 nm. Tristimulus values (X, Y, Z) were calculated using a C light source.
  • the measurement sample (1) had a YI (yellowness index) of 4.6, and the measurement sample (2) had a YI of 7.4.
  • Tvis visible light transmittance
  • YI after 400 hours was 8.0, and ⁇ YI was 0.6 (8.0-7.4), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 81.3%, and the Tvis of the measurement sample (2) before the light resistance test was 85.5%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 4 2%.
  • PVB resin (c1) resin composition (c1)) in which copper salt fine particles were dispersed was carried out in the same manner as in Example 1 except that tris (2,4-di-tert-butylphenyl) phosphate was not used. Obtained.
  • a measurement sample (c1) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (c1).
  • the haze of the measurement sample (c1) was 1.1%, and the haze of the measurement sample (c2) was 1.4%.
  • the spectrum of the measurement sample (c1) and the measurement sample (c2) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (c1) was 4.3, and YI of the measurement sample (c2) was 9.4.
  • ⁇ YI of the measurement sample (c1) and the measurement sample (c2) was 5.1.
  • YI and Tvis were obtained in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (c2).
  • YI after 400 hours was 22.6, and ⁇ YI was 13.2 (22.6-9.4), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 24.6%, and the Tvis of the measurement sample (c2) before the light resistance test was 84.1%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 59 .5%.
  • Example 2 Preparation of copper salt fine particle dispersed resin
  • 3GO triethylene glycol bis (2-ethylhexanoate)
  • plasticizer 250 ml
  • PVB polyvinyl butyral
  • the dispersion was spread on a Teflon (registered trademark) vat and air-dried at 20 ° C for 12 hours. Furthermore, vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (2) (resin composition (2)) in which copper salt fine particles were dispersed.
  • Teflon registered trademark
  • vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (2) (resin composition (2)) in which copper salt fine particles were dispersed.
  • a measurement sample (3) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (3).
  • a measurement sample (4) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (4).
  • the haze of the measurement sample (3) was 1.4%, and the haze of the measurement sample (4) was 2.7%.
  • ⁇ Evaluation of heat resistance> The spectra of the measurement sample (3) and the measurement sample (4) were measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • the YI of the measurement sample (3) was 4.6, and the YI of the measurement sample (4) was 8.6.
  • ⁇ YI of the measurement sample (3) and the measurement sample (4) was 4.0.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (4).
  • YI after 400 hours was 9.8, and ⁇ YI was 1.2 (9.8-8.6), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 81.8%, and the Tvis of the measurement sample (4) before the light resistance test was 84.3%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 2 .5%.
  • Example 3 Preparation of copper salt fine particle dispersed resin
  • PVB resin (3) in which copper salt fine particles are dispersed (resin composition (3)) except that the amount of tris (2,4-di-tertiarybutylphenyl) phosphate used is changed from 150 mg to 50 mg. 3) was obtained.
  • a measurement sample (5) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (5).
  • the haze of the measurement sample (5) was 1.6%, and the haze of the measurement sample (6) was 1.9%.
  • Spectroscopy of the measurement sample (5) and the measurement sample (6) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (5) was 4.8, and YI of the measurement sample (6) was 7.8.
  • ⁇ YI of the measurement sample (5) and the measurement sample (6) was 3.0.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (6).
  • YI after 400 hours was 14.6, and ⁇ YI was 6.8 (14.6-7.8) when the difference from YI before the light resistance test was ⁇ YI.
  • the Tvis after 400 hours was 63.8%, and the Tvis of the measurement sample (6) before the light resistance test was 85.3%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 21 .5%.
  • Example 4 (Preparation of copper salt fine particle dispersed resin) The amount of tris (2,4-di-tertiarybutylphenyl) phosphite was changed from 50 mg to 100 mg, and the amount of tris (2,4-di-tertiarybutylphenyl) phosphate was changed from 50 mg to 100 mg.
  • a PVB resin (4) resin composition (4) in which copper salt fine particles were dispersed.
  • a measurement sample (7) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (7).
  • a measurement sample (8) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (8).
  • the haze of the measurement sample (7) was 6.8%, and the haze of the measurement sample (8) was 6.4%.
  • Spectroscopy of the measurement sample (7) and the measurement sample (8) was measured by the same method as described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (7) was 5.0, and YI of the measurement sample (8) was 7.9.
  • ⁇ YI of the measurement sample (7) and the measurement sample (8) was 2.9.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (8).
  • YI after 400 hours was 8.3, and ⁇ YI was 0.4 (8.3-7.9), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 81.6%, and the Tvis of the measurement sample (8) before the light resistance test was 84.2%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 2 It was 6%.
  • Example 5 Preparation of copper salt fine particle dispersed resin
  • PVB resin (5) resin composition in which copper salt fine particles were dispersed was carried out in the same manner as in Example 1 except that 150 mg of tris (2,4-di-tert-butylphenyl) phosphate was replaced with 24.7 mg of triphenyl phosphate. (5)) was obtained.
  • a measurement sample (9) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (9).
  • the haze of the measurement sample (9) was 1.8%, and the haze of the measurement sample (10) was 1.8%.
  • ⁇ Evaluation of heat resistance> The spectrum of the measurement sample (9) and the measurement sample (10) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (9) was 5.7, and YI of the measurement sample (10) was 7.5.
  • ⁇ YI of the measurement sample (9) and the measurement sample (10) was 1.8.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (10).
  • YI after 400 hours was 18.1, and ⁇ YI was 10.6 (18.1-7.5), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 37.3%, and the Tvis of the measurement sample (10) before the light resistance test was 85.6%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 48 3%.
  • Example 6 Preparation of copper salt fine particle dispersed resin
  • PVB resin (6) in which copper salt fine particles are dispersed (resin composition (except for the resin composition)), except that 150 mg of tris (2,4-di-tert-butylphenyl) phosphate is replaced with 40.4 mg of tributyl phosphate. 6) was obtained.
  • a measurement sample (11) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (11).
  • ⁇ Preparation of measurement sample (12)> A measurement sample (12) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (12).
  • the haze of the measurement sample (11) was 2.2%, and the haze of the measurement sample (12) was 2.1%.
  • Spectroscopy of the measurement sample (11) and the measurement sample (12) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (11) was 5.7, and YI of the measurement sample (12) was 8.4.
  • ⁇ YI of the measurement sample (11) and the measurement sample (12) was 2.7.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (12).
  • YI after 400 hours was 15.8, and ⁇ YI was 7.4 (15.8-8.4), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 30.1%, and the Tvis of the measurement sample (12) before the light resistance test was 84.4%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 54 3%.
  • Example 7 Preparation of copper salt fine particle dispersed resin
  • PVB resin in which copper salt fine particles are dispersed (7), except that 150 mg of tris (2,4-di-tert-butylphenyl) phosphate is replaced with 32.9 mg of tris (2-ethylhexyl) phosphate.
  • Resin composition (7) was obtained.
  • a measurement sample (13) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (13).
  • ⁇ Preparation of measurement sample (14)> A measurement sample (14) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (14).
  • the haze of the measurement sample (13) was 2.6%, and the haze of the measurement sample (14) was 2.0%.
  • Spectroscopy of the measurement sample (13) and the measurement sample (14) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • the YI of the measurement sample (13) was 6.0, and the YI of the measurement sample (14) was 6.7.
  • ⁇ YI of the measurement sample (13) and the measurement sample (14) was 0.7.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (14).
  • YI after 400 hours was 9.9, and ⁇ YI was 3.2 (9.9-6.7), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 29.6%, and the Tvis of the measurement sample (14) before the light resistance test was 85.8%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 56 2%.
  • Example 8 (Preparation of copper salt fine particle dispersed resin) Add 1.90 g of triethylene glycol bis (2-ethylhexanoate) (3GO, plasticizer), 100 g of toluene, 40 g of ethanol, and 5.00 g of polyvinyl butyral (PVB) to a 300 ml Erlenmeyer flask and stir at 20 ° C. for 10 hours. And completely dissolved (solution C).
  • 3GO triethylene glycol bis (2-ethylhexanoate)
  • PVB polyvinyl butyral
  • n-butylphosphonic acid copper salt toluene dispersion (2) (containing 0.583 mmol of copper salt) was added 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Corporation, trioleyl phosphate). The mixture was stirred at 20 ° C for 1 hour (D liquid).
  • the D liquid was added to the C liquid in about 1 minute and irradiated with ultrasonic waves for 1 hour.
  • This dispersion was spread on a Teflon (registered trademark) vat and air-dried at 20 ° C. for 12 hours. Furthermore, vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (8) (resin composition (8)) in which copper salt fine particles were dispersed.
  • a measurement sample (15) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (15).
  • a measurement sample (16) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (16).
  • the haze of the measurement sample (15) was 1.6%, and the haze of the measurement sample (16) was 1.0%.
  • Spectroscopy of the measurement sample (15) and the measurement sample (16) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (15) was 2.3, and YI of the measurement sample (16) was 4.1.
  • ⁇ YI of the measurement sample (15) and the measurement sample (16) was 1.8.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (16).
  • the YI after 400 hours was 9.7. If the difference from the YI before the light resistance test was ⁇ YI, the ⁇ YI was 5.6 (9.7-4.1). The Tvis after 400 hours was 65.1%, and the Tvis of the measurement sample (16) before the light resistance test was 88.0%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 22 9%.
  • a measurement sample (c3) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (c3).
  • ⁇ Preparation of measurement sample (c4)> A measurement sample (c4) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (c4).
  • the haze of the measurement sample (c3) was 1.1%, and the haze of the measurement sample (c4) was 0.9%.
  • Spectroscopy of the measurement sample (c3) and the measurement sample (c4) was measured by the same method as described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (c3) was 1.9, and YI of the measurement sample (c4) was 5.0.
  • ⁇ YI of the measurement sample (c3) and the measurement sample (c4) was 3.1.
  • ⁇ Evaluation of light resistance> YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (c4).
  • YI after 400 hours was 44.1, and ⁇ YI was 39.1 (44.1-5.0), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 24.2%, and the Tvis of the measurement sample (c4) before the light resistance test was 87.5%. Therefore, when the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 63 3%.
  • Example 9 Preparation of copper salt fine particle dispersed resin Performed in the same manner as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 3.9 mg of tris (2,4-di-tert-butylphenyl) phosphate.
  • a PVB resin (9) resin composition (9)) in which copper salt fine particles were dispersed was obtained.
  • ⁇ Preparation of measurement sample (17)> A measurement sample (17) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (17).
  • the haze of the measurement sample (17) was 1.5%, and the haze of the measurement sample (18) was 1.1%.
  • Spectroscopy of the measurement sample (17) and the measurement sample (18) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (17) was 2.2, and YI of the measurement sample (18) was 4.1.
  • ⁇ YI of the measurement sample (17) and the measurement sample (18) was 1.9.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (18).
  • YI after 400 hours was 12.9, and ⁇ YI was 8.8 (12.9-4.1), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 41.7%, and the Tvis of the measurement sample (18) before the light resistance test was 87.3%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 45 It was 6%.
  • Example 10 (Preparation of copper salt fine particle dispersed resin) Performed in the same manner as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 11.8 mg of tris (2,4-di-tert-butylphenyl) phosphate.
  • a PVB resin (10) (resin composition (10)) in which copper salt fine particles were dispersed was obtained.
  • ⁇ Preparation of measurement sample (20)> A measurement sample (20) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (20).
  • the haze of the measurement sample (19) was 1.9%, and the haze of the measurement sample (20) was 1.8%.
  • Spectroscopy of the measurement sample (19) and the measurement sample (20) was measured by the same method as described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (19) was 2.4, and YI of the measurement sample (20) was 4.7.
  • ⁇ YI of the measurement sample (19) and the measurement sample (20) was 2.3.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (20).
  • YI after 400 hours was 19.3, and ⁇ YI was 14.6 (19.3-4.7) where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 34.8%, and the Tvis of the measurement sample (20) before the light resistance test was 88.3%. Therefore, if the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 53 .5%.
  • Example 11 Performed in the same manner as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 23.5 mg of tris (2,4-di-tert-butylphenyl) phosphate.
  • a PVB resin (11) (resin composition (11)) in which copper salt fine particles were dispersed was obtained.
  • a measurement sample (21) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (21).
  • ⁇ Preparation of measurement sample (22)> A measurement sample (22) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (22).
  • the haze of the measurement sample (21) was 1.6%, and the haze of the measurement sample (22) was 1.2%.
  • Spectroscopy of the measurement sample (21) and the measurement sample (22) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (21) was 2.3, and YI of the measurement sample (22) was 4.2.
  • ⁇ YI of the measurement sample (21) and the measurement sample (22) was 1.9.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (22).
  • YI after 400 hours was 14.1, and ⁇ YI was 9.9 (14.1-4.2), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 39.9%, and the Tvis of the measurement sample (22) before the light resistance test was 87.8%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 47 9%.
  • Example 12 Preparation of copper salt fine particle dispersed resin
  • a PVB resin in which copper salt fine particles are dispersed is carried out in the same manner as in Example 8 except that the amount of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) is changed from 30.1 mg to 5.0 mg. 12) (Resin composition (12)) was obtained.
  • a measurement sample (23) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (23).
  • ⁇ Preparation of measurement sample (24)> A measurement sample (24) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (24).
  • the haze of the measurement sample (23) was 1.5%, and the haze of the measurement sample (24) was 1.0%.
  • the spectra of the measurement sample (23) and the measurement sample (24) were measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (23) was 2.3, and YI of the measurement sample (24) was 4.7.
  • ⁇ YI of the measurement sample (23) and the measurement sample (24) was 2.4.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (24).
  • YI after 400 hours was 31.3, and ⁇ YI was 26.6 (31.3-4.7), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 32.5%, and the Tvis of the measurement sample (24) before the light resistance test was 87.4%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 54 9%.
  • Example 13 Preparation of copper salt fine particle dispersed resin
  • a PVB resin in which copper salt fine particles were dispersed was carried out in the same manner as in Example 8 except that the amount of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was changed from 30.1 mg to 15.1 mg. 13) (Resin composition (13)) was obtained.
  • a measurement sample (25) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (25).
  • a measurement sample (26) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (26).
  • the haze of the measurement sample (25) was 1.7%, and the haze of the measurement sample (26) was 1.2%.
  • Spectroscopy of the measurement sample (25) and the measurement sample (26) was measured by the same method as described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (25) was 2.7, and YI of the measurement sample (26) was 5.7.
  • ⁇ YI of the measurement sample (25) and the measurement sample (26) was 3.0.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (26).
  • YI after 400 hours was 30.4, and ⁇ YI was 24.7 (30.4 ⁇ 5.7), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 35.1%, and the Tvis of the measurement sample (26) before the light resistance test was 86.7%. Therefore, if the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 51 It was 6%.
  • Example 14 (Preparation of copper salt fine particle dispersed resin) PVB resin in which copper salt fine particles are dispersed (14) (Resin composition (14)) was obtained.
  • a measurement sample (27) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (27).
  • ⁇ Preparation of measurement sample (28)> A measurement sample (28) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (28).
  • the haze of the measurement sample (27) was 2.2%, and the haze of the measurement sample (28) was 1.4%.
  • Spectroscopy of the measurement sample (27) and the measurement sample (28) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (27) was 3.0, and YI of the measurement sample (28) was 4.5.
  • ⁇ YI of the measurement sample (27) and the measurement sample (28) was 1.5.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (28).
  • YI after 400 hours was 14.8, and ⁇ YI was 10.3 (14.8-4.5), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 45.6%, and the Tvis of the measurement sample (28) before the light resistance test was 88.1%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 42 .5%.
  • Example 15 preparation of copper salt fine particle dispersed resin
  • Nikkor TOP-0V manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate
  • a measurement sample (29) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (29).
  • ⁇ Preparation of measurement sample (30)> A measurement sample (30) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (30).
  • the haze of the measurement sample (29) was 2.3%, and the haze of the measurement sample (30) was 1.5%.
  • Spectroscopy of the measurement sample (29) and the measurement sample (30) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (29) was 3.0, and YI of the measurement sample (30) was 4.5.
  • ⁇ YI of the measurement sample (29) and the measurement sample (30) was 1.5.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (30).
  • YI after 400 hours was 15.7, and ⁇ YI was 11.2 (15.7-4.5), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 42.3%, and the Tvis of the measurement sample (30) before the light resistance test was 88.1%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 45 8%.
  • Example 16 (Preparation of copper salt fine particle dispersed resin) PVB resin (16) in which copper salt fine particles were dispersed was carried out in the same manner as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 5.7 mg of triphenyl phosphate. ) (Resin composition (16)) was obtained.
  • a measurement sample (31) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (31).
  • a measurement sample (32) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (32).
  • the haze of the measurement sample (31) was 3.5%, and the haze of the measurement sample (32) was 2.0%.
  • Spectroscopy of the measurement sample (31) and the measurement sample (32) was measured by the same method as that described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (31) was 3.4, and YI of the measurement sample (32) was 5.1.
  • ⁇ YI of the measurement sample (31) and the measurement sample (32) was 1.7.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (32).
  • YI after 400 hours was 26.5, and ⁇ YI was 21.4 (26.5-5.1) where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 32.8%, and the Tvis of the measurement sample (32) before the light resistance test was 87.6%. Therefore, when the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 54 8%.
  • Example 17 (Preparation of copper salt fine particle dispersed resin) The same procedure was performed as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 6.5 mg of tri-o-cresyl phosphate, and copper salt fine particles were dispersed. PVB resin (17) (resin composition (17)) was obtained.
  • a measurement sample (33) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (33).
  • ⁇ Preparation of measurement sample (34)> A measurement sample (34) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (34).
  • the haze of the measurement sample (33) was 3.1%, and the haze of the measurement sample (34) was 2.1%.
  • Spectroscopy of the measurement sample (33) and the measurement sample (34) was measured by the same method as described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (33) was 2.8, and YI of the measurement sample (34) was 4.9.
  • ⁇ YI of the measurement sample (33) and the measurement sample (34) was 2.1.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (34).
  • YI after 400 hours was 17.3, and ⁇ YI was 12.4 (17.3-4.9), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 42.1%, and the Tvis of the measurement sample (34) before the light resistance test was 87.5%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 45 4%.
  • Example 18 (Preparation of copper salt fine particle dispersed resin) The same procedure was carried out as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 6.4 mg of tri-p-cresyl phosphate. PVB resin (18) (resin composition (18)) was obtained.
  • a measurement sample (35) was obtained in the same manner as in ⁇ Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (35).
  • a measurement sample (36) was obtained in the same manner as in ⁇ Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (36).
  • the haze of the measurement sample (35) was 3.0%, and the haze of the measurement sample (36) was 1.5%.
  • Spectroscopy of the measurement sample (35) and the measurement sample (36) was measured by the same method as described in the section ⁇ Evaluation of heat resistance> in Example 1.
  • YI of the measurement sample (35) was 2.7, and YI of the measurement sample (36) was 4.2.
  • ⁇ YI of the measurement sample (35) and the measurement sample (36) was 1.5.
  • YI and Tvis were determined in the same manner as in the section ⁇ Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (36).
  • YI after 400 hours was 15.8, and ⁇ YI was 11.6 (15.8-4.2), where ⁇ YI was the difference from YI before the light resistance test.
  • the Tvis after 400 hours was 45.3%, and the Tvis of the measurement sample (36) before the light resistance test was 88.3%. Therefore, assuming that the difference in Tvis before and after the test is ⁇ Tvis, ⁇ Tvis is 43 0.0%.

Abstract

The purpose of the present invention is to provide a resin composition containing a near-infrared ray absorbent, which has excellent light resistance and heat resistance. The resin composition according to the present invention comprises a near-infrared ray absorbent, a phosphoric acid triester and a resin, wherein the near-infrared ray absorbent comprises microparticles each comprising a phosphonic acid copper salt represented by general formula (1) [wherein R1 represents a monovalent group represented by the formula -CH2CH2-R11; and R11 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or a fluorinated alkyl group having 1 to 20 carbon atoms], and the phosphoric acid triester is a phosphoric acid triester represented by general formula (2) [wherein R's independently represent an alkyl group, an alkenyl group, a phenyl group, or a phenyl group having a substituent].

Description

樹脂組成物およびその用途Resin composition and use thereof
 本発明は、樹脂組成物およびその用途に関し、詳しくは近赤外線吸収剤と、リン酸トリエステルと、樹脂とからなる樹脂組成物およびその用途に関する。 The present invention relates to a resin composition and its use, and more particularly to a resin composition comprising a near-infrared absorber, a phosphoric acid triester, and a resin, and its use.
 従来から、自動車等の車両、建築物、太陽電池等の各種用途で、合わせガラスが用いられている。合わせガラス用中間膜としては、ポリビニルブチラール樹脂膜、アイオノマー樹脂膜等が知られている。 Conventionally, laminated glass is used in various applications such as vehicles such as automobiles, buildings, and solar cells. As an interlayer film for laminated glass, a polyvinyl butyral resin film, an ionomer resin film, and the like are known.
 ところで、太陽光線には、可視光線の他に紫外線、赤外線等が含まれている。赤外線の中でも波長が可視光に近い赤外線は、近赤外線と呼ばれる。近赤外線は熱線とも呼ばれ車両や建築物内部の温度上昇の原因の一つである。 By the way, the sun rays include ultraviolet rays, infrared rays and the like in addition to visible rays. Among infrared rays, infrared rays having a wavelength close to visible light are called near infrared rays. Near-infrared rays are also called heat rays and are one of the causes of temperature rise inside vehicles and buildings.
 該温度上昇を抑制するために、車両や建築物に用いられる合わせガラスに、可視光線の透過性を保持したまま、熱線吸収性を付与することが考えられる。例えば、ホスホン酸銅塩と、ポリシロキサン成分と、可塑剤と、分散剤とを含有する銅塩組成物が知られている(例えば、特許文献1参照)。一般に金属塩を、樹脂と混合して得られた樹脂組成物は高温にさらされた場合には、可視光線の透過性が低下する場合や、黄変する場合があった。しかしながら、特許文献1には、前記銅塩組成物と樹脂とを含有する樹脂組成物は、高温にさらされた場合であっても可視光の透過性および安定性に優れる赤外線吸収膜を提供することが可能である旨が開示されている。 In order to suppress the temperature rise, it is conceivable to impart heat ray absorptivity to laminated glass used for vehicles and buildings while maintaining visible light transmittance. For example, a copper salt composition containing a phosphonic acid copper salt, a polysiloxane component, a plasticizer, and a dispersant is known (see, for example, Patent Document 1). In general, when a resin composition obtained by mixing a metal salt with a resin is exposed to a high temperature, the visible light transmittance may be reduced or yellowed. However, Patent Document 1 provides an infrared absorption film in which the resin composition containing the copper salt composition and the resin is excellent in visible light transmission and stability even when exposed to high temperatures. It is disclosed that it is possible.
 特許文献1に記載された樹脂組成物は、高温にさらされた場合における黄変が、ホスホン酸銅塩および樹脂のみからなる樹脂組成物と比べると抑制されているが、シラン化合物を脱水縮合する工程が必要となるため、工程数が増えるという問題があった。 In the resin composition described in Patent Document 1, yellowing when exposed to a high temperature is suppressed as compared with a resin composition composed only of a phosphonic acid copper salt and a resin, but dehydrates and condenses a silane compound. Since processes are required, there is a problem that the number of processes increases.
 また、合わせガラス等に用いられる樹脂組成物としては、太陽光によって着色や、可視光透過率の低下が起こらないこと、すなわち耐光性を有することが望まれるが、特許文献1に開示された発明では耐光性についての検討は行われていなかった。 In addition, as a resin composition used for laminated glass and the like, it is desired that the resin composition is not colored by sunlight or that the visible light transmittance is not lowered, that is, has light resistance, but the invention disclosed in Patent Document 1 However, no consideration was given to light resistance.
2009-242650号公報2009-242650
 本発明は、上記従来技術を鑑みてされたものであり、耐光性および耐熱性に優れる、近赤外線吸収剤を含有する樹脂組成物を提供することを目的とする。 The present invention has been made in view of the above prior art, and an object thereof is to provide a resin composition containing a near-infrared absorber, which is excellent in light resistance and heat resistance.
 本発明者らは上記課題を達成するため鋭意研究を重ねた結果、特定の近赤外線吸収剤と、特定のリン酸トリエステルと、樹脂とからなる樹脂組成物は、上記課題を解決することができることを見出し、本発明を完成させた。 As a result of intensive studies to achieve the above problems, the present inventors have found that a resin composition comprising a specific near infrared absorber, a specific phosphoric acid triester, and a resin can solve the above problems. The present invention has been completed by finding out what can be done.
 すなわち、本発明の樹脂組成物は、近赤外線吸収剤と、リン酸トリエステルと、樹脂とからなる樹脂組成物であり、前記近赤外線吸収剤が、下記一般式(1)で表わされるホスホン酸銅塩からなる微粒子であり、前記リン酸トリエステルが、下記一般式(2)で表されるリン酸トリエステルであることを特徴とする。 That is, the resin composition of the present invention is a resin composition comprising a near-infrared absorber, a phosphate triester, and a resin, and the near-infrared absorber is a phosphonic acid represented by the following general formula (1). It is fine particles made of a copper salt, and the phosphoric acid triester is a phosphoric acid triester represented by the following general formula (2).
Figure JPOXMLDOC01-appb-C000003
Figure JPOXMLDOC01-appb-C000003
[一般式(1)中、R1は、-CH2CH2-R11で表される1価の基であり、R11は水素原子、炭素数1~20のアルキル基、または炭素数1~20のフッ素化アルキル基を示す。] [In General Formula (1), R 1 is a monovalent group represented by —CH 2 CH 2 —R 11 , and R 11 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups. ]
Figure JPOXMLDOC01-appb-C000004
Figure JPOXMLDOC01-appb-C000004
[一般式(2)中、Rはそれぞれ独立に、炭素数1~20のアルキル基、炭素数2~35のアルケニル基、フェニル基、または置換基を有するフェニル基であり、前記置換基の炭素数が15以下である。]
 前記一般式(2)において、Rがそれぞれ独立に、置換基を有するフェニル基であることが好ましい。
[In the general formula (2), each R is independently an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 35 carbon atoms, a phenyl group, or a phenyl group having a substituent, The number is 15 or less. ]
In the general formula (2), each R is preferably independently a phenyl group having a substituent.
 前記樹脂組成物が、さらにリン系酸化防止剤を含有することが好ましい。
 前記樹脂が、ポリビニルアセタール樹脂、エチレン‐酢酸ビニル共重合体、(メタ)アクリル酸樹脂、ポリエステル樹脂、ポリウレタン樹脂、塩化ビニル樹脂、ポリオレフィン樹脂、ポリカーボネート樹脂、およびノルボルネン樹脂から選択される少なくとも1種の樹脂であることが好ましく、ポリビニルブチラール樹脂、またはエチレン‐酢酸ビニル共重合体であることがより好ましい。
It is preferable that the resin composition further contains a phosphorus-based antioxidant.
The resin is at least one selected from polyvinyl acetal resin, ethylene-vinyl acetate copolymer, (meth) acrylic acid resin, polyester resin, polyurethane resin, vinyl chloride resin, polyolefin resin, polycarbonate resin, and norbornene resin. A resin is preferable, and a polyvinyl butyral resin or an ethylene-vinyl acetate copolymer is more preferable.
 前記樹脂100質量部あたり、近赤外線吸収剤を0.05~50質量部含有することが好ましい。
 前記樹脂100質量部あたり、リン酸トリエステルを0.05~5.0質量部含有することが好ましい。
It is preferable to contain 0.05 to 50 parts by mass of a near infrared absorber per 100 parts by mass of the resin.
It is preferable to contain 0.05 to 5.0 parts by mass of phosphoric acid triester per 100 parts by mass of the resin.
 前記樹脂100質量部あたり、リン系酸化防止剤を0.05~5.0質量部含有することが好ましい。
 本発明の合わせガラス用中間膜は、前記樹脂組成物から形成される。
It is preferable to contain 0.05 to 5.0 parts by mass of a phosphorus-based antioxidant per 100 parts by mass of the resin.
The interlayer film for laminated glass of the present invention is formed from the resin composition.
 本発明の合わせガラスは、前記合わせガラス用中間膜を有する。 The laminated glass of the present invention has the interlayer film for laminated glass.
 本発明の樹脂組成物は、耐光性に優れ、かつ耐熱性にも優れる。 The resin composition of the present invention has excellent light resistance and excellent heat resistance.
 次に本発明について具体的に説明する。
 本発明の樹脂組成物は、近赤外線吸収剤と、リン酸トリエステルと、樹脂とからなる樹脂組成物であり、前記近赤外線吸収剤が、後述の一般式(1)で表わされるホスホン酸銅塩からなる微粒子であり、前記リン酸トリエステルが、後述の一般式(2)で表されるリン酸トリエステルであることを特徴とする。
Next, the present invention will be specifically described.
The resin composition of the present invention is a resin composition comprising a near-infrared absorber, a phosphate triester, and a resin, and the near-infrared absorber is a copper phosphonate represented by the following general formula (1). It is fine particles made of a salt, and the phosphate triester is a phosphate triester represented by the following general formula (2).
 なお、本発明の樹脂組成物を、銅塩微粒子分散樹脂とも記す。
 [近赤外線吸収剤]
 本発明に用いられる近赤外線吸収剤は、下記一般式(1)で表わされるホスホン酸銅塩からなる微粒子である。
The resin composition of the present invention is also referred to as a copper salt fine particle dispersed resin.
[Near infrared absorber]
The near-infrared absorber used in the present invention is fine particles composed of a phosphonic acid copper salt represented by the following general formula (1).
 前記下記一般式(1)で表わされるホスホン酸銅塩からなる微粒子としては、下記一般式(1)で表わされるホスホン酸銅塩のみから形成されていてもよく、下記一般式(1)で表わされるホスホン酸銅塩と、他の成分とから形成されていてもよい。 The fine particles comprising the phosphonic acid copper salt represented by the following general formula (1) may be formed only from the phosphonic acid copper salt represented by the following general formula (1), and represented by the following general formula (1). The phosphonic acid copper salt may be formed from other components.
Figure JPOXMLDOC01-appb-C000005
Figure JPOXMLDOC01-appb-C000005
[一般式(1)中、R1は、-CH2CH2-R11で表される1価の基であり、R11は水素原子、炭素数1~20のアルキル基、または炭素数1~20のフッ素化アルキル基を示す。]
 前記R11としては、水素原子または炭素数1~20のアルキル基であることが好ましい。具体的にはR11としては、水素原子、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基、トリデシル基、テトラデシル基、ペンタデシル基、ヘキサデシル基、ヘプタデシル基、オクタデシル基等が好ましい。なお、一般式(1)で表わされるホスホン酸銅塩としては、一種単独で用いても、二種以上を用いてもよい。
[In General Formula (1), R 1 is a monovalent group represented by —CH 2 CH 2 —R 11 , and R 11 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups. ]
R 11 is preferably a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. Specifically, as R 11 , hydrogen atom, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, heptyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group Tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group and the like are preferable. In addition, as a phosphonic acid copper salt represented by General formula (1), it may be used individually by 1 type, or 2 or more types may be used.
 なお、本明細書において、「一般式(1)で表わされるホスホン酸銅塩」を、単に「ホスホン酸銅塩」とも記す。
 本発明に用いる、ホスホン酸銅塩からなる微粒子の製造方法としては、特に限定はないが、例えば以下の方法で製造することができる。
In the present specification, the “phosphonic acid copper salt represented by the general formula (1)” is also simply referred to as “phosphonic acid copper salt”.
Although there is no limitation in particular as a manufacturing method of the microparticles | fine-particles which consist of a phosphonic acid copper salt used for this invention, For example, it can manufacture with the following method.
 ホスホン酸銅塩からなる微粒子の製造方法としては、溶媒中で、下記一般式(4)で表わされるホスホン酸化合物と、銅塩とを混合し、反応混合物を得る工程(以下、反応工程とも記す)、該反応混合物中の溶媒を除去することによりホスホン酸銅塩からなる微粒子を得る工程(以下、溶媒除去工程とも記す)を有する方法が挙げられる。 As a method for producing fine particles comprising a phosphonic acid copper salt, a step of mixing a phosphonic acid compound represented by the following general formula (4) and a copper salt in a solvent to obtain a reaction mixture (hereinafter also referred to as a reaction step). ), A method having a step of obtaining fine particles composed of a copper phosphonate by removing the solvent in the reaction mixture (hereinafter also referred to as a solvent removal step).
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000006
[一般式(4)中、R1は、-CH2CH2-R11で表される1価の基であり、R11は水素原子、炭素数1~20のアルキル基、または炭素数1~20のフッ素化アルキル基を示す。]
 前記一般式(4)で表わされるホスホン酸化合物としては、R11が水素原子または炭素数1~20のアルキル基であるものが好ましい。一般式(4)で表されるホスホン酸化合物としては例えば、エチルホスホン酸、プロピルホスホン酸、ブチルホスホン酸、ペンチルホスホン酸、ヘキシルホスホン酸、ヘプチルホスホン酸、オクチルホスホン酸、ノニルホスホン酸、デシルホスホン酸、ウンデシルホスホン酸、ドデシルホスホン酸、トリデシルホスホン酸、テトラデシルホスホン酸、ペンタデシルホスホン酸、ヘキサデシルホスホン酸、ヘプタデシルホスホン酸、オクタデシルホスホン酸等のアルキルホスホン酸が挙げられる。なお、一般式(4)で表されるホスホン酸化合物としては、一種単独で用いても、二種以上を用いてもよい。
[In General Formula (4), R 1 is a monovalent group represented by —CH 2 CH 2 —R 11 , and R 11 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups. ]
As the phosphonic acid compound represented by the general formula (4), those in which R 11 is a hydrogen atom or an alkyl group having 1 to 20 carbon atoms are preferable. Examples of the phosphonic acid compound represented by the general formula (4) include ethylphosphonic acid, propylphosphonic acid, butylphosphonic acid, pentylphosphonic acid, hexylphosphonic acid, heptylphosphonic acid, octylphosphonic acid, nonylphosphonic acid, and decylphosphonic acid. Examples thereof include alkylphosphonic acids such as acid, undecylphosphonic acid, dodecylphosphonic acid, tridecylphosphonic acid, tetradecylphosphonic acid, pentadecylphosphonic acid, hexadecylphosphonic acid, heptadecylphosphonic acid, and octadecylphosphonic acid. In addition, as a phosphonic acid compound represented by General formula (4), it may be used individually by 1 type, or 2 or more types may be used.
 前記銅塩としては、2価の銅イオンを供給することが可能な銅塩が通常用いられる。前記銅塩としては、前記一般式(1)で表わされるホスホン酸銅塩以外の銅塩であればよい。前記銅塩としては例えば、無水酢酸銅、無水蟻酸銅、無水ステアリン酸銅、無水安息香酸銅、無水エチルアセト酢酸銅、無水ピロリン酸銅、無水ナフテン酸銅、無水クエン酸銅等の有機酸の銅塩、該有機酸の銅塩の水和物もしくは水化物;酸化銅、塩化銅、硫酸銅、硝酸銅、塩基性炭酸銅等の無機酸の銅塩、該無機酸の銅塩の水和物もしくは水化物;水酸化銅が挙げられる。なお、銅塩としては、一種単独で用いても、二種以上を用いてもよい。 As the copper salt, a copper salt capable of supplying divalent copper ions is usually used. The copper salt may be a copper salt other than the phosphonic acid copper salt represented by the general formula (1). Examples of the copper salt include copper of organic acids such as anhydrous copper acetate, anhydrous copper formate, anhydrous copper stearate, anhydrous copper benzoate, anhydrous ethyl acetoacetate copper, anhydrous pyrophosphate, anhydrous naphthenic acid copper, and anhydrous copper citrate. Salt, hydrate or hydrate of copper salt of organic acid; copper salt of inorganic acid such as copper oxide, copper chloride, copper sulfate, copper nitrate, basic copper carbonate, hydrate of copper salt of inorganic acid Or a hydrate; copper hydroxide is mentioned. In addition, as a copper salt, you may use individually by 1 type, or may use 2 or more types.
 銅塩としては、無水酢酸銅、酢酸銅一水和物が、溶解性や副生成物の除去の点から好ましく用いられる。
 ホスホン酸銅塩からなる微粒子を製造する際には、前記反応工程において分散剤をもちいてもよい。前記分散剤としては、例えば一般式(3a)で表されるリン酸エステル化合物および一般式(3b)で表されるリン酸エステル化合物から選択される少なくとも1種のリン酸エステル化合物、該リン酸エステル化合物中のリン酸、すなわち水酸基を塩基で中和した化合物が挙げられる。なお、中和に用いる塩基としては、水酸化リチウム、水酸化ナトリウム、水酸化カリウム、水酸化セシウム、水酸化マグネシウム、水酸化カルシウム等の無機塩基が挙げられる。
As the copper salt, anhydrous copper acetate and copper acetate monohydrate are preferably used in terms of solubility and removal of by-products.
When producing fine particles comprising a phosphonic acid copper salt, a dispersant may be used in the reaction step. Examples of the dispersant include at least one phosphate ester compound selected from a phosphate ester compound represented by the general formula (3a) and a phosphate ester compound represented by the general formula (3b), the phosphoric acid The phosphoric acid in an ester compound, ie, the compound which neutralized the hydroxyl group with the base is mentioned. In addition, as a base used for neutralization, inorganic bases, such as lithium hydroxide, sodium hydroxide, potassium hydroxide, cesium hydroxide, magnesium hydroxide, calcium hydroxide, are mentioned.
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000007
[一般式(3a)および(3b)中、R21、R22およびR23は、-(CH2CH2O)n55で表される1価の基であり、nは2~65の整数であり、R55は、炭素数6~25のアルキル基または炭素数6~25のアルキルフェニル基を示す。ただし、R21、R22およびR23は、それぞれ同一でも異なっていてもよい。]
 前記nは2~65の整数であり、好ましくは4~65の整数であり、より好ましくは4~45であり、特に好ましくは4~35の整数である。nが2未満である場合には、合わせガラス等を製造した際に透明性が不充分となる場合がある。また、nが65を超えると、充分な透明性を有する合わせガラス等を得るために必要な、リン酸エステル化合物の量が増え、コスト高の原因となる傾向がある。
[In the general formulas (3a) and (3b), R 21 , R 22 and R 23 are monovalent groups represented by — (CH 2 CH 2 O) n R 55 , and n is from 2 to 65. R 55 is an integer, and R 55 represents an alkyl group having 6 to 25 carbon atoms or an alkylphenyl group having 6 to 25 carbon atoms. However, R 21 , R 22 and R 23 may be the same or different. ]
N is an integer of 2 to 65, preferably an integer of 4 to 65, more preferably 4 to 45, and particularly preferably an integer of 4 to 35. When n is less than 2, transparency may be insufficient when a laminated glass or the like is produced. On the other hand, when n exceeds 65, the amount of the phosphoric acid ester compound necessary for obtaining laminated glass having sufficient transparency tends to increase, resulting in high costs.
 また、R55は、炭素数6~25のアルキル基または炭素数6~25のアルキルフェニル基であり、炭素数6~25のアルキル基であることが好ましく、8~20のアルキル基であることがより好ましく、12~20のアルキル基であることが特に好ましい。R55が、炭素数6未満の基であると、合わせガラス等を製造した際に透明性が不充分となる場合がある。また、R55が、炭素数25を超える基であると、充分な透明性を有する合わせガラス等を得るために必要な、リン酸エステル化合物の量が増え、コスト高の原因となる傾向がある。 R 55 is an alkyl group having 6 to 25 carbon atoms or an alkylphenyl group having 6 to 25 carbon atoms, preferably an alkyl group having 6 to 25 carbon atoms, and preferably an alkyl group having 8 to 20 carbon atoms. Is more preferable, and 12 to 20 alkyl groups are particularly preferable. When R 55 is a group having less than 6 carbon atoms, transparency may be insufficient when a laminated glass or the like is produced. Further, when R 55 is a group having more than 25 carbon atoms, the amount of the phosphate ester compound necessary for obtaining a laminated glass having sufficient transparency tends to increase, resulting in high costs. .
 前記ホスホン酸銅塩からなる微粒子を得る際に分散剤を用いる場合には、前記一般式(3a)で表されるリン酸エステル化合物、前記一般式(3b)で表されるリン酸エステル化合物の少なくとも一方が用いられることが好ましいが、前記一般式(3a)で表されるリン酸エステル化合物、前記一般式(3b)で表されるリン酸エステル化合物の両方を用いることがより好ましい。前記一般式(3a)で表されるリン酸エステル化合物および前記一般式(3b)で表されるリン酸エステル化合物を用いると、合わせガラス等の透明性、耐熱性に優れる傾向があり好ましい。前記一般式(3a)で表されるリン酸エステル化合物、前記一般式(3b)で表されるリン酸エステル化合物の両方を用いる場合には、一般式(3a)で表されるリン酸エステル化合物と、一般式(3b)で表されるリン酸エステル化合物との割合は、特に限定されないが、通常はモル比((3a):(3b))で10:90~90:10である。 When a dispersing agent is used when obtaining fine particles comprising the phosphonic acid copper salt, the phosphoric acid ester compound represented by the general formula (3a) and the phosphoric acid ester compound represented by the general formula (3b) Although at least one is preferably used, it is more preferable to use both the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b). It is preferable to use the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) because they tend to be excellent in transparency and heat resistance of laminated glass and the like. When both the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) are used, the phosphate ester compound represented by the general formula (3a) And the ratio of the phosphoric acid ester compound represented by the general formula (3b) is not particularly limited, but is usually 10:90 to 90:10 in molar ratio ((3a) :( 3b)).
 また、前記一般式(3a)で表されるリン酸エステル化合物としては、一種単独で用いても、二種以上を用いてもよく、前記一般式(3b)で表されるリン酸エステル化合物としては、一種単独で用いても、二種以上を用いてもよい。 Moreover, as a phosphate ester compound represented by the said general formula (3a), it may be used individually by 1 type, or 2 or more types may be used, and the phosphate ester compound represented by the said General formula (3b) May be used alone or in combination of two or more.
 前記一般式(3a)で表されるリン酸エステル化合物および前記一般式(3b)で表されるリン酸エステル化合物から選択される少なくとも1種のリン酸エステル化合物としては、市販されているリン酸エステル化合物、例えばDLP-10、DDP-6、DDP-8、DDP-10、TDP-6、TDP-8、TDP-10(以上、日光ケミカルズ(株)製)や、プライサーフA212C、プライサーフA215C、プライサーフAL12H、プライサーフAL、プライサーフA208F、プライサーフA208N、プライサーフA208B、プライサーフA219B、プライサーフA210D(以上、第一工業製薬(株)製)等を用いることもできる。また、これらのリン酸エステル化合物中のリン酸、すなわち水酸基を適当な塩基で中和した化合物を用いることもできる。中和に使用する塩基としては、水酸化リチウム、水酸化ナトリウム、水酸化カリウム、水酸化セシウム、水酸化マグネシウム、水酸化カルシウム等の無機塩基が挙げられる。 As at least one phosphate ester compound selected from the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b), commercially available phosphoric acid Ester compounds such as DLP-10, DDP-6, DDP-8, DDP-10, TDP-6, TDP-8, TDP-10 (manufactured by Nikko Chemicals Co., Ltd.), Plysurf A212C, Plysurf A215C Plysurf AL12H, plysurf AL, plysurf A208F, plysurf A208N, plysurf A208B, plysurf A219B, plysurf A210D (above, manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) and the like can also be used. Moreover, the phosphoric acid in these phosphate ester compounds, ie, the compound which neutralized the hydroxyl group with the appropriate base can also be used. Examples of the base used for neutralization include inorganic bases such as lithium hydroxide, sodium hydroxide, potassium hydroxide, cesium hydroxide, magnesium hydroxide, and calcium hydroxide.
 なお、ホスホン酸銅塩からなる微粒子を製造する際には、前記銅塩1モルあたり、一般式(4)で表されるホスホン酸化合物を0.5~1.5モル用いることが好ましく、0.8~1.2モル用いることがより好ましい。また、分散剤が、一般式(3a)で表されるリン酸エステル化合物および一般式(3b)で表されるリン酸エステル化合物から選択される少なくとも1種のリン酸エステル化合物、および/または該リン酸エステル化合物中のリン酸、すなわち水酸基を塩基で中和した化合物である場合には、前記銅塩100質量部あたり、5~100質量部用いることが好ましく、10~50質量部用いることがより好ましい。 When producing fine particles comprising a phosphonic acid copper salt, it is preferable to use 0.5 to 1.5 mol of the phosphonic acid compound represented by the general formula (4) per 1 mol of the copper salt. It is more preferable to use 8 to 1.2 mol. Further, the dispersant is at least one phosphate ester compound selected from a phosphate ester compound represented by the general formula (3a) and a phosphate ester compound represented by the general formula (3b), and / or In the case of phosphoric acid in the phosphoric ester compound, that is, a compound obtained by neutralizing a hydroxyl group with a base, 5 to 100 parts by mass is preferably used per 100 parts by mass of the copper salt, and 10 to 50 parts by mass is preferably used. More preferred.
 前記溶媒としては、メタノール、エタノール、イソプロピルアルコール、n-ブタノール等のアルコール、テトラヒドロフラン(THF)、N,N-ジメチルホルムアミド(DMF)、水等が挙げられる。前記溶媒としては、メタノール、エタノール、イソプロピルアルコール、n-ブタノール、N,N-ジメチルホルムアミド(DMF)、およびテトラヒドロフラン(THF)から選択される少なくとも1種の溶媒を含むことが好ましい。また、反応性の観点からメタノール、エタノール、THF、およびDMFから選択される少なくとも1種の溶媒を含むことが好ましく、メタノール、およびエタノールから選択される少なくとも1種の溶媒を含むことがより好ましい。前記溶媒としては、これらの溶媒のみでもよく、それ以外の溶媒を含んでいてもよい。前記溶媒としては、メタノール、エタノール、イソプロピルアルコール、n-ブタノール、DMF、およびTHFから選択される少なくとも1種の溶媒(好ましくは、メタノール、エタノール、THF、およびDMFから選択される少なくとも1種の溶媒、より好ましくはメタノール、およびエタノールから選択される少なくとも1種の溶媒)100質量部に対して、それ以外の溶媒が、通常は0~50質量部、好ましくは0~30質量部含まれていてもよい。溶媒として、二種以上の溶媒を用いる場合に、その具体例としては、エタノールと、少量のその他の溶媒とを含む、変性エタノールが挙げられる。変性エタノールは、エタノール100質量部に対してその他の溶媒を、通常は3~50質量部、好ましくは3~30質量部含んでいる。変性エタノールとしては、メタノール変性エタノール、イソプロピルアルコール変性エタノール、トルエン変性エタノールが挙げられる。 Examples of the solvent include alcohols such as methanol, ethanol, isopropyl alcohol and n-butanol, tetrahydrofuran (THF), N, N-dimethylformamide (DMF), water and the like. The solvent preferably includes at least one solvent selected from methanol, ethanol, isopropyl alcohol, n-butanol, N, N-dimethylformamide (DMF), and tetrahydrofuran (THF). Further, from the viewpoint of reactivity, it preferably contains at least one solvent selected from methanol, ethanol, THF, and DMF, and more preferably contains at least one solvent selected from methanol and ethanol. As said solvent, only these solvents may be included and the other solvent may be included. Examples of the solvent include at least one solvent selected from methanol, ethanol, isopropyl alcohol, n-butanol, DMF, and THF (preferably at least one solvent selected from methanol, ethanol, THF, and DMF). More preferably at least one solvent selected from methanol and ethanol), and other solvents are usually contained in an amount of 0 to 50 parts by weight, preferably 0 to 30 parts by weight. Also good. When two or more kinds of solvents are used as the solvent, specific examples thereof include denatured ethanol containing ethanol and a small amount of other solvents. Denatured ethanol usually contains 3 to 50 parts by mass, preferably 3 to 30 parts by mass of other solvents with respect to 100 parts by mass of ethanol. Examples of the modified ethanol include methanol-modified ethanol, isopropyl alcohol-modified ethanol, and toluene-modified ethanol.
 また、反応工程は、通常は0~80℃、好ましくは10~60℃、より好ましくは室温~60℃、特に好ましくは20~40℃の温度条件で、通常は0.5~60時間、好ましくは0.5~30時間、より好ましくは0.5~20時間、特に好ましくは1~15時間行われる。 The reaction step is usually 0 to 80 ° C., preferably 10 to 60 ° C., more preferably room temperature to 60 ° C., particularly preferably 20 to 40 ° C., usually 0.5 to 60 hours, preferably Is carried out for 0.5 to 30 hours, more preferably 0.5 to 20 hours, particularly preferably 1 to 15 hours.
 前記反応工程では、前記一般式(4)で表されるホスホン酸化合物と、前記銅塩とが反応し、該反応によって、前記溶媒に溶解しない微粒子状のホスホン酸銅塩が生成する。前記一般式(3a)で表されるリン酸エステル化合物および一般式(3b)で表されるリン酸エステル化合物から選択される少なくとも1種のリン酸エステル化合物は、反応時に良好な分散剤として作用することができるため、前記ホスホン酸銅塩は分散性が高く保たれ、凝集を抑制することができる。 In the reaction step, the phosphonic acid compound represented by the general formula (4) reacts with the copper salt, and fine phosphonic acid copper salt that does not dissolve in the solvent is generated by the reaction. At least one phosphate ester compound selected from the phosphate ester compound represented by the general formula (3a) and the phosphate ester compound represented by the general formula (3b) acts as a good dispersant during the reaction. Therefore, the phosphonic acid copper salt can maintain high dispersibility and suppress aggregation.
 なお、前記反応工程では、前記一般式(4)で表されるホスホン酸化合物と銅塩との反応のみではなく、例えば前記一般式(3a)で表されるリン酸エステル化合物および一般式(3b)で表されるリン酸エステル化合物から選択される少なくとも1種のリン酸エステル化合物と、銅塩の一部とが反応してもよい。また、原料の一部が反応せずに残存していてもよい。 In the reaction step, not only the reaction between the phosphonic acid compound represented by the general formula (4) and the copper salt, but also, for example, the phosphate ester compound represented by the general formula (3a) and the general formula (3b) At least one type of phosphate ester compound selected from the phosphate ester compounds represented by) may react with a part of the copper salt. Further, a part of the raw material may remain without reacting.
 なお、前記ホスホン酸銅塩からなる微粒子の製造方法では、通常、前記反応混合物から、少なくとも前記溶媒の一部を除去することにより、ホスホン酸銅塩からなる微粒子を得る。 In the method for producing fine particles composed of the copper phosphonate, the fine particles composed of the copper phosphonate are usually obtained by removing at least a part of the solvent from the reaction mixture.
 溶媒除去工程では、反応混合物中から、少なくとも前記溶媒の一部を除去する。溶媒除去工程では、溶媒以外にも、反応混合物中の液体成分を合わせて除去してもよい。
 溶媒除去工程としては、反応混合物を蒸留することにより溶媒を留分として除去する方法が挙げられる。
In the solvent removal step, at least a part of the solvent is removed from the reaction mixture. In the solvent removal step, in addition to the solvent, the liquid components in the reaction mixture may be removed together.
As a solvent removal process, the method of removing a solvent as a fraction by distilling a reaction mixture is mentioned.
 蒸留は、反応混合物の熱劣化を防止する観点から減圧下で行われることが好ましい。
 減圧蒸留を行う場合には、溶媒の種類によっても異なるが、減圧蒸留の条件としては通常は圧力0.01~15kPaで行われる。なお留分の流出温度は、溶媒の種類、圧力によって異なるが通常は30~150℃である。
Distillation is preferably performed under reduced pressure from the viewpoint of preventing thermal deterioration of the reaction mixture.
When performing vacuum distillation, although depending on the type of solvent, the conditions for vacuum distillation are usually 0.01 to 15 kPa. The outflow temperature of the fraction varies depending on the type of solvent and the pressure, but is usually 30 to 150 ° C.
 また、溶媒を除去する別の方法としては、反応混合物を静置することにより、ホスホン酸銅塩からなる微粒子を沈殿させ、上澄み液(溶媒)を除去する方法や、反応混合物を遠心分離処理することにより、ホスホン酸銅塩からなる微粒子を沈殿させ、上澄み液(溶媒)を除去する方法が挙げられる。 As another method for removing the solvent, the reaction mixture is allowed to stand to precipitate fine particles composed of copper phosphonate, and the supernatant (solvent) is removed, or the reaction mixture is centrifuged. By this, the method of precipitating the microparticles | fine-particles which consist of phosphonic acid copper salt and removing a supernatant liquid (solvent) is mentioned.
 なお、溶媒を除去する方法としては、これらの方法を組み合わせて行ってもよい。
 また、溶媒除去工程を行った後に、ホスホン酸銅塩からなる微粒子中に含まれる不純物の除去を目的として、ホスホン酸銅塩からなる微粒子を、分散媒に分散した後に、該分散媒を除去する工程を設けてもよい。
In addition, as a method of removing a solvent, you may carry out combining these methods.
In addition, after the solvent removal step, for the purpose of removing impurities contained in the phosphonic acid copper salt fine particles, the phosphonic acid copper salt fine particles are dispersed in the dispersion medium, and then the dispersion medium is removed. A process may be provided.
 前記ホスホン酸銅塩からなる微粒子としては通常、平均粒径が1~1000nmのホスホン酸銅塩からなる微粒子が用いられる。平均粒径としては、モノマーへの分散性や樹脂組成物の透明性を確保するため、5~300nmであることがより好ましい。 As the fine particles composed of the copper phosphonate, fine particles composed of a copper phosphonate having an average particle diameter of 1 to 1000 nm are usually used. The average particle size is more preferably 5 to 300 nm in order to ensure dispersibility in the monomer and transparency of the resin composition.
 [リン酸トリエステル]
 本発明に用いられるリン酸トリエステルは、下記一般式(2)で表されるリン酸トリエステルである。
[Phosphoric acid triester]
The phosphate triester used in the present invention is a phosphate triester represented by the following general formula (2).
Figure JPOXMLDOC01-appb-C000008
Figure JPOXMLDOC01-appb-C000008
[一般式(2)中、Rはそれぞれ独立に、炭素数1~20のアルキル基、炭素数2~35のアルケニル基、フェニル基、または置換基を有するフェニル基であり、前記置換基の炭素数が15以下である。]
 本発明に用いられるリン酸トリエステルとしては一種を用いても、二種以上を用いてもよい。
[In the general formula (2), each R is independently an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 35 carbon atoms, a phenyl group, or a phenyl group having a substituent, The number is 15 or less. ]
As a phosphoric acid triester used for this invention, 1 type may be used or 2 or more types may be used.
 前記Rとしてはそれぞれ独立に、フェニル基、または置換基を有するフェニル基であることが好ましく、置換基を有するフェニル基であることがより好ましい。
 炭素数1~20のアルキル基としては、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基、トリデシル基、テトラデシル基、ペンタデシル基、ヘキサデシル基、ヘプタデシル基、オクタデシル基等が挙げられる。なお、アルキル基は分岐構造を有していてもよい。
Each R is preferably independently a phenyl group or a phenyl group having a substituent, and more preferably a phenyl group having a substituent.
Examples of the alkyl group having 1 to 20 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, dodecyl, tridecyl, Examples include a tetradecyl group, a pentadecyl group, a hexadecyl group, a heptadecyl group, and an octadecyl group. The alkyl group may have a branched structure.
 炭素数2~35のアルケニル基としては、炭素数4~25のアルケニル基が好ましい。アルケニル基としては、アリル基、ブテニル基、ヘキセニル基、オクテニル基、デセニル基、オレイル基等が挙げられる。なお、アルケニル基としては分岐構造を有していてもよい。 The alkenyl group having 2 to 35 carbon atoms is preferably an alkenyl group having 4 to 25 carbon atoms. Examples of the alkenyl group include an allyl group, a butenyl group, a hexenyl group, an octenyl group, a decenyl group, and an oleyl group. Note that the alkenyl group may have a branched structure.
 前記置換基を有するフェニル基が有する置換基は、通常は炭素数が15以下である。
 前記置換基を有するフェニル基としては、置換基を少なくとも1個有するフェニル基であればよく、置換基を1~5個有するフェニル基が挙げられ、置換基を1~3個有するフェニル基が好ましく、置換基を2個有するフェニル基がより好ましい。
The substituent that the phenyl group having the substituent has usually has 15 or less carbon atoms.
The phenyl group having a substituent may be any phenyl group having at least one substituent, and examples thereof include a phenyl group having 1 to 5 substituents, and a phenyl group having 1 to 3 substituents is preferable. A phenyl group having two substituents is more preferable.
 また、前記置換基はフェニル基の、少なくとも1位、3位のいずれかに存在することが好ましく、少なくとも1位に存在することが好ましい。
 前記置換基としては、アルキル基、アルコキシ基、オキシカルボニルアルキル基、ニトロ基、シアノ基、エステル基、ハロゲン、フェニル基、ベンジル基、フェノキシ基、水素原子の少なくとも一つが、アルキル基、アルコキシ基、オキシカルボニルアルキル基、ニトロ基、エステル基、シアノ基、ハロゲン等で置換されているフェニル基、ベンゼン環上の水素原子の少なくとも一つがアルキル基、アルコキシ基、オキシカルボニルアルキル基、ニトロ基、エステル基、シアノ基、ハロゲン等で置換されているベンジル基、水素原子の少なくとも一つが、アルキル基、アルコキシ基、オキシカルボニルアルキル基、ニトロ基、エステル基、シアノ基、ハロゲン等で置換されているフェノキシ基等が挙げられ、アルキル基が好ましい。
In addition, the substituent is preferably present at least at the 1-position or the 3-position of the phenyl group, and preferably at least at the 1-position.
As the substituent, at least one of an alkyl group, an alkoxy group, an oxycarbonylalkyl group, a nitro group, a cyano group, an ester group, a halogen, a phenyl group, a benzyl group, a phenoxy group, and a hydrogen atom is an alkyl group, an alkoxy group, Oxycarbonylalkyl group, nitro group, ester group, cyano group, phenyl group substituted by halogen, etc., at least one hydrogen atom on the benzene ring is alkyl group, alkoxy group, oxycarbonylalkyl group, nitro group, ester group , A benzyl group substituted with a cyano group, halogen, etc., a phenoxy group wherein at least one of the hydrogen atoms is substituted with an alkyl group, alkoxy group, oxycarbonylalkyl group, nitro group, ester group, cyano group, halogen, etc. An alkyl group is preferable.
 すなわち、置換基としては、炭素数15以下のアルキル基が好ましい。炭素数15以下のアルキル基としては、入手容易性、価格面で有利な炭素数1~5のアルキル基がより好ましく、具体的には、メチル基、エチル基、プロピル基、ブチル基、ペンチル基が好ましい。 That is, the substituent is preferably an alkyl group having 15 or less carbon atoms. The alkyl group having 15 or less carbon atoms is more preferably an alkyl group having 1 to 5 carbon atoms, which is advantageous in terms of availability and price, and specifically includes a methyl group, an ethyl group, a propyl group, a butyl group, and a pentyl group. Is preferred.
 また、炭素数15以下のアルキル基としてはリン酸エステルの加水分解を抑制する目的のため、分岐を有するアルキル基が好ましい。分岐を有するアルキル基としては、例えば、前記プロピル基としては、イソプロピル基が挙げられ、前記ブチル基としては、sec‐ブチル基、イソブチル基、tert‐ブチル基が挙げられ、前記ペンチル基としては、1-メチルブチル基、2-メチルブチル基、3-メチルブチル基、1-エチルプロピル基、1,1-ジメチルプロピル基、1,2-ジメチルプロピル基、2,2-ジメチルプロピル基が挙げられる。 In addition, the alkyl group having 15 or less carbon atoms is preferably a branched alkyl group for the purpose of suppressing hydrolysis of the phosphate ester. Examples of the branched alkyl group include an isopropyl group as the propyl group, a sec-butyl group, an isobutyl group, and a tert-butyl group as the butyl group, and the pentyl group as Examples include 1-methylbutyl group, 2-methylbutyl group, 3-methylbutyl group, 1-ethylpropyl group, 1,1-dimethylpropyl group, 1,2-dimethylpropyl group, and 2,2-dimethylpropyl group.
 前記置換基を有するフェニル基としては、例えば以下の式(i)、(ii)、(iii)で表される基が好ましく、(i)で表される基がより好ましい。 As the phenyl group having the substituent, for example, groups represented by the following formulas (i), (ii), and (iii) are preferable, and a group represented by (i) is more preferable.
Figure JPOXMLDOC01-appb-C000009
Figure JPOXMLDOC01-appb-C000009
 本発明に用いられるリン酸トリエステルの具体例としては、例えば以下の式(I)~(VII)で表されるリン酸トリエステルが挙げられ、(I)、(V)が好ましく、(I)がより好ましい。 Specific examples of the phosphoric acid triester used in the present invention include phosphoric acid triesters represented by the following formulas (I) to (VII). (I) and (V) are preferred, and (I ) Is more preferable.
Figure JPOXMLDOC01-appb-C000010
Figure JPOXMLDOC01-appb-C000010
Figure JPOXMLDOC01-appb-C000011
Figure JPOXMLDOC01-appb-C000011
 本発明の樹脂組成物は、前記リン酸トリエステルを含有するため、太陽光等の光が照射されることによる着色や可視光透過率の低下が抑制されており、かつ加熱時等の黄変を抑制することができるため好ましい。 Since the resin composition of the present invention contains the phosphoric acid triester, coloring and reduction in visible light transmittance due to irradiation with light such as sunlight are suppressed, and yellowing during heating and the like is suppressed. Can be suppressed, which is preferable.
 [樹脂]
 本発明には、樹脂が用いられる。本発明に用いられる樹脂としては、前述の近赤外線吸収剤を分散することが可能であればよく特に限定はないが、例えば以下の樹脂を用いることができる。
[resin]
In the present invention, a resin is used. The resin used in the present invention is not particularly limited as long as it can disperse the above-described near-infrared absorber. For example, the following resins can be used.
 本発明に用いる樹脂としては、ポリビニルアセタール樹脂、エチレン‐酢酸ビニル共重合体、(メタ)アクリル酸樹脂、ポリエステル樹脂、ポリウレタン樹脂、塩化ビニル樹脂、ポリオレフィン樹脂、ポリカーボネート樹脂、およびノルボルネン樹脂から選択される少なくとも1種の樹脂が、近赤外線吸収剤を良好に分散することが可能であり、かつ可視光の透過性に優れることが好ましい。 The resin used in the present invention is selected from polyvinyl acetal resin, ethylene-vinyl acetate copolymer, (meth) acrylic acid resin, polyester resin, polyurethane resin, vinyl chloride resin, polyolefin resin, polycarbonate resin, and norbornene resin. It is preferable that at least one type of resin can disperse the near-infrared absorber well and is excellent in visible light transmittance.
 本発明に用いる樹脂としては、ポリビニルアセタール樹脂、およびエチレン‐酢酸ビニル共重合体から選択される少なくとも1種の樹脂であることがより好ましく、ポリビニルブチラール樹脂(PVB)、およびエチレン‐酢酸ビニル共重合体から選択される少なくとも1種の樹脂であることが特に好ましく、ポリビニルブチラール樹脂、またはエチレン‐酢酸ビニル共重合体が最も好ましい。ポリビニルアセタール樹脂を用いると、前述の近赤外線吸収剤の分散性に優れ、本発明の樹脂組成物を用いて、光学材料を製造する際に、ガラス等への密着性に優れ、本発明の樹脂組成物が柔軟であり、かつ温度変化に伴う近赤外線吸収剤の変形が起こり難いため好ましい。また、ポリビニルアセタール樹脂としては、ポリビニルブチラール樹脂(PVB)を用いることが、ガラス密着性、分散性、透明性、耐熱性、耐光性などの観点から好ましい。 The resin used in the present invention is more preferably at least one resin selected from polyvinyl acetal resin and ethylene-vinyl acetate copolymer, polyvinyl butyral resin (PVB), and ethylene-vinyl acetate copolymer Particularly preferred is at least one resin selected from a coalescence, and most preferred is a polyvinyl butyral resin or an ethylene-vinyl acetate copolymer. When the polyvinyl acetal resin is used, the dispersibility of the above-mentioned near-infrared absorber is excellent. When an optical material is produced using the resin composition of the present invention, the resin of the present invention is excellent in adhesion to glass or the like. It is preferable because the composition is flexible and deformation of the near-infrared absorber due to a change in temperature hardly occurs. Moreover, as polyvinyl acetal resin, it is preferable to use polyvinyl butyral resin (PVB) from the viewpoints of glass adhesion, dispersibility, transparency, heat resistance, light resistance, and the like.
 ポリビニルアセタール樹脂は、必要な物性に応じて、二種以上を組み合わせたブレンド物であってもよく、アセタール化時にアルデヒドを組み合わせてアセタール化することにより得られるポリビニルアセタール樹脂であってもよい。上記ポリビニルアセタール樹脂の分子量、分子量分布およびアセタール化度は特に限定されないが、アセタール化度は、一般に40~85%であり、好ましい下限は60%、上限は75%である。 The polyvinyl acetal resin may be a blend of two or more kinds depending on the required physical properties, or may be a polyvinyl acetal resin obtained by acetalizing a combination of aldehydes during acetalization. The molecular weight, molecular weight distribution, and degree of acetalization of the polyvinyl acetal resin are not particularly limited, but the degree of acetalization is generally 40 to 85%, with a preferred lower limit being 60% and an upper limit being 75%.
 ポリビニルアセタール樹脂は、ポリビニルアルコール樹脂をアルデヒドによりアセタール化することにより得ることができる。上記ポリビニルアルコール樹脂は、一般にポリ酢酸ビニルを鹸化することにより得られるものであり、鹸化度80~99.8モル%のポリビニルアルコール樹脂が一般的に用いられる。上記ポリビニルアルコール樹脂の粘度平均重合度は好ましい下限は200、上限は3000である。200未満であると、得られる合わせガラスの耐貫通性が低下する場合がある。3000を超えると、樹脂組成物の成形性が悪くなる場合があり、しかも樹脂組成物の剛性が大きくなり過ぎ、加工性が悪くなる。より好ましい下限は500、上限は2200である。なお、ポリビニルアルコール樹脂の粘度平均重合度、および鹸化度は、例えば、JISK 6726「ポリビニルアルコール試験方法」に基づいて測定することができる。 The polyvinyl acetal resin can be obtained by acetalizing a polyvinyl alcohol resin with an aldehyde. The polyvinyl alcohol resin is generally obtained by saponifying polyvinyl acetate, and a polyvinyl alcohol resin having a saponification degree of 80 to 99.8 mol% is generally used. The preferable lower limit of the viscosity average polymerization degree of the polyvinyl alcohol resin is 200, and the upper limit is 3000. If it is less than 200, the penetration resistance of the resulting laminated glass may be lowered. When it exceeds 3000, the moldability of the resin composition may be deteriorated, and the rigidity of the resin composition is excessively increased, resulting in poor processability. A more preferred lower limit is 500 and an upper limit is 2200. The viscosity average degree of polymerization and the degree of saponification of the polyvinyl alcohol resin can be measured based on, for example, JISK 6726 “Polyvinyl alcohol test method”.
 アルデヒドとしては特に限定されず、例えば、炭素数が1~10のアルデヒド等が挙げられ、より具体的には、例えば、n-ブチルアルデヒド、イソブチルアルデヒド、n-バレルアルデヒド、2-エチルブチルアルテヒド、n-へキシルアルデヒド、n-オクチルアルデヒド、n-ノニルアルデヒド、n-デシルアルデヒド、ホルムアルデヒド、アセトアルデヒド、ベンズアルデヒド等が挙げられる。なかでも、n-ブチルアルデヒド、n-へキシルアルデヒド、n-バレルアルデヒド等が好ましい。より好ましくは、炭素数が4のブチルアルデヒドである。 The aldehyde is not particularly limited, and examples thereof include aldehydes having 1 to 10 carbon atoms, and more specifically, for example, n-butyraldehyde, isobutyraldehyde, n-valeraldehyde, 2-ethylbutylartaldehyde. N-hexylaldehyde, n-octylaldehyde, n-nonylaldehyde, n-decylaldehyde, formaldehyde, acetaldehyde, benzaldehyde and the like. Of these, n-butyraldehyde, n-hexylaldehyde, n-valeraldehyde and the like are preferable. More preferred is butyraldehyde having 4 carbon atoms.
 また、エチレン‐酢酸ビニル共重合体を用いると、前述の近赤外線吸収剤の分散性に優れ、ガラス密着性、分散性、透明性、耐熱性、耐光性などの観点から好ましい。
 [リン系酸化防止剤]
 本発明の樹脂組成物は、近赤外線吸収剤、リン酸トリエステルおよび、樹脂に加え、さらにリン系酸化防止剤を含有してもよい。
Use of an ethylene-vinyl acetate copolymer is preferable from the viewpoints of excellent dispersibility of the above-mentioned near-infrared absorber and glass adhesion, dispersibility, transparency, heat resistance, light resistance, and the like.
[Phosphorus antioxidant]
The resin composition of the present invention may further contain a phosphorus-based antioxidant in addition to the near-infrared absorber, the phosphoric acid triester, and the resin.
 前記リン系酸化防止剤としては、下記一般式(A)で表わされる構造を分子内に1つ以上有し、かつリン原子に結合する下記一般式(B)で表わされる構造を分子内に有さないリン系酸化防止剤から選択される少なくとも一種のリン系酸化防止剤が好ましい。リン系酸化防止剤としては一種を用いても、二種以上を用いてもよい。 The phosphorus-based antioxidant has at least one structure represented by the following general formula (A) in the molecule and has a structure represented by the following general formula (B) bonded to a phosphorus atom in the molecule. At least one phosphorus-based antioxidant selected from non-phosphorus-based antioxidants is preferred. As a phosphorus antioxidant, 1 type may be used or 2 or more types may be used.
Figure JPOXMLDOC01-appb-C000012
Figure JPOXMLDOC01-appb-C000012
[一般式(A)中、R2~R4はそれぞれ独立に、炭素数1または2のアルキル基であり、R5~R8はそれぞれ独立に、水素原子または炭素数1~20のアルキル基を示す。
 但し、一般式(A)で表わされる構造を分子内に2つ以上有する場合には、片方の一般式(A)で表わされる構造のR5~R8は、他方の一般式(A)で表わされる構造のR5~R8との架橋を形成していてもよい。]
[In general formula (A), R 2 to R 4 are each independently an alkyl group having 1 or 2 carbon atoms, and R 5 to R 8 are each independently a hydrogen atom or an alkyl group having 1 to 20 carbon atoms. Indicates.
However, when two or more structures represented by the general formula (A) are present in the molecule, R 5 to R 8 of the structure represented by one general formula (A) are represented by the other general formula (A). Crosslinks with R 5 to R 8 having the structure shown may be formed. ]
Figure JPOXMLDOC01-appb-C000013
Figure JPOXMLDOC01-appb-C000013
[一般式(B)中、Rはアルキル基を示す。]
 なお、リン原子に結合する一般式(A)で表わされる構造を分子内に1つ以上有し、かつリン原子に結合する一般式(B)で表わされる構造を分子内に有さないリン系酸化防止剤を、特定のリン系酸化防止剤とも記す。
[In General Formula (B), R represents an alkyl group. ]
A phosphorus system having one or more structures represented by the general formula (A) bonded to a phosphorus atom in the molecule and having no structure represented by the general formula (B) bonded to a phosphorus atom in the molecule. The antioxidant is also referred to as a specific phosphorus antioxidant.
 前記特定のリン系酸化防止剤は、リン原子に結合する一般式(A)で表わされる構造を分子内に2つ以上有することが好ましい。すなわち、前記リン系酸化防止剤が、リン原子に結合する前記一般式(A)で表わされる構造を分子内に2つ以上有し、かつリン原子に結合する前記一般式(B)で表わされる構造を分子内に有さないリン系酸化防止剤であることが好ましい。 The specific phosphorus-based antioxidant preferably has two or more structures represented by the general formula (A) bonded to a phosphorus atom in the molecule. That is, the phosphorus antioxidant has two or more structures represented by the general formula (A) bonded to the phosphorus atom in the molecule and is expressed by the general formula (B) bonded to the phosphorus atom. It is preferable that it is a phosphorus antioxidant which does not have a structure in a molecule | numerator.
 なお、前記特定のリン系酸化防止剤はその分子中にリン原子を少なくとも1つ有する。前記特定のリン系酸化防止剤を構成するリン原子は通常+3価の原子価を有する。
 なお、本発明の樹脂組成物が、リン系酸化防止剤を含むと、樹脂組成物の透明性に優れるため好ましい。
The specific phosphorus-based antioxidant has at least one phosphorus atom in the molecule. The phosphorus atom constituting the specific phosphorus-based antioxidant usually has a +3 valence.
In addition, since it is excellent in the transparency of a resin composition when the resin composition of this invention contains phosphorus antioxidant, it is preferable.
 前述のように、前記一般式(A)において、R2~R4はそれぞれ独立に、炭素数1または2のアルキル基である。
 前記一般式(A)において、R5~R8はそれぞれ独立に、水素原子または炭素数1~20のアルキル基であるが、水素原子または炭素数1~7のアルキル基が好ましい。
As described above, in the general formula (A), R 2 to R 4 are each independently an alkyl group having 1 or 2 carbon atoms.
In the general formula (A), R 5 to R 8 are each independently a hydrogen atom or an alkyl group having 1 to 20 carbon atoms, preferably a hydrogen atom or an alkyl group having 1 to 7 carbon atoms.
 前記一般式(A)で表わされる構造を分子内に2つ以上有する場合には、片方の一般式(A)で表わされる構造のR5~R8は、他方の一般式(A)で表わされる構造のR5~R8との架橋を形成していてもよい。片方の一般式(A)で表わされる構造のR5~R8は、他方の一般式(A)で表わされる構造のR5~R8との架橋を形成する場合には、その架橋構造としては、単結合、炭素数1~4のアルキレン基が挙げられ、単結合が好ましい。 When two or more structures represented by the general formula (A) are present in the molecule, R 5 to R 8 of the structure represented by one general formula (A) are represented by the other general formula (A). Crosslinks with R 5 to R 8 having a structure as described above may be formed. When R 5 to R 8 of the structure represented by one general formula (A) form a bridge with R 5 to R 8 of the structure represented by the other general formula (A), Includes a single bond and an alkylene group having 1 to 4 carbon atoms, and a single bond is preferable.
 前記一般式(A)において、酸素原子のオルト位の置換基、すなわち、炭素原子およびR2~R4から構成される基は、嵩高いアルキル基であり、具体的には3級アルキル基である。具体的には、R2~R4がそれぞれ独立に、炭素数1または2のアルキル基であり、メチル基であることが好ましい。 In the general formula (A), the substituent at the ortho position of the oxygen atom, that is, the group composed of the carbon atom and R 2 to R 4 is a bulky alkyl group, specifically a tertiary alkyl group. is there. Specifically, R 2 to R 4 are each independently an alkyl group having 1 or 2 carbon atoms, preferably a methyl group.
 また、一般式(A)において、R6が、炭素数1~7のアルキル基であることが好ましい。また、R6は、嵩高いアルキル基であることが好ましく、具体的には2級または3級アルキル基であることが好ましく、3級アルキル基であることがより好ましく、t-ブチル基であることが特に好ましい。 In the general formula (A), R 6 is preferably an alkyl group having 1 to 7 carbon atoms. R 6 is preferably a bulky alkyl group, specifically, preferably a secondary or tertiary alkyl group, more preferably a tertiary alkyl group, and a t-butyl group. It is particularly preferred.
 また、一般式(A)において、R5、R7がそれぞれ独立に、水素原子または炭素数1~2のアルキル基であることが好ましい。
 また、一般式(A)において、R8が、水素原子または炭素数1~7のアルキル基であることが好ましい。また、R8は、嵩高いアルキル基であることが好ましく、具体的には3級アルキル基であることが好ましく、t-ブチル基であることがより好ましい。
In the general formula (A), R 5 and R 7 are preferably each independently a hydrogen atom or an alkyl group having 1 to 2 carbon atoms.
In the general formula (A), R 8 is preferably a hydrogen atom or an alkyl group having 1 to 7 carbon atoms. R 8 is preferably a bulky alkyl group, specifically a tertiary alkyl group, and more preferably a t-butyl group.
 前記特定のリン系酸化防止剤としては特に限定はなく、例えば市販品を用いることができる。特定のリン系酸化防止剤としては、例えば、IRGAFOS 168(BASF製)(下記式21)、GSY-P101(堺化学工業製)(下記式22)、スミライザーGP(住友化学製)(下記式23)を用いることができる。なお、式21で表されるリン系酸化防止剤は、城北化学工業からもJP-650との商品名で市販されている。特定のリン系酸化防止剤としては、一種を用いても、二種以上を用いてもよい。 The specific phosphorus-based antioxidant is not particularly limited, and for example, a commercially available product can be used. Specific phosphorus-based antioxidants include, for example, IRGAFOS 168 (manufactured by BASF) (the following formula 21), GSY-P101 (manufactured by Sakai Chemical Industry) (the following formula 22), Sumilizer GP (manufactured by Sumitomo Chemical) (the following formula 23) ) Can be used. The phosphorus-based antioxidant represented by the formula 21 is commercially available from Johoku Chemical Industry under the trade name JP-650. As specific phosphorus antioxidant, 1 type may be used or 2 or more types may be used.
Figure JPOXMLDOC01-appb-C000014
Figure JPOXMLDOC01-appb-C000014
 前記特定のリン系酸化防止剤は、前述のようにリン原子に結合する一般式(A)で表わされる構造を分子内に2つ以上有することが好ましく、IRGAFOS 168は、リン原子に結合する一般式(A)で表わされる構造を分子内に3つ有し、GSY-P101は、リン原子に結合する一般式(A)で表わされる構造を分子内に4つ有し、スミライザーGPは、リン原子に結合する一般式(A)で表わされる構造を分子内に2つ有する。 The specific phosphorus-based antioxidant preferably has two or more structures represented by the general formula (A) bonded to a phosphorus atom in the molecule as described above, and IRGAFOS 168 is generally bonded to a phosphorus atom. The structure represented by formula (A) has three structures in the molecule, GSY-P101 has four structures represented by the general formula (A) bonded to the phosphorus atom in the molecule, The molecule has two structures represented by the general formula (A) bonded to atoms.
 前記スミライザーGPは、片方の一般式(A)で表わされる構造のR8が、他方の一般式(A)で表わされる構造のR8と、単結合により架橋されている。
 なお、本発明に用いられる特定のリン系酸化防止剤としては、分子内にリン原子を1つ有し、リン原子に結合する一般式(A)で表わされる構造を分子内に3つ有するリン系酸化防止剤が、黄変の抑制の観点から最も好ましい。
In the above-mentioned Sumilizer GP, R 8 having a structure represented by one general formula (A) is bridged with R 8 having a structure represented by the other general formula (A) by a single bond.
The specific phosphorus-based antioxidant used in the present invention includes a phosphorus atom having one phosphorus atom in the molecule and three structures represented by the general formula (A) bonded to the phosphorus atom in the molecule. A system antioxidant is most preferable from the viewpoint of suppression of yellowing.
 また、本発明に用いる特定のリン系酸化防止剤は、リン原子に結合する一般式(B)で表わされる構造を分子内に有さない。なお、該構造を有すると、黄変が起こりやすいことを本発明者は見出した。黄変が起こりやすい、詳細な理由は不明であるが、本発明者らは、加熱により前記一般式(B)で表される構造が加水分解することが、黄変が起こる原因の一つであると推定した。 In addition, the specific phosphorus-based antioxidant used in the present invention does not have a structure represented by the general formula (B) bonded to a phosphorus atom in the molecule. In addition, this inventor discovered that yellowing would occur easily when it has this structure. Although the detailed reason for which yellowing is likely to occur is unknown, the present inventors are one of the causes of yellowing that the structure represented by the general formula (B) is hydrolyzed by heating. Presumed to be.
 また、特定のリン系酸化防止剤としては、リン原子に結合する前記一般式(A)で表わされる構造を分子内に1つ以上有し、リン原子に結合する前記一般式(B)で表される構造を有さなければよく、他の構造としては特に限定はされないが、その分子内に、ヒンダードフェノール構造を有していてもよい。 Moreover, as a specific phosphorus antioxidant, it has one or more structures represented by the general formula (A) bonded to the phosphorus atom in the molecule, and is represented by the general formula (B) bonded to the phosphorus atom. As long as it does not have a structure to be formed, other structures are not particularly limited, but a hindered phenol structure may be included in the molecule.
 〔樹脂組成物〕
 本発明の樹脂組成物は、前述のように近赤外線吸収剤と、リン酸トリエステルと、樹脂とからなる樹脂組成物である。
(Resin composition)
As described above, the resin composition of the present invention is a resin composition comprising a near-infrared absorber, a phosphate triester, and a resin.
 また、本発明の樹脂組成物は、耐光性および耐熱性に優れる。本発明の樹脂組成物が、さらにリン系酸化防止剤を含有することが好ましい。リン系酸化防止剤を含有すると、リン酸トリエステルの使用量が比較的少ない場合でも、耐光性および耐熱性に優れ、かつ樹脂組成物の透明性に優れる傾向があるため好ましい。 The resin composition of the present invention is excellent in light resistance and heat resistance. It is preferable that the resin composition of the present invention further contains a phosphorus-based antioxidant. It is preferable to contain a phosphorus-based antioxidant because even if the amount of phosphoric acid triester used is relatively small, the light resistance and heat resistance tend to be excellent, and the transparency of the resin composition tends to be excellent.
 本発明の樹脂組成物は、前述のように近赤外線吸収剤と、リン酸トリエステルと、樹脂とからなる組成物であればよく、さらにリン系酸化防止剤が含まれていることが好ましく、その製造方法としては特に限定されない。本発明の樹脂組成物の製造方法としては、例えば、トルエン、エタノール/トルエン混合溶媒、メタノール/トルエン混合溶媒、塩化メチレン、クロロホルム等の溶剤に樹脂、リン酸トリエステル、近赤外線吸収剤分散液、任意に用いられるリン系酸化防止剤を添加し、撹拌、超音波照射等によって樹脂を溶解させ、分散液を得て、該分散液から溶剤を除去する方法が挙げられる。なお、前記近赤外線吸収剤分散液は、近赤外線吸収剤を、トルエン、メタノール、塩化メチレン、クロロホルム、トリエチレングリコールビス(2-エチルヘキサノエート)等に分散することにより調製することができる。 The resin composition of the present invention may be a composition comprising a near-infrared absorber, a phosphate triester, and a resin as described above, and preferably contains a phosphorus-based antioxidant, The manufacturing method is not particularly limited. Examples of the method for producing the resin composition of the present invention include resins such as toluene, ethanol / toluene mixed solvent, methanol / toluene mixed solvent, methylene chloride, chloroform and the like, resin triester, near infrared absorber dispersion, Examples thereof include a method of adding an optional phosphorus-based antioxidant, dissolving the resin by stirring, ultrasonic irradiation, etc., obtaining a dispersion, and removing the solvent from the dispersion. The near-infrared absorbent dispersion can be prepared by dispersing the near-infrared absorbent in toluene, methanol, methylene chloride, chloroform, triethylene glycol bis (2-ethylhexanoate) or the like.
 本発明の樹脂組成物は、前記樹脂100質量部あたり、近赤外線吸収剤を0.05~50質量部含有することが好ましく、0.1~25質量部含有することがより好ましい。0.05質量部より少ないと充分な近赤外線吸収特性が得られない可能性があり、50質量部より多すぎると樹脂の透明性や接着性が大幅に低下するおそれがある。 The resin composition of the present invention preferably contains 0.05 to 50 parts by mass, more preferably 0.1 to 25 parts by mass of a near infrared absorber per 100 parts by mass of the resin. If the amount is less than 0.05 parts by mass, sufficient near infrared absorption characteristics may not be obtained. If the amount is more than 50 parts by mass, the transparency and adhesiveness of the resin may be significantly reduced.
 本発明の樹脂組成物は、前記樹脂100質量部あたり、前記リン酸トリエステルを0.05~5.0質量部含有することが好ましく、0.1~3.0質量部含有することがより好ましい。0.05質量部より少ないと充分に着色や、可視光透過率の低下を抑制することができない可能性があり、5.0質量部より多すぎると、リン酸トリエステルの分解により着色したり、樹脂中でリン酸トリエステルが析出して樹脂膜の透明性が損なわれるおそれがある。 The resin composition of the present invention preferably contains 0.05 to 5.0 parts by mass, more preferably 0.1 to 3.0 parts by mass of the phosphoric acid triester per 100 parts by mass of the resin. preferable. If it is less than 0.05 parts by mass, it may not be possible to sufficiently suppress coloring or a decrease in visible light transmittance. If it is more than 5.0 parts by mass, it may be colored due to decomposition of the phosphate triester. The phosphoric acid triester may precipitate in the resin and the transparency of the resin film may be impaired.
 また、本発明の樹脂組成物が前記リン系酸化防止剤を含有する場合には、前記樹脂100質量部あたり、前記リン系酸化防止剤を0.05~5.0質量部含有することが好ましく、0.1~3.0質量部含有することがより好ましい。0.05質量部より少ないと充分に着色や、可視光透過率の低下を抑制することができない可能性があり、5.0質量部より多すぎると、リン系酸化防止剤の分解により着色したり、樹脂中でリン系酸化防止剤が析出して樹脂膜の透明性が損なわれるおそれがある。 Further, when the resin composition of the present invention contains the phosphorus antioxidant, it is preferable to contain 0.05 to 5.0 parts by mass of the phosphorus antioxidant per 100 parts by mass of the resin. More preferably, the content is 0.1 to 3.0 parts by mass. If it is less than 0.05 parts by mass, it may not be possible to sufficiently color or suppress the decrease in visible light transmittance. If it is more than 5.0 parts by mass, it will be colored due to decomposition of the phosphorus antioxidant. Or the phosphorus-based antioxidant may be precipitated in the resin and the transparency of the resin film may be impaired.
 本発明の樹脂組成物は、近赤外線吸収能に優れ、光照射がされた場合の着色や、可視光透過率の低下が抑制されているため、合わせガラス等の構造材料用の中間膜として好適に使用することが可能である。また、本発明の樹脂組成物は、加熱時の着色、すなわち黄変についても抑制されているため、このような観点からも合わせガラス等の構造材料用の中間膜として好適に使用することが可能である。 The resin composition of the present invention has excellent near-infrared absorptivity, and is suitable as an intermediate film for structural materials such as laminated glass because coloring when irradiated with light and reduction in visible light transmittance are suppressed. Can be used. Further, since the resin composition of the present invention is also suppressed in coloring during heating, that is, yellowing, it can be suitably used as an intermediate film for structural materials such as laminated glass from this viewpoint. It is.
 また、本発明の樹脂組成物には、各種添加剤が含有されていてもよい。添加剤としては、例えば可塑剤、分散剤、架橋剤、キレート剤、酸化防止剤、紫外線吸収剤、光安定剤、色調補正剤等が挙げられる。これらの添加剤は、本発明の樹脂組成物を製造する際に、添加されてもよく、前述の近赤外線吸収剤、リン酸トリエステル、樹脂、リン系酸化防止剤それぞれを製造する際に添加されてもよい。 Moreover, various additives may be contained in the resin composition of the present invention. Examples of the additive include a plasticizer, a dispersant, a crosslinking agent, a chelating agent, an antioxidant, an ultraviolet absorber, a light stabilizer, and a color tone correction agent. These additives may be added when manufacturing the resin composition of the present invention, and are added when manufacturing the above-mentioned near-infrared absorber, phosphate triester, resin, and phosphorus antioxidant, respectively. May be.
 〔樹脂組成物の用途〕
 本発明の樹脂組成物は、近赤外線を吸収することが望まれる用途に通常は用いられる。
 本発明の樹脂組成物から形成される樹脂膜は、近赤外線吸収能に優れ、耐光性に優れ、加熱時の着色、すなわち黄変についても抑制されているため合わせガラス用中間膜等の構造材料用中間膜として好適に用いることが可能である。
[Use of resin composition]
The resin composition of the present invention is usually used for applications where it is desired to absorb near infrared rays.
The resin film formed from the resin composition of the present invention has excellent near-infrared absorption ability, excellent light resistance, and is suppressed in terms of coloring during heating, that is, yellowing, so that it is a structural material such as an interlayer film for laminated glass It can be suitably used as an intermediate film for use.
 また、本発明の合わせガラスは、前記合わせガラス用中間膜を有している。本発明の合わせガラスを構成するガラスとしては特に限定はなく、従来公知のものを用いることができる。 Further, the laminated glass of the present invention has the interlayer film for laminated glass. There is no limitation in particular as glass which comprises the laminated glass of this invention, A conventionally well-known thing can be used.
 次に本発明について実施例を示してさらに詳細に説明するが、本発明はこれらによって限定されるものではない。
 〔製造例1〕
 (銅塩分散液の調製)
 500mlナスフラスコに、酢酸銅一水和物7.00g(35.06mmol)、メタノール140gを加え、20℃で1時間攪拌し、溶液(A液)を得た。
EXAMPLES Next, although an Example is shown and this invention is demonstrated further in detail, this invention is not limited by these.
[Production Example 1]
(Preparation of copper salt dispersion)
To a 500 ml eggplant flask, 7.00 g (35.06 mmol) of copper acetate monohydrate and 140 g of methanol were added and stirred at 20 ° C. for 1 hour to obtain a solution (solution A).
 別の容器に、プライサーフA219B(第一工業製薬製)1.75g、n-ブチルホスホン酸4.82gをメタノール100gに溶解し、溶液(B液)を得た。
 B液を、A液に対して3時間かけて滴下した。この反応液を20℃で10時間撹拌した。
In a separate container, 1.75 g of PRISURF A219B (Daiichi Kogyo Seiyaku) and 4.82 g of n-butylphosphonic acid were dissolved in 100 g of methanol to obtain a solution (liquid B).
B liquid was dripped over 3 hours with respect to A liquid. The reaction was stirred at 20 ° C. for 10 hours.
 その後、エバポレーター(水浴60℃)で反応液から溶媒を留去した。溶媒が留去された固形分にトルエン100gを加え、恒量になり、酢酸臭がしなくなるまでエバポレーターで留去した。収量8.75g(収率100%)の青緑色固体が得られた。これにトルエン211gを加え、超音波照射を6時間行い、n-ブチルホスホン酸銅塩トルエン分散液(1)を得た。 Thereafter, the solvent was distilled off from the reaction solution with an evaporator (water bath 60 ° C.). 100 g of toluene was added to the solid content from which the solvent had been distilled off, and the solvent was distilled off with an evaporator until a constant weight was obtained and the acetic acid odor disappeared. A blue-green solid with a yield of 8.75 g (100% yield) was obtained. To this was added 211 g of toluene, and ultrasonic irradiation was performed for 6 hours to obtain an n-butylphosphonic acid copper salt toluene dispersion (1).
 〔実施例1〕
 (銅塩微粒子分散樹脂の調製)
 300ml三角フラスコに、トリエチレングリコールビス(2-エチルヘキサノエート)(3GO、可塑剤)1.90g、トルエン250ml、ポリビニルブチラール(PVB)5.00gを加えた。
[Example 1]
(Preparation of copper salt fine particle dispersed resin)
To a 300 ml Erlenmeyer flask, 1.90 g of triethylene glycol bis (2-ethylhexanoate) (3GO, plasticizer), 250 ml of toluene, and 5.00 g of polyvinyl butyral (PVB) were added.
 これに、トリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェート150mgを加えた。
 これに上記n-ブチルホスホン酸銅塩トルエン分散液(1)3.65g(銅塩を0.583mmol含む)を添加し、20℃で10時間撹拌後、1.5時間超音波照射し、PVBを均一に溶解させた。
To this was added 150 mg of tris (2,4-di-tertiarybutylphenyl) phosphate.
To this was added 3.65 g of the above n-butylphosphonic acid copper salt toluene dispersion (1) (containing 0.583 mmol of copper salt), stirred at 20 ° C. for 10 hours, and then irradiated with ultrasonic waves for 1.5 hours. Was dissolved uniformly.
 この分散液をテフロン(登録商標)製バットに広げ、12時間20℃で風乾した。さらに40℃で5時間、70℃で3.5時間真空乾燥を行って溶媒を完全に除去し、銅塩微粒子が分散したPVB樹脂(1)(樹脂組成物(1))を得た。 The dispersion was spread on a Teflon (registered trademark) vat and air-dried at 20 ° C for 12 hours. Furthermore, vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (1) (resin composition (1)) in which copper salt fine particles were dispersed.
 (評価)
 <樹脂シート(1)の作製>
 前記銅塩微粒子が分散したPVB樹脂(1)を、厚さ0.8mmの型枠および(株)神藤金属工業所製の圧縮成形機を用い、120℃、3MPaで予熱1分間を行った後、15MPaで3分間プレスし、樹脂シート(1)を得た。
(Evaluation)
<Preparation of resin sheet (1)>
After the PVB resin (1) in which the copper salt fine particles are dispersed is preheated at 120 ° C. and 3 MPa for 1 minute using a 0.8 mm thick formwork and a compression molding machine manufactured by Shinfuji Metal Industry Co., Ltd. , And pressed at 15 MPa for 3 minutes to obtain a resin sheet (1).
 <樹脂シート(2)の作製>
 前記樹脂シート(1)を、さらに厚さ0.8mmの型枠および(株)神藤金属工業所製の圧縮成形機を用い、200℃、3MPaで予熱1分間を行った後、10MPaで5分間プレスし、樹脂シート(2)を得た。
<Production of resin sheet (2)>
The resin sheet (1) was further preheated at 200 ° C. and 3 MPa for 1 minute using a 0.8 mm-thick mold and a compression molding machine manufactured by Shindo Metal Industry Co., Ltd., and then at 10 MPa for 5 minutes. The resin sheet (2) was obtained by pressing.
 <測定サンプル(1)の作製>
 前記樹脂シート(1)の両面を、スライドガラス(厚み1.2~1.5mm)で挟み、70℃のプレート上で合わせガラス(1)とした。
<Preparation of measurement sample (1)>
Both surfaces of the resin sheet (1) were sandwiched between slide glasses (thickness 1.2 to 1.5 mm), and laminated glass (1) was formed on a plate at 70 ° C.
 該合わせガラス(1)をオートクレーブ内で、窒素雰囲気下、圧力1.5MPa、130℃で0.5時間加熱し、樹脂シートの両面にスライドガラスが配設された測定サンプル(1)を得た。 The laminated glass (1) was heated in an autoclave under a nitrogen atmosphere at a pressure of 1.5 MPa and 130 ° C. for 0.5 hours to obtain a measurement sample (1) in which slide glasses were disposed on both surfaces of the resin sheet. .
 <測定サンプル(2)の作製>
 樹脂シート(1)を樹脂シート(2)に代えた以外は、前記測定サンプル(1)の作製と同様に行い、樹脂シートの両面にスライドガラスが配設された測定サンプル(2)を得た。
<Preparation of measurement sample (2)>
Except that the resin sheet (1) was replaced with the resin sheet (2), the measurement was performed in the same manner as the preparation of the measurement sample (1) to obtain a measurement sample (2) in which slide glasses were disposed on both surfaces of the resin sheet. .
 <透明性の評価>
 前記測定サンプル(1)および測定サンプル(2)のヘイズを、日本電色工業NDH-2000(D65光源,シングルビーム)を使用して測定した。
<Evaluation of transparency>
The haze of the measurement sample (1) and the measurement sample (2) was measured using Nippon Denshoku NDH-2000 (D65 light source, single beam).
 測定サンプル(1)のヘイズは8.7%、測定サンプル(2)のヘイズは5.2%であった。
 <耐熱性の評価>
 前記測定サンプル(1)および(2)の分光をそれぞれ以下の方法で測定した。
The haze of the measurement sample (1) was 8.7%, and the haze of the measurement sample (2) was 5.2%.
<Evaluation of heat resistance>
The spectra of the measurement samples (1) and (2) were measured by the following methods, respectively.
 該測定サンプルの分光は、250~2500nmの波長範囲で、分光光度計(U-4000形、(株)日立製作所製)を使用して測定した。C光源を使用し、三刺激値(X,Y,Z)の値を計算した。 The spectrum of the measurement sample was measured using a spectrophotometer (U-4000, manufactured by Hitachi, Ltd.) in the wavelength range of 250 to 2500 nm. Tristimulus values (X, Y, Z) were calculated using a C light source.
 測定サンプル(1)のYI(黄色度指数)は、4.6であり、測定サンプル(2)のYIは、7.4であった。なおYIの値の計算は、下式により行った。
 YI=(128X-106Z)/Y
 測定サンプル(1)のYIと測定サンプル(2)のYIとの差(測定サンプル(2)のYI-測定サンプル(1)のYI)をΔYIとすると、ΔYIは2.8であった。
The measurement sample (1) had a YI (yellowness index) of 4.6, and the measurement sample (2) had a YI of 7.4. The YI value was calculated according to the following formula.
YI = (128X-106Z) / Y
When the difference between the YI of the measurement sample (1) and the YI of the measurement sample (2) (YI of the measurement sample (2) −YI of the measurement sample (1)) is ΔYI, ΔYI was 2.8.
 <耐光性の評価>
 耐光性試験を以下の方法で行った。
 測定サンプル(2)のTvis(可視光透過率)を、分光光度計(U-4000形、(株)日立製作所製)を使用し求めた。
<Evaluation of light resistance>
The light resistance test was conducted by the following method.
Tvis (visible light transmittance) of the measurement sample (2) was determined using a spectrophotometer (U-4000, manufactured by Hitachi, Ltd.).
 次いでスーパーキセノンウェザーメーター(スガ試験機(株)製)に測定サンプル(2)を入れ、照射する光の強度を180W/m2、降雨なしの条件で400時間保管した後、分光を測定してYI、Tvisを求めた。 Next, put the measurement sample (2) in a super xenon weather meter (manufactured by Suga Test Instruments Co., Ltd.), store it for 400 hours under the condition of 180 W / m 2 , no rain, and then measure the spectrum. YI and Tvis were determined.
 400時間後のYIは8.0であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、0.6(8.0-7.4)であった。
 400時間後のTvisは81.3%であり、耐光性試験前の測定サンプル(2)のTvisは85.5%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、4.2%であった。
YI after 400 hours was 8.0, and ΔYI was 0.6 (8.0-7.4), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 81.3%, and the Tvis of the measurement sample (2) before the light resistance test was 85.5%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 4 2%.
 〔比較例1〕
 (銅塩微粒子分散樹脂の調製)
 トリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェートを用いなかったこと以外は、実施例1と同様に行い、銅塩微粒子が分散したPVB樹脂(c1)(樹脂組成物(c1))を得た。
[Comparative Example 1]
(Preparation of copper salt fine particle dispersed resin)
PVB resin (c1) (resin composition (c1)) in which copper salt fine particles were dispersed was carried out in the same manner as in Example 1 except that tris (2,4-di-tert-butylphenyl) phosphate was not used. Obtained.
 (評価)
 <樹脂シート(c1)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(c1)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(c1)を得た。
(Evaluation)
<Preparation of resin sheet (c1)>
Resin made in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (c1) in which copper salt fine particles are dispersed. A sheet (c1) was obtained.
 <樹脂シート(c2)の作製>
 樹脂シート(1)を樹脂シート(c1)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(c2)を得た。
<Preparation of resin sheet (c2)>
Except having replaced the resin sheet (1) with the resin sheet (c1), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (c2).
 <測定サンプル(c1)の作製>
 樹脂シート(1)を樹脂シート(c1)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(c1)を得た。
<Preparation of measurement sample (c1)>
A measurement sample (c1) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (c1).
 <測定サンプル(c2)の作製>
 樹脂シート(2)を樹脂シート(c2)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(c2)を得た。
<Preparation of measurement sample (c2)>
A measurement sample (c2) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (c2).
 <透明性の評価>
 前記測定サンプル(c1)、測定サンプル(c2)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (c1) and the measurement sample (c2) was measured by the same method as that described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(c1)のヘイズは1.1%、測定サンプル(c2)のヘイズは1.4%であった。
 <耐熱性の評価>
 前記測定サンプル(c1)、測定サンプル(c2)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (c1) was 1.1%, and the haze of the measurement sample (c2) was 1.4%.
<Evaluation of heat resistance>
The spectrum of the measurement sample (c1) and the measurement sample (c2) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(c1)のYIは、4.3であり、測定サンプル(c2)のYIは、9.4であった。測定サンプル(c1)と測定サンプル(c2)のΔYIは5.1であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(c2)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (c1) was 4.3, and YI of the measurement sample (c2) was 9.4. ΔYI of the measurement sample (c1) and the measurement sample (c2) was 5.1.
<Evaluation of light resistance>
YI and Tvis were obtained in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (c2).
 400時間後のYIは22.6であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、13.2(22.6-9.4)であった。
 400時間後のTvisは24.6%であり、耐光性試験前の測定サンプル(c2)のTvisは84.1%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、59.5%であった。
YI after 400 hours was 22.6, and ΔYI was 13.2 (22.6-9.4), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 24.6%, and the Tvis of the measurement sample (c2) before the light resistance test was 84.1%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 59 .5%.
 〔実施例2〕
 (銅塩微粒子分散樹脂の調製)
 300ml三角フラスコに、トリエチレングリコールビス(2-エチルヘキサノエート)(3GO、可塑剤)1.90g、トルエン250ml、ポリビニルブチラール(PVB)5.00gを加えた。
[Example 2]
(Preparation of copper salt fine particle dispersed resin)
To a 300 ml Erlenmeyer flask, 1.90 g of triethylene glycol bis (2-ethylhexanoate) (3GO, plasticizer), 250 ml of toluene, and 5.00 g of polyvinyl butyral (PVB) were added.
 これに、トリス(2,4-ジ-ターシャリーブチルフェニル)ホスファイト50mg、トリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェート50mgを加えた。
 これに上記n-ブチルホスホン酸銅塩トルエン分散液(1)3.65g(銅塩を0.583mmol含む)を添加し、20℃で10時間撹拌後、1.5時間超音波照射し、PVBを均一に溶解させた。
To this, 50 mg of tris (2,4-di-tertiarybutylphenyl) phosphate and 50 mg of tris (2,4-di-tertiarybutylphenyl) phosphate were added.
To this was added 3.65 g of the above n-butylphosphonic acid copper salt toluene dispersion (1) (containing 0.583 mmol of copper salt), stirred at 20 ° C. for 10 hours, and then irradiated with ultrasonic waves for 1.5 hours. Was dissolved uniformly.
 この分散液をテフロン(登録商標)製バットに広げ、12時間20℃で風乾した。さらに40℃で5時間、70℃で3.5時間真空乾燥を行って溶媒を完全に除去し、銅塩微粒子が分散したPVB樹脂(2)(樹脂組成物(2))を得た。 The dispersion was spread on a Teflon (registered trademark) vat and air-dried at 20 ° C for 12 hours. Furthermore, vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (2) (resin composition (2)) in which copper salt fine particles were dispersed.
 (評価)
 <樹脂シート(3)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(2)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(3)を得た。
(Evaluation)
<Preparation of resin sheet (3)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (2) in which copper salt fine particles are dispersed. Sheet (3) was obtained.
 <樹脂シート(4)の作製>
 樹脂シート(1)を樹脂シート(3)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(4)を得た。
<Preparation of resin sheet (4)>
Except having replaced the resin sheet (1) with the resin sheet (3), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (4).
 <測定サンプル(3)の作製>
 樹脂シート(1)を樹脂シート(3)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(3)を得た。
<Preparation of measurement sample (3)>
A measurement sample (3) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (3).
 <測定サンプル(4)の作製>
 樹脂シート(2)を樹脂シート(4)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(4)を得た。
<Preparation of measurement sample (4)>
A measurement sample (4) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (4).
 <透明性の評価>
 前記測定サンプル(3)、測定サンプル(4)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (3) and the measurement sample (4) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(3)のヘイズは1.4%、測定サンプル(4)のヘイズは2.7%であった。
 <耐熱性の評価>
 前記測定サンプル(3)、測定サンプル(4)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (3) was 1.4%, and the haze of the measurement sample (4) was 2.7%.
<Evaluation of heat resistance>
The spectra of the measurement sample (3) and the measurement sample (4) were measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(3)のYIは、4.6であり、測定サンプル(4)のYIは、8.6であった。測定サンプル(3)と測定サンプル(4)のΔYIは4.0であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(4)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
The YI of the measurement sample (3) was 4.6, and the YI of the measurement sample (4) was 8.6. ΔYI of the measurement sample (3) and the measurement sample (4) was 4.0.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (4).
 400時間後のYIは9.8であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、1.2(9.8-8.6)であった。
 400時間後のTvisは81.8%であり、耐光性試験前の測定サンプル(4)のTvisは84.3%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、2.5%であった。
YI after 400 hours was 9.8, and ΔYI was 1.2 (9.8-8.6), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 81.8%, and the Tvis of the measurement sample (4) before the light resistance test was 84.3%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 2 .5%.
 〔実施例3〕
 (銅塩微粒子分散樹脂の調製)
 トリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェートの使用量を150mgから50mgに代えた以外は実施例1と同様に行い、銅塩微粒子が分散したPVB樹脂(3)(樹脂組成物(3))を得た。
Example 3
(Preparation of copper salt fine particle dispersed resin)
PVB resin (3) in which copper salt fine particles are dispersed (resin composition (3)) except that the amount of tris (2,4-di-tertiarybutylphenyl) phosphate used is changed from 150 mg to 50 mg. 3)) was obtained.
 (評価)
 <樹脂シート(5)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(3)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(5)を得た。
(Evaluation)
<Preparation of resin sheet (5)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (3) in which copper salt fine particles are dispersed. A sheet (5) was obtained.
 <樹脂シート(6)の作製>
 樹脂シート(1)を樹脂シート(5)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(6)を得た。
<Preparation of resin sheet (6)>
Except having replaced the resin sheet (1) with the resin sheet (5), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (6).
 <測定サンプル(5)の作製>
 樹脂シート(1)を樹脂シート(5)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(5)を得た。
<Preparation of measurement sample (5)>
A measurement sample (5) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (5).
 <測定サンプル(6)の作製>
 樹脂シート(2)を樹脂シート(6)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(6)を得た。
<Preparation of measurement sample (6)>
A measurement sample (6) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (6).
 <透明性の評価>
 前記測定サンプル(5)、測定サンプル(6)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (5) and the measurement sample (6) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(5)のヘイズは1.6%、測定サンプル(6)のヘイズは1.9%であった。
 <耐熱性の評価>
 前記測定サンプル(5)、測定サンプル(6)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (5) was 1.6%, and the haze of the measurement sample (6) was 1.9%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (5) and the measurement sample (6) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(5)のYIは、4.8であり、測定サンプル(6)のYIは、7.8であった。測定サンプル(5)と測定サンプル(6)のΔYIは3.0であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(6)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (5) was 4.8, and YI of the measurement sample (6) was 7.8. ΔYI of the measurement sample (5) and the measurement sample (6) was 3.0.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (6).
 400時間後のYIは14.6であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、6.8(14.6-7.8)であった。
 400時間後のTvisは63.8%であり、耐光性試験前の測定サンプル(6)のTvisは85.3%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、21.5%であった。
YI after 400 hours was 14.6, and ΔYI was 6.8 (14.6-7.8) when the difference from YI before the light resistance test was ΔYI.
The Tvis after 400 hours was 63.8%, and the Tvis of the measurement sample (6) before the light resistance test was 85.3%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 21 .5%.
 〔実施例4〕
 (銅塩微粒子分散樹脂の調製)
 トリス(2,4-ジ-ターシャリーブチルフェニル)ホスファイトの使用量を50mgから100mgに代え、トリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェートの使用量を50mgから100mgに代えた以外は実施例2と同様に行い、銅塩微粒子が分散したPVB樹脂(4)(樹脂組成物(4))を得た。
Example 4
(Preparation of copper salt fine particle dispersed resin)
The amount of tris (2,4-di-tertiarybutylphenyl) phosphite was changed from 50 mg to 100 mg, and the amount of tris (2,4-di-tertiarybutylphenyl) phosphate was changed from 50 mg to 100 mg. Was performed in the same manner as in Example 2 to obtain a PVB resin (4) (resin composition (4)) in which copper salt fine particles were dispersed.
 (評価)
 <樹脂シート(7)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(4)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(7)を得た。
(Evaluation)
<Preparation of resin sheet (7)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (4) in which copper salt fine particles are dispersed. A sheet (7) was obtained.
 <樹脂シート(8)の作製>
 樹脂シート(1)を樹脂シート(7)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(8)を得た。
<Production of resin sheet (8)>
Except having replaced the resin sheet (1) with the resin sheet (7), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (8).
 <測定サンプル(7)の作製>
 樹脂シート(1)を樹脂シート(7)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(7)を得た。
<Preparation of measurement sample (7)>
A measurement sample (7) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (7).
 <測定サンプル(8)の作製>
 樹脂シート(2)を樹脂シート(8)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(8)を得た。
<Preparation of measurement sample (8)>
A measurement sample (8) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (8).
 <透明性の評価>
 前記測定サンプル(7)、測定サンプル(8)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (7) and the measurement sample (8) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(7)のヘイズは6.8%、測定サンプル(8)のヘイズは6.4%であった。
 <耐熱性の評価>
 前記測定サンプル(7)、測定サンプル(8)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (7) was 6.8%, and the haze of the measurement sample (8) was 6.4%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (7) and the measurement sample (8) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(7)のYIは、5.0であり、測定サンプル(8)のYIは、7.9であった。測定サンプル(7)と測定サンプル(8)のΔYIは2.9であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(8)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (7) was 5.0, and YI of the measurement sample (8) was 7.9. ΔYI of the measurement sample (7) and the measurement sample (8) was 2.9.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (8).
 400時間後のYIは8.3であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、0.4(8.3-7.9)であった。
 400時間後のTvisは81.6%であり、耐光性試験前の測定サンプル(8)のTvisは84.2%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、2.6%であった。
YI after 400 hours was 8.3, and ΔYI was 0.4 (8.3-7.9), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 81.6%, and the Tvis of the measurement sample (8) before the light resistance test was 84.2%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 2 It was 6%.
 〔実施例5〕
 (銅塩微粒子分散樹脂の調製)
 トリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェート150mgをトリフェニルホスフェート24.7mgに代えた以外は実施例1と同様に行い、銅塩微粒子が分散したPVB樹脂(5)(樹脂組成物(5))を得た。
Example 5
(Preparation of copper salt fine particle dispersed resin)
PVB resin (5) (resin composition) in which copper salt fine particles were dispersed was carried out in the same manner as in Example 1 except that 150 mg of tris (2,4-di-tert-butylphenyl) phosphate was replaced with 24.7 mg of triphenyl phosphate. (5)) was obtained.
 (評価)
 <樹脂シート(9)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(5)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(9)を得た。
(Evaluation)
<Preparation of resin sheet (9)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (5) in which copper salt fine particles are dispersed. Sheet (9) was obtained.
 <樹脂シート(10)の作製>
 樹脂シート(1)を樹脂シート(9)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(10)を得た。
<Preparation of resin sheet (10)>
Except having replaced the resin sheet (1) with the resin sheet (9), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (10).
 <測定サンプル(9)の作製>
 樹脂シート(1)を樹脂シート(9)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(9)を得た。
<Preparation of measurement sample (9)>
A measurement sample (9) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (9).
 <測定サンプル(10)の作製>
 樹脂シート(2)を樹脂シート(10)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(10)を得た。
<Preparation of measurement sample (10)>
A measurement sample (10) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (10).
 <透明性の評価>
 前記測定サンプル(9)、測定サンプル(10)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (9) and the measurement sample (10) was measured by the same method as that described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(9)のヘイズは1.8%、測定サンプル(10)のヘイズは1.8%であった。
 <耐熱性の評価>
 前記測定サンプル(9)、測定サンプル(10)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (9) was 1.8%, and the haze of the measurement sample (10) was 1.8%.
<Evaluation of heat resistance>
The spectrum of the measurement sample (9) and the measurement sample (10) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(9)のYIは、5.7であり、測定サンプル(10)のYIは、7.5であった。測定サンプル(9)と測定サンプル(10)のΔYIは1.8であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(10)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (9) was 5.7, and YI of the measurement sample (10) was 7.5. ΔYI of the measurement sample (9) and the measurement sample (10) was 1.8.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (10).
 400時間後のYIは18.1であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、10.6(18.1-7.5)であった。
 400時間後のTvisは37.3%であり、耐光性試験前の測定サンプル(10)のTvisは85.6%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、48.3%であった。
YI after 400 hours was 18.1, and ΔYI was 10.6 (18.1-7.5), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 37.3%, and the Tvis of the measurement sample (10) before the light resistance test was 85.6%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 48 3%.
 〔実施例6〕
 (銅塩微粒子分散樹脂の調製)
 トリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェート150mgをトリブチルホスフェート40.4mgに代えた以外は実施例1と同様に行い、銅塩微粒子が分散したPVB樹脂(6)(樹脂組成物(6))を得た。
Example 6
(Preparation of copper salt fine particle dispersed resin)
PVB resin (6) in which copper salt fine particles are dispersed (resin composition (except for the resin composition)), except that 150 mg of tris (2,4-di-tert-butylphenyl) phosphate is replaced with 40.4 mg of tributyl phosphate. 6)) was obtained.
 (評価)
 <樹脂シート(11)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(6)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(11)を得た。
(Evaluation)
<Preparation of resin sheet (11)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (6) in which copper salt fine particles are dispersed. A sheet (11) was obtained.
 <樹脂シート(12)の作製>
 樹脂シート(1)を樹脂シート(11)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(12)を得た。
<Preparation of resin sheet (12)>
Except having replaced the resin sheet (1) with the resin sheet (11), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (12).
 <測定サンプル(11)の作製>
 樹脂シート(1)を樹脂シート(11)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(11)を得た。
<Preparation of measurement sample (11)>
A measurement sample (11) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (11).
 <測定サンプル(12)の作製>
 樹脂シート(2)を樹脂シート(12)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(12)を得た。
<Preparation of measurement sample (12)>
A measurement sample (12) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (12).
 <透明性の評価>
 前記測定サンプル(11)、測定サンプル(12)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (11) and the measurement sample (12) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(11)のヘイズは2.2%、測定サンプル(12)のヘイズは2.1%であった。
 <耐熱性の評価>
 前記測定サンプル(11)、測定サンプル(12)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (11) was 2.2%, and the haze of the measurement sample (12) was 2.1%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (11) and the measurement sample (12) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(11)のYIは、5.7であり、測定サンプル(12)のYIは、8.4であった。測定サンプル(11)と測定サンプル(12)のΔYIは2.7であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(12)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (11) was 5.7, and YI of the measurement sample (12) was 8.4. ΔYI of the measurement sample (11) and the measurement sample (12) was 2.7.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (12).
 400時間後のYIは15.8であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、7.4(15.8-8.4)であった。
 400時間後のTvisは30.1%であり、耐光性試験前の測定サンプル(12)のTvisは84.4%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、54.3%であった。
YI after 400 hours was 15.8, and ΔYI was 7.4 (15.8-8.4), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 30.1%, and the Tvis of the measurement sample (12) before the light resistance test was 84.4%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 54 3%.
 〔実施例7〕
 (銅塩微粒子分散樹脂の調製)
 トリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェート150mgをトリス(2-エチルヘキシル)ホスフェート32.9mgに代えた以外は実施例1と同様に行い、銅塩微粒子が分散したPVB樹脂(7)(樹脂組成物(7))を得た。
Example 7
(Preparation of copper salt fine particle dispersed resin)
PVB resin in which copper salt fine particles are dispersed (7), except that 150 mg of tris (2,4-di-tert-butylphenyl) phosphate is replaced with 32.9 mg of tris (2-ethylhexyl) phosphate. (Resin composition (7)) was obtained.
 (評価)
 <樹脂シート(13)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(7)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(13)を得た。
(Evaluation)
<Preparation of resin sheet (13)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (7) in which copper salt fine particles are dispersed. A sheet (13) was obtained.
 <樹脂シート(14)の作製>
 樹脂シート(1)を樹脂シート(13)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(14)を得た。
<Preparation of resin sheet (14)>
Except having replaced the resin sheet (1) with the resin sheet (13), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (14).
 <測定サンプル(13)の作製>
 樹脂シート(1)を樹脂シート(13)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(13)を得た。
<Preparation of measurement sample (13)>
A measurement sample (13) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (13).
 <測定サンプル(14)の作製>
 樹脂シート(2)を樹脂シート(14)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(14)を得た。
<Preparation of measurement sample (14)>
A measurement sample (14) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (14).
 <透明性の評価>
 前記測定サンプル(13)、測定サンプル(14)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (13) and the measurement sample (14) was measured by the same method as that described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(13)のヘイズは2.6%、測定サンプル(14)のヘイズは2.0%であった。
 <耐熱性の評価>
 前記測定サンプル(13)、測定サンプル(14)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (13) was 2.6%, and the haze of the measurement sample (14) was 2.0%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (13) and the measurement sample (14) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(13)のYIは、6.0であり、測定サンプル(14)のYIは、6.7であった。測定サンプル(13)と測定サンプル(14)のΔYIは0.7であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(14)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
The YI of the measurement sample (13) was 6.0, and the YI of the measurement sample (14) was 6.7. ΔYI of the measurement sample (13) and the measurement sample (14) was 0.7.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (14).
 400時間後のYIは9.9であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、3.2(9.9-6.7)であった。
 400時間後のTvisは29.6%であり、耐光性試験前の測定サンプル(14)のTvisは85.8%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、56.2%であった。
YI after 400 hours was 9.9, and ΔYI was 3.2 (9.9-6.7), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 29.6%, and the Tvis of the measurement sample (14) before the light resistance test was 85.8%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 56 2%.
 〔製造例2〕
 (銅塩分散液の調製)
 500mlナスフラスコに、酢酸銅一水和物3.557g(17.82mmol)、エタノール178gを加え、20℃で1時間攪拌し、溶液(A液)を得た。
[Production Example 2]
(Preparation of copper salt dispersion)
To a 500 ml eggplant flask, 3.557 g (17.82 mmol) of copper acetate monohydrate and 178 g of ethanol were added and stirred at 20 ° C. for 1 hour to obtain a solution (solution A).
 別の容器に、プライサーフA219B(第一工業製薬製)0.711g、n-ブチルホスホン酸2.436gをエタノール25gに溶解し、溶液(B液)を得た。
 B液を、A液に対して3時間かけて滴下した。この反応液を20℃で20時間撹拌した。
In a separate container, 0.711 g of Prisurf A219B (Daiichi Kogyo Seiyaku) and 2.436 g of n-butylphosphonic acid were dissolved in 25 g of ethanol to obtain a solution (liquid B).
B liquid was dripped over 3 hours with respect to A liquid. The reaction was stirred at 20 ° C. for 20 hours.
 その後、エバポレーター(水浴60℃)で反応液から溶媒を留去した。溶媒が留去された固形分にトルエン50gを加え、恒量になり、酢酸臭がしなくなるまでエバポレーターで留去した。収量4.27g(収率100%)の青緑色固体が得られた。これにトルエン83gを加え、超音波照射を3時間行い、n-ブチルホスホン酸銅塩トルエン分散液(2)を得た。 Thereafter, the solvent was distilled off from the reaction solution with an evaporator (water bath 60 ° C.). 50 g of toluene was added to the solid content from which the solvent had been distilled off, and the solvent was distilled off with an evaporator until a constant weight was reached and there was no odor of acetic acid. A blue-green solid with a yield of 4.27 g (yield 100%) was obtained. To this was added 83 g of toluene, and ultrasonic irradiation was performed for 3 hours to obtain an n-butylphosphonic acid copper salt toluene dispersion (2).
 〔実施例8〕
 (銅塩微粒子分散樹脂の調製)
 300ml三角フラスコに、トリエチレングリコールビス(2-エチルヘキサノエート)(3GO、可塑剤)1.90g、トルエン100g、エタノール40g、ポリビニルブチラール(PVB)5.00gを加え、20℃で10時間撹拌し、完全に溶解した(C液)。
Example 8
(Preparation of copper salt fine particle dispersed resin)
Add 1.90 g of triethylene glycol bis (2-ethylhexanoate) (3GO, plasticizer), 100 g of toluene, 40 g of ethanol, and 5.00 g of polyvinyl butyral (PVB) to a 300 ml Erlenmeyer flask and stir at 20 ° C. for 10 hours. And completely dissolved (solution C).
 上記n-ブチルホスホン酸銅塩トルエン分散液(2)3.131g(銅塩を0.583mmol含む)に、ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)30.1mgを加え、1時間20℃で撹拌した(D液)。 To 3.131 g of the above n-butylphosphonic acid copper salt toluene dispersion (2) (containing 0.583 mmol of copper salt) was added 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Corporation, trioleyl phosphate). The mixture was stirred at 20 ° C for 1 hour (D liquid).
 D液をC液に約1分で添加し、1時間超音波照射した。この分散液をテフロン(登録商標)製バットに広げ、12時間20℃で風乾した。さらに40℃で5時間、70℃で3.5時間真空乾燥を行って溶媒を完全に除去し、銅塩微粒子が分散したPVB樹脂(8)(樹脂組成物(8))を得た。 The D liquid was added to the C liquid in about 1 minute and irradiated with ultrasonic waves for 1 hour. This dispersion was spread on a Teflon (registered trademark) vat and air-dried at 20 ° C. for 12 hours. Furthermore, vacuum drying was performed at 40 ° C. for 5 hours and at 70 ° C. for 3.5 hours to completely remove the solvent, thereby obtaining a PVB resin (8) (resin composition (8)) in which copper salt fine particles were dispersed.
 (評価)
 <樹脂シート(15)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(8)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(15)を得た。
(Evaluation)
<Production of resin sheet (15)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (8) in which copper salt fine particles are dispersed. A sheet (15) was obtained.
 <樹脂シート(16)の作製>
 樹脂シート(1)を樹脂シート(15)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(16)を得た。
<Preparation of resin sheet (16)>
Except having replaced the resin sheet (1) with the resin sheet (15), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (16).
 <測定サンプル(15)の作製>
 樹脂シート(1)を樹脂シート(15)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(15)を得た。
<Preparation of measurement sample (15)>
A measurement sample (15) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (15).
 <測定サンプル(16)の作製>
 樹脂シート(2)を樹脂シート(16)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(16)を得た。
<Preparation of measurement sample (16)>
A measurement sample (16) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (16).
 <透明性の評価>
 前記測定サンプル(15)、測定サンプル(16)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (15) and the measurement sample (16) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(15)のヘイズは1.6%、測定サンプル(16)のヘイズは1.0%であった。
 <耐熱性の評価>
 前記測定サンプル(15)、測定サンプル(16)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (15) was 1.6%, and the haze of the measurement sample (16) was 1.0%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (15) and the measurement sample (16) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(15)のYIは、2.3であり、測定サンプル(16)のYIは、4.1であった。測定サンプル(15)と測定サンプル(16)のΔYIは1.8であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(16)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (15) was 2.3, and YI of the measurement sample (16) was 4.1. ΔYI of the measurement sample (15) and the measurement sample (16) was 1.8.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (16).
 400時間後のYIは9.7であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、5.6(9.7-4.1)であった。
 400時間後のTvisは65.1%であり、耐光性試験前の測定サンプル(16)のTvisは88.0%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、22.9%であった。
The YI after 400 hours was 9.7. If the difference from the YI before the light resistance test was ΔYI, the ΔYI was 5.6 (9.7-4.1).
The Tvis after 400 hours was 65.1%, and the Tvis of the measurement sample (16) before the light resistance test was 88.0%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 22 9%.
 〔比較例2〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0Vを用いなかったこと以外は、実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(c2)(樹脂組成物(c2))を得た。
[Comparative Example 2]
(Preparation of copper salt fine particle dispersed resin)
A PVB resin (c2) (resin composition (c2)) in which copper salt fine particles were dispersed was obtained in the same manner as in Example 8 except that Nikkor TOP-0V was not used.
 (評価)
 <樹脂シート(c3)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(c2)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(c3)を得た。
(Evaluation)
<Preparation of resin sheet (c3)>
Except that the PVB resin (1) in which the copper salt fine particles are dispersed is replaced with the PVB resin (c2) in which the copper salt fine particles are dispersed, the same procedure as in <Preparation of the resin sheet (1)> in Example 1 is carried out. A sheet (c3) was obtained.
 <樹脂シート(c4)の作製>
 樹脂シート(1)を樹脂シート(c3)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(c4)を得た。
<Production of resin sheet (c4)>
Except having replaced the resin sheet (1) with the resin sheet (c3), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (c4).
 <測定サンプル(c3)の作製>
 樹脂シート(1)を樹脂シート(c3)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(c3)を得た。
<Preparation of measurement sample (c3)>
A measurement sample (c3) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (c3).
 <測定サンプル(c4)の作製>
 樹脂シート(2)を樹脂シート(c4)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(c4)を得た。
<Preparation of measurement sample (c4)>
A measurement sample (c4) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (c4).
 <透明性の評価>
 前記測定サンプル(c3)、測定サンプル(c4)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (c3) and the measurement sample (c4) was measured by the same method as that described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(c3)のヘイズは1.1%、測定サンプル(c4)のヘイズは0.9%であった。
 <耐熱性の評価>
 前記測定サンプル(c3)、測定サンプル(c4)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (c3) was 1.1%, and the haze of the measurement sample (c4) was 0.9%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (c3) and the measurement sample (c4) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(c3)のYIは、1.9であり、測定サンプル(c4)のYIは、5.0であった。測定サンプル(c3)と測定サンプル(c4)のΔYIは3.1であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(c4)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (c3) was 1.9, and YI of the measurement sample (c4) was 5.0. ΔYI of the measurement sample (c3) and the measurement sample (c4) was 3.1.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (c4).
 400時間後のYIは44.1であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、39.1(44.1-5.0)であった。
 400時間後のTvisは24.2%であり、耐光性試験前の測定サンプル(c4)のTvisは87.5%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、63.3%であった。
YI after 400 hours was 44.1, and ΔYI was 39.1 (44.1-5.0), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 24.2%, and the Tvis of the measurement sample (c4) before the light resistance test was 87.5%. Therefore, when the difference in Tvis before and after the test is ΔTvis, ΔTvis is 63 3%.
 〔実施例9〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)30.1mgをトリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェート3.9mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(9)(樹脂組成物(9))を得た。
Example 9
(Preparation of copper salt fine particle dispersed resin)
Performed in the same manner as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 3.9 mg of tris (2,4-di-tert-butylphenyl) phosphate. A PVB resin (9) (resin composition (9)) in which copper salt fine particles were dispersed was obtained.
 (評価)
 <樹脂シート(17)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(9)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(17)を得た。
(Evaluation)
<Preparation of resin sheet (17)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (9) in which copper salt fine particles are dispersed. A sheet (17) was obtained.
 <樹脂シート(18)の作製>
 樹脂シート(1)を樹脂シート(17)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(18)を得た。
<Preparation of resin sheet (18)>
Except having replaced the resin sheet (1) with the resin sheet (17), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (18).
 <測定サンプル(17)の作製>
 樹脂シート(1)を樹脂シート(17)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(17)を得た。
<Preparation of measurement sample (17)>
A measurement sample (17) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (17).
 <測定サンプル(18)の作製>
 樹脂シート(2)を樹脂シート(18)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(18)を得た。
<Preparation of measurement sample (18)>
A measurement sample (18) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (18).
 <透明性の評価>
 前記測定サンプル(17)、測定サンプル(18)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (17) and the measurement sample (18) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(17)のヘイズは1.5%、測定サンプル(18)のヘイズは1.1%であった。
 <耐熱性の評価>
 前記測定サンプル(17)、測定サンプル(18)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (17) was 1.5%, and the haze of the measurement sample (18) was 1.1%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (17) and the measurement sample (18) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(17)のYIは、2.2であり、測定サンプル(18)のYIは、4.1であった。測定サンプル(17)と測定サンプル(18)のΔYIは1.9であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(18)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (17) was 2.2, and YI of the measurement sample (18) was 4.1. ΔYI of the measurement sample (17) and the measurement sample (18) was 1.9.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (18).
 400時間後のYIは12.9であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、8.8(12.9-4.1)であった。
 400時間後のTvisは41.7%であり、耐光性試験前の測定サンプル(18)のTvisは87.3%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、45.6%であった。
YI after 400 hours was 12.9, and ΔYI was 8.8 (12.9-4.1), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 41.7%, and the Tvis of the measurement sample (18) before the light resistance test was 87.3%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 45 It was 6%.
 〔実施例10〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)30.1mgをトリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェート11.8mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(10)(樹脂組成物(10))を得た。
Example 10
(Preparation of copper salt fine particle dispersed resin)
Performed in the same manner as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 11.8 mg of tris (2,4-di-tert-butylphenyl) phosphate. A PVB resin (10) (resin composition (10)) in which copper salt fine particles were dispersed was obtained.
 (評価)
 <樹脂シート(19)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(10)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(19)を得た。
(Evaluation)
<Preparation of resin sheet (19)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (10) in which copper salt fine particles are dispersed. A sheet (19) was obtained.
 <樹脂シート(20)の作製>
 樹脂シート(1)を樹脂シート(19)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(20)を得た。
<Preparation of resin sheet (20)>
Except having replaced the resin sheet (1) with the resin sheet (19), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (20).
 <測定サンプル(19)の作製>
 樹脂シート(1)を樹脂シート(19)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(19)を得た。
<Preparation of measurement sample (19)>
A measurement sample (19) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (19).
 <測定サンプル(20)の作製>
 樹脂シート(2)を樹脂シート(20)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(20)を得た。
<Preparation of measurement sample (20)>
A measurement sample (20) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (20).
 <透明性の評価>
 前記測定サンプル(19)、測定サンプル(20)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (19) and the measurement sample (20) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(19)のヘイズは1.9%、測定サンプル(20)のヘイズは1.8%であった。
 <耐熱性の評価>
 前記測定サンプル(19)、測定サンプル(20)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (19) was 1.9%, and the haze of the measurement sample (20) was 1.8%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (19) and the measurement sample (20) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(19)のYIは、2.4であり、測定サンプル(20)のYIは、4.7であった。測定サンプル(19)と測定サンプル(20)のΔYIは2.3であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(20)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (19) was 2.4, and YI of the measurement sample (20) was 4.7. ΔYI of the measurement sample (19) and the measurement sample (20) was 2.3.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (20).
 400時間後のYIは19.3であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、14.6(19.3-4.7)であった。
 400時間後のTvisは34.8%であり、耐光性試験前の測定サンプル(20)のTvisは88.3%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、53.5%であった。
YI after 400 hours was 19.3, and ΔYI was 14.6 (19.3-4.7) where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 34.8%, and the Tvis of the measurement sample (20) before the light resistance test was 88.3%. Therefore, if the difference in Tvis before and after the test is ΔTvis, ΔTvis is 53 .5%.
 〔実施例11〕
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)30.1mgをトリス(2,4-ジ-ターシャリーブチルフェニル)ホスフェート23.5mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(11)(樹脂組成物(11))を得た。
Example 11
Performed in the same manner as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 23.5 mg of tris (2,4-di-tert-butylphenyl) phosphate. A PVB resin (11) (resin composition (11)) in which copper salt fine particles were dispersed was obtained.
 (評価)
 <樹脂シート(21)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(11)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(21)を得た。
(Evaluation)
<Production of resin sheet (21)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (11) in which copper salt fine particles are dispersed. A sheet (21) was obtained.
 <樹脂シート(22)の作製>
 樹脂シート(1)を樹脂シート(21)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(22)を得た。
<Production of resin sheet (22)>
Except having replaced the resin sheet (1) with the resin sheet (21), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (22).
 <測定サンプル(21)の作製>
 樹脂シート(1)を樹脂シート(21)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(21)を得た。
<Preparation of measurement sample (21)>
A measurement sample (21) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (21).
 <測定サンプル(22)の作製>
 樹脂シート(2)を樹脂シート(22)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(22)を得た。
<Preparation of measurement sample (22)>
A measurement sample (22) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (22).
 <透明性の評価>
 前記測定サンプル(21)、測定サンプル(22)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (21) and the measurement sample (22) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(21)のヘイズは1.6%、測定サンプル(22)のヘイズは1.2%であった。
 <耐熱性の評価>
 前記測定サンプル(21)、測定サンプル(22)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (21) was 1.6%, and the haze of the measurement sample (22) was 1.2%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (21) and the measurement sample (22) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(21)のYIは、2.3であり、測定サンプル(22)のYIは、4.2であった。測定サンプル(21)と測定サンプル(22)のΔYIは1.9であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(22)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (21) was 2.3, and YI of the measurement sample (22) was 4.2. ΔYI of the measurement sample (21) and the measurement sample (22) was 1.9.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (22).
 400時間後のYIは14.1であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、9.9(14.1-4.2)であった。
 400時間後のTvisは39.9%であり、耐光性試験前の測定サンプル(22)のTvisは87.8%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、47.9%であった。
YI after 400 hours was 14.1, and ΔYI was 9.9 (14.1-4.2), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 39.9%, and the Tvis of the measurement sample (22) before the light resistance test was 87.8%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 47 9%.
 〔実施例12〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)の使用量を30.1mgから5.0mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(12)(樹脂組成物(12))を得た。
Example 12
(Preparation of copper salt fine particle dispersed resin)
A PVB resin in which copper salt fine particles are dispersed is carried out in the same manner as in Example 8 except that the amount of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) is changed from 30.1 mg to 5.0 mg. 12) (Resin composition (12)) was obtained.
 (評価)
 <樹脂シート(23)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(12)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(23)を得た。
(Evaluation)
<Preparation of resin sheet (23)>
Except that the PVB resin (1) in which the copper salt fine particles are dispersed is replaced with the PVB resin (12) in which the copper salt fine particles are dispersed, the same procedure as in <Preparation of resin sheet (1)> in Example 1 is carried out. A sheet (23) was obtained.
 <樹脂シート(24)の作製>
 樹脂シート(1)を樹脂シート(23)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(24)を得た。
<Production of resin sheet (24)>
Except having replaced the resin sheet (1) with the resin sheet (23), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (24).
 <測定サンプル(23)の作製>
 樹脂シート(1)を樹脂シート(23)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(23)を得た。
<Preparation of measurement sample (23)>
A measurement sample (23) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (23).
 <測定サンプル(24)の作製>
 樹脂シート(2)を樹脂シート(24)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(24)を得た。
<Preparation of measurement sample (24)>
A measurement sample (24) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (24).
 <透明性の評価>
 前記測定サンプル(23)、測定サンプル(24)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (23) and the measurement sample (24) was measured by the same method as that described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(23)のヘイズは1.5%、測定サンプル(24)のヘイズは1.0%であった。
 <耐熱性の評価>
 前記測定サンプル(23)、測定サンプル(24)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (23) was 1.5%, and the haze of the measurement sample (24) was 1.0%.
<Evaluation of heat resistance>
The spectra of the measurement sample (23) and the measurement sample (24) were measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(23)のYIは、2.3であり、測定サンプル(24)のYIは、4.7であった。測定サンプル(23)と測定サンプル(24)のΔYIは2.4であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(24)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (23) was 2.3, and YI of the measurement sample (24) was 4.7. ΔYI of the measurement sample (23) and the measurement sample (24) was 2.4.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (24).
 400時間後のYIは31.3であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、26.6(31.3-4.7)であった。
 400時間後のTvisは32.5%であり、耐光性試験前の測定サンプル(24)のTvisは87.4%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、54.9%であった。
YI after 400 hours was 31.3, and ΔYI was 26.6 (31.3-4.7), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 32.5%, and the Tvis of the measurement sample (24) before the light resistance test was 87.4%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 54 9%.
 〔実施例13〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)の使用量を30.1mgから15.1mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(13)(樹脂組成物(13))を得た。
Example 13
(Preparation of copper salt fine particle dispersed resin)
A PVB resin in which copper salt fine particles were dispersed was carried out in the same manner as in Example 8 except that the amount of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was changed from 30.1 mg to 15.1 mg. 13) (Resin composition (13)) was obtained.
 (評価)
 <樹脂シート(25)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(13)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(25)を得た。
(Evaluation)
<Production of resin sheet (25)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (13) in which copper salt fine particles are dispersed. A sheet (25) was obtained.
 <樹脂シート(26)の作製>
 樹脂シート(1)を樹脂シート(25)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(26)を得た。
<Production of resin sheet (26)>
Except having replaced the resin sheet (1) with the resin sheet (25), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (26).
 <測定サンプル(25)の作製>
 樹脂シート(1)を樹脂シート(25)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(25)を得た。
<Preparation of measurement sample (25)>
A measurement sample (25) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (25).
 <測定サンプル(26)の作製>
 樹脂シート(2)を樹脂シート(26)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(26)を得た。
<Preparation of measurement sample (26)>
A measurement sample (26) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (26).
 <透明性の評価>
 前記測定サンプル(25)、測定サンプル(26)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (25) and the measurement sample (26) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(25)のヘイズは1.7%、測定サンプル(26)のヘイズは1.2%であった。
 <耐熱性の評価>
 前記測定サンプル(25)、測定サンプル(26)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (25) was 1.7%, and the haze of the measurement sample (26) was 1.2%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (25) and the measurement sample (26) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(25)のYIは、2.7であり、測定サンプル(26)のYIは、5.7であった。測定サンプル(25)と測定サンプル(26)のΔYIは3.0であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(26)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (25) was 2.7, and YI of the measurement sample (26) was 5.7. ΔYI of the measurement sample (25) and the measurement sample (26) was 3.0.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (26).
 400時間後のYIは30.4であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、24.7(30.4-5.7)であった。
 400時間後のTvisは35.1%であり、耐光性試験前の測定サンプル(26)のTvisは86.7%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、51.6%であった。
YI after 400 hours was 30.4, and ΔYI was 24.7 (30.4−5.7), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 35.1%, and the Tvis of the measurement sample (26) before the light resistance test was 86.7%. Therefore, if the difference in Tvis before and after the test is ΔTvis, ΔTvis is 51 It was 6%.
 〔実施例14〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)30.1mgをトリブチルホスフェート4.7mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(14)(樹脂組成物(14))を得た。
Example 14
(Preparation of copper salt fine particle dispersed resin)
PVB resin in which copper salt fine particles are dispersed (14) (Resin composition (14)) was obtained.
 (評価)
 <樹脂シート(27)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(14)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(27)を得た。
(Evaluation)
<Preparation of resin sheet (27)>
Except that the PVB resin (1) in which the copper salt fine particles are dispersed is replaced with the PVB resin (14) in which the copper salt fine particles are dispersed, the same procedure as in <Preparation of resin sheet (1)> in Example 1 is performed. A sheet (27) was obtained.
 <樹脂シート(28)の作製>
 樹脂シート(1)を樹脂シート(27)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(28)を得た。
<Production of resin sheet (28)>
Except having replaced the resin sheet (1) with the resin sheet (27), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (28).
 <測定サンプル(27)の作製>
 樹脂シート(1)を樹脂シート(27)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(27)を得た。
<Preparation of measurement sample (27)>
A measurement sample (27) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (27).
 <測定サンプル(28)の作製>
 樹脂シート(2)を樹脂シート(28)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(28)を得た。
<Preparation of measurement sample (28)>
A measurement sample (28) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (28).
 <透明性の評価>
 前記測定サンプル(27)、測定サンプル(28)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (27) and the measurement sample (28) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(27)のヘイズは2.2%、測定サンプル(28)のヘイズは1.4%であった。
 <耐熱性の評価>
 前記測定サンプル(27)、測定サンプル(28)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (27) was 2.2%, and the haze of the measurement sample (28) was 1.4%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (27) and the measurement sample (28) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(27)のYIは、3.0であり、測定サンプル(28)のYIは、4.5であった。測定サンプル(27)と測定サンプル(28)のΔYIは1.5であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(28)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (27) was 3.0, and YI of the measurement sample (28) was 4.5. ΔYI of the measurement sample (27) and the measurement sample (28) was 1.5.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (28).
 400時間後のYIは14.8であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、10.3(14.8-4.5)であった。
 400時間後のTvisは45.6%であり、耐光性試験前の測定サンプル(28)のTvisは88.1%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、42.5%であった。
YI after 400 hours was 14.8, and ΔYI was 10.3 (14.8-4.5), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 45.6%, and the Tvis of the measurement sample (28) before the light resistance test was 88.1%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 42 .5%.
 〔実施例15〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)30.1mgをトリス(2-エチルヘキシル)ホスフェート7.6mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(15)(樹脂組成物(15))を得た。
Example 15
(Preparation of copper salt fine particle dispersed resin)
The same procedure as in Example 8 was conducted except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 7.6 mg of tris (2-ethylhexyl) phosphate, and copper salt fine particles were dispersed. PVB resin (15) (resin composition (15)) was obtained.
 (評価)
 <樹脂シート(29)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(15)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(29)を得た。
(Evaluation)
<Production of resin sheet (29)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (15) in which copper salt fine particles are dispersed. A sheet (29) was obtained.
 <樹脂シート(30)の作製>
 樹脂シート(1)を樹脂シート(29)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(30)を得た。
<Preparation of resin sheet (30)>
Except having replaced the resin sheet (1) with the resin sheet (29), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (30).
 <測定サンプル(29)の作製>
 樹脂シート(1)を樹脂シート(29)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(29)を得た。
<Preparation of measurement sample (29)>
A measurement sample (29) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (29).
 <測定サンプル(30)の作製>
 樹脂シート(2)を樹脂シート(30)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(30)を得た。
<Preparation of measurement sample (30)>
A measurement sample (30) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (30).
 <透明性の評価>
 前記測定サンプル(29)、測定サンプル(30)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (29) and the measurement sample (30) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(29)のヘイズは2.3%、測定サンプル(30)のヘイズは1.5%であった。
 <耐熱性の評価>
 前記測定サンプル(29)、測定サンプル(30)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (29) was 2.3%, and the haze of the measurement sample (30) was 1.5%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (29) and the measurement sample (30) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(29)のYIは、3.0であり、測定サンプル(30)のYIは、4.5であった。測定サンプル(29)と測定サンプル(30)のΔYIは1.5であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(30)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (29) was 3.0, and YI of the measurement sample (30) was 4.5. ΔYI of the measurement sample (29) and the measurement sample (30) was 1.5.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (30).
 400時間後のYIは15.7であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、11.2(15.7-4.5)であった。
 400時間後のTvisは42.3%であり、耐光性試験前の測定サンプル(30)のTvisは88.1%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、45.8%であった。
YI after 400 hours was 15.7, and ΔYI was 11.2 (15.7-4.5), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 42.3%, and the Tvis of the measurement sample (30) before the light resistance test was 88.1%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 45 8%.
 〔実施例16〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)30.1mgをトリフェニルホスフェート5.7mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(16)(樹脂組成物(16))を得た。
Example 16
(Preparation of copper salt fine particle dispersed resin)
PVB resin (16) in which copper salt fine particles were dispersed was carried out in the same manner as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 5.7 mg of triphenyl phosphate. ) (Resin composition (16)) was obtained.
 (評価)
 <樹脂シート(31)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(16)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(31)を得た。
(Evaluation)
<Preparation of resin sheet (31)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1 except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (16) in which copper salt fine particles are dispersed. A sheet (31) was obtained.
 <樹脂シート(32)の作製>
 樹脂シート(1)を樹脂シート(31)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(32)を得た。
<Production of resin sheet (32)>
Except having replaced the resin sheet (1) with the resin sheet (31), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (32).
 <測定サンプル(31)の作製>
 樹脂シート(1)を樹脂シート(31)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(31)を得た。
<Preparation of measurement sample (31)>
A measurement sample (31) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (31).
 <測定サンプル(32)の作製>
 樹脂シート(2)を樹脂シート(32)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(32)を得た。
<Preparation of measurement sample (32)>
A measurement sample (32) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (32).
 <透明性の評価>
 前記測定サンプル(31)、測定サンプル(32)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (31) and the measurement sample (32) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(31)のヘイズは3.5%、測定サンプル(32)のヘイズは2.0%であった。
 <耐熱性の評価>
 前記測定サンプル(31)、測定サンプル(32)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (31) was 3.5%, and the haze of the measurement sample (32) was 2.0%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (31) and the measurement sample (32) was measured by the same method as that described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(31)のYIは、3.4であり、測定サンプル(32)のYIは、5.1であった。測定サンプル(31)と測定サンプル(32)のΔYIは1.7であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(32)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (31) was 3.4, and YI of the measurement sample (32) was 5.1. ΔYI of the measurement sample (31) and the measurement sample (32) was 1.7.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (32).
 400時間後のYIは26.5であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、21.4(26.5-5.1)であった。
 400時間後のTvisは32.8%であり、耐光性試験前の測定サンプル(32)のTvisは87.6%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、54.8%であった。
YI after 400 hours was 26.5, and ΔYI was 21.4 (26.5-5.1) where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 32.8%, and the Tvis of the measurement sample (32) before the light resistance test was 87.6%. Therefore, when the difference in Tvis before and after the test is ΔTvis, ΔTvis is 54 8%.
 〔実施例17〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)30.1mgをトリ‐o‐クレシルホスフェート6.5mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(17)(樹脂組成物(17))を得た。
Example 17
(Preparation of copper salt fine particle dispersed resin)
The same procedure was performed as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 6.5 mg of tri-o-cresyl phosphate, and copper salt fine particles were dispersed. PVB resin (17) (resin composition (17)) was obtained.
 (評価)
 <樹脂シート(33)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(17)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(33)を得た。
(Evaluation)
<Production of resin sheet (33)>
Resin is carried out in the same manner as in <Preparation of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (17) in which copper salt fine particles are dispersed. A sheet (33) was obtained.
 <樹脂シート(34)の作製>
 樹脂シート(1)を樹脂シート(33)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(34)を得た。
<Preparation of resin sheet (34)>
Except having replaced the resin sheet (1) with the resin sheet (33), it carried out similarly to the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (34).
 <測定サンプル(33)の作製>
 樹脂シート(1)を樹脂シート(33)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(33)を得た。
<Preparation of measurement sample (33)>
A measurement sample (33) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (33).
 <測定サンプル(34)の作製>
 樹脂シート(2)を樹脂シート(34)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(34)を得た。
<Preparation of measurement sample (34)>
A measurement sample (34) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (34).
 <透明性の評価>
 前記測定サンプル(33)、測定サンプル(34)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (33) and the measurement sample (34) was measured by the same method as described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(33)のヘイズは3.1%、測定サンプル(34)のヘイズは2.1%であった。
 <耐熱性の評価>
 前記測定サンプル(33)、測定サンプル(34)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (33) was 3.1%, and the haze of the measurement sample (34) was 2.1%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (33) and the measurement sample (34) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(33)のYIは、2.8であり、測定サンプル(34)のYIは、4.9であった。測定サンプル(33)と測定サンプル(34)のΔYIは2.1であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(34)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (33) was 2.8, and YI of the measurement sample (34) was 4.9. ΔYI of the measurement sample (33) and the measurement sample (34) was 2.1.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (34).
 400時間後のYIは17.3であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、12.4(17.3-4.9)であった。
 400時間後のTvisは42.1%であり、耐光性試験前の測定サンプル(34)のTvisは87.5%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、45.4%であった。
YI after 400 hours was 17.3, and ΔYI was 12.4 (17.3-4.9), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 42.1%, and the Tvis of the measurement sample (34) before the light resistance test was 87.5%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 45 4%.
 〔実施例18〕
 (銅塩微粒子分散樹脂の調製)
 ニッコールTOP-0V(日光ケミカルズ(株)製、リン酸トリオレイル)30.1mgをトリ‐p‐クレシルホスフェート6.4mgに代えた以外は実施例8と同様に行い、銅塩微粒子が分散したPVB樹脂(18)(樹脂組成物(18))を得た。
Example 18
(Preparation of copper salt fine particle dispersed resin)
The same procedure was carried out as in Example 8 except that 30.1 mg of Nikkor TOP-0V (manufactured by Nikko Chemicals Co., Ltd., trioleyl phosphate) was replaced with 6.4 mg of tri-p-cresyl phosphate. PVB resin (18) (resin composition (18)) was obtained.
 (評価)
 <樹脂シート(35)の作製>
 銅塩微粒子が分散したPVB樹脂(1)を、銅塩微粒子が分散したPVB樹脂(18)に代えた以外は、実施例1の<樹脂シート(1)の作製>項と同様に行い、樹脂シート(35)を得た。
(Evaluation)
<Production of resin sheet (35)>
Resin is carried out in the same manner as in <Production of resin sheet (1)> in Example 1, except that PVB resin (1) in which copper salt fine particles are dispersed is replaced with PVB resin (18) in which copper salt fine particles are dispersed. A sheet (35) was obtained.
 <樹脂シート(36)の作製>
 樹脂シート(1)を樹脂シート(35)に代えた以外は、実施例1の<樹脂シート(2)の作製>項と同様に行い、樹脂シート(36)を得た。
<Production of resin sheet (36)>
Except having replaced the resin sheet (1) with the resin sheet (35), it carried out like the <Preparation of the resin sheet (2)> term of Example 1, and obtained the resin sheet (36).
 <測定サンプル(35)の作製>
 樹脂シート(1)を樹脂シート(35)に代えた以外は、実施例1の<測定サンプル(1)の作製>の項と同様に行い、測定サンプル(35)を得た。
<Preparation of measurement sample (35)>
A measurement sample (35) was obtained in the same manner as in <Production of measurement sample (1)> in Example 1 except that the resin sheet (1) was replaced with a resin sheet (35).
 <測定サンプル(36)の作製>
 樹脂シート(2)を樹脂シート(36)に代えた以外は、実施例1の<測定サンプル(2)の作製>の項と同様に行い、測定サンプル(36)を得た。
<Preparation of measurement sample (36)>
A measurement sample (36) was obtained in the same manner as in <Production of measurement sample (2)> in Example 1 except that the resin sheet (2) was replaced with a resin sheet (36).
 <透明性の評価>
 前記測定サンプル(35)、測定サンプル(36)のヘイズを実施例1の<透明性の評価>の項に示した方法と同様の方法で測定した。
<Evaluation of transparency>
The haze of the measurement sample (35) and the measurement sample (36) was measured by the same method as that described in the section <Evaluation of transparency> in Example 1.
 測定サンプル(35)のヘイズは3.0%、測定サンプル(36)のヘイズは1.5%であった。
 <耐熱性の評価>
 前記測定サンプル(35)、測定サンプル(36)の分光を実施例1の<耐熱性の評価>の項に示した方法と同様の方法で測定した。
The haze of the measurement sample (35) was 3.0%, and the haze of the measurement sample (36) was 1.5%.
<Evaluation of heat resistance>
Spectroscopy of the measurement sample (35) and the measurement sample (36) was measured by the same method as described in the section <Evaluation of heat resistance> in Example 1.
 測定サンプル(35)のYIは、2.7であり、測定サンプル(36)のYIは、4.2であった。測定サンプル(35)と測定サンプル(36)のΔYIは1.5であった。
 <耐光性の評価>
 測定サンプル(2)を測定サンプル(36)に代えた以外は実施例1の<耐光性の評価>の項と同様に行い、YIおよびTvisを求めた。
YI of the measurement sample (35) was 2.7, and YI of the measurement sample (36) was 4.2. ΔYI of the measurement sample (35) and the measurement sample (36) was 1.5.
<Evaluation of light resistance>
YI and Tvis were determined in the same manner as in the section <Evaluation of light resistance> in Example 1 except that the measurement sample (2) was replaced with the measurement sample (36).
 400時間後のYIは15.8であり、耐光性試験前のYIとの差をΔYIとすると、ΔYIは、11.6(15.8-4.2)であった。
 400時間後のTvisは45.3%であり、耐光性試験前の測定サンプル(36)のTvisは88.3%であったので、試験前後のTvisの差をΔTvisとすると、ΔTvisは、43.0%であった。
YI after 400 hours was 15.8, and ΔYI was 11.6 (15.8-4.2), where ΔYI was the difference from YI before the light resistance test.
The Tvis after 400 hours was 45.3%, and the Tvis of the measurement sample (36) before the light resistance test was 88.3%. Therefore, assuming that the difference in Tvis before and after the test is ΔTvis, ΔTvis is 43 0.0%.

Claims (10)

  1.  近赤外線吸収剤と、リン酸トリエステルと、樹脂とからなる樹脂組成物であり、
     前記近赤外線吸収剤が、下記一般式(1)で表わされるホスホン酸銅塩からなる微粒子であり、
     前記リン酸トリエステルが、下記一般式(2)で表されるリン酸トリエステルであることを特徴とする樹脂組成物。
    Figure JPOXMLDOC01-appb-C000001
    [一般式(1)中、R1は、-CH2CH2-R11で表される1価の基であり、R11は水素原子、炭素数1~20のアルキル基、または炭素数1~20のフッ素化アルキル基を示す。]
    Figure JPOXMLDOC01-appb-C000002
    [一般式(2)中、Rはそれぞれ独立に、炭素数1~20のアルキル基、炭素数2~35のアルケニル基、フェニル基、または置換基を有するフェニル基であり、前記置換基の炭素数が15以下である。]
    A resin composition comprising a near infrared absorber, a phosphoric acid triester, and a resin;
    The near-infrared absorber is fine particles composed of a phosphonic acid copper salt represented by the following general formula (1):
    The phosphoric acid triester is a phosphoric acid triester represented by the following general formula (2).
    Figure JPOXMLDOC01-appb-C000001
    [In General Formula (1), R 1 is a monovalent group represented by —CH 2 CH 2 —R 11 , and R 11 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, or 1 carbon atom. Represents -20 fluorinated alkyl groups. ]
    Figure JPOXMLDOC01-appb-C000002
    [In the general formula (2), each R is independently an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 35 carbon atoms, a phenyl group, or a phenyl group having a substituent, The number is 15 or less. ]
  2.  前記一般式(2)において、Rがそれぞれ独立に、置換基を有するフェニル基である、請求項1に記載の樹脂組成物。 The resin composition according to claim 1, wherein, in the general formula (2), each R is independently a phenyl group having a substituent.
  3.  前記樹脂組成物が、さらにリン系酸化防止剤を含有する請求項1または2に記載の樹脂組成物。 The resin composition according to claim 1 or 2, wherein the resin composition further contains a phosphorus-based antioxidant.
  4.  前記樹脂が、ポリビニルアセタール樹脂、エチレン‐酢酸ビニル共重合体、(メタ)アクリル酸樹脂、ポリエステル樹脂、ポリウレタン樹脂、塩化ビニル樹脂、ポリオレフィン樹脂、ポリカーボネート樹脂、およびノルボルネン樹脂から選択される少なくとも1種の樹脂である請求項1~3のいずれか一項に記載の樹脂組成物。 The resin is at least one selected from polyvinyl acetal resin, ethylene-vinyl acetate copolymer, (meth) acrylic acid resin, polyester resin, polyurethane resin, vinyl chloride resin, polyolefin resin, polycarbonate resin, and norbornene resin. The resin composition according to any one of claims 1 to 3, which is a resin.
  5.  前記樹脂が、ポリビニルブチラール樹脂、またはエチレン‐酢酸ビニル共重合体である請求項1~3のいずれか一項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 3, wherein the resin is a polyvinyl butyral resin or an ethylene-vinyl acetate copolymer.
  6.  前記樹脂100質量部あたり、近赤外線吸収剤を0.05~50質量部含有する請求項1~5のいずれか一項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 5, comprising 0.05 to 50 parts by mass of a near infrared absorber per 100 parts by mass of the resin.
  7.  前記樹脂100質量部あたり、リン酸トリエステルを0.05~5.0質量部含有する請求項1~6のいずれか一項に記載の樹脂組成物。 The resin composition according to any one of claims 1 to 6, which contains 0.05 to 5.0 parts by mass of a phosphoric acid triester per 100 parts by mass of the resin.
  8.  前記樹脂100質量部あたり、リン系酸化防止剤を0.05~5.0質量部含有する請求項3に記載の樹脂組成物。 The resin composition according to claim 3, comprising 0.05 to 5.0 parts by mass of a phosphorus-based antioxidant per 100 parts by mass of the resin.
  9.  前記請求項1~8のいずれか一項に記載の樹脂組成物から形成される合わせガラス用中間膜。 An interlayer film for laminated glass formed from the resin composition according to any one of claims 1 to 8.
  10.  前記請求項9に記載の合わせガラス用中間膜を有する合わせガラス。 Laminated glass having the interlayer film for laminated glass according to claim 9.
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