JPWO2014080502A1 - Production data creation system and production data creation method - Google Patents

Abstract

It is an object of the present invention to provide a production data creation system and a production data creation method capable of creating production data in consideration of the self-alignment effect. The regular mounting position of the electronic component p on the board B is defined as a regular position w1. The deviation amount of the actual mounting position of the electronic component p with respect to the normal position w1 before reflow is defined as a deviation amount C3 before reflow. A deviation amount of the actual mounting position of the electronic component p with respect to the normal position w1 after the reflow is defined as a deviation amount C5 after the reflow. The difference between the pre-reflow shift amount C3 and the post-reflow shift amount C5 is defined as a self-alignment amount. The production data creation system 1 is scheduled to be mounted on a substrate B to be produced in the future based on the storage unit 201 that accumulates self-alignment data including the self-alignment amount and self-alignment conditions during the production of the substrate B. A calculation unit 200 that predicts a self-alignment amount F1 and creates production data for the substrate B.

Description

  The present invention relates to a production data creation system and a production data creation method used when creating production data for a substrate.

  When the solder is printed out of alignment with the land (pad) of the board, a phenomenon in which the electronic component is drawn to the center of the land due to the surface tension of the solder during reflow, that is, a self-alignment phenomenon occurs.

  That is, the solder melted and liquefied during reflow flows toward the center of the land. For this reason, the electronic component mounted on the solder also flows together with the solder. The amount of movement of the electronic component due to the self-alignment phenomenon increases as the amount of printing misalignment of the solder with respect to the land increases.

  As described above, when the solder printing amount with respect to the land is large, the electronic component is likely to approach the regular position (the regular mounting position of the electronic component with respect to the substrate) by reflow. That is, a self-alignment effect can be expected. On the other hand, when the amount of printing misalignment of the solder with respect to the land is small, it is difficult for the electronic component to approach the normal position by reflow. That is, the self-alignment effect cannot be expected.

  For this reason, conventionally, when the amount of printing misalignment of the solder with respect to the land is small, the self-alignment effect cannot be expected. Therefore, the electronic component is mounted based on the land. On the other hand, when the amount of printing deviation of the solder with respect to the land is large, the electronic component is mounted based on the solder instead of the land in anticipation of the self-alignment effect.

JP 2009-231782 A

  However, the magnitude of the self-alignment effect does not depend only on the amount of solder printing deviation relative to the land. For example, the size of the self-alignment effect depends on various factors such as the size of electronic components, land size, solder characteristics, solder thickness during printing, temperature during reflow, furnace atmosphere during reflow, etc. . For this reason, it is difficult to predict the self-alignment effect for any electronic component before board production.

  Conventionally, the prediction of the self-alignment effect has to depend on the skill of the operator. That is, the worker has predicted the self-alignment effect for each electronic component in consideration of various factors. And based on the said prediction, the pass / fail judgment threshold value, such as a printing inspection machine and a pre-reflow board appearance inspection machine, was set. In addition, based on the prediction, the mounting standard (land standard, solder standard) of the electronic component is determined.

  In this regard, Patent Document 1 discloses a method for evaluating a chip-shaped electronic component. According to the evaluation method described in this document, the wettability of solder can be evaluated by intentionally generating a self-alignment phenomenon. This document does not describe the prediction of the self-alignment effect.

  Therefore, an object of the present invention is to provide a production data creation system and a production data creation method capable of creating production data in consideration of the self-alignment effect for electronic parts.

  (1) In order to solve the above-described problem, the production data creation system of the present invention is configured such that the normal mounting position of the electronic component on the board is the normal position, and the electronic with respect to the normal position before the reflow in the production line of the board. The amount of deviation of the actual mounting position of the component is the amount of deviation before reflow, the amount of deviation of the actual mounting position of the electronic component with respect to the normal position after reflow in the production line is the amount of deviation after reflow, and the amount of deviation before reflow. The difference between the amount and the amount of deviation after reflow is defined as a self-alignment amount, and the self-alignment amount and a self-alignment condition that is a condition that affects the self-alignment amount for each substrate during the production of the substrate, , And a storage unit for storing self-alignment data, and mounting on the substrate to be produced next time based on the self-alignment data To the constant electronic components, to predict the self-alignment amount, characterized in that it comprises an arithmetic unit for generating a production data of the substrate.

  The storage unit of the production data creation system of the present invention accumulates self-alignment data for each substrate during substrate production. That is, self-alignment data including a self-alignment amount of an arbitrary electronic component and a self-alignment condition that is a condition affecting the self-alignment amount is accumulated in the storage unit.

  In addition, the calculation unit of the production data creation system of the present invention predicts the self-alignment amount of the electronic component of the board that is the next production target based on the self-alignment data accumulated in the storage unit. Then, in consideration of the amount of self-alignment, production data for the substrate to be produced next time is created.

  According to the production data creation system of the present invention, the self-alignment effect can be predicted based on the self-alignment data. For this reason, the quality of the board | substrate produced can be stabilized irrespective of the skill level of an operator's skill. In addition, the quality of the substrate can be improved.

  (2) Preferably, in the configuration of the above (1), the calculation unit determines pass / fail of an inspection machine arranged in the production line of the substrate that is the next production target based on the self-alignment data. It is better to set the threshold value.

  According to this configuration, the arithmetic unit can set a pass / fail judgment threshold value related to, for example, the amount of solder printing deviation with respect to the land in the printing inspection machine. Further, for example, when the mounting reference of the electronic component is the land reference, it is possible to set the mounting displacement amount of the electronic component with respect to the normal position in the pre-reflow board appearance inspection machine. When the electronic component mounting standard is the solder standard, it is possible to set the electronic component mounting misalignment amount with respect to the normal solder position (the normal electronic component mounting position with respect to the solder) in the pre-reflow board appearance inspection machine.

  (3) Preferably, in the configuration of the above (1) or (2), when the self-alignment amount is equal to or less than a predetermined mounting reference threshold value, the computing unit mounts the electronic component on the substrate. If the self-alignment amount exceeds the mounting reference threshold value, it is determined to mount the electronic component on the board based on the solder printed on the board. It is better to have a configuration.

  According to this configuration, when the self-alignment amount is small, the mounting reference of the electronic component can be set as the land reference. Moreover, when the amount of self-alignment is large, the mounting reference of the electronic component can be set as the solder reference.

  (4) In order to solve the above-described problem, the production data creation method of the present invention is configured such that the normal mounting position of the electronic component with respect to the board is the normal position, and the electronic with respect to the normal position before the reflow in the board production line. The amount of deviation of the actual mounting position of the component is the amount of deviation before reflow, the amount of deviation of the actual mounting position of the electronic component with respect to the normal position after reflow in the production line is the amount of deviation after reflow, and the amount of deviation before reflow. The difference between the amount and the amount of deviation after reflow is defined as a self-alignment amount, and the self-alignment amount and a self-alignment condition that is a condition that affects the self-alignment amount for each substrate during the production of the substrate, , And a data storage process for storing self-alignment data, and, based on the self-alignment data, on the substrate that is the next production target Relative electronic parts wearing schedule to predict the self-alignment amount, and having a production data creating step of creating production data of the substrate, the. Similar to the configuration (1) above, according to the production data creation method of the present invention, the self-alignment effect can be predicted based on the self-alignment data.

  (5) Preferably, in the configuration of (4) above, in the production data creation step, based on the self-alignment data, an inspection machine arranged on the production line of the substrate that is the next production target, It is better to set a pass / fail judgment threshold. Similar to the configuration (2), according to this configuration, for example, a pass / fail judgment threshold value in a printing inspection machine or a pre-reflow board appearance inspection machine can be set.

  (6) Preferably, in the configuration of (4) or (5), when the self-alignment amount is equal to or less than a predetermined mounting reference threshold value in the production data creation step, mounting of the electronic component on the substrate is performed. If the land of the substrate is determined as a reference, and the self-alignment amount exceeds the mounting reference threshold value, the mounting of the electronic component on the substrate is performed based on the solder printed on the substrate. It is better to have a configuration to determine. Similar to the configuration (3), according to the present configuration, the mounting standard of the electronic component can be set to the solder standard or the land standard depending on the amount of self-alignment.

  According to the present invention, it is possible to provide a production data creation system and a production data creation method capable of creating production data in consideration of the self-alignment effect for electronic components.

FIG. 1 is a schematic diagram of a production data creation system which is an embodiment of a production data creation system of the present invention. FIG. 2 is a flowchart of a production data creation method which is an embodiment of the production data creation method of the present invention. FIG. 3 is a schematic diagram of a data accumulation process of the production data creation method. FIG. 4 is a schematic diagram of a simulation of a production data creation process of the production data creation method.

1: Production data creation system.
2: host computer, 20: control device, 200: arithmetic unit, 201: storage unit, 21: print inspection machine, 21: display device, 22: input device.
3: Production line, 30: Solder printer, 31: Printing inspection machine (inspection machine), 32: Electronic component mounting machine, 33: Pre-reflow board appearance inspection machine (inspection machine), 34: Reflow furnace, 35: After reflow Board appearance inspection machine (inspection machine).
B: Substrate, C1: Printing displacement amount, C2: Printing displacement amount, C3 to C6: Mounting displacement amount, C7: Printing displacement amount, C8: Printing displacement amount, C9-C12: Mounting displacement amount, F1: Self-alignment amount, F2: Self-alignment amount, D1: Printing displacement amount, D2: Printing displacement amount, D3 to D6: Mounting displacement amount, E1: Allowable displacement amount, E2: Allowable displacement amount, b: Land, p: Electronic component, w1: Regular Position, w2: solder regular position.

  Embodiments of a production data creation system and a production data creation method according to the present invention will be described below.

<Configuration of production data creation system>
First, the configuration of the production data creation system of this embodiment will be described. In FIG. 1, the schematic diagram of the production data creation system of this embodiment is shown. As shown in FIG. 1, the production data creation system 1 includes a host computer 2 and a production line 3.

  The host computer 2 includes a control device 20, a display device 21, and an input device 22. The control device 20 includes a calculation unit 200 and a storage unit 201. The production line 3 includes a solder printing machine 30, a printing inspection machine 31, an electronic component mounting machine 32, a pre-reflow board appearance inspection machine 33, a reflow furnace 34, and a post-reflow board appearance inspection machine 35. Yes. Among these, the printing inspection machine 31, the pre-reflow board appearance inspection machine 33, and the post-reflow board appearance inspection machine 35 are each included in the concept of the “inspection machine” of the present invention.

  The devices (solder printer 30, print inspection machine 31, electronic component mounting machine 32, pre-reflow board appearance inspection machine 33, reflow furnace 34, post-reflow board appearance inspection machine 35) arranged in the production line 3 are host computers. 2 is electrically connected. Each of these devices includes a control device, similar to the host computer 2.

<Production data creation method>
Next, the production data creation method of this embodiment will be described. FIG. 2 shows a flowchart of the production data creation method of the present embodiment. The production data creation method of the present embodiment includes a data accumulation process and a production data creation process.

[Data Accumulation Step (S (Step) 1 in FIG. 2)]
In this process, the devices (solder printer 30, print inspection machine 31, electronic component mounting machine 32, pre-reflow board appearance inspection machine 33, reflow furnace 34, post-reflow board appearance are arranged on the production line 3 in FIG. 1. Each inspection machine 35) collects self-alignment data. Collection of self-alignment data is performed at the time of actual substrate production.

  In FIG. 3, the schematic diagram of the data storage process of the production data creation method of this embodiment is shown. Note that “before solder printing” in FIG. 3 corresponds to before the solder printing machine 30 in FIG. “After solder printing” in FIG. 3 corresponds to the printing inspection machine 31 in FIG. “Before reflow” in FIG. 3 corresponds to the pre-reflow board appearance inspection machine 33 in FIG. “After reflow” in FIG. 3 corresponds to the post-reflow board appearance inspection machine 35 in FIG.

  As shown in FIGS. 1 and 3, during board production, first, a solder printing machine (screen printing machine) 30 prints solder s (shown by hatching in FIG. 3) on a land b of the board B. . Next, the printing inspection machine 31 inspects the printing state of the solder s on the land b. That is, the print misalignment amounts C1 and C2 of the solder s with respect to the land b in the X-axis direction (= transport direction of the substrate B), the Y-axis direction (= the direction perpendicular to the X-axis direction in the horizontal plane), Inspect D2.

  Subsequently, the electronic component mounting machine 32 mounts the electronic component p on the board B after the solder s printing. Here, when the printing misalignment amounts C1 and D1 are small, the electronic component mounting machine 32 mounts the electronic component p on the basis of the land b of the board B. On the other hand, when the printing misalignment amounts C2 and D2 are large, the electronic component mounting machine 32 mounts the electronic component p on the basis of the solder s.

  Then, the pre-reflow board appearance inspection machine 33 inspects the mounting state of the electronic component p on the board B after the electronic component p is mounted and before the solder s is melted. That is, in the case of the electronic component p based on the land b, the mounting displacement amount C3 of the electronic component p in the X-axis direction with respect to the normal position w1 (the normal mounting position of the electronic component p with respect to the substrate B. The thin line frame in FIG. 3) The mounting displacement amount D3 in the Y-axis direction is inspected. On the other hand, in the case of the electronic component p based on the solder s, the electronic component p is mounted in the X-axis direction with respect to the normal solder position w2 (the normal mounting position of the electronic component p with respect to the solder s. The thin line frame in FIG. 3). The shift amount C4 and the mounting shift amount D4 in the Y-axis direction are inspected.

  Thereafter, the reflow furnace 34 heat-treats the substrate B in a predetermined furnace atmosphere (for example, air, nitrogen, etc.) and a predetermined temperature pattern. By heating, the solder s melts and liquefies. Then, the liquefied solder s flows in the direction of the land b as shown by the white arrow in FIG. Similarly, the electronic component p flows due to the flow of the solder s. Thereafter, the solder s is solidified.

  Finally, the post-reflow board appearance inspection machine 35 inspects the mounting state of the electronic component p on the board B after the solder s is solidified. That is, both the electronic component p based on the land b and the electronic component p based on the solder s are mounted in the X axis direction of the electronic component p with respect to the normal position w1 (thin line frame in FIG. 3). The mounting misalignment amounts D5 and D6 are inspected.

  While the production of the substrate B is performed in this way, the devices arranged on the production line 3 each collect self-alignment data.

  Specifically, each apparatus collects self-alignment conditions as listed below. However, the following self-alignment conditions are examples. Self-alignment conditions are not limited to the following examples. Moreover, the tendency of the change of the self-alignment amount with respect to the change of the self-alignment condition exemplified below is not particularly limited.

  The solder printer 30 stores the type of solder s in use, the thickness of the screen mask (the thickness of the solder s), and the settings of the printer in the storage unit of its own control device. For example, the thicker the solder s, the larger the self-alignment amount.

  Further, the print inspection machine 31 stores the volume of the printing misalignment amounts C1, C2, D1, D2, and solder s in the storage unit of its own control device. For example, the self-alignment amount increases as the print misalignment amounts C1, C2, D1, and D2 increase. Further, the larger the volume of the solder s, the larger the self-alignment amount.

  Further, the electronic component mounting machine 32 stores the mounting position of the electronic component p in the storage unit of its own control device. Further, the pre-reflow board appearance inspection machine 33 stores the mounting displacement amounts C3, C4, D3, and D4 in the storage unit of its own control device.

  In addition, the reflow furnace 34 stores the atmosphere in the furnace, the temperature pattern, and the substrate transport speed in the furnace in the storage unit of its own control device. For example, when the furnace atmosphere is nitrogen, the self-alignment amount is larger than when the furnace atmosphere is air. Moreover, the temperature pattern with which a larger self-alignment effect can be obtained varies depending on conditions such as the particle size and volume of the solder s. Further, the slower the substrate transport speed, the larger the self-alignment amount. Further, the post-reflow board appearance inspection machine 35 stores the mounting displacement amounts C5, C6, D5, and D6 in the storage unit of its own control device.

  As shown in FIG. 1, various self-alignment conditions as described above are transmitted from each device arranged in the production line 3 to the storage unit 201 of the control device 20 of the host computer 2.

  The storage unit 201 stores data related to the electronic component p and the substrate B in advance, such as the shape and size of the electronic component p and the area of the land b of the substrate B. These data are included in the self-alignment conditions transmitted from each device.

  Here, among the self-alignment conditions, the mounting misalignments C5, C6, D5, and D6 collected by the post-reflow board appearance inspection machine 35 are post-reflow misalignments (the actual position of the electronic component p with respect to the normal position w1 after reflow). Of the mounting position).

  Further, in the case of the land b reference, the mounting displacement amounts C3 and D3 collected by the pre-reflow board appearance inspection machine 33 are the pre-reflow displacement amounts (the actual mounting position of the electronic component p with respect to the normal position w1 before the reflow). Deviation).

  Further, in the case of the solder s standard, the sum of the mounting misalignment amount C4 collected by the pre-reflow board appearance inspection machine 33 and the printing misalignment amount C2 collected by the print inspection machine 31 is the pre-reflow misalignment amount. Similarly, the sum of the mounting deviation amount D4 and the printing deviation amount D2 is the deviation amount before reflow.

  The calculation unit 200 of the control device 20 determines the self-alignment amount (= pre-reflow displacement) for each electronic component p and for each X-axis direction and Y-axis direction from the pre-reflow displacement amount and the post-reflow displacement amount. (Amount−deviation after reflow)) is calculated.

  The self-alignment data (the calculated self-alignment amount and the self-alignment condition) is stored in the storage unit 201 of the control device 20 in a state associated with each substrate B.

[Production data creation process (after S2 in FIG. 2)]
In this step, production data for the board to be produced is created based on the self-alignment data stored in the storage unit 201. That is, this process is performed before the production of the substrate. First, the calculation unit 200 reads the self-alignment data stored in the storage unit 201 (S2 in FIG. 2).

  Next, the arithmetic unit 200 predicts the self-alignment amount of the electronic component to be mounted on the board (S3 in FIG. 2). Specifically, there is a correlation between the self-alignment conditions accumulated in the storage unit 201 and the self-alignment amount. The calculation unit 200 approximates the correlation by the least square method. That is, the calculation unit 200 creates a self-alignment amount prediction formula.

  The calculation unit 200 substitutes the self-alignment condition regarding the electronic component to be mounted on the board from now on in the self-alignment amount prediction formula. Then, the self-alignment amount (predicted value) of the electronic component is calculated. In this way, the arithmetic unit 200 calculates the self-alignment amount (predicted value) for each electronic component.

  Subsequently, the arithmetic unit 200 compares the calculated self-alignment amount with the attachment reference threshold value stored in the storage unit 201 (S4 in FIG. 2). When the self-alignment amount exceeds the mounting reference threshold, in other words, when the self-alignment effect can be expected, the mounting reference for the electronic component in the electronic component mounting machine 32 is determined as the solder reference (S5 in FIG. 2). . On the other hand, when the self-alignment amount is equal to or smaller than the mounting reference threshold, in other words, when the self-alignment effect cannot be expected, the mounting reference for the electronic component in the electronic component mounting machine 32 is determined as the land reference (S9 in FIG. 2). ).

  Next, the arithmetic unit 200 performs a simulation of substrate production (S6 in FIG. 2). FIG. 4 shows a schematic diagram of a simulation of the production data creation process of the production data creation method of the present embodiment. In addition, about the site | part corresponding to FIG. 3, it shows with the same code | symbol.

  Here, FIG. 4 shows a simulation in the case where the maximum value of the assumed print misalignment amount, the maximum value of the assumed misalignment amount, and the self-alignment effect occur in the X-axis direction. The simulation can be similarly performed when the maximum value of the assumed printing deviation amount, the maximum value of the assumed mounting deviation amount, and the self-alignment effect occur in the Y-axis direction. In addition, when the maximum value of the expected printing misalignment, the maximum value of the assumed misalignment, and the self-alignment effect occur in both directions in the X-axis direction and Y-axis direction, simulations are performed separately for both directions. And synthesize the results.

  As shown in FIG. 4, the simulation is performed for both the electronic component p based on the land b and the electronic component p based on the solder s. The simulation is performed based on the self-alignment condition of the storage unit 201.

  The calculation unit 200 predicts the print misalignment amount of the solder s with respect to the land b (specifically, the maximum value of the assumed misprint amount) C7 and C8 in the print inspection machine 31. In addition, when the electronic component p is based on the land b, the arithmetic unit 200 has a mounting displacement amount of the electronic component p with respect to the normal position w1 (thin line frame in FIG. 4) in the pre-reflow board appearance inspection machine 33 (details are assumed. (Maximum value of wearing displacement amount) C9 to be predicted. In addition, when the electronic component p is based on the solder s, the calculation unit 200 has a mounting displacement amount C10 of the electronic component p with respect to the normal solder position w2 (thin line frame in FIG. 4) in the pre-reflow board appearance inspection machine 33 (specifically, Estimate the maximum possible amount of misalignment.

  In addition, the calculation unit 200 has the mounting displacement amounts C11 and C12 of the electronic component p with respect to the normal position w1 (thin line frame in FIG. 4) in the post-reflow board appearance inspection machine 35 (specifically, the maximum value of the assumed mounting displacement amount). ). At this time, the calculation unit 200 considers the self-alignment amounts F1 and F2 calculated in S3 of FIG.

  Subsequently, the arithmetic unit 200 evaluates the result of the simulation (S7 in FIG. 2). In the post-reflow board appearance inspection machine 35, when the final mounting deviation amounts (that is, post-reflow deviation amounts) C11 and C12 are equal to or less than the allowable deviation amounts E1 and E2, even if the substrate B is produced with the current production data. The electronic component p can be mounted with a predetermined accuracy with respect to a predetermined mounting coordinate. For this reason, it is not necessary to correct the self-alignment condition.

  In this case, the arithmetic unit 200 determines the print inspection machine 31, the pre-reflow board appearance inspection machine 33, and the post-reflow board appearance based on the simulation results (print displacement amounts C7 and C8 and mounting displacement amounts C9 to C12 in FIG. 4). A pass / fail judgment threshold value of the inspection machine 35 is set (S8 in FIG. 2).

  On the other hand, when the final mounting misalignment amounts (that is, post-reflow misalignment amounts) C11 and C12 exceed the allowable misalignment amounts E1 and E2, even if the board B is produced with the current production data, the electronic component p is related. Cannot be mounted with a predetermined accuracy with respect to a predetermined mounting coordinate. For this reason, the self-alignment condition is corrected (S10 in FIG. 2).

  When the self-alignment condition needs to be corrected, the calculation unit 200 displays a message on the display device 21 that the self-alignment condition needs to be corrected. The operator confirms the message and inputs a correction value for the self-alignment condition from the input device 22. Based on the input correction value, the arithmetic unit 200 recalculates the self-alignment amount (predicted value) of the electronic component p using the self-alignment amount prediction formula.

  As a result of the correction, the self-alignment amount (predicted value) of the electronic component p is changed, and as a result of the simulation, the final mounting misalignment amounts (that is, post-reflow misalignment amounts) C11 and C12 become the allowable misalignment amounts E1 and E2 or less. Then (S6, S7 in FIG. 2), the calculation unit 200 sets pass / fail judgment threshold values for the print inspection machine 31, the pre-reflow board appearance inspection machine 33, and the post-reflow board appearance inspection machine 35 (S8 in FIG. 2). .

  As described above, according to the production data creation method of the present embodiment, it is possible to create the production data of the board to be produced from now on in consideration of the self-alignment effect for each electronic component p.

<Effect>
Next, effects of the production data creation system and the production data creation method of the present embodiment will be described. As shown in FIG. 1, the storage unit of the production data creation system 1 (specifically, devices arranged in the production line 3 (solder printer 30, print inspection machine 31, electronic component mounting machine 32, pre-reflow board) The appearance inspection machine 33, the reflow furnace 34, and the post-reflow board appearance inspection machine 35) storage unit) accumulate self-alignment data for each substrate B during the production of the substrate B. That is, self-alignment data including a self-alignment amount of an arbitrary electronic component p and self-alignment conditions that are conditions that affect the self-alignment amount are accumulated in the storage unit.

  2, the calculation unit 200 of the control device 20 of the host computer 2 shown in FIG. 1 is based on the self-alignment data accumulated in the storage unit 201 and the next time (even the second time, three times). The self-alignment amount of the electronic component p of the substrate B, which is the production target of the first time or the fourth time or later), is predicted. Then, in consideration of the self-alignment amount, production data of the substrate B to be produced from the next time is created.

  According to the production data creation system 1 and the production data creation method of this embodiment, as shown in S2 and S3 of FIG. 2, the self-alignment effect can be predicted based on the self-alignment data. For this reason, the quality of the board | substrate B produced can be stabilized irrespective of the skill level of an operator's skill. In addition, the quality of the substrate B can be improved.

  Further, according to the production data creation system 1 and the production data creation method of the present embodiment, as shown in S8 of FIG. 2, the arithmetic unit 200 shown in FIG. A pass / fail threshold value for the quantity can be set. Further, when the mounting reference of the electronic component p is the land b reference, a pass / fail judgment threshold value regarding the mounting displacement amount of the electronic component p with respect to the normal position w1 in the pre-reflow board appearance inspection machine 33 can be set. Further, when the mounting reference of the electronic component p is the solder s reference, a pass / fail judgment threshold value regarding the mounting displacement amount of the electronic component p with respect to the solder normal position w2 in the pre-reflow board appearance inspection machine 33 can be set. In addition, it is possible to set a pass / fail judgment threshold regarding the amount of mounting deviation of the electronic component p with respect to the normal position w1 in the post-reflow board appearance inspection machine 35.

  Further, according to the production data creation system 1 and the production data creation method of the present embodiment, as shown in S4, S5, and S9 in FIG. 2, the electronic component p is mounted according to the magnitude of the self-alignment amount (predicted value). References (land b reference, solder s reference) can be set. That is, the mounting standard for the electronic component p can be set regardless of the skill level of the operator's skill.

<Others>
The embodiment of the production data creation system and the production data creation method of the present invention has been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  The configuration of the production line 3 shown in FIG. 1 is not particularly limited. The pre-reflow board appearance inspection machine 33 may not be arranged. In this case, the electronic component mounting machine 32 uses the pre-reflow misalignment amount (as shown in FIG. 3, the mounting misalignment amounts C3 and D3 in the case of the land standard. In the case of the solder standard, the misalignment amount C4, D4 and the sum of the print misalignment amounts C2 and D2).

  Further, the pre-reflow misalignment amount (print misalignment amounts C1, C2, D1, and D2 shown in FIG. 3) may be collected by the print inspection machine 31. In this case, what is collected as the post-reflow misalignment is the misalignment of the solder s with respect to the land b in the post-reflow board appearance inspection machine 35.

  Further, the self-alignment condition is not particularly limited. Any condition that affects the self-alignment amount may be used. Further, the self-alignment amount may be predicted in consideration of the rotation of the electronic component p in the horizontal plane during reflow.

  In S10 of FIG. 2, the self-alignment condition was corrected according to the operator's instruction. However, the said correction | amendment part 200 shown in FIG. 1 may perform the said correction | amendment automatically. For example, among the self-alignment conditions, a condition where the contribution ratio to the self-alignment amount is high may be changed by a predetermined amount.

  Further, in S6 of FIG. 2, as shown in FIG. 4, a simulation was performed on both the electronic component p based on the land b and the electronic component p based on the solder s. However, the simulation may be performed only for the electronic component p based on the solder s. This is because the electronic component p based on the solder s can be expected to have a larger self-alignment effect than the electronic component p based on the land b.

Claims (6)

The normal mounting position of the electronic component on the board is the normal position,
The amount of deviation of the actual mounting position of the electronic component with respect to the normal position before reflowing in the production line of the substrate is the amount of deviation before reflowing,
The amount of deviation of the actual mounting position of the electronic component with respect to the normal position after reflowing in the production line is the amount of deviation after reflowing,
The difference between the amount of deviation before reflow and the amount of deviation after reflow is the self-alignment amount.
A storage unit that accumulates self-alignment data including the self-alignment amount and a self-alignment condition that affects the self-alignment amount for each substrate during the production of the substrate;
Based on the self-alignment data, for the electronic component scheduled to be mounted on the board to be produced next time, a calculation unit that predicts the self-alignment amount and creates production data of the board;
Production data creation system with.   2. The production data according to claim 1, wherein the arithmetic unit sets a pass / fail judgment threshold value of an inspection machine arranged in the production line of the substrate that is the next production target based on the self-alignment data. Creation system. When the amount of self-alignment is less than or equal to a predetermined mounting reference threshold value, the arithmetic unit determines that the mounting of the electronic component on the substrate is performed based on the land of the substrate,
3. The production according to claim 1, wherein when the self-alignment amount exceeds the mounting reference threshold value, it is determined that mounting of the electronic component on the substrate is performed based on solder printed on the substrate. Data creation system. The normal mounting position of the electronic component on the board is the normal position,
The amount of deviation of the actual mounting position of the electronic component with respect to the normal position before reflowing in the production line of the substrate is the amount of deviation before reflowing,
The amount of deviation of the actual mounting position of the electronic component with respect to the normal position after reflowing in the production line is the amount of deviation after reflowing,
The difference between the amount of deviation before reflow and the amount of deviation after reflow is the self-alignment amount.
A data accumulating step for accumulating self-alignment data including the self-alignment amount and a self-alignment condition that is a condition affecting the self-alignment amount for each substrate during the production of the substrate;
Based on the self-alignment data, a production data creation step for predicting the self-alignment amount and creating production data for the board for the electronic component to be mounted on the board to be produced next time,
A production data creation method.   5. The pass / fail judgment threshold value of an inspection machine arranged in the production line of the substrate that is the next production target or later is set based on the self-alignment data in the production data creation step. Production data creation method. In the production data creation step, when the self-alignment amount is equal to or less than a predetermined mounting reference threshold value, it is determined that mounting of the electronic component on the substrate is performed based on the land of the substrate,
6. The production according to claim 4 or 5, wherein when the self-alignment amount exceeds the mounting reference threshold value, it is determined that mounting of the electronic component on the substrate is performed based on solder printed on the substrate. Data creation method.

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