JPWO2014030736A1 - Electric module manufacturing method and electric module - Google Patents

Abstract

A first electrode having a transparent conductive film formed on the plate surface of the first substrate and a semiconductor layer formed on the surface of the transparent conductive film, and a plate surface of the second substrate opposed to the transparent conductive film. A method of manufacturing an electric module comprising: a second electrode on which a conductive film is formed; and an electrolyte sealed in a space formed between the first electrode and the second electrode. A bonding step of bonding the first electrode and the second electrode with the counter conductive film facing each other, and a back surface of the first substrate on which the transparent conductive film is formed or the counter conductive film is formed The ultrasonic vibration is applied from any one of the back surfaces of the second substrate, and the first substrate and the second substrate that are located at a position where the ultrasonic vibration is applied are brought into contact with each other. To insulate and weld these first and second substrates together Ri, the method of manufacturing an electro-module; and a dividing step of dividing the first electrode and the second electrode.

Description

The present invention relates to an electrical module manufacturing method and an electrical module.
This application claims priority based on Japanese Patent Application No. 2012-185875 filed in Japan on August 24, 2012, and Japanese Patent Application No. 2013-025019 filed in Japan on February 12, 2013. The contents are incorporated herein.

In recent years, solar cells have attracted attention as clean energy power generation devices that replace fossil fuels, and silicon (Si) solar cells and dye-sensitized solar cells have been developed. In particular, dye-sensitized solar cells have been widely researched and developed for their structures and manufacturing methods as being inexpensive and easy to mass-produce (for example, Patent Document 1 below).
As shown in FIG. 12D, the dye-sensitized solar cell 50 described in Patent Document 1 has a transparent conductive film 52 formed on the plate surface of the transparent substrate 51, and the dye is supported on the surface of the transparent conductive film 52. A first electrode plate 54 having a semiconductor layer 53 formed thereon, a second electrode plate 57 having a counter substrate 55 and a counter conductive film 56 disposed opposite to the transparent conductive film 52, and the semiconductor layer 53. A sealing material 58 that forms a sealed cell S by forming a gap R therebetween to surround the semiconductor layer 53 and bonding the first electrode plate 54 and the second electrode plate 57 together, and the inside of the cell S And an electrolytic solution 59 injected into the.

  And manufacture of the said dye-sensitized solar cell 50 is performed as follows. That is, after the transparent conductive film 52 is patterned on the transparent substrate 51 by a printing method or the like using a mask (not shown) on the transparent substrate 51 as shown in FIGS. 12A to 12D, the transparent conductive film 52 is formed. Further, a paste for forming the semiconductor layer 53 is applied on the transparent conductive film 52 in the same manner as the transparent conductive film 52 to produce a first electrode plate (so-called photoelectrode) 54. In addition, a counter conductive film 56 disposed opposite to the first electrode plate 54 is formed on the counter substrate 55 in the same manner as the transparent conductive film 52 to produce the second electrode plate 57. Then, a sealing material 58 is disposed on the surface of the transparent conductive film 52 so as to surround the semiconductor layer 53 by providing a gap R between the first electrode plate 54 and the second electrode plate 57. The conductive films 52 and 56 are bonded to each other, and an electrolytic solution 59 is injected to form a dye-sensitized solar cell 50.

JP 2011-49140 A

By the way, the electric module 50 of the said patent document 1 requires the process of arrange | positioning the sealing material 58 and the electrically conductive material after patterning the transparent conductive film 52, the semiconductor layer 53, and the opposing conductive film 56, respectively. Then, the first electrode plate 54 and the second electrode plate 57 are accurately aligned so that the patterning position of each of the first electrode plate 54 and the second electrode plate 57, the position of the sealing material 58, and the position of the conductive material match. A process of high bonding was necessary. Therefore, in order to form elaborately patterned cells and have a serial or parallel structure, a complicated and highly accurate manufacturing process is required, which reduces the productivity of the solar cell and increases the manufacturing cost. There was a problem.
In view of the above-described problems, an object of the present invention is to provide an electric module manufacturing method and an electric module in which cells can be easily and accurately formed.

The present invention provides a first electrode in which a transparent conductive film is formed on a plate surface of a first substrate and a semiconductor layer is formed on the surface of the transparent conductive film, and a surface of the second substrate facing the transparent conductive film. In the method of manufacturing an electrical module comprising the second electrode on which the opposing conductive film is formed, and an electrolyte sealed in a space formed between the first electrode and the second electrode, A bonding step of bonding the first electrode and the second electrode with the transparent conductive film and the counter conductive film facing each other; and the back surface of the first substrate on which the transparent conductive film is formed or the counter conductive film Plates that apply ultrasonic vibration from one of the back surfaces of the second substrate on which the film is formed, and the first substrate and the second substrate that are located at the position where the ultrasonic vibration is applied, face each other. Insulate the surfaces by contacting them and weld the first and second substrates together By Rukoto, and having a dividing step of dividing the first electrode and the second electrode.
According to the present invention, the first substrate and the second substrate are insulated and welded by ultrasonic vibration in a state where the transparent conductive film and the counter conductive film are opposed to each other and the first electrode and the second electrode are bonded together. To do. That is, the transparent conductive film of the first substrate and the opposing conductive film of the second substrate are simultaneously patterned at positions facing each other, and the first electrode and the second electrode are welded at the patterned positions to form a plurality of cells and / Or forming an electrical module.

In the present invention, the transparent conductive film and the semiconductor layer continuously formed in the one direction on the plate surface of the first substrate extended in one direction in a band shape may have a width of the first substrate. The counter conductive film continuously formed in the one direction on the plate surface of the second substrate extended in one direction in the direction of the first electrode formed in one or more directions. One or a plurality of the second electrodes formed in succession in the width direction of the first substrate are bonded together, and both ends in the width direction are bonded, and the bonded first electrode and the second electrode are super The first electrode and the second electrode may be insulated and welded in a direction crossing the extending direction by applying sonic vibration, and sealed and cut for each divided unit.
According to this embodiment, since the insulation and welding between the first electrode and the second electrode and the cutting for each cell or electric module are performed at the same time, the work man-hour is reduced, and the first electrode and the second electrode There is no need for alignment in the extending direction. In addition, the length dimension of the cell or the electric module in the extending direction can be set at the timing of sealing and cutting the first electrode and the second electrode bonded together by applying ultrasonic vibration.

The ultrasonic vibration is applied so that the first electrode and the second electrode are simultaneously covered, welded and cut, and the insulating and welded portions are simultaneously insulated, welded and cut. Good.
According to this embodiment, the cell or the electric module can be formed more easily, a space is formed between the first electrode and the second electrode, and the space portion is filled with the electrolyte and sealed. Then, the space of the one electric module can be subdivided into a plurality of electric modules by insulating, welding and cutting by ultrasonic vibration.

The present invention also provides a first electrode having a transparent conductive film formed on the plate surface of the first substrate and a semiconductor layer formed on the surface of the transparent conductive film, and a second substrate facing the transparent conductive film. In the electric module comprising the second electrode on which the opposing conductive film is formed as described above, and an electrolyte is filled in a space formed between the first electrode and the second electrode, the plate surface of the first substrate And the plate surface of the second substrate are in direct contact with each other, and are insulated and welded by ultrasonic vibration.
According to the present invention, the electrical module is welded, insulated, and divided by directly contacting the substrate of the first electrode and the substrate of the second electrode without using a sealing material.

In the present invention, a plurality of the semiconductor layers are formed in the width direction of the first substrate, and the plate surface of the first substrate and the plate surface of the second substrate intersect in the width direction. It may be insulated and welded by ultrasonic vibration.
In this embodiment, it is possible to continuously produce a plurality of electric modules with the first electrode and the second electrode extended.

  According to the present invention, at least the transparent conductive film of the first substrate and the opposing conductive film of the second substrate can be insulated, that is, patterned and welded at the patterned position can be performed in one operation, thereby simplifying the manufacturing process. Can do. In addition, after the first electrode and the second electrode are bonded, the patterning of the transparent conductive film of the first substrate and the opposing conductive film of the second substrate is simultaneously performed at positions facing each other. Positioning at the time of bonding with the electrode becomes unnecessary. Therefore, it is possible to greatly improve the production efficiency of the electric module by facilitating the bonding process, simplifying the patterning and sealing process, and shortening the time.

It is sectional drawing which showed typically the electric module shown as the 1st Embodiment of this invention. FIG. 5 is a cross-sectional view showing a part of the manufacturing process of the electric module shown as the first embodiment of the present invention, in which the first electrode and the second electrode are arranged to face each other. It is a part of manufacturing process of the electric module shown as the 1st Embodiment of this invention, Comprising: It is sectional drawing which showed the 1st electrode. It is sectional drawing which showed a part of manufacturing process of the electric module shown as the 1st Embodiment of this invention. It is a bottom view of the 1st electrode which showed a part of manufacturing process of the electric module shown as a 1st embodiment of the present invention. It is the top view which showed a part of manufacturing process of the electric module shown as the 1st Embodiment of this invention. It is the top view which showed a part of manufacturing process of the electric module shown as the 1st Embodiment of this invention. It is the top view which showed a part of manufacturing process of the electric module shown as the 1st Embodiment of this invention. It is the top view which showed a part of manufacturing process of the electric module shown as the 1st Embodiment of this invention. It is the top view which showed a part of manufacturing process of the electric module shown as the 1st Embodiment of this invention. It is sectional drawing which looked at the electric module shown as the 1st Embodiment of this invention in X1-X1 shown in FIG. It is sectional drawing which looked at the electric module shown as the 1st Embodiment of this invention in the X2-X2 line | wire shown in FIG. It is the perspective view which showed typically the manufacturing process of the electrical module shown as the 2nd Embodiment of this invention. It is the perspective view which showed typically the manufacturing process of the electrical module shown as the 3rd Embodiment of this invention. It is the perspective view which showed typically the manufacturing process of the electrical module shown as the 3rd deformation | transformation embodiment of this invention. It is the figure which showed one process in the manufacturing process of the conventional electrical module. It is the figure which showed one process in the manufacturing process of the conventional electrical module. It is the figure which showed one process in the manufacturing process of the conventional electrical module. It is the figure which showed one process in the manufacturing process of the conventional electrical module.

Hereinafter, a first embodiment of the electric module of the present invention will be described with reference to the drawings, taking as an example a method for manufacturing the dye-sensitized solar cell 1A.
In the present specification, the “cell” means a single dye-sensitized solar cell. In the present specification and claims, the “electric module” means a unit having a plurality of cells. The first embodiment shows an aspect of an electric module obtained by dividing a single cell for the sake of convenience in order to explain the present invention. However, the present invention is not limited to this.
As shown in FIG. 1, a dye-sensitized solar cell 1 </ b> A includes a first electrode 5 having a transparent conductive film 3 and a semiconductor layer 4 on a first substrate 2, and a counter conductive film 7 on a second substrate 6. And a second electrode 9 provided with a catalyst layer 8. And between the 1st electrode 5 and the 2nd electrode 9, it is a frame shape with the sealing material 11 in the edge of the 1st board | substrate 2 and the edge of the 2nd board | substrate 6 in the state which interposed the separator 12. The space surrounded by the sealing material 11 is divided into a plurality of cells C by welding the first substrate 2 and the second substrate 6. Further, the electrolyte solution 13 is filled in each cell C.
In the present invention, the dye-sensitized solar cell 1 </ b> A may not include the separator 12.

  The 1st board | substrate 2 and the 2nd board | substrate 6 are members used as the base of the transparent conductive film 3 and the opposing conductive film 7, respectively, For example, transparent thermoplastics, such as a polyethylene naphthalate (PEN) and a polyethylene terephthalate (PET) A flat plate member made of resin is cut into a substantially rectangular shape. The first substrate 2 and the second substrate 6 may be formed in a film shape.

The transparent conductive film 3 is formed on substantially the entire plate surface 2 a of the first substrate 2.
As the material of the transparent conductive film 3, for example, indium tin oxide (ITO), zinc oxide or the like is used.

The semiconductor layer 4 has a function of receiving and transporting electrons from a sensitizing dye described later, and is provided on the surface 3 a of the transparent conductive film 3 by a semiconductor made of a metal oxide. Examples of the metal oxide include titanium oxide (TiO ₂ ), zinc oxide (ZnO), tin oxide (SnO ₂ ), and the like.

The semiconductor layer 4 carries a sensitizing dye. The sensitizing dye is composed of an organic dye or a metal complex dye. Examples of organic dyes include various organic dyes such as coumarin, polyene, cyanine, hemicyanine, and thiophene. As the metal complex dye, for example, a ruthenium complex is preferably used.
Thus, the first electrode 5 is configured by forming the transparent conductive film 3 on one plate surface 2 a of the first substrate 2 and providing the semiconductor layer 4 formed on the surface 3 a of the transparent conductive film 3. .

The counter conductive film 7 is formed on the entire plate surface 6 a of the second substrate 6.
For example, indium tin oxide (ITO), zinc oxide, or the like is used as the material of the counter conductive film 7. A catalyst layer 8 made of carbon paste, platinum or the like is formed on the surface 7 a of the counter conductive film 7.
In this way, the second electrode 9 is configured by forming the counter conductive film 7 on one plate surface 6 a of the second substrate 6 and forming the catalyst layer 8 on the surface 7 a of the counter conductive film 7.
The second electrode 9 is disposed opposite to the first electrode 5 with the opposing conductive film 7 facing the transparent conductive film 3.

As the sealing material 11, hot melt resin or the like is used.
This sealing material 11 has a frame on the surface of the transparent conductive film 3 along the entire circumference of the edges R1 to R4 of the first electrode 5 arranged in a strip shape shown in FIG. The first electrode 5 and the second electrode 9 are adhered to each other by being heated and pressed. The sealing material 11 may be disposed along the entire circumference of the edge of the second electrode 9 or on both the first electrode 5 and the second electrode 9. In the present invention, the sealing material 11 may be disposed only on a part of the edges R <b> 1 to R <b> 4 of the first electrode 5. For example, as in a third embodiment to be described later, the sealing material 11 is disposed along the edges R1 and R2 of the first electrode 5 or the second electrode 9, and is disposed along the edges R3 and R4. You may make it the structure which does not.

For the separator 12 shown in FIG. 1, a sheet material such as a nonwoven fabric having a large number of holes (not shown) through which the sealing material 11 and the electrolytic solution (electrolyte) 13 pass is used.
However, as will be described later, the separator 12 may not be used in the present invention.

  Examples of the electrolytic solution 13 include non-aqueous solvents such as acetonitrile and propionitrile; liquid components such as ionic liquids such as dimethylpropylimidazolium iodide or butylmethylimidazolium iodide; and a supporting electrolytic solution such as lithium iodide. A solution or the like in which iodine and iodine are mixed is used. Moreover, in order to prevent reverse electron transfer reaction, the electrolyte solution 13 may contain t-butylpyridine.

Next, the manufacturing method of 1 A of dye-sensitized solar cells is demonstrated using FIG. 2A-FIG. 9B.
The manufacturing method of the dye-sensitized solar cell 1A of the first embodiment includes a bonding step of bonding the first electrode 5 and the second electrode 9 with the transparent conductive film 3 and the counter conductive film 7 facing each other, Ultrasonic vibration is applied from either the back surface of the first substrate 2 on which the transparent conductive film 3 and the semiconductor layer 4 are formed or the back surface of the second substrate 6 on which the counter conductive film 7 is formed. A plurality of cells C divided from each other are formed by abutting and insulating the mutually opposing plate surfaces 2a and 6a of the first substrate 2 and the second substrate 6 located at a place where vibration is applied, and welding them. And a dividing step. Further, in the manufacturing method of the present embodiment, (I) an electrode plate forming step is provided before the bonding step (II), and (IV) an electrical connection step is further provided after the dividing step (III). V) A liquid injection hole forming step, (VI) a liquid injection step, and (VII) a liquid injection hole sealing step are provided. Hereinafter, each step will be described.

(I) <Electrode plate forming step>
In the electrode plate forming step, as shown in FIG. 2A, a transparent conductive film 3 is formed on one plate surface 2a of the first substrate 2, and a semiconductor layer 4 is formed on the surface 3a of the transparent conductive film 3. The first electrode 5 and the second electrode 9 on which the opposing conductive film 7 is formed on one plate surface 6a of the second substrate 6 and the catalyst layer 8 is further formed are formed. Specifically, the first electrode 5 and the second electrode 9 are formed as follows.

As shown in FIG. 2A, a substrate made of PET or the like is used as the first substrate 2.
A transparent conductive film 3 is formed by sputtering indium tin oxide (ITO) or the like over the entire plate surface 2a of the first substrate 2.
The semiconductor layer 4 is formed on the surface 3a of the transparent conductive film 3 so as to be porous by a low temperature film forming method that does not require firing, such as an aerosol deposition method or a cold spray method. At this time, as shown in FIG. 4, the semiconductor layer 4 leaves the edges R <b> 1 to R <b> 4 to which the sealing material 11 is applied, takes out the current, or arranges the sealing material 2. The semiconductor layer 4 is formed leaving at least one edge R1.

After forming the semiconductor layer 4, as shown in FIG. 2B, the semiconductor layer 4 is immersed in a sensitizing dye solution in which a sensitizing dye is dissolved in a solvent, and the sensitizing dye is supported on the semiconductor layer 4. The method for supporting the sensitizing dye on the semiconductor layer 4 is not limited to the above, and a method of continuously charging, dipping and pulling up while moving the semiconductor layer 4 in the sensitizing dye solution is also employed. .
Thus, the first electrode 5 shown in FIG. 2B is obtained.

  As shown in FIG. 2A, the second electrode 9 is formed by forming a counter conductive film 7 by sputtering ITO, zinc oxide, platinum or the like on one plate surface 6a of the second substrate 6 made of polyethylene terephthalate (PET) or the like. To do. The counter conductive film 7 may be formed by a printing method, a spray method, or the like. A carbon paste or the like is formed on the entire surface 7 a of the counter conductive film 7 to form the catalyst layer 8.

(II) <Lamination process>
As shown in FIG. 3, in the bonding step, the first electrode 5 and the second electrode 9 are bonded to each other and bonded, and if necessary, the respective edges R1 to R4 (see FIG. 4) are sealed. 11 is a process of sealing by 11.
[Arrangement of sealing material and injection hole forming member]
Specifically, as shown in FIG. 4, a sheet-like sheet formed in a frame shape having a predetermined width dimension on the entire circumference of the edges R <b> 1 to R <b> 4 of the transparent conductive film 3 along the undivided semiconductor layer 4. The sealing material 11 is disposed to surround the semiconductor layer 4. However, as described above, in the present invention, the sealing material 11 may be disposed only on a part of the edges R1 to R4 of the first electrode 5 (see, for example, the third embodiment).

Thereafter, a plurality of liquid injection hole forming members 19 are arranged at a predetermined interval on the edge R2 facing the one edge R1 of the first electrode 5. At this time, each injection hole forming member 19 is disposed so as to protrude from the edge R <b> 2 of the first substrate 2 across the sealing material 11.
In addition, as the injection hole forming member 19, a releasable resin sheet formed in a strip shape is used.
For the releasable resin sheet, for example, polyester, polyethylene terephthalate, polybutylene terephthalate, or the like can be used.
The predetermined interval is an interval at which adjacent cells C and C are formed in the first electrode 5 (or the second electrode 9).

[Board bonding]
Next, as shown in FIG. 3, the second electrode 9 is brought into contact with the first electrode 5 so that the transparent conductive film 3 and the counter conductive film 7 are opposed to each other with the separator 12 interposed. In the present invention, as will be described later, the separator 12 may not be used.

[Adhesion process]
In the bonding step, the edges R2 to R4 are heated and bonded in the stacking direction except for the edge R1 shown in FIG. 5 of the first electrode 5 and the second electrode 9 that are bonded together. At this time, since the injection hole forming member 19 has a heat-resistant temperature higher than the melt curing temperature of the sealing material 11 and is excellent in non-adhesiveness, the sealing material in contact with the injection hole forming member 19 is used. 11 is not bonded. Therefore, both surfaces of the injection hole forming member 19 are not bonded to the first electrode 5 and the second electrode 9.
In the present embodiment, an example of a method in which the injection hole is provided in advance and the liquid is injected after the bonding step has been described, but the present invention is not limited to this. For example, an electrolytic solution may be applied in advance, and press bonding or vacuum bonding may be used.

(III) <Division process>
In the dividing step, as shown in FIG. 6, the space formed by the first electrode 5 and the second electrode 9 is on the boundary that partitions the cells C, C,. The back surface 2b of the first substrate 2 on which the transparent conductive film 3 is formed (see FIG. 3) or the back surface 6b of the second substrate 6 on which the counter conductive film 7 is formed (see FIG. 3). Ultrasonic vibration is applied from either one.

Then, the transparent conductive film 3 and the semiconductor layer 4 formed on the first substrate 2 are diffused by ultrasonic vibration, and the opposing conductive film 7 and the catalyst layer 8 facing the transparent conductive film 3 are similarly super Diffuse by sonic vibration. As a result, as shown in FIG. 1, cracks occur in the transparent conductive film 3, the semiconductor layer 4, the counter conductive film 7, and the catalyst layer 8 at positions facing each other, and the plate surface 2 a of the first substrate 2 and the second substrate 6. The plate surface 6a contacts. Further, the first substrate 2 and the second substrate 6 are melted by ultrasonic vibration and welded to each other, and the sealing material 11 arranged so as to surround the semiconductor layer 4 as shown in FIG. A plurality of cells C, C,... Divided into each other are formed in the frame.
The ultrasonic vibration is performed at a predetermined output that can be welded while patterning the first electrode 5 and the second electrode 9 simultaneously and reliably.

(IV) <Electrical connection process>
In the electrical connection step, a notch 15 straddling between adjacent cells C and C is formed as shown in FIG. 7A at one end edge R1 which is not bonded by the heating press, and the notch 15 and .. Are provided with conducting members 16, 16... To connect a plurality of cells C, C in series. Thereafter, the one end R1 is bonded by a hot press to close the one end R1.
By the above, the 1st electrode 5 and the 2nd electrode 9 are adhere | attached in edge R1-R4 except the position where the member 19 for liquid injection hole formation was distribute | arranged.

(V) <Injection hole forming step>
In the liquid injection hole forming step, as shown in FIG. 8, the liquid injection hole forming members 19, 19 protruding from the edge of the first substrate 2 are pulled out, the cell C is opened, and an electrolyte can be injected. Liquid holes 17 are formed.
Through the above steps, a joined body 1a in which cells C, C... Are formed between the first electrode 5 and the second electrode 9 is obtained.

(VI) <Liquid injection process>
In the liquid injection process, the joined body 1a of the first electrode 5 and the second electrode 9 obtained in the above-described process is placed in a reduced pressure atmosphere, and the liquid injection holes 17, 17 is immersed and the electrolytic solution 13 is injected into the cell C by evacuation.

(VII) <Injection hole sealing step>
Thereafter, in the injection hole sealing step, after injection of the electrolytic solution 13, the injection holes 17, 17,... Are closed with an adhesive or the like to seal the cell C, and a plurality of cells C, C,. The dye-sensitized solar cell 1A shown in FIGS. 9A and 9B is obtained.

  As described above, according to the dye-sensitized solar cell 1A, the insulation of the first electrode 5 and the second electrode 9, that is, the patterning and the welding at the patterned part, are performed in one operation, that is, in one step by ultrasonic vibration. It can be carried out. Further, after the first electrode 5 and the second electrode 9 are bonded together, patterning may be performed using ultrasonic vibration. Therefore, in the bonding of the first electrode 5 and the second electrode 9, the patterning position. It is not necessary to perform alignment in consideration of P (see FIG. 7A) in advance. Therefore, the production efficiency of the dye-sensitized solar cell 1A composed of a plurality of cells C, C... Can be greatly improved by simplifying the production process and shortening the production time.

Further, since the patterning is performed using the ultrasonic vibration after the first electrode 5 and the second electrode 9 are bonded together, the patterning and the welding position P coincide with each other. Therefore, the effect that the division between the cells C and C can be performed easily and accurately is obtained.
In addition, according to the dye-sensitized solar cell 1A having a plurality of cells C, C,... Manufactured according to the present invention, the cells C and C are insulated from each other without using a sealing material. Therefore, it is possible to reduce the material cost and to prevent the electrolyte solution 13 from being deteriorated by touching the sealing material 11.

In the first embodiment, the second electrode 9 is brought into contact with the first electrode 5 so that the transparent conductive film 3 and the counter conductive film 7 are opposed to each other with the separator 12 interposed. . This is because, in the dividing step, if a portion where the first electrode 5 and the second electrode 9 are in contact with each other in the patterning place P and in the vicinity thereof is energized, the battery may be short-circuited.
However, in the present invention, since patterning is performed using ultrasonic vibration, cracks are generated in the transparent conductive film 3, the semiconductor layer 4, the counter conductive film 7, and the catalyst layer 8 at positions where the patterning locations P face each other. Further, cracks are also generated in the vicinity of the patterning portion P. Therefore, there is no portion where the first electrode 5 and the second electrode 9 are in contact with each other in the patterning portion P and the vicinity thereof. Therefore, in the present invention, even when the separator 12 is not used, the first electrode 5 and the second electrode 9 can be reliably insulated at the patterning portion P, so that there is no possibility that the battery is short-circuited.

Next, a second embodiment of the present invention will be described with reference to FIG. In the present invention, the same reference numerals are used for the same configurations and steps as those in the first embodiment described above, and the description of the configurations and steps will be omitted, and only the configurations and steps different from those in the first embodiment will be described.
The manufacturing method of the dye-sensitized solar cell 1A according to the present embodiment is a long process in which a plurality of semiconductor layers 4 are formed and wound in a roll from (I) electrode plate forming step to (III) dividing step. The point which manufactures the dye-sensitized solar cell 1A by continuously performing the work of each process using the long strip-shaped second electrode 9 wound in a roll shape like the strip-shaped first electrode 5. This is different from the method for manufacturing the dye-sensitized solar cell 1A of the first embodiment.

(I) Electrode plate formation process The 1st electrode 5 pulls out the strip | belt-shaped 1st board | substrate 2 wound by roll shape to one direction (arrow L direction), and it is a transparent conductive film on the whole plate surface 2a in a predetermined position. 3 is formed, and the semiconductor layer 4 is intermittently provided in the direction of the arrow L, leaving edges (outer circumferences) R1 to R4 on the surface 3a of the transparent conductive film 3 on the downstream side of the film formation position of the transparent conductive film 3. Establish and produce. In addition, adsorption | suction of the sensitizing dye in the semiconductor layer 4 can be performed by spray application, for example.
The second electrode 9 draws out the strip-shaped second substrate 6 wound in a roll shape in the direction opposite to the one direction (arrow L direction), and forms the opposing conductive film 7 on the entire plate surface 6a at a predetermined position. Further, the catalyst layer 8 is formed on the entire surface 7 a of the counter conductive film 7 on the downstream side of the film formation position of the counter conductive film 7.

(II) <Sealing step> [Arrangement of sealing material and injection hole forming member]
For the arrangement of the sealing material 11, a sheet-like material formed in a frame shape so as to surround the semiconductor layers 4 intermittently formed at predetermined intervals on the first substrate 2 is used. . A region partitioned by the frame-shaped sealing material 11 is one unit T of one dye-sensitized solar cell 1A.
The liquid injection hole forming member 19 is disposed on the sealing material 11 extending along one end edge of the belt-like first substrate 2 as shown in the first embodiment.

[Board bonding]
The strip-shaped first electrode 5 formed as described above and the sealing material 11 disposed on the first electrode 5 are provided with a separator 12 drawn in a strip shape, and further on the downstream side where the separator 12 is disposed. The second electrode 9 is disposed. In the second embodiment, the separator 12 may not be used for the same reason as in the first embodiment.
[Adhesion step] is performed in the same manner as in the first embodiment.

(III) <Division process>
In the dividing step, ultrasonic vibration is applied in a direction orthogonal to the arrow L direction so as to divide the inside of the frame of the sealing material 11 in the extending direction of the first electrode 5 and the second electrode 9, A plurality of cells C, C... Are formed between the second electrode 9.
Then, (IV) cutting process is performed before or after (IV) electrical connection process.
The cutting step is performed by cutting the first electrode 5 and the second electrode 9 that are attached to each other for each unit T of the one dye-sensitized solar cell 1A.
The (IV) electrical connection step, (VI) injection hole forming step, (VII) injection step, and (VIII) injection hole sealing step are performed in the same manner as in the first embodiment. The (VI) injection hole forming step may be performed before the (V) cutting step.

  As described above, the production of the dye-sensitized solar cell 1A is performed not on each dye-sensitized solar cell 1A but on each of the long strip-shaped first substrate 2 and the long strip-shaped second substrate 6. The work of the process is performed continuously, and then the first electrode 5 and the second electrode 9 in the form of a band are bonded together, and then a plurality of joined bodies 1a shown in FIG. 8 or the dye-sensitized solar cell shown in FIG. By cutting 1A one by one, the effect that the dye-sensitized solar cell 1A can be efficiently manufactured is obtained.

  Also, in the step of bonding and sealing the band-shaped first electrode 5 and the second electrode 9 and the step of forming a plurality of cells C, C..., The first electrode 5 and the second electrode 9 It can be easily sealed without considering positioning, or can be insulated and welded between the cells C and C very easily, so that it is very efficient in continuous production of the dye-sensitized solar cell 1A. The effect of becoming is obtained.

In the first embodiment and the second embodiment, the sealing between the first electrode 5 and the second electrode 9 for each dye-sensitized solar cell 1A is performed using the sealing material 11. Although it was set as the structure performed instead of sealing by the sealing material 11, it applies ultrasonic vibration and insulates and seals between the 1st electrode 5 and the 2nd electrode 9, 1A of dye-sensitized solar cells May be formed.
In this case, in the production of the dye-sensitized solar cell 1A, the frame-shaped sealing material 11 is more easily sealed by ultrasonic welding without the work of arranging the frame-shaped sealing material 11 so as to surround the semiconductor layer 4. The effect that it can be obtained. Further, the injection hole can be eliminated by bonding after applying the electrolytic solution. In this case, the welding process can be performed at an arbitrary place without considering the injection hole.

In the above-described embodiment, the position where the liquid injection hole forming member 19 is disposed and the position where the conductive material is disposed are different at the edges R1 and R2, but the liquid injection hole forming member 19 is electrically connected. As long as the material can be appropriately disposed, these may be disposed adjacent to either one of R1 and R2.
Moreover, in the said embodiment, although the position which distribute | circulates conduction | electrical_connection material was made into either edge R1 or edge R2, conduction | electrical_connection material was distribute | arranged on both sides of edge R1, R2, and between cells C and C was connected in parallel. It may be.

Next, a third embodiment of the present invention will be described with reference to FIG. 11A. In the present invention, the same reference numerals are used for the same configurations and processes as those of the above-described second embodiment, and descriptions of the configurations and processes are omitted, and only configurations and processes different from those of the second embodiment will be described.
In the manufacturing method of the dye-sensitized solar cell 1B of the present embodiment, the long band-like shape in which the semiconductor layer 4 is continuously formed in one direction is performed from (I) the electrode plate forming step to (III) dividing step. Using the first electrode 5 and the long strip-shaped second electrode 9, the operations of each process are continuously performed. In addition, the first electrode 5 and the second electrode 9 that are bonded together are simultaneously insulated, welded, and cut by applying ultrasonic vibrations to seal and separate the cells from each other. This is different from the manufacturing method of the sensitive solar cell 1A.

(I) Electrode Plate Forming Process In the second embodiment described above, the semiconductor layer 4 is intermittently provided in the arrow L direction on the surface 3a of the transparent conductive film 3 while leaving the edges (outer circumferences) R1 to R4. However, in the present embodiment, the semiconductor layer 4 is formed continuously (so-called solid coating) on the surface 3a of the transparent conductive film 3 while leaving the edges R1 and R2.

(II) <Lamination process>
In the second embodiment described above, a sheet-like material formed in a frame shape so as to surround the semiconductor layers 4 formed intermittently one by one is arranged on the surface of the first electrode 5, and In this embodiment, the sealing material 11 extends along the edges R1 and R2 of the first electrode 5 or the second electrode 9, that is, at both ends in the width direction. The first electrode 5 and the second electrode 9 are bonded and bonded in a band shape in the direction. Note that the separator 12 may not be used in the third embodiment. As described in the first embodiment, in the present invention, since patterning is performed using ultrasonic vibration, the transparent conductive film 3, the semiconductor layer 4, and the counter conductive film 7 are located at positions facing each other in the patterning portion P. And a crack arises in the catalyst layer 8. Further, cracks are also generated in the vicinity of the patterning portion P. Therefore, there is no portion where the first electrode 5 and the second electrode 9 are in contact with each other in the patterning portion P and the vicinity thereof. Therefore, in the present invention, even when the separator 12 is not used, the first electrode 5 and the second electrode 9 can be reliably insulated at the patterning portion P, so that there is no possibility that the battery is short-circuited.

Then, insulation and welding in a direction orthogonal (crossing) to the extending direction of the bonded first electrode 5 and second electrode 9 are simultaneously performed by applying ultrasonic vibration.
In addition to insulation and welding, cutting may be performed simultaneously. In the following, a case where cutting is performed at the same time in addition to insulation and welding will be described.
At this time, the insulation, welding, and cutting between the first electrode 5 and the second electrode 9 by applying ultrasonic vibration are formed longer than the width of the bonded first electrode 5 and second electrode 9. The horn 20 is used, and ultrasonic vibration is simultaneously applied to the entire portion to be insulated, welded and cut, and simultaneously insulated, welded and cut.
In addition, when the conductive material is arranged in the L direction, if the horn 20 is configured to straddle the conductive material, the insulation, welding, and cutting of the first electrode 5 and the second electrode 9 can be performed without destroying the conductive material. It can be performed simultaneously by applying sonic vibration.
According to this embodiment, the injection hole can be eliminated by performing the bonding after applying the electrolytic solution. In this case, the welding process can be performed at an arbitrary place without considering the injection hole.

As described above, by performing the electrode plate forming step and the insulating, welding, and cutting steps of the first electrode and the second electrode as described above, the insulating, welding, and cutting steps can be simultaneously performed to reduce the manufacturing process. The effect that it can be obtained.
Further, the transparent conductive film 3 and the semiconductor layer 4 of the first electrode are continuously formed in the extending direction of the first substrate, and the opposing conductive film 7 and the catalyst layer 8 of the second electrode are extended to the second substrate 6. Since the first electrode 5 and the second electrode 9 can be bonded together in a state where the film is continuously formed in the existing direction and the film is in a uniform state (not patterned), the first electrode 5 and the second electrode It is not necessary to consider the alignment in the extending direction of the electrode 9, and the cell or the electric module can be separated at an arbitrary position. Therefore, it is possible to easily bond the first electrode 5 and the second electrode 9 and to greatly reduce the manufacturing time of the dye-sensitized solar cell 1B.

  In addition, since it becomes easy to perform so-called Roll to Roll production in which the first electrode 5 and the second electrode 9 are wound in a roll shape and both are extended in one direction and the above-described steps are continuously performed. The effect that the productivity of the sensitized solar cell 1B can be improved is obtained.

  Furthermore, in the electrode plate forming step, it is not necessary to determine the dimensions of the dye-sensitized solar cell 1B in advance and dispose the sealing material, and form the first electrode 5 and the second electrode 9 to extend them. After bonding in the existing direction, insulation, welding, and cutting can be performed simultaneously in the direction crossing the extending direction by ultrasonic vibration. Therefore, the dimensions of the dye-sensitized solar cell 1B in one direction are not restricted by the design of the first electrode 5 and the second electrode 9 formed in the electrode plate forming step, and the dye increase is performed when ultrasonic vibration is applied. The effect that the dimension of the sensitive solar cell 1B can be arbitrarily set is obtained.

  Further, according to the manufacturing method of the present embodiment, the electrolyte is applied or filled on the upper portion of the semiconductor layer 4 of the first electrode 5, and then the first electrode 5 and the second electrode 9 are disposed to face each other. It is also possible to make a single module, and then to insulate, weld, and cut the single module simultaneously by ultrasonic vibration to re-differentiate into a plurality of dye-sensitized solar cells 1B. By adopting such a method, automatic productivity is increased and productivity is further improved.

  In the present embodiment, the insulation, welding, and cutting in the direction crossing the extending direction L of the first electrode 5 and the second electrode 9 (that is, the width direction) are performed by applying ultrasonic vibration to the first substrate 2. The plate surfaces 2a, 6a facing each other and the second substrate 6 are brought into contact with each other and welded, and further cut locally by heating, but then the periphery of the dye-sensitized solar cell 1B including the cut portion. More preferably, a thermoplastic resin is disposed on the inner surface of the dye-sensitized solar cell 1B to improve the liquid-tightness.

Moreover, in this embodiment, you may insulate and weld the location which bonded the 1st electrode 5 and the 2nd electrode 9 with the sealing material 11 by ultrasonic vibration.
In the present embodiment, the first electrode 5 and the second electrode 9 are not subjected to the patterned process, but a plurality of patterns parallel to the longitudinal extension direction L so that the semiconductor layers 4 are arranged in parallel. (See FIG. 11B). A plurality of patterns may be connected in series or in parallel. Even in that case, the effect of the present invention that the alignment of the first electrode 5 and the second electrode 9 in the L direction in the film transport direction is unnecessary is achieved. Although FIG. 11B shows an embodiment in which three semiconductor layers 4 are arranged in parallel, the present invention is not limited to this, and the semiconductor layer 4 can be divided into a desired number of patterns. Moreover, an electrical module can be manufactured simply and efficiently by electrically connecting the divided cells.

  Furthermore, in the present embodiment, sealing, insulation, and cutting in the direction (that is, the width direction) intersecting the extending direction L of the first electrode 5 and the second electrode 9 are performed by applying ultrasonic vibration. The plate surfaces 2a and 6a facing each other between the substrate 2 and the second substrate 6 may be abutted, that is, insulated and welded, and then mechanically cut using the tip of the horn.

  Further, the welding method of the first electrode 5 and the second electrode 9 by applying the ultrasonic vibration shown in the first or second embodiment, the first electrode 5 and the second electrode 9 according to the third embodiment, The dye-sensitized solar cells 1A and 1B can also be manufactured by appropriately combining the insulating, welding, and cutting methods. For example, in the third embodiment, the first electrode 5 and the second electrode 9 are insulated, welded, and cut in units of cells C. However, the cells C and C are insulated and welded to form a dye-sensitized solar cell. Insulation, welding, and cutting between the first electrode 5 and the second electrode 9 may be performed for each battery 1B.

  Hereinafter, the present invention will be specifically described with reference to examples.

[Example 1]
A dye-sensitized solar cell similar to the dye-sensitized solar cell 1A of FIG. 1 was produced according to the following specifications.
<First electrode>
As the transparent electrode film, a 50 × 55 mm ITO-PEN film (manufactured by Oike Kogyo Co., Ltd.) in which indium tin oxide (ITO) was formed in advance on a PEN film by a sputtering method was used.
A TiO ₂ paste (manufactured by Solaronics (trade name: Solaronics DL)) was applied to the surface of the deposited ITO layer to a 40 mm square with an applicator (manufactured by Tester Sangyo Co., Ltd.), and 30 ° C. at 120 ° C. in an electric furnace. Heat and cure for minutes.
Thereafter, the dye (trade name: MK-2 manufactured by Soken Chemical Co., Ltd.) is dissolved in toluene (special grade toluene (dehydrated) manufactured by Kanto Chemical) so that the dye concentration is 0.02 mM to 0.5 mM. The substrate was immersed for 10 minutes. Thereafter, the substrate taken out of the solution was washed with ethanol and dried.

<Second electrode>
A 50 × 55 mm ITO-PEN film (manufactured by Oike Industry Co., Ltd.) in which indium tin oxide (ITO) was formed in advance on the PEN film by a sputtering method was used as the counter electrode film. Further, PEDOT / PSS (manufactured by SIGMA-ALDRICH) was formed as a catalyst layer on the ITO-PEN film.

<Encapsulant>
As the sealing material, a frame-shaped hot melt resin (manufactured by Tamapoly) having an outer shape of 52 mm × 52 mm and an inner shape of 42 mm × 42 mm was used.
[Separator arrangement]
The separator (HOP-6 manufactured by Hirose Paper Co., Ltd.) had a size of 52 mm × 52 mm so that the ITO film was completely covered except for the current extraction wiring portion.

<Division process>
The first electrode and the second electrode obtained as described above are laminated in the order of the first electrode, the hot melt resin, the separator, the hot melt resin, and the second electrode, with the TiO ₂ layer and the catalyst layer disposed opposite to each other. did. At this time, a 1 mm × 10 mm releasable resin sheet (a naflon sheet manufactured by AS ONE) was disposed between the second electrode and the hot melt resin at a position where a cell was formed.

Then, under the conditions of 120 ° C., 1.0 KN, 120 seconds, the three edges excluding the edge facing the edge where the release resin sheet was arranged were bonded by a hot press.
Then, using an ultrasonic welding machine (manufactured by Nippon Emerson), ultrasonic vibration of 40 kHz and 80 W was applied in a direction perpendicular to the edge so that the edge on which the release resin sheet was arranged was divided into four equal parts. (See FIG. 6).

<Series connection process>
A portion that was ultrasonically welded so as to straddle the adjacent cells at the uncured edge was cut out, a conductive material was inserted so that the adjacent electrode was conducted to the notched portion, and the uncured portion was hot pressed (Fig. 7AB).

<Liquid injection hole forming step>
Thereafter, the releasable resin sheet disposed in each cell was pulled out to obtain a joined body in which an electrolyte injection hole was formed (see FIG. 8).
<Liquid injection process>
The obtained joined body is fixed by attaching it to a folder, and vacuuming is performed in a state where the injection hole of the electrolytic solution is immersed in an electrolytic solution (Iodolyte AN-50 manufactured by Solaronics). Then, the electrolyte solution was injected into all the electrodes at the same time, and then the injection hole was hot-pressed and sealed, and the takeout wiring was attached to form a dye-sensitized solar cell.

[Comparative Example 1]
A dye-sensitized solar cell was produced in the same manner as in Example 1 except that the following steps were performed instead of the dividing step.
First, the laser processing of the first electrode and the second electrode was divided at the position P in FIG.
Then, a TiO ₂ electrode was printed in advance in a pattern divided by avoiding the portion P in FIG. A frame-shaped hot melt resin (manufactured by Tamapoly) having an outer shape of 52 mm × 52 mm and an inner shape of 42 mm × 7 mm arranged at intervals of 5 mm was used as a sealing material in the portion P of FIG. Further, a positioning step is provided when the first substrate and the second substrate are bonded together.

[Evaluation results]
Three sets each of Example 1 and Comparative Example 1 were prepared, and the dye-sensitized solar cells of Example 1 and Comparative Example 1 were placed under three sets of fluorescent lamps (450 lx) for power generation evaluation.

  Regarding the superiority in the process, in the case of Comparative Example 1, the patterning process and the sealing material arranging process of the transparent conductive film and the counter conductive film between adjacent cells are required separately, whereas in the case of Example 1 Since the patterning of the transparent conductive film and the counter conductive film and the welding of the patterned portions can be performed in one step and in one operation, the operation is facilitated and the number of steps is reduced compared to the comparative example.

  Further, in the case of Comparative Example 1, the transparent conductive film, the counter conductive film, and the catalyst layer must be intermittently applied between adjacent cells, whereas in the case of Example 1, the transparent conductive film, Since the conductive film and the catalyst layer can be applied continuously, the process of forming the transparent conductive film, the counter conductive film, and the catalyst layer is greatly simplified. The time required is greatly reduced.

  Regarding the alignment, in Comparative Example 1, the patterning position of the transparent conductive film and the counter conductive film, the arrangement position of the sealing material, and the arrangement position of the separator are simultaneously performed when the first electrode and the second electrode are bonded together. It was difficult to align accurately. However, in Example 1, in order to perform insulation treatment and welding between the cells after the first electrode and the second electrode are bonded together, the first electrode and the second electrode are bonded together by arranging the sealing material of the outer frame. This could be done easily by aligning only the position. In addition, since the patterning and welding of the transparent conductive film and the counter conductive film are simultaneously performed in one operation, accurate alignment can be easily performed.

  Moreover, the power generation evaluation of the dye-sensitized solar cell of Example 1 and Comparative Example 1 was performed. As a result, power generation was confirmed in all cases.

  As described above, according to the present invention, the transparent conductive film and the counter conductive film, which are problems in the production of the dye-sensitized solar cell, are subjected to the patterning and sealing process separately, and it is not necessary to perform elaborate bonding. It was confirmed that it is possible to easily produce a dye-sensitized solar cell capable of obtaining power generation performance equivalent to at least the dye-sensitized solar cell obtained in Comparative Example 1.

[Example 2]
Next, a dye-sensitized solar cell similar to the dye-sensitized solar cell 1B of FIG.
<First electrode>
Semiconductor particles are sprayed on the ITO-PEN film having a width of 300 mm and a length of 100 m on which the indium tin oxide (ITO) is formed in advance on the PEN by a sputtering method as a transparent electrode by using an aerosol deposition method (AD method). A 10 μm TiO ₂ layer was formed with a width of 270 mm. As the semiconductor particles, mixed powder in which anatase TiO ₂ particles having an average particle diameter of about 20 nm and about 200 nm were mixed at a weight ratio of 30:70 was used. The mixed powder was sprayed on the ITO-PEN film. The conditions of the AD method were as follows.
Deposition chamber atmosphere pressure 100Pa
Gas used for spraying: N ₂ gas, flow rate 6 L / min
Thereafter, the dye (trade name: MK-2 manufactured by Soken Chemical Co., Ltd.) is dissolved in toluene (special grade toluene (dehydrated) manufactured by Kanto Chemical Co., Ltd.) so that the dye concentration becomes 0.02 mM to 0.5 mM, and sprayed on the TiO2 layer in a spray form. And dried (60 ° C.) for dye staining.

<Second electrode>
PEDOT / PSS (SIGMA) as a catalyst layer on an ITO-PEN film (manufactured by Oike Kogyo Co., Ltd.) having a width of 300 mm and a length of 100 m, in which indium tin oxide (ITO) was formed in advance as a counter conductive film on a PEN film by sputtering. -Aldrich Corporation) was formed.

<Encapsulant>
The sealing material was arranged in a 5 mm wide strip at the substrate width direction end. This sealing material was arranged so as not to contact the semiconductor layer.

An electrolytic solution (Iodolyte 50, manufactured by Solaronics) is dropped on the surface of the TiO ₂ layer of the first electrode, and then the first electrode and the second electrode are combined with the TiO ₂ layer and PEDOT / PSS (manufactured by SIGMA-ALDRICH). Were placed opposite to each other, and the first electrode, hot melt resin, and second electrode were laminated in this order by the roll-to-roll method.
And it was made to adhere | attach by the hot press on 120 degreeC, 1KN, and 120 second conditions.

Three modules of rectangular dye-sensitized solar cells were obtained by performing insulation, welding, and cutting using ultrasonic fusion on a module having a predetermined length. The electrode performance was evaluated for each dye-sensitized solar cell.
[Evaluation results]
The dye-sensitized solar cell obtained in Example 2 was placed under a fluorescent lamp (450 lx), and power generation was evaluated.

  Regarding the superiority in the working process of the dye-sensitized solar cell, in the case of Example 2, since the film formation of the semiconductor layer and the like can be performed with one operation, the process of forming the semiconductor layer and the like is significantly more than conventional. The time required for the process of forming the first electrode and the second electrode is greatly reduced.

In addition, regarding the alignment, in the conventional method, when the first electrode and the second electrode are bonded, the patterning position of the transparent conductive film and the counter conductive film, the position of the sealing material, the position of the separator, At the same time, it was difficult to accurately align the positions. However, in Example 2, the first electrode and the second electrode were bonded to each other after the step of bonding the first electrode and the second electrode, and the module was welded, insulated, sealed, and further cut. Bonding with two electrodes could be easily performed without considering the alignment in the extending direction precisely. In addition, since the insulation, welding, and cutting of the transparent conductive film and the counter conductive film are simultaneously performed in one operation, accurate alignment with respect to one module can be easily performed.
Therefore, it was confirmed that the case of Example 2 was suitable for continuous production by so-called Roll to Roll, and it was confirmed that there was no problem with the sealing property of one dye-sensitized solar cell.

  Further, power generation evaluation of the dye-sensitized solar cell of Example 2 was performed. As a result, it was confirmed that power can be generated without a short circuit.

  As described above, according to the present invention, at least Comparative Example 1 can be achieved without performing elaborate bonding between the first electrode and the second electrode, which is a problem when producing a dye-sensitized solar cell so-called Roll to Roll. It was confirmed that it is possible to easily produce a dye-sensitized solar cell capable of obtaining power generation performance in the same manner as the dye-sensitized solar cell obtained by the above method.

1A, 1B Dye-sensitized solar cell (electric module)
2 first substrate 2a plate surface 2b back surface 3 transparent conductive film 4 semiconductor layer 5 first electrode 6 second substrate 6a plate surface 6b back surface 7 counter conductive film 9 second electrode 11 sealing material P where ultrasonic vibration is applied C cell

Claims (5)

A first electrode having a transparent conductive film formed on the plate surface of the first substrate and a semiconductor layer formed on the surface of the transparent conductive film, and a plate surface of the second substrate opposed to the transparent conductive film. In a method for manufacturing an electrical module comprising a second electrode on which a conductive film is formed and an electrolyte is sealed in a space formed between the first electrode and the second electrode,
A bonding step of bonding the first electrode and the second electrode with the transparent conductive film and the counter conductive film facing each other;
Ultrasonic vibration is applied from either the back surface of the first substrate on which the transparent conductive film is formed or the back surface of the second substrate on which the counter conductive film is formed, and this ultrasonic vibration is applied. The first substrate and the second substrate that are located at the same location are brought into contact with each other to insulate and insulate the first substrate and the second substrate, so that the first electrode and the second substrate are welded together. A method of manufacturing an electric module, comprising: a dividing step of dividing two electrodes.   One or a plurality of the transparent conductive film and the semiconductor layer continuously formed in the one direction are formed in the width direction of the first substrate on the plate surface of the first substrate extended in one direction in a band shape. The counter conductive film continuously formed in the one direction is formed in the width direction of the first substrate on the filmed first electrode and the plate surface of the second substrate extended in one direction in a strip shape. One or a plurality of the second electrodes formed in succession to each other are bonded to each other in the width direction, and ultrasonic vibration is applied to the bonded first electrode and the second electrode. 2. The first electrode and the second electrode are insulated and welded in a direction crossing the extending direction, and cut and divided for each unit divided and cut. Manufacturing method of electrical module.   The ultrasonic vibration is applied so that the first electrode and the second electrode are simultaneously covered over the entire portion to be insulated, welded and cut, and the portion to be insulated and welded is simultaneously insulated, welded and cut. The method of manufacturing an electric module according to claim 2, wherein A transparent conductive film is formed on the plate surface of the first substrate, a semiconductor layer is formed on the surface of the transparent conductive film, and a counter conductive film is provided on the second substrate so as to face the transparent conductive film. In an electric module comprising a second electrode formed and an electrolyte is filled in a space formed between the first electrode and the second electrode.
An electrical module, wherein the plate surface of the first substrate and the plate surface of the second substrate are in direct contact with each other and are insulated and welded by ultrasonic vibration.   A plurality of the semiconductor layers are formed in the width direction of the first substrate, and the plate surface of the first substrate and the plate surface of the second substrate are insulated by ultrasonic vibration in a direction intersecting the width direction. The electric module according to claim 4, wherein the electric module is welded.

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