JPWO2013114592A1 - 熱電変換素子およびその製造方法 - Google Patents
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Abstract
Description
11 真空容器
11A 排気ポート
11B プラズマガス導入ポート
12 ターゲット
12A ターゲット保持台
12B 高周波電源
12D ドーパント金属片
13 被処理基板
13A 基板保持台
22,22A.22B 第1電極
23F La,NbドープSTO薄膜
23F1,23F2,23F3,23F4 La,NbドープSTO薄膜パタ―ン
24 第2電極
41,42 加熱/冷却部
41A〜41D,42A〜42D 突起
図1は、第1の実施形態においてSTO薄膜を形成するのに使われるスパッタ装置10の構成を示す図である。なお本実施形態におけるSTO薄膜の形成は、図1のスパッタ装置10を使ったスパッタ法に限定されるものではなく、他のPVD法、例えばパルスレーザ堆積法などにより形成することも可能である。
図4には、前記STO薄膜23FにおいてLaのドープを行わず、Nbのドープのみを行った比較対照例を示すが、この場合には、STO薄膜の電気伝導度σが半分以下に低減しているのがわかる。これはB席のみにドープを行った結果、ABO3で表されるペロブスカイト型化合物の化学量論組成に対しA席とB席の間で原子数の均衡が崩れて欠陥が発生し、かかる欠陥によりキャリアが相殺されていることを示唆している。
図12Aおよび図12Bは、それぞれ第2の実施形態による熱電変換装置40の構成を示す断面図および平面図を示す。ただし図12Aは図12Bの平面図中、線A−A'に沿った断面を示している。
Claims (10)
- 基板と、
前記基板上に形成され、ペロブスカイト構造の化合物よりなる薄膜と、
前記基板上に設けられ、前記薄膜の上面に第1の領域においてコンタクトする第1の電極と、
前記薄膜の上面に前記第1の領域から離間した第2の領域においてコンタクトする第2の電極と、
前記薄膜を、前記第1の領域において加熱または冷却する第1の加熱または冷却部と、
前記薄膜を、前記第2の領域において加熱または冷却する第2の加熱または冷却部と、
を含み、
前記第2の加熱または冷却部は、前記第1の加熱または冷却部が前記薄膜の前記第2の領域を加熱する場合に前記薄膜の前記第1の領域を冷却し、
前記第2の加熱または冷却部は前記第1の加熱または冷却部が前記薄膜の前記第1の領域を冷却する場合に前記薄膜の前記第2の領域を加熱し、
前記薄膜中には、前記ペロブスカイト構造の化合物を構成する結晶中に、前記結晶とは異なる結晶方位の領域が形成されている熱電変換素子。 - 前記薄膜は(001)面方位のSrTiO3の単結晶薄膜であり、前記複数の領域は、(031)面方位を有することを特徴とする請求項1記載の熱電変換素子。
- 前記薄膜はSrTiO3の単結晶薄膜であり、熱伝導率κが2W/mK以下であることを特徴とする請求項1記載の熱電変換素子。
- 前記薄膜は、少なくともLa(ランタン)とNb(ニオブ)を、合計で20原子%以上の割合で含むことを特徴とする請求項3記載の熱電変換素子。
- 前記Laは前記ペロブスカイト構造のA席に入り、前記Nbは前記ペロブスカイト構造のB席に入ることを特徴とする請求項4記載の熱電変換素子。
- 前記薄膜は、Nbを25原子%以上の割合で含むことを特徴とする請求項3記載の熱電変換素子。
- 前記薄膜は酸素欠損を含み、1020cm−3〜1022cm−3の範囲のキャリア濃度を有していることを特徴とする請求項3記載の熱電変換素子。
- 基板上に形成され、ペロブスカイト構造の化合物よりなる薄膜を形成する工程と、
前記薄膜の上面に、第1の領域において第1の電極を形成する工程と、
前記薄膜の上面に、前記第1の領域から離間した第2の領域において第2の電極を形成する工程と、
前記第1の領域に加熱または冷却部を形成する工程と、
前記第2の領域に冷却または加熱部を形成する工程と、
を含み、
前記薄膜を形成する工程は、前記薄膜を構成する前記ペロブスカイト構造の化合物の結晶中に、前記結晶のマトリクスとは結晶方位の異なる領域が形成されるような濃度で、不純物元素をドープする工程を含むことを特徴とする熱電変換素子の製造方法。 - 前記ペロブスカイト構造の化合物は酸素欠損を含むチタン酸ストロンチウムであり、前記不純物元素はLa(ランタン)およびNb(ニオブ)であり、LaおよびNbは合計で20原子%以上の濃度でドープされることを特徴とする請求項8記載の熱電変換素子の製造方法。
- 前記ペロブスカイト構造の化合物は酸素欠損を含むチタン酸ストロンチウムであり、前記不純物元素はNb(ニオブ)であり、25原子%以上の濃度でドープされることを特徴とする請求項8記載の熱電変換素子の製造方法。
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KR101595309B1 (ko) * | 2014-11-28 | 2016-02-19 | (주)알에프트론 | 주석 금속 타겟을 이용한 주석산화물층의 형성 방법 |
WO2016129082A1 (ja) * | 2015-02-12 | 2016-08-18 | 株式会社日立製作所 | 薄膜熱電変換モジュールおよびその製造方法 |
JP7473112B2 (ja) | 2020-11-17 | 2024-04-23 | 国立大学法人東北大学 | 圧電体薄膜、圧電体薄膜の製造装置、圧電体薄膜の製造方法、および、疲労推定システム |
Citations (6)
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JPH10223476A (ja) * | 1997-02-07 | 1998-08-21 | Tdk Corp | 強誘電体薄膜およびその製造方法 |
WO2008109564A1 (en) * | 2007-03-02 | 2008-09-12 | The Regents Of The University Of California | Complex oxides useful for thermoelectric energy conversion |
JP2009062216A (ja) * | 2007-09-05 | 2009-03-26 | National Institute For Materials Science | 結晶成長用基板とこれを用いた結晶成長方法 |
JP2010165843A (ja) * | 2009-01-15 | 2010-07-29 | Sumitomo Chemical Co Ltd | 熱電変換モジュールの製造方法及び熱電変換モジュール |
WO2011065185A1 (ja) * | 2009-11-27 | 2011-06-03 | 富士通株式会社 | 熱電変換モジュール及びその製造方法 |
JP2011243824A (ja) * | 2010-05-20 | 2011-12-01 | Panasonic Corp | 異方的熱電材料とこれを用いた放射検出器および発電デバイス |
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JP2010161213A (ja) | 2009-01-08 | 2010-07-22 | Tokuyama Corp | 熱電変換材料およびその製造方法 |
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JPH10223476A (ja) * | 1997-02-07 | 1998-08-21 | Tdk Corp | 強誘電体薄膜およびその製造方法 |
WO2008109564A1 (en) * | 2007-03-02 | 2008-09-12 | The Regents Of The University Of California | Complex oxides useful for thermoelectric energy conversion |
JP2009062216A (ja) * | 2007-09-05 | 2009-03-26 | National Institute For Materials Science | 結晶成長用基板とこれを用いた結晶成長方法 |
JP2010165843A (ja) * | 2009-01-15 | 2010-07-29 | Sumitomo Chemical Co Ltd | 熱電変換モジュールの製造方法及び熱電変換モジュール |
WO2011065185A1 (ja) * | 2009-11-27 | 2011-06-03 | 富士通株式会社 | 熱電変換モジュール及びその製造方法 |
JP2011243824A (ja) * | 2010-05-20 | 2011-12-01 | Panasonic Corp | 異方的熱電材料とこれを用いた放射検出器および発電デバイス |
Non-Patent Citations (2)
Title |
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J. D. BANIECKI, M. ISHII, H. ASO, K. KOBAYASHI, K. KURIHARA, AND K. YAMANAKA: "Electronic Transport Behavior of Off-Stoichiometric La and Nb Doped SrxTiyO3-δ Epitaxial Thin Films", APPLIED PHYSICS LETTERS, JPN7015001006, 6 December 2011 (2011-12-06), US, ISSN: 0003053518 * |
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US20140338717A1 (en) | 2014-11-20 |
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