JPWO2011099501A1 - Curable composition, cured product and method of using curable composition - Google Patents
Curable composition, cured product and method of using curable composition Download PDFInfo
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- JPWO2011099501A1 JPWO2011099501A1 JP2011553855A JP2011553855A JPWO2011099501A1 JP WO2011099501 A1 JPWO2011099501 A1 JP WO2011099501A1 JP 2011553855 A JP2011553855 A JP 2011553855A JP 2011553855 A JP2011553855 A JP 2011553855A JP WO2011099501 A1 JPWO2011099501 A1 JP WO2011099501A1
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- Prior art keywords
- group
- curable composition
- silane compound
- optical element
- compound copolymer
- Prior art date
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- Granted
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- 239000000203 mixture Substances 0.000 title claims abstract description 110
- 238000000034 method Methods 0.000 title claims abstract description 30
- -1 alicyclic acid anhydride Chemical class 0.000 claims abstract description 113
- 229910000077 silane Inorganic materials 0.000 claims abstract description 108
- 229920001577 copolymer Polymers 0.000 claims abstract description 76
- 230000003287 optical effect Effects 0.000 claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 46
- 150000001875 compounds Chemical class 0.000 claims abstract description 44
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 22
- 239000004593 Epoxy Substances 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- 150000004756 silanes Chemical class 0.000 claims description 49
- 125000001424 substituent group Chemical group 0.000 claims description 29
- 125000004432 carbon atom Chemical group C* 0.000 claims description 28
- 125000000217 alkyl group Chemical group 0.000 claims description 20
- 239000003963 antioxidant agent Substances 0.000 claims description 18
- 125000005843 halogen group Chemical group 0.000 claims description 18
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 14
- 230000003078 antioxidant effect Effects 0.000 claims description 12
- 125000006239 protecting group Chemical group 0.000 claims description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 239000011574 phosphorus Substances 0.000 claims description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000005647 linker group Chemical group 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 37
- 239000008393 encapsulating agent Substances 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 43
- 238000004519 manufacturing process Methods 0.000 description 28
- 239000003822 epoxy resin Substances 0.000 description 25
- 229920000647 polyepoxide Polymers 0.000 description 25
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 238000001723 curing Methods 0.000 description 17
- 238000002834 transmittance Methods 0.000 description 16
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 238000010438 heat treatment Methods 0.000 description 13
- 238000002329 infrared spectrum Methods 0.000 description 12
- 239000002904 solvent Substances 0.000 description 12
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 125000002947 alkylene group Chemical group 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 238000009826 distribution Methods 0.000 description 11
- 229910018557 Si O Inorganic materials 0.000 description 10
- 125000004450 alkenylene group Chemical group 0.000 description 10
- 125000000732 arylene group Chemical group 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 10
- 125000001309 chloro group Chemical group Cl* 0.000 description 10
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 125000004419 alkynylene group Chemical group 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 229910052801 chlorine Inorganic materials 0.000 description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 125000002723 alicyclic group Chemical group 0.000 description 7
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 6
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 6
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 5
- FZTPAOAMKBXNSH-UHFFFAOYSA-N 3-trimethoxysilylpropyl acetate Chemical compound CO[Si](OC)(OC)CCCOC(C)=O FZTPAOAMKBXNSH-UHFFFAOYSA-N 0.000 description 5
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 5
- 125000001153 fluoro group Chemical group F* 0.000 description 5
- 239000004611 light stabiliser Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 5
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- KVUMYOWDFZAGPN-UHFFFAOYSA-N 3-trimethoxysilylpropanenitrile Chemical compound CO[Si](OC)(OC)CCC#N KVUMYOWDFZAGPN-UHFFFAOYSA-N 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000003377 acid catalyst Substances 0.000 description 4
- 125000003545 alkoxy group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 239000003085 diluting agent Substances 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 4
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 4
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 125000002252 acyl group Chemical group 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 229920000734 polysilsesquioxane polymer Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 3
- 235000017557 sodium bicarbonate Nutrition 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- FWHUTKPMCKSUCV-UHFFFAOYSA-N 1,3-dioxo-3a,4,5,6,7,7a-hexahydro-2-benzofuran-5-carboxylic acid Chemical compound C1C(C(=O)O)CCC2C(=O)OC(=O)C12 FWHUTKPMCKSUCV-UHFFFAOYSA-N 0.000 description 2
- HIGURUTWFKYJCH-UHFFFAOYSA-N 2-[[1-(oxiran-2-ylmethoxymethyl)cyclohexyl]methoxymethyl]oxirane Chemical compound C1OC1COCC1(COCC2OC2)CCCCC1 HIGURUTWFKYJCH-UHFFFAOYSA-N 0.000 description 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- QXBYUPMEYVDXIQ-UHFFFAOYSA-N 4-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound CC1CCCC2C(=O)OC(=O)C12 QXBYUPMEYVDXIQ-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 2
- 125000004414 alkyl thio group Chemical group 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 125000004705 ethylthio group Chemical group C(C)S* 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- 229910052740 iodine Inorganic materials 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- ZCSHNCUQKCANBX-UHFFFAOYSA-N lithium diisopropylamide Chemical compound [Li+].CC(C)[N-]C(C)C ZCSHNCUQKCANBX-UHFFFAOYSA-N 0.000 description 2
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 2
- 235000019341 magnesium sulphate Nutrition 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- DXGLGDHPHMLXJC-UHFFFAOYSA-N oxybenzone Chemical compound OC1=CC(OC)=CC=C1C(=O)C1=CC=CC=C1 DXGLGDHPHMLXJC-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 238000001226 reprecipitation Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- MFRIHAYPQRLWNB-UHFFFAOYSA-N sodium tert-butoxide Chemical compound [Na+].CC(C)(C)[O-] MFRIHAYPQRLWNB-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000002221 trityl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C([*])(C1=C(C(=C(C(=C1[H])[H])[H])[H])[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 2
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- ZESWBFKRPIRQCD-UHFFFAOYSA-N trimethoxy-(4-methoxyphenyl)silane Chemical compound COC1=CC=C([Si](OC)(OC)OC)C=C1 ZESWBFKRPIRQCD-UHFFFAOYSA-N 0.000 description 1
- YFFNIIAVGWYOQJ-UHFFFAOYSA-N trimethoxy-[3-(methoxymethoxy)propyl]silane Chemical compound COCOCCC[Si](OC)(OC)OC YFFNIIAVGWYOQJ-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- SAKLXMOLLSWVHU-UHFFFAOYSA-N trimethoxy-[3-[(2-methylpropan-2-yl)oxy]propyl]silane Chemical compound CO[Si](OC)(OC)CCCOC(C)(C)C SAKLXMOLLSWVHU-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- WGKLOLBTFWFKOD-UHFFFAOYSA-N tris(2-nonylphenyl) phosphite Chemical compound CCCCCCCCCC1=CC=CC=C1OP(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC WGKLOLBTFWFKOD-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Abstract
本発明は、(A)特定の繰り返し単位を有するシラン化合物共重合体、(B)エポキシ化合物、及び(C)カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物を含有する硬化剤を(A):〔(B)+(C)〕=100:20〜100:60の割合(質量比)で含有する硬化性組成物、該組成物を硬化してなる硬化物、並びに、該組成物を光素子固定材用接着剤及び光素子固定材用封止材として使用する方法に関する。本発明によれば、長期にわたり耐熱性、透明性に優れ、高温であっても高い接着力を有する硬化物が得られる硬化性組成物が提供される。The present invention contains (A) a silane compound copolymer having a specific repeating unit, (B) an epoxy compound, and (C) an alicyclic acid anhydride having a carboxyl group and other alicyclic acid anhydrides. A curable composition containing a curing agent (A): [(B) + (C)] = 100: 20 to 100: 60 (mass ratio), a cured product obtained by curing the composition, In addition, the present invention relates to a method of using the composition as an adhesive for an optical element fixing material and an encapsulant for an optical element fixing material. ADVANTAGE OF THE INVENTION According to this invention, the curable composition which is excellent in heat resistance and transparency over a long period of time, and can obtain the hardened | cured material which has high adhesive force even at high temperature is provided.
Description
本発明は、透明性及び耐熱性に優れ、かつ、高い接着力を有する硬化物が得られる硬化性組成物、該組成物を硬化してなる硬化物、並びに、該組成物を光素子固定材用接着剤又は光素子固定材用封止剤として使用する方法に関する。 The present invention relates to a curable composition from which a cured product having excellent transparency and heat resistance and high adhesive strength is obtained, a cured product obtained by curing the composition, and an optical element fixing material using the composition. The present invention relates to a method for use as an adhesive for optical devices or a sealant for optical element fixing materials.
これまで、硬化性組成物は、用途に応じて様々な改良がなされ、光学部品や成形体の原料、接着剤、コーティング剤等として産業上広く利用されてきている。例えば、透明性に優れる硬化物を形成する硬化性組成物は、光学部品の原料やコーティング剤として、また、高い接着力を有する硬化物を形成する硬化性組成物は、接着剤やコーティング剤として好ましく用いられることが多い。
また、近年、硬化性組成物は、光素子封止体を製造する際に、光素子固定材用接着剤や光素子固定材用封止剤等の光素子固定材用組成物としても利用されてきている。Until now, the curable composition has been improved in various ways depending on the application, and has been widely used industrially as a raw material, an adhesive, a coating agent, and the like for optical parts and molded articles. For example, a curable composition that forms a cured product having excellent transparency is used as a raw material or a coating agent for optical parts, and a curable composition that forms a cured product having high adhesive strength is used as an adhesive or a coating agent. It is often used preferably.
In recent years, curable compositions have also been used as compositions for optical element fixing materials, such as adhesives for optical element fixing materials and sealing agents for optical element fixing materials, when producing optical element sealing bodies. It is coming.
光素子には、半導体レーザー(LD)等の各種レーザーや発光ダイオード(LED)等の発光素子、受光素子、複合光素子、光集積回路等がある。近年においては、発光のピーク波長がより短波長である青色光や白色光の光素子が開発され広く使用されてきている。このような発光のピーク波長の短い発光素子の高輝度化が飛躍的に進み、これに伴い光素子の発熱量がさらに大きくなっていく傾向にある。 Examples of the optical element include various lasers such as a semiconductor laser (LD), light emitting elements such as a light emitting diode (LED), a light receiving element, a composite optical element, and an optical integrated circuit. In recent years, blue and white light optical elements having a shorter peak emission wavelength have been developed and widely used. Such a light emitting element with a short peak wavelength of light emission has been dramatically increased in brightness, and accordingly, the amount of heat generated by the optical element tends to be further increased.
ところが、近年における光素子の高輝度化に伴い、光素子固定材用組成物の硬化物が、より高いエネルギーの光や光素子から発生するより高温の熱に長時間さらされ、劣化してクラックが発生したり、剥離したりするという問題が生じた。 However, with the recent increase in brightness of optical elements, the cured product of the composition for optical element fixing materials is exposed to higher energy light and higher temperature heat generated from the optical element for a long time, and deteriorates and cracks. The problem of generating or peeling occurred.
この問題を解決するべく、特許文献1〜3において、ポリシルセスキオキサン化合物を主成分とする光素子固定材用組成物が提案されている。
しかしながら、特許文献1〜3に記載されたポリシルセスキオキサン化合物を主成分とする光素子固定材用組成物の硬化物であっても、十分な接着力を保ちつつ、耐熱性及び透明性を得るのは困難な場合があった。In order to solve this problem, Patent Documents 1 to 3 propose a composition for an optical element fixing material containing a polysilsesquioxane compound as a main component.
However, even if it is a cured product of the composition for optical element fixing materials mainly composed of the polysilsesquioxane compound described in Patent Documents 1 to 3, heat resistance and transparency are maintained while maintaining sufficient adhesive force. It was sometimes difficult to get.
また、光素子封止用に用いる組成物として、特許文献4には、脂環式エポキシ樹脂を用いるエポキシ樹脂組成物が、特許文献5には、ポリチオール化合物を含有するエポキシ樹脂組成物が提案されている。
しかしながら、これらの組成物を用いる場合であっても、経時変化に伴う十分な耐光劣化性を満足することができなかったり、接着力が低下する場合があった。
従って、耐熱性、透明性により優れ、高い接着力を有する硬化物が得られる硬化性組成物の開発が切望されている。Moreover, as a composition used for optical element sealing, Patent Document 4 proposes an epoxy resin composition using an alicyclic epoxy resin, and Patent Document 5 proposes an epoxy resin composition containing a polythiol compound. ing.
However, even when these compositions are used, there is a case where sufficient light deterioration resistance accompanying a change with time cannot be satisfied or the adhesive force is lowered.
Therefore, development of a curable composition that is superior in heat resistance and transparency and that can provide a cured product having high adhesive force is eagerly desired.
本発明は、かかる従来技術の実情に鑑みてなされたものであり、耐熱性及び透明性に優れ、かつ、高い接着力を有する硬化物が得られる硬化性組成物、該組成物を硬化してなる硬化物、並びに、該組成物を光素子固定材用接着剤又は光素子固定材用封止剤として使用する方法を提供することを課題とする。 The present invention has been made in view of the situation of such prior art, and is a curable composition that is excellent in heat resistance and transparency, and that can obtain a cured product having high adhesive strength, and curing the composition. It is an object of the present invention to provide a cured product and a method of using the composition as an adhesive for optical element fixing materials or an encapsulant for optical element fixing materials.
本発明者らは上記課題を解決すべく鋭意研究を重ねた結果、(A)特定のシラン化合物共重合体、(B)エポキシ化合物、及び(C)カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物を含有する組成物の硬化物は、長期にわたって優れた透明性、耐熱性を保ちつつ、かつ、高温においても高い接着力を有する硬化物となることを見出し、本発明を完成するに至った。 As a result of intensive studies to solve the above problems, the present inventors have obtained (A) a specific silane compound copolymer, (B) an epoxy compound, and (C) an alicyclic acid anhydride having a carboxyl group, A cured product of a composition containing other alicyclic acid anhydrides has been found to be a cured product having high adhesive strength even at high temperatures while maintaining excellent transparency and heat resistance over a long period of time. The invention has been completed.
かくして本発明の第1によれば、下記〔1〕〜〔8〕の硬化性組成物が提供される。
〔1〕(A)分子内に、下記式(i)、(ii)及び(iii)Thus, according to the first aspect of the present invention, the following curable compositions [1] to [8] are provided.
[1] (A) In the molecule, the following formulas (i), (ii) and (iii)
〔式中、R1は水素原子又は炭素数1〜6のアルキル基を表し、X0はハロゲン原子、シアノ基又は式:OGで表される基(式中、Gは水酸基の保護基を表す。)を表し、Dは単結合又は連結基を表す。R2は炭素数1〜20のアルキル基又は置換基を有していてもよいフェニル基を表す。〕
で表される繰り返し単位のうち、(i)及び(ii)、(i)及び(iii)、(ii)及び(iii)、又は(i)、(ii)及び(iii)の繰り返し単位を有し、重量平均分子量が、1,000〜30,000であるシラン化合物共重合体、(B)エポキシ化合物、及び(C)カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物を含有する硬化剤を、(A)と〔(B)+(C)〕の質量比で、(A):〔(B)+(C)〕=100:20〜100:60の割合で含有する硬化性組成物。[Wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X 0 represents a halogen atom, a cyano group or a group represented by the formula: OG (wherein G represents a protecting group for a hydroxyl group) D) represents a single bond or a linking group. R 2 represents an alkyl group having 1 to 20 carbon atoms or a phenyl group which may have a substituent. ]
(I) and (ii), (i) and (iii), (ii) and (iii), or (i), (ii) and (iii) having repeating units A silane compound copolymer having a weight average molecular weight of 1,000 to 30,000, (B) an epoxy compound, and (C) an alicyclic acid anhydride having a carboxyl group and other alicyclic acid anhydrides. The curing agent containing the product is (A): [(B) + (C)] = 100: 20 to 100: 60 in a mass ratio of (A) to [(B) + (C)]. A curable composition to contain.
〔2〕前記(A)のシラン化合物共重合体が、式:R1−CH(X0)−D−で表される基の存在量(〔R1−CH(X0)−D〕)とR2の存在量(〔R2〕)のモル比で、〔R1−CH(X0)−D〕:〔R2〕=55:45〜25:75のシラン化合物共重合体である〔1〕に記載の硬化性組成物。[2] The abundance of a group represented by the formula: R 1 —CH (X 0 ) —D— ([R 1 —CH (X 0 ) —D]) Is a silane compound copolymer of [R 1 —CH (X 0 ) —D]: [R 2 ] = 55: 45 to 25:75 in a molar ratio of the abundance of R 2 and R 2 ([R 2 ]). [1] The curable composition according to [1].
〔3〕(A’)式(1):R1−CH(X0)−D−Si(OR3)p(X1)3−p
〔式中、R1は水素原子又は炭素数1〜6のアルキル基を表し、X0はハロゲン原子、シアノ基又は式:OGで表される基(式中、Gは水酸基の保護基を表す。)を表し、Dは単結合又は連結基を表す。R3は炭素数1〜6のアルキル基を表し、X1はハロゲン原子を表し、pは0〜3の整数を表す。〕
で表されるシラン化合物(1)の少なくとも一種、及び
式(2):R2Si(OR4)q(X2)3−q
(式中、R2は炭素数1〜20のアルキル基又は置換基を有していてもよいフェニル基を表し、R4は炭素数1〜6のアルキル基を表し、X2はハロゲン原子を表し、qは0〜3の整数を表す。)
で表されるシラン化合物(2)の少なくとも一種を含むシラン化合物の混合物を縮合させて得られる、重量平均分子量が1,000〜30,000であるシラン化合物共重合体、(B)エポキシ化合物、及び(C)カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物を含有する硬化剤を、(A’)と〔(B)+(C)〕の質量比で、(A’):〔(B)+(C)〕=100:20〜100:60の割合で含有する硬化性組成物。[3] (A ′) Formula (1): R 1 —CH (X 0 ) —D—Si (OR 3 ) p (X 1 ) 3-p
[Wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X 0 represents a halogen atom, a cyano group or a group represented by the formula: OG (wherein G represents a protecting group for a hydroxyl group) D) represents a single bond or a linking group. R 3 represents an alkyl group having 1 to 6 carbon atoms, X 1 represents a halogen atom, and p represents an integer of 0 to 3. ]
And at least one of the silane compounds (1) represented by formula (2): R 2 Si (OR 4 ) q (X 2 ) 3-q
(In the formula, R 2 represents an alkyl group having 1 to 20 carbon atoms or an optionally substituted phenyl group, R 4 represents an alkyl group having 1 to 6 carbon atoms, and X 2 represents a halogen atom. Q represents an integer of 0 to 3.)
A silane compound copolymer having a weight average molecular weight of 1,000 to 30,000, obtained by condensing a mixture of silane compounds containing at least one of the silane compounds (2) represented by: (B) an epoxy compound, And (C) a curing agent containing an alicyclic acid anhydride having a carboxyl group and another alicyclic acid anhydride in a mass ratio of (A ′) and [(B) + (C)] ( A ′): [(B) + (C)] = 100: 20 to 100: 60 The curable composition to be contained.
〔4〕前記(A’)のシラン化合物共重合体が、シラン化合物(1)とシラン化合物(2)とを、モル比で、〔シラン化合物(1)〕:〔シラン化合物(2)〕=55:45〜25:75の割合で縮合させて得られるシラン化合物共重合体である〔3〕に記載の硬化性組成物。 [4] The silane compound copolymer of (A ′) described above has a molar ratio of silane compound (1) and silane compound (2): [silane compound (1)]: [silane compound (2)] = The curable composition according to [3], which is a silane compound copolymer obtained by condensation at a ratio of 55:45 to 25:75.
〔5〕前記(C)の硬化剤の質量比が、(カルボキシル基を有する脂環式酸無水物):(その他の脂環式酸無水物)=50:50〜10:90である〔1〕又は〔3〕に記載の硬化性組成物。 [5] The mass ratio of the curing agent (C) is (an alicyclic acid anhydride having a carboxyl group): (other alicyclic acid anhydride) = 50: 50 to 10:90 [1. ] Or the curable composition as described in [3].
〔6〕さらに酸化防止剤を含む〔1〕又は〔3〕に記載の硬化性組成物。
〔7〕酸化防止剤がリン系の酸化防止剤である〔6〕に記載の硬化性組成物。
〔8〕光素子固定材用組成物である〔1〕又は〔3〕に記載の硬化性組成物。[6] The curable composition according to [1] or [3], further comprising an antioxidant.
[7] The curable composition according to [6], wherein the antioxidant is a phosphorus-based antioxidant.
[8] The curable composition according to [1] or [3], which is a composition for an optical element fixing material.
本発明の第2によれば、下記〔9〕、〔10〕の硬化物が提供される。
〔9〕〔1〕又は〔3〕に記載の硬化性組成物を硬化してなる硬化物。
〔10〕光素子固定材である〔9〕に記載の硬化物。According to the second aspect of the present invention, the following [9] and [10] cured products are provided.
[9] A cured product obtained by curing the curable composition according to [1] or [3].
[10] The cured product according to [9], which is an optical element fixing material.
本発明の第3によれば、下記〔11〕、〔12〕の、本発明の硬化性組成物を使用する方法が提供される。
〔11〕〔1〕又は〔3〕に記載の硬化性組成物を、光素子固定材用接着剤として使用する方法。
〔12〕〔1〕又は〔3〕に記載の硬化性組成物を、光素子固定材用封止剤として使用する方法。According to the third aspect of the present invention, there is provided a method of using the curable composition of the present invention of the following [11] and [12].
[11] A method of using the curable composition according to [1] or [3] as an adhesive for an optical element fixing material.
[12] A method of using the curable composition according to [1] or [3] as a sealant for an optical element fixing material.
本発明の硬化性組成物によれば、高エネルギーの光が照射される場合や高温状態であっても、着色して透明性が低下したりすることがなく、長期にわたって優れた透明性を有し、かつ、高温においても高い接着力を有する硬化物を得ることができる。
本発明の硬化性組成物は、光素子固定材を形成する際に使用することができ、特に、光素子固定材用接着剤、及び光素子固定材用封止剤として好適に使用することができる。According to the curable composition of the present invention, even when irradiated with high energy light or in a high temperature state, it does not color and does not deteriorate transparency, and has excellent transparency over a long period of time. In addition, a cured product having a high adhesive force even at a high temperature can be obtained.
The curable composition of the present invention can be used when forming an optical element fixing material, and particularly preferably used as an optical element fixing material adhesive and an optical element fixing material sealing agent. it can.
以下、本発明を、1)硬化性組成物、2)硬化物、及び、3)硬化性組成物の使用方法、に項分けして詳細に説明する。
1)硬化性組成物
本発明の硬化性組成物は、
(A)分子内に、下記式(i)、(ii)及び(iii)Hereinafter, the present invention will be described in detail by dividing it into 1) a curable composition, 2) a cured product, and 3) a method of using the curable composition.
1) Curable composition The curable composition of the present invention comprises:
(A) In the molecule, the following formulas (i), (ii) and (iii)
で表される繰り返し単位のうち、(i)及び(ii)、(i)及び(iii)、(ii)及び(iii)、又は(i)、(ii)及び(iii)の繰り返し単位を有し、重量平均分子量が、1,000〜30,000であるシラン化合物共重合体、(B)エポキシ化合物、及び(C)カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物を含有する硬化剤を、(A)と〔(B)+(C)〕の質量比で、(A):〔(B)+(C)〕=100:20〜100:60の割合で含有することを特徴とする。 (I) and (ii), (i) and (iii), (ii) and (iii), or (i), (ii) and (iii) having repeating units A silane compound copolymer having a weight average molecular weight of 1,000 to 30,000, (B) an epoxy compound, and (C) an alicyclic acid anhydride having a carboxyl group and other alicyclic acid anhydrides. The curing agent containing the product is (A): [(B) + (C)] = 100: 20 to 100: 60 in a mass ratio of (A) to [(B) + (C)]. It is characterized by containing.
(A)シラン化合物共重合体
本発明の硬化性組成物は、(A)成分として、前記式(i)、(ii)及び(iii)で表される繰り返し単位のうち、(i)及び(ii)、(i)及び(iii)、(ii)及び(iii)、又は(i)、(ii)及び(iii)の繰り返し単位を有し、重量平均分子量が、1,000〜30,000であるシラン化合物共重合体(以下、「シラン化合物共重合体(A)」ということがある。)を含有する。
シラン化合物共重合体(A)は、(i)、(ii)、(iii)で表される繰り返し単位をそれぞれ一種有していてもよく、二種以上有していてもよい。(A) Silane compound copolymer The curable composition of the present invention comprises (i) and (i) of the repeating units represented by the formulas (i), (ii) and (iii) as the component (A). having a repeating unit of ii), (i) and (iii), (ii) and (iii), or (i), (ii) and (iii), and having a weight average molecular weight of 1,000 to 30,000 A silane compound copolymer (hereinafter sometimes referred to as “silane compound copolymer (A)”).
The silane compound copolymer (A) may have one type of repeating unit represented by (i), (ii), or (iii), or may have two or more types.
式(i)〜(iii)中、R1は、水素原子又は炭素数1〜6のアルキル基を表し、水素原子が好ましい。
R1で表される炭素数1〜6のアルキル基としては、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、t−ブチル基、i−ブチル基、s−ブチル基、n−ペンチル基、n−ヘキシル基等が挙げられる。In formulas (i) to (iii), R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and is preferably a hydrogen atom.
Examples of the alkyl group having 1 to 6 carbon atoms represented by R 1 include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, t-butyl group, i-butyl group, s- A butyl group, n-pentyl group, n-hexyl group, etc. are mentioned.
X0は、フッ素原子、塩素原子、臭素原子、ヨウ素原子等のハロゲン原子;シアノ基;又は式:OGで表される基;を表す。X 0 represents a halogen atom such as a fluorine atom, a chlorine atom, a bromine atom or an iodine atom; a cyano group; or a group represented by the formula: OG.
Gは水酸基の保護基を表す。水酸基の保護基としては、特に制約はなく、水酸基の保護基として知られている公知の保護基が挙げられる。例えば、アシル系の保護基;トリメチルシリル基、トリエチルシリル基、t−ブチルジメチルシリル基、t−ブチルジフェニルシリル基等のシリル系の保護基;メトキシメチル基、メトキシエトキシメチル基、1−エトキシエチル基、テトラヒドロピラン−2−イル基、テトラヒドロフラン−2−イル基等のアセタール系の保護基;t−ブトキシカルボニル基等のアルコキシカルボニル系の保護基;メチル基、エチル基、t−ブチル基、オクチル基、アリル基、トリフェニルメチル基、ベンジル基、p−メトキシベンジル基、フルオレニル基、トリチル基、ベンズヒドリル基等のエーテル系の保護基;等が挙げられる。これらの中でも、Gとしては、アシル系の保護基が好ましい。 G represents a hydroxyl-protecting group. There is no restriction | limiting in particular as a hydroxyl-protecting group, The well-known protecting group known as a hydroxyl-protecting group is mentioned. For example, acyl protecting groups; silyl protecting groups such as trimethylsilyl group, triethylsilyl group, t-butyldimethylsilyl group, t-butyldiphenylsilyl group; methoxymethyl group, methoxyethoxymethyl group, 1-ethoxyethyl group An acetal type protective group such as tetrahydropyran-2-yl group or tetrahydrofuran-2-yl group; an alkoxycarbonyl type protective group such as t-butoxycarbonyl group; a methyl group, an ethyl group, a t-butyl group or an octyl group , Ether-based protecting groups such as allyl group, triphenylmethyl group, benzyl group, p-methoxybenzyl group, fluorenyl group, trityl group and benzhydryl group; Among these, as G, an acyl-type protecting group is preferable.
アシル系の保護基は、具体的には、式:−C(=O)R5で表される基である。式中、R5は、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、i−ブチル基、s−ブチル基、t−ブチル基、n−ペンチル基等の炭素数1〜6のアルキル基;又は置換基を有していてもよいフェニル基を表す。Specifically, the acyl-based protecting group is a group represented by the formula: —C (═O) R 5 . In the formula, R 5 represents carbon such as methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, s-butyl group, t-butyl group, and n-pentyl group. An alkyl group of 1 to 6; or a phenyl group which may have a substituent.
R5で表される置換基を有していてもよいフェニル基の置換基としては、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、s−ブチル基、i−ブチル基、t−ブチル基、n−ペンチル基、n−ヘキシル基、n−ヘプチル基、n−オクチル基、i−オクチル基等のアルキル基;フッ素原子、塩素原子、臭素原子等のハロゲン原子;メトキシ基、エトキシ基等のアルコキシ基;が挙げられる。Examples of the substituent of the phenyl group which may have a substituent represented by R 5 include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, s-butyl group, i -Alkyl groups such as butyl, t-butyl, n-pentyl, n-hexyl, n-heptyl, n-octyl and i-octyl; halogen atoms such as fluorine, chlorine and bromine An alkoxy group such as a methoxy group or an ethoxy group;
これらの中でも、X0としては、入手容易性、及び、高い接着力を有する硬化物が得られることから、塩素原子、式:OG’で表される基(式中、G’はアシル系の保護基を表す。)、及びシアノ基から選ばれる基が好ましく、塩素原子、アセトキシ基及びシアノ基から選ばれる基がより好ましく、アセトキシ基が特に好ましい。Among these, as X 0, since it is easy to obtain and a cured product having high adhesive strength is obtained, a chlorine atom, a group represented by the formula: OG ′ (wherein G ′ is an acyl group) And a group selected from a cyano group, a group selected from a chlorine atom, an acetoxy group and a cyano group is more preferable, and an acetoxy group is particularly preferable.
Dは単結合又は連結基を表す。
連結基としては置換基を有していてもよい2価の有機基が挙げられる。当該有機基の炭素数は1〜20が好ましく、1〜10がより好ましい。
置換基を有していてもよい2価の有機基としては、例えば、置換基を有していてもよいアルキレン基、置換基を有していてもよいアルケニレン基、置換基を有していてもよいアルキニレン基、置換基を有していてもよいアリーレン基、置換基を有していてもよい(アルキレン基、アルケニレン基、又はアルキニレン基)と置換基を有していてもよいアリーレン基との組み合わせからなる2価の基等が挙げられる。D represents a single bond or a linking group.
Examples of the linking group include a divalent organic group that may have a substituent. 1-20 are preferable and, as for carbon number of the said organic group, 1-10 are more preferable.
Examples of the divalent organic group that may have a substituent include an alkylene group that may have a substituent, an alkenylene group that may have a substituent, and a substituent. An alkynylene group which may have a substituent, an arylene group which may have a substituent, an arylene group which may have a substituent (an alkylene group, an alkenylene group or an alkynylene group) and an arylene group which may have a substituent; And a divalent group consisting of the above-mentioned combinations.
置換基を有していてもよいアルキレン基のアルキレン基としては、メチレン基、エチレン基、プロピレン基、トリメチレン基、テトラメチレン基、ペンタメチレン基、ヘキサメチレン基等の炭素数1〜20、好ましくは炭素数1〜10のアルキレン基が挙げられる。
置換基を有していてもよいアルケニレン基のアルケニレン基としては、ビニレン基、プロペニレン基、ブテニレン基、ペンテニレン基等の炭素数2〜20のアルケニレン基、好ましくは、炭素数2〜10のアルケニレン基が挙げられる。
置換基を有していてもよいアルキニレン基のアルキニレン基としては、エチニレン基、プロピニレン基等の炭素数2〜20のアルキニレン基、好ましくは炭素数2〜10のアルキニレン基が挙げられる。
置換基を有していてもよいアリーレン基のアリーレン基としては、o−フェニレン基、m−フェニレン基、p−フェニレン基、2,6−ナフチレン基等の炭素数6〜20のアリーレン基、好ましくは炭素数6〜10のアリーレン基が挙げられる。As the alkylene group of the alkylene group which may have a substituent, a methylene group, an ethylene group, a propylene group, a trimethylene group, a tetramethylene group, a pentamethylene group, a hexamethylene group, or the like, preferably 1 to 20 carbon atoms, Examples include an alkylene group having 1 to 10 carbon atoms.
The alkenylene group of the alkenylene group which may have a substituent is an alkenylene group having 2 to 20 carbon atoms such as a vinylene group, propenylene group, butenylene group or pentenylene group, preferably an alkenylene group having 2 to 10 carbon atoms. Is mentioned.
Examples of the alkynylene group which may have a substituent include alkynylene groups having 2 to 20 carbon atoms such as ethynylene group and propynylene group, preferably alkynylene groups having 2 to 10 carbon atoms.
As the arylene group of the arylene group which may have a substituent, an arylene group having 6 to 20 carbon atoms such as an o-phenylene group, an m-phenylene group, a p-phenylene group, or a 2,6-naphthylene group, preferably Includes an arylene group having 6 to 10 carbon atoms.
前記アルキレン基、アルケニレン基、及びアルキニレン基の置換基としては、フッ素原子、塩素原子等のハロゲン原子;メトキシ基、エトキシ基等のアルコキシ基;メチルチオ基、エチルチオ基等のアルキルチオ基;メトキシカルボニル基、エトキシカルボニル基等のアルコキシカルボニル基;等が挙げられる。 Examples of the substituent for the alkylene group, alkenylene group, and alkynylene group include a halogen atom such as a fluorine atom and a chlorine atom; an alkoxy group such as a methoxy group and an ethoxy group; an alkylthio group such as a methylthio group and an ethylthio group; a methoxycarbonyl group; An alkoxycarbonyl group such as an ethoxycarbonyl group; and the like.
前記アリーレン基の置換基としては、シアノ基;ニトロ基;フッ素原子、塩素原子、臭素原子等のハロゲン原子;メチル基、エチル基等のアルキル基;メトキシ基、エトキシ基等のアルコキシ基;メチルチオ基、エチルチオ基等のアルキルチオ基;等が挙げられる。
これらの置換基は、アルキレン基、アルケニレン基、アルキニレン基及びアリーレン基等の基において任意の位置に結合していてよく、同一若しくは相異なって複数個が結合していてもよい。Examples of the substituent for the arylene group include: a cyano group; a nitro group; a halogen atom such as a fluorine atom, a chlorine atom and a bromine atom; an alkyl group such as a methyl group and an ethyl group; an alkoxy group such as a methoxy group and an ethoxy group; And alkylthio groups such as ethylthio group; and the like.
These substituents may be bonded at arbitrary positions in groups such as an alkylene group, an alkenylene group, an alkynylene group, and an arylene group, and a plurality of them may be bonded in the same or different manner.
置換基を有していてもよい(アルキレン基、アルケニレン基、又はアルキニレン基)と置換基を有していてもよいアリーレン基との組み合わせからなる2価の基としては、前記置換基を有していてもよい(アルキレン基、アルケニレン基、又はアルキニレン基)の少なくとも一種と、前記置換基を有していてもよいアリーレン基の少なくとも一種とが直列に結合した基が挙げられる。具体的には、下記式で表される基が挙げられる。 The divalent group consisting of a combination of an optionally substituted (alkylene group, alkenylene group, or alkynylene group) and an optionally substituted arylene group has the above substituents. And a group in which at least one kind of (alkylene group, alkenylene group, or alkynylene group) which may be present and at least one kind of arylene group which may have the substituent are bonded in series. Specific examples include groups represented by the following formula.
これらの中でも、Dとしては、高い接着力を有する硬化物が得られることから、炭素数1〜10のアルキレン基が好ましく、炭素数1〜6のアルキレン基がより好ましく、メチレン基又はエチレン基が特に好ましい。 Among these, D is preferably an alkylene group having 1 to 10 carbon atoms, more preferably an alkylene group having 1 to 6 carbon atoms, and a methylene group or an ethylene group, because a cured product having high adhesive strength is obtained. Particularly preferred.
式(ii)〜(iii)中、R2は、炭素数1〜20のアルキル基又は置換基を有していてもよいフェニル基を表す。
R2で表される炭素数1〜20のアルキル基としては、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、s−ブチル基、i−ブチル基、t−ブチル基、n−ペンチル基、n−ヘキシル基、n−オクチル基、i−オクチル基、n−ノニル基、n−デシル基、n−ドデシル基等が挙げられる。In formulas (ii) to (iii), R 2 represents an alkyl group having 1 to 20 carbon atoms or an optionally substituted phenyl group.
Examples of the alkyl group having 1 to 20 carbon atoms represented by R 2 include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, s-butyl group, i-butyl group, t- A butyl group, n-pentyl group, n-hexyl group, n-octyl group, i-octyl group, n-nonyl group, n-decyl group, n-dodecyl group and the like can be mentioned.
R2で表される置換基を有していてもよいフェニル基の置換基としては、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、s−ブチル基、i−ブチル基、t−ブチル基、n−ペンチル基、n−ヘキシル基、n−ヘプチル基、n−オクチル基、i−オクチル基等のアルキル基;メトキシ基、エトキシ基等のアルコキシ基;フッ素原子、塩素原子等のハロゲン原子等が挙げられる。Examples of the substituent of the phenyl group which may have a substituent represented by R 2 include methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, s-butyl group, i -Alkyl groups such as butyl group, t-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group and i-octyl group; alkoxy groups such as methoxy group and ethoxy group; fluorine atom And halogen atoms such as chlorine atom.
R2で表される置換基を有していてもよいフェニル基の具体例としては、フェニル基、2−クロロフェニル基、4−メチルフェニル基、3−エチルフェニル基、2,4−ジメチルフェニル基、2−メトキシフェニル基等が挙げられる。Specific examples of the phenyl group optionally having a substituent represented by R 2 include a phenyl group, a 2-chlorophenyl group, a 4-methylphenyl group, a 3-ethylphenyl group, and a 2,4-dimethylphenyl group. , 2-methoxyphenyl group and the like.
シラン化合物共重合体(A)においては、式:R1−CH(X0)−D−で表される基の存在量(〔R1−CH(X0)−D〕)とR2の存在量(〔R2〕)のモル比が、〔R1−CH(X0)−D〕:〔R2〕=55:45〜25:75が好ましい。当該範囲内であることで、得られる硬化物は透明性及び接着性に優れ、かつ、耐熱性に優れるため高温に置いた後であってもこれらの性質の低下が抑えられる。
式:R1−CH(X0)−D−で表される基及びR2の存在量は、例えば、シラン化合物共重合体(A)のNMRスペクトルを測定して定量することができる。In the silane compound copolymer (A), the amount of the group represented by the formula: R 1 —CH (X 0 ) —D— ([R 1 —CH (X 0 ) —D]) and R 2 The molar ratio of the abundance ([R 2 ]) is preferably [R 1 —CH (X 0 ) —D]: [R 2 ] = 55: 45 to 25:75. By being in the said range, since the obtained hardened | cured material is excellent in transparency and adhesiveness, and is excellent in heat resistance, even after it sets | places on high temperature, the fall of these characteristics is suppressed.
The abundance of the group represented by the formula: R 1 —CH (X 0 ) —D— and R 2 can be quantified by measuring the NMR spectrum of the silane compound copolymer (A), for example.
シラン化合物共重合体(A)の単位構造配列は特に限定されず、ランダム共重合体、ブロック共重合体、グラフト共重合体、交互共重合体等が挙げられるが、ランダム共重合体が特に好ましい。 The unit structure arrangement of the silane compound copolymer (A) is not particularly limited, and examples thereof include a random copolymer, a block copolymer, a graft copolymer, and an alternating copolymer. A random copolymer is particularly preferable. .
シラン化合物共重合体(A)の重量平均分子量(Mw)は、1,000〜30,000の範囲であり、好ましくは1,500〜6,000の範囲である。当該範囲内にあることで、組成物の取扱性に優れ、かつ、接着性、耐熱性に優れる硬化物が得られる。重量平均分子量(Mw)は、例えば、テトラヒドロフラン(THF)を溶媒とするゲル・パーミエーション・クロマトグラフィー(GPC)による標準ポリスチレン換算値として求めることができる。 The weight average molecular weight (Mw) of the silane compound copolymer (A) is in the range of 1,000 to 30,000, preferably in the range of 1,500 to 6,000. By being in the said range, the hardened | cured material which is excellent in the handleability of a composition, and excellent in adhesiveness and heat resistance is obtained. A weight average molecular weight (Mw) can be calculated | required as a standard polystyrene conversion value by the gel permeation chromatography (GPC) which uses tetrahydrofuran (THF) as a solvent, for example.
シラン化合物共重合体(A)の分子量分布(Mw/Mn)は、特に制限されないが、通常1.0〜3.0好ましくは1.1〜2.0の範囲である。当該範囲内にあることで、接着性、耐熱性に優れる硬化物が得られる。 The molecular weight distribution (Mw / Mn) of the silane compound copolymer (A) is not particularly limited, but is usually 1.0 to 3.0, preferably 1.1 to 2.0. By being in the said range, the hardened | cured material which is excellent in adhesiveness and heat resistance is obtained.
シラン化合物共重合体(A)は一種単独で、あるいは二種以上を組み合わせて用いることができる。 A silane compound copolymer (A) can be used individually by 1 type or in combination of 2 or more types.
シラン化合物共重合体(A)は、ラダー型構造のポリシルセスキオキサン化合物である。
シラン化合物共重合体がラダー型構造を有していることは、例えば、反応生成物の赤外線吸収スペクトル測定、X線回折測定、NMR測定を行うことによって確認することができる。The silane compound copolymer (A) is a ladder-type polysilsesquioxane compound.
The fact that the silane compound copolymer has a ladder structure can be confirmed, for example, by performing infrared absorption spectrum measurement, X-ray diffraction measurement, and NMR measurement of the reaction product.
本発明の硬化性組成物においては、前記(A)成分のシラン化合物共重合体(A)が、式(1):R1−CH(X0)−D−Si(OR3)p(X1)3−p
で表されるシラン化合物(1)の少なくとも一種、及び、
式(2):R2Si(OR4)q(X2)3−q
で表されるシラン化合物(2)の少なくとも一種を含むシラン化合物の混合物を縮合させて得られる、重量平均分子量が1,000〜30,000であるシラン化合物共重合体(以下、「シラン化合物共重合体(A’)」ということがある。)であってもよく、シラン化合物共重合体(A)が、シラン化合物共重合体(A’)であることが好ましい。In the curable composition of the present invention, the silane compound copolymer (A) as the component (A) has the formula (1): R 1 —CH (X 0 ) —D—Si (OR 3 ) p (X 1 ) 3-p
At least one of silane compounds (1) represented by:
Equation (2): R 2 Si ( OR 4) q (X 2) 3-q
A silane compound copolymer having a weight average molecular weight of 1,000 to 30,000 obtained by condensing a mixture of silane compounds containing at least one of the silane compounds (2) represented by Polymer (A ′) ”), and the silane compound copolymer (A) is preferably a silane compound copolymer (A ′).
〔シラン化合物(1)〕
シラン化合物(1)は、式(1):R1−CH(X0)−D−Si(OR3)p(X1)3−pで表される化合物である。シラン化合物(1)を用いることにより、硬化後においても透明性、接着力が良好なシラン化合物共重合体を得ることができる。
しい。[Silane compound (1)]
Silane compound (1) has the formula (1): R 1 -CH (X 0) is -D-Si (OR 3) p (X 1) a compound represented by 3-p. By using the silane compound (1), it is possible to obtain a silane compound copolymer having excellent transparency and adhesion even after curing.
That's right.
式(1)中、R1、X0及びDの具体例としては、シラン化合物共重合体(A)における、R1、X0及びDとして例示したものが挙げられる。In the formula (1), specific examples of R 1, X 0 and D is a silane compound copolymer in (A), those exemplified as R 1, X 0 and D.
R3は、メチル基、エチル基、n−プロピル基、i−プロピル基、n−ブチル基、s−ブチル基、i−ブチル基、t−ブチル基、n−ペンチル基、n−ヘキシル基等の炭素数1〜6のアルキル基を表す。
X1はフッ素原子、塩素原子、臭素原子、ヨウ素原子等のハロゲン原子を表す。
pは0〜3の整数を表す。
pが2以上のとき、OR3同士は同一であっても相異なっていてもよい。また、(3−p)が2以上のとき、X1同士は同一であっても相異なっていてもよい。R 3 is methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, s-butyl group, i-butyl group, t-butyl group, n-pentyl group, n-hexyl group, etc. Represents an alkyl group having 1 to 6 carbon atoms.
X 1 represents a halogen atom such as a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom.
p represents an integer of 0 to 3.
When p is 2 or more, the ORs 3 may be the same or different. When (3-p) is 2 or more, X 1 may be the same or different.
シラン化合物(1)の具体例としては、クロロメチルトリメトキシシラン、ブロモメチルトリエトキシシラン、2−クロロエチルトリプロポキシシラン、2−ブロモエチルトリブトキシシラン、3−クロロプロピルトリメトキシシラン、3−クロロプロピルトリエトキシシラン、3−クロロプロピルトリプロポキシシラン、3−クロロプロピルトリブトキシシラン、3−ブロモプロピルトリメトキシシラン、3−ブロモプロピルトリエトキシシラン、3−ブロモプロピルトリプロポキシシラン、3−ブロモプロピルトリブトキシシラン、3−フルオロプロピルトリメトキシシラン、3−フルオロプロピルトリエトキシシラン、3−フルオロプロピルトリプロポキシシラン、3−フルオロプロピルトリブトキシシラン、3−アイオドプロピルトリメトキシシラン、2−クロロエチルトリメトキシシラン、3−クロロプロピルトリエトキシシラン、4−クロロブチルトリプロポキシシラン、5−クロロペンチルトリプロポキシシラン、2−クロロプロピルトリメトキシシラン、3−クロロ−3−アセチルプロピルトリメトキシシラン、3−クロロ−3−メトキシカルボニルプロピルトリメトキシシラン、o−(2−クロロエチル)フェニルトリプロポキシシラン、m−(2−クロロエチル)フェニルトリメトキシシラン、p−(2−クロロエチル)フェニルトリエトキシシラン、p−(2−フルオロエチル)フェニルトリメトキシシラン等の、X0がハロゲン原子であるトリアルコキシシラン化合物類;Specific examples of the silane compound (1) include chloromethyltrimethoxysilane, bromomethyltriethoxysilane, 2-chloroethyltripropoxysilane, 2-bromoethyltributoxysilane, 3-chloropropyltrimethoxysilane, and 3-chloro. Propyltriethoxysilane, 3-chloropropyltripropoxysilane, 3-chloropropyltributoxysilane, 3-bromopropyltrimethoxysilane, 3-bromopropyltriethoxysilane, 3-bromopropyltripropoxysilane, 3-bromopropyltri Butoxysilane, 3-fluoropropyltrimethoxysilane, 3-fluoropropyltriethoxysilane, 3-fluoropropyltripropoxysilane, 3-fluoropropyltributoxysilane, 3-iodopropylto Methoxysilane, 2-chloroethyltrimethoxysilane, 3-chloropropyltriethoxysilane, 4-chlorobutyltripropoxysilane, 5-chloropentyltripropoxysilane, 2-chloropropyltrimethoxysilane, 3-chloro-3-acetyl Propyltrimethoxysilane, 3-chloro-3-methoxycarbonylpropyltrimethoxysilane, o- (2-chloroethyl) phenyltripropoxysilane, m- (2-chloroethyl) phenyltrimethoxysilane, p- (2-chloroethyl) phenyl Trialkoxysilane compounds in which X 0 is a halogen atom, such as triethoxysilane and p- (2-fluoroethyl) phenyltrimethoxysilane;
クロロメチルトリクロロシラン、ブロモメチルブロモジメトキシシラン、2−クロロエチルジクロロメトキシシラン、2−ブロモエチルジクロロエトキシシラン、3−クロロプロピルトリクロロシラン、3−クロロプロピルトリブロモシラン、3−クロロプロピルジクロロメトキシシラン、3−クロロプロピルジクロロエトキシシラン、3−クロロプロピルクロロジメトキシシラン、3−クロロプロピルクロロジエトキシシラン、3−ブロモプロピルジクロロエトキシシラン、3−ブロモプロピルトリブロモシラン、3−ブロモプロピルトリクロロシラン、3−ブロモプロピルクロロジメトキシシラン、3−フルオロプロピルトリクロロシラン、3−フルオロプロピルクロロジメトキシシラン、3−フルオロプロピルジクロロメトキシシラン、3−フルオロプロピルクロロジエトキシシラン、3−アイオドプロピルトリクロロシラン、4−クロロブチルクロロジエトキシシラン、3−クロロ−n−ブチルクロロジエトキシシラン、3−クロロ−3−アセチルプロピルジクロロエトキシシラン、3−クロロ−3−メトキシカルボニルプロピルトリブロモシラン等の、X0がハロゲン原子であるハロゲノシラン化合物類;Chloromethyltrichlorosilane, bromomethylbromodimethoxysilane, 2-chloroethyldichloromethoxysilane, 2-bromoethyldichloroethoxysilane, 3-chloropropyltrichlorosilane, 3-chloropropyltribromosilane, 3-chloropropyldichloromethoxysilane, 3-chloropropyldichloroethoxysilane, 3-chloropropylchlorodimethoxysilane, 3-chloropropylchlorodiethoxysilane, 3-bromopropyldichloroethoxysilane, 3-bromopropyltribromosilane, 3-bromopropyltrichlorosilane, 3- Bromopropylchlorodimethoxysilane, 3-fluoropropyltrichlorosilane, 3-fluoropropylchlorodimethoxysilane, 3-fluoropropyldichloromethoxysilane 3-fluoropropylchlorodiethoxysilane, 3-iodopropyltrichlorosilane, 4-chlorobutylchlorodiethoxysilane, 3-chloro-n-butylchlorodiethoxysilane, 3-chloro-3-acetylpropyldichloroethoxysilane, Halogenosilane compounds wherein X 0 is a halogen atom, such as 3-chloro-3-methoxycarbonylpropyltribromosilane;
シアノメチルトリメトキシシラン、シアノメチルトリエトキシシラン、1−シアノエチルトリメトキシシラン、2−シアノエチルトリメトキシシラン、2−シアノエチルトリエトキシシラン、2−シアノエチルトリプロポキシシラン、3−シアノプロピルトリメトキシシラン、3−シアノプロピルトリエトキシシラン、3−シアノプロピルトリプロポキシシラン、3−シアノプロピルトリブトキシシラン、4−シアノブチルトリメトキシシラン、5−シアノペンチルトリメトキシシラン、2−シアノプロピルトリメトキシシラン、2−(シアノメトキシ)エチルトリメトキシシラン、2−(2−シアノエトキシ)エチルトリメトキシシラン、o−(シアノメチル)フェニルトリプロポキシシラン、m−(シアノメチル)フェニルトリメトキシシラン、p−(シアノメチル)フェニルトリエトキシシラン、p−(2−シアノエチル)フェニルトリメトキシシラン等の、X0がシアノ基であるトリアルコキシシラン化合物類;Cyanomethyltrimethoxysilane, cyanomethyltriethoxysilane, 1-cyanoethyltrimethoxysilane, 2-cyanoethyltrimethoxysilane, 2-cyanoethyltriethoxysilane, 2-cyanoethyltripropoxysilane, 3-cyanopropyltrimethoxysilane, 3- Cyanopropyltriethoxysilane, 3-cyanopropyltripropoxysilane, 3-cyanopropyltributoxysilane, 4-cyanobutyltrimethoxysilane, 5-cyanopentyltrimethoxysilane, 2-cyanopropyltrimethoxysilane, 2- (cyano Methoxy) ethyltrimethoxysilane, 2- (2-cyanoethoxy) ethyltrimethoxysilane, o- (cyanomethyl) phenyltripropoxysilane, m- (cyanomethyl) phenyltrimethoxy Run, p-(cyanomethyl) phenyl triethoxysilane, p-(2-cyanoethyl) trialkoxysilane compounds are such phenyltrimethoxysilane, X 0 is a cyano group;
シアノメチルトリクロロシラン、シアノメチルブロモジメトキシシラン、2−シアノエチルジクロロメトキシシラン、2−シアノエチルジクロロエトキシシラン、3−シアノプロピルトリクロロシラン、3−シアノプロピルトリブロモシラン、3−シアノプロピルジクロロメトキシシラン、3−シアノプロピルジクロロエトキシシラン、3−シアノプロピルクロロジメトキシシラン、3−シアノプロピルクロロジエトキシシラン、4−シアノブチルクロロジエトキシシラン、3−シアノ−n−ブチルクロロジエトキシシラン、2−(2−シアノエトキシ)エチルトリクロロシラン、2−(2−シアノエトキシ)エチルブロモジエトキシシラン、2−(2−シアノエトキシ)エチルジクロロプロポキシシラン、o−(2−シアノエチル)フェニルトリクロロシラン、m−(2−シアノエチル)フェニルメトキシジブロモシラン、p−(2−シアノエチル)フェニルジメトキシクロロシラン、p−(2−シアノエチル)フェニルトリブロモシラン等の、X0がシアノ基であるハロゲノシラン化合物類;Cyanomethyltrichlorosilane, cyanomethylbromodimethoxysilane, 2-cyanoethyldichloromethoxysilane, 2-cyanoethyldichloroethoxysilane, 3-cyanopropyltrichlorosilane, 3-cyanopropyltribromosilane, 3-cyanopropyldichloromethoxysilane, 3- Cyanopropyldichloroethoxysilane, 3-cyanopropylchlorodimethoxysilane, 3-cyanopropylchlorodiethoxysilane, 4-cyanobutylchlorodiethoxysilane, 3-cyano-n-butylchlorodiethoxysilane, 2- (2-cyano Ethoxy) ethyltrichlorosilane, 2- (2-cyanoethoxy) ethylbromodiethoxysilane, 2- (2-cyanoethoxy) ethyldichloropropoxysilane, o- (2-cyanoethyl) pheny Trichlorosilane, m-(2-cyanoethyl) phenylmethoxy dibromo silane, p-(2-cyanoethyl) phenyl dimethoxy chlorosilane, p-(2-cyanoethyl) and phenyl tribromosilane silane, halosilane compound X 0 is a cyano group Kind;
3−アセトキシプロピルトリメトキシシラン、3−アセトキシプロピルトリエトキシシラン、3−アセトキシプロピルトリプロポキシシラン、3−アセトキシプロピルトリブトキシシラン、3−プロピオニルオキシプロピルトリメトキシシラン、3−プロピオニルオキシプロピルトリエトキシシラン、3−ベンゾイルオキシプロピルトリメトキシシラン、3−ベンゾイルオキシプロピルトリエトキシシラン、3−ベンゾイルオキシプロピルトリプロポキシシラン、3−ベンゾイルオキシプロピルトリブトキシシラン、2−トリメチルシリルオキシエチルトリメトキシシラン、3−トリエチルシリルオキシプロピルトリエトキシシラン、3−(2−テトラヒドロピラニルオキシ)プロピルトリプロポキシシラン、3−(2−テトラヒドロフラニルオキシ)プロピルトリブトキシシラン、3−メトキシメチルオキシプロピルトリメトキシシラン、3−メトキシエトキシメチルオキシプロピルトリエトキシシラン、3−(1−エトキシエチルオキシ)プロピルトリプロポキシシラン、3−(t−ブトキシカルボニルオキシ)プロピルトリメトキシシラン、3−t−ブトキシプロピルトリメトキシシラン、3−ベンジロキシプロピルトリエトキシシラン、3−トリフェニルメトキシプロピルトリエトキシシラン等の、X0が前記式:OGで表される基であるトリアルコキシシラン化合物類;3-acetoxypropyltrimethoxysilane, 3-acetoxypropyltriethoxysilane, 3-acetoxypropyltripropoxysilane, 3-acetoxypropyltributoxysilane, 3-propionyloxypropyltrimethoxysilane, 3-propionyloxypropyltriethoxysilane, 3-benzoyloxypropyltrimethoxysilane, 3-benzoyloxypropyltriethoxysilane, 3-benzoyloxypropyltripropoxysilane, 3-benzoyloxypropyltributoxysilane, 2-trimethylsilyloxyethyltrimethoxysilane, 3-triethylsilyloxy Propyltriethoxysilane, 3- (2-tetrahydropyranyloxy) propyltripropoxysilane, 3- (2-tetrahydrofurani Oxy) propyltributoxysilane, 3-methoxymethyloxypropyltrimethoxysilane, 3-methoxyethoxymethyloxypropyltriethoxysilane, 3- (1-ethoxyethyloxy) propyltripropoxysilane, 3- (t-butoxycarbonyloxy) ) X 0 is a group represented by the above formula: OG, such as propyltrimethoxysilane, 3-t-butoxypropyltrimethoxysilane, 3-benzyloxypropyltriethoxysilane, 3-triphenylmethoxypropyltriethoxysilane, etc. Certain trialkoxysilane compounds;
3−アセトキシプロピルトリクロロシラン、3−アセトキシプロピルトリブロモシラン、3−アセトキシプロピルジクロロメトキシシラン、3−アセトキシプロピルジクロロエトキシシラン、3−アセトキシプロピルクロロジメトキシシラン、3−アセトキシプロピルクロロジエトキシシラン、3−ベンゾイルオキシプロピルトリクロロシラン、3−トリメチルシリルオキシプロピルクロロジメトキシシラン、3−トリエチルシリルオキシプロピルジクロロメトキシシラン、3−(2−テトラヒドロピラニルオキシ)プロピルクロロジエトキシシラン、3−(2−テトラヒドロフラニルオキシ)プロピルジクロロエトキシシラン、3−メトキシメチルオキシプロピルトリブロモシラン、3−メトキシエトキシメチルオキシプロピルトリクロロシラン、3−(1−エトキシエチルオキシ)プロピルクロロジメトキシシラン、3−t−ブトキシカルボニルオキシプロピルジクロロメトキシシラン、3−t−ブトキシプロピルクロロジエトキシシラン、3−トリフェニルメトキシプロピルジクロロエトキシシラン、3−ベンジロキシプロピルトリブロモシラン等の、X0が前記式:OGで表される基であるハロゲノシラン化合物類;等が挙げられる。
これらのシラン化合物(1)は一種単独で、或いは二種以上を組み合わせて用いることができる。3-acetoxypropyltrichlorosilane, 3-acetoxypropyltribromosilane, 3-acetoxypropyldichloromethoxysilane, 3-acetoxypropyldichloroethoxysilane, 3-acetoxypropylchlorodimethoxysilane, 3-acetoxypropylchlorodiethoxysilane, 3- Benzoyloxypropyltrichlorosilane, 3-trimethylsilyloxypropylchlorodimethoxysilane, 3-triethylsilyloxypropyldichloromethoxysilane, 3- (2-tetrahydropyranyloxy) propylchlorodiethoxysilane, 3- (2-tetrahydrofuranyloxy) Propyldichloroethoxysilane, 3-methoxymethyloxypropyltribromosilane, 3-methoxyethoxymethyloxypropyltrichloro Lan, 3- (1-ethoxyethyloxy) propylchlorodimethoxysilane, 3-t-butoxycarbonyloxypropyldichloromethoxysilane, 3-t-butoxypropylchlorodiethoxysilane, 3-triphenylmethoxypropyldichloroethoxysilane, 3 -Halogenosilane compounds such as benzyloxypropyltribromosilane, where X 0 is a group represented by the formula: OG;
These silane compounds (1) can be used singly or in combination of two or more.
これらの中でも、シラン化合物(1)としては、より優れた接着性を有する硬化物が得られることから、X0がハロゲン原子であるトリアルコキシシラン化合物類、X0がシアノ基であるトリアルコキシシラン化合物類、又はX0が前記式:OGで表される基であるトリアルコキシシラン化合物類が好ましく、3−クロロプロピル基を有するトリアルコキシシラン化合物類、3−アセトキシプロピル基を有するトリアルコキシシラン化合物類、2−シアノエチル基を有するトリアルコキシシラン化合物類、又は3−シアノプロピル基を有するトリアルコキシシラン化合物類がより好ましい。Among these, as the silane compound (1), a cured product having better adhesiveness is obtained, so trialkoxysilane compounds in which X 0 is a halogen atom, trialkoxysilane in which X 0 is a cyano group Compounds, or trialkoxysilane compounds in which X 0 is a group represented by the formula: OG are preferred, trialkoxysilane compounds having a 3-chloropropyl group, trialkoxysilane compounds having a 3-acetoxypropyl group More preferred are trialkoxysilane compounds having a 2-cyanoethyl group, or trialkoxysilane compounds having a 3-cyanopropyl group.
〔シラン化合物(2)〕
シラン化合物(2)は、式(2):R2Si(OR4)q(X2)3−qで表される化合物である。
式(2)中、R2の具体例としては、シラン化合物共重合体(A)におけるR2として例示したものが挙げられる。[Silane compound (2)]
Silane compounds (2) have the formula (2): R 2 Si ( OR 4) q (X 2) is a compound represented by 3-q.
In the formula (2), specific examples of R 2 include those exemplified as R 2 in the silane compound copolymer (A).
R4は、前記R3と同様の炭素数1〜6のアルキル基を表す。
X2は、前記X1と同様のハロゲン原子を表す。
qは0〜3のいずれかの整数を表す。
qが2以上のとき、OR4同士は同一であっても相異なっていてもよい。また、(3−q)が2以上のとき、X2同士は同一であっても相異なっていてもよい。R 4 represents the same alkyl group having 1 to 6 carbon atoms as R 3 .
X 2 represents the same halogen atom as X 1 .
q represents an integer of 0 to 3.
When q is 2 or more, OR 4 may be the same or different. When (3-q) is 2 or more, X 2 may be the same or different.
シラン化合物(2)の具体例としては、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、n−プロピルトリメトキシシラン、n−ブチルトリエトキシシラン、i−ブチルトリメトキシシラン、n−ペンチルトリエトキシシラン、n−ヘキシルトリメトキシシラン、i−オクチルトリエトキシシラン、ドデシルトリメトキシシラン、メチルジメトキシエトキシシラン、メチルジエトキシメトキシシラン等のアルキルトリアルコキシシラン化合物類;
メチルクロロジメトキシシラン、メチルジクロロメトキシシラン、メチルクロロジエトキシシラン、エチルクロロジメトキシシラン、エチルジクロロメトキシシラン、n−プロピルクロロジメトキシシラン、n−プロピルジクロロメトキシシラン等のアルキルハロゲノアルコキシシラン化合物類;
メチルトリクロロシラン、メチルトリブロモシラン、エチルトリクロロシラン、エチルトリブロモシラン、n−プロピルトリクロロシラン等のアルキルトリハロゲノシラン化合物類;Specific examples of the silane compound (2) include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, n-propyltrimethoxysilane, n-butyltriethoxysilane, i-butyltrimethoxy. Alkyltrialkoxysilane compounds such as silane, n-pentyltriethoxysilane, n-hexyltrimethoxysilane, i-octyltriethoxysilane, dodecyltrimethoxysilane, methyldimethoxyethoxysilane, methyldiethoxymethoxysilane;
Alkylhalogenoalkoxysilane compounds such as methylchlorodimethoxysilane, methyldichloromethoxysilane, methylchlorodiethoxysilane, ethylchlorodimethoxysilane, ethyldichloromethoxysilane, n-propylchlorodimethoxysilane, n-propyldichloromethoxysilane;
Alkyltrihalogenosilane compounds such as methyltrichlorosilane, methyltribromosilane, ethyltrichlorosilane, ethyltribromosilane, n-propyltrichlorosilane;
フェニルトリメトキシシラン、4−メトキシフェニルトリメトキシシラン、2−クロロフェニルトリメトキシシラン、フェニルトリエトキシシラン、2−メトキシフェニルトリエトキシシラン、フェニルジメトキシエトキシシラン、フェニルジエトキシメトキシシラン等の置換基を有していてもよいフェニルトリアルコキシシラン化合物類;
フェニルクロロジメトキシシラン、フェニルジクロロメトキシシラン、フェニルクロロメトキシエトキシシラン、フェニルクロロジエトキシシラン、フェニルジクロロエトキシシラン等の置換基を有していてもよいフェニルハロゲノアルコキシシラン化合物類;
フェニルトリクロロシラン、フェニルトリブロモシラン、4−メトキシフェニルトリクロロシラン、2−クロロフェニルトリクロロシラン、2−エトキシフェニルトリクロロシラン等の置換基を有していてもよいフェニルトリハロゲノシラン化合物;が挙げられる。
これらのシラン化合物(2)は一種単独で、或いは二種以上を組み合わせて用いることができる。Has substituents such as phenyltrimethoxysilane, 4-methoxyphenyltrimethoxysilane, 2-chlorophenyltrimethoxysilane, phenyltriethoxysilane, 2-methoxyphenyltriethoxysilane, phenyldimethoxyethoxysilane, phenyldiethoxymethoxysilane Optionally phenyltrialkoxysilane compounds;
Phenylhalogenoalkoxysilane compounds which may have a substituent such as phenylchlorodimethoxysilane, phenyldichloromethoxysilane, phenylchloromethoxyethoxysilane, phenylchlorodiethoxysilane, phenyldichloroethoxysilane;
And phenyltrihalogenosilane compounds which may have a substituent such as phenyltrichlorosilane, phenyltribromosilane, 4-methoxyphenyltrichlorosilane, 2-chlorophenyltrichlorosilane, and 2-ethoxyphenyltrichlorosilane.
These silane compounds (2) can be used singly or in combination of two or more.
〔シラン化合物の混合物〕
シラン化合物共重合体(A’)を製造する際に用いられるシラン化合物の混合物としては、シラン化合物(1)及びシラン化合物(2)からなる混合物であっても、さらに、本発明の目的を阻害しない範囲でその他のシラン化合物を含む混合物であってもよいが、シラン化合物(1)及びシラン化合物(2)からなる混合物が好ましい。[A mixture of silane compounds]
Even if the mixture of the silane compound (1) and the silane compound (2) is used as the mixture of the silane compound used for producing the silane compound copolymer (A ′), the object of the present invention is further inhibited. Although it may be a mixture containing other silane compounds as long as it is not, a mixture comprising the silane compound (1) and the silane compound (2) is preferred.
シラン化合物(1)とシラン化合物(2)との使用割合は、モル比で、〔シラン化合物(1)〕:〔シラン化合物(2)〕=55:45〜25:75であるのが好ましい。 The use ratio of the silane compound (1) and the silane compound (2) is preferably a molar ratio of [silane compound (1)]: [silane compound (2)] = 55:45 to 25:75.
前記シラン化合物の混合物を縮合させる方法としては、特に制限はないが、シラン化合物(1)、シラン化合物(2)、及び所望によりその他のシラン化合物を溶媒に溶解し、所定量の触媒を添加し、所定温度で撹拌する方法が挙げられる。 The method for condensing the mixture of the silane compounds is not particularly limited, but the silane compound (1), the silane compound (2), and other silane compounds as required are dissolved in a solvent, and a predetermined amount of catalyst is added. And a method of stirring at a predetermined temperature.
用いる触媒は、酸触媒及び塩基触媒のいずれであってもよい。
酸触媒としては、塩酸、硫酸、硝酸、リン酸等の無機酸;メタンスルホン酸、トリフルオロメタンスルホン酸、ベンゼンスルホン酸、p−トルエンスルホン酸、酢酸、トリフルオロ酢酸等の有機酸;等が挙げられる。The catalyst used may be either an acid catalyst or a base catalyst.
Examples of the acid catalyst include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, and phosphoric acid; organic acids such as methanesulfonic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid, acetic acid, and trifluoroacetic acid; It is done.
塩基触媒としては、トリメチルアミン、トリエチルアミン、リチウムジイソプロピルアミド、リチウムビス(トリメチルシリル)アミド、ピリジン、1,8−ジアザビシクロ[5.4.0]−7−ウンデセン、アニリン、ピコリン、1,4−ジアザビシクロ[2.2.2]オクタン、イミダゾール等の有機塩基;水酸化テトラメチルアンモニウム、水酸化テトラエチルアンモニウム等の有機塩水酸化物;ナトリウムメトキシド、ナトリウムエトキシド、ナトリウムt−ブトキシド、カリウムt−ブトキシド等の金属アルコラート;水素化ナトリウム、水素化カルシウム等の金属水素化物;水酸化ナトリウム、水酸化カリウム、水酸化カルシウム等の金属水酸化物;炭酸ナトリウム、炭酸カリウム、炭酸マグネシウム等の金属炭酸塩;炭酸水素ナトリウム、炭酸水素カリウム等の金属炭酸水素塩;等が挙げられる。 Base catalysts include trimethylamine, triethylamine, lithium diisopropylamide, lithium bis (trimethylsilyl) amide, pyridine, 1,8-diazabicyclo [5.4.0] -7-undecene, aniline, picoline, 1,4-diazabicyclo [2 2.2] Organic bases such as octane and imidazole; Organic salt hydroxides such as tetramethylammonium hydroxide and tetraethylammonium hydroxide; Metals such as sodium methoxide, sodium ethoxide, sodium t-butoxide and potassium t-butoxide Alcoholates; Metal hydrides such as sodium hydride and calcium hydride; Metal hydroxides such as sodium hydroxide, potassium hydroxide and calcium hydroxide; Metal carbonates such as sodium carbonate, potassium carbonate and magnesium carbonate; Hydrogen carbonate And the like are; thorium, metal hydrogen carbonates such as potassium hydrogen carbonate.
これらの中でも、用いる触媒としては、酸触媒が好ましく、無機酸がより好ましい。 Among these, as a catalyst to be used, an acid catalyst is preferable and an inorganic acid is more preferable.
触媒の使用量は、シラン化合物の総モル量に対して、通常、0.1mol%〜10mol%、好ましくは1mol%〜5mol%の範囲である。 The usage-amount of a catalyst is 0.1 mol%-10 mol% normally with respect to the total molar amount of a silane compound, Preferably it is the range of 1 mol%-5 mol%.
用いる溶媒は、シラン化合物の種類等に応じて、適宜選択することができる。例えば、水;ベンゼン、トルエン、キシレン等の芳香族炭化水素類;酢酸メチル、酢酸エチル、酢酸プロピル、プロピオン酸メチル等のエステル類;アセトン、メチルエチルケトン、メチルi−ブチルケトン、シクロヘキサノン等のケトン類;メチルアルコール、エチルアルコール、n−プロピルアルコール、i−プロピルアルコール、n−ブチルアルコール、i−ブチルアルコール、s−ブチルアルコール、t−ブチルアルコール等のアルコール類;等が挙げられる。これらの溶媒は一種単独で、或いは二種以上を混合して用いることができる。 The solvent to be used can be appropriately selected according to the type of the silane compound. For example, water; aromatic hydrocarbons such as benzene, toluene and xylene; esters such as methyl acetate, ethyl acetate, propyl acetate and methyl propionate; ketones such as acetone, methyl ethyl ketone, methyl i-butyl ketone and cyclohexanone; methyl And alcohols such as alcohol, ethyl alcohol, n-propyl alcohol, i-propyl alcohol, n-butyl alcohol, i-butyl alcohol, s-butyl alcohol and t-butyl alcohol. These solvents can be used alone or in combination of two or more.
これらの中でも、水、芳香族炭化水素類、及びこれらの混合溶媒が好ましく、水とトルエンの混合溶媒が特に好ましい。水とトルエンを用いる場合、水とトルエンの比率(容積比)は、好ましくは1:9〜9:1、より好ましくは7:3〜3:7である。 Among these, water, aromatic hydrocarbons, and a mixed solvent thereof are preferable, and a mixed solvent of water and toluene is particularly preferable. When water and toluene are used, the ratio of water to toluene (volume ratio) is preferably 1: 9 to 9: 1, more preferably 7: 3 to 3: 7.
溶媒の使用量は、溶媒1リットルあたり、シラン化合物の総モル量が、通常0.1mol〜10mol、好ましくは0.5mol〜10molとなる量である。 The amount of the solvent used is such that the total molar amount of the silane compound is usually 0.1 mol to 10 mol, preferably 0.5 mol to 10 mol per liter of the solvent.
シラン化合物を縮合(反応)させるときの温度は、通常0℃から用いる溶媒の沸点までの温度範囲、好ましくは20℃〜100℃の範囲である。反応温度があまりに低いと縮合反応の進行が不十分となる場合がある。一方、反応温度が高くなりすぎるとゲル化抑制が困難となる。反応は、通常30分から20時間で完結する。 The temperature at which the silane compound is condensed (reacted) is usually in the temperature range from 0 ° C. to the boiling point of the solvent used, preferably in the range of 20 ° C. to 100 ° C. If the reaction temperature is too low, the progress of the condensation reaction may be insufficient. On the other hand, if the reaction temperature is too high, it is difficult to suppress gelation. The reaction is usually completed in 30 minutes to 20 hours.
反応終了後は、酸触媒を用いた場合は、反応溶液に炭酸水素ナトリウム等のアルカリ水溶液を添加することにより、塩基触媒を用いた場合は、反応溶液に塩酸等の酸を添加することにより中和を行い、その際に生じる塩をろ別又は水洗等により除去し、目的とするシラン化合物共重合体を得ることができる。 After completion of the reaction, when an acid catalyst is used, an alkaline aqueous solution such as sodium hydrogen carbonate is added to the reaction solution. When a base catalyst is used, the reaction solution is added with an acid such as hydrochloric acid. Summing is performed, and the salt generated at that time is removed by filtration or washing with water, etc., and the desired silane compound copolymer can be obtained.
(B)エポキシ化合物
本発明の硬化性組成物は、(B)成分として、エポキシ化合物(以下、「エポキシ化合物(B)」ということがある。)を含有する。
本発明の硬化性組成物は、エポキシ化合物(B)を含有するため、耐熱性に優れる硬化物を得ることができる。(B) Epoxy Compound The curable composition of the present invention contains an epoxy compound (hereinafter sometimes referred to as “epoxy compound (B)”) as the component (B).
Since the curable composition of this invention contains an epoxy compound (B), the hardened | cured material excellent in heat resistance can be obtained.
エポキシ化合物(B)としては、分子内にエポキシ基を有する化合物であればよいが、エポキシ基を2個以上有する化合物が好ましい。 The epoxy compound (B) may be any compound having an epoxy group in the molecule, but a compound having two or more epoxy groups is preferable.
エポキシ基を2個以上有するエポキシ化合物としては、ビスフェノールA、ビスフェノールF、レゾルシノール、フェノールノボラック、クレゾールノボラックなどのフェノール類のグリシジルエーテル;ブタンジオール、ポリエチレングリコール、ポリプロピレングリコールなどのアルコール類のグリシジルエーテル;フタル酸、イソフタル酸、テトラヒドロフタル酸などのカルボン酸のグリシジルエステル;炭素−炭素二重結合を有する脂環式構造を含む化合物の該二重結合を酸化することによりエポキシが導入された、いわゆる脂環式エポキシ化合物; Examples of the epoxy compound having two or more epoxy groups include glycidyl ethers of phenols such as bisphenol A, bisphenol F, resorcinol, phenol novolac, and cresol novolac; glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; Glycidyl esters of carboxylic acids such as acids, isophthalic acid and tetrahydrophthalic acid; so-called alicyclics in which an epoxy is introduced by oxidizing the double bond of a compound containing an alicyclic structure having a carbon-carbon double bond Formula epoxy compounds;
ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、脂環式エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、グリシジルエステル型エポキシ樹脂、ヒダントイン型エポキシ樹脂、アクリル酸変性エポキシ樹脂(エポキシアクリレート)、リン含有エポキシ樹脂、スチルベン型エポキシ樹脂、ハイドロキノン型エポキシ樹脂、ナフタレン骨格型エポキシ樹脂、テトラフェニロールエタン型エポキシ樹脂、DPP(ジ−n−ペンチルフタレート)型エポキシ樹脂、トリスヒドロキシフェニルメタン型エポキシ樹脂、ジシクロペンタジエンフェノール型エポキシ樹脂、含ケイ素エポキシ樹脂、ビスフェノールAエチレンオキサイド付加物のジグリシジルエーテル、ビスフェノールAプロピレンオキサイド付加物のジグリシジルエーテル、シクロヘキサンジメタノールジグリシジルエーテル、脂肪族多価アルコールのポリグリシジルエーテル、多塩基酸のポリグリシジルエステル、及びこれらのハロゲン化物(臭素化エポキシ樹脂等)や核水素添加物等のエポキシ樹脂;等が挙げられる。
これらは一種単独で、或いは二種以上を組み合わせて用いることができる。Bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, alicyclic epoxy resin, cresol novolac type epoxy resin, phenol novolac type epoxy resin, biphenyl type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type Epoxy resin, hydantoin type epoxy resin, acrylic acid modified epoxy resin (epoxy acrylate), phosphorus-containing epoxy resin, stilbene type epoxy resin, hydroquinone type epoxy resin, naphthalene skeleton type epoxy resin, tetraphenylolethane type epoxy resin, DPP -N-pentylphthalate) type epoxy resin, trishydroxyphenylmethane type epoxy resin, dicyclopentadienephenol type epoxy resin, silicon-containing epoxy Resin, diglycidyl ether of bisphenol A ethylene oxide adduct, diglycidyl ether of bisphenol A propylene oxide adduct, cyclohexanedimethanol diglycidyl ether, polyglycidyl ether of aliphatic polyhydric alcohol, polyglycidyl ester of polybasic acid, and These halides (brominated epoxy resins and the like) and epoxy resins such as nuclear hydrogenated materials;
These can be used individually by 1 type or in combination of 2 or more types.
これらの中でも、高温においても高い接着力を有する硬化物が得られる観点から、脂環式エポキシ化合物を用いるのが好ましい。脂環式エポキシ化合物としては、分子内にエポキシ環を2個以上有する、下記式(a)で表される3,4−エポキシシクロヘキサンカルボン酸3,4−エポキシシクロヘキシルメチル、ビニルシクロヘキセンジエポキサイド等が挙げられる。これらの中でも、3,4−エポキシシクロヘキサンカルボン酸3,4−エポキシシクロヘキシルメチルが特に好ましい。 Among these, it is preferable to use an alicyclic epoxy compound from the viewpoint of obtaining a cured product having high adhesive force even at a high temperature. Examples of the alicyclic epoxy compound include 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl, vinylcyclohexene diepoxide, which are represented by the following formula (a), having two or more epoxy rings in the molecule. Can be mentioned. Among these, 3,4-epoxycyclohexanecarboxylate 3,4-epoxycyclohexylmethyl is particularly preferable.
(C)硬化剤
本発明の硬化性組成物は、(C)成分として、カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物を含有する硬化剤(以下、「硬化剤(C)」ということがある。)を含む。
本発明の硬化性組成物は、硬化剤(C)を含有するため、耐熱性に優れる硬化物を得ることができる。(C) Curing Agent The curable composition of the present invention comprises a curing agent (hereinafter referred to as “curing agent”) containing, as component (C), an alicyclic acid anhydride having a carboxyl group and other alicyclic acid anhydrides. (C) ").
Since the curable composition of this invention contains a hardening | curing agent (C), the hardened | cured material excellent in heat resistance can be obtained.
カルボキシル基を有する脂環式酸無水物は、少なくとも一つのカルボキシル基が置換した脂環式酸無水物である。
脂環式酸無水物の具体例としては、ポリアゼライン酸無水物、3−メチル−1,2,3,6−テトラヒドロ無水フタル酸、4−メチル−1,2,3,6−テトラヒドロ無水フタル酸、テトラヒドロ無水フタル酸、3−メチル−ヘキサヒドロ無水フタル酸、4−メチル−ヘキサヒドロ無水フタル酸、ヘキサヒドロ無水フタル酸、無水メチルナジック酸、5−ノルボルネン−2,3−ジカルボン酸無水物、ノルボルナン−2,3−ジカルボン酸無水物、メチル−5−ノルボルネン−2,3−ジカルボン酸無水物、メチル−ノルボルナン−2,3−ジカルボン酸無水物等が挙げられる。
カルボキシル基は、脂環式酸無水物の脂環式構造の任意の位置で置換してよく、置換位置や置換するカルボキシル基の数は特に限定されない。The alicyclic acid anhydride having a carboxyl group is an alicyclic acid anhydride substituted with at least one carboxyl group.
Specific examples of the alicyclic acid anhydride include polyazeline acid anhydride, 3-methyl-1,2,3,6-tetrahydrophthalic anhydride, 4-methyl-1,2,3,6-tetrahydrophthalic anhydride. Acid, tetrahydrophthalic anhydride, 3-methyl-hexahydrophthalic anhydride, 4-methyl-hexahydrophthalic anhydride, hexahydrophthalic anhydride, methyl nadic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, norbornane Examples include 2,3-dicarboxylic acid anhydride, methyl-5-norbornene-2,3-dicarboxylic acid anhydride, methyl-norbornane-2,3-dicarboxylic acid anhydride, and the like.
The carboxyl group may be substituted at any position of the alicyclic structure of the alicyclic acid anhydride, and the position of substitution and the number of carboxyl groups to be substituted are not particularly limited.
これらの中でも、ヘキサヒドロ無水フタル酸にカルボキシル基が置換した、シクロヘキサン−1,2,4−トリカルボン酸−1,2無水物、シクロヘキサン−1,2,3−トリカルボン酸−1,2無水物が好ましく、シクロヘキサン−1,2,4−トリカルボン酸−1,2無水物が特に好ましい。この化合物は、立体異性体が存在し得るが、いずれの異性体であってもよい。
カルボキシル基を有する脂環式酸無水物は、一種単独で、或いは二種以上を組み合わせて用いることができる。Of these, cyclohexane-1,2,4-tricarboxylic acid-1,2 anhydride and cyclohexane-1,2,3-tricarboxylic acid-1,2 anhydride, in which a carboxyl group is substituted for hexahydrophthalic anhydride, are preferred. Cyclohexane-1,2,4-tricarboxylic acid-1,2 anhydride is particularly preferable. This compound may exist as a stereoisomer, but may be any isomer.
The alicyclic acid anhydride having a carboxyl group can be used alone or in combination of two or more.
その他の脂環式酸無水物は、カルボキシル基を有しない脂環式酸無水物である。その他の脂環式酸無水物としては、前記カルボキシル基を有する脂環式酸無水物の脂環式酸無水物として例示したのと同様のものが挙げられる。なかでも、3−メチル−ヘキサヒドロ無水フタル酸、4−メチル−ヘキサヒドロ無水フタル酸が好ましく、4−メチル−ヘキサヒドロ無水フタル酸が特に好ましい。
その他の脂環式酸無水物は、一種単独で、或いは二種以上を組み合わせて用いることができる。Other alicyclic acid anhydrides are alicyclic acid anhydrides having no carboxyl group. Examples of the other alicyclic acid anhydrides include those exemplified as the alicyclic acid anhydride of the alicyclic acid anhydride having a carboxyl group. Of these, 3-methyl-hexahydrophthalic anhydride and 4-methyl-hexahydrophthalic anhydride are preferable, and 4-methyl-hexahydrophthalic anhydride is particularly preferable.
Other alicyclic acid anhydrides can be used singly or in combination of two or more.
硬化剤(C)において、カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物の使用割合は、カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物の質量比で、(カルボキシル基を有する脂環式酸無水物):(その他の脂環式酸無水物)=50:50〜10:90であるのが好ましい。 In the curing agent (C), the proportion of the alicyclic acid anhydride having a carboxyl group and the other alicyclic acid anhydride is such that the alicyclic acid anhydride having a carboxyl group and the other alicyclic acid anhydride are used. It is preferable that (alicyclic acid anhydride having a carboxyl group): (other alicyclic acid anhydride) = 50: 50 to 10:90.
本発明の硬化性組成物においては、前記(A)、(B)、及び(C)成分を、(A)と〔(B)+(C)〕の質量比で、(A):〔(B)+(C)〕=100:20〜100:60の割合で用い、前記(A’)、(B)、及び(C)成分を、(A’)と〔(B)+(C)〕の質量比で、(A’):〔(B)+(C)〕=100:20〜100:60の割合で用いる。(B)+(C)の割合が20より少ないと、十分な接着力が得られず、60より多いと、(A)成分又は(A’)成分との相溶性が悪くなり、優れた透明性が得られない。 In the curable composition of the present invention, the components (A), (B), and (C) are mixed in a mass ratio of (A) and [(B) + (C)] (A): [( B) + (C)] = 100: 20 to 100: 60, and the components (A ′), (B), and (C) are used as (A ′) and [(B) + (C) ] In a mass ratio of (A ′): [(B) + (C)] = 100: 20 to 100: 60. When the ratio of (B) + (C) is less than 20, sufficient adhesive strength cannot be obtained, and when it is more than 60, the compatibility with the component (A) or the component (A ′) is deteriorated and excellent transparency. Sex cannot be obtained.
さらに、(B)、(C)成分の使用割合は、質量比で、(B):(C)=4:6〜6:4であるのが好ましく、5:5であるのが特に好ましい。 Furthermore, the use ratio of the components (B) and (C) is, by mass ratio, preferably (B) :( C) = 4: 6 to 6: 4, particularly preferably 5: 5.
このような割合で各成分を用いることにより、長期にわたって透明性、耐熱性に優れ、高温においても高い接着力を有する硬化物が得られる硬化性組成物を得ることができる。 By using each component in such a ratio, it is possible to obtain a curable composition capable of obtaining a cured product having excellent transparency and heat resistance over a long period of time and having a high adhesive force even at high temperatures.
本発明の硬化性組成物は、前記成分に、さらに、加熱時の酸化劣化を防止するために酸化防止剤を含むのが好ましい。
酸化防止剤としては、リン系酸化防止剤、フェノール系酸化防止剤、硫黄系酸化防止剤等が挙げられ、これらの中でもリン系酸化防止剤が好ましい。The curable composition of the present invention preferably further contains an antioxidant in addition to the above components to prevent oxidative deterioration during heating.
Examples of the antioxidant include phosphorus-based antioxidants, phenol-based antioxidants, sulfur-based antioxidants, and the like. Among these, phosphorus-based antioxidants are preferable.
リン系酸化防止剤としては、トリフェニルホスファイト、ジフェニルイソデシルホスファイト、フェニルジイソデシルホスファイト、トリス(ノニルフェニル)ホスファイト、ジイソデシルペンタエリスリトールホスファイト、トリス(2,4−ジ−t−ブチルフェニル)ホスファイト、サイクリックネオペンタンテトライルビス(オクタデシル)ホスファイト、サイクリックネオペンタンテトライルビス(2,4−ジ−t−ブチルフェニル)ホスファイト、サイクリックネオペンタンテトライルビス(2,4−ジ−t−ブチル−4−メチルフェニル)ホスファイト、ビス[2−t−ブチル−6−メチル−4−{2−(オクタデシルオキシカルボニル)エチル}フェニル]ヒドロゲンホスファイト等のホスファイト類;9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン−10−オキサイド、10−(3,5−ジ−t−ブチル−4−ヒドロキシベンジル)−9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン−10−オキサイド、10−デシロキシ−9,10−ジヒドロ−9−オキサ−10−ホスファフェナントレン−10−オキサイド等のオキサホスファフェナントレンオキサイド類;が挙げられる。 Phosphorus antioxidants include triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, tris (nonylphenyl) phosphite, diisodecylpentaerythritol phosphite, tris (2,4-di-t-butylphenyl) ) Phosphite, cyclic neopentanetetraylbis (octadecyl) phosphite, cyclic neopentanetetraylbis (2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis (2,4 -Di-t-butyl-4-methylphenyl) phosphite, bis [2-t-butyl-6-methyl-4- {2- (octadecyloxycarbonyl) ethyl} phenyl] hydrogen phosphite, etc. 9,10-dihydro- -Oxa-10-phosphaphenanthrene-10-oxide, 10- (3,5-di-t-butyl-4-hydroxybenzyl) -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10- And oxaphosphaphenanthrene oxides such as 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide.
フェノール系酸化防止剤としては、2,6−ジ−t−ブチル−p−クレゾール、ジブチルヒドロキシトルエン、ブチル化ヒドロキシアニソール、2,6−ジ−t−ブチル−p−エチルフェノール、ステアリル−β−(3,5−ジ−t−ブチル−4−ヒドロキシフェニル)プロピオネート等のモノフェノール類;2,2’−メチレンビス(4−メチル−6−t−ブチルフェノール)、2,2’−メチレンビス(4−エチル−6−t−ブチルフェノール)、4,4’−チオビス(3−メチル−6−t−ブチルフェノール)、4,4’−ブチリデンビス(3−メチル−6−t−ブチルフェノール)、3,9−ビス[1,1−ジメチル−2−{β−(3−t−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ}エチル]2,4,8,10−テトラオキサスピロ[5,5]ウンデカン等のビスフェノール類;1,1,3−トリス(2−メチル−4−ヒドロキシ−5−t−ブチルフェニル)ブタン、1,3,5−トリメチル−2,4,6−トリス(3,5−ジ−t−ブチル−4−ヒドロキシベンジル)ベンゼン、テトラキス−[メチレン−3−(3’,5’−ジ−t−ブチル−4’−ヒドロキシフェニル)プロピオネート]メタン、ビス[3,3’−ビス−(4’−ヒドロキシ−3’−t−ブチルフェニル)ブチリックアシッド]グリコールエステル、1,3,5−トリス(3’,5’−ジ−t−ブチル−4’−ヒドロキシベンジル)−S−トリアジン−2,4,6−(1H,3H,5H)トリオン、トコフェノール等の高分子型フェノール類;が挙げられる。 Examples of phenolic antioxidants include 2,6-di-t-butyl-p-cresol, dibutylhydroxytoluene, butylated hydroxyanisole, 2,6-di-t-butyl-p-ethylphenol, stearyl-β- Monophenols such as (3,5-di-t-butyl-4-hydroxyphenyl) propionate; 2,2′-methylenebis (4-methyl-6-t-butylphenol), 2,2′-methylenebis (4- Ethyl-6-tert-butylphenol), 4,4′-thiobis (3-methyl-6-tert-butylphenol), 4,4′-butylidenebis (3-methyl-6-tert-butylphenol), 3,9-bis [1,1-dimethyl-2- {β- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy} ethyl] 2,4,8, Bisphenols such as 10-tetraoxaspiro [5,5] undecane; 1,1,3-tris (2-methyl-4-hydroxy-5-tert-butylphenyl) butane, 1,3,5-trimethyl-2 , 4,6-tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene, tetrakis- [methylene-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) Propionate] methane, bis [3,3′-bis- (4′-hydroxy-3′-t-butylphenyl) butyric acid] glycol ester, 1,3,5-tris (3 ′, 5′-di-) t-butyl-4′-hydroxybenzyl) -S-triazine-2,4,6- (1H, 3H, 5H) trione, polymer phenols such as tocophenol;
硫黄系酸化防止剤としては、ジラウリル−3,3’−チオジプロピオネート、ジミリスチル−3,3’−チオジプロピオネート、ジステアリル−3,3’−チオジプロピオネート等が挙げられる。 Examples of the sulfur-based antioxidant include dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, distearyl-3,3'-thiodipropionate, and the like.
これら酸化防止剤は一種単独で、或いは二種以上を組み合わせて使用することができる。
酸化防止剤の使用量は、シラン化合物共重合体(A)又は(A’)100質量部に対して、好ましくは0.01〜10質量部である。These antioxidants can be used alone or in combination of two or more.
Preferably the usage-amount of antioxidant is 0.01-10 mass parts with respect to 100 mass parts of silane compound copolymers (A) or (A ').
本発明の硬化性組成物には、本発明の目的を阻害しない範囲で、さらに他の成分を含有させてもよい。
他の成分としては、紫外線吸収剤、光安定剤、希釈剤等が挙げられる。The curable composition of the present invention may further contain other components as long as the object of the present invention is not impaired.
Examples of other components include ultraviolet absorbers, light stabilizers, and diluents.
紫外線吸収剤は、得られる硬化物の耐光性を向上させる目的で添加される。
紫外線吸収剤としては、例えば、フェニルサリシレート、p−t−ブチルフェニルサリシレート、p−オクチルフェニルサリシレート等のサリチル酸類;2,4−ジヒドロキシベンゾフェノン、2−ヒドロキシ−4−メトキシベンゾフェノン、2−ヒドロキシ−4−オクトキシベンゾフェノン、2−ヒドロキシ−4−ドデシルオキシベンゾフェノン、2,2’−ジヒドロキシ−4−メトキシベンゾフェノン、2,2’−ジヒドロキシ−4,4’−ジメトキシベンゾフェノン、2−ヒドロキシ−4−メトキシ−5−スルホベンゾフェノン等のベンゾフェノン類;2−(2’−ヒドロキシ−5’−メチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−5’−t−ブチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ−t−ブチルフェニル)ベンゾトリアゾール、2−(2’−ヒドロキシ−3’−t−ブチル−5’−メチルフェニル)−5−クロロベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ−t−ブチルフェニル)−5−クロロベンゾトリアゾール、2−(2’−ヒドロキシ−3’,5’−ジ−t−アミルフェニル)ベンゾトリアゾール、2−{(2’−ヒドロキシ−3’,3’’,4’’,5’’,6’’−テトラヒドロフタルイミドメチル)−5’−メチルフェニル}ベンゾトリアゾール等のベンゾトリアゾール類;ビス(2,2,6,6−テトラメチル−4−ピペリジル)セバケート、ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)セバケート、ビス(1,2,2,6,6−ペンタメチル−4−ピペリジル)[{3,5−ビス(1,1−ジメチルエチル)−4−ヒドロキシフェニル}メチル]ブチルマロネート等のヒンダードアミン類;等が挙げられる。The ultraviolet absorber is added for the purpose of improving the light resistance of the resulting cured product.
Examples of the ultraviolet absorber include salicylic acids such as phenyl salicylate, pt-butylphenyl salicylate, p-octylphenyl salicylate; 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4 -Octoxybenzophenone, 2-hydroxy-4-dodecyloxybenzophenone, 2,2'-dihydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2-hydroxy-4-methoxy- Benzophenones such as 5-sulfobenzophenone; 2- (2′-hydroxy-5′-methylphenyl) benzotriazole, 2- (2′-hydroxy-5′-t-butylphenyl) benzotriazole, 2- (2 ′ -Hydroxy-3 ', 5'-di-t -Butylphenyl) benzotriazole, 2- (2'-hydroxy-3'-t-butyl-5'-methylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di -T-butylphenyl) -5-chlorobenzotriazole, 2- (2'-hydroxy-3 ', 5'-di-t-amylphenyl) benzotriazole, 2-{(2'-hydroxy-3', 3 Benzotriazoles such as '', 4 '', 5 '', 6 ''-tetrahydrophthalimidomethyl) -5'-methylphenyl} benzotriazole; bis (2,2,6,6-tetramethyl-4-piperidyl ) Sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, bis (1,2,2,6,6-pentamethyl-4-piperidyl) [{3,5-bis (1 , 1-Dimethyl Chill) -4-hydroxyphenyl} methyl] butyl hindered amines, such as malonate; and the like.
これらの紫外線吸収剤は一種単独で、或いは二種以上を組み合わせて使用することができる。
紫外線吸収剤の使用量は、シラン化合物共重合体(A)又は(A’)100質量部に対して、好ましくは0.01〜10質量部である。These ultraviolet absorbers can be used alone or in combination of two or more.
Preferably the usage-amount of a ultraviolet absorber is 0.01-10 mass parts with respect to 100 mass parts of silane compound copolymers (A) or (A ').
光安定剤は、得られる硬化物の耐光性を向上させる目的で添加される。
光安定剤としては、例えば、ポリ[{6−(1,1,3,3,−テトラメチルブチル)アミノ−1,3,5−トリアジン−2,4−ジイル}{(2,2,6,6−テトラメチル−4−ピペリジン)イミノ}ヘキサメチレン{(2,2,6,6−テトラメチル−4−ピペリジン)イミノ}]等のヒンダードアミン類が挙げられる。The light stabilizer is added for the purpose of improving the light resistance of the resulting cured product.
Examples of the light stabilizer include poly [{6- (1,1,3,3, -tetramethylbutyl) amino-1,3,5-triazine-2,4-diyl} {(2,2,6 , 6-tetramethyl-4-piperidine) imino} hexamethylene {(2,2,6,6-tetramethyl-4-piperidine) imino}] and the like.
これらの光安定剤は一種単独で、或いは二種以上を組み合わせて使用することができる。
光安定剤の使用量は、シラン化合物共重合体(A)又は(A’)100質量部に対して、好ましくは0.01〜10質量部である。These light stabilizers can be used alone or in combination of two or more.
The amount of the light stabilizer used is preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the silane compound copolymer (A) or (A ′).
希釈剤は、硬化性組成物の粘度を調整するため添加される。
希釈剤としては、例えば、グリセリンジグリシジルエーテル、ブタンジオールジグリシジルエーテル、ジグリシジルアニリン、ネオペンチルグリコールグリシジルエーテル、シクロヘキサンジメタノールジグリシジルエーテル、アルキレンジグリシジルエーテル、ポリグリコールジグリシジルエーテル、ポリプロピレングリコールジグリシジルエーテル、トリメチロールプロパントリグリシジルエーテル、グリセリントリグリシジルエーテル、4−ビニルシクロヘキセンモノオキサイド、ビニルシクロヘキセンジオキサイド、メチル化ビニルシクロヘキセンジオキサイド等が挙げられる。
これらの希釈剤は一種単独で、或いは二種以上を組み合わせて使用することができる。A diluent is added in order to adjust the viscosity of the curable composition.
Examples of the diluent include glycerin diglycidyl ether, butanediol diglycidyl ether, diglycidyl aniline, neopentyl glycol glycidyl ether, cyclohexane dimethanol diglycidyl ether, alkylene diglycidyl ether, polyglycol diglycidyl ether, and polypropylene glycol diglycidyl ether. Examples include ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether, 4-vinylcyclohexene monoxide, vinylcyclohexene dioxide, methylated vinylcyclohexene dioxide, and the like.
These diluents can be used singly or in combination of two or more.
本発明の硬化性組成物は、例えば、前記(A)又は(A’)、(B)、(C)成分、並びに、所望により酸化防止剤及び他の成分を所定割合で配合して、公知の方法により混合、脱泡することにより得ることができる。 The curable composition of the present invention is, for example, known by blending the above components (A) or (A ′), (B), (C), and, optionally, an antioxidant and other components in a predetermined ratio. It can be obtained by mixing and defoaming by the above method.
以上のようにして得られる本発明の硬化性組成物によれば、高エネルギーの光が照射される場合や高温状態であっても、着色して透明性が低下したりすることがなく、長期にわたって優れた透明性を有し、かつ、高い接着力を有する硬化物を得ることができる。
したがって、本発明の硬化性組成物は、光学部品や成形体の原料、接着剤、コーティング剤等として好適に使用される。特に、光素子の高輝度化に伴う、光素子固定材の劣化に関する問題を解決することができることから、本発明の硬化性組成物は、光素子固定材用組成物として好適に使用することができる。According to the curable composition of the present invention obtained as described above, even when irradiated with high energy light or in a high temperature state, it is not colored and the transparency is not lowered, and it is long-term. It is possible to obtain a cured product having excellent transparency and high adhesive strength.
Therefore, the curable composition of the present invention is suitably used as a raw material for optical parts and molded articles, an adhesive, a coating agent, and the like. In particular, since the problem relating to deterioration of the optical element fixing material accompanying the increase in luminance of the optical element can be solved, the curable composition of the present invention can be suitably used as a composition for optical element fixing material. it can.
2)硬化物
本発明の第2は、本発明の硬化性組成物を硬化してなる硬化物である。
本発明の硬化性組成物を硬化する方法としては加熱硬化が挙げられる。硬化するときの加熱温度は、通常、100〜200℃であり、加熱時間は、通常10分から20時間、好ましくは30分から10時間である。2) Cured product The second of the present invention is a cured product obtained by curing the curable composition of the present invention.
Heat curing is mentioned as a method of hardening the curable composition of this invention. The heating temperature for curing is usually 100 to 200 ° C., and the heating time is usually 10 minutes to 20 hours, preferably 30 minutes to 10 hours.
本発明の硬化物は、高エネルギーの光が照射される場合や高温状態であっても、着色して透明性が低下したりすることがなく、長期にわたって優れた透明性を有し、かつ、高い接着力を有する。
したがって、本発明の硬化物は、光学部品や成形体、接着層、コーティング層等として好適に使用される。特に、光素子の高輝度化に伴う、光素子固定材の劣化に関する問題を解決することができることから、本発明の硬化物は、光素子固定材として好適に使用することができる。The cured product of the present invention has excellent transparency over a long period of time, even when irradiated with high energy light or in a high temperature state, without being colored and having a reduced transparency, and High adhesive strength.
Therefore, the hardened | cured material of this invention is used suitably as an optical component, a molded object, an adhesive layer, a coating layer, etc. In particular, since the problem relating to the deterioration of the optical element fixing material accompanying the increase in luminance of the optical element can be solved, the cured product of the present invention can be suitably used as the optical element fixing material.
本発明の硬化物が高い接着力を有することは、例えば、次のようにして接着力を測定することで確認することができる。すなわち、シリコンチップのミラー面に硬化性組成物を塗布し、塗布面を被着体の上に載せ圧着し、加熱処理して硬化させる。これを、予め所定温度(例えば、23℃)に加熱したボンドテスターの測定ステージ上に30秒間放置し、被着体から50μmの高さの位置より、接着面に対し水平方法(せん断方向)に応力をかけ、試験片と被着体との接着力を測定する。
硬化物の接着力は、23℃において110N/2mm□以上であることが好ましい。It can be confirmed that the cured product of the present invention has a high adhesive force, for example, by measuring the adhesive force as follows. That is, the curable composition is applied to the mirror surface of the silicon chip, and the coated surface is placed on the adherend and pressure-bonded, and then heated and cured. This is left for 30 seconds on a measurement stage of a bond tester heated in advance to a predetermined temperature (for example, 23 ° C.), and in a horizontal direction (shear direction) with respect to the adhesion surface from a position 50 μm high from the adherend. Stress is applied and the adhesion between the test piece and the adherend is measured.
The adhesive strength of the cured product is preferably 110 N / 2 mm □ or more at 23 ° C.
前記硬化物が透明性に優れることは、光透過率を測定することで確認することができる。硬化物の光透過率は、波長450nmの光で、80%以上が好ましく、85%以上がより好ましい。 It can be confirmed that the cured product is excellent in transparency by measuring light transmittance. The light transmittance of the cured product is preferably 80% or more, more preferably 85% or more, with light having a wavelength of 450 nm.
前記硬化物が長期にわたって耐熱性に優れることは、硬化物を高温下に長時間置いた後であっても透明性の変化が小さいことから確認することができる。透明性は、150℃で300時間置いた後に、波長450nmの透過率が初期透過率の80%以上であることが好ましい。 It can be confirmed that the cured product has excellent heat resistance over a long period of time because the change in transparency is small even after the cured product has been placed at a high temperature for a long time. The transparency is preferably such that the transmittance at a wavelength of 450 nm is 80% or more of the initial transmittance after being placed at 150 ° C. for 300 hours.
3)硬化性組成物の使用方法
本発明の第3は、本発明の硬化性組成物を、光素子固定材用接着剤又は光素子固定材用封止剤として使用する方法である。
光素子としては、LED、LD等の発光素子、受光素子、複合光素子、光集積回路等が挙げられる。3) Method of using curable composition The third of the present invention is a method of using the curable composition of the present invention as an adhesive for optical element fixing materials or an encapsulant for optical element fixing materials.
Examples of optical elements include light emitting elements such as LEDs and LDs, light receiving elements, composite optical elements, and optical integrated circuits.
〈光素子固定材用接着剤〉
本発明の硬化性組成物は、光素子固定材用接着剤として好適に使用することができる。<Adhesive for optical element fixing material>
The curable composition of this invention can be used conveniently as an adhesive agent for optical element fixing materials.
本発明の硬化性組成物を光素子固定材用接着剤として使用する方法としては、接着の対象とする材料(光素子とその基板等)の一方又は両方の接着面に該組成物を塗布し、圧着した後、加熱硬化させ、接着の対象とする材料同士を強固に接着させる方法が挙げられる。 As a method of using the curable composition of the present invention as an adhesive for an optical element fixing material, the composition is applied to one or both adhesive surfaces of a material to be bonded (such as an optical element and its substrate). After the pressure bonding, there is a method in which the material to be bonded is firmly bonded by heat curing.
光素子を接着するための主な基板材料としては、ソーダライムガラス、耐熱性硬質ガラス等のガラス類;セラミックス;鉄、銅、アルミニウム、金、銀、白金、クロム、チタン及びこれらの金属の合金、ステンレス(SUS302、SUS304、SUS304L、SUS309等)等の金属類;ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、エチレン−酢酸ビニル共重合体、ポリスチレン、ポリカーボネート、ポリメチルペンテン、ポリスルホン、ポリエーテルエーテルケトン、ポリエーテルスルホン、ポリフェニレンスルフィド、ポリエーテルイミド、ポリイミド、ポリアミド、アクリル樹脂、ノルボルネン系樹脂、シクロオレフィン樹脂、ガラスエポキシ樹脂等の合成樹脂;等が挙げられる。 Main substrate materials for bonding optical elements include glass such as soda lime glass and heat-resistant hard glass; ceramics; iron, copper, aluminum, gold, silver, platinum, chromium, titanium, and alloys of these metals , Metals such as stainless steel (SUS302, SUS304, SUS304L, SUS309, etc.); polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, ethylene-vinyl acetate copolymer, polystyrene, polycarbonate, polymethylpentene, polysulfone, polyetheretherketone , Synthetic resins such as polyethersulfone, polyphenylene sulfide, polyetherimide, polyimide, polyamide, acrylic resin, norbornene resin, cycloolefin resin, glass epoxy resin, etc.
加熱硬化させる際の加熱温度は、用いる硬化性組成物等にもよるが、通常、100〜200℃である。加熱時間は、通常10分から20時間、好ましくは30分から10時間である。 The heating temperature at the time of heat curing is usually 100 to 200 ° C., although it depends on the curable composition used. The heating time is usually 10 minutes to 20 hours, preferably 30 minutes to 10 hours.
〈光素子固定材用封止剤〉
本発明の硬化性組成物は、光素子封止体の封止剤として好適に用いることができる。<Sealant for optical element fixing material>
The curable composition of this invention can be used suitably as a sealing agent of an optical element sealing body.
本発明の硬化性組成物を光素子固定材用封止剤として使用する方法としては、例えば、該組成物を所望の形状に成形して、光素子を内包した成形体を得た後、そのものを加熱硬化させることにより光素子封止体を製造する方法等が挙げられる。
本発明の硬化性組成物を所望の形状に成形する方法としては、特に限定されるものではなく、通常のトランスファー成形法や、注型法等の公知のモールド法を採用できる。As a method of using the curable composition of the present invention as a sealant for an optical element fixing material, for example, after molding the composition into a desired shape to obtain a molded body containing the optical element, the process itself And the like, and the like.
The method for molding the curable composition of the present invention into a desired shape is not particularly limited, and a known molding method such as a normal transfer molding method or a casting method can be employed.
加熱硬化する際の加熱温度は、用いる硬化性組成物等にもよるが、通常、100〜200℃である。加熱時間は、通常10分から20時間、好ましくは30分から10時間である。 Although the heating temperature at the time of heat-curing depends on the curable composition to be used, it is usually 100 to 200 ° C. The heating time is usually 10 minutes to 20 hours, preferably 30 minutes to 10 hours.
得られる光素子封止体は、本発明の硬化性組成物を用いているので、光素子に、白色や青色発光LED等の、発光のピーク波長が400〜490nmと短波長のものを用いても、熱や光により着色劣化することがない透明性、耐熱性に優れるものである。 Since the obtained optical element sealing body uses the curable composition of the present invention, an optical element having a short peak wavelength of 400 to 490 nm, such as white or blue light emitting LED, is used. Also, it is excellent in transparency and heat resistance that does not deteriorate due to heat or light.
次に実施例及び比較例により本発明を更に詳細に説明するが、本発明は下記の実施例に限定されるものではない。 EXAMPLES Next, although an Example and a comparative example demonstrate this invention further in detail, this invention is not limited to the following Example.
(重量平均分子量測定)
製造例で得たシラン化合物共重合体の重量平均分子量(Mw)は標準ポリスチレン換算値とし、以下の装置及び条件にて測定した。
装置名:HLC−8220GPC、東ソー社製
カラム:TSKgelGMHXL、TSKgelGMHXLおよびTSKgel2000HXLを順次連結したもの
溶媒:テトラヒドロフラン
注入量:80μl
測定温度:40℃
流速:1ml/分
検出器:示差屈折計(Weight average molecular weight measurement)
The weight average molecular weight (Mw) of the silane compound copolymer obtained in the production example was a standard polystyrene conversion value, and was measured with the following apparatus and conditions.
Device name: HLC-8220GPC, manufactured by Tosoh Corporation Column: TSKgelGMHXL, TSKgelGMHXL and TSKgel2000HXL sequentially connected Solvent: tetrahydrofuran Injection amount: 80 μl
Measurement temperature: 40 ° C
Flow rate: 1 ml / min Detector: Differential refractometer
(IRスペクトルの測定)
製造例で得たシラン化合物共重合体のIRスペクトルは以下の装置を使用して測定した。
フーリエ変換赤外分光光度計(Spectrum100、パーキンエルマー社製)(Measurement of IR spectrum)
The IR spectrum of the silane compound copolymer obtained in Production Example was measured using the following apparatus.
Fourier transform infrared spectrophotometer (Spectrum 100, manufactured by PerkinElmer)
(製造例1)
300mlのナス型フラスコに、シラン化合物(2)としてフェニルトリメトキシシラン(東京化成工業社製)16.7g(84mmol)と、シラン化合物(1)として3−アセトキシプロピルトリメトキシシラン(アヅマックス社製)8.0g(36mmol)、溶媒としてトルエン120ml、蒸留水60mlを仕込んだ後、攪拌しながら、触媒としてリン酸(関東化学社製)0.15g(1.5mmol)を加え、室温でさらに16時間攪拌を継続した。(Production Example 1)
In a 300 ml eggplant-shaped flask, 16.7 g (84 mmol) of phenyltrimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.) as the silane compound (2) and 3-acetoxypropyltrimethoxysilane (manufactured by Amax Co.) as the silane compound (1) After charging 8.0 g (36 mmol), 120 ml of toluene as a solvent and 60 ml of distilled water, 0.15 g (1.5 mmol) of phosphoric acid (manufactured by Kanto Chemical Co., Inc.) was added as a catalyst while stirring, and further at room temperature for 16 hours. Stirring was continued.
反応終了後、反応混合物に酢酸エチル100mlを加え、飽和炭酸水素ナトリウム水溶液にて中和した。しばらく静置した後、水を除去し有機層を蒸留水にて2回洗浄後、無水硫酸マグネシウムで乾燥した。硫酸マグネシウムをろ別後、ろ液をエバポレーターにて50mlまで濃縮し、これを多量のn−ヘキサン中に滴下して再沈殿させ、沈殿物をデカンテーションにより分離した。得られた沈殿物をメチルエチルケトン(MEK)に溶解して回収し、エバポレーターで溶媒を減圧留去し、真空乾燥することにより、シラン化合物共重合体(A1)14.7gを得た。 After completion of the reaction, 100 ml of ethyl acetate was added to the reaction mixture and neutralized with a saturated aqueous sodium hydrogen carbonate solution. After standing still for a while, water was removed, and the organic layer was washed twice with distilled water and then dried over anhydrous magnesium sulfate. After the magnesium sulfate was filtered off, the filtrate was concentrated to 50 ml with an evaporator, dropped into a large amount of n-hexane to cause reprecipitation, and the precipitate was separated by decantation. The obtained precipitate was dissolved and recovered in methyl ethyl ketone (MEK), and the solvent was distilled off under reduced pressure with an evaporator, followed by vacuum drying to obtain 14.7 g of a silane compound copolymer (A1).
シラン化合物共重合体(A1)の重量平均分子量(Mw)は2,500であり、分子量分布(Mw/Mn)は1.53であった。
また、シラン化合物共重合体(A1)のIRスペクトルデータを以下に示す。
Si−Ph:699cm−1,741cm−1,Si−O:1132cm−1,−CO:1738cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A1) was 2,500, and the molecular weight distribution (Mw / Mn) was 1.53.
In addition, IR spectrum data of the silane compound copolymer (A1) is shown below.
Si—Ph: 699 cm −1 , 741 cm −1 , Si—O: 1132 cm −1 , —CO: 1738 cm −1
(製造例2)
製造例1において、フェニルトリメトキシシランの使用量を14.3g(72mmol)とし、3−アセトキシプロピルトリメトキシシランの使用量を10.7g(48mmol)とした以外は製造例1と同様にして、シラン化合物共重合体(A2)15.9gを得た。(Production Example 2)
In Production Example 1, the same procedure as in Production Example 1 except that the amount of phenyltrimethoxysilane used was 14.3 g (72 mmol) and the amount of 3-acetoxypropyltrimethoxysilane used was 10.7 g (48 mmol). 15.9 g of silane compound copolymer (A2) was obtained.
シラン化合物共重合体(A2)の重量平均分子量(Mw)は2,600であり、分子量分布(Mw/Mn)は1.51であった。
また、シラン化合物共重合体(A2)のIRスペクトルデータを以下に示す。
Si−Ph:699cm−1,741cm−1,Si−O:1132cm−1,−CO:1738cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A2) was 2,600, and the molecular weight distribution (Mw / Mn) was 1.51.
In addition, IR spectrum data of the silane compound copolymer (A2) is shown below.
Si—Ph: 699 cm −1 , 741 cm −1 , Si—O: 1132 cm −1 , —CO: 1738 cm −1
(製造例3)
製造例1において、フェニルトリメトキシシランの使用量を11.9g(60mmol)とし、3−アセトキシプロピルトリメトキシシランの使用量を13.3g(60mmol)とした以外は製造例1と同様にして、シラン化合物共重合体(A3)15.3gを得た。(Production Example 3)
In Production Example 1, the same procedure as in Production Example 1 except that the amount of phenyltrimethoxysilane used was 11.9 g (60 mmol) and the amount of 3-acetoxypropyltrimethoxysilane used was 13.3 g (60 mmol). The silane compound copolymer (A3) 15.3g was obtained.
シラン化合物共重合体(A3)の重量平均分子量(Mw)は2,600であり、分子量分布(Mw/Mn)は1.60であった。
また、シラン化合物共重合体(A3)のIRスペクトルデータを以下に示す。
Si−Ph:700cm−1,742cm−1,Si−O:1132cm−1,−CO:1738cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A3) was 2,600, and the molecular weight distribution (Mw / Mn) was 1.60.
In addition, IR spectrum data of the silane compound copolymer (A3) is shown below.
Si-Ph: 700cm -1, 742cm -1, Si-O: 1132cm -1, -CO: 1738cm -1
(製造例4)
製造例1において、フェニルトリメトキシシラン16.7g(84mmol)と3−アセトキシプロピルトリメトキシシラン8.0g(36mmol)を用いる代わりに、フェニルトリメトキシシラン(東京化成工業社製)11.9g(60mmol)と3−グリシドキシプロピルトリメトキシシラン(東京化成工業社製)14.2g(60mmol)を用いる以外は、製造例1と同様にして、シラン化合物共重合体(A4)16.3gを得た。(Production Example 4)
In Production Example 1, instead of using 16.7 g (84 mmol) of phenyltrimethoxysilane and 8.0 g (36 mmol) of 3-acetoxypropyltrimethoxysilane, 11.9 g (60 mmol) of phenyltrimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.) ) And 3-glycidoxypropyltrimethoxysilane (Tokyo Kasei Kogyo Co., Ltd.) 14.2 g (60 mmol) are used in the same manner as in Production Example 1 to obtain 16.3 g of the silane compound copolymer (A4). It was.
シラン化合物共重合体(A4)の重量平均分子量(Mw)は2,800であり、分子量分布(Mw/Mn)は1.56であった。
また、シラン化合物共重合体(A4)のIRスペクトルデータを以下に示す。
Si−Ph:700cm−1,742cm−1,Si−O:1132cm−1,エポキシ基:1254cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A4) was 2,800, and the molecular weight distribution (Mw / Mn) was 1.56.
In addition, IR spectrum data of the silane compound copolymer (A4) is shown below.
Si-Ph: 700cm -1, 742cm -1, Si-O: 1132cm -1, epoxy group: 1254cm -1
(製造例5)
300mlのナス型フラスコにシラン化合物(2)としてフェニルトリメトキシシラン(東京化成工業社製)11.9g(60mmol)と、シラン化合物(1)として3−クロロプロピルトリメトキシシラン(東京化成工業社製)11.9g(60mmol)、溶媒としてトルエン60ml、蒸留水30mlを仕込んだ後、攪拌しながら、触媒としてリン酸(関東化学社製)0.15g(1.5mmol)を加え、室温でさらに16時間攪拌を継続した。(Production Example 5)
In a 300 ml eggplant-shaped flask, 11.9 g (60 mmol) of phenyltrimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.) as the silane compound (2) and 3-chloropropyltrimethoxysilane (manufactured by Tokyo Chemical Industry Co., Ltd.) as the silane compound (1) ) 11.9 g (60 mmol), 60 ml of toluene as a solvent and 30 ml of distilled water were added, and then 0.15 g (1.5 mmol) of phosphoric acid (manufactured by Kanto Chemical Co., Inc.) was added as a catalyst while stirring. Stirring was continued for an hour.
反応終了後、飽和炭酸水素ナトリウム水溶液にて中和した。これに酢酸エチル100mlを加え、しばらく撹拌し、これを静置した後、水を除去し有機層を蒸留水にて2回洗浄後、無水硫酸マグネシウムで乾燥した。硫酸マグネシウムをろ別後、ろ液を多量のn−ヘキサン中に滴下して再沈殿させ、ヘキサンを除去して沈殿物を取り出した。得られた沈殿物をメチルエチルケトン(MEK)に溶解して回収し、エバポレーターで溶媒を減圧留去し、真空乾燥することにより、シラン化合物共重合体(A5)12.9gを得た。 After completion of the reaction, the reaction solution was neutralized with a saturated aqueous sodium hydrogen carbonate solution. To this was added 100 ml of ethyl acetate, and the mixture was stirred for a while and allowed to stand. Then, water was removed, the organic layer was washed twice with distilled water, and dried over anhydrous magnesium sulfate. After magnesium sulfate was filtered off, the filtrate was dropped into a large amount of n-hexane to cause reprecipitation, and hexane was removed to take out the precipitate. The obtained precipitate was dissolved and recovered in methyl ethyl ketone (MEK), and the solvent was distilled off under reduced pressure with an evaporator, followed by vacuum drying to obtain 12.9 g of a silane compound copolymer (A5).
シラン化合物共重合体(A5)の重量平均分子量(Mw)は3,600であり、分子量分布(Mw/Mn)は1.63であった。
また、シラン化合物共重合体(A5)のIRスペクトルデータを以下に示す。
Si−Ph:700cm−1,741cm−1,Si−O:1133cm−1,−Cl:648cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A5) was 3,600, and the molecular weight distribution (Mw / Mn) was 1.63.
In addition, IR spectrum data of the silane compound copolymer (A5) is shown below.
Si-Ph: 700cm -1, 741cm -1, Si-O: 1133cm -1, -Cl: 648cm -1
(製造例6)
製造例5において、フェニルトリメトキシシランの使用量を16.7g(84mmol)とし、3−クロロプロピルトリメトキシシランの使用量を7.15g(36mmol)とした以外は製造例5と同様にし、シラン化合物共重合体(A6)13.4gを得た。(Production Example 6)
In Production Example 5, the same procedure as in Production Example 5 was conducted except that the amount of phenyltrimethoxysilane used was 16.7 g (84 mmol) and the amount of 3-chloropropyltrimethoxysilane used was 7.15 g (36 mmol). 13.4 g of compound copolymer (A6) was obtained.
シラン化合物共重合体(A6)の重量平均分子量(Mw)は3,300であり、分子量分布(Mw/Mn)は1.59であった。
また、シラン化合物共重合体(A6)のIRスペクトルデータを以下に示す。
Si−Ph:700cm−1,742cm−1,Si−O:1133cm−1,−Cl:648cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A6) was 3,300, and the molecular weight distribution (Mw / Mn) was 1.59.
In addition, IR spectrum data of the silane compound copolymer (A6) is shown below.
Si-Ph: 700cm -1, 742cm -1, Si-O: 1133cm -1, -Cl: 648cm -1
(製造例7)
製造例5において、フェニルトリメトキシシランの使用量を14.3g(72mmol)とし、3−クロロプロピルトリメトキシシランの使用量を9.54g(48mmol)とした以外は製造例5と同様にし、シラン化合物共重合体(A7)13.1gを得た。(Production Example 7)
In Production Example 5, the same procedure as in Production Example 5 was conducted except that the amount of phenyltrimethoxysilane used was 14.3 g (72 mmol) and the amount of 3-chloropropyltrimethoxysilane used was 9.54 g (48 mmol). 13.1 g of compound copolymer (A7) was obtained.
シラン化合物共重合体(A7)の重量平均分子量(Mw)は3,400であり、分子量分布(Mw/Mn)は1.61であった。
また、シラン化合物共重合体(A7)のIRスペクトルデータを以下に示す。
Si−Ph:699cm−1,741cm−1,Si−O:1132cm−1,−Cl:648cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A7) was 3,400, and the molecular weight distribution (Mw / Mn) was 1.61.
In addition, IR spectrum data of the silane compound copolymer (A7) is shown below.
Si—Ph: 699 cm −1 , 741 cm −1 , Si—O: 1132 cm −1 , —Cl: 648 cm −1
(製造例8)
製造例5において、3−クロロプロピルトリメトキシシラン11.9gに代えて、2−シアノエチルトリメトキシシラン(アヅマックス社製)10.5g(60mmol)を使用したこと以外は製造例5と同様にし、シラン化合物共重合体(A8)12.3gを得た。(Production Example 8)
In Production Example 5, in place of 11.9 g of 3-chloropropyltrimethoxysilane, 10.5 g (60 mmol) of 2-cyanoethyltrimethoxysilane (manufactured by Amax Co.) was used in the same manner as in Production Example 5, except that silane 12.3 g of compound copolymer (A8) was obtained.
シラン化合物共重合体(A8)の重量平均分子量(Mw)は3,500であり、分子量分布(Mw/Mn)は1.61であった。
また、シラン化合物共重合体(A8)のIRスペクトルデータを以下に示す。
Si−Ph:700cm−1,742cm−1,Si−O:1133cm−1,−CN:2252cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A8) was 3,500, and the molecular weight distribution (Mw / Mn) was 1.61.
In addition, IR spectrum data of the silane compound copolymer (A8) is shown below.
Si-Ph: 700cm -1, 742cm -1, Si-O: 1133cm -1, -CN: 2252cm -1
(製造例9)
製造例8において、フェニルトリメトキシシランの使用量を16.7g(84mmol)とし、2−シアノエチルトリメトキシシランの使用量を6.31g(36mmol)とした以外は製造例8と同様にし、シラン化合物共重合体(A9)13.3gを得た。(Production Example 9)
In Production Example 8, the amount of phenyltrimethoxysilane used was 16.7 g (84 mmol), and the amount of 2-cyanoethyltrimethoxysilane used was 6.31 g (36 mmol). 13.3 g of copolymer (A9) was obtained.
シラン化合物共重合体(A9)の重量平均分子量(Mw)は3,200であり、分子量分布(Mw/Mn)は1.64であった。
また、シラン化合物共重合体(A9)のIRスペクトルデータを以下に示す。
Si−Ph:699cm−1,742cm−1,Si−O:1131cm−1,−CN:2253cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A9) was 3,200, and the molecular weight distribution (Mw / Mn) was 1.64.
In addition, IR spectrum data of the silane compound copolymer (A9) is shown below.
Si—Ph: 699 cm −1 , 742 cm −1 , Si—O: 1131 cm −1 , —CN: 2253 cm −1
(製造例10)
製造例8において、フェニルトリメトキシシランの使用量を14.3g(72mmol)とし、2−シアノエチルトリメトキシシランの使用量を7.01g(48mmol)とした以外は製造例8と同様にし、シラン化合物共重合体(A10)12.9gを得た。(Production Example 10)
The same procedure as in Production Example 8 was conducted except that the amount of phenyltrimethoxysilane used was 14.3 g (72 mmol) and the amount of 2-cyanoethyltrimethoxysilane used was 7.01 g (48 mmol). 12.9 g of copolymer (A10) was obtained.
シラン化合物共重合体(A10)の重量平均分子量(Mw)は3,300であり、分子量分布(Mw/Mn)は1.62であった。
また、シラン化合物共重合体(A10)のIRスペクトルデータを以下に示す。
Si−Ph:699cm−1,742cm−1,Si−O:1131cm−1,−CN:2253cm−1 The weight average molecular weight (Mw) of the silane compound copolymer (A10) was 3,300, and the molecular weight distribution (Mw / Mn) was 1.62.
In addition, IR spectrum data of the silane compound copolymer (A10) is shown below.
Si—Ph: 699 cm −1 , 742 cm −1 , Si—O: 1131 cm −1 , —CN: 2253 cm −1
(実施例1)
製造例1で得たシラン化合物共重合体(A1)10gに、(B)成分として3,4−エポキシシクロヘキサンカルボン酸3,4−エポキシシクロヘキシルメチル(シグマアルドリッチ社製)1.5g、(C)成分として、カルボキシル基を有する脂環式酸無水物としてシクロヘキサン−1,2,4−トリカルボン酸−1,2−無水物(三菱ガス化学社製)0.15g、及びその他の脂環式酸無水物として4−メチルシクロヘキサン−1,2−ジカルボン酸無水物(東京化成社製)1.35gを加え、全容を十分に混合、脱泡し、硬化性組成物(1)を得た。Example 1
10 g of the silane compound copolymer (A1) obtained in Production Example 1 and 1.5 g of 3,4-epoxycyclohexanecarboxylic acid 3,4-epoxycyclohexylmethyl (manufactured by Sigma-Aldrich) as the component (B), (C) As components, cycloaliphatic-1,2,4-tricarboxylic acid-1,2-anhydride (manufactured by Mitsubishi Gas Chemical Company) 0.15 g as an alicyclic acid anhydride having a carboxyl group, and other alicyclic acid anhydrides As a product, 1.35 g of 4-methylcyclohexane-1,2-dicarboxylic acid anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) was added, and the entire volume was sufficiently mixed and defoamed to obtain a curable composition (1).
(実施例2〜8)
実施例1において、シラン化合物共重合体、(B)成分、及び(C)成分を下記第1表−1に記載の種類及び配合量で用いる他は、実施例1と同様にして、硬化性組成物(2)〜(8)を得た。(Examples 2 to 8)
In Example 1, the silane compound copolymer, the component (B), and the component (C) are used in the same manner as in Example 1 except that they are used in the types and amounts described in Table 1 below. Compositions (2) to (8) were obtained.
(実施例9、10)
実施例4、5において、さらにリン系の酸化防止剤であるIRGAFOS168(チバ・ジャパン社製)0.5質量部加えた以外、実施例4、5と同様にして、硬化性組成物(9)、(10)をそれぞれ得た。(Examples 9 and 10)
In Examples 4 and 5, a curable composition (9) was obtained in the same manner as in Examples 4 and 5 except that 0.5 parts by mass of IRGAFOS168 (manufactured by Ciba Japan), which is a phosphorus-based antioxidant, was further added. , (10) were obtained.
(比較例1、2)
実施例1において、シラン化合物共重合体、(B)成分、及び(C)成分を下記第1表−1に記載の配合量で用いる他は、実施例1と同様にして、硬化性組成物(11)、(12)をそれぞれ得た。(Comparative Examples 1 and 2)
In Example 1, a curable composition was obtained in the same manner as in Example 1, except that the silane compound copolymer, the component (B), and the component (C) were used in the amounts shown in Table 1 below. (11) and (12) were obtained, respectively.
(比較例3)
実施例1において、(C)成分に代えて脂環式アミン系硬化剤(商品名:EH3895、ADEKA社製)1.5gを用いる他は、実施例1と同様にして、硬化性組成物(13)を得た。(Comparative Example 3)
In Example 1, a curable composition (in the same manner as in Example 1 except that 1.5 g of an alicyclic amine-based curing agent (trade name: EH3895, manufactured by ADEKA) was used instead of the component (C). 13) was obtained.
(比較例4)
実施例1において、(C)成分に代えて4−メチルシクロヘキサン−1,2−ジカルボン酸無水物(東京化成社製)1.45g及び硬化触媒のトリフェニルホスフィン(関東化学社製)0.05gを用いる他は、実施例1と同様にして、硬化性組成物(14)を得た。(Comparative Example 4)
In Example 1, instead of the component (C), 1.45 g of 4-methylcyclohexane-1,2-dicarboxylic acid anhydride (manufactured by Tokyo Chemical Industry Co., Ltd.) and 0.05 g of a curing catalyst triphenylphosphine (manufactured by Kanto Chemical Co., Ltd.) A curable composition (14) was obtained in the same manner as in Example 1, except that
(比較例5)
実施例3において、シラン化合物共重合体(A2)に代えて製造例4で得たシラン化合物共重合体(A4)10gを用いる以外は、実施例3と同様にして、硬化性組成物(15)を得た。(Comparative Example 5)
In Example 3, it replaces with a silane compound copolymer (A2), and it uses similarly to Example 3 except using 10g of silane compound copolymers (A4) obtained by manufacture example 4, curable composition (15 )
(実施例11〜16、比較例6〜13)
実施例1において、シラン化合物共重合体、(B)成分、及び(C)成分等を下記第1表−2に記載の種類及び配合量で用いる他は、実施例1と同様にして、硬化性組成物(16)〜(29)をそれぞれ得た。(Examples 11-16, Comparative Examples 6-13)
In Example 1, the silane compound copolymer, the component (B), the component (C), etc. were used in the same manner as in Example 1 except that they were used in the types and amounts shown in Table 1 below. Sex compositions (16) to (29) were obtained.
実施例1〜16及び比較例1〜13で得た硬化性組成物(1)〜(29)の硬化物につき、下記のようにして、接着力、初期透過率、及び加熱後の透過率を測定した。
測定結果を下記第2表−1、第2表−2に示す。For the cured products of the curable compositions (1) to (29) obtained in Examples 1 to 16 and Comparative Examples 1 to 13, the adhesive strength, initial transmittance, and transmittance after heating were as follows. It was measured.
The measurement results are shown in Table 2 and Table 2 below.
(接着力試験)
2mm角のシリコンチップのミラー面に硬化性組成物を厚さが約2μmになるよう塗布し、塗布面を被着体(銀メッキ銅板)の上に載せ圧着した。その後、180℃で2時間加熱処理して硬化させて試験片付被着体を得た。この試験片付被着体を、予め所定温度(23℃、100℃)に加熱したボンドテスター(シリーズ4000、デイジ社製)の測定ステージ上に30秒間放置し、被着体から50μmの高さの位置より、スピード200μm/sで接着面に対し水平方法(せん断方向)に応力をかけ、23℃及び100℃における、試験片と被着体との接着力を測定した。(Adhesion test)
The curable composition was applied to a mirror surface of a 2 mm square silicon chip to a thickness of about 2 μm, and the coated surface was placed on an adherend (silver-plated copper plate) and pressure-bonded. Then, it heat-processed at 180 degreeC for 2 hours, it was made to harden | cure, and the adherend with a test piece was obtained. The test piece-attached adherend is left for 30 seconds on a measurement stage of a bond tester (series 4000, manufactured by Daisy) heated in advance to a predetermined temperature (23 ° C., 100 ° C.), and has a height of 50 μm from the adherend. From the position, stress was applied in a horizontal method (shear direction) to the bonded surface at a speed of 200 μm / s, and the adhesive force between the test piece and the adherend at 23 ° C. and 100 ° C. was measured.
(初期透過率の測定)
硬化性組成物を、長さ25mm、幅20mm、厚さ1mmとなるように鋳型に流し込み、140℃で6時間加熱して硬化させ、試験片をそれぞれ作製した。得られた試験片につき、分光光度計(MPC−3100、島津製作所社製)にて、波長450nmの初期透過率(%)を測定した。(Measurement of initial transmittance)
The curable composition was poured into a mold so as to have a length of 25 mm, a width of 20 mm, and a thickness of 1 mm, and cured by heating at 140 ° C. for 6 hours to prepare test pieces. About the obtained test piece, the initial transmittance (%) of wavelength 450nm was measured with the spectrophotometer (MPC-3100, Shimadzu Corporation make).
(加熱後の透過率の測定)
初期透過率を測定した各試験片を150℃のオーブンに100時間及び300時間投入し、再度、波長450nmの透過率(%)を測定した。(Measurement of transmittance after heating)
Each test piece whose initial transmittance was measured was put into an oven at 150 ° C. for 100 hours and 300 hours, and the transmittance (%) at a wavelength of 450 nm was measured again.
第2表−1、第2表−2から、実施例1〜16の硬化物は、23℃においても100℃においても高い接着力を有し、初期の透過率も加熱後の透過率も優れるものであった。
一方、比較例1、6および10の硬化物は、接着力に劣り、比較例2、7および11の硬化物は加熱後の透過率が低く、比較例3、4、8、9、12および13の硬化物は接着力に劣り、加熱後の透過率も低いものであった。比較例5の硬化物は、300時間加熱することにより、透過率が低下することがわかった。From Table 2 and Table 2, the cured products of Examples 1 to 16 have high adhesive strength at both 23 ° C. and 100 ° C., and are excellent in initial transmittance and transmittance after heating. It was a thing.
On the other hand, the cured products of Comparative Examples 1, 6 and 10 are inferior in adhesive strength, and the cured products of Comparative Examples 2, 7 and 11 have low transmittance after heating, and Comparative Examples 3, 4, 8, 9, 12 and The cured product of 13 was inferior in adhesive strength and low in transmittance after heating. The cured product of Comparative Example 5 was found to have reduced transmittance when heated for 300 hours.
Claims (12)
〔式中、R1は水素原子又は炭素数1〜6のアルキル基を表し、X0はハロゲン原子、シアノ基又は式:OGで表される基(式中、Gは水酸基の保護基を表す。)を表し、Dは単結合又は連結基を表す。R2は炭素数1〜20のアルキル基又は置換基を有していてもよいフェニル基を表す。〕
で表される繰り返し単位のうち、(i)及び(ii)、(i)及び(iii)、(ii)及び(iii)、又は(i)、(ii)及び(iii)の繰り返し単位を有し、重量平均分子量が、1,000〜30,000であるシラン化合物共重合体、
(B)エポキシ化合物、及び
(C)カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物を含有する硬化剤
を、(A)と〔(B)+(C)〕の質量比で、(A):〔(B)+(C)〕=100:20〜100:60の割合で含有する硬化性組成物。(A) In the molecule, the following formulas (i), (ii) and (iii)
[Wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X 0 represents a halogen atom, a cyano group or a group represented by the formula: OG (wherein G represents a protecting group for a hydroxyl group) D) represents a single bond or a linking group. R 2 represents an alkyl group having 1 to 20 carbon atoms or a phenyl group which may have a substituent. ]
(I) and (ii), (i) and (iii), (ii) and (iii), or (i), (ii) and (iii) having repeating units A silane compound copolymer having a weight average molecular weight of 1,000 to 30,000,
(B) An epoxy compound, and (C) a curing agent containing an alicyclic acid anhydride having a carboxyl group and other alicyclic acid anhydrides, are prepared in (A) and [(B) + (C)]. A curable composition containing, in mass ratio, (A): [(B) + (C)] = 100: 20 to 100: 60.
〔式中、R1は水素原子又は炭素数1〜6のアルキル基を表し、X0はハロゲン原子、シアノ基又は式:OGで表される基(式中、Gは水酸基の保護基を表す。)を表し、Dは単結合又は連結基を表す。R3は炭素数1〜6のアルキル基を表し、X1はハロゲン原子を表し、pは0〜3の整数を表す。〕
で表されるシラン化合物(1)の少なくとも一種、及び
式(2):R2Si(OR4)q(X2)3−q
(式中、R2は炭素数1〜20のアルキル基又は置換基を有していてもよいフェニル基を表し、R4は炭素数1〜6のアルキル基を表し、X2はハロゲン原子を表し、qは0〜3の整数を表す。)
で表されるシラン化合物(2)の少なくとも一種を含むシラン化合物の混合物を縮合させて得られる、重量平均分子量が1,000〜30,000であるシラン化合物共重合体、
(B)エポキシ化合物、及び
(C)カルボキシル基を有する脂環式酸無水物とその他の脂環式酸無水物を含有する硬化剤
を、(A’)と〔(B)+(C)〕の質量比で、(A’):〔(B)+(C)〕=100:20〜100:60の割合で含有する硬化性組成物。(A ′) Formula (1): R 1 —CH (X 0 ) —D—Si (OR 3 ) p (X 1 ) 3-p
[Wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, X 0 represents a halogen atom, a cyano group or a group represented by the formula: OG (wherein G represents a protecting group for a hydroxyl group) D) represents a single bond or a linking group. R 3 represents an alkyl group having 1 to 6 carbon atoms, X 1 represents a halogen atom, and p represents an integer of 0 to 3. ]
And at least one of the silane compounds (1) represented by formula (2): R 2 Si (OR 4 ) q (X 2 ) 3-q
(In the formula, R 2 represents an alkyl group having 1 to 20 carbon atoms or an optionally substituted phenyl group, R 4 represents an alkyl group having 1 to 6 carbon atoms, and X 2 represents a halogen atom. Q represents an integer of 0 to 3.)
A silane compound copolymer having a weight average molecular weight of 1,000 to 30,000, obtained by condensing a mixture of silane compounds containing at least one of the silane compounds (2) represented by:
A curing agent containing (B) an epoxy compound, and (C) an alicyclic acid anhydride having a carboxyl group and another alicyclic acid anhydride, (A ′) and [(B) + (C)] (A '): [(B) + (C)] = 100: 20 to 100: 60.
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