JPWO2010140416A1 - Method for producing glass member for wavelength conversion - Google Patents
Method for producing glass member for wavelength conversion Download PDFInfo
- Publication number
- JPWO2010140416A1 JPWO2010140416A1 JP2011518342A JP2011518342A JPWO2010140416A1 JP WO2010140416 A1 JPWO2010140416 A1 JP WO2010140416A1 JP 2011518342 A JP2011518342 A JP 2011518342A JP 2011518342 A JP2011518342 A JP 2011518342A JP WO2010140416 A1 JPWO2010140416 A1 JP WO2010140416A1
- Authority
- JP
- Japan
- Prior art keywords
- glass
- phosphor
- molded body
- wavelength conversion
- glass molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 170
- 238000006243 chemical reaction Methods 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 128
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000000126 substance Substances 0.000 claims abstract description 9
- 239000006060 molten glass Substances 0.000 claims description 39
- 238000000465 moulding Methods 0.000 claims description 25
- 238000003825 pressing Methods 0.000 claims description 6
- 230000009477 glass transition Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 39
- 230000006866 deterioration Effects 0.000 abstract description 9
- 239000010410 layer Substances 0.000 description 22
- 238000010438 heat treatment Methods 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 10
- 230000005284 excitation Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- SJKRCWUQJZIWQB-UHFFFAOYSA-N azane;chromium Chemical compound N.[Cr] SJKRCWUQJZIWQB-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007496 glass forming Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005304 optical glass Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005365 phosphate glass Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
蛍光体の劣化を抑制しながら、耐久性に優れた波長変換用ガラス部材を簡易な方法により製造することができる波長変換用ガラス部材の製造方法を提供する。ガラス素材を加圧成形してガラス成形体を形成し、形成したガラス成形体の上に蛍光体を供給する。そして、供給された蛍光体とガラス成形体とを加圧し、蛍光体とガラス成形体とを一体化する。Provided is a method for producing a wavelength conversion glass member, which can produce a wavelength conversion glass member excellent in durability by a simple method while suppressing deterioration of a phosphor. A glass material is pressure-molded to form a glass molded body, and a phosphor is supplied onto the formed glass molded body. And the supplied fluorescent substance and a glass molded object are pressurized, and a fluorescent substance and a glass molded object are integrated.
Description
本発明は波長変換用ガラス部材の製造方法に関し、特に、光源からの光の少なくとも一部の波長を変換するための蛍光体を有する波長変換用ガラス部材の製造方法に関する。 The present invention relates to a method for manufacturing a wavelength conversion glass member, and more particularly to a method for manufacturing a wavelength conversion glass member having a phosphor for converting the wavelength of at least part of light from a light source.
白色発光素子の1種である白色発光ダイオード(以下、白色LEDともいう)は、低消費電力、小型軽量、発熱が少ない、水銀フリー、光量の調節が容易などといった優れた特徴を備えていることから、白熱電球、蛍光ランプ、高圧放電ランプなどを代替可能な次世代省エネルギー型照明光源として期待されている。 A white light-emitting diode (hereinafter also referred to as a white LED), which is a type of white light-emitting element, has excellent features such as low power consumption, small size and light weight, little heat generation, mercury-free, and easy adjustment of light quantity. Therefore, it is expected as a next-generation energy-saving illumination light source that can replace incandescent bulbs, fluorescent lamps, and high-pressure discharge lamps.
LEDを用いて白色光を発光させる方法として、(1)3色以上のLEDチップを組み合わせて白色光を得る方法(特許文献1参照)や、(2)青色LEDチップ又は近紫外LEDチップと、蛍光体とを組み合わせて白色光を得る方法(特許文献2、3参照)が知られている。このうち、(1)の方法は各色LEDチップの発光強度のバランスを取るのが困難であることから、(2)のようにLEDチップと蛍光体とを組み合わせて白色光を得る方法が注目されている。 As a method of emitting white light using an LED, (1) a method of obtaining white light by combining three or more color LED chips (see Patent Document 1), (2) a blue LED chip or a near ultraviolet LED chip, A method of obtaining white light in combination with a phosphor (see Patent Documents 2 and 3) is known. Among these, the method (1) is difficult to balance the emission intensity of each color LED chip, and therefore, a method of obtaining white light by combining the LED chip and the phosphor as shown in (2) is attracting attention. ing.
特許文献2、3には、LEDチップからの光の波長を変換するための蛍光体を、エポキシ樹脂やシリコーン樹脂等の樹脂材料に分散させて固定する構成が記載されている。しかしながら、このような樹脂材料は、LEDチップからの光や、LEDチップ及び蛍光体の発熱などによって劣化が進行し易く、長期使用に耐えうるだけの耐久性を得ることができないという問題があった。特に、車のヘッドライト用LEDのように単位面積当たりの明るさを要求される場合には、蛍光体を分散させた樹脂材料の劣化が顕著であり問題となっていた。 Patent Documents 2 and 3 describe a configuration in which a phosphor for converting the wavelength of light from an LED chip is dispersed and fixed in a resin material such as an epoxy resin or a silicone resin. However, such a resin material is prone to deterioration due to light from the LED chip, heat generation of the LED chip and the phosphor, and there is a problem that durability enough to withstand long-term use cannot be obtained. . In particular, when the brightness per unit area is required, such as an LED for a headlight of a car, the deterioration of the resin material in which the phosphor is dispersed is significant and has become a problem.
そのため、樹脂材料に代えて、より耐久性に優れるガラスを用いて蛍光体を固定する方法の開発が望まれている。しかし、溶融ガラス中に蛍光体を混練する方法では、蛍光体が長時間にわたって高温の溶融ガラス中におかれることになるため、高温による分解や溶融ガラスの成分との反応が進行して蛍光体が著しく劣化してしまう。このような課題に対して、蛍光体の劣化を抑制するため、所定成分のガラス粉末と蛍光体粉末とを混合して焼結させることによりガラス中に蛍光体を分散させる方法が提案されている(特許文献4参照)。 Therefore, it is desired to develop a method for fixing a phosphor using glass having higher durability instead of a resin material. However, in the method of kneading the phosphor in the molten glass, the phosphor is left in the high temperature molten glass for a long time, so that the decomposition by the high temperature and the reaction with the components of the molten glass proceed. Will deteriorate significantly. In order to suppress the deterioration of the phosphor for such a problem, a method of dispersing the phosphor in the glass by mixing and sintering a predetermined component of the glass powder and the phosphor powder has been proposed. (See Patent Document 4).
しかしながら、特許文献4に記載の方法では、使用できるガラスの種類が限定される上、工程が非常に複雑になるという問題がある。また、焼結の際に蛍光体が少なからず劣化してしまうという問題もある。 However, in the method described in Patent Document 4, there are problems that the types of glass that can be used are limited and the process becomes very complicated. In addition, there is a problem that the phosphor deteriorates to some extent during sintering.
本発明は上記のような技術的課題に鑑みてなされたものであり、本発明の目的は、蛍光体の劣化を抑制しながら、耐久性に優れた波長変換用ガラス部材を簡易な方法により製造することができる波長変換用ガラス部材の製造方法を提供することである。 The present invention has been made in view of the above technical problems, and an object of the present invention is to produce a wavelength conversion glass member excellent in durability by a simple method while suppressing deterioration of a phosphor. It is providing the manufacturing method of the glass member for wavelength conversion which can do.
上記の課題を解決するために、本発明は以下の特徴を有するものである。 In order to solve the above problems, the present invention has the following features.
1.光源からの光の少なくとも一部の波長を変換するための蛍光体を有する波長変換用ガラス部材の製造方法であって、
ガラス素材を加圧成形してガラス成形体を形成する工程と、
前記ガラス成形体の上に蛍光体を供給する工程と、
供給された前記蛍光体と前記ガラス成形体とを加圧し、前記蛍光体と前記ガラス成形体とを一体化する工程と、を有することを特徴とする波長変換用ガラス部材の製造方法。1. A method for producing a wavelength-converting glass member having a phosphor for converting the wavelength of at least part of light from a light source,
A step of pressure-molding a glass material to form a glass molded body,
Supplying a phosphor on the glass molded body;
A method for producing a glass member for wavelength conversion, comprising: pressing the supplied phosphor and the glass molded body, and integrating the phosphor and the glass molded body.
2.前記蛍光体と前記ガラス成形体との加圧を開始する際の前記ガラス成形体の温度は、前記ガラス成形体のガラス転移点をTgとしたとき、Tg−150℃以上、Tg+150℃以下の範囲であることを特徴とする前記1に記載の波長変換用ガラス部材の製造方法。 2. The temperature of the glass molded body at the start of pressurization of the phosphor and the glass molded body is a range of Tg−150 ° C. or higher and Tg + 150 ° C. or lower, where Tg is the glass transition point of the glass molded body. 2. The method for producing a wavelength converting glass member as described in 1 above.
3.前記蛍光体の供給は、前記蛍光体を分散させた液体を前記ガラス成形体の上に滴下することにより行うことを特徴とする前記1又は2に記載の波長変換用ガラス部材の製造方法。 3. 3. The method for producing a glass member for wavelength conversion according to 1 or 2, wherein the phosphor is supplied by dropping a liquid in which the phosphor is dispersed onto the glass molded body.
4.前記蛍光体の供給は、前記蛍光体を分散させたシートを前記ガラス成形体の上に載置することにより行うことを特徴とする前記1又は2に記載の波長変換用ガラス部材の製造方法。 4). 3. The method for producing a glass member for wavelength conversion according to 1 or 2, wherein the phosphor is supplied by placing a sheet in which the phosphor is dispersed on the glass molded body.
5.前記ガラス成形体の上面は曲率を有する凸面又は凹面を有し、
前記ガラス素材を加圧成形して前記ガラス成形体の前記上面を形成するための上型と、前記蛍光体を加圧するための上型とは、前記蛍光体の厚みに対応して曲率が異なることを特徴とする前記1から4の何れか1項に記載の波長変換用ガラス部材の製造方法。5. The upper surface of the glass molded body has a convex or concave surface having a curvature,
The upper mold for press-molding the glass material to form the upper surface of the glass molded body and the upper mold for pressurizing the phosphor have different curvatures corresponding to the thickness of the phosphor. The method for producing a glass member for wavelength conversion according to any one of 1 to 4, wherein the glass member is for wavelength conversion.
6.前記ガラス素材は滴下された溶融ガラス滴であることを特徴とする前記1から5の何れか1項に記載の波長変換用ガラス部材の製造方法。 6). 6. The method for producing a glass member for wavelength conversion according to any one of 1 to 5, wherein the glass material is a dropped molten glass droplet.
7.前記蛍光体は、発光する光の波長が異なる複数種の蛍光体からなることを特徴とする前記1から6の何れか1項に記載の波長変換用ガラス部材の製造方法。 7). 7. The method for producing a glass member for wavelength conversion according to any one of 1 to 6, wherein the phosphor is composed of a plurality of types of phosphors having different wavelengths of emitted light.
8.前記蛍光体を供給する工程と、供給された前記蛍光体と前記ガラス成形体とを加圧する工程とを複数回繰り返して、第1の波長の光を発光する第1の蛍光体を含む層と、第2の波長の光を発光する第2の蛍光体を含む層とを、前記ガラス成形体の上に積層することを特徴とする前記7に記載の波長変換用ガラス部材の製造方法。 8). A layer including a first phosphor that emits light of a first wavelength by repeating the step of supplying the phosphor and the step of pressurizing the supplied phosphor and the glass molded body a plurality of times; 8. The method for producing a glass member for wavelength conversion as described in 7 above, wherein a layer containing a second phosphor that emits light of a second wavelength is laminated on the glass molded body.
本発明の方法によれば、加圧成形によって得られたガラス成形体の上に蛍光体を供給した後、供給された蛍光体とガラス成形体とを加圧して蛍光体とガラス成形体とを一体化するため、蛍光体が高温のガラスと長時間接触することが無く、蛍光体の劣化を十分に抑制することができると共に、蛍光体をガラスに強固に固定することができる。従って、蛍光体の劣化を抑制しながら、耐久性に優れた波長変換用ガラス部材を簡易な方法により製造することができる。 According to the method of the present invention, after the phosphor is supplied onto the glass molded body obtained by pressure molding, the phosphor and the glass molded body are pressed by pressurizing the supplied phosphor and the glass molded body. Since they are integrated, the phosphor does not come into contact with the high-temperature glass for a long time, the phosphor can be sufficiently prevented from being deteriorated, and the phosphor can be firmly fixed to the glass. Therefore, it is possible to produce a wavelength conversion glass member having excellent durability while suppressing deterioration of the phosphor by a simple method.
以下、本発明の実施の形態について図1〜図5を参照しつつ詳細に説明するが、本発明は該実施の形態に限られるものではない。 Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 5, but the present invention is not limited to the embodiments.
図1は、白色LED10を模式的に示す断面図である。白色LED10は、基板14の上に配置されたLEDチップ12と、本実施形態の方法で製造された波長変換用ガラス部材13とを備えている。 FIG. 1 is a cross-sectional view schematically showing the white LED 10. The white LED 10 includes an LED chip 12 disposed on a substrate 14 and a wavelength conversion glass member 13 manufactured by the method of this embodiment.
LEDチップ12は青色LEDチップでもよいし、紫外又は近紫外LEDチップでもよい。波長変換用ガラス部材13はLEDチップ12を囲むように配置され、ガラス層131と、その表面に形成された蛍光体層132とを有している。ここでは、波長変換用ガラス部材13が半球形状の場合を例に挙げて図示しているが、これに限定されるものではない。例えば、両面とも平面の平板形状でもよいし、いわゆる砲弾形状でもよい。また、波長変換用ガラス部材13の表面は凸面でもよいし、凹面や平面でもよい。凸面や凹面の場合は、球面でもよいし、非球面成分を有する形状でもよい。波長変換用ガラス部材13はガラス素材を加圧成形して得られたガラス成形体に蛍光体を一体化して製造するため、容易に種々の形状とすることができる。 The LED chip 12 may be a blue LED chip or an ultraviolet or near ultraviolet LED chip. The wavelength converting glass member 13 is disposed so as to surround the LED chip 12, and includes a glass layer 131 and a phosphor layer 132 formed on the surface thereof. Here, the case where the wavelength conversion glass member 13 has a hemispherical shape is illustrated as an example, but is not limited thereto. For example, both sides may have a flat plate shape or a so-called shell shape. The surface of the wavelength converting glass member 13 may be a convex surface, a concave surface or a flat surface. In the case of a convex surface or a concave surface, it may be a spherical surface or a shape having an aspherical component. Since the wavelength converting glass member 13 is manufactured by integrating the phosphor with a glass molded body obtained by press molding a glass material, it can be easily formed into various shapes.
波長変換用ガラス部材13は、後述するように、供給した蛍光体とガラス成形体とを加圧することで製造されるため、蛍光体層132はガラス層131に強固に固定されており、優れた耐久性を備えている。蛍光体層132はガラス層131の何れの面に設けてもよい。加圧成形によってガラス成形体を形成する際、蛍光体層132を設ける側の面が上面になるような構成にすることで、蛍光体層132を設ける面を選択できる。 As will be described later, the wavelength converting glass member 13 is manufactured by pressurizing the supplied phosphor and the glass molded body. Therefore, the phosphor layer 132 is firmly fixed to the glass layer 131 and is excellent. It has durability. The phosphor layer 132 may be provided on any surface of the glass layer 131. When the glass molded body is formed by pressure molding, the surface on which the phosphor layer 132 is provided can be selected by adopting a configuration in which the surface on the side on which the phosphor layer 132 is provided becomes the upper surface.
次に、波長変換用ガラス部材13の製造方法について、図2〜図5を参照しながら説明する。図2は波長変換用ガラス部材13の製造方法の例を示すフローチャートであり、図3及び図4は本実施形態の各工程を模式的に示す図である。また、図5は蛍光体を供給する工程の別の形態を示す図である。 Next, the manufacturing method of the wavelength conversion glass member 13 will be described with reference to FIGS. FIG. 2 is a flowchart showing an example of a method of manufacturing the wavelength conversion glass member 13, and FIGS. 3 and 4 are diagrams schematically showing each step of the present embodiment. FIG. 5 is a diagram showing another embodiment of the process of supplying the phosphor.
なお、ここでは、ガラス素材として溶融ガラス滴を用いる場合を例に挙げて説明するが、加圧成形のためのガラス素材は溶融ガラス滴に限定されるものではなく、所定の体積の溶融ガラスを固化したものを用いることもできる。また、固化したガラスを、球や平板など所望の形状に加工したものを用いることも好ましい。ガラス素材として固化したガラスを用いる場合は、成形型と共に、加圧成形が可能な温度まで加熱して用いればよい。一方、ガラス素材として溶融ガラス滴を用いる場合は、比較的低温の成形型で溶融ガラス滴を受け、そのまま加圧成形しながら冷却・固化することでガラス成形体が得られるため、非常に短時間で効率よく製造できる利点がある。 In addition, although the case where a molten glass droplet is used as an example is described here as an example, the glass material for pressure molding is not limited to a molten glass droplet, a molten glass having a predetermined volume is used. A solidified product can also be used. Moreover, it is also preferable to use what solidified glass processed into desired shapes, such as a bulb | ball and a flat plate. In the case of using solidified glass as the glass material, it may be used by heating to a temperature at which pressure molding can be performed together with the mold. On the other hand, when molten glass droplets are used as the glass material, a glass molded body can be obtained by receiving molten glass droplets with a relatively low temperature mold, and then cooling and solidifying while performing pressure molding as it is. There is an advantage that can be manufactured efficiently.
以下、本実施形態の波長変換用ガラス部材の製造方法の一例として、ガラス素材として溶融ガラス滴を用いる場合を例に挙げて、図2に示すフローチャートに従い各工程について順を追って説明する。 Hereinafter, as an example of the manufacturing method of the glass member for wavelength conversion of this embodiment, the case where a molten glass droplet is used as a glass material is mentioned as an example, and it demonstrates later for each process according to the flowchart shown in FIG.
先ず、溶融ガラス滴31を加圧成形するための成形型である下型21及び上型22をそれぞれ所定の温度に加熱する(工程S110)(図3(a)参照)。下型21及び上型22は、図示しない加熱手段によって所定温度に加熱できるように構成されている。加熱手段としては、公知の加熱手段を適宜選択して用いることができる。例えば、被加熱部材の内部に埋め込んで使用するカートリッジヒータや、被加熱部材の外側に接触させて使用するシート状のヒータ、赤外線加熱装置、高周波誘導加熱装置等を用いることができる。 First, the lower mold 21 and the upper mold 22, which are molds for press-molding the molten glass droplet 31, are each heated to a predetermined temperature (step S110) (see FIG. 3A). The lower mold 21 and the upper mold 22 are configured to be heated to a predetermined temperature by a heating unit (not shown). As the heating means, known heating means can be appropriately selected and used. For example, a cartridge heater that is used by being embedded inside the member to be heated, a sheet heater that is used while being in contact with the outside of the member to be heated, an infrared heating device, a high-frequency induction heating device, or the like can be used.
所定の温度とは、ガラスや蛍光体の種類等に応じて適宜選択すればよい。一般的に、下型21や上型22の温度が低すぎると高い形状精度を得ることが困難になってくる。逆に、必要以上に温度を高くしすぎると、下型21及び上型22の寿命が短くなり易い。これらの観点から、下型21及び上型22の温度は、使用するガラスのガラス転移温度をTgとしたとき、(Tg−150℃)から(Tg+100℃)の範囲が好ましく、(Tg−100℃)から(Tg+100℃)の範囲がより好ましい。下型21の温度と上型22の温度は同じであってもよいし、異なっていてもよい。 The predetermined temperature may be appropriately selected according to the type of glass or phosphor. Generally, when the temperature of the lower mold 21 and the upper mold 22 is too low, it becomes difficult to obtain high shape accuracy. On the other hand, if the temperature is set higher than necessary, the life of the lower mold 21 and the upper mold 22 tends to be shortened. From these viewpoints, the temperature of the lower mold 21 and the upper mold 22 is preferably in the range of (Tg−150 ° C.) to (Tg + 100 ° C.), where Tg is the glass transition temperature of the glass used. ) To (Tg + 100 ° C.) is more preferable. The temperature of the lower mold 21 and the temperature of the upper mold 22 may be the same or different.
下型21及び上型22の加熱温度は工程毎に変化させてもよいが、工程S160でガラス成形体(波長変換用ガラス部材)を回収するまでの間、制御温度を一定に保っておくことで、高い製造効率を確保することができる。また、下型21及び上型22の制御温度を一定に保ったまま、複数のガラス成形体を繰り返し製造することもできる。従って、1つのガラス成形体を製造する毎に下型21及び上型22の昇温と冷却を繰り返す必要はなく、極めて短時間で効率よく光学素子を製造することができる。ここで、下型21及び上型22の制御温度を一定に保つというのは、下型21及び上型22を加熱するための温度制御における目標設定温度を一定に保つという意味であり、各工程実施中において、溶融ガラス滴31との接触等による温度変動を防止しなければならないという意味ではない。 Although the heating temperature of the lower mold 21 and the upper mold 22 may be changed for each process, the control temperature should be kept constant until the glass molded body (wavelength conversion glass member) is recovered in the process S160. Thus, high production efficiency can be ensured. In addition, a plurality of glass molded bodies can be repeatedly produced while keeping the control temperature of the lower mold 21 and the upper mold 22 constant. Therefore, it is not necessary to repeat the heating and cooling of the lower mold 21 and the upper mold 22 every time one glass molded body is manufactured, and an optical element can be manufactured efficiently in an extremely short time. Here, keeping the control temperature of the lower die 21 and the upper die 22 constant means that the target set temperature in the temperature control for heating the lower die 21 and the upper die 22 is kept constant. This does not mean that temperature fluctuation due to contact with the molten glass droplet 31 or the like must be prevented during implementation.
下型21の成形面211、及び、上型22の成形面221は、予め製造する波長変換用ガラス部材の形状に対応した所定の形状に精密加工しておく。それにより、高い形状精度を有する波長変換用ガラス部材を容易に製造することができる。また、波長変換用ガラス部材の表面は、溶融ガラス滴31が成形面211、221と接触して急冷されることにより形成されるため、成形面211、221よりも平滑な面を得ることができる。十分に平滑な表面を得るという観点からは、成形面211、221の算術平均粗さRaを0.2μm以下とすることが好ましい。なお、算術平均粗さRaはJIS B 0601:2001において定義される粗さパラメータである。 The molding surface 211 of the lower mold 21 and the molding surface 221 of the upper mold 22 are precisely machined into a predetermined shape corresponding to the shape of the wavelength conversion glass member manufactured in advance. Thereby, the glass member for wavelength conversion which has high shape accuracy can be manufactured easily. Moreover, since the surface of the wavelength conversion glass member is formed by the molten glass droplet 31 coming into contact with the molding surfaces 211 and 221 and rapidly cooled, a surface smoother than the molding surfaces 211 and 221 can be obtained. . From the viewpoint of obtaining a sufficiently smooth surface, the arithmetic mean roughness Ra of the molding surfaces 211 and 221 is preferably 0.2 μm or less. The arithmetic average roughness Ra is a roughness parameter defined in JIS B 0601: 2001.
下型21及び上型22の材質は、耐熱合金(ステンレス等)、炭化タングステンを主成分とする超硬材料、各種セラミックス(炭化珪素、窒化珪素、窒化アルミニウム等)、カーボンを含む複合材料など、ガラス成形体を製造するための成形型として公知の材質の中から適宜選択して用いることができる。下型21及び上型22を同一の材質で構成してもよいし、異なる材質で構成してもよい。 The materials of the lower mold 21 and the upper mold 22 are heat-resistant alloys (stainless steel, etc.), super hard materials mainly composed of tungsten carbide, various ceramics (silicon carbide, silicon nitride, aluminum nitride, etc.), composite materials containing carbon, etc. It can be suitably selected from known materials as a mold for producing a glass molded body. The lower mold 21 and the upper mold 22 may be made of the same material or different materials.
また、下型21や上型22の表面には、蛍光体やガラスとの離型性を向上させるために被覆層を設けておくことも好ましい。例えば、種々の金属(クロム、アルミニウム、チタン、白金等)、窒化物(窒化クロム、窒化アルミニウム、窒化チタン、窒化硼素等)、酸化物(酸化クロム、酸化アルミニウム、酸化チタン等)等を用いることができる。被覆層の成膜方法に制限はなく、公知の成膜方法の中から適宜選択して用いればよい。例えば、真空蒸着、スパッタ、CVD等が挙げられる。 Moreover, it is also preferable to provide a coating layer on the surfaces of the lower mold 21 and the upper mold 22 in order to improve releasability from the phosphor and glass. For example, various metals (chromium, aluminum, titanium, platinum, etc.), nitrides (chromium nitride, aluminum nitride, titanium nitride, boron nitride, etc.), oxides (chromium oxide, aluminum oxide, titanium oxide, etc.), etc. are used. Can do. There is no limitation on the method for forming the coating layer, and it may be appropriately selected from known film forming methods. For example, vacuum deposition, sputtering, CVD, etc. are mentioned.
次に、下型21を滴下位置に移動して、下型21に溶融ガラス滴31を滴下する(工程S120)(図3(b)、(c)参照)。 Next, the lower mold | type 21 is moved to a dripping position, and the molten glass droplet 31 is dripped at the lower mold | type 21 (process S120) (refer FIG.3 (b), (c)).
下型21は図示しない駆動手段により、滴下ノズル23の下方で溶融ガラス滴31を受けるための位置(滴下位置)と、上型22と対向して溶融ガラス滴31を加圧成形するための位置(加圧位置)との間で移動可能に構成されている。滴下位置への移動は、溶融ガラス滴31を滴下する前であれば、下型21や上型22の加熱(工程S110)の前であっても後であってもよい。 The lower mold 21 has a position (dropping position) for receiving the molten glass droplet 31 below the dropping nozzle 23 by a driving means (not shown), and a position for pressure-molding the molten glass droplet 31 facing the upper mold 22. It is configured to be movable between (pressing position). The movement to the dropping position may be before or after heating the lower mold 21 and the upper mold 22 (step S110) as long as the molten glass droplet 31 is not dropped.
溶融ガラス滴31の滴下は、溶融ガラスを収容する溶融槽(不図示)に接続されたパイプ状の滴下ノズル23を所定温度に加熱することによって行う。滴下ノズル23をヒータ24で所定温度に加熱すると、溶融ガラスは自重によって滴下ノズル23の先端部に供給され、表面張力によって液滴状に溜まる。滴下ノズル23の先端部に溜まった溶融ガラスが一定の重量になると、重力によって滴下ノズル23から自然に分離し、溶融ガラス滴31となって下方に落下する。 The dripping of the molten glass droplet 31 is performed by heating a pipe-shaped dripping nozzle 23 connected to a melting tank (not shown) containing molten glass to a predetermined temperature. When the dripping nozzle 23 is heated to a predetermined temperature by the heater 24, the molten glass is supplied to the tip of the dripping nozzle 23 by its own weight, and accumulates in droplets by the surface tension. When the molten glass collected at the tip of the dropping nozzle 23 reaches a certain weight, it is naturally separated from the dropping nozzle 23 by gravity and falls downward as a molten glass droplet 31.
滴下ノズル23から滴下する溶融ガラス滴31の重量は、滴下ノズル23の先端部の外径などによって調整可能であり、ガラスの種類等によるが、0.1g〜2g程度の溶融ガラス滴31を滴下させることができる。重力によって滴下ノズル23から分離させる方法の他、溶融ガラスを加圧して押し出す方法や、気流や振動等の外力を加えて分離させる方法でもよい。また、滴下ノズル23から滴下した溶融ガラス滴31を、一旦、貫通細孔を設けた部材に衝突させ、衝突した溶融ガラス滴31の一部を、貫通細孔を通過させることによって、微小化された溶融ガラス滴を下型21に滴下してもよい。このような方法を用いることによって、例えば0.01gといった微小な溶融ガラス滴を得ることができるため、滴下ノズル23から滴下する溶融ガラス滴31をそのまま下型21で受ける場合よりも、微小なガラス成形体の製造が可能となる。 The weight of the molten glass droplet 31 dropped from the dropping nozzle 23 can be adjusted by the outer diameter of the tip of the dropping nozzle 23 and the like, and depending on the type of glass, the molten glass droplet 31 of about 0.1 g to 2 g is dropped. Can be made. In addition to the method of separating from the dropping nozzle 23 by gravity, a method of pressing and extruding molten glass or a method of separating by applying an external force such as airflow or vibration may be used. Further, the molten glass droplet 31 dropped from the dropping nozzle 23 is once made to collide with a member provided with through-holes, and a part of the collided molten glass droplet 31 is passed through the through-holes to be miniaturized. The molten glass droplets may be dropped on the lower mold 21. By using such a method, it is possible to obtain a minute molten glass droplet of, for example, 0.01 g, so that a smaller amount of glass is obtained than when the molten glass droplet 31 dropped from the dropping nozzle 23 is directly received by the lower mold 21. The molded body can be manufactured.
使用できるガラスの種類に特に制限はなく、公知のガラスを用途に応じて選択して用いることができる。例えば、ホウケイ酸塩ガラス、ケイ酸塩ガラス、リン酸塩ガラス、ランタン系ガラス等の光学ガラスが挙げられる。 There is no restriction | limiting in particular in the kind of glass which can be used, A well-known glass can be selected and used according to a use. Examples thereof include optical glasses such as borosilicate glass, silicate glass, phosphate glass, and lanthanum glass.
次に、下型21を加圧位置に移動して、溶融ガラス滴31を加圧成形する(工程S130)(図3(d)参照)。溶融ガラス滴31は下型21や上型22と接触することによって急速に冷却され、固化してガラス成形体32となる。加圧を開始してからガラスが固化するまでの時間は、ガラスの種類やサイズ等によるが、通常は数秒〜数十秒の範囲である。溶融ガラス滴31を加圧するために加える荷重は一定であってもよいし、時間的に変化させてもよい。荷重の大きさは、製造するガラス成形体32のサイズ等に応じて適宜設定すればよい。通常は、数百〜数千Nの範囲で設定すればよい。また、上型22を上下移動させる駆動手段に特に制限はなく、エアシリンダ、油圧シリンダ、サーボモータ等の公知の駆動手段を適宜選択して用いることができる。 Next, the lower mold | type 21 is moved to a pressurization position, and the molten glass droplet 31 is pressure-molded (process S130) (refer FIG.3 (d)). The molten glass droplet 31 is rapidly cooled by coming into contact with the lower mold 21 and the upper mold 22 and solidified to become a glass molded body 32. The time from the start of pressurization to the solidification of the glass depends on the type and size of the glass, but is usually in the range of several seconds to several tens of seconds. The load applied to press the molten glass droplet 31 may be constant or may be changed with time. What is necessary is just to set the magnitude | size of a load suitably according to the size etc. of the glass forming body 32 to manufacture. Usually, it may be set in the range of several hundred to several thousand N. The driving means for moving the upper mold 22 up and down is not particularly limited, and known driving means such as an air cylinder, a hydraulic cylinder, and a servo motor can be appropriately selected and used.
図3(d)では、上型22のみを加圧方向に移動して溶融ガラス滴31の加圧成形を行っているが、このような構成に限定されるものではなく、上型22は固定しておいて下型21のみを加圧方向に移動して加圧成形を行ってもよいし、下型21と上型22の両方を移動して加圧成形を行ってもよい。 In FIG. 3 (d), only the upper mold 22 is moved in the pressing direction to perform the pressure molding of the molten glass droplet 31, but the present invention is not limited to such a configuration, and the upper mold 22 is fixed. In addition, only the lower mold 21 may be moved in the pressing direction to perform pressure molding, or both the lower mold 21 and the upper mold 22 may be moved to perform pressure molding.
なお、溶融ガラス滴31の代わりに、固化したガラスをガラス素材として用いる場合には、加圧成形によってガラス素材を変形させるために、少なくともTg以上の温度にガラス素材を加熱しておく必要がある。通常は、軟化点近傍の温度まで加熱することが好ましい。 In addition, when using the solidified glass as a glass material instead of the molten glass droplet 31, it is necessary to heat the glass material to a temperature of at least Tg or more in order to deform the glass material by pressure molding. . Usually, it is preferable to heat to a temperature near the softening point.
次に、ガラス成形体32の上に蛍光体33を供給する(工程S140)(図4(a)参照)。 Next, the phosphor 33 is supplied onto the glass molded body 32 (step S140) (see FIG. 4A).
蛍光体33の供給方法に特に制限はない。蛍光体33を粉体の状態で供給してもよいが、飛散を防止し、供給量を安定させる観点からは、蛍光体33を液体やゲル状のバインダに分散させた状態で供給することが好ましい。この際、製造する波長変換用ガラス部材に不要なバインダが残留しないように、バインダは低温で気化又は熱分解するものが好ましい。例えば、エタノール、アセトンなどの有機溶媒や、合成樹脂等が好適である。合成樹脂は、ポリスチレンやポリプロピレンなど、熱分解によって残さが残りにくいものが好ましい。 There is no restriction | limiting in particular in the supply method of the fluorescent substance 33. FIG. The phosphor 33 may be supplied in a powder state. However, from the viewpoint of preventing scattering and stabilizing the supply amount, the phosphor 33 may be supplied in a state of being dispersed in a liquid or gel binder. preferable. At this time, it is preferable that the binder is vaporized or thermally decomposed at a low temperature so that an unnecessary binder does not remain in the manufactured wavelength conversion glass member. For example, organic solvents such as ethanol and acetone, and synthetic resins are suitable. The synthetic resin, such as polystyrene or polypropylene, is preferably a residue that hardly remains due to thermal decomposition.
本実施形態の方法では、供給した蛍光体33をガラス成形体32と共に加圧して一体化するため、蛍光体33をガラス成形体32の表面に均一な厚みで供給しておかなくても、加圧によって厚みが均一化されるという利点がある。例えば、図4(a)に示すように、蛍光体33を分散させた液体のバインダをガラス成形体32の上に滴下することによって供給してもよい。この方法によれば、公知のディスペンサ等を用いることで、所定量の蛍光体33を容易に供給できる。また、蛍光体33を供給する別の形態として、図5に示すように、蛍光体33を分散させたシートをガラス成形体32の上に載置することにより供給してもよい。この方法も、所定量の蛍光体33を分散させたシート状のバインダを予め用意しておくことで、所定量の蛍光体33を容易に供給できるため好ましい方法である。シート状のバインダには上述の合成樹脂等を用いればよい。 In the method of the present embodiment, the supplied phosphor 33 is pressed and integrated with the glass molded body 32, so that even if the phosphor 33 is not supplied to the surface of the glass molded body 32 with a uniform thickness, the addition is possible. There is an advantage that the thickness is made uniform by the pressure. For example, as shown in FIG. 4A, a liquid binder in which the phosphor 33 is dispersed may be supplied by being dropped onto the glass molded body 32. According to this method, a predetermined amount of the phosphor 33 can be easily supplied by using a known dispenser or the like. As another form of supplying the phosphor 33, as shown in FIG. 5, a sheet in which the phosphor 33 is dispersed may be supplied by placing it on the glass molded body 32. This method is also a preferable method because a predetermined amount of phosphor 33 can be easily supplied by preparing a sheet-like binder in which a predetermined amount of phosphor 33 is dispersed in advance. The above-described synthetic resin or the like may be used for the sheet-like binder.
蛍光体33は白色LEDの用途や種類に応じて、適宜選択して用いればよい。LEDチップ12として青色LEDチップを用いる場合は、例えば、青色光を黄色光に波長変換する(青色光で励起され黄色光を発光する)黄色蛍光体を用いて、青色LED+黄色蛍光体という構成にすることで白色光を得ることができる。2種類以上の蛍光体を用いて、例えば、青色LED+黄色蛍光体+赤色蛍光体という構成や、青色LED+緑色蛍光体+赤色蛍光体という構成にすることもできる。また、LEDチップ12として紫外又は近紫外LEDチップを用いる場合は、青色蛍光体+黄色蛍光体という構成や、青色蛍光体+緑色蛍光体+赤色蛍光体という構成にすることで白色光を得ることができる。 The phosphor 33 may be appropriately selected and used according to the use and type of the white LED. When a blue LED chip is used as the LED chip 12, for example, a blue phosphor + yellow phosphor is configured using a yellow phosphor that converts blue light into yellow light (excited by blue light and emits yellow light). By doing so, white light can be obtained. By using two or more kinds of phosphors, for example, a configuration of blue LED + yellow phosphor + red phosphor or a configuration of blue LED + green phosphor + red phosphor can be used. Further, when an ultraviolet or near-ultraviolet LED chip is used as the LED chip 12, white light is obtained by adopting a configuration of blue phosphor + yellow phosphor or a configuration of blue phosphor + green phosphor + red phosphor. Can do.
好適な蛍光体33として、YAG系蛍光体、シリケート系蛍光体、ナイトライド系蛍光体、オキシナイトライド系蛍光体、サルファイド系蛍光体、チオガレート系蛍光体、アルミネート系蛍光体などが挙げられる。 Suitable phosphors 33 include YAG phosphors, silicate phosphors, nitride phosphors, oxynitride phosphors, sulfide phosphors, thiogallate phosphors, aluminate phosphors, and the like.
また、供給する蛍光体は1種類でもよいし、発光する波長の異なる複数種の蛍光体33を使用してもよい。複数種の蛍光体33を適宜選択して使用することで、照明用として好まれる演色性の高い白色光を得ることができる。 Further, one type of phosphor may be supplied, or a plurality of types of phosphors 33 having different emission wavelengths may be used. By appropriately selecting and using a plurality of types of phosphors 33, it is possible to obtain white light with high color rendering properties that is preferred for illumination.
複数種の蛍光体33を用いる場合、複数の蛍光体を混合して分散させたバインダを供給して加圧すればよい。また、始めに第1の波長の光を発光する第1の蛍光体を供給して加圧した後、続けて第2の波長の光を発光する第2の蛍光体を供給して再度加圧することにより積層構造を形成することも好ましい。一般に、複数種の蛍光体を同時に使用する場合、第1の蛍光体からの発光が別の第2の蛍光体を励起する、いわゆる多段励起による損失が問題となりやすい。しかし、蛍光体33を供給する工程と、供給された蛍光体33とガラス成形体32とを加圧する工程とを複数回繰り返して、第1の波長の光を発光する第1の蛍光体を含む層と、第2の波長の光を発光する第2の蛍光体を含む層とを、ガラス成形体の上に積層する構成とすることで、このような多段励起による損失を減少させることができる。多段励起による損失をより効果的に減少させる観点からは、光源となるLEDチップからの光が先に到達する側に発光波長が長い方の蛍光体層132が形成され、後から到達する側に発光波長が短い方の蛍光体層132が形成されるように蛍光体33を供給することがより好ましい。 In the case of using a plurality of types of phosphors 33, a binder in which a plurality of phosphors are mixed and dispersed may be supplied and pressurized. In addition, first, the first phosphor that emits light of the first wavelength is supplied and pressurized, and then the second phosphor that emits light of the second wavelength is supplied and pressurized again. It is also preferable to form a laminated structure. In general, when a plurality of types of phosphors are used at the same time, loss due to so-called multistage excitation, in which light emitted from the first phosphor excites another second phosphor, tends to be a problem. However, the step of supplying the phosphor 33 and the step of pressurizing the supplied phosphor 33 and the glass molded body 32 are repeated a plurality of times to include the first phosphor that emits light of the first wavelength. Such a loss due to multi-stage excitation can be reduced by laminating a layer and a layer containing a second phosphor that emits light of the second wavelength on a glass molded body. . From the viewpoint of more effectively reducing the loss due to multi-stage excitation, the phosphor layer 132 having the longer emission wavelength is formed on the side where the light from the LED chip serving as the light source reaches first, and on the side where the light reaches later. More preferably, the phosphor 33 is supplied so that the phosphor layer 132 having a shorter emission wavelength is formed.
なお、ガラス成形体32を下型21から浮かせて、ガラス成形体32の両面に蛍光体33を供給してもよい。蛍光体33をガラス成形体32の両面に供給して蛍光体層132をガラス層131の両面に設けることにより、それぞれの蛍光体層132の厚みを薄くできるため、蛍光体33をより強固に固定でき耐久性が向上するという利点がある。また、複数種の蛍光体33を用いる場合には、第1の波長の光を発光する第1の蛍光体と、第2の波長の光を発光する第2の蛍光体とを、ガラス成形体の別々の面にそれぞれ供給して、ガラス層131の両面にそれぞれの蛍光体層132を設ける構成とすることで、上述のような多段励起による損失を減少させることができる。 The glass molded body 32 may be floated from the lower mold 21 and the phosphors 33 may be supplied to both surfaces of the glass molded body 32. By supplying the phosphor 33 to both surfaces of the glass molded body 32 and providing the phosphor layer 132 on both surfaces of the glass layer 131, the thickness of each phosphor layer 132 can be reduced, so that the phosphor 33 is more firmly fixed. And has the advantage of improved durability. Moreover, when using multiple types of fluorescent substance 33, the 1st fluorescent substance which light-emits the light of 1st wavelength, and the 2nd fluorescent substance which emits the light of 2nd wavelength are made into a glass molded object. Thus, the loss due to the multi-stage excitation as described above can be reduced by providing the phosphor layers 132 on both surfaces of the glass layer 131.
次に、供給された蛍光体33とガラス成形体32とを加圧する(工程S150)(図4(b)参照)。 Next, the supplied phosphor 33 and glass molded body 32 are pressurized (step S150) (see FIG. 4B).
本工程における蛍光体33とガラス成形体32の加圧は、工程S130で用いる下型21及び上型22と同じ成形型をそのまま用いて加圧してもよいし、別の成形型を用いて加圧してもよい。蛍光体層132の厚みをより均一にするという観点からは、ガラス成形体32の上面が曲率を有する凸面又は凹面を有している場合には、本工程で蛍光体33を加圧するための上型22は、溶融ガラス滴31を加圧成形してガラス成形体32の上面を形成するための上型22とは、蛍光体33の厚みに対応させて曲率を異ならせておくことが好ましい。例えば、ガラス成形体32の上面が凹の球面である場合、本工程で蛍光体33を加圧するための上型22は、蛍光体33の厚みに相当する量だけ曲率の大きい(曲率半径の小さい)凸の球面とすればよい。 In this step, the phosphor 33 and the glass molded body 32 may be pressed using the same mold as the lower mold 21 and the upper mold 22 used in step S130, or may be applied using another mold. You may press. From the viewpoint of making the thickness of the phosphor layer 132 more uniform, when the upper surface of the glass molded body 32 has a convex surface or a concave surface having a curvature, the upper surface for pressurizing the phosphor 33 in this step is used. The mold 22 preferably has a curvature different from that of the upper mold 22 for forming the upper surface of the glass molded body 32 by press-molding the molten glass droplet 31 in accordance with the thickness of the phosphor 33. For example, when the upper surface of the glass molded body 32 is a concave spherical surface, the upper mold 22 for pressurizing the phosphor 33 in this step has a large curvature (a small curvature radius) by an amount corresponding to the thickness of the phosphor 33. ) A convex spherical surface may be used.
加圧の際の下型21及び上型22の温度は、工程S130で溶融ガラス滴31を加圧成形する際の温度と同じでもよいし、異ならせてもよい。上述のように蛍光体33の供給にバインダを用いる場合は、バインダの気化や熱分解が十分に進行し、製造する波長変換用ガラス部材に不要なバインダが残留しないように温度設定を行うことが好ましい。 The temperature of the lower mold 21 and the upper mold 22 at the time of pressurization may be the same as or different from the temperature at which the molten glass droplet 31 is pressure-molded in step S130. As described above, when a binder is used to supply the phosphor 33, the temperature may be set so that the binder is sufficiently vaporized and thermally decomposed so that no unnecessary binder remains in the wavelength conversion glass member to be manufactured. preferable.
また、蛍光体33とガラス成形体32との付着力は、加圧を開始する際のガラス成形体32の固化の程度(ガラス成形体32の温度)に大きく影響される。ガラス成形体32の温度が高いほど付着力は向上するが、反面、蛍光体33が劣化しやすくなる。逆に、ガラス成形体32の温度が低いと付着力は低下する反面、蛍光体33の劣化は抑制される。蛍光体33の劣化を十分に抑制しながら、蛍光体33とガラス成形体32とをより強固に固定する観点から、蛍光体33とガラス成形体32との加圧を開始する際のガラス成形体32の温度は、ガラス成形体32のガラス転移点をTgとしたとき、Tg−150℃以上、Tg+150℃以下の範囲であることが好ましく、Tg−100℃以上、Tg+100℃以下の範囲であることがより好ましい。 Further, the adhesive force between the phosphor 33 and the glass molded body 32 is greatly influenced by the degree of solidification of the glass molded body 32 (temperature of the glass molded body 32) when starting pressurization. The higher the temperature of the glass molded body 32, the better the adhesion, but on the other hand, the phosphor 33 tends to deteriorate. On the contrary, when the temperature of the glass molded body 32 is low, the adhesive force is reduced, but the deterioration of the phosphor 33 is suppressed. From the viewpoint of more firmly fixing the phosphor 33 and the glass molded body 32 while sufficiently suppressing the deterioration of the phosphor 33, the glass molded body when the pressurization of the phosphor 33 and the glass molded body 32 is started. The temperature of 32 is preferably in the range of Tg−150 ° C. or higher and Tg + 150 ° C. or lower and Tg−100 ° C. or higher and Tg + 100 ° C. or lower, where Tg is the glass transition point of the glass molded body 32. Is more preferable.
このように、本実施形態の方法によれば、加圧成形によって得られたガラス成形体32の上に蛍光体33を供給した後、供給された蛍光体33とガラス成形体32とを加圧して蛍光体33とガラス成形体32とを一体化するため、蛍光体33が高温のガラスと長時間接触することが無く、蛍光体33の劣化を十分に抑制することができると共に、蛍光体33をガラスに強固に固定することができる。 Thus, according to the method of the present embodiment, after the phosphor 33 is supplied onto the glass molded body 32 obtained by pressure molding, the supplied phosphor 33 and the glass molded body 32 are pressurized. Since the phosphor 33 and the glass molded body 32 are integrated, the phosphor 33 is not in contact with the high-temperature glass for a long time, and deterioration of the phosphor 33 can be sufficiently suppressed, and the phosphor 33 Can be firmly fixed to the glass.
最後に、加圧を解除して蛍光体33と一体化したガラス成形体32を回収する(工程S160)(図4(c)参照)。ガラス成形体32の回収は、例えば、真空吸着を利用した離型装置25を用いて行えばよい。ガラス成形体32を回収した後、引き続いて波長変換用ガラス部材の製造を行う場合は、下型21を再び滴下位置に移動し(工程S120)、以降の工程を繰り返せばよい。 Finally, the pressure is released and the glass molded body 32 integrated with the phosphor 33 is collected (step S160) (see FIG. 4C). The glass molded body 32 may be collected using, for example, a mold release device 25 using vacuum suction. After the glass molded body 32 is collected, when the glass member for wavelength conversion is subsequently produced, the lower mold 21 is moved again to the dropping position (step S120), and the subsequent steps may be repeated.
なお、本実施形態の波長変換用ガラス部材の製造方法は、ここで説明した以外の別の工程を含んでいてもよい。例えば、ガラス成形体32を回収する前にガラス成形体32の形状を検査する工程や、ガラス成形体32を回収した後に下型21や上型22をクリーニングする工程を設けることも好ましい。 In addition, the manufacturing method of the glass member for wavelength conversion of this embodiment may include another process other than having demonstrated here. For example, it is also preferable to provide a step of inspecting the shape of the glass molded body 32 before collecting the glass molded body 32 and a step of cleaning the lower mold 21 and the upper mold 22 after collecting the glass molded body 32.
本実施形態の製造方法により製造されたガラス成形体32は、そのまま白色LED用の波長変換用ガラス部材として用いることができる。また、ガラス成形体32に、外径加工やアニール処理などの後処理を行ってから、波長変換用ガラス部材として用いることもできる。 The glass molded body 32 manufactured by the manufacturing method of this embodiment can be used as it is as a glass member for wavelength conversion for white LEDs. Further, the glass molded body 32 can be used as a glass member for wavelength conversion after being subjected to post-treatment such as outer diameter processing and annealing treatment.
10 白色LED
12 LEDチップ
13 波長変換用ガラス部材
131 ガラス層
132 蛍光体層
14 基板
21 下型
211 成形面
22 上型
221 成形面
23 滴下ノズル
31 溶融ガラス滴
32 ガラス成形体
33 蛍光体10 White LED
DESCRIPTION OF SYMBOLS 12 LED chip 13 Glass member for wavelength conversion 131 Glass layer 132 Phosphor layer 14 Substrate 21 Lower mold 211 Molding surface 22 Upper mold 221 Molding surface 23 Dripping nozzle 31 Molten glass droplet 32 Glass molded body 33 Phosphor
Claims (8)
ガラス素材を加圧成形してガラス成形体を形成する工程と、
前記ガラス成形体の上に蛍光体を供給する工程と、
供給された前記蛍光体と前記ガラス成形体とを加圧し、前記蛍光体と前記ガラス成形体とを一体化する工程と、を有することを特徴とする波長変換用ガラス部材の製造方法。A method for producing a wavelength-converting glass member having a phosphor for converting the wavelength of at least part of light from a light source,
A step of pressure-molding a glass material to form a glass molded body,
Supplying a phosphor on the glass molded body;
A method for producing a glass member for wavelength conversion, comprising: pressing the supplied phosphor and the glass molded body, and integrating the phosphor and the glass molded body.
前記ガラス素材を加圧成形して前記ガラス成形体の前記上面を形成するための上型と、前記蛍光体を加圧するための上型とは、前記蛍光体の厚みに対応して曲率が異なることを特徴とする請求項1から4の何れか1項に記載の波長変換用ガラス部材の製造方法。The upper surface of the glass molded body has a convex or concave surface having a curvature,
The upper mold for press-molding the glass material to form the upper surface of the glass molded body and the upper mold for pressurizing the phosphor have different curvatures corresponding to the thickness of the phosphor. The manufacturing method of the glass member for wavelength conversion of any one of Claim 1 to 4 characterized by the above-mentioned.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009135927 | 2009-06-05 | ||
JP2009135927 | 2009-06-05 | ||
PCT/JP2010/054209 WO2010140416A1 (en) | 2009-06-05 | 2010-03-12 | Method for producing glass member for wavelength conversion |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2010140416A1 true JPWO2010140416A1 (en) | 2012-11-15 |
Family
ID=43297557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011518342A Pending JPWO2010140416A1 (en) | 2009-06-05 | 2010-03-12 | Method for producing glass member for wavelength conversion |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2010140416A1 (en) |
WO (1) | WO2010140416A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103022325B (en) * | 2012-12-24 | 2016-01-20 | 佛山市香港科技大学Led-Fpd工程技术研究开发中心 | The LED encapsulation structure of application long distance formula phosphor powder layer and method for making thereof |
CN103319101A (en) * | 2013-05-10 | 2013-09-25 | 厦门科明达科技有限公司 | Remote fluorescence glass sheet, manufacturing method and applications thereof |
CN103626385A (en) * | 2013-11-13 | 2014-03-12 | 钟准 | Molded fluorescent plastic lens |
CN107393912A (en) * | 2017-07-31 | 2017-11-24 | 佛山市南海区正东照明有限公司 | The COB encapsulating structures and its technique, mould of a kind of low thermal resistance high light efficiency LED lamp |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4259198B2 (en) * | 2003-06-18 | 2009-04-30 | 豊田合成株式会社 | Method for manufacturing wavelength conversion unit for light emitting device and method for manufacturing light emitting device |
JP4979299B2 (en) * | 2006-08-03 | 2012-07-18 | 豊田合成株式会社 | Optical device and manufacturing method thereof |
-
2010
- 2010-03-12 WO PCT/JP2010/054209 patent/WO2010140416A1/en active Application Filing
- 2010-03-12 JP JP2011518342A patent/JPWO2010140416A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2010140416A1 (en) | 2010-12-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2010140417A1 (en) | Method for producing glass member for wavelength conversion | |
JP5808487B2 (en) | Method for manufacturing conversion element | |
KR101939246B1 (en) | Glass fluorescent powder slice with multi-layer structrure and preparation therefor, and light-emitting device | |
JP4729583B2 (en) | Light reflecting material, light emitting element storage package, light emitting device, and method of manufacturing light emitting element storage package | |
CN101167194B (en) | A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device | |
US20110205740A1 (en) | Optical converter system for (w)leds | |
WO2011065322A1 (en) | Method for manufacturing light emitting diode unit | |
WO2010140416A1 (en) | Method for producing glass member for wavelength conversion | |
JP2016138020A (en) | Crystallized glass phosphor and wavelength conversion member prepared therewith | |
CN1529682A (en) | Method for producing ceramic optical elements | |
JP5505864B2 (en) | Manufacturing method of semiconductor light emitting device | |
CN101427388A (en) | Light emitting device | |
JP2019105826A (en) | Wavelength conversion member, manufacturing method therefor, and light-emitting device | |
CN104061531A (en) | Manufacturing method of wavelength conversion device | |
CN1807297A (en) | Method of manufacturing glass shaped article | |
WO2012017304A2 (en) | White led device and manufacturing method thereof | |
JP2011057506A (en) | Method for producing glass member for wavelength conversion, glass member for wavelength conversion and light emitting diode element | |
TW200927679A (en) | Molded fluorescent glass lens and method of manufacturing thereof | |
WO2011065321A1 (en) | Method for manufacturing light emitting diode unit | |
WO2010023993A1 (en) | Light-emitting device and method for manufacturing same | |
JP2010280537A (en) | Method for manufacturing glass member for wavelength conversion | |
JP2019159308A (en) | Wavelength conversion member and light-emitting device having the same | |
JP2010283191A (en) | Method of manufacturing glass member for wavelength conversion | |
JP2010280536A (en) | Method for producing glass member for wavelength conversion | |
JP5673561B2 (en) | Light emitting element mounting support, light emitting device, and method of manufacturing light emitting element mounting support |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A712 Effective date: 20130415 |