JPWO2010123052A1 - Light emitting device - Google Patents

Light emitting device Download PDF

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JPWO2010123052A1
JPWO2010123052A1 JP2010537181A JP2010537181A JPWO2010123052A1 JP WO2010123052 A1 JPWO2010123052 A1 JP WO2010123052A1 JP 2010537181 A JP2010537181 A JP 2010537181A JP 2010537181 A JP2010537181 A JP 2010537181A JP WO2010123052 A1 JPWO2010123052 A1 JP WO2010123052A1
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light
phosphor
wavelength conversion
recess
led element
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米田 賢治
賢治 米田
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CCS Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/644Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

本発明は、蛍光体を含有する波長変換部材の熱を効率的に放出することができるLED発光装置を提供するものであり、上端面に開口する凹部を有した基体と、前記凹部の底面に実装されたLED素子と、前記LED素子を封止する透光性部材と、蛍光体を含有し、前記透光性部材の上に載置された波長変換部材と、前記波長変換部材の上に載置されて前記凹部の開口部を覆う透光性放熱部材と、を備えているようにした。The present invention provides an LED light-emitting device capable of efficiently releasing heat of a wavelength conversion member containing a phosphor, and a substrate having a recess opened at an upper end surface, and a bottom surface of the recess. A mounted LED element, a translucent member that seals the LED element, a wavelength conversion member that contains a phosphor and is placed on the translucent member, and on the wavelength conversion member A translucent heat radiating member that is placed and covers the opening of the recess.

Description

本発明は、LED素子から発された光を、蛍光体層によって波長変換して射出するLED発光装置に関するものである。   The present invention relates to an LED light emitting device that emits light emitted from an LED element after wavelength conversion by a phosphor layer.

従来、窒化ガリウム系化合物半導体を用いて青色光又は紫外光を放射するLED素子と種々の蛍光体とを組み合わせることにより、白色をはじめとするLED素子の発光色とは異なる色の光を発する発光装置が開発されている(特許文献1)。このような、LED素子を用いた発光装置は、小型、省電力、長寿命等の長所があり、表示用光源や照明用光源として広く用いられている。特に近時では高出力、高輝度のLED素子が開発されてきており、その用途は益々増大の一途にある。   Conventionally, light emission that emits light of a color different from that of LED elements such as white by combining LED elements that emit blue light or ultraviolet light with various phosphors using a gallium nitride compound semiconductor An apparatus has been developed (Patent Document 1). Such a light emitting device using an LED element has advantages such as small size, power saving and long life, and is widely used as a light source for display and a light source for illumination. In particular, recently, LED elements with high output and high brightness have been developed, and their uses are increasing more and more.

ところで、LED素子が高出力化することによって、LED素子の発熱量が大きく増大し、その熱によってLED素子そのものが劣化するという問題が生じている。また、蛍光体も熱に脆弱であることから、LED素子からの伝熱によって蛍光体が熱劣化すると一般には言われている。   By the way, when the output of the LED element is increased, the amount of heat generated by the LED element is greatly increased, and the LED element itself is deteriorated by the heat. Further, since the phosphor is also vulnerable to heat, it is generally said that the phosphor is thermally deteriorated by heat transfer from the LED element.

そこで、従来は、LED素子の下に放熱板を敷き、ここから熱を発散させるようにしている。   Therefore, conventionally, a heat sink is laid under the LED element to dissipate heat from here.

特開平7−99345JP-A-7-99345

しかしながら、実際には、蛍光体が熱を発し自身の劣化を促進しているという事実を本発明者は鋭意検討により初めて発見した。LED素子を放熱基板上に搭載し、その上を透明樹脂層で覆い、更にその上を蛍光体層で覆い、印加電圧3.5V、電流300mAの条件で実験したところ、LED素子の上面発光層部分が85℃、透明樹脂層の上面で55℃と言うように温度が下がっているにも拘わらず、蛍光体層の上面温度は65℃となっており、従来、軽視されていた蛍光体での発熱が顕著であることが確認された。   However, in reality, the present inventors have discovered for the first time through intensive studies the fact that the phosphor emits heat and promotes its own deterioration. When the LED element was mounted on a heat dissipation substrate, covered with a transparent resin layer, and further covered with a phosphor layer, an experiment was conducted under conditions of an applied voltage of 3.5 V and a current of 300 mA. The temperature of the upper surface of the phosphor layer is 65 ° C. even though the portion is 85 ° C. and the temperature is lowered to 55 ° C. on the upper surface of the transparent resin layer. It was confirmed that the exotherm of was remarkable.

本発明はかかる問題点に鑑みなされたものであって、従来、軽視されていた蛍光体での発熱という点に初めて着目してなされたものであって、蛍光体を含有する波長変換部材の熱を効率的に放出することができるLED発光装置を提供することをその主たる所期課題としたものである。   The present invention has been made in view of such problems, and has been made for the first time by focusing attention on the heat generated by a phosphor that has been neglected in the past. The heat of a wavelength conversion member containing the phosphor It is a main aim of the present invention to provide an LED light-emitting device that can efficiently emit light.

すなわち本発明に係る発光装置は、上端面に開口する凹部を有した基体と、前記凹部の底面に実装されたLED素子と、前記LED素子を封止する透光性部材と、蛍光体を含有し、前記透光性部材の上に載置された波長変換部材と、前記波長変換部材の上に載置されて前記凹部の開口部を覆う透光性放熱部材と、を備えていることを特徴とする。   That is, the light-emitting device according to the present invention includes a base body having a recess opening in the upper end surface, an LED element mounted on the bottom surface of the recess, a translucent member that seals the LED element, and a phosphor. And a wavelength converting member placed on the translucent member, and a translucent heat radiating member placed on the wavelength converting member and covering the opening of the recess. Features.

このようなものであれば、前記透光性放熱部材が前記波長変換部材の上に載置されて互いに密接していることにより、効率的に前記波長変換部材の熱を放出することができるので、前記波長変換部材に含まれる蛍光体の発光効率や輝度の低下や、熱劣化を、効果的に防ぐことができる。   If it is such, since the said translucent heat radiating member is mounted on the said wavelength conversion member, it can discharge | release the heat | fever of the said wavelength conversion member efficiently because it is mutually in contact. Further, it is possible to effectively prevent the luminous efficiency and luminance of the phosphor included in the wavelength conversion member from decreasing and thermal deterioration.

本発明に係る発光装置の発光色の経時的な変化を抑制するためには、前記波長変換部材は、異なる色の光を発する蛍光領域が並設されてなるものであることが好ましい。   In order to suppress the temporal change of the emission color of the light emitting device according to the present invention, it is preferable that the wavelength conversion member is formed by arranging fluorescent regions that emit light of different colors in parallel.

本発明に係る発光装置が白色光を発するものである場合、その色調むらを抑制するためには、前記LED素子は、近紫外光を発するものであり、前記蛍光体は、赤色光を発する蛍光体(以下、赤色蛍光体という。)、緑色光を発する蛍光体(以下、緑色蛍光体という。)、及び、青色光を発する蛍光体(以下、青色蛍光体という。)であることが好ましい。   When the light emitting device according to the present invention emits white light, the LED element emits near-ultraviolet light in order to suppress uneven color tone, and the phosphor emits red light. The phosphor (hereinafter referred to as red phosphor), the phosphor emitting green light (hereinafter referred to as green phosphor), and the phosphor emitting blue light (hereinafter referred to as blue phosphor) are preferable.

本発明に係る発光装置では、前記透光性放熱部材と前記波長変換部材とは上下方向の位置が逆であってもよく、このような態様の発光装置もまた、本発明の1つである。すなわち、このような態様の本発明に係る発光装置は、上端面に開口する凹部を有した基体と、前記凹部の底面に実装されたLED素子と、前記LED素子を封止する透光性部材と、前記透光性部材の上に載置された透光性放熱部材と、前記透光性放熱部材の上に載置されて前記凹部の開口部を覆う、蛍光体を含有する波長変換部材と、を備えていることを特徴とする。   In the light emitting device according to the present invention, the translucent heat radiating member and the wavelength converting member may be opposite in the vertical direction, and such a light emitting device is also one aspect of the present invention. . That is, the light-emitting device according to the present invention having such an aspect includes a base having a recess opening in the upper end surface, an LED element mounted on the bottom surface of the recess, and a translucent member that seals the LED element. And a light transmissive heat radiating member placed on the light transmissive member, and a wavelength conversion member containing a phosphor placed on the light transmissive heat radiating member and covering the opening of the recess. And.

このような構成の本発明によれば、熱による蛍光体の変化を良好に抑制することができる。   According to the present invention having such a configuration, it is possible to satisfactorily suppress changes in phosphor due to heat.

本発明の一実施形態に係る発光装置の模式的縦断面図である。It is a typical longitudinal cross-sectional view of the light-emitting device which concerns on one Embodiment of this invention. 他の実施形態に係る発光装置の模式的縦断面図である。It is a typical longitudinal cross-sectional view of the light-emitting device which concerns on other embodiment. 同実施形態に係る発光装置の模式的分解斜視図である。It is a typical disassembled perspective view of the light-emitting device concerning the embodiment. 他の実施形態における波長変換部材の模式的平面図である。It is a typical top view of the wavelength conversion member in other embodiments. 他の実施形態に係る発光装置の模式的縦断面図である。It is a typical longitudinal cross-sectional view of the light-emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の模式的縦断面図である。It is a typical longitudinal cross-sectional view of the light-emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の模式的縦断面図である。It is a typical longitudinal cross-sectional view of the light-emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の模式的縦断面図である。It is a typical longitudinal cross-sectional view of the light-emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の模式的縦断面図である。It is a typical longitudinal cross-sectional view of the light-emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の模式的縦断面図である。It is a typical longitudinal cross-sectional view of the light-emitting device which concerns on other embodiment.

以下に本発明の一実施形態について図面を参照して説明する。   An embodiment of the present invention will be described below with reference to the drawings.

本実施形態に係る発光装置1は、図1に示すように、上端面21に開口する凹部22を有した基体2と、凹部22の底面221に実装されたLED素子3と、LED素子3を封止する透光性部材4と、透光性部材4の上に載置された波長変換部材5と、波長変換部材5の上に載置されて凹部22の開口部を覆う透光性放熱部材6と、を備えたものである。   As shown in FIG. 1, the light emitting device 1 according to the present embodiment includes a base body 2 having a recess 22 that opens on an upper end surface 21, an LED element 3 mounted on a bottom surface 221 of the recess 22, and an LED element 3. Translucent member 4 to be sealed, wavelength conversion member 5 placed on translucent member 4, and translucent heat radiation placed on wavelength conversion member 5 and covering the opening of recess 22 The member 6 is provided.

各部を詳述する。
基体2は、上端面21に開口する凹部22を有するものであり、例えば、アルミナや窒化アルミニウム等の熱伝導率が高い絶縁材料を成型してなるものが挙げられる。
Each part will be described in detail.
The base 2 has a recess 22 that opens to the upper end surface 21. For example, a base 2 is formed by molding an insulating material having high thermal conductivity such as alumina or aluminum nitride.

基体2は、その凹部22の底面221に後述するLED素子3を実装するものであるが、当該底面221には、LED素子3が電気的に接続されるための配線導体(図示しない。)が形成されている。この配線導体が基体2内部に形成された配線層(図示しない。)を介して発光装置1の外表面に導出されて外部電気回路基板に接続されることにより、LED素子3と外部電気回路基板とが電気的に接続される。   The base body 2 mounts an LED element 3 to be described later on the bottom surface 221 of the recess 22, and a wiring conductor (not shown) for electrically connecting the LED element 3 to the bottom surface 221. Is formed. This wiring conductor is led to the outer surface of the light emitting device 1 through a wiring layer (not shown) formed inside the base body 2 and connected to the external electric circuit board, whereby the LED element 3 and the external electric circuit board are connected. Are electrically connected.

基体2の凹部22の側壁には段部23が形成されており、その上端面には後述する透光性放熱部材6の縁部が載置されるように構成されている。   A step portion 23 is formed on the side wall of the concave portion 22 of the base 2, and an edge portion of a translucent heat radiating member 6 described later is placed on the upper end surface of the step portion 23.

LED素子3は、例えば、サファイア基板上に窒化ガリウム系化合物半導体がn型層、発光層及びp型層の順に積層されたものであり、このようなLED素子3は青色光や紫外光を発する。   The LED element 3 is formed, for example, by laminating a gallium nitride-based compound semiconductor in the order of an n-type layer, a light emitting layer, and a p-type layer on a sapphire substrate. Such an LED element 3 emits blue light or ultraviolet light. .

LED素子3は、窒化ガリウム系化合物半導体を下(凹部22の底面221側)にして凹部22の底面221に半田バンプや金バンプ等を用いてフリップチップ実装されている。   The LED element 3 is flip-chip mounted on the bottom surface 221 of the concave portion 22 using solder bumps, gold bumps, or the like with the gallium nitride compound semiconductor facing down (the bottom surface 221 side of the concave portion 22).

透光性部材4は、凹部22に充実されてLED素子3を封止しており、例えば、透光性及び耐熱性に優れ、LED素子3との屈折率差が小さいシリコーン樹脂等からなるものである。   The translucent member 4 is filled in the concave portion 22 and seals the LED element 3. For example, the translucent member 4 is made of a silicone resin having excellent translucency and heat resistance and having a small difference in refractive index from the LED element 3. It is.

波長変換部材5は、内部に蛍光体51を含有しており、透光性部材4の上に載置されている。このような波長変換部材5としては、例えば、透光性及び耐熱性に優れ、透光性部材4との屈折率差が小さいシリコーン樹脂中に蛍光体51が分散しているものが挙げられるが、蛍光体51が分散された未硬化のシリコーン樹脂を凹部22に充填してなるものであってもよく、シート状に加工されたものを所定の寸法にカットして用いるものであってもよい。   The wavelength conversion member 5 contains a phosphor 51 inside and is placed on the translucent member 4. Examples of such a wavelength conversion member 5 include those in which the phosphor 51 is dispersed in a silicone resin that is excellent in translucency and heat resistance and has a small refractive index difference from the translucent member 4. The concave portion 22 may be filled with an uncured silicone resin in which the phosphor 51 is dispersed, or a sheet processed into a predetermined size may be used. .

波長変換部材5が含有する蛍光体51としては特に限定されず、例えば、赤色蛍光体、緑色蛍光体、青色蛍光体、黄色蛍光体等が挙げられる。   It does not specifically limit as the fluorescent substance 51 which the wavelength conversion member 5 contains, For example, a red fluorescent substance, a green fluorescent substance, a blue fluorescent substance, a yellow fluorescent substance etc. are mentioned.

透光性放熱部材6は、波長変換部材5の熱を放出するためのものであり、波長変換部材5の上に載置されて凹部22の開口部を覆っている。このような透光性放熱部材6としては、例えば、水晶、サファイア、ダイアモンド、窒化アルミニウム等の熱伝導率が高く透光性に優れた材料からなるものが挙げられる。   The translucent heat radiating member 6 is for releasing the heat of the wavelength conversion member 5 and is placed on the wavelength conversion member 5 to cover the opening of the recess 22. Examples of such translucent heat radiating member 6 include those made of a material having high thermal conductivity and excellent translucency, such as quartz, sapphire, diamond, and aluminum nitride.

透光性放熱部材6が水晶からなるものである場合、水晶はサファイア等とは異なり劈開性を有しないので、図2及び図3に示すように、切頭円錐状にカットすることが可能であり、このため、基体2の凹部22を切頭円錐状にすることができる。凹部22が切頭円錐状であると、光性放熱部材6や波長変換部材5と基体2とが接する面積を増大させることができるので、これらの熱をより効率的に基体2へ伝導し放出することができる。また、凹部22が切頭円錐状であると、透光性放熱部材6や波長変換部材5の寸法精度が低くても、凹部22の内側周面に密に接触させることができるので、高い加工精度を必要とせずに、透光性放熱部材6や波長変換部材5と基体2との密着性を向上することができる。従って、より効果的に放熱性を高めることが可能となる。   When the translucent heat radiating member 6 is made of quartz, unlike sapphire, the quartz does not have cleavage, so that it can be cut into a truncated cone as shown in FIGS. For this reason, the concave portion 22 of the base 2 can be formed in a truncated cone shape. If the concave portion 22 has a truncated conical shape, the area where the light radiating member 6 or the wavelength converting member 5 and the base 2 are in contact with each other can be increased, so that these heats are more efficiently conducted to the base 2 and released. can do. Further, if the concave portion 22 has a truncated conical shape, even if the dimensional accuracy of the translucent heat radiating member 6 and the wavelength converting member 5 is low, it can be brought into close contact with the inner peripheral surface of the concave portion 22, so that high processing is possible. The adhesiveness between the translucent heat radiating member 6 and the wavelength converting member 5 and the base 2 can be improved without requiring accuracy. Therefore, it becomes possible to improve heat dissipation more effectively.

本実施形態に係る発光装置1のうち、LED素子3として近紫外光を発するものを用い、蛍光体51として、赤色蛍光体、緑色蛍光体及び青色蛍光体を用いたものでは、LED素子3が発した近紫外光によって励起された赤色蛍光体、緑色蛍光体及び青色蛍光体が発する赤色光、緑色光及び青色光が混ざり合って白色光が発せられる。そして、LED素子3が発する近紫外光は発光装置1の発光色である白色に実質的に影響しない。このため、例えば、LED素子3が青色光を発するものであって、当該青色光が波長変換部材5に含まれる蛍光体51から発した光と混ざり合うように構成してある場合は、発光装置1の発光面において光路長の差に由来する色調むらが生じやすいが、LED素子3が近紫外光を発するものであって、蛍光体51が、赤色蛍光体、緑色蛍光体及び青色蛍光体である発光装置1は、このような色調むらを生じにくい。   Among the light emitting devices 1 according to the present embodiment, the LED element 3 that emits near ultraviolet light is used, and the phosphor 51 that uses a red phosphor, a green phosphor, and a blue phosphor is used. White light is emitted by mixing red light, green light, and blue light emitted by the red, green, and blue phosphors excited by the emitted near-ultraviolet light. The near-ultraviolet light emitted from the LED element 3 does not substantially affect the white color that is the emission color of the light-emitting device 1. For this reason, for example, when the LED element 3 emits blue light and the blue light is configured to be mixed with light emitted from the phosphor 51 included in the wavelength conversion member 5, the light emitting device Although the color unevenness due to the difference in the optical path length is likely to occur on the light emitting surface 1, the LED element 3 emits near-ultraviolet light, and the phosphor 51 is composed of a red phosphor, a green phosphor and a blue phosphor. Some light emitting devices 1 are less likely to cause such uneven color tone.

そして、このような、LED素子3として近紫外光を発するものを用い、蛍光体51として、赤色蛍光体、緑色蛍光体及び青色蛍光体を用いた発光装置1が発する混合光は、プランク軌跡上を移動するものであって、極めて太陽光に近い自然な白色となる。   The LED element 3 that emits near-ultraviolet light is used, and the mixed light emitted from the light emitting device 1 using the red phosphor, the green phosphor, and the blue phosphor as the phosphor 51 is on the Planck locus. The natural white color is very close to sunlight.

このような実施形態に係る発光装置1であれば、透光性放熱部材6が波長変換部材5の上に載置されていることにより、効率的に波長変換部材5の熱を放出することができるので、波長変換部材5に含まれる蛍光体51の発光効率や輝度の低下や、熱劣化を、効果的に防ぐことができる。   If it is the light-emitting device 1 which concerns on such embodiment, when the translucent heat radiating member 6 is mounted on the wavelength conversion member 5, it can discharge | release the heat | fever of the wavelength conversion member 5 efficiently. Therefore, it is possible to effectively prevent the luminous efficiency and luminance of the phosphor 51 included in the wavelength conversion member 5 from decreasing and the thermal deterioration.

なお、本発明は前記実施形態に限られるものではない。   The present invention is not limited to the above embodiment.

例えば、波長変換部材5は、互いに異なる色の光を発する蛍光体51が均一に分散されているものでなくともよく、互いに異なる色の光を発する蛍光領域が並設されているものであってもよい。すなわち、例えば、図4に示すように、赤色蛍光体を含有する赤色蛍光領域R、緑色蛍光体を含有する緑色蛍光領域G、及び、青色蛍光体を含有する青色蛍光領域Bが横方向に並設されていれば、青色蛍光体が発した青色光や緑色蛍光体が発した緑色光が他の蛍光体51に吸収されることがないのでエネルギー変換効率を高くすることができ、また、波長変換部材5において、赤色蛍光領域R、緑色蛍光領域G及び青色蛍光領域Bが下面からこの順で厚さ方向に積層されている場合は、LED素子3に近い赤色蛍光体ほど速く劣化するので、発光装置1の発光色が変化しやすいが、各蛍光領域が横方向に並設されている場合は、各蛍光体51の劣化速度に差が付きにくいので、発光装置1の発光色が変化しにくい。   For example, the wavelength conversion member 5 does not have to have the phosphors 51 that emit light of different colors uniformly dispersed, and has fluorescent regions that emit light of different colors in parallel. Also good. That is, for example, as shown in FIG. 4, a red fluorescent region R containing a red phosphor, a green fluorescent region G containing a green phosphor, and a blue fluorescent region B containing a blue phosphor are arranged in the horizontal direction. If it is provided, the blue light emitted from the blue phosphor and the green light emitted from the green phosphor are not absorbed by the other phosphors 51, so that the energy conversion efficiency can be increased, and the wavelength In the conversion member 5, when the red fluorescent region R, the green fluorescent region G, and the blue fluorescent region B are laminated in the thickness direction in this order from the lower surface, the red phosphor closer to the LED element 3 deteriorates faster, The light emission color of the light emitting device 1 is likely to change. However, when the fluorescent regions are arranged in parallel in the horizontal direction, the light emission color of the light emitting device 1 changes because it is difficult to make a difference in the deterioration rate of the phosphors 51. Hateful.

また、図4に示すように、波長変換部材5の周縁には、熱伝導率の高い、アルミナ、窒化アルミニウム、炭化ケイ素、アルミニウム、銅、銀、金、カーボン、サファイア、ダイアモンド等の粒子が分散されてなる放熱領域Hが形成されていてもよい。このように波長変換部材5の周縁に放熱領域Hが形成されていれば、より一層効率的に波長変換部材5の熱を放出することができる。   Further, as shown in FIG. 4, particles such as alumina, aluminum nitride, silicon carbide, aluminum, copper, silver, gold, carbon, sapphire, diamond and the like having high thermal conductivity are dispersed on the periphery of the wavelength conversion member 5. The formed heat dissipation area H may be formed. Thus, if the heat dissipation area H is formed at the periphery of the wavelength conversion member 5, the heat of the wavelength conversion member 5 can be released more efficiently.

更に、LED素子3から発した紫外光のうち、蛍光体51に吸収されずに外部に射出される紫外光を遮断するために、波長変換部材5又は透光性放熱部材6の上にUVカットフィルター等が設けられていてもよい。   Further, in order to block out the ultraviolet light emitted from the LED element 3 without being absorbed by the phosphor 51, the UV cut is applied on the wavelength conversion member 5 or the translucent heat radiating member 6. A filter or the like may be provided.

また、基体2の凹部22の内側壁面に高反射率の金属薄膜を設けることにより、凹部22の内側壁面がリフレクタとして機能するものであってもよい。   Further, the inner wall surface of the recess 22 may function as a reflector by providing a metal thin film having a high reflectance on the inner wall surface of the recess 22 of the base 2.

更に、透光性放熱部材6は、図5に示すように、凸レンズとして機能するものであってもよい。   Furthermore, the translucent heat radiating member 6 may function as a convex lens, as shown in FIG.

また、LED素子3は基体2に設けられた配線導体にワイヤボンディングを用いて接続されていてもよい。   Further, the LED element 3 may be connected to a wiring conductor provided on the base 2 using wire bonding.

更に、透光性放熱部材6と波長変換部材5とは、図6に示すように、上下方向の位置が前記実施形態と逆であってもよく、波長変換部材5が透光性放熱部材6の上に載置されていてもよい。   Further, as shown in FIG. 6, the translucent heat radiating member 6 and the wavelength converting member 5 may have the vertical positions opposite to those of the above embodiment, and the wavelength converting member 5 is the translucent heat radiating member 6. It may be placed on.

このように波長変換部材5が透光性放熱部材6の上に載置されている実施形態としては、図7に示すように、基体2の凹部22の側壁に段部23が形成されていて、その上端面に透光性放熱部材6の縁部が載置されるように構成されていてもよく、また、図8に示すように、基体2の上端面21に透光性放熱部材6が載置されていてもよい。   As an embodiment in which the wavelength conversion member 5 is placed on the translucent heat radiating member 6 as described above, a step portion 23 is formed on the side wall of the concave portion 22 of the base 2 as shown in FIG. The edge of the light transmissive heat radiating member 6 may be placed on the upper end surface thereof, and the light transmissive heat radiating member 6 is formed on the upper end surface 21 of the base 2 as shown in FIG. May be placed.

なお、図8に示す態様においては、横方向において、波長変換部材5より透光性放熱部材6の方が大きく、更に、透光性放熱部材6より基体2の方が大きく設定されており、このため、発光装置1の側周面は階段状をなしている。各部材の大きさをこのように設定することにより、波長変換部材5から発した熱を、透光性放熱部材6を経て基体2へ、より効率的に伝導し放出することができる。   In the aspect shown in FIG. 8, the translucent heat radiating member 6 is larger than the wavelength converting member 5 in the lateral direction, and further, the base 2 is set larger than the translucent heat radiating member 6. For this reason, the side peripheral surface of the light emitting device 1 has a stepped shape. By setting the size of each member in this manner, the heat generated from the wavelength conversion member 5 can be more efficiently conducted and released to the base body 2 through the translucent heat radiating member 6.

また、前記実施形態では基体2に実装されているLED素子3は1個であるが、図9及び図10に示すように、複数のLED素子3が基体2に実装されていてもよい。なお、図9及び図10に示す実施形態では、基体2は、基板2aとその上に設置される枠体2bとからなり、基板2aの上面が凹部22の底面221を構成している。また、図9及び図10に示す実施形態では、放熱効率及び波長変換効率の点から、横方向において、透光性部材4より波長変換部材5の方が大きく、更に、波長変換部材5より透光性放熱部材6の方が大きく設定されている。   Moreover, in the said embodiment, although the LED element 3 mounted in the base | substrate 2 is one piece, as shown in FIG.9 and FIG.10, the some LED element 3 may be mounted in the base | substrate 2. FIG. In the embodiment shown in FIGS. 9 and 10, the base 2 includes a substrate 2 a and a frame body 2 b installed on the substrate 2 a, and the upper surface of the substrate 2 a constitutes the bottom surface 221 of the recess 22. In the embodiment shown in FIGS. 9 and 10, in terms of heat dissipation efficiency and wavelength conversion efficiency, the wavelength conversion member 5 is larger than the translucent member 4 in the lateral direction, and more transparent than the wavelength conversion member 5. The light radiating member 6 is set larger.

その他、本発明は上記の各実施形態に限られず、本発明の趣旨を逸脱しない限り、前述した種々の構成の一部又は全部を適宜組み合わせて構成してもよい。   In addition, the present invention is not limited to the above-described embodiments, and may be configured by appropriately combining some or all of the various configurations described above without departing from the spirit of the present invention.

このように本発明によれば、熱による蛍光体の変化を抑制したLED発光装置を得ることができる。   Thus, according to this invention, the LED light-emitting device which suppressed the change of the fluorescent substance by a heat | fever can be obtained.

1・・・発光装置
2・・・基体
3・・・LED素子
4・・・透光性部材
5・・・波長変換部材
6・・・透光性放熱部材
DESCRIPTION OF SYMBOLS 1 ... Light-emitting device 2 ... Base | substrate 3 ... LED element 4 ... Translucent member 5 ... Wavelength conversion member 6 ... Translucent heat dissipation member

Claims (4)

上端面に開口する凹部を有した基体と、
前記凹部の底面に実装されたLED素子と、
前記LED素子を封止する透光性部材と、
蛍光体を含有し、前記透光性部材の上に載置された波長変換部材と、
前記波長変換部材の上に載置されて前記凹部の開口部を覆う透光性放熱部材と、を備えていることを特徴とする発光装置。
A base body having a recess opening in the upper end surface;
LED elements mounted on the bottom surface of the recess,
A translucent member for sealing the LED element;
A wavelength conversion member containing a phosphor and placed on the translucent member;
A light-transmitting heat dissipating member placed on the wavelength conversion member and covering the opening of the recess.
前記波長変換部材は、異なる色の光を発する蛍光領域が並設されてなるものである請求項1記載の発光装置。   The light-emitting device according to claim 1, wherein the wavelength conversion member includes fluorescent regions that emit light of different colors. 前記LED素子は、近紫外光を発するものであり、
前記蛍光体は、赤色光を発する蛍光体、緑色光を発する蛍光体、及び、青色光を発する蛍光体である請求項1記載の発光装置。
The LED element emits near ultraviolet light,
The light emitting device according to claim 1, wherein the phosphor is a phosphor that emits red light, a phosphor that emits green light, and a phosphor that emits blue light.
上端面に開口する凹部を有した基体と、
前記凹部の底面に実装されたLED素子と、
前記LED素子を封止する透光性部材と、
前記透光性部材の上に載置された透光性放熱部材と、
前記透光性放熱部材の上に載置されて前記凹部の開口部を覆う、蛍光体を含有する波長変換部材と、を備えていることを特徴とする発光装置。
A base body having a recess opening in the upper end surface;
LED elements mounted on the bottom surface of the recess,
A translucent member for sealing the LED element;
A light transmissive heat radiating member placed on the light transmissive member;
And a wavelength conversion member containing a phosphor, which is placed on the translucent heat dissipation member and covers the opening of the recess.
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