JPWO2009142137A1 - Code plate and manufacturing method thereof - Google Patents

Abstract

An object of the present invention is to provide a highly reliable code board and a method for manufacturing the same, which can obtain stable output characteristics, do not require an A / D converter, and the like. In a code plate in which an ON region 2 for obtaining an ON signal and an OFF region 3 for obtaining an OFF signal are alternately formed on a sliding surface 1a of the slider, an ON region 2 and an OFF region are provided. 3 are formed on the surface of the conductive layer, and a first separation line 4 is provided between the on region 2 and the off region 3, which partitions the on region 2 and the off region 3 and is formed of an insulating material. Yes. At this time, it is preferable that the ON region 2, the OFF region 3, and the first separation line 4 appearing on the sliding surface 1a are formed on the same surface. [Selection] Figure 1

Description

  The present invention relates to a code plate used in an encoder, and more particularly to a code plate that can obtain stable output characteristics, does not require an A / D converter, and has excellent reliability, and a method for manufacturing the same. .

The following Patent Document 1 discloses an invention related to an encoder.
The invention described in Patent Document 1 discloses a code plate in which a number of irregularities are formed on the surface of a metal substrate and a resistance film is formed on the surface. The resistance film is formed with a thin part and a thick part. When the slider comes into contact with the thin part, the electrical resistance value decreases, and when the slider comes into contact with the thick part, the electrical resistance value. Is going to grow. Then, rotation information is obtained by shaping the extracted output waveform by A / D conversion or the like ([0013] column in Patent Document 1).

  However, in the form in which the surface of the metal substrate is provided with unevenness as in Patent Document 1 and a resistance film having a thin portion and a thick portion is formed thereon, the variation in resistance increases, and stable output characteristics can be obtained. difficult.

Further, since the encoder described in Patent Document 1 can obtain an analog output, a processing circuit such as an A / D converter is required to convert it into a digital signal.
JP-A-6-94476

  Therefore, the present invention is to solve the above-described conventional problems, and in particular, a stable output characteristic can be obtained, and an A / D converter or the like is not required, and a highly reliable code plate and a method for manufacturing the same The purpose is to provide.

The present invention provides a code plate in which an ON region for obtaining an ON signal and an OFF region for obtaining an OFF signal are alternately formed on the sliding surface with the slider,
The on region and the off region are both formed on the surface of a conductive layer, and the on region and the off region are partitioned between the on region and the off region, and a first separation formed of an insulating material. A line is provided.

  As described above, in the present invention, since the insulating first separation line is provided between the conductive on region and the off region, the resistance value is adjusted by the film thickness of the resistive film as in Patent Document 1. Therefore, variation in resistance can be suppressed to a small value, and stable output characteristics can be obtained. In addition, since the ON region and the OFF region are insulated by the insulating first separation line, the digital output can be obtained, and the output signal processing is patented such that no A / D converter is required. Compared to the invention described in Document 1, this can be facilitated.

  In the present invention, it is preferable that the ON region, the OFF region, and the first separation line appearing on the sliding surface are formed on the same surface. As a result, the sliding frictional force when the slider slides alternately on the ON region and the OFF region can be made small, and a sudden change due to a step can be eliminated, and the frictional force can be made almost constant. Accordingly, the product life can be extended.

  In the present invention, it is preferable that the first conductive layer constituting the ON region and the second conductive layer constituting the OFF region are formed of the same material. Since the slider slides relatively on the same surface on the on region and off region of the same material, it is possible to extend the life more effectively. In addition, since the material can be made common, the manufacturing cost can be reduced.

  In the present invention, it is preferable that a width dimension of the off region is larger than a width dimension of the on region. As a result, the contact portion of the slider has a width in the sliding direction, and a duty ratio of an output pulse close to 50% can be obtained even when the slider slides in a surface contact state.

  In the present invention, the first separation line is continuously formed over the entire circumference of the sliding surface, the conductive layer is supported by an insulating substrate formed of resin, and the first separation line is formed of the resin. It is preferable that it is formed by. Thus, for example, the conductive layer can be separated by laser light irradiation to form the first separation line, and the insulating first separation line and the insulating substrate can be formed by filling the resin, so that the code plate can be produced with a simple configuration. Can be manufactured with good performance.

  Further, in the present invention, the ON region is entirely divided into a region in which the A-phase ON region and the A-phase ON region that are spaced apart in the circumferential direction over the entire circumference of the sliding surface are different in radial position. It is formed of a B-phase ON region that is spaced apart in the circumferential direction over the circumference, and is provided in a different region that is radially shifted from the A-phase ON region and the B-phase ON region, and is electrically connected to the ON region. A common region, and the off region is formed between the A phase on region via the first separation line and the A phase off region is formed between the B phase on region via the first separation line. The first separation line that divides the common region, the A phase on region, and the B phase on region, and the A phase off region and the B phase off region. Is formed with a single stroke pattern Door is preferable. Thereby, the ON region and the OFF region can be easily partitioned, and the pattern deviation between the A phase and the B phase can be reduced.

  Further, in the present invention, the ON region is entirely divided into a region in which the A-phase ON region and the A-phase ON region that are spaced apart in the circumferential direction over the entire circumference of the sliding surface are different in radial position. It is formed of a B-phase ON region that is spaced apart in the circumferential direction over the circumference, and is provided in a different region that is radially shifted from the A-phase ON region and the B-phase ON region, and is electrically connected to the ON region. A common region, and the off region is formed between the A phase on region via the first separation line and the A phase off region is formed between the B phase on region via the first separation line. It is preferable that the B phase off region is insulated from the B phase off region. This can prevent an erroneous signal from being output.

  In the present invention, the common region, the A phase on region, and the B phase on region are arranged in this order in a direction orthogonal to the circumferential direction, and the adjacent A phase off region and the B phase off region are adjacent to each other. It is preferable that the gap is insulated by a second separation line formed of an insulating material. By forming the second separation line, the A-phase off region and the B-phase off region can be easily separated. In the above configuration, since the A-phase and B-phase patterns (tracks) are adjacent to each other, the output waveform and the phase difference can be easily controlled with high accuracy, and an error signal is output by forming the second separation line. Can be effectively prevented.

  In the present invention, for example, the second separation line is formed by a routing pattern from the first separation line. Alternatively, the second separation line may be formed in a branch pattern from the first separation line.

  In the present invention, it is preferable that the A-phase on region and the B-phase on region are arranged to be shifted in the circumferential direction. As a result, the A-phase signal slider and the B-phase signal slider can be arranged on the same straight line, and the necessary phase difference between the A-phase signal and the B-phase signal can be obtained with high accuracy. be able to.

Further, the present invention provides a method for manufacturing a code plate in which an ON region for obtaining an ON signal and an OFF region for obtaining an OFF signal are alternately formed on the sliding surface with the slider.
A step of printing a conductive paste having conductive particles and a binder resin on the transfer plate to form a conductive layer;
The conductive layer is separated into a first conductive layer whose surface is the on-region and a second conductive layer whose surface is the off-region, and between the first conductive layer and the second conductive layer. Forming a first separation line comprising a groove in
The conductive layer formed on the transfer plate is placed in a mold, and molten resin is poured into the mold. At this time, a first separation line including the groove portion, and the first conductive layer Filling the second conductive layer with the resin;
The transfer plate is peeled off, the conductive layer is transferred to the insulating substrate made of resin, and the ON region, the OFF region, and the first separation line formed of the resin appearing on the sliding surface are the same. And forming with a surface.

  According to the present invention, it is possible to reliably and easily form the first separation line that separates the ON region and the OFF region. Further, in the above manufacturing method, the on-region, the off-region, and the first separation line formed of the resin appearing on the sliding surface can be easily and appropriately formed on the same surface. Therefore, in the present invention, it is possible to manufacture a cord plate having a long life and excellent output stability by a simple manufacturing method.

  In the present invention, it is preferable that the conductive layer is separated into the first conductive layer and the second conductive layer by laser light irradiation. Thus, the first conductive layer and the second conductive layer can be separated with high accuracy. In addition, various code plates of various types and small lots can be easily formed with high productivity simply by changing the laser drawing program.

  Moreover, in this invention, it is preferable to isolate | separate the said conductive layer into the said 1st conductive layer and the said 2nd conductive layer continuously over the perimeter of the said sliding surface. Thereby, since it can isolate | separate by continuous laser beam irradiation, productivity can be improved.

  Further, in the present invention, the on-region is entirely divided into regions where the A-phase on-region and the A-phase on-region that are spaced apart in the circumferential direction over the entire circumference of the sliding surface are different in radial direction. A common region that is formed in a B-phase on region that is spaced circumferentially around the circumference and that is electrically connected to the on-region in a region that is radially shifted from the A-phase on region and the B-phase on region. And forming the off region between the A phase on region via the first separation line and between the B phase on region via the first separation line. When forming with the B phase off region, the first separation line that divides the common region, the A phase on region, and the B phase on region, and the A phase off region and the B phase off region is drawn with one stroke. Preferably formed in a patternThereby, an ON area | region and an OFF area | region can be divided easily, and the pattern shift | offset | difference of A phase and B phase can be made small.

  Further, in the present invention, the on-region is entirely divided into regions where the A-phase on-region and the A-phase on-region that are spaced apart in the circumferential direction over the entire circumference of the sliding surface are different in radial direction. A common region that is formed in a B-phase on region that is spaced circumferentially around the circumference and that is electrically connected to the on-region in a region that is radially shifted from the A-phase on region and the B-phase on region. And forming the off region between the A phase on region via the first separation line and the B phase formed between the A phase off region and the B phase on region via the first separation line. When forming in an off region, it is preferable to insulate the A phase off region from the B phase off region. Thereby, the code board which can prevent that an error signal is output can be manufactured simply and appropriately.

  In the present invention, in the direction perpendicular to the circumferential direction, the common region, the A phase on region, and the B phase on region are formed in this order, and the second conductive that constitutes the adjacent A phase off region. It is preferable that the layer and the second conductive layer constituting the B-phase off region are separated by a second separation line made of the resin. Thereby, even if the A phase and B phase patterns (tracks) are adjacent to each other, the A phase off region and the B phase off region can be easily separated by forming the second separation line.

  In the present invention, the second separation line can be formed with a routing pattern from the first separation line. For example, the second separation line can be easily drawn from the first separation line by the laser beam irradiation described above.

  In the present invention, it is also possible to form the second separation line with a branch pattern from the first separation line.

  In the present invention, it is desirable that the A-phase on region and the B-phase on region are formed so as to be shifted in the circumferential direction. In this way, the slider for the A phase signal and the slider for the B phase signal can be arranged on the same straight line, and the required phase difference between the A phase signal and the B phase signal can be accurately obtained. It can be ensured well, and can correspond to a high-resolution encoder.

In the present invention, a conductive paste having carbon powder and a first binder resin is printed to form a surface-side conductive layer on the transfer plate,
Next, it is preferable to form an inner conductive layer by printing a conductive paste having silver powder and a second binder resin on the surface-side conductive layer. Thereby, the environmental resistance can be improved and the conduction resistance can be reduced.

  According to the cord plate of the present invention, stable output characteristics can be obtained, and an A / D converter or the like is not required, and high reliability can be obtained. In the present invention, it is possible to manufacture a cord plate having a long life and excellent output stability by a simple manufacturing method.

FIG. 1 is a plan view of a code plate according to the first embodiment, FIG. 2 is an enlarged plan view in which a part of FIG. 1 is exaggerated, and FIG. 3 is cut along the line AA shown in FIG. FIG. 4 is a plan view of the code plate in the second embodiment, FIG. 5 is a partially enlarged perspective view of the code plate in the third embodiment, and FIG. 6 is an output pulse in the third embodiment. Waveform, FIG. 7 is an encoder circuit diagram, FIG. 8 is a partially enlarged perspective view for explaining the malfunction of the first embodiment, and FIG. 9 is an output pulse waveform when the malfunction described in FIG. 10 is a plan view of a code plate according to the fourth embodiment. In FIG. 3, the signal waveform of the B-phase pulse signal (V _B ) and the position of the slider at the timing when the signal is switched on / off are additionally illustrated.

  In the embodiment shown in FIG. 1, the sliding surface (surface) 1a of the code plate 1 used for the rotary encoder is formed in a circular shape, but the shape is not particularly limited. In this embodiment, for example, a rotary encoder in which the code plate 1 rotates and the slider 9 (see FIG. 3) is a fixed side is shown. For example, a through hole is formed in the center 1b of the code plate 1. A rotation shaft is inserted into the center 1b of the code plate 1, and the code plate 1 is supported so as to be rotatable about the rotation axis. Note that the code plate 1 may be supported by the rotating shaft by a configuration in which the through hole is not formed in the center 1b of the code plate 1 and the concave and convex portions are integrally formed or integrally formed. The code plate 1 may be a rotary encoder on the fixed side and on the movable side where the slider rotates.

  As shown in FIGS. 1 and 2, a ring-shaped common region 10 is formed on the center 1b side on the sliding surface 1a of the code plate 1 (the common region 10 in a form in which no through hole is formed in the center 1b). May be a simple circle), and an A-phase ON region 11 is formed along the outer periphery of the common region (ON region) 10 so as to protrude in the radial direction at a predetermined interval in the circumferential direction. The B-phase on region 12 is arranged so as to be shifted in the circumferential direction (clockwise direction) with respect to the A-phase on region 11.

  The region between the A phase on region 11 and the region between the B phase on region 12 in the circumferential direction is the off region 3. In the present embodiment, the ON region 2 of the common region 10, the A phase ON region 11, and the B phase ON region 12 is formed on the surface of the first conductive layer 7a, and the OFF region 3 is the surface of the second conductive layer 7b. Formed with.

  In the present embodiment, the first separation line 4 partitions the ON region 2 composed of the common region 10, the A-phase ON region 11, and the B-phase ON region 12, and the OFF region 3. As will be described later, the first separation line 4 separates the conductive layer into the first conductive layer 7a and the second conductive layer 7b by, for example, laser light irradiation, and the separated first conductive layer 7a and second conductive layer 7a are separated from each other. It is formed by filling a resin between the conductive layer 7b.

  The width in the circumferential direction of the A phase on region 11, the B phase on region 12, and the off region 3 is approximately 100 μm to 200 μm, and the width of the first separation line 4 is approximately 20 to 40 μm. A cord plate can be formed.

  In the embodiment shown in FIG. 3, both the first conductive layer 7a and the second conductive layer 7b have a laminated structure. The conductive layers 7a and 7b are composed of the surface-side conductive layer 5 and the inner conductive layer 6, and the surface of the surface-side conductive layer 5 is exposed to the sliding surface 1a.

  In this embodiment, the surface side conductive layer 5 is formed having carbon powder and a first binder resin. The carbon powder is, for example, a mixture of carbon black and carbon fiber.

  The inner conductive layer 6 includes silver powder and a second binder resin. The conductive particles contained in the inner conductive layer 6 are preferably silver powder and bismuth oxide, carbon, or a composite powder containing bismuth oxide and carbon as main components.

  For the first binder resin and the second binder resin, thermosetting resins such as polyimide resin, bismaleimide resin, epoxy resin, phenol resin, and acrylic resin can be preferably used.

  In the embodiment shown in FIG. 1, the first separation line 4 is formed in a one-stroke pattern continuous over the entire circumference of the sliding surface 1a. For example, as shown in FIG. 1, the first separation line 4 is formed in a meander shape (more specifically, substantially in a gear shape), whereby the A-phase on region 11 and the B-phase partitioned by the first separation line 4. The ON region 12 and the OFF region 3 are alternately arranged along the circumferential direction.

  As shown in FIG. 3, the first conductive layer 7a and the second conductive layer 7b are supported by an insulating substrate 8 made of resin. As shown in FIG. 3, since this resin is also interposed between the first conductive layer 7a and the second conductive layer 7b, the first separation line 4 appearing on the sliding surface 1a is also the same as the insulating substrate 8. It is made of resin.

  A common slider (not shown) relatively slides on the common region 10 formed in an annular or circular shape over the entire circumference of the code plate 1. Further, the first slider (not shown) includes an A-phase ON region 11 formed in a region (track) having a radial position (diameter dimension) different from that of the common region 10, and an OFF region between the A-phase ON region 11. 3 and slide relative to each other alternately. Further, the second slider 9 is located in a region having a different radial position (diameter dimension) from the common region 10 and the A-phase on region 11, that is, a region (track) on the outer peripheral side of the A-phase on region 11. The formed B-phase ON region 12 and the OFF region 3 between the B-phase ON regions 12 are alternately slid relative to each other. A phase signal pattern is formed by the A phase on region 11 and the off region 3 between the A phase on regions 11, and similarly, between the B phase on region 12 and the B phase on region 12. A B-phase signal pattern is formed with the off region 3.

When the first slider is relatively sliding on the A-phase ON region 11 by rotating the code plate 1, the first slider and the common slider are electrically connected. And an ON signal is output. On the other hand, when the first slider slides relatively on the off region 3, the first slider and the common slider are electrically disconnected, and an OFF signal is output. Then, the ON signal and the OFF signal are alternately repeated, and an A-phase pulse signal (V _A ) is output.

Similarly, when the second slider 9 slides relatively on the B-phase on region 12, the second slider 9 and the common slider are electrically connected and turned on. (ON) signal is output. On the other hand, when the second slider 9 slides relatively on the OFF region 3, the second slider 9 and the common slider are electrically disconnected, and an OFF signal is output. Then, the ON signal and the OFF signal are alternately repeated, and the B-phase pulse signal (V _B ) is output (see FIG. 3).

  In the embodiment shown in FIG. 1 and FIG. 2, the B-phase on region is output so that the timing (phase) of the A-phase pulse and the B-phase pulse is shifted by 90 degrees (1/4 of one pulse). 12 and the A-phase on region 11 are arranged so as to be shifted in the circumferential direction. Thus, in the present embodiment, the phase difference between the A-phase pulse signal and the B-phase pulse signal is obtained by shifting the A-phase on region 11 and the B-phase on region 12 in the circumferential direction. Since the phase first slider and the phase B second slider can be arranged side by side along the radial direction of the code plate 1, the accuracy of the phase difference can be increased. The rotation state (rotation direction and rotation amount) can be detected by measuring the output of each pulse. In particular, in the form of FIG. 1, the A-phase pattern (track) and the B-phase pattern (track) are adjacent to each other, and a common region 10 is provided on the center 1 b side of the code plate 1, and A Since the phase and B phase patterns are formed, the A phase and B phase patterns can be formed in a wide region, and the output waveform and the phase difference can be controlled with high accuracy.

  A characteristic configuration of the code plate 1 of the present embodiment will be described below. In this embodiment, both the ON region 2 and the OFF region 3 are formed on the surfaces of the conductive layers 7 a and 7 b, and the ON region 2 and the OFF region 3 are partitioned between the ON region 2 and the OFF region 3 and insulated. A first separation line 4 made of material is provided.

  As a result, the variation in resistance can be suppressed smaller than the case where the resistance is adjusted by the film thickness of the resistive film as in Patent Document 1, and stable output characteristics can be obtained. In addition, since a digital binary output can be obtained and the A / D converter is not required, output signal processing can be facilitated as compared with the invention described in Patent Document 1. Further, since the off region 3 is also formed on the surface of the conductive layer 7b in the same manner as the on region 2, the sliding friction when the slider alternately slides on the on region 2 and the off region 3 can be made substantially the same. . Further, the ON region 2 and the OFF region 3 are separated by a narrow first separation line 4, and the ON region 2, the OFF region 3 and the first separation line 4 can be formed on the same plane, so that the OFF region 3 is insulated, for example. Compared to the case where the same resin as that of the substrate 8 is used, a step is less likely to occur on the sliding surface 1a even after long-term use. Therefore, the life of the encoder can be extended.

  Moreover, it is preferable that the first conductive layer 7a constituting the ON region 2 and the second conductive layer 7b constituting the OFF region 3 are formed of the same material. As a result, the slider slides on the ON region 2 and the OFF region 3 of the same material, so that the life can be more effectively extended. In addition, manufacturing costs can be reduced by using common materials.

  As shown in FIG. 3, the width dimension T <b> 4 of the off region 3 is preferably formed larger than the width dimension T <b> 3 of the on region 2. Since an area for generating an ON signal is increased by the width dimension T5 in the sliding direction of the slider 9, for example, if the width dimension T4 of the OFF area 3 is set to be the same as the width dimension T3 of the ON area 2, the ON signal is substantially ON. Region 2 is wider than off region 3. As a result, the duty ratio of the output pulse cannot be brought close to 50%.

  Therefore, in consideration of the width dimension T5 of the slider 9, the width dimension T4 of the off region 3 is formed larger than the width dimension T3 of the on region 2, and the pulse width T1 of the on signal and the pulse width T2 of the off signal are It is more preferable to adjust the width dimension T3 and the width dimension T4 so that they are substantially the same (see FIG. 3). Note that the slider is made of a metal material such as a conductive metal plate. For the sake of easy understanding, the slider 9 is shown in a columnar shape in FIG.

The relationship between the width dimension T3 and the width dimension T4 can be adjusted by the following equation.
T3 = T1-T5, T4 = T2 + T5-2 × T6
Here, T6 is the width dimension of the first separation line 4.

  In addition, the first separation line 4 is continuously formed over the entire circumference of the sliding surface 1a, and the first separation line 4 is formed of the same resin as the insulating substrate 8, so that, for example, the conductive layer is made of a laser. The first separation line 4 can be formed by separation by light irradiation, and the insulating first separation line 4 and the insulating substrate 8 can be formed by filling the resin. Therefore, the code plate can be formed with a simple structure and high productivity.

  In the embodiment shown in FIG. 4, an A-phase ON region 21 is formed on the outer peripheral side of the common region 20 with a predetermined interval in the circumferential direction, and a predetermined interval is provided on the inner peripheral side of the common region 20 in the circumferential direction. B-phase on region 22 is formed. The common region 20, the A phase on region 21, and the B phase on region 22 are on regions 23 formed on the surface of the first conductive layer. As in the embodiment of FIG. 1, the B-phase on region 22 is output so that the timing (phase) of the A-phase pulse and the B-phase pulse are shifted by 90 degrees (1/4 of one pulse). The A-phase ON region 21 is arranged so as to be shifted in the circumferential direction with respect to the common region 20.

  In the embodiment of FIG. 4, the A region on region 21 and the B phase on region 22 are off regions 24 formed on the surface of the second conductive layer, and the on region 23 and the off region 24 are insulative. It is partitioned by the first separation line 25. Although the 1st separation line 25 is continuously formed over the circumferential direction similarly to embodiment of FIG. 1, in the embodiment of FIG. 4, two 1st separation lines 25 are outside and inside of a sliding surface. Provided. In the present embodiment, the number of the first separation lines 25 is not limited. However, as shown in FIG. 1, the common region, the A-phase region, and the B-phase region are arranged in this order in the direction orthogonal to the circumferential direction, that is, in the radial direction. By partitioning the phase on region 11 and the B phase on region 12, the on region and the off region can be easily partitioned, and the A phase pattern and the B phase pattern can be adjacent to each other. The pattern shift between the on region 11 and the B phase on region 12 can be reduced.

  Next, the third embodiment shown in FIG. 5 is obtained by improving the configuration of the first embodiment shown in FIG.

  In FIG. 5, the adjacent A phase off region 3a and B phase off region 3b defined by the first separation line 4 are insulated by a second separation line 31 formed of an insulating material.

  On the other hand, unlike FIG. 5, FIG. 8 does not insulate the A phase off region 3 a and the B phase off region 3 b by the second separation line 31.

  Now, as shown in FIG. 8, the second slider 9 sliding on the B phase region (track) is positioned on the B phase off region 3b, while sliding on the A phase region (track). It is assumed that the first slider 13 is positioned on the first separation line 4. At this time, if the contact surface 13a of the first slider 13 made of a metal plate or the like is larger than the width of the first separation line 4, the first slider 13 is turned on region 2 (A phase on region 11). And the off region 3 (A phase off region 3a). Then, the second slider 9 located on the B-phase off region 3b is electrically connected to the first slider 13 in contact with the A-phase on region 11 via the second conductive layer 7b. As a result, it is electrically connected to a common slider (not shown) that slides on the common region 10 (current paths are indicated by arrows in FIG. 8). Therefore, as shown in the circuit diagram of FIG. 7, the B-phase circuit, which should originally be in an open circuit state without conducting with the common slider, is in conduction with the common slider as shown with a broken line in FIG. As a result, the output is lowered from 5V to 0V, and an ON signal is output as an erroneous signal for a moment at a sliding position where an OFF signal should be output as shown in FIG. As shown in FIG. 9, the same phenomenon occurs for the A phase.

  On the other hand, as shown in FIG. 5, when the state between the adjacent A-phase off region 3 a and B-phase off region 3 b defined by the first separation line 4 is insulated by the second separation line 31, As in the case of FIG. 8, the first slider 13 that slides on the A-phase region is located on the B-phase off region 3 b even if it is located on the first separation line 4. The second slider 9 is not electrically connected to the first slider 13 (and the common slider) in contact with the A-phase on region 11 (on region 2).

  Therefore, while the second slider 9 is positioned on the B-phase off region 3b, the B-phase circuit shown in FIG. 7 maintains an open circuit state. Therefore, as shown in FIG. 6, a rectangular pulse signal can be output with high accuracy, and an erroneous signal can be effectively prevented from being output.

  In FIG. 5, the second separation line 31 is formed in a routing pattern from the first separation line 4. Thereby, the 1st separation line 4 and the 2nd separation line 31 can be formed with a single stroke pattern.

  Alternatively, as shown in FIG. 10, the second separation line 31 may be formed in a branch pattern from the first separation line 4.

  In the present embodiment, the pattern shape of the second separation line 31 is not limited. It suffices if the A phase off region 3a and the B phase off region 3b formed by the second conductive layer 7b are adjacent to each other and the A phase off region 3a and the B phase off region 3b can be insulated by the second separation line 31.

  In the present embodiment, the second separation line 31 is formed of the same resin as the insulating substrate 8 in the same manner as the first separation line 4, and the first separation line 4, the second separation line 31, the on region 2 and the off region 3 are formed. It is preferable that they are all formed on the same surface.

  In the configuration in which the A phase region, the common region, and the B phase region are arranged in this order in the radial direction that is a direction orthogonal to the circumferential direction as in the form of FIG. 4, the two first separation lines 25 The A-phase off region 24a and the B-phase off region 24b are in an insulated state. Therefore, it is not necessary to form the second separation line 31 in the form of FIG.

  FIG. 11 to FIG. 15 are explanatory views of steps showing the method for manufacturing the code plate of the present embodiment. 11 (a), 12 (a), 13 (a), and 14 to 15 are all taken along line BB in FIGS. 11 (b), 12 (b), and 13 (b). FIG. 11B and FIG. 12B are plan views of FIG. 11A and FIG. 12A, respectively. However, FIG.13 (b) is the reverse view seen through the transfer plate 30 from the arrow direction of Fig.13 (a).

  In the process shown in FIG. 11, the surface-side conductive layer 5 is formed by screen printing the first conductive paste on the transfer plate 30 formed of, for example, a brass plate. The surface of the transfer plate 30 is mirror-finished in advance. The transfer plate 30 is preferably made of metal. By forming the transfer plate 30 from a metal that does not thermally contract, the transfer plate 30 can be easily peeled off in the final process due to the effect of thermal contraction of the surface-side conductive layer 5. Moreover, since sufficient heat treatment can be applied to the conductive layers 7a and 7b, the wear resistance of the sliding surface 1a can be enhanced.

  In the present embodiment, the first binder resin is dissolved in the first solvent, and for example, carbon black and carbon fiber (pulverized powder of carbon fiber having an average particle diameter of 3 to 30 μm) are mixed with the first binder resin. 1 conductive paste. For example, the first binder resin is 30 to 95% by volume, and the total of carbon black and carbon fiber is 5 to 70% by volume (the total of the first binder resin, carbon black, and carbon fiber excluding the solvent is 100%. volume%).

A paste-like surface-side conductive layer 5 is screen-printed on the entire surface of the transfer plate 30.
After printing, the surface-side conductive layer 5 is dried, for example, at 100 to 250 ° C. for 10 to 60 minutes using a drying furnace, and the first solvent is evaporated and removed.

  Next, in the step shown in FIG. 12, a paste-like inner conductive layer 6 is pattern-formed on the surface-side conductive layer 5 by screen printing.

  The second conductive paste is mainly composed of a second binder resin, silver as a main component, and bismuth oxide, carbon, or a composite powder containing carbon, bismuth oxide and carbon, or the like in a second solvent. It is preferable that the conductive particles are mixed. For example, the second binder resin is 50 to 95% by volume and the conductive particles are 5 to 50% by volume (the second binder resin excluding the solvent and the total of the conductive particles is 100% by volume).

After printing, the screen-printed paste-like inner conductive layer 6 is dried, for example, at 100 to 260 ° C. for 10 to 60 minutes by using a drying furnace, and the second solvent is evaporated and removed.
You may dry the surface side conductive layer 5 and the inner side conductive layer 6 simultaneously.

  Next, in the process of FIG. 13, the surface side conductive layer 5 and the inner side conductive layer 6 are separated into the first conductive layer 7a and the second conductive layer 7b, and the first conductive layer 7a and the second conductive layer 7b are separated. A first separation line 4 made of a groove is formed between the two. The surface of the first conductive layer 7a (the surface facing the transfer plate 30 of the surface side conductive layer 5) is the ON region 2, and the surface of the second conductive layer 7b (the transfer plate 30 of the surface side conductive layer 5 with the transfer plate 30). The facing surface is the off region 3.

  In the embodiment shown in FIG. 13, the first separation line 4 formed of a groove partitioning the ON region 2 and the OFF region 3 is formed in a one-stroke pattern, for example, by laser light irradiation. For example, as shown in FIG. 13B (a rear view seen through the transfer plate 30 from the direction of the arrow in FIG. 13A), the first separation line 4 is formed in a substantially gear shape. As a result, the sliding surface 1a is divided into the common region 10, the A phase on region 11, and the B phase on region 12, which are the on region 2, and the off region 3 between the A phase on region 11 and the B phase on region 12. The The B phase on region 12 is arranged so as to be shifted in the circumferential direction (clockwise direction) with respect to the A phase on region 11. As shown in FIG. 13B, the A-phase ON region 11 and the B-phase ON region 12 and the OFF region 3 partitioned by the first separation line 4 are alternately formed along the circumferential direction.

  As the laser beam irradiation device, for example, LP-V10 or LP-V15 (both are excitation wavelength: 1064 nm, amplification method: output amplification by ytterbium) manufactured by SUNX Corporation can be preferably used. This laser is classified as a YAG laser, and the laser output is 12 W, for example.

  The first separation line 4 can be formed by etching, for example, but as described above, the first separation line 4 is formed by using, for example, a one-stroke pattern as shown in FIG. 13B using a YAG laser or the like. As a result, the machining time can be shortened, and the ON region 2 and the OFF region 3 can be partitioned with high accuracy.

  Next, the first binder resin contained in the surface-side conductive layer 5 and the second binder resin contained in the inner conductive layer 6 are simultaneously thermoset by heating in a heating furnace at a temperature of about 400 ° C. for 1 to 2 hours. To do. Thus, the surface-side conductive layer 5 has a film structure in which carbon powder is dispersed in a thermoset binder resin, and the inner conductive layer 6 has a film structure in which composite powder is dispersed in a thermoset binder resin.

  Here, carbitol acetate, methyl carbitol, ethyl carbitol, butyl carbitol, monoglyme, diglyme, methyltriglyme and the like can be used as the first solvent and the second solvent.

  Moreover, thermosetting resins, such as a polyimide resin, a bismaleimide resin, an epoxy resin, a phenol resin, an acrylic resin, can be selected for the first binder resin and the second binder resin. The binder resin preferably contains an acetylene-terminated polyisoimide oligomer from the viewpoint of increasing the glass transition temperature (Tg) and improving the heat resistance.

  Next, in the step shown in FIG. 14, the conductive layer formed on the transfer plate 30 is placed in the mold 40. Then, for example, an epoxy resin in a molten state is injected into the cavity 43 of the mold 40. At this time, the epoxy resin also appropriately flows into the first separation line 4 formed by the groove between the first conductive layer 7a and the second conductive layer 7b, and fills the gap (groove). Thereby, the 1st separation line 4 will also be formed with resin.

  The temperature of the mold 40 is, for example, 160 to 200 ° C., and the epoxy resin is cured to form the insulating substrate 8. Then, the insulating substrate 8 with the transfer plate 30 is taken out from the mold 40, and the transfer plate 30 is peeled off from the insulating substrate 8 and the conductive layers 7a and 7b are transferred to the insulating substrate 8 as shown in FIG. The board 1 is completed.

  According to the manufacturing method of the present embodiment, the first separation line 4 that separates and isolates the ON region 2 that is the surface of the first conductive layer 7a and the OFF region 3 that is the surface of the second conductive layer 7b is provided. It can be reliably and easily formed. In the present embodiment, the ON region 2, the OFF region 3, and the first separation line 4 made of an insulating resin can be formed on the same surface. Therefore, in this embodiment, it is possible to manufacture the code plate 1 having a long life and excellent output stability at a low cost by a simple manufacturing method.

  Further, in the present embodiment, it is preferable that the conductive layer is separated into the first conductive layer 7a and the second conductive layer 7b by laser light irradiation because separation can be performed with high accuracy. For example, since it can process by continuous laser beam irradiation like a one-stroke pattern, productivity can be improved. Further, the narrow first separation line 4 can be easily formed by laser light irradiation. Further, when separating into the first conductive layer 7a and the second conductive layer 7b, the width T5 in the sliding direction of the slider 9 and the first separation line are used to set the duty ratio of the output pulse to a desired ratio. As described in FIG. 3 in consideration of the width dimension T6 of 4, the processing pattern (drawing pattern) of the first separation line 4 so that the width dimension T4 of the off region 3 is larger than the width dimension T3 of the on region 2. Is preferably controlled. In particular, as shown in FIG. 3, the width dimension T5 in the sliding direction of the slider 9 and the first separation line 4 are set so that the pulse width T1 of the on signal and the pulse width T2 of the off signal are the same. By controlling the processing pattern in consideration of the width dimension T6, the duty ratio of the output pulse can be made closer to 50%, which is preferable.

  Moreover, in the manufacturing method of the code plate 1 described above, the conductive layer is formed by a laminated structure of the surface-side conductive layer 5 and the inner conductive layer 6, but a single-layer structure may be used. However, as in this embodiment, the surface-side conductive layer 5 containing carbon powder is exposed on the sliding surface, and the inner conductive layer 6 containing silver powder is placed on the inner side of the surface-side conductive layer 5 and exposed on the sliding surface. By avoiding this, the environmental resistance can be improved and the conduction resistance can be reduced.

  Further, as shown in FIG. 1, when a code plate in which the A-phase region and the B-phase region are adjacent to each other in the radial direction that is a direction orthogonal to the circumferential direction is formed, for example, in the process of FIG. The second conductive layer 7b constituting the phase-off region 3a and the second conductive layer 7b constituting the B-phase off region 3b are separated by the second separation line 31 formed of a groove (see FIG. 5). Then, in the step of FIG. 14, the second separation line 31 is filled with resin together with the first separation line 4 including the groove portion.

  As shown in FIG. 5, if the second separation line 31 is formed with a drawing pattern from the first separation line 4, the first separation line 4 and the second separation line 31 can be formed with a single stroke pattern in the process of FIG. it can.

  Alternatively, as shown in FIG. 10, the second separation line 31 can be formed in a branch pattern from the first separation line 4. For example, first, the first separation line 4 is formed by laser light irradiation, and then the second separation line 31 formed of a groove is formed by laser light irradiation between each A-phase off region 3a and B-phase off region 3b. .

  In any of the above-described embodiments, the code plate 1 in which the A-phase on region and the B-phase on region are arranged to be shifted in the circumferential direction has been described, but the present invention is not limited to this. That is, it may be a code plate in which the A-phase ON region and the B-phase ON region are not displaced in the circumferential direction. In this case, both contact portions of the A-phase slider and the B-phase slider By shifting the position in the circumferential direction, a desired phase difference may be generated between the A-phase pulse signal and the B-phase pulse signal.

  In addition, each of the code plates 1 of the present embodiment described above is of a form that is rotatably supported with respect to a fixed slider. For example, the code plate 1 is relative to the slider. Alternatively, it may be supported so as to be slidable. In this case, the ON region and the OFF region are alternately repeated toward the linear sliding direction of the slider.

The top view of the code board in a 1st embodiment, FIG. 1 is an enlarged plan view exaggerating a part of FIG. FIG. 2 is a partially enlarged cross-sectional view taken along the line AA shown in FIG. 1, and a diagram additionally showing a slider and a waveform of a B-phase pulse signal; The top view of the code board in 2nd Embodiment, The partial expansion perspective view of the code board in a 3rd embodiment, Output pulse waveform diagram in the third embodiment, Encoder circuit diagram, The partial expansion perspective view for demonstrating the malfunction of 1st Embodiment, FIG. 8 is an output pulse waveform diagram when the trouble described in FIG. 8 occurs; The top view of the code board in a 4th embodiment, It is process drawing which shows the manufacturing method of the code plate of this embodiment, (a) is a fragmentary sectional view when a code plate is cut | disconnected in the film thickness direction from the BB line shown in FIG.11 (b), (b) ) Is a plan view of the code plate during the manufacturing process, It is process drawing performed after FIG. 11, (a) is a fragmentary sectional view when a code board is cut | disconnected in the film thickness direction from the BB line shown in FIG.12 (b), (b) is a manufacturing process. Top view of the inner code plate It is process drawing performed after FIG. 12, (a) is a fragmentary sectional view when the said code | cord board is cut | disconnected in the film thickness direction from the BB line shown in FIG.13 (b), (b) is transcription | transfer. A back view of the code plate during the manufacturing process seen through the plate, FIG. 14 is a process diagram performed subsequent to FIG. 13, and is a partial cross-sectional view showing a state in which a conductive layer on a transfer plate is arranged in a mold; FIG. 15 is a process diagram performed next to FIG.

DESCRIPTION OF SYMBOLS 1 Code board 1a Sliding surface 2, 23 ON area | region 3, 24 OFF area | region 3a, 24a A phase OFF area | region 3b, 24b B phase OFF area | region 4, 25 1st separation line 5 Surface side conductive layer 6 Inner conductive layer 7a 1st Conductive layer 7b Second conductive layer 8 Insulating substrate 9, 13 Slider 10, 20 Common region 11, 21 Phase A on region 12, 22 Phase B on region 30 Transfer plate 31 Second separation line 40 Mold 43 Cavity

Claims (21)

In the code plate in which the ON region for obtaining the ON signal and the OFF region for obtaining the OFF signal are alternately formed on the sliding surface with the slider,
The on region and the off region are both formed on the surface of a conductive layer, and the on region and the off region are partitioned between the on region and the off region, and a first separation formed of an insulating material. A code plate, characterized in that a line is provided.   The code plate according to claim 1, wherein the ON region, the OFF region, and the first separation line appearing on the sliding surface are formed on the same surface.   The code plate according to claim 1 or 2, wherein the first conductive layer constituting the ON region and the second conductive layer constituting the OFF region are formed of the same material.   The code plate according to any one of claims 1 to 3, wherein a width dimension of the off region is larger than a width dimension of the on region.   The first separation line is continuously formed over the entire circumference of the sliding surface, the conductive layer is supported by an insulating substrate formed of resin, and the first separation line is formed of the resin. The code board according to any one of claims 1 to 4.   The ON region is an A-phase ON region that is spaced circumferentially over the entire circumference of the sliding surface, and a region that is different in radial direction from the A-phase ON region in the circumferential direction over the entire periphery. A common region is formed in a B-phase on region that is arranged at an interval, and is provided in a different region that is radially shifted from the A-phase on region and the B-phase on region. The off region includes an A phase off region formed between the A phase on regions via the first separation line and a B phase formed between the B phase on regions via the first separation line. An off region, and the first separation line dividing the common region, the A phase on region and the B phase on region, the A phase off region and the B phase off region is a one-stroke pattern The formed according to claim 5. Over de plate.   The ON region is an A-phase ON region that is spaced circumferentially over the entire circumference of the sliding surface, and a region that is different in radial direction from the A-phase ON region in the circumferential direction over the entire periphery. A common region is formed in a B-phase on region that is arranged at an interval, and is provided in a different region that is radially shifted from the A-phase on region and the B-phase on region. The off region includes an A phase off region formed between the A phase on regions via the first separation line and a B phase formed between the B phase on regions via the first separation line. The code plate according to any one of claims 1 to 5, further comprising an off region, wherein the A-phase off region and the B-phase off region are insulated.   In the direction orthogonal to the circumferential direction, the common region, the A phase on region, and the B phase on region are arranged in this order, and between the adjacent A phase off region and the B phase off region. The cord plate according to claim 7, wherein the cord plate is insulated by a second separation line made of an insulating material.   The code plate according to claim 8, wherein the second separation line is formed by a routing pattern from the first separation line.   The code plate according to claim 8, wherein the second separation line is formed in a branch pattern from the first separation line.   The code plate according to any one of claims 6 to 10, wherein the A-phase ON region and the B-phase ON region are arranged so as to be shifted in the circumferential direction. In the manufacturing method of the code plate in which the ON region for obtaining the ON signal and the OFF region for obtaining the OFF signal are alternately formed on the sliding surface with the slider,
A step of printing a conductive paste having conductive particles and a binder resin on the transfer plate to form a conductive layer;
The conductive layer is separated into a first conductive layer whose surface is the on-region and a second conductive layer whose surface is the off-region, and between the first conductive layer and the second conductive layer. Forming a first separation line comprising a groove in
The conductive layer formed on the transfer plate is placed in a mold, and molten resin is poured into the mold. At this time, a first separation line including the groove portion, and the first conductive layer Filling the second conductive layer with the resin;
The transfer plate is peeled off, the conductive layer is transferred to the insulating substrate made of resin, and the ON region, the OFF region, and the first separation line formed of the resin appearing on the sliding surface are the same. Forming on the surface,
A method for manufacturing a cord plate, comprising:   The manufacturing method of the code | cord board of Claim 12 which isolate | separates the said conductive layer into a said 1st conductive layer and a said 2nd conductive layer by laser beam irradiation.   14. The method of manufacturing a code plate according to claim 13, wherein the conductive layer is separated into the first conductive layer and the second conductive layer continuously over the entire circumference of the sliding surface.   The A-phase ON region, which is arranged at intervals in the circumferential direction over the entire circumference of the sliding surface, and the A-phase ON region in a region where the radial position is different from each other in the circumferential direction. A common region that is electrically connected to the ON region is formed in a different region that is radially shifted from the A phase ON region and the B phase ON region. A phase off region formed between the A phase on regions via the first separation line, and a B phase off region formed between the B phase on regions via the first separation line, Forming the first separation line in a single stroke pattern that partitions the common region, the A-phase on region, and the B-phase on region, and the A-phase off region and the B-phase off region. Item 14. Manufacture of the cord plate according to item 14 Law.   The A-phase ON region, which is arranged at intervals in the circumferential direction over the entire circumference of the sliding surface, and the A-phase ON region in a region where the radial position is different from each other in the circumferential direction. A common region that is electrically connected to the ON region is formed in a different region that is radially shifted from the A phase ON region and the B phase ON region. A region is formed with an A phase off region formed between the A phase on regions via the first separation line and a B phase off region formed between the B phase on regions via the first separation line. 15. The method for manufacturing a code plate according to claim 12, wherein the A-phase off region and the B-phase off region are insulated from each other.   A second conductive layer that is formed in the order of the common region, the A-phase on region, and the B-phase on region in a direction orthogonal to the circumferential direction, and constitutes the adjacent A-phase off region; The manufacturing method of the code | cord board of Claim 16 which isolate | separates the 2nd conductive layer which comprises B phase OFF area | region with the 2nd separation line which consists of the said resin.   The method for manufacturing a code plate according to claim 17, wherein the second separation line is formed by a drawing pattern from the first separation line.   The method of manufacturing a code plate according to claim 17, wherein the second separation line is formed in a branch pattern from the first separation line.   The method for manufacturing a code plate according to any one of claims 15 to 19, wherein the A-phase on region and the B-phase on region are formed by being shifted in the circumferential direction. Printing a conductive paste having carbon powder and a first binder resin to form a surface-side conductive layer on the transfer plate;
21. The method for manufacturing a code plate according to claim 12, wherein an inner conductive layer is formed by printing a conductive paste having silver powder and a second binder resin on the surface-side conductive layer.

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