JPWO2008044571A1 - 粒子を内在させた樹脂材料の流動解析方法及び流動解析システム - Google Patents

粒子を内在させた樹脂材料の流動解析方法及び流動解析システム Download PDF

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Publication number
JPWO2008044571A1
JPWO2008044571A1 JP2008538677A JP2008538677A JPWO2008044571A1 JP WO2008044571 A1 JPWO2008044571 A1 JP WO2008044571A1 JP 2008538677 A JP2008538677 A JP 2008538677A JP 2008538677 A JP2008538677 A JP 2008538677A JP WO2008044571 A1 JPWO2008044571 A1 JP WO2008044571A1
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JP
Japan
Prior art keywords
particles
load
resin material
convex
particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008538677A
Other languages
English (en)
Japanese (ja)
Inventor
河野　務
務 河野
小林　宏治
宏治 小林
和良 小島
和良 小島
眞行 美野
眞行 美野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corporation
Showa Denko Materials Co Ltd
Original Assignee
Resonac Corporation
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corporation, Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Resonac Corporation
Publication of JPWO2008044571A1 publication Critical patent/JPWO2008044571A1/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00—Details relating to CAD techniques
    • G06F2111/10—Numerical modelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
  • Wire Bonding (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP2008538677A 2006-10-06 2007-10-03 粒子を内在させた樹脂材料の流動解析方法及び流動解析システム Pending JPWO2008044571A1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006275575 2006-10-06
JP2006275575 2006-10-06
PCT/JP2007/069361 WO2008044571A1 (fr) 2006-10-06 2007-10-03 Procédé pour analyser la fluidité d'une matière de résine comprenant des particules et système d'analyse de fluidité

Publications (1)

Publication Number Publication Date
JPWO2008044571A1 true JPWO2008044571A1 (ja) 2010-02-12

Family

ID=39282780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008538677A Pending JPWO2008044571A1 (ja) 2006-10-06 2007-10-03 粒子を内在させた樹脂材料の流動解析方法及び流動解析システム

Country Status (5)

Country Link
JP (1) JPWO2008044571A1 (zh)
KR (1) KR20090064428A (zh)
CN (1) CN101523394A (zh)
TW (1) TW200834364A (zh)
WO (1) WO2008044571A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010186395A (ja) * 2009-02-13 2010-08-26 Hitachi Chem Co Ltd 粒子を含む樹脂材料の粒子変形解析方法および解析システム
JP5190045B2 (ja) 2009-11-11 2013-04-24 株式会社日立製作所 多孔質体に充填された樹脂中に発生するボイド体積変化の予測方法
JP5498523B2 (ja) * 2012-03-07 2014-05-21 住友ゴム工業株式会社 可塑性材料の押出シミュレーション方法及び装置
CN102707291B (zh) * 2012-05-24 2014-03-19 中国工程物理研究院流体物理研究所 一种高速粒子流动量分布实时测量方法及测量装置
US9990455B1 (en) * 2017-12-13 2018-06-05 Tactotek Oy Arrangement and method for facilitating electronics design in connection with 3D structures
JP6414373B1 (ja) * 2018-03-06 2018-10-31 日立化成株式会社 樹脂組成物の流動性評価方法、樹脂組成物の選別方法及び半導体装置の製造方法
CN112632813B (zh) * 2020-12-03 2022-05-31 浙江大学 一种大厚度树脂基复合材料固化制度的优化方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05314091A (ja) * 1992-05-01 1993-11-26 Toyota Central Res & Dev Lab Inc 流動基質中の粒子の運動解析方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05314091A (ja) * 1992-05-01 1993-11-26 Toyota Central Res & Dev Lab Inc 流動基質中の粒子の運動解析方法

Also Published As

Publication number Publication date
KR20090064428A (ko) 2009-06-18
CN101523394A (zh) 2009-09-02
TW200834364A (en) 2008-08-16
WO2008044571A1 (fr) 2008-04-17
TWI343992B (zh) 2011-06-21

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